JP2007057972A - Optical module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce manufacturing cost, to contrive miniaturization, and to increase reliability and mass productivity. <P>SOLUTION: The optical module is equipped with: a peripheral IC 214 for electrically connecting with a substrate 106; a photoelectric element 212 with circuit faces 212d1, 212e1 constituting at least either a light receiving part for receiving an optical signal or a light emitting part for transmitting an optical signal; and an optical fiber 202 extended nearly in parallel with the substrate 106 and optically connected to the photoelectric element 212. The photoelectric element 212 is arranged in the manner that the circuit faces 212d1, 212e1 are nearly vertical to the extending direction of the optical fiber 202. Also, the area from the circuit faces 212d1, 212e1 of the element body over to the side of the peripheral IC 214 is covered with a film in which a wiring 212b is formed for electrically connecting the circuit faces 212d1, 212e1 with the optical module terminal 210. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an optical module that optically connects a photoelectric element and an optical fiber.

  In recent years, the speeding up of devices such as LSI has made remarkable progress. In particular, a 1 GHz product, which was considered impossible about 10 years ago in CMOS, has been put into practical use, and a 10 GHz product has been put into practical use at the most advanced level. Under such circumstances, there is a limit to guaranteeing “signal quality” in the conventional mounting method using only the motherboard wiring or the electrical method in which the connection between the motherboards is performed using an electric cable connector. This is a general recognition of engineers regarding interconnection.

  As a means for solving this problem, it is expected to replace the electrical interconnection with the optical interconnection. However, it is not practical in terms of size, cost, power consumption, etc. to apply the conventional network backbone optical transmission technology for information transmission of several kilometers to several hundred kilometers to “optical interconnection”. There is no practical value in the field of interconnection.

  For this reason, high-speed signals are limited to the LSI package interposer without going through the mounting board, and the electrical wiring length is shortened, converted into an optical signal within the interposer, and used as an external input / output. Has been. However, any of the methods such as a method using a connector and a method of soldering an optical module has many problems in terms of cost.

  As an optical module proposed to replace electrical interconnection with optical interconnection, an optical module described in Patent Document 1 is known. 12A and 12B are schematic configuration explanatory views of the optical module described in Patent Document 1. FIG. As shown in FIG. 12A, the optical module includes an optical fiber 308, an optical element that transmits and receives an optical signal, and a connection pin 309 that is electrically connected to the optical element. As shown in FIG. 12B, the interposer 302 and the optical module 307 are electrically connected by mechanical contact between the connection pin 309 and the jack 310.

Further, Patent Document 2 discloses an optical module aimed at downsizing and cost reduction. FIG. 13 is a perspective view illustrating a schematic configuration of the optical module described in Patent Document 2, and FIG. 14 is a cross-sectional view illustrating the schematic configuration of the optical module. As shown in FIG. 13, the optical module described in Patent Document 2 includes electrical wiring 412 and element mounting on a main surface 410-1 of a support substrate 410 on which a semiconductor element 411 (not shown in FIG. 13) is mounted. A recess 414 is formed at the end of the main surface 410-1, and the electrical wiring 412 extends to the inclined surface 415 of the recess 414. Further, as shown in FIG. 14, a semiconductor element 411 having a light receiving region 411-1 is mounted on the electrode pattern 413 by solder or silver paste, and the central axis of the optical waveguide of the optical transmission line 430 and the light receiving region 411-1 Arranged so that the central axes coincide. With such a configuration, when the electrical wiring 412 and the external connection wiring 421 are brought into contact with each other by the solder material 422, the probability that the solder material 422 causes a short circuit accident with the adjacent wiring is greatly reduced. Further, since the connection is completed without requiring any special adjustment, it is possible to increase the throughput and to realize at a low cost.
JP 2004-253456 A JP 2005-44966 A

However, the optical module described in Patent Document 1 does not disclose a specific structure of photoelectric conversion.
Further, in the optical module described in Patent Document 2, since the support substrate 410 is arranged vertically and connected to the substrate at the edge portion, the electrical connection portion is close to point connection, and it is difficult to ensure reliability. There are also problems. Furthermore, although the angle between the main surface 410-1 and the inclined surface 415 on the support substrate 410 is larger than 90 degrees, the electric wiring 412 is formed across the substantially flat main surface 410-1 and the inclined surface 415. Therefore, there is a problem that disconnection is likely to occur at the boundary between the main surface 410-1 and the inclined surface 415.
Further, since the semiconductor element 411 is exposed, there is a problem that dust or the like enters the circuit surface of the semiconductor element 411. In order to prevent this, it is conceivable to form a resin coat on the surface of the semiconductor element 411. However, there is a possibility that the optical signal transmission / reception may be hindered due to impurities contained in the resin coat itself or unevenness of the surface of the resin coat. is there.

  In this invention, it is an optical module provided on a board | substrate, Comprising: The semiconductor element electrically connected with the said board | substrate, The light-receiving part which is electrically connected with the said semiconductor element, and receives an optical signal is transmitted. A photoelectric element having a circuit surface that forms at least one of the light emitting units, and an optical fiber that extends substantially parallel to the substrate and is optically connected to the photoelectric element, wherein the photoelectric element includes the circuit The photoelectric element is provided by a covering member that is arranged so that the surface is substantially perpendicular to the extending direction of the optical fiber and in which wiring for electrically connecting the circuit surface and the semiconductor element is formed. An optical module is provided in which the main body is covered from the circuit surface to the semiconductor element side.

According to this optical module, since the wiring is formed from the circuit surface to the semiconductor element side along the surface of the photoelectric element, stable electrical connection between the photoelectric element and the semiconductor element side becomes possible. Therefore, there is no need for a support substrate on which photoelectric elements are mounted, and there is a risk of stress concentration in the wiring, resulting in disconnection, etc., by forcing the wiring to the bottom of the module, as in the case where the wiring is formed on the supporting substrate itself. The electrical reliability is dramatically improved. In addition, for example, by incorporating ground wiring together with signal wiring into the photoelectric element wiring, impedance matching can be performed easily and easily, compared to conventional single wiring of signal wiring such as wire bonding. In particular, the signal quality can be improved.
Further, the reliability of the wiring portion is improved as compared with the case where the bare chip is connected to the substrate side by wire bonding. Furthermore, the photoelectric element can be handled as a packaged product including the wiring part, and KGD (Known Good Die) can be delivered, and a good product can be applied during assembly.

  According to the optical module of the present invention, the manufacturing cost of the module can be reduced and the size can be reduced, and the reliability and mass productivity can be remarkably improved, which is extremely advantageous in practical use.

  A preferred embodiment of an optical module of the present invention will be described in detail with reference to the drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted.

FIG. 1 shows an embodiment of the present invention and is a schematic explanatory diagram of a mother board in which module substrates are connected using an optical module.
As shown in FIG. 1, the motherboard 100 is connected with two module substrates 106 and 108 on which LSIs 102 and 104 as high-speed circuit units are mounted. A ball grid array (hereinafter referred to as “BGA”) 110 is formed below each of the module substrates 106 and 108 and is electrically connected to a signal wiring 112, a power supply wiring 114, and the like formed on the motherboard 100. The power supply wiring 114 may be a ground wiring. Each module substrate 106, 108 is mounted with an optical module 200, and each optical module 200 has an optical fiber array 202 (not shown in FIG. 1) that transmits and receives optical signals to each other. Hereinafter, the optical module 200 which is a characteristic configuration of the present invention will be described on one module substrate 106 side of the two module substrates 106 and 108. The difference between the optical module 200 on the one module board 106 side and the other module board 108 side is the optical fiber extraction direction and the arrangement position of each member related thereto. To do.

FIG. 2 is an external perspective view of the optical module.
As shown in FIG. 2, the optical module 200 covers a photoelectric element 212 (not shown in FIG. 2) and a peripheral IC 214 (not shown in FIG. 2) as active elements by a housing 204, and functions as a so-called active connector. Further, a socket 208 detachably attached to the housing 204 is interposed between the housing 204 and the module substrate 106.
The “photoelectric element” is generally used as a general term for an element that converts an optical signal into an electric signal, that is, a photoelectric conversion element, and an element that converts an electric signal into an optical signal, that is, an electric-optical conversion element. Many. In this specification, the term “photoelectric element” is used as a generic term for both unless otherwise specified. Therefore, the term “photoelectric element” refers to any one or both of the above.

FIG. 3 is a partially exploded longitudinal sectional view of the optical module when the optical module of FIG. 2 is cut in the AA direction, and shows a relationship with a socket and the like.
As shown in FIG. 3, the optical module 200 transmits an optical signal to a peripheral IC 214 as a semiconductor element that is electrically connected to the module substrate 106, and a light receiving unit that is electrically connected to the peripheral IC 214 and receives an optical signal. A photoelectric element 212 having circuit surfaces 212d1 and 212e1 forming at least one of the light emitting sections to be emitted, and an optical fiber array 202 extending substantially parallel to the module substrate 106 and optically connected to the photoelectric element 212. Yes.

FIG. 4 is a cross-sectional view of the optical module in which the optical module is cut along the BB cross section in FIG. 2 and the cut surface is viewed from above. Here, FIG. 4 does not show a cross section of the main body portion of the housing for the sake of explanation.
As shown in FIG. 4, the photoelectric element 212 includes both VCSEL (Vertical Cavity Surface Emitting Laser) 212d and PIN-PD (PIN type photodiode) 212e. In the present embodiment, the photoelectric element 212 includes one VCSEL 212d that is a light emitting element and one PIN-PD 212e that is a light receiving element. And since the circuit surface is formed for every light receiving element or light emitting element, when it has two or more light receiving elements or light emitting elements, a photoelectric element will have two or more circuit surfaces. In the present embodiment, the photoelectric element 212 has a circuit surface 212d1 of the VCSEL 212d and a circuit surface 212e1 of the PIN-PD 212e. The VCSEL 212d has a function of transmitting an electrical signal as an optical signal, and the circuit surface 212d1 forms a light emitting unit. The PIN-PD 212e has a function of receiving an optical signal and converting it into an electrical signal, and the circuit surface 212e1 serves as a light receiving portion. As shown in FIG. 4, the VCSEL 212d and the PIN-PD 212e are arranged in parallel in the horizontal direction. The chip-like photoelectric element 212 is erected on the peripheral IC 214 at its side, and is arranged substantially perpendicular to the module substrate 106.

  As shown in FIG. 3, the peripheral IC 214 of the optical module 200 is formed in a chip shape, is substantially parallel to the module substrate 106, and is substantially perpendicular to the photoelectric element 212, and serves as both a receiver and a driver. . As shown in FIG. 4, the peripheral IC 214 forms a driver 214 d below the VCSEL 212 d of the photoelectric element 212 and forms a receiver 214 e below the PIN-PD 212 e of the photoelectric element 212.

  As shown in FIG. 3, the photoelectric element 212 is arranged such that the circuit surfaces 212d1, 212e1 are substantially perpendicular to the extending direction of the optical fiber array 202, and the circuit surfaces 212d1, 212e1 and the peripheral IC 214 are electrically connected. The element body 218 is covered from the circuit surfaces 212d1 and 212e1 to the peripheral IC 214 side by a flexible film 216 mainly composed of polyimide on which wiring 212b for connection is formed. Then, it is connected to the peripheral IC 214 at the lower part (end face 212 c) of the photoelectric element 212.

Here, a method for manufacturing the photoelectric element 212 will be described. FIG. 5A is a cross-sectional explanatory view of the photoelectric element before assembly, and FIG. 5B is a cross-sectional explanatory view of the photoelectric element after assembly.
As shown in FIG. 5A, a hole 220 for connecting to the element body 218 made of an IC of the photoelectric element 212 on one surface of the flexible film 216 as a flat covering member provided with a wiring 212b made of copper inside. And a hole 222 for mounting the external terminal 230 is formed on the other surface. Here, both the signal wiring and the ground wiring are formed in the wiring 212b. As shown in FIG. 5A, the wiring 212b is formed so that the element main body 218 is not located directly above the formation portion of the circuit surfaces 212d1 and 212e1. Thereby, light reception or light emission on the circuit surfaces 212d1 and 212e1 is not hindered. In FIG. 5A, the wiring 212b is not formed between the bumps 228, which will be described later, and is cut out in a predetermined direction (depth direction in FIG. 5) just above the circuit surface 212d1 (directly below in the figure). It has a cross-sectional shape. Then, electrodes 224 and 226 electrically connected to the wiring 212b are formed in the holes 220 and 222, respectively. The electrodes 224 and 226 may be made of, for example, Au on a Ni base or made of a solder material, and the material and the like can be arbitrarily selected.

  Then, the bump 228 is mounted on the element body 218 and connected to the electrode 224 of the hole 220 formed on one surface of the flexible film 216. This connection is realized by, for example, crimping. Here, the bump 228 is made of, for example, Au, and the material and the like can be arbitrarily selected.

  From this state, as shown in FIG. 5B, the flexible film 216 is heated and softened, bent along the element body 218, and thermocompression-bonded to the element body 218, thereby completing a CSP (chip_size_package). In this embodiment, the flexible film 216 is made of a resin whose main component is polyimide, and has a property of being softened at about 200 ° C. and capable of being bonded. Here, FIG. 5B shows the external terminal 230 formed on the side surface of the element body 218. In the present embodiment, the external terminal 230 is composed of BGA. As shown in FIG. 3, the photoelectric element 212 is arranged in the housing 204 so that the external terminal 230 is on the lower side.

  As described above, the photoelectric element 212 has the flexible film 216 including the pattern of the wiring 212b around the element body 218. As a result, the input / output terminals of the circuit surfaces 212d1, 212e1 are other than the circuit surfaces 212d1, 212e1. Can be formed. Here, the flexible film 216 of the photoelectric element 212 is made of a light transmitting material and does not hinder the transmission and reception of optical signals. Thereby, the reliability of the wiring 212b portion is improved as compared with the case where the bare chip is connected to the substrate side by wire bonding. Furthermore, the photoelectric element 212 can be handled as a package product including the wiring 212b portion, delivery by KGD (Known Good Die) is possible, and a good product can be applied during assembly. This improves the product yield. In addition, since the ground wiring is built together with the signal wiring in the wiring 212b portion of the photoelectric element 212, impedance matching can be performed easily and easily, compared to the single wiring of the signal wiring like the conventional wire bonding, Signal quality can be dramatically improved.

  In the present embodiment, the peripheral IC 214 is also manufactured by the same method as that for the photoelectric element 212. FIG. 6 is a cross-sectional explanatory diagram of a peripheral IC. As shown in FIG. 6, with respect to the peripheral IC 214, external terminals 230 are formed on both surfaces of the chip-shaped element body 218, not on the side portion of the element body 218. The external terminal 230 on one surface of the peripheral IC 214 is connected to the external terminal 230 of the photoelectric element 212, and the external terminal 230 on the other surface is connected to the interposer 232 in which the optical module terminal 210 is formed. Since the photoelectric element 212 and the external terminal 230 of the peripheral IC 214 are configured by BGA, they can be connected together by reflow.

  Next, mounting of the optical fiber array 202 on the housing 204 will be described. In the present embodiment, twelve optical fibers are aligned to constitute the optical fiber array 202. As shown in FIG. 3, the optical fiber array 202 is set in a V groove (not shown) of the housing 204 and then fixed with an array fixing piece 234. Here, a guide pin method is used as a method of positional deviation control.

  In the optical module 200 configured as described above, when functioning as a transmitter, the output of the high-speed or ultra-high-speed electrical signal on the module substrate 106 is the socket 208, the optical module terminal 210, the interposer 232, the peripheral IC 214, the photoelectric element. It is transmitted in the order of 212. Then, after the electrical signal is converted into an optical signal by the photoelectric element 212, the optical signal is output to the optical fiber array 202.

  When functioning as a receiver, an optical signal received from the optical fiber array 202 is converted into an electrical signal by the photoelectric element 212. The electrical signal output from the photoelectric element 212 is transmitted in the order of the peripheral IC 214, the interposer 232, the optical module terminal 210, the socket 208, and the module substrate 106. In the present embodiment, a photoelectric element 212 having a PIN-PD 214e is used, and a peripheral IC 214 having a preamplifier receiver 214e is used.

  According to the optical module 200 of the present embodiment, since the circuit surfaces 212d1, 212e1 of the photoelectric element 212 and the optical fiber array 202 are substantially vertical, the distance between the two can be brought close to each other, and an optical signal can be transmitted between them. An optical member such as a lens for sending and receiving is not required. As a result, the number of parts can be reduced, and the number of processes in the assembly process and the inspection process can be reduced, and the manufacturing cost can be drastically reduced as compared with a lens having an optical member such as a lens. Further, the module can be reduced in size by omitting the optical member.

More specifically, in the conventional configuration of the edge emitting laser diode and SM fiber generally used for long-distance communication as an optical transmission device, the emission angle of the emitted light is relatively large, for example, a loss of 0.5 dB or less is assumed. In this case, the allowable displacement of the optical axis is within about 1 μm. In addition to this, the use of a lens has become essential because the optical fiber cannot be sufficiently close to the circuit surface.
In the present embodiment, a VCSEL having a circular emission light and a relatively small radiation angle is employed, and the allowable displacement of the optical axis is relaxed within about 5 μm by combining with an MM fiber as an optical fiber. The lens is not necessary by making the optical fiber array 202 sufficiently close to the circuit surfaces 212d1 and 212e1.

  In this optical module 200, wiring is formed from the circuit surface 212d1 (212e1) to the end surface 212c on the peripheral IC 214 side along the surface of the photoelectric element 212, so that stable electrical connection between the photoelectric element 212 and the peripheral IC 214 is achieved. It becomes possible. This eliminates the need for a support substrate on which the photoelectric element 212 is mounted, and forcibly pulls the wiring to the lower part of the module, as in the case where the wiring is formed on the support substrate itself, resulting in a stress-concentrated portion in the wiring, resulting in disconnection, etc. There is no such a risk that the electrical reliability is greatly improved.

  Moreover, according to the optical module 200 of this embodiment, since the wirings 212b and 214b are covered with the flexible film 216, the mechanical protection of the wirings 212b and 214b can be accurately performed. Further, in addition to mechanical protection, dust can be prevented from entering the circuit surfaces 212d1 and 212e1, and even if dust adheres to the surface of the flexible film 216, it can be easily and easily removed. Furthermore, there is no possibility that impurities are mixed in the flexible film 216, and since it is adhered flatly along the element body 218, the surface of the flexible film 216 is not formed with irregularities, which is suitable for transmission and reception of optical signals. is there.

Also, according to the optical module 200 of the present embodiment, the length of the wiring 212b can be made shorter than that of the conventional one. Therefore, when the wiring 212b is modeled and the signal quality is simulated, the model is reduced. Calculation is relatively easy.
Furthermore, in the prior art, since the wire is a single line of signal wiring, it is necessary to provide a ground structure for impedance matching, which also increases the size of the module and makes impedance matching easy and easy. Can not. In this embodiment, such a problem is also solved.

  Further, according to the optical module 200 of the present embodiment, since high-speed signals are processed in the module substrate 106, the LSI 102 can be used without performing serial / parallel conversion or the like, and the gate usage rate can be increased. In addition, the number of terminals of the LSI 102 can be reduced, and the module-side substrate can be lowered to reduce the cost.

  Further, according to the present embodiment, since the optical module 200 can be inserted into and removed from the mother board 100, even a person who does not have technical knowledge of electrical transmission or optical transmission can easily and easily interconnect between devices. Can be configured.

  In addition, according to the present embodiment, since the high-speed signal is separated from the motherboard 100, it is easier to find the cause at the time of malfunction as compared with the case where the low-speed and high-speed signals are mixed. In addition, even if it is necessary to re-create, any one of the motherboard 100 side and the optical module 200 side may be created, which is advantageous in terms of quality, cost, delivery date, and the like. Further, the problem of unnecessary radiated radio waves caused by wiring conventionally formed on the mother board 100 is solved by a combination of downsizing by modularization and an optical interface. Here, even for a signal of about 10 GHz, it has been experimentally confirmed that the signal quality is guaranteed by setting the size of the module substrate 106 to about 5 cm or less.

  In summary, according to the present embodiment, the module manufacturing cost can be reduced and the module can be reduced in size, and the reliability and mass productivity can be significantly improved, which is extremely advantageous in practical use.

  In the above embodiment, the photoelectric element 212 is composed of the VCSEL 212d and the PIN-PD 212e. However, as shown in FIG. 7, the photoelectric element 212 may be composed of either one. FIG. 7 shows a modification of the above embodiment, in which (a) shows that the photoelectric element 212 consists only of the VCSEL 212d, and (b) shows that the photoelectric element 212 consists only of the PIN-PD 212e. . Further, the peripheral IC 214 may function only as the driver 214d when the photoelectric element 212 is the VCSEL 212d as shown in FIG. 7A, and the photoelectric element 212 is PIN− as shown in FIG. 7B. In the case of the PD 212e, it may function only as the receiver 214e. That is, the peripheral IC 214 may form at least one of the receiver 214e and the driver 214d. Here, FIG. 7 shows an optical fiber array 202 in which four optical fibers are aligned. As described above, the number of optical fibers in the optical fiber array can be appropriately changed according to the specification and the like, and it is needless to say that the number of optical fibers may be one.

  In the above embodiment, the flexible film 216 including the wiring 212b made of copper is bent. However, the flexible film 216 having the wiring 212b formed on the surface may be bent. In the above embodiment, the wiring 212b is a single layer, but the wiring 212b may be a multilayer. In short, the film 216 on which wiring for electrically connecting the circuit surfaces 212d1, 212e1 and the optical module terminal 210 is formed covers the surface of the element body 218 from the circuit surfaces 212d1, 212e1 to the peripheral IC 214 side. It only has to be done.

  In the above embodiment, only the element body 218 is covered with the flexible film 216. For example, as shown in FIG. 8, a circuit function is provided on the opposite side of the circuit surfaces 212d1 and 212e1 in the element body 218. A dummy chip 236 which does not have may be arranged adjacent to the device body 218 and covered with the flexible film 216. As a result, the rigidity and strength of the photoelectric element 212 can be improved, and the module substrate 106 and the peripheral IC 214 can be warped or swelled. Further, since the photoelectric element 212 can be formed large in the thickness direction, it can be stably assembled to the peripheral IC 214.

  Further, for example, as shown in FIG. 9, a heat sink 238 instead of the dummy chip 236 may be arranged adjacent to the element body 218. Thereby, the heat generated inside the element body 218 can be radiated through the heat sink 238. Therefore, when the ambient temperature of the optical module 200 is relatively high, or when the element body 218 generates a relatively large amount of heat, the photoelectric element 212 can be effectively cooled.

  Moreover, in the said embodiment, although the flexible film 216 of the photoelectric element 212 showed what consists of a light transmissive material, if a hole part is formed in the optical path of the optical signal in the flexible film 216, the flexible film 216 will be shown. Need not be a light-transmitting material.

  Furthermore, in the above-described embodiment, the wiring 212b is cut out in a predetermined direction right above the circuit surface 212d1 (212e1). For example, as shown in FIG. 10, the circuit surface 212d1 (212e1) Even if the layer of the wiring 212b is formed at a portion where transmission / reception of the optical signal is not hindered, no trouble is caused. That is, the shape of the layer of the wiring 212b can be changed as appropriate depending on the parallelism, strength, and the like required for the photoelectric element 212. In this case, the thickness of the flexible film 216 of the photoelectric element 212 can be made uniform, and the rigidity is increased by the wiring 212b, which is advantageous in manufacturing and the like.

  In the above-described embodiment, the peripheral IC 214 is formed in a chip shape and arranged substantially perpendicular to the photoelectric element 212. However, the configuration of the peripheral IC 214 and the like is arbitrary. For example, as shown in FIG. 11, the photoelectric element 212 and the peripheral IC 214 may be arranged vertically in parallel and overlap each other.

  Further, in the above-described embodiment, the one using the flexible film 216 made of polyimide as the covering member is shown. However, the covering member may be another resin or the like, for example, a compound of an inorganic material such as ceramic and a resin. Of course, it may be.

  In addition, although the optical module terminal 210 is connected to the module substrate 106 via the socket 208, the optical module terminal 210 may be directly connected to the module substrate 106, or other specific examples. Of course, the detailed structure and the like can be changed as appropriate.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 illustrates an embodiment of the present invention, and is a schematic explanatory diagram of a mother board in which module substrates are connected using an optical module. It is an external appearance perspective view of an optical module. FIG. 3 is a partially exploded longitudinal sectional view of the optical module when the optical module of FIG. 2 is cut in the AA direction, and shows a relationship with a socket and the like. In FIG. 2, it is sectional drawing of the optical module which cut | disconnected the optical module in the BB cross section and looked at the cut surface from upper direction. It is sectional drawing of a photoelectric element, Comprising: (a) shows the thing before an assembly, (b) shows the thing after an assembly. It is sectional explanatory drawing of peripheral IC. It is a cross-sectional view of the optical module which shows a modification, Comprising: (a) shows what a photoelectric element makes a light emission part, (b) shows what a photoelectric element makes a light-receiving part. It is a longitudinal cross-sectional explanatory drawing of the photoelectric element which shows a modification. It is a cross-sectional view of the optical module which shows a modification. It is sectional explanatory drawing of the photoelectric element which shows a modification. It is a partially exploded longitudinal cross-sectional view of the optical module which shows a modification. It is schematic structure explanatory drawing of the conventional optical module, Comprising: (a) shows the state which the connection pin and the jack separated, (b) shows the state which the connection pin and the jack are contacting. It is a perspective view which shows schematic structure of the conventional optical module. It is sectional drawing which shows schematic structure of the conventional optical module.

Explanation of symbols

100 Motherboard 106 Module board 108 Module board 112 Signal wiring 114 Power supply wiring 200 Optical module 202 Optical fiber array 204 Housing 208 Socket 210 Optical module terminal 212 Photoelectric element 212b Wiring 212c End face 212d VCSEL
212d1 Circuit surface 212e PIN-PD
212e1 Circuit surface 214 Peripheral IC
214b Wiring 216 Flexible film 218 Element body 220 Hole 222 Hole 224 Electrode 226 Electrode 228 Bump 230 External terminal 232 Interposer 234 Array fixing piece 236 Dummy chip 238 Heat sink

Claims (5)

An optical module provided on a substrate,
A semiconductor element electrically connected to the substrate;
A photoelectric element that is electrically connected to the semiconductor element and has a circuit surface that forms at least one of a light receiving unit that receives an optical signal and a light emitting unit that transmits an optical signal;
An optical fiber extending substantially parallel to the substrate and optically connected to the photoelectric element,
The photoelectric element is arranged so that the circuit surface is substantially perpendicular to the extending direction of the optical fiber, and wiring for electrically connecting the circuit surface and the semiconductor element is formed. An optical module characterized in that a body of the photoelectric element is covered by a covering member from the circuit surface to the semiconductor element side.   The optical module according to claim 1, wherein the photoelectric element is electrically connected to the semiconductor element at an end face.   The optical module according to claim 1, wherein the photoelectric element is formed in a chip shape and is disposed substantially perpendicular to the substrate.   4. The semiconductor device according to claim 1, wherein the semiconductor element is formed in a chip shape and disposed substantially perpendicular to the photoelectric element, and forms at least one of a receiver and a driver of the photoelectric element. The optical module according to one item. The optical module according to any one of claims 1 to 4, further comprising a socket interposed between the semiconductor element and the substrate.

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