JP2007044952A - Electric wiring member, and ink-jet recording head and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electric wiring member or the like capable of preventing air-bubbles from entering between an electric wiring member and an ink-resistance protection layer by eliminating high-accuracy positioning of the ink-resistance protection layer to the electric wiring member. <P>SOLUTION: The electric wiring member 10 is composed by joining energy generation element substrates 7a, 7b, which respectively have an energy generation element for discharging ink, to a base substrate unit 11 arranged on a base substrate 8, and provided with an electric wiring 2 for transmitting an electric signal to the energy generation element substrates 7a, 7b. The electric wiring member 10 is also composed so that the ink-resistance protection layer 4 having resistance to ink is provided to at least a partial region other than the regions to be joined to the base substrate unit 11 in the face to be joined to the base substrate unit 11 of the electric wiring member 10. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electric wiring member having wiring for transmitting an electric signal to an ink jet recording head, an ink jet recording head to which the electric wiring member is bonded, and a method for manufacturing the same.

  FIG. 4 is a diagram showing a cross-sectional layer structure of a conventional electric wiring member.

  A conventional electric wiring member includes a base film 101, an electric wiring 102 provided on the base film 101, an adhesive layer 103 formed on the entire surface of the base film 101 where the electric wiring 102 is provided, And an ink-resistant protective layer 104 provided on the adhesive layer 103. In the base film 101, an area (hereinafter referred to as “device hole”) in which a portion covering the energy generating element substrate is cut out and opened when connected to the ink jet recording head is formed. The energy generating element substrate of the ink jet recording head is provided with an ejection port (not shown) for ejecting ink and an ejection energy generating element (not shown) for generating energy for ejecting ink from the ejection port. Yes. The electrical wiring member mainly transmits electrical energy for driving the ejection energy generation element to the ejection energy generation element.

  Conventionally, such an electrical wiring member has the same size and shape as the base film 101 with respect to the surface on which the adhesive layer 103 of the base film 101 is formed, and device holes are similarly formed. The film-like ink-resistant protective layer 104 is produced by bonding.

The electric wiring member described above is disclosed in Patent Document 1.
JP 2002-103637 A

  However, in the above-described prior art, after the device hole for the energy generating element substrate is cut out in the ink resistant protective layer, the device hole of the ink resistant protective layer is positioned with respect to the device hole formed in the electric wiring member. In addition, the ink-resistant protective layer must be bonded to the electric wiring member.

  Also, as the number of ejection energy generating elements on the energy generating element substrate increases as the resolution of the ink jet recording head increases, the size of the electrical wiring member increases as the number of electrical wirings increases. In this case, in the configuration in which the ink-resistant protective layer is bonded to the entire surface of the electric wiring member, air bubbles easily enter between the adhesive layer on the electric wiring member and the ink-resistant protective layer at the time of bonding. The probability of becoming a good product increases.

  Therefore, the present invention does not require highly accurate positioning of the ink-resistant protective layer with respect to the electric wiring member, and the electric wiring member capable of suppressing air bubbles from entering between the electric wiring member and the ink-resistant protective layer, An object of the present invention is to provide an ink jet recording head to which the electric wiring member is connected and a manufacturing method thereof.

  In order to achieve the above object, the electrical wiring member of the present invention has the energy generating element bonded to a base substrate unit in which an energy generating element substrate having an energy generating element for discharging ink is disposed on the base substrate. An electric wiring member having an electric wiring connected to a substrate, wherein the ink is provided in at least a part of the surface of the electric wiring member bonded to the base substrate unit other than the region bonded to the base substrate unit. An ink-resistant protective layer having resistance to the above is provided.

  According to the present invention, it is not necessary to position the ink-resistant protective layer with high accuracy with respect to the electric wiring member, and it is possible to prevent bubbles from entering between the electric wiring member and the ink-resistant protective layer.

  Next, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 1 is an exploded perspective view showing an ink jet recording head according to a first embodiment of the present invention.

  The electrical wiring member 10 of the present embodiment protects a region to be processed when the insulating base film 1 having flexibility, the electrical wiring 2 provided on the base film 1, and the electrical wiring 2 are plated. A plating protective layer 5, an adhesive layer 3 formed on the plating protective layer 5, and an ink-resistant protective layer 4 stuck on the adhesive layer 3. The electrical wiring member 10 has device holes 10a and 10b formed in portions covering the energy generating element substrates 7a and 7b when attached to the base substrate unit 11 via the adhesive 6. Since the base film 1 has flexibility as described above, the electric wiring member 10 has a form of a so-called flexible wiring board or a TAB (Tape Automated Bonding) film carrier.

  The base substrate unit 11 is configured by providing energy generating element substrates 7 a and 7 b on a base substrate 8. The base substrate unit 11 is connected to an ink supply member (not shown) for supplying ink to each ink flow path (not shown) formed on the energy generating element substrates 7a and 7b.

  An adhesive 6 having ink resistance is applied on the base substrate 8, and the device holes 10a and 10b of the electric wiring member 10 are positioned with respect to the energy generating element substrates 7a and 7b of the base substrate unit 11, thereby By bonding the member 10 to the base substrate unit 11, an ink jet recording head is configured.

  In the electrical wiring member 10 of the present embodiment, the ink-resistant protective layer 4 and the adhesive layer 3 to which the ink-resistant protective layer 4 is attached are other than the regions facing the base substrate unit 11 when bonded to the base substrate unit 11. It is provided only in the area. Therefore, the area of the joint surface of the ink resistant protective layer 4 in the electric wiring member 10 is smaller than that of the conventional technique in which the ink resistant protective layer is provided on the entire surface of the electric wiring member. Accordingly, when the ink-resistant protective layer 4 is bonded to the adhesive layer 3, it is difficult for air bubbles to enter between the adhesive layer 3 and the ink-resistant protective layer 4, and the probability that the electric wiring member 10 becomes a defective product. Can be reduced. In addition, since the area | region which opposes the base substrate unit 11 of the electrical wiring member 10 is sealed with the adhesive agent 6, even if the ink-resistant protective layer 4 is not provided, it is protected from erosion by ink or the like.

  In addition, since no device hole is formed in a region other than the region facing the base substrate unit 11 of the electric wiring member 10, when the ink resistant protective layer 4 is joined, the ink wiring member 10 is protected against ink. The need to align the layer 4 with high accuracy can be eliminated.

  In this embodiment, a solder resist is used for the plating protective layer 5, and a thermosetting adhesive is used for the adhesive 6.

(Second Embodiment)
FIG. 2A is a plan view showing an electrical wiring member according to the second embodiment of the present invention. FIG. 2A shows a surface of the electric wiring member 10 to be joined to a base substrate unit (not shown).

  As in the first embodiment shown in FIG. 1, device holes 10a and 10b are formed in regions of the electrical wiring member 10 that are joined to a base substrate unit (not shown). An ink-resistant protective layer 4 is provided in a region adjacent to the bonding region. Further, in an area adjacent to the area where the ink resistant protective layer 4 is provided, when the ink jet recording head to which the electric wiring member 10 is connected is mounted on the recording apparatus main body, The electrical connection part A to be connected is configured. A plurality of electrical connection members A connected to electrical contacts provided on the recording apparatus main body on the back side of the electrical wiring member 10 in the electrical connection portion A (surface opposite to the surface joined to the base substrate unit (not shown)). The electrode pad 21 is formed.

  In the present embodiment, by providing the ink-resistant protective layer 4 only in a part of the electric wiring member 10 other than the region bonded to the base substrate unit (not shown), the region where the ink-resistant protective layer 4 is provided is minimized. It is limited. The other configuration of the electrical wiring member 10 of this embodiment is the same as that of the first embodiment, and the electrical wiring member 10 of this embodiment is also provided with electrical wiring, a plating protective layer, and an adhesive layer. In FIG. 2A, illustration thereof is omitted.

  FIG.2 (b) is a top view which shows the modification of the electrical wiring member shown to Fig.2 (a). FIG. 2B also shows a surface bonded to the base substrate unit (not shown) of the electrical wiring member 10.

  The electric wiring member 10 shown in FIG. 2B is provided with an ink-resistant protective layer 4 so as to surround the periphery of a region bonded to a base substrate unit (not shown) of the electric wiring member 10. This is different from the configuration shown in FIG. The other configuration of the electrical wiring member 10 shown in FIG. 2B is the same as that shown in FIG.

  When the size of the base substrate unit is smaller than the width of the electric wiring member 10, when the electric wiring member 10 is joined to the base substrate unit, a blank area of the electric wiring member 10 is generated around the base substrate unit. On the other hand, since the ink-resistant protective layer 4 is provided in the blank area as shown in FIG. 2B, the ink may soak from the area and the wiring of the electric wiring member 10 may be corroded. It is prevented.

  Further, according to the configuration shown in FIG. 2B, when the electric wiring member 10 is bonded to the base substrate unit (not shown) with an adhesive, the bonding protrudes from between the electric wiring member 10 and the base substrate unit. It is possible to prevent the agent from protruding to the outer periphery of the electric wiring member 10.

  3A to 3C are views showing a process of joining the electric wiring member shown in FIG. 2A to the base substrate unit.

  FIG. 3A shows the electric wiring member 10 shown in FIG. As described above, device holes 10 a and 10 b are formed in the electric wiring member 10 in the region where the electric wiring member 10 is joined to the base substrate unit 11. An ink-resistant protective layer 4 is provided in a region adjacent to the bonding region.

  First, as shown in FIG. 3B, a plurality of island-shaped adhesives 30 are applied on the surface of the base substrate 8 to which the electric wiring member 10 is bonded. FIG. 3B shows the electric wiring member 10 shown in FIG. For convenience of illustration, the ink-resistant protective layer 4 is seen through. Next, the device holes 10 a and 10 b of the electric wiring member 10 are positioned with respect to the energy generating element substrates 7 a and 7 b of the base substrate unit 11, and the electric wiring member 10 is placed on the base substrate unit 11. Then, the electric wiring member 10 is pressed against the base substrate unit 11 so that the adhesive 30 on the base substrate unit 11 is crushed and spread, and the electric wiring member 10 is joined to the base substrate unit 11, thereby configuring the ink jet recording head. Is done. Thereby, as shown in FIG. 3C, the plurality of island-shaped adhesives 30 are evenly distributed between the electric wiring member 10 and the base substrate unit 11, and the electric wiring member 10 is sealed with the adhesive 30. And can be protected from ink.

  In this embodiment, when the electric wiring member 10 is pressed against the base substrate unit 11, an adhesive 30 is applied on the base substrate unit 11 in a plurality of islands in order to prevent air bubbles from being enclosed between them. Yes. However, the form of the adhesive applied on the base substrate unit 11 is not limited to this, and the adhesive may be applied to the entire region other than the energy generating element substrates 7a and 7b on the base substrate unit 11, for example.

  The back surface of the region where the electrode pads 21 of the electric wiring member 10 are formed is bonded to the wall surface of an ink supply member (not shown) connected to the base substrate unit 11 with a thermosetting adhesive having ink resistance. Therefore, the back surface of the region of the electrical wiring member 10 is protected from erosion by ink.

1 is an exploded perspective view showing an ink jet recording head according to a first embodiment of the present invention. It is a top view which shows the electrical wiring member which concerns on the 2nd Embodiment of this invention. It is a figure which shows the process of joining the electric wiring member shown to Fig.2 (a) to a base substrate unit. It is a figure which shows the cross-sectional layer structure of the conventional electrical wiring member.

Explanation of symbols

2 Electric wiring 7a, 7b Energy generating element substrate 8 Base substrate 10 Electric wiring member 11 Base substrate unit

Claims (6)

An electrical wiring member having an electrical wiring for transmitting an electrical signal to the energy generating element substrate, wherein an energy generating element substrate having an energy generating element for ejecting ink is joined to a base substrate unit disposed on the base substrate. ,
An ink-resistant protective layer having resistance to the ink is provided in at least a part of the surface of the electrical wiring member that is bonded to the base substrate unit other than the region that is bonded to the base substrate unit. An electrical wiring member characterized by the above.   The electric wiring member according to claim 1, wherein the ink-resistant protective layer has a shape surrounding a region bonded to the base substrate unit of the electric wiring member. A base substrate unit in which an energy generating element substrate having an energy generating element for discharging ink is disposed on the base substrate;
An electrical wiring member having electrical wiring joined to the base substrate unit for transmitting an electrical signal to the energy generating element substrate;
In an inkjet recording head having
An ink-resistant protective layer having resistance to the ink is provided in at least a part of the surface of the electrical wiring member that is bonded to the base substrate unit other than the region that is bonded to the base substrate unit. An ink jet recording head.   4. The ink jet recording head according to claim 3, wherein the ink-resistant protective layer has a shape surrounding a region of the electric wiring member to be joined to the base substrate unit. 5. A base substrate unit in which an energy generating element substrate having an energy generating element for discharging ink is disposed on the base substrate;
An electrical wiring member having electrical wiring joined to the base substrate unit for transmitting an electrical signal to the energy generating element substrate;
In the manufacturing method of the inkjet recording head having
An ink-resistant protective layer having resistance to the ink is provided in at least a part of the surface of the electrical wiring member that is bonded to the base substrate unit, other than the region that is bonded to the base substrate unit. A method for manufacturing an inkjet recording head. Applying a plurality of island-shaped adhesives to regions other than the energy generating element substrate on the base substrate unit;
The electric wiring member is placed on the base substrate unit, and the electric wiring member is pressed against the base substrate unit so that the adhesive is crushed and spread, so that the electric wiring member is joined to the base substrate unit. When,
The manufacturing method of the inkjet recording head of Claim 5 containing these.

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