JP2006332351A - Substrate for mounting light-emitting element, and light-emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate for mounting a light-emitting element which is provided with high inductive performance for a light emitted from the light-emitting element and is excellent in long-term reliability of inductive performance when the light-emitting element is placed, and to provide a light-emitting device formed by utilizing this substrate for mounting a light-emitting element and having excellent directivity. <P>SOLUTION: This substrate 11A for mounting a light-emitting element is provided with a wiring substrate (substrate 10) in which at least two first conductive sections 22a, 22b are arranged on one surface and a region 33 for placing the light-emitting element is provided on any one of the first conductive sections or the one surface; and an insulator 30 having a convex shape from the one surface of the wiring substrate so as to surround the region or segment the region from other regions. The substrate 11A is further provided with a reflector 16 so as to cover at least part of the insulator seen from the region. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a light-emitting element mounting substrate on which a light-emitting element is placed, and a light-emitting device in which an optical component including a light-emitting element such as an LED is mounted on the light-emitting element mounting substrate.

In recent years, methods for directly mounting optical components such as LEDs on a substrate have been developed. In this method, the substrate is formed by wafer level package processing by forming a wiring layer composed of an insulating resin layer and electrolytic copper plating, mounting optical components such as LEDs, and taking out connection terminals to the outside by wire bonding from the respective terminals. Form the foundation and wiring on top.
In addition, as an example of a light emitting device with excellent light directivity, a configuration is proposed in which a concave portion is provided on an insulating metal substrate, a light emitting element is disposed on the bottom surface of the concave portion, and the side wall surface of the concave portion reflects light. (For example, refer to Patent Document 1).
Furthermore, an illuminating device has also been proposed in which a metal radiator that reflects light emitted from the light emitting element is disposed around the light emitting element disposed in the concave portion or convex portion of the substrate (see, for example, Patent Document 2).

However, in order to obtain a light-emitting device or a lighting device having the above-described configuration, it is necessary to perform processing such as etching processing or press molding on the substrate itself that functions as a base on which the light-emitting element is placed. Warpage or distortion due to processing is likely to occur in the substrate itself, or processing distortion remaining in the substrate causes the substrate itself to be deformed or fluctuated over a long period of time. As a result, the traveling direction of the light emitted from the light emitting element provided on the substrate changes due to this, or the relative positional relationship between the reflector provided on the substrate and the light emitting element for reflecting this light is changed. By changing, the optical path of the light emitted from the light emitting element is not fixed, and there is a possibility that it becomes unstable in the long term. Therefore, it has been extremely difficult to mass-produce light-emitting devices and lighting devices that have excellent long-term stability of light-emitting characteristics.
JP-A-5-11718 Japanese Patent Laid-Open No. 11-163212

  The present invention has been made in view of the above circumstances, and has a high inductivity with respect to light emitted from the light-emitting element when the light-emitting element is mounted, and a light-emitting element excellent in inductive long-term reliability. A first object is to provide a mounting substrate. A second object of the present invention is to provide a light-emitting device having excellent directivity using this light-emitting element mounting substrate.

  In the light emitting element mounting substrate according to claim 1 of the present invention, at least two first conductive portions are arranged on one surface, and one or the one surface of the first conductive portion has a region for mounting the light emitting element. A wiring board provided, and an insulator that protrudes from one surface of the wiring board so as to surround the region or to divide the region from another region, and further, the region A reflector is provided so as to cover at least a part of the insulator visible from the side.

  The light emitting element mounting substrate according to claim 2 of the present invention is the light emitting element mounting substrate according to claim 1, wherein when the insulator is provided so as to individually surround the region, the region has a rectangular shape made of the insulator. It is located in a recessed part.

  The light-emitting element mounting substrate according to claim 3 of the present invention is the light-emitting element mounting substrate according to claim 1, wherein the region is a line between the insulators when the insulator is provided so as to divide the region from other regions. It is characterized by being located in a concave portion.

  The light emitting element mounting substrate according to claim 4 of the present invention is characterized in that, in claim 1, the convex insulator is provided only on a part of the wiring substrate.

  The substrate for mounting a light emitting element according to claim 5 of the present invention is characterized in that, in claim 1, the reflector is provided in the entire area of the insulator visible from the region.

  A light-emitting element mounting substrate according to a sixth aspect of the present invention is the light-emitting element mounting substrate according to the first aspect, wherein one end is disposed on an upper portion of the convex insulator and the other end is electrically connected to the other of the first conductive portion. The second conductive portion is provided.

  The light emitting element mounting substrate according to claim 7 of the present invention is characterized in that, in claim 6, the second conductive portion is the same member as the reflector.

  A light emitting device according to an eighth aspect of the present invention is characterized in that a light emitting element is provided in the region constituting the light emitting element mounting substrate according to any one of the first to seventh aspects.

  According to the present invention, on the wiring board on which the region for mounting the light emitting element is provided, from one surface of the wiring board so as to surround the region or to separate the region from other regions. Since a reflector is provided so as to cover at least a part of the insulator, which is visible from the region, and includes a convex insulator, the wiring board itself is subjected to processing such as etching and press molding. A reflector can be disposed on the wiring board without application. Therefore, since the relative positional relationship between the light emitting element and the reflector does not fluctuate due to the influence of such processing, the light emitted from the light emitting element can be transmitted to the outside only by placing the light emitting element in the region on the wiring board. A light emitting element mounting substrate that can be guided along a stable optical path is obtained.

  In the light emitting device according to the present invention, since the light emitting element is provided in the region constituting the substrate for mounting the light emitting element, the light emitting device having excellent directivity for guiding the light emitted from the light emitting element to the outside. Is obtained. In particular, a substrate for mounting a light-emitting element using this configuration is not processed on the substrate itself when providing a reflector, so that warpage or distortion caused by the processing does not occur, and the remaining processing distortion in the substrate. Therefore, the present invention contributes to the provision of a light emitting device with excellent long-term stability and long-term reliability.

The present invention will be described below with reference to the drawings based on the best mode.
1 and 2 are views showing a light emitting device using a light emitting element mounting substrate of a first example according to the present invention, FIG. 1 is a schematic plan view, and FIG. 2 is a cross section taken along the line AA of FIG. FIG.

  In the embodiment of the first example described below, an insulator is provided so as to individually surround the light emitting elements, and a concave portion having a planar rectangular shape as a region for mounting the light emitting elements is formed on a part of the substrate. This is an example in which a portion of the insulator visible from the light emitting element is covered with a reflector.

  That is, in the light emitting device 1A according to the first embodiment, for example, two first conductive portions 22a and 22b are arranged on one surface, and a region 33 on which the light emitting element 23 is placed is on one first conductive portion 22a. The wiring board 10A provided on the insulating board 30, the insulator 30 provided so as to protrude from one surface of the wiring board 10A so as to surround the region 33, and one end disposed on the top of the insulator 30. A second conductive portion 32 whose other end is electrically connected to one conductive portion 22b, and a reflector 16 that is visible from the region 33 and is provided so as to cover at least a part of the insulator 30. I have. Therefore, the light emitting element mounting substrate 11A used in the light emitting device 1A is a substrate in which the light emitting element 23 is not placed in the region 33.

  In the present invention, the wiring board 10 </ b> A is a base material on which the light emitting element 23 is mounted. The two first conductive portions 22 a and 22 b arranged on one surface of the wiring board 10 </ b> A are rewiring layers connected to the light emitting element 23. For example, Cu or the like is used as the material of the first conductive portions 22a and 22b, and the thickness thereof is, for example, 0.1 to 10 μm. Thereby, sufficient conductivity can be obtained. The first conductive portions 22a and 22b can be formed by, for example, a plating method such as an electrolytic copper plating method, a sputtering method, a vapor deposition method, or a combination of two or more methods.

  Further, the wiring substrate 10A may be a semiconductor wafer such as a silicon wafer in addition to an insulating substrate such as ceramic, glass, and polyimide, or may be a semiconductor chip obtained by cutting (dicing) the semiconductor wafer into chip dimensions. When the semiconductor substrate is a semiconductor chip, first, a plurality of semiconductor elements, ICs, induction elements, etc. are formed on a semiconductor wafer and then cut into chip dimensions to obtain a plurality of semiconductor chips. it can.

  The insulator 30 is provided so as to protrude above the wiring substrate 10A so as to individually surround the light emitting elements 23, and forms a concave portion having a planar rectangular shape. This recess constitutes a region 33 on which the light emitting element 23 is placed. The insulator 30 is made of, for example, polyimide resin, epoxy resin, silicon resin, or the like, and the thickness thereof is preferably 400 to 500 μm, for example. The insulator 30 can be formed by, for example, a photolithography method. It is desirable that the depth of the recess be equal to or greater than the height of the light emitting element 23 because light leaking in the lateral direction can be efficiently directed.

  The second conductive portion 32 electrically connects the upper surface of the insulator 30 and the wiring substrate 10A, and as a material, for example, Cu or Al is used, and the thickness thereof is, for example, 0.1 to 10 μm. It is. Thereby, sufficient conductivity can be obtained. The second conductive portion 32 can be formed by, for example, a plating method such as an electrolytic copper plating method, a sputtering method, a vapor deposition method, or a combination of two or more methods.

  The reflector 16 is formed so as to reflect the light emitted from the light emitting element 23 and use it efficiently. The reflector 16 is made of, for example, Al, and the thickness thereof is preferably 0.1 to 10 μm, for example. The reflector 16 can be formed by, for example, a plating method such as an electrolytic copper plating method, a sputtering method, a vapor deposition method, or a combination of two or more methods. The reflector 16 may be the same member as the second conductive portion 32 and may be formed together with the wiring 22 in the same process. This simplifies the process.

  The light emitting element 23 is an optical semiconductor that emits light when an electric current is passed. In the present embodiment, a surface mount type light emitting diode (LED) is used. The light emitting element 23 is appropriately connected to the second conductive portion 32 on the upper surface side thereof by, for example, a bonding wire 24 and is electrically connected to the wiring board 10A. The light emitting element 23 and the second conductive portion 32 are not limited to being connected on the upper surface side, and may be appropriately connected to the second conductive portion 32 on the lower surface side of the light emitting element 23. Thereby, the pad for bonding wires can be omitted.

Next, a method for manufacturing the light emitting device 1A shown in FIGS. 1 and 2 will be described.
3 to 11 are schematic cross-sectional views illustrating an example of the manufacturing method of the light-emitting device in the order of steps. The cross-sectional views of FIGS. 3 to 11 show a cross section at a position along the line AA of FIG.

  First, the substrate 10 as a base material on which the light emitting element 23 is mounted is prepared. The substrate 10 is made of, for example, an insulating substrate such as ceramic, glass, or polyimide, and the thickness thereof is preferably set to 100 to 1000 μm, for example.

  Next, as shown in FIG. 3, a thin seed layer 20 for electrolytic plating is formed on the substrate 10. The seed layer 20 is formed on the entire surface of the substrate 10 or a necessary region. The seed layer 20 is, for example, a laminated body made of a Cu layer and a Cr layer formed by sputtering, or a laminated body made of a Cu layer and a Ti layer. Further, it may be an electroless Cu plating layer, a metal thin film layer formed by a vapor deposition method, a coating method, a chemical vapor deposition method (CVD), or the like, or a combination of the above metal layer forming methods. Good.

  Next, as shown in FIG. 4, a resist film 21 for electrolytic plating is formed on the seed layer 20. The resist film 21 is provided with an opening in a region where the two first conductive portions 22a and 22b are to be formed, and the seed layer 20 is exposed in the opening. The resist film 21 can be formed by, for example, a method of laminating a film resist or a method of spin-coating a liquid resist.

Next, as shown in FIG. 5, on the seed layer 20 exposed using the resist film 21 as a mask, first conductive portions 22a and 22b made of Cu or the like are formed by electrolytic plating or the like.
Then, after the first conductive portions 22a and 22b are formed in desired regions, as shown in FIG. 6, the unnecessary resist film 21 and seed layer 20 are removed by etching to form the first conductive portions 22a and 22b. Circuit formation is performed so that the board | substrate 10 is exposed in parts other than the performed area | region.

  Next, as shown in FIG. 7, an insulator 30 layer is formed on the substrate 10 so as to have a uniform thickness. The insulator 30 layer is made of, for example, a photosensitive resin such as polyimide or epoxy, and the thickness thereof is preferably set to 400 to 500 μm, for example. Such an insulator 30 layer can be formed on the entire surface of the substrate 10 by, for example, a spin coating method, a laminating method, a printing method, or the like. The insulator 30 layer may be formed by bonding an insulating film such as polyimide or epoxy on the substrate 10.

  Next, as shown in FIG. 8, a convex insulator 30 protruding upward is formed on the substrate 10. The convex insulator 30 can be formed by patterning using a photolithography technique. For example, a photoresist is applied on the insulator 30 made of a photosensitive resin applied on the substrate 10 to form a photoresist film, and the resist film is covered with a mask and exposed, and the exposed portion is treated with a chemical solution. To form a resist mask. Subsequently, the photosensitive resin layer is formed by etching through this resist mask. Then, the resist mask remaining on the upper surface of the protrusion is removed and then baked to complete the resin protrusion.

  Next, as shown in FIG. 9, a thin seed layer (not shown) for electrolytic plating is formed on the first conductive portions 22a and 22b and the protruding convex insulator 30 by, for example, a sputtering method. A resist film 31 for electrolytic plating is formed on the seed layer. In the resist film 31, an opening is provided in a region where the reflector 16 and the second conductive portion 32 are to be formed, and the seed layer is exposed in the opening. In this embodiment, the reflector 16 is formed on a concave portion having a planar rectangular shape formed by the convex insulator 30, that is, on the side surface in the region 33 on which the light emitting element 23 is placed. In this case, a concave portion having a planar circular shape may be used. However, since the light emitting elements cannot be closely designed closely, it is desirable that the concave portion has a planar rectangular shape because the overall size can be reduced.

  Subsequently, as shown in FIG. 10, the reflector 16 is formed on the light-emitting element mounting portion on the first conductive portion 22a exposed using the resist film 31 as a mask, and the first electrode made of Cu or the like is formed by electrolytic plating or the like. The two conductive portions 32 are formed at predetermined positions. Further, the second conductive portion 32 may be formed of Au or the like. In addition to the electrolytic plating method, the second conductive portion 32 can be formed by, for example, a sputtering method, a vapor deposition method, or a combination of two or more methods.

Next, as shown in FIG. 11, after the reflector 16 and the second conductive portion 32 are formed in a desired region, the unnecessary resist film 31 and seed layer (not shown) are removed by etching. A light emitting element mounting substrate 11A used in the light emitting device 1A is used.
Thereafter, the light emitting element 23 is mounted in the region 33 for placing the light emitting element 23 on which the reflector 16 is formed, and the light emitting element 23 and the second conductive portion 32 are electrically connected by the bonding wire 24. As a result, the light emitting device 1A shown in FIGS. 1 and 2 is manufactured.

  In the embodiment of the first example, the embodiment in which the region for mounting the light emitting element is on one side of the first conductive portion has been described in detail, but the present invention is not limited to this, for example, As shown in FIG. 12 and FIG. 13, the area for mounting the light emitting element may be on one surface of the substrate 10 </ b> A. Here, FIG. 12 and FIG. 13 are drawings showing a modification related to the first example of the light emitting device according to the present invention, FIG. 12 is a schematic plan view, and FIG. 13 is a line A′-A ′ in FIG. FIG. In this case, the one 22a of the first conductive part is arranged on one surface of the substrate 10A similarly to the other 22b of the first conductive part, and the upper surface of the one 22a of the first conductive part and the insulator are the same as the second conductive part 32b. The second conductive portion 32a is provided so as to connect to the upper surface of 30, and the light emitting element 23 and the second conductive portions 32a and 32b are electrically connected by bonding wires 24a and 24b, respectively. The light emitting device 1A ′ shown in FIG. 13 is manufactured.

  Since the light emitting devices 1A and 1A ′ configured as described above do not require processing of the wiring substrate itself, the possibility of warping of the substrate itself is reduced and the region for mounting the light emitting element is surrounded. As described above, since the insulator is formed so as to protrude from one surface of the wiring board and has a reflector so as to cover at least a part of the insulator, light emitted from the light emitting element is efficiently reflected by the reflector, A light-emitting device having stable high performance with improved directivity can be obtained. In addition to this, by forming a concave portion having a planar rectangular shape as a region for mounting the light emitting element on a part of the substrate, the thickness of the other part of the substrate is reduced, and the weight is reduced. You can also.

  In addition, in the figure explaining embodiment of the said 1st example, although the single light emitting element 23 is provided on the board | substrate 10, this invention is not limited to this, The light emitting element on the board | substrate 10 is shown. Two or more 23 may be provided.

  In the first embodiment, the insulator 30 is formed of a photosensitive resin. However, the insulator 30 may be formed using a non-photosensitive resin. Hereinafter, the difference in the manufacturing method will be described. 14 and 15 are schematic cross-sectional views illustrating an example of a method for manufacturing the light emitting device 1A in the order of steps when the insulator 30 is formed using a non-photosensitive resin. Similarly, the cross-sectional views of FIGS. 14 and 15 also show a cross-section at a position along the line AA of FIG.

  First, as in the case where the insulator is formed of the photosensitive resin of the first example, a substrate 10 is prepared as a base material for mounting the light emitting element, and a thin seed layer for electrolytic plating is formed on the substrate 10. Form (see FIG. 3). Next, a resist film for electrolytic plating is formed on the seed layer (see FIG. 4), and first conductive portions 22a and 22b are formed on the exposed seed layer using the resist film as a mask (see FIG. 5). ). Next, after the first conductive portions 22a and 22b are formed in desired regions, unnecessary resist films and seed layers are removed by etching (see FIG. 6).

  Then, an insulator 30 layer is formed on the substrate 10 so as to have a uniform thickness (see FIG. 7). The insulator 30 layer is made of a non-photosensitive resin such as polyimide or epoxy, and can be formed on the substrate 10 by, for example, a spin coating method, a laminating method, a printing method, or the like.

  Next, as shown in FIG. 14, a resist film 41 is formed by, for example, a coating method on the projecting insulator 30 formation portion on the insulator 30 layer made of the non-photosensitive resin.

  Next, the insulator 30 layer made of a non-photosensitive resin is etched through the resist film 41 to form a convex insulator 30 protruding on the substrate 10 as shown in FIG. Then, the resist mask remaining on the upper surface of the protrusion is removed and then baked to complete the insulating resin protrusion.

  Thereby, a convex insulator 30 protruding on the substrate 10 as shown in FIG. 8 is formed. Thereafter, it can be performed in the same manner as in the first example using a photosensitive resin as the insulator 30. As mentioned above. The insulator 30 is not limited to a photosensitive resin, but can be formed using a non-photosensitive resin. However, if the insulator 30 is a photosensitive resin, the inclination angle and shape of the side surface of the recess can be adjusted depending on the exposure conditions, and miniaturization is possible. This is desirable.

  In the first embodiment, an insulator is provided so as to individually surround the light emitting elements, and a concave portion having a planar rectangular shape is formed on a part of the substrate as a region for placing the light emitting elements. Although the example in which the portion of the insulator that can be seen from the light emitting element is covered with the reflector has been described, as another example in which an insulator is provided so as to individually surround the light emitting element, as in the embodiment of the first example, This insulator is entirely provided on the substrate, a concave portion having a planar rectangular shape is formed on the substrate as a region for mounting the light emitting element, and the portion of the insulator visible from the light emitting element is covered with the reflector. A second example of the light emitting device of the present invention will be described. In the description of each embodiment to be described later, portions common to the above-described embodiment are denoted by the same reference numerals, and description thereof is omitted.

  16 and 17 are drawings showing a second example of the light-emitting device of the present invention. FIG. 16 is a schematic plan view, and FIG. 17 is a cross-sectional view taken along the line BB of FIG.

  In the second embodiment described below, as in the first example described above, an insulator is provided so as to individually surround the light emitting elements, and a concave portion having a planar rectangular shape is provided as a region for mounting the light emitting elements. This is an example in which a portion of an insulator that is formed on a part of a substrate and is visible from a light emitting element is covered with a reflector. The second embodiment is different from the first embodiment in that the region other than the bottom surface of the recess is entirely covered with an insulator on one surface of the substrate provided with the recess.

  That is, in the light emitting device 1B according to the second embodiment, for example, the two first conductive portions 22a and 22b are arranged on one surface, and the light emitting element 23 is mounted, similarly to the light emitting device 1A according to the first embodiment. A wiring board 10B provided with a region 33 on one of the first conductive portions 22a, and an insulator 30 provided so as to entirely project from one surface of the wiring board so as to surround the region 33. A second conductive portion 32 having one end arranged on the top of the insulator 30 and the other end electrically connected to the other first conductive portion 22b, and further visible from the region 33 of the insulator 30. And a reflector 16 provided so as to cover at least a part thereof. Therefore, the light emitting element mounting substrate 11B used in the light emitting device 1B refers to a substrate in which the light emitting element 23 is not placed in the region 33.

  For example, two first conductive portions 22a and 22b are provided on one surface of the wiring substrate 10B, for example, one first conductive portion 22a is directly arranged on the wiring substrate 10B, and the other first conductive portion 22b is on the wiring substrate 10B. It is arranged on the insulator 30 formed in the above.

Next, a method for manufacturing the light emitting device 1B shown in FIGS. 16 and 17 will be described.
18 to 28 are schematic cross-sectional views illustrating an example of a manufacturing method of the light-emitting device 1B in the order of steps. The cross-sectional views in FIGS. 18 to 28 show a cross section at a position along the line BB in FIG.

First, as in the first embodiment, a substrate 10 is prepared as a base material on which a light emitting element is mounted, and a thin seed layer for electrolytic plating is formed on the substrate 10 (see FIG. 3).
Next, as shown in FIG. 18, a resist film 21 for electrolytic plating is formed on the seed layer 20. The resist film 21 is provided with an opening in a region where one of the two first conductive portions 22a and 22b is to be formed, and the seed layer 20 is exposed in the opening.

Next, as shown in FIG. 19, one first conductive portion 22a made of Cu or the like is formed on the exposed seed layer 20 using the resist film 21 as a mask by an electrolytic plating method or the like.
Then, after the first conductive portion 22a is formed in a desired region, as shown in FIG. 20, the unnecessary resist film 21 and seed layer 20 are removed by etching, and one first conductive portion 22a is formed. Circuit formation is performed so that the board | substrate 10 is exposed in parts other than an area | region.

  Next, an insulator 30 layer having a uniform thickness is formed on the substrate 10 (see FIG. 7), and then a photoresist is applied on the insulator 30 layer to form a photoresist film. A mask is put on the film for exposure, and the exposed portion is dissolved with a chemical solution to form a resist mask. Subsequently, the photosensitive resin layer is etched through the resist mask, and as shown in FIG. 21, a concave portion having a planar rectangular shape provided on the substrate 10 so as to surround the light emitting elements 23 individually. That is, the convex insulator 30 protruding upward, in which the region 33 for mounting the light emitting element 23 is formed, is formed.

Next, as shown in FIG. 22, a thin seed layer 40 for electrolytic plating is formed on the first conductive portion 22 a and the insulator 30.
Further, as shown in FIG. 23, a resist film 41 for electrolytic plating is formed on the seed layer 40. In the second embodiment, an opening is provided in a region where the other first conductive portion 22- of the two first conductive portions 22a and 22b is to be formed, and the seed layer 40 is exposed in the opening. Keep it.

Next, as shown in FIG. 24, the other first conductive portion 22b made of Cu or the like is formed on the exposed seed layer 40 using the resist film 41 as a mask by an electrolytic plating method or the like.
Then, after the first conductive portion 22b is formed in a desired region, as shown in FIG. 25, the unnecessary resist film 41 and seed layer 40 are removed by etching, and the other first conductive portion 22b is formed. Circuit formation is performed so that one of the first conductive portions 22a and the insulator 30 are exposed in a portion other than the region.

Further, after forming a thin seed layer (not shown) for electroplating on the two first conductive portions 22a and 22b and the insulator 30, the electrolysis is performed on the seed layer as shown in FIG. A resist film 42 for plating is formed.
Subsequently, in the second embodiment, as shown in FIG. 27, the second end is arranged such that one end is arranged on the upper portion of the insulator 30 and the other end is electrically connected to the other first conductive portion 22b. The conductive portion 32 is formed, and the reflector 16 is formed on the side surface in the concave portion 33 having a planar rectangular shape formed by the insulator 30.

  As in the case of the first example, as shown in FIG. 28, the second conductive portion 32 made of Cu or the like is formed at a predetermined location by an electrolytic plating method or the like, and the reflector 16 is formed in a desired region. After the formation, the unnecessary resist film 42 and the seed layer (not shown) are removed by etching, and the regions other than the region where the reflector 16, the two first conductive portions 22a and 22b, and the second conductive portion 32 are formed. The insulator 30 is exposed at the portion.

  Thereafter, the light emitting element 23 is mounted in the region 33 for placing the light emitting element 23 on which the reflector 16 is formed, and the light emitting element 23 and the second conductive portion 32 are electrically connected by the bonding wire 24. Thus, the light emitting device 1B shown in FIGS. 16 and 17 is manufactured.

  Further, in the second embodiment, the embodiment in which the region for placing the light emitting element is on one side of the first conductive portion has been described in detail, but the present invention is not limited to this, for example, As shown in FIGS. 29 and 30, a region for mounting the light emitting element may be provided on one surface of the substrate 10 </ b> B. Here, FIG. 29 and FIG. 30 are drawings which show the modification regarding the 2nd example of the light-emitting device based on this invention, FIG. 29 is a schematic plan view, FIG. 30 is the B'-B 'line | wire of FIG. FIG. In this case, one of the first conductive parts 22a is arranged on the upper surface of the insulator 30 in the same manner as the other of the first conductive parts 22b, and from the first conductive part 22a to the region 33, like the second conductive part 32b. 29 and 30 are provided by providing a second conductive portion 32a extending in an extended manner and electrically connecting the light emitting element 23 and the second conductive portions 32a and 32b by bonding wires 24a and 24b, respectively. 1B ′ is manufactured.

  Since the light emitting devices 1B and 1B ′ configured as described above do not need to process the wiring substrate itself, the possibility of warping of the substrate itself is reduced, and an area for mounting the light emitting element is reduced. Since an insulator is formed so as to surround the wiring substrate so as to surround the reflector and a reflector is provided so as to cover at least a part of the insulator, light emitted from the light emitting element is efficiently reflected by the reflector. Thus, a light emitting device with improved directivity and stable high performance can be obtained.

In the second example embodiment as well, the insulator 30 can be formed of a photosensitive resin, and the insulator 30 can be formed of a non-photosensitive resin.
Moreover, although the embodiment of the first example and the second example has been described with respect to the case where the insulator is provided so as to individually surround the light emitting elements, the reflector is provided by providing the insulator so as to separate the light emitting elements. Thus, the light emitted from the light emitting element can be reflected and the directivity of the emitted light can be enhanced. The case will be described below as a third example of the light emitting device of the present invention.

  31 and 32 are views showing a third example of the light emitting device of the present invention, FIG. 31 is a schematic plan view, and FIG. 32 is a schematic cross-sectional view taken along the line CC of FIG.

  That is, in the light emitting device 1C in the third example embodiment, two first conductive portions 22a and 22b are arranged on one surface, and a region 35 for placing the light emitting element 23 is on one first conductive portion 22a. The provided wiring board 10C, the insulator 34 provided so as to protrude from one surface of the wiring board so as to divide the region 35 from other regions, and one end disposed on the upper side of the insulator 34, the other A second conductive portion 32 whose other end is electrically connected to the first conductive portion 22b, and a reflector 16 which is visible from the region 35 and is provided so as to cover at least a part of the insulator 34; It is equipped with. Therefore, the light emitting element mounting substrate 11 </ b> C used in the light emitting device 1 </ b> C is a substrate in which the light emitting element 23 is not placed in the region 35.

  The insulator 34 is a convex body provided so as to protrude upward so as to separate the light emitting elements 23, and forms a line-shaped concave portion 35. Like the insulator 30, the insulator 34 is made of, for example, polyimide resin, epoxy resin, silicon resin, or the like, and the thickness thereof is preferably set to 400 to 500 μm, for example. The insulator 34 can be formed by, for example, a photolithography method. If the depth of the concave portion 35 (that is, the height of the convex body) is equal to or deeper (higher) than the height of the light emitting element 23, light leaking in the lateral direction can be efficiently directed. desirable.

  The reflector 16 is provided so as to cover a side surface in the recess 35 formed in a line shape between the insulators 34. The method of forming the reflector 16 can be performed in the same manner as in the first embodiment. The light emitting element 23 is mounted in the recess 35. In addition, in the figure explaining embodiment of this 3rd example, although the single light emitting element 23 is mounted in the recessed part 35, this invention is not restricted to this, The light emitting element in the recessed part 35 is shown. Two or more 23 may be mounted.

And the manufacturing method of the said light-emitting device 1C can be performed with reference to embodiment of said 1st example.
First, as in the first embodiment, a substrate 10 is prepared as a base material on which a light emitting element is mounted, and a thin seed layer for electrolytic plating is formed on the substrate 10 (see FIG. 3).
Next, a resist film for electrolytic plating is formed on the seed layer (see FIG. 4). The resist film is provided with an opening in a region where two first conductive portions are to be formed, and the seed layer is exposed in the opening.

Next, two first conductive portions made of Cu or the like are formed on the exposed seed layer using the resist film as a mask by electrolytic plating or the like (see FIG. 5).
Then, after the first conductive portion is formed in a desired region, the unnecessary resist film and seed layer are removed by etching, and the circuit board is exposed in a portion other than the region where the first conductive portion is formed. Formation is performed (see FIG. 6).

Next, an insulator layer is formed on the substrate so as to have a uniform thickness (see FIG. 7).
Next, a convex insulator 34 protruding upward is formed on the substrate. The convex insulator 34 can be formed by patterning using a photolithography technique as in the first embodiment. For example, a photoresist is applied on an insulator made of a photosensitive resin applied on a substrate to form a photoresist film, and the resist film is covered with a mask for exposure, and the exposed portion is dissolved with a chemical solution. To form a resist mask. Subsequently, the photosensitive resin layer is formed by etching through this resist mask. Then, the resist mask remaining on the upper surface of the protrusion is removed and then baked to complete the resin protrusion (see FIG. 8).

Next, a thin seed layer (not shown) for electrolytic plating is formed on the first conductive portion and the protruding convex insulator 34 by, for example, sputtering, and the electrolytic plating is formed on the seed layer. A resist film is formed (see FIG. 9).
Subsequently, a reflector is formed at a light emitting element mounting location on the exposed first conductive portion using the resist film as a mask, and a second conductive portion made of Cu or the like is formed at a predetermined location by electrolytic plating or the like ( (See FIG. 10).

Then, as shown in FIG. 33, after the reflector 16 and the second conductive portion 32 are formed in a desired region, unnecessary resist film and seed layer (not shown) are removed by etching, whereby this light emission. A light emitting element mounting substrate 11C used in the device 1C is used.
Thereafter, the light emitting element 23 is mounted in the region 35 for placing the light emitting element 23 on which the reflector 16 is formed, and the light emitting element 23 and the second conductive portion 32 are electrically connected by the bonding wire 24. Thus, the light emitting device 1C shown in FIGS. 31 and 32 is manufactured.

  In the embodiment of the third example, the embodiment in which the region for placing the light emitting element is on one side of the first conductive portion has been described in detail. However, the present invention is not limited to this, for example, As shown in FIGS. 34 and 35, a region for mounting the light emitting element may be provided on one surface of the substrate 10C. Here, FIG. 34 and FIG. 35 are drawings showing a modification related to the second example of the light emitting device according to the present invention, FIG. 34 is a schematic plan view, and FIG. 35 is a C′-C ′ line in FIG. FIG. In this case, the one 22a of the first conductive part is arranged on one surface of the substrate 10C like the other 22b of the first conductive part, and the upper surface of the one 22a of the first conductive part and the insulator are the same as the second conductive part 32b. 34 is provided so as to connect the upper surface of 30, and the light emitting element 23 and the second conductive portions 32a and 32b are electrically connected by bonding wires 24a and 24b, respectively, so that FIG. The light emitting device 1C ′ shown in FIG. 35 is manufactured.

  In the light emitting devices 1C and 1C ′ configured as described above, since there is no need to process the wiring substrate itself, the possibility of warping of the substrate itself is reduced, and an area for mounting the light emitting element is reduced. By the reflector 16 formed on the side surface in the concave portion 35 formed in a line shape between the convex insulators 34, including an insulator having a convex shape from one surface of the wiring board so as to be separated from other regions, It is also possible to increase the directivity of light so that light emitted from the light emitting element 23 leaks to the surroundings and light is not mixed.

  In addition, any of the above-described light emitting device manufacturing methods is a suitable example, and is not particularly limited. Therefore, the insulator is not limited to the one whose side surface is perpendicular to the substrate, and as shown in FIG. 36, the insulator may be an insulator 30B whose side surface is formed obliquely with respect to the substrate 10, or FIG. As shown in FIG. 4, the insulator 30C may be formed such that the side surface is formed in an arc shape with respect to the substrate 10. Accordingly, it is easy to form a reflector and the second conductive portion on the side surface of the insulator, and light emitted from the light emitting element is efficiently reflected by the reflector and the directivity is improved.

  The present invention can be applied to a light emitting device used for a backlight of a liquid crystal display of a personal computer or a mobile phone, for example.

It is a top view which shows the 1st example of the light-emitting device which concerns on this invention. It is sectional drawing which follows the AA line of the light-emitting device shown in FIG. It is sectional drawing which shows the 1st process of the manufacturing method of the light emitting element mounting substrate which the light-emitting device shown in FIG. 1 uses. It is sectional drawing which shows the next process (2nd process) of FIG. It is sectional drawing which shows the next process (3rd process) of FIG. It is sectional drawing which shows the next process (4th process) of FIG. It is sectional drawing which shows the next process (5th process) of FIG. It is sectional drawing which shows the next process (sixth process) of FIG. It is sectional drawing which shows the next process (seventh process) of FIG. It is sectional drawing which shows the next process (8th process) of FIG. It is sectional drawing which shows the next process (9th process) of FIG. 10, and shows the 1st example of the light emitting element mounting substrate which concerns on this invention. It is a top view which shows the modification of the 1st example of the light-emitting device which concerns on this invention. It is sectional drawing which follows the A'-A 'line of the light-emitting device shown in FIG. It is sectional drawing which shows the 6th process of the other manufacturing method of the light emitting element mounting substrate which the light emitting device shown in FIG. 1 uses. It is sectional drawing which shows the 7th process of the other manufacturing method of the light emitting element mounting substrate which the light emitting device shown in FIG. 1 uses. It is a top view which shows the 2nd example of the light-emitting device which concerns on this invention. It is sectional drawing which follows the BB line of the light-emitting device shown in FIG. It is sectional drawing which shows the 1st process of the manufacturing method of the light emitting element mounting substrate which the light-emitting device shown in FIG. 16 uses. It is sectional drawing which shows the next process (2nd process) of FIG. FIG. 20 is a cross-sectional view showing the next step (third step) in FIG. 19. It is sectional drawing which shows the next process (4th process) of FIG. FIG. 22 is a cross-sectional view showing a next step (fifth step) of FIG. 21. FIG. 23 is a cross-sectional view showing a next step (sixth step) of FIG. 22. FIG. 24 is a cross-sectional view showing a next step (seventh step) in FIG. 23. FIG. 25 is a cross-sectional view showing a next step (eighth step) of FIG. 24. FIG. 26 is a cross-sectional view showing a next step (ninth step) of FIG. 25. FIG. 27 is a cross-sectional view showing a next process (tenth process) of FIG. 26. It is sectional drawing which shows the next process (11th process) of FIG. 27, and shows the 2nd example of the light emitting element mounting substrate which concerns on this invention. It is a top view which shows the modification of the 2nd example of the light-emitting device which concerns on this invention. FIG. 30 is a cross-sectional view taken along line B′-B ′ of the light emitting device shown in FIG. 29. It is a schematic plan view which shows the 3rd example of the light-emitting device which concerns on this invention. It is sectional drawing which follows the CC line of the light-emitting device shown in FIG. It is sectional drawing which shows the 9th process of the manufacturing method of the light emitting element mounting substrate which the light emitting device shown in FIG. 31 uses, and shows the 3rd example of the light emitting element mounting substrate which concerns on this invention. It is a top view which shows the modification of the 3rd example of the light-emitting device which concerns on this invention. It is sectional drawing which follows the C'-C 'line | wire of the light-emitting device shown in FIG. It is sectional drawing which shows the 2nd example of the shape of the insulator which makes convex shape in the light emitting element mounting substrate which concerns on this invention. It is sectional drawing which shows the 3rd example of the shape of the insulator which makes convex shape in the light emitting element mounting substrate which concerns on this invention.

Explanation of symbols

1A, 1A ′, 1B, 1B ′, 1C, 1C ′ Light emitting device, 10 (10A, 10B, 10C) Substrate (wiring substrate), 11A, 11B, 11C Light emitting element mounting substrate, 16 Reflector, 22a, 22b First 1 conductive part, 23 light emitting element, 24, 24a, 24b bonding wire, 30, 34 insulator, 32 2nd conductive part, 33, 35 area | region (recessed part).

Claims (8)

A wiring board in which at least two first conductive portions are arranged on one surface, and a region for placing a light emitting element is provided on one or the one surface of the first conductive portion;
An insulator having a convex shape from one surface of the wiring board so as to surround the region or to divide the region from other regions;
With
Furthermore, a reflector is provided so as to cover at least a part of the insulator visible from the region. When the insulator is provided so as to individually surround the region,
The light emitting element mounting substrate according to claim 1, wherein the region is located in a rectangular recess made of the insulator. When the insulator is provided so as to separate the region from other regions,
The light emitting element mounting substrate according to claim 1, wherein the region is located in a line-shaped recess between the insulators. The light emitting element mounting board according to claim 1, wherein the convex insulator is provided only on a part of the wiring board. The light-emitting element mounting substrate according to claim 1, wherein the reflector is provided over the entire area of the insulator visible from the region. 2. The second conductive portion, wherein one end is disposed on an upper portion of the convex insulator, and the other end of the first conductive portion is electrically connected to the other end of the first conductive portion. The board | substrate for light emitting element mounting of description. The light emitting element mounting substrate according to claim 6, wherein the second conductive portion is the same member as the reflector. A light-emitting device, wherein a light-emitting element is provided in the region constituting the light-emitting element mounting substrate according to any one of claims 1 to 7.

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