JP2006324437A - Light-emitting diode mounting spacer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting diode mounting space capable of avoiding shotting other parts on a printed board, avoiding the rise of a resin around the base of a lead wire of the light-emitting diode, and eliminating floating of the light-emitting diode. <P>SOLUTION: The light-emitting diode mounting spacer 100 is formed into a triangular prism having the same length and its included angle of 45 degrees and having first and second slopes 11 and 12, is provided with two through holes 13a, 13b perpendicular to the first slope 11 from the first slope 11 to the second slope 12, and a concave portion 14 is formed in a region including opening ends of the through holes 13a, 13b on the first slope 11. A clearance groove 15 for avoiding the rise of resin around the base of the lead wire 10a of the light-emitting diode 10 is provided on a region including the opening ends of the though holes 13a, 13b of the first slope 11. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a light emitting diode mounting spacer for holding a light emitting diode (LED) and fixing it to a substrate at a predetermined angle when performing substrate wiring.

  FIG. 7 is a diagram illustrating a configuration example of a conventional light emitting diode mounting spacer. Conventionally, when a light emitting diode is mounted on a printed circuit board at a predetermined angle, a light emitting diode mounting spacer as shown in FIG. 7 is used. The light-emitting diode mounting spacer 1 is a spacer used when the light-emitting diode is disposed on the printed board at an angle of 45 degrees (see Patent Document 1).

  As shown in FIG. 7, the light-emitting diode mounting spacer 1 is a rectangular parallelepiped formed of a synthetic resin, and has two inclined holes 2a parallel to the slope 2 from which a part of the rectangle is cut in a side shape. In addition to opening 2b, a vertical opening 3 is provided in communication with the inclined holes 2a and 2b.

  When attaching the light emitting diode 10 to the printed circuit board, as shown in FIG. 8, the lead wire 10a of the light emitting diode 10 is inserted through the inclined holes 2a and 2b, bent downward at the rear ends of the inclined holes 2a and 2b, and By inserting the tip of the lead wire 10a into the through hole of the printed board and performing soldering, the light emitting diode 10 can be attached to the printed board at an angle of 45 degrees.

Design registration No. 1172952.

  However, in the case of the above-described light emitting diode mounting spacer 1 shown in FIG. 7, when the light emitting diode 10 is attached to the printed board, the lead wire 10a of the light emitting diode 10 is inserted into the inclined holes 2a and 2b, respectively, as shown in FIG. Since the portion bent downward after the insertion is exposed to the outside and may protrude depending on the bending condition of the lead wire 10a, there is a drawback that there is a risk of shooting with other parts mounted on the printed circuit board. was there.

  Further, since there is a resin bulge around the base portion of the lead wire 10a of the normal light emitting diode 10, when the light emitting diode mounting spacer 1 shown in FIG. 7 is used, the resin bulge around the base portion of the lead wire 10a of the light emitting diode 10 is avoided. There is a disadvantage that the light emitting diode 10 is lifted when mounted.

  Therefore, the present invention does not expose the lead wire of the light emitting diode on the printed circuit board, avoids shots with other components, and increases the resin swell around the base of the lead wire of the light emitting diode. An object of the present invention is to provide a light-emitting diode mounting spacer that can avoid the floating of the light-emitting diode.

  In order to solve the above problems, a light-emitting diode mounting spacer according to the present invention is a spacer that is mounted between a printed board and a light-emitting diode mounted on the printed board, and holds the light-emitting diode in a predetermined posture. And formed of a non-conductive material into a triangular prism body having a first inclined surface on which the light emitting diode is disposed and a second inclined surface disposed on the printed circuit board as a bottom surface, from the first inclined surface to the second inclined surface. Two through holes perpendicular to the first inclined surface are provided, and a recess is formed in the second inclined surface in a region including the open end of the through hole.

  For example, an escape groove for avoiding the resin bulge around the base portion of the lead wire of the light emitting diode is provided in a region including the open end of the through hole on the first slope. The first slope and the second slope are equal in length, and the included angle between the first slope and the second slope is 45 degrees.

  Further, for example, the plurality of triangular prisms are integrally formed with a predetermined interval via a connecting portion provided on a side surface, and the connecting portion has a predetermined cross section that can be cut or broken.

  In this invention, it forms in the triangular prism which has the 1st slope which arrange | positions a light emitting diode, and the 2nd slope which arrange | positions to the said printed circuit board as a bottom face, toward the 2nd slope from the said 1st slope. Two through holes perpendicular to the first slope are provided, and a recess is formed in a region including the open end of the through hole on the second slope. When the light emitting diode is attached to the printed board, the lead wire of the light emitting diode is inserted into the two through holes, bent downward at the lower open end of the through hole, and attached to the printed board.

  Thereby, the lead wire of the light emitting diode is not exposed on the printed circuit board, and it is possible to avoid shots with other components. Further, by providing a recess on the bottom surface, it is possible to secure a space for accommodating solder overflowing from the through hole of the substrate when the lead wire is soldered to the substrate.

  In addition, by providing a relief groove, the resin bulge at the base of the lead wire of the light emitting diode can be fitted into the relief groove, thus avoiding the resin bulge around the base of the lead wire and eliminating the light emitting diode floating. It becomes possible.

  Further, in order to make the lengths of the first slope and the second slope equal and to make the included angle between the first slope and the second slope 45 degrees, the light emitting diode can be stably kept at 45 degrees. It can be attached.

  Further, the plurality of triangular prisms are integrally formed with a predetermined interval via a connecting portion having a predetermined cross section that can be cut or broken, so that a plurality of light emitting diodes can be arranged in parallel. In addition, the light emitting diode mounting spacers formed in a multiple type are diodes of the double type, the triple type, etc. by cutting out the number of the multiple type light emitting diode mounting spacers appropriately according to the number of the light emitting diodes to be attached. It can be used as a mounting spacer.

  According to the present invention, the light-emitting diode mounting spacer is formed of a non-conductive material in a triangular prism body having a first slope on which the light-emitting diode is disposed and a second slope on the printed circuit board as a bottom surface. Two through holes perpendicular to the first slope are provided from the first slope to the second slope, and a recess is formed in the second slope including the open end of the through hole. When the light emitting diode is attached to the printed circuit board, the lead wire of the light emitting diode is not exposed on the printed circuit board, and it is possible to avoid shots with other components. By providing the concave portion on the bottom surface, it is possible to secure a space for accommodating solder overflowing from the through hole of the substrate when the lead wire is soldered to the substrate.

  Further, by providing the relief groove, it is possible to avoid the resin bulge around the base portion of the lead wire of the light emitting diode, and to eliminate the floating of the light emitting diode.

  In addition, since the lengths of the first slope and the second slope are equal and the included angle between the first slope and the second slope is 45 degrees, the light-emitting diode can be stably mounted at 45 degrees. Can do.

  Further, the plurality of triangular prisms are integrally formed with a predetermined interval via a connecting portion having a predetermined cross section that can be cut or broken, so that a plurality of light emitting diodes can be arranged in parallel. In addition, the light emitting diode mounting spacers formed in a multiple type are diodes of the double type, the triple type, etc. by cutting out the number of the multiple type light emitting diode mounting spacers appropriately according to the number of the light emitting diodes to be attached. It can be used as a mounting spacer.

  The light-emitting diode mounting spacer according to the first embodiment of the present invention will be described below with reference to the drawings.

  FIG. 1 is a perspective view showing a configuration of a light-emitting diode mounting spacer according to a first embodiment of the present invention. In FIG. 1, a light emitting diode mounting spacer 100 that can be mounted at 45 degrees is shown. FIG. 2 is a plan view showing a configuration of the light emitting diode mounting spacer 100.

  As shown in FIGS. 1 and 2, the light-emitting diode mounting spacer 100 is formed of a synthetic resin in a triangular prism body. The triangular prism body has a first slope on which the light-emitting diode is disposed and a second slope disposed on the printed circuit board as a bottom surface. And the slope 12. The lengths of the first slope 11 and the second slope 12 are equal, and the included angle between the first slope 11 and the second slope 12 is 45 degrees.

  Two through holes 13 a and 13 b perpendicular to the first slope 11 are provided from the first slope 11 toward the second slope 12. Further, a recess 14 was formed in a region including the open ends of the through holes 13 a and 13 b on the second inclined surface 12. The recess 14 includes a front end surface 14a, a top surface 14b, and a rear end surface 14c, and the rear end surface 14c has a predetermined angle (for example, 45 degrees) with respect to the second inclined surface 12. That is, the rear end surface 14c of the recess 14 is parallel to the through holes 13a and 13b. Thereby, when the lead wire 10a of the light emitting diode 10 is inserted into the through holes 13a and 13b, it can be avoided that the lead wire 10a hits the rear end surface 14c of the recess 14.

  Further, a relief groove 15 is provided in a region including the open ends of the through holes 13 a and 13 b on the first inclined surface 11 to avoid the resin bulge around the base portion of the lead wire 10 a of the light emitting diode 10.

  FIG. 3 is a diagram showing a substrate mounting state of the light emitting diode mounting spacer 100. When attaching the light emitting diode 10 to the printed circuit board, as shown in FIG. 3, the lead wires 10a of the light emitting diode 10 are inserted into the through holes 13a and 13b, respectively, and are formed on the side surfaces of the recesses 14 at the rear ends of the through holes 13a and 13b. Then, the light emitting diode 10 is attached to the printed board at an angle of 45 degrees by bending it downward and inserting the tip of the lead wire 10a into the through hole of the printed board and soldering.

  As described above, in the above-described embodiment, the light-emitting diode mounting spacer 100 includes the first inclined surface 11 on which the light-emitting diode 10 is disposed and the second inclined surface 12 that is disposed on the printed circuit board as a bottom surface, using a non-conductive material. Two through-holes 13a and 13b that are perpendicular to the first inclined surface 11 are provided from the first inclined surface 11 toward the second inclined surface 12, and the second inclined surface 11 includes the through-holes 13a and 13a, A recess 14 was formed in a region including the open end of 13b.

  Further, a relief groove 15 for avoiding the resin bulge around the base portion of the lead wire 10a of the light emitting diode 10 is provided in a region including the open ends of the through holes 13a and 13b on the first slope 11. The lengths of the first slope 11 and the second slope 12 are equal, and the included angle between the first slope 11 and the second slope 12 is 45 degrees.

  When the light emitting diode 10 is attached to the printed board, the lead wire 10a of the light emitting diode 10 is inserted into the two through holes 13a and 13b, bent downward at the lower open ends of the through holes 13a and 13b, and attached to the printed board.

  Thereby, when the light emitting diode is attached to the printed circuit board, the lead wire of the light emitting diode is not exposed on the printed circuit board, and it is possible to avoid shots with other components. By providing the recess 14 on the bottom surface, it is possible to secure a space for accommodating solder overflowing from the through hole of the substrate when the lead wire 10a is soldered to the substrate, and the solder overflows to the light emitting diode mounting spacer 100 side. , It can be suppressed from flowing sideways, and the risk of short circuit can be reduced.

  Further, by providing the relief groove, it is possible to avoid the resin bulge around the base portion of the lead wire of the light emitting diode, and to eliminate the floating of the light emitting diode.

  In addition, since the lengths of the first slope and the second slope are equal and the included angle between the first slope and the second slope is 45 degrees, the light-emitting diode can be stably mounted at 45 degrees. Can do.

  Hereinafter, a light emitting diode mounting spacer according to a second embodiment of the present invention will be described with reference to the drawings.

  FIG. 4 is a perspective view showing the configuration of the light-emitting diode mounting spacer according to the second embodiment of the present invention. In FIG. 4, a light-emitting diode mounting spacer 200 capable of mounting three light-emitting diodes in parallel at 45 degrees is shown. FIG. 5 is a plan view showing the configuration of the light emitting diode mounting spacer 200.

  As shown in FIGS. 4 and 5, in the light emitting diode mounting spacer 200, three triangular prisms are integrally formed with a predetermined interval via a connecting portion 26 therebetween, and each triangular prism is a first one in which the light emitting diodes are arranged. Two through holes 23a having a first inclined surface 21 and a second inclined surface 22 disposed on the printed circuit board as a bottom surface and perpendicular to the first inclined surface 21 from the first inclined surface 21 toward the second inclined surface 22. , 23b are provided. In addition, a recess 24 is formed in a region including the open ends of the through holes 23 a and 23 b on the second inclined surface 22. The recess 24 includes a front end surface 24a, a top surface 24b, and a rear end surface 24c, and the rear end surface 24c has a predetermined angle (for example, 45 degrees) with respect to the second inclined surface 22, that is, a through hole. It is made parallel to 23a, 23b. Thereby, when the lead wire 10a of the light emitting diode 10 is inserted into the through holes 23a and 23b, it is possible to avoid hitting the rear end surface 24c of the recess 24.

  Further, a relief groove 25 is provided in a region including the open ends of the through holes 23 a and 23 b on the first inclined surface 21 to avoid the resin bulge around the base portion of the lead wire 10 a of the light emitting diode 10.

  The light-emitting diode mounting spacer 200 is made of synthetic resin, and the first inclined surface 21 and the second inclined surface 22 have the same length, and the included angle between the first inclined surface 21 and the second inclined surface 22 is 45 degrees.

  The connecting portion 26 has a predetermined cross section that can be easily cut or broken. The connecting portion 26 is formed in a direction close to the first slope 21 on both side surfaces and parallel to the first slope 21. In addition, in order to perform a cutting | disconnection or a cutting | disconnection easily, you may make it make the cut | interruption 26a etc. in the single side | surface or both surfaces of the cutting part of the connection part 26. FIG. When two or one light emitting diodes 10 are attached, the connecting portion 26 of the triple light emitting diode attachment spacer 200 can be cut or broken to obtain two or one light emitting diode 10 spacers.

  FIG. 6 is a diagram showing a substrate mounting state of the light emitting diode mounting spacer 200. When attaching the light emitting diode 10 to the printed circuit board, the lead wires 10a of the three light emitting diodes 10 are inserted into the through holes 23a and 23b, respectively, and bent downward along the side surfaces of the recesses 24 at the rear ends of the through holes 23a and 23b. (Refer to FIG. 3 described above) Then, by inserting the tip of the lead wire 10a into the through hole of the printed board and performing soldering, the three light emitting diodes 10 are attached to the printed board in parallel at an angle of 45 degrees.

  As described above, in the above-described embodiment, the light-emitting diode mounting spacer 200 has three triangular prism bodies integrally formed with a predetermined interval via the connecting portion 26 therebetween, and from the first inclined surface 21 of each triangular prism body. Two through holes 23 a and 23 b perpendicular to the first inclined surface 21 are provided toward the second inclined surface 22. In addition, a recess 24 is formed in a region including the open ends of the through holes 23 a and 23 b on the second inclined surface 22. Further, a relief groove 25 is provided in a region including the open ends of the through holes 23 a and 23 b on the first inclined surface 21 to avoid the resin bulge around the base portion of the lead wire 10 a of the light emitting diode 10. For example, the lengths of the first slope 21 and the second slope 22 are equal, and the included angle between the first slope 21 and the second slope 22 is 45 degrees.

  Thereby, three light emitting diodes can be arranged in parallel and obliquely at a predetermined interval. Further, when the light emitting diode is attached to the printed circuit board, the lead wire of the light emitting diode is not exposed on the printed circuit board, and shots with other parts can be avoided. Further, by providing the recess 24 on the bottom surface, it is possible to secure a space for accommodating solder overflowing from the through hole of the substrate when the lead wire 10a is soldered to the substrate, and the solder overflows on the light emitting diode mounting spacer 200 side. It can be prevented from flowing out and flowing sideways, and the risk of a short circuit can be reduced.

  Further, by providing the relief groove, it is possible to avoid the resin bulge around the base portion of the lead wire of the light emitting diode, and to eliminate the floating of the light emitting diode.

  In addition, since the lengths of the first slope and the second slope are equal and the included angle between the first slope and the second slope is 45 degrees, the light-emitting diode can be stably mounted at 45 degrees. Can do.

  Further, the light emitting diode mounting spacer 200 can be easily cut or broken to arbitrarily obtain a double type diode mounting spacer.

  In the above-described embodiment, the light-emitting diode mounting spacers 100 and 200 are made of synthetic resin. However, the present invention is not limited to this. You may make it form using another nonelectroconductive material.

  In the above-described embodiment, the light-emitting diode mounting spacer 200 has been described as the triple-type light-emitting diode mounting spacer capable of mounting three light-emitting diodes in parallel at 45 degrees, but is not limited thereto. is not. The present invention can also be applied to a multiple type light emitting diode mounting spacer in which four or more light emitting diodes can be mounted at 45 degrees in parallel. Therefore, four or more light emitting diodes can be arranged in parallel. Moreover, according to the number of the light-emitting diodes to be attached, the multiple-type light-emitting diode attachment spacers can be cut into an appropriate number to be used as double, triple,.

  In the above-described embodiment, the first slope and the second slope of the light-emitting diode mounting spacers 100 and 200 have the same length, and the included angle between the first slope and the second slope is 45. However, the present invention is not limited to this.

  In the above-described embodiment, the light emitting diode mounting spacer 100 is provided with two through holes 13a and 13b perpendicular to the first inclined surface 11 from the first inclined surface 11 toward the second inclined surface 12. Although described, the present invention is not limited to this. For example, instead of the through holes 13a and 13b, two grooves perpendicular to the first inclined surface 11 from the first inclined surface 11 toward the second inclined surface 12 may be provided on both side surfaces of the triangular prism body. In this case, the lead wire of the light emitting diode is exposed on the side surface, but the light emitting diode can be easily attached and detached.

  The present invention can be applied to a light emitting diode mounting spacer for holding a light emitting diode and fixing it to a printed circuit board at a predetermined angle. Further, the present invention can be applied to a light emitting diode mounting spacer capable of mounting a plurality of light emitting diodes in parallel. Further, it can be used for the purpose of avoiding the resin bulge around the base portion of the lead wire of the light emitting diode and eliminating the floating of the light emitting diode.

It is a perspective view which shows the structure of the light emitting diode attachment spacer of 1st Embodiment. 3 is a plan view showing a configuration of a light emitting diode mounting spacer 100. FIG. It is a figure which shows the board | substrate mounting state of the light emitting diode attachment spacer. It is a perspective view which shows the structure of the light emitting diode attachment spacer of 2nd Embodiment. 3 is a plan view showing a configuration of a light emitting diode mounting spacer 200. FIG. It is a perspective view which shows the board | substrate mounting state of the light emitting diode attachment spacer 200. FIG. It is a top view which shows the structural example of the conventional light emitting diode attachment spacer. It is a figure which shows the board | substrate mounting state of the conventional light emitting diode attachment spacer.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Light emitting diode 10a Lead wire 11,21 1st slope 12,22 2nd slope 13a, 13b, 23a, 23b Through-hole 14,24 Recessed part 14a, 24a Front end surface 14b, 24b Top surface 14c, 24c Rear end surface 15, 25 Escape Groove 26 Connection 26a Cut 100,200 Light Emitting Diode Mounting Spacer

Claims (4)

A spacer mounted between a printed circuit board and a light emitting diode mounted on the printed circuit board, and holding the light emitting diode in a predetermined posture,
A non-conductive material is formed into a triangular prism body having a first inclined surface on which the light emitting diode is disposed and a second inclined surface disposed on the printed circuit board as a bottom surface,
Two through holes perpendicular to the first slope are provided from the first slope toward the second slope,
A light emitting diode mounting spacer, wherein a recess is formed in a region including the open end of the through hole on the second inclined surface.   2. The light emitting diode mounting spacer according to claim 1, wherein an escape groove for avoiding a resin bulge around a base portion of the lead wire of the light emitting diode is provided in a region including the open end of the through hole on the first slope. .   The length of the said 1st slope and the 2nd slope is equal, The included angle of this 1st slope and the 2nd slope is 45 degree | times, The said 1st person is the claim 2 characterized by the above-mentioned. Light emitting diode mounting spacer. The plurality of triangular prisms are integrally formed with a predetermined interval via a connecting portion provided on a side surface,
4. The light emitting diode mounting spacer according to claim 1, wherein the connection portion has a predetermined cross section that can be cut or broken. 5.

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