JP2006318316A - Quality monitoring apparatus, method and program, and computer readable recording medium - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a quality monitoring apparatus for easily obtaining an abnormality in a processing step to stabilize a manufacturing step including the processing step by displaying a test result in an order for processing wafers. <P>SOLUTION: A quality monitoring apparatus 101 is provided with: a graph data extraction part 114 for acquiring a wafer number for specifying a wafer tested in a test step and test results of the wafer in the test step from a test result DB group 103 storing test information of the wafer tested in a specific test step, and a wafer number for specifying the wafer processed in the processing step and a processing time when the processed object is processed in the processing step from a history DB 102 storing the processing information of the wafer processed in the specific processing step; a connection part 150 for associating the test result with the processing time based on the wafer number; and a sort processing part 130 for sorting the test results in the order of the time of processing the wafer in the specific processing step. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a quality monitoring apparatus that manages, for example, wafer history information and inspection information acquired in a semiconductor device manufacturing process, and displays variations in inspection results.

  Semiconductor devices are manufactured by repeating a series of manufacturing processes such as cleaning, film formation, resist coating, exposure, and etching on the wafer (substrate) by the number of defined layers to form wiring and circuit elements. Is done. However, since these manufacturing processes include elements that cause malfunctions of semiconductor devices such as foreign matter contamination and layer film formation defects, various inspections are performed as necessary during the manufacturing process. The

  The various inspections include, for example, a non-uniformity inspection for inspecting the non-uniformity of the film formed on the wafer, a film thickness measurement inspection for measuring the thickness of the formed film, and an overlay accuracy of the upper layer film and the lower layer film. Overlay accuracy measurement inspection to measure the position, size of the foreign material present on the wafer, characteristic inspection to check the electrical characteristics of the formed circuit elements, whether the semiconductor device actually operates For example, circuit inspection.

  In the conventional manufacturing process management system, the inspection results in these inspection processes are collected in a database, and the time transition of designated inspection items is displayed as a trend chart. Specifically, for example, the manufacturing process is managed by monitoring whether the inspection result does not exceed a preset control value, or whether the change in the measured value has a tendency such as an upward trend or a downward trend. (For example, refer to Patent Document 1).

  However, in the configuration disclosed in Patent Document 1, the inspection in these inspection processes is caused by the processing result of the manufacturing process prior to the inspection process. In the configuration disclosed in Patent Document 1, only the result of one inspection process is managed, and the entire production line is not managed.

Therefore, it has been proposed to more accurately grasp the state of the manufacturing process by collecting and using not only the inspection result in each inspection process but also the wafer processing history in the manufacturing process (for example, Patent Documents). 2). In the manufacturing process management system disclosed in Patent Document 2, in order to monitor a specific manufacturing facility assigned to a specific manufacturing process in advance, an inspection process and an inspection item in the inspection process are associated with the manufacturing facility. . In the configuration disclosed in Patent Document 2, the values of the inspection items monitored for the wafers processed in the manufacturing facility within a certain period are searched and rearranged in the order of inspection of the wafers by the inspection apparatus. By displaying it as a trend chart, the trend and abnormality of the manufacturing facility are grasped.
Japanese Patent Laid-Open No. 2-98632 (Release Date; April 11, 1990) JP 9-50949 A (publication date; February 18, 1997)

  However, in the conventional configuration, the inspection results are displayed in the order of wafer inspection by the inspection apparatus, and there is a problem that the inspection results cannot be displayed in the order of processing by the processing apparatus. Specifically, in Patent Document 2, the inspection date and time of the inspection device is stored, and the inspection result is displayed based on the inspection date and time. Thus, when the said test result is displayed based on test | inspection date, a test result cannot be displayed in the order processed by the process process (processing apparatus).

  For example, wafers to be processed while proceeding through a production line are used to inspect a plurality of wafers at once using the plurality of inspection apparatuses in a single production line, or a plurality of wafers using the plurality of processing apparatuses. Are processed at once, the order of the wafers flowing through the production line may change. However, in the above-described conventional configuration, the inspection results are displayed in the order in which they are inspected by the inspection apparatus, so that the inspection results are not displayed in the order in which they are actually processed by the processing apparatus.

  That is, when it is desired to detect an abnormality in the processing apparatus, it is necessary to display the inspection results in the processing order of the processing apparatus. However, in the conventional configuration, the wafer processing order in the processing apparatus is not managed. Inspection results cannot be displayed in the order of processing by various processing devices. In this case, the abnormality of the processing device cannot be quickly grasped.

  The present invention has been made in view of the above-mentioned problems, and its purpose is to easily grasp abnormalities in processing steps by displaying changes in physical quantities (inspection results) in the order of processing of objects to be processed. An object of the present invention is to provide a quality monitoring device that stabilizes a manufacturing process including a processing process.

  A quality monitoring apparatus according to the present invention is a quality monitoring apparatus for displaying quality fluctuations in a plurality of processing objects manufactured through a processing process and an inspection process in order to solve the above-described problem, From the inspection result storage device in which the processing object specifying information for specifying each of the plurality of processing objects inspected in the inspection process and the respective inspection results in the inspection process of the processing object are associated and stored , Inspection result acquisition means for acquiring a combination of the processing object specifying information and the inspection result for each of a plurality of processing objects, and a processing object for specifying each of the plurality of processing objects processed in a specific processing step From the processing information storage device in which the specific information and each processing time when the processing object is processed in the processing step are stored in association with each other, the processing object specifying information and the processing time are stored. Processing information acquisition means for acquiring a combination of times for each of a plurality of processing objects, association means for associating the inspection result with the processing time based on the processing object specifying information, and processing in the specific processing step Sorting means for sorting the inspection results in order of the processing time of the object is provided.

  According to said structure, the test result acquired by the test result acquisition means and the process time acquired by the process information acquisition means are linked | related using the said processed material specific information. Specifically, the inspection result having the same processed object specifying information is associated with the processing time. And the said test result is rearranged in order of the processing time of the process target object in the said specific process process using the linked | related result.

  Thereby, the inspection result inspected in the inspection process can be displayed in the order of the processing time of the processing object in the processing process, not in the inspection order of the processing object in the inspection process.

  Therefore, the presence or absence of abnormality of the processing apparatus can be more accurately grasped from the inspection result of the product processed by the processing apparatus.

  The quality monitoring apparatus according to the present invention includes a statistical processing unit that calculates at least one of an average value, a standard deviation, and a histogram distribution of the inspection result in a predetermined period in which a plurality of processing objects are processed in the processing step. The structure provided is more preferable.

  According to said structure, the result rearranged in the process order in a specific process process can be statistically processed, and the average value, standard deviation, and histogram distribution in a predetermined period can be calculated | required. Thereby, the transition of the result of the product (processing object) processed by the processing process can be grasped more accurately.

  In the quality monitoring apparatus according to the present invention, the statistical processing means calculates an average value of inspection results in a predetermined number of consecutive periods, and further calculates the average of the predetermined number of predetermined periods. When the value continuously rises or falls, it is more preferable to provide a notification means for notifying that effect.

  According to the above configuration, when the average value continuously rises or falls, it is considered that some abnormality has occurred in the processing process. Can be resolved.

  The quality monitoring apparatus according to the present invention further includes a determination means for determining whether or not the statistical processing value of the inspection result for a predetermined period is within a predetermined range, and when the statistical processing value is not within the predetermined range, A configuration including a notification unit that notifies the effect is more preferable.

  According to the above configuration, if the standard deviation of the inspection results during the predetermined period or the distribution of the histogram is not within the predetermined range, it is considered that some abnormality has occurred in the processing process, and thus a warning is issued in this case. Thus, the abnormality in the processing process can be eliminated at an early stage.

  The quality monitoring apparatus according to the present invention provides a means for deriving a critical value of cumulative probability for a histogram (probability density distribution) of inspection results in a predetermined period, and whether the critical value exists within the predetermined range. It is preferable to determine whether the notification means is present outside the predetermined range and to notify the fact when the notification means is present outside the predetermined range.

  According to the above configuration, it is not determined based on whether or not the standard deviation level is included in the predetermined range, but it is determined whether or not to issue a warning using the cumulative probability of the histogram. By using this cumulative probability, it is possible to grasp the abnormality of the processing process more accurately.

  The quality monitoring device according to the present invention is a case where a plurality of processing devices respectively perform the same processing step, and the processing information acquisition means further acquires processing device information for specifying the processing device, More preferably, the rearranging means rearranges the inspection results in order of processing time when the specific processing apparatus in the specific processing step processes the processing object.

  For example, when a processing step such as a film forming step is performed simultaneously using a plurality of processing devices, in other words, when one processing device is performed on a plurality of lines, only a specific processing device is abnormal There is.

  According to said structure, the test result of the process target object which the specific process apparatus processed in the specific process process can be displayed in order of the process time which the said process apparatus processed. Thereby, even when a specific processing apparatus becomes abnormal, it is possible to immediately grasp this abnormality.

  In the quality monitoring device according to the present invention, the inspection result acquisition means acquires a plurality of inspection results for a specific processing object obtained by a plurality of different inspection steps from the inspection result storage device. The calculation means includes a calculation means for obtaining a calculation result for a specific processing object by performing a calculation for obtaining a new physical quantity using the plurality of acquired inspection results, and the association means includes the processing object specification information. More preferably, the calculation result is associated with the processing time of the processing object in a specific processing step.

  According to said structure, a new physical quantity is calculated from a test result, This calculation result and the process order of the processing target object processed at a process process are matched and displayed on the graph. More specifically, using the processing object specifying information for specifying the processing object, the calculation result calculated based on the result obtained in the inspection process and the processing time at which the processing object is processed in the processing process Are associated with each other.

  By adopting the above configuration, a graph (result) in which new physical quantities (calculation results) obtained from the inspection result of the processing object inspected in the inspection step are rearranged in the processing order processed in the processing step. Can be displayed.

  Thereby, since an inspection result can be displayed not in the inspection order in the inspection process but in the order in which the processing object is processed in the processing process, an abnormality in the processing process can be detected. In addition, since a new physical quantity is calculated from physical quantities having different physical properties, for example, a physical quantity that cannot be directly measured in the inspection process can be displayed in the processing order processed in the processing process.

  In the quality monitoring apparatus according to the present invention, it is more preferable that the calculation means perform calculation using inspection results of different types of physical quantities.

  According to said structure, since it calculates using the result of a physical quantity different from each other, the thing for physical types different from the said physical quantity is obtained. Thereby, a physical quantity that cannot be directly inspected can be calculated and used as an inspection result.

  The quality monitoring apparatus according to the present invention has a configuration comprising display command means for displaying a plurality of inspection results on a specific processing object obtained in different inspection processes on a display device in a single graph according to the processing time. preferable.

  According to said structure, since a some test result can be displayed on one graph, a user (operator) judges whether abnormality has occurred in the processing process based on a plurality of information (test result). be able to.

  In the quality monitoring apparatus according to the present invention, it is more preferable that the display command means adjusts the scale of the graph so that the inspection results are not superimposed and displayed when the plurality of inspection results are displayed in a graph.

  According to said structure, since a scale can be adjusted so that a mutual result may not be superimposed and displayed when displaying a several result in a graph, a graph easy to see for a user can be displayed.

  A quality monitoring method according to the present invention is a quality monitoring method for displaying a variation in quality in a plurality of processing objects manufactured through a processing step and an inspection step, and a plurality of inspected in a specific inspection step From the inspection result storage device in which the processing object specifying information for specifying each processing object and each inspection result of the processing object in the inspection process are stored in association with each other, the processing object specifying information and the inspection are stored. An inspection result acquisition process for acquiring a combination of results for each of a plurality of processing objects, a processing object specifying information for specifying each of the plurality of processing objects processed in a specific processing process, and the processing object From the processing information storage device in which each processing time at the time of processing in the processing step is stored in association with each other, a plurality of combinations of the processing object specifying information and the processing time are stored. A processing information acquisition process to be acquired for each of the physical objects, an associating process for associating the inspection result with the processing time based on the processing object specifying information, and a processing time of the processing object in the specific processing process And a rearrangement step of rearranging the inspection results.

  According to said structure, the test result acquired by the test result acquisition process and the process information acquired by the process information acquisition process are linked | related using the said processed material specific information. And the said test result is rearranged in order of the processing time of the process target object in the said specific process process using the linked | related result.

  Thereby, the result inspected in the inspection process can be displayed in the order of the processing time of the processing object in the processing process, not in the inspection order of the processing object in the inspection process.

  Therefore, the presence or absence of abnormality of the processing apparatus can be more accurately grasped from the inspection result of the product processed by the processing apparatus.

  The quality monitoring apparatus may be realized by a computer. In this case, the quality monitoring program for causing the computer to realize the quality monitoring apparatus by operating the computer as each of the above means, and a computer recording the same A readable recording medium falls within the scope of the present invention.

  The quality monitoring apparatus according to the present invention stores the processing object specifying information for specifying the processing object inspected in the specific inspection process and the inspection result of the processing object in the inspection process in association with each other. Inspection result acquisition means for acquiring the processing object specifying information and the inspection result from the inspection result storage device, processing object specifying information for specifying the processing object processed in a specific processing step, and the processing object Processing information acquisition means for acquiring the processing object specifying information and the processing time from a processing information storage device in which processing times at the time of processing in the processing steps are stored in association with each other, and the processing object specification An association means for associating the inspection result with the processing time based on the information, and a rearranging means for rearranging the inspection result in order of the processing time of the processing object in the specific processing step. It is a configuration that.

  Thereby, the result inspected in the inspection process can be displayed in the order of the processing time of the processing object in the processing process, not in the inspection order of the processing object in the inspection process.

  Therefore, there is an effect that the presence or absence of abnormality of the processing apparatus can be grasped more accurately from the inspection result of the product processed by the processing apparatus.

[Embodiment 1]
An embodiment of the present invention will be described as follows.

  The quality monitoring apparatus according to the present embodiment is a process for specifying the processing object based on the inspection result of the processing object inspected in the inspection process and the processing history of the processing object processed in the processing process. The inspection result is displayed in the processing order of the processing object in the processing step by associating using the object specifying information.

  In the following description, a quality monitoring apparatus used in a semiconductor manufacturing process will be described in which a processing target is a semiconductor substrate (hereinafter referred to as a wafer).

  FIG. 2 is a diagram showing a schematic configuration of a manufacturing process management system including a quality monitoring apparatus according to the present embodiment. As shown in FIG. 2, in the manufacturing process management system 200, a plurality of processing devices 203, a plurality of inspection devices 205, a quality monitoring device 101, and a display client 110 are connected via a network 206. Has been. The wafer as the processing object is subjected to various types of processing and various types of inspection by the plurality of processing devices 203... And the plurality of inspection devices 205. That is, the wafer becomes a product through a manufacturing process including a plurality of processing steps and a plurality of inspection steps.

  The above manufacturing process represents a manufacturing line for processing an input wafer, and the wafer is, for example, a plurality of processing processes such as a cleaning process, a film forming process, an exposure process, a developing process, and an etching process (processing process 1 in the figure). As a result of being processed by ~ M), it is completed as a product. Here, the processing process is a process divided for each manufacturing process unit for the wafer, such as a cleaning process, a film forming process, an exposure process, an etching process, and the like. If so, at least one processing apparatus 203 is assigned in accordance with each process, such as a film forming apparatus.

  The manufacturing process includes, for example, a film thickness measurement inspection process for measuring the thickness of the formed thin film, a line width measurement inspection process for measuring the line width of the formed circuit, and the resistance value of the formed thin film. A plurality of inspection steps (in the figure, processing steps 1 to N) such as a resistance value measurement step for measuring the resistance are provided as necessary, so that it is possible to grasp whether the wafer has been processed normally in the processing step. ing. That is, the manufacturing process includes a plurality of processing steps and a plurality of inspection steps. Also in the inspection process, at least one inspection device 205 is assigned in accordance with each process. That is, a production line is formed by a plurality of processing devices 203... And inspection devices 205.

  The processing apparatuses 203 and inspection apparatuses 205 are connected to the quality monitoring apparatus 101 via a network 206. Through the network 206, the processing apparatus 203 stores wafer processing history information, and the inspection apparatus 205 stores wafer processing history information. Each of the inspection result information is transmitted to the quality monitoring apparatus 101.

  The quality monitoring apparatus 101 collects the transmitted processing history information and inspection result information, analyzes the data, and stores the data together with the processing history information and inspection result information in a database (DB: Data Base). The network 206 is connected to a display client 110 that is arranged in the manufacturing process or in the operator's room. The display client 110 can retrieve data stored in the quality monitoring apparatus 101 by an operator's operation and display the result as a graph on a monitor provided in the display client 110. Here, the quality monitoring apparatus will be described.

  FIG. 1 is a block diagram showing a schematic configuration of a quality monitoring apparatus 101 according to the present embodiment. The quality monitoring apparatus 101 includes a graph definition region 111, a history DB 102, an inspection result DB group 103, a graph data extraction unit 114, a graph creation unit 115, and a notification unit 123.

  The graph definition area 111 stores information necessary for creating a graph. Specifically, a graph definition table (information necessary for creating a graph) in which a graph number, a process step number, and an inspection step number are associated with each other is stored in the graph definition area.

  The graph number included in the graph definition table is a number assigned to specify a graph. If the graph data to be displayed is different, the graph number is different. The process step number is a process number assigned to designate a specific process step among a plurality of process steps constituting the manufacturing process. The said inspection process number is a process number attached | subjected in order to designate a specific inspection process among the inspection processes which comprise the manufacturing process. In the drawing, only one inspection process number is described, but there may be a plurality of inspection process numbers. The plurality of inspection steps and the plurality of processing steps each have a uniquely assigned number. That is, a different process number is assigned to each inspection process and each processing process. In the graph definition table, an inspection step number indicating an inspection step for inspecting a wafer processed in the processing step specified by the processing step number is associated with the processing step number, and the graph definition Defined in the table. In other words, the processing step number recorded in one graph definition table and the inspection step are closely related, and the processing performed in the processing step represented by the processing step number and the inspection after the processing A graph definition table is created so that the results are associated with each other.

  The data registration unit 104 receives processing history information (processing information) transmitted from a plurality of processing devices 203 constituting the manufacturing line and a plurality of inspection devices 205 constituting the manufacturing line. Inspection result information (inspection information) is registered in the history DB 102 or the inspection result DB group 103. More specifically, the data registration unit 104 includes a data distribution unit 124, and transmits the processing history information transmitted from the plurality of processing devices 203 to the history DB 102 from the plurality of inspection devices 205. The inspection result information is registered in the inspection DB 113 of the inspection result DB group 103.

  The history DB 102 includes wafer processing history information transmitted from a plurality of processing apparatuses 203 (in the drawing, processing apparatuses (A) to (C)) in the manufacturing process, and a plurality of inspection apparatuses 205 (see FIG. Among them, wafer processing history information transmitted from the inspection apparatuses (A) to (D)) is stored. This processing history information will be described later.

  The inspection result DB group stores wafer inspection result information transmitted from a plurality of inspection apparatuses 205 in the manufacturing process. This inspection result information will be described later. In the present embodiment, the inspection result information obtained by the inspection apparatus (A) is in the inspection DB (A) 113, and the inspection result information obtained by the inspection apparatus (B) is in the inspection DB (B) 113. The inspection result information obtained by the inspection apparatus (C) is registered in the inspection DB (C) 113, and the inspection result information obtained by the inspection apparatus (D) is registered in the inspection DB (D) 113. .

  The graph data extraction unit 114 generates data (inspection result information and processing history information) necessary for creating a graph from the inspection result DB group 103 and the history DB 102 based on a graph display instruction from the display client 110. To extract. More specifically, the graph data extraction unit 114 refers to the graph definition table stored in the graph definition area 111 based on a graph display instruction from the display client 110, and stores the history DB 102 and the inspection result DB group. Data necessary for creating a graph from 103 (hereinafter referred to as graph data) is extracted. The graph data extraction unit 114 includes a combination unit 150 (association unit). The combination unit 150 may use the extracted inspection result information and processing history information as, for example, a wafer number (lot number or the like). ) To associate these two pieces of information.

  The graph creation unit 115 creates a graph based on the graph data extracted by the graph data extraction unit 114. The graph creation unit 115 aggregates the inspection result information included in the graph data and determines whether or not the processing process is operating normally.

  The graph creation unit 115 includes a sort processing unit 130 and a data determination unit 132.

  The sort processing unit 130 sorts a large number of graph data extracted by the graph data extraction unit, and creates display data for graph display on the display client 110. More specifically, the sort processing unit 130 is a graph associated with the combining unit 150 of the graph data extracting unit 114 in the order of processing times included in the processing history information extracted from the history DB 102 by the graph data extracting unit 114. Data is sorted.

  The data determination unit 132 determines whether or not the processing device 203 is operating normally by performing statistical processing on the graph data extracted by the graph data extraction unit 114. The data determination unit 132 includes a statistical processing unit 131. The statistical processing unit 131 performs statistical processing of the inspection result included in the inspection result information extracted from the inspection result DB group 103 by the graph data extraction unit 114. The data aggregation process will be described later. When the data determination unit 132 determines that the processing performed by the processing device is abnormal based on the statistical processing result statistically processed by the statistical processing unit 131, the data determination unit 132 determines whether the processing is abnormal. Notifies that an abnormality has occurred.

  The notification unit 123 issues a warning when the statistical processing unit 131 determines that an abnormality has occurred. For example, the notification unit 123 may operate the display unit 122 of the display client 110 to issue a warning.

  Incidentally, the graph created by the graph creating unit 115 is displayed on the display unit 122 of the display client 110. The display client includes an instruction unit 121 that issues a graph display instruction for creating a graph to the quality monitoring apparatus 101, and a display unit 122 that displays the graph.

  Here, the history DB 102 and the processing history information (processing information) will be described. In the manufacturing process, when the processing apparatus 203 processes the wafer, the wafer No. assigned to the processed wafer is processed. Then, the process history information including the process number assigned to the processing process (hereinafter referred to as the processing process number) and the processing end date and time when the processing on the wafer is completed is transmitted to the quality monitoring apparatus 101. Here, wafer no. Is a number assigned to each wafer at the time of loading so as not to be duplicated in all wafers, and the process number is assigned to each process so as not to be duplicated in all steps of the manufacturing process or in all the treatment steps. Number.

  More specifically, the data registration unit 104 of the quality monitoring apparatus 101 has, for example, a data structure in which a wafer number, a lot number, a process number, a processing device, and a processing date / time are set as shown in FIG. The processing history information sent from the processing device 203 is registered in the history DB 102 as needed. Of the processing history information shown in FIG. 3, the processing device does not necessarily have to be stored. Also, for example, lot no. When displaying the graph in units, the wafer No. May not be stored, and conversely, wafer no. When a graph is displayed in units, lot no. It is not necessary to memorize about.

  In the manufacturing process, when the inspection apparatus 205 inspects the wafer, the wafer number assigned to the inspected wafer. Then, processing history information including a process number assigned to the inspection process (hereinafter referred to as an inspection process number) and an inspection end date and time when the wafer inspection is completed is transmitted to the quality monitoring apparatus 101. The data registration unit 104 stores the received processing history information in the history DB 102. That is, the history DB 102 stores history information of wafers processed (inspected) in the inspection process and the processing process.

  Therefore, as shown in FIG. 3, the history DB 102 records processing history information of wafers processed by the processing apparatus 203 and processing history information of wafers inspected (processed) by the inspection apparatus 205. .

  Next, inspection result information (inspection information) stored in each inspection DB 113 of the inspection result DB group 103 will be described. When the inspection of the wafer is completed, the inspection device 205 transmits inspection result information of the wafer to the quality monitoring device 101. More specifically, the inspection apparatus 205 has a wafer No. assigned to the inspected wafer. Then, the inspection process number assigned to the inspection process and the inspection result information including the inspection result of the wafer are transmitted to the quality monitoring apparatus 101. In addition, the wafer No. Is attached to the wafer as described above. Further, the inspection process number is a number assigned to each process so as not to be duplicated in all the manufacturing processes or all the inspection processes.

  More specifically, the data registration unit 104 of the quality monitoring apparatus 101 has, for example, a data structure in which a wafer number, a lot number, an inspection process number, and an inspection result are combined as shown in FIG. The test result information sent from is registered in the test result DB group 103 at any time. Also, for example, lot no. When displaying the graph in units, the wafer No. May not be stored, and conversely, wafer no. When a graph is displayed in units, lot no. It is not necessary to memorize about.

  Here, a flow of data when creating graph data based on an instruction from the display client 110 and performing a statistical processing result of the graph data will be described with reference to FIG. FIG. 5 is a flowchart showing the flow of the graph data creation process.

  First, processing and inspection in the processing device 203 and the inspection device 205 are performed before processing for creating graph data from the point in time when a graph creation instruction is issued from the display client 110.

  Specifically, for example, a semiconductor device manufacturing process includes a cleaning process, a film forming process, an exposure process, a developing process, and an etching process. In each step, the wafer is subjected to various processing by various processing devices 203, and inspected by the inspection device 205 in order to inspect the characteristics of the wafer changed by the processing. At this time, when the processing apparatus 203 processes the wafer, the processing apparatus 203 reads the wafer number and lot number of the wafer, and generates processing history information indicating a processing history. Then, the processing device 203 transmits the created processing history information to the quality monitoring device 101.

  The wafer processed by the processing apparatus 203 is inspected by the inspection apparatus 205. Then, when inspecting the wafer, the inspection device 205 reads the wafer No. and lot No. of the wafer, inspects the wafer, and creates inspection result information. Then, the inspection device 205 transmits the created inspection result information to the quality monitoring device 101.

  The processing history information and the inspection result information are stored and accumulated in the history DB 102 and the inspection result DB group 103 of the quality monitoring apparatus 101, respectively.

  Then, a graph creation command is issued from the operator of the display client 110 while the processing history information and the inspection result information are accumulated. Specifically, the operator of the display client 110 issues an instruction for a graph to be created and various setting information instructions such as a display period to the quality monitoring apparatus 101. Note that the display period is a range in which statistical processing is desired, and is, for example, a lot unit or the number of days. 9 or 2 days from December 4th to 5th. In the following description, a case will be described in which a graph that displays results in a predetermined period is created.

  Next, the graph data extraction unit of the quality monitoring apparatus 101 that has received the graph creation command from the operator of the display client (S100), based on the contents of the graph creation command, obtains necessary information from the history DB 102 and the inspection result. Extracted from the DB group 103 (S101). More specifically, the graph data extraction unit 114 acquires a graph definition table including the graph number from the graph definition region 111 based on the graph number included in the graph creation command. Then, the graph data extraction unit 114 extracts the process step number and the inspection step number described in the acquired graph definition table. Thereafter, the graph data extraction unit 114 acquires processing history information having the same process number as the processing step number from the history DB 102 based on the processing step number. Further, the graph data extraction unit 114 acquires the inspection result information having the same process number as the inspection process number from the inspection result DB group 103 based on the inspection process number.

  Then, the combining unit 150 of the graph data extracting unit 114 generates the graph data by combining the processing history information and the inspection result information based on the wafer No. from the acquired processing history information and the inspection result information. To do. Thereafter, the graph data extraction unit 114 transmits the created graph data to the graph creation unit.

  Next, the sort processing unit 130 of the graph creation unit 115 rearranges the graph data in the order of processing times of wafers processed in the specific processing apparatus 203 (S102). Specifically, the time and processing device name processed by the processing device are described in the graph data, and the sort processing unit 130 uses the two pieces of information to identify the specific processing device 203. After the graph data is extracted, the extracted graph data is rearranged in time order.

  FIG. 6 shows the data structure of the graph data after the sorting processing (sorting processing) is performed by the sorting processing unit 130. As shown in FIG. 6, the sort processing unit 130 rearranges the inspection results inspected by the inspection apparatus 205 so that the wafers are processed in a specific processing apparatus 203 (here, the film forming apparatus 1). I do.

  That is, the processing history information of the wafer processed by the processing apparatus 203 and the inspection result information inspected by the inspection apparatus 205 correspond to each other by using the wafer No. in the combining unit 150 of the graph data extraction unit 114. The attached graph data is created, and the sort processing unit 130 performs sort processing for rearranging the graph data in the order processed by the processing device 203. Thereby, graph data in which the inspection results are arranged in the processing order processed by the processing device 203 is created. Then, the data determination unit 132 transmits the display graph data to the display client 110.

  Next, the statistical processing unit 131 performs statistical processing on the examination results included in the graph data subjected to the sorting processing by the sorting processing unit 130, and issues a warning to the operator from the statistical processing results. It is determined whether or not. More specifically, the statistical processing unit 131 calculates the average value of the data, the standard deviation, and the cumulative probability distribution of the histogram based on the test result included in the graph data (S103). Then, display graph data for displaying on the display client 110 a graph of an average value of data in a specific period and / or a graph of standard deviation of data in a specific period is created (S104).

  The data determination unit 132 determines whether the result (standard deviation and cumulative probability) calculated by the statistical processing unit 131 is a specified value (S105).

  In S105, when the data determination unit 132 determines that the calculated result is not within the specified value (NO in S105), warning information for displaying a warning is displayed together with the graph data for display. The data is transmitted to the display client 110 (S106). On the other hand, when it is determined in S105 that the calculated result is within the specified value (YES in S105), the data determination unit 132 transmits only the display graph data to the display client 110. To do.

  Then, on the display unit 122 of the display client 110, a graph of the inspection result of the wafer processed within a specific period in the specific processing apparatus is displayed.

  Here, the determination criteria of the data determination unit 132 in step S105 will be described in detail.

  FIG. 7 shows a graph displayed on the display unit 122 of the display client 110 created using the display graph data created in step S104. Specifically, the graph shown in FIG. 7 is a graph showing the resistance value of a wafer processed by a specific processing apparatus 203. In the graph shown in FIG. 7, the horizontal axis represents a period obtained by dividing the processing time of the wafer processed by the processing apparatus 203 into predetermined ranges, and the vertical axis represents the resistance value.

  Specifically, A to H on the horizontal axis in FIG. 7 are periods during which the processing device 203 processes a single lot, and each point on the graph is processed by the processing device 203 during the period A to the period H. The processed lots are arranged in order. The circle in the graph indicates the average value of the wafers included in each lot, and the arrow indicates the standard deviation. The larger the size of this arrow, the greater the variation within the lot.

  Also, the two straight lines drawn in parallel with the horizontal axis of the graph are the upper limit / lower limit of the specified value, and if there is a numerical value of the characteristic inspection between the two specified values, the characteristic inspection is passed. Show. The two specified values are set as appropriate by the operator.

  Furthermore, a method for determining whether or not the data determination unit 132 issues a warning will be described with reference to FIG.

  Before that, as a comparison, for example, a graph showing the inspection result of a specific inspection apparatus 205 is shown in FIG. FIG. 8 shows manufacturing information (actual measurement data) of characteristic inspection performed after the film forming process. The horizontal axis in FIG. 8 indicates the time when the inspection apparatus 205 performs the inspection, and the vertical axis indicates the inspection result (measured resistance value). The graph of FIG. 8 shows the inspection result inspected by the specific inspection device 205, and is not in the order of processing by the processing device 203. In the result of FIG. 8, if the measured data clearly exceeds the specified value, an abnormality of the processing apparatus 203 manufacturing apparatus can be predicted, but the actual measured data is extremely difficult.

  On the other hand, in the present embodiment, the graph created by the graph creation unit displays the inspection results in the order of processing of a specific processing device, as shown in FIG.

  And the test result in the period A of the graph of FIG. 7 shows that the average value is within the specified value and the standard deviation is also within the specified value, and it can be seen that all products in the period A are manufactured smoothly. On the other hand, since the test result in period H is outside the specified value range for both the average value and the standard deviation, it indicates that all products in period H are out of range.

  In addition, since the test results in group I (periods B, C, and D) in the graph of FIG. 7 are within the specified values for both the average value and the standard deviation, the data determination unit 132 determines from this result. , Judge that all products have passed the characteristic inspection.

  However, even if the inspection result is within the specified range, it can be seen from the graph showing the actual inspection result that the average value gradually decreases, and there is some abnormality in the processing device 203 (manufacturing device). This suggests the possibility that it has occurred, and it is possible to confirm at a glance the abnormality of the processing device 203 that is difficult to understand only by displaying the actual measurement data. In other words, in the present embodiment, it is possible to predict the state of the processing device 203 and detect defective products by performing statistical processing of actually measured data.

  Therefore, the data determination unit 132 warns when the average value continuously increases or decreases even if the inspection result statistically processed by the statistical processing unit is within a predetermined specified range. May be issued. Specifically, in the result shown in FIG. 7, the data determination unit 132 acquires the average values of the periods B, C, and D, respectively, and determines that these inspection results are continuously decreasing. it can. In this case, when the data determination unit 132 displays the inspection result graph on the display unit 122 of the display client 110 as the graph data to be transmitted to the display client 110, the above-described periods B, C, D For example, a value obtained by connecting the average values of the two with a yellow straight line is created. Accordingly, the average value of the periods B, C, and D is connected to the display unit 122 by a yellow straight line, and a warning can be displayed to the operator.

  Further, the data determination unit 132 can create a command for sounding a warning sound together with the graph data, and transmit the command to the display client 110. In this case, a warning is displayed on the display unit 122 and a warning sound can be given to the operator. Through these warning displays, abnormalities in the manufacturing apparatus can be visually confirmed, and abnormalities can be predicted quickly, so throughput is not reduced. In addition, the yield is improved by detecting the abnormality at an early stage.

  In addition, the average value in group II (periods E, F, and G) of the graph shown in FIG. 7 is within the specified value, but the standard deviation exceeds the specified value, and the average value is within each period. It can be seen that some products have failed the characteristic inspection, and it can be seen that the variation is large within the period. Thus, the graph creation unit 115 creates the graph data for displaying not only the average value but also the standard deviation on the display unit 122 so that the processing device 203 has a large variation within a specific period. Therefore, the operator can confirm at a glance the abnormality of the processing device 203 that is difficult to understand only by displaying the actual measurement data.

  In addition, the data determination unit 132 may display a warning when the result of the statistical processing by the statistical processing unit 131 exceeds the preset standard deviation, and a warning sound may be displayed. Further warnings are possible by ringing. In this way, even when there is a large variation in the period, the warning display can visually identify the abnormality of the processing device 203 and quickly foresee the abnormality. Therefore, by detecting the abnormality early without reducing the throughput, the yield can be reduced. improves.

  In addition, according to an operator's instruction, for example, the data determination unit 132 includes data indicating a simple test result that is not subjected to statistical processing, and a graph subjected to statistical processing in a specific period as illustrated in FIG. For example, display graph data that is displayed at the same time, displayed separately, or displayed so as to be switched between each other may be created.

  So far, a quality management system has been described in which inspection results are obtained in the order of time series of wafers processed by the processing device 203 with an average value or standard deviation in an arbitrary period. This processing device 203 is used before and after maintenance. There are cases where the state changes to discontinuity, the fluctuation has periodicity, or the tendency gradually changes with time, and the data distribution is often different from the normal distribution.

  For example, FIG. 9 is a trend chart showing the inspection result of the substrate characteristics after processing by a certain processing apparatus 203. In this trend chart, the data distribution in the periods A, B, and C is various, such as a lid mountain distribution and a left-right asymmetric distribution, and is different from the normal distribution. For example, when an actual semiconductor substrate is manufactured, a test result that does not follow the normal distribution as described above is very often obtained due to the characteristics of the processing apparatus. Therefore, for the test result data that does not follow the normal distribution, a straight line 9 (indicated by a thick line in the figure) that simply represents the average value of the test results for a predetermined period is separated from the average value by a standard deviation. When quality control is performed using the straight line 8a and the straight line 8b (indicated by a broken line in the figure) representing the points, the ratio of being judged as defective becomes very large or conversely very small. Resulting in. Specifically, in the result of FIG. 9, it can be seen that in the period A, a lot of test result data is distributed in the region 11 that is lower than the straight line 8b representing the lower limit value of the standard deviation of the test result.

  In order to compare the distribution in the period A of the trend chart shown in FIG. 9 with the normal distribution, FIG. 10 shows the cumulative probability of the distribution. When the characteristic value X is distributed between Xmin and Xmax, the cumulative probability f (Xp) with respect to the characteristic value Xp represents the probability that the characteristic value X is included between Xmin and Xp.

  According to FIG. 10, the cumulative probability of the distribution of period A reaches 30% when the characteristic value is 55, but the cumulative probability of the normal distribution is only 16%. That is, when quality control is performed using only the average value and standard deviation of the inspection result data, there is a high possibility that it is determined to be normal although it is abnormal.

  Therefore, in the quality monitoring apparatus 101 according to the present embodiment, the data determination unit 132 determines whether or not the inspection result is abnormal based on the statistical processing result of the graph data acquired from the graph data extraction unit 114. This is determined using the equations (1) to (4).

Specifically, when the cumulative probability distribution for the test result histogram is f and the threshold value of the predetermined cumulative probability is fc, the data determination unit 132
fc = f (XL) (1)
1-fc = f (XU) (2)
Finding XL and XU
XL <LCL (lower limit) (3)
XU> UCL (upper limit) (4)
It is determined whether or not the above is satisfied, and if the expression (3) or (4) is satisfied, a warning is issued. The LCL (lower limit) and UCL (upper limit) are predetermined values.

  In the above example, the case where both the lower limit and the upper limit are determined is shown. However, for example, when only the lower limit is determined, the data determination unit 132 uses the above formula (1), (3) may be used to determine whether XL <LCL. On the other hand, when determining only the upper limit, the data determination unit 132 may determine whether XU> UCL using the equations (2) and (4). As described above, the data determination unit 132 can prevent erroneous determination by determining the cumulative value of the distribution of the target period instead of determining the range of the specified value based on the standard deviation.

  Now, assuming that the critical value of the cumulative probability is fc and giving 0.159 (15.9%), as shown in FIG. 10, from this value and the equation (1), 15.9 = f (XL) When XL is obtained, XL = 50, and when XU is similarly obtained, XU = 76.

  In the example of FIG. 10, the critical value of 15.9% is the cumulative probability when elements X ≦ M−σ and X ≧ M + σ in a normal distribution with an average M and standard deviation σ. In this embodiment, the cumulative probability corresponding to M ± σ is given as the critical value fc, but fc may be determined in accordance with the actual condition of monitoring the process.

  Then, for example, the lower limit characteristic value is LCL = 50, the upper limit characteristic value is UCL = 80, and the data determination unit 132 determines that the inspection result A inspected by the inspection apparatus 205 is within the range of the above formula (3). By issuing a warning when it is not within the range, it is possible to correctly determine the distribution bias as compared with a configuration in which it is determined whether or not to issue a warning using a normal distribution (in this case, the characteristic value of the lower limit is 55).

  FIG. 11 is a trend chart showing actual test results and limit values indicating whether or not the data determination unit 132 issues a warning.

  As shown in FIG. 11, at the lower limit and the upper limit obtained by the above formulas (1) to (4), that is, characteristic values 50 to 76 (the lower limit 50 is indicated by a straight line 10), the data determination unit 132 Is determined to issue a warning, a warning is issued when the straight line 10 indicating the cumulative probability level falls below the lower limit line 50 of the management range.

  Note that whether or not to issue a warning by the data determination unit 132 is not limited to the above. For example, the stricter one of the cumulative probability of the LCL and UCL and the conventional standard deviation criterion Criteria may be adopted, and both standard deviation criteria and cumulative probability criteria are obtained. If both are within the specified value range, it is considered normal.If one of the values is out of the specified value, attention is required. May be.

  As described above, the quality monitoring apparatus 101 according to the present embodiment has an inspection process number indicating a specific inspection process and a wafer No (processed object) that specifies a wafer (processing object) inspected in the inspection process. From the inspection result DB group (inspection result storage device) 103 that stores a plurality of inspection result information (inspection information) in which specific information) and inspection results in the inspection process of the wafer are associated with each other, Graph data extraction unit 114 (inspection result acquisition means) for acquiring the wafer No and the inspection result, processing step information indicating a specific processing step, and a wafer No for specifying the wafer processed in the processing step A history DB (processing information storage device) 102 that stores processing history information (processing information) associated with the processing time when the wafer is processed in the processing step. , The graph data extraction unit 114 (processing information acquisition means) for acquiring the wafer No and the processing time in a specific processing step, and the processing result in the specific processing step based on the processing result specifying information A combination unit 150 (association unit) for associating a processing time of an object, and a sort processing unit (rearrangement unit) 130 for rearranging the inspection results in order of the processing time of the processing object in the specific processing step. .

  According to said structure, the test result acquired by the graph data extraction part 114 and the process information acquired by the graph data extraction part 114 are linked | related using the said wafer No. Then, using the associated results, the inspection results are rearranged in the order of wafer processing times in the specific processing step.

  Thereby, the result inspected in the inspection step can be displayed in the order of wafer processing time in the processing step, not in the order of wafer inspection in the inspection step.

  Therefore, the presence or absence of abnormality of the processing device 203 can be more accurately grasped from the inspection result of the product processed by the processing device 203.

  The quality monitoring apparatus 101 according to the present embodiment calculates a statistical processing unit (statistical processing means) that calculates at least one of the average value, standard deviation, and cumulative probability distribution of the histogram for the predetermined period from the inspection result. A configuration including 131 is more preferable.

  According to said structure, the average value, standard deviation, and histogram distribution in a predetermined period can be calculated | required by statistically processing the result rearranged in the process order in a specific process process. Thereby, transition of the result of the product processed by the processing process can be grasped more accurately.

  In the quality monitoring apparatus 101 according to the present embodiment, when the statistical processing unit 131 calculates an average value of the inspection results in a predetermined period continuous with each other, the average value continuously increases or decreases. In addition, a configuration including a notification unit (notification unit) 123 that issues a warning is more preferable.

  According to the above configuration, if the average value rises continuously, it is considered that some abnormality has occurred in the processing process. In this case, by issuing a warning in this case, the abnormality in the processing process can be resolved early. can do.

  In the quality monitoring apparatus 101 according to the present embodiment, the statistical processing unit 131 calculates the standard deviation and / or cumulative probability of the histogram, and whether these statistical processing values are within a predetermined range. It is more preferable to include a data determination unit (determination unit) 132 that determines whether or not and a notification unit 123 that issues a warning if it is not within the predetermined range.

  According to the above configuration, if the statistical processing value of the inspection result is not within the predetermined range, it is considered that some abnormality has occurred in the processing process. Can be resolved early.

  When the quality monitoring apparatus 101 according to the present embodiment sets f as the cumulative probability distribution of histograms of a plurality of inspection results for a predetermined period and fc as a critical value of a predetermined cumulative probability, the statistical processing unit 131 sets fc = f While obtaining XL which becomes (XL), the data determination unit 132 determines whether XL <LCL using the lower limit specified value LCL, and the notification unit 123 determines that XL <LCL. When it is determined, a configuration for informing that effect is more preferable.

  Further, when the quality monitoring apparatus 101 according to the present embodiment sets the cumulative probability distribution of histograms of a plurality of inspection results for a predetermined period to f and the critical value of the predetermined cumulative probability fc, the statistical processing unit 131 The data determination unit 132 determines whether or not XU <UCL by using the upper limit specified value UCL, while obtaining XU that satisfies 1−fc = f (XU). If it is determined that <UCL, a configuration for informing that effect is more preferable.

  When the quality monitoring apparatus 101 according to the present embodiment sets the cumulative probability distribution of histograms of a plurality of inspection results for a predetermined period to f and the critical value of a predetermined cumulative probability to fc, the statistical processing unit 131 sets the fc to = F (XU) is obtained, and the data determination unit 132 determines whether or not XU> UCL using the upper limit specified value UCL. The notification unit 123 satisfies XU> UCL. If it is determined that there is, a configuration that notifies that effect is more preferable.

  According to the above configuration, the range of the specified value is not simply determined by the standard deviation, but it is determined whether or not to issue a warning by using probability density accumulation (that is, accumulated probability). By using this cumulative probability, it is possible to grasp the abnormality of the processing process more accurately.

  In addition, with the configuration of the quality monitoring apparatus 101 according to the present embodiment, the operating status of the production line (manufacturing process) can be easily grasped visually, and the quality of products being produced can also be visually confirmed in real time. It can be easily understood, and it is possible to perform quality control with high accuracy. In addition, since quality can be managed in real time, abnormalities in the manufacturing apparatus can be predicted and defects can be detected at an early stage, so that throughput can be improved, yield can be improved, and productivity can be increased.

  Also, statistical processing is performed to calculate standard deviation and average value or histogram and its cumulative probability distribution in an arbitrary period, so that the production status can be grasped with higher accuracy, and abnormality of the processing device 203 can be predicted. Since defects can be detected at an early stage, throughput can be improved, yield can be improved, and productivity can be increased.

  In addition, with the above configuration, a slight change in the processing device 203 is confirmed by displaying a warning when the average value of the inspection results after a plurality of continuous statistical processing increases or decreases. Since the tendency of the production status can be determined, an abnormality of the processing device 203 can be predicted.

  In addition, it is possible to produce a product with stable quality by determining whether the standard deviation of a plurality of inspection values within an arbitrary period is within the range of the specified value and displaying a warning when it is out of the range.

  Furthermore, by determining the distribution of inspection values based on the cumulative value of the probability density distribution of a plurality of inspection values in an arbitrary period, an abnormal state can be accurately determined even for data having a distribution different from the normal distribution.

  Moreover, according to said structure, in a manufacturing process which has a some processing process and a some inspection process, a manufacturing process management system calculates a new monitoring item from the test result in a some inspection process, and a desired processing process By associating the wafer processing history with the monitoring item in the desired processing apparatus 203 arranged in the above, the time transition of the processing state of the desired processing apparatus 203 can be managed using the new monitoring item.

  Further, the inspection results in a plurality of inspection processes are simultaneously monitored items, and the wafer processing history in the desired processing apparatus 203 arranged in the desired processing process is associated with the monitoring items, whereby the plurality of inspection processes It is possible to manage the time transition of the processing state of the desired processing device 203 using the inspection result as a monitoring item.

  In addition, a new monitoring item is calculated from a plurality of inspection items in the same inspection process, and the new processing item is associated with the processing history of the wafer in the desired processing apparatus 203 arranged in the desired processing step, thereby obtaining the new monitoring item. The time transition of the processing state of the desired processing device 203 can be managed using the monitoring item.

In the above example, the actual measurement data of the characteristic inspection of the semiconductor substrate has been described. However, the management method of the present invention can also be applied to the actual measurement data of the semiconductor substrate apparatus, for example, the actual measurement data such as the laser output. It can also be applied to products other than semiconductors.
[Embodiment 2]
Another embodiment of the present invention will be described as follows. For convenience of explanation, members having the same functions as those shown in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  The quality monitoring apparatus according to the present embodiment calculates a new physical quantity from a plurality of inspection results of the processing object inspected in the inspection process, and the calculation result and the processing object processed in the processing process. The processing history is associated with the processing object specifying information for specifying the processing object, and the calculation result is displayed in the processing order of the processing object in the processing process.

  In the present embodiment as well, a quality monitoring apparatus used in a semiconductor manufacturing process will be described in which a processing target is a semiconductor substrate (hereinafter referred to as a wafer).

  FIG. 12 is a block diagram showing a schematic configuration of the quality monitoring apparatus 101 according to the present embodiment. The quality monitoring apparatus 101 includes a data registration unit 104, a graph definition area 111, a data monitoring unit 105, a history DB 102, a data acquisition unit 116, an inspection result DB group 103, a calculation unit 118, a graph DB group 107, and a graph data extraction unit 114. And a graph creation unit 115.

  The graph definition area 111 stores data necessary for creating a graph. Specifically, as shown in FIG. 12, a graph definition table in which a graph number, a process step number, an inspection step number, a start step number, and a calculation method are associated is stored in the graph definition area. . More specifically, the calculation method indicates an arithmetic expression or a calculation method for calculating a new physical quantity using an inspection result obtained from the inspection device 205 (inspection process). Details of the graph definition table will be described later.

  The data monitoring unit 105 monitors whether the processing history information to be analyzed is registered in the history DB 102 in order to display a graph. More specifically, the data monitoring unit 105 monitors whether or not processing history information corresponding to the start process number included in the graph definition table stored in the graph definition area is stored in the history DB 102. is there.

  The data acquisition unit 116 is necessary for the calculation unit 118 (to be described later) to calculate data necessary for graph creation (hereinafter referred to as graph creation data) based on the graph definition table stored in the graph definition area. In this case, an inspection result is acquired from the inspection result DB group 103.

  The calculation unit 118 calculates data (hereinafter referred to as calculation results) necessary for actually displaying the graph based on the calculation method recorded in the graph definition table on the graph creation data acquired by the data acquisition unit 116. (Referred to as result information).

  The graph DB group 107 stores calculation result information obtained by the calculation unit 118. The graph DB group 107 includes a plurality of graph DBs (graph DBs (A) to (B) in the figure) 117. The calculation result information calculated by the calculation unit 118 is stored in different graph DBs 117 according to the graph numbers in the graph definition table.

  The graph data extraction unit 114 extracts graph data (calculation result information and processing history information) from the graph DB group 107 and the history DB 102 based on a graph display instruction from the display client 110.

  The graph creation unit 115 creates a graph using the graph data extracted by the graph data extraction unit 114. The graph creation unit 115 includes a sort processing unit 130. The graph creation unit 115 may include a data determination unit 132 as necessary.

  Next, inspection result information (inspection information) stored in each inspection DB 113 of the inspection result DB group 103 will be described. When the wafer inspection is completed, the inspection device 205 transmits the wafer inspection result information to the quality monitoring device 101 together with the processing history information. When the data registration unit 104 acquires the processing history information and the inspection result information from the inspection device 205, the data registration unit 104 stores the processing history information in the history DB 102 and the inspection result information in the inspection DB 113.

  13 and 14 are diagrams for explaining an inspection method in the inspection apparatus 205. FIG. 13 shows an example of current characteristic inspection. In FIG. 14, the current characteristics of the circuit 403 formed on the cell 402 arranged on the wafer 401 are measured.

  The current characteristic (inspection result) measured by the inspection device 205 is a cell ID that identifies a cell that is assigned in advance so as not to overlap the measured cell within the wafer, and the position of the measured circuit on the cell. Are grouped together with address values (X address, Y address) indicating the wafer number of the inspected wafer. The data is sent to the quality monitoring apparatus 101 together with the process number of the inspection process, the apparatus name of the inspected inspection apparatus 205, the inspection date and time, and is registered in the inspection DB 113 in the format shown in FIG.

  On the other hand, FIG. 14 is an example of overlay accuracy measurement. In the overlay accuracy measurement, alignment marks 601 and 602 are created at locations where the film forming base layer and the film forming layer should be at the same position, and the center point of the lower alignment mark 601 and the upper alignment mark are formed. The overlay accuracy of the deposited layers is measured by measuring the shift of the center point of 602. Since the inspection result obtained here is the coordinates and deviation amount of the measurement point with respect to the wafer, the inspection result transmitted to the quality monitoring apparatus 101 is registered in the inspection DB 113 in the format shown in FIG. In addition, the measurement point No. in FIG. Is a number assigned to each measurement point corresponding to each process by the inspection device 205. As is apparent from FIGS. 15 and 16, the format of the inspection result information differs depending on the content of the inspection. Therefore, the inspection result DB group 103 of the quality monitoring apparatus 101 has the same number of inspection DBs 113 as the inspection types.

  Next, a method for calculating graph data by the quality monitoring apparatus 101 shown in FIG. 1 will be described. Before that, the graph definition region 111 will be described.

  The quality monitoring apparatus 101 has a graph definition area 111, and a graph definition table is registered for each graph to be created, for example, according to the format shown in FIG. FIG. 17 shows the data structure of the graph definition table stored in the graph definition area 111. This graph definition table includes a graph number 801, a start process number 802, a plurality of inspection process numbers 803..., A calculation method 804, and a process process number 805.

  In this graph definition table, the graph number 801 is a number given so as not to overlap for each type of graph. Further, the start process number 802 indicates the process number of the inspection process in which the inspection is performed at the last of the plurality of inspection processes associated with each other among the inspection processes to be analyzed. In other words, the start process number 802 is a process number indicating an inspection process for obtaining an inspection result at the end of the inspection process for obtaining an inspection result necessary for calculating a new physical quantity. The inspection process number 803 is a process number assigned to the inspection process. Since the start process number 802 and the inspection process number 803 are allocated so as not to overlap in the manufacturing process, the type of the inspection process can be specified from the process number, but if the inspection type cannot be specified for some reason, the process number And the inspection type may be described as a pair. The calculation method 804 describes what kind of calculation is performed using the inspection result information of the inspection process number 803. Specific contents of the calculation method 804 will be described later. The processing step number 805 is a step number indicating the specific processing step when the calculation results obtained by the calculation unit 118 are rearranged in the processing order of the wafers in the specific processing step.

  FIG. 18 is a flowchart for calculating calculation result information. The data monitoring unit 105 in the quality monitoring apparatus 101 constantly monitors the history DB 102, and the inspection process number of the processing history information recorded in the history DB 102 matches the start process number 802 recorded in the graph definition table. It is determined whether it has been done (S901).

  The start process number 802 stored in the graph definition table indicates the last inspection process number 803 among the process numbers described in the graph definition table, and the data monitoring unit 105 starts the process number 802. When the same inspection process number is found, it is indicated that all the inspection results for performing the calculation by the calculation unit 118 are prepared. In other words, the data monitoring unit 105 monitors the start process number 802 recorded in the graph definition table in order to determine whether all the inspection results necessary for the calculation unit 118 to perform the calculation have been prepared. Yes.

  If it is detected that the inspection process number matching the start process number 802 is registered in the history DB 102 (YES in S901), the data monitoring unit 105 performs processing in which the inspection process number in the history DB 102 is recorded. From the history information, the wafer No. And the wafer No. is extracted. Then, the data acquisition unit 116 is notified of the graph number 801 of the graph definition table in which the start process number 802 is recorded (S902).

  Next, the data acquisition unit 116 notified of the wafer number and the graph number 801 acquires a graph definition table including the graph number 801 from the graph definition table described in the graph definition area 111. Then, the data acquisition unit 116 extracts inspection result information having the same inspection process number as the inspection process number 803 recorded in the acquired graph definition table from the inspection result DB group 103. And the data acquisition part 116 acquires the test result containing the same wafer No as the notified wafer No from the extracted test result information. In this way, the data acquisition unit 116 acquires the inspection result necessary for the calculation by the calculation unit 118 (S903).

  Then, the data acquisition unit 116 transmits the acquired inspection result, the wafer number and the calculation method recorded in the acquired graph definition table to the calculation unit 118.

  The calculation unit 118 that has acquired the inspection result and the calculation method calculates a new physical quantity from the inspection result based on the calculation method (S904).

  Next, the computing unit 118 stores the graph data in which the calculated new physical quantity is associated with the wafer number in the graph DB 117 of the graph DB group 107 (S905).

  In this way, a new physical quantity is calculated from the inspection result. Note that the calculated physical quantity may be the same as or different from the type before the calculation.

  The graph DB 117 in which calculation result information obtained by the calculation by the calculation unit 118 is recorded, for example, as shown in FIG. 19, an item (item) indicating a wafer number and a new physical quantity that is an item to be displayed in the graph. 1 and items 2... Are associated with each other. Since items to be displayed in the graph are different for each graph, the graph DB 117 exists for each type of graph. Note that the new physical quantity created by the calculation method included in the graph definition table and the wafer No. are associated with each other and stored in a different graph DB 117 for each graph number included in each graph definition table. Is done. For example, the new physical quantity, the wafer number, and the graph number may be stored in the graph DB 117 in association with each other.

  Here, the calculation procedure in the case of calculating the items to be monitored from the inspection results in a plurality of inspection processes and preparing the calculation result information will be specifically described. FIG. 20 is a diagram illustrating an example in which the resistance characteristic of the wafer is calculated based on the result of the current characteristic inspection and the result of the voltage characteristic inspection. In this example, the current characteristic inspection and the voltage characteristic inspection measure the same circuit 1102 formed on the wafer, and the same measurement point No is given to the measurement point of the same circuit. To do. Hereinafter, a graph that displays three items of current characteristics, voltage characteristics, and resistance characteristics calculated therefrom as a trend chart is referred to as a characteristic graph. An example of the characteristic graph is shown in FIG. In the graph definition table of FIG. 17, the graph number assigned to the characteristic graph is the graph number 801, the process number of the voltage characteristic inspection to be performed later is the start process number 802, and the current characteristic inspection process to be performed previously. The numbers are described in the inspection process number 803, respectively.

  When the current characteristic inspection for the wafer 1101 is completed, the current characteristic measuring apparatus, which is one of the inspection apparatuses 205, displays the current characteristic inspection process number and the wafer No. of the wafer 1101. And the like, and the inspection result information describing the inspection results of the individual circuits are transmitted to the quality monitoring apparatus 101. The data registration unit 104 registers the processing history information in the history DB 102 and the inspection result information in the inspection DB 113 according to the formats of FIGS. At this time, the data monitoring unit 105 monitors the history DB 102, but the processing history of the current characteristic inspection is different from the start process number 802, so nothing is notified to the data acquisition unit 116.

  Next, when the voltage characteristic inspection is carried out, the processing history information and the inspection result information are transmitted to the quality monitoring apparatus 101 by the voltage characteristic measuring apparatus, which is one of the inspection apparatuses 205, in the same manner as the current characteristic inspection. Registered in the DB 102 and the inspection DB 113, respectively. At this time, the data monitoring unit 105 determines that the inspection process number included in the processing history information registered in the history DB 102 matches the start process number 802 included in the graph definition table, and the data acquisition unit 116. The data acquisition command by is issued. And the process of said step S903-S905 is performed. The voltage characteristic inspection is to measure the voltage characteristic instead of measuring the current characteristic as shown in FIG. 13, and the inspection result of the voltage characteristic is, for example, in the format as shown in FIG. However, it is not always necessary to record in the same format as that shown in FIG.

  FIG. 22 shows a flowchart of this calculation process. First, the data monitoring unit 105 determines whether or not the voltage characteristic inspection process history information is registered in the history DB 102 (S1301). If it is determined in step S1301 that the voltage characteristic inspection processing history information has been registered, the data monitoring unit 105 determines the wafer No. of the wafer 1101. And the graph number 801 of the characteristic graph is notified to the data acquisition unit 116 (S1302). The data acquisition unit 116 confirms the inspection process number 803 to be analyzed from the notified graph number 801, and from the inspection DB 113 of the inspection result DB group 103, based on the inspection process number 803, the data structure shown in FIG. The inspection results of the current characteristic inspection and the voltage characteristic inspection having the above are acquired (S1303). Receiving the inspection result from the data acquisition unit 116, the arithmetic unit 118 extracts the current characteristic and the voltage characteristic of the circuit having the same measurement point No from the inspection result of the current characteristic inspection and the voltage characteristic inspection, and is described in the graph definition table. The resistance characteristic is calculated according to the calculation method (S1304). Then, the calculation unit 118 calculates the measured value of the electrical characteristic inspection, the measured value of the voltage characteristic inspection, and the maximum value-average value-minimum value of the resistance characteristic in the wafer, and the data structure (wafer No. and wafer number) shown in FIG. The data is registered in the graph DB 117 of the graph DB group 107 in a format in which the calculated calculation result is associated (S1305).

  In the flowchart of FIG. 22, the start process number 802 and the inspection process number 803 are set to different inspection process numbers and recorded in the graph DB 117 without calculating values from the inspection result information. Graph data for displaying inspection results in the process as the same trend chart can be created. In this case, as a calculation method, information for creating graph data for displaying a plurality of inspection results is simply described.

  Next, a method for calculating new monitoring items from a plurality of inspection items in a certain inspection process and calculating operation result information will be described. FIG. 24 shows an example of an electrical characteristic test, and is a drawing for explaining an example in which current characteristics and voltage characteristics are simultaneously measured in the test. And the quality monitoring apparatus 101 concerning this Embodiment calculates resistance characteristics from these test | inspection items. Hereinafter, a method of creating graph data for displaying a graph indicating three items of the current characteristic, the voltage characteristic, and the resistance characteristic calculated from the current characteristic measured in the electrical characteristic test 1105 will be described. In the following description, a graph showing the above three items will be referred to as a characteristic graph.

  When the current characteristic and the voltage characteristic are measured simultaneously, the graph definition table shown in FIG. 17 includes the graph number assigned to the characteristic graph as the graph number 801 and the start process number 802 includes the process number of the electrical characteristic inspection. Each is set, and no process number is set in the inspection process number 803. When the electrical property inspection performed on the wafer (not shown) is completed, the electrical property measuring apparatus displays the process number of the electrical property inspection and the wafer number of the wafer. And the like, and the inspection result information describing the inspection results of the individual circuits are transmitted to the quality monitoring apparatus 101. The data registration unit 104 registers the processing history information in the history DB 102 and the inspection result information in the inspection DB 113 according to the formats of FIGS.

  At this time, the data monitoring unit 105 determines whether the inspection process number included in the processing history information registered in the history DB 102 matches the start process number 802 included in the graph definition table. If it is determined that the data acquisition unit 116 determines that the data acquisition unit 116 has received the data, the data acquisition unit 116 issues a data acquisition command. And the process of said step S903-S905 is performed.

  FIG. 25 shows a flowchart of this calculation process. First, the data monitoring unit 105 determines whether or not processing history information for electrical characteristic inspection is registered in the history DB 102 (S1601). If it is determined in step S1601 that the processing history information of the electrical characteristic inspection has been registered, the data monitoring unit 105 checks the wafer No. of the inspection wafer (not shown). And the graph number 801 of the characteristic graph is notified to the data acquisition unit 116 (S1602). The data acquisition unit 116 confirms the start process number 802 to be analyzed from the notified graph number 801, and based on the start process number 802 from the inspection DB 113 of the inspection result DB group 103, the data structure shown in FIG. (S1603). Receiving the test result information from the data acquisition unit 116, the calculation unit 118 extracts the current characteristic and voltage characteristic for each circuit from the test result information of the electrical characteristic test, and calculates the resistance characteristic according to the calculation method described in the graph definition table. Calculate (S1604). Then, the calculation unit 118 calculates the measured value of the electrical characteristic inspection, the measured value of the voltage characteristic inspection, and the maximum value-average value-minimum value of the resistance characteristic in the wafer, and the data structure (wafer No. and wafer number) shown in FIG. The data is registered in the graph DB 117 of the graph DB group 107 in a format in which the calculated calculation result is associated (S1605).

  In this way, the quality monitoring apparatus 101 according to the present embodiment acquires the inspection result from the inspection DB 113 of the inspection result DB group 103, calculates a new physical quantity by the arithmetic unit 118, and the result is the graph DB 117. Is remembered.

  Next, a process for creating graph data from the calculation result information stored in the graph DB 117 will be described. When actually displaying a graph, for example, there are a method of displaying a wafer as a minimum unit and a method of displaying a lot as a minimum unit, and each case will be described.

  The display client 110 connected to the network 206 shown in FIG. 2 designates a search condition for a graph to be viewed with respect to the quality monitoring apparatus 101, and displays the data accumulated in the server as a trend chart. 121. The search conditions for the graph include, for example, the type of graph to be displayed, the rearrangement method when the lots are arranged in the processing order, the processing period to be displayed, and whether the display unit of the graph is a wafer or a lot.

  When the display client 110 instructs these conditions to the graph data extraction unit 114 of the quality monitoring apparatus 101, the graph data extraction unit 114 is necessary for creating graph data from each of the data in the history DB 102 and the graph DB 117. Simple data (processing history information and calculation result information) is extracted, and the data is transmitted to the graph creating unit 115 that creates graph data. Then, the graph creation unit 115 creates the graph data, and then transmits the graph data to the display client 110.

  Here, processing for displaying a characteristic graph in units of wafers will be described with reference to the flowchart of FIG.

  When the operator inputs a search condition to the instruction unit 121 of the display client 110 and issues a graph creation command, the display client 110 sends the input search condition to the graph data extraction unit 114 of the quality monitoring apparatus 101. Send to. This search condition includes a graph number indicating a graph to be displayed. Then, when receiving the search condition (S1701), the graph data extraction unit 114 extracts a graph definition table having the same graph number as the graph number included in the search condition from the graph definition area 111 (S1702).

  Next, the graph data extraction unit 114 acquires process history information having the same process number as the process process number included in the extracted graph definition table among the process history information included in the history DB 102. Note that the graph data extraction unit 114 acquires processing history information corresponding to a specific period included in the search condition when acquiring the processing history information (S1703).

  Next, the graph data extraction unit 114 acquires calculation result information in which the wafer No and the calculation result are associated from the graph DB 117 in which the calculation result calculated by the calculation method included in the graph definition table is recorded. (S1704).

  Then, the combining unit 150 of the graph data extracting unit 114 associates the acquired processing history information with the calculation result information (S1705). Specifically, the combining unit 150 associates the wafer No. included in each of the acquired processing history information and calculation result information with each other as a key. Then, the graph data extraction unit 114 transmits the associated data (processing history information and calculation result information) to the graph creation unit 115.

  Then, the sort processing unit 130 of the graph creating unit 115 converts the associated data into the processing date / time information included in the processing history information, specifically, the date / time information of the wafer processed by the specific processing apparatus 203. Based on the above, the data is rearranged so as to be in the order of the wafers processed by the specific processing apparatus 203 (S1706). Thereby, graph data is created.

  Then, the graph creation unit 115 transmits the created graph data to the display client 110 (S1707). Then, the display client 110 displays a characteristic graph on the display unit 122 based on the received graph data. In this way, graph data is created by the graph data extraction unit 114 and the graph creation unit 115. When the graph data extraction unit 114 obtains the processing history information in step S1704, if the fact that a graph for only the specific processing device 203 is displayed is recorded in the search result, The graph data extraction unit 114 may acquire only the processing history information indicating the history processed by the specific processing device 203 among the processing history information.

  FIG. 28 shows a data structure for explaining the graph data created in steps S1701 to S1706. In step S1703 of FIG. 24, the graph data extraction unit 114 acquires processing history information 1801 for each processing device 203 of the specified processing process. Then, the graph data extraction unit 114 displays the wafer No. of the processing history information 1801. Calculation result information (electric characteristic graph) 1802 having the same wafer No. is extracted from the graph DB 117. Then, the combining unit 150 associates the processing history information 1801 and the calculation result information 1802 with the wafer number as a key, thereby generating graph data. Such graph data is created for each processing device 203 and displayed as a characteristic graph for each processing device 203 in the display client 110.

  Next, regarding the process for displaying the characteristic graph in lot units, in the following description, a method for creating graph data without using the graph definition table is created. However, the method described below is performed in units of wafers. The present invention can also be applied when displaying a characteristic graph. Further, the process for displaying the characteristic graph in units of wafers described above may be applied to the following process for displaying the characteristic graph in units of lots.

  FIG. 29 is a flowchart for explaining processing for displaying a characteristic graph in units of lots. When the operator inputs a search condition to the display client 110, the display client 110 transmits the input search condition to the graph data extraction unit 114 of the quality monitoring apparatus 101. When the graph data extraction unit 114 receives the search condition (S1901), the history data of the wafers that match the search condition (more specifically, a list of process history information from the history DB 102). Simply described as processing history information) (S1902). This processing history information includes the wafer No. Lot number of the lot that belonged when the wafer was processed. And the date and time when the wafer was processed by the processing apparatus.

  Next, the graph data extraction unit 114 specifies the graph DB 117 from which the operation result information is acquired from the search condition, and from the graph DB 117, the wafer No. included in the processing history information created in step S1902 above. Calculation result information (more specifically, a list of calculation result information, but here described as unit calculation result information) is acquired (step S1903). The combining unit 150 of the graph data extracting unit 114 is connected to the wafer No. The obtained calculation result information and the processing history information are combined for each processing device using as a key (step S1904). The combined calculation result information and the processing history information are intermediate data for creating calculation result information, unlike the case of displaying a graph in units of wafers.

  Next, the graph data extraction unit 114 transmits the intermediate data to the graph creation unit 115. Then, the sort processing unit 130 of the graph creating unit 115 applies the same lot number to the intermediate data. Graph data is created by re-aggregating the values of the data of wafers having a group (S1905).

  Thereafter, the graph creation unit 115 transmits the created graph data to the display client 110 (S1906). Then, the display client 110 displays a characteristic graph on the display unit 122 based on the received graph data. In this way, graph data is created by the graph data extraction unit 114 and the graph creation unit 115.

  FIG. 30 shows an example of intermediate data created in steps S1901 to S1704. The processing history information 2001 acquired in step S1902 includes the lot No. in the processing history information for each wafer shown in FIG. It has a structure with. The calculation result information 2002 is the same as the calculation result information for each wafer shown in FIG. Then, the coupling unit 150 allows the information to be stored in the wafer No. Are used as keys to create intermediate data 2101.

  FIG. 31 shows a data structure for explaining graph data created from the intermediate data of FIG. The sort processing unit 130 of the graph creation unit 115 includes the same lot number of the intermediate data shown in FIG. The intermediate data 2101 obtained by grouping the data having “” is re-aggregated to generate graph data 2102. In this graph data 2102, the processing date and time is the latest processing date and time of the wafers grouped in the intermediate data 2101. Further, the maximum value of the current characteristics of the data included in the intermediate data 2101 is the maximum value of the current characteristics, and the average value of the average current characteristics of the data included in the intermediate data 2101 is the minimum value of the average value. , The minimum value among the current characteristic minimum values of the data included in the intermediate data 2101 is stored. Further, the voltage data and the resistance characteristics are also re-calculated in the same manner as described above, and the graph data 2102 is created. Then, the final graph data is obtained by sorting the graph data 2102 for all lots included in the intermediate data shown in FIG.

  As described above, the quality monitoring apparatus 101 according to the present embodiment has the inspection result DB group 103 (inspection result storage apparatus) in which inspection information of a wafer (processing object) inspected in a specific inspection process is stored. ) To use the inspection result of the wafer in the inspection step to calculate a new physical quantity (calculation means) 118, the new physical quantity calculated by the arithmetic section 118, and the wafer from which the physical quantity is calculated. A graph data extraction unit (calculation result information acquisition unit) 114 that acquires calculation result information associated with a wafer No that identifies the wafer No. and processing information of the wafer processed in a specific processing step are stored. Processing from the history DB (processing information storage device) 102 for identifying the wafer processed in the processing step and processing when the wafer is processed in the processing step A graph data extraction unit (processing information acquisition unit) 114 for acquiring time, a coupling unit 150 (association unit) for associating the inspection result with the processing time based on the wafer No, and the specific processing step. It is the structure provided with the sort process part (sorting means) 130 which sorts the said test result in order of the process time of a process target object.

  Further, the quality monitoring apparatus 101 according to the present embodiment is a case where a plurality of processing devices 203 perform the same processing steps with each other, and the graph data extraction unit 114 further specifies a processing device 203. More preferably, the sort processing unit 130 is configured to sort the inspection results in the order of processing times when the specific processing apparatus 203 in the specific processing step processes the wafer.

  For example, when a processing process such as a film forming process is performed simultaneously using a plurality of processing apparatuses 203, in other words, when one processing apparatus 203 is performed on a plurality of lines, only a specific processing apparatus 203 is abnormal. It may be.

  According to said structure, the inspection result of the wafer which the specific processing apparatus 203 processed in the specific processing process can be displayed in order of the processing time which the said processing apparatus 203 processed. Thereby, even when a specific processing apparatus 203 becomes abnormal, it is possible to immediately grasp this abnormality.

  In the quality monitoring apparatus 101 according to the present embodiment, the graph data extraction unit 114 acquires, from the inspection result DB group 103, a plurality of inspection results for a specific wafer obtained by a plurality of different inspection processes. A calculation unit 118 that obtains a calculation result for a specific wafer by performing a calculation for obtaining a new physical quantity using the plurality of acquired inspection results, and the coupling unit 150 includes the wafer No. More preferably, the calculation result is associated with the wafer processing time in a specific processing step.

  According to the above configuration, a new physical quantity is calculated from the inspection result, and the calculation result and the processing order of the wafer processed in the processing step are displayed in a graph in association with each other. More specifically, using the wafer No that identifies the wafer, the calculation result calculated based on the result obtained in the inspection process is associated with the processing time at which the wafer was processed in the processing process. .

  With the above configuration, a new physical quantity (calculation result) obtained from the inspection result of the wafer inspected in the inspection process is displayed in a graph (result) rearranged in the processing order processed in the processing process. can do.

  Thereby, since the inspection results can be displayed not in the inspection order in the inspection process but in the order in which the wafers are processed in the processing process, an abnormality in the processing process can be detected. In addition, since a new physical quantity is calculated from physical quantities having different physical properties, for example, a physical quantity that cannot be directly measured in the inspection process can be displayed in the processing order processed in the processing process.

  The quality monitoring apparatus 101 according to the present embodiment preferably has a configuration in which the calculation unit 118 performs a calculation using inspection results of different types of physical quantities.

  According to said structure, since it calculates using the result of a physical quantity different from each other, the thing for physical types different from the said physical quantity is obtained. Thereby, a physical quantity that cannot be directly inspected can be calculated and used as an inspection result.

  The quality monitoring apparatus 101 according to the present embodiment includes a graph creation unit 115 that causes the display client 110 to display the results rearranged by the sort processing unit 130. The graph creation unit 115 includes a plurality of the results. Is more preferable to display a single graph.

  According to said structure, since a several result can be displayed on one graph, the user (operator) can judge whether abnormality has occurred in the process based on several information.

  The quality monitoring apparatus 101 according to the present embodiment is configured such that the graph creating unit 115 can adjust the scale of the graph so that the results are not superimposed and displayed when the plurality of results are displayed as a graph. Is more preferable.

  According to said structure, since a scale can be adjusted so that a mutual result may not be superimposed and displayed when displaying a several result in a graph, a graph easy to see for a user can be displayed.

  Then, with the configuration of the quality monitoring apparatus 101 according to the present embodiment, the following can be realized. Specifically, with the above-described configuration, a new item to be monitored can be calculated from inspection results in a plurality of inspection processes. For example, when you want to monitor the resistance characteristics calculated from the current characteristics and voltage characteristics measured in separate inspection processes, the circuit made on the wafer measures the current characteristics in the current inspection process placed in the manufacturing process. After that, the voltage characteristics are measured in a voltage inspection process that is also arranged in the manufacturing process. If there is no inspection process for measuring the resistance characteristic in this manufacturing process, it is necessary to calculate the resistance characteristic from the measurement value of the current inspection process and the measurement value of the voltage inspection process in order to monitor the resistance characteristic of the circuit 1102. However, conventionally, since there is no means for extracting a specific inspection item from a plurality of processes and calculating a new monitoring item, the newly calculated item cannot be calculated. However, since the quality monitoring apparatus 101 according to the present embodiment can calculate a new physical quantity from a plurality of inspection results, for example, an inspection item that cannot be directly measured can be calculated. Can be displayed in the order of wafers processed by the processing apparatus 203.

  Moreover, by setting it as said structure, the test result in the some test process which performs a different test | inspection can be displayed as the same trend chart. In general, characteristic inspection is performed in the final process of semiconductor device manufacturing. However, if an abnormality occurs in the electrical characteristics of a semiconductor device, various processes up to the final process are considered as possible causes. Although the cause can be easily determined by comparing the inspection result with the inspection result in another inspection process, the conventional configuration cannot simultaneously display the results of the different inspection processes. However, since the quality monitoring apparatus 101 according to the present embodiment can display inspection results in a plurality of inspection processes for performing different inspections as the same trend chart, even if an abnormality occurs in a specific processing process, this cause Can be identified quickly.

  Further, with the above configuration, a new monitoring item can be calculated from one or a plurality of inspection items in a certain inspection process. For example, if you want to use the resistance characteristics obtained from current measurement and voltage measurement measured in a certain inspection process for monitoring, it is necessary to perform calculations for current measurement and voltage measurement. There is no simple means. However, since the quality monitoring apparatus 101 according to the present embodiment can calculate new monitoring items from one or more inspection items in the inspection process, inspection items that cannot be directly measured can be used for monitoring.

  In the manufacturing process, the wafer constituting the lot at the time of lot insertion may change during the process due to the reorganization of the lot or extraction by defect determination. Even in such a case, by using the quality monitoring apparatus 101 of the present embodiment, it is possible to reproduce the lot processing status in the specified processing process.

  FIG. 32 shows an example of a screen when a characteristic graph is displayed on the display unit 122 of the display client 110. Two processing apparatuses AAA-1 and AAA-2 are assigned to the process number XXXX displayed on the display unit 2201, and the results of the electrical property inspection of the wafer processed by each apparatus are shown in graphs 2202 and 2203. Respectively. Here, the vertical axis of the graphs 2203 and 2203 has overlapping current characteristics, voltage characteristics, and resistance characteristics, and the horizontal axis represents the processing date and time. These graphs can be easily drawn by plotting the graph data shown in FIGS. Also, the display unit 2204 in the figure shows the wafer No. of the wafer selected on the graph. Or the values of the electrical characteristics, etc., but these values are also included in the calculation result information and can be easily displayed.

  Further, when the processing apparatus 203 or the inspection apparatus 205 in the manufacturing process includes a plurality of processing chambers, the processing chamber name may be added to the processing history information transmitted from the processing apparatus 203 to the quality monitoring apparatus 101. In this case, the data structure of the history DB 102 shown in FIG. 3 adds and stores chamber information for processing each wafer. Accordingly, in response to a graph display request from the display client 110, the graph data extraction unit 114 creates calculation result information for each chamber of each processing apparatus, so that the processing apparatus 203 designated on the display client 110 is specified. A trend chart can be displayed for each processing chamber.

  Further, the processing history information transmitted from the processing device 203 or the inspection device 205 in the manufacturing process to the quality monitoring device 101 may include processing conditions of the device such as temperature and pressure. In this case, processing conditions are added and stored in the data structure of the history DB 102 shown in FIG. Thus, when the graph creation unit 115 creates graph data in response to a graph display request from the display client 110, the graph is created on the display client 110 by creating the graph data by adding the processing conditions to the items. The processing conditions can be displayed on the trend chart.

  In addition, graph data is created according to the flowchart of FIG. 22 or the flowchart of FIG. 25 for any of the processing steps of the preset manufacturing process, and the upward trend or the downward trend is regularly performed in the quality monitoring apparatus 101 using the conventional technology. Etc. may be automatically monitored.

  Further, in order to calculate using the measurement results of the same circuit from a plurality of inspection processes, the quality monitoring apparatus 101 assigns the same measurement point to the corresponding measurement point, although the same measurement point No. is assigned to the same circuit. Instead of this, the quality monitoring device 101 may store a correspondence table of measurement points related to the aggregation target inspection and refer to it when calculating graph data. Further, the graph data may be calculated from the measurement point with the shortest distance or the average of the measurement values within a certain range.

  In the above description, the calculation result information in which the calculation result calculated by the calculation unit 118 and the wafer No. are associated is stored in the graph DB group 107. However, the graph DB group 107 is not necessarily required. Each time the graph creation instruction is received from the display client 110, the calculation unit 118 may perform the calculation. In other words, if the calculation unit 118 can calculate at high speed, the calculation result can be generated in real time without providing the graph DB group 107, and the graph generation unit 115 generates graph data. can do.

  Moreover, the quality monitoring apparatus according to the present embodiment includes inspection process information indicating a specific inspection process, processed object specifying information for specifying a processing object inspected in the inspection process, and the above-described processing object. Inspection result acquisition means for acquiring a plurality of inspection results for a specific processing object from an inspection result storage device storing a plurality of inspection information associated with inspection results in the inspection process, and the plurality of acquired By performing a calculation to obtain a new physical quantity using the inspection result, a calculation means for obtaining a calculation result in a specific processing object, processing step information indicating a specific processing step, and processing in the processing step A processing information storage device that stores a plurality of pieces of processing information in which the processing target specifying information for specifying the processing target and the processing time at which the processing specific processing is performed in the processing step are associated with each other The information extracting means for acquiring the processing object specifying information and the processing time in a specific processing step and acquiring the calculation result corresponding to the processing object specifying information from the calculating means, and the extracted processing object Display instruction means for displaying a graph in which the calculation results are arranged in time series based on the processing time from the calculation result and processing time in the specific information, and the calculating means includes physical quantities having different physical properties from each other. The calculation may be performed using the inspection result.

  In addition, the quality monitoring apparatus according to the present embodiment may be configured such that the calculation means calculates and calculates a new physical quantity using an inspection result obtained with a processing step in between.

  In order to obtain the fluctuation amount in the processing process, it cannot be obtained unless the inspection results before and after the processing process are used, and the fluctuation amount cannot be obtained directly by only one inspection process.

  According to the above configuration, since a new physical quantity is obtained using the inspection result obtained with the processing step interposed, it is possible to obtain a physical quantity that has fluctuated in the processing step.

  In addition, the quality monitoring method according to the present embodiment relates to information and processing time for specifying a processing object in a processing process, in which the manufacturing process has a plurality of processing processes and a plurality of inspection processes. A first information storage step for storing processing information including at least information; a second information storage step for storing inspection information including at least information for specifying an inspection object and inspection results in the inspection step; And a plurality of examinations having different examination items, and a search object designation step that designates as a search object a first processing step that can affect at least one of the plurality of examinations, and examination information of the plurality of examinations And the processing information of the first processing step, the inspection object and the processing object are the same regardless of the processing unit or the inspection unit of each object. A collation step for collating, and an inspection result display step for displaying the plurality of inspection results and / or calculation results calculated from the plurality of inspection results on a single graph in time-series order of processing times of the first processing. It is the method of including.

  Further, in the quality monitoring method according to the present embodiment, the plurality of inspections include a first inspection in the first inspection step and a second inspection in a second inspection step different from the first inspection step. The first test result and the second test result are the same unit system or a unit system that can be converted into the same unit system, and the function is designated from the first test result and the second test result. In the inspection result display step, the first inspection result, the second inspection result, the first inspection result, and the second are obtained by the same unit system in the inspection result display step. The calculation result calculated from the inspection result may be displayed on a single graph.

  Further, in the quality monitoring method according to the present embodiment, the plurality of inspections are a third inspection in the third inspection step and a fourth inspection in a fourth inspection step different from the third inspection step. The third inspection and the fourth inspection are inspections related to each other, and the third inspection result and the fourth inspection result are units that can be converted into different units or different units, In the test result display step, the third test result value and the fourth test result value are not displayed overlapping each other, and in the test result display step, the third test result value range and the third test result value range are A second calculation step for calculating an adjustment of each display range of the plurality of different units so as to overlap, and a third test result and a fourth test result by the plurality of different units in the test result display step; Inspection A fruit, or a method of displaying on a single graph.

  In the quality monitoring method according to the present embodiment, the plurality of inspections are a fifth first inspection item and a fifth second inspection item in the same fifth inspection step. The first inspection item and the fifth second inspection item are inspection items that are related to each other, and a third result that calculates a calculation result by a function specified from the fifth first inspection result and the fifth second inspection result The calculation step may be included, and the calculation result may be displayed on a single graph in the inspection result display step.

  Finally, each block of the quality monitoring apparatus 101 may be configured by hardware logic, or may be realized by software using a CPU as follows.

  That is, the quality monitoring apparatus 101 includes a CPU (central processing unit) that executes instructions of a control program that realizes each function, a ROM (read only memory) that stores the program, and a RAM (random access memory) that expands the program. And a storage device (recording medium) such as a memory for storing the program and various data. An object of the present invention is a recording medium on which a program code (execution format program, intermediate code program, source program) of a control program of the quality monitoring apparatus 101 which is software for realizing the functions described above is recorded so as to be readable by a computer. This can also be achieved by supplying to the quality monitoring apparatus 101 and reading and executing the program code recorded on the recording medium by the computer (or CPU 52 or MPU).

  Examples of the recording medium include tapes such as magnetic tapes and cassette tapes, magnetic disks such as floppy (registered trademark) disks / hard disks, and disks including optical disks such as CD-ROM / MO / MD / DVD / CD-R. Card system such as IC card, IC card (including memory card) / optical card, or semiconductor memory system such as mask ROM / EPROM / EEPROM / flash ROM.

  Moreover, the quality monitoring apparatus 101 may be configured to be connectable to a communication network, and the program code may be supplied via the communication network. The communication network is not particularly limited. For example, the Internet, intranet, extranet, LAN, ISDN, VAN, CATV communication network, virtual private network, telephone line network, mobile communication network, satellite communication. A net or the like is available. Further, the transmission medium constituting the communication network is not particularly limited. For example, even in the case of wired such as IEEE 1394, USB, power line carrier, cable TV line, telephone line, ADSL line, etc., infrared rays such as IrDA and remote control, Bluetooth ( (Registered trademark), 802.11 wireless, HDR, mobile phone network, satellite line, terrestrial digital network, and the like can also be used. The present invention can also be realized in the form of a computer data signal embedded in a carrier wave in which the program code is embodied by electronic transmission.

  Thus, in this specification, the means does not necessarily mean physical means, but includes cases where the functions of the means are realized by software. Further, the function of one means may be realized by two or more physical means, or the functions of two or more means may be realized by one physical means.

  The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

  The quality monitoring apparatus according to the present invention can be particularly preferably used for an application for managing the workpieces flowing through the production line.

It is a block diagram which shows the schematic structure of the quality monitoring apparatus concerning this Embodiment. It is drawing which shows the schematic structure of the manufacturing process management system provided with the said quality monitoring apparatus. It is drawing which shows the data structure of the process history information memorize | stored in log | history DB. It is drawing which shows the data structure of the test result information memorize | stored in test | inspection DB. It is a flowchart which shows the flow of a graph data creation process. It is a data structure which shows the graph data after a sort process is performed by the sort process part. It is drawing which shows the example of the data structure of the test result information in a superimposition precision measurement test | inspection. It is a graph which shows the test result of a specific test | inspection apparatus. It is a trend chart showing the inspection result of a substrate characteristic after processing with a certain processing device. It is drawing which showed the cumulative probability distribution in the period A of the trend chart shown in FIG. 9 in contrast with the case of normal distribution. It is a trend chart which shows the limit value which shows whether an actual test result and a data determination part issue a warning. It is a block diagram which shows the schematic structure of the quality monitoring apparatus concerning this Embodiment. It is drawing explaining the inspection method in a test | inspection apparatus, and is drawing explaining the example of a current characteristic test | inspection. It is drawing explaining the inspection method in an inspection apparatus, and is a figure explaining the example which measures the current characteristic of the circuit formed on the cell arrange | positioned on the wafer. It is a data structure which shows the current characteristic (inspection result) measured with the inspection apparatus. It is a data structure which shows the measurement result of overlay accuracy measurement. It is drawing which shows the data structure of the graph definition table stored in the graph definition area. It is a flowchart at the time of calculating calculation result information. This is a data structure in which a wafer number is associated with an item indicating a new physical quantity that is an item to be displayed in a graph. It is drawing explaining the example which calculates the resistance characteristic of a wafer based on the result of a current characteristic test | inspection, and the result of a voltage characteristic test | inspection. It is a graph which shows the trend chart of three items of a current characteristic, a voltage characteristic, and the resistance characteristic calculated from them. It is a flowchart explaining a calculation process. It is the data structure which shows the measured value of an electrical property test | inspection, the measured value of a voltage property test | inspection, and the maximum value-average value-minimum value in a wafer of resistance characteristics. An example of electrical property inspection is shown, and in this inspection, an example in which current characteristics and voltage characteristics are measured at the same time is described. It is a flowchart explaining the other example of a calculation process. It is a flowchart explaining a matching process. It is a data structure explaining the inspection result information stored in the inspection DB. It is drawing which shows the data with which process history information and calculation result information were combined. It is a flowchart for demonstrating the process for displaying a characteristic graph per lot. It is a data structure explaining intermediate data. It is a data structure explaining the graph data created from the intermediate data of FIG. It is drawing which shows the example of the screen at the time of displaying a characteristic graph on the display part of the display client.

Explanation of symbols

101 Quality monitoring device 102 History DB (processing information storage device)
103 inspection result DB group (inspection result storage device)
104 Data Registration Unit 105 Data Monitoring Unit 107 Graph DB Group 109 Data Acquisition Unit 110 Display Client 111 Graph Definition Area 113 Inspection DB
114 Graph data extraction unit (examination result acquisition means, processing information acquisition means)
115 Graph creation unit (display command means)
116 Data acquisition unit 117 Graph DB
118 Calculation unit (calculation means)
121 Instruction unit 122 Display unit 123 Notification unit (notification means)
124 Data distribution unit 130 Sort processing unit (sorting means)
131 Statistical processing unit (statistical processing means)
132 Data determination unit (determination means)
150 coupling part (association means)
200 Manufacturing Process Management System 203 Processing Device 205 Inspection Device 206 Network

Claims (14)

A quality monitoring device for displaying quality fluctuations in a plurality of processing objects manufactured through a processing step and an inspection step,
Inspection result storage in which processed object specifying information for specifying each of a plurality of processing objects inspected in a specific inspection process and each inspection result in the inspection process of the processing object are stored in association with each other From the apparatus, inspection result acquisition means for acquiring a combination of the processing object specifying information and the inspection result for each of a plurality of processing objects;
Processing object specifying information for specifying each of the plurality of processing objects processed in a specific processing process and each processing time when the processing object is processed in the processing process are stored in association with each other. Processing information acquisition means for acquiring a combination of the processing object specifying information and the processing time for each of a plurality of processing objects from the processing information storage device being
An association means for associating the inspection result with the processing time based on the processing object specifying information;
A quality monitoring apparatus comprising: a rearranging unit that rearranges the inspection results in order of processing time of the processing object in the specific processing step.   2. A statistical processing unit that calculates at least one of an average value, a standard deviation, and a histogram distribution of the inspection results in a predetermined period in which a plurality of processing objects are processed in the processing step. The quality monitoring device described. The statistical processing means calculates a mean value of test results in a predetermined number of consecutive periods,
3. The quality monitoring apparatus according to claim 2, further comprising notification means for notifying when the average value of the predetermined number of predetermined periods continuously increases or decreases. Further, a determination means for determining whether or not the statistical processing value of the inspection result for a predetermined period is within a predetermined range,
The quality monitoring apparatus according to claim 2, further comprising an informing means for informing the fact when it is not within the predetermined range. When the cumulative probability distribution of histograms of a plurality of inspection results for a predetermined period is f and the critical value of a predetermined cumulative probability is fc, the statistical processing means is
fc = f (XL)
And the above-mentioned determination means uses the lower limit specified value LCL,
XL <LCL
Whether or not
5. The quality monitoring apparatus according to claim 4, wherein said notifying means notifies that when XL <LCL is satisfied. When the cumulative probability distribution of histograms of a plurality of inspection results for a predetermined period is f and the critical value of a predetermined cumulative probability is fc, the statistical processing means is
1-fc = f (XU)
XU is determined, and the determination means uses the upper limit specified value UCL,
XU> UCL
Whether or not
5. The quality monitoring apparatus according to claim 4, wherein when the notification means determines that XU> UCL, the notification means notifies the fact. When a plurality of processing apparatuses respectively perform the same processing step,
The processing information acquisition means further acquires processing device information for specifying a processing device,
2. The quality monitoring apparatus according to claim 1, wherein the rearranging means rearranges the inspection results in order of processing time when the specific processing device in the specific processing step processes the processing object. The inspection result acquisition means acquires, from the inspection result storage device, a plurality of inspection results in a specific processing object obtained by a plurality of different inspection steps,
A calculation means for obtaining a calculation result in a specific processing object by performing a calculation for obtaining a new physical quantity using the plurality of acquired test results,
The quality monitoring apparatus according to claim 1, wherein the associating means associates the calculation result with the processing time of the processing object in a specific processing step based on the processing object specifying information.   9. The quality monitoring apparatus according to claim 8, wherein the calculation means performs calculation using inspection results of different types of physical quantities.   The quality monitoring according to claim 1, further comprising display command means for displaying a plurality of inspection results on a specific processing object obtained in different inspection processes on a display device in a single graph according to processing time. apparatus.   11. The quality according to claim 10, wherein the display command means adjusts the scale of the graph so that the inspection results are not superimposed and displayed when the plurality of inspection results are displayed in a graph. Monitoring device. A quality monitoring method for displaying quality fluctuations in a plurality of processing objects manufactured through a processing step and an inspection step,
Inspection result storage in which processed object specifying information for specifying each of a plurality of processing objects inspected in a specific inspection process and each inspection result in the inspection process of the processing object are stored in association with each other From the apparatus, an inspection result acquisition step of acquiring a combination of the processing object identification information and the inspection result for each of a plurality of processing objects,
Processing object specifying information for specifying each of the plurality of processing objects processed in a specific processing process and each processing time when the processing object is processed in the processing process are stored in association with each other. A processing information acquisition step of acquiring a combination of the processing object specifying information and the processing time for each of a plurality of processing objects from the processing information storage device being performed;
An associating step for associating the inspection result with the processing time based on the processing object specifying information;
A quality monitoring method comprising: a rearrangement step of rearranging the inspection results in order of processing time of the processing object in the specific processing step.   A quality monitoring program for operating the quality monitoring apparatus according to any one of claims 1 to 11, wherein the quality monitoring program causes a computer to function as each of the above means.   A computer-readable recording medium on which the quality monitoring program according to claim 13 is recorded.

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