JP2006310828A - Method of bonding substrates, method of forming chip, and chip - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a bonding method of enabling substrates to be bonded without causing damage to the substrate. <P>SOLUTION: A bonding method of bonding a first substrate 10 and a second substrate 20 is presented which comprises steps of making a main body of at least one of the first substrate 10 and the second substrate 20 with a light-transmissive material that transmits light; forming at least a part of the surfaces of the first substrate 10 and the second substrate 20 to be bonded with a thermoplastic resin, containing a light absorbing agent 23 that absorbs light; and bonding the first substrate 10 and the second substrate 20 by irradiating the light-absorbing agent 23, on the surface to be bonded with light through the substrate that transmits light. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for bonding substrates, a chip forming method, and a chip.

  In recent years, the importance of detecting, detecting and quantifying biological substances and chemical substances such as DNA (Deoxyribo Nucleic Acid), enzymes, proteins, antigens, antibodies, viruses and cells has increased in the fields of medicine, health, food and pharmaceuticals. is doing. Various biochips and microchemical chips that can easily measure them have been proposed. These chips are characterized in that the reaction can be completed in a short time by pouring a small amount of sample or specimen into a flow channel having a width of several hundred μm. These chips are produced by bonding two substrates, and a technique for bonding these substrates is particularly important. For bonding the substrates, for example, an adhesive such as a hot-melt adhesive or a UV (Ultra Violet) adhesive is used.

  The hot melt adhesive is a linear polymer copolymer mainly composed of an ethylene vinyl acetate copolymer (EVA). EVA has a fluidity that softens at 80 ° to 110 ° and can be bonded at 160 ° to 180 °. Therefore, the substrates can be bonded together by applying a hot melt adhesive heated and melted at about 180 ° to the bonding surface of the substrates and cooling.

  The UV adhesive is an adhesive containing a photopolymerization initiator, an acrylic oligomer, an acrylic monomer, and the like, and a polymer constituting the UV adhesive is radically polymerized by irradiation with UV light. A UV adhesive is applied to the bonding surfaces of the two substrates, and UV light having a wavelength of 150 nm to 410 nm is irradiated from the outside of the substrate while being heated to 40 ° to 80 °. At this time, the acrylic oligomer and the acrylic monomer are polymerized by radicals generated from the photopolymerization initiator to form a polymer, thereby bonding the substrates together.

  Further, ultrasonic welding for bonding substrates together by pressing the first substrate and the second substrate while applying ultrasonic waves has been studied.

  However, when using an adhesive such as a hot-melt adhesive or UV adhesive, pattern collapse occurs when the molten adhesive flows into the flow path or reagent reservoir, and the flow of fluid in the flow path Is inhibited. In addition, the reaction of biological substances and chemical substances is hindered by the adhesive flowing into the flow path. In particular, in the method using a hot-melt adhesive, since the adhesive heated to about 160 ° to 180 ° is used, the entire substrate to which the adhesive is applied becomes high temperature. Therefore, pattern collapse of the flow path and reagent storage part formed in the substrate occurs. Furthermore, when biological materials or chemical substances are fixed to the flow path, the reagent storage unit, or the like, they are deactivated due to the high temperature of the substrate. Further, in the method using ultrasonic welding, there are cases where the flow path in the substrate or the substrate itself is distorted or collapsed due to the pressing of the first substrate and the second substrate.

  Then, an object of this invention is to provide the bonding method which can bond a board | substrate without damaging a board | substrate.

  A first invention of the present application is a method for bonding a first substrate and a second substrate in order to solve the above-described problem, and transmits light through at least one of the first substrate and the second substrate. Forming a light transmissive material, forming at least a part of a bonding surface of the first substrate and the second substrate with a thermoplastic resin containing a light absorbing material that absorbs light, There is provided a bonding method including a step of bonding the first substrate and the second substrate by irradiating light to a light-absorbing substance on the bonding surface through a substrate that transmits light.

  For example, when the first substrate is formed of a light-transmitting material that transmits light, the first substrate and the second substrate are brought into contact with each other, and light is irradiated from above the first substrate. The light passes through the first substrate and reaches a light absorbing material formed on at least a part of the bonding surface of the first substrate and the second substrate. Then, as the light absorbing material absorbs light, the thermoplastic resin containing the light absorbing material is heated and melted. The melted thermoplastic resin is cooled and cured, whereby the first substrate and the second substrate are bonded together.

  According to this bonding method, it is not necessary to use an adhesive for bonding the substrates. Therefore, it is possible to prevent damage to the substrate such as deformation of the pattern in the substrate due to the outflow of the adhesive and obstruction of the flow of fluid in the flow path.

  Moreover, the light which permeate | transmitted the board | substrate is absorbed by the light absorption material located in a bonding surface, and a bonding surface heat | fever-generates locally. That is, without applying heat to the entire first substrate and the second substrate, the thermoplastic resin on the bonding surface is melted and bonded to each other by local heat generation. Therefore, it is possible to prevent the entire substrate from being collapsed or deformed by heat. In addition, even when a detection substance such as a biological substance is already disposed in the substrate at the time of bonding, it is possible to prevent the detection substance from being deactivated due to heat generation of the entire substrate. Furthermore, it is possible to prevent the side walls of the flow paths and the like in the substrate from melting and inhibiting the reaction of the detection substance.

  Moreover, since it is not necessary to strongly press the substrates at the time of bonding, it is possible to prevent the patterns such as the reagent storage part and the flow path formed in the substrates from being collapsed or deformed by the strong pressing. In addition, the collapse and deformation of the substrate itself due to strong pressing can be prevented.

  According to a second invention of the present application, in the first invention, a detection substance for detecting a measurement target substance is disposed on the first substrate and / or the second substrate, and the wavelength of the light is in a range of 400 nm to 2.5 μm. Provide a bonding method.

  Examples of the substance to be measured include various substances such as glucose and cholesterol in blood. The detection substance is a substance that reacts with the substance to be measured. For example, biological substances such as enzymes, proteins, antigens, antibodies, bacteria, yeasts, and microorganisms, and chemical substances are used. Here, since light having a short wavelength such as UV light has high energy, there is a possibility that the covalent bond of these detection substances is cut and deactivated. On the other hand, since the energy of light having a wavelength in the range of 400 nm to 2.5 μm is equal to or lower than the bond dissociation energy of the detection substance, the detection substance can be prevented from being deactivated.

  According to a third invention of the present application, in the first invention, the first substrate and / or the second substrate is fixed on a detection substance fixed place, or a pattern is formed on the first substrate and / or the second substrate. Provided is a bonding method in which a mask that blocks the light is arranged at a portion corresponding to a place, and light is irradiated onto the light-absorbing material on the bonding surface from above the mask.

  By irradiating light from the upper part of the mask arranged corresponding to the detection substance or the pattern in the substrate, it is possible to prevent the light from being applied to the pattern such as the detection substance or the channel. Therefore, it is possible to prevent the detection substance from being deactivated due to heat generation and the deformation of the flow path.

  A fourth invention of the present application provides the bonding method according to the third invention, wherein the first substrate and the second substrate are thermoplastic resin substrates, and the melting points of the first substrate and the second substrate are substantially the same. .

  For example, the first substrate of the two substrates is formed of a light-transmitting thermoplastic resin substrate. In addition, the second substrate is formed of a thermoplastic resin substrate in which a light-absorbing substance is included on the bonding surface with the first substrate. At this time, when the first substrate and the second substrate are formed of thermoplastic resin substrates having substantially the same melting point, the light-absorbing material is irradiated with light, so that the bonding surfaces of the first substrate and the second substrate are melted almost simultaneously. The substrates are easily bonded to each other.

  A fifth invention of the present application is a method of forming a chip formed by bonding a first substrate and a second substrate, and transmits light through at least one of the first substrate and the second substrate. Forming a light transmissive material, forming at least a part of a bonding surface of the first substrate and the second substrate with a thermoplastic resin containing a light absorbing material that absorbs light, A step of forming a flow path on a main surface of one substrate and / or the second substrate, and a first substrate and the second substrate facing each other so as to cover the flow path, and through a substrate that transmits the light. And a step of bonding the first substrate and the second substrate by irradiating light onto the light absorbing material on the bonding surface.

  This chip forming method has the same effects as the first invention of the present application.

  The sixth invention of the present application is the fifth invention, wherein carbon black is used as the light absorbing material, and the carbon black content in the layer containing carbon black is 0.01 vol% or more and 0.025 vol% or less. A method for forming a chip is provided.

  By making the content of carbon black 0.01% by volume or more and 0.025% by volume or less, elution of carbon black into the solution can be suppressed. Therefore, the biochemical reaction can be normally performed in the solution in the channel formed in the chip, and the sample or the like can be accurately quantified. Moreover, if it is content of this range, the bonding intensity | strength of board | substrates can fully be ensured, without generating a nonuniform color in a board | substrate. Thus, by making the content of carbon black in the above-described range, it can be efficiently used while utilizing the characteristics of carbon black.

  A seventh invention of the present application provides the chip forming method according to the sixth invention, wherein the layer containing carbon black is formed by injection molding.

  Since injection molding is a simple manufacturing method that is generally used for substrate molding, it is suitable for injection molding in the case of the above-mentioned content in terms of productivity and production cost of substrates containing carbon black. Excellent.

  According to an eighth aspect of the present invention, in the fifth aspect, in the step of bonding the first substrate and the second substrate, a main surface different from the bonding surface in at least one of the first substrate and the second substrate However, there is provided a method for forming a chip in which the first substrate and the second substrate are bonded together by receiving pressure from a transparent glass plate through a transparent plate having an uneven surface.

  As described above, by interposing a transparent plate having an uneven surface between the first substrate and / or the second substrate and the transparent glass plate, the first substrate and / or the second substrate and the transparent glass plate. Adsorption can be prevented.

  A ninth invention of the present application provides the method for forming a chip according to the eighth invention, wherein a main surface different from the bonding surface in contact with the transparent plate is treated with a solvent.

  Solvent treatment is performed for surface modification such as surface modification and surface coating, and other cleaning and sterilization. When the solvent treatment is performed, the main surface different from the above-described bonding surface may be treated so as to have elasticity. These adsorption | suction can be prevented by interposing the transparent board which has an uneven | corrugated surface between a 1st board | substrate and / or a 2nd board | substrate, and a transparent glass plate.

  According to a tenth aspect of the present invention, in the fifth aspect, in the step of bonding the first substrate and the second substrate, a main surface different from the bonding surface in at least one of the first substrate and the second substrate However, by receiving pressure from the transparent glass plate, the first substrate and the second substrate are bonded together, and a transparent resin is formed on the main surface of the transparent glass plate in contact with the main surface different from the bonding surface. Provided is a method for forming a chip on which a film is formed. If the transparent resin film of this invention is used, the effect similar to 8th invention can be acquired.

  The eleventh invention of the present application provides the method for forming a chip according to the tenth invention, wherein a principal surface different from the bonding surface in contact with the transparent resin film of the transparent glass plate is treated with a solvent. If the structure of this invention is used, the effect similar to 9th invention can be acquired.

  The twelfth invention of the present application includes a first substrate formed of a thermoplastic resin, a second substrate bonded to the first substrate, and a main surface of the first substrate and / or the second substrate. A light-transmitting material in which at least one main body of the first substrate and the second substrate transmits light, and a bonding surface of the first substrate and the second substrate is formed. At least a portion of the first substrate or the second substrate, which includes a light-absorbing substance that absorbs light and is opposed so as to cover the flow path, passes through the light-transmitting substrate. Provided is a chip that is bonded by irradiating light onto the light-absorbing substance on the bonded surface.

  The chip formed in this way has the same effects as the first invention of the present application.

  A thirteenth invention of the present application provides the chip according to the twelfth invention, wherein a detection substance for detecting a substance to be measured is fixed in the flow path.

  Examples of the substance to be measured include various substances such as glucose and cholesterol in blood. The detection substance is a substance that reacts with the substance to be measured. For example, biological substances such as enzymes, proteins, antigens, antibodies, bacteria, yeasts, and microorganisms, and chemical substances are used. By fixing the detection substance in the flow path, the measurement target substance that reacts with the detection substance can be detected from the solution that has passed through the flow path.

  Here, according to the bonding method of the present application, the bonding surfaces including the light absorbing material are locally heated to bond the substrates to each other, so that heat is not applied to the entire substrate during chip formation. Therefore, the detection substance fixed to the flow path can be prevented from being deactivated.

  A fourteenth invention of the present application provides the chip according to the thirteenth invention, wherein the detection substance is fixed at a distance of 100 μm or more from the introduction position of the light absorbing substance.

  The light absorbing material generates heat by absorbing the irradiated light. By disposing the detection material at a predetermined distance from the light absorption material, it is possible to prevent the detection material from being deactivated due to heat generation when the substrates are bonded together.

  A fifteenth invention of the present application provides the chip according to the twelfth invention, wherein the light absorbing / absorbing substance is a pigment.

  Examples of the dye include carbon black.

  A sixteenth invention of the present application provides the chip according to the twelfth invention, wherein the light absorbing / absorbing substance is a dye having a different color for each substance to be measured.

  Examples of the measurement target substance include glucose and cholesterol. Therefore, by using a pigment having a different color for each measurement target substance, the measurer can easily confirm the chip used for the measurement. Therefore, it is possible to prevent the chip from being mistaken at the time of measurement.

  The seventeenth invention of the present application is the twelfth invention, wherein carbon black is used as the light absorbing material, and the carbon black content in the layer containing carbon black is 0.01 vol% or more and 0.025 vol% or less. Provide chips.

  By making the content of carbon black 0.01% by volume or more and 0.025% by volume or less, elution of carbon black into the solution can be suppressed. Therefore, the biochemical reaction can be normally performed in the solution in the channel formed in the chip, and the sample or the like can be accurately quantified. Moreover, if it is content of this range, the bonding intensity | strength of board | substrates can fully be ensured, without generating a nonuniform color in a board | substrate. Thus, by making the content of carbon black in the above-described range, it can be efficiently used while utilizing the characteristics of carbon black.

  The 18th invention of the present application provides the chip according to the 17th invention, wherein the layer containing carbon black is formed by injection molding.

  Since injection molding is a simple manufacturing method that is generally used for substrate molding, it is suitable for injection molding in the case of the above-mentioned content in terms of productivity and production cost of substrates containing carbon black. Excellent.

  According to the present invention, it is not necessary to use an adhesive for bonding the substrates. Therefore, there is no damage to the substrate such as a deformation in the pattern in the substrate due to the outflow of the adhesive, and the flow of fluid in the flow path is not hindered.

<Outline of the invention>
In the microfluidic chip formed by bonding the first substrate and the second substrate, at least one main body of the first substrate and the second substrate is formed of a light-transmitting material that transmits light. In addition, at least a part of the bonding surfaces of the first substrate and the second substrate is formed of a thermoplastic resin containing a light absorbing material that absorbs light. Here, when light is irradiated from above the substrate that transmits light, the light reaches the light-absorbing substance on the bonding surface. As the light absorbing material absorbs light, the thermoplastic resin containing the light absorbing material is heated and melted. And the 1st and 2nd board | substrate is bonded together when the fuse | melted thermoplastic resin is cooled and hardened | cured.

  Since the microfluidic chip as described above does not use an adhesive for bonding, substrate damage such as deformation of the pattern in the substrate due to the outflow of the adhesive can be suppressed. Therefore, the flow of fluid in the flow path is not hindered, and a microfluidic chip with good flow controllability can be created. In addition, since the bonded surface locally generates heat due to the light absorbing material located on the bonded surface, it is possible to prevent the substrate itself from being deformed or deformed by heat and the inactivation of the biological material in the substrate.

  Further, since it is not necessary to strongly press the substrates together when the substrates are bonded to each other, it is possible to prevent damage to the patterns in the substrates and the substrates themselves.

<First embodiment>
{Chip configuration}
FIG. 1A is a plan view of a chip according to a first embodiment of the present invention, and FIG. 1B is a cross-sectional view taken along line AA ′ of FIG. The chip 100 includes a first thermoplastic resin substrate 10 and a second thermoplastic resin substrate 20 that are made of a thermoplastic resin, and the substrates are bonded to each other through a bonding surface 24. Here, the bonding surface 24a of the first thermoplastic resin substrate 10 and the bonding surface 24b of the second thermoplastic resin substrate 20 are bonded together. Examples of the thermoplastic resin include polyethylene terephthalate (PET), polyethylene (Polyethylene), polypropylene (Polypropylene), polystyrene (Polystyrenes), polycarbonate (Polycarbonate), PMMA (Poly Methyl Methacrylate), ABS (Acrylonitrile-butadiene). -styrene) resin, polyacetal (polyoxymethylene), polyamide (polyamide) and the like.

  Carbon black is dispersed in the second thermoplastic resin substrate 20 as a light absorber that absorbs light. Carbon black is a fine particle of graphite having a particle system of about 20 nm and absorbs laser light. Here, the 2nd thermoplastic resin board | substrate 20 is created by patterning the thermoplastic resin which knead | mixed carbon black. On the other hand, the 1st thermoplastic resin board | substrate 10 does not contain the light absorber so that light can permeate | transmit. Moreover, the reagent storage part 13 and the flow path 15 are formed by removing a part of main surface of the 1st thermoplastic resin board | substrate 10. FIG. The reagent storage unit 13 stores a reagent used for detecting a measurement target substance that is a measurement target. The flow path 15 is formed with a groove formed in the first thermoplastic resin substrate 10 and a main surface of the second thermoplastic resin substrate 20 as side walls, and the substance to be measured passes therethrough. A detection substance 19 for detecting a substance to be measured may be fixed to the bottom of the flow path 15 at a desired position of the chip 100 as shown in FIG. Examples of the detection substance 19 and the reagent include enzymes such as peroxidase, cholesterol oxidase, and cholesterol esterase, proteins, antigens, antibodies, biological substances such as bacteria, yeast, and microorganisms, and chemical substances. Moreover, various substances such as glucose and cholesterol in blood are exemplified as the measurement target substance.

{Board bonding method}
(1) Bonding by whole surface irradiation Next, a bonding method of the first thermoplastic resin substrate 10 and the second thermoplastic resin substrate 20 of the chip 100 shown in FIG. 1 using FIGS. 2 (a) and 2 (b). explain. 2A and 2B are cross-sectional views showing a method for bonding the first thermoplastic resin substrate 10 and the second thermoplastic resin substrate 20 together.

  First, the main surface on which the flow path 15 of the first thermoplastic resin substrate 10 is formed is opposed to the second thermoplastic resin substrate 20. That is, the bonding surface 24a of the first thermoplastic resin substrate 10 is opposed to the bonding surface 24b of the second thermoplastic resin substrate 20 (see FIG. 2A). Then, laser light is directed toward the bonding surfaces 24 (bonding surface 24a and bonding surface 24b) of the first and second thermoplastic resin substrates 10 and 20 from the upper part of the first thermoplastic resin substrate 10 facing each other. Irradiate. (See FIG. 2 (b)).

  Here, the first thermoplastic resin substrate 10 does not contain carbon black, and the irradiated laser light passes through the first thermoplastic resin substrate 10. The laser light transmitted through the first thermoplastic resin substrate 10 reaches the bonding surface 24 between the second thermoplastic resin substrate 20 and the first thermoplastic resin substrate 10 formed by kneading carbon black. In particular, since the laser light is coherent light, the vicinity of the bonding surface 24 that is the focal point can be locally irradiated. The laser light reaching the bonding surface 24 is absorbed by the carbon black located near the bonding surface 24 in the second thermoplastic resin substrate 20 and converted into heat. When this heat exceeds the melting point of the first thermoplastic resin substrate 10 and / or the second thermoplastic resin substrate 20 in the vicinity of the bonding surface 24, the first thermoplastic resin substrate 10 and / or the second thermoplastic resin substrate 20 is Melt. And the 1st thermoplastic resin board | substrate 10 and the 2nd thermoplastic resin board | substrate 20 are bonded together when the fuse | melted thermoplastic resin is cooled and hardened | cured.

(2) Bonding by Partial Irradiation In the above, the entire surface of the first thermoplastic resin substrate 10 is irradiated with laser light. However, as shown below, laser light can be partially irradiated using a mask. FIG. 3 is a cross-sectional view showing a method for bonding substrates by partial irradiation using a mask. As shown in FIG. 3, a mask 41 that blocks the laser beam is disposed in a corresponding portion of the flow path 15 to which the detection substance 19 is fixed. When the first thermoplastic resin substrate 10 is irradiated with laser light from the top of the mask 41, the laser light is not irradiated on the α portion in the drawing corresponding to the mask 41. Therefore, since the detection substance 19 fixed in the flow path 15 is not irradiated with laser light, the detection substance 19 can be prevented from being deactivated. In addition, since the α portion is not irradiated with laser light, heat is not generated on the surface of the second thermoplastic resin substrate 20 in the α portion, and the substrate does not melt. Thereby, the deformation | transformation of the flow path 15 by melting | fusing of a board | substrate can be prevented, and the flow of the fluid in the flow path 15 is not inhibited.

  When the mask 41 is used, the detection substance 19 can be immobilized on the surface of the second thermoplastic resin substrate 20 as shown in FIG. FIG. 4 is an explanatory diagram showing a case where the detection substance 19 is fixed on the surface of the second thermoplastic resin substrate 20 and the fixing position of the detection substance 19 is different from that in FIG. 3. When bonding is performed by whole-surface irradiation shown in FIG. 2, it is preferable that the detection substance 19 is fixed to the first thermoplastic resin substrate 10 instead of the surface of the second thermoplastic resin substrate 20. This is because the surface of the second thermoplastic resin substrate 20 forming the flow path 15, that is, the bonding surface 24, may generate heat due to laser light irradiation, and the detection substance 19 may be deactivated. Therefore, in FIGS. 1 and 2, the detection substance 19 is fixed to the flow path 15 in the first thermoplastic resin substrate 10. However, when the laser beam is irradiated using the mask 41 as shown in FIGS. 3 and 4, heat generation on the surface of the second thermoplastic resin substrate 20 can be prevented. Therefore, deactivation of the detection substance 19 can be prevented while fixing the detection substance 19 on the surface of the second thermoplastic resin substrate 20. Therefore, there is a degree of freedom regarding the fixed position of the detection substance 19.

(3) About laser light The laser light irradiated to a board | substrate is produced | generated by the laser oscillator which used the semiconductor laser, for example. However, the type of the oscillator is not limited as long as the wavelength and power can be set appropriately.

  Further, the wavelength of the laser beam to be irradiated is such that the light transmittance with respect to the first thermoplastic resin substrate 10, the property of the light absorbent in the second thermoplastic resin substrate 20, the property of the reagent in the reagent storage unit 13, the flow path 15. It selects according to the property etc. of the detection substance 19 in the inside.

  For example, since carbon black absorbs light in inverse proportion to the wavelength, the shorter the wavelength, the more efficiently the light is absorbed and heat is generated. The first thermoplastic resin substrate 10 transmits laser light having a wavelength in the range of about 300 nm to 2.5 μm. Further, when the detection substance 19 is a biological substance composed of a polymer, it is necessary to prevent the substance from being decomposed and deactivated by a photochemical reaction by laser light. For example, light having a short wavelength such as UV light has high energy, and there is a possibility that the covalent bond of these detection substances is cut and deactivated. Here, the bond dissociation energy of the C—C bond, C—N bond, C—O bond, etc. constituting the polymer is about 300 kJ / mol or more. Therefore, it is necessary to select a laser beam having a wavelength of about 400 nm or more so that the detection substance 19 is not deactivated. Considering the above, a wavelength suitable for various resin materials is selected as the wavelength of the laser beam to be irradiated, for example, in the range of about 400 nm to 2.5 μm.

  Note that the generated heat can be localized on the bonding surface by controlling the irradiation time of the laser light to a short time.

{Function and effect}
According to this bonding method, it is not necessary to use an adhesive for bonding the substrates. Therefore, there is no damage to the substrate such as deformation of the pattern in the substrate due to the outflow of the adhesive, and the flow of fluid in the flow path 15 is not hindered.

  Moreover, the light which permeate | transmitted the 1st thermoplastic resin board | substrate 10 is absorbed by the carbon black located in the bonding surface 24 vicinity, and the bonding surface 24 generates heat | fever locally. That is, without applying heat to the first and second thermoplastic resin substrates 10 and 20, the thermoplastic resin on the bonding surface 24 is melted by local heat generation, and the substrates are bonded to each other. Therefore, the entire substrate can be prevented from being deformed or deformed due to heat generation, and further, the detection substance 19 disposed in the flow path 15 of the first thermoplastic resin substrate 10 can be prevented from being deactivated. In addition, it is possible to prevent the reagent storage unit 13 and the side walls of the flow path 15 from melting and inhibiting the reaction of the detection substance 19.

  Further, since it is not necessary to press the substrates together at the time of bonding, the patterns such as the reagent storage unit 13 and the flow path 15 formed in the first thermoplastic resin substrate 10 are broken or deformed by the pressing. Can be prevented. In addition, the collapse or deformation of the substrate itself due to pressing can be prevented.

<First embodiment>
A method for bonding the chip 100 according to the first embodiment will be described with reference to FIGS. FIGS. 5A and 5B are cross-sectional views showing a method for bonding the first thermoplastic resin substrate 10 and the second thermoplastic resin substrate 20. As the first thermoplastic resin substrate 10 and the second thermoplastic resin substrate 20, polyethylene terephthalate (PET) having a thickness of 1 mm and a length of 25 mm × width of 25 mm is used. The second thermoplastic resin substrate 20 is made of PET in which carbon black is dispersed. PET has a melting point of 245 ° C. and a tensile modulus of 421 Kgf / mm ² . A flow path 15 having a width of 100 μm and a depth of 200 μm is formed on the main surface of the first thermoplastic resin substrate 10. Further, in order to control the flow of the fluid, cellulose acetate was applied to a part of the flow path 15 by a casting method, and polystyrene was applied to another part and dried. Further, as shown in FIGS. 5A and 5B, an antibody that reacts with a protein is immobilized on a part of the flow path 15 as the detection substance 19 on the first thermoplastic resin substrate 10. The detection substance 19 was fixed in the first thermoplastic resin substrate 10 so as to be separated from the position where the carbon black was introduced by 100 μm or more. In other words, the detection substance 19 is separated from the bonding surface 24 of the first and second thermoplastic resin substrates 10 and 20 in order to protect from the influence of heat generated when the substrates are bonded.

  The bonding method will be specifically described. First, as shown in FIG. 5A, the main surface of the first thermoplastic resin substrate 10 on which the flow path 15 is formed is opposed to the second thermoplastic resin substrate 20. Here, the bonding surface 24a of the first thermoplastic resin substrate 10 and the bonding surface 24b of the second thermoplastic resin substrate 20 are opposed to each other. Next, as shown in FIG. 5 (b), the first and second thermoplastic resin substrates are pressed by applying 0.3 MPa from the entire surface of the first thermoplastic resin substrate 10 through the quartz glass 40. 10 and 20 were brought into close contact with each other. In addition, since the pattern of the flow path 15 etc. will collapse if excessive pressurization is performed, pressurization is performed according to the strength of the substrate.

  Next, as shown in FIG. 5 (b), the first thermoplastic resin substrate 10 was irradiated with a laser beam having a wavelength of 940 μm and a power of 30 W through the quartz glass 40. Irradiation was performed with a laser beam spot size diameter of 5 mm and a scan speed of 20 mm / s. At this time, the irradiation time at a certain point was 0.25 seconds.

  When the temperature of the bonding surface 24 of the first and second thermoplastic resin substrates 10 and 20 reached the melting point of 245 ° C. of PET by the irradiated laser light, the bonding surface 24 was dissolved and the substrates were bonded to each other. Here, it was discovered that the heat distribution is limited to a local range within 100 μm from the bonding surface. Further, since the irradiation time was as short as 0.25 seconds, diffusion of heat generated on the bonding surface could be prevented. And since the detection substance 19 was fixed to the position separated from the bonding surface by 100 μm or more, the deactivation of the detection substance 19 due to the heat generated on the bonding surface could be prevented. Furthermore, high flow controllability in the flow channel 15 could be realized by cellulose acetate and polystyrene applied to the flow channel 15. This is because the flow in the flow path 15 is controlled by applying cellulose acetate, which is a hydrophilic polymer film, to a part where the flow path 15 is present and applying polystyrene, which is a hydrophobic polymer, to another part. Because it can.

<Second Embodiment>
{Chip configuration}
(1) Entire light absorption layer FIG. 6A is a plan view of a chip according to a second embodiment of the present invention, and FIG. 6B is a cross-sectional view taken along the line BB ′ of FIG. FIG. 6C is a cross-sectional view showing a method for forming the light absorption layer. The chip 100 includes a first thermoplastic resin substrate 10 and a second thermoplastic resin substrate 20 that are made of a thermoplastic resin, and the substrates are bonded to each other through a bonding surface 24.

  The second thermoplastic resin substrate 20 has a light absorption layer 27 containing carbon black as a light absorber 23 that absorbs light. Here, the light absorption layer 27 is formed by spin-coating a solution containing, for example, carbon black on the entire surface of the second thermoplastic resin substrate 20 as shown in FIG. 6C. The first and second thermoplastic resin substrates 10 and 20 are bonded to each other via a bonding surface 24 between the light absorption layer 27 of the second thermoplastic resin substrate 20 and the first thermoplastic resin substrate 10. On the other hand, the first thermoplastic resin substrate 10 does not contain a light absorber so as to transmit light, and has a reagent storage portion 13 and a flow path 15 formed by removing a part of the main surface. is doing. The flow path 15 is formed with a groove formed in the first thermoplastic resin substrate 10 and a main surface of the second thermoplastic resin substrate 20 as side walls, and the substance to be measured passes therethrough. A detection substance 19 for detecting a measurement target substance may be fixed to the bottom of the flow path 15 at a desired position of the chip 100 as shown in FIG.

(2) Partial Light Absorbing Layer In FIGS. 6A to 6C, the light absorbing layer 27 is provided on the entire surface of the second thermoplastic resin substrate 20, but the partial light absorption is performed as shown below. An absorption layer 28 can also be provided. FIG. 7A is a cross-sectional view of a substrate having a partial light absorption layer 28, and FIG. 7B is a cross-sectional view illustrating a method for forming the partial light absorption layer 28.

  As shown in FIG. 7B, the partial light absorption layer 28 is disposed in the β portion in the figure corresponding to the flow path 15, and the surface of the second thermoplastic resin substrate 20 is interposed through the mask 43. It is formed by injecting the light absorber 23 into the substrate. The first and second thermoplastic resin substrates 10 and 20 are bonded to each other through the bonding surface 24 between the partial light absorption layer 28 of the second thermoplastic resin substrate 20 and the first thermoplastic resin substrate 10. is doing. At this time, as shown in FIG. 7A, the light absorption layer containing the light absorber 23 is not in contact with the wall surface of the flow path 15. Therefore, even when the laser beam is irradiated from the upper part of the first thermoplastic resin substrate 10, the laser beam passes through the β portion of the second thermoplastic resin substrate 20. Therefore, the wall surface of the flow path 15 located in the β portion generates heat and does not melt. Accordingly, there is a degree of freedom with respect to the fixing position of the detection substance 19 such that the detection substance 19 can be fixed to the surface of the second thermoplastic resin substrate 20 constituting a part of the wall surface of the flow path 15.

{Board bonding method}
Next, a method of bonding the first thermoplastic resin substrate 10 and the second thermoplastic resin substrate 20 of the chip 100 shown in FIGS. 6A and 6B will be described with reference to FIGS. To do. FIGS. 8A and 8B are cross-sectional views illustrating a method for bonding the first thermoplastic resin substrate 10 and the second thermoplastic resin substrate 20 together.

  First, the main surface of the first thermoplastic resin substrate 10 on which the flow path 15 is formed is opposed to the light absorption layer 27 of the second thermoplastic resin substrate 20. At this time, the β portion where the light absorption layer 27 is not formed is opposed to the flow path 15 of the first thermoplastic resin substrate 10 (see FIG. 8A). Then, a laser beam is irradiated from the upper part of the first thermoplastic resin substrate 10 facing each other toward the bonding surface 24 of the first and second thermoplastic resin substrates 10 and 20. (See FIG. 8 (b)).

  Here, the laser light transmitted through the first thermoplastic resin substrate 10 reaches the bonding surface 24 between the light absorption layer 27 of the second thermoplastic resin substrate 20 and the first thermoplastic resin substrate 10. Thereby, the carbon black in the light absorption layer 27 generates heat, and the first thermoplastic resin substrate 10 and / or the second thermoplastic resin substrate 20 on the bonding surface 24 are melted and bonded to each other.

  In addition, as shown in FIG. 3 of the first embodiment, bonding by partial irradiation may be performed. In other words, when the substrates are bonded to each other by irradiating the laser beam, the mask 41 that blocks the laser beam is disposed in a corresponding portion of the flow path 15 to which the detection substance 19 is fixed. Thereby, since the laser beam is not irradiated to the light absorption layer 27 corresponding to the flow path 15, deformation of the flow path 15 due to melting can be prevented, and the flow of fluid in the flow path 15 is inhibited. There is no. Furthermore, since the light absorption layer 27 forming the flow path 15 does not generate heat, even when the detection substance 19 is fixed on the light absorption layer 27, deactivation can be prevented. Therefore, there is a degree of freedom regarding the fixed position of the detection substance 19.

{Function and effect}
By providing the light absorption layer 27 on the surface of the second thermoplastic resin substrate 20, the heat generation portion can be retained on the substrate surface and can be made more local. Therefore, it is possible to further prevent deformation of the substrate due to heat generation of the entire substrate and deformation of the pattern such as the flow path formed in the substrate. In addition, the detection substance 19 disposed in the flow path 15 of the first thermoplastic resin substrate 10 can be prevented from being deactivated by heat. Furthermore, it is possible to prevent the side walls of the reagent storage unit 13 and the flow path 15 from melting due to heat generation and inhibiting the reaction of the detection substance 19.

  Moreover, when the 2nd thermoplastic resin board | substrate 20 whole contains the light absorber, it is necessary to set the time which irradiates a laser beam to a short time, and to suppress the spreading | diffusion of a heat_generation | fever. However, by providing the light absorption layer 27 only on the surface of the second thermoplastic resin substrate 20, it is possible to suppress the spread of heat generation without performing control according to the irradiation time of the laser light.

  Furthermore, since the light absorption layer 27 is provided on the substrate surface, the amount of the light absorber such as carbon black can be suppressed to a small amount.

  In addition, the following effects can be obtained as in the first embodiment. According to the bonding method of the second embodiment, the deformation of the pattern in the substrate due to the outflow of the adhesive and the flow of the fluid in the flow path 15 are not hindered. Furthermore, since it is not necessary to strongly press the substrates together at the time of bonding, it is possible to prevent the pattern in the substrate or the collapse or deformation of the substrate itself due to the pressing.

<Third Embodiment>
{Chip configuration}
FIG. 9A is a plan view of a chip according to the third embodiment of the present invention, and FIG. 9B is a cross-sectional view taken along the line CC ′ of FIG. 9A. In the chip 100, a light absorbing substrate 29 is sandwiched between a first thermoplastic resin substrate 10 and a second thermoplastic resin substrate 20 that are made of a thermoplastic resin. Here, as the light absorbing substrate 29, a thermoplastic elastomer containing carbon black is used as the light absorbing agent 23. Examples of the thermoplastic elastomer include polymer materials such as styrene, olefin, vinyl chloride, urethane, ester, and amide.

  The 1st and 2nd 1st thermoplastic resin board | substrates 10 and 20 do not contain the light absorber so that light can permeate | transmit. Moreover, the reagent storage part 13 and the flow path 15 are formed in the 1st thermoplastic resin board | substrate 10 by removing a part of main surface. Further, the flow path 15 is formed with the grooves formed in the first thermoplastic resin substrate 10 and the main surface of the light absorption substrate 29 as side walls, and the substance to be measured passes therethrough. A detection substance 19 for detecting a measurement target substance may be fixed to the bottom of the flow path 15 at a desired position of the chip 100 as shown in FIG. Examples of the detection substance 19 and the reagent include enzymes such as peroxidase, cholesterol oxidase, and cholesterol esterase, proteins, antigens, antibodies, biological substances such as bacteria, yeast, and microorganisms, and chemical substances.

{Board bonding method}
Next, the first thermoplastic resin substrate 10 and the second thermoplastic resin substrate through the light absorption substrate 29 of the chip 100 shown in FIGS. 9A and 9B using FIGS. The 20 bonding method will be described. FIGS. 10A to 10D are cross-sectional views illustrating a method for bonding the first thermoplastic resin substrate 10 and the second thermoplastic resin substrate 20 with the light absorption substrate 29 interposed therebetween.

  First, the second thermoplastic resin substrate 20 and the light absorption substrate 29 are opposed to each other. At this time, the adhesive 21 is applied to the opposing surface (see FIG. 10A). And it presses with the horn 45 from the upper part of the light absorption board | substrate 29, and the 2nd thermoplastic resin board | substrate 20 and the light absorption board | substrate 29 are affixed (refer FIG.10 (b)). Further, the main surface of the first thermoplastic resin substrate 10 on which the flow path 15 is formed is opposed to the light absorption substrate 29. Here, the bonding surface 24a of the first thermoplastic resin substrate 10 and the bonding surface 24b of the light absorption substrate 29 are opposed to each other (see FIG. 10C). Then, the laser beam is irradiated from above the first thermoplastic resin substrate 10 toward the bonding surfaces 24 (bonding surface 24a and bonding surface 24b) of the first and second thermoplastic resin substrates 10 and the light absorption substrate 29. . (See FIG. 10D).

  Here, the first thermoplastic resin substrate 10 does not contain carbon black, and the irradiated laser light is transmitted through the first thermoplastic resin substrate 10. In addition, the laser light transmitted through the first thermoplastic resin substrate 10 reaches the bonding surface 24 between the light absorbing substrate 29 containing carbon black and the first thermoplastic resin substrate 10. As a result, the carbon black in the light absorption substrate 29 generates heat, and the first thermoplastic resin substrate 10 and / or the light absorption substrate 29 on the bonding surface 24 is melted and bonded together.

{Function and effect}
The light absorbing substrate 29 described above is not limited to the thermoplastic elastomer, and may be a thermoplastic resin made of the same material as the substrate, for example. However, when the light absorption substrate 29 is formed of a thermoplastic elastomer, water tightness and air tightness can be improved. This is because the thermoplastic elastomer has the property of rubber elasticity as well as thermoplasticity, so that the adhesion between the first and second thermoplastic resin substrates 10 and 20 can be enhanced. In particular, watertightness and airtightness can be maintained even when the chip area is large.

  Furthermore, in the third embodiment, the following effects can be obtained as in the first embodiment. The deformation of the pattern in the substrate due to the outflow of the adhesive and the flow of the fluid in the flow path 15 are not hindered. Furthermore, since it is not necessary to strongly press the substrates together at the time of bonding, it is possible to prevent the pattern in the substrate or the collapse or deformation of the substrate itself due to the pressing.

<Example of Fourth Embodiment>
FIG. 11A is a plan view of a chip 100 according to the fourth embodiment of the present invention, and FIG. 11B is a cross-sectional view taken along the line EE ′ of FIG.

  In the chip 100, a light absorption substrate 29 is sandwiched between the first thermoplastic resin substrate 10 and the second thermoplastic resin substrate 20. Here, the material of the first thermoplastic resin substrate 10 and the second thermoplastic resin substrate 20 is a thermoplastic resin. The light absorbing substrate 29 is a thermoplastic elastomer containing carbon black as the light absorbing agent 23.

  The main surface of the first thermoplastic resin substrate 10 includes a first opening 80a, a second opening 80b, a first flow path 70 and a second opening that connect the first opening 80a and the second opening 80b. A second flow path 75 that connects 80b and the outside of the chip 100 is provided. In addition, the second thermoplastic resin substrate 20 is provided with a third flow path 90 to which pressure to the outside or the inside of the chip 100 is applied. As shown in FIG. 11B, the portion where the third flow path 90 opens in the main surface of the second thermoplastic resin substrate 20 corresponds to the first flow path 70 of the first thermoplastic resin substrate 10. .

  The chip 100 is formed as follows by irradiation with laser light. The first thermoplastic resin substrate 10 does not contain carbon black, and the irradiated laser light is transmitted through the first thermoplastic resin substrate 10. In addition, the laser light transmitted through the first thermoplastic resin substrate 10 reaches the bonding surface 24 between the light absorbing substrate 29 containing carbon black and the first thermoplastic resin substrate 10. As a result, the carbon black in the light absorption substrate 29 generates heat, and the first thermoplastic resin substrate 10 and / or the light absorption substrate 29 on the bonding surface 24 is melted and bonded together. Therefore, pattern collapse of the first and second openings 80a and 80b, the first, second, and third flow paths 70, 75, and 90 can be prevented. Moreover, since the light absorption board | substrate 29 has the property of rubber elasticity with thermoplasticity, it can improve the adhesiveness of the 1st and 2nd thermoplastic resin board | substrates 10 and 20, and can improve watertightness and airtightness.

  12A and 12B are explanatory diagrams for explaining the movement of the chip 100 to which pressure from the outside to the inside of the chip 100 is applied, and FIG. It is explanatory drawing explaining the motion of the chip | tip 100 to be performed. As shown in FIG. 12A, when a pressure from the outside to the inside of the chip 100 is applied to the third flow path 90, the light in the portion that opens on the main surface of the second thermoplastic resin substrate 20 in the third flow path 90. The absorption substrate 29 receives pressure. At this time, the light absorption substrate 29 extends so that the passage of the first flow path 70 connecting the first opening 80a and the second opening 80b becomes narrow. Therefore, the fluid in the first and second openings 80a and 80b is led out of the chip 100 through the second flow path 75 (see FIG. 12A). Next, when a pressure from the outside to the inside of the chip 100 is further applied to the third channel 90, the light absorption substrate 29 expands so as to block the first channel 70. Therefore, the fluid flow between the first opening 80a and the second opening 80b stops (see FIG. 12B).

  Next, as shown in FIG. 12C, when pressure is applied to the third flow path 90 from the inside of the chip 100 to the outside, the light absorbing substrate 29 is pulled toward the second thermoplastic resin substrate 20. Stretch to. Therefore, for example, the fluid is taken into the chip 100 through the second flow path 75. Thus, the light-absorbing substrate 29 having rubber elasticity can be used as a valve or a pump for opening and closing the first opening 80a and the second opening 80b.

<Other embodiment examples>
(1)
In the above, if the melting points of the substrates to be bonded are set to the same level, the light absorbing agent in the vicinity of the bonding surfaces of the substrates is irradiated with light, so that the bonding surfaces of both substrates are melted almost simultaneously and the substrates are bonded to each other. easy.

(2)
In the above, carbon black is used as the light absorber, but other color pigments may be used. In addition, it is preferable to use a dye having a different color for each substance to be measured because the measurer can easily confirm the chip used for the measurement. For example, when measuring various measurement target substances such as glucose and cholesterol, it is possible to prevent the chip from being mixed up.

(3)
In the above description, the surface of the reagent storage section 13 or the flow path 15 formed in the substrate has a surface depending on the properties of the fluid passing through the interior, the properties of the stored reagent, the properties of the detection substance 19 to be fixed, and the like. A polymer film may be disposed on the substrate. For example, it is assumed that blood having a viscosity of about 4 to 15 is a substance to be measured and the viscosity of a reagent or the like inside the chip is 1. Thus, when mixing, reacting, and detecting solutions having greatly different viscosities in one chip, it is difficult to control the fluid. For example, a solution having a high viscosity or a solution having a large surface tension may cause the solution to stagnate due to the viscosity, or the solution may be repelled by the surface tension and difficult to flow. On the other hand, a solution having a low viscosity flows through the flow path 15 without receiving resistance. As described above, when the viscosities are different, mixing and reaction are incomplete, and it is difficult to accurately detect the inspection target substance. Therefore, the surface of a certain part such as a flow path is subjected to a hydrophilic treatment, and the surface of another part is subjected to a hydrophobic treatment to control the fluid in the flow path. Examples of the hydrophilic polymer film include cellulose acetate, polyvinyl alcohol (PVA), polyvinyl pyrrolidone (PVP), and the like. Examples of the hydrophobic polymer include polystyrene (PS), polyethylene (PE), Teflon (registered trademark), and silicon.

(4)
In the above, it is preferable that the detection substance is fixed at a distance of 100 μm or more from the position where the light absorbing substance is introduced. The light absorbing material generates heat by absorbing the irradiated light. By disposing the detection material at a predetermined distance from the light absorption material, it is possible to prevent the detection material from being deactivated due to heat generation when the substrates are bonded together.

(5)
In the above, laser light is applied to the bonding surfaces of the first and second thermoplastic resin substrates 10 and 20 using laser light that is coherent light, but it is only necessary that the bonding surfaces can be irradiated with light. It is not limited to laser light.

(6)
In the above, both the substrates to be bonded are formed of the thermoplastic resin, but at least one of the substrates may be made of the thermoplastic resin. For example, one may be a thermoplastic resin substrate and the other may be a metal, glass, or the like. At this time, it is preferable to form a pattern such as a reagent reservoir or a flow path on a thermoplastic resin substrate that is easier to process than metal or glass.

(7)
In the above description, the flow path 15 is formed in the first thermoplastic resin substrate 10, but the flow path may be formed in the second thermoplastic resin substrate 20. Further, the flow path 15 may be formed by combining a groove formed in the first thermoplastic resin substrate 10 and a groove formed in the second thermoplastic resin substrate 20.

(8)
The second thermoplastic resin substrate 20 of the first embodiment is formed by kneading carbon black. The carbon black content of the second thermoplastic resin substrate 20 is 0.01% by volume or more, 0 It is preferably 0.025% by volume or less.

  As described above, a solution such as blood or a reagent as a sample is introduced into the flow path 15 of FIG. 2, and a biochemical reaction is performed. A part of the flow path 15 is formed by the second thermoplastic resin substrate 20, and the solution introduced into the flow path 15 and the second thermoplastic resin substrate 20 are in contact with each other. At this time, if carbon black as a light absorbing material is excessively contained in the second thermoplastic resin substrate 20, the carbon black is eluted from the second thermoplastic resin substrate 20 into the solution in the flow path 15. . For example, conventionally, the carbon black content is in the range of 0.05% by volume or more and 0.1% by volume or less. However, in this range, the content is large, and the carbon black is from the second thermoplastic resin substrate 20. It elutes into the solution in the flow path 15. For this reason, the eluted carbon black may interfere with biochemical reaction or the like in the flow path 15. In addition, when using a spectroscopic method such as irradiating light to the channel 15 into which the solution has been introduced and measuring the intensity of transmitted light, the spectrum of transmitted light, and the intensity of scattered light, the carbon eluted into the channel 15 Black acts as an inhibitor, such as absorbing transmitted light. Therefore, the sample cannot be accurately quantified such as quantification of a product generated by a biochemical reaction or the like. On the other hand, when the content of carbon black in the second thermoplastic resin substrate 20 is small, light absorption is not sufficiently performed and the substrates are not sufficiently bonded. In addition, since the content of carbon black as a coloring matter is small, color unevenness occurs on the substrate, which also causes insufficient bonding of the substrates.

  FIG. 13 is an experimental result showing the light absorption characteristics of each manufactured substrate when the carbon black content and the substrate manufacturing method are changed. Here, as a substrate, carbon black content 0.0125 vol%, 0.016 vol%, 0.025 vol%, 0.05 vol% formed by injection molding and carbon formed by extrusion molding are used. A substrate having a black content of 0.05% by volume was prepared. And after immersing these substrates purely, the elution degree of carbon black was detected with the ultraviolet spectrometer. Since carbon black specifically absorbs light having a wavelength of about 270 nm, the presence of eluted carbon black can be confirmed. As shown in FIG. 13, it can be seen that the conventional carbon black content of 0.05% by volume has the highest absorbance and the most remarkable elution of carbon black. However, it can be seen that elution of carbon black is suppressed by setting the content to 0.025% by volume or less as in the present invention.

  If the carbon black content in the second thermoplastic resin substrate 20 is 0.025% by volume or less as in the present invention, elution of the carbon black into the solution can be suppressed. Therefore, the biochemical reaction can be normally performed in the solution in the flow path 15, and the sample or the like can be accurately quantified. Further, if the carbon black content is 0.01% by volume or more, the bonding strength between the substrates can be sufficiently secured without causing uneven color in the substrates. In addition, since injection molding is a simple manufacturing method that is generally used for molding a substrate, it is suitable for injection molding in the case of the above-mentioned content. Excellent surface. Thus, by making the content of carbon black in the above-described range, it can be efficiently used while utilizing the characteristics of carbon black.

  The content of carbon black as described above is the same as the light absorption layer 27 and the partial light absorption layer 28 containing the carbon black of the second embodiment, and the light absorption substrate 29 of the third and fourth embodiments. The present invention can also be applied.

(9)
In the first embodiment, in order to prevent the floating between the first thermoplastic resin substrate 10 and the second thermoplastic resin substrate 20, as shown in FIG. The first thermoplastic resin substrate 10 is uniformly pressed through the excellent quartz glass 40. Here, it is preferable that a transparent plate having an uneven surface is interposed between the first thermoplastic resin substrate 10 and the quartz glass 40.

  Here, since the 1st thermoplastic resin board | substrate 10 is resin, it is formed more coarsely so that the surface may have an unevenness | corrugation rather than the quartz glass 40. FIG. On the other hand, as described above, the surface of the quartz glass 40 is flat and smooth. Therefore, when the first thermoplastic resin substrate 10 and the quartz glass 40 are brought into contact with each other, the unevenness of the first thermoplastic resin substrate 10 serves as a sucker, and the quartz glass 40 is adsorbed to the first thermoplastic resin substrate 10. End up. And once it is adsorbed in a vacuum state, the quartz glass 40 cannot be removed from the first thermoplastic resin substrate, and the chip cannot be taken out of the pressure device. In addition, when the quartz glass 40 is pulled with a strong force and peeled off from the first thermoplastic resin substrate 10, the adhesion between the first thermoplastic resin substrate 10 and the second thermoplastic resin substrate 20 may be peeled off. In particular, when the first thermoplastic resin substrate 10 is subjected to a solvent treatment for surface treatment such as surface modification, surface coating, or other cleaning or sterilization, the surface of the first thermoplastic resin substrate 10 becomes elastic. The above-mentioned problem becomes remarkable.

  FIG. 14 is an explanatory view showing a manufacturing process when a transparent plate having an uneven surface is interposed between the first thermoplastic resin substrate 10 and the quartz glass 40. As shown in FIG. 14, the first thermoplastic resin substrate 10 and the transparent plate having the concavo-convex surface are provided by interposing the transparent plate 50 having the concavo-convex surface between the first thermoplastic resin substrate 10 and the quartz glass 40. Adsorption with 50 can be prevented. This is because the surface of the transparent plate 50 is rough and uneven, and the surface of the first thermoplastic resin substrate 10 in contact with the transparent plate 50 is also rough, so that the above-described adsorption is performed. This is because it does not occur. Thereby, adsorption | suction with the 1st thermoplastic resin substrate 10 and the quartz glass 40 can be prevented.

  Further, as the transparent plate 50 having an uneven surface, for example, PMMA, APO (amorphous polyolefin), polycarbonate, poly-4-methylpentene-1 or the like can be used. Further, instead of the thick transparent plate 50, these materials may be processed into a sheet-like thin film such as transparent polyamide (nylon).

  In order to apply pressure uniformly to the bonding surfaces of the substrates during pressing, it is optimal to combine the quartz glass 40 having high rigidity and the transparent plate 50 having minute irregularities. The fine unevenness means, for example, unevenness of about 0.1 μm to about 1.0 μm or more. Instead of the combination of the quartz glass 40 and the transparent plate 50, a transparent resin plate having high rigidity may be used.

  Further, the same effect can be obtained even if quartz glass 40 in which a transparent resin film such as a fluororesin or a silicon resin is coated on the contact surface side with the first thermoplastic resin substrate 10 is used.

  Moreover, although the transparent plate 50 which has an unevenness | corrugation is arrange | positioned at the side which contacts the 1st thermoplastic resin board | substrate 10 above, the transparent board 50 is also provided in the contact surface of the 2nd thermoplastic resin board | substrate 20 and a pressurization apparatus. You may provide, and you may provide in both.

  In addition, as a combination of the unevenness | corrugation magnitude | size of the transparent plate 50, and the unevenness | corrugation magnitude | size of the 1st thermoplastic resin board | substrate 10, if the combination of the grade which the transparent board 50 and the 1st thermoplastic resin board | substrate 10 do not adsorb | suck mutually, it is limited. Not.

  The thermoplastic resin substrate bonded using the present invention can prevent the substrate from being deformed or deformed by heat. Therefore, it can be applied to biochips and microchemical chips where channels, reagent storages, etc. are formed inside the substrate to measure biological materials and chemicals such as DNA, enzymes, proteins, antigens, retreats, viruses and cells. Is possible.

(A) The top view of the chip | tip concerning the example of 1st Embodiment of this invention. (B) Sectional drawing in the A-A 'line of Fig.1 (a). (A) Sectional drawing (1) which shows the bonding method of the 1st thermoplastic resin board | substrate 10 and the 2nd thermoplastic resin board | substrate 20. FIG. (B) Sectional drawing (2) which shows the bonding method of the 1st thermoplastic resin board | substrate 10 and the 2nd thermoplastic resin board | substrate 20. FIG. Sectional drawing which shows the bonding method of the board | substrate by the partial irradiation using a mask. Sectional drawing of the chip | tip with which the detection substance is fix | immobilized on the surface of the 2nd thermoplastic resin board | substrate. (A) Sectional drawing (1) which shows the bonding method of the chip | tip which concerns on 1st Example of this invention. (B) Sectional drawing (2) which shows the chip | tip bonding method based on 1st Example of this invention. (A) The top view of the chip | tip concerning the example of 2nd Embodiment of this invention. (B) Sectional drawing in the B-B 'line of Fig.6 (a). (C) Sectional drawing which shows the formation method of a light absorption layer. (A) Sectional drawing of the board | substrate which has a partial light absorption layer. (B) Sectional drawing which shows the formation method of the partial light absorption layer 28. FIG. (A) Sectional drawing (1) which shows the bonding method of the chip | tip which concerns on the 2nd Embodiment of this invention. (B) Sectional drawing (2) which shows the chip | tip bonding method based on 2nd Embodiment of this invention. (A) The top view of the chip | tip concerning the example of 3rd Embodiment of this invention. FIG. 9B is a cross-sectional view taken along line C-C ′ in FIG. (A) Sectional drawing (1) which shows the bonding method of the biochip 180 shown in FIG. (B) Sectional drawing (2) which shows the bonding method of the biochip 180 shown in FIG. (C) Sectional drawing (3) which shows the bonding method of the biochip 180 shown in FIG. (D) Sectional drawing (4) which shows the bonding method of the biochip 180 shown in FIG. (A) The top view of the chip | tip 100 which concerns on the example of 4th Embodiment of this invention. (B) Sectional drawing in the E-E 'line of Fig.11 (a). (A) Explanatory drawing (1) explaining the motion of the chip | tip 100 to which the pressure from the exterior to the inside of the chip | tip 100 is applied. (B) Explanatory drawing (2) explaining the motion of the chip | tip 100 to which the pressure from the inside to the inside of the chip | tip 100 is applied. (C) Explanatory drawing explaining the motion of the chip | tip 100 to which the pressure from the inside of the chip | tip 100 is applied to the exterior. The experimental result which shows the light absorption characteristic in each manufactured board | substrate when changing content of carbon black and the manufacturing method of a board | substrate. Explanatory drawing which shows the manufacturing process at the time of interposing the transparent plate which has an uneven surface between the 1st thermoplastic resin substrate 10 and the quartz glass 40. FIG.

Explanation of symbols

10: first thermoplastic resin substrate 15: flow path 19: sensing substance 20: second thermoplastic resin substrate 23: light absorber 27: light absorption layer 28: partial light absorption layer 29: light absorption substrate

Claims (18)

A method for bonding a first substrate and a second substrate,
Forming at least one main body of the first substrate and the second substrate with a light-transmitting material that transmits light;
Forming at least a part of the bonding surfaces of the first substrate and the second substrate with a thermoplastic resin containing a light absorbing material that absorbs light;
Bonding the first substrate and the second substrate by irradiating light to the light-absorbing material on the bonding surface through the light-transmitting substrate;
Bonding method including.   The bonding method according to claim 1, wherein a detection substance for detecting a measurement target substance is arranged on the first substrate and / or the second substrate, and the wavelength of the light is in a range of 400 nm to 2.5 μm. .   The first substrate and / or the second substrate block the light at a portion corresponding to a fixed location of a fixed sensing substance or a pattern forming location formed on the first substrate and / or the second substrate. The bonding method according to claim 1, wherein a mask is disposed, and light is irradiated onto the light-absorbing material on the bonding surface from above the mask.   The bonding method according to claim 3, wherein the first substrate and the second substrate are thermoplastic resin substrates, and the melting points of the first substrate and the second substrate are substantially the same. A method of forming a chip formed by bonding a first substrate and a second substrate,
Forming at least one main body of the first substrate and the second substrate with a light-transmitting material that transmits light;
Forming at least a part of the bonding surfaces of the first substrate and the second substrate with a thermoplastic resin containing a light absorbing material that absorbs light;
Forming a flow path on a main surface of the first substrate and / or the second substrate;
The first substrate and the second substrate are made to face each other so as to cover the flow path, and light is irradiated to the light-absorbing substance on the bonding surface through the substrate that transmits the light, thereby the first substrate. Bonding the second substrate to the second substrate;
A method of forming a chip including:   6. The chip formation according to claim 5, wherein carbon black is used as the light-absorbing substance, and the carbon black content in the carbon black-containing layer is 0.01 vol% or more and 0.025 vol% or less. Method.   The chip forming method according to claim 6, wherein the layer containing carbon black is formed by injection molding. In the step of bonding the first substrate and the second substrate,
A main surface different from the bonding surface in at least one of the first substrate and the second substrate is pressurized from a transparent glass plate through a transparent plate having an uneven surface, whereby the first substrate The chip formation method according to claim 5, wherein the second substrate is bonded to the second substrate.   The chip formation method according to claim 8, wherein a main surface different from the bonding surface in contact with the transparent plate is treated with a solvent. In the step of bonding the first substrate and the second substrate,
A main surface different from the bonding surface in at least one of the first substrate and the second substrate receives pressure from a transparent glass plate, whereby the first substrate and the second substrate are bonded to each other. And
The method for forming a chip according to claim 5, wherein a transparent resin film is formed on a main surface of the transparent glass plate in contact with a main surface different from the bonding surface.   The chip forming method according to claim 10, wherein a main surface different from the bonding surface in contact with the transparent resin film of the transparent glass plate is treated with a solvent. A first substrate formed of a thermoplastic resin;
A second substrate bonded to face the first substrate;
A flow path formed in the main surface of the first substrate and / or the second substrate,
The main body of at least one of the first substrate and the second substrate is a light transmissive material that transmits light,
At least a part of the bonding surface of the first substrate and the second substrate includes a light absorbing material that absorbs light,
The bonding surface of the first substrate or the second substrate facing to cover the flow path is bonded by irradiating light to the light-absorbing substance on the bonding surface through the substrate that transmits the light. Matched chips.   The chip according to claim 12, wherein a detection substance for detecting a measurement target substance is fixed in the flow path.   The chip according to claim 13, wherein the detection substance is fixed at a distance of 100 μm or more from the introduction position of the light absorption substance.   The chip according to claim 12, wherein the light absorbing / absorbing substance is a pigment.   The chip according to claim 12, wherein the light absorbing / absorbing substance is a pigment having a different color for each measurement target substance.   The chip according to claim 12, wherein carbon black is used as the light absorbing material, and a carbon black content in the layer containing the carbon black is 0.01 volume% or more and 0.025 volume% or less.   The chip according to claim 17, wherein the layer containing carbon black is formed by injection molding.

Images