JP2006310806A - Heat dissipation member, substrate for mounting electronic component, package for housing electronic component and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat dissipation member capable of satisfactorily diffusing heat generated from an electronic component to the outside or the air, and firmly fixing the electronic component. <P>SOLUTION: The heat dissipation member 1 has a portion for mounting an electronic component 7 on the top surface of a flat plate configured in such a way that carbon fiber sheets each formed by two-dimensionally knitting first carbon fibers and second carbon fibers crossing the first carbon fibers are laminated in a multiple layer and a metal is impregnated between the gaps of the carbon fiber sheets. In the member 1, the first carbon fibers are arranged so as to reach from the top surface to the bottom surface of the flat plate, a through hole is formed from the top surface to the bottom surface of the flat plate, and a high-temperature conductor having a thermal conductivity higher than that of the flat plate is filled in the through hole. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a heat radiating member that dissipates heat generated by, for example, an electronic component mounted thereon, an electronic component mounting board and an electronic component storing package having the heat radiating member, and the electronic component storing package. The present invention relates to an electronic device using the.

  Conventionally, electronic component storage packages for storing electronic components such as semiconductor elements, piezoelectric vibrators, and light emitting elements are generally made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, and a glass ceramic. It is composed of a frame, a heat dissipating member made of copper-tungsten material or copper-molybdenum material for dissipating heat generated when the electronic component is mounted and operating to the outside or the atmosphere, and a lid. In addition, the frame body is disposed so as to surround the electronic component mounting portion on the upper surface of the heat radiating member, and from the inside to the outside of the recess formed by these frame body and the heat radiating member, tungsten, molybdenum, manganese, copper, A plurality of wiring conductors made of silver or the like are attached to the frame body and led out.

  Then, the electronic component is bonded and fixed to the mounting portion on the upper surface of the heat radiating member via an adhesive such as glass, resin, or brazing material, and each electrode of the electronic component is electrically connected to the wiring conductor via a bonding wire. After that, the lid body is joined to the frame body through a sealing material made of glass, resin, brazing material, etc., and the electronic component is accommodated in the container composed of the heat radiation member, the frame body, and the lid body. Thus, an electronic device as a product is obtained (for example, see Patent Document 1 below). This electronic device may be mounted on an external heat sink by screwing or the like in order to further improve the heat dissipation efficiency.

An electronic component storage package including a heat dissipation member made of such a copper-tungsten material or a copper-molybdenum material has a high heat conductivity of the heat dissipation member, and a thermal expansion coefficient of the heat dissipation member is a semiconductor as an electronic component. Electronic component storage package equipped with high heat-generating semiconductor elements such as power ICs and high-frequency transistors because the thermal expansion coefficient is close to that of silicon, gallium arsenide, which is the component material of the element, and ceramic materials used as the component material of the package It is attracting attention as.
Japanese Patent Laid-Open No. 4-348062

  In recent years, a heat dissipation member having a thermal conductivity of 300 W / m · K or more has been demanded due to an increase in the amount of heat generated with the high integration of power ICs and high-frequency transistors. However, the thermal conductivity of the conventional heat-dissipating member made of copper-tungsten material or copper-molybdenum material is about 200 W / m · K, which is low for the requirement, and there is a problem that heat dissipation characteristics are insufficient. It was.

  On the other hand, in the conventional copper-tungsten material and copper-molybdenum material, although the thermal conductivity of the heat dissipation member can be increased by increasing the copper content, the thermal expansion coefficient of the electronic component and the heat dissipation member There is a problem that the difference becomes large and the electronic component cannot be firmly bonded to the heat dissipation member.

  The present invention has been devised in view of the above-described problems in the prior art, and its purpose is to dissipate heat generated by electronic components well to the outside and the atmosphere, and to firmly bond electronic components. An object of the present invention is to provide a heat dissipating member that can be used, an electronic component mounting substrate and an electronic component storing package having the heat dissipating member, and an electronic device using the electronic component storing package.

  The heat dissipating member of the present invention laminates a carbon fiber sheet formed by two-dimensionally knitting a first carbon fiber and a second carbon fiber intersecting with the first carbon fiber, and impregnates the gap between the carbon fiber sheets with a metal. A heat dissipating member having an electronic component mounting portion on the upper surface of the flat plate formed by arranging the first carbon fiber so as to reach the lower surface from the upper surface of the flat plate, and from the upper surface to the lower surface of the flat plate A through hole is formed, and the through hole is filled with a high thermal conductor having a higher thermal conductivity than the flat plate.

  The heat dissipating member of the present invention is preferably characterized in that the first and second carbon fibers are bonded with carbon powder.

  In the heat dissipating member of the present invention, preferably, the first carbon fiber is arranged so that an axial direction of the first carbon fiber is substantially perpendicular to an upper surface of the heat dissipating member.

  In the heat dissipating member of the present invention, it is preferable that the upper end surface of the high thermal conductor is a mounting portion for the electronic component.

  In the heat dissipating member of the present invention, preferably, the area of the upper end surface of the high thermal conductor is made larger than that of the electronic component in plan view.

  The electronic component mounting board of the present invention is characterized in that a wiring conductor is formed on the upper surface of the heat dissipation member of the present invention via an insulator.

  An electronic component storage package according to the present invention includes the heat dissipating member according to the present invention, and a frame formed by forming a plurality of wiring conductors surrounding the mounting portion and being led out from the inner surface to the outer surface. It is characterized by being.

  In the electronic component storage package of the present invention, preferably, the heat dissipating member has a rectangular shape in plan view, and the layer direction of the carbon fiber sheet is arranged in parallel to the side surface on the long side of the heat dissipating member. Features.

  An electronic device according to the present invention includes the electronic component mounting board according to the present invention, and an electronic component mounted on the mounting portion and having an electrode electrically connected to the wiring conductor.

  The electronic device of the present invention includes the electronic component storage package of the present invention, an electronic component mounted on the mounting portion and having an electrode electrically connected to the wiring conductor, and the electronic component on the upper surface of the frame. It is characterized by comprising a lid attached so as to cover or a sealing resin filled inside the frame so as to cover the electronic component.

  The heat dissipating member of the present invention laminates a carbon fiber sheet formed by two-dimensionally knitting a first carbon fiber and a second carbon fiber intersecting with the first carbon fiber, and impregnates the gap between the carbon fiber sheets with a metal. A heat dissipating member having an electronic component mounting portion on the upper surface of the flat plate formed by arranging the first carbon fiber so as to reach the lower surface from the upper surface of the flat plate, and forming a through hole from the upper surface to the lower surface of the flat plate In addition, since the through hole is filled with a high thermal conductor having a higher thermal conductivity than that of the flat plate, the heat generated in the electronic component is very well via the first carbon fiber that is oriented from the upper surface to the lower surface of the heat dissipation member. It can dissipate heat. In other words, simply laminating the carbon fiber sheets in the vertical direction, when heat moves from the upper surface to the lower surface of the heat dissipation member, it passes through the contact portion between the upper and lower carbon fiber sheets, the heat conduction Whereas the first carbon fiber is oriented so as to be continuous from the upper surface to the lower surface of the heat radiating member in the present invention, there is no contact portion between the carbon fibers, and the thermal conductivity becomes extremely high.

  In addition, since the gaps between the carbon fiber sheets are impregnated with metal, the voids present in the carbon fiber sheets are filled with the metal, improving the airtightness of the carbon fiber sheets themselves, and further improving the thermal conductivity of the heat dissipation member. In addition, the airtight sealing of the empty space for storing the electronic components of the electronic component storing package is good, and the electronic components can be operated stably and normally.

  Furthermore, the heat conductivity in the thickness direction of the heat radiating member can be further increased by the synergistic effect of the high thermal conductor filled in the through-hole formed from the upper surface to the lower surface of the heat radiating member and the first carbon fiber.

  Moreover, even if the metal or high thermal conductor impregnated in the carbon fiber sheet is thermally expanded, the thermal expansion of the metal or high thermal conductor impregnated in the carbon fiber sheet is restrained by the carbon fiber sheet, Thermal expansion can be suppressed. As a result, it is possible to effectively prevent the occurrence of stress due to the difference in thermal expansion between the frame and the electronic component, and it is possible to stably maintain the strong bonding between the frame and the electronic component and the heat dissipation member over a long period of time. .

  Moreover, according to the heat radiating member of this invention, since the 1st and 2nd carbon fiber was couple | bonded with carbon powder, while reducing the thermal expansion coefficient of a heat radiating member, thermal conductivity can be improved.

  Further, according to the heat radiating member of the present invention, since the axial direction of the first carbon fiber is arranged substantially perpendicular to the upper surface of the heat radiating member, the length of the first carbon fiber oriented from the upper surface to the lower surface of the heat radiating member. That is, the heat conduction path with the best heat conductivity can be shortened, and the heat dissipation with respect to the mounted electronic component can be further improved.

  According to the electronic component mounting substrate of the present invention, since the wiring conductor is formed on the upper surface of the heat dissipation member of the present invention via an insulator, the electronic component mounting device having the characteristics of the heat dissipation member of the present invention is provided. It is possible to provide an electronic component mounting board with extremely good heat dissipation characteristics.

  According to the electronic component storage package of the present invention, the electronic component storage package includes the frame body that surrounds and attaches the mounting portion and forms a plurality of wiring conductors led out from the inner surface to the outer surface. It is possible to provide an electronic component storage package that has the characteristics of a heat dissipation member and has extremely good heat dissipation characteristics for electronic components.

  Further, according to the electronic component storage package of the present invention, the heat dissipating member has a rectangular shape in plan view, and the layer direction of the carbon fiber sheet is arranged in parallel to the side surface on the long side of the heat dissipating member. By orienting the layer direction of the carbon fiber sheet having a small expansion coefficient parallel to the long side direction in which the thermal expansion of the rectangular heat radiating member increases, the thermal expansion of the heat radiating member can be more effectively prevented.

  According to the first electronic device of the present invention, the electronic component mounting board according to the present invention, and the electronic component mounted on the mounting portion and electrically connected to the wiring conductor are provided. It is possible to provide an electronic device having the characteristics of the heat radiating member of the present invention, having extremely good heat radiating characteristics with respect to the electronic component, and capable of operating the electronic component stably over a long period of time.

  According to the second electronic device of the present invention, the electronic component storage package of the present invention, the electronic component mounted on the mounting portion and having the electrode electrically connected to the wiring conductor, and the electronic component on the upper surface of the frame body And the sealing resin filled so as to cover the electronic component inside the lid or the frame attached so as to cover the electronic component, the electronic component having the characteristics of the electronic component storing package of the present invention, It is possible to provide an electronic device that has extremely good heat dissipation characteristics for components and can stably operate electronic components over a long period of time.

  Next, the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a cross-sectional view showing an example of an embodiment of an electronic component storage package including a heat dissipation member of the present invention and an electronic device using the same, and FIG. 2 is a plan view of the electronic component storage package of FIG. It is. In these drawings, 1 is a heat radiating member, 2 is a high thermal conductor, 3 is a frame, and 4 is a wiring conductor. The heat dissipation member 1 and the frame 3 constitute an electronic component storage package that stores the electronic component 7. In addition, after mounting the electronic component 7 on the mounting portion 6 of the heat radiating member 1, a sealing resin is filled in the recess 3 a composed of the heat radiating member 1 and the frame 3 so as to cover the electronic component 7. The electronic device 10 of the present invention is configured by sealing, or by attaching the lid 9 to the upper surface of the frame 3 so as to cover the recess 3a and sealing the electronic component 7.

  The heat dissipating member 1 includes a plurality of carbon fiber sheets obtained by two-dimensionally weaving a first carbon fiber disposed so as to reach the lower surface from the upper surface and a second carbon fiber intersecting the first carbon fiber and bonding them with carbon powder. In addition to being juxtaposed in a direction orthogonal to the thickness direction of 1, the gap between the carbon fiber sheets is impregnated with metal. FIG. 3 is a diagram schematically showing the configuration of such a heat radiating member 1. As shown in FIG. 3, the heat radiating member 1 has a carbon fiber sheet A in which the first carbon fiber 12 and the second carbon fiber 13 are two-dimensionally knitted in a direction orthogonal to the thickness direction of the heat radiating member 1. It is arranged side by side. Here, the surface B is the upper surface of the heat radiating member 1, that is, the surface on which the electronic component 7 is mounted. In FIG. 3, the number of the carbon fiber sheets A constituting the heat radiating member 1 is six in order to simplify the illustration. In FIG. 3, in order to clearly illustrate the configuration of the heat radiating member 1, the high heat conductor 2 and the mounting portion 6 formed on the heat radiating member 1 are omitted. The metal impregnated in the gaps between the carbon fibers of the carbon fiber sheet A is preferably made of a metal having high thermal conductivity such as copper or a copper alloy.

  Moreover, it is preferable that the some carbon fiber sheet A arranged in parallel in the direction orthogonal to the thickness direction of the heat radiating member 1 is mutually couple | bonded with carbon powder. Thereby, the thermal expansion to the direction orthogonal to the thickness direction of the heat radiating member 1 can be suppressed effectively.

  The heat radiating member 1 transmits heat generated from the electronic component 7 from the upper surface to the lower surface to dissipate the heat to the outside of the electronic component storage package, so that the electronic component 7 is always kept at an appropriate temperature.

  The heat radiating member 1 is impregnated with a solution of a thermosetting resin such as a phenol resin in which a powder of pitch pitch carbon fibers 12 and 13 is knitted in two dimensions, for example, solid pitch or coke powder. After drying these layers and laminating a plurality of layers, a predetermined pressure is applied and heated, and this is fired in an inert atmosphere at a high temperature of 2000 ° C. to 3000 ° C. A base material in which a plurality of layers of carbon fiber sheets A knitted in dimension is laminated is produced. Next, after impregnating the molten copper in the base material under a temperature and pressure of, for example, 1000 ° C. to 1300 ° C., 10 MPa to 200 MPa, carbon fibers oriented in at least one direction (first carbon fibers 12) are obtained. It is manufactured by cutting the base material into a flat plate shape so as to reach the lower surface from the upper surface (that is, cutting so that the plurality of carbon fiber sheets A are arranged in parallel in the direction perpendicular to the thickness direction of the heat radiating member 1). .

  The carbon fiber sheet A is formed by two-dimensionally knitting the first carbon fiber 12 and the second carbon fiber 13 intersecting each other, and the first carbon fiber 12 and the second carbon fiber 13 are orthogonal to each other. However, they are not necessarily orthogonal. Further, the first carbon fiber 12 and the second carbon fiber 13 are bonded to each other by carbon powder, so that the thermal expansion coefficient of the heat radiating member 1 is reduced and the thermal conductivity is improved.

  The first carbon fibers 12 may be arranged so as to reach the lower surface from the upper surface of the heat dissipation member 1. Preferably, the smaller one of the crossing angles formed by the axial direction of the first carbon fiber 12 and the upper surface of the heat radiating member 1 is 45 to 90 degrees. When the angle is less than 45 degrees, the length of the first carbon fiber 12 from the upper surface to the lower surface of the heat radiating member 1 becomes long, and the effect of improving the heat dissipation tends to be small.

  More preferably, the first carbon fibers 12 are arranged so that the axial direction of the first carbon fibers 12 is substantially perpendicular to the upper surface of the heat radiating member 1. Thereby, the length of the first carbon fibers 12 oriented from the upper surface to the lower surface of the heat radiating member 1, that is, the heat conduction path having the best thermal conductivity can be shortened, and the heat radiating property to the electronic component 7 to be mounted. Can be further improved. Note that “substantially perpendicular” means that the angle formed by the axial direction of the first carbon fiber 12 and the upper surface of the heat radiating member 1 is approximately 90 degrees, specifically 80 to 90 degrees.

  The heat radiating member 1 is a flat plate having a main surface, and the shape may be rectangular, polygonal or circular. Moreover, when forming the several wiring conductor 4 in the frame 3, the package for semiconductor element accommodation can be reduced in size by arrange | positioning the wiring conductor 4 collectively on the both sides which a frame opposes. In this case, the heat radiating member 1 is also preferably rectangular in plan view.

  When the heat radiating member 1 has a rectangular shape in plan view, the layer direction of the carbon fiber sheet A is preferably arranged in parallel with the long side surface of the heat radiating member 1 as shown in FIG. Thereby, the thermal expansion of the heat radiating member 1 is more effectively prevented by orienting the layer direction of the carbon fiber sheet A having a small thermal expansion coefficient in parallel to the long side direction in which the thermal expansion of the rectangular heat radiating member 1 is increased. can do. Note that the layer direction of the carbon fiber sheet A is arranged in parallel with the side surface on the long side of the heat radiating member 1 is not necessarily arranged completely in parallel. If the angle formed with the layer direction of the carbon fiber sheet A is 0 to 45 degrees, the effect of more effectively preventing the thermal expansion in the long side direction in which the thermal expansion of the rectangular heat radiating member 1 is increased can be achieved.

  Further, one or a plurality of through holes are formed in the heat radiating member 1 from the upper surface to the lower surface, and the high thermal conductor 2 having a higher thermal conductivity than the heat radiating member 1 is filled in the through holes.

  Preferably, as shown in FIGS. 1 and 2, the electronic component 7 is mounted on the upper end surface of the high thermal conductor 2, and the area of the upper end surface is made larger than the electronic component 7 in plan view. The heat of the electronic device 7 can be directly conducted to the lower surface side of the heat radiating member 1 by the high high heat conductor 2 to perform very good heat dissipation, and the thermal expansion of the high heat conductor 2 is effectively suppressed by the carbon fiber. In addition, the stress due to the difference in thermal expansion between the electronic component 7 and the high thermal conductor 2 can be effectively prevented.

  The high thermal conductor 2 is for conducting the heat generated by the electronic component 7 well and radiating heat from the electronic component 7, and a material having a higher thermal conductivity than the heat radiating member 1 is used. Examples of such a material include copper, a copper alloy, silver, a silver alloy, diamond, and a carbon fiber composite.

  As a method of filling the through hole of the heat radiating member 1 with the high heat conductor 2, a method of filling the molten high heat conductor into the through hole or a method of inserting and brazing the solid high heat conductor 2 into the through hole, etc. Is mentioned.

  The frame 3 is made of an aluminum oxide sintered body, a mullite sintered body, glass ceramics, or the like, and is bonded and fixed to the upper surface of the heat radiating member 1 via a bonding material a such as a brazing material. Note that a bonding metal layer (not shown) may be formed at the joint portion of the frame body 3 with the heat radiating member 1 when the bonding material a is bonded and fixed. The frame 3 may be made of metal. In that case, in order to insulate the wiring conductor 4 from the metal constituting the frame 3, the periphery of the wiring conductor 4 is made of an insulator such as ceramics, resin, or glass. Cover it.

  If the frame 3 is made of, for example, an aluminum oxide sintered body, an appropriate organic binder, solvent, plasticizer, dispersant, etc. are added to the raw material powder such as aluminum oxide, silicon oxide, magnesium oxide, calcium oxide. A ceramic green sheet (ceramic green sheet) is formed by adding a mixture to form a mud, and then adopting a doctor blade method or a calender roll method, and then performing an appropriate punching process on the ceramic green sheet. Conductive paste made by mixing an appropriate organic binder and solvent with powders of metal materials such as tungsten, molybdenum, manganese, copper, silver, nickel, palladium, gold, etc. After printing and applying to pattern 4, this green sheet Laminating several sheets, it is produced by firing at a temperature of about 1600 ° C..

  Further, the frame body 3 is formed with a wiring conductor 4 that is led out from the inside (the periphery of the mounting portion 6) of the recess 3 a configured by the heat radiating member 1 and the frame body 3 to the outside of the frame body 3. Each electrode of the electronic component 7 is electrically connected to one end inside the concave portion 3 a of 4 through a bonding wire 8. A lead terminal 5 for connection to an external electric circuit is connected to the other outer end of the frame 3 of the wiring conductor 4.

  When the frame 3 is configured by combining a plurality of partial frames, the wiring conductor 4 may be formed in advance in one of the partial frames.

  The wiring conductor 4 is made of a high melting point metal such as tungsten or molybdenum, and a metal paste obtained by adding and mixing an appropriate organic binder, solvent, or the like to a metal powder such as tungsten or molybdenum is preliminarily applied to the ceramic green sheet serving as the frame 3. By applying a predetermined pattern by screen printing or the like, the heat radiation member 1 and the frame body 3 are deposited from the inside of the recess 3 a to the outside of the frame body 3.

  Further, when the wiring conductor 4 is coated with a metal having excellent corrosion resistance such as nickel and gold on the exposed surface and excellent bonding property of the bonding wire 8 to a thickness of 1 to 20 μm by a plating method, the wiring conductor 4 is obtained. As a result, it is possible to effectively prevent the oxidative corrosion of the wire and to strengthen the connection of the bonding wire 8 to the wiring conductor 4. Therefore, it is desirable that the wiring conductor 4 is coated with a metal having excellent corrosion resistance such as nickel and gold and excellent bonding properties on the exposed surface to a thickness of 1 to 20 μm.

  Moreover, it is preferable that arithmetic mean roughness Ra of the lower surface side of the thermal radiation member 1, ie, the opposite side to the mounting part 6 in which the electronic component 7 is mounted, is Ra <= 30 (micrometer). Usually, the electronic component storage package is connected to an external heat radiation plate made of a metal body such as aluminum or copper or a ceramic body having high thermal conductivity by screwing, or using a molten metal such as solder or a brazing material. At this time, when the arithmetic average roughness Ra of the lower surface of the heat radiating member 1 is Ra> 30 (μm), it is difficult to sufficiently bring the electronic component storage package and the external heat radiating plate into close contact with each other. Air gaps and voids are likely to be generated, and as a result, there is a possibility that heat generated in the electronic component 7 cannot be efficiently transferred from the electronic component storage package to the external heat sink. Therefore, it is desirable that the lower surface be a smooth surface with Ra ≦ 30 (μm) so that good adhesion to the external heat sink can be obtained.

  Thus, the electronic component 7 is bonded and fixed on the mounting portion 6 of the heat dissipation member 1 of the electronic component storage package described above via an adhesive made of glass, resin, brazing material, etc., and each electrode of the electronic component 7 is bonded. Electrically connected to the predetermined wiring conductor 4 via the wire 8, and thereafter, a sealing resin such as an epoxy resin is applied so as to cover the electronic component 7 inside the recess 3 a formed of the heat radiating member 1 and the frame 3. The electronic component 7 is sealed by filling and sealing the electronic component 7 by attaching the lid 9 made of resin, metal, ceramics or the like to the upper surface of the frame 3 so as to cover the recess 3a. Thus, the electronic device 10 as a product is obtained.

  Heretofore, the case where the heat dissipation member according to the present invention is applied to an electronic component storage package has been described as an example. However, by forming a wiring conductor on the upper surface of the heat dissipation member via an insulator, the electronic component It can also be applied to a mounting substrate. The electronic component mounting board obtained in this way has extremely good heat dissipation characteristics for the electronic component. In addition, the electronic component is mounted on the mounting portion of the heat dissipating member in the electronic component mounting substrate, and the electrode of the electronic component is electrically connected to the wiring conductor, so that the heat dissipation characteristic for the electronic component is extremely good. An electronic device that can operate an electronic component stably over a long period of time can be realized.

  Moreover, you may use the heat radiating member by this invention as a heat sink. In this case, it is possible to realize a heat sink with extremely good heat dissipation characteristics for electronic components. Furthermore, a heat radiating member on which the electronic component is mounted is installed in the package, and the electrode of the electronic component is electrically connected to a wiring conductor provided in another region in the same package, thereby radiating heat to the electronic component. It is possible to realize an electronic device having extremely good characteristics and capable of operating an electronic component stably over a long period of time.

  In addition, this invention is not limited to the example of the above embodiment, A various change is possible if it is the range which does not deviate from the summary of this invention. For example, in order to efficiently dissipate the heat generated in the electronic component 7 from the heat radiating member 1 to the atmosphere, the heat radiating fin is integrated with the heat radiating member 1 by connecting the heat radiating fin to the lower surface or joining by brazing or the like. It may be formed into a shape, whereby the heat generated by the operation of the electronic component 7 is absorbed by the heat radiating member 1 and further dissipated into the atmosphere.

It is sectional drawing which shows an example of embodiment of the electronic device using the package for electronic component storage which has a heat radiating member of this invention. It is a top view of the electronic component storage package of FIG. 1 is a diagram schematically showing a configuration of a heat dissipation member 1. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ..... Radiation member 2 ...... High heat conductor 3 ...... Frame body 4 ...... Wiring conductor 6 ······· Mounting part 7 ········ Electronic components 9 ····························· Electronic device

Claims (10)

A flat plate formed by laminating a carbon fiber sheet formed by two-dimensionally knitting a first carbon fiber and a second carbon fiber intersecting the first carbon fiber, and impregnating a metal into a gap between the carbon fiber sheets. A heat dissipating member having an electronic component mounting portion on an upper surface, wherein the first carbon fiber is disposed so as to reach the lower surface from the upper surface of the flat plate, and a through hole is formed from the upper surface to the lower surface of the flat plate, A heat radiating member, wherein a through-hole is filled with a high thermal conductor having a higher thermal conductivity than the flat plate. The heat radiating member according to claim 1, wherein the first and second carbon fibers are bonded with carbon powder. The heat radiating member according to claim 1, wherein the first carbon fiber is disposed so that an axial direction of the first carbon fiber is substantially perpendicular to an upper surface of the heat radiating member. . The heat radiating member according to any one of claims 1 to 3, wherein an upper end surface of the high thermal conductor is used as a mounting portion of the electronic component. The heat radiating member according to claim 4, wherein an area of the upper end surface of the high thermal conductor is made larger than the electronic component in a plan view. 6. A substrate for mounting electronic parts, wherein a wiring conductor is formed on an upper surface of the heat dissipating member according to claim 1 via an insulator. A heat dissipating member according to any one of claims 1 to 5 and a frame formed by forming a plurality of wiring conductors surrounding the mounting portion and being led out from the inner surface to the outer surface. A package for storing electronic components. The electronic component storage package according to claim 7, wherein the heat dissipating member has a rectangular shape in plan view, and the layer direction of the carbon fiber sheet is arranged in parallel to the side surface on the long side of the heat dissipating member. . An electronic device comprising: the electronic component mounting board according to claim 6; and an electronic component mounted on the mounting portion and having an electrode electrically connected to the wiring conductor. The electronic component storage package according to claim 7 or 8, an electronic component mounted on the mounting portion and having an electrode electrically connected to the wiring conductor, and an upper surface of the frame covering the electronic component. An electronic device comprising: a lid attached to the frame or a sealing resin filled inside the frame so as to cover the electronic component.

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