JP2006306977A - Composite, prepreg, metal foil-clad laminated board, printed-wiring board, multilayer printed-wiring board and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a composite excellent in adhesion reliability and sufficiently restrained from the generation of resin powders or fluffs of fibers and the like that may fall off, a prepreg using such a composite, a metal foil-clad laminated board, a multilayer printed-wiring board, and its manufacturing method. <P>SOLUTION: The composite is obtained by impregnating a fibrous sheet with a curable resin composition whose cured product has a storage modulus at 20°C of 100-2,000 MPa. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a composite, a prepreg, a metal foil-clad laminate, a printed wiring board, a multilayer printed wiring board, and methods for producing them.

  In recent years, a multilayer printed wiring board that performs electrical connection between layers using a conductive paste is known (see, for example, Patent Document 1). A method for manufacturing such a multilayer printed wiring board will be described with reference to FIG. First, as shown in (A), a release film 803 such as polyester is laminated on both surfaces of a porous substrate 802 obtained by impregnating an aromatic polyamide fiber with a thermosetting epoxy resin. Next, as shown to (B), the through-hole 804 is formed in the predetermined location of the porous base material 802 by the laser processing method. Next, as shown in (C), the through-hole 804 is filled with a conductive paste 805. As a filling method, a porous substrate 802 having through-holes 804 is placed on a table of a screen printing machine, and the conductive paste 805 is directly printed on the release film 503. At this time, the release film 803 on the printing surface plays the role of a printing mask and the prevention of contamination of the surface of the porous substrate 802. Next, the release film 803 is peeled from both surfaces of the porous substrate 802.

Next, a metal foil 808 such as a copper foil is attached to both surfaces of the porous substrate 802. By heating and pressing in this state, the porous substrate 802 and the metal foil 808 are bonded as shown in (D). In this step, the porous substrate 802 is compressed and its thickness is reduced. At that time, the conductive paste 805 in the through-hole 804 is also compressed. At that time, the binder component in the conductive paste is pushed out, and the conductive components and the bond between the conductive component and the metal foil 808 are strengthened. The conductive material in 805 is densified, and electrical connection between layers is obtained. Thereafter, the thermosetting resin and the conductive paste 805 which are constituent components of the porous substrate 802 are cured. Finally, as shown in (E), the metal foil 808 is selectively etched into a predetermined pattern to complete a double-sided printed wiring board.
JP-A-6-268345

  However, conventional printed wiring boards such as those described above may have dents on the wiring board during production or disconnection of the wiring, and have sufficient reliability. There was something that did not. In particular, when the layer thickness is reduced to increase the density, the above-described defects tend to occur frequently.

  Thus, as a result of examining the cause of the defect in detail, the present inventors have found that the resin powder or fiber that falls off the porous base material used as the insulating substrate is a major cause of the defect.

  Here, even if the material for the insulating substrate is selected only considering the suppression of the dropping of resin powder or fiber, if it does not have sufficient adhesion reliability necessary for the insulating substrate used for the printed wiring board, As a result, a printed wiring board having sufficient reliability cannot be obtained.

  The present invention solves the above-described problems, and provides a composite that is sufficiently excellent in adhesion reliability and that sufficiently suppresses the occurrence of scraps such as resin powder or fibers that may drop off. Objective. Another object of the present invention is to provide a prepreg, a metal foil-clad laminate, a printed wiring board, a multilayer printed wiring board, and a method for producing them using such a composite.

  In order to achieve the above object, the composite of the present invention is a composite comprising a fiber sheet impregnated with a curable resin composition, and the cured product of the curable resin composition has a storage elastic modulus at 20 ° C. 100 to 2000 MPa.

  In the composite of the present invention, the fiber sheet is impregnated with a curable resin composition in which the storage modulus of the cured product falls within the above range, thereby sufficiently suppressing the occurrence of resin powder or fibers that may fall off. In addition, the adhesive reliability is sufficiently excellent. Therefore, by using the composite of the present invention as a material for an insulating substrate, a printed wiring board having excellent reliability can be manufactured.

  When the storage elastic modulus at 20 ° C. of the cured product of the curable resin composition is less than 100 MPa, the handleability and dimensional stability are lowered, and it becomes difficult to obtain sufficient adhesion reliability. If it exceeds, the cured resin becomes brittle and it is difficult to sufficiently suppress the generation of resin powder or fibers that may fall off.

  Furthermore, in the composite of the present invention, the curable resin composition preferably contains a viscoelastic resin. Such a composite is more reliably suppressed from generating resin powder or fibers that may fall off, and has better adhesion reliability.

  Further, in the composite of the present invention, the curable resin composition contains an acrylic polymer having a weight average molecular weight of 30000 or more, and the acrylic polymer contains 2 to 20% by mass of glycidyl acrylate as a polymerization component, The epoxy value is preferably 2 to 36. In addition, the value calculated | required by the HLC measuring method is employ | adopted for an epoxy value.

  When the weight average molecular weight of the acrylic polymer is less than 30,000, the flexibility tends to be lowered and the coating becomes fragile. Further, if the glycidyl acrylate contained as a polymerization component in the acrylic polymer is less than 2% by mass, the glass transition temperature Tg of the cured product tends to be lowered and the heat resistance tends to be insufficient, whereas 20% by mass. If it exceeds 1, the storage elastic modulus of the cured product tends to increase, making it difficult to sufficiently suppress the generation of resin powder or fibers. Furthermore, when the epoxy value of the acrylic polymer is less than 2, the glass transition temperature Tg of the cured product tends to be lowered and the heat resistance tends to be insufficient. The rate tends to increase and it becomes difficult to sufficiently suppress the generation of resin powder or fibers.

  Furthermore, in the composite of the present invention, the fiber sheet is preferably a glass cloth having a thickness of 10 to 200 μm. According to such a composite, it is possible to obtain an insulating substrate that has a further sufficient mechanical strength, improves dimensional stability, and makes it easier to increase the density of the printed wiring board.

  Further, the total thickness of the composite of the present invention is preferably 100 μm or less. When the total thickness of the composite is 100 μm or less, it is easier to increase the density when used as an insulating substrate constituting a printed wiring board.

  Furthermore, in the composite of the present invention, the composite preferably has a through hole. According to such a composite, the step of forming the through-hole can be omitted by providing the through-hole in a predetermined position in advance, and a printed wiring board having an IVH structure excellent in reliability by using such a composite is provided. It can be manufactured with good yield.

  The prepreg of the present invention is characterized in that, in the composite of the present invention, the curable resin composition is semi-cured.

  By using the curable resin composition described above, the prepreg of the present invention is sufficiently suppressed in the generation of resin powder or fibers that may fall off and has sufficiently excellent adhesion reliability. Yes. Therefore, when manufacturing the printed wiring board which has IVH structure using the prepreg of this invention, the printed wiring board excellent in reliability can be obtained.

  Furthermore, the prepreg of the present invention preferably has a through hole. According to such a prepreg, the step of forming the through-hole can be omitted by providing the through-hole in a predetermined position in advance, and the use of such a prepreg makes it easier to produce a printed wiring board having an IVH structure that is excellent in reliability. Can be manufactured.

  Further, the metal foil-clad laminate of the present invention is a composite of the present invention having a through hole, in which a through hole is filled with a conductor and a metal foil is disposed on at least one surface of the composite. It is characterized by being obtained.

  By using the composite of the present invention, such a metal foil-clad laminate is sufficiently suppressed from falling off the resin powder or fibers from the metal foil-clad laminate and has sufficiently excellent adhesion reliability. is doing. Therefore, when manufacturing the printed wiring board which has IVH structure using the metal foil tension laminated board of this invention, the printed wiring board excellent in reliability can be obtained with a sufficient yield.

  Further, the metal foil-clad laminate of the present invention is obtained by heating and pressurizing a prepreg of the present invention having a through hole, in which the through hole is filled with a conductor and a metal foil is disposed on at least one surface of the prepreg. It is characterized by being able to.

  Such a metal foil-clad laminate has a sufficiently excellent adhesion reliability while sufficiently preventing the resin powder or fibers from falling off the metal foil-clad laminate by using the prepreg of the present invention. ing. Therefore, when manufacturing the printed wiring board which has IVH structure using the metal foil tension laminated board of this invention, the printed wiring board excellent in reliability can be obtained with a sufficient yield.

  In the printed wiring board of the present invention, a conductor is filled in a through-hole opened in the thickness direction of an insulating substrate containing the above-described composite, and a conductor layer having a predetermined pattern provided on both sides of the insulating substrate A printed wiring board that is electrically connected to each other by a conductor, wherein an adhesive layer is formed on both sides of the insulating substrate, the insulating substrate is in the form of a film, and at least one of the conductor layers is formed on the adhesive layer portion. It is characterized by being buried.

  In the printed wiring board of the present invention, a conductor is filled in a through-hole opened in the thickness direction of the insulating substrate containing the above-described composite, and a conductor layer having a predetermined pattern provided on both sides of the insulating substrate is provided. A printed wiring board that is electrically connected to each other by a conductor, wherein an adhesive layer is formed on both sides of the insulating substrate, the insulating substrate is in the form of a film, and at least one of the conductor layers is an adhesive layer It is buried and the insulating substrate is distorted in the thickness direction.

  In the configuration and manufacturing method of the conventional printed wiring board as shown in FIG. 8, when the through hole 804 is made fine, the initial connection resistance value increases and the variation also increases. In addition, there is a problem that the connection resistance value varies due to reliability tests such as a temperature cycle test and a pressure cooker test. This is because when the through hole 804 is made fine, the aspect ratio, which is the ratio of the diameter of the through hole 804 and the thickness of the porous base material 802, approaches 1, and the compression rate necessary to stabilize the electrical connection is reduced. This is thought to be because it cannot be obtained.

  Even in the step of peeling the release film 803, if the diameter of the through hole 804 is reduced, the influence of the release film 803 at the end of the through hole 804 cannot be ignored, and the conductive paste 805 is peeled off when the release film 803 is peeled off. Is peeled off together with the release film 803, and as a result, the filling of the conductive paste 805 into the through hole 804 is hindered.

  On the other hand, in the printed wiring board of the present invention, the conductor in the through hole is sufficiently compressed, and a fine via hole having high reliability can be formed. That is, by burying at least one of the conductor layers in the adhesive layer, the conductor in the through hole is sufficiently compressed. As a result, the conductor component of the conductor is densified and the initial connection resistance value is low. Highly reliable via-hole connection is possible.

  The method for producing a printed wiring board according to the present invention includes a step of providing a through hole in an insulating substrate containing the above composite having an adhesive layer formed on both sides, a step of filling a conductive material in the through hole, and an insulating substrate. And a step of stacking a support substrate having a predetermined pattern and a conductor layer having a thickness substantially equal to or thicker than that of the adhesive layer on at least one surface of the substrate, and insulating the stack of the support substrate It is characterized by having a step of embedding a conductor layer in the adhesive layer by heating and pressurizing the substrate, and a step of removing the supporting base material while leaving the conductor layer.

  According to this, a via hole having high connection reliability with a fine conductor layer can be formed by a simple method of supporting a patterned conductor layer by a support substrate and removing the support substrate after laminating press. The printed wiring board which has can be provided.

  In the method for producing a printed wiring board of the present invention, a release film having an adhesive layer formed on one side is attached to both sides of an insulating substrate containing the above composite so that the adhesive layer and the insulating substrate are in contact with each other. A step of combining, a step of providing a through hole in an insulating substrate provided with a release film, a step of filling the through hole with a conductor, a step of leaving the adhesive layer on the insulating substrate and peeling the release film, and an insulation A step of stacking a support substrate having a predetermined pattern and a conductor layer having a predetermined pattern and a thickness substantially equal to or thicker than the adhesive layer on at least one surface of the substrate; It is characterized by comprising a step of embedding a conductor layer in an adhesive layer by heating and pressurizing the insulating substrate, and a step of removing the supporting substrate while leaving the conductor layer.

  According to this, it is possible to avoid manufacturing difficulties such as simultaneously forming thin semi-cured adhesive layers on both surfaces of the insulating substrate. In addition, a printed wiring board having a via hole having high connection reliability with a fine conductor layer by a simple method of removing the support substrate after laminating and pressing the support substrate on which the conductor layer is formed Can be provided.

  When the thickness of the adhesive layer provided on the surface of the insulating substrate before heating and pressing is substantially equal to or thinner than the thickness of the conductor layer embedded in the adhesive layer, the conductive layer is conductive until it is substantially flush with the insulating substrate. The body layer can be embedded, and it is possible to minimize the decrease in the compression force of the conductor (conductive paste) due to the adhesive layer spreading in the lateral direction during compression.

  In the present invention, it is preferable that the step of removing the supporting substrate while leaving the conductor layer is a step of selectively dissolving and removing the supporting substrate. By dissolving and removing the supporting base material, no mechanical external force is applied to the conductor layer, so that a printed wiring board having a fine conductor layer without disconnection or deformation can be manufactured with high yield. Moreover, even a large-sized printed wiring board can be easily manufactured.

  The first multilayer printed wiring board of the present invention is a multilayer printed wiring board in which two or more insulating substrates containing the above-mentioned composite having a through hole in the thickness direction filled with a conductor are laminated, The insulating substrate includes a film, and an adhesive layer is provided on at least one surface of the multilayer printed wiring board, and the conductive layer is embedded in the adhesive layer portion and is electrically connected to the conductive material of the insulating substrate. It is characterized by that.

  The first multilayer printed wiring board of the present invention is a multilayer printed wiring board in which two or more insulating substrates containing the above-mentioned composite having a through hole in the thickness direction filled with a conductor are laminated, The insulating substrate includes a film, and an adhesive layer is provided on at least one surface of the multilayer printed wiring board. The conductor layer is embedded in the adhesive layer, and the film is distorted in the thickness direction so that the conductor of the insulating substrate is provided. It is electrically connected to.

  According to this configuration, a multilayer printed wiring board having highly reliable and fine via holes can be provided.

  The first method for producing a multilayer printed wiring board according to the present invention includes a step of providing a through hole in an insulating substrate containing the above-described composite having an adhesive layer formed on both sides, and a step of filling the through hole with a conductor. And a step of superimposing a support base material having a predetermined pattern and having a conductor layer having a predetermined pattern and a thickness substantially equal to or thicker than the adhesive layer on at least one surface of the insulating substrate; It is characterized by having a step of embedding a conductor layer in an adhesive layer by heating and pressing an insulating substrate on which the layers are stacked, and a step of removing a supporting base material while leaving the conductor layer. According to this configuration, a simple method for manufacturing a multilayer printed wiring board can be provided.

  The second multilayer printed wiring board of the present invention is a conductor layer having a predetermined pattern formed on a surface layer of the first multilayer printed wiring board, and a surface layer of a core substrate having a predetermined insulator layer and a conductor layer. Are electrically connected to each other through insulating substrates each having an adhesive layer and a through hole filled with the conductor on both sides, and the conductor on the surface layer of the first multilayer printed wiring board. At least one of the layer and the conductor layer on the surface of the core substrate is embedded in the adhesive layer.

  According to such a configuration, a multilayer in which the conductor layer on the surface layer of the core substrate is electrically connected to the conductor layer on the surface layer of the first multilayer printed wiring board having fine wiring and fine via holes made of a plurality of layers. A printed wiring board can be provided.

  In the second multilayer printed wiring board manufacturing method of the present invention, the first multilayer printed wiring board is filled in a core substrate having a predetermined insulator layer and a conductor layer with an adhesive layer and a conductor on both sides. Are formed on the surface layer of the multilayer printed wiring board by heating and pressurizing the core substrate and the multilayer printed wiring board stacked via the insulating substrate. And a step of embedding at least one of the conductor layer and the conductor layer on the surface of the core substrate in the adhesive layer. According to this configuration, a simple method for manufacturing a multilayer printed wiring board can be provided.

  Moreover, it is preferable that the thickness of the adhesive layer provided on the surface of the insulating substrate before heating and pressing is substantially equal to or thinner than the thickness of the conductor layer embedded in the adhesive layer.

  In the present invention, when the insulating substrate before being heated and pressurized has a space capable of accommodating the constituent material of the adhesive layer, the constituent material of the adhesive layer melted during the heating and pressing is accommodated in the insulating substrate. Thus, distortion of the insulating substrate due to the embedded conductor layer can be suppressed.

  In the present invention, when the insulating substrate before heating and pressing has fine holes through which the constituent material of the adhesive layer provided on both sides can go back and forth, the constituent material of the adhesive layer melted at the time of heating and pressing is transferred to the upper and lower sides of the insulating substrate. Therefore, distortion of the insulating substrate can be further suppressed.

  In the present invention, the insulating substrate before being heated and pressurized is formed into a film or provided with a film on the insulating substrate, for example, when the film is mainly composed of an organic material, the adhesive layer is a semi-cured organic resin. You can also Further, by selecting a film material having a high heat resistance and a high rigidity, it is possible to impart properties suitable for semiconductor mounting. In addition, the material of the adhesive layer can be freely selected in consideration of electrical insulation and embedding properties, and a high-performance printed wiring board can be realized. Further, since a thin film having a uniform composition can be produced, it is convenient for forming a via hole having a small diameter.

  In the present invention, if the conductor filled in the through hole is a conductive paste, when pressure is applied to the conductive paste in the through hole, the resin component in the conductive paste is discharged from the through hole and As a result of the densification of the conductor component, the initial connection resistance value is low, and it becomes easy to obtain highly reliable via-hole connection, which is preferable. In this case, the presence of the resin component of the conductive paste between the conductor layer and the insulating substrate is more preferable because the initial connection resistance value is low and it becomes easier to obtain a highly reliable via hole connection.

  In the present invention, when the through hole is covered with the conductor layer, the filled conductor is difficult to be exposed on the surface. Therefore, it is effective to provide such a through hole in the surface layer of the substrate.

  A conductor layer is formed so that a part of the through hole is exposed, and if this is used for the inner layer, a landless via that compresses the via hole with a wiring smaller than the via hole diameter can be realized, and a finer wiring can be formed. Can do.

  If at least the surface of the conductor layer facing the through hole is roughened, the contact area between the conductor layer and the conductor filled in the through hole is increased, and the adhesion between the conductor layer and the adhesive layer is increased. Therefore, it is effective to further improve the reliability of the fine via hole.

  In the present invention, the composite used for the insulating substrate may be semi-cured, and the adhesive layer may be a thermosetting resin. Thereby, since the said composite_body | complex is used for an insulated substrate, the process of providing an adhesive bond layer specially becomes unnecessary, and a printed wiring board and a multilayer printed wiring board can be manufactured easily.

  In the present invention, it is preferable that the surface on the side where the conductor layer is embedded in the adhesive layer portion is flat, because even if the conductor layer is laminated in multiple layers, unevenness is not generated on the surface.

  A third multilayer printed wiring board according to the present invention includes a first multilayer printed wiring board, and a substrate bonding in which a core substrate having a predetermined insulator layer and a conductor layer has a through hole filled with a conductor. The conductor layer having a predetermined pattern formed on the surface layer of the first multilayer printed wiring board and the conductor layer on the surface layer of the core substrate are electrically connected via the conductor. In addition, the substrate bonded body before lamination has compressibility.

  According to such a configuration, the multilayer printed wiring board in which the conductor layer on the surface layer of the core substrate and the conductor layer on the surface layer of the first multilayer printed wiring board having fine wirings and fine via holes connected to each other are connected. Can be provided.

  Here, “the substrate assembly has compressibility” means that the substrate assembly has a compressible property, for example, the substrate assembly contains a porous base material having pores therein. It has a compressible property. When the substrate assembly is made of a porous base material, the porosity is preferably 2 to 35% by volume. When the porosity is less than 2% by volume, compression becomes difficult, and the electrical connection resistance between the conductor and the conductor layer tends to increase or connection failure tends to occur. On the other hand, when the porosity exceeds 35% by volume, it becomes easy to deform in the direction perpendicular to the compression direction when the substrate bonded body is compressed, or the conductive resin penetrates into the pores. Is not sufficiently compressed, so that the electrical connection resistance between the conductor and the conductor layer tends to increase.

  In the third multilayer printed wiring board, the material constituting the substrate assembly preferably contains the composite of the present invention. Thereby, the electrical characteristics and mechanical characteristics of the multilayer printed wiring board are further improved.

  According to a third method for producing a multilayer printed wiring board of the present invention, the first multilayer printed wiring board is coated on a core substrate having a predetermined insulator layer and a conductor layer, and a through hole is filled with a conductor. A step of stacking through a substrate bonded body having compressibility, and a conductor layer formed on the surface layer of the multilayer printed wiring board by heating and pressing the multilayer printed wiring board and the core substrate stacked through the substrate bonded body And a step of electrically connecting the conductor layer of the core substrate to each other through the conductor. Thereby, the manufacturing method of a simple multilayer printed wiring board can be provided.

  In the third method for producing a multilayer printed wiring board, when the conductor is a conductive paste, it is preferable that the conductive paste filled in the through holes of the substrate bonded body before heating and pressing protrude from the surface of the substrate bonded body. According to this, electrical connection between the two conductor layers can be reliably performed with low resistance via the conductive paste.

  ADVANTAGE OF THE INVENTION According to this invention, the composite_body | complex which is excellent in adhesion reliability sufficiently and generation | occurrence | production of injuries, such as resin powder or a fiber which may drop | omit is fully suppressed can be provided.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings as necessary. In the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted. Further, the positional relationship such as up, down, left and right is based on the positional relationship shown in the drawings unless otherwise specified. Further, the dimensional ratios in the drawings are not limited to the illustrated ratios.

  First, an embodiment of the composite of the present invention will be described. FIG. 1 is a schematic cross-sectional view showing one embodiment of the composite of the present invention. A composite 100 in FIG. 1 is formed by impregnating a fiber sheet 101 with a curable resin composition 102. The composite 100 includes a through hole 103.

  Examples of the fiber sheet 101 include heat resistant synthetic fibers such as paper, glass cloth such as glass fiber woven fabric and glass fiber nonwoven fabric, and aramid nonwoven fabric. Among these, a glass fiber woven fabric and a glass fiber nonwoven fabric are preferable, and a glass fiber woven fabric is particularly preferable. Examples of the glass material include E glass, S glass, and D glass. Moreover, about the weaving method of the fiber when using a woven fabric as a fiber sheet, a plain weave, satin weave, twill weave, etc. are mentioned, for example.

  About the thickness of a fiber sheet, if the fiber sheet has sufficient intensity | strength, the thinner one is preferable. Specifically, for example, the thickness is preferably 10 to 200 μm, and more preferably 10 to 80 μm. The fiber sheet is preferably one having a smaller linear expansion coefficient.

  The curable resin composition 102 only needs to have a storage elastic modulus at 20 ° C. of 100 to 2000 MPa of the cured product, and includes, for example, a curable resin and a curing agent that cures the curable resin. Things. As the resin component of the curable resin, it is preferable to use a viscoelastic resin, and examples thereof include epoxy resins, rubber-modified epoxy resins, SBR, NBR, CTBN, acrylic resins, polyamides, polyamideimides, and silicone-modified polyamideimides. . Examples of the curing agent include dicyandiamide, phenol resin, imidazole, amine compound, acid anhydride and the like.

  The curable resin composition 102 can be used as a varnish containing a predetermined solvent for the purpose of impregnating the fiber sheet. Solvents used include aromatic hydrocarbon solvents such as benzene, toluene, xylene and trimethylbenzene; ether solvents such as tetrahydrofuran; ketone solvents such as acetone, methyl ethyl ketone and methyl isobutyl ketone; glycol ethers such as methyl cellosolve and diethylene glycol. System solvents; ester solvents such as methyl cellosolve acetate; dialkyl glycol solvents such as ethylene glycol dimethyl ether; amide solvents such as N-methylpyrrolidone, N, N′-dimethylformamide, N, N′-dimethylacetamide; methanol, Alcohol solvents such as butanol and isopropanol; ether alcohol solvents such as 2-methoxyethanol and 2-butoxyethanol can be used, and one or more of these can be used. It can be used.

  In the present embodiment, it is preferable to use a combination of a curable acrylic polymer and a curing agent that cures the acrylic polymer as the curable resin composition. In this case, it is preferable to use the curing agent in a proportion of 60 to 350 parts by mass with respect to 100 parts by mass of the acrylic polymer. When the curing agent is less than 60 parts by mass with respect to 100 parts by mass of the acrylic polymer, the storage elastic modulus of the cured product tends to be less than 300 MPa, the handleability is lowered, and the Tg of the cured product is lowered. There is a tendency that problems such as dimensional shrinkage due to deterioration when left at high temperature and solder heat resistance decrease tend to occur. On the other hand, when the ratio of the curing agent exceeds 350 parts by mass, the storage elastic modulus of the cured product tends to exceed 2000 MPa. In this case, the cured product becomes brittle, and thus the resin powder or fibers tend to fall off.

  The acrylic polymer preferably has a weight average molecular weight (Mw) of 30000 or more. Further, the acrylic polymer has 2 to 20% by mass of glycidyl acrylate as a polymerization component in the polymer. The epoxy value is preferably 2 to 36.

  Examples of the method for producing the composite 100 include a method in which a fiber sheet is impregnated with a curable resin composition and dried, and then a through hole is formed at a predetermined position. Examples of the method of impregnating the fiber sheet with the curable resin composition include, for example, a method of immersing the fiber sheet in a resin composition solution such as a wet method and a dry method, and a method of applying the curable resin composition to the fiber sheet. Etc.

  Next, a preferred embodiment of the prepreg of the present invention will be described.

  FIG. 2 is a schematic cross-sectional view showing an embodiment of the prepreg of the present invention. A prepreg 200 shown in FIG. 2 includes a fiber sheet 201 and a semi-cured resin composition layer 202 obtained by semi-curing a curable resin composition impregnated in the fiber sheet 201. Further, the prepreg 200 includes a through hole 203.

  The prepreg 200 can be obtained by semi-curing the curable resin composition 102 in the composite 100 described above. In this case, the fiber sheet 201 is the same as the fiber sheet 101, and the semi-cured resin composition layer 202 is obtained by semi-curing the curable resin composition 102. As another method, the prepreg 200 is prepared by impregnating the above curable resin composition into the above fiber sheet and drying, and then semi-curing the curable resin composition to obtain a semi-cured resin composition. It can also be obtained by forming the through hole 203 at a predetermined position after forming the physical layer 202.

  Examples of the method for semi-curing the curable resin composition include methods such as heating, ultraviolet irradiation, and electron beam irradiation. Examples of the conditions for semi-curing by heating include conditions of 100 to 200 ° C. and 1 to 30 minutes.

  In the prepreg of this embodiment, it is preferable that the curing rate of the curable resin composition be in the range of 10 to 70%. When the curing rate of the curable resin composition is less than 10%, when integrated with the conductor, the unevenness of the fiber sheet is reflected on the surface of the integrated conductor layer, and the surface smoothness tends to decrease, Further, it tends to be difficult to control the thickness of the insulating substrate. On the other hand, when the curing rate of the curable resin composition exceeds 70%, the resin component is insufficient when integrated with the conductor layer, and when integrated at a high speed, bubbles and blurring tend to occur. Adhesive strength tends to be insufficient.

  Next, a preferred embodiment of the metal foil-clad laminate of the present invention will be described.

  FIG. 3 is a schematic cross-sectional view showing an embodiment of the metal foil-clad laminate of the present invention. A metal foil-clad laminate 300 shown in FIG. 3 includes an insulating substrate 301 having a through hole 303, a conductor 304 filled in the through hole 303, and a conductor layer 302 stacked on the insulating substrate 301. Has been.

  Examples of the conductor layer 302 include metal foil such as copper foil, aluminum foil, and nickel foil. In the metal foil-clad laminate of this embodiment, the conductor layer 302 is preferably a copper foil, and the thickness is preferably 1 to 70 μm. Moreover, electrolytic copper foil, rolled copper foil, etc. can be used for copper foil. In the metal foil-clad laminate of this embodiment, the conductor layer 302 may be a film having conductivity, and other than the above metal foil, for example, a metal, an organic substance, and a composite thereof may be used. Good.

  Examples of the conductor 304 include a heat-pressed one of a conductive paste containing a metal such as gold, silver, nickel, copper, platinum, palladium, ruthenium oxide, a metal oxide, an organometallic compound, or the like.

  The insulating substrate 301 having the through hole 303 is formed using the composite 100 or the prepreg 200 described above.

  For example, when the metal foil-clad laminate 300 is obtained using the prepreg 200, first, the through-hole 203 of the prepreg 200 is filled with a conductive paste that is a conductor. Next, a metal foil as a conductor layer is arranged on the surface of the prepreg 200, and the metal foil and the prepreg can be integrated to manufacture the metal foil-clad laminate 300. Further, even if the composite 100 is used instead of the prepreg 200, the metal foil-clad laminate 300 can be similarly manufactured.

Examples of the method for integrating the metal foil with the prepreg or the composite include metallization, press lamination method, and hot roll continuous lamination method. In the present embodiment, it is preferable to use the press lamination method from the viewpoint of efficiently forming the conductor layer. Examples of the heating and pressing conditions for integrating the metal foil and the prepreg or the composite by the press lamination method include a temperature of 120 to 230 ° C., a pressure of 10 to 60 kg / cm ² , and a heating time of 30 to 120 minutes. A range condition is mentioned.

  Further, before continuously laminating the metal foil and the prepreg or the composite, the same photosensitive resin composition as that contained in the prepreg or the composite is applied to the surface of the metal foil, and the resin composition It is preferable to form a layer. Thereby, it can further reduce that the unevenness | corrugation of the surface of the fiber sheet contained in a prepreg or a composite_body | complex is reflected in the surface of a conductor layer.

  Next, preferred embodiments of the printed wiring board and the manufacturing method thereof of the present invention will be described.

  FIG. 4 is a process cross-sectional view illustrating a first embodiment of a method for producing a printed wiring board (double-sided printed wiring board) according to the present invention.

  First, as shown in (A), an insulating substrate 402 having an adhesive layer 401 formed on both sides thereof is prepared. As the insulating substrate 402, a substrate containing the composite of the present invention is used.

  As the adhesive layer 401, an epoxy-based adhesive or an imide-based adhesive can be used as the thermosetting resin, and a silicon-based high heat-resistant grade adhesive can be used as the thermoplastic adhesive. The thermosetting resin may be in a semi-cured state in order to ensure the embedding property of the conductor layer. The thickness of the adhesive layer is not particularly limited, and may be, for example, 5 μm on each side.

  Next, as shown in (B), a release film 403 such as polyester or polyethylene terephthalate is laminated on both sides of the insulating substrate 402 having the adhesive layer 401 formed on both sides thereof. Lamination can be performed at a temperature of about 80 ° C., for example. As a result, the surface of the adhesive layer 401 is appropriately melted and the release film 403 can be attached. The thickness of the release film is not particularly limited, and may be about 10 to 20 μm, for example.

  Next, as shown in (C), a through-hole 404 is formed on the insulating substrate 402 provided with the release film 403 using a laser beam. As the laser beam, a short wavelength laser such as an excimer laser having a wavelength of 307 nm or a third harmonic YAG solid-state laser having a wavelength of 355 nm can be used. The diameter of the through hole 404 is not particularly limited, but when the conductive paste is filled by the method described later, it is preferable to determine the filling diameter in consideration of the filling property.

  Subsequently, as shown in (D), the through-hole 404 is filled with a conductive paste 405 that is a conductor. Examples of the filling method include a method of printing the conductive paste 405 directly from the release film 403 with a screen printer. In this case, the resin component in the conductive paste 405 in the through-hole 404 is absorbed by vacuum suction from a side opposite to the printing surface through a porous sheet such as Japanese paper, thereby increasing the proportion of the conductor component. The ingredients can be packed more densely. In this case, the release film 403 can serve as a printing mask and prevent contamination of the surface of the adhesive layer 401. If the aspect ratio (hole diameter / hole length) between the hole diameter and the hole length of the through hole is about 0.3 or more, the conductive paste can be filled by this method.

  Next, as shown in (E), the release film 403 is peeled from both sides. At this time, if the through-hole 404 is fine, the influence of the end cannot be ignored, and the conductive paste in the through-hole of the release film 403 may be peeled off together with the release film. However, the remaining portion of the conductive paste 405 is only flush with the adhesive layer 401 even when the degree of peeling is large.

  Next, as shown in (F), a support base 406 made of an aluminum foil provided with a conductor layer 407 in which a copper foil is formed in a predetermined shape is placed immediately above the through-hole 404 filled with at least the conductive paste 405. The insulating layer 402 is overlaid from both sides and heated and pressed so that the conductor layer 107 is disposed. The heating and pressurization is performed by, for example, a vacuum press.

  By this heating and pressing, as shown in (G), the adhesive layer 401 flows, and the conductor layer 407 is embedded in the adhesive layer 401. Thus, by burying the conductor layer 407 in the adhesive layer 401, the conductive paste 405 in the through hole 404 is compressed, and the resin component in the conductive paste 405 flows out to the adhesive layer 401, and The conductor component is densified, and electrical connection between the conductor layers 407 on the front and back sides of the insulating substrate 402 is obtained. Thereafter, the adhesive layer 401 and the conductive paste 405 are cured.

  Finally, as shown in (H), the support base material 406 is removed leaving the conductor layer 407 embedded in the adhesive layer 401 to complete a double-sided printed wiring board. The constituent material of the support base material 406 and the conductor layer 407 is not particularly limited as long as its function can be exhibited. Therefore, as described above, for example, an aluminum foil is used for the support base material 406 and the conductor layer 407 is used. Can use copper foil. In this case, the support substrate 406 can be removed by dissolving and removing the aluminum foil by selective etching of the aluminum foil and the copper foil. When the support base material 406 is removed by dissolution and removal, it becomes difficult to apply a large stress to the double-sided printed wiring board, so that the destruction can be suppressed. In addition, when dissolution removal is employed, the removal in the integrated line becomes easy and productivity is improved. As an etchant for selective etching, ammonium persulfate or the like can be used.

  A similar method can be used when forming the conductor layer 407 in a predetermined pattern. As a composite material of aluminum foil and copper foil, for example, copper foil UTC-Foil (trade name) manufactured by Mitsui Kinzoku Co., Ltd. can be given. When such a composite material is used, since the copper foil thickness is as thin as 5 μm or 9 μm, a fine pattern can be formed.

  Moreover, a composite material obtained by forming a resist pattern on an aluminum foil in advance and performing electrolytic copper plating after an acidic zincate treatment may be used. When electrolytic copper plating is employed, a fine pattern and a thick copper foil can be obtained. According to the present embodiment, for example, the thickness of the copper foil may be set to 9 μm, and the thickness of the adhesive layer 401 may be set to be 5 μm on one side and thinner than the thickness of the copper foil.

  According to the present embodiment, the resin component in the conductive paste 405 in the through-hole 404 is pushed out to the adhesive layer, whereby the conductor component is densified in the through-hole 404 to obtain a low resistance and highly reliable via hole. be able to. In addition, when the surface of the copper foil used as the conductor layer 407 in contact with the conductive paste 405 is roughened, the adhesion between the adhesive layer 401 and the copper foil is improved, and the peel strength is increased. Further, since the contact area between the copper foil and the conductive paste 405 increases, connection reliability is improved.

  In the above embodiment, the insulating substrate 402 provided with the adhesive layer 401 on both sides is used. Instead, the release film 403 provided with the adhesive layer 401 is attached to the insulating substrate 402. You may form it. By taking such a manufacturing method, the adhesive layer 401 can be applied to one side of the release film 403 and dried to a semi-cured state, and the adhesive layer 401 is simultaneously applied to both surfaces of the insulating substrate 402, The adhesive layer 401 can be more easily formed on both surfaces of the insulating substrate 402 than the step of drying in a semi-cured state.

  In FIG. 4, the conductor layer 407 is configured to cover the through hole 404, but it is not necessary for the conductor layer to cover the entire portion of the through hole 404. Since the conductor layer only needs to be embedded in the through hole so as to obtain a predetermined compression rate, it is only necessary to cover a part of the through hole. That is, as long as the conductive paste in the through hole overlaps so as to be compressed by the conductor layers provided above and below, a part of the through hole may be exposed. For example, even when the diameter of the through hole in this embodiment is 50 μm and the line width of the conductor layer is 30 μm, the conductive paste is compressed, and electrical connection between the conductor layers can be obtained. By adopting such a configuration, so-called lands are unnecessary, and finer wiring can be formed. In particular, the above configuration is effective when applied to the inner layer of a multilayer printed wiring board.

  In the above embodiment, the case where a thermosetting resin or a thermoplastic resin is used as the adhesive layer 401 has been described. However, the material of the adhesive layer is the same as the material of the insulating substrate, that is, the composite of the present invention. It may be used. Thereby, this invention can be implemented more simply.

  FIG. 5 is a process cross-sectional view illustrating a second embodiment of the method for producing a printed wiring board (double-sided printed wiring board) according to the present invention.

  First, as shown in (A), through holes 504 are provided in an insulating substrate 502 having an adhesive layer 501 formed on both sides, as in the first embodiment, and a conductive paste 505 is filled.

  Next, as shown in (B), the support layer 506 provided with the conductor layer 507 formed in a predetermined shape is disposed immediately above the through-hole 504 filled with at least the conductive paste 505. As described above, the copper foil 508 is overlaid on the other side. Thereafter, heating and pressing are performed by, for example, a vacuum press.

  By this heating and pressurization, as shown in (C), the adhesive layer 501 flows and the conductor layer 507 is embedded in the adhesive layer 501. As described above, the conductive layer 507 is embedded in the adhesive layer 501, whereby the insulating substrate 502 is deformed, the conductive paste 505 in the through-hole 504 is compressed, and the resin component in the conductive paste 505 is replaced with the adhesive layer 501. The conductive component in the conductive paste 505 is densified, and electrical connection between the conductor layer 507 on one surface side of the insulating substrate 502 and the copper foil 508 on the other surface side is obtained. Thereafter, the adhesive layer 501 and the conductive paste 505 are cured.

  Finally, as shown in (D), the support base material 506 is removed leaving the conductor layer 507 embedded in the adhesive layer 501, thereby completing the double-sided printed wiring board. The second embodiment is different from the first embodiment in that compression is performed from one side of the insulating substrate 502.

  In this embodiment, the conductor layer 507 is formed by appropriately setting the thickness (film thickness) of the insulating substrate 502 before heating and pressing, the thickness of the adhesive layer 501, and the thickness of the conductor layer 507. When pushing into the adhesive layer 501, the insulating substrate 502 is sufficiently deformed, and the conductive paste 505 can be compressed without increasing the diameter of the through hole of the adhesive layer 501. According to the present embodiment, the conductor component is densified in the through-hole 504, and a via hole with low resistance and high reliability can be obtained.

  As for the total thickness of the adhesive layer 501 and the thickness of the conductor layer 507, the electrical connection becomes better if the thickness of the conductor layer is larger than the thickness of the adhesive layer. However, since the adhesive is accommodated between the conductors of the conductor layer, if the conductor layer is excessively thick, the gap between the conductors cannot be filled. In addition, the deformation amount of the insulating substrate is expected to increase. The amount of deformation varies depending on the density of the conductor layer. Therefore, if a porous material that forms a space that can accommodate the constituent material of the adhesive layer provided on both sides of the insulating substrate is used as an insulating substrate, it melts when the adhesive layer flows by heating and pressing. Since the constituent material of the adhesive layer can be accommodated, the deformation amount of the insulating substrate can be suppressed. Thereby, the stability of connection can be improved. In addition, since the constituent material of the adhesive layer under the conductor layer is accommodated between the patterns of the conductor layer, it is conceivable that the amount of indentation varies depending on the pattern arrangement, but it is provided on both sides of the insulating substrate. Since there is a space that can accommodate the constituent material of the adhesive layer, the amount of change can be minimized.

  Furthermore, if the insulating substrate is a porous substrate having fine pores through which the constituent material of the adhesive layer provided on both sides thereof can go back and forth, it melts when the adhesive layer flows by heating and pressing. Since the constituent material of the adhesive layer can move between the upper and lower sides of the insulating substrate, it is more effective. The fine holes may be fine as long as the conductor component in the conductive paste does not leak out. For example, when the conductor component is copper powder having a diameter of 10 μm, the fine pore diameter may be about 5 μm.

  FIG. 6 is a process cross-sectional view illustrating the first embodiment of the method for producing a multilayer printed wiring board according to the present invention.

  First, as shown to (A), a double-sided printed wiring board is produced similarly to 2nd Embodiment of the manufacturing method of the above-mentioned double-sided printed wiring board. Therefore, this double-sided printed wiring board is composed of an adhesive layer 601, an insulating substrate 602, a through hole 604, a conductive paste 605, a conductor layer 607 and a copper foil 608 as shown in the figure.

  The double-sided printed wiring board formed as described above is provided with an adhesive layer 611 on both sides and through-holes 614 filled with conductive paste 615 at predetermined positions, as shown in FIG. The insulated substrate 612 is superposed together with the support base 616 provided with the conductor layer 617 formed in a predetermined pattern.

  Next, as shown in (C), heating and pressing are performed by, for example, a vacuum press, and electrical connection between the conductor layer 607 and the conductor layer 617 is performed. Next, as shown to (D), the support base material 616 is removed.

  After repeating the steps shown in (B), (C), and (D) and laminating a predetermined number of layers, as shown in (E), the copper foil 608 is etched into a predetermined shape to complete a multilayer printed wiring board. To do.

  In the multilayer printed wiring board of this embodiment, since a via hole (for example, the through hole 614) can be formed on the via hole (for example, the through hole 604), the wiring accommodation rate is improved. In addition, since the surface after removing the support base 616 is flat, unevenness is hardly generated on the surface even when the layers are laminated, and a high multilayer can be easily achieved. Moreover, since the multilayer printed wiring board of this embodiment has a smooth surface, it is convenient for mounting a semiconductor bare chip. When a semiconductor bare chip is mounted face-down on such a wiring board, the flatness under the chip is good, so that the mounting yield is good and the mounting reliability is improved.

  In the method for manufacturing a multilayer printed wiring board according to this embodiment, each layer is laminated on the copper foil 608, so that dimensional change after lamination can be suppressed, and even when the number of layers is high, the positional deviation should be small. Can be designed with fine design rules.

  FIG. 7 is a process sectional view showing a second embodiment of the method for producing a multilayer printed wiring board according to the present invention.

  First, a multilayer printed wiring board 730 produced in the same manner as in the first embodiment of the multilayer printed wiring board manufacturing method, and a core substrate 731 having a predetermined number of insulating layers and conductor layers are prepared. The configuration of the core substrate 731 is not particularly limited, and for example, a conventional multilayer printed wiring board shown in FIG. 8 may be used.

  Next, as shown in FIG. 5A, the two layers are superposed via an insulating substrate 702 each having an adhesive layer 701 on both sides and a through hole 704 filled with a conductive paste 705 at a predetermined position. The insulating substrate 702 contains the composite of the present invention and is obtained, for example, through the same steps as those of the first embodiment of the double-sided printed wiring board described above.

  Next, as shown in (B), the multilayer printed wiring board 730 and the conductive paste 705 in the through hole 704 are compressed by embedding the conductor 737 on the surface layer of the core substrate 731 in the adhesive layer 701 by heating and pressing. Electrical connection between the core substrates 731 was performed. Then, as shown in (C), the copper foil 708 on the surface of the multilayer printed wiring board 730 is selectively etched into a predetermined shape to obtain a multilayer printed wiring board having a fine wiring pattern on the surface of the multilayer printed wiring board. .

  The above-mentioned multilayer printed wiring board is a substrate having excellent wiring capacity, and the wiring capacity ratio is further improved by providing a fine wiring pattern on the surface layer. In order to mount a semiconductor bare chip, a fine wiring pattern corresponding to the pad pitch is required on the surface layer. However, according to this embodiment, it is possible to support such a semiconductor bare chip mounting.

  In the present embodiment, an example in which another multilayer printed wiring board is provided on one side of the above-described multilayer printed wiring board, which is the core substrate 731, is explained. It is advantageous.

  In the multilayer printed wiring board of the present embodiment, the example using the conventional multilayer printed wiring board shown in FIG. 8 as the core substrate 731 has been described, but the core substrate is not limited to this. For example, a glass epoxy multilayer printed wiring board may be used as the core substrate. In this case, it has the following advantages compared with a so-called build-up wiring board in which fine wiring is formed on a glass epoxy multilayer printed wiring board. That is, since the fine conductor layer can be formed on the copper foil by a separate process, the degree of freedom of process conditions and the like is increased and high performance can be achieved. In addition, since the fine conductor layer is formed on the copper foil and then transferred to the core substrate, the alignment is not required to be performed so strictly and the yield is improved. Furthermore, a large-area multilayer printed wiring board can be manufactured.

  Further, when the multilayer printed wiring board manufacturing method of the present embodiment is used, the surface multilayer printed wiring board 730 and the core substrate 731 can be separately manufactured and inspected, and as a result, the yield can be improved.

  In this embodiment, the example in which the surface layer conductor 737 of the core substrate 731 is embedded in the adhesive layer 701 has been described. However, the multilayer printed wiring board as shown in FIG. The conductor layer side made of may be laminated on the insulating substrate 702 side. In this case, the surface conductive layer of the multilayer printed wiring board 730 is embedded in the adhesive layer 701. Since the conductor layer made of the copper foil 608 can compress the conductive paste 705 in the through hole 704, the same effect as described above can be obtained.

  Further, in this case, the support base 616 can be finally removed after the copper foil 608 on the surface layer of the multilayer printed wiring board 730 is embedded in the adhesive layer 701 by removing the support base 616 without removing the support base 616. . According to this, since the surface conductive layer is protected by the support base material 616 until just before the multilayer printed wiring board is completed, including during heating and pressurization, it is advantageous in manufacturing.

  Further, both the conductor 737 on the surface layer of the core substrate 731 and the copper foil 608 on the surface layer of the multilayer printed wiring board 730 may be embedded in the adhesive layer 701. In this case, since the conductive paste 705 in the through hole 704 is compressed from both sides, the amount of compression of the conductive paste becomes larger, and the connection reliability by the conductive paste can be further enhanced.

  Next, an embodiment according to a method for manufacturing a multilayer printed wiring board of the present invention when a substrate assembly is used will be described.

  In the present embodiment, the insulating substrate 702 includes an adhesive layer 701 on both sides in the second embodiment of the method for manufacturing a multilayer printed wiring board described above, and a through hole 704 filled with a conductive paste 705 at a predetermined position. Instead, a case where a substrate bonded body having compressibility in which through holes formed at predetermined positions are filled with a conductive paste is used will be described.

As a constituent material of the substrate assembly, an electrically insulating material such as a glass epoxy resin, a phenol resin, a polyimide resin, a polyester resin, or an aramid resin can be used. Among these, a prepreg in which an aramid non-woven fabric is impregnated with an epoxy resin so as to be in a semi-cured state (B stage state) is mentioned as a general one. A through hole is formed in a predetermined position in the prepreg by laser processing, and the through hole is filled with a conductive paste containing a conductor component such as Ag, Cu, or an Ag—Cu alloy. At this time, if the conductive paste is formed so as to protrude from the surface of the substrate assembly, the conductive paste is compressed well, and electrical connection between the multilayer printed wiring board 730 and the core substrate 731 is performed with low resistance. be able to. More specifically, a through hole is formed at a desired position using a CO ₂ laser in a prepreg (for example, about 0.1 mm thick) in which an aramid fiber nonwoven fabric is impregnated with an epoxy resin, The Cu paste may be filled so as to slightly protrude from the surface.

  Next, the multilayer printed wiring board 730, the board assembly, and the core board 731 are heated and compressed. What is necessary is just to set suitably about conditions, such as a pressure at the time of heat-pressing, temperature, and time. As a result, the conductor 737 protruding from the surface of the core substrate 731 is immersed in the epoxy resin of the substrate bonded body. At the same time, since the conductive paste is sandwiched between the conductor layer of the multilayer printed wiring board 730 and the conductor 737 on the surface of the core substrate 731, the conductor paste filled therein is compressed and the conductor layer and the conductor are compressed. 737 is electrically connected.

  In the present embodiment, the example in which the conductor 737 protruding on the surface of the core substrate 731 is embedded in the substrate assembly has been described. However, as in the second embodiment of the method for manufacturing a multilayer printed wiring board, the multilayer printed wiring board is used. The same effect can be obtained even if a conductor layer protruding to the laminated surface side of 730 is formed. Furthermore, both the conductor 737 protruding on the surface of the core substrate 731 and the conductor layer protruding on the surface of the multilayer printed wiring board 730 may be embedded in the substrate assembly. In this case, since the conductive paste in the through hole is compressed from both sides, the amount of compression of the conductive paste becomes larger, and the connection reliability by the conductive paste can be further enhanced.

  If the surface of the conductor layer of the multilayer printed wiring board 730 that comes into contact with the conductive paste and the surface of the conductor 737 on the surface of the core substrate 731 are roughened, the connection reliability of the conductive paste is improved. The roughening process may be performed by appropriately setting conditions. For example, before heating and pressurizing, the surface of the conductor layer of the multilayer printed wiring board 730 and the surface of the conductor 737 of the core substrate 731 are mixed using a mixed aqueous solution of sodium hydroxide, sodium phosphate and sodium chlorite. A roughening process can be performed by performing a blackening process. Although the film formed on the surface of the copper foil by the blackening treatment is an insulating film, it is extremely thin and can be easily broken and conductive when heated and pressurized.

  Moreover, electrolytic copper plating can also be used as a roughening method. As a method of this electrolytic copper plating, for example, a method is known in which the current density is increased more than the conditions for forming a copper foil, and copper is abnormally deposited in a hump shape. When this method is used, since the film produced on the copper foil surface is copper, a more stable connection can be obtained.

It is a schematic cross section which shows one Embodiment of the composite_body | complex of this invention. It is a schematic cross section which shows one Embodiment of the prepreg of this invention. It is a schematic cross section which shows one Embodiment of the metal foil tension laminated board of this invention. It is process sectional drawing which shows one Embodiment of the manufacturing method of the printed wiring board of this invention. It is process sectional drawing which shows one Embodiment of the manufacturing method of the printed wiring board of this invention. It is process sectional drawing which shows one Embodiment of the manufacturing method of the multilayer printed wiring board of this invention. It is process sectional drawing which shows one Embodiment of the manufacturing method of the multilayer printed wiring board of this invention. It is process sectional drawing which shows the manufacturing method of the conventional multilayer printed wiring board.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Composite, 101 ... Fiber sheet, 102 ... Curable resin composition, 103, 203, 303, 411, 421, 422a, 422b ... Through-hole, 200 ... Prepreg, 201 ... Fiber sheet, 202 ... Semi-cured resin composition Physical layer, 300 ... metal foil-clad laminate, 301 ... insulating substrate, 302 ... conductor layer, 304 ... conductor.

Claims (21)

A composite comprising a fiber sheet impregnated with a curable resin composition,
The composite whose storage elastic modulus in 20 degreeC of the hardened | cured material of the said curable resin composition is 100-2000 Mpa.   The composite according to claim 1, wherein the curable resin composition contains a viscoelastic resin.   The curable resin composition contains an acrylic polymer having a weight average molecular weight of 30000 or more, and the acrylic polymer contains 2 to 20% by mass of glycidyl acrylate as a polymerization component and has an epoxy value of 2 to 36. The complex according to claim 1 or 2.   The composite according to claim 1, wherein the fiber sheet is a glass cloth having a thickness of 10 to 200 μm.   The composite_body | complex as described in any one of Claims 1-4 whose total thickness of a composite_body | complex is 100 micrometers or less.   The composite according to any one of claims 1 to 5, which has a through-hole.   The composite according to any one of claims 1 to 5, wherein the curable resin composition is semi-cured.   The prepreg of Claim 7 which has a through-hole.   The metal foil-clad laminate obtained by heating and pressurizing the composite body according to claim 6, wherein the through hole is filled with a conductor and a metal foil is disposed on at least one surface of the composite body.   The prepreg according to claim 8, wherein the metal foil-clad laminate is obtained by heating and pressurizing the through-hole filled with a conductor and a metal foil disposed on at least one surface of the prepreg.   A through-hole opened in the thickness direction of the insulating substrate containing the composite according to any one of claims 1 to 5 is filled with a conductor, and has a predetermined pattern provided on both sides of the insulating substrate. A printed wiring board in which conductor layers are electrically connected to each other by the conductor, an adhesive layer is formed on both surfaces of the insulating substrate, the insulating substrate is in the form of a film, and at least one of the conductive layers A printed wiring board in which a body layer is embedded in the adhesive layer portion.   A through-hole opened in the thickness direction of the insulating substrate containing the composite according to any one of claims 1 to 5 is filled with a conductor, and has a predetermined pattern provided on both sides of the insulating substrate. A printed wiring board in which conductor layers are electrically connected to each other by the conductor, an adhesive layer is formed on both surfaces of the insulating substrate, the insulating substrate is in the form of a film, and at least one of the aforementioned A printed wiring board in which a conductor layer is embedded in the adhesive layer and the insulating substrate is distorted in the thickness direction.   A multilayer printed wiring board in which two or more insulating substrates containing the composite according to any one of claims 1 to 5 having a through-hole in a thickness direction filled with a conductor are laminated, The insulating substrate includes a film, an adhesive layer is provided on at least one surface of the multilayer printed wiring board, and a conductor layer is embedded in the adhesive layer portion to electrically connect the conductor of the insulating substrate. Connected multilayer printed wiring board.   A multilayer printed wiring board in which two or more insulating substrates containing the composite according to any one of claims 1 to 5 having a through-hole in a thickness direction filled with a conductor are laminated, The insulating substrate includes a film, and an adhesive layer is provided on at least one surface of the multilayer printed wiring board, and a conductive layer is embedded in the adhesive layer so that the film is distorted in the thickness direction and the insulation is performed. A multilayer printed wiring board electrically connected to the conductor of the substrate.   The conductor layer having a predetermined pattern formed on the surface layer of the multilayer printed wiring board according to claim 13 or 14, and the conductor layer on the surface layer of the core substrate having the predetermined insulator layer and the conductor layer are both surfaces. Are electrically connected via an insulating substrate each having an adhesive layer and a through-hole filled with a conductor, and the conductive layer on the surface layer of the multilayer printed wiring board and the conductive layer on the surface layer of the core substrate. A multilayer printed wiring board in which at least one of the body layers is embedded in the adhesive layer.   The multilayer printed wiring board according to claim 13 or 14, and a core substrate having a predetermined insulator layer and a conductor layer, are laminated via a substrate assembly having a through hole filled with a conductor. The conductor layer having a predetermined pattern formed on the surface layer of the multilayer printed wiring board and the conductor layer on the surface layer of the core substrate are electrically connected via the conductor, A multilayer printed wiring board in which the substrate assembly has compressibility. A step of providing a through hole in an insulating substrate containing the composite according to any one of claims 1 to 5 wherein an adhesive layer is formed on both sides;
Filling the through hole with a conductor;
A step of superimposing a support base material on which at least one surface of the insulating substrate has a predetermined pattern and a conductor layer having a thickness substantially equal to or thicker than the adhesive layer;
A step of embedding the conductor layer in the adhesive layer by heating and pressing the insulating substrate on which the support base material is stacked;
And a step of removing the supporting base material while leaving the conductor layer. A release film having an adhesive layer formed on one side of the insulating substrate containing the composite according to any one of claims 1 to 5 so that the adhesive layer and the insulating substrate are in contact with each other. And the process of attaching to
Providing a through hole in an insulating substrate provided with the release film;
Filling the through hole with a conductor;
Leaving the adhesive layer on the insulating substrate and peeling the release film;
A step of superimposing a support base material on which at least one surface of the insulating substrate has a predetermined pattern and a conductor layer having a thickness substantially equal to or thicker than the adhesive layer;
A step of embedding the conductor layer in the adhesive layer by heating and pressing the insulating substrate on which the support base material is stacked;
And a step of removing the supporting base material while leaving the conductor layer. It has a predetermined pattern on one side of an insulating substrate containing the composite according to any one of claims 1 to 5, comprising an adhesive layer on both sides and a through hole filled with a conductor. Stacking a support substrate on which a conductor layer having a thickness approximately equal to or thicker than the adhesive layer is formed;
Burying the conductor layer in the adhesive layer by compressing by heating and pressing; and
The manufacturing method of the multilayer printed wiring board formed by repeating the process of leaving the said conductor layer and removing the said support base material. 15. Insulation comprising the multilayer printed wiring board according to claim 13 or 14, each comprising a core substrate having a predetermined insulator layer and a conductor layer, and through-holes filled with an adhesive layer and a conductor on both sides. A step of stacking through a substrate;
By heating and pressing the core substrate and the multilayer printed wiring board stacked via the insulating substrate, the conductor layer formed on the surface layer of the multilayer printed wiring board and the conductor layer of the surface layer of the core substrate And a step of embedding at least one of them in the adhesive layer. The multilayer printed wiring board according to claim 13 or 14 is connected to a core substrate having a predetermined insulator layer and a conductor layer through a substrate bonded body having a compressibility by filling a through hole with a conductor. The process of stacking,
The conductor layer formed on the surface layer of the multilayer printed wiring board by heating and pressurizing the multilayer printed wiring board and the core substrate stacked via the substrate assembly and the conductor layer of the core substrate are A method for producing a multilayer printed wiring board, comprising the step of electrically connecting via a conductor.

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