JP2006303202A - Printed board with built-in component and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a printed board with built-in component capable of solving a problem of unnecessary radiation noise due to an electronic component arranged in the printed board and capable of easily drawing out a circuit wire from the electronic component, and to provide a method for manufacturing the printed board with built-in electronic component. <P>SOLUTION: In the printed board with built-in component where the electronic component 6 is arranged on a conductive layer of an inner layer part of the printed board, a cover-shaped shielding body 34 of which the side face and upper surface consist of a metallic conductor is arranged on the upper part of the electronic component 6, the electronic component 6 is arranged in the cover-shaped shielding body, and space between the cover-shaped shielding body 34 and the electronic component 6 is tightly sealed by insulating resin. The method for manufacturing the printed board with built-in electronic component comprises a process for forming a circuit wire from a pad in which the electronic component 6 is arranged, a process for laminating prepreg with a punching and a double-sided copper-plated laminating board with a through-hole on the upper part of the electronic component 6, and a process for applying a cover-state conductor plating on the upper part of the through-hole. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic component built-in type printed wiring board that shields unnecessary radiation noise from an embedded electronic component and protects the embedded electronic component and circuit wiring from external noise, and a method of manufacturing the same.

  In recent years, there has been a demand for miniaturization and higher density of printed wiring boards. In the past, various types of electronic components that were mounted on the surface of printed wiring boards have been incorporated into printed wiring boards. There are technologies related to printed wiring boards. This component built-in type printed wiring board has a structure in which electronic components are introduced into the printed wiring board, so that it can cope with a reduction in the space and density of the surface mounting portion, It greatly contributes to development.

  In addition, the component built-in type printed wiring board has an electrical wiring structure that uses the inner layer portion of the printed wiring board from the conventional planar surface mounting portion, for example, a structure in which passive components are arranged directly under the LSI. This makes it possible to reduce the lead inductance during high-speed transmission of LSI, and is effective in optimizing the signal wiring to support the operation. Also have.

  However, the component built-in type printed wiring board has a problem of unnecessary radiation noise. This has been a major problem as electromagnetic waves generated from electronic components cause malfunctions due to communication failure and interference between electronic components, as electronic components become more functional and faster. Similarly, unnecessary radiation noise generated from the embedded electronic components and circuit wiring may cause malfunctions in the electronic components and circuit wiring arranged in the vicinity, which is also a big problem in this respect. .

  As a technique for solving the problem of unnecessary radiation noise in such a component built-in type printed wiring board, for example, a printed wiring board as shown in FIG. 7 has already been reported (see Patent Document 1).

  That is, in order to shield unnecessary radiation noise generated from the electronic component 80, a metal film 78 is formed on one or both sides of the lower side of the upper wiring board 72 that covers the storage portion inside the area where the electronic component 80 is mounted. Furthermore, by providing a metal conductor layer 74, which is a metal film, on the inner wall side surface portion of the storage hole of the central wiring board 73 provided with storage holes of various shapes as an area for mounting the electronic component 80, The problem is solved by a configuration in which an area for mounting an electronic component is completely sealed from the outside, and an airtight space 75 is provided inside the sealed area.

  In such a structure shown in FIG. 7, the area where the electronic component is mounted is completely sealed from the outside, so that unnecessary radiation noise generated from the electronic component 80 is shielded, and other adjacent electronic components are shielded. It becomes a structure which can suppress interference and can solve problems, such as the above-mentioned unnecessary radiation noise.

  However, the structure shown in FIG. 7 causes a problem in routing the wiring from the electronic component 80. That is, the problem of unnecessary radiation noise is solved by making the electronic component 80 a sealed structure, but the wiring from the electronic component 80 is connected to the solder bump 79 disposed on the lower wiring board 71 by making the sealed structure. It is necessary to draw out to the lower layer of the electronic component 80 through the land 70 and the non-penetrating conduction hole 77, and it is difficult to connect with other adjacent electronic components arranged in the same layer, and the print density is increased. The actual situation was a problem in the routing of circuit wiring against the background of the wiring board.

JP 2002-84070 A

  Based on this background, the problem to be solved by the present invention is to solve the problem of unnecessary radiation noise caused by electronic components arranged inside the printed wiring board, and to easily draw out circuit wiring from the electronic components. Accordingly, it is an object of the present invention to provide a component-embedded printed wiring board that can easily arrange high-density electronic components.

  The inventor has made various studies in order to solve the above problems. As a result, on the upper surface of the electronic component placed inside the printed wiring board, an insulating base material and through holes that have been processed in advance to accommodate the electronic component are sequentially stacked, and a conductor is provided on the upper surface of the through hole. The present invention has been completed by finding that a component-embedded printed wiring board having an electronic component covered with a lid-shaped shield body formed by the above method is effective.

  That is, the present invention provides a component-embedded printed wiring board in which an electronic component is arranged on a conductor layer of an inner layer portion of the printed wiring board, and a lid having a side surface portion and an upper surface portion made of a metal conductor on the upper surface of the electronic component. A mold-shaped shield body, an electronic component is disposed inside the lid-shaped shield body, and the lid-shaped shield body and the electronic component are hermetically sealed with an insulating resin. The above-described problems are solved by a component built-in type printed wiring board characterized by being stopped.

  In addition, the present invention solves the above-described problems with a component-embedded printed wiring board characterized in that the shield body and the conductor layer on which the electronic component is disposed are in a non-contact state.

  Further, the present invention provides a built-in component characterized in that a pad in which an electronic component is arranged inside the shield body and another pad outside the shield body in the same layer as the pad are connected by circuit wiring. The above-mentioned problem is solved by a mold printed wiring board.

  In addition, the present invention solves the above-described problems with a component-embedded printed wiring board, wherein the electronic component is a passive component, an active component, or a module.

  According to another aspect of the present invention, there is provided a method of manufacturing a component-embedded printed wiring board in which an electronic component is disposed on an inner layer portion of the printed wiring board, and a step of forming circuit wiring from a pad portion where the electronic component is disposed; It consists of a step of laminating a prepreg provided with a punched portion in advance on the upper surface of the part and a double-sided copper-clad laminate provided with a through hole in advance, and a step of applying a conductor plating in a lid state on the upper surface of the through hole. The above-described problems are solved by a method for manufacturing a component built-in type printed wiring board.

  According to the present invention, the lid-shaped shield body having the side surface portion and the upper surface portion made of the metal conductor is disposed on the upper surface of the electronic component disposed in the inner layer portion of the printed wiring board. As a result of the unnecessary radiation noise generated from the components being shielded, interference with other adjacent electronic components can be suppressed, and at the same time, the influence of external noise on the embedded electronic components and circuits can be prevented. In addition, the circuit wiring from the electronic component can be routed in the same layer where the electronic component is disposed.

  Embodiments of the present invention will be described below with reference to the drawings.

  First, a first embodiment will be described with reference to FIGS.

  As shown in FIG. 1A, first, a double-sided copper-clad laminate 10 in which a copper foil 1a and a copper foil 1b are laminated on both sides of an insulating material 2 is prepared. Next, after providing the interlayer connection via 3 in the double-sided copper-clad laminate 10 as shown in FIG. 1B, a circuit is formed only on one side of the copper foil 1a, and the circuit wiring 4 and the electronic component are mounted. A pad 5 is provided.

  The interlayer connection via 3 is formed by forming a hole mainly using a conformal via forming method or a copper direct via forming method using a laser, and then applying conductor plating.

  Further, regarding the circuit formation of the copper foil 1a, it is formed by a subtractive circuit forming method or the like in which the steps of exposure, development, etching, and peeling using a dry film are sequentially performed. Here, the thickness of each conductor of the circuit wiring 4 and the pad 5 for mounting the electronic component in FIG. 1B is adjusted according to the required structure of the printed wiring board. In FIG. 1 (b), when the etching amount of the conductor is adjusted, the conductor thickness of the circuit wiring 4 is shown to be thinner than the conductor thickness of the pad 5, but both the conductor thicknesses may be the same. good.

  Subsequently, the electronic component 6 is arrange | positioned on the pad 5, and the printed wiring board 11 after the electronic component mounting shown by FIG.1 (c) is obtained after arrangement | positioning. As a method for arranging the electronic component 6 here, in addition to a mounting form using a solder paste, a placement type mounting form using a conductive film adhesive or an anisotropic conductive adhesive is used.

  The printed wiring board 11 after mounting the electronic component shown in FIG. 1C can perform two types of circuit wiring from the pad 5a on which the electronic component 6 is arranged. That is, one is a connection method from the pad 5a on which the electronic component 6 is disposed to the underlying conductor via the interlayer connection via 3, and the other is from the pad 5a on which the electronic component 6 is disposed via the circuit wiring 4. This is a connection method to another pad 5b arranged in the same layer.

  In addition, as the electronic component 6 used here, a passive component such as a chip-shaped resistor or capacitor, an active component such as an IC or LSI, or a module is preferably used.

  Next, a structure in which the electronic component 6 is built in the printed wiring board and a method for routing circuit wiring from the electronic component 6 will be described with reference to FIG.

  First, as shown in FIG. 2 (a), a printed wiring board 11 after mounting an electronic component obtained by placing the electronic component 6 on a printed wiring board is used, and the electronic component 6 From the upper surface, a prepreg 24 provided with a punched portion 25 in advance and a double-sided copper-clad laminate 20 provided with a through hole 23 in advance are stacked in order.

  Here, the extraction part 25 of the prepreg 24 is performed by router drilling or the like, and the size of the extraction part 25 is preferably the same size as the electronic component 6 or slightly larger than the electronic component 6. This is because the amount of the resin component that flows during the lamination heating differs depending on the prepreg 24 to be used, and the amount of resin flow of the prepreg 24 is taken into consideration.

  The through hole 23 is formed in the double-sided copper-clad laminate 20 by the following procedure, for example. First, prepare a double-sided copper-clad laminate and drill through holes with a drill or router. The size of the opening of the through hole is preferably the same as or slightly larger than that of the punched portion 25 provided in the prepreg 24. This is because the through hole 23 is filled with the resin component flowing from the prepreg 24 during the lamination heating.

  Next, the opening of the through hole is washed with desmear or the like, and after the copper plating 22 is attached, a circuit is formed in the required structure. With respect to the circuit formation of the through-hole 23 part, it is formed by a subtractive circuit formation method or the like in which the steps of exposure, development, etching and peeling using a dry film are sequentially performed. At the same time, circuit wiring (not shown) having a structure required in the vicinity of the through hole 23 in FIG. In this way, the double-sided copper-clad laminate 20 shown in FIG. 2A is obtained.

  The structure of the through hole 23 may be a vertical wall surface structure shown in FIG. 2A, and the wall surface of the through hole 23 may be an oblique shape having a taper angle. This is because the resin component that flows from the prepreg 24 at the time of laminating heating as described above becomes a structure that can be easily filled into the through hole 23. Furthermore, since the through hole 23 has a main role of shielding the electronic component 6, it is important that the through hole 23 has a structure that can easily shield the electronic component 6. Therefore, the through hole 23 is preferably used as a quadrangular structure or a polygonal structure in addition to the circular structure.

  Next, by performing a laminated heat press with the structure shown in FIG. 2A, the components of the resin 26 in the prepreg 24 flow by heating, and the periphery of the electronic component 6 is sealed and sealed without any gaps. At the same time, the through hole 23 of the double-sided copper-clad laminate 20 is filled without any gaps, and after completion of the lamination, a four-layered component built-in type printed wiring board of L1 to L4 shown in FIG. 2B is obtained.

  Here, in the structure shown in FIG. 2 (b), the resin 26 in the prepreg 24 may rise and become a convex portion at the L1 portion. In such a case, a physical polishing process such as buffing is performed after the lamination is completed, and the surface layer portion is flattened to obtain a structure having a flat surface as shown in FIG.

  The structure shown in FIG. 2B has a structure in which a shield body made of a through hole 23 is arranged on the side surface portion of the electronic component 6 arranged in the inner layer portion of the printed wiring board, and unnecessary radiation generated from the electronic component 6 is obtained. Noise can be shielded and interference from other adjacent electronic components can be suppressed.

  The shield body composed of the through hole 23 is located at L1 and L2 in the structure shown in FIG. That is, the shield body formed of the through hole 23 has a structure in a non-contact state with the L3 conductor layer including the pad 5 on which the electronic component 6 is disposed and the circuit wiring 4.

  Further, the electronic component 6 is arranged on the mounting pad 5a, and the circuit wiring 4 of the mounting pad 5a can be routed on the same layer (L3 layer in FIG. 2B). The electrical connection with the pad 5b becomes possible. Furthermore, the electronic component 6 is disposed on the mounting pad 5a, and from there, wiring can be routed from the mounting pad 5a to the lower layer (L4 layer in FIG. 2B) via the interlayer connection via 3.

  Next, chemical copper plating and electrolytic copper plating are sequentially performed on the surface of the structure shown in FIG. 2B to obtain the structure shown in FIG. 3A to which the copper plating 31 is attached.

  Next, the circuit formation of the 31 parts of the copper plating attached to the surface of the structure shown in FIG. 3A is performed by a subtractive method or the like, and the formation of the lid part 34 connected to the through hole 23 is required. Circuit wiring is formed to obtain the structure shown in FIG.

  Here, in the structure shown in FIG. 3B, the side surface portion by the through hole 23 and the upper surface portion by the lid portion 34 are metal on the upper surface of the electronic component 6 disposed in the inner layer portion of the printed wiring board. A lid-shaped shield body made of a conductor is arranged.

  By disposing a lid-shaped shield body having a side surface portion and an upper surface portion made of a metal conductor on the upper surface of the electronic component 6 disposed in the inner layer portion of the printed wiring board, there is no need to generate from the embedded electronic component 6 It can shield radiation noise, suppress interference with other adjacent electronic components, and at the same time, has an effect of preventing the influence of external noise on embedded electronic components and circuits.

  Further, in the structure shown in FIG. 3B, the copper part 36 is formed on the lower surface of the electronic component 6 by forming the copper part 36 having a larger area than the electronic component 6 when forming the circuit. It is good also as a shield of the lower surface of the electronic component 6. FIG. This is because when the electronic component 6 is protected from external noise, it is more effective to shield both the upper surface and the lower surface of the electronic component 6. In addition, the copper portion 36 can be easily formed by the circuit formation. This is because it has the advantage that it can be formed.

  Further, in the structure shown in FIG. 3B, the lid 34 on the upper surface and the copper portion 36 on the lower surface of the electronic component 6 can be used as a power supply layer because they have a flat and flat structure.

  Next, the built-up structure to the structure shown in FIG. 3B will be described with reference to FIG.

  In FIG. 4, after the prepreg 32 and the copper foil are sequentially stacked on the structure shown in FIG. 3 (b), the interlayer connection via 3 is provided, and then the pads 5 and the required are formed by circuit formation. Circuit wiring 35 is formed. In this manner, a component built-in type multilayer printed wiring board having a desired number of layers can be formed by sequentially stacking the prepreg 32 and the copper foil in a stacked manner.

  The structure shown in FIG. 4 is a structure of a component built-in type printed wiring board according to the present invention. As a function of the structure, a lid-type shape in which a side surface portion made of a through hole 23 and an upper surface portion made of a lid portion 34 are made of a metal conductor on the upper surface of the electronic component 6 arranged in the inner layer portion of the printed wiring board. By arranging the shield body, unnecessary radiation noise generated from the embedded electronic component 6 can be shielded, interference with other adjacent electronic components can be suppressed, and at the same time, the influence on the embedded electronic components and circuits from external noise prevent.

  In addition, since the conductor layer on which the electronic component 6 is arranged and the lid-shaped shield body are in a non-contact state, circuit wiring can be arranged at the non-contact state, and as a result, the electronic component This is advantageous because the circuit wiring from 6 can be routed over a wide range.

  Further, as described in the structural description shown in FIG. 3B, the upper cover portion 34 and the lower copper portion 36 of the electronic component 6 have a flat and flat structure and should be used as a power supply layer. Can do. Therefore, in the structure shown in FIG. 4, when the circuit wiring 35 is formed in the outer layer direction of the lid portion 34 and the copper portion 36, the circuit wiring 35 can be used as a signal line. Since the lower layer is a power ground layer, it is advantageous because a microstrip line can be formed.

  Next, a second embodiment will be described with reference to FIGS.

  As shown in FIG. 5A, first, the printed wiring board 11 after the electronic component mounting obtained in FIG. 1C is prepared. Next, the prepreg 32 and the copper foil 33 are sequentially arranged from the lower surface of the printed wiring board 11 after mounting the electronic component. In addition, a prepreg 24 provided with an opening in advance from the upper surface of the printed wiring board 11 after mounting the electronic component, a double-sided copper-clad laminate 20 provided with a through hole 23 in advance, a prepreg 32 and a copper foil 33 are arranged in this order. Adhere by lamination.

  Here, the opening of the prepreg 24 is preferably formed by router drilling, and the size of the opening is preferably the same size as the electronic component 6 or slightly larger than the electronic component 6. This is because the amount of the resin component that flows during the lamination heating differs depending on the prepreg 24 to be used, and the amount of resin flow of the prepreg 24 is taken into consideration.

  The through hole 23 is formed in the double-sided copper-clad laminate 20 in the following procedure. First, prepare a double-sided copper-clad laminate and drill through holes with a drill or router. The size of the through hole opening is preferably the same as or slightly larger than that of the punched portion 25 provided in the prepreg 24. This is because the through hole 23 is filled with the resin component flowing from the prepreg 24 during the lamination heating.

  The structure of the through hole 23 here may be the structure of a vertical wall surface shown in FIG. 5A, and the wall surface of the through hole 23 may be an oblique shape having a taper angle. This is because the structure in which the resin component flowing from the prepreg 24 at the time of laminating heating is easily filled in the through hole 23 is obtained.

  Next, copper plating 22 is attached to the through-hole opening, and a circuit is formed in the target structure to obtain a double-sided copper-clad laminate 20 shown in FIG.

  By heating by lamination with the structure shown in FIG. 5 (a), the components of the resin 26 in the prepreg 24 and the prepreg 32 provided with the punched portion flow, and the electronic component 6 is wrapped around without gaps. The through-hole 23 of the copper-clad laminate 20 is filled without any gaps, and after completion of the lamination, a six-layer structure built-in printed wiring board shown in FIG. 5B is obtained.

  Next, after providing the interlayer connection via 3 so as to be connected to the through hole 23 on the printed wiring board with a built-in component shown in FIG. 6 and the like, and the formation of the lid 34 and the necessary circuit wiring are performed to obtain the structure shown in FIG.

  Here, the structure shown in FIG. 6 includes an upper surface of the electronic component 6 arranged in the inner layer portion of the printed wiring board, a side surface portion by the through hole 23 and the interlayer connection via 3, and an upper surface portion by the lid portion 34. And a lid-shaped shield body made of a metal conductor. With such a structure, unnecessary radiation noise generated from the electronic component 6 can be shielded, and interference from other adjacent electronic components can be suppressed. In addition, the circuit wiring from the electronic component 6 can be routed in the same layer where the electronic component is disposed.

Test Example A simulation test for comparing the electric field strength was performed on the lid-shaped shield body including the through hole 23 and the lid portion 34 in the present invention in order to confirm the shielding effect. As a printed wiring board structure used for the simulation test, (i) a printed wiring board structure (shield) excluding the through-hole 23 and the lid 34 from the component built-in printed wiring board structure shown in FIG. The structure having no function) and (ii) the component-embedded printed wiring board structure (structure having a shield function) shown in FIG. 4 were used.

  As a test method, an electromagnetic field analysis simulator (MW-Studio) manufactured by CST was used to prepare models of the two types of structures, and comparison of electric field strength was examined by unsteady analysis.

  As an analysis method, a rectangular signal having a voltage of 0.4 [V] and a rise time of 50 [ps] is input from the start end of the wiring to which the embedded component is connected, and is output from the end of the wiring. At that time, the strength of the electric field with respect to the input signal was analyzed on the time axis at the measurement terminal for electric field strength analysis arranged at a position 1 mm above the embedded part.

  That is, in the structure of the component built-in type printed wiring board shown in FIG. 4, a rectangular signal of 0.4 [V] is input from the input terminal portion 90, and the rectangular signal is output from the output terminal portion 91. At that time, the measurement location of the electric field intensity at the input / output of the signal is installed on the upper part of the lid part 34 of the component built-in type printed wiring board shown in FIG. Analysis of the electric field strength was performed.

  With respect to the measurement results, (i) the case of a printed wiring board structure (structure without a shield function) excluding the through hole 23 and the lid 34 from the component built-in printed wiring board structure shown in FIG. FIG. 8B shows the case of the structure (structure having a shield function) of the component built-in type printed wiring board of the present invention shown in FIG.

  In the case of the structure without the shielding function shown in FIG. 8A, it was confirmed that the electric field strength at the upper part of the electronic component embedded at the time of inputting the rectangular signal was 4500 [V / m] at the maximum. On the other hand, in the case of the structure having the shielding function of the present invention shown in FIG. 8B, it was confirmed that the electric field strength at the upper part of the electronic component embedded at the time of rectangular signal input was 1300 [V / m] at the maximum. Therefore, the component-embedded printed wiring board structure having the shielding function of the present invention shown in FIG. 4 has unnecessary radiation generated from the embedded component and the circuit wiring when a rectangular signal is input due to the shield structure of the embedded component. It was confirmed that the effect of shielding noise was obtained.

  That is, (i) in the case of a structure without a shielding function, the signal line (transmission line) arranged on the upper layer of the component is subjected to the influence of unnecessary radiation noise generated from the embedded electronic component and its peripheral circuit wiring. And problems that electronic parts receive.

  On the other hand, in the case of the structure having the shield function of (ii) the present invention, it becomes possible to prevent problems caused by unnecessary radiation noise generated from the embedded electronic component and its peripheral circuit wiring. Even when a signal line (transmission line), an electronic component, or the like arranged in the above is arranged, it has an effect of shielding the influence of unnecessary radiation noise.

  In addition, the embedded electronic component and the surrounding circuit wiring itself are not affected by unnecessary radiation noise from the power supply, circuit wiring, etc. arranged in the upper layer, and do not interfere with each other through the shielding function. Thus, it was confirmed that there is an effect of reducing unnecessary radiation noise.

The printed wiring board with built-in component according to the present invention shields unnecessary radiation noise by covering embedded electronic components and circuit wiring with a shielding material, and at the same time protects electronic components and circuit wiring from the influence of external noise. Therefore, EMC (electromagnetic compatibility) characteristics of the component built-in type printed wiring board are improved.
In addition, since it is not necessary to provide a sufficient insulating space between components as a noise countermeasure, it is possible to increase the density of the component built-in type printed wiring board.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic cross-sectional process explanatory diagram illustrating a first embodiment of the present invention. FIG. 2 is a schematic cross-sectional process explanatory diagram subsequent to FIG. 1. FIG. 3 is a schematic cross-sectional process explanatory diagram subsequent to FIG. 2. FIG. 4 is a schematic cross-sectional process explanatory diagram subsequent to FIG. 3. Schematic cross-sectional process explanatory drawing which shows the 2nd Embodiment of this invention. FIG. 6 is a schematic cross-sectional process explanatory diagram subsequent to FIG. 5. The schematic cross-section explanatory drawing of the conventional component built-in type printed wiring board. The graph which shows the test result in a test example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 1a, 1b: Copper foil 2: Insulating material 3: Interlayer connection via 4: Circuit wiring 5, 5a, 5b: Pad 6: Electronic component 10: Double-sided copper clad laminated board 11: Printed wiring board 20 after electronic component mounting : Double-sided copper-clad laminate 22: Copper plating 23: Through hole 24: Pre-preg 25: Extraction part 26: Resin 31: Copper plating 32: Pre-preg 33: Copper foil 34: Lid part 35: Circuit wiring 36: Copper part 70: Connection Land 71: Lower wiring plate 72: Upper wiring plate 73: Middle wiring plate 74: Metal conductor layer 75: Airtight space 77: Non-penetrating conduction hole 78: Metal film 79: Bump 80: Electronic component

Claims (5)

  In a component built-in type printed wiring board in which electronic components are arranged on a conductor layer of an inner layer portion of the printed wiring board, a lid-shaped shield body having a side surface portion and an upper surface portion made of a metal conductor is provided on the upper surface of the electronic component. Provided that an electronic component is disposed inside the lid-shaped shield body and the gap between the lid-shaped shield body and the electronic component is hermetically sealed with an insulating resin. A printed wiring board with built-in components.   The component built-in printed wiring board according to claim 1, wherein the shield body and the conductor layer on which the electronic component is disposed are in a non-contact state.   The pad in which the electronic component is disposed inside the shield body and another pad outside the shield body in the same layer portion as the pad are connected by circuit wiring. The component built-in type printed wiring board according to Item 1.   The component built-in printed wiring board according to claim 1, wherein the electronic component is a passive component, an active component, or a module.   In the manufacturing method of the component built-in type printed wiring board in which the electronic component is arranged in the inner layer portion of the printed wiring board, the step of forming the circuit wiring from the pad portion where the electronic component is arranged, and the upper surface of the electronic component, A component comprising: a step of laminating a prepreg provided with a punched portion in advance and a double-sided copper-clad laminate provided with a through hole in advance, and a step of applying a conductor plating in a lid state on the upper surface of the through hole. A method for manufacturing a built-in printed wiring board.