JP2006350078A - Three-dimensional shape measuring device and three-dimensional shape measuring method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a three-dimensional shape measuring device and a three-dimensional shape measuring method for measuring the three-dimensional shape of layers other than a surface layer. <P>SOLUTION: The three-dimensional shape measuring device is equipped with: a wavelength switching mechanism 30 switching the wavelength of illuminating light from a light source 11; a stage driving mechanism 34 scanning a focal position on a sample 23 along an optical axis; a CCD camera 28 detecting reflected light reflected on the sample through a confocal optical system; and a processing device 33 performing processing based on detected light detected by the CCD camera 28 used when scanning the focal position. The processing device 33 calculates a focusing point position based on the detected light detected by the CCD camera 28 and constructs the three-dimensional shape. The wavelength is switched to the different one by the wavelength switching mechanism 30 so as to construct the three-dimensional shape of the upper surfaces of the first layer 23a and the second layer 23b. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a three-dimensional shape measuring apparatus and a three-dimensional shape measuring method for measuring a three-dimensional shape of a sample using a confocal optical system.

  Currently, confocal microscopes are widely used. In a confocal microscope, light from a point light source is imaged on a sample, and reflected light from the sample is detected through a pinhole. The point light source and the sample, and the sample and the pinhole are arranged at conjugate positions. Accordingly, light from other than the focal position is blocked by the pinhole. Thereby, the resolution in the optical axis direction can be increased. Moreover, not only the thing using a point light source but the slit confocal which images a line-shaped light on a sample and detects with a one-dimensional photodetector is also utilized (for example, patent document 1).

  In such a confocal microscope, the light intensity of the reflected light increases when the focal position matches the surface, so that a three-dimensional shape can be measured. That is, the reflected light is detected by scanning the focal position of the objective lens along the optical axis. At this time, the focal position coincides with the sample surface at the position where the intensity of the reflected light is maximized. Thereby, the height of the sample surface can be obtained. The three-dimensional shape of the sample can be measured by scanning the light beam in a direction perpendicular to the optical axis with a galvanometer mirror or the like to obtain the focal position of each point.

  Furthermore, a confocal microscope capable of obtaining a three-dimensional image while preventing deterioration of the S / N ratio is disclosed (Patent Document 2). This confocal microscope includes a wavelength selection filter that selects wavelengths of R (red), G (green), and B (blue). Then, the intensity of light of each color of R, G, and B is detected by the color image sensor. The sample surface is obtained based on the luminance signal of the highest intensity color among R, G and B. That is, a three-dimensional image is constructed by selecting a luminance signal in the optimum wavelength band based on the luminance signals of R, G, and B.

JP-A-10-104523 JP 2003-140050 A

  However, with the above confocal microscope, only the shape of the surface of the sample could be measured. That is, in the case where the sample is a laminated structure composed of multiple layers, only the shape of the uppermost layer could be measured.

  The present invention has been made in view of the above problems, and provides a three-dimensional shape measuring apparatus and a three-dimensional shape measuring method capable of measuring the three-dimensional shape of the uppermost layer and the lower layer of a sample having a multilayer structure. The purpose is to do.

  A three-dimensional shape measuring apparatus according to a first aspect of the present invention is a three-dimensional shape measuring apparatus for measuring a three-dimensional shape of a sample having at least a lower layer and an upper layer provided on the lower layer, A light source that emits illumination light for illuminating the object, an objective lens that focuses the illumination light from the light source on the sample, and a focal position scan that scans the focal position of the objective lens relative to the sample along the optical axis Means, a vertical scanning means for focusing the illumination light on the sample in a direction perpendicular to the optical axis, a detector for detecting reflected light reflected by the sample via a confocal optical system, and the focus In-focus position calculating means for calculating the in-focus position based on the detection light detected by the detector when the focus position is scanned by the position scanning means, and for calculating the in-focus position by the in-focus position calculating means. A wavelength selection unit that selects a wavelength of the detection light to be used, and a three-dimensional shape based on a change in the in-focus position when the focus position of the illumination light is scanned in a direction perpendicular to the optical axis by the vertical scanning unit. Three-dimensional shape constructing means for constructing three-dimensional shape constructing means for constructing the three-dimensional shapes of the upper surface of the upper layer and the upper surface of the lower layer based on the detection lights of different wavelengths selected by the selecting means; And a display unit that performs display based on the three-dimensional shape of the upper surface of the upper layer and the upper surface of the lower layer constructed by the three-dimensional shape constructing means. Thereby, the three-dimensional shape of the lower layer, that is, the three-dimensional shape of a layer other than the surface layer of the sample can be measured.

  A three-dimensional shape measuring apparatus according to a second aspect of the present invention is the above-described three-dimensional shape measuring apparatus, wherein the first wavelength transmitted through the upper layer is selected by the wavelength selection unit, and the first A three-dimensional shape of the interface between the upper layer and the lower layer is constructed based on wavelength detection light. Thereby, the shape of the lower layer of the sample can be measured with high accuracy.

  A three-dimensional shape measuring apparatus according to a third aspect of the present invention is the above-described three-dimensional shape measuring apparatus, wherein the wavelength selecting means is provided in the optical path of the illumination light or the reflected light, and the incident position of the light A wavelength filter that changes the wavelength of the transmitted light according to the wavelength, and by changing the incident position of the illumination light or reflected light with respect to the wavelength filter, the wavelength of the illumination light or reflected light is switched to a different wavelength. The wavelength of the detection light is selected. Thereby, the configuration of the apparatus can be simplified.

  A three-dimensional shape measuring apparatus according to a fourth aspect of the present invention is the above-described three-dimensional shape measuring apparatus, wherein the in-focus position is calculated by the in-focus position calculating unit based on the refractive index of the second layer. A refractive index correction unit for correcting the position is further provided. Thereby, a three-dimensional shape can be measured accurately.

  A three-dimensional shape measurement apparatus according to a fifth aspect of the present invention is the above-described three-dimensional shape measurement apparatus, which is calculated by the in-focus position calculation unit based on the aberration of the optical system of the three-dimensional shape measurement apparatus. The apparatus further includes an aberration correction unit that corrects the in-focus position. Thereby, a three-dimensional shape can be measured accurately.

  A three-dimensional shape measuring method according to a sixth aspect of the present invention is a three-dimensional shape measuring method for measuring a three-dimensional shape of a sample having at least a lower layer and an upper layer provided on the lower layer, and comprising illumination light And condensing the sample to irradiate the sample, detecting the reflected light reflected by the sample through a confocal optical system, and scanning the focal position of the illumination light with respect to the sample along the optical axis. Scanning the focal position of the illumination light on the sample in a direction perpendicular to the optical axis, and based on the detection light detected in the detecting step, the focal position of the illumination light along the optical axis. Calculating the in-focus position at the time of movement, and calculating the in-focus position; selecting the wavelength of the detection light used to calculate the in-focus position; and A step of constructing a three-dimensional shape based on a change in the focal position when the focal position is scanned by a step of scanning the focal position of the bright light in a direction perpendicular to the optical axis, the upper surface of the upper layer and the lower layer of the upper layer The upper surface of the upper layer and the upper surface of the lower layer constructed in the step of constructing a three-dimensional shape with the upper surface of the upper layer based on the detection lights of different wavelengths selected by the selection means, and the step of constructing the three-dimensional shape And displaying based on the three-dimensional shape. Thereby, the three-dimensional shape of the lower layer, that is, the three-dimensional shape of a layer other than the surface layer of the sample can be measured.

  A three-dimensional shape measurement method according to a seventh aspect of the present invention is the above-described three-dimensional shape measurement method, wherein in the step of selecting the wavelength, a first wavelength that is transmitted through the upper layer is selected, and the lower layer is selected. The three-dimensional shape of the interface between the first layer and the upper layer is constructed based on the in-focus position calculated by the detection light having the first wavelength. Thereby, the shape of the lower layer of the sample can be measured with high accuracy.

  A three-dimensional shape measurement method according to an eighth aspect of the present invention is the above-described three-dimensional shape measurement method, wherein in the step of selecting the wavelength, the wavelength is selected by switching the wavelength of illumination light or reflected light. It is characterized by this. Thereby, the shape of layers other than the surface layer of a sample can be measured.

  The three-dimensional shape measurement method according to the ninth aspect of the present invention is the above-described three-dimensional shape measurement method, further comprising the step of setting a switching position for switching the selected wavelength in the direction along the optical axis, In the step of scanning the focal position along the optical axis, scanning is performed by fixing the selected wavelength to the second wavelength reflected on the surface of the upper layer on the surface side of the sample from the switching position. It is characterized by. Thereby, measurement time can be shortened.

  A three-dimensional shape measurement method according to a tenth aspect of the present invention is the above-described three-dimensional shape measurement method, which is calculated in the step of calculating the in-focus position based on the refractive index of the second layer. The method further includes a step of correcting the in-focus position. Thereby, a three-dimensional shape can be measured accurately.

  A three-dimensional shape measuring method according to an eleventh aspect of the present invention is the above-described three-dimensional shape measuring method, wherein the in-focus position is calculated in the step of calculating the in-focus position based on the aberration of the optical system. The method further includes a step of correcting. Thereby, a three-dimensional shape can be measured accurately.

  ADVANTAGE OF THE INVENTION According to this invention, the three-dimensional shape measuring apparatus and three-dimensional shape measuring method which can measure the shape of layers other than the surface layer of the sample which has a multilayer structure can be provided.

  Hereinafter, embodiments to which the present invention can be applied will be described. The following description is to describe the embodiment of the present invention, and the present invention is not limited to the following embodiment. For clarity of explanation, the following description is omitted and simplified as appropriate. Further, those skilled in the art will be able to easily change, add, and convert each element of the following embodiments within the scope of the present invention. In addition, what attached | subjected the same code | symbol in each figure has shown the same element, and abbreviate | omits description suitably.

  The configuration of the three-dimensional shape measuring apparatus according to the present invention will be described with reference to FIG. FIG. 1 is a diagram showing a configuration of a three-dimensional shape measuring apparatus. In FIG. 1, 11 is a light source, 12 is a lens, 13 is an infrared cut filter, 14 is a multi slit, 15 is a prism, 16 is a voice coil motor (hereinafter referred to as VCM) 17 is a mirror, 19 is a two-group lens, and 20 is Beam splitter, 21 is a beam splitter, 22 is an objective lens, 23 is a sample, 24 is a stage, 25 is a two-group lens, 26 is a mirror, 27 is an imaging lens, 28 is a CCD camera, 30 is a wavelength switching mechanism, and 31 is Wavelength filter. Reference numeral 32 denotes a rotation mechanism, 33 denotes a processing device, 34 denotes a stage driving mechanism, 40 denotes a lens, and 41 denotes a two-divided photodiode.

  In the present embodiment, a CCD camera 28 that captures a confocal image of the sample 23 and a two-divided photodiode 41 for detecting the position of the multi slit 14 are provided. The light transmitted from the light source 11 through the multi slit 14 is detected by the CCD camera 28. That is, the three-dimensional shape measuring apparatus 1 measures the shape of the sample 23 using a confocal optical system. That is, the three-dimensional shape of the sample 23 is measured based on the XYZ coordinates in the horizontal and vertical scans and the light intensity detected through the confocal optical system.

  The light source 11 emits illumination light for illuminating the sample 23. The light source 11 is, for example, a white light source, and more specifically, various lamp light sources such as a mercury lamp and a halogen lamp can be used. Of course, other light sources may be used. That is, the light source 11 preferably has a broad spectrum and emits light of various wavelengths as illumination light.

  The multi slit 14 is provided in the vicinity of the light source 11. A multi-slit 14 provided with a plurality of slits that transmit light is disposed on the optical path. Thereby, the light from the light source 11 is converted into line-shaped light. Between the light source 11 and the multi-slit 14, a wavelength filter 31 that is a part of a wavelength switching mechanism 30 that selects a wavelength, a lens 12 that collects light from the light source 11, and an infrared cut filter 13 that cuts infrared light. And are provided. The infrared cut filter 13 cuts infrared rays from the light source 11 in order to prevent the sample 23 from being heated. The configuration of the wavelength switching mechanism 30 having the wavelength filter 31 will be described later.

  The multi slit 14 is attached to the VCM 16 and can be moved linearly. By driving the VCM 16, the multi slit 14 moves in a direction perpendicular to the optical axis. The multi-slit 14 moves in a direction perpendicular to each slit provided with the multi-slit 14. The VCM 16 is driven by a signal from the camera controller 29. The VCM 16 can move the multi slit 14 to a predetermined position by, for example, PID control.

  The configuration of the multi slit 14 will be described with reference to FIGS. FIG. 2 is a diagram showing the configuration of the multi slit 14 connected to the VCM 16. FIG. 3 is a plan view showing the configuration of the multi slit 14.

  As shown in FIG. 2, the multi-slit 14 connected to the VCM 16 is provided with a slit portion 51 for converting light from the light source 11 into linear light. A rectangular pattern 52 that transmits light detected by the two-divided photodiode 41 is provided beside the slit portion 51. The multi-slit 14 provided with the slit portion 51 and the rectangular pattern 52 is moved in the direction of the arrow by driving the VCM 16.

  The multi slit 14 will be described in detail with reference to FIG. A slit portion 51 is provided at the center of the multi-slit 14. The slit portion 51 is configured by a light shielding portion 54 provided between the slit 53 for generating line-shaped light. In the slit portion 51, only the light incident on the slit 53 is transmitted, and the light incident on the light shielding portion 54 is blocked. Therefore, light from the light source 11 is converted into line-shaped light. The multi slit 14 is formed by providing a light shielding pattern on a transparent substrate such as glass by a photolithography process.

  The slits 53 and the light-shielding portions 54 are repeatedly provided with a constant width, and a periodic space pattern is formed. Each of the plurality of slits 53 arranged in the Y direction generates slit light that is long in the X direction. The ratio between the slit 53 and the light shielding part 54 is, for example, 1: 7 or 1:15. That is, 1/8 or 1/16 of the light incident on the slit portion 51 is used. The slit-shaped illumination light transmitted through the multi-slit 14 is projected onto the sample, and the VCM 16 scans the multi-slit 14 in the Y direction to sequentially illuminate the entire surface of the sample. That is, the illumination light can be scanned in the direction perpendicular to the optical axis by moving the multi slit 14 having the slits 53 provided along the X direction in the Y direction. The interval between the slits 53 is set such that the reflected light corresponding to each slit 53 does not affect each other when the reflected light from the sample 23 enters the CCD camera 28.

  The rectangular pattern 52 provided at a position different from the slit portion 51 transmits light received by the two-divided photodiode 41. In FIG. 3, the light receiving surfaces 45 a and 45 b of the respective photodiodes in the two-divided photodiode 41 are projected onto the multi slit 14 and illustrated. Each of the light receiving surface 45a and the light receiving surface 45b of the two-divided photodiode 41 is arranged so that light that has passed through the rectangular pattern 52 can be detected. That is, the light from the rectangular pattern 52 is projected across the boundary line between the light receiving surface 45a and the light receiving surface 45b of the two-divided photodiode 41. When the multi slit 14 moves in the Y direction, the light from the rectangular pattern 52 moves on the light receiving surface, and the amount of light received by the light receiving surface 45a and the light receiving surface 45b changes. The position of the multi-slit 14 is detected based on the output ratio of the two-divided photodiode 41. That is, as the multi-slit 14 moves in the Y direction, the amount of light incident on one of the light receiving surface 45a or the light receiving surface 45b increases and the other decreases. The position of the multi slit 14 is detected based on the difference between the output signals of the two-divided photodiodes 41.

  Here, the description returns to FIG. The light that has passed through the slit 53 of the multi slit 14 is reflected by the mirror 17 toward the sample 23. The light reflected by the mirror 17 is collected by the second group lens 19, passes through the beam splitters 20 and 21, and enters the objective lens 22. The light incident on the objective lens 22 is condensed and imaged on the sample 23. By moving the multi slit 14 by the VCM 16, an arbitrary position on the sample 23 can be illuminated. The sample 23 placed on the stage 24 is arranged at a position conjugate with the multi slit 14.

  The stage 24 is an XYZ stage and is connected to a stage driving mechanism 34. That is, the stage drive mechanism 34 can move the stage 24 in the horizontal direction (XY direction) and the vertical direction (Z direction). By moving the stage 24 in the horizontal direction (XY direction), an arbitrary portion of the sample 23 can be observed. By moving the stage 24 in the vertical direction, the distance between the objective lens 22 and the sample 23 can be changed. By changing the relative distance between the objective lens 22 and the sample 23, the focal position of the objective lens 22 can be scanned along the optical axis. Since the confocal optical system is configured by using the slit, it is possible to capture an image (slice image) of only the height in focus. Therefore, the relative distance between the objective lens 22 and the stage 24 corresponds to the Z coordinate at the time of three-dimensional measurement. That is, the height of the focal position of the objective lens 22 from the surface of the stage 24 can be obtained from the relative distance between the objective lens 22 and the stage 24. Accordingly, the height of the focal position from the surface of the stage 24 becomes the Z coordinate. Note that the objective lens 22 may be moved instead of the stage 24. By changing the relative distance between the sample 23 and the objective lens 22, the height of the focal position from the stage 24 can be changed. Thus, the three-dimensional shape of the sample 23 can be measured by the horizontal scanning by the multi-slit 14 and the vertical scanning by the stage 24.

  The reflected light from the sample 23 is again condensed by the objective lens 22 and then reflected by the beam splitter 21. Thereby, the illumination light for illuminating the sample 23 and the reflected light reflected by the sample 23 can be separated. The light reflected by the beam splitter 21 is refracted by the second group lens 25 and enters the mirror 26. Light incident on the mirror 26 is reflected in the direction of the CCD camera 28. The focal length can be finely adjusted by adjusting the distance between the second group lens 25 as the objective lens, so that the image magnification of the slit 53 and the CCD camera can be easily matched. The second group lens 19 arranged on the illumination side and the second group lens 25 arranged on the image plane side have the same design, and the structure can adjust the magnification by adjusting the interval.

  The CCD camera 28 is a two-dimensional array photodetector in which light receiving elements are arranged in an array. The light receiving surface of the CCD camera 28 is disposed at a position conjugate with the sample. The CCD camera 28 accumulates electric charges based on the intensity of light detected by each light receiving element, and outputs detection signals by sequentially transferring the electric charges. The CCD camera 28 reads only the pixel data of the illumination area that is irradiated with the illumination light that has passed through the sample, and the pixel data of the non-illumination area that is not irradiated with the illumination light is transferred at high speed and is discarded and not used. That is, a detection signal from a pixel other than the pixel column arranged at a position conjugate with the incident position of the illumination light on the sample is not used. The CCD camera 28 outputs a signal based on the light received by the pixel among the reflected light reflected by the sample 23 to the camera controller 29. That is, the CCD camera 28 outputs a detection signal based on the detected detection light. Thereby, a confocal image can be acquired. The camera controller 29 amplifies and A / D-converts the detection signal, for example, and outputs it to the processing device 33. The processing device 33 is an information processing device such as a personal computer, and performs predetermined arithmetic processing on the detection signal input from the camera controller. The processing device 33 performs arithmetic processing for measuring a three-dimensional shape and displays a processing result. The processing in the processing device 33 will be described later.

  The multi-slit 14 is moved by the VCM 16 to scan the illumination area on the sample 23. When the position of the multi slit 14 changes, the pixel row of the CCD camera 28 that is conjugated with the slit 53 of the multi slit 14 changes. That is, when the multi-slit 14 moves by a predetermined distance, the pixel row at a position conjugate with the slit 53 on the light receiving surface of the CCD camera 28 moves to the adjacent pixel row. Specifically, when the multi-slit 14 is moved by a predetermined distance from the state in which the first pixel row of the CCD camera 28 is arranged at a position conjugate with the slit 53 of the multi-slit 14, 2 of the CCD camera. The pixel row of the column is arranged at a position conjugate with the slit 53 of the multi slit 14. Then, by repeating the movement of the multi-slit 14 by a predetermined distance, the pixel row at a position conjugate with the slit 53 is sequentially shifted. As a result, the reflected light of the illumination light scanned in the Y direction is confocal. It is detected via an optical system. By illuminating the entire sample 23, acquisition of data corresponding to all the pixels on the CCD camera is completed. Here, the XY coordinates when performing the three-dimensional measurement are determined by the position of the pixel on the light receiving surface of the CCD camera 28. That is, since reflected light from different positions of the sample 23 is detected by different pixels of the CCD camera 28, the positions of the pixels on the light receiving surface correspond to XY coordinates. Thereby, the position where the illumination light is condensed on the XY plane, that is, the XY coordinates at the time of three-dimensional measurement can be obtained. These data are combined by a processing device 33 connected to the camera controller 29 to form a two-dimensional image. The two-dimensional image is stored in the processing device 33 and displayed on the display. Thereby, a slice image of the sample 23 can be taken. The stage 24 is moved up and down (Z direction), and this image capturing is repeated. Scanning is performed in this way, and illumination light is collected at an arbitrary point in the sample. And the reflected light from a condensing position is detected through a confocal optical system. An omnifocal image can be obtained or a three-dimensional image can be obtained by processing the detection result by the processing device and synthesizing the slice images.

  The light transmitted through the rectangular pattern 52 of the multi-slit 14 enters the lens 40 via the mirror 17 and the second group lens 19. The lens 40 refracts light so that the light transmitted through the rectangular pattern 52 on the light receiving surface of the two-divided photodiode 41 becomes an appropriate spot.

  The two photodiodes provided in the two-divided photodiode 41 respectively detect the light transmitted through the rectangular pattern 52 of the multi-slit 14 and output a signal based on the intensity of the detected light to the camera controller 29. The camera controller 29 calculates the position of the multi-slit 14 based on the output ratio of the two-divided photodiode, and determines whether the multi-slit 14 is disposed at a predetermined position. When the multi slit 14 is arranged at a predetermined position, the CCD camera 28 takes an image. When the multi slit 14 is not arranged at the predetermined position, the VCM 16 is driven to move the multi slit 14 to a predetermined position. Then, imaging is performed at that position. Thus, accurate measurement can be performed by performing feedback control. Further, the camera controller 29 stores the pixel of the CCD camera 28 corresponding to the position of the multi slit 14. That is, the camera controller 29 stores the position of the multi-slit 14 and the pixel row of the CCD camera 28 at a position conjugate with the slit 53 at that position in association with each other. Then, a detection signal of a pixel row at a position conjugate with the slit 53 is stored in the processing device 33 via the camera controller 29. A confocal image can be captured by using a detection signal of a pixel row at a position conjugate with the slit 53 provided in the multi slit 14. Thereby, a slit confocal optical system can be configured.

  Further, in the present invention, two prisms 15 are provided so that the light from the light source 11 can bypass the multi slit 14. The two prisms 15 are provided so as to be movable before and after the multi slit 14. By moving the prism 15 on the optical path, the light from the light source 11 can bypass the multi slit 14 and illuminate the entire surface of the sample 23. That is, the prism 15 disposed in front of the multi slit 14 refracts light so that the light from the light source 11 does not enter the multi slit 14. The light refracted by the prism 15 returns to the original optical path by the prism 15 disposed after the multi slit 14. The sample 23 is irradiated with light that has bypassed the multi-slit 14. Thereby, a multi slit can be bypassed with a simple optical system. Of course, the configuration for bypassing the multi-slit 14 is not limited to the prism 15 and may be an optical component such as a mirror. Further, the multi-slit 14 may be removed from the optical path by driving the VCM 16. Thereby, the light from the light source 11 becomes surface illumination, and can be used as a normal microscope.

  Next, the configuration of the wavelength switching mechanism 30 will be described with reference to FIG. FIG. 4 is a front view showing the configuration of the wavelength filter 31 provided in the wavelength switching mechanism 30. The disc-shaped wavelength filter 31 is divided into six as shown in FIG. That is, the wavelength filter 31 is divided into six regions 31a to 31f. Here, among the six divided areas, 31a is a white area and 31b to 31f are colored areas. The transmissive region 31 a transmits white light from the light source 11. The colored regions 31b to 31f transmit different colors of light. That is, the colored region 31b to the colored region 31f have different wavelength bands of light to be transmitted. In other words, the colored region 31b to the colored region 31f block light other than light in a predetermined wavelength band among illumination light from the light source 11. And the wavelength band of the transmitted light differs in the colored regions 31b to 31f. For example, the colored region 31b transmits light having a wavelength near 405 nm, the colored region 31c transmits light having a wavelength near 436 nm, the colored region 31d transmits light having a wavelength near 546 nm, and the colored region 31e has a wavelength. Light having a wavelength of about 580 nm is transmitted, and the colored region 31f transmits light having a wavelength of about 600 nm. That is, the peak of the wavelength band of the transmitted light that passes through the colored region 31b to the colored region 31f is 405 nm, 436 nm, 546 nm, 580 nm, and 600 nm, respectively. Note that the wavelength bands of transmitted light may partially overlap. The wavelength filter 31 can be constituted by an interference filter in which a dielectric multilayer film is deposited on a transparent glass substrate or the like, a color filter in which a pigment is applied, or color glass.

  A rotation mechanism 32 is attached to the center of the wavelength filter 31. The rotation mechanism 32 includes a motor for rotating the wavelength filter 31. By controlling the driving of the rotation mechanism 32, the wavelength filter 31 can be stopped at a predetermined rotation position. The rotation center of the wavelength filter 31 is arranged so as to deviate from the optical axis. Therefore, when the rotation angle is changed by rotating the wavelength filter 31 by the rotation mechanism 32, the region where the illumination light from the light source 11 enters changes. Specifically, when the wavelength filter 31 is rotated by 60 ° from the state where the illumination light is incident on the colored region 31b, the illumination light is incident on the colored region 31c. By controlling the rotation mechanism 32, the illumination light from the light source 11 can be incident on any one of the white region 31a and the colored regions 31b to 31f. Thereby, the wavelength of illumination light can be changed and illumination light can be switched to a desired wavelength. Thus, a three-dimensional shape can be measured using a plurality of colors of light. That is, the wavelength of light that contributes to the measurement of the three-dimensional shape can be selected.

  The illumination light from the transparent region 31a becomes white light. With white light, it is possible to observe in a natural color that does not depend on the wavelength. Therefore, a confocal image under white light can be captured by using illumination light from the transparent region 31a. The transmissive region 31a may be used, for example, when capturing a non-confocal image. When capturing a non-confocal image, the prism 15 is arranged in the optical path, and the sample 23 is imaged by the CCD camera 28. Thereby, a non-confocal image can be captured. If a non-confocal image is used, an image equivalent to a normal optical microscope can be obtained. In the case of white light, there is no attenuation of the amount of light by the filter, so that a high brightness image can be obtained.

  Next, the shape of the sample 23 will be described with reference to FIG. FIG. 5 is a perspective view showing an example of the shape of the sample 23. The sample 23 has a three-layer structure including a substrate 23c, a second layer 23b, and a first layer 23a. A second layer 23b is formed on the substrate 23c. A first layer 23a is formed on the second layer 23b. That is, the sample 23 is a laminated structure in which a second layer 23b as a lower layer and a first layer 23a as an uppermost layer are formed on a substrate 23c. As shown in FIG. 5, linear illumination light 35 along the X direction is incident on the sample 23. Then, the focal position of the illumination light is scanned in the direction of the arrow (Y direction) by moving the multi slit 14. Here, the second layer 23b is made of a material different from that of the first layer 23a and the substrate 23c. That is, the first layer 23a, the second layer 23b, and the substrate 23c have different refractive indexes and transmittances. For example, when the sample 23 is a flexible wiring board, the substrate 23c is a base material, the second layer 23b is a conductor material, and the first layer 23a is a coverlay material. Assume that the sample 23 is placed on the stage 24. The three-dimensional shape measuring apparatus 1 according to the present invention can measure the three-dimensional shape of each layer of the first layer 23a, the second layer 23b, and the substrate 23c shown in FIG.

  A configuration when the illumination light is scanned in the Z direction with respect to the sample 23 having the above configuration will be described with reference to FIG. FIG. 6 is a cross-sectional view showing the configuration of the sample 23 on which the illumination light is incident. Further, FIG. 6 shows a state in which illumination is performed with long-wavelength illumination light that passes through the first layer 23a and the second layer 23b. As shown in FIG. 6, the sample 23 is configured from the bottom in the order of the substrate 23c, the second layer 23b, and the first layer 23a. Here, when the focal position of the illumination light is scanned along the optical axis, the illumination light is condensed at various heights of the sample 23. When the focal position of the illumination light is scanned in the Z direction, for example, the focal position changes as shown in FIGS. 6 (a) to 6 (c). For example, in a state where the stage 24 is raised and the distance between the objective lens 22 and the sample 23 is reduced, the illumination light 35 is collected on the upper surface of the substrate 23c as shown in FIG. On the other hand, when the stage 24 is lowered and the objective lens 22 and the sample 23 are moved away from each other, the illumination light 35 is collected on the surface of the first layer 23a as shown in FIG. Of course, the focal position of the illumination light 35 may be a position other than those shown in FIGS. 6 (a) to 6 (c). In FIG. 6, refraction at the interface between the first layer 23a and the air layer and at the interface between the second layer 23b and the first layer 23a is omitted.

  When the distance between the objective lens 22 and the sample 23 is gradually changed, the focal point position of the objective lens 22 is displaced along the Z direction. Thereby, illumination light can be condensed on the interface of each layer. When the illumination light 35 is condensed on the interface between the first layer 23a and the air layer, that is, on the surface of the first layer 23a, the configuration shown in FIG. Moreover, when the illumination light 35 is condensed on the upper surface of the second layer 23b, that is, the interface between the first layer 23a and the second layer 23b, the configuration is as shown in FIG. Further, when the illumination light 35 is condensed on the lower surface of the second layer 23b, that is, the interface between the second layer 23b and the substrate 23c, the configuration is as shown in FIG. Here, the illumination light 35 is reflected at each interface of the sample 23 having a laminated structure due to a difference in refractive index. Specifically, the interface between the first layer 23a and the air layer (the upper surface of the first layer 23a), the interface between the first layer 23a and the second layer 23b (the upper surface of the second layer 23b), and the second layer 23b The illumination light 35 is reflected at the interface with the substrate 23c (the upper surface of the substrate 23c). In the confocal optical system, a peak occurs at the in-focus position where the interface and the focal position coincide. Actually, the illumination light 35 is also reflected at the interface between the substrate 23c and the stage 24 (the lower surface of the substrate 23c), but the description is omitted here.

  Here, the transmittance of each layer varies depending on the wavelength. Therefore, the intensity of the incident light incident on each interface in the illumination light 35 varies depending on the wavelength. Furthermore, the refractive index in each layer and the reflectance at each interface also differ depending on the wavelength. Of course, the luminance of the illumination light 35 emitted from the light source 11 also changes depending on the wavelength. Therefore, the intensity of the reflected light reflected at each interface of the illumination light 35 incident on the sample 23 from the objective lens 22 varies depending on the wavelength. Here, FIG. 7 shows a change in the intensity of the detection light when the distance between the objective lens 22 and the stage 24 is changed. In the graph of FIG. 7, the horizontal axis is the position of the stage 24 in the Z direction, and the vertical axis is the intensity of the detection light. In the graph of FIG. 7, the stage 24 is raised upward toward the right side, and the distance between the objective lens 22 and the sample 23 is getting closer. That is, as the stage 24 is raised, it moves to the right side of the graph. In other words, the relative focal position of the objective lens 22 is lowered to the lower side (substrate 23c side) as the right side of the graph is reached. 1 layer 23a side).

  In the three-dimensional shape measuring apparatus 1 shown in FIG. 1, since the reflected light is detected through the confocal optical system, when the focal position of the objective lens 22 coincides with the interface of each layer, the peak of the detected light intensity is obtained. appear. That is, in the confocal optical system, the position where the interface and the focal position are aligned, that is, the light from the focal position is detected by the detection light, and the light from other than the focal position is not detected by the detector. Therefore, when the illumination light 35 is condensed on the interface of each layer, the intensity of the detection light detected by the CCD camera 28 is increased. In other words, the peak of the detected light intensity corresponds to the focal position at the interface. The three-dimensional shape of each layer can be measured based on the peak of detection light in each pixel when the focal position is scanned in the Z direction. For example, the CCD camera 28 outputs a detection signal based on the detected light intensity. The processing device 33 stores detection data obtained by A / D converting the detection signal in association with the pixel. That is, the focal point position is obtained for each pixel. Here, the position where the peak of the detected light intensity of each pixel when scanning in the Z direction is the in-focus position. Therefore, the relative distance between the objective lens and the sample at the in-focus position corresponds to the height of the interface in the pixel. That is, the height of the interface (position in the Z direction) can be obtained based on the focal position. A three-dimensional shape can be measured by scanning the illumination light 35 in the Y direction and calculating in-focus positions in all pixels of the CCD camera 28 based on the peak of the detected light intensity.

  FIG. 7A to FIG. 7C show the position of the stage 24 and the detected light intensity detected by the CCD camera 28 when different wavelengths are selected by the wavelength switching mechanism 30. Here, the detected light intensity from the pixel of the CCD camera 28 at a position conjugate with the sample is shown. FIG. 7A shows a graph when a wavelength of 600 nm is selected, FIG. 7B shows a graph when 546 nm is selected, and FIG. 7C shows a graph when a wavelength of 405 nm is selected. Here, most of the 405 nm illumination light 35 is reflected by the surface of the first layer 23a, and most of the 546nm illumination light 35 is transmitted through the first layer 23a and between the first layer 23a and the second layer 23b. It is assumed that most of the illumination light 35 of 600 nm reflected by the interface is transmitted through the first layer 23a and the second layer 23b and reflected by the interface between the second layer 23b and the substrate 23c. That is, it is assumed that the first layer 23a and the second layer 23b of the sample 23 are made of a material that transmits light on the long wavelength side and reflects light on the short wavelength side in the visible light region. The substrate 23c is made of a material that reflects light on the long wavelength side. Furthermore, the first layer 23a is made of a material that can transmit light having a shorter wavelength than the second layer 23b. Although FIG. 7 shows three types of selected wavelengths, it is sufficient that the number of selected wavelengths is two or more.

  Here, the case of scanning in the direction in which the stage 24 is raised will be described. As the stage 24 is raised from a predetermined position, the distance between the sample 23 and the objective lens 22 gradually approaches. Accordingly, the focal position of the objective lens 22 coincides with the surface of the first layer 23a as shown in FIG. 6A, and then the first layer 23a and the second layer 23b as shown in FIG. 6B. And then coincide with the interface between the second layer 23b and the substrate 23c as shown in FIG.

  As shown in FIG. 6A, the position of the stage 24 when the focal position of the objective lens 22 coincides with the surface of the first layer 23a is z1 on the graph of FIG. At the position z1, a peak appears in the detected light intensity as shown in FIGS. 7 (a) to 7 (c). That is, peaks appear at all wavelengths of 600 nm, 546 nm, and 405 nm. Here, the long wavelength side light, specifically, most of the illumination light 35 of 600 nm and 546 nm is transmitted through the first layer 23a. Therefore, only a part of the illumination light 35 of 600 nm and 546 nm is reflected by the surface of the first layer 23a. Therefore, the intensity of the detection light of the illumination light 35 of 600 nm and 546 nm at z1 becomes small. On the other hand, most of the short-wavelength light, specifically, the 405 nm illumination light 35 is reflected by the surface of the first layer 23a. Therefore, the intensity of the detection light of the illumination light 35 of 405 nm at z1 increases. Thereby, the peaks of the detection light intensity at 600 nm and 546 nm on the surface of the first layer 23a are smaller than the peaks of the detection light intensity at 405 nm. Therefore, as shown in FIG. 7C, in the illumination light 35 of 405 nm, the maximum peak appears at the position of z1. In the illumination light 35 of 600 nm and 546 nm, a small peak appears at the position of z1 as shown in FIGS. 7 (a) and 7 (b).

  When the stage 24 is raised, the focal position of the objective lens 22 coincides with the interface between the first layer 23a and the second layer 23b as shown in FIG. 6B. The position of the stage 24 at this time is z2. At the position of z2, a peak appears in the detected light intensity as shown in FIGS. 7 (a) and 7 (b). That is, since light having wavelengths of 600 nm and 546 nm passes through the first layer 23a, it reaches the interface between the second layer 23b and the first layer 23a. The illumination light 35 transmitted through the first layer 23a is reflected at the interface between the second layer 23b and the first layer 23a. Therefore, in the illumination light 35 having wavelengths of 600 nm and 546 nm, a peak appears at the position of z2. In the illumination light 35 of 546 nm, most of the light that has passed through the first layer 23a and entered the upper surface of the second layer 23b is reflected by the upper surface of the second layer 23b. Accordingly, the illumination light 35 of 546 nm has the maximum peak at the position of z2. On the other hand, in the illumination light 35 having a wavelength of 600 nm, most of the light transmitted through the first layer 23a and incident on the upper surface of the second layer 23b is transmitted through the second layer 23b, and only a part of the light is reflected by the upper surface of the second layer 23b. Is done. A small peak appears at the position of z2 with 600 nm illumination light. Therefore, the peak of the detection light at the position z2 is higher in the illumination light 35 of 546 nm than in the illumination light 35 of 600 nm. On the other hand, since most of the 405 nm illumination light 35 is reflected by the surface of the first layer 23a, it does not reach the interface between the first layer 23a and the second layer 23b. Therefore, as shown in FIG. 7C, in the illumination light 35 of 405 nm, no peak appears at the position of z2.

  When the stage 24 is further raised, the focal position of the objective lens 22 coincides with the interface between the substrate 23c and the second layer 23b as shown in FIG. 6C. The position of the stage 24 at this time is set to z3. At the position of z3, a peak appears in the detected light intensity as shown in FIG. That is, light having a wavelength of 600 nm passes through the first layer 23a and the second layer 23b, and therefore reaches the interface between the second layer 23b and the substrate 23c. The light transmitted through the second layer 23b is reflected at the interface between the substrate 23c and the second layer 23b. Therefore, in the illumination light 35 having a wavelength of 600 nm, a peak appears at the position of z3. In the 600 nm illumination light 35, most of the light transmitted through the second layer 23b and incident on the upper surface of the substrate 23c is reflected by the upper surface of the substrate 23c. Therefore, in the illumination light of 600 nm, the peak at z3 is higher than z1 and z2. Therefore, with the illumination light 35 of 600 nm, the detected light intensity at the position of z3 is maximized. On the other hand, most of the illumination light 35 of 405 nm and 546 nm is reflected by the surface of the first layer 23a or the surface of the second layer 23b, and therefore does not reach the interface between the substrate 23c and the second layer 23b. Therefore, as shown in FIGS. 7C and 7B, in the illumination light 35 of 546 nm and 405 nm, no peak appears at the position of z3.

  Thus, in this invention, it illuminates separately with the light of a some wavelength, and detects the light of each wavelength with a confocal optical system. Then, the height of the sample 23 based on the peak of the detected light intensity is obtained for each wavelength. The shape of each layer of the laminated structure can be measured by measuring the height of the sample 23 made of the laminated structure using detection light having different wavelengths. For example, the first layer 23a measures the shape based on the illumination light 35 having a wavelength of 405 nm, the second layer 23b measures the shape based on the illumination light 35 having a wavelength of 546 nm, and the substrate 23c has a wavelength of 600 nm. The shape is measured based on the illumination light 35. Thereby, the measurement of the three-dimensional shape of the lower layer of a laminated structure can be performed accurately. That is, in the laminated structure, the optical properties are different depending on each layer, so that the reflectance and transmittance are different. For this reason, the shape of the layer is measured based on light having a wavelength with high reflectivity in each layer. Specifically, the shape of the upper layer is measured with light having a wavelength reflected from the upper layer, and the lower layer is measured with light having a wavelength transmitted through the upper layer. Thereby, a three-dimensional shape can be measured for lower layers other than the surface layer. That is, the shape of the lower layer corresponding to the location where the upper layer is provided can also be measured. For example, it is possible to measure the shape of the lower layer even for a sample that is entirely covered with a surface layer. Therefore, the present invention is suitable for measuring the shape of a sample in which a lower layer pattern is covered with a protective layer or the like provided on the surface. In order to deal with various samples, it is preferable that the number of wavelengths that can be selected by the wavelength switching mechanism 30 is larger. Of course, it is preferable that a shorter wavelength and a longer wavelength can be selected. Thereby, it is possible to measure the three-dimensional shape of the lower layer for various samples 23. The light source 11 and the wavelength filter 31 may be changed according to the sample.

  The processing for performing the above three-dimensional measurement can be realized by the processing device 33 connected to the camera controller 29. The processing device 33 is, for example, a personal computer, and realizes the above arithmetic processing by hardware and software read by the hardware. A configuration for performing the above processing will be described with reference to FIG. FIG. 8 is a block diagram showing the configuration of the processing device 33. As shown in FIG. 8, the processing device 33 includes a stage control unit 70, a VCM control unit 71, a wavelength selection unit 72, a scanning range setting unit 73, a detection data storage unit 74, and an in-focus position calculation unit 75. , An aberration correction unit 76, a refractive index correction unit 77, a three-dimensional shape construction unit 78, and a display unit 79.

  The stage control unit 70 controls the position of the stage 24. The stage controller 70 outputs a stage drive signal for driving the stage 24 to the stage drive mechanism 34, for example. This stage drive signal is input to the stage drive mechanism 34. The stage drive mechanism 34 moves the stage 24 to a predetermined position based on the stage drive signal. Specifically, the stage 24 is moved in the horizontal direction (XY direction). Thereby, it is possible to perform measurement on a predetermined position of the sample 23. Furthermore, the stage can be moved in the Z direction based on the stage drive signal. Thereby, a tomographic image at an arbitrary height of the sample 23 can be taken. Further, the height of the stage 24 is gradually changed, and scanning in the Z direction is performed. Thereby, the three-dimensional shape of the sample 23 can be measured. In addition, a position signal indicating the position of the stage is input from the stage drive mechanism 34 to the stage controller 70. Based on this position signal, the stage controller 70 recognizes the current position of the stage 24 in the XYZ directions.

  The VCM control unit 71 controls the VCM 16 via the camera controller 29. Thereby, the position of the multi slit 14 can be moved. Specifically, a VCM drive signal for driving the VCM 16 is output. By this VCM drive signal, the VCM 16 can be driven to move the multi slit 14 to a predetermined position. For example, the multi slit 14 is driven so that the pixel row of the CCD camera 28 arranged at a position conjugate with the slit 53 of the multi slit 14 is scanned. Therefore, the illumination light 35 can be scanned with respect to the sample 23. As a result, a position conjugate with the slit 53 on the light receiving surface of the CCD camera 28 is sequentially moved to the adjacent pixel row.

  The wavelength selector 72 selects the wavelength of the illumination light 35 by controlling the rotation mechanism 32 of the wavelength switching mechanism 30. Thereby, the wavelength of the illumination light 35 can be switched. Furthermore, since the wavelength selection unit 72 stores the angle of the rotation mechanism 32, it can detect which wavelength of the wavelength filter 31 is selected. The scanning range setting unit 73 sets a scanning range in the Z direction. For example, when the approximate thickness of the sample 23 is known, the operator sets the scanning range in the Z direction based on the thickness. For example, an area wider than the entire thickness of the sample 23 is set. Further, a range from the position on the objective lens side of the surface layer to the stage side from the upper surface of the substrate 23c may be set. Or you may set the scanning range of a Z direction based on the range which measures the three-dimensional shape among the samples 23. FIG. The scanning range setting unit 73 sets a scanning range in the XY directions. For example, a range in which an operator wants to measure a three-dimensional shape is set from a non-confocal image. Thereby, the scanning range in the XY directions is set. Based on the scanning range set in the scanning range setting unit 73, the stage control unit 70 outputs a stage drive signal. Based on this stage drive signal, the stage drive mechanism 34 changes the height of the stage 24 and moves the stage 24 in the horizontal direction. Thereby, the three-dimensional shape of an arbitrary portion of the sample can be measured.

  The detection data storage unit 74 stores detection data corresponding to the detection signal from the CCD camera 28. Specifically, the detection signal from the CCD camera 28 is A / D converted by the camera controller 29. The detection data storage unit 74 stores the converted digital data as detection data. Further, the detection data storage unit 74 stores the three-dimensional coordinates corresponding to the incident position of the illumination light and the selected wavelength in association with the detection data. That is, the relative distance between the objective lens 22 and the stage 24 is determined by the position in the Z direction of the stage 24 recognized by the stage control unit 70. Thereby, the Z coordinate corresponding to each detection data is determined. Further, the illumination position on the XY plane on the focal position of the objective lens 22 from the position of the multi-slit 14 stored in the VCM controller 71 and the position of the stage 24 in the XY direction recognized by the stage controller 70. Will be determined. Therefore, the XY coordinates are determined according to the pixel of the CCD camera 28 that detects the reflected light from the sample 23. By storing the detection data for each pixel, the XYZ coordinates can be associated with the detection data. Thereby, since the XYZ coordinates of an arbitrary point on the sample are determined, the detection data can be associated with the XYZ coordinates. Further, the selection wavelength is determined from the rotation angle of the rotation mechanism 32 operated by the wavelength selection unit 72. As a result, the detection data and the selected wavelength can be stored in association with each other. In this way, the detection data storage unit 74 stores the detection data in association with the XYZ coordinates of an arbitrary point in the sample 23 and the selected wavelength. In other words, the detection data storage unit 74 stores five items of the X coordinate, the Y coordinate, the Z coordinate, the selected wavelength, and the detection data as a table.

  The in-focus position calculation unit 75 calculates the in-focus position based on the detection data stored in the detection data storage unit 74. Then, the height of each interface is obtained. Specifically, for each pixel, the position in the Z direction that is the peak of the detected light intensity is calculated. For example, the position of the maximum value in the graph shown in FIG. 7 can be set as the peak position. Of course, the peak of the detected light intensity can be calculated by various known arithmetic processing methods. This peak position is the in-focus position. For each selected wavelength, the peak position of the detected light intensity is calculated for each pixel. At this time, at the wavelength that transmits the upper layer, for example, as shown in FIG. 7A or 7B, a plurality of detection light peaks appear. In this case, the calculated peak positions of all detected light intensities are stored.

  Next, the aberration correction unit 76 and the refractive index correction unit 77 for correcting the in-focus position will be described. The aberration correction unit 76 corrects the focal position shift due to the aberration. That is, in the present invention, since the illumination light having different wavelengths is detected, the focal position may be shifted due to chromatic aberration. In order to correct the deviation of the focal position due to this aberration, the aberration is corrected by the aberration correction unit 76. For example, when the focal position of the objective lens 22 is shifted in the Z direction due to chromatic aberration, the aberration correction unit 76 stores characteristics for each selected wavelength of the objective lens 22. Then, an offset with respect to a reference position is stored for each wavelength. Then, the height of each layer is corrected for each selected wavelength. That is, the peak position of the detected light intensity is changed by an offset amount corresponding to the selected wavelength. Thereby, the shift | offset | difference of the focus position by an aberration can be correct | amended, and a three-dimensional shape can be measured correctly. As described above, the aberration correction unit 76 stores the correction value based on the aberration of the optical system of the three-dimensional shape measuring apparatus, and corrects the height of each layer based on the correction value.

  The refractive index correction unit 77 corrects the shift of the focal position due to the refractive index. For example, when the refractive index of the first layer 23a is a known value in the configuration shown in FIG. 6, the deviation of the focal position caused by the refractive index is corrected. Specifically, the height is corrected from the refraction angle of refraction at each interface. Furthermore, when the value of the refractive index is different for each selected wavelength, correction may be performed using a different refractive index for each wavelength. By correcting the refractive index in this way, the three-dimensional shape can be measured accurately. Furthermore, the absolute film thickness of each layer can be measured by using the refractive index of each layer. In this way, the refractive index correction unit 77 stores the refractive index of the upper layer, and corrects the height of each layer based on this refractive index. The refractive index of each layer is set by, for example, inputting a value corresponding to the type of the sample 23 by the operator.

  The three-dimensional shape constructing unit 78 constructs a three-dimensional shape based on the in-focus position calculated by the in-focus position calculating unit 75. Specifically, the in-focus position for each pixel is synthesized to construct a three-dimensional shape for each layer. That is, the three-dimensional shape of each layer can be constructed by connecting the height of the interface for each pixel. Here, a three-dimensional shape is constructed using in-focus positions calculated at different wavelengths for each layer. For example, in the case of the sample 23 having the configuration shown in FIG. 5, the surface shape of the first layer 23a is constructed based on the in-focus position calculated with the wavelength of 405 nm. On the other hand, the second layer 23b constructs a three-dimensional shape based on the focal position at a wavelength of 546 nm and the substrate 23c at 600 nm. Here, the height of the layer is obtained from the wavelength with the highest detected light intensity at the peak position. That is, the peak intensity for each selected wavelength is compared at all interfaces. The focal point position calculated from the selected wavelength having the highest peak intensity among the plurality of selected wavelengths is defined as the height of the interface. Specifically, as shown in FIG. 7, on the surface of the first layer 23a, the surface shape of the first layer 23a is obtained using a wavelength of 405 nm having the highest peak intensity. In addition, at the interface between the first layer 23a and the second layer 23b, using the wavelength of 546 nm having the highest peak intensity, the shape of the interface between the first layer 23a and the second layer 23b, that is, the second layer The height distribution of 23b is obtained. Further, at the interface between the substrate 23c and the second layer 23b, the wavelength of 600 nm having the highest peak intensity is used to determine the shape of the interface between the substrate 23c and the second layer 23b. Thereby, a suitable wavelength can be selected from a plurality of selection wavelengths. As described above, in the present invention, it is possible to construct a three-dimensional shape of each layer by using an optimum wavelength for each layer.

  The display unit 79 includes a display such as a liquid crystal display device, and displays the three-dimensional shape constructed by the three-dimensional shape construction unit 78. For example, the three-dimensional shape of the sample 23 viewed from a predetermined angle is displayed. Thereby, a perspective view of the sample 23 is displayed. At this time, the uppermost layer may be displayed as a translucent color. Thereby, the shape of the lower layer can be easily recognized. Further, the display color of each layer may be determined according to the color of the corresponding selected wavelength. For example, when the shape of the first layer 23a is detected by light having a wavelength of 405 nm, the first layer 23a is displayed in a color (for example, purple) corresponding to the wavelength of 405 nm on the display. This makes it possible to visualize which layer is visible at which wavelength. The transmission / reflection characteristics of the substance constituting the sample 23 are visualized, which can be used for understanding the three-dimensional shape of the sample 23. Of course, the height difference may be converted into a color and displayed in gradation. Furthermore, an arbitrary cross section may be designated so that the cross sectional shape in the cross section can be displayed. In addition, since the XYZ coordinates are acquired at the same time when the three-dimensional shape is constructed, it is possible to measure an arbitrary distance, height, width, volume, and the like. Specifically, measurement may be performed by designating an arbitrary point of the sample displayed on the display screen. Thereby, the film thickness of each layer, the width of the pattern provided on the sample 23, the distance between the patterns, and the like can be obtained.

  Next, the procedure of the three-dimensional shape measuring method according to the present invention will be described with reference to FIG. FIG. 9 is a flowchart showing the procedure of the three-dimensional shape measuring method according to the present invention. First, a correction value is set first (step S101). Specifically, the operator inputs a correction value in the aberration correction unit 76 and a refractive index correction value in the refractive index correction unit 77. The correction value for correcting aberration is an offset corresponding to the wavelength selected by the wavelength switching mechanism 30 and is determined by chromatic aberration of the objective lens 22 or the like. Therefore, the correction value for aberration correction is a value unique to the three-dimensional shape measuring apparatus 1. Therefore, the correction value for aberration correction need only be set once. The correction value for correcting the aberration can be calculated from the deviation of the in-focus position by measuring the in-focus position for each wavelength with respect to the flat surface of the standard sample using a sample with a flat surface.

  The correction value of the refractive index is determined by the refractive index of each layer provided in the sample 23. Accordingly, the refractive index correction value is a value specific to the sample 23. When these correction values are unknown or when correction is not necessary, the correction values need not be set. Each of these correction values is stored in a memory or the like. The aberration correction unit 76 and the refractive index correction unit 77 perform correction based on the set correction value.

  Next, a scanning range is set (step S102). Specifically, a horizontal scanning range and a vertical scanning range are set. These scanning ranges are stored in a memory or the like. The stage control unit 70 moves the stage 24 based on the set scanning range in a detection data acquisition step described later.

  Here, the Z direction scanning step (step S103) and the wavelength switching point setting step (step S104) for shortening the measurement time will be described. In the Z direction scanning step (step S103), the stage 24 is moved to perform scanning in the Z direction. Then, the position of the surface of the sample 23 is detected from the detection data at this time. That is, the height of the surface of the sample 23 can be obtained from the peak position of the detected light intensity on the uppermost side of the sample 23. For example, in the sample 23 having a flat surface, the approximate height of the surface can be detected in this step. Here, scanning in the Z direction may be performed with the wavelength fixed, or scanning in the Z direction may be performed by switching the wavelength.

  A wavelength switching point is set from the surface position of the sample detected in the Z-direction scanning in step S103 (step S104). Specifically, a position in the middle of the surface layer of the sample 23 is set as a wavelength switching point. When scanning in the Z direction from the upper side to the lower side of the sample 23, detection data is acquired with a single wavelength from the scanning start point on the objective lens side of the sample 23 to the switching point. That is, detection is performed with the selected wavelength fixed until the switching point. Thereby, the three-dimensional shape of the surface layer is measured by one selected wavelength. When the position in the Z direction moves below the switching point, measurement is performed by switching to a different wavelength. Further, not only the surface of the uppermost layer but also a wavelength switching point for the lower layer may be set. Of course, wavelength switching points may be set for a plurality of layers. The switching point is preferably set with a margin so that the shape of the entire surface layer can be measured. Setting the wavelength switching point eliminates the need to acquire detection data for all wavelengths. Thereby, measurement time can be shortened. The setting of the wavelength switching point is particularly effective for the sample 23 having a flat layer. That is, the selected wavelength for measuring the shape of the layer can be a single selected wavelength. Therefore, it is not necessary to switch a plurality of wavelengths to acquire detection data in order to measure the shape of the layer, and the measurement time can be shortened. Furthermore, when the number of selected wavelengths is large, the effect of shortening the measurement time by setting the wavelength switching point is great.

  By setting the wavelength switching point in at least one layer of the sample 23, the measurement time can be shortened. If the wavelength switching point is not set, the Z-direction scanning step (step S103) and the wavelength switching point setting step (step S104) may not be performed.

  Next, detection data is acquired for the set scanning range (step S105). Here, scanning by the multi-slit 14 and scanning in the Z direction by the stage 24 are performed, and detection data during that time is sequentially stored in the memory of the processing device 33. Furthermore, when it is desired to perform measurement over a wider range, the detection data is acquired by moving the stage 24 in the XY directions. At this time, the wavelength is switched according to the wavelength switching point. That is, when the position of the stage 24 in the Z direction becomes the set wavelength switching point, the selected wavelength is switched. Thereby, detection data for the entire setting range can be acquired.

  When no wavelength switching point is set, detection data is acquired using a plurality of selected wavelengths in each slice. At this time, the detection data can be acquired in an arbitrary order. For example, the detection data is measured by moving the position in the Z direction while fixing the selected wavelength. In this case, after acquiring detection data of the scanning range in the Z direction, the selected wavelength is switched. Alternatively, the selected wavelength may be switched while the position in the Z direction is fixed. In this case, when the detection data of all the selection wavelengths are acquired, the position in the Z direction is changed. In any procedure, similar detection data can be acquired. Of course, the order is not limited to the above.

  The in-focus position is calculated from the detection data acquired in this way (step S106). As described above, the in-focus position is calculated for all the pixels of the CCD camera 28. Further, a focal point position is calculated for each of a plurality of selected wavelengths. When the position of the stage 24 in the XY direction is moved, the focal point position is calculated for each moved position. That is, the in-focus position at each position in the XY direction is calculated. When the position of the stage 24 in the XY direction is moved, a part of the incident position of the illumination light may overlap before and after the movement. Thereby, the alignment in the height direction can be performed at the position where the incident positions overlap. That is, the deviation in the height direction due to the movement of the stage 24 can be corrected. The processing device 33 stores the focal position calculated for each wavelength in association with the pixel.

  Next, a three-dimensional shape is constructed based on the calculated in-focus position (step S107). That is, the shape of each layer of the laminated structure is determined by the focal position based on different wavelengths. Then, a three-dimensional shape is constructed by overlapping the shapes of the layers. In the layer where the wavelength switching point is set, the shape is determined by the height at the wavelength. In the layer where the wavelength switching point is not set, a suitable wavelength is selected based on the detected light intensity. Then, the layer shape is determined from the height at the selected wavelength. In this way, the three-dimensional shape is obtained by obtaining the three-dimensional shape of each layer of the laminated structure.

  A three-dimensional image is displayed based on the three-dimensional shape thus constructed (step S108). For example, the three-dimensional shape of the sample 23 viewed from a predetermined angle is displayed on the display screen. This display image can be operated in various ways by the GUI. For example, the elevation angle, rotation angle, scale, range, etc. of the three-dimensional image can be changed. Further, the cross-sectional information at an arbitrary position may be displayed as a graph simultaneously or separately with the three-dimensional image. Furthermore, the film thickness, the interval, and the like may be measured by aligning the cursor with the upper layer and lower layer profile data appearing in the cross-sectional graph. Of course, the display method is not limited to the above. Thus, the surface shape is measured at a different wavelength for each layer, and the surface shape of each layer is synthesized. Thereby, not only the surface layer but also the shape of the lower layer can be displayed.

  In the above description, the measurement apparatus having the slit confocal optical system has been described, but the present invention is not limited to this. For example, a confocal optical system using a pinhole or the like and a point light source may be used. In the above description, the stage 24 is moved in the vertical direction and the focal position of the objective lens 22 is scanned along the optical axis. However, the present invention is not limited to this. For example, the focal position may be scanned by moving the objective lens 22. The illumination position scanning for scanning the position of the illumination light on the sample is not limited to that by the multi slit 14. For example, beam scanning such as a galvano mirror or stage scanning can be used as scanning means for scanning the position of illumination light. Further, when a slit confocal optical system is configured, light from the light source 11 may be converted into linear illumination light 35 using a cylindrical lens. In addition, the sample 23 should just be a laminated structure comprised from 2 or more types of different materials.

  The position of the wavelength switching mechanism 30 is not limited to the position between the lens 12 and the light source 11, and may be another position. That is, it suffices if it is in the optical path between the light source 11 and the CCD camera 28. For example, the wavelength of the reflected light can be switched by disposing it in front of the CCD camera 28. Further, the wavelength switching mechanism 30 is not limited to one constituted by a plurality of wavelength filters. For example, the wavelength switching mechanism 30 may be configured by a spectroscope or the like. A plurality of monochromatic light sources may be arranged and used by switching each. A wavelength-variable light source or filter may be used. Even in such a configuration, the wavelength can be selected. Furthermore, a detector in which a filter is formed in front of each pixel of the light receiving element, such as a color CCD camera, may be used. When a general color CCD camera is used, R, G, and B color filters are formed in front of each light receiving element as a pixel. Therefore, the color CCD camera can simultaneously detect detection signals corresponding to the three wavelengths. Then, the processing device 33 calculates the peak of the detected light intensity in the Z direction for each pixel. In other words, all the detection lights of R, G, and B are detected, and the wavelength for calculating the in-focus position by the processing device 33 is selected. Thereby, the height of each layer is detected by a different color, and a three-dimensional shape can be measured. By using such a color CCD camera, the wavelength can be selected with a simple configuration. Furthermore, since three wavelengths can be measured simultaneously, the measurement time can be shortened. Thus, in the three-dimensional shape measuring apparatus according to the present invention, the wavelength switching mechanism 30 can use various configurations. That is, the wavelength switching mechanism 30 is not limited to a hardware configuration, and can be realized by a configuration combining a hard wafer and a soft wafer. That is, it is only necessary that the wavelength of the illumination light corresponding to the detection signal can be selected when the processing device 33 calculates the in-focus position.

It is a figure which shows the structure of the three-dimensional shape measuring apparatus concerning this invention. It is a figure which shows typically the structure of the multi slit in the three-dimensional shape measuring apparatus of this invention. It is a front view which shows the structure of the multi slit in the three-dimensional shape measuring apparatus of this invention. It is a front view which shows the structure of the wavelength filter used for the wavelength switching mechanism in the three-dimensional shape measuring apparatus of this invention. It is a perspective view which shows the structure of the sample which is a measuring object in the three-dimensional shape measuring apparatus of this invention. It is sectional drawing which shows the structure of the sample which is a measuring object in the three-dimensional shape measuring apparatus of this invention. It is a figure which shows the relationship between the position of a Z direction, and the intensity | strength of detection light in the three-dimensional shape measuring apparatus of this invention. It is a block diagram which shows the structure of the processing apparatus in the three-dimensional shape measuring apparatus of this invention. It is a flowchart which shows the measurement procedure in the three-dimensional shape measuring method of this invention.

Explanation of symbols

1 three-dimensional shape measuring device, 11 light source, 12 lens, 13 infrared cut filter,
14 multi slits, 15 prisms, 16 voice coil motors,
17 mirror, 19 2 group lens, 20 beam splitter,
21 beam splitter, 22 objective lens, 23 sample, 23a first layer,
23b 2nd layer, 23c substrate, 24 stage, 25 2 group lens, 26 mirror,
28 CCD camera, 30 wavelength switching mechanism, 31 wavelength filter, 32 rotation mechanism,
33 processing device, 34 stage drive mechanism, 35 illumination light,
40 lens, 41 two-divided photodiode, 45 light-receiving surface of two-divided photodiode 51 slit part, 51 rectangular pattern, 53 slit, 54 light-shielding part,
70 stage control unit, 71 VCM control unit, 72 wavelength selection unit,
73 detection data storage unit, 75, in-focus position calculation unit, 76 aberration correction unit,
77 Refractive Index Correction Unit, 78 3D Shape Construction Unit, 79 Display Unit

Claims (11)

A three-dimensional shape measuring apparatus for measuring a three-dimensional shape of a sample having at least a lower layer and an upper layer provided on the lower layer,
A light source that emits illumination light for illuminating the sample;
An objective lens that focuses the illumination light from the light source on the sample;
A focal position scanning means for scanning a focal position of the objective lens with respect to the sample along an optical axis;
Vertical scanning means for scanning the focal position of the illumination light on the sample in a direction perpendicular to the optical axis;
A detector for detecting reflected light reflected by the sample via a confocal optical system;
In-focus position calculation means for calculating a focus position based on detection light detected by the detector when the focus position is scanned by the focus position scanning means;
Wavelength selecting means for selecting a wavelength of the detection light used for calculating the in-focus position by the in-focus position calculating means;
3D shape constructing means for constructing a 3D shape based on a change in the in-focus position when the focal position is scanned in a direction perpendicular to the optical axis by the vertical scanning means, the upper surface of the upper layer and the lower layer A three-dimensional shape constructing means for constructing a three-dimensional shape with the upper surface of the light source on the basis of detection lights having different wavelengths selected by the selecting means;
A three-dimensional shape measuring apparatus comprising: a display unit that performs display based on a three-dimensional shape of the upper surface of the upper layer and the upper surface of the lower layer constructed by the three-dimensional shape constructing unit.   The wavelength selection means selects a first wavelength that is transmitted through the upper layer, and constructs a three-dimensional shape of the interface between the upper layer and the lower layer based on the detection light of the first wavelength. The three-dimensional shape measuring apparatus according to claim 1, according to claim 1. The wavelength selection means is provided in the optical path of the illumination light or reflected light, and has a wavelength filter that changes the wavelength of light transmitted according to the incident position of the light,
The wavelength of the detection light is selected by switching the wavelength of the illumination light or reflected light to a different wavelength by moving the incident position of the illumination light or reflected light with respect to the wavelength filter. Three-dimensional shape measuring device.   4. The three-dimensional shape measuring apparatus according to claim 1, further comprising a refractive index correction unit that corrects a focal position calculated by the focal position calculation unit based on a refractive index of the second layer.   5. The three-dimensional image according to claim 1, further comprising an aberration correction unit that corrects the in-focus position calculated by the in-focus position calculation unit based on the aberration of the optical system of the three-dimensional shape measuring apparatus. Shape measuring device. A three-dimensional shape measuring method for measuring a three-dimensional shape of a sample having at least a lower layer and an upper layer provided on the lower layer,
Condensing and illuminating the sample with illumination light;
Detecting reflected light reflected by the sample through a confocal optical system;
Scanning the focal position of the illumination light with respect to the sample along the optical axis;
Scanning the focal position of the illumination light on the sample in a direction perpendicular to the optical axis;
Based on the detection light detected in the detecting step, calculating a focal position when the focal position of the illumination light is moved along the optical axis;
Selecting the wavelength of the detection light used to calculate the in-focus position in the step of calculating the in-focus position; and
A step of constructing a three-dimensional shape based on a change in the in-focus position when the illumination position is scanned by the step of scanning the focal position of the illumination light in a direction perpendicular to the optical axis, the upper surface of the upper layer; Constructing a three-dimensional shape with the upper surface of the lower layer based on detection lights of different wavelengths selected by the selection means;
And a step of performing display based on the three-dimensional shape of the upper surface of the upper layer and the upper surface of the lower layer constructed in the step of constructing the three-dimensional shape. In the step of selecting the wavelength, a first wavelength that is transmitted through the upper layer is selected,
The three-dimensional shape measurement method according to claim 6, wherein the three-dimensional shape of the interface between the lower layer and the upper layer is constructed based on a focal point position calculated by the detection light of the first wavelength.   The three-dimensional shape measuring method according to claim 6 or 7, wherein, in the step of selecting the wavelength, a desired wavelength is selected by switching a wavelength of illumination light or reflected light. Further comprising a step of setting a switching position for switching the selected wavelength in the direction along the optical axis;
In the step of scanning the focal position along the optical axis, scanning is performed with the selected wavelength fixed to the second wavelength reflected on the surface of the upper layer on the objective lens side from the switching position. The three-dimensional shape measuring method according to claim 6, 7 or 8.   10. The three-dimensional shape measuring method according to claim 6, further comprising a step of correcting the in-focus position calculated in the step of calculating the in-focus position based on a refractive index of the second layer. . The three-dimensional shape measurement method according to claim 6, further comprising a step of correcting the in-focus position calculated in the step of calculating the in-focus position based on an aberration of an optical system.

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