JP2006233256A - Mask clamp-moving mechanism, and film deposition apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mask clamp-moving mechanism to divide the movement of a mask clamp into a plurality of portions, and a film deposition apparatus having the mechanism. <P>SOLUTION: In a moving mechanism of a mask clamp 20 in a film deposition apparatus for manufacturing an organic EL element, the moving mechanism of the mask clamp 20 comprises a chuck 16 which is arranged facing an evaporation source 14 of an organic material 12 while a substrate overlaps a mask 34, the mask clamp 20 which has a tip part 20a in a hook shape, and retains the mask 34 overlapping the chuck 16 by the tip part 20a, and an expansion means 22 to move a substrate clamp 18. In the expansion means 22, a first expansion means 24 is arranged on an apparatus body 11, a first rod to perform the expansion/contraction is connected to a plate member 23, a second expansion means 26 is arranged on the plate member 23, and a second rod to perform the expansion/contraction is connected to or brought into contact with a base end of the substrate clamp 18. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a mask clamp moving mechanism and a film forming apparatus, and more particularly to a mask clamp moving mechanism used in a film forming apparatus for manufacturing an organic EL element.

  For example, a vacuum deposition apparatus is used as a film forming apparatus for manufacturing an organic EL (Electroluminescent) element. FIG. 8 is an explanatory view of the upper part of the vacuum deposition apparatus. The vacuum evaporation apparatus 1 is provided with an evaporation source (not shown) of an organic material at the bottom, and a chuck 2 is provided at the upper part of the apparatus facing the evaporation source. The chuck 2 is a flat plate that keeps the glass substrate 3 flat, and can be rotated by a rotation mechanism provided outside the apparatus main body. A mask clamp 4 for holding the mask is provided around the chuck 2 so as to be movable up and down. The mask has an opening pattern for forming an organic EL element pattern (pixel) on the surface of the glass substrate 3.

  The mask clamp 4 has an upper end protruding outside the apparatus main body, and a connection member 5 is disposed at the upper end. A cylinder 6 is provided below the connection member 5, one of which is connected to the upper part of the apparatus main body and the other is connected to the plate member 7. The plate member 7 is provided so as to be in contact with the connection member 5. As the plate member 7 moves up and down due to the expansion and contraction of the cylinder 6, the connection member 5 moves up and down, and the mask clamp 4 moves up and down.

  In addition, the literature disclosed about moving a mask clamp up and down by the expansion-contraction operation | movement of a cylinder is unknown.

  The upper and lower range of the mask clamp is a position where the upper limit is in contact with the glass substrate, and the lower limit is a position where the lower limit is not in contact with the substrate transport mechanism. This substrate transport mechanism inserts a glass substrate from the outside of the vacuum deposition apparatus and places it on the substrate clamp, and takes out the glass substrate on which the pattern is formed to the outside of the apparatus. Accordingly, since the mask clamp and the substrate transport mechanism do not come into contact with each other, the cylinder stroke for moving the mask clamp up and down needs to be large.

  By the way, after the glass substrate is inserted into the apparatus and mounted and fixed on the chuck, the mask and the glass substrate are aligned in order to form a pattern of the organic EL element at a predetermined position of the glass substrate. This alignment is performed at a slight distance because it is sufficient that the mask placed on the alignment arm and the glass substrate do not contact each other, that is, the distance may be as small as possible.

  At the time of this alignment, the mask clamp that fixes the mask uses an air cylinder that cannot adjust the stroke. Then, a long distance is moved until the mask is fixed on the glass substrate. Therefore, since it takes a lot of time to move a long distance, the manufacturing speed is slow and the manufacturing efficiency is low.

  Further, the glass substrate is rotated in the horizontal direction in order to make the thickness of the organic thin film formed on the glass substrate uniform within the substrate surface. Therefore, in order to rotate the glass substrate, the chuck, the mask, the mask holder, and the like must be rotated. Therefore, the rotating mechanism must be disposed on the upper part of the vacuum deposition apparatus. However, since the vacuum vapor deposition apparatus is complicatedly connected with wiring for driving each mechanism provided in the apparatus, a mechanism for dividing the mask clamp in multiple stages on the axis of the rotation mechanism is provided. It was considered difficult.

An object of this invention is to provide the moving mechanism of the mask clamp which divides | segments the moving amount | distance of a mask clamp into plurality.
Another object of the present invention is to provide a film forming apparatus having a mask clamp moving mechanism.

In order to achieve the above object, a mask clamp moving mechanism according to the present invention is a mask clamp moving mechanism in a film forming apparatus for manufacturing an organic EL element, and is arranged to face an evaporation source of an organic material. A chuck on which the substrate and the mask are overlaid, a mask clamp for holding the mask overlaid on the chuck, and an expansion / contraction means for moving the substrate clamp, wherein the expansion / contraction means includes the first expansion / contraction means. A first rod that performs expansion / contraction operation is connected to the plate member, a second expansion / contraction means is disposed on the plate member, and a second rod that performs expansion / contraction operation is connected to the base end of the substrate clamp. It is characterized by being connected or in contact with the part.
In this case, the expansion / contraction means can be an air cylinder, a hydraulic cylinder or an actuator.

  The film forming apparatus according to the present invention is a film forming apparatus for manufacturing an organic EL element, and is provided with a chuck for holding a substrate facing an organic material supply source, and the pattern of the organic EL element. A mask clamp serving as a holding means for the mask formed on the chuck is disposed so as to be vertically movable along a side edge of the chuck, and an expansion / contraction means is disposed under the base end portion of the mask clamp, The apparatus main body is provided with a rotation mechanism for rotating the mask clamp and the expansion / contraction means in the horizontal direction.

  In addition, the extending and retracting means arranged in an overlapped manner is connected to the first main expanding and contracting means in which one end is connected to the apparatus body and the first rod is connected to the plate member, and the second rod is connected to the plate member. And a second expansion / contraction means connected to or in contact with the member.

  In the movement mechanism of the mask clamp, when the expansion / contraction means expands / contracts, the connecting member connected to or in contact with the expansion / contraction means moves up and down. That is, when at least one of the first expansion / contraction means and the second expansion / contraction means is expanded / contracted, the mask clamp is also moved up and down in accordance with this operation. Therefore, if the expansion / contraction operation of each expansion / contraction means is controlled independently, the movement amount of the mask clamp can be divided into two stages.

The expansion / contraction operation of the expansion / contraction means can be performed by extending / contracting a cylinder rod provided in the air cylinder, hydraulic cylinder or actuator.
Then, during the manufacture of the organic EL element, the first expansion / contraction means is extended while the second expansion / contraction means is contracted during the positioning of the mask and the substrate, and after the positioning is completed, the first expansion / contraction means and the second expansion / contraction means are extended, Since the amount of movement of the mask clamp after completion of positioning is shortened, the manufacturing time of the organic EL element can be shortened.

  The best mode of the mask clamp moving mechanism and film forming apparatus according to the present invention will be described below. In the following, an embodiment using a vacuum vapor deposition apparatus as a film forming apparatus will be described. FIG. 1 is an explanatory diagram of a vacuum deposition apparatus. FIG. 2 is a schematic plan view of the mask clamp. The vacuum evaporation apparatus 10 includes an evaporation source 14 (sublimation source) of the organic material 12 at the bottom of the apparatus main body 11, and a chuck 16, a substrate clamp 18, a mask clamp 20, an expansion / contraction means 22, and a mask clamp at the top of the apparatus main body 11. It is the structure provided with 28 grade | etc.,.

  Specifically, the evaporation source 14 of the organic material 12 includes a crucible 14a in which the organic material 12 is placed, and a heater 14b that heats and evaporates (sublimates) the organic material 12 is provided on the outer surface of the crucible 14a. . Further, the chuck 16 provided on the inner upper side of the apparatus main body 11 is a flat plate arranged in the horizontal direction so as to face the crucible 14a. The chuck 16 can be horizontally rotated by a rotation mechanism 30 provided on the outer upper portion of the apparatus main body 11.

  The substrate clamp 18 extends downward from the upper part of the apparatus main body 11, and has a vertical shape in which a lower end 18 c is bent toward the chuck 16 side (center side of the vacuum deposition apparatus 10). A plurality are arranged along the edge. The substrate clamp 18 is set so that the tip portions 18c have the same height (in the same plane) in order to support the edge portion of the glass substrate 32 at the tip portion 18c (bending portion). The substrate clamp 18 can be moved up and down by an elevating mechanism (not shown) provided on the outer upper portion of the apparatus main body 11 while maintaining the state in which the tip portions 18c are in the same plane. When the substrate clamp 18 is raised, the glass substrate 32 can be brought into contact with the chuck 16 and mounted and held in a flat shape.

  The mask clamp 20 is a saddle type that extends downward from the upper part of the apparatus main body 11 and has a lower tip 20a bent toward the chuck 16 (center side of the vacuum deposition apparatus 10). A plurality are arranged along the side edge of the clamp 18. The mask clamp 20 is set so that the lower tip portions 20a have the same height (in the same plane) in order to support the edge portion of the mask 34 with the lower tip portion 20a (folded portion). . The mask 34 includes a mask film 34a provided with a plurality of opening patterns corresponding to each pixel of the organic EL element, and a frame-shaped mask frame 34b that holds the peripheral edge of the mask film 34a.

  Further, the upper end portion 20b above the mask clamp 20 protrudes outside the apparatus main body 11, and a connecting member 20c is disposed at each upper end portion 20b. The upper tip 20b and the connecting member 20c are the base end of the mask clamp 20. By moving the connecting member 20c up and down, each mask clamp 20 connected to the connecting member 20c is moved up and down. As a result, it is possible to move up and down while maintaining the state in which the tip portions 20a provided below the mask clamp 20 are in the same plane.

  Further, below the connection member 20c, an expansion / contraction means 22 for moving the connection member 20c up and down is provided. That is, the connecting member 20c and the expansion / contraction means 22 are disposed to face each other. The expansion / contraction means 22 includes a first expansion / contraction means 24 and a second expansion / contraction means 26. The first expansion / contraction means 24 and the second expansion / contraction means 26 may be, for example, an air cylinder, a hydraulic cylinder, an actuator, or the like. When an air cylinder is used, maintenance is easy. One end of the first expansion / contraction means 24 is connected to the upper part of the apparatus main body 11, and the other end 24 a is connected to the plate member 23. More specifically, a plurality of first expansion / contraction means 24 (cylinder main body) are arranged on the outer upper part of the apparatus main body 11 along the rotation direction of the chuck 16, and each other end 24 a (first rod) is connected to the plate. In this configuration, the members 23 are connected. The plate member 23 is moved up and down in accordance with the expansion / contraction operation of the first expansion / contraction means 24.

  The plate member 23 is provided with second expansion / contraction means 26, and the other end 26a is connected to or in contact with the connection member 20c. More specifically, the plurality of second expansion / contraction means 26 (cylinder main body) is disposed below the plate member 23, and the other end 26 a (second rod) is a hole provided in the plate member 23. It extends upward via (not shown), and its tip is connected to or in contact with the connecting member 20c. The connection member 20c is moved up and down in accordance with at least one of the second expansion / contraction means 26 and the first expansion / contraction means 24.

  The substrate clamp 18, the mask clamp 20, and the expansion / contraction means 22 can be rotated together with the chuck 16 by a rotation mechanism 30 provided on the outer upper part of the apparatus main body 11.

  The mask clamp 28 is disposed between the chuck 16 and the evaporation source 14 so as to face the chuck 16, and the configuration thereof corresponds to the edge of the mask 34 (mask frame 34 b), and is on the side of the mask 34. It has the extended part 28a extended from the direction, and the fitting pin 28b provided in the front-end | tip part of this extended part 28a. More specifically, the extending portion 28a supports the edge of the mask 34, is disposed at a position where the mask clamp 20 is sandwiched along the side edge of the chuck 16, and is formed in a bowl shape. It extends from the outside of the mask 34 to the edge of the mask 34 along the tip of the clamp 20. A fitting pin 28b that fits into the fitting hole 34c of the mask 34 is provided at the tip of the extended portion 28a. In some embodiments, a fitting hole may be provided at the tip of the extended portion 28a, and a fitting pin may be provided on the mask 34. Further, the base end portions of the extending portions 28a arranged so as to sandwich one mask clamp 20 from both sides are connected to each other. In the form shown in FIG. 2, the extending portion 28 a extends from the outside of the mask 34 so as to support each corner portion of the mask 34. Since the mask clamp 28 is at the reference position with respect to the vacuum deposition apparatus 10, when the mask 34 is placed on the mask clamp 28 so that the fitting hole 34c and the fitting pin 28b are fitted, the mask 34 is placed in the vacuum deposition apparatus 10. Is positioned with respect to.

  Next, the operation of the moving mechanism of the mask clamp 20 and the operation of the vacuum deposition apparatus 10 will be described. Hereinafter, the chuck 16, the substrate clamp 18, the mask clamp 20, and the mask clamp 28 may be referred to as an apparatus upper mechanism. FIG. 3 is an explanatory diagram when the apparatus upper mechanism is at the reference position. FIG. 4 is an explanatory diagram of the upper mechanism of the apparatus when the glass substrate and the mask are aligned. FIG. 5 is an explanatory diagram of the upper mechanism of the apparatus after aligning the glass substrate and the mask.

  A mask 34 is disposed on the mask clamp 28 in advance. At this time, since the mask clamp 28 is at the reference position with respect to the vacuum deposition apparatus 10, when the mask 34 is placed so that the fitting pin 28 b and the fitting hole 34 c are fitted, the mask 34 is positioned with respect to the vacuum deposition apparatus 10. Is done. The glass substrate 32 is placed inside the apparatus main body 11 by the substrate transport mechanism and is inserted between the chuck 16 and the mask 34. Then, the glass substrate 32 is moved downward together with the lowering operation of the substrate transport mechanism and placed on the substrate clamp 18 (S100).

  Thereafter, the mask clamp 28 is raised to move the mask 34 upward, and the glass substrate 32 is placed on the mask 34 (S110). The mask clamp 28 continues to be raised until the glass substrate 32 comes into contact with the bottom surface (chuck surface) of the chuck 16 (S120). When the glass substrate 32 is placed on the mask 34, the glass substrate 32 becomes horizontal along the mask 34 and is brought into contact with the chuck 16 while maintaining this horizontal state.

  Thereafter, the substrate clamp 18 is raised until it contacts the glass substrate 32 (S130). Thereby, the glass substrate 32 is mounted and held on the chuck 16 while maintaining the horizontal state by the substrate clamp 18. Then, the mask clamp 28 is lowered to move the mask 34 downward (S140, see FIG. 3). In addition, since the 1st expansion-contraction means 24 and the 2nd expansion-contraction means 26 are contracted during the step of S100-S140, the front-end | tip part 20a below the mask clamp 20 does not contact with the mask 34 or the said board | substrate conveyance mechanism. Absent.

  Thereafter, the alignment between the glass substrate 32 and the mask 34 is performed using the alignment mark provided on the glass substrate 32 and the alignment mark provided on the mask 34 (S150). FIG. 6 is an explanatory diagram of alignment between the glass substrate and the mask. FIG. 6A illustrates the arrangement of the camera, the glass substrate, and the mask. FIG. 6B is an image captured by a camera and shows a case where a positional deviation has occurred. Further, FIG. 6C is an image taken by a camera and shows a case where the positions are correct.

  Specifically, the glass substrate 32 is provided with alignment marks 42 in at least two places. The alignment mark 42 provided on the glass substrate 32 is provided at, for example, the corners of the glass substrate 32 that are opposite to each other. It only has to be done. The shape of the alignment mark 42 provided on the glass substrate 32 may be, for example, a circle, a dot, or a cross.

  The alignment mark 44 provided on the mask 34 may be provided at a position corresponding to the alignment mark 42 provided on the glass substrate 32. The shape may be a dot, a circle, a cross, or the like. If the alignment mark 42 on the glass substrate 32 is round, the alignment mark 44 on the mask 34 may be used as a dot. If the alignment mark 42 on the glass substrate 32 is used as a dot, the alignment mark 44 on the mask 34 is enlarged. What is necessary is just to make it a different circle or a different shape.

  Furthermore, the vacuum deposition apparatus 10 may be provided with a camera 40 that images the alignment mark 42 provided on the glass substrate 32 and the alignment mark 44 provided on the mask 34 (see FIG. 6A).

  Then, while confirming the image captured by the camera 40, X (vertical) of the mask 34 (mask clamp 28), so that the point of the alignment mark 44 (42) enters the circle of the alignment mark 42 (44). When the Y (horizontal) and θ (rotation) directions are adjusted, the alignment between the glass substrate 32 and the mask 34 is completed (see FIGS. 6B and 6C). When aligning the glass substrate 32 and the mask 34, the mask 34 is positioned with respect to the vacuum deposition apparatus 10, so that the alignment mark 44 of the mask 34 surely enters the field of view of the camera 40.

  While the mask 34 and the glass substrate 32 are positioned as described above, the first expansion / contraction means 24 is extended to raise the mask clamp 20 (see S160, FIG. 4). As a result, the lower end of the mask clamp 20 is raised. The lower tip when the first expansion / contraction means 24 is extended is below the mask 34 on which the positioning operation is performed.

  When the steps of S150 and S160 are completed, the second extension means 26 is extended to raise the mask clamp 20 (S170, see FIG. 5). Specifically, when the lower tip 20a of the mask clamp 20 is raised, the mask 34 is transferred from the mask clamp 28 to the mask clamp 20, and when the lower tip 20a is further raised, the mask 34 is made of glass. The substrate 32 is covered. Then, when the mask 34 is placed on the glass substrate 32, the lower tip 20a rises, that is, the second expansion means 26 stops. Note that the upper limit position of the lower tip 20a when the second expansion / contraction means 26 is extended is slightly smaller than the distance from the chuck 16 surface to the lower surface of the mask 34 when the mask 34 is placed on the glass substrate 32 (at least several mm). Suffice to be positioned above.

  Thereafter, the glass substrate 32 and the mask 34 are rotated by the operation of the rotating mechanism 30, and the organic material 12 is heated and evaporated by the heater 14b to form an organic EL element pattern on the glass substrate 32 (S180).

  Thereafter, the first expansion / contraction means 24 and the second expansion / contraction means 26 are contracted, and the mask clamp 20 is lowered (S190). At this time, the mask 34 is moved downward with the lowering of the mask clamp 20, but is replaced in the course of movement from the mask clamp 20 to the mask clamp 28 below the chuck 16. Further, the substrate clamp 18 is also lowered to move the glass substrate 32 downward (S200). Thereafter, the substrate transfer device enters the apparatus main body 11, and the glass substrate 32 is collected (S210). An organic EL element is manufactured by such an operation.

  According to the moving mechanism of the mask clamp 20 and the vacuum deposition apparatus 10 as described above, the first expansion / contraction means 24 and the second expansion / contraction means 26 are provided as the expansion / contraction means 22 for moving the mask clamp 20 up and down. By extending and contracting, the mask clamp 20 can move up and down in two stages. That is, the movement amount of the mask clamp 20 can be divided into two stages. Therefore, the mask clamp 20 is raised by one step during the alignment between the mask 34 and the glass substrate 32, and the distance between the mask 34 and the lower end of the mask clamp 20 is kept slightly, and the mask is moved after the alignment is completed. If the clamp 20 is raised one more stage and the mask 34 is placed on the glass substrate 32, the movement distance of the mask clamp 20 after the alignment is completed can be shortened. Therefore, since the alignment of the mask 34 and the glass substrate 32 and the raising of the mask clamp 20 are simultaneously performed, the manufacturing time of the organic EL element can be shortened and the manufacturing speed can be improved. And the manufacturing efficiency of an organic EL element can be improved.

  The expansion / contraction means 22 has a configuration in which a plate member 23 is connected to the other end 24 a of the first expansion / contraction means 24, and the second expansion / contraction means 26 is disposed on the plate member 23, so that each mechanism ( There is no interference with the wiring for driving the device upper mechanism. Accordingly, the mask clamp 20 can be lifted and lowered in two stages on the axis of the rotation mechanism 30 by the first expansion / contraction means 24 and the second expansion / contraction means 26.

  The mask clamp 20 may be lowered to the lowest point by contracting the first expansion / contraction means 24 and the second expansion / contraction means 26 when the glass substrate 32 is inserted and recovered, or the mask 34 is replaced. In some cases, the second expansion / contraction means 26 may be expanded / contracted and moved up and down with the first expansion / contraction means 24 extended.

  In the present embodiment, the first expansion / contraction means 24 and the second expansion / contraction means 26 are connected to each other up and down via the plate member 23. However, as another embodiment, a plate is further added to the other end 26a of the second expansion / contraction means 26. A member may be connected, a third expansion / contraction means may be disposed on the plate member, and the other end of the third expansion / contraction means may be connected to or contacted with the connection member 20c. That is, the first extension means, the second extension means, and the third extension means can be connected to each other through the plate member, and the mask clamp 20 can be moved up and down in three stages. Furthermore, if the structure which connects a plurality of expansion-contraction means up and down via a plate member is repeated, the mask clamp 20 can be divided | segmented into several steps and can be raised / lowered.

  In the present embodiment, two cameras for aligning the glass substrate and the mask are provided. However, the present invention is not limited to this. That is, three cameras can be provided as shown in FIG. 7A, and four cameras can be provided as shown in FIG. 7B.

  In the present embodiment, the formation of the mask moving mechanism used in the vacuum deposition apparatus 10 has been described. However, the mask moving mechanism is not only used in the vacuum deposition apparatus 10, but also a sputtering apparatus, a vapor phase growth apparatus, or the like. It can also be used for other film forming apparatuses. The substrate is not limited to the glass substrate 32 and may be a substrate made of a material other than glass.

It is explanatory drawing of a vacuum evaporation system. It is a schematic plan view of a mask clamp. It is explanatory drawing when an apparatus upper part mechanism exists in a reference position. It is explanatory drawing of an apparatus upper part mechanism when aligning a glass substrate and a mask. It is explanatory drawing of an apparatus upper part mechanism after aligning a glass substrate and a mask. It is explanatory drawing of position alignment with a glass substrate and a mask. It is a figure explaining the arrangement | positioning position of a camera. It is explanatory drawing of a vacuum evaporation apparatus upper part.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ......... Vacuum vapor deposition apparatus, 11 ......... System unit, 16 ......... Chuck, 18 ......... Substrate clamp, 20 ......... Mask clamp, 20c ......... Connecting member, 22 ...... Expandable means, 23 ..... Plate member, 24 ..... First telescopic means, 26 .... Second telescopic means, 28 ..... Mask clamp, 32 .... Glass substrate, 34 ..... Mask, 40 .... Camera.

Claims (4)

A moving mechanism of a mask clamp in a film forming apparatus for manufacturing an organic EL element,
A chuck disposed opposite to the evaporation source of the organic material, and the substrate and the mask are overlaid;
A mask clamp for holding the mask superimposed on the chuck;
A telescopic means for moving the substrate clamp,
The expansion / contraction means arranges the first expansion / contraction means on the apparatus main body, connects the first rod that performs expansion / contraction operation to the plate member, and arranges the second expansion / contraction means on the plate member and performs expansion / contraction operation. A second rod is connected or brought into contact with the base end of the substrate clamp;
A mechanism for moving the mask clamp.   2. The mask clamp moving mechanism according to claim 1, wherein the expansion / contraction means is an air cylinder, a hydraulic cylinder, or an actuator. A film forming apparatus for manufacturing an organic EL element,
A chuck for holding the substrate is disposed opposite the organic material supply source,
A mask clamp serving as a holding means for the mask on which the pattern of the organic EL element is formed is disposed so as to be vertically movable along the side edge of the chuck,
Extending and disposing expansion / contraction means on the lower part of the base end of the mask clamp,
A rotation mechanism that rotates the chuck, the mask clamp, and the expansion / contraction means in a horizontal direction is provided in the apparatus body.
A film forming apparatus. The expansion and contraction means arranged in an overlapping manner,
A first extending / contracting means having one end connected to the apparatus body and a first rod connected to the plate member;
A second expansion / contraction means disposed on the plate member and connecting or contacting the second rod to the connection member;
The film forming apparatus according to claim 3, further comprising:

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