JP2006210570A - Adjusting method and exposure apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an adjusting method for smoothly adjusting a location of an object with higher working ability. <P>SOLUTION: The standard plate 50 is carried to an attracting part of a movable measuring stage ST2, and location of the standard plate 50 is adjusted by sliding the standard plate 50 on the attractor with an inertia force generated when the measuring stage ST2 is driven. In this timing, the standard mark provided on the standard plate 50 is detected using the alignment system of the exposure apparatus in view of adjusting the amount of slide by controlling the drive of the measuring stage ST2 on the basis of the detected results. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an adjustment method for adjusting the position of an object and an exposure apparatus that exposes a pattern on a substrate.

  In a photolithography process that is one of the manufacturing processes of microdevices such as semiconductor devices and liquid crystal display devices, an exposure apparatus that projects and exposes a pattern formed on a mask onto a photosensitive substrate is used. This exposure apparatus has a mask stage for supporting a mask and a substrate stage for supporting a substrate, and projects the mask pattern onto the substrate via a projection optical system while sequentially moving the mask stage and the substrate stage. is there. In the manufacture of microdevices, miniaturization of patterns formed on a substrate is required in order to increase the density of devices. In order to meet this demand, it is desired to further increase the resolution of the exposure apparatus. As one means for realizing the high resolution, an immersion exposure apparatus has been devised, which is disclosed in Patent Document 1 below, which performs exposure processing in a state where the optical path space of exposure light is filled with liquid. Has been.

Also, recently, as disclosed in Patent Document 2 below, a measuring instrument is provided that can move independently of the substrate stage and measures the state of exposure light and the imaging characteristics of the projection optical system. An exposure apparatus having the above-described measurement stage has been devised. In the case of a configuration equipped with a measurement stage, the substrate stage only needs to have the minimum functions necessary for substrate exposure, so that the substrate stage can be reduced in size and weight, and the substrate stage is driven. The drive device can be downsized and the amount of heat generated by the drive device can be reduced.
International Publication No. 99/49504 Pamphlet Japanese Patent Laid-Open No. 11-135400

  For example, a configuration in which exposure light is irradiated to a measuring instrument in an exposure apparatus can be considered. In that case, a specific member (object) among a plurality of members constituting the measuring instrument may change the performance of the object due to exposure light irradiation or a change with time. For this reason, it may be necessary to remove the object from the stage and replace it with a new one, or to perform maintenance.

  When a new object (or an object after maintenance) is attached to the stage, it is necessary to adjust the position of the object. However, in the configuration where the attachment work (position adjustment work) is performed by an operator, the position reproducibility of the object is improved. It can be difficult to maintain. Further, since various devices and members are provided around the stage, working efficiency is low in a configuration in which the attachment work (position adjustment work) is performed by an operator, and the operation rate of the exposure apparatus may be reduced.

  The present invention has been made in view of such circumstances, and an object thereof is to provide an adjustment method capable of smoothly adjusting the position of an object with good workability. It is another object of the present invention to provide an exposure apparatus that can smoothly adjust the position of an object with good workability.

  In order to solve the above-described problems, the present invention employs the following configurations corresponding to the respective drawings shown in the embodiments. However, the reference numerals with parentheses attached to each element are merely examples of the element and do not limit each element.

  According to the first aspect of the present invention, in the adjustment method for adjusting the position of the object (50), the object (50) is transported to the holding unit (100, 60) of the movable stage (ST2), and the stage ( An adjustment method for adjusting the position of the object (50) by driving ST2) and sliding the object (50) on the holding unit (60) is provided.

  According to the first aspect of the present invention, by driving the stage, the position of the object can be smoothly adjusted on the stage with good workability.

  According to the second aspect of the present invention, in an exposure apparatus that exposes a pattern to a substrate (P) through a liquid (LQ), the first stage (ST1) that holds and moves the substrate (P), and the substrate The second stage (ST2) that moves the object (50) different from (P), and when positioning the object (50) on the second stage (ST2), the second stage (ST2) is driven to move the object ( 50) an exposure apparatus (EX) comprising a control device (CONT) for sliding.

  According to the second aspect of the present invention, the second stage can be driven to smoothly adjust the position of the object on the second stage with good workability.

  According to the present invention, the position of an object can be smoothly adjusted on the stage with good workability.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto.

<Exposure device>
First, an embodiment of an exposure apparatus according to the present invention will be described with reference to FIG. FIG. 1 is a schematic block diagram showing an embodiment of the exposure apparatus EX.

  In FIG. 1, an exposure apparatus EX includes a mask stage MST that holds and moves a mask M, a substrate holder PH that holds a substrate P, and moves and moves while holding a substrate P. A measurement stage ST2 that moves by mounting a measuring instrument that performs measurement, an illumination optical system IL that illuminates the mask M on the mask stage MST with the exposure light EL, and a pattern image of the mask M that is illuminated with the exposure light EL. A projection optical system PL that projects and exposes the substrate P on ST1 and a control device CONT that controls the overall operation of the exposure apparatus EX are provided. Each of the substrate stage ST1 and the measurement stage ST2 is movable independently of each other on the base member BP on the image plane side of the projection optical system PL.

  The exposure apparatus EX of the present embodiment is an immersion exposure apparatus to which an immersion method is applied in order to substantially shorten the exposure wavelength to improve the resolution and substantially widen the depth of focus. An immersion apparatus 1 is provided for forming an immersion region LR of the liquid LQ on the image plane side of the PL. The liquid immersion device 1 is provided in the vicinity of the image plane side of the projection optical system PL. The nozzle member 70 includes a supply port 12 for supplying the liquid LQ and a recovery port 22 for recovering the liquid LQ. The liquid supply unit 11 that supplies the liquid LQ to the image plane side of the projection optical system PL via the supply port 12 and the supply tube 13, and the projection optical system via the recovery port 22 and the recovery tube 23 provided in the nozzle member 70. And a liquid recovery unit 21 that recovers the liquid LQ on the image plane side of the PL. The nozzle member 70 is formed in an annular shape so as to surround the image plane side tip of the projection optical system PL. The liquid immersion device 1 transfers at least a part of the pattern on the mask M onto the substrate P onto the substrate P including the projection area AR of the projection optical system PL by the liquid LQ supplied from the liquid supply unit 11. Then, an immersion region LR of the liquid LQ that is larger than the projection region AR and smaller than the substrate P is locally formed. Specifically, the exposure apparatus EX includes a lower surface of the first optical element LS1 closest to the image plane of the projection optical system PL and a part of the upper surface Pa of the substrate P disposed on the image plane side of the projection optical system PL. A local liquid immersion method that fills the optical path space of the exposure light EL between the liquid LQ and the substrate with the exposure light EL that has passed through the mask M via the liquid LQ forming the liquid immersion region LR and the projection optical system PL. By irradiating P, the pattern of the mask M is projected and exposed onto the substrate P. The control device CONT supplies a predetermined amount of the liquid LQ from the liquid supply unit 11 onto the substrate P, and collects a predetermined amount of the liquid LQ on the substrate P by the liquid recovery unit 21, thereby allowing the liquid LQ on the substrate P to be liquid. The immersion region LR is locally formed.

  In the present embodiment, the exposure apparatus EX is a scanning exposure apparatus (so-called so-called exposure apparatus EX) that exposes the pattern formed on the mask M onto the substrate P while synchronously moving the mask M and the substrate P in different directions (reverse directions) in the scanning direction. A case where a scanning stepper) is used will be described as an example. In the following description, the synchronous movement direction (scanning direction) of the mask M and the substrate P in the horizontal plane is the Y-axis direction, the direction orthogonal to the Y-axis direction in the horizontal plane is the X-axis direction (non-scanning direction), the Y-axis, and A direction perpendicular to the X-axis direction and coincident with the optical axis AX of the projection optical system PL is defined as a Z-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively. Here, the “substrate” includes a substrate in which a photosensitive material (resist) is coated on a base material such as a semiconductor wafer, and the “mask” includes a reticle on which a device pattern to be reduced and projected on the substrate is formed.

The illumination optical system IL illuminates a predetermined illumination area on the mask M with the exposure light EL having a uniform illuminance distribution. The exposure light EL emitted from the illumination optical system IL is emitted from, for example, a mercury lamp. Luminous lines (g-line, h-line, i-line), far-ultraviolet light (DUV light) such as KrF excimer laser light (wavelength 248 nm), ArF excimer laser light (wavelength 193 nm), F ₂ laser light (wavelength 157 nm), etc. Vacuum ultraviolet light (VUV light) or the like is used. In this embodiment, ArF excimer laser light is used.

  In the present embodiment, pure water is used as the liquid LQ. Pure water is not only ArF excimer laser light, but also, for example, far ultraviolet light (DUV light) such as emission lines (g-line, h-line, i-line) emitted from a mercury lamp and KrF excimer laser light (wavelength 248 nm). It can be transmitted.

  Mask stage MST is movable while holding mask M. The mask stage MST holds the mask M by, for example, vacuum suction. The mask stage MST is in a plane perpendicular to the optical axis AX of the projection optical system PL in a state where the mask M is held by driving a mask stage driving device MD including a linear motor controlled by the control device CONT, that is, XY. It can move two-dimensionally in the plane and can rotate slightly in the θZ direction.

  A movable mirror 31 is provided on the mask stage MST. In addition, a laser interferometer 32 that detects the position of the mask stage MST in cooperation with the movable mirror 31 is provided at a position facing the movable mirror 31. In FIG. 1, the movable mirror 31 and the laser interferometer 32 are illustrated in a simplified manner, but actually, a Y movable mirror having a reflecting surface orthogonal to the Y-axis direction on the mask stage MST, An X moving mirror having a reflecting surface orthogonal to the X axis direction is provided. The position of the mask M on the mask stage MST in the two-dimensional direction and the rotation angle in the θZ direction (including rotation angles in the θX and θY directions in some cases) are detected by the laser interferometer 32 in real time. The detection result of the laser interferometer 32 is output to the control device CONT. The control device CONT drives the mask stage driving device MD based on the detection result of the laser interferometer 32, and controls the position of the mask M held on the mask stage MST.

  The projection optical system PL projects and exposes the pattern of the mask M onto the substrate P at a predetermined projection magnification β, and is composed of a plurality of optical elements, which are held by a lens barrel PK. . In the present embodiment, the projection optical system PL is a reduction system having a projection magnification β of, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. The projection optical system PL may be any one of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Of the plurality of optical elements constituting the projection optical system PL, the first optical element LS1 closest to the image plane of the projection optical system PL is exposed from the lens barrel PK.

  The substrate stage ST1 has a substrate holder PH that holds the substrate P, and the substrate holder PH can be moved on the image plane side of the projection optical system PL. The substrate stage ST1 is movably provided on the base BP while supporting the substrate holder PH. The substrate holder PH holds the substrate P by, for example, vacuum suction. A recess 80 is provided on the substrate stage ST1, and the substrate holder PH is disposed in the recess 80. The upper surface 81 of the substrate stage ST1 other than the recess 80 is a flat surface (flat portion) that is substantially the same height (flat) as the upper surface Pa of the substrate P held by the substrate holder PH. Therefore, by moving the substrate stage ST1 in the XY direction with respect to the projection optical system PL while supplying and recovering the liquid LQ by the immersion apparatus 1, the space between the upper surface Pa of the substrate P and the upper surface 81 of the substrate stage ST1. Thus, the liquid immersion area LR can be moved smoothly.

  A gap G1 is formed between the upper surface Pa of the substrate P held by the substrate holder PH and the upper surface 81 of the substrate stage ST1. Since the gap G1 is very small, the liquid LQ supplied to the upper surface 81 of the substrate stage ST1 can be prevented from entering the substrate stage ST1 through the gap G1. Further, the upper surface 81 of the substrate stage ST1 and the inner surface of the recess 80 are subjected to liquid repellency treatment, and the inner surface of the upper surface 81 and the recess 80 has liquid repellency with respect to the liquid LQ. Examples of the liquid repellent treatment include a treatment of applying a liquid repellent material such as a fluorine resin or an acrylic resin. Since the upper surface 81 and the inner surface of the recess 80 have liquid repellency, the infiltration of the liquid LQ through the gap G1 can be further suppressed.

  The substrate stage ST1 is driven by the substrate stage driving device SD1. The substrate stage driving device SD1 is configured to include a linear motor, for example, and includes an XY driving device that moves the substrate stage ST1 in the X axis direction, the Y axis direction, and the θZ direction, and a voice coil motor, for example. And a Z driving device that moves the substrate stage ST1 in the Z-axis direction, the θX direction, and the θY direction. By driving the substrate stage ST1, the upper surface Pa of the substrate P held by the substrate holder PH can move in directions of six degrees of freedom in the X axis, Y axis, Z axis, θX, θY, and θZ directions. The substrate stage driving device SD1 is controlled by the control device CONT.

  A movable mirror 33 is provided on the side surface of the substrate stage ST1. The movable mirror 33 includes a reflecting surface 33X orthogonal to the X-axis direction and a reflecting surface 33Y orthogonal to the Y-axis direction. The exposure apparatus EX also includes an interferometer system 40 that detects the position of the substrate stage ST1 in cooperation with the movable mirror 33 provided on the substrate stage ST1. The interferometer system 40 detects the position of the substrate stage ST1 by projecting a beam onto the reflecting surface of the movable mirror 33. Two-dimensional position information (XY direction position information) and rotation angle (θZ direction position information) of the substrate P on the substrate stage ST1 (substrate holder PH) are detected in real time by the interferometer system 40. In addition, the exposure apparatus EX is an oblique incidence type focus leveling that detects surface position information of the upper surface Pa of the substrate P held by the substrate holder PH as disclosed in, for example, Japanese Patent Laid-Open No. 8-37149. A detection system 30 is provided. The focus / leveling detection system 30 is arranged in a predetermined positional relationship with respect to the detection light La and a projection unit 30A that irradiates the detection light La on the upper surface Pa of the substrate P held by the substrate holder PH. A light receiving unit 30B that receives the reflected light of the detection light La reflected by Pa. Based on the detection result of the light receiving unit 30B, surface position information (position information in the Z-axis direction and θX) of the upper surface Pa of the substrate P And tilt information in the θY direction). The detection result of the interferometer system 40 is output to the control device CONT. The detection result of the focus / leveling detection system 30 is also output to the control device CONT. The control device CONT drives the substrate stage drive device SD1 based on the detection result of the focus / leveling detection system 30, and controls the focus position (Z position) and the tilt angle (θX, θY) of the substrate P, thereby controlling the substrate. The upper surface Pa of P and the image plane formed through the liquid LQ of the projection optical system PL are combined, and based on the detection result of the interferometer system 40, the X-axis direction, Y-axis direction, and θZ of the substrate P Position control in the direction.

  The measurement stage ST2 is mounted with various measuring instruments (including measurement members) that perform measurement related to exposure, and is movable on the image plane side of the projection optical system PL. Examples of the measuring instrument include a measuring instrument (measuring member) that measures the state of the exposure light EL and the imaging characteristics of the projection optical system PL. The measurement result of the measuring instrument is output to the control device CONT.

  The measurement stage ST2 is an XY plane that is substantially parallel to the image plane of the projection optical system PL on the image plane side of the projection optical system PL in a state where a measuring instrument is mounted by driving the measurement stage driving device SD2 including a linear motor. Can move two-dimensionally and can rotate in the θZ direction. Furthermore, the measurement stage ST2 can move in the Z-axis direction, the θX direction, and the θY direction. That is, the measurement stage ST2 can also move in directions of six degrees of freedom in the X axis, Y axis, Z axis, θX, θY, and θZ directions, like the substrate stage ST1. The measurement stage driving device SD2 is controlled by the control device CONT. A movable mirror 34 is provided on the side surface of the measurement stage ST2. The movable mirror 34 includes a reflective surface 34X orthogonal to the X-axis direction and a reflective surface 34Y orthogonal to the Y-axis direction. The interferometer system 40 detects the position of the measurement stage ST2 in cooperation with the movable mirror 34 by projecting a beam onto the reflecting surface of the movable mirror 34 provided on the measurement stage ST2. The position and rotation angle of the measurement stage ST2 in the two-dimensional direction are detected by the interferometer system 40 in real time. The control device CONT drives the measurement stage driving device SD2 based on the detection result of the interferometer system 40, and controls the position of the measurement stage ST2.

  Further, the upper surface 81 of the substrate stage ST1 and the upper surface 82 of the measurement stage ST2 are set to have substantially the same height (the same surface). Further, the upper surface 82 of the measurement stage ST2 is also subjected to liquid repellency treatment in the same manner as the upper surface 81 of the substrate stage ST1, and the upper surface 82 has liquid repellency with respect to the liquid LQ. Examples of the liquid repellent treatment include a treatment of applying a liquid repellent material such as a fluorine resin or an acrylic resin.

  In the vicinity of the mask stage MST, a pair of mask alignment systems RAa and RAb composed of a TTR (Through The Reticle) type alignment system using light having an exposure wavelength is provided at a predetermined distance in the X-axis direction. Mask alignment systems RAa and RAb are arranged above mask stage MST. The mask alignment systems RAa and RAb project a pair of alignment marks on the mask M and a first reference mark FM1 (detailed later) on a reference plate 50 provided on the measurement stage ST2 so as to correspond to the alignment marks. A conjugate image through the optical system PL is simultaneously observed. In the mask alignment system of this embodiment, for example, as disclosed in Japanese Patent Laid-Open No. 7-176468, the mark is irradiated with light, and the mark image data captured by a CCD camera or the like is subjected to image processing and the mark is processed. A VRA (Visual Reticle Alignment) method for detecting the position is adopted. The detection results of the mask alignment systems RAa and RAb are output to the control device CONT.

  Near the tip of the projection optical system PL, an off-axis alignment system that detects an alignment mark on the substrate P and a second reference mark FM2 (detailed later) on the reference plate 50 provided on the measurement stage ST2. ALG is provided. The alignment system ALG is arranged on the + Y side of the projection optical system PL. In the alignment system ALG of the present embodiment, for example, as disclosed in Japanese Patent Laid-Open No. 4-65603, a broadband detection light beam that does not expose a photosensitive material on the substrate P is subjected to a target mark (an alignment mark formed on the substrate P). , And a second reference mark FM2 or the like formed on a reference plate 50, which will be described later, and an image of the target mark and an index (provided in the alignment system ALG) formed on the light receiving surface by reflected light from the target mark. The FIA (Field Image Alignment) method is used to measure the position of the mark by imaging the image of the index mark on the index plate) using an image sensor (CCD, etc.) and processing the image of these image signals. Has been. The detection result of alignment system ALG is output to control device CONT.

  FIG. 2 is a schematic perspective view showing the substrate stage ST1, the measurement stage ST2, and the interferometer system 40. As shown in FIG. 2, the reflection surface 33Y of the movable mirror 33 that is orthogonal to the Y-axis direction and extends in the X-axis direction is mirror-finished at one end (+ Y side end) of the substrate stage ST1 in the Y-axis direction. It is formed by. Further, at one end portion (+ X side end portion) of the substrate stage ST1 in the X-axis direction, a reflecting surface 33X of the movable mirror 33 orthogonal to the X-axis direction and extending in the Y-axis direction is formed by mirror finishing. . Beams (interferometer beams) from the Y-axis interferometers 41 and 41 s and the X-axis interferometers 42 and 42 s constituting the interferometer system 40 are projected onto the reflecting surfaces 33Y and 33X, respectively.

  The Y-axis interferometers 41 and 41s and the X-axis interferometers 42 and 42s receive the reflected light from the reflecting surfaces 33Y and 33X, respectively, so that the reference positions of the reflecting surfaces 33Y and 33X (generally, the lens barrel PK). And a displacement in the detection direction from the reference surface of the fixed mirror disposed on the side surface of the alignment system ALG.

  The X-axis interferometer 42 has a measurement axis that passes through the projection center (optical axis AX) of the projection optical system PL and is parallel to the X axis, and a measurement axis that passes through the detection center of the alignment system ALG and is parallel to the X axis. At the time of exposure, the position in the X-axis direction of the substrate stage ST1 is detected by the measurement axis passing through the projection center position of the projection optical system PL, and the detection center of the alignment system ALG is used in enhanced global alignment (EGA). The position in the X-axis direction of the substrate stage ST1 is detected by the measurement axis that passes. In addition, the X-axis interferometer 42 determines the position of the measurement stage ST2 in the X-axis direction by appropriately using two measurement axes according to the measurement of the baseline amount and the measurement contents of various measuring instruments provided in the measurement stage ST2. To detect. That is, the X-axis interferometer 42 determines the position of the substrate stage ST1 or the measurement stage ST2 in the X-axis direction as the projection center position of the projection optical system PL in the Y-axis direction and the detection center position of the alignment system ALG in the Y-axis direction. Can be detected. The baseline amount is an amount indicating the positional relationship of the substrate stage ST1 with respect to the projection image of the pattern projected by the projection optical system PL, and specifically, the projection center of the projection optical system PL and the detection center of the alignment system ALG. And the distance.

  Y-axis interferometer 41 has a measurement axis parallel to the Y-axis connecting the projection center (optical axis AX) of projection optical system PL and the detection center of alignment system ALG, and determines the position of substrate stage ST1 in the Y-axis direction. Detect mainly. The Y-axis interferometer 41 detects the position of the measurement stage ST2 in the Y-axis direction while the substrate stage ST1 is positioned at the loading position for exchanging the substrate P.

  The X-axis interferometer 42s and the Y-axis interferometer 41s supplementarily detect the position of the substrate stage ST1 in the XY plane while the substrate stage ST1 is positioned at the loading position for exchanging the substrate P. To do.

  At one end portion (+ Y side end portion) of the measurement stage ST2 in the Y-axis direction, a reflecting surface 34Ys of the movable mirror 34 that is orthogonal to the Y-axis direction and extends in the X-axis direction is formed by mirror finishing. Furthermore, a reflection surface 34X of the movable mirror 34 that is orthogonal to the X-axis direction and extends in the Y-axis direction is formed by mirror finishing at one end (+ X side end) of the measurement stage ST2 in the X-axis direction. The reflection surface 34Y of the movable mirror 34 that is orthogonal to the Y-axis direction and extends in the X-axis direction is formed by mirror finishing at the other end portion (−Y side end portion) in the Y-axis direction.

  A beam (interferometer) from the Y-axis interferometer 41 that detects the position of the substrate stage ST1 in the Y-axis direction while the substrate stage ST1 is positioned at the loading position for exchanging the substrate P is disposed on the reflecting surface 34Ys. Beam) is projected. Further, the beams from the Y-axis interferometer 43 and the X-axis interferometer 42 are projected onto the reflecting surfaces 34Y and 34X, respectively. The X-axis interferometer 42 and the Y-axis interferometer 43 receive the reflected light from the reflecting surfaces 34X and 34Y, respectively, and detect displacements in the detection direction from the reference positions of the reflecting surfaces 34X and 34Y.

  Similar to the Y-axis interferometer 41, the Y-axis interferometer 43 has a measurement axis parallel to the Y-axis connecting the projection center (optical axis AX) of the projection optical system PL and the detection center of the alignment system ALG. Unless the substrate stage ST1 is in the loading position for exchanging the substrate P, the position of the measurement stage ST2 in the Y-axis direction is detected.

  FIG. 3 is a plan view of the measurement stage ST2. As described above, the measurement stage ST2 includes a plurality of measuring instruments (measuring members) for performing various measurements related to exposure. At a predetermined position on the upper surface 82 of the measurement stage ST2, a reference plate 50 on which a plurality of reference marks are formed is provided as a measuring instrument (measurement member). The reference plate 50 is held by the holding unit 100 provided in the measurement stage ST2. The reference plate 50 is formed of a low thermal expansion material, and is formed in a substantially circular shape in plan view in the present embodiment. In the present embodiment, the reference plate 50 is disposed in the vicinity of the reflecting surface 34X on which the beam from the X-axis interferometer 42 is projected and the reflecting surface 34Ys on which the beam from the Y-axis interferometer 41 is projected. Yes.

  On the upper surface 50A of the reference plate 50, the first reference mark FM1 measured by the mask alignment systems RAa and RAb and the second reference mark FM2 measured by the alignment system ALG are formed. The mask alignment systems RAa and RAb detect the first reference mark FM1 provided on the reference plate 50, and the alignment system ALG detects the second reference mark FM2 provided on the reference plate 50.

  The first reference mark FM1 includes a total of six marks in which a pair of marks arranged at a predetermined distance in the X-axis direction are arranged in three rows along the Y-axis direction. The distance (distance) L1 in the X-axis direction between the marks constituting the first reference mark FM1 is L2 as the distance between the pair of mask alignment marks formed on the mask M, and β as the projection magnification of the projection optical system PL. It is set to satisfy the condition of L1 = L2 × β. In addition, the shape and size of the first reference mark FM1 is formed in consideration of the size of the mask alignment mark. The second reference mark FM2 is provided at an intermediate position between a pair of marks FM11 and FM12 provided on the most + Y side among the six marks constituting the first reference mark FM1.

  Further, a slit opening 158 is formed at a position away from the reference plate 50 on the upper surface 82 of the measurement stage ST2. A wavefront aberration measuring instrument 159 is disposed below the slit opening 158 (−Z direction). The wavefront aberration measuring instrument 159 includes, for example, a microlens array and a light receiving element such as a CCD, and the wavefront of the exposure light EL that has passed through the slit opening 158 via the projection optical system PL is divided by the microlens array. The wavefront aberration of the projection optical system PL is measured based on the imaging position of each wavefront on the light receiving element. As the wavefront aberration measuring instrument 159, for example, a wavefront aberration measuring instrument disclosed in International Publication No. 99/60361 pamphlet (corresponding European Patent No. 1,079,223) can be used.

  Further, a pinhole opening pattern 161 is formed at a position away from the reference plate 50 on the upper surface 82 of the measurement stage ST2. Then, information (light quantity, illuminance, illuminance unevenness, etc.) relating to the exposure energy of the exposure light EL irradiated onto the measurement stage ST2 via the projection optical system PL is measured below the pinhole 161 (−Z direction). An exposure light measuring instrument 162 is arranged. As the exposure light measuring device 162, for example, as disclosed in Japanese Patent Laid-Open No. 57-117238 (corresponding US Pat. No. 4,465,368) or the like, illuminance unevenness is measured, or Japanese Patent Laid-Open No. 2001-267239. An unevenness measuring instrument for measuring the variation in the transmittance of the exposure light EL of the projection optical system PL, as disclosed in Japanese Patent Application Laid-Open No. 11-16816, and, for example, Japanese Patent Application Laid-Open No. 11-16816 (corresponding US Patent Application Publication No. 2002) / 0061469 specification) etc. can be used for the irradiation amount measuring device (illuminance measuring device).

  FIG. 4 is a diagram illustrating an example of the first reference mark FM1 and the second reference mark FM2. As shown in FIG. 4A, the first fiducial mark FM1 is formed by forming a cross-shaped opening (slit) with respect to a light shielding region made of metal such as Cr (chromium). FIG. 4A shows one of the first reference marks FM1 composed of six marks.

  As shown in FIG. 4B, the second reference mark FM2 has a mark group in which mark elements having the Y-axis direction as the longitudinal direction and arranged at predetermined intervals in the X-axis direction are separated by a predetermined distance in the X-axis direction. And a Y mark FMy formed by separating a mark group in which mark elements having the X-axis direction as a longitudinal direction are arranged at a predetermined interval in the Y-axis direction and separated by a predetermined distance in the Y-axis direction. ing. The second fiducial mark FM2 may form each mark element with a metal such as Cr (chromium), and form an opening (slit) with respect to a light shielding region formed with a metal such as Cr (chromium). Thus, each mark element may be formed.

  5 is a cross-sectional view taken along the line AA in FIG. As shown in FIG. 5, an internal space 58 of the measurement stage ST2 is formed below the reference plate 50 (−Z direction), and the internal space 58 is passed through the liquid LQ by the projection optical system PL. A part of the aerial image measuring instrument 55 that measures the aerial image projected on the measurement stage ST2 is provided. The aerial image measuring instrument 55 has a condensing lens 56 provided below the reference plate 50, one end portion disposed at one focal position of the condensing lens 56, and the exposure light EL condensed by the condensing lens 56. The optical fiber 57 is guided to the -Y side of the measurement stage ST2, and includes a photoelectric conversion element such as a photomultiplexer (not shown) that photoelectrically converts the exposure light EL guided by the optical fiber 57 and emitted from the other end. Yes. As this aerial image measuring instrument 55, for example, one disclosed in Japanese Patent Application Laid-Open No. 2002-14005 (corresponding US Patent Application Publication No. 2002/0041377) can be used.

  The reference plate 50 is held by the holding unit 100 provided in the measurement stage ST2. The holding unit 100 includes a recess 51 provided in a part of the upper surface 82 of the measurement stage ST2, and a suction unit 60 provided inside the recess 51 and holding the reference plate 50 by suction. The suction unit 60 holds the reference plate 50 by, for example, vacuum suction. The upper surface 50A of the reference plate 50 held by the holding unit 100 (suction unit 60) and the upper surface 82 of the measurement stage ST2 are set to be substantially the same height (level). Therefore, by moving the measurement stage ST2 in the XY direction with respect to the projection optical system PL while supplying and collecting the liquid LQ by the liquid immersion device 1, the upper surface 50A of the reference plate 50 and the upper surface 82 of the measurement stage ST2 are moved. The immersion region LR can be moved smoothly between the two.

  Further, the outer side surface 50C of the reference plate 50 held by the suction unit 60 of the holding unit 100 faces the inner side surface 51C of the recess 51, and the outer side surface 50C (upper surface) of the reference plate 50 held by the suction unit 60 50A) and an inner side surface 51C (upper surface 82) of the recess 51, a predetermined gap G2 is formed. Since the gap G2 is very small, the liquid LQ supplied to the upper surface 82 of the measurement stage ST2 can be prevented from entering the measurement stage ST2 through the gap G2. In addition, since the reference plate 50 has a circular shape in plan view and the concave portion 51 has a circular shape, the gap G2 between the reference plate 50 and the concave portion 51 can be set substantially uniformly in the circumferential direction of the reference plate 50. The liquid LQ can be further suppressed from entering the measurement stage ST2 through the gap G2.

  The upper surface 50A and the outer surface 50C of the reference plate 50 are subjected to liquid repellency treatment, and the upper surface 50A and the outer surface 50C have liquid repellency with respect to the liquid LQ. Examples of the liquid repellent treatment include a treatment of applying a liquid repellent material such as a fluorine resin or an acrylic resin.

  Further, as described above, the upper surface 82 of the measurement stage ST2 has liquid repellency, the upper surface 82 has liquid repellency, and the inner surface 51C of the recess 51 of the measurement stage ST2 is also subjected to liquid repellency treatment. The inner side surface 51C of the recess 51 is liquid repellent with respect to the liquid LQ. Examples of the liquid repellent treatment include a treatment of applying a liquid repellent material such as a fluorine resin or an acrylic resin. Since the upper surface 50A, the outer surface 50C of the reference plate 50, the upper surface 82 of the measurement stage ST2, and the inner surface 51C of the recess 51 have liquid repellency, the liquid LQ passes through the gap G2 in the measurement stage ST2. It is possible to further suppress the intrusion into the inside.

  In addition, a guide member 54 made of a pin member can be arranged inside the suction portion 60. The guide member 54 is driven by an actuator such as a pneumatic cylinder, for example, and is movable (movable up and down) in the Z-axis direction. As will be described later, the guide member 54 can be fitted with a recess 53 formed at a substantially central portion of the lower surface 50B of the reference plate 50. The guide member 54 is disposed at a position where the exposure light EL transmitted through the first reference mark FM1 of the reference plate 50 is not blocked.

  6 is an enlarged view of the main part of FIG. 5, and FIG. 7 is a view of the suction part 60 as viewed from above. 6 and 7, the suction portion 60 is formed on the base 63 and the base 63 formed in an annular shape so as not to block the exposure light EL transmitted through the first reference mark FM <b> 1. An annular first peripheral wall portion 61 formed on the base material 63 along the inner edge portion, and provided on the outside of the first peripheral wall portion 61, and formed on the base material 63 so as to surround the first peripheral wall portion 61. The annular second peripheral wall portion 62 and a plurality of convex portions 64 formed on the base 63 between the first peripheral wall portion 61 and the second peripheral wall portion 62 are provided. The convex portion 64 supports the lower surface 50 </ b> B of the reference plate 50. The upper surface of the second peripheral wall portion 62 is provided so as to face the peripheral region (edge region) of the lower surface 50B of the reference plate 50. The upper surface of the first peripheral wall portion 61 is provided so as to face a region inside the peripheral region of the lower surface 50B of the reference plate 50. A first space K1 surrounded by the base 63, the first and second peripheral wall portions 61 and 62, and the lower surface 50B of the reference plate 50 is formed on the lower surface 50B side of the reference plate 50 held by the suction portion 60. The

  A suction port 65 is formed on the base 63 between the first peripheral wall 61 and the second peripheral wall 62. The suction port 65 is for adsorbing and holding the reference plate 50, and at a plurality of predetermined positions other than the convex portion 64 on the upper surface of the base material 63 between the first peripheral wall portion 61 and the second peripheral wall portion 62. Each is provided. Each of the suction ports 65 is connected to a first pressure adjusting device 67 including a vacuum system via a flow channel 66. The first pressure adjusting device 67 is controlled by the control device CONT. The control device CONT drives the first pressure adjusting device 67 and sucks the gas (air) inside the first space K1 surrounded by the base material 63, the first and second peripheral wall portions 61 and 62, and the reference plate 50. Then, the reference plate 50 is sucked and held on the convex portion 64 by making the first space K1 have a negative pressure. In the present embodiment, the suction portion 60 constitutes a so-called pin chuck mechanism. In a state where the suction portion 60 holds the reference plate 50 by suction, the upper surface of the first peripheral wall portion 61 and the lower surface 50B of the reference plate 50 are in close contact with each other, and the upper surface of the second peripheral wall portion 62 and the lower surface 50B of the reference plate 50 are Are in close contact. Thereby, even if the liquid LQ enters from the gap G2, the liquid LQ can be prevented from entering the first space K1.

  The first pressure adjusting device 67 can also supply gas to the first space K1 via the suction port 65 connected to the first space K1. The first pressure adjusting device 67 can make the first space K1 have a negative pressure or a positive pressure by sucking the gas in the first space K1 or supplying the gas to the first space K1.

  A supply port 75 is connected to the second space K2 including the gap G2 between the outer side surface 50C of the reference plate 50 held by the suction portion 60 and the inner side surface 51C of the recess 51 facing the outer side surface 50C. A second pressure adjusting device 77 is connected to the supply port 75 via a flow path 76. The second space K <b> 2 includes a space surrounded by the reference plate 50, the outer surface of the second peripheral wall portion 62 of the suction portion 60, and the recess 51. The second pressure adjusting device 77 is controlled by the control device CONT. Similar to the first pressure adjustment device 67, the second pressure adjustment device 77 can supply gas to the second space K2 via the supply port 75 connected to the second space K2. Gas can be sucked. The second pressure adjusting device 77 can set the second space K2 to a positive pressure or a negative pressure by supplying gas to the second space K2 or sucking the gas in the second space K2.

  Thus, the first pressure adjusting device 67 can adjust the pressure of the first space K1 formed between the reference plate 50 and the suction portion 60 of the holding unit 100, and the second pressure adjusting device 77 is The pressure in the second space K2 formed between the reference plate 50 and the concave portion 51 of the holding unit 100 can be adjusted.

  The first pressure adjusting device 67 that adjusts the pressure in the first space K1 and the second pressure adjusting device 77 that adjusts the pressure in the second space K2 are independent of each other. The control device CONT can individually control the operations of the first pressure adjusting device 67 and the second pressure adjusting device 77, and the pressure adjusting operation of the first space K1 by the first pressure adjusting device 67 and the second pressure adjusting device. The pressure adjustment operation of the second space K2 by the device 77 can be performed independently.

  And the control apparatus CONT can remove the reference | standard board 50 from the adsorption | suction part 60 (holding | maintenance part 100) by canceling | releasing the suction operation by the 1st pressure regulation apparatus 67. FIG. That is, the reference plate 50 is detachably (replaceable) with respect to the measurement stage ST2 (holding unit 100).

<First Embodiment of Adjustment Method>
As described above, the reference plate 50 is provided so as to be replaceable with respect to the suction unit 60 (holding unit 100). Hereinafter, a first embodiment of an operation of attaching the reference plate 50 to the suction unit 60 (holding unit 100) of the measurement stage ST2 will be described with reference to a flowchart of FIG. 8 and a schematic diagram of FIG. The operation of attaching the reference plate 50 to the measurement stage ST2 includes the operation of adjusting the position of the reference plate 50.

  When the reference plate 50 is attached, as shown in FIG. 9A, the reference plate 50 is transported to the suction unit 60 (holding unit 100) of the measurement stage ST2 by a predetermined transport device (not shown). (Step SA1). The reference plate 50 may be conveyed to the suction unit 60 by an operator or the like.

  When the reference plate 50 is transported to the suction unit 60, the guide member 54 made of a pin member is disposed inside the base member 63 formed in an annular shape in the suction unit 60. The control device CONT drives an actuator such as a pneumatic cylinder to raise the guide member 54 and arranges the tip end portion (upper end portion) of the guide member 54 above the upper surface of the convex portion 64 (+ Z direction). In addition, a concave portion 53 that can be fitted to the guide member 54 is formed in a substantially central portion of the lower surface 50B of the reference plate 50. As shown in FIG. 9B, the control device CONT fits the distal end portion of the guide member 54 and the concave portion 53 of the reference plate 50. Since the guide member 54 is provided in a predetermined positional relationship with respect to the suction portion 60, the control device CONT fits the guide member 54 and the concave portion 53 of the reference plate 50 so that the reference plate for the suction portion 60 is fitted. 50 rough positionings can be performed. Next, the control device CONT lowers the guide member 54 in a state where the distal end portion of the guide member 54 and the concave portion 53 of the reference plate 50 are fitted. As the guide member 54 is lowered, the reference plate 50 is also lowered. The control device CONT lowers the reference plate 50 and the guide member 54 together to bring the lower surface 50B of the reference plate 50 and the upper surface of the convex portion 64 of the suction portion 60 into contact with each other. As a result, as shown in FIG. 9C, the reference plate 50 is placed on the upper surface of the convex portion 64 of the suction portion 60 of the holding portion 100 (step SA2).

  Since the reference plate 50 is used for, for example, baseline measurement or aerial image measurement, the control device CONT needs to adjust the position of the reference plate 50. Therefore, after placing the reference plate 50 on the suction unit 60, the control device CONT performs position adjustment (positioning) of the reference plate 50 on the measurement stage ST2. When positioning the reference plate 50 in the measurement stage ST2, the control device CONT drives the measurement stage ST2 using the measurement stage driving device SD2 in a state where the reference plate 50 is placed on the suction part 60 of the measurement stage ST2. Then, the position of the reference plate 50 is adjusted by sliding the reference plate 50 on the suction portion 60 of the holding unit 100 (step SA3). When the control device CONT drives the measurement stage ST2 to position the reference plate 50 and slides the reference plate 50 on the suction portion 60, the second reference of the reference plate 50 as shown in FIG. 9D. The measurement stage ST2 is moved so that the mark FM2 is arranged below the alignment system (mark detection system) ALG. Then, the control device CONT detects the second reference mark FM2 provided on the reference plate 50 using the alignment system ALG, and controls the driving of the measurement stage ST2 based on the detection result.

  When the reference plate 50 is slid on the suction unit 60, the control device CONT stops driving the first pressure adjusting device 67. That is, the first space K1 formed between the reference plate 50 and the suction portion 60 is almost atmospheric pressure. The control device CONT places the reference plate 50 on the suction part 60, and drives the measurement stage ST2 without pressing the upper surface 50A of the reference plate 50. By the inertial force generated by driving the measurement stage ST2, The reference plate 50 can be slid on the suction part 60. When the control device CONT slides the reference plate 50 on the suction portion 60, the guide member 54 is disposed inside the recess 53 of the reference plate 50.

  As shown in the schematic diagram of FIG. 10, the control device CONT has the reference plate 50 with the reference plate 50 in a state where the guide member 54 is disposed inside the recess 53 formed in the substantially central portion of the lower surface 50B of the reference plate 50. The measurement stage ST2 is driven so as to slide in the θZ direction (rotation direction) with the center portion of 50 (that is, the recess 53) as the rotation center. The control device CONT uses the measurement stage drive device SD2 to drive the measurement stage ST2 with a predetermined acceleration in a state where the reference plate 50 is placed on the suction portion 60, and then suddenly stops. While the guide member 54 guides the sliding movement of the reference plate 50, the reference plate 50 can be slid on the suction portion 60 so as to rotate in the θZ direction. For example, the controller CONT rotates the measurement stage ST2 with a large acceleration in the + θZ direction (or −θZ direction) so that the concave portion 53 (guide member 54) is the center of rotation, and then suddenly stops, and then the −θZ direction. Slowly rotate in (or + θZ direction) to return to the original position, and repeat this. Accordingly, the reference plate 50 can be rotated in the −θZ direction (or + θZ direction) with respect to the measurement stage ST2. Here, in the following description, the measurement stage ST2 is rotated in the + θZ direction (or −θZ direction) at a predetermined acceleration, then stopped suddenly, and then slowly rotated in the −θZ direction (or + θZ direction). The operation of returning to the original position and repeating this is appropriately referred to as “pulse driving”.

  And the control apparatus CONT can adjust the rotation amount (slip amount) on the adsorption | suction part 60 of the reference | standard board 50 by adjusting suitably the acceleration and rotation amount when driving measurement stage ST2. When the reference plate 50 is slid on the suction portion 60, measurement is performed so that the reference plate 50 slides well on the suction portion 60 according to at least one of the coefficient of friction of the reference plate 50 and the weight of the reference plate 50. The acceleration when driving the stage ST2 is set.

  In the present embodiment, since the reference plate 50 has a circular shape in plan view and the concave portion 51 has a circular shape, the reference plate 50 can slide smoothly in the θZ direction with respect to the measurement stage ST2. Moreover, since the recessed part 53 is formed in the center part of the lower surface 50B of the reference | standard board 50, the reference | standard board 50 can rotate smoothly in the (theta) Z direction centering | focusing on the guide member 54. As shown in FIG. As described above, the guide member 54 has a function of guiding the sliding movement of the reference plate 50 in the θZ direction, and the reference plate 50 can slide in the θZ direction while being guided by the guide member 54. As a result, the outer side surface 50C of the reference plate 50 and the inner side surface 51C of the recess 51 come into contact with each other, so that the liquid repellent material applied to the outer side surface 50C and the inner side surface 51C can be removed and the liquid repellency is deteriorated. It is possible to prevent the occurrence of inconvenience such as damage to the plate 50 and the recess 51.

  When adjusting the position of the reference plate 50, the control unit CONT detects the second reference mark FM2 provided on the reference plate 50 using the alignment system ALG, and drives the measurement stage ST2 based on the detection result. By controlling, the position of the reference plate 50 is adjusted. When adjusting the position of the reference plate 50, the measurement stage ST2 is driven so that the second reference mark FM2 is arranged inside the index mark of the index plate of the alignment system ALG, and the alignment system ALG, the reference plate 50, The measurement stage ST2 is driven in a state where the positions are roughly aligned.

  FIG. 11 is a schematic perspective view for explaining a state in which the measurement stage ST2 is driven while the second reference mark FM2 is detected by the alignment system ALG. In FIG. 11, the alignment system ALG includes a mirror 110, an objective lens 112, a beam splitter 114, an imaging lens 116, an index plate 118, and an image pickup provided near the image plane side tip of the projection optical system PL. A lens 120, a half mirror 121, and an image sensor 122 (122X, 122Y) such as a CCD are provided. The alignment system ALG also includes an optical fiber 124 for guiding light of a broadband wavelength from a halogen lamp or the like, a condenser lens 126, and an illumination field stop to illuminate the detection target mark (in this case, the second reference mark FM2). 128, a lens system 130, and an illumination system including the beam splitter 114 described above.

  Further, the control device CONT determines the positions of the measurement stage ST2 in the X-axis direction and the Y-axis direction when the second reference mark FM2 is detected by the alignment system ALG, and thus the positions of the reflecting surfaces 34X and 34Y of the movable mirror 34. Detection is performed by the interferometer system 40.

  FIG. 12 is a view showing the indicator plate 118. The indicator plate 118 is formed by forming, on the surface of a transparent glass plate 118G, indicator marks TLY, TRy, TLx, TRx made of a plurality of (in this case, two) line patterns formed of a light shielding material such as chromium. is there. The index mark serves as a reference when aligning the second reference mark FM2 or the alignment mark on the substrate P, and the surface of the index plate 118 on which the index mark is formed is a projected image plane (second reference mark FM2). The surface 50A of the reference plate 50 on which is formed, and the upper surface Pa) of the substrate P are arranged almost conjugate with each other, and the surface of the indicator plate 118 and the light receiving surface of the image sensor 122 are arranged almost conjugate. Therefore, the image sensor 122 can simultaneously capture the image of the second reference mark FM2 and the image of the index mark. The index marks TLy and TRy are provided so as to sandwich the Y mark FMy of the second reference mark FM2 on the reference plate 50 in the Y-axis direction. The index marks TLx and TRx are the same as those of the second reference mark FM2 on the reference plate 50. The X mark FMx is provided so as to be sandwiched in the X axis direction. The center C of the index marks TLy, TRy, TLx, TRx is the detection center of the alignment system ALG.

  Each index mark on the index plate 118 and the image of the second reference mark FM2 are imaged by the two imaging elements 122X and 122Y via the half mirror 121. The imaging area of the imaging element 122X is set to the area 123X in FIG. 12 on the index plate 118, and the imaging area of the imaging element 122Y is set to the area 123Y in FIG. The horizontal scanning line of the image sensor 122X is defined in the X-axis direction orthogonal to the line pattern of the index marks TLx and TRx, and the horizontal scanning line of the image sensor 122Y is Y orthogonal to the line pattern of the index marks TLy and TRy. It is determined in the axial direction.

  FIG. 13 is a diagram illustrating the index marks TLy and TRy and the Y mark FMy of the second reference mark FM2 captured by the image sensor 122Y. As shown in FIG. 13A, the index marks TLy and TRy and the Y mark FMy of the second reference mark FM2 are simultaneously imaged in the imaging area of the imaging element 122Y. As described above, the horizontal scanning line SL of the image sensor 122Y is defined in the Y-axis direction orthogonal to the line pattern of the index marks TLy and TRy. FIG. 13B is a diagram illustrating an example of an image signal obtained along the horizontal scanning line SL. By photoelectrically detecting the index marks TLy and TRy along the horizontal scanning line SL, a signal waveform having an extreme value Kt as shown in FIG. 13B is obtained at the index marks TLy and TRy. Further, by photoelectrically detecting the Y mark FMy along the horizontal scanning line SL, a signal waveform having an extreme value Km as shown in FIG. 13B is obtained at each of the edge portions of the Y mark FMy. An image signal (imaging result) captured by the image sensor 122Y is output to the control device CONT.

  The control device CONT obtains a position (for example, a position on the light receiving surface of the image sensor 122Y) in the direction along the horizontal scanning line SL of each of the extreme values Km obtained by photoelectrically detecting the Y mark FMy of the second reference mark FM2. The center position Jy of the Y mark FMy on the image sensor 122Y can be obtained by processing the obtained result with a predetermined algorithm. Similarly, the control device CONT obtains the positions of the extreme values Kt obtained by photoelectrically detecting the index marks TLy and TRy, and processes the obtained results with a predetermined algorithm, thereby obtaining the distance between the index marks TLy and TRy. The center position Cy on the light receiving surface of the image sensor 122Y can be obtained. Thereby, the control device CONT can determine the amount of deviation Δy of the center position Jy of the Y mark FMy of the second reference mark FM2 with respect to the center position Cy between the index marks TLy and TRy.

  Similarly, the control device CONT can obtain the center position Jx of the X mark FMx of the second reference mark FM2 on the light receiving surface of the imaging element 122X based on the imaging result of the imaging element 122X. Further, the control device CONT can obtain the center position Cx on the light receiving surface of the image sensor 122X between the index marks TLx and TRx. Then, the control device CONT can obtain a deviation amount Δx of the center position Jx of the X mark FMx of the second reference mark FM2 with respect to the center position Cx between the index marks TLx and TRx.

  By the way, the control device CONT stores in advance the reference position information of the measurement stage ST2 regarding the coordinate system defined by the interferometer system 40, and hence the reference position information of the movable mirror 34. For example, each of the reflecting surfaces 34X and 34Y of the movable mirror 34 of the measurement stage ST2 is a reference position (for example, a reference surface of a fixed mirror disposed on the side surface of the lens barrel PK or the side surface of the alignment system ALG). With respect to the coordinate system defined by the interferometer system 40, the amount of deviation in the θZ direction of each reflecting surface 34X, 34Y of the movable mirror 34 is zero (zero yawing). Say the position. That is, when the measurement stage ST2 is at the reference position, the reflection surface 34Y of the movable mirror 34 of the measurement stage ST2 and the beam (that is, the Y axis) from the Y-axis interferometer 43 are perpendicular to each other, and the reflection surface 34X and the X-axis It is perpendicular to the beam from the interferometer 42 (ie, the X axis). Further, in a state where the movable mirror 34 (measurement stage ST2) is positioned at the reference position, the positions of the reference plate 50 and the suction portion 60 are adjusted so that the alignment system ALG can detect the second reference mark FM2 of the reference plate 50. Designed.

  In the present embodiment, the control device CONT sets the reference plate so that the second reference mark FM2 and the alignment system ALG have a predetermined positional relationship when the movable mirror 34 (measurement stage ST2) is positioned at the reference position. 50 is slid on the suction portion 60 to position the reference plate 50. More specifically, the control device CONT sets the center position J of the second reference mark FM2 and the detection center of the alignment system ALG (the center of the index mark) when the reflecting surfaces 34X and 34Y of the movable mirror 34 are positioned at the reference position. The reference plate 50 is positioned by sliding the reference plate 50 on the suction portion 60 so that the position C) is in a predetermined positional relationship. Here, the above-mentioned predetermined positional relationship is, for example, a positional relationship in which the center positions Jx, Jy of the second reference mark FM2 coincide with the detection centers of the alignment system ALG (index mark center positions Cx, Cy), or This includes a positional relationship in which the deviation amounts Δx and Δy are less than or equal to the allowable values.

  When the movable mirror 34 (reflecting surfaces 34X, 34Y) provided on the measurement stage ST2 is at the reference position with respect to the XY coordinate system defined by the interferometer system 40, the control device CONT 2 A second plate provided on the reference plate 50 using the alignment system ALG so that the center position J of the reference mark FM2 has a predetermined positional relationship (for example, the center position C and the center position J coincide with each other). While detecting the reference mark FM2, the measurement stage ST2 is pulse-driven to slide the reference plate 50 on the suction portion 60. Here, the alignment system ALG (the center position C of the index mark and the light receiving surfaces of the image sensors 122X and 122Y) is at a fixed position with respect to the XY coordinate system defined by the interferometer system 40. For this reason, the control device CONT is configured with respect to the center position C of the index mark of the alignment system ALG in a state where the movable mirror 34 (reflecting surfaces 34X and 34Y) is arranged at the reference position with respect to the XY coordinate system defined by the interferometer system 40. By positioning the center position J of the second reference mark FM2 of the reference plate 50, the reference plate 50 is positioned with respect to the movable mirror 34 (reflection surfaces 34X, 34Y). Thus, in the present embodiment, the control device CONT positions the reference plate 50 with respect to the movable mirror 34 provided on the measurement stage ST2.

FIG. 14 is a schematic diagram showing a state in which the reference plate 50 is positioned with respect to the movable mirror 34. FIG. 14A shows a state in which the movable mirror 34 (measurement stage ST2) is disposed at the reference position, and the position of the second reference mark FM2 on the reference plate 50 is shifted in the θZ direction. FIG. In this case, the center position C of the index mark of the alignment system ALG and the center position J of the second reference mark FM2 are not in a predetermined positional relationship. As shown in FIG. 14B, the control device CONT drives the measurement stage ST2 in a pulsed manner, slides the reference plate 50 on the suction portion 60 and rotates it in the θZ direction, thereby moving the movable mirror 34 (measurement stage ST2). ) Is arranged at the reference position, the position of the reference plate 50 is adjusted so that the center position C of the index mark of the alignment system ALG and the center position J of the second reference mark FM2 have a predetermined positional relationship. To do. Then, the position adjustment operation of the reference plate 50 is completed when the center position C of the index mark of the alignment system ALG and the center position J of the second reference mark FM2 are in a predetermined positional relationship (step SA4).
After the attachment work (position adjustment work) of the reference plate 50 is completed, the control device CONT lowers the guide member 54 and removes it from the recess 53 as shown in FIG. The control device CONT retracts the guide member 54 to a position where the exposure light EL transmitted through the first reference mark FM1 of the reference plate 50 is not blocked.

  Then, as shown in FIG. 15B, after the position adjustment of the reference plate 50, the control device CONT drives the first pressure adjustment device 67 to make the first space K1 a negative pressure, and the suction of the holding unit 100 The reference plate 50 is sucked and held by the unit 60 (step SA5). As described above, the control device CONT can fix the position of the reference plate 50 in a state where the reference plate 50 is positioned at a desired position.

<Second Embodiment of Adjustment Method>
Next, a second embodiment of the adjustment method will be described. The present embodiment includes an operation of adjusting the pressure of the first space K1 formed between the reference plate 50 and the suction portion 60 when the measurement stage ST2 is driven to adjust the position of the reference plate 50. An example of the adjustment method will be described.

  As shown in the schematic diagram of FIG. 16 (A), the control device CONT uses the first pressure adjusting device 67 to reduce the pressure of the first space K1 formed between the reference plate 50 and the suction portion 60. Under pressure, the lower surface 50B of the reference plate 50 and the convex portion 64 are adsorbed, and the measurement stage ST2 can be driven in this state. For example, when the weight of the reference plate 50 is too light or the friction coefficient of the lower surface 50B of the reference plate 50 is small, when the measurement stage ST2 is driven and the reference plate 50 is slid on the convex portion 64, the reference plate 50 slips too much. Position adjustment may not be performed smoothly. In such a case, the first space K1 is set to a negative pressure so that the reference plate 50 can slide on the convex portion 64, and the lower surface 50B of the reference plate 50 and the convex portion 64 of the suction portion 60 are slightly sucked. In this state, the position of the reference plate 50 can be adjusted smoothly by driving the measurement stage ST2 and sliding the reference plate 50 on the convex portion 64.

  Conversely, when the weight of the reference plate 50 is too heavy, or the friction coefficient of the lower surface 80B of the reference plate 50 is large and the reference plate 50 is difficult to slide on the convex portion 64, as shown in the schematic diagram of FIG. By making the first space K1 slightly positive, the measurement stage ST2 can be driven to smoothly slide the reference plate 50 on the convex portion 64, and the position adjustment of the reference plate 50 can be performed smoothly. Can do.

  Thus, the upper surface of the convex portion 64 and the reference plate 50 are adjusted by adjusting the pressure of the first space K1 according to the state of the reference plate 50 (at least one of the friction coefficient of the lower surface 50B and the weight of the reference plate 50). It is possible to adjust the force acting between the lower surface 50B.

  Moreover, you may use together adjustment of the pressure of 1st space K1, and adjustment of the acceleration when driving the measurement stage ST2. For example, when the reference plate 50 slides too much on the convex portion 64, the acceleration when driving the measurement stage ST2 is reduced. On the other hand, when the reference plate 50 is difficult to slide on the convex portion 64, the acceleration when driving the measurement stage ST2 is increased.

  In the above-described embodiment, the measurement stage ST2 is driven so that the reference plate 50 rotates in the θZ direction. However, the measurement stage ST2 is driven so that the reference plate 50 slides in the X-axis direction and the Y-axis direction. May be. Furthermore, the measurement stage ST2 may be driven in the vertical direction (Z-axis direction) or in the tilt direction.

  In the above-described embodiment, the reference plate 50 is provided to be exchangeable with respect to the measurement stage ST2, and the position of the reference plate 50 is adjusted on the measurement stage ST2 by driving the measurement stage ST2. The reference plate 50 may be provided on the substrate stage ST1. In that case, the position of the reference plate 50 can be adjusted by driving the substrate stage ST1.

  In the above-described embodiment, the control device CONT positions the reference plate 50 with respect to the movable mirror 34 based on the information on the reference position stored in advance in the control device CONT. On the other hand, for example, when a new one of the used reference plate 50 is replaced, before the used reference plate 50 is removed from the measurement stage ST2, the control device CONT uses the second reference mark FM2 on the reference plate 50. The center position J of the alignment system A and the center position C of the index mark of the alignment system ALG are adjusted to a predetermined positional relationship, and the position in the XY direction of the measurement stage ST2 at that time is measured using the interferometer system 40, and the measurement stage The position information of ST2 is stored. Thereafter, the used reference plate 50 is removed from the measurement stage ST <b> 2, and a new reference plate 50 is placed on the suction unit 60. Then, the control device CONT detects the position of the measurement stage ST2 with the interferometer system 40, positions the measurement stage ST2 with respect to the stored position information, and at the position, the second reference mark on the reference plate 50 is obtained. The measurement stage ST2 is pulse-driven so that the reference plate 50 is slid on the suction portion 60 so that the center position J of FM2 and the center position C of the index mark of the alignment system ALG are in a predetermined positional relationship. Also good.

  As described above, the position of the reference plate 50 is adjusted with a simple configuration in which the reference plate 50 is placed on the suction unit 60 of the holding unit 100 and the measurement stage ST2 is driven to slide on the suction unit 60. Can do.

  The exposure apparatus EX in the present embodiment is an immersion exposure apparatus to which an immersion method is applied. The first optical element LS1 of the projection optical system PL is made lyophilic and is a member facing the first optical element LS1, that is, a reference plate. The liquid immersion region LR is maintained in a desired state (shape) by making the upper surface 82 of the measurement stage ST2 including the upper surface 50A of 50 and the upper surface 81 of the substrate stage ST1 including the upper surface Pa of the substrate P liquid-repellent. The occurrence of problems such as the outflow or residual liquid LQ is prevented. In the present embodiment, the reference plate 50 is subjected to a liquid repellent treatment such as applying a liquid repellent material such as a fluorine resin, thereby imparting liquid repellency to the reference plate 50. However, when the measurement operation using the reference plate 50 is performed, if the reference plate 50 is irradiated with the exposure light EL that is ultraviolet light, the liquid repellency of the reference plate 50 may deteriorate. In other words, the exposure of the exposure light EL may deteriorate the liquid repellency of the reference plate 50 over time, and the desired liquid repellency may not be maintained. Therefore, it is necessary to take measures such as replacing the reference plate 50 with a new one, or removing the reference plate 50 from the measurement stage ST2 and performing maintenance. Further, since the reference plate 50 is in contact with the liquid LQ, if a dry residue (a so-called watermark) is formed when the liquid LQ remaining on the reference plate 50 is vaporized, a good measurement process cannot be performed. Even when a residue is formed, the reference plate 50 needs to be replaced or maintained. As described above, in the immersion exposure apparatus EX, when an object in contact with the liquid LQ is made to be liquid repellent by liquid repellency, the state of the exposure light EL or the exposure apparatus EX is measured using the object. When the object is irradiated with the exposure light EL, it is necessary to replace the object in order to maintain desired liquid repellency.

  Even in an exposure apparatus that exposes the optical path of the exposure light EL including the optical path space between the projection optical system PL and the substrate P without filling the liquid LQ, the first reference mark FM1 and the second reference mark in the reference plate 50 FM2 may be damaged for some reason. For this reason, even in an exposure apparatus that performs exposure without filling the liquid LQ, the above-described reference plate 50 needs to be replaced.

  In the present embodiment, the alignment system ALG detects the second reference mark FM2 provided on the reference plate 50, drives the measurement stage ST2 based on the detection result, and slides the reference plate 50 on the suction unit 60. Thus, the position adjustment operation of the reference plate 50 can be performed easily and smoothly. Further, since the reference plate 50 is configured to be sucked and held by the sucking unit 60, the reference plate 50 can be easily and smoothly measured on the measurement stage ST2 without performing a fixing operation (for example, a fixing operation using a bolt or the like) by an operator. It can attach to the holding | maintenance part 100 of this. Moreover, when removing the reference | standard board 50 from measurement stage ST2, it can remove simply by canceling | releasing adsorption | suction holding | maintenance by the adsorption | suction part 60. FIG.

  By the way, after the position adjustment of the reference plate 50 and after the reference plate 50 is adsorbed to the adsorbing portion 60, the gap between the outer side surface 50C (upper surface 50A) of the reference plate 50 and the inner side surface 51C (upper surface 82) of the recess 51 is reduced. A predetermined gap G2 is formed. Since the upper surface 80A and the outer surface 80C of the reference plate 50, or the upper surface 82 of the measurement stage ST2 and the inner surface 51C of the recess 51 are liquid-repellent, even when the liquid LQ is supplied to the upper surface 82 of the measurement stage ST2, The liquid LQ is prevented from entering the gap G2. When the reference plate 50 is vacuum-sucked and held by the suction portion 60, the upper surface of the first peripheral wall portion 61 and the lower surface 50B of the reference plate 50 are in close contact with each other, and the upper surface of the second peripheral wall portion 62 and the lower surface 50B of the reference plate 50 are used. Therefore, even if the liquid LQ enters the second space K2 through the gap G2, the liquid LQ is prevented from entering the first space K1. However, when the first space K1 is set to a negative pressure in order to suck and hold the reference plate 50 by the suction portion 60, the upper surface of the second peripheral wall portion 62 and the reference plate 50 are temporarily arranged as shown in FIG. When a gap is formed between the lower surface 50B and the gas in the second space K2 flows into the first space K1, the second space K2 is made negative, and accordingly the upper surface 50A of the reference plate 50 and the measurement stage There is a possibility that the liquid LQ existing on the upper surface 82 of ST2 enters the second space K2 via the gap G2 and flows into the first space K1.

  In such a case, as shown in FIG. 17B, the control device CONT adjusts the position of the reference plate 50 or adjusts the position of the reference plate 50, and the reference plate 50 is moved by the suction unit 60. After adsorbing and holding, the pressure in the second space K2 is adjusted using the second pressure adjusting device 77 so that the liquid LQ does not enter the first space K1. Specifically, the control device CONT uses the second pressure adjusting device 77 to slightly positively pressure the second space K2. Thereby, the liquid LQ existing on the upper surface 50A of the reference plate 50 and the upper surface 82 of the measurement stage ST2 can be prevented from entering the second space K2 via the gap G2. Therefore, it is possible to prevent the liquid LQ from entering the first space K1. Note that when the control device CONT uses the second pressure adjusting device 77 to slightly increase the positive pressure in the second space K2, the gas in the second space K2 passes through the gap G2 and the upper surface 50A of the reference plate 50 and the measurement. The pressure in the second space K2 is adjusted so that it does not flow into the liquid LQ present on the upper surface 82 of the stage ST2, that is, bubbles are not generated in the liquid LQ.

  Alternatively, as shown in FIG. 17C, without providing the second pressure adjusting device 77, by connecting one end of the flow path 78 to the supply port 75 and connecting the other end to the atmospheric space K3, The second space K2 and the atmospheric space K3 may be connected via the flow path 78 to open the second space K2 to the atmosphere. By doing so, even if a gap is formed between the upper surface of the second peripheral wall portion 62 and the lower surface 50B of the reference plate 50, the second space K2 is suppressed from becoming negative pressure, and the second space K2 Can be maintained at approximately atmospheric pressure. Therefore, a large pressure difference between the space on the upper surface 50A of the reference plate 50 and the upper surface 82 side of the measurement stage ST2 (that is, the space above the gap G2) and the second space K2 (that is, the space below the gap G2). Therefore, the liquid LQ present on the upper surface 50A of the reference plate 50 and the upper surface 82 of the measurement stage ST2 can be prevented from entering the second space K2 via the gap G2. Therefore, it is possible to prevent the liquid LQ from flowing into the first space K1.

<Exposure method>
Next, an example of the parallel processing operation of the substrate stage ST1 and the measurement stage ST2 in the exposure apparatus EX having the above configuration will be described. 18 and 19 are plan views for explaining the parallel processing operation of the substrate stage ST1 and the measurement stage ST2.

  FIG. 18A is a plan view showing a state in which step-and-scan exposure is performed on a substrate P (here, for example, the last substrate in one lot) held on the substrate stage ST1. is there. As shown in FIG. 18A, the substrate stage ST1 is disposed below the projection optical system PL (−Z direction), and the measurement stage ST2 does not collide (contact) with the substrate stage ST1. Waiting at the standby position. The control device CONT performs each shot region on the substrate P based on the result of substrate alignment such as enhanced global alignment (EGA) performed in advance and the measurement result of the baseline amount of the latest alignment system ALG. While repeating the inter-shot moving operation of moving the substrate stage ST1 to the scanning start position for the exposure of the substrate and the scanning exposure operation of transferring the pattern formed on the mask M to each shot region by the scanning exposure method, P exposure processing is performed. During the exposure of the substrate P, the liquid LQ is filled between the first optical element LS1 and the substrate P, and an immersion region LR is formed on the substrate P. Further, the control device CONT detects the surface position information of the upper surface Pa of the substrate P using the focus / leveling detection system 30 during or before the exposure of the substrate P, and based on the detection result, the projection optical system PL The exposure is performed while adjusting the positional relationship between the image plane formed via the liquid LQ and the upper surface Pa of the substrate P.

  When the exposure on the substrate P held on the substrate stage ST1 is completed, the control device CONT controls the driving of the measurement stage drive device SD2 provided in the measurement stage ST2 based on the detection value of the Y-axis interferometer 43. Then, the measurement stage ST2 is moved to the position shown in FIG. 18B, and the + Y side surface of the measurement stage ST2 and the −Y side surface of the substrate stage ST1 are brought into contact with each other. Here, the case where the + Y side surface of the measurement stage ST2 and the −Y side surface of the substrate stage ST1 are brought into contact with each other will be described as an example. However, the detection values of the interference systems 41 and 43 are monitored, and the + Y side surface of the measurement stage ST2 A slight gap (gap) may be provided between the −Y side surface of the substrate stage ST1 and the + Y side surface of the measurement stage ST2 and the −Y side surface of the substrate stage ST1 may be in a non-contact state. Here, the gap provided between the + Y side surface of the measurement stage ST2 and the −Y side surface of the substrate stage ST1 is a value that does not leak due to surface tension even when the liquid LQ is supplied onto the gap (for example, about 300 μm). Set to In the example shown in FIG. 18, the position of the measurement stage ST2 in the X-axis direction is not detected until the measurement stage ST2 and the substrate stage ST1 come into contact with each other, but the position of the measurement stage ST2 in this state in the X-axis direction is not detected. It is desirable to provide an auxiliary laser interferometer that detects.

  Next, the control apparatus CONT moves both stages ST1 and ST2 together in the + Y direction while maintaining the positional relationship between the substrate stage ST1 and the measurement stage ST2 in the Y-axis direction. The control device CONT moves the substrate stage ST1 and the measurement stage ST2 together to move the liquid immersion area LR of the liquid LQ held between the first optical element LS1 of the projection optical system PL and the substrate P. The substrate P, the substrate stage ST1, and the measurement stage ST2 can be moved in this order. During the above movement, the substrate stage ST1 and the measurement stage ST2 maintain the positional relationship in contact with each other.

  FIG. 19A shows a state when the immersion region LR of the liquid LQ is simultaneously present on the substrate stage ST1 and the measurement stage ST2 during the movement of the substrate stage ST1 and the measurement stage ST2 in the + Y direction, that is, It is a figure which shows the state immediately before the liquid LQ is moved on the measurement stage ST2 from the substrate stage ST1. The control device CONT further moves the substrate stage ST1 and the measurement stage ST2 together in the + Y direction by a predetermined distance from the state shown in FIG. 19A, so that the liquid LQ as shown in FIG. The liquid immersion region LR can be moved onto the measurement stage ST2. In this state, the liquid LQ is held between the first optical element LS1 of the projection optical system PL and the measurement stage ST2. Prior to this, the control device CONT resets the X-axis interferometer 42 at any time when the interferometer beam from the X-axis interferometer 42 is irradiated on the reflecting surface 34X of the measurement stage ST2. To do.

  Next, the control device CONT manages the position of the substrate stage ST1 based on the detection values of the X-axis interferometer 42s and the Y-axis interferometer 41s, and controls the drive of the substrate stage drive device SD1 to obtain a predetermined loading position. Then, the substrate stage ST1 is moved, and the exposed substrate P is replaced with a new substrate P (here, the first substrate of the next lot). In parallel with this, the control device CONT performs predetermined measurement using the measurement stage ST2 as necessary. As this measurement, for example, the measurement of the baseline amount of the alignment system ALG performed after the mask exchange on the mask stage MST is given as an example.

  FIG. 20 is a plan view showing the positional relationship between the substrate stage ST1 and the measurement stage ST2 when measuring the baseline amount. When the substrate stage ST1 is disposed at the loading position, as shown in FIG. 20A, the beam from the Y-axis interferometer 41 is projected onto the reflecting surface 34Ys provided on the measurement stage ST2. Therefore, the control device CONT monitors the detection values of the X-axis interferometer 42 and the Y-axis interferometer 41, and controls the drive of the measurement stage drive device SD2 provided in the measurement stage ST2 to project the reference plate 50. Position below the optical system PL. As shown in FIG. 20A, the specific position where the reference plate 50 is positioned is the first position at or near the position where the image of the mask alignment mark formed on the mask M by the projection optical system PL is projected. 1 is a position where each of the fiducial marks FM11 and FM12 (see FIG. 3) is arranged. Here, the beam from the Y-axis interferometer 43 is also projected onto the reflecting surface 34Y provided on the measurement stage ST2, but the baseline amount error is caused by the scaling error between the Y-axis interferometer 41 and the Y-axis interferometer 43. In order to avoid this, the Y-axis interferometer 41 that detects the position of the substrate stage ST1 in the Y-axis direction is used to detect the position of the measurement stage ST2 in the Y-axis direction.

  When the positioning of the reference plate 50 is completed, the control device CONT irradiates the mask alignment mark with the exposure light EL by the illumination optical system IL in a state where the first optical element LS1 of the projection optical system PL and the reference plate 50 are opposed to each other. Then, the image of the mask alignment mark is projected on or near the first reference marks FM11 and FM12 via the projection optical system PL and the liquid LQ. Also at this time, the liquid LQ is filled between the first optical element LS1 of the projection optical system PL and the reference plate 50. The light beams that have passed through the first fiducial marks FM11 and FM12 are collected by a condensing lens 56 provided in the aerial image measuring device 55 shown in FIG. 5, and are guided to a photoelectric conversion element (not shown) via an optical fiber 57 to receive light. Is done. At this time, a detection signal having a signal intensity corresponding to the degree of overlap between the mask alignment mark and the first reference marks FM11 and FM12 is output from the photoelectric conversion element to the control device CONT. The control device CONT finely moves the measurement stage ST2 in the XY plane while monitoring the detection values of the X-axis interferometer 42 and the Y-axis interferometer 41, and detects the detection signal of the photoelectric conversion element provided in the aerial image measuring device 55. Based on the change and the detection results of the X-axis interferometer 42 and the Y-axis interferometer 41, the projection center of the projection optical system PL in the coordinate system defined by the interferometer system 40 is obtained. Thereby, the positional relationship between the projection image projected by the projection optical system PL and the substrate stage ST1 is obtained. As described above, the control apparatus CONT uses the reference plate 50, the aerial image measuring instrument 55, the interferometer system 40, and the like as the state of the exposure apparatus EX, and the projection image projected by the projection optical system PL and the substrate stage ST1. Find the positional relationship.

  Next, the control device CONT monitors the detection values of the X-axis interferometer 42 and the Y-axis interferometer 41, and controls the driving of the measurement stage drive device SD2, so that the reference plate 50 provided on the measurement stage ST2 is adjusted. Position below the alignment system ALG. Here, as shown in FIG. 20B, the specific position where the reference plate 50 is positioned is that the second reference mark FM2 formed on the reference plate 50 is in the detection region (detection field) of the alignment system ALG. It is the position to be placed. When the positioning of the reference plate 50 is completed, the position of the second reference mark FM2 is detected by the alignment system ALG, and the control device CONT detects the detection result of the alignment system ALG and the detection results of the X-axis interferometer 42 and the Y-axis interferometer 41. Based on the above, the detection center (detection reference) of the alignment system ALG in the coordinate system defined by the interferometer system 40 is obtained. Next, the control device CONT calculates the baseline amount based on the projection center of the projection optical system PL and the detection center of the alignment system ALG in the coordinate system defined by the interferometer system 40 obtained as described above. , Memorize the obtained baseline amount. As described above, the control device CONT uses the reference plate 50, the alignment system ALG, the interferometer system 40, and the like to obtain the baseline amount as the state of the exposure apparatus EX.

  The control unit CONT measures the baseline amount of the alignment system ALG, a plurality of mask alignment marks formed on the mask M, and a total of six first reference marks formed corresponding to the mask alignment marks. Using the FM1, the mask alignment system moves the relative position between at least two pairs of the first reference mark FM1 and the corresponding mask alignment mark by stepping at least one of the mask stage MST and the substrate stage ST1 in the Y-axis direction. So-called mask alignment, which is measured using RAa and RAb, is performed. In this case, the mark detection using the mask alignment systems RAa and RAb is performed via the projection optical system PL and the liquid LQ.

  When the replacement operation of the substrate P on the substrate stage ST1 and the measurement operation using the measurement stage ST2 are completed, the control device CONT brings the measurement stage ST2 and the substrate stage ST1 into contact with each other and maintains the state of the XY plane. To return the substrate stage ST1 to a position immediately below the projection optical system PL. Even during this movement, the control device CONT resets the X-axis interferometer 42 at any time when the beam from the X-axis interferometer 42 is irradiated onto the reflecting surface 33X of the substrate stage ST1. Note that when the measurement stage ST2 and the substrate stage ST1 come into contact with each other, the beam from the Y-axis interferometer 41 is projected onto the reflecting surface 33Y of the substrate stage ST1. On the substrate stage ST1 side, substrate alignment is performed on the substrate P after replacement, that is, the alignment mark on the substrate P after replacement is detected by the alignment system ALG, and EGA calculation is performed to perform a plurality of shots on the substrate P. The position coordinates of the area are calculated.

  Thereafter, the control device CONT moves the substrate stage ST1 and the measurement stage ST2 together in the −Y direction while maintaining the positional relationship in the Y-axis direction between the substrate stage ST1 and the measurement stage ST2 in the opposite direction. After moving the substrate stage ST1 (substrate P) below the projection optical system PL, the measurement stage ST2 is retracted to a predetermined position. Then, the controller CONT performs a step-and-scan exposure operation on the new substrate P in the same manner as described above, and sequentially transfers the pattern of the mask M to a plurality of shot areas on the substrate P.

  In the above description, the case where the baseline measurement is performed as the measurement operation has been described. However, the present invention is not limited to this, and the control device CONT performs the measurement stage while exchanging the substrate P on the substrate stage ST1 side. Using the reference plate 50 provided in ST2 and the aerial image measuring instrument 55 provided under the reference plate 50, the aerial image measurement can be performed as the state of the exposure apparatus EX. Then, the control device CONT may reflect the measurement result of the aerial image measuring instrument 55 on the subsequent exposure of the substrate P. Alternatively, the control device CONT performs wavefront aberration measurement using the wavefront aberration measuring device 159 provided on the measurement stage ST2, or performs illuminance measurement, illuminance unevenness measurement, and the like using the exposure detector 162, and then outputs the measurement results thereafter. You may make it reflect in exposure of the board | substrate P performed. Specifically, for example, based on the measurement result, the image is projected by an imaging characteristic adjusting device as disclosed in Japanese Patent Laid-Open Nos. 60-78454, 11-195602, and 2003/65428. The optical characteristics of the optical system PL can be adjusted.

The liquid LQ in the above-described embodiment is water, but it may be a liquid other than water. For example, when the light source of the exposure light EL is an F ₂ laser, the F ₂ laser light does not transmit water. Therefore, the liquid LQ may be, for example, a fluorinated fluid such as perfluorinated polyether (PFPE) or fluorinated oil that can transmit F ₂ laser light.

  As the substrate P in the above-described embodiment, not only a semiconductor wafer for manufacturing a semiconductor device but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Further, as the exposure apparatus EX, a reduced image of the first pattern is projected with the first pattern and the substrate P being substantially stationary (for example, a refraction type projection optical system that does not include a reflecting element at 1/8 reduction magnification). The present invention can also be applied to an exposure apparatus that performs batch exposure on the substrate P using the above. In this case, after that, with the second pattern and the substrate P substantially stationary, a reduced image of the second pattern is collectively exposed onto the substrate P by partially overlapping the first pattern using the projection optical system. It can also be applied to a stitch type batch exposure apparatus. Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  The present invention can also be applied to a twin stage type exposure apparatus disclosed in Japanese Patent Application Laid-Open No. 10-163099, Japanese Patent Application Laid-Open No. 10-214783, and Japanese Translation of PCT International Publication No. 2000-505958.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ) Or an exposure apparatus for manufacturing reticles or masks.

  The exposure apparatus EX according to the embodiment of the present application is manufactured by assembling various subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Is done. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 21, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a base material of the device. Manufacturing step 203, exposure processing step 204 for exposing the mask pattern onto the substrate by the exposure apparatus EX of the above-described embodiment, device assembly step (including dicing process, bonding process, packaging process) 205, inspection step 206, etc. It is manufactured after.

It is a schematic block diagram which shows one Embodiment of exposure apparatus. It is a schematic perspective view which shows a substrate stage and a measurement stage. It is the top view which looked at the measurement stage from the upper part. It is a figure which shows an example of a reference mark. It is a sectional side view which shows a reference | standard board and an aerial image measuring device. It is a sectional side view which shows the holding | maintenance part holding a reference | standard board. It is a top view which shows the holding | maintenance part holding a reference | standard board. It is a flowchart for demonstrating 1st Embodiment of the adjustment method. It is a schematic diagram for demonstrating 1st Embodiment of the adjustment method. It is a figure for demonstrating the operation | movement which slides a reference | standard board on a holding | maintenance part. It is a schematic perspective view which shows a mark detection system. It is a figure which shows the parameter | index plate provided in the mark detection system. It is a figure which shows an example of the detection result by a mark detection system. It is a schematic diagram for demonstrating the operation | movement which adjusts the position of a reference | standard board. It is a schematic diagram for demonstrating 1st Embodiment of the adjustment method. It is a schematic diagram for demonstrating 2nd Embodiment of the adjustment method. It is a schematic diagram for demonstrating the operation | movement which adjusts the pressure of the space formed between a reference | standard board and a holding | maintenance part. It is a figure for demonstrating one Embodiment of the exposure method. It is a figure for demonstrating one Embodiment of the exposure method. It is a figure for demonstrating one Embodiment of the exposure method. It is a flowchart figure for demonstrating an example of the manufacturing process of a microdevice.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Liquid immersion device, 34 ... Moving mirror, 40 ... Interferometer system (detection device), 50 ... Reference | standard board (object), 54 ... Guide member, 55 ... Aerial image measuring device (detection device), 60 ... Adsorption part ( Holding unit), 100 ... Holding unit, ALG ... Alignment system (detection device, mark detection system), CONT ... Control device, EX ... Exposure device. FM1 ... first reference mark, FM2 ... second reference mark, K1 ... first space, K2 ... second space, LQ ... liquid, SD1 ... substrate stage driving device, SD2 ... measurement stage driving device, ST1 ... substrate stage (first) 1 stage), ST2 ... Measurement stage (2nd stage)

Claims (10)

In an adjustment method for adjusting the position of an object,
Transport the object to a movable stage holder,
An adjustment method comprising adjusting the position of the object by driving the stage and sliding the object on the holding unit. Detecting a mark provided on the object;
The adjustment method according to claim 1, wherein the driving of the stage is controlled based on the detection result.   The adjustment method according to claim 1, wherein the object is sucked by the holding unit after the position of the object is adjusted.   The adjustment method according to claim 1, wherein the sliding movement of the object is guided by a guide member.   5. The adjustment method according to claim 1, wherein when adjusting the position of the object, a pressure in a space formed between the object and the holding unit is adjusted.   The adjustment method according to claim 1, wherein at least a part of the object is subjected to a liquid repellent treatment. In an exposure apparatus that exposes a pattern onto a substrate via a liquid,
A first stage that holds and moves the substrate;
A second stage for moving an object different from the substrate;
An exposure apparatus comprising: a control device that drives the second stage to slide the object when positioning the object on the second stage.   8. The exposure apparatus according to claim 7, further comprising a detection device that detects the state of the exposure apparatus using the object. A mark detection system for detecting a mark provided on the object;
9. The exposure apparatus according to claim 7, wherein the control device drives the stage based on a detection result of the mark detection system. An interferometer for detecting the position of the second stage in cooperation with a movable mirror provided on the second stage;
The exposure apparatus according to claim 7, wherein the control device positions the object with respect to the movable mirror.

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