JP2006278426A - Optical coupling device, lead frame used therefor and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To ensure reliability while miniaturizing a device in the optical coupling device realized as a photocoupler or a semiconductor relay and fabricated, in such a way that a light-emitting element and a light-receiving element are mutually arranged on a lead frame so as be opposed each other, the elements thereof are covered with a primary transmissive package, and the outer portion of the primary optical package is covered with a secondary package having a light shielding performance and moisture non-permeability. <P>SOLUTION: A width extension 21a formed by extending the width near a lead terminal 27 to an element side is formed in the edge 21b of the element side of the primary tie bar 21 of the lead frame for preventing leakage of a mold resin in molding of the primary package 23. As a result, when the primary tie bar 21 is cut after the primary molding and secondary molding is performed, even a thin secondary package 24 positively covers a portion to the width extension 21a. Thus, the primary package 23 can be prevented from being exposed to the outside and permeation of moisture through the primary package 23 can be positively prevented. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an optical coupling element such as a photocoupler or a semiconductor relay, a lead frame used therefor, and a method for manufacturing the optical coupling element.

  As shown in FIG. 9, the optical coupling element such as the photocoupler or the semiconductor relay has a light emitting element 1 and a light receiving element 2 disposed inside each other, and a light-transmitting primary package 3 is provided between them. It is manufactured by covering and covering the outside of the primary package 3 with a secondary package 4 having light-shielding properties and moisture-impermeable properties. The structure of FIG. 9 is shown in Patent Document 1.

  The manufacturing process of the optical coupling element will be described in detail with reference to FIGS. First, the light emitting element 1 is mounted on the lead frame 5, the light receiving element 2 is mounted on the lead frame 6, and they are combined (see FIG. 9). FIG. 10 shows the lead frame 10 before the light emitting element 1 and the light receiving element 2 are mounted. In FIG. 11, the light emitting element 1 and the light receiving element 2 are mounted on the lead frame 10. However, in FIG. 9 described above, the light-emitting element 1 and the light-receiving element 2 are disposed to face each other in the thickness direction. However, in FIGS. The element 2 is shown facing the surface direction, and the lead frames 5 and 6 on which the elements 2 are mounted are combined and shown as a lead frame 10.

  Thereafter, the packages 3 and 4 are molded by a method called transfer molding, which is a general molding process of the optical coupling element. In this method, first, a primary tie bar 11 of a lead frame 10 on which the light emitting element 1 and the light receiving element 2 are mounted is sandwiched between an upper mold and a lower mold so that the mold resin does not leak, and the translucent mold is used. Primary molding is performed to fill the resin and form the primary package 3 as shown in FIG.

  Next, as shown in FIG. 13, the primary tie bar 11 and the resin burr 15 are cut, and then the secondary tie bar 12 is sandwiched between the upper mold and the lower mold so that the mold resin does not leak, Secondary molding for filling the light-shielding mold resin and forming the secondary package 4 as shown in FIG. 14 is performed. Thereafter, as shown in FIG. 15, the secondary tie bar 12 and the resin burr 16 are cut, and as shown in FIG. 16, the terminals are divided into individual optical coupling elements, and the lead terminals 17 are plated with solder. Processing is performed. FIG. 16 is an enlarged view showing one divided optical coupling element, (a) is a plan view, (b) is a side view, and (c) is a section line of (b). It is sectional drawing seen from AA.

Here, in Patent Document 2, conventionally, the base of the outer lead is covered with a tie bar or a resin film so that the mold resin is dammed and prevented from leaking. By cutting out a part of the extended portion, the cutout portion is used as a resin reservoir for the mold resin, and the mold resin is prevented from leaking further outward, thereby eliminating the need for the tie bar or resin film. A lead frame for a semiconductor device is shown. However, since this conventional technique is intended for a multi-pin semiconductor device, a semiconductor device with a small number of pins, such as an optical coupling element assumed by the present invention, has a wide interval between outer leads, This technology is not applicable.
Japanese Patent Laid-Open No. 5-110128 JP-A-8-204101

  The optocoupler is also required to be downsized as in general electronic components, that is, the secondary package 4 is required to be downsized. On the other hand, considering the current capacity and reliability of the light emitting element 1, the light receiving element 2, and other mounted elements, there is a demand for the primary package 3 to be as large as possible. Therefore, in order to meet these demands, it is necessary to reduce the thickness of the secondary package 4.

  However, when the thickness of the secondary package 4 is reduced, the primary package 3 is exposed to the outside of the secondary package 4 as shown by a portion C in FIG. 17 in which the portion B in FIG. 16 is enlarged. This is because the lead frame 10 is continuously formed in a strip shape (FIG. 18 shows the continuous lead frame in a state after the secondary molding shown in FIG. 14), and the primary shown in FIG. When the tie bar 11 is cut one after another with a cutter, a certain degree of clearance is secured, and due to wear of the cutter, the primary package 3 has more This is because the resin burr 15 in the inner part may not be completely removed. For example, the outer diameter of the secondary package 4 is 4.4 mm square, and the terminal width is 0.4 mm.

  On the other hand, it is difficult to add impurities to the mold resin of the primary package 3 in order to transmit light, resulting in poor moisture resistance. Therefore, when the primary package 3 is exposed as described above, moisture enters from that portion, causing a problem in reliability such as corrosion of the internal aluminum pattern.

  An object of the present invention is to provide an optical coupling element capable of ensuring reliability in downsizing, a lead frame used therefor, and a method for manufacturing the optical coupling element.

  In the optical coupling element of the present invention, at least a light emitting element and a light receiving element are arranged opposite to each other on a lead frame, and these element parts are covered with a translucent primary package, and at least the outside of the primary package is shielded from light. In an optical coupling element manufactured by covering with a secondary package having heat resistance and moisture permeability, a portion near the lead terminal is widened on the element side at the element side edge of the primary tie bar of the lead frame. Features.

  According to the above configuration, it is realized as a photocoupler, a semiconductor relay or the like, and at least the light emitting element and the light receiving element are arranged opposite to each other on the lead frame, and these element parts are covered with a light-transmitting primary package, In the optical coupling element manufactured by covering the outside of the primary package with a secondary package having at least light-shielding and moisture-impermeable properties, the lead frame primary prevents leakage of mold resin when the primary package is molded. At the edge of the tie bar on the element side, a portion near the lead terminal is formed wider on the element side.

  Therefore, when the primary tie bar is cut after the primary molding and the secondary molding is performed, the secondary package covers up to the widened portion of the primary tie bar even if it is a thin secondary package. Therefore, the primary package is not exposed to the outside, and moisture can be reliably prevented from entering through the primary package. Thus, reliability can be ensured in downsizing.

  In the lead frame for an optical coupling element of the present invention, at least a light emitting element and a light receiving element are disposed opposite to each other on the lead frame, and these element portions are covered with a light-transmitting primary package. In the lead frame for an optical coupling element manufactured by covering at least the outer side with a secondary package having light-shielding and moisture-impermeable properties, the vicinity of the lead terminal is on the element side at the element side edge of the primary tie bar. Widened to form.

  According to the above configuration, it is realized as a photocoupler, a semiconductor relay or the like, and at least the light emitting element and the light receiving element are arranged opposite to each other on the lead frame, and these element parts are covered with a light-transmitting primary package, In a lead frame for an optical coupling element manufactured by covering the outer side of the primary package with at least a light-shielding and moisture-impermeable secondary package, preventing leakage of mold resin when the primary package is molded 1 At the edge of the next tie bar on the element side, the portion near the lead terminal is widened to the element side.

  Therefore, when the primary tie bar is cut after the primary molding and the secondary molding is performed, the secondary package is sure to reach the widened portion of the primary tie bar even if it is a thin secondary package. Therefore, the primary package is not exposed to the outside, and moisture can be reliably prevented from entering through the primary package. Thus, reliability can be ensured in downsizing.

  Furthermore, in the method for manufacturing an optical coupling element according to the present invention, at least a light emitting element and a light receiving element are arranged opposite to each other on a lead frame, and these element portions are covered with a translucent primary package. In a method for manufacturing an optical coupling element manufactured by covering the outside of a package with a secondary package having at least light-shielding and moisture-impermeable properties, the lead terminal vicinity portion is on the element side at the element-side edge of the primary tie bar. A step of punching the lead frame from the metal plate together with a secondary tie bar, an element mounting portion and a lead terminal portion so as to widen, a step of mounting at least a light emitting element and a light receiving element on the lead frame, A primary molding process in which a primary tie bar of a lead frame on which a light receiving element is mounted is sandwiched between an upper mold and a lower mold and filled with mold resin. A step of cutting a primary tie bar of the lead frame formed by the primary molding, and a secondary molding step of filling the mold resin by sandwiching the secondary tie bar of the lead frame cut by the tie bar between an upper die and a lower die, The method further comprises a step of cutting a secondary tie bar of the secondary-shaped lead frame, and a step of individually dividing each optical coupling element from the lead frame and processing a terminal.

  According to the above configuration, it is realized as a photocoupler, a semiconductor relay or the like, and at least the light emitting element and the light receiving element are arranged opposite to each other on the lead frame, and these element parts are covered with a light-transmitting primary package, In the manufacturing method of an optical coupling element manufactured by covering the outside of the primary package with a secondary package having at least light-shielding properties and moisture-impermeable properties, the mold of the primary package is formed by punching the lead frame from the metal plate. At the edge of the primary tie bar on the element side that prevents leakage of the mold resin at the time, a portion near the lead terminal is widened on the element side.

  Therefore, when the primary tie bar is cut after the primary molding and the secondary molding is performed, the secondary package is sure to reach the widened portion of the primary tie bar even if it is a thin secondary package. Since it covers, the primary package is not exposed to the outside, and moisture can be reliably prevented from entering through the primary package. Thus, reliability can be ensured in downsizing.

  Moreover, the manufacturing method of the optical coupling element of this invention sets a cutter blade so that it may cover in the said widened part in the process of the cutting of the said primary tie bar.

  According to said structure, even if the clearance at the time of the cut of the primary tie bar cut continuously is ensured, it sets so that a cutter blade may be applied to the said widening part (a part is shaved off). Thus, at the side of the primary package, the resin burrs can be reliably removed from between the lead terminals, and chips at the time of tie bar cutting adhere to the resin burrs and short-circuit between the lead terminals. Such troubles can also be prevented in advance.

  As described above, the optical coupling element of the present invention, the lead frame used therefor, and the manufacturing method of the optical coupling element are realized as a photocoupler, a semiconductor relay, or the like, and at least the light emitting element and the light receiving element face each other on the lead frame. In the optical coupling element which is arranged and covered by covering the element part with a light-transmitting primary package and covering the outside of the primary package with a secondary package having at least light-shielding property and moisture-impermeable property, At the edge portion on the element side of the primary tie bar of the lead frame that prevents leakage of the mold resin during molding of the next package, a portion near the lead terminal is widened on the element side.

  Therefore, when the primary tie bar is cut after the primary molding and the secondary molding is performed, even if the secondary package is thin, the secondary package extends to the widened portion of the primary tie bar. Since it covers reliably, a primary package is not exposed outside and it can prevent reliably that a water | moisture content penetrate | invades through this primary package. Thus, reliability can be ensured in downsizing.

[Embodiment 1]
FIG. 1 is a front view of a lead frame 20 used in an optical coupling element according to an embodiment of the present invention. The optical coupling element of the present invention is also realized as a photocoupler, a semiconductor relay, or the like, and is configured as shown in FIG. 9, for example. Compared with the conventional lead frame 10 shown in FIG. 10 described above, the lead frame 20 of the present embodiment is notable in the edge portion 21b on the element side such as the light emitting element 1 and the light receiving element 2 of the primary tie bar 21. In other words, it has a widened portion 21a in which the vicinity of the lead terminal 27 is widened on the element side. The shape of the secondary tie bar 22 is the same as that of the conventional secondary tie bar 12.

  2-7 is a figure explaining in detail the manufacturing process of the optical coupling element which concerns on one Embodiment of this invention. Each of the steps in FIGS. 2 to 7 corresponds to the steps in FIGS. 11 to 16 described above, and the work contents in each step are the same.

  As shown in FIG. 2, when the chip mounting of the light emitting element 1 and the light receiving element 2 on the lead frame 20 is completed, the process proceeds to a double transfer molding process. First, the primary tie bar 21 of the lead frame 20 is moved to the upper mold and the lower mold. In order to prevent the mold resin from leaking out, filling with a translucent mold resin, primary molding is performed to form the primary package 23 as shown in FIG.

  Next, as shown in FIG. 4, the primary tie bar 21 and the resin burr 25 are cut, and then the secondary tie bar 22 is sandwiched between the upper mold and the lower mold so that the mold resin does not leak out. The mold resin is filled and secondary molding is performed to form the secondary package 24 as shown in FIG. Thereafter, as shown in FIG. 6, the secondary tie bar 22 and the resin burr 26 are cut, and as shown in FIG. 7, the terminal processing such as dividing into individual optical coupling elements and solder plating on the lead terminals 27 is performed. I do. FIG. 7 is an enlarged view showing one divided optical coupling element, (a) is a plan view, (b) is a side view, and (c) is a section line of (b). It is sectional drawing seen from DD.

  In the optical coupling element of the present invention manufactured as described above, by forming the widened portion 21a in which the portion near the lead terminal 27 is widened on the element side at the element-side edge 21b of the primary tie bar 21, As shown in the F part of FIG. 8 in which the E part of FIG. 7 is enlarged, even if the primary tie bar 21 cannot be completely removed with the cutter blade, the thin secondary package 24 is not covered with the widened part 21a. Since it covers reliably, it can prevent that the primary package 23 inferior to moisture resistance will be exposed outside. Thereby, reliability can be ensured in downsizing.

  Further, even if a clearance for cutting the primary tie bar 21 that is continuously punched is secured, the cutter blade is set so as to be applied to the widened portion 21a (a part thereof is cut off). 4, the resin burr 25 can be reliably removed from between the lead terminals 27 at the side portion of the primary package 23 indicated by reference numeral 30, and chips from the tie bar cut adhere to the resin burr 25. Occurrence of a problem that short-circuits between the lead terminals 27 can also be prevented.

  Here, Japanese Utility Model Laid-Open No. 3-65255 discloses a lead frame that prevents intrusion of moisture by providing irregularities on the contact surface with the mold resin when performing the double transfer molding as described above. Yes. However, even with this conventional technique, the exposure of the primary package as described above still occurs. Also in the present invention, this conventional technique may be employed on the contact surface between the primary package 23 and the secondary package 24 and the lead frame 20 to improve the adhesion.

It is a front view of the lead frame used for the optical coupling element which concerns on one Embodiment of this invention. It is a figure for demonstrating the manufacturing process of the optical coupling element of one Embodiment of this invention, and is a front view of the state which mounted the element. It is a figure for demonstrating the manufacturing process of the optical coupling element of one Embodiment of this invention, and is a front view of the state shape | molded primarily. It is a figure for demonstrating the manufacturing process of the optical coupling element of one Embodiment of this invention, and is a front view of the state which cut the primary tie bar. It is a figure for demonstrating the manufacturing process of the optical coupling element of one Embodiment of this invention, and is a front view of the state shape | molded secondary. It is a figure for demonstrating the manufacturing process of the optical coupling element of one Embodiment of this invention, and is a front view of the state which cut the secondary tie bar. It is a figure for demonstrating the manufacturing process of the optical coupling element of one Embodiment of this invention, and is a figure which expands and shows one divided optical coupling element. It is sectional drawing which expands and shows a part of FIG. 7 for demonstrating the effect of the optical coupling element of one Embodiment of this invention. It is sectional drawing which shows the structure of a common optical coupling element. It is a figure for demonstrating the manufacturing process of the conventional optical coupling element, and is a front view of a lead frame. It is a figure for demonstrating the manufacturing process of the conventional optical coupling element, and is a front view of the state which mounted the element. It is a figure for demonstrating the manufacturing process of the conventional optical coupling element, and is a front view of the state shape | molded primarily. It is a figure for demonstrating the manufacturing process of the conventional optical coupling element, and is a front view of the state which cut the primary tie bar. It is a figure for demonstrating the manufacturing process of the conventional optical coupling element, and is a front view of the state shape | molded secondary. It is a figure for demonstrating the manufacturing process of the conventional optical coupling element, and is a front view of the state which cut the secondary tie bar. It is a figure for demonstrating the manufacturing process of the conventional optical coupling element, and is a figure which expands and shows one divided optical coupling element. It is sectional drawing which expands and shows a part of FIG. 16 for demonstrating the problem of the conventional optical coupling element. It is a perspective view of a series of lead frames in a state of secondary molding.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light emitting element 2 Light receiving element 3 Primary package 4 Secondary package 20 Lead frame 21 Primary tie bar 21a Widening part 21b Element side edge 22 of primary tie bar 23 Secondary tie bar 23 Primary package 24 Secondary package 25, 26 Resin burr 27 Lead terminal 30 Side of primary package

Claims (4)

At least a light emitting element and a light receiving element are arranged opposite to each other on the lead frame, and these element portions are covered with a light-transmitting primary package, and the outside of the primary package is at least light-shielding and moisture-impermeable 2. In the optical coupling device manufactured by covering with the next package,
An optical coupling element, wherein a portion near a lead terminal is widened to the element side at an element side edge of a primary tie bar of the lead frame. At least a light emitting element and a light receiving element are arranged opposite to each other on the lead frame, and these element portions are covered with a light-transmitting primary package, and the outside of the primary package is at least light-shielding and moisture-impermeable 2. In the lead frame for the optical coupling element manufactured by covering with the next package,
A lead frame for an optical coupling element, wherein a portion near a lead terminal is widened to an element side at an element side edge of a primary tie bar. At least a light emitting element and a light receiving element are arranged opposite to each other on the lead frame, and these element portions are covered with a light-transmitting primary package, and the outside of the primary package is at least light-shielding and moisture-impermeable 2. In the manufacturing method of the optical coupling element manufactured by covering with the next package,
A step of punching the lead frame from the metal plate together with the secondary tie bar, the element mounting portion, and the lead terminal portion so that the vicinity of the lead terminal is widened to the element side at the element side edge of the primary tie bar;
Mounting at least a light emitting element and a light receiving element on the lead frame;
A primary molding step of filling a mold resin by sandwiching a primary tie bar of a lead frame on which the light emitting element and the light receiving element are mounted between an upper mold and a lower mold;
Cutting the primary tie bar of the primary molded lead frame;
A secondary molding step of filling a mold resin by sandwiching a secondary tie bar of the tie bar cut lead frame between an upper die and a lower die;
Cutting a secondary tie bar of the secondary molded lead frame;
A step of individually dividing each optical coupling element from the lead frame and processing a terminal.   4. The method of manufacturing an optical coupling element according to claim 3, wherein in the step of cutting the primary tie bar, a cutter blade is set so as to cover the widened portion.

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