JP2006265539A - Flame-retardant resin composition - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin composition having improved flame retardancy and electric characteristics. <P>SOLUTION: The flame-retardant resin composition having the improved electric characteristics is constituted of a base resin, a halogen-based flame retardant (such as a brominated polybenzyl (meth)acrylate and brominated polystyrene), and at least one kind of an oxyacid component selected from an organic phosphonous or phosphonic acid compound (such as an alkyl phosphonite or phosphonate, an alkylidenediphosphonic acid, a nitrilotrisalkylenephosphonic acid or a salt thereof), an organic sulfonic acid compound (such as an alkanesulfonic acid) and salts thereof. The resin composition may contain a flame retardant synergist, an olefinic resin and/or an electric characteristic-improving auxiliary besides them. The proportion of each component is 3-30 pts.wt. halogen-based flame retardant and 1-30 pts.wt. oxyacid component based on 100 pts.wt. base resin. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a resin composition having excellent flame retardancy and a molded article formed from the flame retardant resin composition.

  Among thermoplastic resins, polyester resins such as polybutylene terephthalate (PBT) and polyamide resins have excellent mechanical properties, electrical properties, weather resistance, water resistance, chemical resistance, and solvent resistance. It is used for various applications such as electrical / electronic parts, mechanical mechanism parts, and automobile parts. On the other hand, as the application field expands, the thermoplastic resin is required to be flame retardant for safety as well as improved mechanical properties. In general, a method of making a flame retardant by adding a halogen-based flame retardant, a non-halogen-based flame retardant such as a phosphorus compound or a nitrogen-containing compound to a thermoplastic resin is known.

  Japanese Unexamined Patent Publication No. 2001-288361 (Patent Document 1) discloses a flame retardant resin composition containing a flame retardant such as a synthetic resin such as a polyamide resin and a salt of an amino group-containing nitrogen compound and an organic sulfonic acid. Yes. However, such a non-halogen flame retardant has lower flame retardancy than a halogen flame retardant, and it is difficult to make the resin flame-retardant in a small amount, and the moldability is significantly lowered.

On the other hand, in Japanese Patent Application Laid-Open No. 10-114854 (Patent Document 2) and Japanese Patent Application Laid-Open No. 10-273589 (Patent Document 3), a composition containing a polyester resin or a polyamide resin, a halogenated flame retardant or the like is used. Disclosed is a flame retardant resin molding composition with improved electrical properties comprising an effective amount of pyro / polyphosphate metal salt to improve (such as comparative tracking index). However, even when a halogen-based flame retardant and pyro / polyphosphate are used in combination, the effect of improving the comparative tracking index is insufficient, and it is difficult to achieve both flame retardancy and electrical characteristics.
JP 2001-288361 A (Claim 4) JP-A-10-11854 (Claim 1 and Example) JP-A-10-273589 (Claim 1 and Example)

  Accordingly, an object of the present invention is to provide a flame retardant resin composition that can improve flame retardancy while maintaining moldability of a base resin, and is excellent in electrical characteristics, and a molded product thereof.

  Another object of the present invention is to provide a flame retardant resin composition having further improved electrical characteristics such as tracking resistance and a molded product thereof.

  As a result of intensive studies to achieve the above-mentioned problems, the present inventors have combined a halogen-based flame retardant with a specific oxygen acid component (an organic (sub-) phosphonic acid compound, an organic sulfonic acid compound, or a salt thereof). The inventors have found that flame retardancy and electrical characteristics can be improved while maintaining the moldability of the base resin, and the present invention has been completed.

  That is, the flame retardant resin composition of the present invention comprises at least one oxygen selected from a base resin, a halogen flame retardant, an organic (sub) phosphonic acid compound or a salt thereof, and an organic sulfonic acid compound or a salt thereof. It is composed of an acid component and has excellent electrical characteristics. The halogen-based flame retardant includes bromine-containing acrylic resin, bromine-containing styrene resin, bromine-containing polycarbonate resin, bromine-containing epoxy compound (including bromine-containing phenoxy resin), bromine-containing phosphate ester, bromine-containing triazine compound, bromine It may be a bromine atom-containing flame retardant such as a containing isocyanuric acid compound, a brominated polyarylether compound, a brominated aromatic imide compound, or a brominated bisaryl compound. The organic (phosphorous) phosphonic acid compound may be a compound represented by the following formula (1), and the organic sulfonic acid compound may be a compound represented by the following formula (2).

(In the formula, R ¹ and R ² are the same or different and each represents a hydrogen atom or a hydrocarbon group. X represents an n-valent organic group, n represents an integer of 1 to 6. m is 1 or 0. is there)
R ³ —S (═O) ₂ —OH (2)
(Wherein R ³ represents a monovalent organic group)
The salt-forming component that forms the salt of the organic (phosphorous) phosphonic acid compound and the salt of the organic sulfonic acid compound may be at least one selected from a metal and a nitrogen-containing compound having an amino group. The resin composition may contain about 3 to 30 parts by weight of a halogen-based flame retardant and about 1 to 30 parts by weight of an oxygen acid component with respect to 100 parts by weight of the base resin. The proportion of the oxygen acid component may be about 5 to 500 parts by weight with respect to 100 parts by weight of the halogen flame retardant.

  The resin composition may further contain at least one selected from flame retardant aids (antimony-containing compounds, fluorine-containing resins, silicon-containing compounds, aromatic resins, phosphorus-containing compounds, etc.) and olefinic resins. The resin composition further includes an electrical property improving aid (for example, metal oxide, metal sulfide, (hydrous) metal silicate, (hydrous) metal borate, (hydrous) metal stannate, hydrogen phosphate. Metal salts, aminotriazine compounds, pyrophosphates, polyphosphates, polymetaphosphates, and / or polyphosphate amides).

  The resin composition may further contain at least one selected from an antioxidant, a stabilizer, a lubricant and a filler.

  The resin composition may have a comparative tracking index based on IEC112 of 300 V or higher (particularly 350 V or higher). In addition, the resin composition has (a) (i) flame retardancy according to UL94 flammability test of V-2 or higher when measured at a test piece thickness of 1.6 mm, and (ii) IEC112. Resin composition having a compliant comparative tracking index of 400 V or more, (b) (i) When measured at a test piece thickness of 1.6 mm, flame retardancy in accordance with UL94 flammability test is V-0 or more, And (ii) a resin composition having a comparative tracking index conforming to IEC112 of 350 V or more, (c) (i) when measured at a test piece thickness of 0.8 mm, flame retardancy conforming to UL94 flammability test is V Also included is a resin composition having a value of −0 or more and (ii) a comparative tracking index according to IEC112 of 300 V or more.

  The present invention also includes a molded article formed from the flame retardant resin composition. The molded article may be at least one selected from electrical and / or electronic parts, home appliance parts, office automation (OA) equipment parts, mechanical mechanism parts, and automobile parts.

  In the present specification, organic phosphonous acid (compound) and organic phosphonic acid (compound) are collectively referred to as organic (phosphorous) phosphonic acid (compound).

  In the present invention, since a halogen-based flame retardant and a specific oxygen acid component (organic (phosphorous) phosphonic acid compound or salt thereof, organic sulfonic acid compound or salt thereof) are combined, not only the flame retardancy of the base resin, Electrical characteristics (such as tracking resistance expressed by comparative tracking index) can be improved. In addition, even if the amount of the halogen-based flame retardant or oxygen acid component used is small, the flame retardancy and electrical characteristics of the base resin can be improved, so that the moldability of the resin can be maintained.

  The flame retardant resin composition of the present invention comprises at least one oxygen acid component selected from a base resin, a halogen flame retardant, an organic (sub) phosphonic acid compound or a salt thereof, and an organic sulfonic acid compound or a salt thereof. It consists of and. Such a resin composition is improved not only in flame retardancy but also in electrical characteristics (such as tracking resistance represented by a comparative tracking index).

(Base resin)
The base resin is not particularly limited and includes various thermoplastic resins and thermosetting resins. Examples of the thermoplastic resin constituting the base resin include polyester resins, polyamide resins, polycarbonate resins, polyphenylene oxide resins, polyphenylene sulfide resins, acrylic resins, styrene resins, and vinyl resins.

(Polyester resin)
The polyester-based resin is a homopolyester or a copolyester obtained by polycondensation of a dicarboxylic acid component and a diol component, polycondensation of oxycarboxylic acid or lactone, or polycondensation of these components. Preferred polyester resins usually include saturated polyester resins, particularly aromatic saturated polyester resins.

Examples of the dicarboxylic acid component include aliphatic dicarboxylic acids (for example, C _4-40 dicarboxylic acids such as succinic acid, glutaric acid, adipic acid, hexadecanedicarboxylic acid, and dimer acid, preferably C _4-14 dicarboxylic acids), fats cyclic dicarboxylic acids (e.g., hexahydrophthalic acid, hexahydroterephthalic acid, _{C 8-12} dicarboxylic acids such as himic acid), an aromatic dicarboxylic acid _{[C 8-16} dicarboxylic acids, for example, an array Nji carboxylic acid (phthalic acid, Isophthalic acid, terephthalic acid, 2,6-naphthalenedicarboxylic acid, etc.), bisphenyl-dicarboxylic acid (4,4'-biphenyldicarboxylic acid, diphenylether-4,4'-dicarboxylic acid, diphenylalkanedicarboxylic acid (4,4 ' -Diphenylmethane dicarboxylic acid), 4,4'-di Phenyl ketone dicarboxylic acid etc.)], or derivatives thereof (for example, derivatives capable of forming an ester such as lower alkyl esters, aryl esters, acid anhydrides, etc.). These dicarboxylic acid components may be used alone or in combination of two or more. Furthermore, you may use together polyvalent carboxylic acids, such as trimellitic acid and a pyromellitic acid, as needed.

  Preferred dicarboxylic acid components include aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, and naphthalenedicarboxylic acid.

Examples of the diol component include aliphatic diols [for example, alkylene glycol (for example, ethylene glycol, trimethylene glycol, propylene glycol, 1,4-butanediol, 1,3-butanediol, neopentyl glycol, hexanediol, etc. C _2-12 alkylene glycol, preferably C _2-10 alkylene glycol), polyalkylene glycol (glycols having a plurality of oxy C _2-4 alkylene units, such as diethylene glycol, dipropylene glycol, ditetramethylene glycol, triethylene glycol) , Tripropylene glycol, polytetramethylene glycol, etc.)], alicyclic diols [for example, 1,4-cyclohexanediol, cycloalkane dialkanol (1,4- Cyclohexane di _{C 5-6} cycloalkane _{C 1-2} alkanols such as methanol, etc.), and hydrogenated bisphenol A], and the like. Hydroquinone, resorcinol, biphenol, bisphenols or their C _2-3 alkylene oxide adducts [2,2-bis (4-hydroxyphenyl) propane, 2,2-bis- (4- (2-hydroxyethoxy) phenyl] ]) Propane or brominated derivatives thereof], or aromatic diols such as xylylene glycol may be used in combination. These diol components may be used alone or in combination of two or more. Furthermore, you may use together polyols, such as glycerol, a trimethylol propane, a trimethylol ethane, a pentaerythritol, as needed.

Preferred diol components include C _2-6 alkylene glycol (linear alkylene glycol such as ethylene glycol, trimethylene glycol, propylene glycol, 1,4-butanediol), and oxyalkylene units having about 2 to 4 repetitions. Polyalkylene glycols [glycols containing poly (oxy-C _2-4 alkylene) units such as diethylene glycol], 1,4-cyclohexanedimethanol, and the like.

  Examples of the oxycarboxylic acid include oxybenzoic acid (p-hydroxybenzoic acid, m-hydroxybenzoic acid, etc.), oxynaphthoic acid (2-hydroxy-6-naphthoic acid, etc.), 4-carboxy-4'-hydroxybiphenyl. , Hydroxyphenylacetic acid, glycolic acid, D-, L- or D / L-lactic acid, oxycarboxylic acids such as oxycaproic acid, or derivatives thereof.

Lactones include C _3-12 lactones such as propiolactone, butyrolactone, valerolactone, caprolactone (eg, ε-caprolactone, etc.), and the like.

Preferred polyester-based resins include cycloalkane dialkylene arylates (such as 1,4-cyclohexanedimethylene terephthalate units) and alkylene arylates (alkylene terephthalate and / or alkylene naphthalate units such as C _2-4 alkylene terephthalate units, C _2. A homopolyester or copolyester having at least one unit selected from _-4 alkylene naphthalate units) as a main component (for example, about 50 to 100% by weight, preferably about 75 to 100% by weight) [for example, poly 1, 4-cyclohexanedimethylene terephthalate (PCT), polyalkylene terephthalate (for example, polyethylene terephthalate (PET), polypropylene terephthalate (PPT), polybutylene terephthalate (P T) poly C _2-4 alkylene terephthalate such as), polyalkylene naphthalate (e.g., polyethylene naphthalate, polypropylene naphthalate, poly C _2-4 alkylene naphthalate and polybutylene naphthalate) homopolymer polyesters such as; cycloalk Copolyester containing at least one unit selected from candialkylene terephthalate, alkylene terephthalate and alkylene naphthalate as a main component (for example, 50% by weight or more). Particularly preferred polyester resins include polybutylene terephthalate resins containing a butylene terephthalate unit as a main component (for example, polybutylene terephthalate, polybutylene terephthalate copolyester), polypropylene terephthalate resins containing a propylene terephthalate unit as a main component ( For example, polypropylene terephthalate, polypropylene terephthalate copolyester) and polyethylene terephthalate resin (for example, polyethylene terephthalate, polyethylene terephthalate copolyester) containing ethylene terephthalate units as main components are included. In addition, these polyester-type resin can be used individually or in combination of 2 or more types.

In the copolyester, the copolymerizable monomer includes C _2-6 alkylene glycol (such as linear alkylene glycol such as ethylene glycol, propylene glycol, 1,4-butanediol), and a repeating number of 2 to 2. Polyalkylene glycols having about 4 oxyalkylene units (eg, glycols containing poly (oxy-C _2-4 alkylene) units such as diethylene glycol and polytetramethylene glycol), C _4-12 aliphatic dicarboxylic acids (succinic acid, glutar Acid, adipic acid, sebacic acid, etc.), alicyclic diol (1,4-cyclohexanedimethanol, etc.), aromatic diol [C _2-3 alkylene oxide adduct of bisphenols such as 2,2-bis (4 -(2-hydroxyethoxy) phenyl) propane Etc.], aromatic dicarboxylic acids [asymmetric aromatic dicarboxylic acids (phthalic acid, isophthalic acid, 5-sulfoisophthalic acid monosodium salt, etc.), diphenyldicarboxylic acid, etc.], oxycarboxylic acids (oxybenzoic acid, oxynaphthoic acid, 4 -Carboxy-4'-hydroxybiphenyl and the like). The polyester resin may be not only linear but also branched or crosslinked as long as the melt moldability is not impaired. The polyester resin may be a liquid crystal polyester. Furthermore, the polyester resin includes amino group-containing monomers (for example, 3- or 4-aminophenol, 3- or 4-aminobenzoic acid, tetramethylene diamine, hexamethylene diamine, nonamethylene diamine, m-xylylene diamine. Also included are (liquid crystal) polyesteramide resins modified with amines).

  The polyester resin can be produced by a conventional method such as transesterification or direct esterification.

  The intrinsic viscosity of the polyester resin may be, for example, about 0.4 to 2, preferably about 0.5 to 1.8, and more preferably about 0.6 to 1.5.

(Polyamide resin)
Polyamides include polyamides derived from diamines and dicarboxylic acids; aminocarboxylic acids, polyamides obtained by using diamines and / or dicarboxylic acids in combination; lactams, and optionally diamines and / or dicarboxylic acids; Polyamide derived by the combined use of. Polyamide includes copolyamide. Diamine, dicarboxylic acid, aminocarboxylic acid, and lactam can be used alone or in combination of two or more.

Examples of the diamine include alicyclic diamines such as C _3-10 aliphatic diamines such as tetramethylene diamine and hexamethylene diamine, bis (4-aminocyclohexyl) methane, and bis (4-amino-3-methylcyclohexyl) methane. (Bis (amino C _5-8 cycloalkyl) C _1-4 alkane etc. which may have a substituent such as an alkyl group). If necessary, aromatic diamines such as phenylenediamine and metaxylylenediamine may be used in combination.

Examples of the dicarboxylic acid include C _4-20 aliphatic dicarboxylic acids such as adipic acid, suberic acid, sebacic acid, and dodecanedioic acid (C _6-16 alkane dicarboxylic acid and the like); dimerized fatty acid (dimer acid); Alicyclic dicarboxylic acids such as cyclohexane-1,4-dicarboxylic acid and cyclohexane-1,3-dicarboxylic acid; aromatic dicarboxylic acids such as phthalic acid, phthalic anhydride, isophthalic acid, terephthalic acid, and naphthalenecarboxylic acid It is done.

Examples of aminocarboxylic acids include C _4-20 aminocarboxylic acids such as aminoheptanoic acid, aminononanoic acid, and aminoundecanoic acid. Examples of the lactam include C _4-20 lactams such as caprolactam and dodecalactam.

Examples of polyamide resins include aliphatic polyamides such as polyamide 46, polyamide 6, polyamide 66, polyamide 610, polyamide 612, polyamide 11 and polyamide 12, and alicyclic diamines such as bis (aminocyclohexyl) C _1-3 alkanes. Alicyclic polyamides obtained from aliphatic dicarboxylic acids such as C _8-14 alkanedicarboxylic acids; aromatic dicarboxylic acids (eg terephthalic acid and / or isophthalic acid) and aliphatic diamines (eg hexamethylenediamine, nonamethylene) And polyamides obtained from aromatic and aliphatic dicarboxylic acids (for example, terephthalic acid and adipic acid) and aliphatic diamines (for example, hexamethylenediamine). Polyamide resins can be used alone or in combination of two or more.

  Among these polyamide resins, non-aromatic or aliphatic polyamides (polyamide 46, polyamide 6, polyamide 66, polyamide 610, polyamide 612, polyamide 11, polyamide 12 etc.), semi-aromatic polyamides (polyamide MXD6, polyamide 9T etc.) ), Semi-aromatic copolymer polyamide (polyamide 6T / 6, polyamide 6T / 66, polyamide 6T / 11, polyamide 6T / 12, polyamide 6I / 6, polyamide 6I / 66, polyamide 6T / 6I, polyamide 6T / 6I / 6 , Polyamide 6T / 6I / 66, polyamide 66 / 6I / 6, polyamide 66 / 6I / 11, polyamide 66 / 6I / 12, polyamide 66 / 6I / 610, polyamide 66 / 6I / 612, polyamide 6T / M5T, etc.) Is preferred.

(Polycarbonate resin)
Polycarbonate resins include polymers obtained by reaction of dihydroxy compounds (such as alicyclic diols and bisphenol compounds) with carbonates such as phosgene or diphenyl carbonate. Examples of bisphenol compounds include bis (4-hydroxyphenyl) methane and bis (hydroxyaryl) C _1-10 alkanes such as 2,2-bis (4-hydroxyphenyl) propane (bisphenol A); 1,1-bis (4 Bis (hydroxyaryl) C _4-10 cycloalkanes such as -hydroxyphenyl) cyclohexane; 4,4'-dihydroxydiphenyl ether; 4,4'-dihydroxydiphenyl sulfone; 4,4'-dihydroxydiphenyl sulfide; 4,4'- Examples thereof include dihydroxy diphenyl ketone.

  Preferred polycarbonate-based resins include bisphenol A type polycarbonate. Polycarbonate resins can be used alone or in combination of two or more.

(Polyphenylene oxide resin)
The polyphenylene oxide resin (polyphenylene ether resin) includes a homopolymer and a copolymer. Homopolymers include poly (2,6-dimethyl-1,4-phenylene) oxide, poly (2,5-dimethyl-1,4-phenylene) oxide, poly (2,5-diethyl-1,4-phenylene). Poly (mono, di or tri C _1-6 alkyl-phenylene) oxide such as phenylene) oxide, poly (mono or di C _6-20 aryl-phenylene) oxide, poly (mono C _1-6 alkyl-mono C _{6- 20} aryl-phenylene) oxide and the like.

  As the copolymer of polyphenylene oxide, a copolymer having two or more kinds of monomer units of the homopolymer (for example, 2,6-dimethyl-1,4-phenylene oxide unit and 2,3,6-trimethyl- Random copolymers having 1,4-phenylene oxide units, etc.), benzeneformaldehyde resins (formaldehyde condensates such as phenolic resins) and alkylbenzeneformaldehyde resins obtained by reacting alkylphenols such as cresol with alkylphenol-modified benzeneformaldehyde resins A modified polyphenylene oxide copolymer composed of a block and a polyphenylene oxide block as a main structure, a polyphenylene oxide or a copolymer thereof, a styrenic polymer and / or an unsaturated carboxylic acid or anhydrous ((Meth) acrylic acid, maleic anhydride) and the like modified graft copolymers are grafted. Polyphenylene oxide resins can be used alone or in combination of two or more.

(Polyphenylene sulfide resin)
The polyphenylene sulfide resin (polyphenylene thioether resin) includes a homopolymer and a copolymer having a polyphenylene sulfide skeleton- (Ar-S)-[wherein Ar represents a phenylene group]. Examples of the phenylene group (—Ar—) include a substituted phenylene group (for example, an alkylphenylene group having a substituent such as a C _1-6 alkyl group, a phenyl group, in addition to a p-, m-, or o-phenylene group. An arylphenylene group having a substituent such as: -Ar-A ¹ -Ar- [wherein Ar represents a phenylene group, A ¹ represents a direct bond (or a single bond), O, CO, or SO ₂ ], etc. It may be. The polyphenylene sulfide resin may be a homopolymer using the same repeating unit among the phenylene sulfide groups composed of such phenylene groups, or may be a copolymer containing different repeating units.

  The homopolymer is preferably a substantially linear polymer having a p-phenylene sulfide group as a repeating unit. Copolymers can be used in combination of two or more different phenylene sulfide groups. As the copolymer, a combination containing a p-phenylene sulfide group as a main repeating unit and an m-phenylene sulfide group is preferred, and a substantially linear copolymer containing 60 mol% (preferably 70 mol%) or more of p-phenylene sulfide groups. It may be.

  The polyphenylene sulfide-based resin may be a polymer obtained by oxidizing or thermally crosslinking a relatively low molecular weight linear polymer, and may have a substantially linear structure obtained by condensation polymerization from a monomer mainly composed of a bifunctional monomer. It may be a polymer. The polyphenylene sulfide resin also includes a branched or crosslinked polyphenylene sulfide resin obtained by polymerizing a monomer having three or more functional groups, and a resin composition obtained by blending this resin with the linear polymer.

  As the polyphenylene sulfide-based resin, polyphenylene sulfide, polybiphenylene sulfide (PBPS), polyphenylene sulfide ketone (PPSK), polybiphenylene sulfide sulfone (PPSS), and the like can be used. Polyphenylene sulfide resins can be used alone or in combination of two or more.

The number average molecular weight of the polyphenylene sulfide resin is, for example, about 300 to 30 × 10 ⁴ , preferably about 400 to 10 × 10 ⁴ .

(Acrylic resin)
Examples of the acrylic resin include (meth) acrylic acid, (meth) acrylic acid C _1-10 alkyl ester such as methyl (meth) acrylate, and (meth) acrylic acid hydroxy C ₁ such as hydroxyethyl (meth) acrylate. _-10 Alkyl esters, epoxy group-containing (meth) acrylates such as glycidyl (meth) acrylate, (meth) acrylic monomers such as (meth) acrylamide and (meth) acrylonitrile, or copolymers or (meth) Copolymers of acrylic monomers and other copolymerizable monomers are included. Preferable acrylic resins include poly (meth) methyl acrylate, (meth) acrylic acid-styrene copolymer, methyl (meth) acrylate-styrene copolymer, and the like. These acrylic resins can be used alone or in combination of two or more.

(Styrene resin)
Examples of the styrenic resin include a styrene monomer (eg, styrene, vinyltoluene, etc.) or a copolymer; a styrene monomer and a vinyl monomer [eg, (meth) acrylic monomer (For example, (meth) acrylonitrile, (meth) acrylic acid ester, (meth) acrylic acid, etc.), α, β-monoolefinic unsaturated carboxylic acid such as maleic anhydride or acid anhydride or ester thereof) and the like A styrene graft copolymer, a styrene block copolymer, and the like.

  Preferred styrenic resins include polystyrene (GPPS), styrene-methyl methacrylate copolymer, styrene- (meth) acrylic acid copolymer, styrene-acrylonitrile copolymer (AS resin), rubber component (polybutadiene, acrylic rubber). , Styrene-butadiene copolymer rubber, EPDM, EVA, etc.) and a graft copolymer obtained by polymerizing a styrene monomer and, if necessary, a copolymerizable monomer (acrylonitrile, methyl methacrylate, etc.) [impact polystyrene ( HIPS), ABS resin, MBS resin, etc.], copolymers composed of polystyrene blocks and diene or olefin blocks [e.g., styrene-butadiene-styrene (SBS) block copolymers, styrene-isoprene block copolymers, Styrene-isoprene-styrene ( IS) block copolymer, hydrogenated styrene-butadiene-styrene (SEBS) block copolymer, hydrogenated styrene-isoprene-styrene (SEPS) block copolymer, epoxidized SBS, epoxidized SIS and the like. . These styrenic resins can be used alone or in combination of two or more.

(Vinyl resin)
Examples of vinyl resins include vinyl monomers (eg, vinyl esters such as vinyl acetate; chlorine-containing vinyl monomers (eg, vinyl chloride); fluorine-containing vinyl monomers; vinyl ketones; vinyl ethers; N- For example, vinylamines such as vinylcarbazole, etc.) or copolymers with other copolymerizable monomers. Derivatives of the vinyl resins (for example, polyvinyl acetals such as polyvinyl alcohol, polyvinyl formal, and polyvinyl butyral, and ethylene-vinyl acetate copolymers) can also be used. These vinyl resins can be used alone or in combination of two or more.

(Other resins)
Other resins include polyacetal resins (polyacetal homo- or copolymers); ketone resins; polysulfone resins (for example, polysulfone, poly (ether sulfone), poly (4,4′-bisphenol ether sulfone, etc.); polyethers Examples include ketone resins (polyether ketone, poly (ether ether ketone), etc.), polyether imides, thermoplastic polyurethane resins, thermoplastic polyimides, polyoxybenzylenes, thermoplastic elastomers, etc. Thermosetting resins Examples thereof include phenol resins, amino resins, thermosetting polyester resins, epoxy resins, silicone resins, vinyl ester resins, polyurethane resins, and the like.

  These resins or polymer compounds may be used alone or in combination of two or more.

  Preferable base resins include thermoplastic resins such as polyester resins, which may be liquid crystal polyesters, polyacetal resins, styrene resins, polyamide resins, polyphenylene oxide resins, and more preferably polyester resins (PBT). Resin, PPT resin, PET resin, etc.), polyamide resin and the like.

  The base resin may be an alloy composed of a plurality of resins. Among the base resins, for example, a polycarbonate resin, a polyphenylene oxide resin, a polyphenylene sulfide resin, and the like may be used as an alloy in combination with other resins (for example, a polyester resin and / or a polyamide resin).

The number average molecular weight of the base resin is not particularly limited and is appropriately selected depending on the type and use of the resin, for example, 5 × 10 ³ to 200 × 10 ⁴ , preferably 1 × 10 ^{4 to} 150 × 10 ⁴ , Preferably, it can be selected from a range of about 1 × 10 ^{4 to} 100 × 10 ⁴ (for example, 1.2 × 10 ^{4 to} 100 × 10 ⁴ ). When the base resin is a polyester resin, the number average molecular weight is, for example, 5 × 10 ^{3 to} 100 × 10 ⁴ , preferably 1 × 10 ⁴ to 70 × 10 ⁴ , and more preferably 1.2 × 10 ⁴ to. It may be about 30 × 10 ⁴ .

(Halogen flame retardant)
Organic halides can be used as the halogen-based flame retardant. The organic halide usually contains at least one halogen atom selected from fluorine, chlorine, bromine and iodine atoms.

Examples of halogen flame retardants include halogen-containing acrylic resins [halogenated polybenzyl (meth) acrylate resins such as polybrominated polybenzyl (meth) acrylates such as poly (pentabromobenzyl (meth) acrylate), poly (penta) Halogenated benzyl (meth) acrylates such as chlorobenzyl (meth) acrylate) or copolymers], halogen-containing styrene resins [halogenated polystyrene (brominated polystyrene, chlorinated polystyrene and other styrene resins) Treated halides, halogenated styrene monomers alone or copolymers, etc.), halogen-containing polycarbonate resins (brominated polycarbonates, halogenated polycarbonates such as chlorinated polycarbonate, etc.), halogen-containing Poxy compounds [Halogen-containing phenoxy resins such as bromine-containing epoxy resins (such as brominated epoxy resins), halogen-containing epoxy resins such as chlorinated epoxy resins (such as halogenated epoxy resins); Bromine-containing phenoxy resins (such as brominated phenoxy resins)) (Such as halogenated phenoxy resins)], halogen-containing phosphate esters [eg, tris (bromoethyl) phosphate, tris (mono or dibromopropyl) phosphate, tris (mono or dibromobutyl) phosphate, tris (mono to tribromoneopentyl) ) Phosphate, bis (tribromoneopentyl) phenyl phosphate, bromine-containing phosphate esters such as tris (mono to tribromophenyl) phosphate], halogen-containing triazine compounds (eg, tris) Bromine-containing triazine compounds such as tribromophenoxy) triazine), halogen-containing isocyanuric acid compounds [for example, tris (2,3-dibromopropyl) isocyanurate, tris (2,3,4-tribromobutyl) isocyanurate, tris Bromine-containing isocyanuric acid compounds such as (pentabromobenzyl) isocyanurate], halogenated polyaryl ether compounds [for example, bis (halogenated aryl) ethers such as octa to decabromodiphenyl ether, octa to decachlorodiphenyl ether (for example, bis (Halogenated phenyl) ether, etc.); halogen-containing polyphenylene oxide resins such as brominated polyphenylene ether], halogenated aromatic imide compounds [for example, ethylene bis brominated phthalates Brominated aromatic imide compounds such as ruimide (for example, bisimide compounds)], halogenated bisaryl compounds [for example, bis (halogenated C _6-10 aryl) such as brominated diphenyl; bis (halogen such as brominated diphenylmethane) C _6-10 aryl) C _1-4 alkane; halogenated bisphenols such as brominated bisphenol A or derivatives thereof (brominated polyesters obtained by polymerizing ethylene oxide adducts of halogenated bisphenols, etc.)], halogenated alicyclic rings Group hydrocarbons (bridged saturated or unsaturated halogenated alicyclic hydrocarbons such as halogenated polycycloalkadienes such as dodecachloropentacyclooctadeca-7,15-diene) and the like. Halogen flame retardants can be used alone or in combination of two or more.

  The halogen-based flame retardant is preferably a compound containing a chlorine atom and / or a bromine atom, and particularly an organic bromide containing a bromine atom [bromine-containing acrylic resin, bromine-containing styrene resin, bromine-containing polycarbonate resin, bromine Containing epoxy compounds (brominated epoxy resins, brominated phenoxy resins, etc.), brominated polyaryl ether compounds (bis (brominated aryl) ether compounds such as octabromodiphenyl ether), brominated aromatic imide compounds, brominated bisaryl compounds Bromine atom-containing flame retardants such as

  Among these bromine atom-containing flame retardants, in particular, brominated polybenzyl (meth) acrylate resins, alkylene brominated phthalimides, brominated products of styrene resins, and homo- or copolymers of brominated styrene monomers (bromine) At least one selected from the group consisting of modified polystyrene and the like. Further, at least one selected from brominated bisphenol A type epoxy resin, brominated bisphenol A type phenoxy resin and brominated bisphenol A type polycarbonate resin is also preferable.

(Specific oxygen acid component (electric property improver))
(i) Organic (sub) phosphonic acid compound or salt thereof Among the oxygen acid components, as organic (sub) phosphonic acid compound or salt thereof (hereinafter sometimes simply referred to as organic (sub) phosphonic acid compound), Poly (sulfur) phosphonic acid compounds condensed with (sub) phosphonic acid or (sub) phosphonic acid (including derivatives such as esters) have an organic group (which may have a hydrocarbon group or substituent). An organic group-substituted (phosphorous) phosphonic acid compound substituted with an optionally substituted heteroatom-containing group or the like [a salt with at least one selected from a metal, boron, ammonium and a basic nitrogen-containing compound (metal salt) , Boron salts (boryl compounds, etc.), ammonium salts, salts with amino group-containing nitrogen-containing compounds, etc.). Further, the organic (sub) phosphonic acid compound includes a plurality of (sub) phosphonic acid units (at least one organic group-substituted (sub)) phosphonic acid unit such as a polyvalent hydrocarbon group or hetero atom-containing group. ) -Linked organic (sub) phosphonic acid or a salt thereof (the salt exemplified above), and a polymer having a plurality of phosphonic acid groups or a salt thereof.

  Of the organic (sub) phosphonic acid compounds, for example, the organic (sub) phosphonic acid represented by the formula (1) or a salt thereof is preferable.

  The compound of formula (1) where m is 0 represents an organic phosphonous acid compound, and the compound of formula (1) where m is 1 represents an organic phosphonic acid compound.

In the formula (1), examples of the hydrocarbon group represented by the groups R ¹ and R ² include an alkyl group (a linear or branched C _1-20 alkyl group such as a methyl, ethyl, hexyl, or decyl group). ), A cycloalkyl group (C _5-8 cycloalkyl group such as cyclohexyl group), an aryl group (C _6-10 aryl group such as phenyl group), an aralkyl group (C _6-10 aryl-C such as benzyl group). _1-4 alkyl group and the like. These hydrocarbon groups include a substituent, for example, a hydrocarbon group such as an alkyl group (such as the C _1-20 alkyl group exemplified above) (such as the hydrocarbon group exemplified above); a hydroxyl group or a derivative group thereof (methoxy group). A C _1-4 alkoxy group such as); a carboxyl group or a derivative group thereof (C _2-6 acyl group such as an acetyl group; C _1-4 alkoxy-carbonyl group such as a methoxycarbonyl group); an amino group or N— It may have a substituted amino group; a nitro group; an oxo group (═O); a halogen atom (such as a fluorine, chlorine, bromine or iodine atom). The hydrocarbon group may have one of the above substituents and may have a plurality of the same or different substituents.

In the formula (1), each of the groups R ¹ and R ² may be a hydrocarbon group, but at least one of them is preferably a hydrogen atom (for example, the group R ¹ is a hydrogen atom). And the group R ² may be a hydrogen atom or an alkyl group).

Examples of the n-valent organic group represented by the group X include monovalent or polyvalent hydrocarbon groups and heteroatom-containing groups [chain heteroatom-containing groups, heterocyclic groups (including nitrogen atom-containing heterocycles such as triazine rings). And the like). Examples of monovalent hydrocarbon groups include alkyl groups (linear or branched C _1-20 alkyl groups such as methyl, ethyl, and t-butyl groups), and alkenyl groups (C _2-20 alkenyl such as vinyl groups). An alicyclic hydrocarbon group such as the above-exemplified cycloalkyl group; an aromatic hydrocarbon group such as the above-mentioned aryl group and aralkyl group, and the like. Examples of the divalent hydrocarbon group include alkylene groups (such as linear or branched C _2-20 alkylene groups such as ethylene, propylene and trimethylene groups), and alkylidene groups (C _1-6 alkylidene groups such as methylene and ethylidene groups). ), Cycloalkylene group (C _5-8 cycloalkylene group such as cyclohexylene group; cyclohexane dimethylene group etc.), aromatic divalent group (C _6-10 arylene group such as phenylene group; C ₆ such as xylylene group) _-10 arene - di C _1-4 alkylene group; biphenylene, such as divalent groups corresponding to the bisaryl such as diphenylmethane-diyl group). Examples of the trivalent or higher polyvalent group include C _1-10 alkane, C _5-6 cycloalkane, C _6-10 aromatic hydrocarbon ring (benzene ring, naphthalene ring, etc.), bisaryl ring (biphenyl, the above bisaryl compound) And polyvalent groups corresponding to hydrocarbons such as 3 to 6 valent groups.

Examples of the chain heteroatom-containing group include a nitrogen atom-containing group and an oxygen atom-containing group, for example, a 1 to 3 valent group corresponding to (R ⁴ ) ₃ N (wherein R ⁴ is a monovalent carbon atom as exemplified above A hydrogen group), a divalent group corresponding to (R ⁵ ) ₂ O (wherein R ⁵ represents a monovalent hydrocarbon group exemplified above), a monohydric or polyalkyl ether of a polyhydric alcohol ( And monovalent groups or polyvalent groups (such as _1-4 tetravalent groups) corresponding to C _1-4 alkyl ethers of 2- to 4-valent alcohols such as trimethylolpropane trimethyl ether and pentaerythritol tetramethyl ether. Among these chain heteroatom-containing groups, a 1-3 valent group corresponding to a trialkylamine [N, N-diC _1-4 alkylamino C _1-4 alkyl group; N, N-diC _1-4 An alkyleneamine group; a nitrilotrisalkylene or alkylidene group (such as a nitrilotrismethylene or nitrilotrisethylene group such as a nitrilotris C _1-4 alkylidene or alkylene group), a divalent ether corresponding to a divalent ether (such as a methoxymethyl group); C _1-4 alkoxy C _1-4 alkyl group; oxydi C _1-4 alkylene such as oxydimethylene, oxydiethylene group or oxydi C _1-4 alkylidene group) and the like are preferable.

These groups X may have the substituents exemplified in the above R ¹ and R ² terms. The number of substituents is not limited, and may be one or plural.

  Preferred group X is an aliphatic hydrocarbon group which may have a substituent or a heteroatom-containing group (such as a chain heteroatom-containing group) which may have a substituent.

  n is preferably an integer of 1 to 4, more preferably an integer of 1 to 3. In organic phosphorous acid where m is 0, n is usually 1.

  Examples of metals that form salts of organic (sub) phosphonic acid compounds include Group 1 metals (alkali metals) (potassium, sodium, etc.), Group 2 metals (alkaline earth metals) (magnesium, calcium, Barium etc.), periodic table group 4 metals (titanium, zirconium etc.), transition metals (periodic table group 7 metals such as manganese; periodic table group 8 metals such as iron; periodic table group 9 metals such as cobalt; Periodic table group 10 metals such as nickel; periodic table group 11 metals such as copper), periodic table group 12 metals such as zinc, and periodic table group 13 metals such as aluminum. These metals can be used alone or in combination of two or more. Among these metals, at least one selected from Group 1 metal, Group 2 metal, Group 4 metal, Group 8 metal, Group 12 metal and Group 13 metal of the periodic table, in particular, Periodic Table 2 Group metals and / or Group 13 metals of the periodic table are preferred. The metal salt may be a hydrate salt such as a hydrate magnesium salt, a hydrate calcium salt, a hydrate aluminum salt, a hydrate zinc salt, and the like. Metal salts also include salts in which the metal is partially oxidized (eg, titanyl salts, zirconyl salts, etc.).

  Examples of basic nitrogen-containing compounds that form salts include nitrogen-containing compounds having amino groups [aminotriazine compounds (melamine, guanamine, benzoguanamine and / or condensates thereof (melamine condensates such as melam, melem, melon, etc.) Etc.), guanidine compounds (eg guanidine etc.)], urea compounds (eg urea) and the like. The basic nitrogen-containing compounds can be used alone or in combination of two or more. Of these nitrogen-containing compounds, aminotriazine compounds (such as melamine and melamine condensates) are particularly preferable.

  These salt-forming components can be used alone or in combination of two or more. The organic phosphinic acid salt includes a double salt of an organic phosphinic acid and a plurality of salt-forming components, for example, a melamine, melam, melem, double salt, melamine, melam, melem, melon.

Specific examples of the organic (phosphorous) phosphonic acid compound include, for example, methyl phosphonic acid, ethyl phosphonic acid, n-propyl phosphonic acid, isopropyl phosphonic acid, n-butyl phosphonic acid, isobutyl phosphonic acid, t-butyl phosphonic acid, pentyl phosphone. Acid, octylphosphonic acid, hydroxyalkylphosphonic acid (such as hydroxymethylphosphonic acid, hydroxyethylphosphonic acid, hydroxypropylphosphonic acid), carboxyalkylphosphonic acid (such as carboxymethylphosphonic acid, 2-carboxyethylphosphonic acid), methylphosphonous acid, Ethylphosphonous acid, n-propylphosphonous acid, isopropylphosphonous acid, n-butylphosphonous acid, isobutylphosphonous acid, t-butylphosphonous acid, pentylphosphonous acid, octylphosphonous acid Which have a substituent may be alkyl (sub) phosphonate (C _1-16 alkyl (sub) such as phosphonic acid); phenyl phosphonic acid, Toriruhosuhon acid, have a substituent such as a phenyl phosphonous Aryl (phosphorous) phosphonic acid (C _6-10 aryl (phosphorous) phosphonic acid etc.) which may be substituted; Alkanedi which may have a substituent such as ethane-1,2-diphosphonic acid, hydroxyethane diphosphonic acid Phosphonic acid (C _2-6 alkanediphosphonic acid etc.); alkylidene diphosphonic acid (C _1-4 alkylidene diphosphonic acid etc.) which may have a substituent such as 1-hydroxyethylidene-1,1-diphosphonic acid ); Arylenes such as 1,4-phenylene diphosphonic acid and 1,4-phenylene diphosphonic acid (phosphorous) (C _{6-12 arylene} ) (Nitro) phosphonic acid, etc.]; nitrilotris (alkyl phosphonic acid) optionally having substituents (hydroxyl group, etc.) such as nitrilotris (methylphosphonic acid) [nitrilotris (C _1-4 alkylphosphonic acid), etc. ] Oxydi (alkylphosphonic acid) which may have a substituent (hydroxyl group etc.) such as oxydimethylphosphonic acid [Oxydi ( _C1-4 alkylphosphonic acid) etc.]; Polyvinylphosphonic acid, Polyallylphosphonic acid Polymeric phosphonic acids such as these: Esters of these organic (phosphorous) phosphonic acids [methylphosphonic acid monomethyl ester, ethyl 2-carboxyethylphosphonate, triethyl carboxymethylphosphonate, triethyl carboxyethylphosphonate, etc. Alkyl (sub) phosphonic acid Mono- or polyalkyl esters _(such as _{C 1-16} alkyl (sub) mono- or _{di-C 1-16} alkyl esters of phosphonic acid); pentaerythritol ester of methylphosphonic acid, methylphosphonate 2-ethyl-2-hydroxymethyl-1, Such as 3-propanediol ester and hydroxyethyl poly (oxyethyl) phosphonic acid ester, which may have a substituent such as an ester of alkyl (sub) phosphonic acid with a polyhydric alcohol]; these organic (sub) phosphonic acids [Methyl (phosphorous) phosphonic acid Ca salt, ethyl (phosphorous) phosphonic acid Ca salt, n-propyl (phosphorous) phosphonic acid Ca salt, isopropyl (phosphorous) phosphonic acid Ca salt, n-butyl (phosphorous) phosphonic acid Ca salt] Salt, isobutyl (phosphorous) phosphonic acid Ca salt, t-butyl (phosphorous) phosphonic acid Ca salt, pentyl A) phosphonic acid Ca salt, alkyl (sub) phosphonic acid Ca salt such as octyl (sub) phosphonic acid Ca salt, alkyl (sub) phosphonic acid Mg salt corresponding to these alkyl (sub) phosphonic acid Ca salts, 1- Alkaline earth metal salts such as hydroxyethylidene-1,1-diphosphonic acid Ca salt, nitrilotris (methylphosphonic acid) Ca salt, nitrilotris (methylphosphonic acid) Mg salt; alkyl corresponding to the alkyl (sub) phosphonic acid Ca salt (Sub-) phosphonic acid Ti salt, 1-hydroxyethylidene-1,1-diphosphonic acid Ti salt, nitrilotris (methylphosphonic acid) Ti salt, and titanyl salts corresponding to these Ti salts (including titanyl salts) An alkyl (sub) phosphonic acid Al salt corresponding to the alkyl (sub) phosphonic acid Ca salt, ethane-1; 2-diphosphonic acid Al salt, carboxymethylphosphonic acid Al salt, 2-carboxyethylphosphonic acid Al salt, Al salt of methylphosphonic acid monomethyl ester, 1-hydroxyethylidene-1,1-diphosphonic acid Al salt, nitrilotris (methylphosphonic acid) Aluminum salt such as Al salt; Alkyl (phosphorous) phosphonic acid Zn salt, 1-hydroxyethylidene-1,1-diphosphonic acid Zn salt, nitrilotris (methylphosphonic acid) Zn salt corresponding to the alkyl (phosphorous) phosphonic acid Ca salt Zinc salts such as: alkyl (sub) phosphonic acid melamine salts corresponding to the alkyl (sub) phosphonic acid Ca salts, melam salts, melem salts, melon salts, melamine melam melem double salts corresponding to these melamine salts, Melamine, melam, melem, melon double salt, 1-hydroxyethyl And salts of aminotriazine compounds (such as melamine or condensates thereof) such as mono- or tetramelamine salts of den-1-diphosphonic acid, nitrilotris (methylphosphonic acid) mono- or hexamelamine salts, and the like. Of these, organic (sub) phosphonates, especially aliphatic organic (sub) phosphonates [eg, alkyl (sub) phosphonates, alkylene diphosphonates optionally having substituents, substituted An alkylidene diphosphonate which may have a group, a nitrilotris (alkylphosphonic acid) salt which may have a substituent, and the like] are preferable.

  An organic (phosphorous) phosphoric acid compound can be used individually or in combination of 2 or more types.

(ii) Organic sulfonic acid compound or salt thereof Among the oxygen acid components, the organic sulfonic acid compound or salt thereof (hereinafter sometimes simply referred to as organic sulfonic acid compound) includes an organic group (having a substituent). Or a salt thereof [a salt with at least one salt-forming component selected from a metal, ammonium and a basic nitrogen-containing compound (metal salt, ammonium salt, Etc.] etc.] etc. can be used.

The organic sulfonic acid compound can be represented, for example, by the following formula (2).
R ³ —S (═O) ₂ —OH (2)
(Wherein R ³ represents a monovalent organic group)
The monovalent organic group represented by R ³ may be a heteroatom-containing group such as a nitrogen atom and / or an oxygen atom-containing group, but is usually a substituent (explained in the above R ¹ and R ² terms). It is often a hydrocarbon group (such as a monovalent hydrocarbon group exemplified in the section of the group X) that may have a substituent. Preferable group R ³ includes, for example, an optionally substituted aliphatic hydrocarbon group (C _1-6 alkyl group and the like), an optionally substituted aromatic hydrocarbon group (C _{6-6 10} aryl group and the like, and an aliphatic hydrocarbon group is particularly preferable.

  Examples of the salt-forming component that forms a salt with the organic sulfonic acid include at least one selected from the metal and the nitrogen-containing compound having an amino group exemplified in the section of the organic (sub) phosphonate.

Specific examples of the organic sulfonic acid compound include, for example, alkanesulfonic acid (C _1-4 alkanesulfonic acid and the like) which may have a substituent such as methanesulfonic acid, ethanesulfonic acid, hydroxyethanesulfonic acid; benzene Arene sulfonic acid (C _6-10 arene sulfonic acid etc.) which may have a substituent such as sulfonic acid and toluene sulfonic acid; and salts of these organic sulfonic acids [alkaline earth metals such as calcium methanesulfonate Salts; aluminum salts such as aluminum methanesulfonate; salts with aminotriazine compounds (such as melamine or condensates thereof) such as melam salt of methanesulfonate] and the like. Of these compounds, alkane sulfonate is particularly preferable.

  The organic sulfonic acid compound or a salt thereof can be used alone or in combination of two or more.

  Specific examples of organic (phosphorous) phosphonic acid compounds and organic sulfonic acid compounds include, for example, JP-A-48-57988, JP-A-55-5979, JP-A-56-84750, and JP-A 63-22866, JP-A 1-222691, JP 2-180875, JP 4-234893, JP 7-2224078, JP 7-247112, and JP 8- No. 59679, JP-A-8-245545, JP-A-8-245659, JP-A-9-272759, JP-A-2000-63843, JP-A-2001-2688, JP-A-2001-64438. JP, 2001-64521, JP 2001-98161, 2001-98273, 2001-. 06919, JP 2001-288361 and JP WO00 / 11108 discloses also include compounds described in JP WO01 / 57134.

  Such an oxygen acid component can improve the electrical characteristics of the resin even when a halogen-based flame retardant is used. Therefore, the oxygen acid component seems to function as an electrical property improver.

  The resin composition may further contain at least one selected from a flame retardant aid and an olefin resin.

(i) Flame retardant aids Flame retardant aids include aromatic resins (phenolic resins, aniline resins, polyphenylene oxide resins, aromatic epoxy resins (bisphenol A type epoxy resins, novolac type epoxy resins, etc.), phenoxy Resin (such as bisphenol A type phenoxy resin), polyphenylene sulfide resin, polycarbonate resin, polyarylate resin, aromatic polyamide resin, aromatic polyester resin that may be liquid crystalline, aromatic polyester that may be liquid crystalline Amide resins), antimony-containing compounds, molybdenum-containing compounds (such as molybdenum oxide), tungsten-containing compounds (such as tungsten oxide), bismuth-containing compounds (such as bismuth oxide), tin-containing compounds (such as tin oxide), iron-containing compounds (oxidized) Iron), copper-containing compounds Products (copper oxide, etc.), phosphorus-containing compounds [(condensed) phosphate esters, (condensed) phosphate ester amides (phosphoramide, etc.), phosphonitrile compounds, aromatic phosphazenes (phenoxyphosphazenes, tolyloxyphosphazenes, bisphenols) Crosslinked phenoxyphosphazenes), organic phosphinic acid compounds (dialkylphosphinic acid metal salts such as methylethylphosphinic acid aluminum salt, diethylphosphinic acid aluminum salt; methylethylphosphinic acid melamine, diethylphosphinic acid melamine, diethylphosphinic acid melam, diethyl Organic compounds such as dialkylphosphinic acid aminotriazine salts such as melamine, melam, and melem double salts of phosphinates; inorganic compounds such as red phosphorus and boron phosphate], sulfur inclusion Objects (metal salts of perfluoroalkane sulfonic acids, such as sulfamic acid compound or a salt thereof), a fluorine-containing resin, a silicon-containing compound [(poly) organosiloxane, layered silicates, etc.], and others. These flame retardant aids can be used alone or in combination of two or more. In addition, as a flame retardant aid, when using a resinous flame retardant aid (aromatic resin, for example, aromatic polyester resin, aromatic polyamide resin, polycarbonate resin, polyphenylene oxide resin, polyphenylene sulfide resin, etc.) Usually, a different type of resin from the base resin can be used.

  Among these flame retardant aids, in particular, antimony-containing compounds, aromatic resins [phenolic resins, polyphenylene oxide resins, aromatic epoxy resins, phenoxy resins, polyphenylene sulfide resins, polycarbonate resins, polyarylate resins, aromatics Polyamide resins (polyamide resins in which all of the constituent monomer components are aromatic monomers, such as polyamides of aromatic dicarboxylic acid components and aromatic diamine components), aromatics that may be liquid crystalline Polyester resins (polyester resins in which all constituent monomer components are aromatic monomers, such as polyesters of aromatic dicarboxylic acids and aromatic diols) and aromatic polyester amide resins that may be liquid crystalline (Polyesteramide resin in which all constituent monomer components are aromatic monomers, etc. ] And phosphorus-containing compounds (in particular, an organic phosphinic acid compound) is preferably used at least one selected from fluorine-containing resin and a silicon-containing compound. The monomer components such as the aromatic dicarboxylic acid, aromatic diamine, and aromatic diol can use the components exemplified in the section of the base resin.

  The use of antimony-containing compounds, aromatic resins, and / or organic phosphinic acid compounds can further improve flame retardancy, and the use of fluorine-containing resins and / or silicon-containing compounds can effectively prevent dripping. .

Examples of the antimony-containing compound include antimony oxide [antimony trioxide (Sb ₂ O ₃ etc.), antimony tetraoxide, antimony pentoxide (xNa ₂ O · Sb ₂ O ₅ · yH ₂ O (x = 0 to 1, y = 0-4) etc.], antimonate [antimonic acid metal salts (for example, alkali metal salts such as sodium antimonate, alkaline earth metal salts such as magnesium antimonate), ammonium antimonate, etc.] Can be mentioned. These antimony-containing compounds can be used alone or in combination of two or more. Of the antimony-containing compounds, antimony oxide and alkali metal salts of antimonic acid are preferred.

  In addition, the antimony-containing compound may be used after surface treatment with a surface treatment agent such as an epoxy compound, a silane compound, an isocyanate compound and / or a titanate compound, if necessary.

  In addition, the average particle diameter of an antimony containing compound may be 0.02-5 micrometers, for example, Preferably about 0.1-3 micrometers may be sufficient.

  Phosphorus-containing compounds include (condensed) phosphate esters [eg, resorcinol bis (diphenyl phosphate), hydroquinone bis (diphenyl phosphate), biphenyl bis (diphenyl phosphate), bisphenol-A (diphenyl phosphate), resorcinol bis (di- 2,6-xylyl phosphate), hydroquinone bis (di-2,6-xylyl phosphate), biphenyl bis (di-2,6-xylyl phosphate), bisphenol-A bis (di-2,6-xyl) Silyl phosphate), pentaerythritol diphenyl phosphate, pentaerythritol di-2,6-xylyl phosphate, 2,6,7-trioxa-1-phosphabicyclo [2.2.2] octane-4-methanol-1-oxide And US Patent No. 154775 and US Pat. No. 4,801,625, etc.], (condensed) phosphoric ester amides [for example, 1,4-piperazinediyltetraphenyl phosphate, 1,4-piperazinediyltetra 2,6-xylyl phosphate, N, N′-bis (neopentylenedioxyphosphinyl) piperazine, and JP-A-10-175985, JP-A-2001-139823, and JP-A-2001-35489 Phosphoric acid ester amides (such as phosphoramides), etc.], phosphonitrile compounds [e.g. cyclic and / or -Like aryloxyphosphazenes (non-crosslinked aryloxyphosphazenes), cross-linked products thereof (for example, cross-linked aryloxyphosphazenes such as phenoxyphosphazenes cross-linked with bisphenol residues), and WO99 / 19383, WO00 / 9518 And phosphazene compounds described in WO 02/98886 and WO 04/24844], organic phosphinic acid compounds [for example, organic phosphinic acid esters [9,10-dihydro-9-oxa-10-phosphaphenanthrene-10] -Oxide, 10-Benzyl-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 10- (2,5-dihydroxyphenyl) -10H-9,10-dihydro-9-oxa- 10-phosphafe Nanthrene-10-oxide etc.], organic phosphinic acid metal salts [for example, alkali metal salts such as Li, Na, K; alkaline earth metal salts such as Mg, Ca, Sr; periodic table group 3 metal salts such as Ce Group 4 metal salts such as Ti and Zr; Group 7 metal salts such as Mn; Group 8 metal salts such as Fe; Group 12 metal salts such as Zn; Group 13 metal salts such as Al; Group 14 metal salts such as Ge; various metal salts such as Group 15 metal salts such as Sb and Bi), basic nitrogen compound salts of organic (sub) phosphonic acid (melamine salts, guanamine salts, benzoguanamine salts and / or Their condensate salts (aminotriazine salts such as melam salt, melem salt, melamine salt such as melon salt)) and inorganic phosphorus compounds [eg red phosphorus; phosphoric acids (phosphoric acid, phosphorous acid) Hypophosphorous acid ) And alkaline earth metal or Group 13 metal of the periodic table (including double salts), for example, metal phosphates (calcium phosphate, aluminum phosphate, phosphate / aluminum phosphite double salts, etc.), phosphorous Acid metal salts (calcium phosphite, aluminum phosphite, etc.), metal hypophosphites (calcium hypophosphite, aluminum hypophosphite, etc.); boron phosphate, etc.]. A phosphorus containing compound can be used individually or in combination of 2 or more types.

Of these phosphorus-containing compounds, organic phosphinic acid or a salt thereof is particularly preferable. Specific examples of the organic phosphinic acid compound include, for example, optionally substituted alkylphosphinic acid [dialkylphosphinic acids (such as di-C _1-10 alkylphosphinic acid)] such as dimethylphosphinic acid, methylethyl Phosphinic acid, diethylphosphinic acid, ethyl (n-, iso- or t-) butylphosphinic acid, di-n-propylphosphinic acid, diisopropylphosphinic acid, di-n-butylphosphinic acid, diisobutylphosphinic acid, di-t-butylphosphine Dialkylphosphinic acids such as acids, dipentylphosphinic acid, dioctylphosphinic acid; (hydroxymethyl) methylphosphinic acid, (hydroxyethyl) methylphosphinic acid, bis (hydroxymethyl) phosphinic acid, bis (hydroxyethyl) phosphinic acid, etc. Hydroxyl group-containing dialkylphosphinic acid; carboxyl group-containing dialkylphosphinic acid such as (2-carboxyethyl) methylphosphinic acid; alkoxy group-containing dialkylphosphinic acid such as (methoxymethyl) methylphosphinic acid], arylphosphinic acid [phenylphosphine] C _6-10 arylphosphinic acid such as acid; diC _6-10 arylphosphinic acid such as diphenylphosphinic acid], alkylarylphosphinic acid (C _1-4 alkyl-C _6-10 aryl- such as methylphenylphosphinic acid) Phosphinic acid and the like, and salts of these organic phosphinic acids (dimethylphosphinic acid Ca salt, methylethylphosphinic acid Ca salt, diethylphosphinic acid Ca salt, di (n- or iso-) propylphosphinic acid Ca salt, di ( n-, iso- or t-) butylphosphinic acid Ca salt, ethyl (n- or iso-) propylphosphinic acid Ca salt, ethyl (n-, iso- or t-) butylphosphinic acid Ca salt, di (n-, Alkaline earths such as iso- or t-) butyl phosphinic acid Ca salt, dipentyl phosphinic acid Ca salt, dioctyl phosphinic acid Ca salt, (2-carboxyethyl) methyl phosphinic acid Ca salt and Mg salts corresponding to these calcium salts Metal salt; Al salt of dimethylphosphinic acid, Al salt of methylethylphosphinic acid, Al salt of diethylphosphinic acid, Al salt of di (n- or iso-) propylphosphinic acid, Di (n-, iso- or t-) butylphosphinic acid Al salt, ethyl (n- or iso-) propylphosphinic acid Al salt, ethyl (n-, iso- or t-) butylphosphite Aluminum salt such as Al acid salt, Dipentylphosphinic acid Al salt, Dioctylphosphinic acid Al salt, (2-Carboxyethyl) methylphosphinic acid Al salt; Dimethylphosphinic acid Ti salt, Methylethylphosphinic acid Ti salt, Diethylphosphinic acid Ti salt Di (n- or iso-) propylphosphinic acid Ti salt, di (n-, iso- or t-) butylphosphinic acid Ti salt, ethyl (n- or iso-) propylphosphinic acid Ti salt, ethyl (n-, Titanium salts such as iso- or t-) butyl phosphinic acid Ti salt, dipentyl phosphinic acid Ti salt, dioctyl phosphinic acid Ti salt, (2-carboxyethyl) methyl phosphinic acid Ti salt and titanyl salts corresponding to these salts; dimethyl Phosphinic acid Zn salt, diethylphosphinic acid Zn salt, methyl ethyl phosphate Zn salt of finic acid, Zn salt of di (n- or iso-) propylphosphinic acid, Zn salt of di (n-, iso- or t-) butylphosphinic acid, Zn salt of ethyl (n- or iso-) propylphosphinic acid, ethyl (N-, iso- or t-) butylphosphinic acid Zn salt, dipentylphosphinic acid Zn salt, dioctylphosphinic acid Zn salt, zinc salt such as (2-carboxyethyl) methylphosphinic acid Zn salt; dimethylphosphinic acid melamine salt, Methyl ethyl phosphinic acid melamine salt, diethyl phosphinic acid melamine salt, di (n- or iso-) propyl phosphinic acid melamine salt, di (n-, iso- or t-) butyl phosphinic acid melamine salt, ethyl (n- or iso-) ) Melamine salt of propylphosphinic acid, melamine of ethyl (n-, iso- or t-) butylphosphinic acid Salt, dipentylphosphinic acid melamine salt, dioctylphosphinic acid melamine salt, (2-carboxyethyl) methylphosphinic acid melamine salt, salts with aminotriazine compounds such as melamine melam memel double salt corresponding to these melamine salts, etc.) Etc.

The organic phosphinic acid compound also includes a cyclic organic phosphinic acid or a salt thereof which may have an unsaturated bond in the ring. Specific examples of such an organic phosphinic acid compound include substituents such as 1-hydroxy-1H-phosphorane-1-oxide and 2-carboxy-1-hydroxy-1H-phosphorane-1-oxide. Alkylene phosphinic acid (C _3-8 alkylene phosphinic acid etc.) which may be substituted; Alkenylene phosphinic acid (C _3-8 alkenylene phosphinic acid etc.) which may have a substituent such as 1-hydroxyphosphorane-1-oxide Cycloalkylene phosphinic acids such as 1,3-cyclobutylene phosphinic acid, 1,3-cyclopentylene phosphinic acid, 1,4-cyclooctylene phosphinic acid, 1,5-cyclooctylene phosphinic acid (C _4-10 Cycloalkylenephosphinic acid, etc.); or salts thereof (1-hydroxy-1H-phospho Alkaline earth metal salts (Ca salt, Mg salt, etc.) of horan-1-oxide, metal salts such as Al salt, Ti salt, titanyl salt, Zn salt; aminotriazines such as melamine salt, melamine melam memel double salt Salt, etc.).

Of the organic phosphinic acid compounds, polyvalent phosphinic acid (such as bisphosphinic acid) compounds are preferred. Specific examples of such polyvalent phosphinic acid compounds include polyvalent phosphinic acids in which a plurality of phosphinic acids (or organic phosphinic acids) are linked by a polyvalent organic group, such as alkanebisphosphinic acid [ethane-1, 2- bis (such as phosphinic acid) _{C 1-10} such Arukanbisu (phosphinic acid), Arukanbisu _{C 1-10} Arukanbisu such (alkyl phosphinic acid) [ethane-1,2-bis (methyl phosphinic acid) _{(C 1 -6} alkylphosphinic acid), etc.], or salts thereof. Examples of the salt include metals such as ethane-1,2-bisphosphinic acid Ca salt, ethane-1,2-bis (methylphosphinic acid) Ca salt, Mg salt, Al salt, Zn salt, Ti salt, or titanyl salt. Salt; ethane-1,2-bisphosphinic acid melamine salt, ethane-1,2-bis (methylphosphinic acid) melamine salt, melam salt, melem salt, salt with nitrogen-containing compound such as melamine melam memel double salt Etc.

  Specific examples of the organic phosphinic acid salt include, for example, JP-A-55-5979, JP-A-8-73720, JP-A-9-278784, JP-A-11-236392, JP-A-2001-2686. Gazette, JP-A-2004-238378, JP-A-2004-269526, JP-A-2004-269984, JP-A-2004-346325, JP-T-2001-513784, JP-A-2001-525327, JP 2001-525328 A, JP 2001-525329 A, JP 2001-540224 A, US Pat. No. 4,180,495, US Pat. No. 4,083,321, US Pat. No. 4,083,322, US Pat. No. 6,229,044, US Pat. No. 6,303,674 Compounds that are mounting the like.

  The above organic phosphinic acid salts can be used alone or in combination of two or more.

  The fluorine-containing resin includes a fluorine-containing monomer alone or a copolymer, for example, a fluorine-containing monomer (tetrafluoroethylene, chlorotrifluoroethylene, vinylidene fluoride, hexafluoropropylene, perfluoroalkyl vinyl ether, etc.) Or a copolymer thereof, and the fluorine-containing monomer and other copolymerizable monomers (olefin monomers such as ethylene and propylene, and acrylic monomers such as (meth) acrylate). Copolymers are included.

  Specific examples of the fluorine-containing resin include homopolymers such as polytetrafluoroethylene, polychlorotrifluoroethylene, and polyvinylidene fluoride; tetrafluoroethylene-hexafluoropropylene copolymer, tetrafluoroethylene- Examples of the copolymer include a perfluoroalkyl vinyl ether copolymer, an ethylene-tetrafluoroethylene copolymer, and an ethylene-chlorotrifluoroethylene copolymer. A fluorine-containing resin can be used individually or in combination of 2 or more types.

  The fluorine-containing resin may be used in the form of particles, and the average particle size may be, for example, about 10 to 5000 μm, preferably about 100 to 1000 μm, and more preferably about 100 to 700 μm.

Examples of silicon-containing compounds include smectite layered silicates such as montmorillonite, saponite, beidellite, hectorite, and fluorine hectorite, Li-type fluorine teniolite, Na-type fluorine teniolite, Li-type tetrasilicon fluorine mica, Na-type tetrasilicon fluorine mica And swellable synthetic fluorine mica, vermulite, halloysite and the like. The layered silicate is a modified layered silicate intercalated with an organic onium cation such as quaternary ammonium or quaternary phosphonium between layers, epoxy group, amino group, carboxyl group, acid anhydride group, oxazoline group. Modified layered silicates to which reactive functional groups such as the above are added (layered silicates treated with a silane coupling agent having reactive functional groups) and the like are also included. Furthermore, as other silicon-containing compounds, (poly) organosiloxanes, for example, polyorganosiloxanes such as polydimethylsiloxane and polymethylphenylsiloxane (organosiloxane homopolymers or copolymers) and the like can be mentioned. Among these (poly) organosiloxanes, organosiloxanes having a viscosity of about 1 × 10 ^{−3 to} 5 × 10 ⁻² m ² s ⁻¹ (25 ° C.) are preferable. These silicon-containing compounds can be used alone or in combination of two or more.

(Olefin resin)
When an olefin resin is used, the electrical characteristics (for example, tracking resistance) of the resin can be further improved. Examples of the olefin resin include olefin monomers [alpha-olefins such as ethylene, propylene, 1-butene, 3-methyl-1-pentene, 4-methyl-1-butene, 1-hexene and 1-octene. (in particular, _{alpha-C 2-10} olefin); cyclic olefin {e.g., cyclobutene, cyclopentene, _(such as _{C 3-10} cycloalkene) cycloalkenes such as cyclohexene; Shikuropenchin, _{C 3-10} cycloalkyne, such as cyclohexanol Shin; crosslinking Cyclic olefins (polycycloalkenes such as norbornene and tetradicyclododecene, dicycloalkadienes such as dicyclopentadiene); or derivatives thereof (alkyl-substituted, alkylidene-substituted, alkoxy-substituted, acyl-substituted, Carboxy substitution etc.) etc.] Germany or copolymer, olefin monomer or polymer, copolymerizable monomer [vinyl monomer, for example, (meth) acrylic acid or salt thereof (metal salt, etc.), (meth) acrylic Acrylic monomers such as acid esters ((meth) acrylic acid alkyl esters, (meth) acrylic acid glycidyl esters, etc.); organic acid vinyl ester monomers such as vinyl acetate; fumaric acid, (anhydrous) maleic acid, (Anhydrous) itaconic acid, (anhydrous) citraconic acid, (anhydrous) α, β-unsaturated dicarboxylic acid monomers such as nadic acid; vinyl cyanide monomers such as (meth) acrylonitrile, etc.] And polymers (random copolymers, block copolymers, graft copolymers, etc.).

Specific examples of the olefin resin include α-olefin resins [for example, homo- or copolymers of α-C _2-3 olefins such as polyethylene, polypropylene, propylene-ethylene copolymers; ethylene- (meta ) Acrylic acid copolymer, propylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylic acid metal salt copolymer, ethylene- (meth) acrylic acid ester copolymer (ethylene-ethyl acrylate copolymer) Ethylene- (meth) acrylic acid alkyl copolymer; ethylene- (meth) acrylic acid glycidyl copolymer; ethylene- (meth) acrylic acid glycidyl- (meth) acrylic acid alkyl copolymer, etc.)- C _2-3 copolymer of an olefin and a copolymerizable monomer, etc.], an acid-modified olefin resin [e.g., Oleh A resin or a copolymer of α, β-unsaturated carboxylic acid ((meth) acrylic acid, maleic acid, fumaric acid, itaconic acid, citraconic acid, nadic acid, etc.) and / or an acid anhydride thereof. Modified acid-modified olefin resin etc.], cyclic olefin resin (for example, homopolymer of cyclic olefin, α-C _2-10 olefin-cyclic olefin copolymer, etc.) and the like.

Among these olefin resins, poly α-C _2-3 olefin (particularly polyethylene, polypropylene, propylene-ethylene block copolymer), α-C _2-3 olefin- (meth) acrylic acid ester copolymer [for example, , Α-C _2-3 olefin- (meth) acrylic acid C _1-4 alkyl copolymer (especially ethylene-ethyl acrylate copolymer), α-C _2-3 olefin-glycidyl (meth) acrylate copolymer Polymer (especially ethylene- (meth) acrylic acid glycidyl copolymer), α-C _2-3 olefin- (meth) acrylic acid glycidyl- (meth) acrylic acid C _1-4 alkyl copolymer (especially ethylene -Glycidyl (meth) acrylate-methyl (meth) acrylate copolymer, etc.)], acid-modified polyolefin (maleic anhydride-modified polymer). An acid-modified _{poly-C 2-3} olefin such as propylene) and the like are preferable.

The number average molecular weight of the olefin resin is not particularly limited, but is, for example, about 300 to 20 × 10 ⁵ , preferably about 500 to 10 × 10 ⁴ .

  Olefin resins can be used alone or in combination of two or more.

(Electrical property improvement aid)
If necessary, the resin composition of the present invention may further contain an additive (electric property improvement aid) for improving electric characteristics, such as a nitrogen-containing compound [aminotriazine compound (melamine; guanamine; melamine such as melam, melem). Condensates, etc.), salts of aminotriazine compounds (organic acids or inorganic acid salts of the above aminotriazine compounds, such as cyanurates such as melamine cyanurate, etc.), phosphorus-containing compounds [(poly) phosphates (bases) Salts with metallic nitrogen-containing compounds, etc.), organophosphates, polyphosphate amides, etc.], silicon-containing compounds [silicates (eg talc, kaolin, aluminum silicate), hydrotalcite, zeolite, etc.], Inorganic metal compounds [inorganic acids (inorganic acids other than phosphoric acid and silicic acid, such as carbonic acid, boric acid, stannic acid, tongue Metal salts of metal oxides (magnesium oxide, iron oxide, titanium oxide, zinc oxide, alumina, etc.), metal hydroxides (aluminum hydroxide, magnesium hydroxide, zirconium hydroxide, alumina hydrate) (Such as boehmite), metal sulfide (such as zinc sulfide, molybdenum sulfide, tungsten sulfide)]. These electrical property improving aids can be used alone or in combination of two or more. In addition, as an electrical property improvement aid, a compound different from the oxygen acid component and the flame retardant aid is usually used.

  Among the electrical property improving aids, the phosphorus-containing compound includes (poly) phosphate [ammonium salt such as ammonium polyphosphate; salt of polyphosphoric acid (including pyrophosphoric acid) and aminotriazine compound (melamine polyphosphate) Salts of polyphosphoric acid and melamine condensates, such as melam polyphosphate, melem polyphosphate, melon polyphosphate, melamine polymelamine melam melem double salt, melamine polyphosphate melam melem melon double salt, melamine polymetaphosphate Metal salts of phosphoric acid or polyphosphoric acid (including pyrophosphoric acid) (hydrogen phosphate metal salts such as calcium hydrogen phosphate (alkaline earth metal salts)); ) (Poly) metal phosphates such as aluminum phosphate; aluminum pyrophosphate, phosphoric acid Metal pyrophosphates such as aluminum lophosphate double salts)], organic phosphates (aliphatic organic phosphates, such as alkyl phosphates such as trimethyl phosphate), polyphosphates ((poly) phosphates And / or a polymer compound obtained by baking and condensing an organic phosphoric acid and a cyanamide derivative in the presence of urea and / or urea phosphate. Further, as the metal constituting the inorganic metal compound, alkali metals (K, Na, etc.), alkaline earth metals (Mg, Ca, Ba, etc.), transition metals (Fe, Co, etc.), periodic table group 12 metals (Zn etc.) etc. are mentioned. Among inorganic metal compounds, inorganic acid metal salts include carbonates (such as alkaline earth metal salts such as calcium carbonate) and borates (such as anhydrous or hydrous zinc borate, anhydrous or hydrous calcium borate) ) Metal borate, etc.), stannate (such as anhydrous or hydrous zinc stannate (water) metal stannate), tungstate (such as zinc tungstate), sulfate (magnesium sulfate, calcium sulfate, sulfuric acid) Barium, etc.).

  Among the electrical property enhancement aids, metal oxides, metal sulfides, (hydrous) metal silicates, (hydrous) metal borate, (hydrous) metal stannates, metal hydrogen phosphates, pyrophosphates, At least one selected from polyphosphate, polymetaphosphate and polyphosphate amide is preferred. In particular, titanium oxide, zinc sulfide, talc, kaolin, (hydrous) zinc borate, (hydrous) calcium borate, (hydrous) zinc stannate, calcium hydrogen phosphate, melamine cyanurate, melamine polyphosphate, melam polyphosphate, At least one selected from melem polyphosphate, melon polyphosphate, melamine polymelate, melam, melem double salt, melamine polymelamine, melam, melem, melon double salt, melamine polymetaphosphate and melamine polymetaphosphate, melam, melem double salt preferable.

(Ratio of each component)
The proportion of the halogen flame retardant is, for example, 3 to 30 parts by weight, preferably 5 to 25 parts by weight, and more preferably about 7 to 20 parts by weight with respect to 100 parts by weight of the base resin.

  The ratio of the specific oxygen acid component is, for example, 1 to 30 parts by weight, preferably 3 to 28 parts by weight, and more preferably about 5 to 25 parts by weight with respect to 100 parts by weight of the base resin. The ratio of the specific oxygen acid component is, for example, about 5 to 500 parts by weight, preferably about 10 to 300 parts by weight, and more preferably about 20 to 280 parts by weight with respect to 100 parts by weight of the halogen flame retardant. Also good.

  The ratio of the flame retardant aid is, for example, about 0 to 30 parts by weight, preferably about 0.1 to 20 parts by weight, and more preferably about 1 to 15 parts by weight with respect to 100 parts by weight of the base resin. The proportion of the flame retardant aid is, for example, 0 to 200 parts by weight, preferably 0.2 to 150 parts by weight, more preferably 0.5 to 120 parts by weight (for example, based on 100 parts by weight of the halogen flame retardant). It may be about 0.5 to 110 parts by weight. The ratio (weight ratio) between the oxygen acid component and the flame retardant aid is as follows: oxygen acid component / flame retardant aid = 10/90 to 100/0 (for example, 10/90 to 99.9 / 0.1). Degree), preferably 20/80 to 99/1, more preferably about 25/75 to 97/3.

  The proportion of the olefin resin may be, for example, 0 to 30 parts by weight, preferably 1 to 20 parts by weight, and more preferably about 2 to 15 parts by weight with respect to 100 parts by weight of the base resin. The ratio of the olefin resin is, for example, 0 to 300 parts by weight, preferably 1 to 150 parts by weight, more preferably 5 to 100 parts by weight (for example, 5 to 80 parts by weight) with respect to 100 parts by weight of the halogen flame retardant. ) Degree. The proportion of the olefin resin is, for example, 1 to 150 parts by weight, preferably 5 to 100 parts by weight, more preferably 10 to 70 parts by weight, based on 100 parts by weight of the total amount of the halogen flame retardant and the oxygen acid component. It may be about a part.

  The proportion of the electrical property improving aid is, for example, 0 to 30 parts by weight, preferably 1 to 20 parts by weight, more preferably 1.5 to 15 parts by weight (for example, 2 to 15 parts) with respect to 100 parts by weight of the base resin. Part by weight). The proportion of the electrical property improving aid is, for example, 0 to 300 parts by weight, preferably 1 to 200 parts by weight, more preferably 1.5 to 150 parts by weight (for example, 3 parts by weight) with respect to 100 parts by weight of the halogen flame retardant. ˜100 parts by weight).

  In the present invention, the flame retardant resin composition further includes other additives such as other flame retardants (nitrogen-based, phosphorus-based flame retardants, etc.), antioxidants (phenolic antioxidants, amine-based antioxidants). , Hydroquinone antioxidants, quinoline antioxidants, sulfur antioxidants, phosphorus antioxidants (or stabilizers), stabilizers (ultraviolet absorbers, weathering (light) stabilizers, thermal stabilizers, Processing stabilizers, phosphorus stabilizers, reactive stabilizers, etc.), antistatic agents, lubricants, mold release agents, crystallization nucleating agents, plasticizers, colorants (dyes, pigments, etc.), lubricants, anti-dripping agents. And fillers (such as fibrous inorganic fillers such as glass fibers and carbon fibers, non-fibrous inorganic fillers such as glass flakes), and the like. These other additives can be used alone or in combination of two or more.

  The resin composition preferably contains at least one selected from an antioxidant, a stabilizer (particularly, a phosphorus stabilizer, a reactive stabilizer), a lubricant, and a filler among the additives. Moreover, you may use a filler at least among the said additives.

  The ratio of the filler in the flame retardant resin composition is, for example, 0 to 100 parts by weight, preferably 0.5 to 80 parts by weight, and more preferably about 1 to 70 parts by weight with respect to 100 parts by weight of the base resin. There may be.

Among the antioxidants, phenolic antioxidants include hindered phenols such as 1,6-hexanediol-bis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate. C _2-10 alkanediol-bis [3- (3,5-di-branched C _3-6 alkyl-4-hydroxyphenyl) propionate]; triethylene glycol-bis [3- (3-t-butyl) 5-methyl-4-hydroxyphenyl) propionate] di- or Toriokishi _{C 2-4} alkylene diol such as - bis [3- (3,5-di - branched _{C 3-6} alkyl-4-hydroxyphenyl) propionate]; _{C 3-8} Arukirento such as glycerin tris [3- (3,5-di -t- butyl-4-hydroxyphenyl) propionate] All - bis [3- (3,5-di - branched _{C 3-6} alkyl-4-hydroxyphenyl) propionate]; pentaerythritol tetrakis [3- (3,5-di -t- butyl-4-hydroxyphenyl) C _4-8 alkylenetetraol tetrakis [3- (3,5-di-branched C _3-6 alkyl-4-hydroxyphenyl) propionate] such as propionate]; n-octadecyl [3- (3,5-di- C _10-35 alkyl [3- (3,5-di-branched C _3-6 alkyl-4-hydroxyphenyl) propionate] such as t-butyl-4-hydroxyphenyl) propionate]; N, N′-hexa methylenebis (3,5-di -t- butyl-4-hydroxy hydrocinnamate raw bromide) N, such as, _{N'-C 2-10} alkylene bis (3,5 And di branched _{C 3-6} alkyl-4-hydroxy hydrocinnamate raw bromide) is preferred.

The amine-series antioxidant, a hindered amine, for example, tri- or tetra-C _1-3 alkyl piperidine or methoxy derivative thereof (4-position, benzoyloxy, phenoxy and the like may be substituted 2,2,6, 6-tetramethylpiperidine, etc.), bis (tri, tetra or penta C _1-3 alkylpiperidine) C _2-20 alkanedicarboxylic acid ester [eg bis (2,2,6,6-tetramethyl-4-piperidyl) Oxalate, malonate corresponding to oxalate, adipate, sebacate, terephthalate, etc .; bis (1,2,2,6,6-pentamethyl-4-piperidyl) sebacate], 1,2-bis (2,2,6,6- Tetramethyl-4-piperidyloxy) ethane, phenylnaphthylamine, N, N'-diphenyl-1 4- phenylenediamine, and the like N- phenyl -N'- cyclohexyl-1,4-phenylenediamine.

  Examples of the hydroquinone antioxidant include 2,5-di-t-butylhydroquinone, and examples of the quinoline antioxidant include 6-ethoxy-2,2,4-trimethyl-1,2. -Dihydroquinoline and the like are included. Examples of the sulfur-based antioxidant include dilauryl thiodipropionate and distearyl thiodipropionate.

  Examples of phosphorus stabilizers (or phosphorus antioxidants) include phosphite stabilizers (trialkyl phosphites, trisalkylaryl phosphites, tris (branched alkylphenyl) phosphites, (branched alkylphenyl) phenylphosphines). Phyto, bis (alkylaryl) pentaerythritol diphosphite, etc.), triphenyl phosphate stabilizers, diphosphonite stabilizers and the like.

  Examples of reactive stabilizers include epoxy reactive stabilizers (glycidyl ether compounds, epoxy group-containing acrylic polymers, etc.), oxazoline reactive stabilizers (1,3-phenylenebis (2-oxazoline), 1 , 4-phenylenebis (2-oxazoline)), carbodiimide-based reactive stabilizers (polyarylcarbodiimide, polyalkylarylcarbodiimide, poly [alkylenebis (alkyl or cycloalkylaryl) carbodiimide], etc.).

  These antioxidants and / or stabilizers can be used alone or in combination of two or more. The proportion of the antioxidant is in the range of 0.01 to 10 parts by weight, preferably 0.05 to 8 parts by weight, more preferably about 0.1 to 5 parts by weight with respect to 100 parts by weight of the base resin (A). You can choose from. The proportion of the stabilizer can also be selected from the same range as the proportion of the antioxidant.

Among the additives, the lubricant includes a long-chain fatty acid or a derivative thereof [monovalent saturated or unsaturated fatty acid (capric acid, lauric acid, myristic acid, pentadecylic acid, palmitic acid, stearic acid, arachidic acid, behenic acid, such as _{C 10-34} saturated fatty acids such as montanic acid), a divalent saturated or unsaturated fatty acids (oleic acid, linoleic acid, linolenic acid, arachidonic acid, an unsaturated _{C 10-34} fatty acids, such as erucic acid) And their fatty acid esters and fatty acid amides], polyalkylene glycols [C _2-6 alkylene glycols (ethylene glycol, propylene glycol, tetramethylene glycol, etc.) or copolymers, or derivatives thereof], silicone-based Compound [dialkylsiloxane (such as dimethylsiloxane), al Monoaryl siloxanes such as diaryl siloxane (such as phenylmethyl siloxane), diaryl siloxane (such as diphenyl siloxane), or homopolymers or copolymers thereof (polyorganosiloxane), modified polyorganosiloxane, etc.], waxes [natural Paraffin, synthetic paraffin, micro wax, polyolefin wax (poly C _2-4 olefin wax such as polyethylene wax and polypropylene wax, olefin copolymer wax such as ethylene copolymer wax) and the like. A lubricant can be used individually or in combination of 2 or more types.

  The ratio of the lubricant is, for example, 0.01 to 20 parts by weight, preferably 0.01 to 15 parts by weight, more preferably 0.01 to 10 parts by weight (for example, relative to 100 parts by weight of the base resin (A). 0.1 to 10 parts by weight).

  The flame retardant resin composition of the present invention may be a powder mixture or a molten mixture. A base resin, a halogen flame retardant, a specific oxygen acid component, and other components (a flame retardant aid, And an olefin resin, an electrical property improving aid, an additive, etc.) can be prepared by a conventional method. The present invention also includes a molded article formed from the flame retardant resin composition (for example, a resin composition (molded article) formed by solidifying the molten mixture).

  The flame retardant resin composition and the molded product are, for example, (1) a method of mixing each component, kneading and extruding with a single or twin screw extruder to prepare pellets, and (2) once, A method of preparing pellets (master batches) having different compositions, mixing (diluting) the pellets in a predetermined amount and using them for molding, and obtaining a molded product having a predetermined composition. (3) One or more of each component in a molding machine The method of directly charging and molding can be adopted. In addition, all or a part other than the base resin may be mixed in advance and mixed with the base resin, or may be directly mixed with the base resin without previously mixing components other than the base resin. Also, the order of addition of components other than the base resin is not particularly limited, and all the components other than the base resin may be added to the base resin all at once, and the components remaining after adding and mixing some components (May be divided into multiple times if necessary).

  In addition, a molded article can be manufactured by melt-kneading a flame-retardant resin composition by a conventional method and molding by a conventional method such as extrusion molding, injection molding, or compression molding.

  Although the flame retardant resin composition (and molded product) of the present invention contains a halogen-based flame retardant, it can achieve both flame retardancy and electrical characteristics. When the resin composition and molded product of the present invention are measured with a test piece thickness of 1.6 mm, the flame retardancy based on the UL94 flammability test is V-1 or more, preferably V-0 or more. Moreover, the comparative tracking index (CTI) based on IEC112 is 300 V or more (for example, about 300 to 1000 V), preferably 350 V or more (for example, about 350 to 1000 V), more preferably, the resin composition and the molded product of the present invention. Is 400 V or more (for example, about 400 to 900 V), particularly 500 V or more (for example, about 500 to 800 V).

  In the present invention, (a) a flame retardant resin composition (and a molded product) having flame retardancy in accordance with UL94 of V-2 or higher and the comparative tracking index of 400 V or higher, (b) Measured at a flame retardant resin composition (and molded product) having flame retardancy in accordance with UL94 of V-0 or higher and the comparative tracking index of 350 V or higher, and (c) test piece thickness of 0.8 mm. In addition, a flame retardant resin composition (and a molded product) having a flame retardancy based on UL94 of V-0 or higher and a comparative tracking index of 300 V or higher is also included.

  In addition, the resin molded product (molded product) of the present invention is excellent in safety against electric fire inside the device, safety against fire of the molded product itself, mechanical characteristics, electrical characteristics, and the like. , Connectors, relays, disk drive chassis, transformers, electromagnetic switches, switch parts, outlet parts, sockets, plugs, capacitors, various cases, resistors, metal terminals or parts used in places where conductors are incorporated) Household appliance parts [e.g., housing for general household appliances, parts related to computers or peripheral equipment, lighting parts, parts related to telephone or facsimile equipment, air conditioner parts, audiovisual equipment for home use (TVs, digital versatile disc players, video Deck etc.), etc.], office automation (OA) equipment parts (computer-related parts, acoustic parts, lighting parts, telegraph or telephone equipment-related parts, facsimile parts, copying machine parts, air conditioning parts, optical equipment parts, etc.), mechanical mechanism parts (various gears, It is useful for various bearings, motor parts, etc.) and automobile parts (automotive ignition device parts, automobile connectors, various automobile electrical parts, etc.).

  The flame retardant resin composition (and molded product) of the present invention is excellent in flame retardancy and electrical properties, and is used in various applications such as electric / electronic parts, home appliance parts, office automation (OA) equipment parts, It can be suitably used for machine mechanism parts, automobile parts and the like.

  Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited to these examples.

  In addition, the flame retardance and electrical property (comparison tracking index) of the resin composition were evaluated by the following test.

[Flammability test]
In accordance with UL94, the flammability was evaluated at a test piece thickness of 1.6 mmt or 0.8 mmt.

[Comparison tracking index (CTI)]
Based on IEC112, the comparative tracking index (CTI) [unit: V] was evaluated using solution A.

  Further, the base resin (A), halogen-based flame retardant (B), oxygen acid component (C), flame retardant aid (D), olefin resin (E), and electrical property improvement aid used in Examples and Comparative Examples are used. The agent (F), filler (G), antioxidant (H), stabilizer (I), and lubricant (J) are as follows.

1. Base resin (A)
(A-1): Polybutylene terephthalate [Intrinsic viscosity = 0.85]
(A-2): Polyethylene terephthalate [Intrinsic viscosity = 0.75]
(A-3): Polypropylene terephthalate [Intrinsic viscosity = 0.85]
(A-4): 12.5 mol% isophthalic acid modified polybutylene terephthalate [inherent viscosity = 0.85]
(A-5): Polyamide 66 [Leona 1300, manufactured by Asahi Kasei Chemicals Corporation]
(A-6): Polyamide 6 [SF1013A, manufactured by Ube Industries, Ltd.]
(A-7): Polyamide MXD6 [Reny 6002, manufactured by Mitsubishi Engineering Plastics Co., Ltd.].

2. Halogen flame retardant (B)
(B-1): Poly (pentabromobenzyl acrylate) [FR1025, manufactured by Bromchem Far East]
(B-2): Brominated polystyrene [Pyrocheck 68PB, manufactured by Ferrochemicals]
(B-3): Brominated polystyrene [SYTEX HP-7010P, manufactured by Albemarle]
(B-4): Ethylenebistetrabromophthalimide [SYTEX BT-93, manufactured by Albemarle Corporation]
(B-5): Brominated epoxy resin [SRT5000, manufactured by Sakamoto Pharmaceutical Co., Ltd.]
(B-6): Brominated polycarbonate resin [Fireguard FG-7500, manufactured by Teijin Chemicals Ltd.].

3. Oxygen acid component (C)
(I) Organic (sub) phosphonic acid compound C1
(C1-1): nitrilotris (methylphosphonic acid) calcium salt (C1-2): nitrilotris (methylphosphonic acid) magnesium salt (C1-3): nitrilotris (methylphosphonic acid) aluminum salt (C1-4): nitrilotris (Methylphosphonic acid) hexamelamine salt (C1-5): 1-hydroxyethylidene-1,1-diphosphonic acid calcium salt (C1-6): 1-hydroxyethyldene-1,1-diphosphonic acid aluminum salt (C1-7) ): Calcium methylphosphonate (C1-8): Magnesium methylphosphonate (C1-9): Aluminum methylphosphonate (C1-10): Aluminum ethylphosphonate (C1-11): Aluminum salt of methylphosphonic acid monomethyl ester (C1-12): Methyl Phosphonic acid aluminum salt (C1-13): ethyl phosphonous acid aluminum salt (ii) an organic sulfonic acid compound C2
(C2-1): methanesulfonic acid calcium salt (C2-2): methanesulfonic acid aluminum salt (C2-3): methanesulfonic acid melam salt.

4). Flame retardant aid (D)
(I) Antimony-containing compound D1
(D1-1): Antimony trioxide (D1-2): Antimony pentoxide (D1-3): Sodium antimonate (ii) Fluorine-containing resin D2
(D2-1): Polytetrafluoroethylene (iii) Silicon-containing compound D3
(D3-1): Swellable synthetic fluorinated mica [ME-100, manufactured by Coop Chemical Co., Ltd.]
(Iv) Phosphorus-containing compound D4
(D4-1): Aluminum methylethylphosphinate (D4-2): Aluminum diethylphosphinate (D4-3): Resorcinol bis (di-2,6-xylylphosphate)
(D4-4): Cyclic phenoxyphosphazene (mixture of trimer and tetramer)
(D4-5): 1,4-piperazinediyltetraphenyl phosphate (v) Aromatic resin D5
(D5-1): Novolac type epoxy resin [EPPN, manufactured by Nippon Kayaku Co., Ltd.]
(D5-2): Bisphenol-A type epoxy resin [Epicoat 1004K, manufactured by Yuka Shell Epoxy Co., Ltd.].

5. Olefin resin (E)
(E-1): Ethylene-ethyl acrylate copolymer [NUC-6570, manufactured by Nippon Unicar Co., Ltd.]
(E-2): Ethylene-glycidyl methacrylate copolymer [Bond First E, manufactured by Sumitomo Chemical Co., Ltd.]
(E-3): Ethylene-propylene copolymer [J707ZB, manufactured by Mitsui Chemicals, Inc.]
6). Electric property improvement aid (F)
(F-1): Titanium oxide (F-2): Zinc sulfide (F-3): Hydrous zinc borate [Fire Break ZB, manufactured by US Borax Co., Ltd.]
(F-4): Melamine polyphosphate [Melapur 200, manufactured by DSM]
(F-5): Melamine cyanurate (F-6): Talc.

7). Filler (G)
(G-1): Glass fiber (chopped strand having a diameter of 13 μm and a length of 3 mm)
8). Antioxidant (H)
(H-1): Pentaerythritol tetrakis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate] [Irganox 1010, manufactured by Ciba Specialty Chemicals Co., Ltd.]
(H-2): N, N′-hexamethylenebis (3,5-di-t-butyl-4-hydroxyhydrocinnamamide) [Irganox 1098, manufactured by Ciba Specialty Chemicals Co., Ltd.]
(H-3): Octadecyl-3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate [Irganox 1076, manufactured by Ciba Specialty Chemicals Co., Ltd.].

9. Stabilizer (I)
(I) Phosphorus stabilizer I1
(I1-1): Tetrakis (2,4-di-t-butylphenyl) -4,4′-biphenylenediphosphonite [Sand Stub P-EPQ, manufactured by Sand Corp.]
(I1-2): Bis (2,6-di-t-butyl-4-methylphenyl) pentaerythritol diphosphite [Adeka Stub PEP36, manufactured by Adeka Argus Co., Ltd.]
(I1-3): primary calcium phosphate (ii) reactive stabilizer I2
(I2-1): Bisphenol-A diglycidyl ether [Epicoat 828, manufactured by Yuka Shell Epoxy Co., Ltd.].

10. Lubricant (J)
(J-1): Polyethylene wax [Sun Wax, manufactured by Sanyo Chemical Co., Ltd.]
(J-2): Montanate ester [LUZA WAX-P, manufactured by Toyo Petrolite Co., Ltd.]
(J-3): Ethylene bisstearylamide (J-4): Polyethylene glycol monostearate.

Examples 1-28 and Comparative Examples 1-3
The above components were mixed in the proportions (parts by weight) shown in Tables 1 to 3 and kneaded and extruded with an extruder to prepare a pellet-shaped resin composition. Using the obtained pellets, test molded articles were produced by injection molding, and flammability (1.6 mmt) and tracking resistance (comparative tracking index) were evaluated. The results are shown in Tables 1 to 3.

Examples 29 to 32 and Comparative Example 4
The above components were mixed in the proportions (parts by weight) shown in Table 4, and kneaded and extruded with an extruder to prepare a pellet-shaped resin composition. Using the obtained pellets, test molded articles were produced by injection molding, and flammability (1.6 mmt) and tracking resistance (comparative tracking index) were evaluated. The results are shown in Table 4.

Examples 33-50
The above components were mixed in the proportions (parts by weight) shown in Table 5 and Table 6, and kneaded and extruded by an extruder to prepare a pellet-shaped resin composition. Using the obtained pellets, test molded articles were produced by injection molding, and flammability (1.6 mmt) and tracking resistance (comparative tracking index) were evaluated. The results are shown in Tables 5 and 6.

Examples 51-60 and Comparative Examples 5-10
The above components were mixed in the proportions (parts by weight) shown in Table 7 and Table 8, and kneaded and extruded with an extruder to prepare a pellet-shaped resin composition. Using the obtained pellets, a test molded product was produced by injection molding, and flammability (0.8 mmt) and tracking resistance (comparative tracking index) were evaluated. The results are shown in Table 7 and Table 8.

Examples 61-78 and Comparative Examples 11-12
The above components were mixed in the proportions (parts by weight) shown in Table 9 and Table 10, and kneaded and extruded with an extruder to prepare a pellet-shaped resin composition. Using the obtained pellets, a test molded product was produced by injection molding, and flammability (0.8 mmt) and tracking resistance (comparative tracking index) were evaluated. The results are shown in Table 9 and Table 10.

Claims (27)

  Consisting of a base resin, a halogen-based flame retardant, an organic (phosphorous) phosphonic acid compound or a salt thereof, and at least one oxygen acid component selected from an organic sulfonic acid compound or a salt thereof. A flammable resin composition.   The base resin is at least one thermoplastic resin selected from polyester resins, polyamide resins, polycarbonate resins, polyphenylene oxide resins, polyphenylene sulfide resins, acrylic resins, styrene resins, and vinyl resins. The resin composition according to claim 1. The resin composition according to claim 1, wherein the base resin is a homo- or copolyester having at least one unit selected from 1,4-cyclohexanedimethylene terephthalate, C _2-4 alkylene terephthalate, and C _2-4 alkylene naphthalate. object.   Halogen flame retardant is bromine-containing acrylic resin, bromine-containing styrene resin, bromine-containing polycarbonate resin, bromine-containing epoxy compound, bromine-containing phosphate ester, bromine-containing triazine compound, bromine-containing isocyanuric acid compound, brominated polyaryl The resin composition according to claim 1, which is at least one bromine atom-containing flame retardant selected from an ether compound, a brominated aromatic imide compound, and a brominated bisaryl compound.   The halogen flame retardant is at least one selected from a brominated polybenzyl (meth) acrylate resin, an alkylene brominated phthalimide, a brominated product of a styrene resin, and a brominated styrene monomer alone or a copolymer. The resin composition according to claim 1.   The resin composition according to claim 1, wherein the halogen flame retardant is at least one selected from a brominated bisphenol A type epoxy resin, a brominated bisphenol A type phenoxy resin, and a brominated bisphenol A type polycarbonate resin. The organic (sub) phosphonic acid compound has the following formula (1)

(In the formula, R ¹ and R ² are the same or different and each represents a hydrogen atom or a hydrocarbon group. X represents an n-valent organic group, n represents an integer of 1 to 6. m is 1 or 0. is there)
The organic sulfonic acid compound is represented by the following formula (2)
R ³ —S (═O) ₂ —OH (2)
(Wherein R ³ represents a monovalent organic group)
The resin composition according to claim 1, which is a compound represented by the formula:   The resin composition according to claim 1, wherein the salt-forming component forming the salt of the organic (phosphorous) phosphonic acid compound and the salt of the organic sulfonic acid compound is at least one selected from a metal and a nitrogen-containing compound having an amino group. In the formula (1), the group R ¹ is a hydrogen atom, the group R ² is a hydrogen atom or an alkyl group, and the group X has an aliphatic hydrocarbon group or substituent which may have a substituent. A heteroatom-containing group that may be substituted, n is an integer of 1 to 4, and when m is 0, n is 1, and in the formula (2), the group R ³ has a substituent. The resin composition according to claim 7, which is an aliphatic hydrocarbon group which may be present.   The organic (sub) phosphonic acid compound may have an alkyl (sub) phosphonic acid which may have a substituent, an alkylphosphonic acid monoalkyl ester which may have a substituent, or a substituent. An alkylidene diphosphonic acid, an optionally substituted nitrilotris (alkyl phosphonic acid), or an optionally substituted oxydi (alkyl phosphonic acid), and the organic sulfonic acid compound has a substituent. A salt-forming component that is an alkanesulfonic acid that may be present and that forms a salt of an organic (phosphorous) phosphonic acid and a salt of an organic sulfonic acid, a Group 1 metal, a Group 2 metal, a Group 4 metal 2. The resin composition according to claim 1, wherein the resin composition is at least one selected from the group consisting of a group 8 metal, a group 12 metal, a group 13 metal, and an aminotriazine compound.   The resin composition according to claim 1, wherein the proportion of the halogen-based flame retardant is 3 to 30 parts by weight and the proportion of the oxygen acid component is 1 to 30 parts by weight with respect to 100 parts by weight of the base resin.   The resin composition according to claim 1, comprising 5 to 500 parts by weight of an oxygen acid component with respect to 100 parts by weight of the halogen-based flame retardant.   Furthermore, the resin composition of Claim 1 containing at least 1 type selected from the flame retardant adjuvant and the olefin resin.   The resin composition according to claim 13, wherein the flame retardant aid comprises at least one selected from an antimony-containing compound, a fluorine-containing resin, a silicon-containing compound, an aromatic resin, and a phosphorus-containing compound.   The resin according to claim 13, wherein the flame retardant aid is at least one selected from antimony oxide, antimonate, (poly) organosiloxane, layered silicate, and a fluorine-containing monomer alone or a copolymer. Composition.   Flame retardant aid may be phenol resin, polyphenylene oxide resin, aromatic epoxy resin, phenoxy resin, polyphenylene sulfide resin, polycarbonate resin, polyarylate resin, aromatic polyamide resin, aromatic liquid crystal The resin composition according to claim 13, wherein the resin composition is at least one selected from a polyester resin and an aromatic polyesteramide resin which may be liquid crystalline.   Flame retardant aids include (condensed) phosphate esters, (condensed) phosphate ester amides, non-bridged or bridged aryloxyphosphazenes, organic phosphinic acid aminotriazine salts, organic phosphinic acid metal salts, (sub-) phosphorous acid metal salts, The resin composition according to claim 13, wherein the resin composition is at least one selected from metal salts of hypophosphorous acid and metal.   Furthermore, the resin composition of Claim 1 containing an electrical property improvement adjuvant.   Electrical property improvement aids are metal oxide, metal sulfide, (hydrous) metal silicate, (hydrous) metal borate, (hydrous) metal stannate, metal hydrogen phosphate, aminotriazine compound, pyrroline The resin composition according to claim 18, wherein the resin composition is at least one selected from acid salts, polyphosphates, polymetaphosphates, and polyphosphate amides.   Electrical properties improvement aids are titanium oxide, zinc sulfide, talc, kaolin, (hydrous) zinc borate, (hydrous) calcium borate, (hydrous) zinc stannate, calcium hydrogen phosphate, melamine cyanurate, melamine polyphosphate , Melam polyphosphate, Melem polyphosphate, Melon polyphosphate, Melamine polymelate / Melam / Melem double salt, Melamine polyphosphate / Melam / Melem / Melon double salt, Melamine polymetaphosphate and Melamine polymetaphosphate / Melam / Melem double salt The resin composition according to claim 18, wherein the resin composition is at least one kind.   The resin composition according to claim 1, further comprising at least one selected from an antioxidant, a stabilizer, a lubricant, and a filler.   The resin composition according to claim 1, wherein the comparative tracking index based on IEC112 is 400 V or more.   (i) When measured with a test piece thickness of 1.6 mm, the flame retardancy according to UL94 flammability test is V-2 or higher, and (ii) the comparative tracking index according to IEC112 is 400 V or higher. Item 2. The resin composition according to Item 1.   (i) When measured at a test piece thickness of 1.6 mm, the flame retardancy according to UL94 flammability test is V-0 or higher, and (ii) the comparative tracking index according to IEC112 is 350 V or higher. Item 2. The resin composition according to Item 1.   (i) When measured with a test piece thickness of 0.8 mm, the flame retardancy according to the UL94 flammability test is V-0 or higher, and (ii) the comparative tracking index according to IEC112 is 300 V or higher. Item 2. The resin composition according to Item 1.   A molded article formed from the resin composition according to claim 1.   27. The molded article according to claim 26, wherein the molded article is at least one selected from an electrical or electronic part, a household electrical appliance part, an office automation equipment part, a mechanical mechanism part, and an automobile part.