JP2006120791A - Substrate storing container - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate storing container capable of suppressing the breakage of a substrate as well as facilitating the ejection operation by returning the substrate to the regular position of teeth. <P>SOLUTION: The substrate storing container is provided with a container body for storing a semiconductor wafer W, two or more teeth for supporting the semiconductor wafer W almost horizontally which is allocated in the internal both sides of the container body, a rear retainer for supporting the rear periphery of the semiconductor wafer W via a support groove 32, and a lid for opening and closing the front face configuring the aperture of the container body. Furthermore, at the back of two or more teeth, two or more guide grooves 50 for guiding the semiconductor wafer W to an up and down direction are formed by bringing a slope 51 into contact with the periphery of both sides of the semiconductor wafer W when closing engagement of the container body by means of the lid. The oblique angle of the slope 51 for forming each guide groove 50 is set less than that of a slope 33 consisting of the support groove 32 of the rear retainer 30. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate storage container for storing a semiconductor wafer, a photomask, a substrate for a recording medium, and the like, and more particularly to a substrate support structure.

  In recent years, with the increase in the diameter of semiconductor wafers from 200 mm to 300 mm, front open box type substrate storage containers are manufactured and sold. This type of substrate storage container includes a container body of a front open box that stores a plurality of semiconductor wafers (not shown), and a plurality of pairs of teeth that are disposed on both sides of the container body and horizontally support the semiconductor wafers, It consists of a rear retainer that is arranged inside the container body and holds the rear periphery of the semiconductor wafer via a holding groove, and a detachable lid that opens and closes the open front of the container body. Low contamination is achieved (see Patent Documents 1 and 2).

  When the substrate storage container having such a configuration is transported by aircraft, ship, truck, or the like, the container body storing the semiconductor wafer is fitted and closed by the lid, and the rear retainer and the front retainer of the lid are connected. The semiconductor wafer is sandwiched and slightly lifted so as not to be rubbed from the pair of teeth, and generation of particles and wear powder due to friction between the semiconductor wafer and the teeth is prevented.

On the other hand, when the semiconductor wafer is taken out after transportation, the lid is removed from the container body, and the holding of the rear retainer and the front retainer of the lid is released, so that the semiconductor wafer is mounted and supported again on the pair of teeth. Is done.
Japanese Patent Laid-Open No. 2003-522078 JP 2004-111830 A

  The conventional substrate storage container is configured as described above, and when the lid is removed, the holding of the rear retainer and the front retainer of the lid is released, and the semiconductor wafer is again supported by the pair of teeth. At this time, the peripheral edge portion of the semiconductor wafer having poor slippage is caught on the rear retainer, and the semiconductor wafer may not return to the normal position of the pair of teeth. Such a tendency is often observed in semiconductor wafers having poor slip after cleaning. If the semiconductor wafer does not return, there will be a serious problem that it will hinder the picking-up operation of the robot for picking up the semiconductor wafer or damage the semiconductor wafer.

In order to solve such a problem, it is conceivable to increase the inclination angle of the retaining groove of the rear retainer to improve the slipperiness.
However, simply increasing the inclination angle of the holding groove makes it difficult to hold the semiconductor wafer, so it becomes difficult to lift the semiconductor wafer from the teeth. .

  The present invention has been made in view of the above, and it is an object of the present invention to provide a substrate storage container that can return a substrate to a proper position of a tooth to facilitate its removal operation and suppress damage to the substrate. .

In the present invention, in order to solve the above-mentioned problem, a container main body for storing a substrate, a plurality of teeth provided on both sides of the container main body for supporting the substrate, and a rear peripheral edge of the substrate provided in the container main body. A rear retainer that is held via the holding groove, and a lid that opens and closes the front of the container body. When the container body is closed by the lid, a plurality of substrates are sandwiched between the rear retainer and the lid. Lifting from the teeth,
Provided behind the plurality of teeth is a guide groove that guides the substrate in the vertical direction by bringing the inclined surface into contact with the peripheral edge of the substrate when the container body is closed by the lid, and the inclination angle of the inclined surface that forms the guide groove Is set smaller than the inclination angle of the retaining groove of the rear retainer.

The rear retainer can be formed using an elastic material.
Moreover, it is preferable that the inclination angle of the holding groove of the rear retainer is in the range of 70 ° to 85 °.
Moreover, it is preferable to make the inclination angle of the inclined surface which forms a guide groove into the range of 45 degrees-80 degrees.

Further, the rear retainer and / or the guide groove can be formed of a material having a lower friction than that of the container body.
Further, the rear retainer can be constituted by a support provided on the inner back surface of the container body and an elastic piece provided on the support and holding the rear periphery of the substrate via a holding groove.

  Here, the substrate in the claims includes at least a semiconductor wafer made of a silicon wafer having a diameter of 200 mm, 300 mm, and 450 mm, a glass wafer, a photomask, a substrate for a recording medium, and liquid crystal glass. The container body may be transparent, translucent, or opaque. The back surface of the container body can be a see-through window.

  The retaining groove of the rear retainer is formed in a substantially U-shaped cross section, a substantially V-shaped cross section, a substantially Y-shaped cross section, or the like. The guide groove can be integrally formed behind the teeth or can be formed separately. The inclination angle of the inclined surface forming the guide groove is an angle of an acute angle portion among the angles formed by the substrate support surface and the inclined surface of the tooth. Further, the substrate storage container according to the present invention includes both FOSB type and FOUP type as long as it is a front open box.

  According to the present invention, when the container main body containing the substrate is closed by the lid, the substrate supported by the plurality of teeth is pushed by the lid and moves from the teeth to the guide groove to slide the inclined surface, and the guide It moves to the holding groove of the rear retainer from the middle of the inclined surface of the groove, and then the rear periphery of the substrate is held in the holding groove. When the substrate is held in the holding groove of the rear retainer, the substrate is held between the rear retainer and the lid and lifted so as not to be rubbed from the teeth.

  On the other hand, when the lid is removed from the container body in order to take out the substrate, the substrate slides down the inclined surface from the holding groove of the rear retainer, moves from the middle of the inclined surface of the holding groove to the inclined surface of the guide groove, and then It is supported by moving on the teeth from the inclined surface of the guide groove.

ADVANTAGE OF THE INVENTION According to this invention, there exists an effect that a board | substrate is returned to the regular position of a tooth and the taking-out operation | work is made easy, or damage to a board | substrate can be suppressed effectively.
Further, if the rear retainer is formed using an elastic material, the substrate can be safely protected even if an impact or vibration is applied to the substrate when the substrate storage container is moved. Further, the substrate can be dropped from the holding groove of the rear retainer with a high probability.

Further, if the inclination angle of the holding groove of the rear retainer is in the range of 70 ° to 85 °, it is possible to suppress the deterioration of the slipperiness of the substrate, to ensure the mobility of the substrate when contacting the inclined surface, The accompanying damage or contamination of the substrate can be prevented.
Further, if the inclination angle of the inclined surface forming the guide groove is in the range of 45 ° to 80 °, the substrate can be slid down on the teeth from the inclined surface of the holding groove of the rear retainer, and the substrate is placed in the container by the lid. Resistance when pushed into the body can be reduced.

  Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. A substrate storage container in this embodiment includes a container main body 1 for storing a plurality of semiconductor wafers W as shown in FIGS. A plurality of pairs of teeth 20 disposed on both side walls of the container body 1 and supporting the semiconductor wafer W substantially horizontally, and a rear peripheral edge of the semiconductor wafer W mounted on the back wall 6 of the container body 1 and holding grooves 32. A rear retainer 30 that is held via a container and a detachable lid 40 that opens and closes the front surface of the container body 1 are provided, and a plurality of guide grooves 50 are provided behind the plurality of pairs of teeth 20.

  Each semiconductor wafer W is made of, for example, a round disc-shaped silicon wafer having a diameter of 300 mm. Both front and back surfaces are formed in mirror surfaces, and are loaded and unloaded with the right and left peripheral edges handled by a dedicated robot. At the peripheral edge of the semiconductor wafer W, a notch for facilitating discrimination and alignment of the crystal direction is cut out into a substantially semicircular plane.

  As shown in FIGS. 1 to 3, the container body 1 is formed into a transparent front open box having a front opening using a predetermined resin such as polycarbonate resin having excellent transparency and rigidity, and a plurality of pieces (for example, 25 A plurality of semiconductor wafers W are arranged and stored in the vertical direction.

  As shown in FIG. 3, the container body 1 includes a hollow widest portion 2 located on the front side, a hollow widened portion 3 integrally formed behind the widest portion 2 via an inclined step wall, A hollow reduced width portion 5 integrally formed behind the widened portion 3 via the inclined stepped wall 4 and a most contracted width portion integrally formed via the inclined stepped wall behind the reduced width portion 5. And a back wall 6. The inclined step wall 4 behind the widened portion functions as a stopper when the semiconductor wafer W is accommodated.

  Positioning tools 8 that are positioned by a processing apparatus on which the substrate storage container is mounted are integrally formed on both the front side and the rear center of the bottom surface of the container body 1. Each positioning tool 8 is formed in a substantially M-shaped cross section, a substantially inverted V shape, a substantially inverted Y shape, or a concave oval shape.

  As shown in FIGS. 1 and 2, a flat rectangular robotic flange 9 is integrally or detachably attached to the center of the ceiling of the container body 1, and this robotic flange 9 is called OHT (overhead hoist transfer). By being held by an automatic conveyance mechanism (not shown), the substrate storage container conveys the inside of the process. Further, the peripheral edge of the front of the opening of the container body 1 is formed to have a substantially L-shaped cross section, so that it protrudes outward to form a rim portion 10 (see FIGS. 2 and 3). A plurality of recesses 11 for locking the lid are formed on the upper and lower sides of each.

Thick disc-shaped, substantially L-shaped, or inverted U-shaped transport handles (not shown) are selectively mounted on both side walls of the container body 1, and the transport handles are gripped by the operator. As a result, the substrate storage container is conveyed.
The container body 1, the positioning tool 8, the robotic flange 9, and the transport handle are molded using, for example, polycarbonate, polyetherimide, cyclic olefin resin, or the like. Carbon black, acetylene black, carbon fiber, carbon nanotube, metal fiber, antistatic agent and the like can be appropriately added to these materials.

  As shown in FIGS. 2, 3, 8, and 9, the plurality of pairs of teeth 20 protrude inward from the inner surfaces of both side walls of the container body 1 to face each other and support and mount the semiconductor wafer W substantially horizontally. The pair of left and right teeth 20 is provided, and a plurality of the pair of teeth 20 are arranged at a predetermined pitch in the vertical direction. Each tooth 20 is formed using the same material as the container main body 1, the positioning tool 8, the robotic flange 9, and the transport handle, and is formed from the widened portion 3 of the container main body 1 to the inclined stepped wall 4 behind it. The

  Each of the teeth 20 is formed into a substantially rectangular shape, a substantially square shape, or a substantially semicircular arc shape, and a flat plate 21 along the peripheral edge of the semiconductor wafer W and a flat surface integrally formed on the inner side of the front portion of the flat plate 21. The front middle thickness region 22 and the flat front thick region which is integrally formed on the front outer side of the flat plate 21 and located outside the front middle thickness region 22, in other words, on the side wall side of the container body 1. 23, a rear middle region 24 formed integrally with the rear portion of the flat plate 21, and a rear portion of the flat plate 21 formed in front of the rear middle region 24 and positioned in a slight area near the side wall of the container body 1. And a flat rear thick region 25.

  Between the front middle wall region 22 and the front thick wall region 23, a slight vertical step that contacts the peripheral edge of the semiconductor wafer W is formed. The front thick region 23 is formed to have a height corresponding to the thickness of the semiconductor wafer W, specifically, a height of about 0.3 to 0.7 mm. Jumping out from 1 is restricted as a stopper. A slightly recessed thin region is formed between the front middle region 22 and the rear middle region 24, and this thin region is opposed to the side edge of the semiconductor wafer W with a slight gap.

  The teeth 20 having such a configuration horizontally support the peripheral edge of the semiconductor wafer W in a flat front middle region 22 and rear middle region 24 while maintaining high accuracy. It functions to prevent the robot from tilting in and out with the fork of the robot.

  As shown in FIGS. 2, 3, 6, 8, and 9, the rear retainer 30 includes a substantially U-shaped planar support plate 31 that is attached to the inner surface of the back wall of the container body 1. A plurality of holding grooves 32 having a substantially V-shaped cross section are formed on both free ends of 31 in the vertical direction, and the rear edge of the semiconductor wafer W is held in each holding groove 32.

  The support plate 31 is formed using a material that is superior to the container body 1 in terms of flexibility, slidability (low friction), and elasticity from the viewpoint that the holding grooves 32 are individually brought into contact with the semiconductor wafer W. Specifically, polybutylene terephthalate, polyethylene terephthalate, polyether ether ketone, polyether sulfone, fluorine-containing resin, various thermoplastic elastomers such as polyester are used.

  The inclination angle θ2 of the inclined surface 33 extending in the vertical direction of each holding groove 32 is in the range of 70 ° to 85 °. This is because if the angle is less than 70 °, the slipperiness of the semiconductor wafer W decreases. It is. On the other hand, when the angle exceeds 85 °, the mobility of the semiconductor wafer W at the time of sliding contact with the inclined surface 33 is deteriorated, and the peripheral edge of the semiconductor wafer W is damaged or contaminated by rubbing.

  As shown in FIGS. 1 to 4, the lid body 40 is set on a fitting body 41 detachably fitted in the rim portion 10 of the container body 1 and on both sides of the opened surface of the fitting body 41. A pair of left and right locking mechanisms 46, and a cover plate 47 that is detachably mounted on the open surface of the fitting body 41 and covers the locking mechanism 46, and is press-fitted into the rim portion 10 of the container body 1. It is fitted and closed in a sealed state.

  The fitting body 41 is basically formed in a substantially hat-shaped cross section, is formed in a horizontally long frontal rectangular shape, and has a substantially H-shaped cross section, a substantially L-shaped cross section, or a substantially Z-shaped cross section so that the peripheral wall can ensure rigidity. The seal gasket 42 interposed between the container main body 1 and the lid body 40 is detachably fitted to the bent peripheral wall. The seal gasket 42 is formed endlessly using, for example, fluorine rubber or silicone rubber, and is pressed and deformed to the inner peripheral surface of the rim portion 10 when the lid body 40 is fitted. It functions to suppress and prevent the inflow of gas.

  An elastic front retainer 43 is attached to the center of the recessed back surface of the fitting body 41, and the front retainer 43 sandwiches the front peripheral edge of each semiconductor wafer W stored in the container body 1 (see FIG. 9). As shown in FIGS. 2 and 4, the front retainer 43 is formed integrally with the plurality of spring pieces 44 arranged in the vertical direction and the respective spring pieces 44, and holds the front peripheral edge of the semiconductor wafer W via the V-groove. The guide block 45 is formed.

  Each locking mechanism 46 is pivotally supported on the surface side portion of the fitting body 41, and is rotated by an operation from the outside of a lid opening / closing device (not shown), and is slidably supported by the fitting body 41 and coupled to the rotation reel. And a plurality of advancing / retracting bars that slide linearly in the up / down direction of the lid 40 based on the rotation of the rotary reel, and formed at the front end of each advancing / retracting bar, and protrudes and retracts from the opening of the peripheral wall of the fitting body 41. And a locking claw that is engaged with and locked in the locking hole 11 of the rim portion 10 and locks the lid body 40 that is fitted and closed to the rim portion 10 of the container body 1.

The cover plate 47 is formed in a shape corresponding to the opening surface of the fitting body 41, and a through operation hole 48 for the locking mechanism 46 facing the center of the surface of the rotary reel is formed in a front rectangle. The penetration operation hole 48 is penetrated by the key of the lid opening / closing device.
The fitting body 41, the locking mechanism 46, the cover plate 47, etc. of the lid body 40 are molded using, for example, polycarbonate, polycarbonate containing fluorine, polybutylene terephthalate, polyether ether ketone, polyether imide, polyacetal, or the like. The

  As shown in FIGS. 2, 3, and 5, the plurality of guide grooves 50 are arranged in a line in the vertical direction of the inner surfaces of both side walls of the container body 1, in other words, the inclined step wall 4 behind the widened portion. When the container body 1 is positioned behind the plurality of teeth 20 and closed by the lid body 40, the inclined surfaces 51 are brought into contact with the peripheral edges of both sides of the semiconductor wafer W to guide the semiconductor wafer W in the vertical direction. It works as follows. The plurality of guide grooves 50 are formed according to the number of semiconductor wafers W, and each guide groove 50 is formed in a substantially V-shaped cross section.

  The inclination angle θ1 of the inclined surface 51 that forms the guide groove 50 is set to be smaller than the inclination angle θ2 of the inclined surface 33 of the holding groove 32, and specifically ranges from 45 ° to 80 ° (FIG. 5, (See FIG. 7). This is because if the angle is less than 45 °, the semiconductor wafer W does not slide onto the teeth 20 from the inclined surface 33 of the holding groove 32, and the semiconductor wafer W stops at the guide groove 50 and there is a risk of an extraction error. is there. On the contrary, when the angle exceeds 80 °, the resistance when the semiconductor wafer W is pushed into the container body 1 by the front retainer 43 increases, and the semiconductor wafer W is scratched.

  The guide groove 50 and the holding groove 32 are overlapped so that the semiconductor wafer W can be transferred to the inclined surface 33 of the holding groove 32 from the middle of the inclined surface 51 of the guide groove 50 as shown in FIG. Set to the relationship. In the present embodiment, the lid 40 is pushed into the container body 1 by 2 mm, so that the semiconductor wafer W is set on the inclined surface 33 of the holding groove 32 from the middle of the inclined surface 51 of the guide groove 50.

  In the above, in order to transport the substrate storage container by aircraft, ship, truck, or the like, the container body 1 in which the semiconductor wafers W are aligned and stored is fitted and closed by the lid 40 (see FIGS. 8 and 9), The semiconductor wafer W supported by the teeth 20 is pressed by the front retainer 43 of the lid 40 and moves from the teeth 20 to the guide groove 50 and slides on the inclined surface 51, and from the middle of the inclined surface 51 of the guide groove 50. For the first time, the moving groove contacts the steeply inclined surface 33 of the holding groove 32, and thereafter, the rear edge of the semiconductor wafer W stops at the valley 34 of the holding groove 32 (see FIGS. 7 and 9).

  When the semiconductor wafer W is stopped and held in the valley 34 of the holding groove 32 in this way, the semiconductor wafer W is held between the rear retainer 30 and the front retainer 43 of the lid 40 so that the semiconductor wafer W is not rubbed from the pair of teeth 20. Thus, generation of particles and wear powder due to friction between the semiconductor wafer W and the teeth 20 is reliably prevented.

  On the other hand, in order to take out the semiconductor wafer W after transportation, when the lid 40 that has released the locking mechanism 46 is removed from the container body 1, the semiconductor wafer W slides down the inclined surface 33 from the valley 34 of the holding groove 32 and holds it. After moving and contacting the inclined surfaces 33 and 51 of the guide groove 50 for the first time in the middle of the inclined surface 33 of the groove 32, the front middle region 22 and the rear portion of the tooth 20 with respect to the tip of the inclined surface 51 of the guide groove 50. It moves to the middle thickness region 24 and is mounted by positioning. At this time, since the inclination angle of the holding groove 32 is steeper than the inclination angle of the guide groove 50, the semiconductor wafer W can be dropped from the holding groove 32 with high probability.

  According to the above configuration, the holding groove 32 is steeper than the guide groove 50 and the peripheral edge of the semiconductor wafer W is not caught by the rear retainer 30. The positioning of the wafer W can be returned. Therefore, it is possible to very effectively solve the problem that the robot picking out the semiconductor wafer W is obstructed and the semiconductor wafer W is damaged. In addition, the semiconductor wafer W can be transported safely, and the contact area unnecessary for transport can be reduced to prevent the contamination from being suppressed.

  Further, since the semiconductor wafer W is moved along the inclined surface 51 of the guide groove 50 having a relatively gentle inclination, and subsequently moved so as to be supported by the rear retainer 30 having a sharp inclination angle, the semiconductor wafer W can be smoothly moved. It can be expected to facilitate the maintenance. Therefore, the semiconductor wafer W can be easily lifted from the teeth 20, and there is no possibility that the semiconductor wafer W will be damaged.

  In addition, since the rear retainer 30 is formed using a material excellent in flexibility, slidability, and elasticity, the semiconductor wafer W can be surely dropped from the holding groove 32, and the semiconductor wafer W can be taken out. The positional accuracy can be remarkably improved. Furthermore, since the teeth 20 are formed of the same material as the container body 1 and the like, elastic deformation is small and dimensional variations are small, so that the semiconductor wafer W can be mounted and supported on the teeth 20 with high accuracy.

  Next, FIG. 10 shows a second embodiment of the present invention. In this case, a continuous mountain shape is formed on the inner surfaces of both side walls of the container body 1, in other words, on the inclined step wall 4 behind the widened portion. A plurality of concavo-convex portions made of a plurality of concavo-convex portions are arranged in parallel in a vertical direction, and the surface of the concavo-convex portions is coated with a resin layer 52 having excellent slidability and low friction properties. A plurality of body guide grooves 50 are provided.

  The separate guide groove 50 is formed in the container body 1 by, for example, an insert molding method or a two-color molding method using a resin such as polybutylene terephthalate, polyethylene terephthalate, polyether ether ketone, polyether sulfone, or fluorine-containing resin. Is done. The other parts are the same as those in the above embodiment, and the description thereof is omitted.

  In this embodiment, the same effect as that of the above embodiment can be expected, and the guide groove 50 is formed using a material excellent in slidability and low friction. Therefore, the semiconductor wafer W after cleaning has high accuracy. It is clear that it can be loaded. Further, damage and wear of the semiconductor wafer W can be suppressed and prevented.

Next, FIG. 11 shows a third embodiment of the present invention. In this case, the rear retainer 30 is mounted on the inner surface of the back wall of the container body 1 and the support frame 35. The plurality of elastic pieces 36 are arranged in parallel between the two sides of the semiconductor wafer W and hold the rear periphery of the semiconductor wafer W via the holding grooves 32. Other parts are the same as those in the above embodiment, and thus the description thereof is omitted.
In the present embodiment, it is obvious that the same operational effects as those in the above embodiment can be expected, and that the configuration of the rear retainer 30 can be diversified.

  Next, FIG. 12 shows a fourth embodiment of the present invention. In this case, a part or all of the teeth 20 that are disposed on both sides inside the container body 1 and contact the semiconductor wafer W are contacted. Similar to the guide groove 50, a plurality of low friction resin layers 26 are provided in the region using a material that is superior in flexibility, slidability (low friction) and elasticity than the container body 1.

  The low-friction resin layer 26 is integrally formed, for example, by an insert molding method, a two-color molding method, or the like on the front middle region 22 or the rear middle region 24 of the teeth 20, or as a separate layer by friction engagement or the like. It is laminated by the method. Specific materials for the low friction resin layer 26 include polybutylene terephthalate, polyethylene terephthalate, polyether ether ketone, polyether sulfone, fluorine-containing resin, and the like. The other parts are the same as those in the above embodiment, and the description thereof is omitted.

  Also in this embodiment, the same effect as the above embodiment can be expected, and by using the low friction resin layer 26, the semiconductor wafer W can be more smoothly moved between the teeth 20 and the rear retainer 30 when the lid 40 is opened and closed. Obviously it can be moved. Further, it is possible to effectively prevent the edge of the semiconductor wafer W from being damaged, a worn portion from being generated, or a positional shift from occurring.

  The lock mechanism of the above embodiment includes a rotating body that is supported by the lid body 40 and is rotated by an external operation, and is slidably supported by the lid body 40 and connected to the rotating body, and is based on the rotation of the rotating body. A plurality of advancing / retracting bars that move forward and backward in and out of the lid body 40, and rotatably supported near the opening of the peripheral wall of the lid body and connected to the tip of the advancing / retreating bar. And a locking roller that protrudes and retracts from the opening of the lid body 40.

  In addition, the guide grooves 50 may be integrated on the inner surfaces of both side walls of the container body 1 by a method such as thermal welding or ultrasonic welding of mounting bosses, or may be attached as separate parts. Furthermore, the low frictional resistance region may be formed by processing a texture on all or a part of the teeth 20, the rear retainer 30, and the guide groove 50.

It is a whole perspective explanatory view showing an embodiment of a substrate storage container concerning the present invention. It is the II-II sectional view taken on the line of FIG. It is the III-III sectional view taken on the line of FIG. It is explanatory drawing which shows the cover body and front retainer in embodiment of the substrate storage container which concerns on this invention. It is the VV sectional view explanatory drawing of FIG. 3 which shows the guide groove in embodiment of the substrate storage container which concerns on this invention. FIG. 6 is a cross-sectional explanatory view taken along line VI-VI in FIG. 3 showing a rear retainer in the embodiment of the substrate storage container according to the present invention. It is a section explanatory view showing the relation between the rear retainer and the guide groove in the embodiment of the substrate storage container according to the present invention. It is explanatory drawing which shows the state just before the fitting closure of the cover body in embodiment of the substrate storage container which concerns on this invention. It is explanatory drawing which shows the state at the time of fitting closure of the cover body in embodiment of the substrate storage container which concerns on this invention. It is a section explanatory view showing a 2nd embodiment of a substrate storage container concerning the present invention. It is a section explanatory view showing a 3rd embodiment of a substrate storage container concerning the present invention. It is a section explanatory view showing a 4th embodiment of a substrate storage container concerning the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Container main body 2 Widest widening part 3 Widening part 4 Inclination level | step difference wall 5 Shrinkage width part 6 Back wall (back surface)
9 Rims 20 Teeth 21 Flat Plate 22 Front Middle Thickness Area 23 Front Thickness Area 24 Rear Middle Thickness Area 25 Rear Thick Thickness Area 26 Low Friction Resin Layer 30 Rear Retainer 32 Holding Groove 33 Inclined Surface 34 Valley 35 Support Frame (Support) body)
36 Elastic piece 40 Lid 43 Front retainer 44 Spring piece 45 Guide block 50 Guide groove 51 Inclined surface 52 Resin layer W Semiconductor wafer (substrate)
θ1 Inclination angle of the inclined surface of the guide groove θ2 Inclination angle of the inclined surface of the holding groove

Claims (6)

A container main body for storing the substrate; a plurality of teeth provided on both sides of the container main body for supporting the substrate; a rear retainer provided in the container main body for holding the rear periphery of the substrate via a holding groove; A substrate storage container that lifts from a plurality of teeth by sandwiching the substrate between the rear retainer and the lid when the container body is closed by the lid,
Provided behind the plurality of teeth is a guide groove that guides the substrate in the vertical direction by bringing the inclined surface into contact with the peripheral edge of the substrate when the container body is closed by the lid, and the inclination angle of the inclined surface that forms the guide groove Is set smaller than the inclination angle of the holding groove of the rear retainer.   2. The substrate storage container according to claim 1, wherein the rear retainer is formed using an elastic material.   The substrate storage container according to claim 1 or 2, wherein the inclination angle of the holding groove of the rear retainer is in the range of 70 ° to 85 °.   The substrate storage container according to claim 1, 2, or 3, wherein an inclination angle of an inclined surface forming the guide groove is in a range of 45 ° to 80 °.   The substrate storage container according to any one of claims 1 to 4, wherein the rear retainer and / or the guide groove are formed of a material having lower friction than the container body.   6. The rear retainer according to claim 1, wherein the rear retainer includes a support provided on the inner back surface of the container body, and an elastic piece provided on the support and holding the rear periphery of the substrate via a holding groove. Substrate storage container.

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