JP2006120388A - Plasma display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plasma display panel prevented from oscillation sound and lowering of panel performance caused by impurities by arranging recess grooves for barrier ribs receiving warp of end parts of the partition walls and recess parts for exhaustion exhausting gas containing impurities generated at sealing. <P>SOLUTION: The plasma display panel is composed of a front face side substrate, on which a plurality of electrodes parallel with each other are formed, and a back face side substrate, on which at least the partition walls are formed in a direction crossing the electrodes. Each recess groove for the partition wall, receiving the protrusion of the end parts of each partition wall, is formed at a position contacting the both end parts of the partition wall of the front face side substrate when sticking the front face side substrate on the back face side substrate in a direction crossing the partition wall. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a plasma display panel (hereinafter referred to as “PDP”), and more particularly to an improved structure for sealing a front substrate and a rear substrate of a PDP.

  As a conventional PDP, an AC type PDP having a three-electrode surface discharge structure is known. In this PDP, a large number of display electrodes capable of surface discharge are provided in the horizontal direction on the front side (display side) substrate, and a large number of address electrodes for selecting light emitting cells are provided in the direction intersecting the display electrodes on the back side substrate. The intersection between the display electrode and the address electrode is a cell. The display electrode and the address electrode are covered with a dielectric layer. On the back side substrate, partition walls for partitioning the discharge space are formed in stripes between the address electrodes and the address electrodes, and a phosphor layer is formed in a groove between the partition walls.

  The PDP is manufactured by sealing the periphery of the front-side panel assembly and the back-side panel assembly that are manufactured in this manner, and then sealing discharge gas therein.

  In general, in the PDP, in order to form a partition wall on the back substrate, first, a partition material layer is formed by applying a paste-like or sheet-like partition material (low melting glass) to the entire back substrate surface. The partition wall layer is formed by grinding it with sandblast or the like, and this is fired to form the partition wall.

JP-A-9-320475

  However, when the partition wall is formed in the above process, both ends of the partition warp due to thermal contraction of the partition material when the partition material is baked, and the end of the partition becomes locally high. Therefore, when the front substrate and the rear substrate are bonded to form a panel, a gap is locally opened at the contact point between the front substrate and the top of the partition wall, and an oscillating sound may be generated when the panel is driven. (See Patent Document 1).

  Also, when sealing the periphery with the front side substrate and the back side substrate facing each other, the inside of the panel is shut off from the outside by the sealing material. There is a problem that the panel performance is deteriorated due to being trapped inside, deteriorating the phosphor layer and the protective film.

  The present invention has been made in view of such circumstances, and a recess for a partition that receives warpage of the end of the partition and an exhaust recess for exhausting a gas containing impurities at the time of sealing are provided on the front substrate. By providing, it prevents the problem of oscillation sound and deterioration of panel performance due to impurities.

  The present invention includes a front substrate on which a plurality of electrodes are formed in parallel, and a rear substrate on which at least partition walls in a direction intersecting the electrodes are formed. A plasma display panel in which a partition groove for receiving a bulge at an end of a partition wall is formed in a direction intersecting the partition wall at a position where it abuts on both ends of the partition wall when the substrate and the back side substrate are bonded. .

  According to the present invention, even if the end portion of the partition wall formed on the back substrate is warped by firing, the raised portion is received by the partition groove and does not contact the front substrate. Therefore, a local gap is not opened between the partition wall and the front substrate, and no oscillation sound is generated when the panel is driven.

  In the present invention, the front side substrate and the back side substrate are made of glass, quartz, ceramic or the like, and desired components such as electrodes, insulating films, dielectric layers and protective films are provided on these substrates. A formed substrate is included.

  The plurality of electrodes may be formed in parallel with the front substrate. The partition may be formed on the substrate on the back side in a direction intersecting with the electrode. In addition to the partition walls, for example, address electrodes may be formed on the rear substrate.

  The electrodes and the barrier ribs only need to be formed in a crossing direction when seen in a plan view. If one is vertical, the other is horizontal, and conversely if one is horizontal, the other is vertical. Each may be formed. The crossing angle is not limited to orthogonal, and it is sufficient that they cross at an arbitrary angle.

The electrode can be formed using various materials and methods known in the art. Examples of the material used for the electrode include transparent conductive materials such as ITO and SnO ₂ and metal conductive materials such as Ag, Au, Al, Cu, and Cr. As a method for forming the electrode, various methods known in the art can be applied. For example, it may be formed using a thick film forming technique such as printing, or may be formed using a thin film forming technique including a physical deposition method or a chemical deposition method. Examples of the thick film forming technique include a screen printing method. Among thin film formation techniques, examples of physical deposition methods include vapor deposition and sputtering. Examples of the chemical deposition method include a thermal CVD method, a photo CVD method, and a plasma CVD method.

  The partition recesses are provided in the front substrate so as to receive the bulges at the end portions of the partition walls at positions where they come into contact with both end portions of the partition walls when the front substrate and the back substrate are bonded together. The partition recesses can be formed by excavating the substrate by a method known in the art, for example, sandblasting.

  In the above configuration, the partition groove may be formed as a continuous groove. A black layer may be formed in the partition groove.

  The electrode is preferably composed of a metal bus electrode and a transparent electrode. In this case, the bus electrode can be formed in a groove dug in the front side substrate, and the transparent electrode can be formed so as to cover the groove and the bus electrode.

  A black layer may be formed in the groove formed in the substrate on the front side before the bus electrode is formed, and then the bus electrode may be formed.

  The partition groove and the bus electrode formation groove are preferably formed in the same process.

  A thick film electrode terminal may be connected to the bus electrode formed in the groove of the substrate on the front side.

  In the above-described configuration, the sealing material is further heat-sealed with the front-side substrate and the back-side substrate facing each other at a position where the front-side substrate contacts the sealing material provided around the back-side substrate. It is desirable that the exhaust recess for exhausting the gas generated at the time of being formed is divided in the direction intersecting the partition wall.

  In this configuration, it is desirable that the depth of the exhaust recess is deeper than the depth of the partition groove and greater than the depth of the groove in which the bus electrode of the electrode is formed.

  Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings. In addition, this invention is not limited by this, A various deformation | transformation is possible.

  FIG. 1A and FIG. 1B are partially exploded perspective views showing the configuration of the PDP of the present invention. This PDP is an AC type PDP having a three-electrode surface discharge structure for color display.

  This PDP is composed of a front panel assembly including a front substrate 11 and a rear panel assembly including a rear substrate 21. As the front substrate 11 and the rear substrate 21, a glass substrate, a quartz substrate, a ceramic substrate, or the like can be used.

On the inner side surface of the front substrate 11, display electrodes X and display electrodes Y are formed, for example, at equal intervals in the horizontal direction as electrode pairs for generating surface discharge (hereinafter, the display electrodes X are simply “X electrodes”). The display electrode Y may be simply referred to as “Y electrode”). A display line is formed between the display electrode X and the display electrode Y. Each of the display electrodes X and Y is made of a wide transparent electrode 12 such as ITO or SnO ₂ and, for example, Ag, Au, Al, Cu, Cr, and a laminated body thereof (for example, a laminated structure of Cr / Cu / Cr). And a narrow bus electrode 13 made of metal. The bus electrode 13 is formed in a groove formed in the front substrate 11, and the transparent electrode 12 is formed on the front substrate 11 so as to cover the groove and the bus electrode 13. For the display electrodes X and Y, a desired number and thickness can be obtained by using a thick film forming technique such as screen printing for Ag and Au, and using a thin film forming technique such as vapor deposition and sputtering and an etching technique for others. It can be formed with a width, width and spacing.

  On the display electrodes X and Y, a dielectric layer 17 for alternating current (AC) driving is formed so as to cover the display electrodes X and Y. The dielectric layer 17 is formed by applying a low-melting glass paste on the front substrate 11 by screen printing and baking.

  A protective film 18 is formed on the dielectric layer 17 to protect the dielectric layer 17 from damage caused by ion collision caused by discharge during display. This protective film is made of, for example, MgO, CaO, SrO, BaO or the like.

  On the inner side surface of the substrate 21 on the back side, a plurality of address electrodes A are formed in a direction intersecting the display electrodes X and Y in plan view, and a dielectric layer 24 is formed to cover the address electrodes A. . The address electrode A generates an address discharge for selecting a light emitting cell at the intersection with the Y electrode, and is formed in a three-layer structure of Cr / Cu / Cr. In addition, the address electrode A can be formed of Ag, Au, Al, Cu, Cr, or the like. As with the display electrodes X and Y, the address electrode A uses a thick film forming technique such as screen printing for Ag and Au, and a thin film forming technique such as vapor deposition and sputtering and an etching technique for the other. Thus, it can be formed with a desired number, thickness, width and interval. The dielectric layer 24 can be formed using the same material and the same method as the dielectric layer 17.

  A plurality of stripe-shaped partition walls 29 are formed on the dielectric layer 24 between the adjacent address electrodes A and A. The partition walls 29 can be formed by a sand blast method, a printing method, a photo etching method, or the like. For example, in the sandblasting method, a glass paste made of a low melting point glass frit, a binder resin, a solvent, etc. is applied on the dielectric layer 24 and dried, and then a cutting mask having an opening of a partition pattern is formed on the glass paste layer. It forms by spraying cutting particle | grains in the provided state, cutting the glass paste layer exposed to the opening of a mask, and also baking. In the photo-etching method, instead of cutting with cutting particles, a photosensitive resin is used as the binder resin, and it is formed by baking after exposure and development using a mask.

  Red (R), green (G), and blue (B) phosphor layers 28R, 28G, and 28B are formed in stripes on the side surfaces of the partition walls 29 and on the dielectric layer 24 between the partition walls. For the phosphor layers 28R, 28G, and 28B, a phosphor paste containing phosphor powder, a binder resin, and a solvent is applied to the concave discharge space between the barrier ribs 29 by screen printing or a method using a dispenser. This is repeated for each color and then fired. The phosphor layers 28R, 28G, and 28B can be formed by a photolithography technique using a sheet-like phosphor layer material (so-called green sheet) containing phosphor powder, a photosensitive material, and a binder resin. In this case, a phosphor sheet of each color can be formed between the corresponding partition walls by applying a sheet of a desired color to the entire display area on the substrate, exposing and developing, and repeating this for each color. it can.

  In the PDP, the front-side panel assembly and the rear-side panel assembly are arranged so that the display electrodes X and Y and the address electrodes A intersect with each other, and the periphery is sealed and surrounded by the partition wall 29. It is produced by filling the discharge space 30 with a discharge gas. In this PDP, the discharge space 30 at the intersection of the display electrodes X and Y and the address electrode A is one cell region (unit light emitting region) which is the minimum unit of display. One pixel is composed of three cells, R, G, and B.

2 is an explanatory view showing a state of the substrate on the back side in plan view, FIG. 3 is an explanatory view showing a III-III section of FIG. 2, and FIG. 4 is an explanatory view showing a IV-IV section of FIG.
In these figures, 31 is a sealing material. The sealing material 31 seals the front-side substrate 11 and the back-side substrate 21 when the front-side substrate 11 and the back-side substrate 21 are bonded to face each other. The sealing material 31 is obtained by applying a low melting point glass paste and drying it.

  As shown in these drawings, a striped partition wall 29 is formed in the vertical direction on the substrate 21 on the back side. As shown in FIG. 3, both end portions 29a of the partition wall 29 located outside the display area are warped by firing.

  FIG. 5 is an explanatory diagram showing a state in which a PDP obtained by bonding the front side substrate and the rear side substrate is viewed in a plan view. 6 and 7 are cross-sectional views taken along the line VI-VI in FIG. 5. FIG. 6 is an explanatory diagram when sealing the front substrate and the rear substrate facing each other. FIG. 7 shows the front substrate and the rear substrate. It is explanatory drawing after making a board | substrate face and seal.

  As shown in these drawings, a partition groove 32 is formed in the front substrate 11 at a position where it abuts against both ends 29a of the partition when the front substrate 11 and the rear substrate 21 are bonded together. Has been. The partition groove 32 is for receiving the protrusion of the partition wall end 29 a and is formed as a continuous groove in a direction perpendicular to the longitudinal direction of the partition wall 29. The bumps at both end portions 29a of the partition wall 29 are caused by warping due to thermal contraction of the partition wall material when the partition wall 29 is fired.

  In addition, the warping of the end of the partition wall does not occur only in the stripe-shaped partition wall described above, but an auxiliary partition wall (higher than the partition wall) that connects between the partition walls between display electrode pairs (so-called reverse slits) serving as non-discharge portions. This also occurs in the shape of the partition wall in which the thickness is low. In short, warping occurs in the partition wall structure in which the ends of the partition walls are not connected between adjacent partition walls.

  A black layer 33 is formed in the partition groove 32. The black layer 33 is formed using a black pigment.

  As described above, the display electrodes X and Y are each composed of the metal bus electrode 13 and the transparent electrode 12. The bus electrode 13 is formed in an electrode groove 34 dug in the front substrate 11, and the transparent electrode 12 is formed in the front substrate 11 so as to cover the electrode groove 34 and the bus electrode 13.

  In the electrode groove 34, the black layer 35 is formed before the bus electrode 13 is formed, and then the bus electrode 13 is formed. The black layer 35 is formed using a black pigment.

The black layer 35 of the electrode groove 34 and the black layer 33 of the partition groove 32 are formed in order to improve the contrast of the screen.
The electrode groove 34 for forming the bus electrode 13 is directly formed in the front substrate 11.

An exhaust recess 36 is formed at a position of the front substrate 11 that contacts the sealing material 31 applied to the rear substrate. The exhaust recess 36 includes impurities such as water vapor and CO ₂ generated from the sealing material itself when the sealing material 31 is heated and melted after the front and back substrates are opposed to each other. This is for exhausting the gas in the direction indicated by the arrow G in the figure. The exhaust recess 36 is formed by being divided in a direction intersecting the longitudinal direction of the partition wall 29.

  The exhaust recess 36 is deeper than the partition recess 32 and deeper than the electrode recess 34.

FIG. 8 is an explanatory view showing the partition groove 32 and the exhaust recess 36 of the PDP.
In a state where the front side substrate and the back side substrate are opposed to each other and sealed, the sealing material is fused to form the sealed portion H. If the partition groove 32 is visible from the outside in a state completed as a panel (use as a television or a monitor), it is necessary to form a black layer in the partition groove 32, but it is not visible. If it is, it is not necessary to form.

  Even when the black layer is formed in the partition groove, if the black layer in contact with the sealing material is applied up to the portion where the sealing material is melted and hidden, there is no problem in the product.

  9 (a) to 9 (f) and FIGS. 10 (g) to 10 (j) are explanatory views showing a manufacturing process of the front panel assembly. 9B is a sectional view taken along line XX in FIG. 9A, FIG. 9D is a sectional view taken along line XI-XI in FIG. 9C, and FIG. 9F is a sectional view taken along line XII- in FIG. FIG. 10H is a cross-sectional view taken along XIII-XIII in FIG. 10G, and FIG. 10J is a cross-sectional view taken along XIV-XIV in FIG.

In the manufacturing process of the front side panel assembly, first, the front side substrate 11 is prepared (see FIGS. 9A and 9B).
Next, an electrode groove 34 for embedding the bus electrode is formed in the front substrate 11. At the same time, a partition groove 32 and an exhaust recess 36 are also formed. These are performed simultaneously in the same process. This formation is performed by sandblasting. These grooves and recesses 34, 32, and 36 may be formed by laser irradiation, etching using a chemical solution such as hydrofluoric acid, or the like in addition to sandblasting. Thereafter, black layers 35 and 33 are formed in the electrode groove 34 and the partition groove 32 (see FIGS. 9C and 9D). The black layers 35 and 33 are formed by screen printing.

Next, the bus electrode 13 is formed on the black layer 35 of the electrode groove 34 (see FIGS. 9E and 9F).
Next, the transparent electrode 12 made of ITO, SnO ₂ , ZnO, or the like is formed on the bus electrode 13 so as to cover the electrode groove 34 and the bus electrode 13 (see FIG. 10G and FIG. 10H). .

  Next, the dielectric layer 17 is formed thereon. Finally, a protective film 18 such as MgO is formed (see FIGS. 10 (i) and 10 (j)) to complete the manufacture of the front panel assembly.

FIG. 11A, FIG. 11B, and FIG. 11C are explanatory views showing a process of forming a thick film electrode terminal. FIG.11 (c) is XV-XV sectional drawing of FIG.11 (b).
In order to form the electrode terminal 41 of the display electrode, after forming the bus electrode and the transparent electrode, the electrode terminal 41 is formed by a technique such as screen printing or inkjet.

  When a groove forming method for digging an electrode groove with a laser is employed, the area of the electrode groove to be digged is related to the manufacturing tact. Therefore, it takes a long time to form the electrode by digging the groove to the electrode terminal. Therefore, only the electrode in the display area is formed in the electrode groove, and the electrode terminal is formed after the transparent electrode is formed.

Examples of manufacturing the front panel assembly will be described below with reference to FIGS. 9 (a) to 9 (f) and FIGS. 10 (g) to 10 (j).
(1) A dry film resist was pasted on the front glass substrate, and a resist pattern was formed through mask exposure and development.
(2) The electrode groove 34, the partition groove 32, and the exhaust recess 36 were formed on the glass substrate by sandblasting (see FIGS. 9C and 9D). The width of the electrode groove was 30 μm and the depth was 30 μm.
(3) A black layer is embedded in the electrode groove 34 and the partition groove 32 by screen printing (see FIGS. 9C and 9D). The film thickness of the black layer was 10 μm.

(4) The silver paste was embedded in the electrode groove 34 by screen printing and then fired to form the bus electrode 13 (see FIGS. 9E and 9F).
(5) ITO was sputtered, a pattern was formed by photolithography, and etching was performed to form the transparent electrode 12 (see FIGS. 10 (g) and 10 (h)).
(6) The electrode terminal was baked after screen printing.

(7) A film-like dielectric material is transferred by a laminator and baked to form a dielectric layer.
(8) A protective film is formed by vacuum-depositing MgO to obtain a front substrate (see FIGS. 10 (i) and 10 (j)).
(9) A panel assembly on the back side having a partition wall structure prepared separately was bonded and sealed, and the inside of the panel was replaced with a discharge gas to obtain a PDP.

By using the front substrate having such a configuration, the following effects can be obtained.
・ Low resistance is realized by increasing the bus electrode cross-sectional area. Improved streaking properties.
-Since the black layer is formed under the bus electrode, the contrast is improved.
-By reducing the line width of the bus electrode, the aperture ratio is increased and the panel brightness is improved.
-The thickness of the display electrode when viewed in plan can be reduced. Such a decrease in the area of the display electrode can reduce the discharge current.

Since the partition groove is formed at a position opposite to the end of the partition formed on the back side substrate, even if the end of the partition is warped, it does not come into contact with the front side substrate. For this reason, a local gap is not opened between the top of the partition wall and the substrate on the front side, and no oscillation sound is generated when the panel is driven.

・ When the front substrate and the back substrate are bonded together, the gap for exhaust is divided and formed at the position facing the sealing material, so there is a gap between the front substrate and the sealing material. The gas containing impurities generated by opening and sealing is efficiently discharged out of the panel, and the phosphor and the protective film are not deteriorated.

-Since the black layer is formed in the place corresponding to the edge part of the partition of the board | substrate of a back side, areas other than a pixel can be made to look black and a panel quality improves.

It is a partial exploded perspective view which shows the structure of PDP of this invention. It is explanatory drawing which shows the state which looked at the board | substrate of the back side planarly. It is explanatory drawing which shows the III-III cross section of FIG. It is explanatory drawing which shows the IV-IV cross section of FIG. It is explanatory drawing which shows the state which looked at PDP planarly. It is explanatory drawing when the board | substrate of a front side and a back side is made to oppose and is sealed. It is explanatory drawing after sealing the board | substrate of the front side and the back side facing each other. It is explanatory drawing which shows the recessed groove for partition walls and the recessed part for exhaust_gas | exhaustion of PDP. It is explanatory drawing which shows the manufacturing process of the panel assembly of the front side. It is explanatory drawing which shows the manufacturing process of the panel assembly of the front side. It is explanatory drawing which shows the process of forming an electrode terminal.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Front side board | substrate 12 Transparent electrode 13 Bus electrode 17, 24 Dielectric layer 18 Protective film 21 Back side board | substrate 28R, 28G, 28B Phosphor layer 29 Striped partition wall 29a End part of striped partition wall 30 Discharge space 31 Sealing Material 32 Groove for partition 33, 35 Black layer 34 Groove for electrode 36 Concave for exhaust 41 Electrode terminal A Address electrode H Sealing part X, Y Display electrode

Claims (9)

A front substrate on which a plurality of electrodes are formed in parallel, and a rear substrate on which at least partition walls in a direction intersecting the electrodes are formed,
When the front substrate and the rear substrate are bonded to each other, the partition groove for receiving the bulge at the end of the partition is in a direction crossing the partition. A plasma display panel formed.   2. The plasma display panel according to claim 1, wherein the partition groove is formed as a continuous groove.   The plasma display panel according to claim 1, wherein a black layer is formed in the partition groove.   The electrode comprises a transparent electrode and a metal bus electrode, the bus electrode is formed in a groove dug in a front substrate, and the transparent electrode is formed so as to cover the groove and the bus electrode. 2. The plasma display panel according to 1.   5. The plasma display panel according to claim 4, wherein a black layer is formed in the groove formed in the substrate on the front side before the bus electrode is formed, and then the bus electrode is formed.   5. The plasma display panel according to claim 4, wherein the partition groove and the bus electrode forming groove are formed in the same process.   5. The plasma display panel according to claim 4, wherein a thick film electrode terminal is connected to the bus electrode formed in the groove of the front substrate.   Gas generated when heat-sealing the sealing material with the front-side and back-side substrates facing each other at the position where the front-side substrate contacts the sealing material provided around the back-side substrate. 2. A plasma display panel according to claim 1, wherein the exhaust recess for exhaust is divided and formed in a direction intersecting with the partition wall. Gas generated when heat-sealing the sealing material with the front-side and back-side substrates facing each other at the position where the front-side substrate contacts the sealing material provided around the back-side substrate. An exhaust recess for exhaust is formed by dividing in a direction intersecting with the partition wall,
5. The plasma display panel according to claim 4, wherein the exhaust recess has a depth deeper than a depth of the partition groove and a depth of the groove in which the bus electrode of the electrode is formed.

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