JP2006108322A - Maintenance method and component mounting machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a maintenance method which can detect the maintenance time of constituent components of equipment which constitutes a component mounting machine collectively and quantitatively. <P>SOLUTION: A management device 600 identifies the position of the set equipment by using an IC tag reader/writer 111 (S1001). The IC tag reader/writer 111 acquires maintenance information on the constituent components from an IC tag 400 (S1002), and then a judgement section 608 determines the maintenance time by comparing the actual maintenance information on the constituent components acquired in the step S1002 with maintenance information recorded in a maintenance information storage section 605 (S1003). When it is not the maintenance time (No in S1003), the judgement section 608 finishes a series of processes. When it is the maintenance time (Yes S1003), the judgement section 608 tells an alarming section 609 to send out an alarm (S1004) and stops the operation of the component mounting machine 100 (S1005). <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a maintenance method for a component mounter that mounts electronic components on a substrate, and more particularly, to a device that constitutes a component mounter and a maintenance method for a component that constitutes the device.

  2. Description of the Related Art Conventionally, a component mounter that mounts electronic components on a printed circuit board is, for example, an electronic component that is stored or fixed on a component tape while the component tape is pulled out from a reel on which the component tape that stores or fixes the electronic component is wound. The electronic component is picked up using a nozzle attached to the mounting head portion, the picked-up electronic component is confirmed using a recognition camera, and the electronic component is mounted on a printed circuit board.

  And in recent component mounters, since multiple nozzles can be equipped with suction nozzles corresponding to various types of components, almost all types of electronic components (components to be mounted) Can be mounted from a chip resistance of 0.4 mm × 0.2 mm to a connector of 200 mm), and a board production line can be configured by arranging as many component mounters as necessary. .

  Equipment such as nozzles and parts cassettes that house parts mounting machines are basically consumables. When the number of uses and usage time reaches the limit of use, maintenance work such as equipment replacement is performed. There is a need to do. By performing this maintenance work, it is possible to prevent a reduction in the adsorption rate of electronic components and the mounting rate on the substrate.

In addition, a component mounting method and apparatus for storing a cumulative number of components taken out from the component cassette in a memory of each component cassette and issuing a maintenance warning in comparison with the number of times of use are disclosed (for example, Patent Document 1).
JP 2000-208987 A

  However, in the conventional component mounter, for example, when acquiring component information such as a component cassette, an operator reads the memory of each component cassette with a reader, or the reader has a plurality of components. If the cassette memory is not moved to scan, the component information of each component tape cannot be acquired. Therefore, it takes time to acquire the component information. As a result, it takes time to start production. There is a problem that it takes. Usually, the number of component cassettes that are set and used in a component mounting machine is 50 to 100 or more, and it takes a lot of labor and tact loss to read them manually or by moving the reader. However, without much effort, it was difficult to perform maintenance accurately and ensure quality.

  In addition, replacement by maintenance of equipment in a conventional component mounter is performed by, for example, a device such as a nozzle or a component cassette when the appearance of the device such as a component cassette becomes old or when an obvious failure occurs in a device such as a nozzle. It is common to perform maintenance management in units. For example, the maintenance management according to Patent Document 1 is a maintenance method for a component cassette, and cannot be performed until maintenance management of components such as a spring constituting the component cassette. That is, for example, the parts cassette is composed of various components such as springs, shutters, feed mechanisms, etc., and the maintenance time such as the number of service life times and the time of maintenance inspection for each of these components is different. In order to perform more appropriate maintenance management of component mounters, it is required to grasp the maintenance information of each of these components as well, but with conventional methods, maintenance in units of such components is required. There is a problem that you can not.

  Further, conventionally, for example, when performing maintenance processing of a component cassette, it is necessary for an operator to specify even a faulty part such as a spring, and it is troublesome to specify the faulty part.

  Such failures may occur irregularly, and each time the component mounter operator needs to perform unscheduled maintenance work, and equipment such as component cassettes that can still be used. However, it is determined that the part needs to be replaced by maintenance, and is discarded, resulting in an economic problem.

  The present invention has been made in view of the above problems, and provides a maintenance method, a component mounter, and the like that can collectively acquire maintenance information of devices such as a component cassette used in a component mounter. In addition, maintenance methods and component mounters that enable maintenance not only in units of equipment constituting the component mounter but also in units of component parts constituting the equipment and quantitatively confirm maintenance information, etc. The purpose is to provide.

  In order to solve the above-described problems, a maintenance method according to the present invention is a maintenance method for a component mounter for mounting a component on a board, and is received from an IC tag attached to a device constituting the component mounter. A position specifying step for specifying the position of the device based on the received signal, and a reading step for reading maintenance information of the device from the IC tag of the device at the position specified in the position specifying step. To do.

  With this configuration, since the reader reads the component information from the IC tag, the reader can reliably read the maintenance information of the device even if the reader is away from the IC tag. As a result, if only one reader is arranged, Even if the device is not moved, the maintenance information of the device can be acquired from the IC tag attached to the device at the position for each position specified in the position specifying step. Maintenance information can be acquired collectively for a plurality of devices while distinguishing them, and the time required for reading the maintenance information is reduced and the production time is shortened. The components include not only electronic components but also all components to be mounted on a substrate, such as optical system components.

  Further, in the maintenance method according to the present invention, maintenance information for each device is recorded in the IC tag, and in the reading step, maintenance information related to maintenance of the device is read from the IC tag, and the maintenance method is performed. Further includes a determination step of determining whether or not maintenance of the device is possible based on the read maintenance information.

  Further, in the maintenance method according to the present invention, maintenance information for each component constituting the device is recorded in the IC tag, and maintenance information relating to maintenance of the component is recorded from the IC tag in the read step. In the determining step, whether or not maintenance of the component is possible is determined based on the read maintenance information.

  Furthermore, the maintenance method according to the present invention further includes a warning step for issuing a warning when it is determined in the determination step that maintenance is required.

  With these configurations, in the read step, maintenance information for each device and each component stored in the IC tag is read, and in the determination step, whether or not maintenance can be performed for each device or component can be determined. It becomes possible to quantitatively check the maintenance timing of components such as cassettes and the like and components such as springs and filters.

  In addition, when it is determined that maintenance is required in the determination step, there is a warning step for performing a warning, so that a device that needs to be replaced is used in the mounting process and the mounting efficiency is reduced. Can be prevented in advance.

  In addition, the maintenance method according to the present invention further includes a write for writing a usage history for each device or component into the IC tag as information relating to the maintenance during operation of the component mounter or during a stop time after operation. Including steps.

  With this configuration, in the write step, maintenance information such as the number of times of use of the devices and components after the component mounting process can be updated as needed, so that the maintenance information can be made more accurate information.

  In the maintenance method according to the present invention, in the write step, when the component is replaced, the maintenance information of the component stored in the IC tag is reset to an initial value. It is characterized by writing.

  With this configuration, it is possible to appropriately manage the maintenance time such as the number of times of use different for each component.

  Further, in the maintenance method according to the present invention, the maintenance information includes at least one of a maximum acceleration, an impact force, a temperature that is a use environment value, and a humidity of the component cassette that is the device. Determines that the maintenance of the component cassette is necessary when the maximum acceleration, the impact force, the temperature, or the humidity set for each component cassette reaches a use limit value. .

  With this configuration, it is possible to record various information as maintenance information on the IC tag and perform maintenance management of the component mounter more accurately.

  In order to achieve the above object, the present invention can be realized as a component mounter using the characteristic steps of the maintenance method as a means, or as a program for causing a computer to execute each step. It goes without saying that such a program can be distributed as a recording medium such as a CD-ROM or a transmission medium such as the Internet.

  According to the maintenance method of the present invention, since the IC tags of the devices can be read in a batch using a reader, maintenance information can be easily obtained without complicating the equipment. In addition, when the device is set on the component mounter, the position of the device can be immediately identified, and maintenance information can be read corresponding to the position.

  Furthermore, maintenance information of components such as springs and filters constituting the component mounting machine can be recorded and managed in the IC tag, and maintenance can be performed in units of components constituting the device. Then, the maintenance time of each component can be quantitatively confirmed using maintenance information such as the number of usable times and the usable time set for each component.

Hereinafter, a component mounter used in a maintenance method according to an embodiment of the present invention will be described with reference to the drawings.
(Embodiment)
FIG. 1 is a configuration diagram showing the configuration of a component mounting system according to the present invention.

  FIG. 1 is a configuration diagram showing the configuration of the component mounting system according to the present embodiment. The component mounting system according to the present embodiment attaches an IC tag to a device such as a nozzle that adsorbs an electronic component and mounts it on a substrate, or a component cassette that stores the electronic component, and uses this IC tag to mount a component mounting machine. The maintenance information of 100 devices is managed in an integrated manner.

  The component mounting system shown in FIG. 1 includes a plurality of component mounters 100 and 200 that constitute a production line for mounting electronic components while sending circuit boards from upstream to downstream, and component mounters 100 and 200. And a management device 600 that performs maintenance management.

  The component mounter 100 includes two sub facilities (a front sub facility 110 and a rear sub facility 120) that perform component mounting simultaneously and independently. Each sub-equipment 110 (120) is an orthogonal robot type mounting stage, which includes component supply units 115a and 115b, a multi-mounting head 112, an XY robot 113, a component recognition camera 116, a tray supply unit 117, and an IC tag reader. / The writer 111 etc. are provided.

  Each of the component supply units 115a and 115b includes an array of a maximum of 48 component cassettes 114 for storing component tapes. The multi-mounting head 112 is also referred to as a 10-nozzle head or simply a head, and 10 suction nozzles (hereinafter simply referred to as “nozzles”) that can pick up a maximum of 10 components from the component cassette 114 and mount them on the substrate 20. "). The XY robot 113 moves the multi mounting head 112. The component recognition camera 116 is used for two-dimensionally or three-dimensionally inspecting the suction state of the component sucked by the multi-mounting head 112. The tray supply unit 117 supplies tray parts. The IC tag reader / writer 111 reads information stored in the IC tag and writes information in the IC tag. Each such sub-equipment executes component mounting on the board in charge of each sub-equipment independently (in parallel).

  Such an IC tag for a nozzle is a memory that performs non-contact communication using so-called RFID (Radio Frequency Identification) technology, and stores information by the communication or transmits stored information. Or

  In addition, the management apparatus 600 includes a maintenance information storage unit 605 described later with reference to FIG. 6 in order to acquire maintenance information written in the IC tag from the component mounter 100 and store it collectively.

  The component mounter 100 shown in the figure is a mounter having both functions of a component mounter called a high-speed mounter and a component mounter called a multi-function mounter. A high-speed mounting machine is a facility characterized by high productivity for mounting electronic components of 10 mm square or less at a speed of about 0.1 seconds per point, and a multi-function mounting machine is 10 mm square or more. It is a facility for mounting IC parts such as large electronic parts, atypical parts such as switches and connectors, and QFP (Quad Flat Package) and BGA (Ball Grid Array). In other words, the component mounting machine 100 is designed so that almost all types of electronic components (from 0.4 mm × 0.2 mm chip resistance to 200 mm connector as the components to be mounted) can be mounted. A production line for the board 20 can be configured by arranging a required number of the component mounting machines 100.

  FIG. 2 is a plan view showing a main configuration of the component mounter 100 shown in FIG. The shuttle conveyor 118 is a moving table (moving conveyor) for placing the components taken out from the tray supply unit 117 and transporting them to a predetermined position where they can be picked up by the mounting head 112. The nozzle station 119 is a table on which replacement suction nozzles corresponding to various types of component types are placed.

  The two component supply units 115a and 115b constituting each sub-equipment 110 (or 120) are arranged on the left and right with the component recognition camera 116 interposed therebetween. Therefore, the mounting head 112 that has picked up the component in the component supply unit 115a or 115b moves to the mounting point of the substrate 20 after passing through the component recognition camera 116, and repeats the operation of sequentially mounting all the sucked components. .

  Note that the component supply unit 115a on the left side of each sub-equipment is also referred to as a “left block”, and the component supply unit 115b on the right side is also referred to as a “right block”. In addition, a single operation (suction / movement / mounting) or a group of components mounted by such a single operation) in a series of repeated operations of picking / moving / mounting the components by the mounting head 112 is “ Called “task”. For example, according to the mounting head 112 provided in the component mounting machine 100, the maximum number of components mounted by one task is 10. Here, “suction” includes all suction operations from when the head starts to pick up components until it moves. For example, ten suction operations (up and down operation of the mounting head 112) This includes not only the case of simultaneously picking up parts but also the case of picking up 10 parts by a plurality of picking operations.

  FIG. 3 is a reference diagram for explaining the position of the IC tag 400 attached to the nozzle 301 of the component mounter 100 according to the present embodiment.

  FIG. 3A is an external view of the mounting head 112. The mounting head 112 is a working head called a “gang pickup system”, and has a maximum of ten suction nozzles 301a to 301b (first suction mounted at the left end toward the suction and mounting of components independently). A total of ten suction nozzles from the nozzle 301a to the tenth suction nozzle 301b mounted on the right end) can be attached and detached, and parts can be simultaneously removed from each of up to ten part cassettes 114 (by one up and down movement). Can be adsorbed. That is, the mounting head 112 moves to the component supply units 115a and 115b and sucks the components. At this time, for example, when ten parts cannot be picked up at the same time, a maximum of ten parts can be picked up by performing the picking up and down operation a plurality of times while moving the picking position.

  FIG. 3B is an external view showing an arrangement example of the IC tag 400 attached to the nozzle 301 of the component mounter 100 according to the present embodiment. The IC tag 400 is provided at one end of the upper surface, the lower surface, the side surface, and the like of the flange 301c constituting the nozzle 301, for example. The attachment position of the IC tag 400 may be anywhere as long as it is attached to the nozzle as long as it is a nozzle or an associated part of the nozzle.

  FIG. 4 is an external view for explaining an IC tag 400 attached to a component tape 402 used in the component mounter 100 according to the present embodiment.

  The component tape 402 is wound around a reel 401, and includes a carrier tape 402b on which an electronic component is placed, a cover tape 402a attached to the carrier tape 402b, and the above-described IC tag 400.

  The carrier tape 402b is made of a thin resin molded product, paper, or the like, and a plurality of electronic components are stored in storage recesses 402c formed at equal intervals in the longitudinal direction on the carrier tape 402b.

  The cover tape 402a is made of, for example, a light-transmitting synthetic resin, and is affixed to the carrier tape 402b so that the electronic component does not come off from the storage recess 402c of the carrier tape 402b, that is, closes each storage recess 402c.

  The IC tag 400 is attached to the tip of the carrier tape 402b or attached to the side of the reel, and information necessary for component maintenance such as the number of times the reel can be used, the reel specification, and the feed pitch are recorded. ing. The attachment position of the IC tag 400 may be anywhere on the component tape or reel.

  Such an IC tag 400 is attached to the carrier tape 402b in advance, and after the electronic component is placed and stored on the carrier tape 402b, the above-described maintenance information corresponding to the electronic component is stored in the IC tag 400. Is written to.

  FIG. 5 shows an external view of the component cassette 114 (114a and 114b) to which the IC tag 400 in which the information for maintenance according to the present embodiment is recorded is attached.

  FIG. 5A shows an external view of a motor-type (self-propelled) parts cassette 114a. In this component cassette, the tape feed is driven by a servo motor, and for example, the feed pitch / feed speed is set according to the component. In the component mounter according to the present embodiment, it is necessary for the maintenance of the components constituting the component cassette and the component cassette such as the reel specifications and the feed pitch on the IC tag 400 attached to the motor-type component cassette 114a. When the IC tag reader / writer 111 automatically reads such information, the feed pitch and the like can be automatically set.

  FIG. 5B shows an overview of the component cassette 114b that is mechanically pitch-fed. The reel 401 is rotatably attached to a reel side plate 528 coupled to the main body frame 527. The carrier tape 402b drawn from the reel 401 is guided by a feed roller 529, and in conjunction with the operation of a component mounter (not shown) on which the component cassette 114a is mounted, a feed lever ( The feed lever of the electronic component supply apparatus moves in the direction of arrow Y1 in the drawing by (not shown), and the ratchet 532 is rotated by a constant angle via the link 531 attached to the feed lever 530. Then, the feed roller 529 interlocked with the ratchet 532 is moved by a constant pitch (for example, a feed pitch of 2 mm or 4 mm). For example, if the fixed pitch is 2 mm and the desired tape feed amount is 4 mm, the feed lever 530 is moved twice from the component mounter side to feed 2 mm twice, for a total of 4 mm tape feed. Is possible.

  The carrier tape 402b is peeled off from the cover tape 402a by a cover tape peeling portion 533 in front of the feed roller (on the reel 401 side), and the peeled cover tape 402a is taken up by the cover tape take-up reel 534, and the cover tape 402a. The carrier tape 402b peeled off from the electronic component is conveyed to the electronic component take-out unit 535, and simultaneously with the feeding roller 529 being carried to the carrier tape 402b, the vacuum suction head is opened from the electronic component take-out unit 535 that opens in conjunction with the ratchet 532. The chip-type electronic component stored in the storage recess 402c is picked up and taken out (not shown). Thereafter, the feed lever 530 is released from the pushing force by the feed lever and returns to the Y2 direction, that is, to the original position by the urging force of the tension spring 536. When such a series of operations is repeated, the used carrier tape 402b is configured to be discharged to the outside of the electronic component supply apparatus.

  In the component cassette 114b shown in FIG. 5B, the IC tag 400 in which maintenance information related to the component cassette 114 is recorded is attached to the upper surface of a main body frame 527 that is an outer frame constituting the component cassette 114, for example. In this case, in order to feed the tape with the tape feed amount stored in the IC tag 400, it is necessary to move the feed lever 530 from the component mounter side a number of times corresponding to the stored tape feed amount.

  As described above, in the component mounter according to the present embodiment, as shown in FIGS. 3 to 5, maintenance information for each component such as a spring is recorded at one location of a device such as a component cassette of the component mounter. IC tag 400 is attached. When the device is the component cassette 114, the component includes a spring, a shutter, a feed mechanism, a housing, and the like. When the device is the nozzle 301, the component includes a spring, a filter, and a flange. , And the like. The device is a component that constitutes a component mounter, and the component is a component that constitutes the device.

FIG. 6 is a functional block diagram showing the configuration of the management apparatus 600 according to the present embodiment.
This management device 600 can collate maintenance information of the components constituting the nozzle 301 used for sucking the electronic components mounted on the board and the component cassette 114 for storing the electronic components, and details are described below. A calculation control unit 601, a display unit 602, an input unit 603, a memory 604, a maintenance information storage unit 605, a communication I / F unit 606, a database unit 607, a determination unit 608, a warning unit 609, and the like are described.

  The arithmetic control unit 601 is a CPU (Central Processing Unit), a numerical processor, or the like, and downloads and executes a necessary program in the memory 604 according to an instruction from the user, and controls each component according to the execution result.

  The display unit 602 is a CRT (Cathode-Ray Tube), an LCD (Liquid Crystal Display), or the like.

  The input unit 603 is a keyboard, a mouse, or the like, and these are used for the operator to interact with the component mounter 100 under the control of the arithmetic control unit 601.

  The memory 604 is a RAM (Random Access Memory) or the like that provides a work area for the arithmetic control unit 601.

  The maintenance information storage unit 605 stores information related to the maintenance of the components constituting the nozzle 301 and the component cassette 114, for example, the number of usable times and the usage for each component constituting the devices such as the nozzle 301 and the component cassette 114. Information such as possible time, number of times of adsorption, number of times of attachment, maintenance time, etc. are stored. The number of times that can be picked up is the maximum number of times that the mounting head can pick up an electronic component using that component, and the number of times of mounting is the number of times that the mounting head uses the component to mount the electronic component on the board. The maximum number of times that can be done.

  In addition to the above information, the maintenance information storage unit 605 also includes specifications of component tapes and component cassettes, such as tape material such as paper or emboss, information such as tape width and feed pitch, component tapes and component cassettes, and the like. Information indicating the correct combination of the above (a combination of the specification of the allowable component cassette and the specification of the component tape) is also stored as maintenance information.

  The communication I / F unit 606 is a LAN (Local Area Network) adapter or the like, and is used for communication between the management apparatus 600 and the component mounter 100.

  The database unit 607 is a hard disk that stores input data (mounting point data 607a, component library 607b, and mounter information 607c) used for the component mounter 100.

  Based on the maintenance information of the component parts read from the IC tag reader / writer 111 and the maintenance information such as the number of usable times stored in the maintenance information storage unit 605, the determination unit 608 determines each component part at the time of mounting the electronic component. Determine whether maintenance is possible.

  The warning unit 609 performs control to issue a yellow warning or a red warning to a lamp provided in the component mounter 100 when it is determined that maintenance is necessary according to an instruction from the determination unit 608.

  FIG. 7 is a table 700 showing an example of maintenance information recorded on an IC tag 400 attached to a device such as a nozzle or a component cassette according to the present embodiment. In the present embodiment, in order to manage maintenance information for each component, for example, the IC tag 400 attached to the component cassette includes components such as a spring, a shutter, and a casing that constitute the component cassette. Maintenance information for each is recorded.

  The maintenance information recorded in the IC tag 400 includes the number of times / time such as the number of times of adsorption, the number of times of mounting, the number of errors, the number of times of use, the maintenance history, the time of use (not shown), etc., as displayed in the table 700. Information on management, information on quality index management such as adsorption rate and mounting rate, and information on usage environment management such as maximum acceleration, temperature and humidity are included. The number of times of suction is the number of times that the mounting head has sucked the electronic component by using the component, and the number of times of mounting is the number of times that the mounting head has mounted the electronic component on the substrate by using the component. The number of errors is the number of errors caused by the component, the number of uses is the number of times that the component is used, and the maintenance history is a history of maintenance such as when the component is replaced, The usage time is the usage time (integrated time) of the component. Also, the suction rate is the ratio of the number of times that the mounting head has sucked the electronic component by using the component, and the mounting rate is the ratio of the number of times the mounting head has sucked the electronic component. Is the ratio of the number of times that the electronic component has been mounted on the board to the total number of times without error. The maximum acceleration is the maximum acceleration allowed for the component, and the temperature / humidity is the range of the operating environment temperature / humidity allowed for the component.

  For the information on the use environment management, the management device 600 includes, for example, a mounting head having a rotating mechanism, moves and positions the component supply table at high speed and high acceleration, supplies components, and mounts electronic components at high speed. The maximum acceleration (G) of a component cassette in a rotary machine, which is a component mounting machine, is stored in the IC tag of the component cassette, and the acceleration measured using the accelerometer side sensor is set for each component cassette. This is information for confirming whether the limit has been reached. When the measured acceleration exceeds the maximum acceleration, maintenance can be performed by stopping the use of the component cassette. In addition to the maximum acceleration, the information related to the use environment management includes use environment values around the mounting machine such as temperature and humidity. Also, with respect to these usage environment values, values in the actual usage environment are measured and matched with the usage environment values recorded in the IC tag 400 (or are they within the range indicated by the usage environment values)? Whether or not the upper limit value indicated by the usage environment value is exceeded.

  Furthermore, the component cassette 114 may be dropped while the operator is working, and the component mounting accuracy in the mounting process may be reduced due to the drop. In order to avoid this problem, for example, an impact sensor is attached to the component cassette, the detected value is read by the IC tag reader / writer 111, and a determination unit is used so as not to use the component cassette 114 that has received an impact of a predetermined impact value or more. It can also be monitored at 608. That is, an impact force (maximum impact force) may be added as a use environment value recorded in the IC tag 400.

  The number of times / time management information such as the number of times of picking up, the number of times of mounting, the number of errors, the number of times of use, the maintenance history, the usage time (not shown), and the information on quality index management such as the suction rate and mounting rate During the operation of the component mounting machine or during the stop time after the operation, each component is written into the IC tag 400 by the IC tag reader / writer 111.

  FIG. 8 is a diagram for explaining a method for specifying the Z number of the component tape by the IC tag 400. Here, the Z number is a value indicating the order in the arrangement of the component tapes or component cassettes set in the component mounting machine, and is an example of position information of the component tapes or component cassettes set in the component mounting machine.

  The IC tag reader / writer 111 transmits a radio wave having a predetermined frequency including a read command to the IC tag 400 and receives a radio wave having a predetermined frequency including information stored in the IC tag 400 from the IC tag 400. Then, the two IC tag reader / writers 111 specify the position of each IC tag 400 based on the direction of the radio wave received from each IC tag 400. When the position of the IC tag 400 is specified, the Z number is specified. For example, in the coordinate system shown in the figure, if the Z number increases by 1 every time the X coordinate value increases by 10, the position of the part A is specified as (X, Y) = (10, 4). Then, it can be seen from the X coordinate that the Z number of the part A is 1. At that time, the two IC tag readers / writers 111 are stored in the component cassette 114 based on the information received from the IC tag 400 in order to receive the maintenance information of each component cassette and component tape from each IC tag 400. The part name and Z number of the electronic part are specified.

  Therefore, according to the component mounter 100 according to the present invention, the Z number (device position information) and the maintenance information read from each IC tag can be associated with each other and managed. In other words, in the past, it was necessary to move and access the reader, and it was necessary for the operator to read each maintenance target device, but immediately after the target device was set on the component mounting machine. In addition, the above maintenance information can be collectively managed. For example, it is possible to manage component cassette maintenance information and electronic component maintenance information for each Z number, such as which type of component cassette and which type of electronic component (component name) are set in which Z number. Become.

Then, with the configuration of the IC tag reader / writer 111 shown in FIG. 8, the IC tag 400 of the component tape, the IC tag 400 of the component cassette 114, the IC tag 400 of the nozzle 301, and all the IC tags provided in other devices are accessed. It becomes possible.
The method for specifying the position of the IC tag 400 is not limited to the direction of radio waves, and may be based on the strength of radio waves received by the two IC tag reader / writers 111 or the ratio of the strengths of radio waves. . Further, the number of IC tag reader / writers 111 is not necessarily two, and may be one as long as the position of the IC tag 400 can be determined from the strength and direction of the received radio wave.

  FIG. 9 is a diagram for explaining another method for acquiring the maintenance information from the IC tag 400 there for each component cassette 114 with the component mounters 100 and 200 at each Z number. This method corresponds to a modification of the method for specifying the Z number shown in FIG. For example, the component mounters 100 and 200 include one IC tag reader / writer 111 and an antenna disposed from the IC tag reader / writer 111 to the vicinity of the IC tag 400 of each component cassette 114 in the component supply units 115a and 115b. 111a. The IC tag reader / writer 111 and the antenna 111a constitute a component information acquisition device.

  As described above, since the antenna 111a is close to each IC tag 400, the IC tag reader / writer 111 can reliably acquire component information from each IC tag 400 even if the IC tag reader / writer 111 is away from each IC tag 400. . Further, the IC tag reader / writer 111 identifies the position of each IC tag 400, that is, the Z number of its component cassette 114 based on the output signal (for example, the intensity or direction of radio waves) of each IC tag 400.

  Accordingly, the component mounters 100 and 200 according to the present embodiment are mounted on the Z number for each Z number without moving the component supply unit or providing a plurality of readers as in the conventional case. Maintenance information of the component cassette 114 can be easily obtained. In the method shown in FIG. 9, in addition to the method shown in FIG. 8, since the antenna 111a is wired to the vicinity of each IC tag 400, the radio wave reception sensitivity is maintained better than the method shown in FIG. Therefore, the maintenance information can be reliably acquired from the IC tag 400 of the component cassette 114 and the IC tag 400 of the nozzle 301.

  If the component cassette is a double cassette for storing two component tapes, two component tapes exist for the same Z number, but the IC tag 400 attached to the reel 426 of each component tape. Therefore, the IC tag reader / writer 111 can determine whether the signal source is the component tape located on the left side or the right side of the double cassette.

  In addition, when the IC tag 400 outputs a signal using electromagnetic waves or infrared rays as a wireless communication medium, the IC tag reader / writer 111 specifies the position of the IC tag 400 based on the intensity or direction of the signal. Also good.

  8 and 9, the description has been given using the component cassette 114. However, for example, even when a plurality of nozzles 301 and the like are arranged on the mounting head, the position recognition processing of the IC tag 400 of the device is performed similarly. It can be carried out.

  As described above, according to the component mounter in the present embodiment, it is possible to acquire maintenance information for a plurality of devices in a batch while distinguishing them, and the time required for reading the maintenance information And the overall production time is shortened.

  FIG. 10 is a flowchart showing an operation procedure in the case of performing maintenance management of equipment or components using the number / time management information in the component mounter 100 according to the present embodiment.

  First, the management apparatus 600 determines whether or not the device is set at a predetermined position of the component mounter using the IC tag reader / writer 111, and determines the position of the set device as described above. Identification is performed using the writer 111 (S1001).

  Thereafter, the IC tag reader / writer 111 acquires the maintenance information of the component from the IC tag 400 of the set device (S1002).

  Next, the determination unit 608 stores information on the number of times of use, the number of times of suction, the number of times of mounting, the number of times of use, the time of use, etc., which are recorded in the maintenance information storage unit 605, and each actual component acquired in S1002. It is determined whether or not it is the maintenance time for each component by comparing the number of times the component is used, the number of times of suction, the number of times of mounting, the usage time, etc. (S1003). As a result, when the actual number of use times of each component exceeds the number of use times required for maintenance recorded in the maintenance information storage unit 605, it is determined that the maintenance time has come. In addition, the determination unit 608 exceeds the information acquired in S1002 in comparison with the usable number of times, the number of adsorbable times, the number of possible attachments, the usable time, and the like recorded in the maintenance information storage unit 605. Sometimes judged as “use limit”.

  If the determination unit 608 determines that it is not the maintenance time (No in S1003), the series of processing ends. On the other hand, when it is determined that the maintenance time has been reached (Yes in S1003), a yellow signal is displayed when maintenance is required before reaching the use limit, and a red warning is displayed when the “use limit” is reached. To the warning unit 609 (S1004), and the operation of the component mounting machine 100 is stopped (S1005). In the case of a yellow signal, a warning is given as to how many times it can be used later or how many hours it can be produced. In addition to the warning by color display, a warning by sound is also possible. In the maintenance method according to the present embodiment, the management limit can be managed for the entire device such as the component cassette 114 and the nozzle 301.

  FIG. 11 is a flowchart showing an operation procedure when the maintenance information is updated after the component is mounted on the substrate in the IC tag reader / writer 111 of the component mounter 100 according to the present embodiment. In the present embodiment, when there is a component that has undergone maintenance processing such as replacement, the maintenance information of the component is initialized.

  First, when the operation of the component mounter 100 ends (S1101), the determination unit 608 determines whether there is a component that has undergone maintenance processing (S1102). If there is a component replacement or the like (Yes in S1102), the IC tag reader / writer 111 initializes the maintenance information of the component recorded in the IC tag 400 (S1103), and then the IC tag reader The / writer 111 updates and writes information necessary for maintenance such as the number of times of use and usage time in the IC tag 400 attached to the used device (S1104).

  On the other hand, when the determination unit 608 determines that there is no component for which maintenance processing has been performed (No in S1102), the IC tag reader / writer 111 sets each component in the IC tag 400 attached to the used device. Information necessary for maintenance such as the number of times used and the usage time are updated and written (S1104). Note that the timing of writing by the IC tag reader / writer 111 can be written after the end of the mounting process or at the end of one task.

  By such maintenance information initialization, information is updated in synchronization with the replacement of component parts, and accurate maintenance information is maintained for each individual component part, so that maintenance can be performed at an appropriate timing. it can.

  FIG. 12 is a flowchart showing an operation procedure in the case of performing equipment maintenance management using information related to quality management in the component mounter 100 according to the present embodiment.

  First, the IC tag reader / writer 111 scans and reads the IC tag 400 of the device such as the nozzle 301, and reads the suction rate and mounting rate recorded in the production up to the present time, which is quality management information (S1201).

  Next, the determination unit 608 determines whether or not the suction rate or the mounting rate has decreased (S1202). Specifically, the current suction rate is calculated from the number of suctions and the suction error acquired during component mounting (or the current mounting rate is calculated from the number of mountings and the mounting error), and the obtained current suction rate ( Alternatively, by comparing the attachment rate) with the adsorption rate (or attachment rate) read from the IC tag 400, it is determined whether or not the adsorption rate (or attachment rate) has decreased. This determination may be made after the entire mounting process, or may be made at the end of one task. Then, the determination unit 608 determines whether or not the nozzle 301 and the component cassette 114 being used have reached the maintenance time using the quality management information (S1202). For example, when the current suction rate of the nozzle 301 being used is lower than a predetermined range compared to the suction rate recorded in the IC tag 400 as maintenance information of the nozzle 301 in the past, the maintenance time It is determined that In addition, when the suction rate and the mounting rate are decreased (Yes in S1202), the determination unit 608 determines whether the suction rate and the mounting rate are decreased for a specific electronic component. (S1203). If the suction rate and the mounting rate are not lowered (No in S1202), the process is terminated as it is.

  As a result of the determination, when it is determined that the suction rate or the like is reduced for a specific electronic component (Yes in S1203), the use of a device (for example, a component cassette) corresponding to the specific electronic component is stopped. (S1204).

  On the other hand, when the determination unit 608 determines that the suction rate is reduced for all electronic components or a plurality of electronic components instead of a specific electronic component (No in S1203), the determination unit 608 uses the warning unit 609. Control is performed to give a yellow signal before reaching the limit and a red warning when the use limit is reached (S1205), and the operation of the component mounting machine 100 is stopped (S1206). As a result, the necessity of maintenance is determined in units of electronic components, and if the cause of the failure is due to some electronic components, the mounting should be continued by discontinuing use of only those electronic components. Can do.

  FIG. 13 is a flowchart showing an operation procedure when the setup relationship between the component tape and the component cassette 114 is confirmed in the component mounter 100 according to the present embodiment.

  First, the IC tag reader / writer 111 identifies the component tape and the component cassette 114 arranged at the same Z number from the position of the IC tag 400, and from the IC tag 400 attached to the identified component cassette. The specification of the component cassette is acquired, and the specification of the component tape is acquired from the IC tag 400 attached to the specified component tape (S1301).

  Next, the determination unit 608 includes information acquired by the IC tag reader / writer 111, maintenance information stored in the maintenance information storage unit 605, such as tape material such as paper or emboss, tape width, feed pitch, and the like. Referring to FIG. 5, it is determined whether or not the combination of the component tape to be attached and the component cassette is correct (S1302). For example, the specification of the component cassette acquired from the IC tag 400 attached to the component cassette and the specification of the component tape acquired from the IC tag 400 attached to the component tape stored in the component cassette It is determined whether or not the combination corresponds to a combination indicated by the maintenance information stored in the maintenance information storage unit 605 (a combination of an allowable component cassette specification and a component tape specification).

  If the determination unit 608 determines that the combination of the component tape and the component cassette is correct (Yes in S1302), the determination unit 608 determines that the component mounting operation is continued as it is, while the combination of the component tape and the component cassette is correct. If it is determined that there is not (No in S1302), the warning unit 609 is instructed to give a red warning or the like (S1303). Thereby, it is confirmed whether each component tape is stored in the correct component cassette before the start of component mounting.

  FIG. 14 is a flowchart showing an operation procedure when the expiration date management of the electronic component is performed in the component mounter 100 according to the present embodiment.

  First, the IC tag reader / writer 111 acquires information on the expiration date from the IC tag 400 attached to the component tape 402 (S1401). Next, the determination unit 608 determines whether the electronic component is used within the expiration date (S1402). This determination is made, for example, by determining whether or not the current date and time acquired from a calendar timer provided in the component mounter has exceeded the expiration date recorded on the IC tag of the component tape 402. If it is determined that the use is not within the expiration date (No in S1402), it is determined that maintenance is necessary, and a warning is displayed so that a warning is displayed when mounting on the component cassette 114 or during the mounting operation of the equipment. The unit 609 is instructed (S1403). This warning can also be given a yellow warning for parts that are near the expiration date and a red warning for parts that have passed the expiration date.

  On the other hand, if it is determined that the use is within the expiration date (Yes in S1402), the series of processing is terminated as it is.

  As a result, it is possible to avoid the occurrence of an inconvenience that an electronic component with an expiration date continues to be used after the expiration date, and the quality of the substrate to be produced is ensured. Note that the expiration date of the parts is, for example, September 10, 2006.

  FIG. 15 is a correspondence table 1500 showing the correspondence between the failure location in the nozzle 301 and the detection contents of various sensors in the present embodiment.

  The failure of the nozzle 301 includes a nozzle, that is, a bent nozzle, a filter, that is, a leak, etc. In the component mounter 100 according to the present invention, the nozzle 301 includes a flow sensor, a light quantity sensor, a pneumatic sensor, a mounting pressure sensor, and the like. One or more sensors are installed, each problem is monitored, and a yellow warning or red warning is given when an abnormality is found.

  Then, the IC tag reader / writer 111 of the component mounter 100 holds the measured values of various sensors during operation in the IC tag 400, and compares these measured values over time, so that as shown in the correspondence table 1500, For example, when the detection value of the flow sensor or the light amount sensor decreases, the nozzle, that is, the nozzle bending, the filter, etc. can be monitored, and when the detection value of the pressure sensor increases, the nozzle, that is, the nozzle bending, the filter, etc. can be monitored.

  Also, if the detection value of the flow rate sensor or light quantity sensor is not 0 when holding the component, it can be detected that a leak has occurred, and the detection value of the pressure sensor can be reduced when holding the component. It can be detected that a leak has occurred. Further, by using a mounting pressure sensor, it is possible to monitor whether or not the mounting pressure at each mounting point of the electronic component on the substrate is within a range of appropriate values.

  As described above, in the component mounter 100 according to the present embodiment, the IC tag reader / writer 111 is used to specify the positions of the IC tags 400 of a plurality of devices such as the nozzles 301, and the component parts are collectively collected. Since the maintenance information can be acquired, when the target device is set on the component mounter, the device position information and the maintenance information read from each IC tag can be managed in association with each other immediately. Parts information can be easily acquired without complicating the process.

  Further, an IC tag 400 capable of recording / updating maintenance information of each component is attached to a device such as the nozzle 301, and the maintenance information and maintenance information storage unit 605 that the determination unit 608 acquires by the IC tag reader / writer 111. By comparing the stored maintenance information such as the number of usable times, the necessity of maintenance including the maintenance time is quantitatively determined for each device or component.

  Furthermore, since management is performed using the IC tag 400, a large amount of information can be stored in the built-in memory. Therefore, it is possible to manage maintenance information in fine units, not for each device but for each component. .

  Furthermore, since the IC tag reader / writer 111 updates and records maintenance information recorded on the IC tag 400 attached to the device as needed after completion of the mounting of the electronic component, it is possible to realize maintenance based on more accurate maintenance information. .

  In this embodiment, the IC tag 400 is used as the storage unit. However, in addition to the IC tag 400, the IC tag reader / writer 111 can read (or read and write), for example, 2 It is also possible to use a dimensional barcode, a memory, or the like. In addition, the component mounter device using the maintenance method according to the present invention is not limited to the component cassette 114 and the nozzle 301. For example, the same maintenance method is used for various devices such as a mounting head and a tape feeder. Needless to say, you can.

  In the present embodiment, the management device 600 is hardware different from the component mounter. However, the present invention is not limited to such a configuration, and the management device 600 is incorporated in the component mounter. Alternatively, it may be realized by software or hardware as one function of the component mounter.

  A maintenance method and a component mounting machine according to the present invention are, for example, a component mounting machine maintenance method and a component mounting machine for mounting an electronic component on a substrate. And a component mounter having such a maintenance function.

The block diagram which shows the structure of the component mounting system which concerns on this invention FIG. 1 is a plan view showing the main configuration of the component mounter shown in FIG. Reference diagram for explaining the position of the IC tag attached to the nozzle of the component mounter according to the embodiment External view for explaining an IC tag attached to a component tape used in a component mounter according to an embodiment External view of a component cassette to which an IC tag in which information for maintenance according to an embodiment is recorded is attached Functional block diagram showing the hardware configuration of the management device according to the embodiment Table showing an example of maintenance information recorded on an IC tag attached to a device according to an embodiment The figure for demonstrating the method for pinpointing the Z number of a component tape with an IC tag The figure for demonstrating the method in which a component mounting machine acquires component information from the IC tag there for every component cassette in each Z number The flowchart which shows the operation | movement procedure in the case of performing maintenance management of a component using the frequency | count / time management information in the component mounting machine which concerns on embodiment The flowchart which shows the operation | movement procedure at the time of updating maintenance information after completion | finish of mounting on the board | substrate in the IC tag reader / writer of the component mounting machine which concerns on embodiment The flowchart which shows the operation | movement procedure in performing the maintenance management of an apparatus using the information regarding quality control in the component mounting machine which concerns on embodiment The flowchart which shows the operation | movement procedure in the case of confirming the setup relationship of an electronic component and a component cassette in the component mounting machine which concerns on embodiment The flowchart which shows the operation | movement procedure in the case of performing the expiration date management of an electronic component in the component mounting machine which concerns on embodiment In the embodiment, a correspondence table showing correspondences between failure locations in nozzles and detection contents of various sensors

Explanation of symbols

100, 200 Component mounter 111 IC tag reader / writer 112 Mounting head 113 XY robot 114 Component cassette 115a, 115b Component supply unit 116 Component recognition camera 117 Tray supply unit 301 Nozzle 400 IC tag 401 Reel 402 Component tape 402a Cover tape 402b Carrier tape 402c Storage recess 600 Management device 601 Operation control unit 602 Display unit 603 Input unit 604 Memory unit 605 Nozzle information storage unit 606 Communication I / F unit 607 Database unit 608 Judgment unit 609 Warning unit

Claims (24)

A maintenance method for a component mounter that mounts components on a board,
A position specifying step for specifying the position of the device by a signal received from an IC tag attached to the device constituting the component mounter;
And a reading step of reading maintenance information of the device from an IC tag of the device at the position specified in the position specifying step. Maintenance information for each device is recorded on the IC tag,
In the read step, the maintenance information related to maintenance of the device is read from the IC tag,
The maintenance method further includes:
The maintenance method according to claim 1, further comprising a determination step of determining whether maintenance of the device is possible based on the read maintenance information. In the IC tag, maintenance information for each component constituting the device is recorded,
In the read step, the maintenance information regarding the maintenance of the component parts is read from the IC tag,
The maintenance method according to claim 2, wherein in the determination step, it is determined whether or not the component parts can be maintained based on the read maintenance information. The maintenance method further includes:
The maintenance method according to claim 2, further comprising a warning step for issuing a warning when it is determined that maintenance is necessary in the determination step. The maintenance information includes at least one of the usage count, usage time, error count, suction count, repair history, maintenance history, mounting count, and expiration date of the component for each device or component. ,
The determination step determines that the maintenance of the component is necessary when the information regarding the maintenance that differs for each device or the component reaches a predetermined limit value. The maintenance method according to 3. The maintenance method further includes:
The write step of writing a use history for each of the devices or components into the IC tag as the information related to the maintenance during the operation of the component mounting machine or during a stop time after the operation is provided. The maintenance method according to 3. In the light step,
The maintenance method according to claim 6, wherein when the device or component is replaced, the maintenance information of the device or component stored in the IC tag is reset to an initial value and written. 5. The warning step includes performing a first warning in a predetermined period before the device or the component reaches a use limit, and a second warning after the use limit is reached. Maintenance method. The device is a component cassette for storing components,
The maintenance method according to claim 3, wherein the component includes at least one of a spring, a shutter, a feed mechanism, and a casing that constitute the component cassette. The device is a nozzle that sucks parts,
The maintenance method according to claim 3, wherein the component includes at least one of a spring, a shutter, a flange, a filter, and a casing that constitute the nozzle. The maintenance information includes at least one of maximum acceleration, impact force, temperature that is a use environment value, and humidity of the component cassette that is the device,
In the determination step, when the maximum acceleration, the impact force, the temperature, or the humidity set for each component cassette reaches a use limit value, it is determined that maintenance of the component cassette is necessary. The maintenance method according to claim 2. The information on the maintenance includes information on the adsorption rate of the component or the mounting rate on the substrate of the component,
The maintenance method according to claim 2, wherein, in the determination step, it is determined that the maintenance is necessary when the suction rate or the mounting rate is lower than a predetermined value for each type of the component. The device is a nozzle that adsorbs the component;
The maintenance method according to claim 2, wherein the nozzle includes at least one of a flow rate sensor, a light amount sensor, an air pressure sensor, and a mounting pressure sensor for managing the maintenance information. The device is a component cassette for storing a component tape for supplying the component,
In the determination step, based on the information read from the IC tag attached to the component cassette read in the read step and the specification read from the IC tag attached to the component tape, an operation combining the component cassette and the component tape. The maintenance method according to claim 2, wherein success or failure is determined. The maintenance method further includes:
The maintenance method according to any one of claims 1 to 3, further comprising a stop step of stopping the use of the component mounter when it is determined that maintenance is required in the determination step. . An antenna for reading maintenance information from the IC tag is disposed in the vicinity of the IC tag,
In the read step, a reader reads the maintenance information from an IC tag of the device at the position specified in the position specifying step via an antenna disposed in the vicinity of the IC tag. The maintenance method according to Item 1. A maintenance method for a component mounter that mounts components on a board,
A read step of reading maintenance information related to maintenance of component parts constituting the device from an IC tag attached to the device constituting the component mounter;
And a determination step of determining whether or not maintenance of the component is possible based on the read maintenance information. A component mounter for mounting components on a board,
Position specifying means for specifying the position of the device by a signal received from an IC tag attached to the device constituting the component mounter;
A component mounting machine comprising: a reading unit that reads maintenance information of the device from an IC tag of the device at the position specified by the position specifying unit. Maintenance information for each device is recorded on the IC tag,
The read means reads maintenance information related to maintenance of the device from the IC tag,
The component mounter further includes:
The component mounting machine according to claim 18, further comprising a determination unit that determines whether or not maintenance of the device is possible based on the read maintenance information. In the IC tag, maintenance information for each component constituting the device is recorded,
The read means reads maintenance information related to maintenance of the component from the IC tag,
The component mounting machine according to claim 19, wherein the determination unit determines whether or not the component can be maintained based on the read maintenance information. An operation method of a component mounter for mounting a component on a board,
A position specifying step for specifying the position of the device by a signal received from an IC tag attached to the device constituting the component mounter;
And a reading step of reading maintenance information of the device from the IC tag of the device at the position specified in the position specifying step. Maintenance information for each component constituting the device or the device is recorded on the IC tag,
In the read step, the maintenance information related to maintenance of the device or component is read from the IC tag,
The driving method further includes:
The operation method of the component mounter according to claim 21, further comprising a determination step of determining whether or not maintenance of the device or component is possible based on the read maintenance information.   The program for making a computer perform the step of the method of any one of Claims 1-16.   A computer-readable recording medium on which the program according to claim 23 is recorded.

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