JP2006190735A - Cooling device and electronic unit provided therewith - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a small cooling device where an exothermic electronic component on a substrate can highly efficiently be cooled and the passage resistance of piping is small, and to provide an electronic unit provided with the cooling device. <P>SOLUTION: In the cooling device, a liquid refrigerant is circulated, heat is taken from the exothermic electronic component mounted on the substrate by heat exchange with the liquid refrigerant, and taken heat is radiated by a radiator 3. The device is provided with a heat reception integrated pump 2 in which a heat reception part for thermally exchanging the exothermic electronic component and the liquid refrigerant flowing inside is arranged, and which sends the liquid refrigerant after thermal exchange to the radiator 3 by a liquid channel 5. The heat reception integrated pump 2 and the radiator 3 are oppositely arranged. A fan 4 which compulsorily cools the radiator 3 is arranged between them so that it faces them. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a cooling device that cools heat-generating electronic components such as a central processing unit (hereinafter referred to as CPU) disposed on a substrate inside an electronic device casing, and an electronic device including the same.

  In recent years, the processing speed of computers has been rapidly increased, and the clock frequency of CPUs has become dramatically larger than before. As a result, the amount of heat generated by the CPU increases, and the negative heat dissipation method of dissipating heat by bringing a heat sink or heat sink into contact with the heat generator like conventional computers becomes insufficient. Forcibly cool, or forcibly cool the radiator with a fan by interposing a heat sink module with a built-in heat pipe, and forcibly circulate the liquid refrigerant using a liquid pump between the heat receiver and the radiator There is a forced cooling method such as forced cooling by heat exchange. Since the processing speed is expected to increase further in the future, further improvement in cooling capacity and downsizing are expected.

  As a cooling device attached to a substrate on which such heat generating electronic components are mounted, for example, as disclosed in (Patent Document 1), heat transport including a heat flow member and a metal housing wall having a flexible liquid flow path. Cooling devices that are thermally connected by devices are known. FIG. 8 is a view showing a conventional fixing device for a cooling device of an electronic device.

  In FIG. 8, the electronic device includes a wiring board 20 on which a plurality of semiconductor elements are mounted, a keyboard 21, a disk device 22, a display device 23, and the like, and is housed in a metal housing 24. Of the semiconductor elements mounted on the wiring board 20, the semiconductor element 25 that generates a particularly large amount of heat is cooled by a heat transport device including a heat receiving header 26, a heat radiating header 27, a flexible tube 28, and the like. As shown in FIG. 8, the semiconductor element 25 and the heat receiving header 26 are brought into contact with each other with a thermal compound or high thermal conductive silicon rubber interposed therebetween, and the heat generated in the semiconductor element 25 is efficiently transmitted to the heat receiving header 26.

  Furthermore, the heat receiving header 26 connected to the semiconductor element 25 is connected by a flexible tube 28 to a heat radiating header 27 installed on the housing wall on the back surface of the display device 23. The heat-dissipating header 27 is thermally and physically attached to the metal housing wall via a thermal compound, high thermal conductive silicon rubber, or directly by means such as screws 29.

A flow path is formed inside the heat receiving header 26 and the heat radiating header 27, and a liquid is sealed therein. Further, a liquid driving device is incorporated in the heat radiating header 27 and is driven as a heat cycle by reciprocating or circulating the liquid between the heat receiving header 26 and the heat radiating header 27. Since the heat receiving header 26 and the heat radiating header 27 are connected by the flexible tube 28, even when a large number of components are mounted in a very narrow housing, the heat generating semiconductor element and the heat radiating are not affected by the mounting structure. Since the heat transfer is performed by driving the liquid, the heat generated in the high heat generation semiconductor element is effectively transported to the heat dissipation header. In the heat dissipating part, the heat dissipating header and the metal housing wall are thermally connected, so heat is widely diffused to the housing wall due to the high thermal conductivity of the metal housing, and high heat dissipating performance is obtained. It is done. Therefore, the semiconductor element can be efficiently cooled.
JP-A-7-142886 (page 6, FIG. 1)

  However, in the conventional cooling device described in (Patent Document 1), the heat receiving header 26 is installed on the surface of the semiconductor element 25 that is a heat generating electronic component such as a CPU, and other elements constituting the liquid cooling device, for example, heat dissipation. Since the header 27 and the flexible tube 28 are separately arranged in the electronic device casing, the electronic device casing can be made thin, but the mounting work of the cooling device to the electronic device casing is complicated, and the cooling device The volume that it occupies was very large.

  In addition, since the length of the pipe connecting the parts to each other is inevitably increased, the amount of refrigerant evaporated due to long-term use also increases, and a relatively large reserve tank for replenishing this is used as a part of the liquid flow path. Therefore, as a result, the entire cooling device is increased in size and the piping length is increased. Thereby, in the conventional cooling device, the flow path resistance of the piping with respect to the pump is increased, the flow rate is decreased, and the cooling performance is lowered.

  Furthermore, in order to enhance heat dissipation, even when metal fins are provided near the heat dissipation header 27 or in the vicinity thereof and they are forcibly cooled by a fan, the airflow path is placed in the electronic device casing so that the fan airflow path is not obstructed. In order to secure a space for securing, or to install a cooling device in an electronic device casing, further complication of components and a decrease in cooling performance associated therewith have been problems.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a cooling device that can cool a heat-generating electronic component on a substrate with high efficiency, is small, and has a small flow path resistance of a pipe, and an electronic device including the same.

  In order to solve the above problems, the present invention is a cooling device that circulates a liquid refrigerant, takes heat from a heat generating electronic component mounted on a substrate by heat exchange with the liquid refrigerant, and dissipates the taken heat with a radiator, A heat receiving part for exchanging heat between the heat generating electronic component and the liquid refrigerant flowing inside is provided, and includes a heat receiving integrated pump that sends the liquid refrigerant after heat exchange to the radiator through a circulation path, and the heat receiving integrated pump and the radiator face each other. The main feature is that the fans forcibly cooling the radiator are arranged so as to face each other.

  According to the cooling device of the present invention, components such as the heat receiving integrated pump, the radiator, the fan, and the reserve tank can be integrally configured with a simple structure, so that the mounting work to the heat generating electronic components in the electronic device casing can be performed. Not only is it easy, but the pipe length can be shortened, the amount of water evaporation of the refrigerant can be suppressed, the reserve tank can be downsized accordingly, the entire cooling device can be downsized, and the pipe length can be shortened. The flow path resistance of the piping with respect to the pump decreases, thereby increasing the flow rate and improving the cooling performance.

  The first invention of the present invention, which has been made to solve the above problems, circulates a liquid refrigerant, removes heat from a heat-generating electronic component mounted on a substrate by heat exchange with the liquid refrigerant, and uses a radiator to remove the deprived heat. A cooling device that dissipates heat, and includes a heat receiving unit for exchanging heat between the heat generating electronic component and the liquid refrigerant flowing inside, and includes a heat receiving integrated pump that sends the liquid refrigerant after heat exchange to a radiator through a circulation path. A cooling device in which an integrated pump and the radiator are arranged to face each other, and a fan for forcibly cooling the radiator between them is arranged to face each other, and is configured integrally with a simple structure. In addition to facilitating the mounting work on the heat generating electronic components in the housing, the radiator can be released even if the cooling device of the present invention is installed in the electronic device housing close to other peripheral devices or the housing wall. Without the fans blowing path required impeded, the pipe length is short, flow resistance of the pipe with respect to the pump is reduced, the cooling performance by the flow rate increases can be improved.

  A second invention of the present invention is an invention subordinate to the first invention, and is a cooling device in which an air passage is provided between the fan and the heat receiving integrated pump. In addition to the effects of the first invention, Even if the cooling device of the present invention is installed close to other peripheral devices or the housing wall in the electronic device casing, it can secure a sufficient fan air passage for heat dissipation of the radiator, and can supply a sufficient amount of air to the radiator. Since the air can be blown, the heat dissipation performance of the radiator can be improved.

  A third invention of the present invention is an invention dependent on the first invention or the second invention, wherein a cooling device coupling member for coupling and integrating the heat receiving integrated pump, the radiator and the fan is provided. In addition to the effects of the first or second invention, the cooling device coupling member can easily arrange and fix each component of the cooling device at a predetermined position.

  A fourth invention of the present invention is an invention dependent on the third invention, wherein the cooling device coupling member is disposed between the heat receiving integrated pump and the fan, and between the cooling device coupling member and the heat receiving integrated pump. A cooling device provided with an elastic member, and in addition to the effect of the third invention, when the cooling device of the present invention is attached to and detached from the substrate, the cooling coupling member and the cooling device are pressed against the substrate side, thereby the cooling device It can be used for the operation of locking or releasing the coupling member to the substrate, which makes it easy to attach and detach the cooling device, and makes it easier to replace the heat generating electronic components. Furthermore, since the heat receiving integrated pump can be uniformly pressed against the heat generating electronic components and a stable heat connection state can be maintained, the heat dissipation performance can also be improved. It can also absorb vibration during transportation.

  A fifth invention of the present invention is an invention dependent on the third or fourth invention, wherein the cooling device coupling member is disposed between the heat receiving integrated pump and the fan, and the cooling device coupling member is related to the substrate. It is a cooling device provided with a hook for stopping, and can be used for, for example, an operation of locking or releasing the cooling device coupling member to a clamp portion provided on the substrate side, thereby detaching the cooling device. This makes it easier to replace the heat generating electronic components.

  A sixth invention of the present invention is an invention dependent on any one of the first to fifth inventions, wherein a reserve tank is disposed adjacent to any side surface of the heat receiving integrated pump, the radiator, or the fan. In addition to the effects of any one of the first to fifth inventions, the cooling device does not require replenishment of the refrigerant that evaporates when used for a long period of time, and the liquid flow path is shortened by being adjacent to the side surface. Therefore, it is possible to provide a cooling device in which the amount of refrigerant evaporated from the liquid flow path is reduced and the cooling device can be used continuously.

  A seventh invention of the present invention is an electronic apparatus comprising the cooling device according to any one of the first to sixth inventions, wherein the heat receiving integrated pump of the cooling device is thermally connected to the heat generating electronic component, and is small in size and includes a refrigerant. It is possible to provide an electronic device that can suppress the amount of moisture evaporation and can easily perform maintenance work such as replacement of heat-generating electronic components.

  Hereinafter, Embodiment 1 of the present invention will be described with reference to the drawings.

(Embodiment 1)
Embodiment 1 of the present invention relates to a liquid cooling type cooling apparatus using a liquid refrigerant mounted on a computer device as an electronic apparatus. 1 is an overall side view showing a mounting state of a cooling device fixing device according to Embodiment 1 of the present invention, and FIG. 2 is an upper perspective view of the cooling device attached to the cooling device coupling member according to Embodiment 1 of the present invention. FIG. 3 is a lower perspective view of the cooling device attached to the cooling device coupling member according to the first embodiment of the present invention, and FIG. FIG. 5 is a side view showing the positional relationship, FIG. 5 is an explanatory diagram of a clamp part immediately before pressing the cooling device in the first embodiment of the present invention in the substrate direction, and FIG. 6 is a diagram showing the cooling device in the first embodiment of the present invention in the substrate direction. FIG. 7 is an explanatory view of the clamp part immediately after pressing, and FIG. 7 is an explanatory view of the movable member of the clamp part when the cooling device according to Embodiment 1 of the present invention is removed.

  1 to 3 show a state in which the cooling device 1 is mounted on the fixing device of the first embodiment. The cooling device 1 includes a heat receiving integrated pump 2, a radiator 3, and a reserve tank 6 in a circulation path, uses a liquid refrigerant (hereinafter referred to as cooling liquid), carries heat received by the heat receiving integrated pump 2 to the radiator 3, and a fan 4. This is a structure in which the cooling system for cooling the radiator 3 and returning the radiated coolant back to the heat receiving integrated pump 2 for circulation is made into one block. The liquid refrigerant is preferably water or antifreeze.

  The heat generated from the CPU, which is a heat generating electronic component, is transmitted to the coolant circulating inside through the heat receiving surface 2a (heat receiving portion of the present invention) formed on the bottom surface of the heat receiving integrated pump 2, and the temperature of the coolant Rises. The coolant whose temperature has been increased by heat exchange is sent to the radiator 3 by the heat receiving integrated pump 2. The radiator 3 includes a metallic pipe 3a through which a coolant flows and a plurality of heat radiation fins 3b in contact therewith, and has a structure in which heat of the coolant whose temperature has risen is efficiently transmitted to the heat radiation fins 3b.

  The radiator 3 is composed of a meandering metallic pipe 3a as shown in FIG. 2 and a plurality of radiating fins 3b intersecting and contacting the pipe 3a. The coolant flows through the pipe 3a and the heat is generated. Heat is transferred to the radiation fin 3b. Further, in order to dissipate the heat transferred, the fan 4 applies air to the heat dissipating fins 3b and releases the air whose temperature has increased. The coolant whose temperature has been removed due to heat removal passes through the reserve tank 6 and is sent to the heat receiving integrated pump 2 again.

  And the heat receiving integrated pump 2 and the radiator 3 are arrange | positioned in the opposing positional relationship, and the fan 4 which forcibly cools the radiator 3 is arrange | positioned so as to oppose both. At this time, the suction side of the fan 4 is disposed to face the heat receiving integrated pump 2, and an air passage 7 for air supplied to the fan 4 is formed between the two. Thus, by disposing the fan 4, the heat receiving integrated pump 2, and the radiator 3 so as to face each other, the cooling device 1 is configured with a minimum space, and air is sent to the radiator 3 by the air passage 7 between the fan 4 and the heat receiving integrated pump 2. Sufficient air volume can be secured.

  The reserve tank 6 is provided with a gas-liquid separation mechanism for separating the air mixed in the cooling liquid, and the separated air is supplied again to the heat receiving integrated pump 2 regardless of the posture of the cooling device 1. It is configured not to be mixed. In addition, a sufficient amount of coolant is stored in the interior in order to maintain cooling performance even if the coolant is used over a long period of time and vaporizes. In the first embodiment, the coolant circulates in the order of the heat receiving integrated pump 2 → the radiator 3 → the reserve tank 6 → the heat receiving integrated pump 2, but the order in which the coolant circulates can be changed as appropriate.

  In the cooling device 1, the fan 4 is fixed to the cooling device coupling member 8 with a fixing pin 8 a as shown in FIGS. 2 and 3, the radiator 3 is mounted on the upper side, and the reserve tank 6 is fixed to the side surface of the radiator 3. Is done. On the other hand, the heat receiving integrated pump 2 is fixed to the lower surface of the cooling device coupling member 8 by a fixing screw 8b via a coil spring 8c (compressed in FIG. 1) which is an elastic member. Since it is fixed by the coil spring 8c, the heat receiving integrated pump 2 is movable in the vertical direction and can absorb vibration and pressing force. The heat generated from the CPU, which is a heat generating electronic component, is transmitted to the coolant circulating inside the heat receiving surface via the heat receiving surface 2a located on the bottom surface of the heat receiving integrated pump 2, and the temperature of the coolant rises.

  The coolant whose temperature has been increased by heat exchange through the heat receiving surface 2 a is sent to the radiator 3 by the heat receiving integrated pump 2. In the radiator 3, the coolant flows through the pipe 3a, and the heat is transferred to the radiation fins 3b. Further, the heat transferred is released by the wind from the fan 4. The coolant whose temperature has decreased is sent again to the heat receiving integrated pump 2 through the reserve tank 6.

  By the way, the cooling device coupling member 8 is provided with hooks 8d as shown in FIG. 3 on both sides of the heat receiving integrated pump 2, and engages with a clamp portion 12 described later. Thus, the heat receiving integrated pump 2 can be urged with a predetermined load via the coil spring 8c and pressed against the upper surface of the CPU. The circular heat receiving surface 2a below the heat receiving integrated pump 2 shown in FIG. Close contact with the center. The cooling device coupling member 8 is preferably made of metal such as a metal plate, but may be made of metal as long as the material can withstand this pressing load.

  Then, the mounting method of the cooling device 1 is demonstrated based on FIGS. As shown in FIG. 4, the cooling device 1 that is attached to the cooling device coupling member 8 and formed into a block has an arrow with respect to the guide 11 and the clamp portion 12 that are provided around the CPU 10 on the mounting surface of the substrate 9. Inserted in the direction. Next, as shown in FIG. 5, when the heat receiving integrated pump 2 of the cooling device 1 is pushed in the direction of the substrate 9 so as to be housed in the guide 11, the guide 11 guides the heat receiving integrated pump 2 to the central portion of the CPU 10. When the cooling device 1 is pushed in the direction of the substrate 9 as it is, as shown in FIG. 5, the hook 8d of the liquid cooling device coupling member 8 comes into contact with the clamp movable pin 12a, and the clamp movable side plate 12b and the clamp movable pin 12a which are movable members. Is pushed outward as indicated by the broken line.

  When the cooling device 1 is further pushed in here, as shown in FIG. 6, the substantially cylindrical clamp movable pin 12a gets over the bent top of the hook 8d of the cooling device coupling member 8, and is a recess formed adjacent to the bent top. The clamp movable side plate 12b is self-returned to the original posture (perpendicular to the substrate 9) from the inclined position indicated by the broken line because of the torsion spring (not shown), and in this state, the clamp movable pin 12a Is engaged with the hook 8d of the cooling device coupling member 8. When the operation of pushing in the cooling device 1 is stopped in this state, the cooling device coupling member 8 is locked by the clamp movable pin 12a and the hook 8d, and the heat receiving integrated pump 2 is loaded with a predetermined load via the coil spring 8c which is an elastic member. It will be in the state pressed against the upper surface.

  Therefore, the load for pressing the heat receiving integrated pump 2 against the upper surface of the CPU 10 can be arbitrarily set and adjusted by changing the spring constant of the coil spring 8 c, and the side surface of the cooling device 1 is guided by the guide 11. Since it is held and fixed in a state in which the position is regulated in a direction parallel to the substrate 9 by being inscribed in the surface, a uniform pressing force can be obtained without positional fluctuation, and the upper surface of the heat receiving surface 2a of the cooling device 1 and the CPU 10 can be obtained. The parallelism is maintained, the contact state between the two is stable, the thermal connection state is good, and the cooling performance is improved. It can also absorb vibrations during transportation.

  Next, a method of removing the cooling device 1 after mounting it as described above will be described with reference to FIG. The removal may basically be performed in the reverse order of the mounting procedure described above. First, the cooling device 1 is pressed against the substrate 9 to a position where the clamp movable pin 12a can release the hooked state of the hook 8d, and the clamp movable pins 12a and the clamp movable side plates 12b on both sides are opened outward as indicated by broken lines in FIG. When the pressing of the cooling device 1 is stopped, the state returns to the state of FIG. When one clamp movable side plate 12b is further pushed open from this state as shown in FIG. 7, the clamp movable side plate convex portion 12c pushes up the heat receiving integrated pump side surface convex portion 2b by the principle of scissors around the clamp fixing pin 12d. For this reason, even if the cooling device 1 is firmly fixed to the CPU 10 by the thermal interface applied to the surface of the CPU 10, it can be easily removed. When the bottom surface of the heat receiving integrated pump 2 is directly pushed up by the clamp movable side plate convex portion 12c, the heat receiving integrated pump side surface convex portion 2b is not necessary, and the heat receiving integrated pump side surface convex portion 2b can be appropriately installed.

  In the present invention, the heat receiving body and the heat radiating body are configured separately, and the entire cooling device that cools the heat radiating body with a fan or radiates the heat from the heat generating body to the radiator side while circulating the liquid refrigerant. Or it can apply as a fixing device which fixes only the one part component.

  Further, the mechanism for holding and fixing the cooling device according to the present invention is not limited to the configuration of the first embodiment, and the workability for mounting the cooling device and the fixing and holding strength of the cooling device itself are not limited. If is suitable, another form may be used.

  The present invention can be applied to a cooling device for cooling a heat generating electronic component disposed on a substrate while circulating a liquid refrigerant, and an electronic apparatus including the same.

Whole side view which shows the mounting state of the fixing device of the cooling device in Embodiment 1 of this invention The upper perspective view of the cooling device attached to the cooling device coupling member in Embodiment 1 of this invention The lower perspective view of the cooling device attached to the cooling device coupling member in Embodiment 1 of this invention The side view which shows the positional relationship before cooling device mounting | wearing with the fixing device of the cooling device in Embodiment 1 of this invention. Explanatory drawing of the clamp part just before pressing the cooling device in Embodiment 1 of this invention to a board | substrate direction. Explanatory drawing of the clamp part immediately after pressing the cooling device in Embodiment 1 of this invention to a board | substrate direction. Explanatory drawing of the movable member of the clamp part at the time of removing the cooling device in Embodiment 1 of this invention The figure which shows the fixing device of the cooling device of the conventional electronic device

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Cooling device 2 Heat receiving integrated pump 2a Heat receiving surface 2b Heat receiving integrated pump side convex part 3 Radiator 3a Pipe 3b Radiation fin 4 Fan 5 Liquid flow path 6 Reserve tank 7 Air flow path 8 Cooling device coupling member 8a Fixing pin 8b Fixing screw 8c Coil spring 8d Hook 9 Substrate 10 CPU
DESCRIPTION OF SYMBOLS 11 Guide 12 Clamp part 12a Clamp movable pin 12b Clamp movable side board 12c Clamp movable side board convex part 12d Clamp fixing pin 20 Wiring board 21 Keyboard 22 Disk apparatus 23 Display apparatus 24 Metal housing 25 Semiconductor element 26 Heat receiving header 27 Heat radiation header 28 Flexible tube 29 screw

Claims (7)

A cooling device that circulates a liquid refrigerant, removes heat from a heat generating electronic component mounted on a substrate by heat exchange with the liquid refrigerant, and dissipates the deprived heat with a radiator, the liquid refrigerant flowing inside the heat generating electronic component A heat receiving unit for exchanging heat between the heat receiving unit and a heat receiving integrated pump that sends the liquid refrigerant after heat exchanging to the radiator through a circulation path, the heat receiving integrated pump and the radiator being arranged to face each other, and the radiator A cooling device, wherein fans for forcibly cooling the fan are arranged to face each other. The cooling device according to claim 1, wherein an air passage is provided between the fan and the heat receiving integrated pump. The cooling device according to claim 1 or 2, further comprising a cooling device coupling member that couples the heat receiving integrated pump, the radiator, and the fan together. The said cooling device coupling member is arrange | positioned between the said heat receiving integrated pump and the said fan, and the elastic member was provided between this cooling device coupling member and the said heat receiving integrated pump. Cooling system. 5. The cooling device coupling member is disposed between the heat receiving integrated pump and the fan, and the cooling device coupling member is provided with a hook for locking to the substrate. Cooling system. The cooling device according to any one of claims 1 to 5, wherein a reserve tank is disposed adjacent to any side surface of the heat receiving integrated pump, the radiator, or the fan. An electronic apparatus comprising the cooling device according to claim 1, wherein the heat receiving integrated pump of the cooling device is thermally connected to a heat generating electronic component.

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