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JP2006156462A - Surface-mounted light emitting diode - Google Patents

Surface-mounted light emitting diode Download PDF

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Publication number
JP2006156462A
JP2006156462A JP2004340575A JP2004340575A JP2006156462A JP 2006156462 A JP2006156462 A JP 2006156462A JP 2004340575 A JP2004340575 A JP 2004340575A JP 2004340575 A JP2004340575 A JP 2004340575A JP 2006156462 A JP2006156462 A JP 2006156462A
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solder
circuit board
light emitting
emitting diode
external connection
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JP2004340575A
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JP4673610B2 (en
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Yasuki Kuwabara
靖樹 桑原
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Citizen Electronics Co Ltd
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Citizen Electronics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a surface-mounted light emitting diode in which a bonding part with solder can be taken to be sufficiently wide during solder mounting on a mounting substrate such as a mother board, a solder fillet can easily be confirmed, and which is provided with an outer connection electrode. <P>SOLUTION: The surface mounted light emitting diode 21 is provided with a sheet-like circuit board 22 where wiring electrodes 23a and 23b are formed on a surface and the outer connection electrodes 24a and 24b conducted with the wiring electrodes 23a and 23b are formed on a backside, a light emitting element 25 mounted on a center of an upper face of the circuit board 22, and a reflection frame 26 arranged on the circuit board 22 so that it surrounds a periphery of the light emitting element 25. A part of the outer connection electrodes 24a and 24b is recessed in at least the corner of the circuit board 22. The recessed part is formed as solder electrodes 31a and 31c. Thus, an application region of solder 30 is enlarged to a thickness direction of the circuit board 22. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、表面実装型発光ダイオードに係り、特に、マザーボードに実装する際の半田接合を確実に行うための構造を備えた表面実装型発光ダイオードに関するものである。   The present invention relates to a surface-mounted light-emitting diode, and more particularly to a surface-mounted light-emitting diode having a structure for reliably performing solder bonding when mounted on a motherboard.

図７に従来の代表的な表面実装型発光ダイオードの構造を示す（特許文献１参照）。この表面実装型発光ダイオード（発光ダイオード）１は、矩形状のガラスエポキシ基板（基板）２の上面に一対の配線電極３ａ，３ｂ（カソード電極とアノード電極）をパターン形成し、このそれぞれの配線電極３ａ，３ｂ上に発光素子５を実装した後、この発光素子５を囲うようにして反射枠体６が配設された構造となっている。前記配線電極３ａ，３ｂは、基板２の両端部に設けられたスルーホール９ａ，９ｂを通じて裏面側に回り込み、裏面電極４ａ，４ｂがマザーボード８に設けられた図示しないプリント配線部と導通するようになっている。   FIG. 7 shows the structure of a typical conventional surface-mounted light emitting diode (see Patent Document 1). The surface-mount type light emitting diode (light emitting diode) 1 is formed by patterning a pair of wiring electrodes 3a and 3b (cathode electrode and anode electrode) on an upper surface of a rectangular glass epoxy substrate (substrate) 2, and each of these wiring electrodes. After the light emitting element 5 is mounted on 3a and 3b, the reflection frame 6 is disposed so as to surround the light emitting element 5. The wiring electrodes 3a and 3b wrap around to the back side through through holes 9a and 9b provided at both ends of the substrate 2 so that the back side electrodes 4a and 4b are electrically connected to a printed wiring unit (not shown) provided on the mother board 8. It has become.

前記発光素子５は略立方体形状の微小チップであり、下面にＰ電極及びＮ電極からなる一対の素子電極部を有する。この素子電極部は、半田部材を介して前記配線電極３ａ，３ｂに接続される。また、この発光素子５は、保護及び集光作用を持たせるために、半球状の透光性樹脂材１３で封止されている。反射枠体６は、すり鉢状の内周面を有するカップ部７が形成されており、前記発光素子５から発せられる光をカップ部７の内周面で反射させて上方向へ集光させために設けられている。   The light emitting element 5 is a substantially cubic microchip, and has a pair of element electrode portions including a P electrode and an N electrode on the lower surface. This element electrode portion is connected to the wiring electrodes 3a and 3b via a solder member. The light-emitting element 5 is sealed with a hemispherical translucent resin material 13 in order to provide protection and light condensing action. The reflection frame 6 is formed with a cup portion 7 having a mortar-shaped inner peripheral surface, and the light emitted from the light emitting element 5 is reflected by the inner peripheral surface of the cup portion 7 and condensed upward. Is provided.

上記構造の発光ダイオード１は、図７に示したように、裏面電極４ａ，４ｂをマザーボード８に形成されているプリント配線部に載置し、このプリント配線部の上面からスルーホール９ａ，９ｂの側面にかけて半田１０を塗布して導通接合させている。
特開２０００−２６１０４１号公報 As shown in FIG. 7, the light emitting diode 1 having the above structure has the back electrodes 4a and 4b mounted on the printed wiring portion formed on the mother board 8, and the through holes 9a and 9b are formed from the upper surface of the printed wiring portion. Solder 10 is applied to the side surface to conduct conduction.
JP 2000-261041 A

しかしながら、上記従来例のようなスルーホール９ａ，９ｂの側面に半田１０を塗布してマザーボード８上のプリント配線部と接合させるような構造にあっては、スルーホール９ａ，９ｂにおける半田１０の塗布スペースが十分とれない場合がある。これは、発光ダイオードの小型化、薄型化に伴って、前記スルーホール９ａ，９ｂの表面スペースが狭くなっているからである。また、半田１０の塗布形状（半田フィレット）１０ａが外部から確認しにくいといった問題もある。   However, in the structure in which the solder 10 is applied to the side surfaces of the through holes 9a and 9b and joined to the printed wiring portion on the mother board 8 as in the conventional example, the solder 10 is applied to the through holes 9a and 9b. There may be insufficient space. This is because the surface space of the through-holes 9a and 9b is narrowed as the light-emitting diode is reduced in size and thickness. There is also a problem that it is difficult to confirm the applied shape (solder fillet) 10a of the solder 10 from the outside.

前記発光素子５や反射枠体６などの直接的に発光の機能に関わる部分に関しては、高輝度化と共に小型化が可能となっているが、これに反して、スルーホール９ａ，９ｂとマザーボード８のプリント配線部に関係する実装部分については、前述したような物理的な制約があるため、コンパクトにしすぎると接合強度が弱くなるといった問題点を有していた。   The portions directly related to the light emitting function such as the light emitting element 5 and the reflection frame 6 can be reduced in size with high brightness. On the other hand, the through holes 9a and 9b and the mother board 8 can be reduced. Since the mounting portion related to the printed wiring portion has the physical restrictions as described above, there is a problem that the bonding strength is weakened if it is made too compact.

また、前記構造の発光ダイオード１を側面発光型として、マザーボード８上に立てて実装する場合にあっては、安定性が悪くなるため、前記スルーホール９ａ，９ｂ及び裏面電極４ａ，４ｂに半田１０を塗布しただけでは十分ではない。このため、反射枠体６を別の接着剤を用いて接合すると共に、電極間同士の導通部分には半田１０の塗布量を多くしなければならず、実装に要する工数やコストが多くかかるといった問題があった。   Further, when the light emitting diode 1 having the above structure is a side light emitting type and mounted on the mother board 8 in a standing manner, the stability is deteriorated, so that the solder 10 is applied to the through holes 9a and 9b and the back electrodes 4a and 4b. It is not enough to just apply. For this reason, the reflective frame 6 must be joined using another adhesive, and the amount of solder 10 applied must be increased at the conductive portion between the electrodes, which requires a lot of man-hours and costs for mounting. There was a problem.

そこで、本発明の目的は、フレキシブルプリント基板等の薄い基板上に半田実装する際に、半田との接合部分を十分広くとることができ、側面実装が可能であると共に、半田フィレットの確認が容易な外部接続電極を備えた表面実装型発光ダイオードを提供することである。   Accordingly, an object of the present invention is to provide a sufficiently wide joint portion with solder when solder mounted on a thin substrate such as a flexible printed circuit board, enabling side mounting and easy confirmation of a solder fillet. It is an object of the present invention to provide a surface mount type light emitting diode having an external connection electrode.

上記課題を解決するために、本発明の表面実装型発光ダイオードは、表面に配線電極、裏面に前記配線電極と導通する外部接続電極が形成された薄板状の回路基板と、この回路基板の上面略中央部に実装される発光素子と、この発光素子の周囲を囲うようにして前記回路基板の上方に配設される反射枠体とを備えた表面実装型発光ダイオードにおいて、前記外部接続電極の一部が回路基板の少なくとも角部において凹設され、該凹設した部分を半田電極部として形成することによって、半田の塗布領域を回路基板の厚み方向に大きくしたことを特徴とする。   In order to solve the above problems, a surface-mounted light-emitting diode according to the present invention comprises a thin circuit board having a wiring electrode on the front surface and an external connection electrode connected to the wiring electrode on the back surface, and an upper surface of the circuit board. A surface-mounted light-emitting diode comprising a light-emitting element mounted at a substantially central portion and a reflection frame body disposed above the circuit board so as to surround the light-emitting element. Part of the circuit board is recessed at least at the corners, and the recessed part is formed as a solder electrode part, whereby the solder application area is increased in the thickness direction of the circuit board.

本発明に係る表面実装型発光ダイオードによれば、マザーボード上に導通接続される外部接続電極が、その一部を凹設して半田電極部として形成しているので、半田を立体的に塗布することができ、導通接合をより確実なものとすることができる。また、前記半田電極部が回路基板の少なくとも角部に設けられているため、前記外部接続電極がマザーボードに対して垂直となるような縦置型の実装形態をとった場合にあっても、半田との導通接合領域を前記半田電極部の厚み分確保することができる。このように、半田による導通接合部の強度が保たれることから、外部からの衝撃や経年変化に伴う半田接合部の劣化が抑えられ、導通不良や断線によって生ずるトラブルを未然に防ぐことができる。   According to the surface-mount type light emitting diode according to the present invention, the external connection electrode that is conductively connected on the motherboard is formed as a solder electrode portion with a part of the external connection electrode, so that the solder is three-dimensionally applied. It is possible to make the conductive bonding more reliable. Further, since the solder electrode portion is provided at least at a corner portion of the circuit board, even when a vertical mounting form in which the external connection electrode is perpendicular to the mother board is employed, This conductive junction region can be secured by the thickness of the solder electrode portion. As described above, the strength of the conductive joint portion due to the solder is maintained, so that deterioration of the solder joint portion due to external impact or aging can be suppressed, and troubles caused by poor conduction or disconnection can be prevented in advance. .

また、前記半田電極部が回路基板の左右両端の外部接続電極に沿って形成された凹溝部にすることで、半田の塗布領域を前記回路基板の幅方向に広がりを持たせることができる。このように、前記外部接続電極を回路基板の上面に平面的に実装した形態にあっても、導通接合の確実性がより高まる。さらに、前記半田電極部における半田フィレットの確認が容易となる。   In addition, by forming the solder electrode portions into recessed groove portions formed along the external connection electrodes on the left and right ends of the circuit board, the solder application region can be widened in the width direction of the circuit board. As described above, even when the external connection electrode is planarly mounted on the upper surface of the circuit board, the reliability of the conductive bonding is further increased. Furthermore, it becomes easy to confirm the solder fillet in the solder electrode portion.

さらに、前記回路基板をフレキシブル基板で構成することによって、前記半田電極部となる凹設部の形成が容易となる。   Furthermore, by forming the circuit board with a flexible substrate, it becomes easy to form the recessed portion to be the solder electrode portion.

以下、添付図面に基づいて本発明に係る表面実装型発光ダイオードの実施形態を詳細に説明する。   Hereinafter, embodiments of a surface-mounted light emitting diode according to the present invention will be described in detail with reference to the accompanying drawings.

図１に示すように、本実施形態の表面実装型発光ダイオード（発光ダイオード）２１は、薄板状の回路基板２２と、この回路基板２２の上面略中央部に載置される発光素子２５と、この発光素子２５を取り囲むようにして前記回路基板２２上に配設される反射枠体２６とを備えた構成になっている。   As shown in FIG. 1, the surface-mounted light-emitting diode (light-emitting diode) 21 of the present embodiment includes a thin circuit board 22, and a light-emitting element 25 mounted on the upper surface of the circuit board 22. A reflection frame 26 is provided on the circuit board 22 so as to surround the light emitting element 25.

前記回路基板２２には、上面に発光素子２５の各素子電極部と導通する一対の配線電極２３ａ，２３ｂ（カソード電極とアノード電極）、下面に前記一対の配線電極２３ａ，２３ｂからスルーホール２９ａ，２９ｂを介してそれぞれ導通する外部接続電極２４ａ，２４ｂが形成されている。また、この回路基板２２には、裏面の四隅において前記外部接続電極２４ａ，２４ｂの一部を上面側に凹設した半田電極部３１ａ〜３１ｄを設けている。本実施形態では、前記回路基板２２にフレキシブル基板を用いており、前記半田電極部３１ａ〜３１ｄとなる凹設箇所は、フレキシブル基板を所定温度に加熱した上で、半田電極部３１ａ〜３１ｄの形状に合わせた金型を用いてプレス加工して成形される。   The circuit board 22 has a pair of wiring electrodes 23a and 23b (cathode electrode and anode electrode) electrically connected to each element electrode portion of the light emitting element 25 on the upper surface, and a through hole 29a from the pair of wiring electrodes 23a and 23b on the lower surface. External connection electrodes 24a and 24b are formed which are respectively conducted through 29b. The circuit board 22 is provided with solder electrode portions 31a to 31d in which the external connection electrodes 24a and 24b are partially recessed on the upper surface side at the four corners of the back surface. In the present embodiment, a flexible substrate is used for the circuit board 22, and the recessed portions to be the solder electrode portions 31 a to 31 d are formed in the shape of the solder electrode portions 31 a to 31 d after the flexible substrate is heated to a predetermined temperature. It is molded by pressing using a mold matched to the above.

前記フレキシブル基板は、ベース部材となる薄いフィルムの表裏面に配線電極等がＣｕでパターン形成され、このＣｕパターン上にＮｉ等のメッキが施されるが、このＮｉメッキを施した後では、半田電極部３１ａ〜３１ｄを形成するためのプレス加工が困難になる場合がある。そこで、本実施形態で使用するフレキシブル基板にあっては、フィルム上にＣｕパターンを形成した後、加熱条件の下で先にプレス加工を行う。これによって、約０．５ｍｍ程度の凹設が可能となる。そして、このプレス加工が終了した後、前記Ｃｕパターン上にＮｉメッキあるいはＮｉにＡｕまたはＡｇを加えたメッキを施して形成する。   In the flexible substrate, wiring electrodes and the like are patterned with Cu on the front and back surfaces of a thin film serving as a base member, and Ni or the like is plated on the Cu pattern. Press processing for forming the electrode portions 31a to 31d may be difficult. Therefore, in the flexible substrate used in the present embodiment, after a Cu pattern is formed on the film, press processing is first performed under heating conditions. As a result, a recess of about 0.5 mm can be provided. Then, after this press working is finished, the Cu pattern is formed by applying Ni plating or plating obtained by adding Au or Ag to Ni.

前記発光素子２５は、略立方体形状の微小チップであり、下面に備わる一対の素子電極部（Ｐ電極とＮ電極）が前記配線電極２３ａ，２３ｂにそれぞれ半田部材を介して表面実装される。この発光素子２５は、窒化ガリウム系化合物半導体の発光素子、あるいは、４元系の発光素子で構成される。   The light emitting element 25 is a substantially cubic microchip, and a pair of element electrode portions (P electrode and N electrode) provided on the lower surface are surface-mounted on the wiring electrodes 23a and 23b via solder members, respectively. The light emitting element 25 is composed of a gallium nitride compound semiconductor light emitting element or a quaternary light emitting element.

前記反射枠体２６は、前記回路基板２２と略同じ大きさで一定の厚みを有した立方形状の枠部２６ａと、この枠部２６ａの内部をすり鉢状に刳り貫いたカップ部２７とで構成されている。前記枠部２６ａはポリフタルアミド、液晶ポリマー等の樹脂材で形成され、カップ部２７の内周面には高反射率を有する金属膜が蒸着等によって形成される。この反射枠体２６は、カップ部２７の底部に発光素子２５が露出するようにして回路基板２２上に載置され、絶縁性の接着剤を介して接合される。また、前記発光素子２５は、集光性を持たせるための透光性樹脂材３３によって半球状に封止されると共に、前記カップ部２７内には、前記発光素子２５及び配線電極２３ａ，２３ｂの接合部分を保護するための透光性を備えた封止樹脂材２８が塗布される。なお、この反射枠体２６には、回路基板２２の四隅に設けた半田電極部３１ａ〜３１ｄによる突出部分を逃げて回路基板２２上に密着させるための凹設加工が施される。   The reflection frame 26 is composed of a cubic frame portion 26a having substantially the same size as the circuit board 22 and a certain thickness, and a cup portion 27 penetrating the inside of the frame portion 26a in a mortar shape. Has been. The frame portion 26a is formed of a resin material such as polyphthalamide or liquid crystal polymer, and a metal film having a high reflectance is formed on the inner peripheral surface of the cup portion 27 by vapor deposition or the like. The reflection frame 26 is placed on the circuit board 22 so that the light emitting element 25 is exposed at the bottom of the cup portion 27, and is joined via an insulating adhesive. The light emitting element 25 is sealed in a hemispherical shape by a translucent resin material 33 for providing light collecting properties, and the light emitting element 25 and the wiring electrodes 23a and 23b are disposed in the cup portion 27. A sealing resin material 28 having translucency for protecting the joint portion is applied. The reflective frame body 26 is subjected to a recessing process for allowing the protruding portions of the solder electrode portions 31 a to 31 d provided at the four corners of the circuit board 22 to escape and adhere to the circuit board 22.

図２は、上記発光ダイオード２１を側面発光型の光源として使用するための縦置き実装形態を示したものである。回路基板２２の裏面には、カソード側の外部接続電極２４ａとアノード側の外部接続電極２４ｂとが対向して形成され、前記外部接続電極２４ａ，２４ｂにはそれぞれ２つずつの半田電極部３１ａ，３１ｂ及び半田電極部３１ｃ，３１ｄが角部に形成されている。この実装形態では、前記反射枠体２６の一側面をマザーボード３２上に載置し、このマザーボード３２と接する側の外部接続電極２４ａ，２４ｂの半田電極部３１ａ，３１ｃに半田３０をそれぞれ塗布させた半田フィレット３０ａを形成して導通接続を図っている。なお、この実施形態の発光ダイオード２１は、カソード側及びアノード側の外部接続電極２４ａ，２４ｂが左右対称であり、また、半田電極部３１ａ，３１ｂと半田電極部３１ｃ，３１ｄとが回路基板２２の角部において対称になっている。このため、半田電極部３１ｂ，３１ｄの方をマザーボード３２に実装することもできる。   FIG. 2 shows a vertical mounting form for using the light-emitting diode 21 as a side-emitting light source. On the back surface of the circuit board 22, an external connection electrode 24a on the cathode side and an external connection electrode 24b on the anode side are formed to face each other, and two external electrode electrodes 24a and 24b have two solder electrode portions 31a and 31a, respectively. 31b and solder electrode portions 31c and 31d are formed at the corners. In this mounting form, one side surface of the reflection frame 26 is placed on the mother board 32, and the solder 30 is applied to the solder electrode portions 31a and 31c of the external connection electrodes 24a and 24b on the side in contact with the mother board 32, respectively. A solder fillet 30a is formed for conducting connection. In the light-emitting diode 21 of this embodiment, the cathode-side and anode-side external connection electrodes 24 a and 24 b are symmetrical, and the solder electrode portions 31 a and 31 b and the solder electrode portions 31 c and 31 d are formed on the circuit board 22. Symmetrical at the corners. Therefore, the solder electrode portions 31 b and 31 d can be mounted on the mother board 32.

また、前記発光ダイオード２１は、上面発光型の光源として使用することもできる。この場合には、図３に示したように、外部接続電極２４ａ，２４ｂをマザーボード３２上のプリント配線部に合わせて平面載置し、半田電極部３１ａ〜３１ｄに半田３０を塗布して半田フィレット３０ａを形成する。このような横置き実装形態によれば、前記半田フィレット３０ａを半田電極部３１ａ〜３１ｄの４箇所に設けることができるので、より確実な導通接合を図ることが可能となる。また、前記半田電極部３１ａ〜３１ｄを設けたことによって、導通不要な箇所への半田３０の流出を抑えることができる。   The light emitting diode 21 can also be used as a top-emitting light source. In this case, as shown in FIG. 3, the external connection electrodes 24a and 24b are placed on the plane in alignment with the printed wiring portion on the mother board 32, and the solder 30 is applied to the solder electrode portions 31a to 31d. 30a is formed. According to such a horizontally mounted form, the solder fillet 30a can be provided at four locations of the solder electrode portions 31a to 31d, so that more reliable conductive bonding can be achieved. Further, by providing the solder electrode portions 31a to 31d, it is possible to suppress the outflow of the solder 30 to a place where conduction is unnecessary.

前述したように、発光ダイオード２１を縦置き実装する場合は、外部接続電極２４ａ，２４ｂとマザーボード３２との接触面が限定されるが、凹設された半田電極部３１ａ〜３１ｄを設けたことによって、導通接合面が広がると共に、半田３０の塗布量を多くした場合でも周囲にはみ出したりすることがない。これは、横置き実装する場合においても同様である。これによって、縦置きあるいは横置きのいずれの場合にあっても、導通接続をより確実且つ安定した状態で行うことができる。また、半田３０の広がりを抑えることができるので、ショート等を有効に防止することができる。   As described above, when the light emitting diode 21 is mounted vertically, the contact surface between the external connection electrodes 24a and 24b and the mother board 32 is limited, but by providing the recessed solder electrode portions 31a to 31d. In addition, the conductive bonding surface is widened, and even when the amount of the solder 30 applied is increased, it does not protrude to the periphery. The same applies to the case of horizontal mounting. As a result, the conductive connection can be performed in a more reliable and stable state regardless of whether the device is placed vertically or horizontally. Moreover, since the spread of the solder 30 can be suppressed, a short circuit or the like can be effectively prevented.

上記実施形態の発光ダイオード２１では、半田電極部３１ａ〜３１ｄを回路基板２２の裏面の四隅に形成したが、これに限定されることはなく、図４に示す発光ダイオード４１のように、外部接続電極４４ａ，４４ｂの幅方向に沿って延びる断面Ｌ字状の長溝による半田電極部５１ａ，５１ｂを形成してもよい。このような長溝状の半田電極部５１ａ，５１ｂを設けることによって、マザーボード３２との半田３０による接合部を広げることができるので、導通がより一層確実なものとなる。また、図３に示した縦置き実装においては、半田３０を半田電極部５１ａ，５１ｂに沿って高さ方向に厚く塗布することができる。   In the light emitting diode 21 of the above embodiment, the solder electrode portions 31a to 31d are formed at the four corners on the back surface of the circuit board 22, but the present invention is not limited to this, and external connection is possible as in the light emitting diode 41 shown in FIG. Solder electrode portions 51a and 51b having long grooves having an L-shaped cross section extending along the width direction of the electrodes 44a and 44b may be formed. By providing such long groove-shaped solder electrode portions 51a and 51b, the joint portion by the solder 30 with the mother board 32 can be widened, so that conduction is further ensured. Further, in the vertical mounting shown in FIG. 3, the solder 30 can be thickly applied in the height direction along the solder electrode portions 51a and 51b.

次に、上記図１及び図２に示した構造からなる発光ダイオード２１の製造方法について説明する。この発光ダイオード２１の製造においては、図５に示すように、個々の回路基板２２が複数一括して切り出し可能な集合フレキシブル基板（集合ＦＰＣ）６１が用いられる。この集合ＦＰＣ６１には、一つの升目が前記回路基板２２のＸ幅及びＹ幅となるように、複数のＸ軸切断ライン（Ｘ０，Ｘ１，・・・Ｘｎ）及びＹ軸切断ライン（Ｙ０，Ｙ１，・・・Ｙｎ）が設定されている。この集合ＦＰＣ６１に対して、最初に半田電極部３１ａ〜３１ｄとなる凹部６３を複数形成する。この凹部６３は、前記Ｘ軸切断ライン及びＹ軸切断ラインの各交点を中心にして、図６に示すように、集合ＦＰＣ６１の裏面から円形状にプレス加工して形成される。このプレス加工は、専用の金型を使用し、集合ＦＰＣ６１を加熱した状態で行われる。このようにして、凹部６３が複数形成された集合ＦＰＣ６１の各升目（回路基板２２）の中心部に発光素子２５を半田部材によって表面接合する。次に、前記集合ＦＰＣ６１の上面に前記個々の反射枠体２６が集合した集合反射枠体６２を絶縁性接着剤によって接合する。なお、この集合反射枠体６２は別工程においてカップ部２７等が予め形成される。最後に前記集合ＦＰＣ６１及び集合反射枠体６２をＸ軸切断ライン及びＹ軸切断ラインに沿ってダイシングすることで、図１に示したような単一の発光ダイオード２１が完成する。   Next, a method for manufacturing the light emitting diode 21 having the structure shown in FIGS. 1 and 2 will be described. In manufacturing the light emitting diode 21, as shown in FIG. 5, a collective flexible board (set FPC) 61 on which a plurality of individual circuit boards 22 can be cut out at once is used. In this set FPC 61, a plurality of X-axis cutting lines (X0, X1,... Xn) and Y-axis cutting lines (Y0, Y1) are set so that one grid is the X width and Y width of the circuit board 22. ,... Yn) are set. First, a plurality of recesses 63 to be the solder electrode portions 31a to 31d are formed in the collective FPC 61. The recess 63 is formed by pressing from the back surface of the collective FPC 61 into a circular shape with the intersections of the X-axis cutting line and the Y-axis cutting line as the center, as shown in FIG. This press work is performed in a state where the collective FPC 61 is heated using a dedicated die. In this way, the light emitting element 25 is surface-bonded to the central portion of each cell (circuit board 22) of the aggregate FPC 61 in which a plurality of concave portions 63 are formed by the solder member. Next, the collective reflecting frame 62 in which the individual reflecting frames 26 are gathered is joined to the upper surface of the collective FPC 61 with an insulating adhesive. The collective reflection frame 62 is previously formed with a cup portion 27 and the like in a separate process. Finally, the collective FPC 61 and the collective reflecting frame 62 are diced along the X-axis cutting line and the Y-axis cutting line, thereby completing the single light emitting diode 21 as shown in FIG.

なお、図４に示した長溝状の半田電極部５１ａ，５１ｂを備えた発光ダイオード４１については、前記集合ＦＰＣ６１に形成する凹部６３をＸ軸切断ラインあるいはＹ軸切断ラインの中心線に沿って所定幅プレスすることによって形成することができる。後の工程は同様であるので説明は省略する。   For the light emitting diode 41 having the long groove-like solder electrode portions 51a and 51b shown in FIG. 4, the concave portion 63 formed in the aggregate FPC 61 is predetermined along the center line of the X-axis cutting line or the Y-axis cutting line. It can be formed by width pressing. Since the subsequent steps are the same, description thereof is omitted.

以上説明したように、本発明の表面実装型発光ダイオードでは、回路基板の外部接続電極の一部に半田電極部を凹設形成しているので、上面発光型に対応した横置き、側面発光型に対応した縦置きのいずれの実装形態においても、半田を介した導通接合面を広く設定することができる。このため、自動車等の使用条件耐用条件の厳しい箇所においても搭載可能な高信頼性を備えた発光ダイオードを提供することができる。また、前記回路基板にフレキシブル基板を採用することによって、半田電極部の加工を最初の基板形成工程で一括して行うことができることから製品単価を低く抑えることができる。   As described above, in the surface mount type light emitting diode of the present invention, the solder electrode portion is formed in a concave portion on the external connection electrode of the circuit board. In any of the vertically mounted forms corresponding to the above, the conductive joint surface through the solder can be set widely. For this reason, the light emitting diode provided with the high reliability which can be mounted even in the location where use condition durability conditions, such as a motor vehicle, are severe can be provided. In addition, by adopting a flexible substrate as the circuit substrate, the processing of the solder electrode portion can be performed at a time in the first substrate formation step, so that the product unit price can be kept low.

本発明に係る表面実装型発光ダイオードの構成を示す断面図である。It is sectional drawing which shows the structure of the surface mount type light emitting diode which concerns on this invention. 上記表面実装型発光ダイオードの縦置き実装形態を示す斜視図である。It is a perspective view which shows the vertical mounting form of the said surface mount type light emitting diode. 上記表面実装型発光ダイオードの横置き実装形態を示す断面図である。It is sectional drawing which shows the horizontal mounting form of the said surface mount type light emitting diode. 他の実施形態における表面実装型発光ダイオードの実装形態を示す斜視図である。It is a perspective view which shows the mounting form of the surface mount type light emitting diode in other embodiment. 表面実装型発光ダイオードを複数形成した集合フレキシブル基板の平面図である。It is a top view of the collective flexible substrate which formed multiple surface mount type light emitting diodes. 前記集合フレキシブル基板に複数形成された表面実装型発光ダイオードの断面図である。FIG. 4 is a cross-sectional view of a plurality of surface-mounted light emitting diodes formed on the assembly flexible substrate. 従来の表面実装型発光ダイオードの構成を示す断面図である。It is sectional drawing which shows the structure of the conventional surface mount type light emitting diode.

符号の説明Explanation of symbols

２１ 発光ダイオード
２２ 回路基板（フレキシブル基板）
２３ａ 配線電極（カソード）
２３ｂ 配線電極（アノード）
２４ａ 外部接続電極
２４ｂ 外部接続電極
２５ 発光素子
２６ 反射枠体
２６ａ 枠部
２７ カップ部
２８ 封止樹脂材
２９ａ スルーホール
２９ｂ スルーホール
３０ 半田
３０ａ 半田フィレット
３１ａ〜３１ｄ 半田電極部
３２ マザーボード
３３ 透光性樹脂材
21 Light-emitting diode 22 Circuit board (flexible board)
23a Wiring electrode (cathode)
23b Wiring electrode (anode)
24a External connection electrode 24b External connection electrode 25 Light emitting element 26 Reflective frame body 26a Frame portion 27 Cup portion 28 Sealing resin material 29a Through hole 29b Through hole 30 Solder 30a Solder fillet 31a to 31d Solder electrode portion 32 Motherboard 33 Translucent resin Material

Claims (5)

表面に配線電極、裏面に前記配線電極と導通する外部接続電極が形成された薄板状の回路基板と、この回路基板の上面略中央部に実装される発光素子と、この発光素子の周囲を囲うようにして前記回路基板の上方に配設される反射枠体とを備えた表面実装型発光ダイオードにおいて、
前記外部接続電極の一部が回路基板の少なくとも角部において凹設され、該凹設した部分を半田電極部として形成することによって、半田の塗布領域を回路基板の厚み方向に大きくしたことを特徴とする表面実装型発光ダイオード。 A thin circuit board on which wiring electrodes are formed on the front surface and external connection electrodes that are electrically connected to the wiring electrodes are formed on the back surface, a light-emitting element mounted at a substantially central portion on the upper surface of the circuit board, and surrounding the light-emitting element Thus, in the surface-mounted light emitting diode provided with a reflective frame disposed above the circuit board,
A part of the external connection electrode is recessed at least at a corner portion of the circuit board, and the recessed portion is formed as a solder electrode portion, thereby increasing the solder application area in the thickness direction of the circuit board. Surface mount type light emitting diode. 前記回路基板は、前記配線電極及び外部接続電極が表裏面にそれぞれ形成されたフレキシブル基板である請求項１記載の表面実装型発光ダイオード。 The surface-mount light-emitting diode according to claim 1, wherein the circuit board is a flexible board on which the wiring electrodes and the external connection electrodes are formed on the front and back surfaces, respectively. 前記半田電極部が、前記外部接続電極の一部を回路基板の裏面側からプレス加工して形成される請求項１記載の表面実装型発光ダイオード。 The surface-mount light-emitting diode according to claim 1, wherein the solder electrode portion is formed by pressing a part of the external connection electrode from the back side of the circuit board. 前記半田電極部が、前記外部接続電極の四隅に形成されている請求項１または３記載の表面実装型発光ダイオード。 4. The surface mount light emitting diode according to claim 1, wherein the solder electrode portions are formed at four corners of the external connection electrode. 前記半田電極部が、回路基板の左右両端に沿って外部接続電極に凹溝部を形成した請求項１または３記載の表面実装型発光ダイオード。 The surface-mount type light emitting diode according to claim 1 or 3, wherein the solder electrode portion has a concave groove portion formed in the external connection electrode along both left and right ends of the circuit board.
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