JP2006148473A - Camera module and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve work efficiency at the time of assembling a lens, an optical filter, an imaging device and a substrate constituting a camera module and to improve the dust-proofness of the imaging device. <P>SOLUTION: For the camera module 30, on the lower surface side of a substrate 32, a lower side resin mold 46 for which a resin material is molded so as to cover an IC 40 for control, a bonding wire 41 and a flexible cable 44 is formed. Also, on the upper surface side of the substrate 32, an upper side resin mold 48 for which the resin material is molded so as to cover the edge part of the imaging device 34, a bonding wire 36 and a wiring pattern 38 is formed. Then, the lower side resin mold 46 and the upper side resin mold 48 are integrally connected through a side face resin mold 49 molded so as to cover the side face of the substrate 32. To the upper end 48a of the upper side resin mold 48, a lens holding member 52 for holding the lenses 50 and 51 is fixed. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a camera module and a manufacturing method thereof, and more particularly to a camera module configured to improve work efficiency when assembling a lens, an optical filter, an imaging device, and a substrate, and to improve dustproofness of the imaging device, and a manufacturing method thereof. About.

  For example, a camera module mounted on a mobile phone or the like is required to be reduced in size and thickness, and also required to improve production efficiency and dustproofness of an image sensor.

  As a conventional camera module, for example, there is one configured as shown in FIG. The camera module shown in FIG. 1 has a control IC 12 and an image sensor 14 made of a CCD (Charge Coupled Device), CMOS, or the like mounted on a substrate 10, a lens barrel 16 bonded on the substrate 10, and a lens barrel. 16 comprises a lens 18 and an optical filter 20 held inside.

  The terminals of the control IC 12 and the image sensor 14 are connected to the wiring pattern of the substrate 10 via bonding wires 22, and the lens barrel 16 is bonded onto the substrate 10 so as to cover the periphery of the control IC 12 and the image sensor 14. Is done.

In addition to the above, there is a configuration in which a control circuit is provided on the lower surface of the substrate and the lower surface of the substrate is resin-molded (see, for example, Patent Document 1).
JP 2003-264274 A

  However, in the conventional camera module shown in FIG. 1, it takes time to assemble and align the lens barrel 16, and it is difficult to seal the lower end portion of the lens barrel 16 and the substrate 10 with an adhesive. There is a possibility that moisture may enter the inside of the lens barrel 16, and there is a problem that each terminal, the bonding wire 22, and the solder deteriorate due to the moisture.

  Furthermore, in the conventional device, since the terminals of the control IC 12 and the image pickup device 14 are exposed inside the lens barrel 16, when the metal piece is peeled off, it may adhere to the image pickup surface of the image pickup device. It is also the cause of the occurrence.

  In addition, since the conventional one has a weak adhesive strength of the lens barrel 16, when the acceleration due to the impact is applied, the lens barrel 16 is wobbled and the lens 18 may not be stably held.

  Further, in the camera module disclosed in the above cited reference 1, the lower surface side of the substrate is resin-molded, but the imaging element and the lens provided on the substrate are housed inside the lens barrel, and the lens barrel is assembled. In addition, since each terminal of the image sensor is exposed inside the lens barrel, there are problems similar to those of the conventional one.

  Accordingly, an object of the present invention is to provide a camera module and a method for manufacturing the same that solve the above-described problems.

  In order to solve the above problems, the present invention has the following features.

The invention described in claim 1 is a camera module having an image pickup device provided on a substrate, a lens provided at a position of a predetermined focal length from the image pickup device, and an optical filter that transmits light from the lens. In
The lower surface of the substrate, between the upper surface of the substrate and the edge of the image sensor, and the support portion for supporting the lens at a predetermined position are integrally formed of a resin material.

  The invention according to claim 2 is characterized in that the support portion has an imaging space that communicates between the lens and the imaging surface of the imaging element.

  The invention described in claim 3 is characterized in that the imaging space has an optical filter holding section for holding the optical filter therein.

  The invention according to claim 4 is characterized in that the support portion is formed so that an inner wall of the imaging space surrounds the outer periphery of the lens, and an upper end is sealed by a lens holding member that holds the lens. Is.

  The invention described in claim 5 is characterized in that a control circuit for controlling the image sensor is provided on the lower surface of the substrate.

According to a sixth aspect of the present invention, there is provided a camera module comprising: an image sensor provided on a substrate; a lens provided at a position with a predetermined focal length from the image sensor; and an optical filter that transmits light from the lens. In the manufacturing method of
Molding the lower surface of the substrate with a resin material;
Molding a support portion between the upper surface of the substrate and the edge of the image sensor and supporting the lens at a predetermined position with a resin material;
Attaching an optical filter inside the support;
And a step of inserting the lens into the inside of the supporting portion and sealing the inside of the supporting portion by bonding a holding portion of the lens to an upper end of the supporting portion. Is the method.

The invention according to claim 7 is a step of providing a plurality of image sensors on a substrate;
Connecting each terminal of the image sensor and the wiring pattern on the substrate by wire bonding;
Molding the lower surface of the substrate with a resin material;
A step of integrally molding a support portion between the upper surface of the substrate and the edge of the image sensor and supporting the lens at a predetermined position with a resin material;
Cutting the resin molded portion along the boundary lines of the plurality of image sensors to separate the image sensors;
Attaching an optical filter inside the support;
And a step of inserting the lens into the inside of the supporting portion and sealing the inside of the supporting portion by bonding a holding portion of the lens to an upper end of the supporting portion. Is the method.

  According to the present invention, the lower surface of the substrate, the upper surface of the substrate and the edge of the image sensor, and the support portion that supports the lens at a predetermined position are integrally formed of the resin material, so that the assembly work efficiency can be improved and the imaging can be performed. The airtightness around the element is increased, moisture can be prevented from entering, the connection portion between the image sensor terminal and the substrate can be prevented from deteriorating, and the occurrence of defects due to peeling of the metal piece from the solder connection portion can also be prevented. Further, by surrounding the image pickup element with a resin mold, there is no wobbling due to impact, and impact resistance is improved. Further, by molding the solder connection portion with a resin material, it can be used even in a temperature environment higher than the melting point of the solder, and the heat resistance can be further improved.

  In addition, according to the present invention, since the support portion has an imaging space that communicates between the lens and the imaging surface of the image sensor, the support portion functions as a lens barrel, and the lens barrel is attached as in the conventional case. Therefore, the bonding work and the position adjusting work are not required, and the efficiency of the assembling work can be increased.

  In addition, according to the present invention, since the optical filter holding unit that holds the optical filter is provided inside the imaging space, the optical filter can be easily attached.

  Further, according to the present invention, the inner wall of the imaging space of the support portion is formed so as to surround the outer periphery of the lens, and the upper end is sealed by the lens holding member that holds the lens, so that the inside of the imaging space is easily sealed. be able to.

  Further, according to the present invention, since the control circuit for controlling the image sensor is provided on the lower surface of the substrate, the number of components arranged on the substrate is reduced correspondingly, and the height of the support portion is reduced. It is possible to cope with thinning.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

  FIG. 2 is a longitudinal sectional view showing Embodiment 1 of the camera module according to the present invention. As shown in FIG. 2, in the camera module 30, an image sensor 34 (for example, CCD or CMOS) is fixed to a substrate 32, and each terminal provided on the edge of the image sensor 34 is connected via a bonding wire 36. It is connected to the wiring pattern 38 on the substrate 32. A control IC 40 for controlling the image sensor 34 is fixed to the lower surface of the substrate 32, and each terminal of the control IC 40 is connected to the wiring pattern 42 on the lower surface of the substrate 32 through bonding wires 41.

  Further, the flexible cable 44 is soldered to the external terminal 45 on the lower surface of the substrate 32 on the lower surface of the substrate 32. In addition, although the board | substrate 32 of a present Example has the structure on which the three board | substrates were piled up, it is not restricted to this, It is good also considering the number of boards as less than three.

  On the lower surface side of the substrate 32, a lower resin mold 46 is formed by molding a resin material so as to cover the control IC 40, the bonding wire 41, and the flexible cable 44. Further, on the upper surface side of the substrate 32, an upper resin mold 48 is formed by molding a resin material so as to cover the edge of the imaging element 34, the bonding wire 36, and the wiring pattern 38. The lower resin mold 46 and the upper resin mold 48 are integrally coupled via a side resin mold 49 molded so as to cover the side surface of the substrate 32.

  A lens holding member 52 that holds the lenses 50 and 51 is fixed to the upper end 48 a of the upper resin mold 48. In other words, the upper resin mold 48 covers the upper surface of the substrate 32 and the edge of the imaging device 34, and also functions as a lens support portion for positioning the height positions of the lenses 50 and 51 from the upper surface of the substrate 32 by a predetermined height. Formed.

  The lens holding member 52 includes a cylindrical portion 52a that holds the lenses 50 and 51, and a flange portion 52b that is formed to extend in the radial direction from the cylindrical portion 52a. The lens holding member 52 has a flange portion 52 b bonded to the upper end 48 a of the upper resin mold 48 with an adhesive 54. Therefore, the lens 50 is positioned at a predetermined mounting position having a focal length with respect to the imaging surface 34 a of the imaging element 34 by the height position of the upper resin mold 48.

  An imaging space 56 that communicates between the upper resin mold 48 and the lens 50 is formed in the upper resin mold 48, and an optical for fixing the optical filter 58 is formed in the imaging space 56. A filter mounting surface 48b is provided. The optical filter 58 is, for example, an IR filter that absorbs visible light and transmits infrared light.

  An imaging space 56 formed inside the upper resin mold 48 is a lens housing space into which the lens 50 is inserted, and an inner wall 48c of the upper resin mold 48 surrounding the imaging space 56 functions as a lens barrel. The imaging space 56 is sealed by the lens holding member 52, and is kept in a sealed state so that dust and moisture from the outside do not enter.

  In addition, since the lens holding member 52 can take the adhesion area of the collar part 52b large, it can hold | maintain the lenses 50 and 51 stably, without wobbling with respect to the upper side resin mold 48. FIG.

  Thus, in the camera module 30, the lower surface side of the substrate 32 is covered with the lower resin mold 46, the upper surface side of the substrate 32 is covered with the upper resin mold 48, and the flange portion 52 b of the lens holding member 52 is the upper resin mold 48. Therefore, the number of parts that require assembling work is smaller than in the prior art, and the assembling work efficiency can be increased accordingly. Further, the airtightness and dustproofness around the image pickup device 34 are enhanced, the penetration of moisture and dust can be prevented, the deterioration of the connection portion between the terminal of the image pickup device 34 and the substrate 32 can be prevented, and the metal from the solder connection portion can be prevented. It is also possible to prevent the occurrence of defects due to peeling of pieces. Further, by surrounding the image pickup element 34 with a resin material, it is possible to improve impact resistance without wobbling due to impact.

  The lower resin mold 46 and the upper resin mold 48 endure up to about 300 ° C. with respect to the melting point of the solder (about 260 ° C. in the case of no lead), so the solder of each terminal of the imaging device 34 and the control IC 40 It becomes possible to further improve the heat resistance of the attachment portion. Therefore, the camera module 30 can stably capture an image even in a high temperature environment, and for example, can improve reliability when used in a place where direct sunlight is irradiated.

  Here, a method for manufacturing the camera module 30 will be described with reference to FIGS.

  As shown in FIG. 3, in step 1, a large substrate 60 is provided with elongated slits 64 to define a plurality (eight in FIG. 3) of substrate regions 62 on which the substrate 32 is formed. The elongated slit 64 is provided so as to be located at the boundary between the substrate regions 62. Further, a resin material is injected into the groove of the slit 64 to form a side resin mold 49. A wiring pattern 38 is provided on the upper surface of each substrate region 62 so as to surround the periphery of the mounting position of the image sensor 34.

  As shown in FIG. 4, in step 2, a wiring pattern 42 is provided on the lower surface of each substrate region 62 so as to surround the periphery of the mounting position of the control IC 40.

  As shown in FIG. 5, in step 3, an electronic component 66 such as a capacitor is soldered to the wiring pattern 42.

  As shown in FIG. 6, in step 4, the control IC 40 is fixed to the lower surface of each substrate region 62, and each terminal of the control IC 40 and the wiring pattern 42 are connected by the bonding wire 41. Further, the flexible cable 44 is soldered to the external terminal 45 on the lower surface of the substrate 32.

  As shown in FIG. 7, in step 5, the entire lower surface side of each substrate region 62 is integrally molded with a resin material, and the lower resin mold 46 is formed of the control IC 40, the bonding wire 41, the wiring pattern 42, and the flexible cable 44. Mold to cover the end. The lower resin mold 46 is molded so as to fill the slit 64.

  As shown in FIG. 8, in step 6, the image sensor 34 is fixed to the upper surface of each substrate region 62, and each terminal of the image sensor 34 and the wiring pattern 38 are connected by a bonding wire 36.

  As shown in FIGS. 9 and 10, in step 7, the upper surface side of each substrate region 62 is integrally molded with a resin material, and the upper resin mold 48 is covered with the imaging element 34, the bonding wire 36, and the wiring pattern 38. Mold. Thereby, the upper resin mold 48 and the lower resin mold 46 are integrated via the side resin mold 49.

  As shown in FIG. 11, in step 8, the lower resin mold 46 and the upper resin mold 48 are cut along the slit 64. Thereby, two camera modules 30 are obtained as one unit.

  As shown in FIG. 12, in step 9, the middle portion of the unit shown in FIG. 11 is cut to obtain one camera module 30.

  As shown in FIG. 13, in step 10, the optical filter 58 is inserted into the imaging space 56 of the upper resin mold 48 and fixed to the optical filter mounting surface 48 b described above.

  As shown in FIG. 14, in step 11, the flange portion 52 b of the lens holding member 52 is bonded to the upper end 48 a of the upper resin mold 48. Thus, the camera module 30 shown in FIG. 2 is completed.

  Thus, since a plurality of (eight in this embodiment) camera modules 30 can be resin-molded from the substrate 60, they can be efficiently produced, which is advantageous in mass production.

  FIG. 15A is a longitudinal sectional view showing a camera module according to a second embodiment, and FIG. 15B is a view of an external terminal of the camera module as viewed from below. In FIGS. 15A and 15B, the same parts as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  As shown in FIGS. 15A and 15B, in the camera module 70, the lower resin mold 46 is molded so as to expose the external terminals 45 formed on the lower surface of the substrate 32. For this reason, the flexible cable 44 is not connected to the external terminal 45, and the external terminal 45 is processed into a shape corresponding to a model of a mobile phone (not shown) in which the camera module 70 is incorporated or a shape corresponding to a storage space. The cable can be soldered later.

  FIG. 16A is a longitudinal sectional view showing Embodiment 3 of the camera module, and FIGS. 16B and 16C are views of the external terminals of the camera module as viewed from below. In FIGS. 16A to 16C, the same parts as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  As shown in FIGS. 16A and 16B, the camera module 80 has a solder plating 82 laminated on the surface of the external terminal 62. In the camera module 80, since the solder plating 82 is formed on the external terminal 45, the solderability when soldering the flexible cable is improved.

  As shown in FIG. 16C, the solderability can be improved by providing solder balls 84 on the surface of the external terminals 62.

  FIG. 17A is a longitudinal sectional view showing a camera module according to a fourth embodiment, and FIG. 17B is a view of the external terminals of the camera module as viewed from below. In FIGS. 17A and 17B, the same parts as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  17A and 17B, in the camera module 90, a connector 92 is connected to an external terminal 45 formed on the lower surface of the substrate 32. Therefore, a flexible cable processed into an arbitrary shape according to a shape corresponding to a model of a mobile phone (not shown) in which the camera module 90 is incorporated or a storage space can be easily combined in an assembly process of the mobile phone. It becomes possible.

  In the above-described embodiment, the camera module incorporated in the mobile phone has been described as an example. However, the present invention is not limited to this, and a device other than the mobile phone (for example, a notebook personal computer or a terminal device such as a PDA (Personal Digital Assistant)) Of course, the present invention can also be applied to a camera unit mounted on a security device or the like.

It is a longitudinal cross-sectional view which shows an example of the conventional camera module. It is a longitudinal cross-sectional view which shows Example 1 of the camera module which becomes this invention. 3 is a perspective view showing step 1 of the manufacturing method of the camera module 30. FIG. FIG. 6 is a perspective view showing step 2 of the manufacturing method of the camera module 30. FIG. 6 is a perspective view showing step 3 of the manufacturing method of the camera module 30. 6 is a perspective view showing step 4 of the manufacturing method of the camera module 30. FIG. FIG. 10 is a perspective view showing step 5 of the manufacturing method of the camera module 30. FIG. 10 is a perspective view showing step 6 of the manufacturing method of the camera module 30. It is the perspective view which looked at the process 7 of the manufacturing method of the camera module 30 from upper direction. It is the perspective view which looked at the process 7 of the manufacturing method of the camera module 30 from the downward direction. FIG. 10 is a perspective view showing step 8 of the manufacturing method of the camera module 30. FIG. 10 is a perspective view showing step 9 of the manufacturing method of the camera module 30. FIG. 10 is a perspective view showing step 10 of the manufacturing method of the camera module 30. FIG. 10 is a perspective view showing step 11 of the manufacturing method of the camera module 30. It is a figure which shows Example 2 of a camera module. It is a figure which shows Example 3 of a camera module. It is a figure which shows Example 4 of a camera module.

Explanation of symbols

30, 70, 80, 90 Camera module 32 Substrate 34 Image sensor 40 Control IC
44 Flexible cable 46 Lower resin mold 48 Upper resin mold 49 Side resin molds 50 and 51 Lens 52 Lens holding member 56 Imaging space 58 Optical filter 60 Substrate 62 Substrate region 64 Slit 82 Solder plating 84 Solder ball 92 Connector

Claims (7)

In a camera module having an image sensor provided on a substrate, a lens provided at a position of a predetermined focal length from the image sensor, and an optical filter that transmits light from the lens,
A camera module, wherein a lower surface of the substrate, a surface between the upper surface of the substrate and the edge of the imaging device, and a support portion that supports the lens at a predetermined position are integrally formed of a resin material.   The camera module according to claim 1, wherein the support portion includes an imaging space that communicates between the lens and an imaging surface of the imaging element.   The camera module according to claim 2, wherein the imaging space includes an optical filter holding unit that holds the optical filter therein.   2. The camera module according to claim 1, wherein the support portion is formed so that an inner wall of the imaging space surrounds an outer periphery of the lens, and an upper end thereof is sealed by a lens holding member that holds the lens. .   The camera module according to claim 1, wherein a control circuit for controlling the imaging element is provided on a lower surface of the substrate. In a method for manufacturing a camera module, comprising: an image sensor provided on a substrate; a lens provided at a position at a predetermined focal length from the image sensor; and an optical filter that transmits light from the lens.
Molding the lower surface of the substrate with a resin material;
Molding a support portion between the upper surface of the substrate and the edge of the image sensor and supporting the lens at a predetermined position with a resin material;
Attaching an optical filter inside the support;
And a step of inserting the lens into the inside of the supporting portion and sealing the inside of the supporting portion by bonding a holding portion of the lens to an upper end of the supporting portion. Method. Providing a plurality of image sensors on a substrate;
Connecting each terminal of the image sensor and the wiring pattern on the substrate by wire bonding;
Molding the lower surface of the substrate with a resin material;
A step of integrally molding a support portion between the upper surface of the substrate and the edge of the image sensor and supporting the lens at a predetermined position with a resin material;
Cutting the resin molded portion along the boundary lines of the plurality of image sensors to separate the image sensors;
Attaching an optical filter inside the support;
And a step of inserting the lens into the inside of the supporting portion and sealing the inside of the supporting portion by bonding a holding portion of the lens to an upper end of the supporting portion. Method.

Images