JP2006039231A - Method for manufacturing photoelectric wiring consolidated board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a supporting material from being carelessly peeled off in a manufacturing processes, to easily peel off the supporting material from a metal layer and to improve the formability of electric wirings when manufacturing a photoelectric wiring consolidated board by using a laminated material in which the supporting material, the metal layer for electric wiring formation and a resin layer for optical wiring formation are laminated. <P>SOLUTION: The metal layer 3 for electric wiring formation is laminated at least on one face side of the supporting material 1, and the supporting material 1 and the metal layer 3 are bonded with an adhesive 2 provided only at the peripheral part of their boundary. A transparent resin layer 4 and a photosensitive transparent resin layer 5 in which the solvent solubility or the refractive index is varied by the irradiation with active energy rays are sequentially formed on the face of the side of the metal layer 3 reverse to the supporting material 1. Then, a core layer 8 is formed by irradiating the photosensitive transparent resin layer 5 with the active energy rays using the lamination layer 6 having such constitution. A transparent resin layer 12 is formed on a face on which the core layer 8 is formed. Moreover, after the supporting material 1 is exfoliated from the metal layer 3, wiring processing is applied to the metal layer 3. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method of manufacturing an optical wiring / electrical wiring mixed board (optical electric wiring mixed mounting board) in which optical wiring and electric wiring are mixedly provided on the same substrate.

  Conventionally, the following two kinds of methods are mainly used in manufacturing an opto-electric wiring mixed substrate formed by laminating optical wiring and electric wiring in multiple layers.

  That is, in one method, a clad layer, a core layer, and a clad layer constituting an optical waveguide of an optical wiring layer are sequentially laminated on a substrate on which electric wiring is provided, and the electric wiring layer is further stacked thereon by plating or the like. It is a method of forming.

  In another method, a clad layer, a core layer, and a clad layer constituting an optical waveguide of an optical wiring layer are sequentially laminated on a temporary substrate, and then this optical wiring layer is bonded to an electric wiring board. In this method, the substrate is peeled off and an electric wiring layer is stacked on the optical wiring layer by plating or the like.

  However, in the above method, since the optical wiring layer and the electrical wiring layer are sequentially formed and stacked, the number of processes is increased, and since the electrical wiring layer is formed by plating, the wiring accuracy is low, and the high There has been a problem that it is difficult to stably industrially produce high quality opto-electric wiring mixed boards.

Therefore, it has been proposed to prepare a material in which a metal layer necessary for electrical wiring and a photosensitive resin layer capable of forming a cladding layer and a core layer necessary for optical wiring are laminated in an appropriate order in advance (patent) Reference 1). When such a laminated material is used, it has become possible to manufacture a high-quality opto-electric wiring mixed substrate by a simple method without substantially changing the conventional electric wiring board manufacturing process.
JP 2003-344684 A

  However, since the above-mentioned laminated material is composed of a thin metal layer and a resin layer, there is a problem that it has poor strength and is difficult to handle as it is.

  In order to improve the handling of such a laminated material, it has also been proposed to give rigidity to the laminated material by laminating an appropriate support material on the laminated material. It is necessary to remove the support material, and its removability becomes a problem.

  That is, in laminating the support material and the metal layer, for example, a metal foil or the like may be bonded to the support material with an adhesive or the metal layer may be formed on the support material by a plating method. Although the metal layer laminated | stacked in this way and a support material are peeled, there exists a possibility that a deformation | transformation and destruction of a board | substrate may arise, and a yield will worsen. Moreover, if the peel strength at the interface between the metal layer and the support material is reduced to prevent such deformation and destruction, the metal layer and the support material will be inadvertently peeled off in an optical wiring molding process or the like. There is a fear.

  In addition, when the metal layer made of metal foil and the support material are bonded, the metal foil is likely to be wrinkled, and is thus bonded to the support material in a state where wrinkles are generated. It was difficult to form the electrical wiring due to the molding failure of the metal layer.

  The present invention has been made in view of the above points, and in manufacturing an opto-electric wiring mixed board using a laminated material in which a supporting material, a metal layer for forming an electric wiring, and a resin layer for forming an optical wiring are stacked. In addition, it is possible to prevent the support material from being inadvertently peeled off during the manufacturing process, and to easily peel off the support material from the metal layer, and to prevent the metal layer from being formed poorly. It is an object of the present invention to provide a method for manufacturing an opto-electric wiring mixed substrate that can improve the performance.

  The manufacturing method of the opto-electrical wiring mixed substrate 13 according to the present invention is such that the metal layer 3 for forming the electric wiring is laminated on at least one surface side of the support material 1 and the support 2 is provided by the adhesive 2 provided only at the peripheral edge of the interface. The material 1 and the metal layer 3 are bonded to each other, and the surface of the metal layer 3 opposite to the support material 1 is exposed to a photosensitive resin whose solvent solubility changes or the refractive index changes when irradiated with active energy rays. After forming the optical layer by forming the core layer 8 by irradiating the photosensitive transparent resin layer 12 of the laminate material 6 with active energy rays using the laminate material 6 having the transparent resin layer 12 formed thereon, The support material 1 is peeled from the metal layer 3, and then the metal layer 3 is subjected to wiring processing. When the opto-electric wiring mixed substrate 13 is manufactured in this way, the handling material is improved by providing the support material 1 on the laminated material 6, and the opto-electric wiring mixed substrate 13 can be easily manufactured, and When the metal layer 3 and the support material 1 are bonded, since the bonding is performed only at the peripheral portion of the interface, the metal layer 3 is less likely to wrinkle, and when the electric wiring 9 is formed in the metal layer 3 The moldability is good. Further, when the support material 1 is peeled from the metal layer 3, the region where the interface between the metal layer 3 and the support material 1 is bonded is only the peripheral edge of the interface. Excessive stress is not easily applied to the molded body, and the occurrence of defects such as deformation and breakage can be suppressed, or only the peripheral portion including the adhesive 2 interposed between the metal layer 3 and the support material 1 of the molded body. Can be easily peeled off without applying stress to the molded body.

  In the method for manufacturing the opto-electric wiring mixed substrate 13, a material made of a thermoplastic resin can be used as the adhesive 2 for bonding the metal layer 3 and the support material 1. In this case, when the support material 1 is peeled off from the metal layer 3, the adhesive 2 is heated to be softened and melted to further reduce the stress applied to the molded body when the support material 1 is peeled off. It is something that can be done.

  Moreover, in the manufacturing method of the said opto-electrical wiring mixed board | substrate 13, the peelable thing can also be used as the adhesive agent 2 which adheres the said metal layer 3 and the support material 1. In this case, the stress applied to the molded body when the support material 1 is peeled can be further reduced.

  In the method of manufacturing the opto-electric wiring mixed substrate 13 as described above, the adhesive 2 for bonding the metal layer 3 and the support material 1 is used as the peripheral edge over the entire circumference of the interface between the metal layer 3 and the support material 1. It is preferable to provide continuously in the part. In this case, when chemical processing is performed in the manufacturing process of the opto-electric wiring mixed substrate 13, it is possible to prevent the chemical from entering the gap between the interface of the metal layer 3 and the support material 1, thereby reducing the adhesive strength and the metal. Contamination of the surface of the layer 3 can be prevented.

  According to the present invention, when manufacturing an opto-electric wiring mixed substrate using a laminated material in which a supporting material, a metal layer for forming an electric wiring, and a resin layer for forming an optical wiring are stacked, the supporting material is not prepared in the manufacturing process. Can be easily peeled off when the support material is peeled off from the metal layer, and the moldability of the metal layer can be prevented and the moldability of the electrical wiring can be improved. is there.

  Embodiments of the present invention will be described below.

  In the present invention, when manufacturing the opto-electrical wiring mixed substrate 13, first, a laminated material 6 is produced by laminating the supporting material 1, the metal layer 3 for forming the electric wiring 9 and the resin layer for forming the optical wiring in this order.

  A laminated material 6 shown in FIG. 1 is formed by laminating a metal layer 3 for forming an electrical wiring 9 and a resin layer for forming an optical wiring in this order on one surface of a support material 1.

  The support material 1 can be formed of an appropriate material, but can be formed of, for example, a metal plate, a resin plate, a glass plate, a ceramic plate, or the like. The surface of the support material 1 in contact with the metal layer 3 is preferably formed on a mirror surface in order to obtain high peelability.

  The material of the metal layer 3 is not particularly limited, but can be formed using a metal foil such as copper, aluminum, nickel, etc. Among them, the copper foil is preferable. Although the thickness of the metal layer 3 is not specifically limited, For example, it can form in the range of 9-70 micrometers.

  The support 1 and the metal layer 3 are bonded using an adhesive 2. In the drawings excluding FIG. 1, illustration of the adhesive 2 is omitted. As the adhesive 2, any suitable adhesive can be used as long as it can withstand various treatments applied to the laminated material 6.

  For example, as the adhesive 2, a thermosetting resin such as an epoxy resin, a photocurable resin such as an acrylic resin, or the like can be used. These adhesives 2 can be applied to an adhesion site in a liquid state and cured by heating, light irradiation, or the like to exert an adhesive force.

  Further, as the adhesive 2, one made of a thermoplastic resin such as nylon or polyester can also be used. In the case of using such an adhesive 2 made of a thermoplastic resin, for example, the adhesive 2 is formed into a sheet shape, this sheet material is placed in an adhesion site, softened by heating, and then solidified by cooling. Adhesive strength can be exhibited.

  In addition, a pressure-sensitive adhesive (pressure-sensitive adhesive) can be used as the adhesive 2. As such a pressure sensitive adhesive, it is possible to use an acrylic or urethane adhesive such as a permanent one, that is, a non-peelable one, and can be peeled to lose its adhesive strength by heating, UV irradiation or the like. You can also use anything.

  The adhesion region 14 at the interface between the support material 1 and the metal layer 3, that is, the region where the adhesive force is exerted by the presence of the adhesive 2, the pressure-sensitive adhesive, or the like is formed only at the peripheral edge of the interface (FIG. 1). (See (b)). The width and area of the adhesive region 14 are appropriately adjusted according to the type of the adhesive 2 and the pressure-sensitive adhesive used, the adhesive strength required for the interface, the peeling method of the interface, and the like. It is preferable that the width w is in the range of 1 to 5 mm.

  When the support material 1 and the metal layer 3 are bonded in this manner, the bonding region 14 is only the peripheral edge at the interface between the support material 1 and the metal layer 3 as described above. Generation | occurrence | production of a flaw is suppressed and the shaping | molding defect of the electrical wiring 9 formed in the metal layer 3 can be prevented so that it may mention later.

  The adhesive region 14 is preferably formed continuously over the entire periphery of the periphery of the interface between the metal layer 3 and the support material 1, that is, the adhesive 2 or the adhesive is applied at the interface between the metal layer 3 and the support material 1. It is preferable that they are continuously provided over the entire circumference. In this case, when chemical processing is performed in the manufacturing process of the opto-electric wiring mixed substrate 13, it is possible to prevent the chemical from entering the gap between the interface between the metal layer 3 and the support material 1, thereby reducing the adhesive strength and the metal layer. 3 can prevent contamination of the surface.

  In addition, the resin layer for forming the optical wiring is formed of the photosensitive transparent resin layer 5, but can also be constituted by the transparent resin layer 4 and the photosensitive transparent resin layer 5.

  The photosensitive transparent resin layer 5 is made of a photosensitive transparent resin whose solvent solubility is changed by irradiation with active energy rays. As such a photosensitive transparent resin, a solvent solubility is lowered by irradiation of active energy rays such as UV, a photo-curable acrylic resin, an epoxy resin, a polyimide resin, a silicon resin, an electron beam curable resin Moreover, photodegradable naphthoquinone resin etc. can be illustrated as a thing whose solvent solubility becomes high by irradiation of an active energy ray. Among these, it is preferable to use one having high transparency and high heat resistance.

  The transparent resin layer 4 is formed so that the refractive index is lower than that of the photosensitive transparent resin layer 5 described above. Further, it is preferably formed of a resin having high flame retardancy, and further, formed of a resin that absorbs active energy rays irradiated to change the solvent solubility in the photosensitive transparent resin layer 5. More preferable. When it is difficult to achieve such properties with a single resin, for example, as shown in FIG. 2A, the transparent resin layer 4 and the metal having a lower refractive index than the photosensitive transparent resin layer 5 are used. An adhesive resin layer 11 made of a resin having high flame retardancy can be provided between the layer 3 and the layer 3.

  Examples of the resin for forming the transparent resin layer 4 include photocurable acrylic resins, epoxy resins, polyimide resins, photocurable resins such as silicon resins, epoxy resins, polyimide resins, unsaturated polyester resins, and epoxy acrylates. A thermosetting resin such as a resin can be used. In addition, the resin may contain an additive-type or reactive-type halogen-based, phosphorus-based, silicon-based flame retardant or ultraviolet absorber for imparting flame retardancy and absorbing active energy rays.

  An example of the manufacturing method of such a laminated material 6 is given. First, the support material 1 and the metal layer 3 are laminated and bonded. At this time, when the metal layer 3 is formed of a metal foil having one surface as a shiny surface (glossy surface) and the other surface as a matte surface (rough surface), the glossy surface of the metal foil and the support material 1 are formed. Are preferably laminated and laminated.

  For example, the adhesive 2 is first disposed on the peripheral edge of at least one of the support material 1 and the metal layer 3. At this time, for example, in the case of application, printing, and sheet material, the adhesive 2 can be disposed by bonding or the like. In the case of using a peelable pressure sensitive adhesive (pressure sensitive adhesive) that loses adhesive strength by heating, UV irradiation or the like as the adhesive 2, for example, an adhesive applied to at least one surface of a sheet-like substrate, for example, heat A heat release sheet coated with a peelable adhesive or a UV tape used for dicing a semiconductor wafer coated with an ultraviolet peelable adhesive or the like is used, and the support 1 is used so that the adhesive is exposed to the outer surface. Can be glued to. Next, the support material 1 and the metal layer 3 are superposed and bonded by applying heat, ultraviolet light, pressure, or the like as necessary.

  Next, when a metal foil is used as the metal layer 3, a resin for forming the transparent resin layer 4 is coated on the mat surface. Examples of the coating method include a comma coater, a curtain coater, a die coater, screen printing, and offset printing. Next, when the resin forming the transparent resin layer 4 contains a solvent, the resin is dried and removed, and then the resin is cured or semi-cured as necessary. The curing method and conditions are appropriately selected according to the type of resin.

  Subsequently, the laminated material 6 can be obtained by coating the resin which forms the photosensitive transparent resin layer 5 on this transparent resin layer 4 with the same coating method.

  Further, a cover film 10 may be laminated on the photosensitive transparent resin layer 5 as shown in FIG. These manufacturing steps may be performed continuously. Examples of the cover film 10 include a polyester film, a polypropylene film, a polyethylene film, and a polyacetate film, but are not limited thereto. The thickness of the cover film 10 is not particularly limited, but a cover having a thickness in the range of 5 to 100 μm is preferably used. Moreover, you may perform a mold release process on the surface of the cover film 10 as needed.

  Further, the cover film 10 may be used to form the photosensitive transparent resin layer 5. That is, for example, the photosensitive transparent resin layer 5 is formed in advance on one surface of the cover film 10, and this photosensitive transparent resin layer 5 is laminated with the transparent resin layer 4 provided by being laminated on the metal layer 3. To be integrated.

  The cover film 10 is provided to protect the resin layer for forming the optical wiring, and is peeled off when the opto-electric wiring mixed substrate 13 is manufactured.

  Further, as shown in FIG. 2C, the laminated material 6 may be formed by further laminating a transparent resin layer 12 on the photosensitive transparent resin layer 5. The transparent resin layer 12 can be formed of the same resin as the transparent resin layer 4.

  Moreover, the laminated material 6 may be formed by laminating the metal layer 3 and the resin layer on both surfaces of the support material 1 as shown in FIG. That is, the metal layer 3 and the resin layer are laminated and formed on one surface of the support material 1 in the same manner as the above embodiments, and the metal layer 3 and the resin layer are formed on the other surface in the same manner. .

  Next, a method for manufacturing the opto-electric wiring mixed substrate 13 using the laminated material 6 thus obtained will be described.

  First, as shown in FIG. 3A, the photosensitive transparent resin layer 5 is exposed by irradiating active energy rays E from the side opposite to the metal layer 3. The irradiation of the active energy ray is performed in a pattern corresponding to the wiring pattern of the optical wiring. For example, the pattern irradiation of the active energy ray can be performed by ultraviolet mask exposure, laser drawing exposure, or the like. Next, the photosensitive transparent resin layer 5 is partially dissolved in the solvent by developing the photosensitive transparent resin layer 5 by applying a solvent. At this time, when the photosensitive transparent resin layer 5 is formed of a resin that changes so that the solubility of the portion irradiated with the active energy ray, such as a photocurable resin, becomes lower, the portion other than the portion irradiated with the active energy ray This resin is dissolved in a solvent, and the resin irradiated with active energy rays remains. Further, when the photosensitive transparent resin layer 5 is formed of a resin that changes so as to increase the solubility of a portion irradiated with active energy rays, such as a photodegradable resin, the resin of the portion irradiated with active energy rays is reduced. Resin other than the portion dissolved in the solvent and irradiated with the active energy ray remains, and the core layer 8 is formed in the remaining portion.

  In this way, after forming the core layer 8 in the optical wiring pattern as shown in FIG. 3B, the transparent resin layer 12 is coated on the surface of the transparent resin layer 4 on which the core layer 8 is provided. The core layer 8 is covered with the transparent resin layer 12 as shown in 3 (c). As the transparent resin layer 12, a translucent resin having a refractive index lower than that of the photosensitive transparent resin layer 5 (core layer 8) is used. For example, the same resin as the transparent resin layer 4 can be used. And, for example, by using a substrate 7 such as an insulating substrate, a printed wiring board produced by providing electrical wiring, a metal foil, and the like, by bonding the transparent resin layer 12 to the surface of such a substrate 7 with an adhesive 15 Then, as shown in FIG. At this time, when a resin that also serves as the adhesive 15 is used as a resin for forming the transparent resin layer 12, the resin is coated on the surface of the transparent resin layer 4 on the side where the core layer 8 is provided. While the resin remains in an uncured or semi-cured state, a base material 7 is further provided on this resin, and the resin is cured to form a transparent resin layer 12 and bond the transparent resin layer 12 and the base material 7 together. can do.

  Thereafter, the support material 1 is peeled off from the metal layer 3 as shown in FIG. 3 (e), and then the surface metal layer 3 is processed by printed wiring by etching or the like to form the electric wiring 9 as shown in FIG. 3 (f). Form.

  In FIG. 3F, the refractive index of the core layer 8 of the optical wiring pattern is larger than the refractive indexes of the transparent resin layer 4 and the transparent resin layer 12 that are in direct contact with the photosensitive transparent resin layer 5, so that it is transparent. The resin layer 4 and the transparent resin layer 12 become a clad layer 16 to form an optical waveguide, and an optical wiring is formed by the core layer 8. An optical electrical circuit in which the optical wiring by the core layer 8 and the electrical wiring 9 are laminated. It can be used as the wiring mixed board 13.

  In the above-described embodiment, when the laminated material 6 is manufactured, the photosensitive transparent resin layer 5 is a photosensitive material in which the refractive index of the irradiated region is changed by irradiation with active energy rays, instead of the one shown in the above-described embodiment. It can also be formed of a conductive transparent resin. Otherwise, the laminated material 6 can be produced in the same manner as described above.

  Among such photosensitive transparent resins, those having a refractive index that is increased by irradiation with active energy rays include, for example, “Polyguide” manufactured by DuPont, whose refractive index is increased by ultraviolet irradiation, and the like. An acrylic resin containing a photopolymerizable monomer can be used. At this time, it is necessary that the portion of the photosensitive transparent resin layer 5 irradiated with the active energy rays has a higher refractive index than the portion not irradiated with the active energy rays and the transparent resin layer 4.

  On the other hand, among the photosensitive transparent resins, those whose refractive index is lowered by irradiation with active energy rays include, for example, polysilane such as polymethylphenylsilane, polycarbonate resin, etc. whose refractive index is lowered by ultraviolet irradiation. It is possible to use a composite resin or the like in which a photopolymerizable acrylic monomer is added to form a film while being dissolved in the resin, and the acrylic monomer is distilled off in vacuum after exposure. At this time, it is necessary that the portion of the photosensitive transparent resin layer 5 that is not irradiated with active energy rays has a higher refractive index than the portion that is irradiated with active energy rays and the transparent resin layer 4.

  Next, a method for manufacturing the opto-electric wiring mixed substrate 13 using the laminated material 6 thus obtained will be described. First, as shown in FIG. 4A, the photosensitive transparent resin layer 5 is irradiated with active energy rays E from the side opposite to the metal layer 3.

  At this time, when the photosensitive transparent resin layer 5 is formed such that the refractive index increases when irradiated with active energy rays, the irradiation of active energy rays is performed in a pattern according to the wiring pattern of the optical wiring. For example, active energy ray pattern irradiation can be performed by ultraviolet mask exposure, laser drawing exposure, or the like. At this time, the refractive index of the portion of the photosensitive transparent resin layer 5 that is not irradiated with active energy rays does not change, but the portion that is irradiated with active energy rays has a higher refractive index, and this irradiated portion is the core layer. 8 and the refractive index of the core layer 8 is higher than that of the transparent resin layer 4.

  Further, when the photosensitive transparent resin layer 5 is formed such that the refractive index is lowered by irradiating active energy rays, the active energy rays are irradiated in a pattern opposite to the wiring pattern of the optical wiring. For example, pattern irradiation with active energy rays can be performed by ultraviolet mask exposure, laser drawing exposure, or the like. At this time, the refractive index of the portion of the photosensitive transparent resin layer 5 that is not irradiated with active energy rays does not change, but the portion that is irradiated with active energy rays has a low refractive index, that is, the photosensitive transparent resin. The core layer 8 is formed in the non-irradiated portion of the layer 5, and the refractive index of the core layer 8 is higher than the refractive index of the transparent resin layer 4.

  Thus, after forming the core layer 8 in the optical wiring pattern shape in the photosensitive transparent resin layer 5 as shown in FIG. 4B, the surface of the transparent resin layer 4 on the side where the photosensitive transparent resin layer 5 is provided ( The transparent resin layer 12 is coated on the surface on which the core layer 8 is provided, and the photosensitive transparent resin layer 5 is covered with the transparent resin layer 12 as shown in FIG. As the transparent resin layer 12, a translucent resin having a refractive index lower than that of the core layer 8 of the photosensitive transparent resin layer 5 is used. For example, the same resin as that of the transparent resin layer 4 can be used. And, for example, by using a substrate 7 such as an insulating substrate, a printed wiring board produced by providing electrical wiring, a metal foil, and the like, by bonding the transparent resin layer 12 to the surface of such a substrate 7 with an adhesive 15 Then, as shown in FIG. At this time, when a resin that also serves as the adhesive 15 is used as a resin for forming the transparent resin layer 12, the resin is coated on the surface of the transparent resin layer 4 on the side where the photosensitive transparent resin layer 5 is provided. The resin is left in an uncured or semi-cured state, and the substrate 7 is further stacked on the resin, and the resin is cured to form the transparent resin layer 12 and the transparent resin layer 12 and the substrate 7. Can be glued together.

  Thereafter, as shown in FIG. 4E, the support material 1 is peeled off from the metal layer 3, and then the surface metal layer 3 is processed by printed wiring to form the electrical wiring 9 as shown in FIG. 4F.

  4 (f), the refractive index of the core layer 8 of the photosensitive transparent resin layer 5 of the optical wiring pattern is such that the portion other than the core layer 8 of the photosensitive transparent resin layer 5 or the photosensitive transparent resin layer. 5 is larger than the refractive index of the transparent resin layer 4 or the transparent resin layer 12 that is in direct contact with 5, so that the transparent resin layer 4 or the transparent resin layer 12 other than the core layer 8 of the photosensitive transparent resin layer 5 becomes the cladding layer 16. The optical waveguide is formed, and the optical wiring is formed by the core layer 8 of the photosensitive transparent resin layer 5. The optical wiring by the core layer 8 of the photosensitive transparent resin layer 5 and the electrical wiring 9 are laminated. It can be used as the electric wiring mixed board 13.

  When the printed wiring board is used as the base material 7 in producing the opto-electric wiring mixed board 13 as described above, electric wiring is formed on both sides of the optical wiring. Further, when a metal foil is used as the substrate 7, the metal foil can be printed and processed to form an electrical wiring, whereby the electrical wiring can be formed on both sides of the optical wiring. Further, it is possible to connect the electric wirings on both sides by laser via processing or plating processing.

  In the manufacturing process of the opto-electric wiring mixed substrate 13 as described above, the metal layer 3 is not easily wrinkled when bonded to the support material 1 as described above. In forming the electrical wiring 9, the occurrence of molding defects can be suppressed.

  Further, when the support material 1 is peeled off from the metal layer 3, the metal layer 3 and the support material 1 are bonded only at the peripheral edge portion of the interface, so that a slight portion including the peripheral edge portion is cut from the molded body. The support material 1 can be easily peeled off simply by removing it.

  Further, even when the support material 1 is peeled off from the metal layer 3 without cutting the molded body, the support material 1 and the metal layer 3 are not bonded to the entire interface, and the peripheral edge of the interface Therefore, even if the metal layer 3 and the support material 1 are bonded with high adhesive strength by the adhesive 2, it is difficult to apply excessive stress to the molded body at the time of peeling. The occurrence of bending and breakage is suppressed.

  In particular, when the adhesive 2 that bonds the metal layer 3 and the support material 1 is a thermoplastic adhesive, the adhesive 2 is interposed in the interface between the support material 1 and the metal layer 3. The adhesive 2 is softened by heating the region, and in this state, the support 1 is easily peeled from the metal layer 3 without cutting the molded body and without applying excessive stress to the molded body. Is something that can be done.

  Further, when the adhesive 2 that bonds the metal layer 3 and the support material 1 is a peelable pressure-sensitive adhesive (adhesive) that loses adhesive strength by heating, UV irradiation, or the like, the support material The adhesive force of the adhesive 2 is lost by heating, UV irradiation, or the like according to the type of the adhesive 2 in the area where the adhesive 2 is interposed in the interface between the metal layer 3 and the metal layer 3. In this state, the support material 1 and the metal layer 3 can be easily peeled off without cutting the opto-electrical wiring mixed substrate 13 in the process of manufacturing and applying almost no stress to the molded body.

  When the support material 1 is peeled in this way, an excessive load is not applied to the molded body at the time of peeling, so that the molded body is not bent or damaged, and the support material 1 can be easily peeled off. .

  In producing the opto-electric wiring mixed substrate 13 as described above, an optical path for emitting light guided through the core layer 8 to the outside of the core layer 8 or guiding light outside the core layer 8 into the core layer 8. Conversion means can be provided. This optical path changing means can be formed by drawing a grating that diffracts light on the core layer 8 or by providing an optical element such as a micromirror or a prism on the core layer 8. By diffracting, reflecting, refracting light transmitted through the inside, the optical path of the light guided through the core layer 8 is converted to the outside, for example, in the thickness direction of the core layer 8, or from the outside to the core layer 8 The optical path of the light incident toward it can be converted to guide this light into the core layer 8.

  For example, when the laminated material 6 is formed, an optical element such as a prism or a mirror is embedded in advance at a predetermined position of the photosensitive transparent resin layer 12 where the core layer 8 is formed. By producing the electrical wiring mixed substrate 13, the optical path changing means can be provided at the same time. Moreover, after forming the transparent resin layer 4, the core layer 8, and the transparent resin layer 12 in order, the core layer 8 and the cladding layer 16 by energy irradiation are formed, and then between the core layer 8 and the cladding layer 16 by energy irradiation. A method of forming a grating in the core layer 8 using the difference in alteration can also be mentioned. In the latter method, for example, a femtosecond pulse laser can be used as the energy irradiation.

  When such an optical path changing means is provided, for example, by mounting a light emitting element on the electric wiring 9, an electric signal transmitted through the electric wiring 9 is converted into an optical signal by the light emitting element, and this optical signal is converted into an optical signal. The light is emitted from the light emitting element toward the optical path changing means, and the optical path of the optical signal is converted by the optical path changing means so that it can be transmitted to the optical wiring composed of the core layer 8, and the light receiving element is mounted on the electric wiring 9. Then, the optical path of the optical signal transmitted through the optical wiring composed of the core layer 8 is converted by the optical path conversion means and received by the light receiving element, and the light receiving element converts the optical signal into an electric signal and transmits it to the electric wiring 9. That is, the electrical wiring 9 and the optical wiring can be coupled.

  In the above process, a laminate 6 in which a metal layer 3, a transparent resin layer 4, and a photosensitive transparent resin layer 5 are formed on a support material 1 as shown in FIGS. 1 (a), 2 (a), and 2 (b). In the case of using the laminated material 6 having the photosensitive transparent resin layer 5 as at least the resin layer, even if the laminated material 6 having another configuration is used, an appropriate process is shown. It is possible to fabricate the opto-electric wiring mixed substrate by changing the details of the above. For example, in the case of using a laminated material having the configuration shown in FIG. 2C, the core layer 8 must be formed with the transparent resin layer 12 already formed. If the resin is formed of a photosensitive resin whose refractive index changes due to the irradiation of, the active energy ray is irradiated to a predetermined position of the photosensitive transparent resin layer 5 even when the transparent resin layer 12 is formed. The core layer 8 can be formed in the same manner as in the state shown in FIG. 4C, and thereafter, the opto-electric wiring mixed substrate can be manufactured by the same steps as in FIGS. Further, as shown in FIG. 2D, when the metal layer 3 and the resin layer for forming the optical wiring are formed on both surfaces of the support material 1, the both surfaces of the support material 1 are shown in FIG. 3 and FIG. By performing the same process as the process, an opto-electric wiring mixed substrate can be manufactured.

  The material used about each Example and the comparative example is shown below.

  Metal foil: A copper foil having a thickness of 18 μm (product name “MPGT” manufactured by Furukawa Electric Co., Ltd.) was used.

Transparent resin A: 90 parts by mass of “Celoxide 2021P” (liquid alicyclic epoxy resin) manufactured by Daicel Chemical Industries, Ltd. and “EHPE-3150” (solid alicyclic epoxy resin) manufactured by Daicel Chemical Industries, Ltd. 5 parts by mass, 5 parts of “Epicron 1050” (solid bisphenol A type epoxy resin) manufactured by Dainippon Ink and Chemicals, Ltd., 0.5 of “Optomer SP170” (photocation initiator) manufactured by Asahi Denka Kogyo Co., Ltd. Ultraviolet curable epoxy resin having a refractive index of 1.52 which is obtained by blending parts by mass. Photosensitive resin A: 75 “EHPE-3150” (solid alicyclic epoxy resin) manufactured by Daicel Chemical Industries, Ltd. Parts by mass, 25 parts by mass of “YDF8170” (bisphenol F type epoxy resin) manufactured by Tohto Kasei Co., Ltd., 20 parts by mass of toluene, methyl ethyl ketone A resin varnish comprising 10 parts by mass of Ton and 1 part by mass of “Optomer SP170” manufactured by Asahi Denka Kogyo Co., Ltd. was used. The resin varnish is dried to remove the solvent, cured by irradiation with ultraviolet rays at 5 J / cm ² with a high-pressure mercury lamp, and then cured at 150 ° C. for 1 hour. The refractive index of the cured product is 1. 54.

  Photosensitive resin B: “Gracia PS-SR103” (polysilane resin varnish) manufactured by Nippon Paint Co., Ltd.

Cover film 10: Polyethylene terephthalate film having a thickness of 25 μm Adhesive 2A: 90 parts by mass of “YDB500” (brominated epoxy resin) manufactured by Toto Kasei Co., Ltd., “YDCN-1211” manufactured by Toto Kasei Co., Ltd. (cresol) 10 parts of novolac type epoxy resin, 3 parts by weight of dicyandiamide, 30 parts by weight of “2E4MZ” (2-ethyl-4-methylimidazole) manufactured by Shikoku Kasei Co., Ltd., and 8 parts by weight of DMS (dimethylformamide) Formulated varnish.

Example 1
A 110 mm × 110 mm × 0.4 mm aluminum plate was used as the support material 1, and a hot melt adhesive sheet (“Daiamide Film” manufactured by Daicel Finechem Co., Ltd.) was applied to the peripheral portion of the support material 1 with a width of 5 mm. 3102 "), which is cut into strips, is temporarily fixed, and the surface of the support 1 to which the hot melt adhesive sheet is temporarily bonded is attached to the glossy surface of the copper foil cut into the same plane view dimensions as the support 1 And bonded using a roll laminator heated to 140 ° C. in this state.

Next, the transparent resin A is applied to the rough surface of the copper foil by a roll transfer method so as to have a thickness of 20 μm, irradiated with ultraviolet light at 2.5 J / cm ² with a high-pressure mercury lamp, and then at 100 ° C. After curing for 30 minutes, the resin was cured, whereby the transparent resin layer 4 was formed.

  Subsequently, the photosensitive resin A was apply | coated to the surface of the said transparent resin layer 4, and the photosensitive transparent resin layer 12 with a thickness of 40 +/- 8micrometer was formed by heat-drying, and the laminated material 6 was obtained by this.

The photosensitive transparent resin layer 12 of the laminate 6 was exposed to ultraviolet light at 5 J / cm ² with a high-pressure mercury lamp through a negative mask under the condition of heat treatment at 100 ° C. for 30 minutes. Nine linear core layers 8 having a width of 40 μm and a length of 80 mm were formed in parallel at intervals of 10 mm by developing using “clean through” (an aqueous cleaning agent instead of Freon).

Next, the transparent resin A is applied so as to fill the core layer 8 so as to have a thickness of 60 μm, and is cured by irradiating with ultraviolet light at 2.5 J / cm ² with a high-pressure mercury lamp. Formed.

  On the other hand, a glass substrate epoxy resin laminate having a thickness of 1 mm was used as the substrate 7, and the adhesive 2A was applied on one surface thereof and precured at 130 ° C. to form a dry film having a thickness of 40 μm.

  And the adhesive 2 was hardened by putting the dry film of the adhesive 2 in this base material 7 on the said transparent resin layer 4, and vacuum-pressing at 170 degreeC.

  The molded body thus obtained was heated at 100 ° C. for 10 minutes to soften and melt the hot melt adhesive sheet between the support material 1 and the metal layer 3, and the support material 1 was peeled off. At this time, the molded article could be easily peeled without causing deformation or breakage.

  Next, the molded body is cut and polished so that both ends of the core layer 8 are exposed, and near-infrared light having a wavelength of 850 μm is incident from one end of the core layer 8 through a multimode optical fiber having a core diameter of 50 μm. When the emitted light from the other end of the layer 8 was observed with a CCD camera, light guiding in the core layer 8 was confirmed.

  The peel strength of the metal layer 3 was 6.9 N / cm (0.7 kg / cm), and the electrical wiring 9 could be formed on the metal layer 3 by etching.

(Comparative Example 1)
In bonding the support material 1 and the metal foil, a hot melt adhesive sheet is disposed over the entire surface of the support material 1, and the glossy surface of the copper foil cut into the same plane view dimensions as the support material 1 The hot melt adhesive sheet was superposed on one surface of the support material 1 to which it was temporarily bonded, and bonded in this state using a roll laminator heated to 140 ° C. Except that, a molded body was produced in the same manner as in Example 1.

  At this time, when the support material 1 was peeled off from the metal layer 3, the molded body was greatly bent due to the stress at the time of peeling.

  Further, in this molded body, when the emitted light in the core layer 8 was observed in the same manner as in Example 1, the emitted light was observed, but its intensity was weaker than that in Example 1.

(Example 2)
A 110 mm × 110 mm × 0.4 mm aluminum plate is used as the support material 1, and a one-component adhesive 2 (“Cemedine Super” manufactured by Cemedine Super Co., Ltd.) is applied to a 5 mm wide region around the entire circumference of the support material 1. X2 ") is applied, and the glossy surface of the copper foil cut to the same planar view size as the support material 1 is superposed on one surface of the support material 1 to which the one-component adhesive 2 is applied, and in this state After making it adhere | attach using a roll laminator, it was left to cure at room temperature for half a day.

  Thereafter, a molded body was produced in the same manner as in Example 1.

  When the support material 1 was peeled from the metal layer 3, the support material 1 could be easily peeled by first cutting an area having a width of 10 mm on the four sides of the formed body. In addition, as in Example 1, good light guiding in the core layer 8 was confirmed, the metal layer 3 had a sufficient peel strength, and the electrical wiring 9 was formed on the metal layer 3 by etching. Was possible.

(Comparative Example 2)
When bonding the support material 1 and the metal foil, the glossy surface of the copper foil coated with the one-component adhesive 2 over the entire surface of the support material 1 and cut into the same plane view dimensions as the support material 1 Was superposed on one surface of the support material 1 coated with the one-component adhesive 2 and adhered in this state using a roll laminator, and then allowed to stand at room temperature for half a day to be cured. Except that, a molded body was produced in the same manner as in Example 2.

  With respect to this molded body, there was no problem in the light guiding in the core layer 8 and the peeling strength of the metal layer 3, but the support material 1 could not be peeled from the metal layer 3.

(Example 3)
An aluminum plate of 110 mm × 110 mm × 0.4 mm is used as the support material 1, and a heat release sheet (“Riva Alpha” manufactured by Nitto Denko Corporation) is applied to a 5 mm wide region around the entire circumference of the support material 1. A material that is cut into a strip shape is bonded so that the pressure-sensitive adhesive is exposed, and the glossy surface of the copper foil that has been cut to the same planar view size as the support material 1 is attached to the heat release sheet. 1 was superposed on one surface, and in this state, they were adhered by using a roll laminator.

  Thereafter, a molded body was produced in the same manner as in Example 1.

  When peeling the support material 1 from the metal layer 3, the adhesive is lost in the heat release sheet between the support material 1 and the metal layer 3 by heating the molded body at 150 ° C. for 10 minutes. 1 was peeled off. At this time, the molded article could be easily peeled without causing deformation or breakage.

  Next, the molded body is cut and polished so that both ends of the core layer 8 are exposed, and near-infrared light having a wavelength of 850 μm is incident from one end of the core layer 8 through a multimode optical fiber having a core diameter of 50 μm. When the emitted light from the other end of the layer 8 was observed with a CCD camera, good waveguide of light in the core layer 8 was confirmed.

  The peel strength of the metal layer 3 was 6.9 N / cm (0.7 kg / cm), and the electrical wiring 9 could be formed on the metal layer 3 by etching.

(Comparative Example 3)
In bonding the support material 1 and the metal foil, a heat release sheet (with a protective sheet) is bonded over the entire surface of the support material 1, and the protective sheet is peeled off. The glossy surface of the copper foil cut into pieces was superposed on one surface of the support material 1 to which the heat-peeling sheet was adhered, and in this state, they were adhered to each other using a roll laminator. At this time, wrinkles occurred in the copper foil. Except that, a molded body was produced in the same manner as in Example 3.

  About the obtained molded object, the light guide property in the core layer 8 is favorable, and when peeling the support material 1 from the metal layer 3, it peels easily like the case of Example 3. However, wrinkles were generated in the metal layer 3 as described above, and it was difficult to form the electrical wiring 9 by etching.

Example 4
A glass plate of 110 mm × 110 mm × 2.0 mm is used as the support material 1, and a dicing UV tape (Furukawa Electric Co., Ltd., double-sided type) is applied to the 5 mm width region around the entire circumference of the support material 1. After bonding the strip cut, the glossy surface of the copper foil cut in the same plane view size as the support material 1 is superposed on one surface of the support material 1 to which the dicing UV tape is bonded, In the state, they were adhered by using a roll laminator.

  Thereafter, a molded body was produced in the same manner as in Example 1. However, the bonding conditions of the base material 7 were 150 ° C. vacuum lamination and 170 ° C. open cure.

When the support material 1 is peeled from the metal layer 3, the adhesive property of the UV tape is lost by irradiating UV light of 1.0 J / cm ² to the UV tape through the glass plate as the support material 1. Thus, the support material 1 was peeled off. At this time, the molded article could be easily peeled without causing deformation or breakage.

  Next, the molded body is cut and polished so that both ends of the core layer 8 are exposed, and near-infrared light having a wavelength of 850 μm is incident from one end of the core layer 8 through a multimode optical fiber having a core diameter of 50 μm. When the emitted light from the other end of the layer 8 was observed with a CCD camera, good waveguide of light in the core layer 8 was confirmed.

  The peel strength of the metal layer 3 was 6.9 N / cm (0.7 kg / cm), and the electrical wiring 9 could be formed on the metal layer 3 by etching.

(Comparative Example 4)
In bonding the support material 1 and the metal foil, the UV tape is bonded to the entire surface of the support material 1, and the glossy surface of the copper foil cut into the same planar view size as the support material 1 is attached to the UV tape. It was overlapped with one surface of the bonded support material 1 and bonded in this state by using a roll laminator. At this time, wrinkles occurred in the copper foil. Except that, a molded body was produced in the same manner as in Example 4.

  About the obtained molded object, the waveguide property of the light in the core layer 8 is favorable, and when peeling the support material 1 from the metal layer 3, it peels easily like the case of Example 4. However, wrinkles were generated in the metal layer 3 as described above, and it was difficult to form the electrical wiring 9 by etching.

(Example 5)
In Example 2, when the support material 1 and the copper foil were bonded, a vacuum laminator was used to perform heat and pressure bonding under conditions of 150 ° C. and 15 minutes. Except that, a molded body was obtained in the same manner as in Example 2.

  When the thickness of the core layer 8 of the obtained molded body was measured with a contact-type step gauge, the thickness variation (36 measurement points) of the core layer 8 was ± 4.7 μm at 3σ (three times the standard deviation). Met.

  On the other hand, when the variation in thickness of the core layer 8 was measured in the same manner as in Example 2, it was ± 7.2 μm at 3σ. This difference is that, in Example 5, since the support material 1 and the copper foil were bonded in a vacuum atmosphere, the presence of air between the support material 1 and the copper foil was reduced, and the copper foil floated on the support material 1. This is considered to be because the application accuracy of the resin in forming the core layer 8 is improved.

(Example 6)
In Example 1, the laminated material 6 was obtained using the photosensitive resin B instead of the photosensitive resin A.

The photosensitive transparent resin layer 12 of the laminated material 6 is exposed to ultraviolet light at 10 J / cm ² with a high-pressure mercury lamp through a positive mask under a condition to reduce the refractive index of the exposed portion, and has a width of 40 μm and a long length. Nine linear core layers 8 having a length of 80 mm were formed in parallel at intervals of 10 mm.

Next, the transparent resin A is applied to the photosensitive transparent resin layer 12 so as to have a thickness of 60 μm, and cured by irradiating with ultraviolet light at 2.5 J / cm ² with a high-pressure mercury lamp. Formed.

  Thereafter, a molded body was obtained in the same manner as in Example 1.

  The molded body thus obtained was heated at 100 ° C. for 10 minutes to soften and melt the hot melt adhesive sheet between the support material 1 and the metal layer 3, and the support material 1 was peeled off. At this time, the molded article could be easily peeled without causing deformation or breakage.

  Next, the molded body is cut and polished so that both ends of the core layer 8 are exposed, and near-infrared light having a wavelength of 850 μm is incident from one end of the core layer 8 through a multimode optical fiber having a core diameter of 50 μm. When the emitted light from the other end of the layer 8 was observed with a CCD camera, light guiding in the core layer 8 was confirmed.

  The peel strength of the metal layer 3 was 6.9 N / cm (0.7 kg / cm), and the electrical wiring 9 could be formed on the metal layer 3 by etching.

The reinforcing material used for manufacture of an opto-electrical wiring mixed board is shown, (a) is a front view, (b) is a top view which shows the interface with the metal layer of the support material in a reinforcing material. (A) thru | or (d) are sectional drawings which show the other example of a reinforcing material, respectively. An example of the process at the time of manufacturing an opto-electrical wiring mixed board is shown, (a) thru / or (f) are sectional views, respectively. The other example of the process at the time of manufacturing an opto-electrical wiring mixed board is shown, and (a) thru / or (f) are sectional views, respectively.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Support material 2 Adhesive 3 Metal layer 4 Transparent resin layer 5 Photosensitive transparent resin layer 6 Laminated material 8 Core layer 9 Electrical wiring 12 Transparent resin layer 13 Opto-electrical wiring mixed board

Claims (4)

  A metal layer for forming electrical wiring is laminated on at least one side of the support material, and the support material and the metal layer are bonded to each other by an adhesive provided only at the peripheral edge of the interface, opposite to the support material of the metal layer. Using a laminated material in which a photosensitive transparent resin layer is formed of a photosensitive resin whose solvent solubility is changed or refractive index is changed by irradiation of active energy rays on the side surface, the photosensitive transparent resin layer of the laminated material is used. After forming an optical wiring by forming a core layer by irradiating active energy rays, the support material is peeled from the metal layer in the obtained molded body, and then the metal layer is subjected to wiring processing The manufacturing method of the opto-electrical wiring mixed board.   2. The method for manufacturing an opto-electric wiring mixed substrate according to claim 1, wherein an adhesive made of a thermoplastic resin is used as an adhesive for bonding the metal layer and the support material.   2. The method for manufacturing an opto-electrical wiring mixed substrate according to claim 1, wherein a peelable adhesive is used as an adhesive for adhering the metal layer and the support material. The adhesive for adhering the metal layer and the support material is continuously provided on the peripheral edge of the entire circumference of the interface between the metal layer and the support material. Manufacturing method for opto-electrical wiring mixed board.

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