JP2006019720A - Exposure apparatus, exposure method and method of manufacturing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an exposure apparatus capable of preventing deterioration in exposure accuracy and measurement accuracy caused by contaminated elements. <P>SOLUTION: The exposure apparatus is formed on the bottom surface 2S side of a final optical element 2G nearest the image surface of a projection optical system among a plurality of optical elements forming the projection optical system, and the exposure apparatus is provided with a first space K1 filled with liquid LQ1, and a second space K2 formed differently from the first space K1 on the top surface 2T side of the final element 2G, and filled with a liquid LQ2. The exposure apparatus has a substrate P irradiated with exposure light via the liquid LQ1 of the first space K1, and the liquid LQ2 of the second space K2 to expose the substrate P. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an exposure apparatus that exposes a substrate, an exposure method, and a device manufacturing method.

  Semiconductor devices and liquid crystal display devices are manufactured by a so-called photolithography technique in which a pattern formed on a mask is transferred onto a photosensitive substrate. An exposure apparatus used in this photolithography process has a mask stage for supporting a mask and a substrate stage for supporting a substrate, and a mask pattern is transferred via a projection optical system while sequentially moving the mask stage and the substrate stage. It is transferred to the substrate. In recent years, in order to cope with higher integration of device patterns, higher resolution of the projection optical system is desired. The resolution of the projection optical system becomes higher as the exposure wavelength used is shorter and the numerical aperture of the projection optical system is larger. Therefore, the exposure wavelength used in the exposure apparatus is shortened year by year, and the numerical aperture of the projection optical system is also increasing. The mainstream exposure wavelength is 248 nm of the KrF excimer laser, but the 193 nm of the shorter wavelength ArF excimer laser is also being put into practical use. Also, when performing exposure, the depth of focus (DOF) is important as well as the resolution. The resolution R and the depth of focus δ are each expressed by the following equations.

R = k ₁ · λ / NA (1)
δ = ± k ₂ · λ / NA ² (2)
Here, λ is the exposure wavelength, NA is the numerical aperture of the projection optical system, and k ₁ and k ₂ are process coefficients. From the equations (1) and (2), it can be seen that the depth of focus δ becomes narrower when the exposure wavelength λ is shortened and the numerical aperture NA is increased in order to increase the resolution R.

If the depth of focus δ becomes too narrow, it becomes difficult to match the substrate surface with the image plane of the projection optical system, and the focus margin during the exposure operation may be insufficient. Therefore, as a method for substantially shortening the exposure wavelength and increasing the depth of focus, for example, a liquid immersion method disclosed in Patent Document 1 below has been proposed. This immersion method fills the space between the image plane side end surface (lower surface) of the projection optical system and the substrate surface with a liquid such as water or an organic solvent to form an immersion region, and the wavelength of the exposure light in the liquid is Using 1 / n in air (where n is the refractive index of the liquid, usually about 1.2 to 1.6), the resolution is improved and the depth of focus is increased by about n times. .
International Publication No. 99/49504 Pamphlet

  By the way, when a liquid immersion area is formed on the substrate, there is a possibility that, for example, impurities generated from the substrate are mixed in the liquid in the immersion area and the liquid in the immersion area is contaminated. Then, the contaminated liquid in the immersion area may contaminate an optical element in contact with the contaminated liquid in the immersion area among a plurality of elements (optical elements) constituting the projection optical system. . When the optical element is contaminated, inconveniences such as a decrease in the light transmittance of the optical element and a distribution in the light transmittance occur, leading to deterioration in exposure accuracy and measurement accuracy through the projection optical system.

  The present invention has been made in view of such circumstances, and it is an object of the present invention to provide an exposure apparatus, an exposure method, and a device manufacturing method using the exposure apparatus and exposure method that can prevent deterioration of exposure accuracy and measurement accuracy. And

  In order to solve the above-described problems, the present invention adopts the following configuration corresponding to FIGS. 1 to 9 shown in the embodiment. However, the reference numerals with parentheses attached to each element are merely examples of the element and do not limit each element.

  According to the first aspect of the present invention, in an exposure apparatus that exposes a substrate (P) by irradiating the substrate (P) with exposure light (EL) via the projection optical system (PL), the projection optical system ( Among the plurality of elements (2A to 2G) constituting the PL), the first element (2G) closest to the image plane of the projection optical system (PL) is connected to the optical axis (AX) of the projection optical system (PL). And a first member (2G) formed on one side of the first element (2G) and filled with the liquid (LQ1), and the first element (2G). ) On the other surface side, the second space (K2) is formed independently of the first space (K1) and is filled with the liquid (LQ2), and the substrate is formed with the liquid (LQ1) in the first space (K1). (P) A liquid immersion area (AR2) covering a part of the surface is formed, and the first space ( An exposure apparatus (EX) that exposes the substrate (P) by irradiating the substrate (P) with exposure light (EL) via the liquid (LQ1) of 1) and the liquid (LQ2) of the second space (K2). ) Is provided.

  According to the present invention, it is possible to satisfactorily expose the substrate while securing a large image-side numerical aperture by filling the first and second spaces on the one surface side and the other surface side of the first element with liquid. it can. In addition, for example, when the liquid filled in the first space comes into contact with the substrate, there is a high possibility that one surface side of the first element is contaminated, but the first element can be easily replaced. Therefore, it is only necessary to replace the contaminated first element with a clean element, and exposure and measurement through the projection optical system and the liquid including the clean first element can be performed satisfactorily.

  The first element in the present invention may be a non-refractive power transparent member (for example, a plane parallel plate). For example, the transparent member arranged closest to the image plane side has no effect on the imaging performance of the projection optical system. Even when it does not contribute, the transparent member is regarded as the first element.

  In addition, the first element in the present invention is supported in a substantially stationary state with respect to the optical axis of the projection optical system. However, when the first element is supported so as to be finely movable in order to adjust its position and posture, It is regarded as being supported in a substantially stationary state.

  According to the second aspect of the present invention, in an exposure apparatus that exposes a substrate (P) by irradiating the substrate (P) with exposure light (EL) via the projection optical system (PL), the projection optical system ( PL, the first space (K1) formed on the one surface (2S) side of the first element (2G) closest to the image plane of the projection optical system (PL) among the plurality of elements (2A to 2G) A second space (K1) formed on the other surface (2T) side of the first element (2G), and a connection hole (74) connecting the first space (K1) and the second space (K2). The liquid (LQ) is supplied from one of the first space (K1) and the second space (K2), and the first space (K1) and the second space (K2) are liquidated via the connection hole (74). Liquid supply mechanism (30) for filling with (LQ), and the liquid (LQ in the first space (K1) and the second space (K2) Through the substrate (P) on the exposure light exposure apparatus by irradiating (EL) exposes a substrate (P) (EX) is provided.

  According to the present invention, the liquid supply mechanism supplies the liquid to one of the first space on the one surface side of the first element and the second space on the other surface side, whereby the first and second spaces are connected via the connection hole. Each can be easily filled with liquid. Then, by filling the first and second spaces on the one surface side and the other surface side of the first element with liquid, the substrate can be satisfactorily exposed in a state where a large image-side numerical aperture is secured. In addition, for example, when the liquid filled in the first space comes into contact with the substrate, there is a high possibility that one surface side of the first element is contaminated, but the first element can be easily replaced. Therefore, it is only necessary to replace the contaminated first element with a clean element, and exposure and measurement through the projection optical system and the liquid including the clean first element can be performed satisfactorily.

  The first element in the present invention may be a non-refractive power transparent member (for example, a plane parallel plate). For example, the transparent member arranged closest to the image plane side has no effect on the imaging performance of the projection optical system. Even when it does not contribute, the transparent member is regarded as the first element.

  According to the present invention, there is provided a device manufacturing method using the exposure apparatus according to the first and second aspects.

  According to the present invention, good exposure accuracy and measurement accuracy can be maintained, so that a device having desired performance can be manufactured.

  According to the 3rd aspect of this invention, exposure which exposes the said board | substrate by irradiating exposure light (EL) to a board | substrate (P) via the projection optical system (PL) provided with several element (2A-2G). In the method, the liquid (LQ1) is provided in the first space (K1) on the light emission side of the first element (2G) closest to the image plane of the projection optical system (PL) among the plurality of elements. Supplying the liquid (LQ2) to the second space (K2) on the light incident side of the first element and isolated from the first space (K1), and the liquid (LQ1) and the second space in the first space Irradiating the substrate with exposure light via a liquid (LQ2) in space to expose the substrate, and filling the second space (K2) with liquid while irradiating the substrate with exposure light And stopping the supply of the liquid (LQ2) to the second space in the state A method is provided.

  According to the exposure method of the third aspect of the present invention, the liquid is supplied to the first space on the light emission side and the second space on the light incident side of the first element, and the exposure light is irradiated through the liquid in these spaces. Since the substrate is exposed, the substrate can be exposed with a large image-side numerical aperture secured. In addition, by making the first element removable, the cleaning or replacement can be easily performed even when the first element is contaminated by the liquid in the first space. In addition, since the supply of the liquid to the second space is stopped while the substrate is exposed, vibration caused by the supply of the liquid to the second space is suppressed, and the substrate can be exposed with a desired accuracy. .

  According to the 4th aspect of this invention, exposure which exposes the said board | substrate by irradiating exposure light (EL) to a board | substrate (P) via the projection optical system (PL) provided with several element (2A-2G). A first space (K1) formed on one surface side of the first element (2G) closest to the image plane of the projection optical system among the plurality of elements (2A to 2G); The first space and the second space are filled with the liquid (LQ) by supplying the liquid to one space between the space and the second space (K2) formed on the other surface side, and the first space ( A liquid immersion area (AR2) that covers part of the surface of the substrate (P) is formed with the liquid (LQ1) of K1), and the substrate is irradiated with exposure light via the liquid (LQ) in the first space and the second space. An exposure method comprising exposing the substrate is provided.

  According to the exposure method of the fourth aspect of the present invention, since the first space and the second space are distributed, the liquid is supplied to only one of the spaces, and the liquid is recovered from only one of the spaces. do it. Therefore, equipment necessary for liquid supply and liquid recovery can be simplified, and vibration that may affect the exposure operation can be suppressed.

  According to the present invention, good exposure accuracy and measurement accuracy can be maintained.

  Hereinafter, the exposure apparatus and the exposure method of the present invention will be described with reference to the drawings, but the present invention is not limited thereto.

<First Embodiment>
FIG. 1 is a schematic block diagram that shows an exposure apparatus according to the first embodiment.

   In FIG. 1, an exposure apparatus EX includes a mask stage MST that supports a mask M, a substrate stage PST that supports a substrate P, and an illumination optical system IL that illuminates the mask M supported by the mask stage MST with exposure light EL. A projection optical system PL that projects and exposes the pattern image of the mask M illuminated by the exposure light EL onto the substrate P supported by the substrate stage PST, and a control device CONT that controls the overall operation of the exposure apparatus EX. I have.

   The exposure apparatus EX of the present embodiment is an immersion exposure apparatus to which an immersion method is applied in order to substantially shorten the exposure wavelength to improve the resolution and substantially widen the depth of focus. A first liquid supply mechanism 10 that supplies the liquid LQ1 to the image plane side of the PL, and a first liquid recovery mechanism 20 that recovers the liquid LQ1 on the image plane side of the projection optical system PL are provided. The first liquid supply mechanism 10 includes a lower surface 2S of the final optical element 2G closest to the image plane of the projection optical system PL and the substrate P among the plurality of optical elements 2 (2A to 2G) constituting the projection optical system PL. The liquid LQ1 is supplied to the first space K1 formed therebetween. The first liquid recovery mechanism 20 recovers the liquid LQ1 supplied to the first space K1.

   Further, the exposure apparatus EX includes a second liquid supply mechanism 30 that supplies the liquid LQ2 to the second space K2 formed between the upper surface 2T of the final optical element 2G and the optical element 2F provided above the second optical element 2G, And a second liquid recovery mechanism 60 that recovers the liquid LQ2 supplied to the second space K2. The first space K1 and the second space K2 are independent spaces, and the second liquid supply mechanism 30 can supply the liquid to the second space K2 independently of the first liquid supply mechanism 10. Further, the second liquid recovery mechanism 60 can recover the liquid in the second space K2 independently of the first liquid recovery mechanism 20.

   The exposure apparatus EX uses the liquid LQ2 supplied from the second liquid supply mechanism 30 at least during the transfer of the pattern image of the mask M onto the substrate P (while irradiating the exposure light EL on the substrate P). In a state where the two spaces K2 are filled, the liquid LQ1 supplied from the first liquid supply mechanism 10 has a portion on the substrate P including the projection area AR1 of the projection optical system PL that is larger than the projection area AR1 and larger than the substrate P. A small liquid immersion area AR2 is locally formed. Specifically, the exposure apparatus EX fills the liquid LQ1 in the first space K1 between the final optical element 2G closest to the image plane of the projection optical system PL and the surface of the substrate P disposed on the image plane side, A local liquid immersion method in which a part of the surface of the substrate P is covered with the liquid immersion area AR2 is adopted. The pattern of the mask M is projected and exposed onto the substrate P by irradiating the substrate P with the exposure light EL that has passed through the mask M through the liquid LQ1 in the first space K1 on the 2S side.

   Further, in the vicinity of the image plane of the projection optical system PL, nozzle members (flow path forming members) that constitute a part of the first and second liquid supply mechanisms 10 and 20 and the first and second liquid recovery mechanisms 30 and 60 are provided. ) 70 is arranged. The nozzle member 70 is an annular member provided so as to surround the lower part of the lens barrel PK above the substrate P (substrate stage PST).

   In the present embodiment, the exposure apparatus EX is a scanning exposure apparatus (so-called so-called exposure apparatus EX) that exposes the pattern formed on the mask M onto the substrate P while synchronously moving the mask M and the substrate P in different directions (reverse directions) in the scanning direction. A case where a scanning stepper) is used will be described as an example. In the following description, the direction that coincides with the optical axis AX of the projection optical system PL is the Z-axis direction, the synchronous movement direction (scanning direction) between the mask M and the substrate P in the plane perpendicular to the Z-axis direction is the X-axis direction, A direction (non-scanning direction) perpendicular to the Z-axis direction and the X-axis direction is defined as a Y-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

The illumination optical system IL illuminates the mask M supported by the mask stage MST with the exposure light EL, and an exposure light source, an optical integrator that equalizes the illuminance of the exposure light EL emitted from the exposure light source, It has a condenser lens for condensing the exposure light EL from the optical integrator, a relay lens system, a variable field stop for setting the illumination area on the mask M by the exposure light EL in a slit shape, and the like. A predetermined illumination area on the mask M is illuminated with the exposure light EL having a uniform illuminance distribution by the illumination optical system IL. The exposure light EL emitted from the illumination optical system IL is, for example, far ultraviolet light (DUV light) such as bright lines (g line, h line, i line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp. Alternatively, vacuum ultraviolet light (VUV light) such as ArF excimer laser light (wavelength 193 nm) and F ₂ laser light (wavelength 157 nm) is used. In this embodiment, ArF excimer laser light is used.

   In the present embodiment, the same pure water is used for the liquid LQ1 that fills the first space K1 and the liquid LQ2 that fills the second space K2. Pure water can transmit not only ArF excimer laser light but also far ultraviolet light (DUV light) such as bright lines (g-line, h-line, i-line) emitted from mercury lamps and KrF excimer laser light (wavelength 248 nm). It is.

   The mask stage MST is movable while holding the mask M. For example, the mask M is fixed by vacuum suction (or electrostatic suction). The mask stage MST can be moved two-dimensionally in the plane perpendicular to the optical axis AX of the projection optical system PL, that is, the XY plane, and can be slightly rotated in the θZ direction by a mask stage driving device MSTD including a linear motor or the like. The mask stage MST is movable at a scanning speed specified in the X-axis direction, and the movement stroke in the X-axis direction is such that the entire surface of the mask M can cross at least the optical axis AX of the projection optical system PL. have.

   A movable mirror 41 is provided on the mask stage MST. A laser interferometer 42 is provided at a position facing the movable mirror 41. The position of the mask M on the mask stage MST in the two-dimensional direction and the rotation angle in the θZ direction (including rotation angles in the θX and θY directions in some cases) are measured in real time by the laser interferometer 42, and the measurement result is a control device. Output to CONT. The control device CONT controls the position of the mask M supported by the mask stage MST by driving the mask stage drive device MSTD based on the measurement result of the laser interferometer 42.

   The projection optical system PL projects and exposes the pattern of the mask M onto the substrate P at a predetermined projection magnification β. The image is next to the final optical element 2G and the final optical element 2G provided at the front end portion on the substrate P side. It is composed of a plurality of optical elements 2 (2A to 2G) including an optical element 2F close to the surface. The plurality of optical elements 2A to 2G are supported by the barrel PK in a state of being substantially stationary with respect to the optical axis AX. In the present embodiment, the projection optical system PL is a reduction system having a projection magnification β of, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. The projection optical system PL may be any one of a catadioptric system including a refractive element and a reflective element, a refractive system not including a reflective element, and a reflective system not including a refractive element.

   The substrate stage PST can move while holding the substrate P via the substrate holder PH, can move two-dimensionally in the XY plane, and can be rotated slightly in the θZ direction. Furthermore, the substrate stage PST is also movable in the Z-axis direction, the θX direction, and the θY direction. The substrate P is held by the substrate holder PH by, for example, vacuum suction. The substrate stage PST is driven by a substrate stage driving device PSTD such as a linear motor controlled by the control device CONT.

   A movable mirror 43 is provided on the substrate stage PST. A laser interferometer 44 is provided at a position facing the movable mirror 43. The two-dimensional position and rotation angle of the substrate P on the substrate stage PST are measured in real time by the laser interferometer 44. Although not shown, the exposure apparatus EX performs focus leveling for detecting positional information on the surface of the substrate P supported by the substrate stage PST, as disclosed in, for example, Japanese Patent Laid-Open No. 8-37149. A detection system is provided. The focus / leveling detection system detects position information in the Z-axis direction on the surface of the substrate P and tilt information in the θX and θY directions of the substrate P through or without the liquid LQ1 in the first space K1. In the case of a focus / leveling detection system that detects surface information on the surface of the substrate P without using the liquid LQ1, the surface information on the surface of the substrate P may be detected at a position away from the projection optical system PL. An exposure apparatus that detects surface information on the surface of the substrate P at a position away from the projection optical system PL is disclosed in, for example, US Pat. No. 6,674,510.

   The measurement result of the laser interferometer 44 is output to the control device CONT. The light reception result of the focus / leveling detection system is also output to the control device CONT. The control device CONT drives the substrate stage driving device PSTD based on the detection result of the focus / leveling detection system, and controls the focus position and the tilt angle of the substrate P so that the surface of the substrate P is image plane of the projection optical system PL. And aligning the substrate P in the X-axis direction and the Y-axis direction based on the measurement result of the laser interferometer 44.

   A recess 50 is provided on the substrate stage PST, and a substrate holder PH for holding the substrate P is disposed in the recess 50. The upper surface 51 of the substrate stage PST other than the recess 50 is a flat surface (flat portion) that is substantially the same height (flat) as the surface of the substrate P held by the substrate holder PH. In the present embodiment, the upper surface of the movable mirror 43 is also substantially flush with the upper surface 51 of the substrate stage PST. Since the upper surface 51 that is substantially flush with the surface of the substrate P is provided around the substrate P, there is almost no stepped portion outside the edge portion of the substrate P even when the edge region of the substrate P is subjected to immersion exposure. The liquid immersion area AR2 can be satisfactorily formed by holding the liquid LQ on the image plane side of the projection optical system PL. As long as the liquid LQ1 can be held in the first space K1, there may be a step between the surface of the substrate P and the upper surface 51 of the substrate stage PST. Further, there is a gap of about 0.1 to 2 mm between the edge portion of the substrate P and the flat surface (upper surface) 51 provided around the substrate P, but the liquid is placed in the gap due to the surface tension of the liquid LQ. LQ hardly flows, and the liquid LQ can be held under the projection optical system PL by the upper surface 51 even when the vicinity of the periphery of the substrate P is exposed.

   Further, by making the upper surface 51 liquid repellent, it is possible to suppress the outflow of the liquid LQ to the outside of the substrate P (outside the upper surface 51) during the immersion exposure, and to smoothly collect the liquid LQ even after the immersion exposure. The inconvenience that the liquid LQ remains on the upper surface 51 can be prevented. By forming the upper surface 51 of the substrate stage PST with a material having liquid repellency such as polytetrafluoroethylene (Teflon (registered trademark)), the upper surface 51 can be made liquid repellant. Alternatively, for example, a fluorine-based resin material such as polytetrafluoroethylene, an acrylic resin material, or a silicon-based resin material is applied to the upper surface 51, or a thin film made of the liquid-repellent material is applied. A liquid repellent treatment such as sticking may be performed. Further, the region of the liquid repellent material (the liquid repellent treatment region) may be the entire upper surface 51 or only a part of the region requiring liquid repellency.

 The exposure apparatus EX includes a lens barrel surface plate 5 that supports the projection optical system PL, and a main column 1 that supports the lens barrel surface plate 5 and the mask stage MST. The main column 1 is installed on a base 9 provided on the floor surface. The substrate stage PST is supported on the base 9. The main column 1 is formed with an upper step 7 and a lower step 8 that protrude inward.

   The illumination optical system IL is supported by a support frame 3 fixed to the upper part of the main column 1. A mask surface plate 4 is supported on the upper step 7 of the main column 1 via a vibration isolator 46. Openings MK1 and MK2 that allow the pattern image of the mask M to pass through are formed in the center of the mask stage MST and the mask surface plate 4, respectively. A plurality of gas bearings (air bearings) 45 which are non-contact bearings are provided on the lower surface of the mask stage MST. The mask stage MST is supported in a non-contact manner on the upper surface (guide surface) of the mask surface plate 4 by the air bearing 45, and can be moved two-dimensionally in the XY plane and can be rotated in the θZ direction by the mask stage driving device MSTD. is there.

   A flange PF is provided on the outer periphery of the lens barrel PK that holds the projection optical system PL, and the projection optical system PL is supported by the lens barrel surface plate 5 via the flange PF. An anti-vibration device 47 including an air mount is disposed between the lens barrel surface plate 5 and the lower step portion 8 of the main column 1, and the lens barrel surface plate 5 that supports the projection optical system PL is the main column. 1 is supported through a vibration isolator 47. The vibration isolator 47 vibrationally separates the lens barrel base plate 5 and the main column 1 so that the vibration of the main column 1 is not transmitted to the lens barrel base plate 5 that supports the projection optical system PL. .

   A plurality of gas bearings (air bearings) 48 that are non-contact bearings are provided on the lower surface of the substrate stage PST. A substrate surface plate 6 is supported on the base 9 via a vibration isolator 49 including an air mount. The substrate stage PST is supported in a non-contact manner on the upper surface (guide surface) of the substrate surface plate 6 by an air bearing 48, and can be moved two-dimensionally in the XY plane and slightly rotated in the θZ direction by the substrate stage driving device PSTD. It is. The vibration isolator 49 prevents the vibration of the base 9 (floor surface) and the main column 1 from being transmitted to the substrate surface plate 6 that supports the substrate stage PST in a non-contact manner. (Floor surface) is separated vibrationally.

   The nozzle member 70 is supported on the lower step portion 8 of the main column 1 via a connecting member 52. The connecting member 52 is fixed to the lower step portion 8 of the main column 1, and the nozzle member 70 is fixed to the connecting member 52. The lower step portion 8 of the main column 1 supports the projection optical system PL via the vibration isolator 47 and the lens barrel surface plate 5, and the nozzle member 70 is a lower step portion that supports the projection optical system PL. 8 is supported.

   The main column 1 supporting the nozzle member 70 via the connecting member 52 and the lens barrel surface plate 5 supporting the lens barrel PK of the projection optical system PL via the flange PF are the vibration isolator. 47 is separated vibrationally. Therefore, the vibration generated in the nozzle member 70 is prevented from being transmitted to the projection optical system PL. Further, the main column 1 supporting the nozzle member 70 via the connecting member 52 and the substrate surface plate 6 supporting the substrate stage PST are vibrationally separated via the vibration isolator 49. . Therefore, vibration generated in the nozzle member 70 is prevented from being transmitted to the substrate stage PST via the main column 1 and the base 9. Further, the main column 1 supporting the nozzle member 70 via the connecting member 52 and the mask surface plate 4 supporting the mask stage MST are separated vibrationally via the vibration isolator 46. . Therefore, vibration generated in the nozzle member 70 is prevented from being transmitted to the mask stage MST via the main column 1.

  The first liquid supply mechanism 10 is for supplying the liquid LQ1 to the first space K1 formed on the lower surface 2S side (light emission side) of the final optical element 2G of the projection optical system PL. A first liquid supply section 11 that can be sent out and a supply pipe 13 that connects one end of the first liquid supply section 11 to the first liquid supply section 11 are provided. The first liquid supply unit 11 includes a tank that stores the liquid LQ1, a temperature adjustment device that adjusts the temperature of the supplied liquid LQ1, a filter device that removes foreign matter in the liquid LQ1, a pressure pump, and the like. When forming the liquid immersion area AR2 on the substrate P, the liquid supply mechanism 10 supplies the liquid LQ1 onto the substrate P.

  The first liquid recovery mechanism 20 is for recovering the liquid LQ1 supplied to the first space K1 formed on the lower surface 2S side of the final optical element 2G, and is capable of recovering the liquid LQ1. And a recovery pipe 23 that connects one end of the first liquid recovery part 21 to the first liquid recovery part 21. The first liquid recovery unit 21 includes, for example, a vacuum system (suction device) such as a vacuum pump, a gas-liquid separator that separates the recovered liquid LQ1 and gas, and a tank that stores the recovered liquid LQ1. Note that equipment such as a factory in which the exposure apparatus EX is disposed may be used without providing at least a part of the vacuum system, gas-liquid separator, tank, and the like in the exposure apparatus EX. In order to form the liquid immersion area AR2 on the substrate P, the first liquid recovery mechanism 20 recovers a predetermined amount of the liquid LQ1 on the substrate P supplied from the first liquid supply mechanism 10.

  The second liquid supply mechanism 30 is for supplying the liquid LQ2 to the second space K2 formed on the upper surface 2T side of the final optical element 2G of the projection optical system PL, and is capable of delivering the liquid LQ2. The liquid supply part 31 and the supply pipe | tube 33 which connects the one end part to the 2nd liquid supply part 31 are provided. The second liquid supply unit 31 includes a tank that stores the liquid LQ2, a temperature adjustment device that adjusts the temperature of the supplied liquid LQ2, a filter device that removes foreign matter in the liquid LQ2, a pressure pump, and the like. Note that at least part of the tanks and pressure pumps of the first liquid supply unit 11 and the second liquid supply unit 31 are not necessarily provided in the exposure apparatus EX, and facilities such as a factory in which the exposure apparatus EX is installed. Can be substituted.

  The second liquid recovery mechanism 60 is for recovering the liquid LQ2 supplied to the second space K2 formed on the upper surface 2S side of the final optical element 2G, and can recover the liquid LQ2. And a recovery pipe 63 that connects one end of the second liquid recovery part 61 to the second liquid recovery part 61. The second liquid recovery unit 61 includes, for example, a vacuum system (a suction device) such as a vacuum pump, a gas-liquid separator that separates the recovered liquid LQ2 and gas, and a tank that stores the recovered liquid LQ2. Note that equipment such as a factory in which the exposure apparatus EX is disposed may be used without providing at least a part of the vacuum system, the gas-liquid separator, the tank, and the like in the exposure apparatus EX.

  2 is a cross-sectional view showing the image plane side of the projection optical system PL and the vicinity of the nozzle member 70, and FIG. 3 is a view of the nozzle member 70 as viewed from below.

  2 and 3, the final optical element 2G and the optical element 2F disposed above the final optical element 2G are supported by the lens barrel PK. The final optical element 2G is a parallel flat plate, and the lower surface PKA of the lens barrel PK and the lower surface 2S of the final optical element 2G held by the lens barrel PK are substantially flush with each other. The upper surface 2T and the lower surface 2S of the final optical element 2G supported by the lens barrel PK are substantially parallel to the XY plane. The final optical element (parallel flat plate) 2G is supported substantially horizontally and has no refractive power. Further, the connection portion between the lens barrel PK and the final optical element 2G is sealed. That is, the first space K1 on the lower surface 2S side and the second space K2 on the upper surface 2T side of the final optical element 2G are independent from each other, and the liquid flows between the first space K1 and the second space K2. Is blocked. As described above, the first space K1 is a space between the final optical element 2G and the substrate P, and the liquid immersion area AR2 of the liquid LQ1 is formed in the first space K1. On the other hand, the second space K2 is a part of the internal space of the lens barrel PK, and is a space between the upper surface 2T of the final optical element 2G and the lower surface 2U of the optical element 2F disposed above it.

  The area of the upper surface 2T of the final optical element 2G is substantially the same as or smaller than the area of the lower surface 2U of the optical element 2F facing the upper surface 2T, and the second space K2 is filled with the liquid LQ. In this case, almost the entire upper surface 2T of the final optical element 2G is covered with the liquid LQ.

  The final optical element 2G can be easily attached to and detached from the lens barrel PK. That is, the last optical element 2G is provided so as to be replaceable. In particular, when the final optical element 2G is attached and removed, the final optical element is not detached from the other optical elements in the lens barrel PK and does not affect the optical characteristics of the other optical elements or the projection optical system. The element 2G can be attached to the lens barrel PK. For example, the lens barrel PK is separated into a first holding member that holds the optical element 2F and a second holding member that holds the final optical element 2G, and the second holding member is used as a first holding member using a screw or the like. By setting it as the structure to fix, the 2nd holding member can be removed and the last optical element 2G can be replaced | exchanged easily.

  The nozzle member 70 is disposed in the vicinity of the lower end portion of the projection optical system PL, and is an annular member provided so as to surround the lens barrel PK above the substrate P (substrate stage PST). The nozzle member 70 constitutes a part of each of the first liquid supply mechanism 10 and the first liquid recovery mechanism 20. The nozzle member 70 has a hole 70 </ b> H in which the projection optical system PL (lens barrel PK) can be arranged at the center thereof. In the present embodiment, the projection area AR1 of the projection optical system PL is set to a rectangular shape with the Y-axis direction (non-scanning direction) as the longitudinal direction.

  On the lower surface 70 </ b> A of the nozzle member 70 facing the substrate P, a recess 78 having the longitudinal direction in the Y-axis direction is formed. A hole 70H in which the projection optical system PL (lens barrel PK) can be disposed is formed inside the recess 78. Inside the recess 78, a surface 78A (hereinafter referred to as a cavity surface 78A) that is substantially parallel to the XY plane and faces the substrate P supported by the substrate stage PST is provided. The recess 78 has an inner side surface 79. The inner side surface 79 is provided so as to be substantially orthogonal to the surface of the substrate P supported by the substrate stage PST. Here, the substrate stage PST supports the substrate P so that the surface of the substrate P and the XY plane are substantially parallel. The distance between the final optical element 2G and the substrate P is longer than the distance between the lower surface 70A of the nozzle member 70 and the substrate P.

  Of the lower surface 70 </ b> A of the nozzle member 70, the inner surface 79 of the recess 78 is provided with first supply ports 12 (12 </ b> A, 12 </ b> B) that constitute a part of the first liquid supply mechanism 10. In the present embodiment, two first supply ports 12 (12A, 12B) are provided, and are provided on both sides of the X-axis direction across the optical element 2 (projection area AR1) of the projection optical system PL. Yes. Each of the first supply ports 12A and 12B causes the liquid LQ1 delivered from the first liquid supply unit 11 to be substantially parallel to the surface of the substrate P disposed on the image plane side of the projection optical system PL, that is, substantially parallel to the XY plane. Blow out (laterally).

  The first supply ports 12A and 12B in the present embodiment are formed in a substantially circular shape, but may be formed in an arbitrary shape such as an elliptical shape, a rectangular shape, or a slit shape. In the present embodiment, the first supply ports 12A and 12B have substantially the same size, but may have different sizes. Further, the first supply port may be one place. Further, the first supply ports 12A and 12B may be provided on both sides in the Y-axis direction with respect to the optical element 2 (projection area AR1) of the projection optical system PL.

  On the lower surface 70A of the nozzle member 70, a first recovery port 22 that constitutes a part of the first liquid recovery mechanism 20 is provided outside the recess 78 with reference to the projection area AR1 of the projection optical system PL. The first recovery port 22 is located outside the first supply ports 12A and 12B of the first liquid supply mechanism 10 with respect to the projection region AR1 of the projection optical system PL on the lower surface 70A of the nozzle member 70 facing the substrate P. It is provided away from the first supply ports 12A and 12B with respect to AR1, and is formed in an annular shape so as to surround the projection area AR1 and the first supply ports 12A and 12B. The first recovery port 22 is provided with a porous body 22P. The first recovery port 22 may not be provided in an annular shape so as to surround the projection area AR1 and the first supply ports 12A and 12B, and may be provided discretely, for example. That is, the number, arrangement, shape, and the like of the first recovery ports 22 are not limited to those described above, and any structure that can recover the liquid LQ1 so that the liquid LQ1 does not leak out may be used.

  The nozzle member 70 supported by the lower step portion 8 of the main column 1 via the connecting member 52 is separated from the projection optical system PL (lens barrel PK). That is, a gap is provided between the inner side surface 70K of the hole 70H of the nozzle member 70 and the side surface PKS of the lens barrel PK. This gap is provided for vibrationally separating the projection optical system PL and the nozzle member 70. Thereby, the vibration generated in the nozzle member 70 is prevented from being transmitted to the projection optical system PL side. Further, as described above, the main column 1 (lower step 8) and the lens barrel surface plate 5 are vibrationally separated via the vibration isolator 47. Therefore, the vibration generated in the nozzle member 70 is prevented from being transmitted to the projection optical system PL via the main column 1 and the lens barrel surface plate 5.

  As shown in FIG. 2, the other end portion of the supply pipe 13 is connected to one end portion of the first supply flow path 14 formed inside the nozzle member 70. On the other hand, the other end of the first supply flow path 14 of the nozzle member 70 is connected to the first supply port 12 formed on the inner surface 79 of the recess 78 of the nozzle member 70. Here, the first supply flow path 14 formed inside the nozzle member 70 branches from the middle so that the other end can be connected to each of the plurality (two) of the supply ports 12 (12A, 12B). ing. As shown in FIG. 2, the vicinity of the first supply port 12 in the first supply flow path 14 connected to the first supply port 12 is an inclined surface that gradually expands toward the first supply port 12. The supply port 12 is formed in a trumpet shape.

  The liquid supply operation of the first liquid supply unit 11 is controlled by the control device CONT. In order to form the liquid immersion area AR2, the control device CONT delivers the liquid LQ1 from the first liquid supply unit 11 of the first liquid supply mechanism 10. The liquid LQ1 delivered from the first liquid supply unit 11 flows through the supply pipe 13 and then flows into one end of the first supply flow path 14 formed in the nozzle member 70. Then, the liquid LQ1 flowing into one end of the first supply flow path 14 is branched in the middle, and finally, from a plurality (two) of the first supply ports 12A and 12B formed on the inner surface 79 of the nozzle member 70. It is supplied to the first space K1 between the optical element 2G and the substrate P. Here, in the present embodiment, the liquid LQ1 supplied from the first supply port 12 is blown out substantially parallel to the surface of the substrate P, and therefore, for example, downward from the upper surface of the substrate P to the surface of the substrate P. Compared with the configuration in which the liquid LQ1 is supplied, the force exerted on the substrate P by the supplied liquid LQ1 can be reduced. Therefore, it is possible to prevent the occurrence of inconvenience such as deformation of the substrate P and the substrate stage PST due to the supply of the liquid LQ1. Of course, the first supply port may be formed so that the liquid LQ1 is supplied downward in consideration of the pressure exerted on the substrate P and the substrate stage PST.

  As shown in FIG. 2, the other end of the recovery pipe 23 is connected to one end of a manifold channel 24 </ b> M that constitutes a part of the first recovery channel 24 formed inside the nozzle member 70. On the other hand, the other end portion of the manifold channel 24M is formed in an annular shape in plan view so as to correspond to the first recovery port 22, and constitutes a part of the first recovery channel 24 connected to the first recovery port 22. It is connected to a part of the annular flow path 24K.

  The liquid recovery operation of the first liquid recovery unit 21 is controlled by the control device CONT. The control device CONT drives the first liquid recovery part 21 of the first liquid recovery mechanism 20 in order to recover the liquid LQ1. By driving the first liquid recovery unit 21 having a vacuum system, the liquid LQ1 on the substrate P is directed vertically upward (+ Z direction) to the annular flow path 24K via the first recovery port 22 provided above the substrate P. ). The liquid LQ1 that has flowed into the annular flow path 24K in the + Z direction flows through the manifold flow path 24M after being collected in the manifold flow path 24M. Thereafter, the liquid is sucked and collected by the first liquid recovery unit 21 via the recovery pipe 23.

  A second supply port 32 that constitutes a part of the second liquid supply mechanism 30 is provided on the inner surface PKL of the lens barrel PK. The second supply port 32 is formed in the vicinity of the second space K2 on the inner side surface PKL of the barrel PK, and is provided on the + X side with respect to the optical axis AX of the projection optical system PL. The second supply port 32 blows out the liquid LQ2 delivered from the second liquid supply unit 31 substantially parallel to the upper surface 2T of the final optical element 2G, that is, substantially parallel to the XY plane (laterally). Since the second supply port 32 blows out the liquid LQ2 substantially parallel to the upper surface 2T of the final optical element 2G, the force exerted on the optical elements 2G and 2F by the supplied liquid LQ2 can be reduced. Accordingly, it is possible to prevent inconveniences such as the optical elements 2G, 2F, etc. being deformed or displaced due to the supply of the liquid LQ2.

  In addition, a second recovery port 62 constituting a part of the second liquid recovery mechanism 60 is provided at a predetermined position with respect to the second supply port 32 on the inner side surface PKL of the lens barrel PK. The second recovery port 62 is formed in the vicinity of the second space K2 on the inner side surface PKL of the barrel PK, and is provided on the −X side with respect to the optical axis AX of the projection optical system PL. That is, the second supply port 32 and the second recovery port 62 are opposed to each other. In the present embodiment, the second supply port 32 and the second recovery port 62 are each formed in a slit shape. Note that the second supply port 32 and the second recovery port 62 may be formed in an arbitrary shape such as a substantially circular shape, an elliptical shape, or a rectangular shape. In the present embodiment, each of the second supply port 32 and the second recovery port 62 has substantially the same size, but may have different sizes. Further, the second supply port 32 may be formed in a trumpet shape like the first supply port 12.

  As shown in FIG. 2, the other end of the supply pipe 33 is connected to one end of a second supply flow path 34 formed inside the lens barrel PK. On the other hand, the other end of the second supply channel 34 of the lens barrel PK is connected to a second supply port 32 formed on the inner side surface PKL of the lens barrel PK.

  The liquid supply operation of the second liquid supply unit 31 is controlled by the control device CONT. When the control device CONT sends the liquid LQ2 from the second liquid supply unit 31 of the second liquid supply mechanism 30, the liquid LQ2 sent from the second liquid supply unit 31 flows through the supply pipe 33, and then the lens barrel. It flows into one end of the second supply channel 34 formed inside the PK. Then, the liquid LQ2 that has flowed into the one end of the second supply flow path 34 is second between the optical element 2F and the final optical element 2G from the second supply port 32 formed on the inner surface PKL of the lens barrel PK. It is supplied to the space K2.

  As shown in FIG. 2, the other end of the recovery pipe 63 is connected to one end of a second recovery flow path 64 formed inside the lens barrel PK. On the other hand, the other end of the second recovery channel 64 is connected to a second recovery port 62 formed on the inner side surface PKL of the lens barrel PK.

  The liquid recovery operation of the second liquid recovery unit 61 is controlled by the control device CONT. The control device CONT drives the second liquid recovery unit 61 of the second liquid recovery mechanism 60 in order to recover the liquid LQ2. By driving the second liquid recovery unit 61 having a vacuum system, the liquid LQ2 in the second space K2 flows into the second recovery flow path 64 via the second recovery port 62, and then the second liquid recovery unit 61 via the recovery pipe 63. The two liquid recovery unit 61 performs suction and recovery. Note that the number and arrangement of the second supply ports 32 and the second recovery ports are not limited to those described above, and the optical path of the exposure light EL between the optical element 2F and the optical element 2G is filled with the second liquid LQ2. If it is.

  In this embodiment, the flow paths 34 and 64 are formed inside the lens barrel PK. However, a through hole is provided in a part of the lens barrel PK, and a pipe serving as a flow path is passed therethrough. It may be. In the present embodiment, the supply pipe 33 and the recovery pipe 63 are provided separately from the nozzle member 70. However, instead of the supply pipe 33 and the recovery pipe 63, a supply path and a recovery path are provided inside the nozzle member 70. And may be connected to each of the flow paths 34 and 64 formed inside the lens barrel PK.

  The lower surface 2U of the optical element 2F held by the lens barrel PK is formed in a planar shape and is substantially parallel to the upper surface 2T of the final optical element 2G. On the other hand, the upper surface 2W of the optical element 2F is formed in a convex shape toward the object plane side (mask M side) and has a positive refractive index. Thereby, the reflection loss of light (exposure light EL) incident on the upper surface 2W is reduced, and as a result, a large image-side numerical aperture of the projection optical system PL is secured. Further, the optical element 2F having a refractive index (lens action) is firmly fixed to the lens barrel PK in a well-positioned state.

  The liquid LQ2 filled in the second space K2 is in contact with the lower surface 2U of the optical element 2F and the upper surface 2T of the final optical element 2G, and the liquid LQ1 in the first space K1 is in contact with the lower surface 2S of the final optical element 2G. In the present embodiment, at least the optical elements 2F and 2G are made of quartz. Since quartz has a high affinity with the liquids LQ1 and LQ2 that are water, the liquids LQ1 and LQ2 are in close contact with almost the entire lower surface 2U of the optical element 2F that is the liquid contact surface, the upper surface 2T and the lower surface 2S of the final optical element 2G. Can be made. Accordingly, the liquid LQ1 and LQ2 are brought into close contact with the liquid contact surfaces 2S, 2T, and 2U of the optical elements 2F and 2G, and the optical path between the optical element 2F and the final optical element 2G, and between the final optical element 2G and the substrate P, The optical path between them can be surely filled with the liquids LQ1 and LQ2.

  Further, since quartz is a material having a large refractive index, the size of the optical element 2F and the like can be reduced, and the entire projection optical system PL and the entire exposure apparatus EX can be made compact. Further, since quartz has water resistance, there is an advantage that, for example, it is not necessary to provide a protective film on the liquid contact surfaces 2S, 2T, 2U and the like.

  Note that at least one of the optical elements 2F and 2G may be fluorite having high affinity with water. In this case, it is desirable to form a protective film for preventing dissolution in water on the liquid contact surface of fluorite. Further, for example, the optical elements 2A to 2E may be formed of fluorite, the optical elements 2F and 2G may be formed of quartz, or all of the optical elements 2A to 2G may be formed of quartz (or fluorite). .

Further, the liquid contact surfaces 2S, 2T, and 2U of the optical elements 2F and 2G are subjected to a hydrophilic treatment (lyophilicity) such as adhesion of MgF ₂ , Al ₂ O ₃ , SiO _2, etc. You may make it raise the affinity of. Alternatively, since the liquids LQ1 and LQ2 in the present embodiment are highly polar water, the lyophilic treatment (hydrophilic treatment) can be performed by forming a thin film with a substance having a molecular structure with a large polarity such as alcohol. Hydrophilicity can also be imparted to the liquid contact surfaces 2S, 2T, and 2U of the elements 2F and 2G. That is, when water is used as the liquids LQ1 and LQ2, it is desirable that the liquid contact surfaces 2S, 2T, and 2U have a highly polar molecular structure such as an OH group.

  In the present embodiment, each of the inner side surface PKL of the lens barrel PK and the side surface 2FK of the optical element 2F is subjected to liquid repellency and has liquid repellency. By making each of the inner side surface PKL of the lens barrel PK and the side surface 2FK of the optical element 2F liquid repellent, the liquid LQ2 in the second space K2 enters the gap formed by the inner side surface PKL and the side surface 2FK. In addition, the gas in the gap is prevented from being mixed as bubbles in the liquid LQ2 in the second space K2.

  As the liquid repellency treatment, for example, a fluororesin material such as polytetrafluoroethylene, an acrylic resin material, a silicon resin material or the like is applied, or a thin film made of the liquid repellent material is applied. And the like.

  Further, by applying a liquid repellent treatment to each of the side surface PKS of the lens barrel PK and the inner side surface 70K of the nozzle member 70 to make the side surface PKS and the inner side surface 70K liquid repellent, the inner side surface 70K and the side surface PKS The liquid LQ1 in the first space K1 is prevented from entering the gap formed, and the gas in the gap is prevented from being mixed as bubbles in the liquid LQ1 in the first space K1.

  Note that a seal member such as an O-ring or a V-ring may be disposed between the side surface 2FK of the optical element 2F and the inner side surface PKL of the lens barrel PK. Further, a seal member such as an O-ring or a V-ring may be disposed between the side surface PKS of the lens barrel PK and the inner surface 70K of the nozzle member 70.

  Next, a method for exposing the pattern image of the mask M onto the substrate P using the exposure apparatus EX having the above-described configuration will be described.

  When exposing the substrate P, the control device CONT supplies the liquid LQ2 from the second liquid supply mechanism 30 to the second space K2. The controller CONT optimally controls the supply amount of the liquid LQ2 per unit time by the second liquid supply mechanism 30 and the recovery amount of the liquid LQ2 per unit time by the second liquid recovery mechanism 60, while controlling the second liquid supply mechanism. 30 and the second liquid recovery mechanism 60 supplies and recovers the liquid LQ2, and fills at least the optical path of the exposure light EL in the second space K2 with the liquid LQ2. It should be noted that when the supply of the liquid LQ2 to the second space K2 is started, the second liquid supply is performed in order to suppress the penetration of the liquid LQ2 into the gap between the inner side surface PKL of the barrel PK and the side surface 2FK of the optical element 2F. The supply amount of the liquid LQ2 per unit time by the mechanism 30 may be gradually increased.

  Further, after the substrate P is loaded on the substrate stage PST at the loading position, the control device CONT moves the substrate stage PST holding the substrate P to the exposure optical system, that is, to the exposure position. Then, with the substrate stage PST and the final optical element 2G of the projection optical system PL facing each other, the control device CONT supplies the liquid LQ1 supplied by the first liquid supply mechanism 10 per unit time and the first liquid recovery mechanism. 20, the liquid LQ1 is supplied and recovered by the first liquid supply mechanism 10 and the first liquid recovery mechanism 20 while optimally controlling the recovery amount of the liquid LQ1 per unit time by 20 and at least the exposure in the first space K1. A liquid immersion area AR2 of the liquid LQ1 is formed on the optical path of the light EL, and the optical path of the exposure light EL is filled with the liquid LQ1.

  Here, at a predetermined position on the substrate stage PST, for example, a substrate alignment system as disclosed in JP-A-4-65603 and a mask alignment system as disclosed in JP-A-7-176468. A reference member (measurement member) provided with a reference mark measured by is provided. Further, at a predetermined position on the substrate stage PST, an illuminance unevenness sensor as disclosed in, for example, Japanese Patent Application Laid-Open No. 57-117238, for example, as disclosed in Japanese Patent Application Laid-Open No. 2002-14005, as an optical measurement unit. An aerial image measurement sensor and a dose sensor (illuminance sensor) as disclosed in, for example, Japanese Patent Laid-Open No. 11-16816 are provided. Before the exposure processing of the substrate P, the control device CONT performs mark measurement on the reference member, various measurement operations using the optical measurement unit, and mark detection operation on the substrate P using the substrate alignment system. Based on the measurement result, alignment processing of the substrate P and imaging characteristic adjustment (calibration) processing of the projection optical system PL are performed. For example, when performing a measurement operation using an optical measurement unit, the control device CONT moves the substrate stage PST relative to the liquid immersion area AR2 of the liquid LQ1 by moving the substrate stage PST in the XY directions. The liquid immersion area AR2 of the liquid LQ1 is arranged on the optical measurement unit, and the measurement operation via the liquid LQ1 and the liquid LQ2 is performed in that state. Note that various measurement operations using the reference member and the optical measurement unit may be performed before loading the substrate P to be exposed on the substrate stage PST. Further, the alignment mark on the substrate P may be detected by the substrate alignment system before the immersion area AR2 of the liquid LQ1 is formed on the image plane side of the projection optical system PL.

  After performing the alignment process and the calibration process, the controller CONT performs the liquid LQ1 on the substrate P by the first liquid recovery mechanism 20 in parallel with the supply of the liquid LQ1 to the substrate P by the first liquid supply mechanism 10. The pattern image of the mask M is transferred to the projection optical system PL, the liquid LQ2 in the second space K2, and the first while moving the substrate stage PST supporting the substrate P in the X-axis direction (scanning direction). Projection exposure is performed on the substrate P via the liquid LQ1 in the space K1 (that is, the liquid in the liquid immersion area AR2).

  The exposure apparatus EX in the present embodiment projects and exposes the pattern image of the mask M onto the substrate P while moving the mask M and the substrate P in the X-axis direction (scanning direction). A partial pattern image of the mask M is projected into the projection area AR1 through the system PL and the liquids LQ1 and LQ2 in the first and second spaces K1 and K2, and the mask M is in the −X direction (or + X direction). In synchronization with the movement at the speed V, the substrate P moves in the + X direction (or −X direction) with respect to the projection area AR1 at the speed β · V (β is the projection magnification). A plurality of shot areas are set on the substrate P, and after the exposure to one shot area is completed, the next shot area is moved to the scanning start position by the stepping movement of the substrate P. Hereinafter, step-and-scan The scanning exposure process for each shot area is sequentially performed while moving the substrate P by the method.

  In the present embodiment, the final optical element 2G made of a plane-parallel plate is disposed under the optical element 2F having a lens action. However, the first and second surfaces on the lower surface 2S side and the upper surface 2T side of the final optical element 2G are arranged. By filling the liquids LQ1 and LQ2 in the two spaces K1 and K2, respectively, reflection loss on the lower surface 2U of the optical element 2F and the upper surface 2T of the final optical element 2G is reduced, and a large image-side numerical aperture of the projection optical system PL is increased. The substrate P can be satisfactorily exposed in the secured state.

  Even during the exposure of the substrate P, the supply and recovery of the liquid LQ2 by the second liquid supply mechanism 30 and the second liquid recovery mechanism 60 are continued. Further, the supply and recovery of the liquid LQ2 by the second liquid supply mechanism 30 and the second liquid recovery mechanism 60 are continued before and after the exposure of the substrate P. By continuing supply and recovery of the liquid LQ2 by the second liquid supply mechanism 30 and the second liquid recovery mechanism 60, the liquid LQ2 in the second space K2 is always replaced with a fresh (clean) liquid LQ2. The exposure may be performed in a state where the liquid LQ2 is stored in the second space K2 without supplying and collecting the liquid LQ2 to the second space K2, but the temperature of the liquid LQ2 changes due to the exposure light EL irradiation, The imaging characteristics through the liquid of the projection optical system PL may vary. Accordingly, the temperature of the liquid LQ2 in the second space K2 is suppressed by constantly supplying the temperature-adjusted liquid LQ2 from the second liquid supply mechanism 30 and collecting the liquid LQ2 by the second liquid recovery mechanism 60. Can do. Similarly, the liquid LQ1 in the first space K1 is always fresh (clean) by constantly supplying and recovering the liquid LQ1 by the first liquid supply mechanism 10 and the first liquid recovery mechanism 20 during the irradiation of the exposure light EL. It is exchanged for liquid LQ1. The temperature change of the liquid LQ1 in the first space K1 (that is, the liquid LQ1 in the immersion area AR2 on the substrate P) can be suppressed. In addition, since the liquids LQ1 and LQ2 are always supplied and recovered and the clean liquids LQ1 and LQ2 are kept flowing, bacteria (such as bacteria) are generated in the first and second spaces K1 and K2, and the cleanliness is deteriorated. It is also possible to prevent the occurrence of inconvenience.

  If the temperature change or the like of the liquid LQ2 in the second space K2 does not affect the exposure accuracy, the exposure is performed with the liquid LQ2 stored in the second space K2, and the predetermined processing interval or predetermined processing substrate is used. The liquid LQ2 in the second space K2 may be exchanged for each number. In this case, since the supply and recovery of the liquid LQ2 by the second liquid supply mechanism 30 and the second liquid recovery mechanism 60 are stopped during the irradiation of the exposure light EL (for example, during the exposure of the substrate P), the supply of the liquid LQ2 The vibration and displacement of the optical element 2F due to (the flow of the liquid LQ2) are prevented, and various measurement operations using the exposure of the substrate P and the above-described optical measurement unit can be performed with high accuracy.

  When the exposure of the substrate P is completed, the control device CONT stops the supply of the liquid LQ1 by the first liquid supply mechanism 10, and uses the first liquid recovery mechanism 20 and the like to use the liquid LQ1 (first space) in the immersion area AR2. All the liquid LQ1) of K1 is recovered. Further, the control device CONT collects the droplets of the liquid LQ1 remaining on the substrate P and the substrate stage PST using the first recovery port 22 of the first liquid recovery mechanism 20 and the like. On the other hand, the controller CONT continues to supply and recover the liquid LQ2 of the second liquid supply mechanism 30 and the second liquid recovery mechanism 60 even after the exposure of the substrate P is completed, and causes the liquid LQ2 to flow into the second space K2. to continue. By doing this, as described above, the cleanliness of the second space K2 is deteriorated, or due to vaporization (drying) of the liquid LQ2, adhesion marks (so-called water) are formed on the liquid contact surfaces 2U, 2T of the optical elements 2F, 2G. It is possible to prevent the occurrence of inconvenience such as the formation of a mark. Then, after the liquid LQ1 on the substrate P is recovered, the control device CONT moves the substrate stage PST supporting the substrate P to the unload position and unloads it. When the substrate stage PST is moved to a position (for example, a load position or an unload position) that is separated from the projection optical system PL, a predetermined member having a flat surface is disposed on the image plane side of the projection optical system PL. The space (first space) between the predetermined member and the projection optical system PL may be continuously filled with the liquid LQ1.

  By the way, the liquid LQ1 in the liquid immersion area AR2 (first space K1) is contaminated by impurities generated from the substrate P such as foreign matters caused by the photosensitive agent (photoresist). there's a possibility that. Since the liquid LQ1 in the immersion area AR2 also contacts the lower surface 2S of the final optical element 2G, there is a possibility that the lower surface 2S of the final optical element 2 is contaminated by the contaminated liquid LQ1. Further, there is a possibility that impurities floating in the air adhere to the lower surface 2S of the final optical element 2G exposed on the image plane side of the projection optical system PL.

  In the present embodiment, since the final optical element 2G can be easily attached to and detached from (replaceable with) the lens barrel PK, only the contaminated final optical element 2G is cleaned. By exchanging with, it is possible to prevent deterioration in exposure accuracy and measurement accuracy via the projection optical system PL due to contamination of the optical element. On the other hand, the clean liquid LQ2 is constantly flowing into the second space K2, so that the liquid LQ2 in the second space K2 does not come into contact with the substrate P. In addition, since the second space K2 is a substantially closed space surrounded by the optical elements 2F and 2G and the lens barrel PK, impurities floating in the air are unlikely to enter the liquid LQ2 in the second space K2, and the optical Impurities hardly adhere to the element 2F. Therefore, the cleanliness of the lower surface 2U of the optical element 2F and the upper surface 2T of the final optical element 2G is maintained. Therefore, only by exchanging the final optical element 2G, it is possible to prevent a decrease in the transmittance of the projection optical system PL and maintain exposure accuracy and measurement accuracy.

  As described above, the first space K1 on the lower surface 2T side of the final optical element 2G and the second space K2 on the upper surface 2S side are independent spaces, and the liquid LQ1 and the liquid LQ1, respectively in the first space K1 and the second space K2. Since exposure is performed while satisfying LQ2, the exposure light EL that has passed through the mask M is converted into a part of the lower surface 2U of the optical element 2F, a part of the upper surface 2T of the final optical element 2G, and a lower surface 2S of the final optical element 2G. It is possible to satisfactorily reach the substrate P through a part thereof.

  Then, by making it possible to easily replace the final optical element 2G that is highly likely to be contaminated, it is possible to perform good exposure using the projection optical system PL including the clean final optical element 2G. A configuration in which the liquid in the immersion area AR2 is brought into contact with the optical element 2F without providing the final optical element 2G made of a plane-parallel plate is also conceivable. However, when the image-side numerical aperture of the projection optical system PL is increased, the optical element The effective diameter of the optical element 2F must be increased, and the optical element 2F must be enlarged. Since various measuring devices such as the nozzle member 70 as described above and an alignment system (not shown) are arranged around the optical element 2F, exchanging such a large optical element 2F is a work It is difficult and difficult. Furthermore, since the optical element 2F has a refractive index (lens action), in order to maintain the optical characteristics (imaging characteristics) of the entire projection optical system PL, the optical element 2F is positioned with a high positioning accuracy with the lens barrel PK. It is necessary to attach to. In the present embodiment, since the final optical element 2G is provided with a relatively small plane-parallel plate and the final optical element 2G is replaced, the replacement work can be easily performed with good workability, and the projection optical system PL It is also possible to maintain the optical characteristics. The first and second liquid supply mechanisms are capable of independently supplying and collecting the liquids LQ1 and LQ2 to the first space K1 on the lower surface 2S side and the second space K2 on the upper surface 2T side of the final optical element 2G. 10, 30 and the first and second liquid recovery mechanisms 20 and 60 provide the projection optical system PL with the exposure light EL emitted from the illumination optical system IL while maintaining the cleanliness of the liquids LQ1 and LQ2. It is possible to satisfactorily reach the substrate P disposed on the image plane side.

  In the present embodiment, the liquid LQ2 is filled in the second space K2 so as to wet almost the entire area of the lower surface 2U of the optical element 2F and the upper surface 2T of the final optical element 2G, but the liquid LQ2 is exposed to exposure light. It is only necessary to fill a part of the second space K2 so as to be arranged on the EL optical path. In other words, the second space K2 only needs to be sufficiently filled with the liquid LQ2. Similarly, the first space K1 only needs to be sufficiently filled with the liquid LQ1.

  In the embodiment described with reference to FIGS. 1 to 3, the mechanism for locally forming the liquid immersion area AR <b> 2 on the substrate P is the first liquid supply mechanism 10 and the first liquid recovery mechanism 20 (nozzle member 70). ) And various forms of mechanisms can be used. For example, a mechanism disclosed in European Patent Application Publication EP1420298 (A2) can also be used.

Second Embodiment
Next, a second embodiment will be described with reference to FIG. In the following description, the same or equivalent components as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  A characteristic part of this embodiment is that a connection hole 74 for connecting the first space K1 and the second space K2 is provided. A plurality of connection holes 74 are provided at predetermined intervals in the circumferential direction on the lower surface of the barrel PK. Each of the connection holes 74 is provided with a porous body 74P.

  Moreover, in this embodiment, the 1st liquid supply mechanism (10) containing the 1st supply port which supplies a liquid directly to 1st space K1 is not provided. Further, the second liquid recovery mechanism (60) including the second recovery port that directly recovers the liquid in the second space K2 is not provided. The exposure apparatus EX in the present embodiment includes a second liquid supply mechanism 30 that supplies the liquid LQ to the second space K2, and a first liquid recovery mechanism 20 that recovers the liquid LQ in the first space K1 (immersion area AR2). I have.

  In the present embodiment, the seal member 100 that prevents the liquid LQ in the first space K1 from entering the gap between the side surface of the lens barrel PK and the nozzle member 70 is provided. The seal member 100 is preferably formed of a member such as flexible rubber or silicon from the viewpoint of preventing vibration of the nozzle member 70 from being transmitted to the lens barrel PK. The seal member 100 may not be provided. As described in the first embodiment, for example, by making the side surface of the lens barrel PK and the inner side surface 70T of the nozzle member 70 liquid repellent, the first gap to the gap is provided. The penetration of the liquid LQ1 in the first space K1 and the mixing of gas into the liquid LQ in the first space K1 can be prevented.

  When filling the liquid LQ in the first space K1 and the second space K2, the control device CONT supplies the liquid LQ to the second space K2 using the second liquid supply mechanism 30. The liquid LQ supplied to the second space K2 is also supplied to the first space K1 through the connection hole 74. The second liquid supply mechanism 30 supplies the liquid LQ from the second space K2, and causes the liquid LQ to flow into the first space K1 via the connection hole 74, thereby connecting the first space K1 and the second space K2. Fill with liquid LQ. The liquid LQ supplied to the first space K1 through the connection hole 74 forms a liquid immersion area AR2 on the substrate P, and the liquid LQ in the liquid immersion area AR2 is the first recovery port of the first liquid supply mechanism 20. 22 is recovered. Then, after the first space K1 and the second space K2 are filled with the liquid LQ, the control device CONT emits the exposure light EL onto the substrate P via the liquid LQ in the first space K1 and the second space K2. Irradiate to expose the substrate P. In the present embodiment, the liquid LQ may be supplied to the first space K1 by using the first liquid supply mechanism 10 together.

  Thus, by connecting the first space K1 and the second space K2 via the connection hole 74, the device configuration can be simplified.

  In addition, after the liquid LQ is filled in the first space K1, the liquid LQ filled in the first space K1 is caused to flow into the second space K2 through the connection hole 74, whereby the first space K1 and the second space are filled. K2 may be filled with the liquid LQ. In this case, since the liquid LQ in contact with the substrate P is filled in the second space K2, for example, if a chemical filter or the like is disposed in the connection hole 74, the second space K2 can enter the second space K2 from above the substrate P or the like. The liquid LQ mixed with the generated impurities is not filled.

<Third Embodiment>
Next, a third embodiment will be described with reference to FIG.

   The characteristic part of this embodiment is that the final optical element 2G is supported by the nozzle member 70. That is, the final optical element 2G is supported separately from the other optical elements 2A to 2F constituting the projection optical system PL.

   In FIG. 5, the optical element 2F is exposed from the lens barrel PK. Among the plurality of optical elements 2A to 2G constituting the projection optical system PL, the optical elements 2A to 2F are supported by the lens barrel PK. On the other hand, the final optical element 2G is supported by the nozzle member 70 via the connecting member 72. The nozzle member 70 which is an annular member is disposed in the vicinity of the optical elements 2F and 2G at the tip of the projection optical system PL, and surrounds the optical elements 2F and 2G above the substrate P (substrate stage PST). Is provided. That is, the optical elements 2F and 2G are arranged inside the hole 70H of the nozzle member 70. The hole 70 </ b> H is formed inside the recess 78.

   The final optical element 2G is held on the cavity surface 78A of the nozzle member 70 via the connecting member 72. The connecting member 72 is fixed to the cavity surface 78A of the nozzle member 70, and the final optical element 2G is fixed to the connecting member 72. The final optical element 2G held by the nozzle member 70 via the connecting member 72 is separated from the optical elements 2A to 2F held by the lens barrel PK, and the upper surface 2T of the final optical element 2G and the lower surface of the optical element 2F A second space 2K is formed between 2U. The final optical element 2G is configured to be supported by the nozzle member 70 via the connecting member 72 in a state separated from the other optical elements 2A to 2F held by the lens barrel PK.

   The lower surface 72A of the connecting member 72 and the lower surface 2S of the final optical element 2G made of a plane parallel plate held by the connecting member 72 are substantially flush with each other. The upper surface 2T and the lower surface 2S of the final optical element 2G supported by the connecting member 72 are substantially parallel to the XY plane. Further, the connecting portion between the connecting member 72 and the cavity surface 78A, the connecting portion between the final optical element 2G and the connecting member 72, and the like are sealed. The connecting member 72 is a substantially plate-like member and is not provided with a hole or the like. That is, the first space K1 on the lower surface 2S side of the final optical element 2G and the second space K2 on the upper surface 2T side are independent spaces, and the liquid flows between the first space K1 and the second space 2K. Is blocked.

   Further, the final optical element 2G can be easily attached to and detached from the connecting member 72. That is, the last optical element 2G is provided so as to be replaceable. In order to replace the final optical element 2G, the connecting member 72 may be provided so as to be attachable / detachable (replaceable) to the nozzle member 70 (cavity surface 78A), or the nozzle member 70 may be replaced. Also good.

   Of the lower surface 70A of the nozzle member 70, the inner surface 79 inside the recess 78 has a first supply port 12 (12A, 12B) that constitutes a part of the first liquid supply mechanism 10 as in the first embodiment. Is provided. Further, on the lower surface 70A of the nozzle member 70, on the outer side of the recess 78 with reference to the projection area AR1 of the projection optical system PL, the first liquid constituting the first liquid recovery mechanism 20 is formed as in the first embodiment. A recovery port 22 is provided.

   The nozzle member 70 supported by the lower step portion 8 of the main column 1 via the connecting member 52 is separated from the projection optical system PL (optical element 2F). That is, a gap is provided between the inner surface 70K of the hole 70H of the nozzle member 70 and the side surface 2FK of the optical element 2F, and also between the lens barrel PK that holds the optical element 2F and the nozzle member 70. A gap is provided. These gaps are provided for vibrationally separating the projection optical system PL (optical elements 2A to 2F) and the nozzle member 70 from each other. Thereby, the vibration generated in the nozzle member 70 is prevented from being transmitted to the projection optical system PL side. Further, as described above, the main column 1 (lower step 8) and the lens barrel surface plate 5 are vibrationally separated via the vibration isolator 47. Therefore, vibration generated in the nozzle member 70 is prevented from being transmitted to the projection optical system PL via the main column 1 and the lens barrel surface plate 5.

   A second supply port 32 that constitutes a part of the second liquid supply mechanism 30 is provided on the inner surface 70 </ b> K of the nozzle member 70. The second supply port 32 blows out the liquid LQ2 delivered from the second liquid supply unit 31 substantially parallel to the upper surface 2T of the final optical element 2G, that is, substantially parallel to the XY plane (laterally). Since the second supply port 32 blows out the liquid LQ2 substantially parallel to the upper surface 2T of the final optical element 2G, the force exerted on the optical element 2G and the like by the supplied liquid LQ2 can be reduced. Therefore, it is possible to prevent inconveniences such as the optical element 2G, the connecting member 72, or the optical element 2F being deformed or displaced due to the supply of the liquid LQ2.

   A second recovery port 62 that constitutes a part of the second liquid recovery mechanism 60 is provided at a predetermined position on the inner surface 70 </ b> K of the nozzle member 70 with respect to the second supply port 32. In the present embodiment, the second recovery port 62 is provided above the second supply port 32.

   FIG. 6 is a schematic perspective view showing the nozzle member 70. As shown in FIG. 6, a plurality of second supply ports 32 are provided on the inner surface 70 </ b> K of the nozzle member 70. In the present embodiment, the second supply ports 32 are provided at substantially equal intervals in the circumferential direction on the inner side surface 70K. Similarly, a plurality of second recovery ports 62 are provided on the inner surface 70K of the nozzle member 70. In the present embodiment, the second recovery ports 62 are substantially equidistant in the circumferential direction above the second supply port 32. Is provided.

   In FIG. 6, the second supply port 32 and the second recovery port 62 are formed in a substantially circular shape, but may be formed in an arbitrary shape such as an elliptical shape, a rectangular shape, or a slit shape. In the present embodiment, each of the second supply port 32 and the second recovery port 62 has substantially the same size, but may have different sizes. Further, the second supply port 32 may be disposed above the second recovery port 62. In addition to the configuration in which each of the second supply port 32 and the second recovery port 62 is arranged in the circumferential direction on the inner side surface 70K, for example, the inner side 70K has the second optical axis AX of the projection optical system PL on the + X side across the optical axis AX. The arrangement of the two supply ports 32 and the second recovery port 62 on the −X side can be arbitrarily set. That is, also in the present embodiment, the number, arrangement, shape, and the like of the second supply port 32 and the second recovery port 62 are not limited to the structures shown in FIGS. 5 and 6, and the optical element 2F and the optical element 2G Any structure may be used as long as the optical path of the exposure light EL is filled with the second liquid LQ.

   In the embodiment described with reference to FIG. 2, the second supply port 32 and the second recovery port 62 may be formed on the inner surface PKL of the lens barrel PK in the arrangement as shown in FIG.

   As shown in FIG. 5, the other end of the supply pipe 33 is connected to one end of a second supply flow path 34 formed inside the nozzle member 70. On the other hand, the other end of the second supply flow path 34 of the nozzle member 70 is connected to a second supply port 32 formed on the inner side surface 70 </ b> K of the nozzle member 70. Here, the second supply flow path 34 formed inside the nozzle member 70 is branched from the middle so that the other end can be connected to each of the plurality of second supply ports 32. The second supply port 32 may be formed in a trumpet shape like the first supply port 12.

   The liquid supply operation of the second liquid supply unit 31 is controlled by the control device CONT. When the control device CONT delivers the liquid LQ2 from the second liquid supply unit 31 of the second liquid supply mechanism 30, the liquid LQ2 sent from the second liquid supply unit 31 flows through the supply pipe 33, and then the nozzle member. It flows into one end portion of the second supply flow path 34 formed inside 70. Then, after the liquid LQ2 that has flowed into one end of the second supply channel 34 branches off in the middle, the optical element 2F and the final optical element are supplied from the plurality of second supply ports 32 formed on the inner surface 70K of the nozzle member 70. It is supplied to the second space K2 between 2G.

   As shown in FIG. 5, the other end of the recovery pipe 63 is connected to a part of the second recovery flow path 44 formed inside the nozzle member 70. On the other hand, the other end of the second recovery flow path 44 is connected to a second recovery port 62 formed on the inner surface 70 </ b> K of the nozzle member 70. Here, the second recovery flow path 64 formed inside the nozzle member 70 is branched from the middle so that the other end can be connected to each of the plurality of second recovery ports 62.

   The liquid recovery operation of the second liquid recovery unit 61 is controlled by the control device CONT. The control device CONT drives the second liquid recovery unit 61 of the second liquid recovery mechanism 60 in order to recover the liquid LQ2. By driving the second liquid recovery unit 61 having a vacuum system, the liquid LQ2 in the second space K2 flows into the second recovery flow path 64 via the second recovery port 62, and then the second liquid recovery unit 61 via the recovery pipe 63. The two liquid recovery unit 61 performs suction and recovery.

 Further, in the present embodiment, each of the inner side surface 70K of the nozzle member 70 and the side surface 2FK of the optical element 2F is liquid-repellent and has liquid repellency. By making each of the inner side surface 70K of the nozzle member 70 and the side surface 2FK of the optical element 2F liquid repellent, the liquid LQ2 in the second space K2 enters the gap formed by the inner side surface 70K and the side surface 2FK. In addition, the gas in the gap is prevented from being mixed as bubbles in the liquid LQ2 in the second space K2.

   As described above, the final optical element 2G and the other optical elements 2A to 2F are separated and supported, and the first space K1 on the lower surface 2T side and the second space K2 on the upper surface 2S side of the final optical element 2G are independent. Since the first space K1 and the second space K2 are filled with the liquids LQ1 and LQ2 for exposure, the exposure light EL that has passed through the mask M can reach the substrate P satisfactorily.

   Further, by supporting the final optical element 2G with the nozzle member 70, the lens barrel PK may not be disposed between the optical elements 2F and 2G and the nozzle member 70. Therefore, the nozzle member 70 can be brought closer to the optical elements 2F and 2G, and the apparatus can be made compact, and the degree of freedom in designing the apparatus can be improved. Further, the first supply port 12 and the first recovery port 22 formed in the nozzle member 70 can be brought close to the projection area AR1. Therefore, the size of the liquid immersion area AR2 can be reduced. Therefore, it is not necessary to increase the size of the substrate stage PST or increase the movement stroke of the substrate stage PST in accordance with the size of the liquid immersion area AR2, so that the apparatus can be made compact.

   The nozzle member 70 is a member having a supply port 12 and a recovery port 22 for supplying and recovering liquid in the liquid immersion area AR2 (first space K1), and accompanying the movement of the substrate P (substrate stage PST). Since the shearing force of the liquid in the liquid immersion area AR2 is received, the nozzle member 70 is likely to vibrate. However, in the present embodiment, since the optical element 2G held by the nozzle member 70 is a parallel plate, the influence of the vibration of the nozzle member 70 on the accuracy of exposure and measurement can be suppressed. On the other hand, as described above, since vibration is hardly generated in the lens barrel PK by the vibration isolator 47 or the like, the lens barrel PK is used as in the first and second embodiments described with reference to FIGS. By supporting the final optical element 2G, the influence on the imaging characteristics of the projection optical system PL can be suppressed.

   In the case where the final optical element 2G is supported by the nozzle member 70, the vibration generated in the nozzle member 70 is caused to vibrate by the vibration isolation mechanism provided between the nozzle member 70 and the final optical element 2G. Can be prevented from being transmitted to. The vibration and displacement of the optical element 2F due to the supply of the liquid LQ2 (flow of the liquid LQ2) are prevented, and various measurement operations using the exposure of the substrate P and the above-described optical measurement unit can be performed with high accuracy.

<Fourth embodiment>
Next, a fourth embodiment will be described with reference to FIG. The characteristic part of the present embodiment is that a connecting hole 74 is provided in the connecting member 72 to connect the first space K1 and the second space K2. A plurality of connection holes 74 are provided in the connection member 72 at predetermined intervals in the circumferential direction. Each of the connecting holes 74 is provided with a porous body 74P.

  Moreover, in this embodiment, the 1st liquid supply mechanism (10) containing the 1st supply port which supplies a liquid directly to 1st space K1 is not provided. Further, the second liquid recovery mechanism (60) including the second recovery port that directly recovers the liquid in the second space K2 is not provided. On the other hand, the exposure apparatus EX in the present embodiment has a second liquid supply mechanism 30 that supplies the liquid LQ to the second space K2, and a first liquid recovery mechanism that recovers the liquid LQ in the first space K1 (immersion area AR2). 20 is provided.

  When filling the liquid LQ in the first space K1 and the second space K2, the control device CONT supplies the liquid LQ to the second space K2 using the second liquid supply mechanism 20. The liquid LQ supplied to the second space K2 is also supplied to the first space K1 through the connection hole 74. As described above, the second liquid supply mechanism 30 supplies the liquid LQ from the second space K2 and causes the liquid LQ to flow into the first space K1 via the connection hole 74, whereby the first space K1 and the second space L2 are supplied. The space K2 is filled with the liquid LQ. The liquid LQ supplied to the first space K1 through the connection hole 74 forms a liquid immersion area AR2 on the substrate P, and the liquid LQ in the liquid immersion area AR2 is the first recovery port of the first liquid supply mechanism 20. 22 is recovered. Then, after the first space K1 and the second space K2 are filled with the liquid LQ, the control device CONT emits the exposure light EL onto the substrate P via the liquid LQ in the first space K1 and the second space K2. Irradiate to expose the substrate P.

  Thus, by connecting the first space K1 and the second space K2 via the connection hole 74, the device configuration can be simplified. In the present embodiment as well, the first space K1 is filled with the liquid LQ, and then the liquid LQ filled in the first space K1 is caused to flow into the second space K2 via the connection hole 74. The space K1 and the second space K2 may be filled with the liquid LQ.

  In the third and fourth embodiments described above, the final optical element 2G is supported by the nozzle member 70 having the liquid flow paths for the first space K1 and the second space K2, but the first space The final optical element 2G may be supported by the nozzle member 70 having a liquid flow path for either K1 or the second space K2.

 The final optical element 2G may be supported by a nozzle member having only a supply port for supplying a liquid to at least one of the first space K1 and the second space, or at least one of the first space K1 and the second space. The final optical element 2G may be supported by a nozzle member having only a recovery port for recovering the liquid.

 In the third and fourth embodiments described above, the final optical element 2G is supported by the nozzle member 70. However, the present invention is not limited to this, and the final optical element is a member different from the lens barrel PK and the nozzle member 70. 2G may be supported.

   Further, the configuration in which the final optical element 2G employed in the third and fourth embodiments described above is supported by the nozzle member 70 may be employed in an immersion exposure method in which only the first space K1 is filled with liquid. it can.

   In the first to fourth embodiments described above, the projection optical system PL is adjusted so as to have predetermined imaging characteristics including the final optical element 2G which is a plane-parallel plate having no refractive power. When the final optical element 2G has no influence on the image formation characteristics, the image formation characteristic of the projection optical system PL may be adjusted to be a predetermined image formation characteristic except for the final optical element 2G. .

   In the first to fourth embodiments described above, the final optical element 2G is a plane-parallel plate having no refractive power, but may be an optical element having refractive power. That is, the upper surface 2T of the final optical element 2G may have a curvature. In this case, in order to facilitate replacement of the final optical element 2G, it is desirable that the curvature of the upper surface 2T of the final optical element 2G is as small as possible.

   In the first to fourth embodiments described above, the liquid LQ1 in the first space K1 is thicker than the liquid LQ2 in the second space K2 on the optical axis AX of the projection optical system PL. That is, the distance between the final optical element 2G and the optical element 2F is shorter than the distance between the final optical element 2G and the substrate P, but the liquid LQ2 in the second space K2 may be thicker than the liquid LQ1 in the first space K1. It may be the same thickness. Furthermore, in the first to fourth embodiments described above, the thickness of the final optical element 2G is thinner than the liquid LQ1 in the first space K1 and the liquid LQ2 in the second space K2 in the Z-axis direction. However, the final optical element 2G may be thickest. That is, the thickness in the Z-axis direction of the liquid LQ1 in the first space K1, the liquid LQ2 in the second space K2, and the final optical element 2G is projected onto the substrate P through the liquids LQ1, LQ2, and the final optical element 2G. What is necessary is just to determine suitably so that the image formation state of the pattern to be optimized. As an example, the thickness of the liquid LQ1 and the liquid LQ2 on the optical axis AX can be 5 mm or less, and the thickness of the final optical element 2G can be 3 to 12 mm.

   In the first to fourth embodiments described above, the final optical element 2G is supported in a substantially stationary state with respect to the optical axis AX of the projection optical system PL. In order to adjust the position and inclination of the final optical element 2G. In addition, it may be supported so as to be movable minutely. For example, by placing an actuator on the support portion of the final optical element 2G, the position (X axis direction, Y axis direction, Z axis direction) and inclination (θX direction, θY direction) of the final optical element 2G can be automatically adjusted. You may do it. In this case, when the final optical element 2G is held by the nozzle member 70 as in the third and fourth embodiments, the position and / or inclination of the final optical element 2G is adjusted by adjusting the position and inclination of the nozzle member. Alternatively, the inclination may be adjusted.

   In the first to fourth embodiments described above, such as an interferometer that measures the position (X-axis direction, Y-axis direction, Z-axis direction) and inclination (θX direction, θY direction) of the final optical element 2G. A measuring instrument may be further provided. It is desirable that this measuring instrument can measure the position and inclination with respect to the optical elements 2A to 2F. By mounting such a measuring instrument, the position and inclination of the final optical element 2G can be easily known, and when used in combination with the actuator described above, the position and inclination of the final optical element 2G can be adjusted with high accuracy. can do.

   Further, as described in the third and fourth embodiments, when the final optical element 2G is supported separately from the optical element 2F, the pressure and vibration that the final optical element 2G receives from the liquid LQ1 are directly applied. Since it does not conduct to the optical elements 2A to 2F, it is possible to suppress the deterioration of the imaging characteristics of the projection optical system PL. In this case, if the final optical element 2G is softly held or the position and inclination of the final optical element 2G are adjusted according to the inclination of the substrate P (inclination of the substrate stage PST), the optical elements 2A to 2F are more effectively transferred. Pressure and vibration can be suppressed.

<Fifth Embodiment>
Next, another embodiment of the recovery method of the first liquid recovery mechanism 20 in the above-described first to fourth embodiments will be described. In the present embodiment, only the liquid LQ is recovered from the first recovery port 22, thereby suppressing the occurrence of vibration due to the liquid recovery.

  Hereinafter, the principle of the liquid recovery operation by the first liquid recovery mechanism 20 in the present embodiment will be described with reference to the schematic diagram of FIG. As the porous member 25, for example, a thin plate-like porous member (mesh member) in which a large number of holes are formed is provided in the first recovery port 22 of the first liquid recovery mechanism 20 described in relation to FIGS. Can be used. In the present embodiment, the porous member is made of titanium. Further, in this embodiment, by controlling the pressure difference between the upper surface and the lower surface of the porous member 25 so as to satisfy a predetermined condition described later while the porous member 25 is wet, the liquid LQ is discharged from the hole of the porous member 25. Only to collect. The parameters relating to the above-mentioned predetermined conditions include the pore diameter of the porous member 25, the contact angle (affinity) of the porous member 25 with the liquid LQ, and the suction force of the first liquid recovery unit 21 (pressure on the upper surface of the porous member 25). Etc.

  FIG. 8 is an enlarged view of a partial cross section of the porous member 25 and shows a specific example of the liquid recovery performed through the porous member 25. A substrate P is disposed under the porous member 25, and a gas space and a liquid space are formed between the porous member 25 and the substrate P. More specifically, a gas space is formed between the first hole 25Ha of the porous member 25 and the substrate P, and a liquid space is formed between the second hole 25Hb of the porous member 25 and the substrate P. . Such a situation can occur, for example, at the end of the immersion area AR2 shown in FIG. 2 or when a gas space is generated in the immersion area AR2 for some reason. In addition, a channel space that forms a part of the first recovery channel 24 is formed on the porous member 25.

In FIG. 8, the pressure in the space between the first hole 25Ha of the porous member 25 and the substrate P (pressure on the lower surface of the porous member 25H) is Pa, and the pressure in the flow path space above the porous member 25 (upper surface of the porous member 25). Pb, the hole diameter (diameter) of the first and second holes 25Ha, 25Hb is d, the contact angle of the porous member 25 (inside the hole 25H) with the liquid LQ is θ, and the surface tension of the liquid LQ is γ. As
(4 × γ × cos θ) / d ≧ (Pa−Pb) (3)
When the above condition is satisfied, as shown in FIG. 8, even if a gas space is formed below the first hole 25Ha (substrate P side) of the porous member 25, the gas in the space below the porous member 25 remains. It is possible to prevent movement (intrusion) into the space above the porous member 25 through the hole 25Ha. That is, by optimizing the contact angle θ, the hole diameter d, the surface tension γ, the pressure Pa, and Pb of the liquid LQ so as to satisfy the condition of the above expression (3), the interface between the liquid LQ and the gas is a porous member. It is maintained in the 25 holes 25Ha, and the intrusion of gas from the first holes 25Ha can be suppressed. On the other hand, since the liquid space is formed below the second hole 25Hb (substrate P side) of the porous member 25, only the liquid LQ can be recovered through the second hole 25Hb.

  Note that, in the condition of the above formula (3), the hydrostatic pressure of the liquid LQ on the porous member 25 is not considered for the sake of simplicity.

  In the present embodiment, the first liquid recovery mechanism 20 includes the pressure Pa in the space below the porous member 25, the diameter d of the hole 25H, and the contact angle θ with the liquid LQ of the porous member 25 (the inner surface of the hole 25H). The surface tension γ of the liquid (pure water) LQ is constant, and the suction force of the first liquid recovery unit 21 is controlled to satisfy the above expression (3). The pressure is adjusted. However, in the above equation (3), the larger (Pa−Pb), that is, the greater ((4 × γ × cos θ) / d), the more the control of the pressure Pb that satisfies the above equation (3). Since it becomes easy, it is desirable that the diameter d of the holes 25Ha and 25Hb and the contact angle θ (0 <θ <90 °) of the porous member 25 with the liquid LQ be as small as possible.

 In the above description using FIGS. 1, 2, 4, 5, 7, and 8 and the like, the bottom surface 2S of the final optical element 2G and the bottom surface 2S of the final optical element 2G are opposed to each other. The first space K1 between the substrate P and the substrate P is filled with the liquid LQ1, but the projection optical system PL is also used when the projection optical system PL and another member (for example, the upper surface 51 of the substrate stage PST) face each other. Needless to say, a liquid can be filled between and other members.

   As described above, pure water was used as the liquids LQ1 and LQ2 in the present embodiment. Pure water has an advantage that it can be easily obtained in large quantities at a semiconductor manufacturing factory or the like, and has no adverse effect on the photoresist, optical element (lens), etc. on the substrate P. In addition, pure water has no adverse effects on the environment, and since the impurity content is extremely low, it can be expected to clean the surface of the substrate P and the surface of the optical element provided on the front end surface of the projection optical system PL. . When the purity of pure water supplied from a factory or the like is low, the exposure apparatus may have an ultrapure water production device.

   The refractive index n of pure water (water) with respect to the exposure light EL having a wavelength of about 193 nm is said to be approximately 1.44. When ArF excimer laser light (wavelength 193 nm) is used as the light source of the exposure light EL, On the substrate P, the wavelength is shortened to 1 / n, that is, about 134 nm, and a high resolution can be obtained. Furthermore, since the depth of focus is enlarged by about n times, that is, about 1.44 times compared with that in the air, the projection optical system PL can be used when it is sufficient to ensure the same depth of focus as that in the air. The numerical aperture can be further increased, and the resolution is improved in this respect as well.

   2 and 5 described above, the same pure water is supplied as the liquids LQ1 and LQ2, but is supplied to the pure water (liquid LQ1) supplied to the first space and the second space. The quality of the pure water (liquid LQ2) may be different. Examples of the quality of pure water include temperature, temperature uniformity, temperature stability, specific resistance value, TOC (total organic carbon) value, dissolved gas concentration (dissolved oxygen, dissolved nitrogen), and the like. For example, the quality of pure water supplied to the first space K1 closer to the image plane of the projection optical system PL may be made higher than that of pure water supplied to the second space K2. Alternatively, different types of liquids may be supplied to the first space and the second space, and the liquid LQ1 filling the first space K1 and the liquid LQ2 filling the second space K2 may be different types. For example, those having different refractive indexes and / or transmittances for the exposure light EL can be used. In addition, for example, the second space K2 can be filled with a predetermined liquid other than pure water including fluorinated oil. Since the oil is a liquid with a low probability of propagation of bacteria such as bacteria, the cleanliness of the flow path through which the second space K2 and the liquid LQ2 (fluorinated oil) flow can be maintained.

Further, both the liquids LQ1 and LQ2 may be liquids other than water. For example, when the light source of the exposure light EL is an F ₂ laser, the F ₂ laser light does not transmit water, so that the liquids LQ1 and LQ2 can transmit F ₂ laser light, for example, perfluorinated polyether (PFPE). ) Or fluorine-based fluids such as fluorine-based oils. In this case, a lyophilic treatment is performed by forming a thin film with a substance having a molecular structure with a small polarity including fluorine, for example, in a portion that contacts the liquids LQ1 and LQ2. In addition, the liquids LQ1 and LQ2 are other than the liquid LQ1 and LQ2 that are transmissive to the exposure light EL, have a refractive index as high as possible, and are stable with respect to the photoresist applied to the projection optical system PL and the surface of the substrate P ( For example, cedar oil) can be used. Also in this case, the surface treatment is performed according to the polarities of the liquids LQ1 and LQ2 used.

In the immersion method as described above, the numerical aperture NA of the projection optical system may be 0.9 to 1.3. When the numerical aperture NA of the projection optical system becomes large in this way, the imaging performance may deteriorate due to the polarization effect with random polarized light conventionally used as exposure light. desirable. In that case, linearly polarized illumination is performed in accordance with the longitudinal direction of the line pattern of the mask (reticle) line-and-space pattern. From the mask (reticle) pattern, the S-polarized light component (TE-polarized light component), that is, the line pattern It is preferable that a large amount of diffracted light having a polarization direction component is emitted along the longitudinal direction. When the space between the projection optical system PL and the resist applied on the surface of the substrate P is filled with a liquid, the space between the projection optical system PL and the resist applied on the surface of the substrate P is filled with air (gas). Compared with the case where the transmittance of the diffracted light of the S-polarized component (TE-polarized component) contributing to the improvement of the contrast is high on the resist surface, the numerical aperture NA of the projection optical system exceeds 1.0. Even in this case, high imaging performance can be obtained. Further, it is more effective to appropriately combine a phase shift mask and an oblique incidence illumination method (particularly a dipole illumination method) or the like according to the longitudinal direction of the line pattern as disclosed in JP-A-6-188169. In particular, the combination of the linearly polarized illumination method and the diball illumination method is used when the periodic direction of the line-and-space pattern is limited to a predetermined direction, or when the hole pattern is closely packed along the predetermined direction It is effective when For example, when illuminating a halftone phase shift mask (pattern with a half pitch of about 45 nm) with a transmittance of 6% using both the linearly polarized illumination method and the dipole illumination method, a diball is formed on the pupil plane of the illumination system. If the illumination σ defined by the circumscribed circle of the two luminous fluxes is 0.95, the radius of each luminous flux on the pupil plane is 0.125σ, and the numerical aperture of the projection optical system PL is NA = 1.2, the randomly polarized light is The depth of focus (DOF) can be increased by about 150 nm rather than using it.

  Further, for example, an ArF excimer laser is used as the exposure light, and a fine line and space pattern (for example, a line and space of about 25 to 50 nm) is formed on the substrate by using the projection optical system PL with a reduction magnification of about 1/4. When exposing on P, depending on the structure of the mask M (for example, the fineness of the pattern and the thickness of chrome), the mask M acts as a polarizing plate due to the Wave guide effect, and the P-polarized component (TM polarized light) that lowers the contrast. More diffracted light of the S-polarized component (TE polarized component) is emitted from the mask M than the diffracted light of the component. In this case, it is desirable to use the above-mentioned linearly polarized illumination, but even if the mask M is illuminated with random polarized light, it is high even when the numerical aperture NA of the projection optical system PL is as large as 0.9 to 1.3. Resolution performance can be obtained.

  When an extremely fine line-and-space pattern on the mask M is exposed on the substrate P, the P-polarized component (TM-polarized component) is larger than the S-polarized component (TE-polarized component) due to the Wire Grid effect. For example, an ArF excimer laser is used as exposure light, and a line and space pattern larger than 25 nm is exposed on the substrate P using the projection optical system PL with a reduction magnification of about 1/4. In this case, since the diffracted light of the S polarization component (TE polarization component) is emitted from the mask M more than the diffracted light of the P polarization component (TM polarization component), the numerical aperture NA of the projection optical system PL is 0.9. High resolution performance can be obtained even when the value is as large as -1.3.

  Furthermore, not only linearly polarized illumination (S-polarized illumination) matched to the longitudinal direction of the line pattern of the mask (reticle) but also a circle centered on the optical axis as disclosed in JP-A-6-53120. A combination of the polarization illumination method that linearly polarizes in the tangential (circumferential) direction and the oblique incidence illumination method is also effective. In particular, when not only a line pattern extending in a predetermined direction but also a plurality of line patterns extending in different directions (a mixture of line and space patterns having different periodic directions) is included in the mask (reticle) pattern, Similarly, as disclosed in Japanese Patent Laid-Open No. 6-53120, an aperture of the projection optical system can be obtained by using both the polarization illumination method that linearly polarizes in the tangential direction of the circle centered on the optical axis and the annular illumination method. Even when the number NA is large, high imaging performance can be obtained. For example, a polarized illumination method and an annular illumination method (annular ratio) in which a half-tone phase shift mask having a transmittance of 6% (a pattern having a half pitch of about 63 nm) is linearly polarized in a tangential direction of a circle around the optical axis. 3/4), when the illumination σ is 0.95 and the numerical aperture of the projection optical system PL is NA = 1.00, the depth of focus (DOF) is more than that of using randomly polarized light. If the projection optical system has a numerical aperture NA = 1.2 with a pattern with a half pitch of about 55 nm, the depth of focus can be increased by about 100 nm.

  The substrate P in each of the above embodiments is not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Further, as the exposure apparatus EX, a reduced image of the first pattern is projected with the first pattern and the substrate P being substantially stationary (for example, a refraction type projection optical system that does not include a reflecting element at 1/8 reduction magnification). The present invention can also be applied to an exposure apparatus that performs batch exposure on the substrate P using the above. In this case, after that, with the second pattern and the substrate P substantially stationary, a reduced image of the second pattern is collectively exposed onto the substrate P by partially overlapping the first pattern using the projection optical system. It can also be applied to a stitch type batch exposure apparatus. Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved. The present invention can also be applied to an exposure apparatus that includes a measurement stage on which a measurement member and a sensor are mounted separately from the stage that holds the substrate P. An exposure apparatus provided with a measurement stage is described in, for example, European Patent Publication No. 1,041,357.

  The present invention can also be applied to a twin (multi) stage type exposure apparatus disclosed in JP-A-10-163099, JP-A-10-214783, JP 2000-505958A, and the like.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ) Or an exposure apparatus for manufacturing reticles or masks.

  In the above-described embodiment, a light transmissive mask (reticle) in which a predetermined light shielding pattern (or phase pattern / dimming pattern) is formed on a light transmissive substrate is used. Instead of this reticle, for example, the United States As disclosed in Japanese Patent No. 6,778,257, an electronic mask that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed may be used.

  Further, as disclosed in International Publication No. 2001/035168, an exposure apparatus (lithography system) that forms a line and space pattern on a wafer W by forming interference fringes on the wafer W. The present invention can also be applied.

 In the above-described embodiment, an exposure apparatus that locally fills the space between the projection optical system PL and the substrate P with a liquid is employed. However, for example, JP-A-6-124873, JP-A-10-303114, As described in detail in US Pat. No. 5,825,043 and the like, the present invention can also be applied to an immersion exposure apparatus in which the entire surface of a substrate to be exposed is covered with a liquid.

   When using a linear motor (see USP5,623,853 or USP5,528,118) for the substrate stage PST and mask stage MST, use either an air levitation type using air bearings or a magnetic levitation type using Lorentz force or reactance force. Also good. Each stage PST, MST may be a type that moves along a guide, or may be a guideless type that does not have a guide.

   As a driving mechanism for each stage PST, MST, a planar motor that drives each stage PST, MST by electromagnetic force with a magnet unit having a two-dimensionally arranged magnet and an armature unit having a two-dimensionally arranged coil facing each other is provided. It may be used. In this case, either one of the magnet unit and the armature unit may be connected to the stages PST and MST, and the other of the magnet unit and the armature unit may be provided on the moving surface side of the stages PST and MST.

   As described in JP-A-8-166475 (USP 5,528,118), the reaction force generated by the movement of the substrate stage PST is not transmitted to the projection optical system PL, but mechanically using a frame member. You may escape to the floor (ground).

   As described in JP-A-8-330224 (US S / N 08 / 416,558), a frame member is used so that the reaction force generated by the movement of the mask stage MST is not transmitted to the projection optical system PL. May be mechanically released to the floor (ground).

   As described above, the exposure apparatus EX according to the present embodiment maintains various mechanical subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

   As shown in FIG. 9, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a base material of the device. Manufacturing step 203, exposure processing step 204 for exposing the mask pattern onto the substrate by the exposure apparatus EX of the above-described embodiment, device assembly step (including dicing process, bonding process, packaging process) 205, inspection step 206, etc. It is manufactured after.

It is a schematic block diagram which shows 1st Embodiment of the exposure apparatus of this invention. It is a principal part enlarged view of FIG. It is the figure which looked at the nozzle member from the lower part. It is a principal part enlarged view which shows 2nd Embodiment of the exposure apparatus of this invention. It is a principal part enlarged view which shows 3rd Embodiment of the exposure apparatus of this invention. It is a schematic perspective view of a nozzle member. It is a principal part enlarged view which shows 4th Embodiment of the exposure apparatus of this invention. It is a figure for demonstrating the liquid collection | recovery operation | movement in the 1st liquid collection | recovery mechanism in the exposure apparatus of 5th Embodiment of this invention. It is a flowchart figure which shows an example of the manufacturing process of a semiconductor device.

Explanation of symbols

2 (2A to 2G): optical element (element), 2S: lower surface, 2T ... upper surface, 10: first liquid supply mechanism, 20: first liquid recovery mechanism, 30: second liquid supply mechanism, 60: second liquid Recovery mechanism, 70 ... nozzle member (flow path forming member), 74 ... connecting hole, EL ... exposure light, EX ... exposure apparatus, K1 ... first space, K2 ... second space, LQ (LQ1, LQ2) ... liquid, P ... substrate, PL ... projection optical system

Claims (34)

In an exposure apparatus that exposes the substrate by irradiating exposure light onto the substrate via a projection optical system,
A support member that supports the first element closest to the image plane of the projection optical system among the plurality of elements constituting the projection optical system in a substantially stationary state with respect to the optical axis of the projection optical system;
A first space formed on one side of the first element and filled with a liquid;
A second space formed on the other surface side of the first element independently of the first space and filled with a liquid;
An immersion region is formed to cover a part of the substrate surface with the liquid in the first space, and exposure light is irradiated onto the substrate through the liquid in the first space and the liquid in the second space. An exposure apparatus for exposing the substrate.   2. The exposure apparatus according to claim 1, wherein the liquid in the first space is different from the liquid in the second space. The projection optical system has a second element close to the image plane of the projection optical system after the first element,
The exposure apparatus according to claim 1, further comprising a support member that supports the first element and the second element.   The exposure apparatus according to claim 1, wherein the first element is supported separately from other elements constituting the projection optical system. A first liquid supply mechanism for supplying a liquid to the first space;
The exposure apparatus according to claim 1, further comprising a first liquid recovery mechanism that recovers the liquid supplied to the first space. A flow path disposed around the first element so as to face the substrate and capable of holding a liquid between the substrate and a liquid flow path to be recovered by the first liquid recovery mechanism. Further comprising a forming member,
6. The exposure apparatus according to claim 5, wherein a recovery port for recovering the liquid is formed on at least a part of the lower surface of the flow path forming member.  The exposure apparatus according to claim 6, wherein the flow path forming member is also formed with a flow path for the liquid supplied by the first liquid supply mechanism.  The exposure apparatus according to claim 7, wherein the flow path forming member has a liquid supply port of the first liquid supply mechanism formed on both sides of the first element.  The exposure apparatus according to any one of claims 6 to 8, wherein a distance between the first element and the substrate is longer than a distance between a lower surface of the flow path forming member and the substrate. The projection optical system has a second element close to the image plane of the projection optical system after the first element,
The exposure apparatus according to claim 9, wherein a distance between the first element and the second element is shorter than a distance between the first element and the substrate.   The first element is held by a flow path forming member in which at least one of a liquid flow path supplied by the first liquid supply mechanism and a liquid flow path recovered by the first liquid recovery mechanism is formed. 6. The exposure apparatus according to claim 5, wherein   12. The flow path forming member is also formed with a flow path for supplying liquid to the second space independently of the liquid supply to the first space. Exposure equipment.   The exposure apparatus according to claim 1, further comprising a second liquid supply mechanism that supplies a liquid to the second space.   The exposure apparatus according to claim 13, further comprising a second liquid recovery mechanism that recovers the liquid supplied to the second space.   15. The exposure apparatus according to claim 14, wherein the liquid in the second space is exchangeable.  The exposure apparatus according to claim 13, wherein the liquid supply by the second liquid supply mechanism is stopped during the exposure of the substrate.   The exposure apparatus according to claim 5, wherein a porous member is disposed in the liquid recovery port of the first liquid recovery mechanism. In an exposure apparatus that exposes the substrate by irradiating exposure light onto the substrate via a projection optical system,
A first space formed on one surface side of the first element closest to the image plane of the projection optical system among the plurality of elements constituting the projection optical system;
A second space formed on the other surface side of the first element;
A connecting hole for connecting the first space and the second space;
A liquid supply mechanism for supplying liquid from one of the first space and the second space, and filling the first space and the second space with the liquid via the connection hole;
An exposure apparatus that exposes the substrate by irradiating exposure light onto the substrate through the liquid in the first space and the second space.    The exposure apparatus according to claim 1, wherein the first element is a plane parallel plate.    The exposure apparatus according to claim 1, wherein the liquid in the first space is pure water.    21. The exposure apparatus according to claim 20, wherein the liquid in the second space is pure water. The projection optical system has a second element close to the image plane of the projection optical system after the first element,
The first element is disposed so as to face the substrate surface, the first surface through which the exposure light passes, and the second surface disposed so as to face the second element, through which the exposure light passes. Have
The second element is disposed to face the second surface of the first element, and has a third surface through which the exposure light passes,
The exposure apparatus according to any one of claims 1 to 21, wherein an area of the second surface is the same as an area of the third surface or smaller than an area of the third surface.    The exposure apparatus according to claim 1, wherein the first element has no refractive power.    24. A device manufacturing method using the exposure apparatus according to any one of claims 1 to 23. An exposure method for exposing the substrate by irradiating the substrate with exposure light via a projection optical system comprising a plurality of elements,
Providing a liquid in the first space on the light exit side of the first element closest to the image plane of the projection optical system among the plurality of elements;
Supplying a liquid to a second space on the light incident side of the first element and isolated from the first space;
Irradiating the substrate with exposure light through the liquid in the first space and the liquid in the second space to expose the substrate;
An exposure method comprising: stopping the supply of liquid to the second space while the second space is filled with liquid while irradiating the substrate with exposure light.  26. The exposure method according to claim 25, wherein the liquid is independently supplied to the first space and the second space when the liquid is brought to the first space and the second space, respectively.  27. The exposure method according to claim 26, further comprising recovering the liquid independently from each of the first space and the second space.   28. The exposure method according to any one of claims 25 to 27, wherein when bringing the liquid into the first space, the liquid is blown into the first space in parallel with the substrate.   The exposure method according to any one of claims 25 to 28, wherein an immersion region is formed on a part of the substrate with the liquid in the first space.   30. The flow path forming member disposed in the vicinity of the first element and the liquid is held between the first element and the substrate to form a liquid immersion region on a part of the substrate. Exposure method.  The exposure method according to claim 30, wherein the liquid in the first space is recovered from a recovery port formed in at least a part of the lower surface of the flow path forming member.  32. The exposure method according to claim 30, wherein a distance between the first element and the substrate is longer than a distance between a lower surface of the flow path forming member and the substrate. The projection optical system has a second element close to the image plane of the projection optical system after the first element,
33. The exposure method according to any one of claims 25 to 32, wherein a distance between the first element and the second element is shorter than a distance between the first element and the substrate. An exposure method for exposing the substrate by irradiating the substrate with exposure light via a projection optical system comprising a plurality of elements,
Of the plurality of elements, a first space formed on one surface side of the first element closest to the image plane of the projection optical system, and a second space circulated with the first space and formed on the other surface side The first space and the second space are filled with liquid by supplying liquid to one of the spaces,
Forming a liquid immersion region that covers a part of the surface of the substrate with the liquid in the first space, and exposing the substrate by irradiating the substrate with exposure light through the liquid in the first space and the second space; Including an exposure method.

Images