JP2006013699A - Package for electronic component, and manufacturing method of package for electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To extend a mount area of a surface of a base on which the electronic components are mounted without disturbing downsizing. <P>SOLUTION: The package 3 comprises the base 31 and a cover 32. The cover 32 comprises a folded flat plate of an L-shape including two faces. Further, a sealing film 33 made of a metallic material is formed to the lower side of the cover 32. The base 31 comprises a rectangular solid bottom part 34 and a wall part 35 formed along the three sides of the front side 341 of the bottom part 34 and no wall part 35 is formed on one side 342 for forming an opening. A mount region 36 for mounting a crystal vibration chip 2 is formed to the front side 341 of the base 31. A joining region 37 for joining with the cover 32 is formed to a wall surface 351 of the wall part 35 of the base 31 and one side face 311 of the bottom part 34. The joining region 37 is formed with a metallic film 38 made of a metallic material. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electronic component package for hermetically sealing the inside and a method for manufacturing the electronic component package.

  Currently, communication devices and electronic devices are being downsized. For this reason, downsizing of electronic components provided in equipment is also progressing with downsizing of equipment.

  An electronic component provided in a device needs to be hermetically sealed in order to obtain its electrical characteristics, and the following electronic component package is used for hermetic sealing.

  An electronic component package that hermetically seals an electronic component includes a base on which a mounting area for mounting the electronic component is formed and a lid for hermetically sealing the mounting area (for example, see Patent Document 1). reference.).

  An electronic component package described in Patent Document 1 described below includes a base having an open surface and a lid that seals the surface of the base and hermetically seals the electronic component mounted in the mounting region. .

The substrate has a concave side surface cross section and an open end surface on the surface. A bonding region for bonding the lid is formed on the opening end surface of the base body, and a bonding material is provided in the bonding region. The base body and the lid are joined by performing seam welding via a joining material, and the electronic component is hermetically sealed.
JP 2001-144201 A

  When the electronic component package described in Patent Document 1 is downsized, the mounting area and the bonding area formed on the surface of the base body are also reduced along with the downsizing.

  However, in order to obtain the electrical characteristics of the electronic component, it is necessary to secure a mounting area, and in order to secure the mounting area in a miniaturized base, it is necessary to reduce the bonding area on the surface of the base.

  Regarding the reduction of the bonding area, a quartz crystal vibrating piece is taken as an example of an electronic component as follows.

  At present, ceramic is used for the base of the crystal vibrating piece, and the width of the opening end face of the base, that is, the width of the bonding region (seal path width) cannot be set to less than 0.15 mm due to the characteristics of the ceramic. That is, there is a limit to the reduction of the bonding area.

  Accordingly, in order to solve the above-described problems, the present invention provides an electronic component package and an electronic component package manufacturing method for expanding a mounting area for mounting an electronic component on the surface of a base without hindering downsizing. For the purpose.

  In order to achieve the above object, an electronic component package according to the present invention includes a base on which a mounting area for mounting an electronic component is formed, and a lid for hermetically sealing the mounting area. In the electronic component package in which the electronic component is mounted in the mounting region, and the base and the lid are joined and the electronic component is hermetically sealed, the joint region of the base for joining to the lid is a side surface. Of at least one surface.

  According to the present invention, the bonding region of the base body to be bonded to the lid is formed on at least one of the side surfaces. Therefore, after securing the bonding region of the base body in the package, the base body It is possible to expand the mounting area on which the electronic component is mounted on the surface. Therefore, even when the package is downsized, it is possible to obtain the characteristics of the electronic component.

  The said structure WHEREIN: The said joining area | region may be formed in at least one surface of the front and back of the said base | substrate.

  In this case, the bonding region is formed on at least one surface of the front and back surfaces of the base body, so that the base body and the lid are bonded not only to the side surface but also to at least one surface of the front and back surfaces. It becomes possible to increase the bonding strength with the lid.

  In the above configuration, the lid may be formed by bending a plate-like body.

  In this case, since the lid is formed by bending a plate-like body, the shape of the lid can be easily formed.

  In the above configuration, the lid may be configured by bonding at least two plate-like bodies with an angle.

  In this case, since the lid is configured by bonding at least two plate-like bodies with an angle, it is preferable in the case of the lid having a shape that is difficult to be formed by bending the plate-like body. For example, the present invention is preferable in the case where a plurality of plate-like bodies are bonded to each of different sides of a single plate-like body.

  The said structure WHEREIN: The said joining area | region may be formed in the several surface of the said base | substrate, and the joining melting | fusing point of each said surface of the said joining area | region may differ.

  In this case, the bonding region is formed by a plurality of surfaces of the base, and the bonding melting points of the respective surfaces of the bonding region are different. Therefore, the lid and the base are bonded to each other using a difference in bonding melting points. It becomes possible. For example, the lid and the base are joined on a surface having a low joining melting point, and then the lid and the base are joined on a surface having a high joining melting point, thereby joining the base and the lid one by one. Can be done. As a result, even when joining to a plurality of surfaces, it is possible to suppress a deviation in the surface direction on each surface. Further, excess molten gas generated in the bonding region does not remain in the hermetically sealed package.

  The said structure WHEREIN: The said joining area | region may be formed in the several surface of the said base | substrate, and the joining melting | fusing point of each said surface of the said joining area | region may be the same.

  In this case, since the bonding region is formed by a plurality of surfaces of the base and the bonding melting points of the surfaces of the bonding region are the same, it is possible to bond the base and the lid at a time. Time can be reduced.

  In the above configuration, the lid has opposing surfaces and one end of each of the opposing surfaces is configured as a free end, and at least one of the opposing surfaces is inclined and arranged in a direction in which the free end approaches the opposing surface. May be.

  In this case, the lid has opposing surfaces and one end of each of the opposing surfaces is configured as a free end, and at least one of the opposing surfaces is inclined so as to approach the opposing surface side where the free end faces. Therefore, when the lid is arranged at the joining position of the base body, the lid is held on the base body by the free end, and the lid is easily arranged at the preset holding position of the base body. .

  The said structure WHEREIN: The area of the edge part which is the boundary of the said surface which is the said joining area | region of the said base | substrate may be expanded.

  In this case, since the area of the ridge portion, which is the boundary between the continuous surfaces in the bonding region of the base body, is enlarged, the bonding surface between the lid and the base body in the ridge portion is increased, and a gap is generated. It becomes possible to suppress.

  The said structure WHEREIN: The said ridge part may be formed in a curved surface.

  In this case, since the ridge portion is formed in a curved surface, it is possible to suppress the generation of a gap by increasing the joining surface by making the contact point between the lid and the base in the ridge portion continuous.

  The said structure WHEREIN: The said ridge part may be formed in the slope whose inclination angle is an obtuse angle.

  In this case, since the ridge portion is formed on a slope having an obtuse angle, it is possible to increase the joint surface at the ridge portion and suppress the generation of a gap.

  The said structure WHEREIN: The said base | substrate may be formed from an insulator, the said joining area | region may be formed with a metal object, and a sealing material may be formed in the joint surface with the base | substrate of the said lid | cover.

  In this case, the base is formed of the insulator and the metal in the joining region, and the sealing material is formed on the joint surface of the lid with the base. It becomes easy to form the bonding region.

  In the above configuration, the metal object formed on the side surface of the base body may be used as a ground terminal.

  In this case, since the metal object formed on the side surface of the base is used as a ground terminal, the number of parts can be reduced without making the ground terminal easy.

  In the above configuration, the electronic component is preferably a piezoelectric vibrating piece. As a suitable example, it is preferable to use a quartz crystal vibrating piece as the piezoelectric vibrating piece, and it becomes possible to obtain good electrical characteristics.

  Furthermore, in order to achieve the above object, a method for manufacturing an electronic component package according to the present invention includes a base on which a mounting area for mounting an electronic component is formed, and a lid that hermetically seals the mounting area. In the method for manufacturing an electronic component package, in which an electronic component is mounted on a mounting region of the base, and the base and the lid are bonded to hermetically seal the electronic component, the base is bonded to be bonded to the lid The bonding region forming step of forming the region on a plurality of surfaces of the base including at least one side surface and the bonding melting point of the bonding region on each surface are set to be different from each other, and the lid is bonded using the different bonding melting points. And a determining step for determining a bonding order of the surfaces of the substrates.

  According to the present invention, since the connection region forming step and the determining step are included, the mounting region for mounting the electronic component on the surface of the base body after securing the bonding region of the base body in the package Can be enlarged. Therefore, even when the package is downsized, it is possible to obtain the characteristics of the electronic component. Further, it is possible to bond the lid and the substrate one by one using the difference in bonding melting points. For example, it is possible to bond the base and the lid one by one by bonding the lid and the base on the surface having a low bonding melting point and then bonding the lid and the base on the surface having a high bonding melting point. . As a result, even in the case of bonding to a plurality of surfaces, it is possible to suppress a deviation in the surface direction on each surface. Further, excess molten gas generated in the bonding region does not remain in the hermetically sealed package.

  Furthermore, in order to achieve the above object, a method for manufacturing an electronic component package according to the present invention includes a base on which a mounting area for mounting an electronic component is formed, and a lid that hermetically seals the mounting area. In the method for manufacturing an electronic component package, in which an electronic component is mounted on a mounting region of the base, and the base and the lid are bonded to hermetically seal the electronic component, the base is bonded to be bonded to the lid A bonding region forming step of forming a region on a plurality of surfaces of the substrate including at least one side surface, a plurality of forming steps of forming a plurality of the plurality of substrates in a row from a plate-like sheet, and the lid; A bonding region forming step of forming a bonding region of the substrate for bonding on a plurality of surfaces of the substrate including at least one side surface, and a cutting step of individually cutting a plurality of the substrates after the forming step; Characterized in that it has.

  According to the present invention, the electronic component on the surface of the base body is secured after the joining area of the base body in the package is secured because the multiple-part forming step, the joint region forming step, and the cutting step are included. It is possible to expand the mounting area for mounting. Therefore, even when the package is downsized, it is possible to obtain the characteristics of the electronic component. In addition, a large number of substrates can be manufactured at a time.

  Furthermore, in order to achieve the above object, a method for manufacturing an electronic component package according to the present invention includes a base on which a mounting area for mounting an electronic component is formed, and a lid that hermetically seals the mounting area. In the method for manufacturing an electronic component package, in which an electronic component is mounted on a mounting region of the base, and the base and the lid are bonded to hermetically seal the electronic component, the base is bonded to be bonded to the lid A bonding region forming step of forming a region on a plurality of surfaces of the substrate including at least one side surface, a groove forming step of forming break grooves for individually cutting a plurality of substrates on the sheet, and the bonding of the substrates An enlargement step of enlarging an area of a ridge that is a boundary between the respective surfaces that are continuous, and the enlargement step cuts the sheet in the break groove.

  According to the present invention, the connecting region forming step, the groove forming step, and the expanding step include cutting the sheet in the break groove, so the bonding region of the base in the package It is possible to enlarge the mounting area for mounting the electronic component on the surface of the base. Therefore, even when the package is downsized, it is possible to obtain the characteristics of the electronic component. In addition, it is possible to suppress the occurrence of a gap in the bonding between the lid and the base body in the ridge portion without increasing the number of steps without requiring a separate step for increasing the area of the ridge portion. It becomes.

  According to the electronic component package and the electronic component package manufacturing method of the present invention, it is possible to expand the mounting area for mounting the electronic component on the surface of the substrate without hindering downsizing.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the embodiment described below, a case where the present invention is applied to a quartz crystal resonator element as an electronic component is shown.

  As shown in FIG. 1, a crystal resonator element 1 according to the present embodiment includes a crystal resonator element 2 and a crystal resonator element package 3 (hereinafter referred to as a package) on which the crystal resonator element 2 is mounted and hermetically sealed. Consists of

  The package 3 includes a base 31 on which the crystal vibrating piece 2 is mounted and a lid 32 for hermetically sealing the crystal vibrating piece 2 mounted on the base 31.

  The lid 32 is for hermetically sealing the mounting region 36 (see below) of the base 31. As shown in FIGS. 2 and 3 (a), the plate-like body is bent to form an L-shaped two. It consists of a flat plate made of a surface. Further, the lower surface side of the lid 32 is set as a bonding surface with the base 31, and a sealing film 33 made of a sealing material is formed on the lower surface side. Further, the lid 32 constitutes a sealing film 33 in which Sn plating is performed on the lower surface side of a Kovar metal base material via Ni plating, and Ni plating is performed on the upper surface side.

  Further, as shown in FIG. 3 (b), the lid 32 is formed in an L shape by bending a plate-like body, so that the sealing film 33 at the bent position collects the sealing material. Formed in an expanded shape.

  Ceramic is used for the base 31, and the base 31 includes a bottom part 34 of a rectangular parallelepiped and a wall part 35 provided along three sides of the surface 341 of the bottom part 34, as shown in FIGS. Consists of. Further, the wall portion 35 is not formed on one side 342 of the surface 341 of the bottom portion 34, and the one side 342 is opened.

  On the surface 341 of the bottom 34 of the base 31, a mounting region 36 for mounting the crystal vibrating piece 2 is formed.

  A bonding region 37 for bonding to the lid 32 is formed on the wall surface 351 of the wall portion 35 of the base 31. A bonding region 37 for bonding to the lid 32 is formed on one side 311 of the base 31 including one side 342 of the bottom 34. These joining regions 37 are formed by a metal film 38 made of a metal material. Note that. In the present embodiment, the metal film 38 formed on the one side surface 311 of the base 31 is used as a ground terminal. Further, as shown in FIG. 3B, the metal film 38 is laminated in the order of W, Ni, and Au from the bottom layer.

  In addition, the bonding melting point of the metal film 38 between the one side surface 311 of the base 31 and the wall surface 351 is set to be different depending on the surfaces 311 and 351. In the present embodiment, the bonding melting point of the metal film 38 formed on the wall surface 351 is set low, and the bonding melting point of the metal film 38 formed on the one side surface 311 is set high. In joining the lid 32 and the base 31, the lid 32 and the base 31 are joined on the wall surface 351 of the base 31 having a low joining melting point, and then the lid 32 is formed on one side 311 of the base 31 having a high joining melting point. And the substrate 31 are joined (see the manufacturing method of the package 3 described below, the determining step referred to in the present invention).

  This base 31 is formed from a large number of bases 42 (see FIG. 4B) in a single row of six pieces formed from sheets 4 as shown in FIG. In forming the base 31, first, the bottom 34 of the base 31 is formed, and the wall 35 is formed on the surface of the bottom 34 to form the shape of the sheet 4. The metal film 38 is formed by printing W metallization on the surface 41 of the sheet 4 and performing Ni plating and Au plating (joining region forming step in the present invention). After the metal film 38 is formed on the surface 41, the sheet 4 is cut by a dicing saw along the broken line A shown in FIG. 4A to form a large number of substrates 42 in a single row (in the present invention). A process of forming many pieces). After forming a large number of substrates 42 in a line, a metal film 38 is formed by printing W metallization on one side 43 of the sheet 4 and performing Ni plating and Au plating (the present invention). (Junction region forming step). After the metal film 38 is formed on the one side surface 43, a large number of substrates 42 in a line are cut by a dicing saw along the broken line B shown in FIG. 4B to form the substrate 31 alone (the present invention). Cutting process).

  Further, in the formation of the metal film 38 of the base 31 described above, the metal film 38 is fused to the metal film 38 formed on the wall surface 351 of the base 31 on one side surface 311 as shown in FIG. Formed while.

  Further, in the production of the base 31, a break groove (not shown) may be formed at the stage of the sheet 4 shown in FIG. 4 (groove forming step in the present invention). In this case, a break groove is formed at the stage of the sheet 4, and the break groove is set at a cutting position by a dicing saw. By cutting with this setting, the area of the ridge 312 of the base 31 is enlarged (enlargement step in the present invention). In this case, since the area of the ridge 312 that is the boundary between the one side surface 311 and the wall surface 351 in the bonding region 37 of the base 31 is enlarged, the bonding surface between the lid 32 and the base 31 at the ridge 312 is formed. It is possible to suppress the increase gap. In addition, since the connection region forming step, the groove forming step, and the expanding step are performed and the sheet 4 is cut in the break groove, a step for expanding the area of the ridge 312 is not required. It is possible to suppress the occurrence of a gap in the joining between the lid 32 and the base 31 at the ridge 312 without increasing the number of the ridges 312. Specifically, a ridge 312 of the base 31 as shown in FIG. 5 is formed. Note that the ridge 312 shown in FIG. 5A is formed in a curved surface. In this case, the contact between the lid 32 and the base 31 at the ridge 312 can be made continuous to increase the joint surface and prevent the gap from being generated. Moreover, the ridge part 312 shown in FIG.5 (b) is formed in the slope whose inclination angle is an obtuse angle. In this case, since the inclination angle is an obtuse angle, it is possible to increase the joint surface at the ridge 312 and suppress the generation of a gap.

Next, the hermetic sealing of the crystal vibrating piece 2 (manufacture of the package 3) and the manufacture of the crystal resonator 1 by the package 3 having the above-described configuration are performed as follows.
The crystal vibrating piece 2 is mounted on the mounting area 36 of the base 31. Thereafter, the base 31 and the lid 32 are bonded together by heating in a vacuum atmosphere via the sealing film 33 and the metal film 38. By this bonding, the crystal vibrating piece 2 mounted in the mounting region 36 is hermetically sealed, and the crystal resonator 1 including the crystal vibrating piece 2 and the package 3 as shown in FIG. 1 is manufactured.

  In the bonding between the base 31 and the lid 32, the bonding melting point of the metal film 38 formed on the wall surface 351 of the base 31 is low, and the bonding melting point of the metal film 38 formed on one side surface 311 of the base 31. Therefore, the lid 32 and the base 31 are bonded to each other on the wall surface 351 of the base 31 having a low bonding melting point, and then the lid 32 and the base 31 are connected to one side 311 of the base 31 having a high bonding melting point. Be joined.

  As described above, according to the package 3 according to the present embodiment, since the bonding region 37 of the base 31 for bonding to the lid 32 is formed on the one side surface 311, the bonding region 37 of the base 31 in the package 3. As a result, the mounting area 36 for mounting the crystal vibrating piece 2 on the surface 341 of the base 31 can be enlarged. Therefore, even when the package 3 is downsized, the characteristics of the crystal vibrating piece 2 can be obtained.

  Further, since the joining region 37 is formed on the one side surface 311 and formed on the wall surface 351 of the base body 31, the base body 31 and the lid 32 are joined not only on the one side surface 311 but also on the wall surface 351. The bonding strength between the base 31 and the lid 32 can be increased.

  Further, since the lid 32 is formed by bending a plate-like body, the shape of the lid 32 can be easily formed.

  Further, the bonding region 37 is formed by one side 311 of the base 31 and the wall surface 351, and the bonding melting points of the respective surfaces 311 and 351 of the bonding region 37 are different. 31 can be joined. In the present embodiment, the lid 32 and the substrate 31 are bonded to each other on the wall surface 351 having a low bonding melting point, and then the lid 32 and the substrate 31 are bonded to each other on a surface having a high bonding melting point, so And the lid 32 can be joined. As a result, even in the case of bonding to a plurality of surfaces, it is possible to suppress a deviation in the surface direction on each surface.

  In addition, the base 31 is made of ceramic and the joining region 37 is formed by the metal film 38, and the sealing film 33 is formed on the joint surface of the lid 32 with the base 31. It becomes easy to form.

  Further, since the metal film 38 formed on the one side surface 311 of the base 31 is used as a ground terminal, the number of parts can be reduced without making the ground terminal easy.

  Furthermore, according to the manufacturing method of the package 3 of the present invention, since the connection region forming step and the determining step are included, the lid 32 and the base 31 can be bonded one by one using the difference in bonding melting point. As a result, even in the case of bonding to a plurality of surfaces, it is possible to suppress a deviation in the surface direction on each surface.

  Moreover, since it has many formation process, a joining area | region formation process, and a cutting process, many base bodies 31 can be manufactured at once.

  In addition, by mounting an element or a lid on each substrate of the line-shaped body, it is easy to mount an element and position the lid on a miniaturized substrate.

  Moreover, since the dicing process is performed when the sheets 4 are cut into rows, the dimensional accuracy of the surface is increased and the sealing performance is improved.

  In the present embodiment, the quartz crystal resonator element 2 is used as an electronic component. However, this is a preferable example in which electrical characteristics can be obtained, and the present invention is not limited to this. It may be a vibrating piece. Moreover, the other electronic components which require airtight sealing may be sufficient.

  Further, in the present embodiment, the lid 32 is formed in an L shape by bending the plate-like body. However, the lid is not limited to this, and the lid has an angle formed by at least two plate-like bodies. It may be configured by adhering. In this case, it is preferable in the case of a lid having a shape that is difficult to be formed by bending a plate-like body. For example, the present invention is preferable when a plurality of plate-like bodies are bonded to each of different sides of a single plate-like body (for example, the shape of the lid 55 shown in FIG. 7).

  Further, in the present embodiment, the sealing film 33 of the lid 32 is Sn plated through Ni plating on the lower surface side of the metal base material, but is not limited to this. The film configuration may be as follows. For example, the lower surface side of the metal base material that has been subjected only to Ni plating, the one that has been subjected to Au plating through Ni plating, the one that has been subjected to Au—Sn plating through Ni plating, Alternatively, PdSn plating may be performed via Ni plating.

  In the present embodiment, ceramic is used for the base 31, but the present invention is not limited to this, and any insulating material such as glass may be used.

  In the present embodiment, the metal film 38 of the base 31 is laminated in the order of W, Ni, and Au from the bottom layer. However, the present invention is not limited to this, and other laminated films may be used. . For example, the layers can be stacked in the order of W, Au, Mo, Ni, Au, Mo, Au, Ag-Pd, or Ag-Pd, Au.

  In this embodiment, the metal film 38 is formed up to the lower surface 313 of the one side surface 311 of the base 31 and used as the ground terminal. However, the present invention is not limited to this, and as shown in FIG. The film 38 is not formed up to the lower end 313 of the one side surface 311 of the base 31 and may not be used as a ground terminal.

  Moreover, in this Embodiment, although the junction area | region 37 (metal film 38) is formed in the whole surface (refer FIG. 2), it is not limited to this. For example, as shown in FIGS. 6 and 12, the bonding region 37 may be set in an arbitrary range as long as the base 31 and the lid 32 can be bonded by the metal film 38.

  In the present embodiment, the bonding region 37 is formed on the one side surface 311 of the base 31. However, the present invention is not limited to this, and the bonding region may be formed on at least one of the side surfaces of the base. That's fine. For example, as another form, the joining area | region 37 as shown to FIGS. In the package 5 shown in FIG. 7, the base 51 is composed of a bottom portion 52 and a wall portion 53, and the wall portions 53 are provided along opposite sides of the bottom portion 52. And the joining area | region 37 is formed in all the side surfaces 54 (a part of illustration is omitted). The lid 55 is formed of a box-like body having a plate-like body bent and opened on one side, and a sealing film (not shown) is formed on the inner surface of a portion corresponding to the bonding region 37 of the base body 51. . Further, since the joining region 37 is formed on the entire side surface 54, the joining force between the lid 55 and the base body 51 can be increased. In the package 6 shown in FIG. 8, the base body 61 is formed in a rectangular parallelepiped shape, and the joining region 37 is formed on the entire side surface 62 (partially omitted). Further, the lid 63 is a box-shaped body having a plate-like body bent and opened on one side, and a sealing film (not shown) is formed on the inner surface of the portion corresponding to the bonding region 37 of the base body 61. . In the package 7 shown in FIG. 9, the base 71 is joined to the upper surface 72 and the lower surface 73 at both ends 75 and 76 of the wall 74. And the joining area | region 37 is formed in all the side surfaces 77 (a part of illustration is omitted). Further, the lid 78 is formed of a plate-like body formed by bending a plate-like body, and the sealing film 33 is formed on the inner surface of the portion corresponding to the bonding region 37 of the base body 71. In the package 8 shown in FIG. 10, the base body 81 is joined at both end portions 85 and 86 of the wall portion 84 where the upper surface portion 82 and the lower surface portion 83 are adjacent to each other. And the joining area | region 37 is formed in the two side surfaces 87 and 88 except the adjacent wall part 84. As shown in FIG. Further, the lid 89 is formed of a plate-like body having two L-shaped surfaces by bending the plate-like body, and the sealing film 33 is formed on the inner surface of the portion corresponding to the bonding region 37 of the base body 81. .

  In the present embodiment, the bonding region 37 is formed on the wall surface 351 and the one side surface 311 of the base 31, but the present invention is not limited to this, and the bonding region is at least of the side surfaces of the base. It may be formed on one surface and at least one surface of the front and back surfaces of the substrate. For example, as another form, the joining region 37 as shown in FIGS. In the package 9 shown in FIG. 11, the base 91 is composed of a bottom portion 92 and a wall portion 93, and the wall portions 93 are provided along the opposite sides of the bottom portion 92. The bonding region 37 is formed on the pair of surfaces 94 and the surface 95 of the base 91 excluding the wall portion 93. Further, the lid 96 is formed of a plate-like body having three surfaces by bending the plate-like body, and the sealing film 33 is formed on the inner surface of the portion corresponding to the bonding region 37 of the base 91. According to the package 9 shown in FIG. 11, the bonding region 37 is formed on the pair of surfaces 94 and the surface 95, and therefore the bonding region 37 shown in FIG. 2 is formed on the one side surface 311 and the wall surface 351. In comparison, the bonding strength between the base 91 and the lid 96 can be increased. In the package 10 shown in FIG. 12, the base body 101 is bonded to the upper surface portion 102 and the lower surface portion 103 at both end portions 105 and 106 of the wall portion 104. The bonding region 37 is formed on the front surface 107 of the upper surface portion 102, the back surface (not shown) of the lower surface portion 103, and the pair of surfaces 108 of the wall portion 104. The lid 109 is formed of a box-like body having a plate-like body bent and opened on one side, and a sealing film (not shown) is formed on the inner surface of a portion corresponding to the bonding region 37 of the base body 101. . According to the package 10 shown in FIG. 12, since the bonding region 37 is formed not only on the pair of surfaces 108 but also on the front and back surfaces 107 of the base 101, the bonding region 37 shown in FIG. Compared with the case of forming 351, the bonding strength between the base 101 and the lid 109 can be increased.

  Further, when the lid 96 as shown in FIG. 11 has a pair of surfaces and one end of the pair of surfaces is configured as a free end, at least one surface of the pair of surfaces is in a direction in which the free end approaches the opposing surface side to which it faces. It may be inclined. In this case, when the lid 96 is disposed at the joining position of the base body 91, the lid 96 is held by the base body 91 by the free end, and the lid 96 can be easily disposed at a preset holding position of the base body 91.

  In the present embodiment, the bonding melting point of the metal film 38 between the one side surface 311 of the base 31 and the wall surface 351 is set to be different depending on the respective surfaces 311 and 351. However, the present invention is not limited to this. The bonding region may be formed by a plurality of surfaces of the substrate, and the bonding melting point of each surface of the bonding region may be the same. In this case, the base and the lid can be joined at a time, and the manufacturing time can be shortened.

  Moreover, what is shown next as one form of the sealing film 33 from which melting | fusing point of the joining area | region in this Embodiment differs is mentioned. For example, a sealing film with Au-Su or Sn plating applied through Ni plating is used for the low melting point region of the lid, and Ag plating is applied to the high melting point region of the lid with Ni plating. The applied sealing film is used. At this time, the metal film 38 of the base 31 is composed of the same material (laminated in the order of W, Ni, and Au from the bottom layer).

  In the present embodiment, 36 substrates 31 are formed from the sheet 4, but the present invention is not limited to this, and the number thereof can be arbitrarily changed.

  In the present embodiment, the base 31 and the lid 32 are bonded via the sealing film 33 and the metal film 38 by heating in a vacuum atmosphere. However, the present invention is not limited to this. Bonding may be performed by sealing (for example, laser sealing or electron beam sealing) or glass sealing (using silver phosphate glass, tin phosphate glass, bismuth glass, or the like). When glass sealing is used, the lid material may be ceramic or glass.

  In addition, the present invention can be implemented in various other forms without departing from the spirit or main features thereof. Therefore, the above-described embodiment is merely an example in all respects and should not be interpreted in a limited manner. The scope of the present invention is indicated by the claims, and is not restricted by the text of the specification. Further, all modifications and changes belonging to the equivalent scope of the claims are within the scope of the present invention.

  The present invention can be applied to any electronic component package that requires hermetic sealing. For example, it is useful when the electronic component is a piezoelectric vibrating piece.

1 is a schematic side sectional view of a crystal resonator according to an embodiment. It is a schematic perspective view of the lid | cover and base | substrate concerning this Embodiment. (A) is a schematic side view of the lid concerning this Embodiment. (B) is a schematic side view of the base | substrate concerning this Embodiment. (A) is a schematic plan view of the sheet | seat concerning this Embodiment. (B) is a schematic plan view of a large number of substrates in a single row according to the present embodiment. (A) is a schematic side view of the base | substrate in which the ridge part was formed in the curved surface. (B) is a schematic side view of the base | substrate with the ridge part formed in the slope. It is a schematic perspective view of the lid | cover and base | substrate concerning the other form of this Embodiment. It is a schematic perspective view of the lid | cover and base | substrate concerning the other form of this Embodiment. It is a schematic perspective view of the lid | cover and base | substrate concerning the other form of this Embodiment. It is a schematic perspective view of the lid | cover and base | substrate concerning the other form of this Embodiment. It is a schematic perspective view of the lid | cover and base | substrate concerning the other form of this Embodiment. It is a schematic perspective view of the lid | cover and base | substrate concerning the other form of this Embodiment. It is a schematic perspective view of the lid | cover and base | substrate concerning the other form of this Embodiment.

Explanation of symbols

2 Crystal resonator element (electronic component)
3 Crystal vibrating piece package (electronic component package)
31 Substrate 311 One side surface 312 Edge 32 Cover 33 Sealing film (sealed material)
36 Mounting area 37 Bonding area 38 Metal film (metal)
4 sheets 42 A large number of substrates in a line

Claims (16)

It is composed of a base on which a mounting area for mounting an electronic component is formed and a lid for hermetically sealing the mounting area. The electronic component is mounted on the mounting area of the base, and the base and the lid are joined together. In the electronic component package in which the electronic component is hermetically sealed,
The electronic component package according to claim 1, wherein a bonding region of the base for bonding to the lid is formed on at least one of the side surfaces.   The electronic component package according to claim 1, wherein the bonding region is formed on at least one surface of the front and back surfaces of the base.   3. The electronic component package according to claim 1, wherein the lid is formed by bending a plate-like body.   3. The electronic component package according to claim 1, wherein the lid is configured by bonding at least two plate-like bodies with an angle.   5. The electronic component package according to claim 1, wherein the bonding region is formed by a plurality of surfaces of the base, and the bonding melting points of the surfaces of the bonding region are different.   5. The electronic component package according to claim 1, wherein the bonding region is formed by a plurality of surfaces of the base, and the bonding melting points of the surfaces of the bonding region are the same. The lid has opposing surfaces and one end of the opposing surfaces is configured as a free end,
The electronic component package according to any one of claims 1 to 6, wherein at least one of the opposing surfaces is inclined so that a free end thereof approaches a facing opposing surface side.   The electronic component package according to claim 1, wherein an area of a ridge portion that is a boundary between the continuous surfaces of the base body is enlarged.   The electronic component package according to claim 8, wherein the ridge portion is formed in a curved surface.   The electronic component package according to claim 8, wherein the ridge portion is formed on a slope having an obtuse angle. The base body is formed of an insulator and the bonding region is formed of a metal object,
The electronic component package according to claim 1, wherein a sealing material is formed on a joint surface of the lid with the base body.   12. The electronic component package according to claim 1, wherein the metal object formed on the side surface of the base body is used as a ground terminal.   The electronic component package according to claim 1, wherein the electronic component is a piezoelectric vibrating piece. A substrate having a mounting area for mounting an electronic component, and a lid for hermetically sealing the mounting area, mounting the electronic component on the mounting area of the substrate, joining the substrate and the lid, and In a method for manufacturing an electronic component package for hermetically sealing an electronic component,
A bonding region forming step of forming a bonding region of the substrate for bonding with the lid on a plurality of surfaces of the substrate including at least one side surface;
And determining the bonding order of the surfaces of the base body to be bonded to the lid using the different bonding melting points, and setting the bonding melting points of the bonding regions on the respective surfaces to be different from each other. Manufacturing method of package for electronic components. A substrate having a mounting area for mounting an electronic component, and a lid for hermetically sealing the mounting area, mounting the electronic component on the mounting area of the substrate, joining the substrate and the lid, and In a method for manufacturing an electronic component package for hermetically sealing an electronic component,
A bonding region forming step of forming a bonding region of the substrate for bonding with the lid on a plurality of surfaces of the substrate including at least one side surface;
A plurality of forming steps of forming a plurality of the plurality of bases of the columnar body from a sheet of plate-like bodies;
A bonding region forming step of forming a bonding region of the substrate for bonding with the lid on a plurality of surfaces of the substrate including at least one side surface;
And a cutting step of individually cutting a large number of the substrates after the forming step. A substrate having a mounting area for mounting an electronic component, and a lid for hermetically sealing the mounting area, mounting the electronic component on the mounting area of the substrate, joining the substrate and the lid, and In a method for manufacturing an electronic component package for hermetically sealing an electronic component,
A bonding region forming step of forming a bonding region of the substrate for bonding with the lid on a plurality of surfaces of the substrate including at least one side surface;
A groove forming step for forming break grooves for individually cutting a plurality of substrates in the sheet;
An enlargement step of enlarging the area of the ridge that is the boundary between the continuous surfaces in the bonding region of the base body,
In the method of manufacturing an electronic component package, the expanding step includes cutting the sheet in the break groove.

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