JP2006013030A5 - - Google Patents
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- Publication number
- JP2006013030A5 JP2006013030A5 JP2004186007A JP2004186007A JP2006013030A5 JP 2006013030 A5 JP2006013030 A5 JP 2006013030A5 JP 2004186007 A JP2004186007 A JP 2004186007A JP 2004186007 A JP2004186007 A JP 2004186007A JP 2006013030 A5 JP2006013030 A5 JP 2006013030A5
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- layer
- metal layer
- plating resist
- reinforcing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Claims (4)
（１）可撓性フィルムを有機物層を介して補強板に貼り合わせる工程と、
（２）可撓性フィルムの表面に第１金属層を形成する工程と、
（３）第１金属層の表面に金属配線パターン用の第１のめっきレジスト膜（第１めっきレジスト膜）を設け、電解めっきによって第２金属層のパターンを形成する工程と、
（４）第１めっきレジスト膜及び第２金属層の上にめっきにより形成する突起部用の第２めっきレジスト膜（第２めっきレジスト膜）を設け、電解めっきによって突起部を第３金属層で形成する工程と、
（５）第１及び第２めっきレジスト膜を剥離した後、エッチング液によって露出した第１金属層を除去する工程を有することを特徴とする請求項１または２記載の回路基板用部材の製造方法。 A method for producing a circuit board member in which a reinforcing plate, an organic material layer, a flexible film, and a metal layer are laminated in this order,
(1) a step of bonding a flexible film to a reinforcing plate via an organic layer ;
(2) forming a first metal layer on the surface of the flexible film;
(3) providing a first plating resist film (first plating resist film) for a metal wiring pattern on the surface of the first metal layer, and forming a pattern of the second metal layer by electrolytic plating;
(4) Providing a second plating resist film (second plating resist film) for the protrusion formed by plating on the first plating resist film and the second metal layer, and forming the protrusion with the third metal layer by electrolytic plating Forming, and
(5) The method for manufacturing a circuit board member according to claim 1 or 2, further comprising a step of removing the first metal layer exposed by the etching solution after the first and second plating resist films are peeled off. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004186007A JP2006013030A (en) | 2004-06-24 | 2004-06-24 | Member for circuit board and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004186007A JP2006013030A (en) | 2004-06-24 | 2004-06-24 | Member for circuit board and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006013030A JP2006013030A (en) | 2006-01-12 |
| JP2006013030A5 true JP2006013030A5 (en) | 2007-08-02 |
Family
ID=35779917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004186007A Pending JP2006013030A (en) | 2004-06-24 | 2004-06-24 | Member for circuit board and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2006013030A (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101232541B1 (en) * | 2006-05-16 | 2013-02-12 | 엘지디스플레이 주식회사 | Fabricating method of flexible substrate |
| JP2008270311A (en) * | 2007-04-17 | 2008-11-06 | Hitachi Cable Ltd | Method of manufacturing tape carrier for semiconductor device |
| JP2009094128A (en) * | 2007-10-04 | 2009-04-30 | Phoenix Precision Technology Corp | Circuit board, and manufacturing method thereof |
| KR101534849B1 (en) * | 2008-08-27 | 2015-07-07 | 엘지이노텍 주식회사 | Flip chip package and method for packaging the same |
| US20100236822A1 (en) * | 2009-03-23 | 2010-09-23 | Ibiden Co., Ltd. | Wiring board and method for manufacturing the same |
| JP6696128B2 (en) * | 2015-08-25 | 2020-05-20 | 大日本印刷株式会社 | Manufacturing method of component mounting thin film wiring substrate |
| TWI736695B (en) * | 2017-10-24 | 2021-08-21 | 啟耀光電股份有限公司 | Electronic device and manufacturing method thereof |
| TWM624524U (en) * | 2021-11-23 | 2022-03-11 | 頎邦科技股份有限公司 | Semiconductor package |
-
2004
- 2004-06-24 JP JP2004186007A patent/JP2006013030A/en active Pending
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