JP2006093612A - Light emitting device and illuminator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting device and an illuminator which can efficiently emit light from a plurality of light emitting elements toward the outside of the illuminator and can suppress an irregular distribution of luminous intensity. <P>SOLUTION: The light emitting device comprises a base 1 having an upper surface on which a plurality of light emitting elements 3 are mounted, a reflecting member 2 mounted on the upper surface of the base 1 and formed with a plurality of through holes whose inner peripheral surfaces surround the plurality of light emitting elements 3, a light transmitting member 5 filled inside of the plurality of through holes so as to coat the light emitting elements 3, and a wavelength converting layer 4 formed so as to cover the light transmitting member 5 for converting the wavelength of light of the light emitting elements 3. In the reflecting member 2, a gap is formed between a site between the adjacent through holes in the upper surface of the reflecting member and the wavelength converting layer 4, and the light transmitting member 5 is continuous through the gap. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a light-emitting device that houses a plurality of light-emitting elements and a lighting device using the same.

  A light-emitting device that emits an arbitrary color with a phosphor that converts light such as near-ultraviolet light and blue light emitted from a light-emitting element such as a conventional light-emitting diode (LED) into light of red, green, blue, yellow, etc. A cross-sectional view is shown in FIG. In FIG. 3, the light-emitting device includes a base body 11 made of an insulator having a plurality of mounting portions 11 a for mounting the light-emitting elements 13 on the top surface, and a plurality of light-emitting elements 13 bonded and fixed to the top surface of the base body 11. The reflection member 12 having a through hole formed so that each inner peripheral surface surrounds the mounting portion 11a, the light emitting element 13 mounted on the mounting portion 11a, and the light emitting element 13 covered inside the plurality of through holes The wavelength conversion containing the translucent member 15 so filled and the phosphor that converts the light of the light-emitting element 13 that is formed inside the plurality of through holes to cover the translucent member 15. Layer 14.

  The substrate 11 is made of an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, ceramics such as glass ceramics, or a resin such as epoxy resin. When the substrate 11 is made of ceramics, the wiring conductor is formed on the upper surface by baking a metal paste made of tungsten (W), molybdenum (Mo) -manganese (Mn) or the like at a high temperature. When the base 11 is made of resin, the lead terminal made of copper (Cu), iron (Fe) -nickel (Ni) alloy or the like is installed and fixed inside the base 11 by molding the resin to be the base 11. The

  The reflecting member 12 has a plurality of through holes formed so that the inner peripheral surfaces surround the mounting portions 11a of the light emitting elements 13 and the upper opening is larger than the lower opening, and the inner periphery of the through hole. On the surface, a reflecting surface 12a for reflecting light is formed. Specifically, it consists of metals such as aluminum (Al) and Fe-Ni-cobalt (Co) alloys, ceramics such as alumina ceramics or resins such as epoxy resins, and molding technologies such as cutting, die molding or extrusion molding. It is formed by.

  The inner peripheral surface of the through hole of the reflecting member 12 is a reflective surface 12a that reflects light emitted from the light emitting element 13, and the reflective surface 12a is formed by cutting or electrolytic polishing the inner peripheral surface of the through hole. It is formed by flattening by chemical polishing or the like, or by depositing a metal such as Al on the inner peripheral surface by vapor deposition or plating. Then, the reflecting member 12 is formed on the upper surface of the base 11 so as to surround the plurality of mounting portions 11a with the inner peripheral surface of each through-hole by a bonding material such as solder, a brazing material such as silver (Ag) paste, or a resin adhesive. Be joined.

  The light emitting element 13 is made of a gallium nitride-based compound semiconductor or a silicon carbide-based compound semiconductor, and is mounted on the mounting portion 11a with an adhesive such as solder or Ag paste, and emits light with a wiring conductor disposed around the mounting portion 11a. The element 13 is electrically connected by a bonding wire (not shown) or flip chip mounting.

  The translucent member 15 is made of a transparent resin, transparent glass, or the like that has a small refractive index difference from the light emitting element 13 and has a high transmittance with respect to light from the ultraviolet light region to the visible light region.

  The wavelength conversion layer 14 contains a phosphor that converts light of the light-emitting element 13 to a long wavelength side in a transparent resin or transparent glass having a high transmittance with respect to light in the visible light region.

  Then, the light emitting element 13 is mounted on the mounting portion 11a of such a light emitting device, the electrode of the light emitting element 13 is electrically connected to the wiring conductor, and light is emitted by an injector such as a dispenser inside the through hole of the reflecting member 12. A wavelength conversion layer 14 containing a phosphor (not shown) that fills the translucent member 15 so as to cover the element 13 and further converts the light of the light-emitting element 13 to the longer wavelength side is provided as an injector such as a dispenser. By filling the inside of the through hole so as to cover the translucent member 15, the light emitting device can extract light having a desired wavelength spectrum.

With this configuration, the light emitted from the light emitting elements 13 is favorably reflected upward by the reflecting surface 12 a formed on the inner peripheral surface of the through hole surrounding each mounting portion 11 a of each light emitting element 13, and is reflected on the wavelength conversion layer 14. It enters at the same incident angle. Therefore, since the path lengths passing through the wavelength conversion layer 14 are substantially the same, unevenness in the intensity distribution of the light emitted from each through hole is suppressed. Then, a plurality of such light with small unevenness in intensity distribution emitted from each through hole are mixed to form a high-intensity light-emitting device.
JP 2002-94128 JP

  However, when the wavelength conversion layer 14 is formed inside the through hole in this way, the wavelength conversion layer 14 is not continuous. For this reason, the light that has traveled to the part where the wavelength conversion layer 14 is not continuous is prevented from traveling by the light reflecting surface 12 a, and the light does not easily travel above the reflecting member 12 between the light emitting elements 13.

  That is, above the through hole of the reflecting member 12, the light emitted from the light emitting element 13 is emitted to the outside without being interrupted by the wavelength conversion layer 14, so that the emitted light intensity is increased. However, above the portion where the wavelength conversion layer 14 is not continuous, the light emitted from the light emitting element 13 is blocked by the reflecting member 12 between the light emitting elements 13, so that the light is above the reflecting member 12. It is hard to be emitted and the emitted light intensity is weak. In this way, unevenness occurs in the color distribution and illuminance distribution on the upper surface of the light emitting device, and the illumination characteristics are unstable.

  Further, light that is prevented from traveling by the reflecting member 12 is easily absorbed by the light emitting element 13 or the reflecting member 12 or is irregularly reflected in the light emitting device. Increasing the number of light emitting elements 13 to prevent such a decrease in light emission intensity due to light loss increases the size of the light emitting device and simultaneously increases the number of through-holes surrounding each light emitting element 13. There has been a problem that the illuminance distribution is not uniform and becomes uneven.

  The present invention has been devised in view of the above-described problems in the prior art, and an object of the present invention is to efficiently emit light from a plurality of light emitting elements to the outside of the light emitting device, and to reduce unevenness in emission intensity. It is an object to provide a light emitting device and a lighting device that can be suppressed.

  The light-emitting device of the present invention is provided with a base on which a plurality of light-emitting elements are mounted on an upper surface, and a plurality of through holes that are attached to the upper surface of the base and accommodate each of the light-emitting elements inside. A reflective member, a translucent member filled to cover the light emitting element inside a plurality of the through holes, and a wavelength converting light of the light emitting element formed so as to cover the translucent member A light emitting device comprising a wavelength conversion layer, wherein the reflection member has a gap formed between a portion between the adjacent through holes on the upper surface and the wavelength conversion layer, The translucent member is continuous through the gap.

  The illumination device according to the present invention is characterized in that the light-emitting device according to the present invention is installed in a predetermined arrangement.

  The light-emitting device of the present invention includes a base having a plurality of light-emitting elements mounted on the upper surface, and a reflecting member provided with a plurality of through-holes that are attached to the upper surface of the base and accommodate each of the plurality of light-emitting elements. And a translucent member filled so as to cover the light emitting element inside the plurality of through holes, and a wavelength conversion layer that is formed so as to cover the translucent member and converts the wavelength of light of the light emitting element. In the light emitting device, the reflective member has a gap formed between a portion between adjacent through holes on the upper surface thereof and the wavelength conversion layer, and the translucent member is continuous through the gap. Therefore, the radiated light in which the light emitted from the plurality of light emitting elements is mixed can be emitted to the outside with uniform radiant light intensity and with high luminous efficiency.

  That is, the light emitted from the light emitting element is uniformly incident on the wavelength conversion layer through the gap between the portion between the through holes of the reflecting member and the wavelength conversion layer, and then is emitted to the outside. Since this wavelength conversion layer is continuously formed on the entire upper surface of the light emitting device, light can be evenly emitted from the upper surface of the light emitting device, and as a result, the upper part of the reflecting member between the through holes is dark. The unevenness of the intensity of the upper surface of the light emitting device is suppressed.

  Conventionally, light loss is caused by the light of the light emitting element being blocked by the reflecting member. Therefore, in order to increase the strength of the light emitting device, it is necessary to increase the number of light emitting elements to be mounted. However, in the light emitting device of the present invention, in the above configuration, the ratio of the light of each light emitting element directly incident on the wavelength conversion layer without being blocked by the reflecting member is increased, so that the light loss can be suppressed and the light emitting device has high luminous efficiency. Can be produced. Therefore, if the light emitting device has the same light emission intensity, the present invention can reduce the number of light emitting elements to be mounted as compared with the prior art, and the light emitting device can be downsized.

  In addition, the light traveling from the light emitting element and traveling sideways is reflected upwards well by a moderately high reflecting member surrounding the light emitting element, so that it is effective to enter the wavelength conversion layer in an extremely oblique direction. Can be suppressed. Therefore, the light emitted from the light emitting element enters the wavelength conversion layer at the same incident angle, and the path length passing through the wavelength conversion layer has the same value, so that unevenness of the light intensity distribution is suppressed.

  Since the illuminating device of the present invention is installed so that the above-described light emitting device of the present invention is in a predetermined arrangement, each light emitting device is suppressed in intensity unevenness, so that they are collected to form an illuminating device. Unevenness of the illumination device is also suppressed.

  In addition, the light emitting device of the present invention is installed in a predetermined arrangement as a light source, and by installing a reflection jig, an optical lens, a light diffusing plate, etc. optically designed in an arbitrary shape around these light emitting devices, It can be set as the illuminating device which radiates | emits the light of this light distribution.

  The light emitting device of the present invention will be described in detail below. FIG. 1 is a plan perspective view showing an example of an embodiment of a light emitting device of the present invention, and FIG. 2 is a cross-sectional view taken along line A-A ′ in FIG. 1. Reference numeral 1 denotes a base, and 2 denotes a reflecting member. The light emitting element 3 is mounted on a plurality of mounting portions 1 a of the base 1, and the light-transmitting member 5 surrounds the light emitting element 3 and the through hole 2 a of the reflecting member 2. A light emitting device is obtained by coating and further forming the wavelength conversion layer 4 on the upper surface of the translucent member 5.

  The substrate 1 is an insulator made of an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, ceramics such as glass ceramics, or a resin such as epoxy resin, and supports the light emitting element 3. It functions as a member, and has a plurality of mounting portions 1a for mounting the light emitting element 3 on its upper surface.

  Further, when the substrate 1 is made of ceramics, a metallized layer formed of a metal powder such as W, Mo, or Mn to electrically connect the inside and outside of the light-emitting device from the mounting portion 1a and its periphery to the outer surface of the substrate 1 A wiring conductor (not shown) made of is formed. Then, the wiring conductor exposed on the outer surface such as the lower surface of the base 1 is electrically connected to an external electric circuit board via a lead terminal (not shown) made of a metal such as Cu or Fe—Ni alloy, for example. Thus, the external electric circuit board and the light emitting element 3 can be electrically connected.

  Further, when the base 1 is made of resin, by molding the resin to be the base 1, lead terminals made of Cu, Fe—Ni alloy or the like are installed and fixed inside the base 1, and the inside and outside of the light emitting device are electrically connected. Conductive connection to.

  It should be noted that a metal layer with excellent corrosion resistance, such as a Ni layer having a thickness of 0.5 to 9 μm or an Au layer having a thickness of 0.5 to 5 μm, should be deposited on the exposed surface of the wiring conductor, thereby oxidizing the wiring conductor. This can be effectively prevented, and the bonding with the light emitting element 3 using a bonding material such as solder, the connection with the bonding wire, and the connection with the lead terminal can be strengthened.

  In addition, the base 1 is electrically connected to the wiring conductor or the lead terminal on the upper surface for the purpose of suppressing light transmission from the light emitting element 3 to the lower surface of the base 1 and efficiently reflecting light to the upper side of the base 1. In order to prevent short circuit, a metal layer such as Al, Ag, Au, platinum (Pt), or Cu is formed by vapor deposition or plating, and the reflection layer that improves the reflectance of light that travels above the substrate 1 Is preferably produced.

    The reflecting member 2 is provided with a plurality of through holes 2a for accommodating each of the plurality of light emitting elements 3, and is made of a metal brazing material such as Ag-Cu brazing or Pb-Sn, Au-Sn, Au-silicon (Si ), A solder such as Sn—Ag—Cu, or a bonding material such as a silicone-based or epoxy-based resin adhesive or the like. The bonding material may be appropriately selected in consideration of the material of the base 1 and the reflection member 2, the thermal expansion coefficient, and the like, and is not particularly limited. Further, when high reliability of bonding between the base 1 and the reflecting member 2 is required, the bonding is preferably performed using a metal brazing material or solder.

  Further, the reflecting member 2 has an inner peripheral surface that is a reflecting surface that efficiently reflects the light of the light emitting element 3. With this configuration, a reflecting surface is formed around the light emitting element 3, so that light emitted from the light emitting element 3 is efficiently reflected on the upper side of the light emitting device, and light is absorbed or transmitted by the base 1. Is effectively suppressed, so that the intensity and brightness of the emitted light can be remarkably improved.

  In order to form such a reflecting surface, the reflecting member 2 is made of a highly reflective metal such as Al, Ag, Au, Pt, titanium (Ti), chromium (Cr), Cu, ceramics such as white, white, etc. There is a method in which a resin is used, and this is subjected to cutting or mold forming. Or you may form a reflective surface by forming a metal thin film by metal plating, vapor deposition, etc., such as Al, Ag, Au, etc. with the reflection member 2. FIG. If the reflective surface is made of a metal that is easily discolored by oxidation such as Ag or Cu, low melting point glass, sol-gel glass, or silicone resin having excellent transmittance from the ultraviolet light region to the visible light region is used on the surface. Or an epoxy resin. As a result, the corrosion resistance, chemical resistance, and weather resistance of the inner peripheral surface of the reflecting member 2 are improved.

  Moreover, it is preferable that the through hole 2a of the reflecting member 2 is inclined so as to spread outward as the inner peripheral surface moves upward. Thereby, the light emitted from the light emitting element 3 can be efficiently reflected on the upper surface.

  The arithmetic mean roughness Ra of the surface on the inner peripheral surface of the through hole 2a of the reflecting member 2 is preferably 4 μm or less. Thereby, the light of the light emitting element 3 can be favorably reflected to the upper side of the light emitting device. When Ra exceeds 4 μm, it is difficult to regularly reflect light on the inner peripheral surface of the through hole 2a of the reflecting member 2 of the light emitting element 3 and to emit the light upward from the light emitting device, and it is easy to diffusely reflect inside the light emitting device. . As a result, the propagation loss of light inside the light emitting device tends to increase, making it difficult to emit light outside the light emitting device at a desired radiation angle.

  In addition, when the arithmetic average roughness Ra of the inner peripheral surface of the reflecting member 2 is less than 0.004 μm, it is difficult to form such a surface stably and efficiently, and the product cost tends to increase. Accordingly, the arithmetic average roughness of the inner peripheral surface is more preferably 0.004 to 4 μm.

  In addition, what is necessary is just to form by the conventionally well-known electrolytic polishing process, chemical polishing process, cutting polishing process, etc. in order to make Ra of the internal peripheral surface of the through-hole 2a into said range. Further, a method of forming by transfer processing using the surface accuracy of the mold may be used.

  In addition, the inner peripheral surface of the through hole 2a of the reflecting member 2 may be flat (straight) as shown in FIG. 2, or may be arcuate (curved). In the case of the circular arc shape, the light from the light emitting element 3 can be evenly reflected so that highly directional light can be radiated uniformly from the outside.

  In the mounting portion 1a of the present invention, it is preferable that at least three mounting portions 1a are respectively formed at equal intervals on a plurality of concentric circumferences. As a result, the integration density of the light emitting elements 3 decreases toward the outer side of the base 1, and the heat flow density due to the heat of the light emitting elements 3 can be decreased from the central portion toward the outer peripheral portion of the base 1, and the inner circumference 1b. The heat of the light emitting element 3 mounted thereon can be efficiently diffused radially to the outer periphery of the substrate 1 having a low heat flux density. Therefore, the temperature distribution inside the substrate 1 can be made substantially uniform, and the heat of the light emitting element 3 can be efficiently transmitted to the external electric circuit and the heat radiating fins, or can be efficiently dissipated outside the light emitting device via the substrate 1.

  In the light emitting device of the present invention, since the plurality of light emitting elements 3 are respectively surrounded by the inner peripheral surface of the through hole 2a of the reflecting member 2, the heat of the light emitting element 3 is uniformly applied to the reflecting member 2 through the base 1. It becomes easy to transmit efficiently, heat can be efficiently dissipated by the whole reflection member 2, and the heat dissipation of a light-emitting device improves further.

  As a result, the deterioration of the internal quantum efficiency and light output of the light emitting element 3 is suppressed and the fluctuation of the light emission wavelength of the light emitting element 3 is suppressed, so that the light output of the light emitting device is improved and the color characteristics are stabilized.

  The light emitting element 3 may have any peak wavelength of energy to be radiated from the ultraviolet region to the infrared region, but from the viewpoint of emitting white light and light of various colors with good visibility, a near ultraviolet system of 300 to 500 nm. To an element that emits blue light. For example, a buffer layer composed of gallium (Ga) -nitrogen (N), Al-Ga-N, indium (In) -GaN, etc., an n-type layer, a light-emitting layer, and a p-type layer are sequentially stacked on a sapphire substrate. A gallium nitride compound semiconductor or a silicon carbide compound semiconductor is used. Then, a bonding material such as a non-conductive paste, solder, resin adhesive, etc., in which Ag epoxy resin in which metal powder such as Ag, Al or the like is mixed in the resin is mounted on the light emitting element 3 or resin in which powder such as ceramics is mixed in the resin. (Not shown). Then, the electrode of the light emitting element 3 is attached to a wiring conductor formed in the mounting portion 1a and the periphery, a solder bump using Au—Sn solder, Sn—Ag solder, Sn—Ag—Cu solder, Sn—Pb or the like, or Au Electrically connected by flip chip mounting connected via a connecting means made of a metal bump using a metal such as Ag or Ag, or wire bonding (not shown) connected via a wire such as an Au wire or an Al wire. The Preferably, the connection is made by a flip chip bonding method. Accordingly, since the wiring conductor can be provided immediately below the light emitting element 3 on the upper surface of the base body 1, it is not necessary to provide a wiring conductor region in the periphery of the light emitting element 3 on the upper surface of the base body 1. Therefore, it is possible to effectively suppress the light output emitted from the light emitting element 3 from being absorbed and radiated by the wiring conductor region of the substrate 1.

  The translucent member 5 has a small refractive index difference from the light emitting element 3 and has a high transmittance with respect to light from the ultraviolet light region to the visible light region, such as a transparent resin such as silicone resin, epoxy resin, urea resin, or low melting glass. And transparent glass such as sol-gel glass. The translucent member 5 may be appropriately selected in consideration of the material of the base 1 and the reflecting member 2, the thermal expansion coefficient, and the like, and is not particularly limited. This effectively suppresses the occurrence of light reflection loss due to the difference in refractive index between the light emitting element 3 and the translucent member 5 and allows light to be emitted outside the light emitting device with a desired radiation intensity and angular distribution with high efficiency. Can be manufactured.

  In addition, the light emitting device of the present invention covers the translucent member 5 so that a phosphor or pigment that emits light when excited by the light of the light emitting element 3 is applied to the translucent member such as epoxy resin, silicone resin, or glass. The wavelength conversion layer 4 made to contain is arrange | positioned. Phosphors and pigments (not shown) are selected from, for example, alkaline earth aluminate phosphors and rare earth elements that are excited by light from the light-emitting element 3 and emit blue, red, green, etc. by recombination of electrons. Phosphors and pigments such as yttrium, aluminum, and garnet phosphors activated with at least one kind of element are used, and are contained in a transparent resin or transparent glass. Thereby, the light which has a desired emission spectrum and color can be output by mix | blending fluorescent substance and a pigment in arbitrary ratios.

  Then, the light emitting element 3 is mounted on the mounting portion 1a of such a light emitting device, the electrode of the light emitting element 3 is electrically connected to the wiring conductor, and the light emitting element 3 and the reflecting member 2 are further connected with an injector such as a dispenser. The periphery of the through-hole 2a on the upper surface is covered with the translucent member 5 and then thermally cured. Then, the same material resin as the silicone resin of the transparent member 5 is interposed as an adhesive so as to cover the translucent member 5, The light emitting device can be obtained by extracting light having a desired wavelength spectrum by a method such as coating with a wavelength conversion layer 4 containing a phosphor or a pigment and thermosetting.

  Moreover, the reflective member 2 of the present invention has a gap formed between the portion between the adjacent through holes 2a on the upper surface thereof and the wavelength conversion layer 4, and the translucent member 5 is continuous through the gap. ing. The gap is not particularly specified, but if it is a / 2 or less with respect to the distance a from the upper surface of the substrate 1 to the wavelength conversion layer 4, the reflection characteristics as a reflecting member are not impaired and the light enters the phosphor. The ratio of light does not decrease, which is preferable.

  Further, in the light emitting device of the present invention, the reflecting member 2 provided with a plurality of through holes 2 a for accommodating each of the plurality of light emitting elements 3 is attached to the upper surface of the base 1. As shown in FIG. 2, such a reflecting member 2 is more preferably formed with a side wall portion higher than the reflecting member 2 between the through holes 2 a at a portion surrounding all of the plurality of through holes 2 a. . By doing in this way, the light emitted from the side of the wavelength conversion layer 4 is also reflected upward as light having high directivity, and is emitted to the outside of the light emitting device, so that the emission intensity becomes higher.

  In addition, the light emitting device of the present invention is a circular shape in which one device is installed in a predetermined arrangement, or a plurality of light emitting devices, for example, a lattice shape, a staggered shape, a radial shape, or a plurality of light emitting devices. In addition, a lighting device can be obtained by installing the light emitting device groups in a plurality of concentric shapes so as to have a predetermined arrangement. Thereby, since light emission by recombination of electrons of the light emitting element 3 made of a semiconductor is used, it is possible to achieve lower power consumption and longer life than a lighting device using a conventional discharge, and generate less heat. It can be set as a small illuminating device. As a result, fluctuations in the center wavelength of the light generated from the light emitting element 3 can be suppressed, and light can be emitted with a stable radiant light intensity and radiant light angle (light distribution distribution) over a long period of time. It can be set as the illuminating device by which the color nonuniformity in the surface and the bias of illuminance distribution were suppressed.

  In addition, the light emitting device of the present invention is installed in a predetermined arrangement as a light source, and by installing a reflection jig, an optical lens, a light diffusing plate, etc. optically designed in an arbitrary shape around these light emitting devices, It can be set as the illuminating device which can radiate | emit the light of this light distribution.

  For example, a plurality of light emitting devices 101 are arranged in a plurality of rows on the light emitting device driving circuit board 102 as shown in the plan view and the sectional view shown in FIGS. 4 and 5, and are optically designed in an arbitrary shape around the light emitting device 101. In the case of an illuminating device in which the reflecting jig 103 is installed, in a plurality of light emitting devices 101 arranged on adjacent rows, an arrangement in which the interval between the adjacent light emitting devices 101 is not the shortest, a so-called staggered pattern It is preferable that That is, when the light emitting devices 101 are arranged in a grid, the glare is strengthened by arranging the light emitting devices 101 as light sources on a straight line, and such a lighting device enters human vision. Thus, discomfort and eye damage are likely to occur, but by forming a staggered pattern, glare is suppressed and discomfort and damage to the eyes of the human eye can be reduced. Furthermore, since the distance between adjacent light emitting devices 101 is increased, thermal interference between adjacent light emitting devices 101 is effectively suppressed, and heat in the light emitting device driving circuit board 102 on which the light emitting devices 101 are mounted is reduced. Clouding is suppressed, and heat is efficiently dissipated to the outside of the light emitting device 101. As a result, it is possible to manufacture a long-life lighting device that has little obstacle to human eyes and has stable optical characteristics over a long period of time.

  In addition, the lighting device is a concentric arrangement of a circular or polygonal light emitting device 101 group composed of a plurality of light emitting devices 101 on the light emitting device drive circuit board 102 as shown in the plan view and the sectional view shown in FIGS. In the case of the illuminating device formed in a plurality of groups, it is preferable that the number of the light emitting devices 101 in one circular or polygonal light emitting device 101 group is increased from the central side of the illuminating device to the outer peripheral side. Thereby, it is possible to arrange more light emitting devices 101 while maintaining an appropriate interval between the light emitting devices 101, and it is possible to further improve the illuminance of the lighting device. In addition, the density of the light emitting device 101 in the central portion of the lighting device can be reduced to suppress heat accumulation in the central portion of the light emitting device driving circuit board 102. Therefore, the temperature distribution in the light emitting device driving circuit board 102 becomes uniform, heat is efficiently transmitted to the external electric circuit board and the heat sink on which the lighting device is installed, and the temperature rise of the light emitting device 101 can be suppressed. As a result, the light-emitting device 101 can operate stably over a long period of time, and a long-life lighting device can be manufactured.

  Examples of such lighting devices include general lighting fixtures, chandelier lighting fixtures, residential lighting fixtures, office lighting fixtures, store lighting, display lighting fixtures, street lighting fixtures, used indoors and outdoors. Guide light fixtures and signaling devices, stage and studio lighting fixtures, advertising lights, lighting poles, underwater lighting lights, strobe lights, spotlights, security lights embedded in power poles, emergency lighting fixtures, flashlights, Examples include electronic bulletin boards and the like, backlights for dimmers, automatic flashers, displays and the like, moving image devices, ornaments, illuminated switches, optical sensors, medical lights, in-vehicle lights, and the like.

  It should be noted that the present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the scope of the present invention. For example, an optical lens for arbitrarily condensing or diffusing the light emitted from the light emitting device or a flat light-transmitting lid on the upper surface of the reflecting member 2 may be joined with solder or a resin adhesive. In addition, light can be extracted at a radiation angle to be improved, and water resistance into the light emitting device is improved, thereby improving long-term reliability. Further, in order to suppress the optical loss due to the bonding wire, a light emitting device in which metallized wiring is formed on the mounting portion 1a and the light emitting element 3 is electrically connected to the metallized wiring via solder may be used.

It is a top view which shows an example of embodiment about the light-emitting device of this invention. It is sectional drawing in A-A 'of the light-emitting device of FIG. It is sectional drawing which shows the conventional light-emitting device. It is a top view which shows the other example of embodiment of the illuminating device of this invention. It is sectional drawing of the illuminating device of FIG. It is a top view which shows an example of embodiment of the illuminating device of this invention. It is sectional drawing of the illuminating device of FIG.

Explanation of symbols

1: Base 1a: Mounting portion 2: Reflecting member 2a: Through hole 3: Light emitting element 4: Wavelength conversion layer 5: Translucent member

Claims (2)

A base on which a plurality of light emitting elements are mounted on an upper surface, a reflecting member attached to the upper surface of the base and provided with a plurality of through-holes for accommodating each of the plurality of light emitting elements inside; A translucent member filled inside the through-hole so as to cover the light-emitting element, and a wavelength conversion layer formed so as to cover the translucent member and wavelength-converting the light of the light-emitting element. In the light emitting device, a gap is formed between a portion between the adjacent through holes on the upper surface of the reflecting member and the wavelength conversion layer, and the translucent member is the gap. A light emitting device characterized in that the light emitting device is continuous through the substrate. An illumination device, wherein the light emitting device according to claim 1 is installed in a predetermined arrangement.

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