JP2006093317A - Template and chip component mounting apparatus using same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a template capable of securely aligning all chip components mounted in a plurality of recesses in a decumbent attitude, and also to provide a chip component mounting apparatus using the template. <P>SOLUTION: The template 15 is configured in such a way that it is used for a chip component mounting apparatus capable of mounting a plurality of chip components 10 on a printed board in a lump, and recesses 15a each for receiving one chip component 10 are formed at a plurality of locations in a predetermined arrangement. In the recess 15a, there is opened an air intake 15b in a side surface 15c on a longitudinal one end side separated from a region facing a guide pipe 19 on a component supply stage, and the air intake 15b is communicated with a suction apparatus 16 via communication passages 15d, 15e. The template 15 can be manufactured by stacking and integrating a plurality of thin sheet members at which openings and clearance grooves are formed. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a template used for a chip component mounting apparatus capable of mounting a plurality of chip components having no lead wires such as resistors and capacitors at a predetermined position on a printed circuit board, and a chip using the template. The present invention relates to a component mounting apparatus.

  This type of chip component mounting apparatus includes a template in which recesses for receiving one chip component are provided at a plurality of locations in a predetermined arrangement, and various chip components are placed in each recess of the template at the component supply stage. After mounting, this template is transported to the mount stage, and the chip parts held in each recess are sucked by the suction nozzle, so that a plurality of chip parts can be mounted on the printed circuit board at once. ing. The component supply stage includes an arrange board disposed on the template and having a through hole at a position facing the recess, and a plurality of hoppers disposed above the arrange board and capable of accommodating a large number of chip components. A guide pipe for dropping the chip components in each hopper into the through hole of the arrangement board is disposed, and the chip components in each hopper are dropped into the recess through the guide pipe and the through hole. By doing so, various chip components are mounted in the respective recesses of the template in a predetermined arrangement. In addition, the mounting stage is equipped with a suction unit with a plurality of suction nozzles corresponding to the respective recesses of the template. After suctioning a plurality of chip components with these suction nozzles, printing is performed directly under the suction nozzle. By disposing the substrate and temporarily fixing each chip component on the cream solder previously applied to a predetermined position of the printed substrate, each chip component is transferred from the template to the printed substrate. Then, by heating the printed circuit board in a reflow furnace, the cream solder is melted and the chip component electrodes are soldered to the land of the printed circuit board, so that a plurality of chip components are placed at predetermined positions on the printed circuit board. It will be implemented collectively.

  By the way, in such a chip component mounting apparatus, the chip component falls into the recess of the template in a substantially upright posture at the component supply stage, but the chip component in which electrodes are formed at both ends in the longitudinal direction. In order to be sucked by the suction nozzle and mounted at a predetermined position on the printed circuit board, the chip parts must be aligned in a lying position (side down position) in the recess of the template on the mount stage. Therefore, in this type of conventional chip component mounting apparatus, a vibration stage is set in which the template is vibrated and the chip component in the recess is laid sideways while the template is being transferred from the component supply stage to the mount stage. (For example, refer to Patent Document 1).

As another conventional example, as shown in FIG. 7, by opening an intake port 1 b on the bottom surface of the recess 1 a of the template 1 and communicating the intake port 1 b with the suction device 3 through the communication path 2, There is also known a chip component mounting apparatus in which the chip component 10 mounted in the recess 1a is laid down by air suction. That is, in the component supply stage, the chip component 10 in an almost upright position falls into the recess 1a of the template 1 via the guide pipe 4 and the through hole 5a of the arrange board 5, but the air in the recess 1a. Is sucked into the intake port 1b opened at an appropriate position on the bottom surface, this air flow acts as a force for causing the chip component 10 in a standing posture to lie down.
Japanese Patent Laid-Open No. 11-026988 (page 3-5, FIG. 3)

  As described above, in a conventional general chip component mounting apparatus, a vibration stage is set and vibration is applied to the template in order to lay down the chip component in the recess of the template. However, there are some chip parts that do not fall sideways, so it is not easy to ensure that all the chip parts mounted in multiple recesses in the template are aligned in a lying position, thus reducing chip part misalignment. There was a need for new measures.

  The prior art shown in FIG. 7 is considered to be one of the countermeasures. However, since air flows downward toward the air inlet 1b opened on the bottom surface of the recess 1a of the template 1, the air suction force causes the chip component 10 to lie down. Therefore, the effect of reducing the misalignment of the chip component 10 is not sufficient.

  The present invention has been made in view of such a state of the art, and a first object thereof is a template capable of reliably aligning all chip components mounted in a plurality of recesses in a lying posture. Is to provide. A second object of the present invention is to provide a chip component mounting apparatus that can effectively reduce misalignment of chip components arranged in a recess of a template.

  In order to achieve the first object described above, the template of the present invention is used in a chip component mounting apparatus capable of mounting a plurality of chip components on a printed circuit board in a lump and accepts a single chip component. Are provided at a plurality of locations in a predetermined arrangement, and a component supply stage in which the chip components in the hopper fall into the recess through the guide pipe, and the chip components mounted in the recess are suction nozzles. In a template that is transported between a suction stage and a mount stage that is mounted on a printed circuit board, an intake port is opened on a side surface on one end side in the longitudinal direction in the recess, and the suction port is connected to a suction device via a communication path. It was possible to communicate with.

  In this way, if the air inlet is opened on the side surface separated from the falling point of the chip part in the recess of the template, and the air in the recess flows into the air inlet, it will fall into the recess. Since the air suction force acts efficiently as a force for lying down the coming chip parts, it is easy to align the chip parts in the recumbent posture in the recess.

  In the above-described configuration, a plurality of flat thin plate members having openings formed at a plurality of locations in a predetermined arrangement are stacked and integrated in a state where the openings communicate with each other. If the recess, the intake port, and the communication path are formed, the opening of each thin plate member can be formed with high accuracy by etching or the like. It is preferable because an intake port exposed on the side surface of the recess and a communication passage continuing to the intake port can be easily formed. If a plurality of thin plate members are laminated and integrated by thermocompression bonding or the like, the thin plate members can be fixed while the respective openings are aligned with high accuracy.

  In this case, a relief groove that cuts outward is provided in a part of the recess of the corner of the opening, and if the opening and the relief groove are formed by etching, Since there is no possibility that the chip component is caught in the corner of the recess, it is more preferable that the chip component is aligned in the recess in a recumbent posture. In addition, forming such an opening and a relief groove in a thin plate member can be easily performed by etching.

  In order to achieve the second object described above, in the chip component mounting device of the present invention, a template configured as described above, and a suction device that communicates with the intake port via the communication path of the template. Arrange board having a through hole at a position on the template and facing the recess at the component supply stage, and arranged above the arrange board at the component supply stage to accommodate a large number of chip components A plurality of hoppers and a guide pipe for dropping the chip components in each of the hoppers into the through holes of the arrangement board.

  The chip component mounting apparatus configured as described above applies a suction force of air flowing toward the intake port in the recess to the chip component falling into the template recess via the guide pipe or the arrange board. As a result, it becomes easy to align the chip components in the recumbent posture in the recess, so that the alignment failure of the chip components arranged in the recess of the template can be effectively reduced.

  In the template of the present invention, an air inlet is opened on the side surface separated from the component dropping point in the recess that accepts the chip component, so air suction is used as a force to lay the chip component falling into the recess. The force acts efficiently and therefore facilitates aligning the chip components in the recess in a lying position.

  In addition, since the chip component mounting apparatus of the present invention uses the template described above, it is possible to effectively reduce the alignment failure of the chip components arranged in the recess of the template.

  FIG. 1 is a block diagram of a chip component mounting apparatus according to an embodiment of the present invention, and FIG. 2 is a side view of a chip component dropped on a template of the mounting apparatus. FIG. 3 is a plan view of the template, FIG. 4 is a cross-sectional view of main parts of the template, FIG. 5 is a plan view of main parts of a plurality of thin plate members constituting the template, and FIG. It is explanatory drawing which shows the operation | movement which mounts the chip component adsorbed from the template on a printed circuit board.

  The chip component mounting apparatus shown in these drawings includes an XY table 12 fixed on a gantry 11 and first and second transport bases 13 and 14 controlled to be movable in a two-dimensional direction on the XY table 12. A template 15 fixed on the first transfer table 13, a suction device 16 (see FIG. 2) communicating with the inlet 15b of each template 15, and a position on the XY table 12 attached to the gantry 11 An arrangement board 17, a plurality of hoppers 18 positioned above the arrangement board 17, a plurality of guide pipes 19 connecting the hoppers 18 and the arrangement board 17, and an imaging camera attached to the gantry 11. 20 and a suction unit 21 having a plurality of suction nozzles 21a (see FIG. 6). This chip component mounting apparatus is a multimounter capable of mounting a plurality of chip components 10 collectively on a printed circuit board 22 transported by a transport conveyor (not shown), and arrange board 17, hopper 18 and guide pipe 19. Are disposed on a component supply stage, the imaging camera 20 is disposed on an image recognition stage that is also a vibration stage, and the suction unit 21 is disposed on a mount stage. And the 1st conveyance stand 13 which mounted the template 15 circulates through a component supply stage, an image recognition stage, and a mount stage, and the 2nd conveyance stand 14 in which the printed circuit board 22 can be mounted is a mount stage. It moves between the substrate supply / discharge stage.

  The XY table 12 constitutes a fixed part of the two-dimensional linear motor, and the first and second transport tables 13 and 14 constitute a movable part of the two-dimensional linear motor. Although not shown in the drawings, a magnet core around which a coil is wound is incorporated in each of the transport bases 13 and 14, and each of the transport bases 13 and 14 is controlled by controlling the direction and magnitude of the current supplied to these coils. 14 can freely move in a two-dimensional direction on the XY table 12 in increments of 0.01 mm, for example.

  The template 15 is provided with a plurality of recesses 15a for receiving one chip component 10 in a predetermined arrangement, and an air inlet 15b is provided on one side of each recess 15a. The template 15 is fixed on the first carrier 13 and conveyed to the component supply stage, the image recognition stage, and the mount stage. As shown in FIG. 2, the chip component 10 in the hopper 18 guides the component supply stage. It falls into the recess 15a through the pipe 19 and the arrange board 17. One side surface of the recess 15a in which the air inlet 15b is formed is a side surface 15c on one end side in the longitudinal direction that is separated from a region that protrudes from the guide pipe 19 when the template 15 is on the component supply stage. That is, the air inlet 15b is opened on the side surface 15c on one end side in the longitudinal direction that is separated from the dropping point of the chip component 10 in the recess 15a. Further, the template 15 is formed with a narrow communication passage 15d continuous with the recess 15a through the air inlet 15b and a wide communication passage 15e continuous with the communication passage 15d. Since the intake port 15b communicates with the suction device 16 via these communication passages 15d and 15e, the chip component 10 that has fallen into the recess 15a is caused by causing the air in the recess 15a to flow into the intake port 15b. A suction force for reliably lying down is generated.

  As shown in FIGS. 4 and 5, the template 15 is formed by laminating and integrating a plurality of thin plate members 30 and the like in which openings 30a and 30b are formed at a plurality of locations in a predetermined arrangement. . Specifically, a plurality of types of thin plate members 30 to 35 made of stainless steel flat plates are laminated in a state where corresponding openings communicate with each other, and a template 15 having a desired shape is obtained by thermocompression bonding them. . For example, the recess 15a for the chip capacitor of the template 15, its intake port 15b, and the communication passages 15d and 15e are formed by an aggregate of the openings 30a to 35a of the 13 thin plate members 30 to 35. Further, the recess 15a for the chip resistor of the template 15, its inlet 15b, and the communication passages 15d and 15e are formed by an aggregate of the openings 30b to 35b of the 13 thin plate members 30 to 35.

  The detailed configuration of the template 15 which is a laminate of the 13 thin plate members 30 to 35 will be described. All the layers from the first layer to the fourth layer of the uppermost layer are 0.1 mm thick as shown in FIG. The thin plate member 30 is formed with square hole-shaped openings 30a, 30b and the like whose plane shapes match each other. Further, relief grooves 30c are formed at the four corners of the openings 30a and 30b. The fifth layer therebelow comprises a thin plate member 31 having a plate thickness of 0.05 mm as shown in FIG. 5 (b). The thin plate member 31 has a square hole-shaped opening 31a whose planar shape matches the opening 30a, A square hole-shaped opening 31b having a slightly longer longitudinal dimension than the opening 31a is formed. In the former opening 31a, relief grooves 31c are formed at four corners, but in the latter opening 31b, relief grooves 31c are formed only at two of the four corners. The sixth layer therebelow comprises a thin plate member 32 having a plate thickness of 0.05 mm as shown in FIG. 5 (c). The thin plate member 32 has a square hole-shaped opening 32a whose planar shape matches the opening 31b, A slit-like opening 32b having a length equivalent to the short dimension of the opening 32a is formed. Therefore, in the former opening 32a, escape grooves 32c are formed at two of the four corners. The seventh layer below is formed of a thin plate member 33 having a plate thickness of 0.1 mm shown in FIG. 5 (d). The thin plate member 33 includes a square hole-shaped opening 33a whose planar shape matches the opening 32a, A slit-like opening 33b whose planar shape matches the opening 32b is formed. Therefore, the former opening 33a has relief grooves 33c formed at two of the four corners. The eighth layer below is formed of a thin plate member 34 having a plate thickness of 0.2 mm shown in FIG. 5 (e). The thin plate member 34 is formed with slit-like openings 34a, 34b and the like whose plane shapes match each other. The openings 34a and 34b have substantially the same shape as the openings 32b and 33b. All the layers from the ninth layer to the lowermost thirteenth layer are composed of a thin plate member 35 having a plate thickness of 0.5 mm shown in FIG. 5 (f), and the thin plate members 35 have round holes whose plane shapes match each other. Shaped openings 35a, 35b and the like are formed. The diameters of these round holes 35a and 35b are substantially equal to the lengths of the openings 32b and 33b and the openings 34a and 34b.

  The openings 30a to 35a, 30b to 35b, the escape grooves 30c to 33c and the like described above can be formed with high accuracy by etching the thin plate members 30 to 35. Further, since the thin plate members 30 to 35 are integrated by laminating and thermocompression bonding, the respective openings 30a to 35a, 30b to 35b, the escape grooves 30c to 33c and the like are fixed with high accuracy. Thus, the template 15 can be obtained.

  In FIG. 4, the recess 15a shown on the left side is for receiving one chip capacitor, and the recess 15a shown on the right side is for receiving one chip resistor. First, the chip capacitor recess 15a shown on the left side of FIG. 4 will be described. The recess 15a includes the openings 30a of the four thin plate members 30 constituting the first layer to the fourth layer, and the fifth layer. To each of the openings 31a, 32a and 33a of the three thin plate members 31 to 33 constituting the seventh layer. Here, the longitudinal dimensions of the openings 32a and 33a of the sixth and seventh layers are set larger by about 0.15 mm than the longitudinal dimensions of the openings 30a and 31a of the first layer to the fifth layer, and the eighth layer. Since the slit-shaped opening 34a overlaps with one end in the longitudinal direction of the opening 33a of the seventh layer, an air inlet 15b is formed on the side surface on one end in the longitudinal direction of the recess 15a, and the air inlet 15b A narrow communication passage 15d that is continuous with the other is formed. A cylindrical communication path 15e is formed by the openings 35a of the five thin plate members 35 constituting the ninth to thirteenth layers, and the upper end of the communication path 15e is continuous with the narrow communication path 15d. is doing.

  On the other hand, the chip resistor recess 15a shown on the right side of FIG. 4 includes openings 30b of the four thin plate members 30 constituting the first to fourth layers, and openings 31b of the fifth thin plate member 31. The thickness of the sixth and seventh layers is 0.15 mm, which is shallower than the recess 15a for the chip capacitor. This is because the chip resistor is thinner than the chip capacitor. In the recess 15a for the chip resistor, the longitudinal dimension of the fifth layer opening 31b is set to be approximately 0.15 mm larger than the longitudinal dimension of the first to fourth layer openings 30b, and the sixth to eighth openings. Since the slit-like openings 32b to 34b of the layer overlap with one end in the longitudinal direction of the opening 31b of the fifth layer, an air inlet 15b is formed on the side surface on one end in the longitudinal direction of the recess 15a. A narrow communication passage 15d that is continuous with the intake port 15b is formed. A cylindrical communication path 15e is formed by the openings 35b of the five thin plate members 35 constituting the ninth to thirteenth layers, and the upper end of the communication path 15e is continuous with the narrow communication path 15d. is doing.

  Note that the relief grooves 30c to 33c provided at the four corners of the openings 30a, 30b, and 31a and the two corners of the openings 31b, 32a, and 33a are provided with chip components (chip capacitors and chips falling from above). This is to prevent the resistor 10 from being caught in the corner of the recess 15a. That is, since these corners are both a part of the recess 15a, there is a possibility that the corner of the chip component 10 is caught if there is no escape space made up of the relief groove 30c, etc. It becomes difficult to lay the chip component 10 on its side.

  The other components of the chip component mounting apparatus according to the present embodiment will be described. The arrangement board 17 arranged on the XY table 12 has a template 15 conveyed to the component supply stage as shown in FIG. Through holes 17a are formed at positions facing the respective recesses 15a. A plurality of chip components 10 can be stored in each of the plurality of hoppers 18 disposed above the arrangement board 17. The chip components 10 in each hopper 18 are supplied to the guide pipe 19 one by one by opening and closing a shutter (not shown), and pass through the guide pipe 19 and through the through hole 17a of the arrangement board 17. It falls into the recess 15a of the template 15.

  The imaging camera 20 is disposed above the image recognition stage, and is used for image recognition for determining the presence / absence of the chip component 10 in each recess 15a of the template 15 and the quality of its recumbent posture.

  The suction unit 21 is disposed above the mount stage. After the chip component 10 mounted in each recess 15a of the template 15 conveyed from the image recognition stage to the mount stage is sucked by the suction nozzle 21a, These chip components 10 can be temporarily fixed at predetermined positions on the printed circuit board 22 conveyed from the substrate supply / discharge stage to the mount stage.

  Next, the operation of the thus configured chip component mounting apparatus will be described. First, prior to the start of work, the first carrier 13 is moved to a predetermined position on the XY table 12 to align the origin. Thereafter, the first transport table 13 is moved to the component supply stage, and the guide pipe 19 and the through-hole 17a are supplied from the hopper 18 into each recess 15a of the template 15 fixed on the transport table 13. The chip component 10 passing through is dropped. In this embodiment, when the chip component 10 is dropped, the suction device 16 is activated to cause the air in the recess 15a of the template 15 to flow toward the intake port 15b. As a result, an air suction force can be applied to the chip component 10 falling into the recess 15a, so that the chip component 10 can be easily aligned in the lying position in the recess 15a. (See FIG. 2). In addition, since the communication path 15d continuous to the intake port 15b is narrow and the communication path 15e close to the suction device 16 is formed wide, the air suction force in the recess 15a is efficiently increased. It has become.

  Thereafter, the first carriage 13 is moved from the component supply stage to the image recognition stage (vibration stage), and a vibration is applied to slightly move back and forth in the XY directions. As a result, even if there is a chip part 10 standing in the recess 15 a against the air suction force, the chip part 10 may be laid down by the vibration of the first transfer table 13. Therefore, the alignment defect of the chip component 10 is almost eliminated. Then, through image recognition using the imaging camera 20, the presence / absence of the chip component 10 in each recess 15 a of the template 15, the quality of the recumbent posture, and the like are determined.

  Thereafter, the first carrier 13 is moved from the image recognition stage to the mount stage, and the chip component 10 in each recess 15a of the template 15 is sucked by the suction nozzle 21a of the suction unit 21 and taken out upward. Then, the first carriage 13 is moved from the mount stage to the image recognition stage, and the presence / absence of defective removal of the chip component 10 from each recess 15a is determined by image recognition using the imaging camera 20.

  On the other hand, the second transport table 14 moves to the mount stage after receiving the printed circuit board 22 from the transport conveyor at the substrate supply / discharge stage, and is applied to a predetermined position of the printed circuit board 22 as shown in FIG. Each chip component 10 sucked by the plurality of suction nozzles 21a is mounted on the solder paste 23 and temporarily fixed. Next, the second transport table 14 is moved from the mount stage to the substrate supply / discharge stage, the printed circuit board 22 is discharged to the transport conveyor, and the printed circuit board 22 is heated in a reflow furnace (not shown), thereby the cream solder 23 Then, the electrode of the chip component 10 is soldered to the land of the printed circuit board 22. As a result, the plurality of chip components 10 are collectively mounted at predetermined positions on the printed circuit board 22.

  As described above, in the present embodiment example, the intake port 15b is opened in the side surface 15c separated from the drop point of the chip component 10 in the recess 15a of the template 15, and the recess 15a is directed toward the intake port 15b. The air suction force acts efficiently as a force that lays down the chip part 10 falling into the recess 15a, and therefore the chip part 10 is lying in the recess 15a. It becomes easy to align by posture. Therefore, it is possible to effectively reduce misalignment of the chip components 10 disposed in the recesses 15a of the template 15 and to obtain a highly reliable chip component mounting device (multi-mounter) in which mounting defects are unlikely to occur.

It is a block diagram of the chip component mounting apparatus which concerns on the example of embodiment of this invention. It is explanatory drawing which shows a mode that the chip component which fell to the template of this mounting apparatus is laid down. It is a top view of this template. It is principal part sectional drawing of this template. It is a principal part top view of the some thin plate member which comprises this template. It is explanatory drawing which shows the operation | movement which mounts the chip component adsorbed from this template on a printed circuit board. It is explanatory drawing of the chip component mounting apparatus which concerns on a prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Chip components 12 XY table 13,14 Carriage 15 Template 15a Recess 15b Inlet 15c Side 15d, 15e Communication path 16 Suction device 17 Arrange board 18 Hopper 19 Guide pipe 20 Imaging camera 21 Suction unit 21a Suction nozzle 22 Printed circuit board 30-35 Thin plate member 30a-35a, 30b-35b Opening 30c-33c Escape groove

Claims (4)

Used in a chip component mounting apparatus capable of mounting a plurality of chip components on a printed circuit board in a lump. The recesses for receiving one chip component are provided in a plurality of locations in a predetermined arrangement, and in the hopper The chip component is transferred between the component supply stage in which the chip component falls into the recess through the guide pipe and the mount stage in which the chip component mounted in the recess is sucked by the suction nozzle and mounted on the printed circuit board. Template,
A template having an air intake port on a side surface at one end in the longitudinal direction in the recess, and the air intake port can communicate with a suction device through a communication path.   The assembly of the openings according to claim 1, wherein a plurality of flat thin plate members having openings formed at a plurality of locations in a predetermined arrangement are stacked and integrated in a state where the openings are in communication with each other. A template in which the recess, the air inlet, and the communication path are formed by a body.   3. The relief groove according to claim 2, wherein a relief groove that cuts outward is provided in a portion of the corner of the opening that becomes a part of the recess, and the opening and the relief groove are formed by etching. A template characterized by being.   The template according to any one of claims 1 to 3, a suction device communicated with the inlet through the communication path of the template, and the recess located on the template at the component supply stage. An arrangement board having a through-hole at a position opposite to the board, a plurality of hoppers arranged above the arrangement board on the component supply stage and capable of storing a large number of chip components, and the chip components in each of the hoppers A chip component mounting device comprising a guide pipe that drops into the through hole of the arrange board.

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