JP2006058086A - Inspection device and manufacturing method for electro-optical device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To efficiently perform a lighting inspection concerning also an electro-optical device in which the size of each connecting terminal and each interval are made highly fine. <P>SOLUTION: An inspection implement 4a is made of a conductive elastic material, and has a conductive surface 41 which comes in touch with connecting terminals to be in continuity with scanning lines out of the electro-optical device. An inspection implement 4c is made of a conductive elastic material, and has a conductive surface 41 which comes in touch with connecting terminals to be in continuity with data lines out of the electro-optical device. To the inspection implements 4a and 4c, inspection signals for driving the electro-optical device are supplied. Into the gap between the inspection implement 4a and the inspection implement 4c, a spacer 5 made of insulating material is inserted. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a technique for inspecting an electro-optical device such as a liquid crystal device.

A lighting inspection is performed on the electro-optical device before shipment. This lighting inspection is an operation of supplying an inspection signal for lighting a pixel to the electro-optical device, thereby observing whether or not each pixel is actually lit. More specifically, a probe needle is brought into contact with each connection terminal of the electro-optical device, and an inspection signal is input from the probe needle to the electro-optical device via the connection terminal (see, for example, Patent Document 1). According to this lighting inspection, it is possible to confirm the presence or absence of a pixel defect due to a short circuit or disconnection of wiring.
JP 2000-155299 A (FIG. 1)

  By the way, the size of each connection terminal and the interval (pitch) of each connection terminal are becoming finer as the image becomes higher definition and larger. It is extremely difficult to bring the probe needle into contact with each of the connection terminals thus miniaturized because of the structure of the probe needle, and it cannot be said that it is a realistic measure from the viewpoint of work efficiency. . The present invention has been made in view of such circumstances, and an object thereof is to efficiently perform a lighting inspection on an electro-optical device in which the size of each connection terminal and each interval are highly miniaturized. It is in.

In order to solve this problem, the present invention inspects an electro-optical device in which first and second terminal groups including a plurality of connection terminals to which signals for driving an electro-optical material are input are arranged on a substrate. A first elastic member having a conductive surface in contact with a plurality of connection terminals of the first terminal group, to which an inspection signal for driving the electro-optic material is applied; An inspection signal for driving the electro-optic material is applied to the conductive elastic member that has a conductive surface that contacts the plurality of connection terminals of the second terminal group and is disposed adjacent to the first inspection member. And a layered insulating portion formed of an insulating material and interposed in the gap between the first inspection member and the second inspection member.
According to this configuration, the inspection member comes into contact with the plurality of connection terminals of each terminal group, and the inspection signals are supplied to these connection terminals all at once. Even if it is miniaturized, lighting inspection can be performed with high work efficiency. Further, since the insulating portions are inserted in the gaps between the inspection members, the inspection members are arranged close to each other even if the first terminal group and the second terminal group are close to each other. However, it is possible to ensure the insulation between the inspection members and accurately supply the intended inspection signal to each terminal group. In a desirable mode of the present invention, the first inspection member and the second inspection member have substantially the same height from the conduction surface to the opposite surface, and the insulating portion is substantially the same as the first inspection member and the second inspection member. Have equal height. According to this aspect, it is possible to reliably avoid conduction between the inspection members.
Although only two inspection members, the first inspection member and the second inspection member, are specified here, an inspection apparatus including three or more inspection members is naturally included in the scope of the present invention. That is, one inspection member arbitrarily selected from the three or more inspection members corresponds to the “first inspection member” of the present invention, and the other inspection members arranged adjacent to the first inspection member of the present invention. It corresponds to a “second inspection member”.

  In a desirable mode of the present invention, each conductive surface of each of the first inspection member and the second inspection member has a protruding portion that extends in a direction in which a plurality of connection terminals of each terminal group are arranged and protrudes from the conductive surface ( (Corresponding to “projection 411” in the embodiment). According to this configuration, since the inspection member is in linear contact with each connection terminal, the inspection member is not compared with the case of using an inspection member that does not have a protrusion and is in surface contact with each connection terminal. And the connection terminals stick to each other.

  Another aspect of the present invention includes a support member that supports each inspection member in contact with a side surface adjacent to each conductive surface of the first inspection member and the second inspection member. According to this aspect, since each inspection member is supported by the support member that contacts the side surface, each inspection member can be easily detached from the support member during inspection or repair. The support member in this aspect desirably has a protrusion (corresponding to the “protrusion 65” in the embodiment) at a position where it abuts on the first inspection member and the second inspection member. According to this aspect, the situation in which each inspection member is detached from the support member during the inspection is prevented by the protrusion of the support member. In a more desirable mode, the support member has a notch (corresponding to “notch 66” in the embodiment) at a position corresponding to the gap between the first inspection member and the second inspection member, and the insulating portion has the first inspection. The member and the second inspection member are separate members, and the portions protruding from the first inspection member and the second inspection member engage with the notch of the support member. According to this configuration, since the position of the insulating portion (and the position of each inspection member partitioned by the insulating portion) is fixed by the support member, each inspection member can be brought into contact with the terminal group with higher accuracy.

  In another aspect, the first inspection member and the first inspection member which are fixed to the support member in a posture facing the surfaces opposite to the conductive surfaces of the first inspection member and the second inspection member, and supported by the support member. (2) A wiring board having a plurality of conductive patterns in contact with the inspection member is provided, and an inspection signal is applied to each conductive pattern on the wiring board. According to this configuration, since each inspection member comes into contact with the conductive pattern by fixing the support member and the wiring board, it is possible to easily assemble the inspection apparatus and perform wiring for the inspection member.

  Another aspect of the present invention includes a first guide member that supports the electro-optical device and has a portion that abuts on a side surface adjacent to the conduction surface of each of the first inspection member and the second inspection member. . In this aspect, since the first guide member that contacts the first inspection member and the second inspection member plays a role of supporting the electro-optical device, the member that supports the electro-optical device and each inspection member are separately provided. Compared to the arrangement, the relative positional relationship between the electro-optical device and each inspection member can be easily adjusted. In this aspect, the first guide member has a notch (corresponding to “notch 172” in the embodiment) at a position corresponding to the gap between the first inspection member and the second inspection member, and the insulating portion is the first The inspection member and the second member are separate members, and portions protruding from the first inspection member and the second inspection member engage with the notches of the first guide member. According to this aspect, the position of the insulating portion (and the position of each inspection member partitioned by the insulating portion) is fixed by the guide member. Furthermore, each inspection member can be brought into contact with the terminal group with high accuracy. Moreover, if the dimension of the part which engages with the notch of a 1st guide member among the insulation parts is made smaller than another part, an insulation part can be easily engaged with a notch.

  A desirable aspect of the present invention includes a second guide member that sandwiches the electro-optical device in a gap with the first guide member, and an adjustment mechanism that moves the second guide member relative to the first guide member. . According to this aspect, since the second guide member is moved by the adjustment mechanism, the position of the electro-optical device can be appropriately adjusted to perform the inspection with high accuracy.

  In another aspect of the present invention, the insulating portion is a portion formed integrally with the inspection member on at least one surface of the first inspection member and the second inspection member (for example, a region indicated by reference numeral 91 in FIG. 14). . According to this aspect, since the number of parts of the inspection apparatus is reduced, the burden of assembling the inspection apparatus can be reduced. Specifically, an insulating part applied to any inspection member is employed. Alternatively, when each inspection member is molded by applying energy such as heat or laser to the conductive elastic material, the insulating layer formed on the surface by applying the energy is used as the insulating portion. Can be adopted.

  The present invention is also specified as a method for inspecting an electro-optical device using the inspection device according to each aspect described above. More specifically, the inspection method according to the present invention includes an electro-optical device in which first and second terminal groups each including a plurality of connection terminals to which signals for driving an electro-optical material are input are arranged on a substrate. An inspection apparatus comprising a first inspection member and a second inspection member, which are adjacent to each other with a layered insulating portion made of an insulating material interposed therebetween and are each made of a conductive elastic material. Among these, the step of bringing the first inspection member into contact with each connection terminal of the first terminal group and bringing the second inspection member into contact with each connection terminal of the second terminal group, and the inspection for driving the electro-optic material Applying a signal to the first inspection member and the second inspection member. In this inspection method, the inspection signal may be applied to each inspection member after the first inspection member and the second inspection member are brought into contact with each terminal group, or the first inspection signal is actually applied. The inspection member and the second inspection member may be brought into contact with each terminal group.

  Furthermore, the present invention is also specified as a method of manufacturing an electro-optical device after performing this inspection method. This manufacturing method includes first and second terminal groups including a plurality of connection terminals to which signals for driving an electro-optic material are input, and a first IC that is electrically connected to each connection terminal of the first terminal group. In a method of manufacturing an electro-optical device in which a chip and a second IC chip electrically connected to each connection terminal of the second terminal group are arranged on a substrate, the layered insulating portions made of an insulating material are sandwiched between each other. And inspecting an electro-optical device before each IC chip is mounted using an inspection device that includes a first inspection member and a second inspection member that are adjacent to each other and each made of a conductive elastic material. An inspection signal for driving the electro-optical material after bringing the first inspection member into contact with each connection terminal of the first terminal group and bringing the second inspection member into contact with each connection terminal of the second terminal group To the first inspection member and the second inspection member An inspection step of pressurizing, a first IC chip and second IC chip after the inspection process and a mounting step of mounting a substrate.

<A: Configuration of electro-optical device>
First, with reference to FIG. 1, the configuration of an electro-optical device to be inspected using the inspection apparatus according to the present invention will be described. The electro-optical device D1 according to the present embodiment is a liquid crystal display device using liquid crystal as an electro-optical material, and is opposed to each other via a frame-shaped sealing material (not shown), as shown in FIG. The first substrate 81 and the second substrate 82 are attached to each other. Liquid crystal is sealed in a space surrounded by both substrates and the sealing material. A plurality of scanning lines 811 extending in the X direction are formed on the surface of the first substrate 81 facing the liquid crystal. On the surface of the second substrate 82 facing the liquid crystal, there are a plurality of data lines 821 extending in the Y direction orthogonal to the X direction, and a TFD (Thin Film Diode) element having one end connected to each data line 821. A substantially rectangular pixel electrode connected to the other end of each TFD element is formed. However, the illustration of the TFD element and the pixel electrode is omitted in FIG. Each pixel electrode, the scanning line 811 facing the pixel electrode, and the liquid crystal interposed in the gap constitute a pixel that is the minimum unit of the display image. These pixels are arranged in a matrix in the X and Y directions in a substantially rectangular display area Ad.

  The second substrate 82 has a larger outer dimension than the first substrate 81. Three IC chips 85 (851, 852, 853) are mounted by COG (Chip On Glass) technology on a region 82a of the second substrate 82 that extends from the periphery of the first substrate 81 (hereinafter referred to as “projected region”). Has been. Here, FIG. 2 is an enlarged plan view showing the overhang region 82a. In the figure, the outline of each IC chip 85 is indicated by a one-dot chain line. As shown in FIG. 2, a plurality of connection terminals 823 arranged in the X direction are formed in the overhang region 82a. These connection terminals 823 are divided into an X terminal group Ga, an X terminal group Gb, and a Y terminal group Gc. The X terminal group Ga is positioned on the negative side in the X direction when viewed from the Y terminal group Gc, and the X terminal group Gb is positioned on the positive side in the X direction when viewed from the Y terminal group Gc. Each of the plurality of connection terminals 823 belonging to the X terminal groups Ga and Gb is connected to the first via a wiring 825 formed on the surface of the second substrate 82 and conductive particles (not shown) dispersed in a sealing material. It is electrically connected to the scanning line 811 formed on the substrate 81. More specifically, each connection terminal 823 belonging to the X terminal group Ga is connected to the odd-numbered scanning line 811, and each connection terminal 823 belonging to the X terminal group Gb is connected to the even-numbered scanning line 811. . On the other hand, each of the plurality of connection terminals 823 belonging to the Y terminal group Gc is electrically connected to the data line 821 via the wiring 825. A plurality of external connection terminals 827 arranged in the X direction along the periphery of the second substrate 82 are formed in the overhang region 82a. These external connection terminals 827 are terminals for electrically connecting the outside and the electro-optical device D1. For example, the external connection terminals 827 are electrically connected to wiring of an FPC (Flexible Printed Circuit) bonded to the second substrate 82. Is done.

  Each IC chip 85 is arranged in the X direction so as to correspond to each of the X terminal groups Ga and Gb and the Y terminal group Gc (abbreviated as “terminal group G” when it is not necessary to distinguish each of them). Is done. Among these, the IC chips 851 and 852 have a scanning line driving circuit that generates a scanning signal for sequentially selecting a plurality of pixels for each row and outputs the scanning signal to each scanning line 811. Each terminal of the IC chip 851 is electrically connected to each connection terminal 823 and each external connection terminal 827 of the X terminal group Ga, and each terminal of the IC chip 852 is connected to each connection terminal 823 and each external connection terminal of the X terminal group Gb. 827 is conducted. Scan signals generated by the IC chips 851 and 852 based on the signals input from the external connection terminals 827 are respectively connected to the first substrate 81 via the connection terminals 823 of the X terminal groups Ga and Gb. This is supplied to the scanning line 811. On the other hand, the IC chip 853 has a data line driving circuit that generates a data signal corresponding to the gradation of the pixel and outputs the data signal to each data line 821. Each terminal of the IC chip 853 is electrically connected to each connection terminal 823 and each external connection terminal 827 of the Y terminal group Gc. A data signal generated by the IC chip 853 based on a signal (for example, an image signal) input from each external connection terminal 827 passes through each data line 821 and the TFD element from each connection terminal 823 of the Y terminal group Gc. And supplied to the pixel electrode. The alignment direction of the liquid crystal sandwiched between the scan line 811 and the pixel electrode changes depending on the voltage of the scan signal supplied to the scan line 811 and the voltage of the data signal supplied to the pixel electrode. As a result, a desired image is displayed in the display area Ad.

<B: Configuration of inspection device>
Next, the configuration of an inspection apparatus used for inspecting the electro-optical device D1 will be described. This inspection apparatus is an apparatus that supplies a signal (hereinafter referred to as “inspection signal”) for lighting all the pixels at the same time to the electro-optical device D1. When the operator visually confirms an image displayed in the display area Ad by supplying the inspection signal (or by confirming an image obtained by photographing the display area Ad on the monitor), a short circuit or disconnection of the wiring is detected. Inspect the pixel defect that caused it. The electro-optical device D1 before each IC chip 85 is mounted on the overhanging region 82a is the inspection target. Then, after this inspection, each IC chip 85 is mounted on the second substrate 82, whereby the electro-optical device D1 of FIG. 1 is completed.

  FIG. 3 is a cross-sectional view showing the configuration of the inspection apparatus. As shown in the figure, the inspection apparatus D 2 includes a first guide member 10 and a second guide member 20 installed on the stage 31. The first guide member 10 and the second guide member 20 are plate-like jigs that support the electro-optical device D1 to be inspected. The first guide member 10 can move in the vertical direction with respect to the stage 31. When the first guide member 10 is at a position separated from the second guide member 20 (that is, at a position indicated by a broken line in FIG. 3), the electro-optical device D1 is placed on the second guide member 20, and then the work is performed. The first guide member 10 is lowered toward the second guide member 20 in accordance with the operation of the person. As a result, the electro-optical device D1 is supported in a state of being sandwiched in the gap between the first guide member 10 and the second guide member 20 arranged so as to face each other. In this state, in the electro-optical device D1, the first substrate 81 faces upward (first guide member 10 side), and the second substrate 82 faces downward (second guide member 20 side). The first guide member 10 and the second guide member 20 are fixed to each other by a bolt 35 inserted through the hole 112 of the first guide member 10 and the hole 212 of the second guide member 20.

  An opening 111 is formed in a portion of the first guide member 10 that overlaps the display area Ad of the electro-optical device D1 when viewed from the vertical direction. The opening 111 is slightly larger in size than the display area Ad. A similar opening 211 is formed in a portion of the second guide member 20 that overlaps the display area Ad when viewed from the vertical direction. An illumination device (not shown) is disposed below the second guide member 20. Irradiation light from the illumination device passes through the opening 211 of the second guide member 20 and reaches the electro-optical device D1, passes through the display area Ad of the electro-optical device D1, and opens in the opening 111 of the first guide member 10. 3 is emitted upward in FIG. The operator inspects the defect of the pixel by visually recognizing the emitted light.

  FIG. 4 is a plan view showing a configuration on the surface of the second guide member 20 facing the first guide member 10. In FIG. 4, the outer shape of the electro-optical device D1 set in the inspection device D2 (more specifically, the outer shape of the second substrate 82) is indicated by a two-dot chain line (the same applies to FIG. 6). As shown in FIGS. 3 and 4, recesses 23 are formed on the surface of the second guide member 20 in the vicinity of each side of the opening 211. Each recessed portion 23 is a portion that is recessed from the other portions of the second guide member 20. A buffer member 231 is installed on the bottom surface of each recess 23. Each buffer member 231 is a member made of an elastic material such as rubber, and as shown in FIG. 3, contacts each side of the second substrate 82 in the electro-optical device D1 set in the inspection device D2.

  A screw hole 251 is formed on one side surface (the right side surface in FIG. 4) of the second guide member 20, and a short plunger 26 is fixed inside the screw hole 251. As shown in FIG. 5A, the short plunger 26 includes a cylindrical base body 261 having a bottom surface, a spring (not shown) accommodated in the base body 261, and a pressing member fixed to one end of the spring. 262. A screw groove is carved on the side surface of the base 261, and the short plunger 26 is fixed to the second guide member 20 by meshing the screw groove with the screw hole 251 of the second guide member 20. On the other hand, the second guide member 20 is formed with a pin hole 254 that penetrates the second guide member 20 in the vertical direction and communicates with the screw hole 251. The pin hole 254 is a long hole whose longitudinal direction is the direction of the arrow A in FIG. As shown in FIG. 5A, the pin 32 erected in the vertical direction from the stage 31 is inserted into the pin hole 254. Under this configuration, the pressing member 262 of the short plunger 26 presses the pin 32 by the elastic force of the spring as shown in FIG. Therefore, the second guide member 20 is urged to the right in FIG.

  On the other hand, a screw hole 252 is also formed on the side surface of the second guide member 20 opposite to the short plunger 26, and a knurled knob 27 is fixed inside the screw hole 252. As shown in FIG. 5B, the knurled knob 27 includes a cylindrical base body 271 having a thread groove on the side surface, a spring (not shown) housed in the base body 271, and one end of the spring. It has a fixed pressing member 272 and a knob 273 fixed to the base 271 opposite to the pressing member 272. On the other hand, the second guide member 20 is formed with a pin hole 254 that penetrates the second guide member 20 so as to be continuous with the screw hole 252. As shown in FIG. 5B, the pin 32 rising from the stage 31 is inserted into the pin hole 254. With this configuration, when the knob 273 of the knurled knob 27 rotates and the base 271 moves in the axial direction of the screw hole 252, the pressing force acting on the pin 32 from the pressing member 272 changes. 2 The guide member 20 moves in the direction A. For example, when the base body 271 moves in a direction approaching the pin 32 due to the rotation of the knob 273, the pressing force to the pin 32 increases, so that the second guide member 20 resists the bias by the short plunger 26. Move to the left of 4. On the contrary, when the base body 271 moves in a direction away from the pin 32, the pressing force to the pin 32 decreases, so that the second guide member 20 moves to the right of FIG. Move towards. The operator adjusts the position of the second guide member 20 by appropriately rotating the knurled knob 27 so that the electro-optical device D1 placed on the second guide member 20 reaches the intended position. Thus, in the present embodiment, the knurled knob 27 and the short plunger 26 function as a mechanism for adjusting the position of the second guide member 20. However, the mechanism for adjusting the position of the second guide member 20 is not limited to the combination of the knurled knob 27 and the short plunger 26.

  Next, FIG. 6 is a plan view showing a configuration on the surface of the first guide member 10 facing the second guide member 20. As shown in FIGS. 3 and 6, circular pin holes 154 are formed at positions corresponding to the pin holes 254 of the second guide member 20 in the first guide member 10. By inserting the pins 32 erected from the stage 31 into these pin holes 154, the position of the first guide member 10 with respect to the stage 31 is fixed.

  As shown in FIGS. 3 and 6, on the surface of the first guide member 10, each side of the opening 111 is located on the surface of the second substrate 82 of the electro-optical device D1 at a position corresponding to the edge other than the overhang region 82a. A recess 13 is formed along In each recess 13, as in the recess 23 of the second guide member 20, a buffer member 131 that contacts each side of the first substrate 81 of the electro-optical device D 1 is disposed. As described above, since the electro-optical device D1 is supported while being sandwiched between the buffer member 131 and the buffer member 231 having elasticity, the first substrate 81 and the second substrate 82 (and elements on each substrate) are damaged. Is prevented.

  On the other hand, a concave portion 141 having a shape different from that of the other concave portions 13 is formed in the first guide member 10 at a position facing the protruding region 82a of the electro-optical device D1. FIG. 7 is an enlarged plan view showing the vicinity of the recess 141, and FIG. 8 is a sectional view taken along line VIII-VIII in FIG. However, in FIG. 8, the near side of FIG. 7 is located below, and the far side of FIG. 7 is located above. As shown in FIGS. 6 to 8, the inspection unit U is disposed on the bottom surface of the recess 141. More specifically, as shown in FIGS. 7 and 8, a portion (hereinafter referred to as “peripheral protrusion”) 17 that is sandwiched between the periphery of the recess 141 and the periphery of the opening 111 and protrudes from the bottom of the recess 141. The inspection unit U is disposed so as to contact the side surface 171 (that is, the inner peripheral surface of the recess 141). The inspection unit U is means for supplying an inspection signal input from the inspection signal output circuit 38 via the transmission line 381 to the electro-optical device D1. A groove 142 is continuously provided in the recess 141 so as to reach the edge of the first guide member 10, and a transmission line 381 that connects the inspection unit U and the inspection signal output circuit 38 is disposed inside the groove 142. The

  Next, a specific configuration of the inspection unit U will be described with reference to FIGS. 9 and 10. It should be noted that FIG. 9 and FIG. 10 have the vertical relationship reversed from FIG. That is, the upper side in FIGS. 9 and 10 is the second guide member 20 side (lower side in FIG. 3), and the lower side in FIGS. 9 and 10 is the first guide member 10 side (upper side in FIG. 3). As shown in these drawings, the inspection unit U includes X inspection members 4a and 4b, a Y inspection member 4c, a spacer 5, a support member 6, and a wiring board 7.

  The X inspection members 4a and 4b and the Y inspection member 4c (referred to as “inspection member 4” when it is not necessary to distinguish between them) are substantially rectangular parallelepipeds made of an elastic material having conductivity (for example, conductive rubber). The Y inspection member 4c is arranged between the X inspection members 4a and 4b. Hereinafter, as shown in FIGS. 9 and 10, the direction in which the inspection members 4 are arranged is referred to as “x direction”. On the upper surface of each inspection member 4 (that is, the surface facing the electro-optical device D1 set in the inspection device D2, hereinafter referred to as “conductive surface”) 41, a protrusion 411 having a substantially semicircular cross section is formed. It extends in the x direction.

  Here, FIG. 11 is a plan view showing a planar positional relationship between each connection terminal 823 and each inspection member 4 at the time of inspection. As shown in the figure, at the time of lighting inspection, each inspection member 4 is arranged so that the conduction surface 41 faces the overhanging region 82a of the electro-optical device D1, and contacts each connection terminal 823. If the electro-optical device D1 is set at an appropriate position of the inspection device D2, the X direction in which the connection terminals 823 of the electro-optical device D1 are arranged substantially coincides with the x direction in which the inspection members 4 are arranged. Therefore, the protruding portion 411 of each inspection member 4 extends in the X direction in which the plurality of connection terminals 823 are arranged in the overhang region 82a. FIG. 12 is a cross-sectional view showing the positional relationship between each connection terminal 823 and each inspection member 4. As shown in the figure, when the conductive surface 41 of each inspection member 4 is disposed so as to face the overhanging region 82 a, the protruding portion 411 is electrically connected to each connection terminal 823. More specifically, as shown in FIG. 11, the protrusions 411 of the X inspection member 4a simultaneously contact all the connection terminals 823 of the X terminal group Ga. Similarly, the protrusions 411 of the X inspection member 4b are simultaneously in contact with all the connection terminals 823 of the X terminal group Ga. On the other hand, the protrusions 411 of the Y inspection member 4c are simultaneously in contact with all the connection terminals 823 of the Y terminal group Gc.

  As shown in FIGS. 9 and 10, spacers 5 are inserted in the gap between the X inspection member 4a and the Y inspection member 4c and the gap between the X inspection member 4b and the Y inspection member 4c, respectively. The spacer 5 is a layered member made of an insulating material such as plastic, and is formed in a substantially rectangular shape in accordance with the dimensions of each inspection member 4. More specifically, the height H5 of each spacer 5 is substantially equal to the height H4 from the bottom surface of each inspection member 4 to the conduction surface 41 (that is, the height excluding the protruding portion 411). The length L5 of each spacer 5 is larger than the width W4 of each inspection member 4 (that is, the dimension in the direction orthogonal to the x direction). Therefore, as shown in FIG. 10, both the end portions E <b> 1 and E <b> 2 of the spacer 5 project from the side surfaces of the respective inspection members 4 in a state of being sandwiched by the respective inspection members 4. Further, the end portion E1 of the spacer 5 in the present embodiment is chamfered. Therefore, the width in the vicinity of the end portion E1 of the spacer 5 is narrower than the other portions.

  On the other hand, the support member 6 is a plate-like member for supporting each inspection member 4 and is made of an insulating material such as plastic. As shown in FIGS. 9 and 10, the support member 6 is formed so that the planar shape is substantially U-shaped. More specifically, the support member 6 extends in the x direction so as to follow the arrangement of the inspection members 4, and the side surface 611 faces the inspection members 4, and x from each end of the portion 61. It has the parts 62 and 63 which protrude in the direction orthogonal to a direction. The distance L6 between the side surface 621 inside the portion 62 (the side facing the portion 63) and the side surface 631 inside the portion 63 (the side facing the portion 62) is the X inspection members 4a and 4b and the Y inspection member 4c. Is approximately equal to the total value of the length in the x direction and the thickness of the two spacers 5. As shown in FIG. 9, a protrusion 65 is formed on the side surface 611 of the portion 61 that faces each inspection member 4 so as to correspond to each inspection member 4.

  As shown in FIG. 7, in the state where the inspection unit U is fixed to the first guide member 10, the side surface 622 of the portion 62 and the side surface 632 of the portion 63 are the side surfaces of the peripheral protrusion 17 of the first guide member 10. 171. As shown in FIGS. 7 to 10, the X inspection members 4a and 4b and the Y inspection member 4c include a side surface 611 of the portion 61, a side surface 621 of the portion 62, a side surface 631 of the portion 63, and a first guide member. It is arranged in a space surrounded on all sides by the side surfaces 171 of the ten peripheral protrusions 17. That is, the side surface 621 of the portion 62 is in contact with the X inspection member 4a, the side surface 631 of the portion 63 is in contact with the X inspection member 4b, and the side surface 611 of the portion 61 and the side surface 171 of the peripheral protrusion 17 are X inspection members 4a and 4b. And the Y inspection member 4c. In this state, as shown in FIG. 8, the protrusion 65 formed on the side surface 611 of the portion 61 elastically bites into each inspection member 4. Here, as shown in FIG. 12, when the inspection member 4 is brought into contact with each connection terminal 823 of the electro-optical device D1, each inspection member 4 may adhere to the second substrate 82 and be detached from the support member 6. . In the present embodiment, since the vertical movement of each inspection member 4 is restricted by the protrusion 65, a situation where each inspection member 4 is detached from the support member 6 is prevented.

  As shown in FIG. 9, a notch (groove) 66 is formed at a position corresponding to the gap between the inspection members 4 on the side surface 611 of the portion 61 of the support member 6. Further, as shown in FIG. 7, a notch (groove) 172 is formed at a position corresponding to the gap between the inspection members 4 on the side surface 171 of the peripheral protrusion 17 of the first guide member 10. These notches 66 and 172 have a width substantially equal to the thickness of the spacer 5. In the state where each inspection member 4 is supported by the support member 6, the end E2 of each spacer 5 inserted in the gap between each inspection member 4 is notched in the support member 6 as shown in FIGS. 66. Similarly, the end E1 of each spacer 5 is inserted into the notch 172 of the peripheral protrusion 17 as shown in FIGS. With such a configuration, the position in the x direction of each spacer 5 (and the position in the x direction of each inspection member 4 sandwiching the spacer 5) is fixed. Here, a so-called burr may remain in the notch 172 of the first guide member 10. In the present embodiment, as described above, the width of the end portion E1 of the spacer 5 is narrower than that of the other portions. Therefore, even if such a burr is formed, the spacer 5 Can be quickly engaged with the notch 172. For the same reason, the end portion E2 of the spacer 5 may be chamfered to narrow the width.

  Next, the wiring substrate 7 is a substrate on which a conductive pattern 71 for supplying the inspection signal output from the inspection signal output circuit 38 to each inspection member 4 is formed. As shown in FIGS. 9 and 13, the wiring board 7 has three conductive patterns 71 (711, 712, 713) corresponding to the number of inspection members 4. In FIG. 13, each conductive pattern 71 is hatched. These conductive patterns 71 are formed on one surface (hereinafter referred to as “pattern forming surface”) of the substrate 70 so as to be separated from each other (that is, not electrically conductive). As shown in FIGS. 9 and 10, each inspection member 4 and support member 6 are disposed on the pattern forming surface of the substrate 70. More specifically, as shown in FIGS. 7 and 8, the support member 6 is connected to the wiring board 7 by a bolt 39 inserted into a hole 67 formed in the support member 6 and a hole 75 of the wiring board 7. The first guide member 10 is fixed in an overlapping state. In this state, each inspection member 4 supported by the support member 6 contacts and electrically conducts each conductive pattern 71 of the wiring board 7. That is, the X inspection member 4 a is electrically connected to the conductive pattern 711, the X inspection member 4 b is electrically connected to the conductive pattern 712, and the Y inspection member 4 c is electrically connected to the conductive pattern 713. In other words, the plurality of conductive patterns 71 of the wiring board 7 are patterned in a shape in which each of the conductive patterns 71 is in contact with a separate inspection member 4. Therefore, each inspection member 4 and each conductive pattern 71 can be made conductive by assembling the inspection unit U, and a separate member or process for making each conductive is unnecessary.

  As shown in FIG. 13, an inspection signal output from the inspection signal output circuit 38 is applied to these conductive patterns 71. For example, the conductive patterns 711 and 712 are supplied with the higher potential of the power supply as an inspection signal. This inspection signal is supplied from the conductive patterns 711 and 712 to all the connection terminals 823 of the X terminal groups Ga and Gb of the electro-optical device D1 through the X inspection members 4a and 4b. A higher potential is applied. On the other hand, the lower potential of the power source is supplied to the conductive pattern 713 as an inspection signal. This inspection signal is supplied from the conductive pattern 713 to all the connection terminals 823 of the Y terminal group Gc via the Y inspection member 4c, whereby a lower potential is applied to all the pixel electrodes. Accordingly, if there is no problem in the electro-optical device D1, all the pixels in the display area Ad are turned on. On the other hand, if there is a problem such as a short circuit or disconnection of the wiring, the pixel corresponding to the location where the problem has occurred do not do. The operator determines the presence or absence of a pixel defect by visually recognizing the display associated with the full lighting.

  As described above, in the present embodiment, since the inspection member 4 simultaneously contacts the connection terminals 823 belonging to each terminal group G and the inspection signal is input, the size of each connection terminal 823 and the size of each connection terminal 823 A lighting inspection can be performed with high work efficiency, no matter how fine the interval is.

  On the other hand, when the interval between the IC chips 85 is narrowed from the viewpoint of narrowing the area surrounding the display area Ad (so-called frame area), a plurality of terminal groups G to which separate inspection signals are to be input approach each other. Will be placed. In order to inspect such an electro-optical device D1, it is necessary to arrange the inspection members 4 in contact with the terminal groups G close to each other. However, under this configuration, the inspection members 4 adjacent to each other come into contact with each other, and as a result, there is a problem that it is difficult to supply an intended inspection signal to the electro-optical device D1. Even under such circumstances, in the present embodiment, the inspection members 4 adjacent to each other are partitioned by the spacers 5 serving as insulating portions, so that the situation in which the inspection members 4 contact each other is avoided. The intended inspection signal can be supplied to G with high accuracy.

<C: Modification>
Various modifications are added to this embodiment. An example of a specific modification is as follows. The following aspects may be appropriately combined.

(1) In the above embodiment, the configuration in which the spacer 5 is a member separate from each inspection member 4 is exemplified, but a member for electrically insulating each inspection member 4 (that is, “insulation” in the present invention) The portion “) may be formed integrally with each inspection member 4. In other words, the “insulating portion” in the present invention may be an insulating layer interposed in the gap between the inspection members 4. For example, a layer obtained by applying an insulating resin material to the side surface of each inspection member 4 facing the other inspection member 4 and curing it may be used as the insulating portion. In this way, the number of parts of the inspection unit U is reduced, so that the ease of assembly can be improved and the manufacturing cost can be reduced.

  Moreover, you may utilize the insulating layer produced | generated in the process of shape | molding each test | inspection member 4 as an insulation part. For example, as shown in FIG. 14, a case is assumed in which a long elastic member 90 having conductivity is cut by irradiation with a laser L to form an inspection member 4 (downward in FIG. 14). In this case, as shown by hatching in FIG. 14, an insulating thin film is formed on the cut surface 91 of the elastic member 90 (that is, the side surface of the inspection member 4) by hardening the material melted by the irradiation of the laser L. Can be formed. This thin film may be used as an insulating portion instead of the spacer 5 of the above embodiment or together with the spacer 5. Here, it is assumed that the elastic member 90 is cut by irradiation with the laser L. However, when the elastic member 90 is cut by applying other energy (for example, heat), the insulation used as an insulating portion is used. A thin film can be formed.

(2) In the above embodiment, the electro-optical device including the TFD element as the two-terminal nonlinear element is illustrated, but the electro-optical apparatus including the TFT (Thin Film Transistor) element as the three-terminal nonlinear element, The present invention is also applied to an apparatus for inspecting a passive matrix type electro-optical device that does not use an element. In the above-described embodiment, a liquid crystal device using liquid crystal as an electro-optical material has been exemplified. However, a display device using an organic light emitting diode (OLED) element such as an organic EL (ElectroLuminescent) as an electro-optical material, or The present invention is also applied to an apparatus for inspecting various electro-optical devices such as a plasma display panel using an inert gas such as neon or xenon as an electro-optical material. That is, the electro-optical device to be inspected by the inspection apparatus according to the present invention only needs to have a configuration in which a plurality of terminal groups to which separate inspection signals are to be supplied are formed on the substrate. Is unquestionable.

1 is a perspective view illustrating a configuration of an electro-optical device inspected by an inspection device according to the present invention. It is a top view which expands and shows the overhang | projection area | region of an electro-optical apparatus. It is sectional drawing which shows the structure of the inspection apparatus which concerns on embodiment of this invention. It is a top view which shows the structure of the 2nd guide member among test | inspection apparatuses. It is sectional drawing which expands and shows the vicinity of the periphery of a 2nd guide member. It is a top view which shows the structure of the 1st guide member among test | inspection apparatuses. It is a top view which expands and shows the vicinity of an inspection unit among inspection devices. It is sectional drawing seen from the VIII-VIII line in FIG. It is a disassembled perspective view which shows the structure of a test | inspection unit among test | inspection apparatuses. It is a perspective view which shows the structure of a test | inspection unit. It is a top view which shows the positional relationship of each connection terminal and each test | inspection member. It is sectional drawing which shows the positional relationship of each connection terminal and each test | inspection member. It is a top view which shows the structure of the wiring board of a test | inspection unit. It is a figure for demonstrating the manufacturing method of the test | inspection member which concerns on a modification.

Explanation of symbols

D1: electro-optical device, 81: first substrate, 82: second substrate, 82a: overhang area, 811: scanning line, 821: data line, 823: connection terminal, 825: wiring , 827 ... external connection terminals, Ga, Gb ... X terminal group, Gc ... Y terminal group, 85 (851, 852, 853) ... IC chip, D2 ... inspection device, 10 ... first guide member , 17... Peripheral protrusion, 171... Projection, 172... Notch, 20... Second guide member, 26... Short plunger, 27. Circuit 381 ...... Transmission line, U ...... Inspection unit, 4a, 4b ...... X inspection member, 4c ...... Y inspection member, 41 …… Projection, 5 …… Spacer, 6 …… Support member, 65 …… Projection part, 66 ... Notch, 7 ... Wiring board, 70 ... Board, 1 (711, 712, and 713) .... conductive pattern.

Claims (12)

In an apparatus for inspecting an electro-optical device in which a first terminal group and a second terminal group including a plurality of connection terminals to which signals for driving an electro-optical material are input are arranged on a substrate,
A first elastic member having a conductive surface in contact with a plurality of connection terminals of the first terminal group, to which an inspection signal for driving the electro-optical material is applied;
An inspection signal for driving the electro-optical material, which is a conductive elastic member that has a conductive surface that contacts a plurality of connection terminals of the second terminal group and is disposed adjacent to the first inspection member. A second inspection member to which is applied;
An inspection apparatus comprising: a layered insulating portion formed of an insulating material and interposed in a gap between the first inspection member and the second inspection member. Each conductive surface of the first inspection member and the second inspection member is provided with a protrusion that extends in a direction in which a plurality of connection terminals of each terminal group are arranged and protrudes from the conductive surface. Item 2. The inspection apparatus according to Item 1.   The inspection apparatus according to claim 1, further comprising a support member that contacts each side surface of the first inspection member and the second inspection member that is adjacent to the conduction surface and supports each inspection member. The inspection apparatus according to claim 3, wherein the support member has a protrusion at a position where the support member abuts on the first inspection member and the second inspection member. The support member has a notch at a position corresponding to a gap between the first inspection member and the second inspection member;
The insulating portion is a member that is separate from the first inspection member and the second inspection member, and a portion protruding from the first inspection member and the second inspection member engages with a notch of the support member. Item 4. The inspection apparatus according to Item 3. Each of the first inspection member and the second inspection member is fixed to the support member in a posture facing the surface opposite to the conduction surface of each of the first inspection member and the second inspection member, and the first inspection member and the first member supported by the support member 2 comprising a wiring board having a plurality of conductive patterns in contact with the inspection member;
The inspection apparatus according to claim 3, wherein an inspection signal is applied to each conductive pattern of the wiring board.   The member which supports the said electro-optical apparatus, Comprising: The 1st guide member which has a part contact | abutted to the side surface adjacent to the said conduction surface of each of the said 1st test | inspection member and the said 2nd test | inspection member is comprised. The inspection device described. The first guide member has a notch at a position corresponding to a gap between the first inspection member and the second inspection member;
The insulating portion is a member separate from the first inspection member and the second member, and a portion protruding from the first inspection member and the second inspection member engages with a notch of the first guide member. The inspection apparatus according to claim 7. The inspection apparatus according to claim 8, wherein a portion of the insulating portion that engages with the notch of the first guide member has a smaller size than other portions. A second guide member for sandwiching the electro-optical device in a gap with the first guide member;
The inspection apparatus according to claim 7, further comprising an adjustment mechanism that moves the second guide member relative to the first guide member. The inspection apparatus according to claim 1, wherein the insulating portion is a portion formed integrally with the inspection member on at least one surface of the first inspection member and the second inspection member. First and second terminal groups each including a plurality of connection terminals to which signals for driving an electro-optic material are input; a first IC chip electrically connected to each connection terminal of the first terminal group; In a method of manufacturing an electro-optical device in which a second IC chip electrically connected to each connection terminal of the second terminal group is disposed on a substrate,
Each of the IC chips is formed by using an inspection apparatus that includes a first inspection member and a second inspection member that are adjacent to each other across a layered insulating portion made of an insulating material and that are each made of a conductive elastic material. A step of inspecting the electro-optical device before being mounted, wherein the first inspection member is brought into contact with each connection terminal of the first terminal group, and the second inspection member is disposed in each of the second terminal groups. An inspection step of applying an inspection signal for driving the electro-optical material to the first inspection member and the second inspection member after contacting the connection terminal;
A method of manufacturing an electro-optical device, comprising: a mounting step of mounting the first IC chip and the second IC chip on the substrate after the inspection step.

Images