JP2006054259A - Optical semiconductor module, its manufacturing method and semiconductor device using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical semiconductor module which is miniaturized and whose cost is made low while mounting each component element required for short distance light wiring such as LSI wiring. <P>SOLUTION: A guide 2 has a positioning part 4 of an optical transmission line and an optical semiconductor mounting face 5 from which one end face of the optical transmission line arranged by the positioning part 4 is exposed. The optical semiconductor element 8 is mounted on the optical semiconductor mounting face 5 of the guide 2 so that a light emitting face or a light receiving face faces the one end face of the optical transmission line. A driving semiconductor element 10 driving the optical semiconductor element 8 is laminated on the optical semiconductor element 8 and is incorporated in the optical semiconductor module 1, for example. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an optical semiconductor module that realizes optical coupling with a relatively simple structure for short-distance optical wiring, a manufacturing method thereof, and a semiconductor device using the same.

  By improving the performance of electronic devices such as bipolar transistors and field effect transistors, large-scale integrated circuits (LSIs) have been dramatically improved in operating speed. However, even if the internal operation of the LSI is accelerated, the operation speed at the printed circuit board level for mounting the LSI is kept lower than the internal operation of the LSI, and the operation speed is further reduced at the rack level where the printed circuit board is mounted. Yes. These are caused by transmission loss of electric wiring accompanying an increase in operating frequency, increase in noise and electromagnetic interference, and the operating frequency is kept lower for longer wiring in order to ensure signal quality. For this reason, in semiconductor devices, the tendency that the mounting technology dominates the system operation speed rather than the operation speed of the LSI itself is increasing.

In response to the problems faced by the semiconductor devices as described above, application of optical wiring technology for connecting LSIs with light is being studied, and an optical semiconductor module for realizing such optical wiring is proposed. (For example, refer to Patent Document 1). Optical wiring has almost no frequency dependency such as loss in the frequency range from DC to 100 GHz, and there is no electromagnetic interference in the wiring path or ground potential fluctuation noise. Therefore, wiring of several tens of Gbps can be easily realized. In order to realize this type of optical interconnection between LSIs, for example, an optical semiconductor module having a simple structure as shown in Patent Document 1 is required. Further, since a large number of optical transmission lines are required for LSI wiring, it is important to reduce the cost of the optical semiconductor module.
JP 2000-347072 A

  Many common optical semiconductor modules cannot be miniaturized much because they incorporate an imaging lens or the like, and have a connector structure at the optical fiber coupling portion. In comparison, for example, an optical semiconductor module as described in Patent Document 1 is relatively easy to downsize because an optical transmission line such as an optical fiber and an optical semiconductor element are directly coupled and integrated. Has the advantage of being. However, the optical semiconductor module described in Patent Document 1 has the following disadvantages.

  That is, in order to drive an optical semiconductor element in a normal optical semiconductor module, a driver element and a receiver element corresponding to a high-speed signal are required, but Patent Document 1 does not show any mounting method of these driving elements. . For example, depending on the mounting form of the drive element, there arises a problem that the optical semiconductor module becomes large and the electric wiring portion between the optical semiconductor element and the drive element becomes long. Furthermore, it is necessary to transmit a very weak signal to the receiver element on the light receiving element side. If the receiver element is installed outside the module, a very large cost is required for noise countermeasures.

  In the optical semiconductor module described in Patent Document 1, an optical fiber and a supporting member thereof are integrally formed, and an electrode for mounting an optical semiconductor element is formed thereon. For this reason, it is necessary to perform electrode pattern drawing or pattern transfer on a very narrow end face of the support member holding the optical fiber. That is, it is necessary to perform patterning with an accuracy of several μm on a minute region on the end surface of the support member with an optical fiber of several meters to several tens of meters being attached. The electrode forming process including patterning on the end face of the support member causes a significant increase in the manufacturing cost of the optical semiconductor module and a decrease in manufacturing yield.

  The present invention has been made to cope with such problems, and is equipped with each component required for short-distance optical wiring such as LSI wiring, and is aimed at miniaturization and cost reduction. An object of the present invention is to provide an optical semiconductor module, a method of manufacturing the same, and a semiconductor device using the same.

  An optical semiconductor module according to an aspect of the present invention includes a guide having a positioning portion of an optical transmission path, an optical semiconductor mounting surface on which one end face of the optical transmission path disposed in the positioning section is exposed, and the optical transmission path An optical semiconductor element mounted on the optical semiconductor mounting surface of the guide, and a semiconductor element stacked on the optical semiconductor element so that one end surface of the guide faces a light emitting surface or a light receiving surface. It is said.

  Further, in the method of manufacturing an optical semiconductor module according to one aspect of the present invention, in manufacturing the optical semiconductor module of the present invention described above, a plurality of the guides are aligned with the optical semiconductor mounting surface facing upward, and And a step of integrally manufacturing the plurality of guides in a state of being connected by a frame, and a step of mounting the optical semiconductor element and the semiconductor element on the optical semiconductor mounting surface of the plurality of guides while being stacked. Yes.

  A semiconductor device according to an aspect of the present invention includes the above-described optical semiconductor module according to the present invention, a substrate on which the optical semiconductor module is mounted, and a signal wiring connected to the semiconductor element of the optical semiconductor module; And a signal processing semiconductor element mounted on the substrate and connected to the signal wiring of the substrate.

  According to the optical semiconductor module of one aspect of the present invention, since the driving semiconductor element is stacked on the optical semiconductor element, for example, the guide is mounted on the guide. Reliability can be increased. Moreover, according to the manufacturing method of the optical semiconductor module which concerns on 1 aspect of this invention, the productivity of such an optical semiconductor module can be improved. Furthermore, according to the semiconductor device of one embodiment of the present invention, by using such an optical semiconductor module, high-speed wiring between LSIs can be realized at low cost.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. First, an optical semiconductor module according to a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a cross-sectional view showing a configuration of an optical semiconductor module according to a first embodiment of the present invention. FIGS. 2 and 3 are cross-sectional views showing a state in which an optical fiber is arranged as an optical transmission line in the optical semiconductor module shown in FIG. FIG.

  An optical semiconductor module 1 shown in FIG. 1 has a guide 2 for positioning an optical transmission line such as an optical fiber. The guide 2 is made of, for example, a member obtained by mixing a glass filler with an epoxy resin, and constitutes the main body of the photoelectric ferrule. A positioning through hole 4 for inserting and holding the optical fiber 3 is formed in the guide 2 as a positioning portion. A plurality of positioning through holes 4 are formed according to the number of optical fibers 3 used for the optical wiring. FIG. 1 shows a guide 2 used for a four-channel optical semiconductor element array.

  Here, the plurality of positioning through holes 4 are required to be formed in the guide 2 at a predetermined pitch with high accuracy. For such a point, a plurality of positioning through holes 4 may be individually formed. For example, a plurality of positioning through holes 4 may be formed as communication holes. That is, by using the communication holes in which the adjacent through-holes 4 having a circular cross section communicate with each other, the positional accuracy when forming each through-hole 4 can be improved. Therefore, it is possible to improve the alignment accuracy between the optical fiber 3 held by the guide 2 and an optical semiconductor element described later.

  The surface of the guide 2 on which the one end opening of the positioning through hole 4 is formed is an optical semiconductor mounting surface 5. That is, one end surface of the optical fiber 3 inserted and disposed in the positioning through hole 4 is exposed to the optical semiconductor mounting surface 5. A wiring layer 6 by general metal plating is provided on the optical semiconductor mounting surface 5 of such a guide 2. The plated wiring layer 6 is formed in a right-angle bent state from the optical semiconductor mounting surface 5 to the side surface 7 of the guide 2.

  A wiring layer portion 6 </ b> A formed on the optical semiconductor mounting surface 5 of the guide 2 is a portion that becomes a mounting portion or wiring portion for an optical semiconductor element or a driving semiconductor element described later, and is drawn out to the side surface 7 of the guide 2. The wiring layer portion 6B is a portion that becomes an electrode when connected to other components. Since such a plated wiring layer 6 is formed in advance on the optical semiconductor mounting surface 5 and the side surface 7 of the guide 2, it can be formed at low cost and with high accuracy. This contributes to a reduction in manufacturing cost of the optical semiconductor module 1 and an improvement in manufacturing yield. The specific manufacturing process of the plated wiring layer 6 will be described in detail later.

  An optical semiconductor element 8 is mounted on the optical semiconductor mounting surface 5 of the guide 2 described above. A light emitting element such as an LED or a light receiving element such as a photodiode is applied to the optical semiconductor element 8 mounted on the guide 2. Such an optical semiconductor element 8 includes an optical fiber in which a light emitting surface (when the optical semiconductor element 8 is a light emitting element) or a light receiving surface (when the optical semiconductor element 8 is a light receiving element) is inserted into the positioning through hole 4. 3 is fixed to the optical semiconductor mounting surface 5 of the guide 2 in an aligned state so as to face one end surface of the guide 2.

  The alignment of the optical semiconductor element 8 is performed based on the position of the positioning through hole 4 of the guide 2 and the light emitting surface or the light receiving surface of the optical semiconductor element 8. The alignment accuracy is approximately 1 μm or less. Specifically, the optical semiconductor element 8 is fixed by bonding the bumps 9 of the optical semiconductor element 8 to the plated wiring layer 6. The optical semiconductor element 8 is mechanically fixed to the guide 2 and is electrically connected to the plated wiring layer 6 by the bonding by the bumps 9.

  A driving semiconductor element 10 for driving the optical semiconductor element 8 is stacked on the back surface of the optical semiconductor element 8 described above. As the driving semiconductor element 10, a driver element is applied when the optical semiconductor element 8 is a light emitting element, and a receiver element is applied when the optical semiconductor element 8 is a light receiving element. The driving semiconductor element 10 is bonded and fixed to the back surface of the optical semiconductor element 8 via, for example, an adhesive resin 11. The optical semiconductor element 8 and the driving semiconductor element 10 are bonded to the back surfaces of the elements 8 and 10 so that the electrode of the driving semiconductor element 10 not shown is exposed on the outermost surface of the laminated structure.

  The electrode of the driving semiconductor element 10 (not shown) is electrically connected to the plated wiring layer 6 via the bonding wire 12. That is, the optical semiconductor element 8 and the driving semiconductor element 10 are electrically connected via the plated wiring layer 6 and the bonding wire 12. Further, the driving semiconductor element 10 is connected via a bonding wire 12 to a plated wiring layer 6 serving as an electrode when connecting to other components, that is, a wiring layer portion 6B drawn to the side surface 7 of the guide 2. . When the optical semiconductor element 8 includes a drive circuit or the like, for example, a semiconductor element (conversion circuit semiconductor element) for converting a signal from parallel to serial is stacked on the optical semiconductor element 8. Further, other semiconductor elements may be used.

  As described above, by laminating the driving semiconductor element 10 on the back surface of the optical semiconductor element 8, each component necessary for the operation of the optical semiconductor module 1 is built in, and the optical semiconductor module 1 can be downsized. Cost reduction can be achieved. Furthermore, since the distance of the electric wiring part (electric wiring by the plating wiring layer 6 and the bonding wire 12) that handles a weak electric signal can be shortened, the optical semiconductor module 1 can suppress deterioration of signal quality. Become. That is, the signal reliability can be significantly increased after the optical semiconductor module 1 is reduced in size and cost.

  The optical semiconductor element 8 and the driving semiconductor element 10 stacked and mounted on the optical semiconductor mounting surface 5 of the guide 2 are together with the plated wiring layer 6 (wiring layer portion 6A) and the bonding wire 12 formed on the optical semiconductor mounting surface 5. It is insulated and sealed with a sealing resin 13. The component of the insulating sealing resin 13 is adjusted so as not to go around to the surface side (light emitting surface or light receiving surface side) of the optical semiconductor element 8. Accordingly, the light emitting surface or the light receiving surface of the optical semiconductor element 8 is disposed opposite to one end surface of the optical fiber 3 inserted and disposed in the positioning through hole 4. The optical semiconductor module 1 is configured by these components.

  The optical semiconductor module 1 described above is used as an optical interface module by inserting and fixing the optical fiber 3 into the positioning through hole 4 of the guide 2 as shown in FIGS. Here, it is preferable that the tip of the optical fiber 3 is bonded and fixed in a state where it abuts against the transparent resin 14 disposed on the light emitting surface or the light receiving surface of the optical semiconductor element 8, for example. The transparent resin 14 may be formed of a resin sheet arranged in advance, or may be formed by injecting resin. The constituent material of the transparent resin 14 is not particularly limited, and a semiconductor element protective film may be substituted as long as it has a certain degree of transparency.

  The optical semiconductor module 1 of the above-described embodiment is manufactured as follows, for example. First, the guide 2 having the positioning through holes 4 is produced by injection molding or the like. Here, the guides 2 may be produced individually, but for example, as shown in FIG. Furthermore, it is preferable that the plurality of guides 2 and 2 are integrated in a state where the optical semiconductor mounting surface 5 is aligned upward. Thus, according to the component 22 in which the plurality of guides 2 and 2 are integrated, it can be easily handled in an existing semiconductor manufacturing process, and the productivity of the optical semiconductor module 1 can be increased.

  In the integrated component 22 shown in FIG. 4, the plurality of guides 2, 2 are aligned with the optical semiconductor mounting surface 5 facing upward, and in this state, supported by the transport frame 21 via the interference portion 23. ing. The frame body 21 is conveyed so as to slide on the rail by almost all devices such as a wire bonder, a die bonder, and a molding device, and is used for holding purposes, width direction regulating purposes, and the like. The interference unit 23 is a deforming unit that allows a position error when the guide 2 is fixed. That is, when the elements 8 and 10 are mounted on the guide 2, the integrated component 22 is sequentially conveyed to the processing position, and the guide 2 is fixed by suction or pinching thereon. In order to allow an error at this time, each guide 2 is supported by the frame body 21 via a deformable interference portion 23.

  Using the integrated component 22 as described above, the wiring layer 6 is formed by applying a plating method to the optical semiconductor mounting surface 5 and the side surface 7 of each guide 2. FIG. 4 shows a state in which the plated wiring layer 6 is formed on each guide 2. Next, the optical semiconductor element 8 is mounted on the optical semiconductor mounting surface 5 of the guide 2. As described above, the optical semiconductor element 8 is fixed using the bumps 9. The alignment of the optical semiconductor element 8 is performed based on the position of the positioning through hole 4 of the guide 2 and the light emitting surface or the light receiving surface of the optical semiconductor element 8. The alignment accuracy is approximately 1 μm or less.

  Next, the driving semiconductor element 10 is fixed to the back side of the optical semiconductor element 8. The driving semiconductor element 10 is fixed by pasting the adhesive resin 11 on the back surface of the optical semiconductor element 4 in advance, placing the driving semiconductor element 10 on the adhesive resin 11, and thermocompression bonding. Subsequently, wire bonding is performed to electrically connect the driving semiconductor element 10 and the plated wiring layer 6. Thereafter, the optical semiconductor element 8 and the driving semiconductor element 10 are insulated and sealed with a sealing resin 13. After such a series of manufacturing steps is completed, the optical semiconductor module 1 is completed by separating both ends of the guide 2 from the frame body 21.

  The optical semiconductor module 1 according to the first embodiment described above includes a driving semiconductor element 10 such as a driver element that drives the light emitting optical semiconductor element 8 and a receiver element that drives the light receiving optical semiconductor element 8. Built-in in a stacked state. Accordingly, since the wiring of the analog circuit portion that handles very weak electric signals is shortened, it is possible to greatly reduce signal quality degradation. Furthermore, the optical semiconductor module 1 incorporating such a driving semiconductor element 10 can be reduced in size. In addition to the miniaturization of the optical semiconductor module 1, since a general plated wiring is applied to the electrical wiring, the cost of the optical semiconductor module 1 can be reduced. This greatly contributes to practical application of LSI optical wiring that requires a large number of optical transmission lines.

  Next, an optical semiconductor module according to a second embodiment of the present invention will be described with reference to FIG. FIG. 5 is a cross-sectional view showing the configuration of the optical semiconductor module according to the second embodiment of the present invention. In addition, the same code | symbol is attached | subjected to the same part as 1st Embodiment, and the description is partially abbreviate | omitted. The optical semiconductor module 30 according to the second embodiment shown in FIG. 5 uses a through plug 31 for connection between the optical semiconductor element 8 and the driving semiconductor element 10. Other configurations are the same as those in the first embodiment.

  That is, the optical semiconductor element 8 has a through plug 31 that penetrates through the chip, and an electrode is formed on the back surface side of the through plug 31. The driving semiconductor element 10 is stacked on the back side of the optical semiconductor element 8. Specifically, the bump 32 formed on the driving semiconductor element 10 is connected to the back electrode of the optical semiconductor element 8, thereby mechanically fixing and electrically connecting the optical semiconductor element 8 and the driving semiconductor element 10. A connection has been made. In such an optical semiconductor module 30, since the distance of the electrical wiring portion is further shortened, it is possible to suppress degradation of signal quality to a higher degree.

  Next, an optical semiconductor module according to a third embodiment of the present invention will be described with reference to FIGS. FIG. 6 is a cross-sectional view showing a configuration of an optical semiconductor module according to the third embodiment of the present invention, and FIG. 7 is a cross-sectional view showing an element portion of the optical semiconductor module shown in FIG. In addition, the same code | symbol is attached | subjected to the same part as 1st Embodiment, and the description is partially abbreviate | omitted. In the optical semiconductor module 40 according to the third embodiment shown in FIG. 6, an electrical wiring is constituted by a lead frame 41 joined to the optical semiconductor mounting surface 5 of the guide 2.

  In other words, the optical semiconductor element 8 is mounted on the lead frame 41 as shown in FIG. The optical semiconductor element 8 is connected and fixed by bonding the bump 9 to the lead frame 41. On the back surface of the optical semiconductor element 8, the driving semiconductor element 10 is laminated and fixed via the adhesive resin 11, as in the first embodiment. Further, the electrode of the driving semiconductor element 10 (not shown) is electrically connected to the lead frame 41 via the bonding wire 12. The optical semiconductor element 8 and the driving semiconductor element 10 are insulated and sealed with a sealing resin 13. The mounting process and connection process of the elements 8 and 10 to the lead frame 41 can be performed by applying a general assembly process of a semiconductor device.

  Then, the optical semiconductor module 40 is configured by adhering the element module 42 manufactured by mounting the elements 8 and 10 on the lead frame 41 to the optical semiconductor mounting surface 5 of the guide 2. As in the first embodiment, the optical semiconductor module 40 is used by inserting the optical fiber 3 into the positioning through hole 4 of the guide 2. The portion protruding from the guide 2 of the lead frame 41 can be used as a connector when connecting to other components. This portion may be bent along the side surface of the guide 2 and used as an electrode.

  Since the optical semiconductor module 40 according to the third embodiment incorporates the driving semiconductor element 10 in a state of being stacked on the optical semiconductor element 8, it realizes suppression of signal quality deterioration and miniaturization of the optical semiconductor module 40. be able to. In addition to the downsizing of the optical semiconductor module 40, the lead frame 41 is applied to the electrical wiring, so that the manufacturing cost of the optical semiconductor module 40 can be reduced. This greatly contributes to practical application of LSI optical wiring that requires a large number of optical transmission lines. The connection between the elements 8 and 10 may be performed using a through plug as in the second embodiment.

  Next, an optical semiconductor module according to a fourth embodiment of the present invention will be described with reference to FIGS. FIG. 8 is a cross-sectional view showing a configuration of an optical semiconductor module according to the fourth embodiment of the present invention, and FIGS. 9 and 10 are cross-sectional views showing element portions of the optical semiconductor module shown in FIG. In addition, the same code | symbol is attached | subjected to the same part as 1st Embodiment, and the description is partially abbreviate | omitted. The optical semiconductor module 50 according to the fourth embodiment shown in FIG. 8 uses through plugs 51 and 52 for connection between the elements 8 and 10 and uses a lead frame 53 connected to the driving semiconductor element 10 for electric wiring. It was.

  That is, the optical semiconductor element 8 and the driving semiconductor element 10 each have through plugs 51 and 52 penetrating through the chip, and electrodes are formed on the chip back surfaces of the through plugs 51 and 52. First, as shown in FIG. 9, the driving semiconductor element 10 having the through plug 52 is connected and fixed to the lead frame 53 using bumps 54. Next, the optical semiconductor element 8 is connected and fixed on the driving semiconductor element 10 using the bumps 55. Further, bumps 56 are formed on the optical semiconductor element 8.

  The lead frame 53 of such an element module 57 is formed into a desired shape as shown in FIG. 10 and then bonded and fixed to the optical semiconductor mounting surface 5 of the guide 2 using bumps 56. Note that the bumps 56 are used only for mechanical fixing of the optical semiconductor element 8, and other fixing structures may be applied. Then, the optical module 50 is configured by insulatingly sealing the element module 57 bonded to the guide 2 with the sealing resin 13. In the optical semiconductor module 50 of this embodiment, the portion protruding from the guide 2 of the lead frame 53 can be used as a connector when connecting to other components.

  Since the optical semiconductor module 50 according to the fourth embodiment incorporates the driving semiconductor element 10 in a state of being stacked on the optical semiconductor element 8 as in the above-described embodiments, it is possible to suppress deterioration in signal quality and reduce the light. The semiconductor module 40 can be downsized. In addition to the downsizing of the optical semiconductor module 40, the lead frame 41 is applied to the electrical wiring, so that the manufacturing cost of the optical semiconductor module 40 can be reduced. Furthermore, since the lead frame 53 is pulled out in the same direction as the longitudinal direction of the guide 2, the lead frame 53 can be thinned when connected to other components.

  Next, an optical semiconductor module according to a fifth embodiment of the present invention will be described with reference to FIGS. In addition, the same code | symbol is attached | subjected to the same part as 1st, 2nd, 3rd and 4th embodiment, and the description is partially abbreviate | omitted. The optical semiconductor module 60 according to the fifth embodiment shown in these drawings uses a printed wiring board 61 for electrical wiring.

  An optical semiconductor module 60 shown in FIG. 11 uses a printed wiring board 61 instead of the lead frame 41 of the third embodiment. That is, the optical semiconductor element 8 is connected and fixed by bonding the bump 9 to the printed wiring board 61. A driving semiconductor element 10 is laminated and fixed on the back surface of the optical semiconductor element 8 via an adhesive resin 11. Furthermore, the electrode of the driving semiconductor element 10 (not shown) is electrically connected to the printed wiring board 61 via the bonding wire 12. The optical semiconductor element 8 and the driving semiconductor element 10 are insulated and sealed with a sealing resin 13. The mounting process, the connection process, and the like of the elements 8 and 10 on the printed wiring board 61 can be performed by applying a general semiconductor device assembly process.

  The optical semiconductor module 60 is configured by adhering the element module 62 produced by mounting the elements 8 and 10 on the printed wiring board 61 to the optical semiconductor mounting surface 5 of the guide 2. This optical semiconductor module 60 is used by inserting the optical fiber 3 into the positioning through hole 4 of the guide 2 as in the other embodiments. The portion protruding from the guide 2 of the printed wiring board 61 can be used as a connector when connecting to other components. This portion may be bent along the side surface of the guide 2 and used as an electrode.

  Further, in the optical semiconductor module 60 shown in FIG. 12, the through plug 31 is applied to the connection between the optical semiconductor element 8 and the driving semiconductor element 10 as in the second embodiment. Furthermore, the optical semiconductor module 60 shown in FIG. 13 uses through plugs 51 and 52 for connection between the elements 8 and 10 and is connected to the driving semiconductor element 10 for electric wiring, as in the fourth embodiment. The printed wiring board 61 is used. An optical semiconductor module 60 shown in FIG. 13 employs a flexible printed wiring board 61, and a portion protruding from the guide 2 can be used by being bent in the same direction as the longitudinal direction of the guide 2.

  Since the optical semiconductor module 60 according to the fifth embodiment incorporates the driving semiconductor element 10 in a state of being stacked on the optical semiconductor element 8 as in the above-described embodiments, it is possible to suppress degradation of signal quality and reduce light. It is possible to reduce the size of the semiconductor module 60. Further, since the printed wiring board 61 is applied to the electrical wiring in addition to the downsizing of the optical semiconductor module 60, the manufacturing cost of the optical semiconductor module 40 can be reduced.

  In each of the above-described embodiments, the optical semiconductor module including the laminated body of the optical semiconductor element 8 and the driving semiconductor element 10 has been described. However, the embedded element is not limited thereto. For example, as shown in FIG. 14, a component 71 such as another semiconductor element or a passive component may be stacked on the driving semiconductor element 10. In addition, as long as the optical semiconductor element 8 is mounted on the optical semiconductor mounting surface of the guide, the stacking order of the other elements is not particularly limited. Note that the electrical wiring 72 shown in FIG. 14 may be any of the plated wiring layer, the lead frame, and the printed wiring board shown in the above-described embodiments. Further, although the guide is not shown in FIG. 14, the overall configuration of the optical semiconductor module is the same as that of each of the embodiments described above.

  Next, an embodiment of a semiconductor device to which the optical semiconductor module of the present invention is applied will be described with reference to FIG. A semiconductor device 80 shown in FIG. 15 has a signal processing LSI 81. The signal processing LSI 81 is flip-chip connected to the substrate 83 having the high-speed signal wiring 82 via the bumps 84. An underfill agent 85 is filled between the signal processing LSI 81 and the substrate 83.

  On the substrate 83 on which the signal processing LSI 81 is mounted, the optical semiconductor module 86 having the configuration shown in each of the above embodiments is mounted. The configuration of the optical semiconductor module 86 may be any of the first to fifth embodiments. The optical semiconductor module 86 is connected and fixed on the substrate 83 so that the driving semiconductor element in the optical semiconductor module 86 is electrically connected to the high-speed signal wiring 82. An optical fiber 87 is connected to the optical semiconductor module 86. Although not shown, the substrate 83 has a wiring layer constituting a power source, a ground line, and a low-speed control signal line, and this wiring layer is connected to a bump electrode 88 formed in the lower portion of the substrate 83. ing.

  According to the semiconductor device 80 of the above-described embodiment, since the optical semiconductor module 86 having a simple structure is applied for optical coupling, a wiring structure in which optical wiring is applied to LSI wiring can be realized at low cost. . This greatly contributes to cost reduction of LSI high-speed inter-chip wiring. Accordingly, it is possible to improve the sophistication and performance of information communication devices. The application of the optical semiconductor module of the present invention is not limited to LSI wiring, but can be applied to various short-distance optical transmissions.

It is sectional drawing which shows schematic structure of the optical semiconductor module by the 1st Embodiment of this invention. It is sectional drawing which shows the state which has arrange | positioned the optical fiber to the optical semiconductor module shown in FIG. It is a perspective view which shows the state which has arrange | positioned the optical fiber to the optical semiconductor module shown in FIG. It is a perspective view which shows the principal part manufacturing process of the optical semiconductor module shown in FIG. It is sectional drawing which shows schematic structure of the optical semiconductor module by the 2nd Embodiment of this invention. It is sectional drawing which shows schematic structure of the optical semiconductor module by the 3rd Embodiment of this invention. It is sectional drawing which shows the element part of the optical semiconductor module shown in FIG. It is sectional drawing which shows schematic structure of the optical semiconductor module by the 4th Embodiment of this invention. It is sectional drawing which shows the manufacturing process of the element part of the optical semiconductor module shown in FIG. It is sectional drawing which shows the element part of the optical semiconductor module shown in FIG. It is sectional drawing which shows schematic structure of the optical semiconductor module by the 5th Embodiment of this invention. It is sectional drawing which shows the modification of the optical semiconductor module shown in FIG. It is sectional drawing which shows the other modification of the optical semiconductor module shown in FIG. It is sectional drawing which shows the other example of the element laminated structure in the optical semiconductor module of this invention. It is sectional drawing which shows schematic structure of the semiconductor device by one Embodiment of this invention.

Explanation of symbols

    DESCRIPTION OF SYMBOLS 1,30,40,50,60,86 ... Optical semiconductor module, 2 ... Guide, 3,87 ... Optical fiber, 4 ... Positioning through-hole, 5 ... Optical semiconductor mounting surface, 6 ... Plated wiring layer, 8 ... Light Semiconductor element 10... Semiconductor element for driving, 12... Bonding wire, 21... Frame, 31, 51, 52... Through plug, 41 and 53. ... high-speed signal wiring, 83 ... substrate.

Claims (5)

A guide having a positioning part of the optical transmission line, and an optical semiconductor mounting surface at which one end face of the optical transmission line arranged in the positioning part is exposed;
An optical semiconductor element mounted on the optical semiconductor mounting surface of the guide so that one end surface of the optical transmission path and a light emitting surface or a light receiving surface face each other;
An optical semiconductor module comprising: a semiconductor element stacked on the optical semiconductor element. The optical semiconductor module according to claim 1,
A plated wiring layer formed on at least the optical semiconductor mounting surface, a lead frame bonded to the optical semiconductor mounting surface, a lead frame connected to the semiconductor element, a printed wiring board bonded to the optical semiconductor mounting surface, and A semiconductor module comprising electrical wiring selected from printed wiring boards connected to the semiconductor element. The optical semiconductor module according to claim 1 or 2,
The optical semiconductor module, wherein the optical semiconductor element and the semiconductor element are electrically connected through at least a bonding wire or a through plug in the element. In manufacturing the optical semiconductor module according to claim 1,
A plurality of the guides are integrally manufactured in a state in which the optical semiconductor mounting surface is aligned upward and connected by a frame,
And a step of stacking and mounting the optical semiconductor element and the semiconductor element on the optical semiconductor mounting surface of the plurality of guides. An optical semiconductor module according to any one of claims 1 to 3,
A substrate on which the optical semiconductor module is mounted and having signal wiring connected to the semiconductor element of the optical semiconductor module;
A semiconductor device comprising: a signal processing semiconductor element mounted on the substrate and connected to a signal wiring of the substrate.

Images