JP2006040632A - Anisotropic conductive connector, its manufacturing method, adapter device and electrical inspection device of circuit device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an anisotropic conductive connector capable of surely accomplishing required electrical connection to respective electrodes regardless of a pattern of electrodes, and of accomplishing required electrical connection to the respective electrodes even if the electrodes are arranged at minute intervals and in high density, and manufacturable at a low cost; to provide an adapter device equipped with it; and to provide an electrical inspection device of a circuit device. <P>SOLUTION: This anisotropic conductive connector is provided by forming a plurality of conductive path formation parts by laser-processing an conductive elastomer layer formed by dispersing conductive particles into an elastic polymer substance supported on a die-separating support plate in a form oriented in its thickness direction, by entering the respective conductive path formation parts formed on the die-separating support plate into a material layer for an insulation part formed so as to close an opening of a frame plate and formed of a liquid polymer substance formation material solidified to become the elastic polymer substance, and by solidifying the material layer for an insulation part. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an anisotropic conductive connector that can be suitably used for electrical inspection of a circuit device such as a printed circuit board, a method for manufacturing the same, an adapter device including the anisotropic conductive connector, and an adapter device including the adapter device. The present invention relates to an electrical inspection device for a circuit device.

In general, for a circuit board for configuring or mounting an integrated circuit device or other electronic component, the wiring pattern of the circuit board is expected before the electronic component is assembled or before the electronic component is mounted. It is necessary to inspect its electrical characteristics to confirm that it has performance.
Conventionally, as a method of performing an electrical inspection of a circuit board, a test electrode device in which a plurality of test electrodes are arranged according to lattice point positions arranged vertically and horizontally, and a circuit board to be inspected on the test electrodes of this test electrode device A method of using a combination with an adapter for electrically connecting the electrodes to be inspected is known. The adapter used in this method is a printed wiring board called a pitch conversion board.
This adapter has a plurality of connection electrodes arranged in accordance with a pattern corresponding to the inspection target electrode of the circuit board to be inspected on one surface, and a lattice point having the same pitch as the inspection electrode of the inspection electrode device on the other surface. A plurality of terminals having a plurality of terminal electrodes arranged at positions, and comprising a current supply connection electrode and a voltage measurement connection electrode arranged in accordance with a pattern corresponding to an electrode to be inspected on a circuit board to be inspected on one side Are known, and the other adapter has, for example, a plurality of terminal electrodes arranged at lattice point positions at the same pitch as the inspection electrodes of the inspection electrode device on the other surface. It is used for an open / short test of each circuit on a circuit board, and the latter adapter is used for an electrical resistance measurement test for each circuit on the circuit board.
Therefore, in the electrical inspection of a circuit board, in general, in order to achieve a stable electrical connection between the circuit board to be inspected and the adapter, there is a difference between the circuit board to be inspected and the adapter. It has been practiced to interpose a directionally conductive elastomer sheet.

This anisotropically conductive elastomer sheet has conductivity only in the thickness direction, or has a number of pressurized conductive portions that show conductivity only in the thickness direction when pressed.
As such an anisotropically conductive elastomer sheet, those having various structures are conventionally known, and typical examples thereof are those obtained by uniformly dispersing metal particles in an elastomer (for example, patents). Reference 1), in which conductive magnetic metal particles are non-uniformly dispersed in an elastomer to form a number of conductive path forming portions extending in the thickness direction and insulating portions that insulate them from each other. (For example, refer to Patent Document 2), and those in which a step is formed between the surface of the conductive path forming portion and the insulating portion (for example, refer to Patent Document 3).
For a circuit board having electrodes to be inspected with a small arrangement pitch, an anisotropic conductive elastomer sheet in which a conductive path forming portion is formed according to a pattern corresponding to the pattern of the electrodes to be inspected on the circuit board is high. This is preferable in that connection reliability can be obtained.

However, such an anisotropically conductive elastomer sheet is manufactured as a single product and handled alone, and has a specific positional relationship with respect to the adapter and the circuit board in electrical connection work. It is necessary to hold and fix.
However, in the means for achieving the electrical connection of the circuit board using an independent anisotropic conductive elastomer sheet, the arrangement pitch of the electrodes to be inspected on the circuit board to be inspected, that is, the centers of the electrodes to be inspected adjacent to each other There is a problem in that it becomes difficult to align and hold the anisotropic conductive elastomer sheet as the distance between them becomes smaller.
Even when the desired alignment and holding / fixing are realized once, when a thermal history due to a temperature change is received, the degree of stress due to thermal expansion and contraction is determined by the circuit board to be inspected. There is a problem in that since the constituent material and the material constituting the anisotropic conductive elastomer sheet are greatly different, the electrical connection state is changed and a stable connection state is not maintained.

Conventionally, in order to solve the above problems, an anisotropic conductive connector in which the peripheral edge portion of an anisotropic conductive elastomer sheet is supported by a frame plate made of metal has been proposed (for example, see Patent Document 4). ).
Such an anisotropic conductive connector is manufactured as follows, for example.
First, a mold having a configuration as shown in FIG. 24 is prepared. In this mold, a ferromagnetic part 82 is arranged on a substrate 81 in accordance with the same pattern as, for example, an electrode to be inspected of a circuit board to be inspected, and a non-magnetic substance is provided in a part other than the ferromagnetic part 82. The ferromagnetic body portion 87 is placed on one template (hereinafter referred to as “upper die”) 80 in which the portion 83 is disposed and on the substrate 86 according to the pattern of the electrodes to be inspected and the palms of the circuit board to be inspected. And the other template (hereinafter referred to as “lower mold”) 85 in which a non-magnetic part 88 is arranged in a part other than the ferromagnetic part 87.
Then, as shown in FIG. 25, a frame plate 90 having an opening 91 is disposed in the mold, and an anisotropic conductive elastomer material layer 95A is formed so as to close the opening 91 of the frame plate 90. This anisotropic conductive elastomer material layer 95A is formed by containing conductive particles P exhibiting magnetism in a liquid polymer material-forming material that is cured to become an elastic polymer material.
Next, a pair of electromagnets (not shown) are arranged on the upper surface of the upper mold 80 and the lower surface of the lower mold 85, and the electromagnet is operated, so that the lower mold 85 corresponding to the lower mold 85 corresponds to this. A parallel magnetic field is applied in the direction toward the ferromagnetic body portion 87 of the. At this time, each of the ferromagnetic body portion 82 of the upper mold 80 and the ferromagnetic body section 87 of the lower mold 85 acts as a magnetic pole, and therefore, the ferromagnetic body section 82 of the upper mold 80 and the ferromagnetic body section 87 of the lower mold 85. A magnetic field having a larger strength than the other regions acts on the region between the two regions. As a result, in the anisotropic conductive elastomer material layer 95 </ b> A, the conductive particles P dispersed in the anisotropic conductive elastomer material layer 95 </ b> A are converted into the ferromagnetic part 82 of the upper mold 80 and the lower mold 85. It moves toward the part located between the ferromagnetic part 87 and gathers in the part, and further aligns in the thickness direction.
In this state, by performing, for example, a curing process by heating on the anisotropic conductive elastomer material layer 95A, a large number of conductive paths extending in the thickness direction containing the conductive particles P as shown in FIG. An anisotropic conductive connector is manufactured in which an anisotropic conductive elastomer sheet 95 composed of a forming portion 96 and an insulating portion 97 that insulates them from each other is supported by a frame plate 90.

  According to such an anisotropic conductive connector, it is possible to easily align the anisotropic conductive elastomer sheet with respect to the circuit board in the electrical inspection of the circuit board. Since the thermal expansion can be regulated by the frame plate, a favorable electrical connection state is stably maintained against environmental changes such as thermal history due to temperature changes, and thus high connection reliability can be obtained.

However, the anisotropic conductive connector has the following problems.
As a circuit board for configuring or mounting an electronic component, one in which electrodes are arranged in a frame shape along, for example, four sides of a rectangle is known. Thus, in order to perform an electrical inspection of such a circuit board, the anisotropic conductive film having the anisotropic conductive elastomer sheet 95 in which the conductive path forming portion 96 is arranged in a frame shape along the four sides of the rectangle. It is necessary to use a sex connector. However, in such an anisotropic conductive elastomer sheet 95, since the central portion surrounded by the conductive path forming portion 96 is all the insulating portion 97, the anisotropic conductive elastomer sheet 95 is formed in the anisotropic conductive elastomer sheet 95. As for the conductive particles existing in the central portion of the elastomer material layer 95A, the moving distance becomes extremely long, and as a result, it is difficult to reliably gather the conductive particles in the portion to be the conductive path forming portion. . For this reason, the obtained conductive path forming portion 96 is not filled with a required amount of conductive particles, and a considerable amount of conductive particles remain in the insulating portion 97. A reliable elastomer sheet cannot be formed reliably.

In addition, in integrated circuit devices, the number of electrodes has increased with the increase in functionality and capacity, and the arrangement pitch of electrodes, that is, the distance between the centers of adjacent electrodes has decreased, further increasing the density. Tend to. Therefore, when an electrical inspection is performed on a circuit board for configuring or mounting such an integrated circuit device, anisotropic conductive connectors arranged at high density with a small pitch of the conductive path forming portions are provided. It is necessary to use it.
Thus, in manufacturing such an anisotropic conductive connector, it is naturally necessary to use the upper mold 80 and the lower mold 85 in which the ferromagnetic portions 82 and 87 are arranged at an extremely small pitch. .

  However, when the anisotropic conductive elastomer sheet 95 is formed using the upper mold 80 and the lower mold 85 as described above, each of the upper mold 80 and the lower mold 85 is formed as shown in FIG. In FIG. 5, since the separation distance between a certain ferromagnetic part 82a, 87a and the adjacent ferromagnetic parts 82b, 87b is small, the lower part 85 corresponding to the lower part 85 corresponds to the ferromagnetic part 82a of the upper mold 80. In addition to the direction toward the ferromagnetic part 87a (indicated by the arrow X), for example, the ferromagnetic part adjacent to the ferromagnetic part 87a of the lower mold 85 corresponding to the ferromagnetic part 82a of the upper mold 80, for example. The magnetic field also acts in the direction toward 87b (indicated by arrow Y). Therefore, in the anisotropic conductive elastomer material layer 95A, the conductive magnetic particles are located between the ferromagnetic part 82a of the upper die 80 and the corresponding ferromagnetic part 87a of the lower die 85. It becomes difficult to collect the conductive magnetic particles in the portion located between the ferromagnetic body portion 82a of the upper mold 80 and the ferromagnetic body section 87b of the lower mold 85, and the conductive It is difficult to sufficiently orient the conductive particles in the thickness direction of the anisotropic conductive elastomer material layer 95A, and as a result, an anisotropic conductive connector having a desired conductive path forming portion and insulating portion cannot be obtained.

  Further, in forming the anisotropic conductive elastomer sheet, as described above, two mold plates of the upper mold 80 and the lower mold 85 are necessary. These templates are individually manufactured according to the circuit board to be inspected, for example, and the manufacturing process is complicated, so that the manufacturing cost of the anisotropic conductive connector is extremely high. As a result, the inspection cost of the circuit device is increased.

JP 51-93393 A Japanese Patent Laid-Open No. 53-147772 JP-A-61-250906 Japanese Patent Laid-Open No. 11-40224

The present invention has been made based on the above circumstances, and a first object of the present invention is to provide required electrical connection to each of the electrodes regardless of the arrangement pattern of the electrodes to be connected. It can be reliably achieved, and even if the electrodes to be connected are arranged with a small pitch and a high density, the required electrical connection is reliably achieved for each of the electrodes. It is another object of the present invention to provide an anisotropic conductive connector that can be manufactured at low cost and a method for manufacturing the same.
The second object of the present invention is to reliably achieve the required electrical connection for the circuit device regardless of the arrangement pattern of the electrode to be inspected of the circuit device to be inspected. Provided is an adapter device that can reliably achieve a required electrical connection for the circuit device even when the pitch is very small and densely arranged, and can be manufactured at a low cost. There is to do.
The third object of the present invention is to perform a required electrical inspection for the circuit device reliably regardless of the arrangement pattern of the electrodes to be inspected of the circuit device to be inspected, and to the circuit to be inspected. An electrical inspection device for a circuit device capable of surely executing a required electrical inspection for the circuit device even when the electrodes to be inspected are arranged at a minute pitch and at a high density. It is to provide.

The method of manufacturing an anisotropic conductive connector according to the present invention includes a frame plate having one or more openings formed therein, and one or more of the frame plates arranged to close the opening of the frame plate and supported by the frame plate. The elastic anisotropic conductive film is formed in a thickness direction in which the elastic anisotropic conductive film is contained in a state in which the conductive particles exhibiting magnetism arranged in the opening of the frame plate are aligned in the thickness direction. A method of manufacturing an anisotropic conductive connector comprising a plurality of conductive path forming portions extending in the direction and an insulating portion formed around the conductive path forming portion,
By performing laser processing on the conductive elastomer layer in which the conductive particles exhibiting magnetism are aligned in the thickness direction in the elastic polymer material supported on the releasable support plate, the mold release is performed. Forming a plurality of conductive path forming portions on the conductive support plate,
Each of the conductive path forming portions formed on the releasable support plate is for an insulating portion made of a liquid polymer material forming material which is cured to become an elastic polymer material so as to close the opening of the frame plate. It has a step of forming an insulating portion by intruding into the material layer and curing the insulating material layer in this state.

  In the anisotropic conductive connector manufacturing method of the present invention, the laser processing is preferably performed by a carbon dioxide laser.

In the anisotropic conductive connector manufacturing method of the present invention, a metal mask is formed on the surface of the conductive elastomer layer according to the pattern of the conductive path forming portion to be formed, and then the conductive elastomer layer is laser processed. By doing so, it is preferable to form a plurality of conductive path forming portions.
In such a manufacturing method, it is preferable to form a metal mask by plating the surface of the conductive elastomer layer.
Further, a thin metal layer is formed on the surface of the conductive elastomer layer, a resist layer having an opening formed in accordance with a specific pattern is formed on the surface of the thin metal layer, and exposed from the opening of the resist layer in the thin metal layer. It is preferable to form a metal mask by plating the surface of the part.

  In the method for producing an anisotropic conductive connector according to the present invention, a conductive elastomer material layer in which conductive particles exhibiting magnetism are contained in a liquid elastomer material that is cured to become an elastic polymer substance. On the other hand, it is preferable to form a conductive elastomer layer by applying a magnetic field in the thickness direction and curing the conductive elastomer material layer.

  The anisotropic conductive connector of the present invention is obtained by the above-described manufacturing method.

The adapter device of the present invention has an adapter body having a connection electrode region in which a plurality of connection electrodes are formed in accordance with a pattern corresponding to an electrode to be inspected in a circuit device to be inspected on the surface;
The anisotropic conductive connector having a plurality of conductive path forming portions arranged on the connection electrode region of the adapter main body and formed according to a pattern corresponding to the connection electrode in the adapter main body. It is characterized by that.

The adapter device according to the present invention has a plurality of connection electrode pairs each formed of two connection electrodes for current supply and voltage measurement according to a pattern corresponding to an electrode to be inspected in a circuit device to be inspected on the surface. An adapter body having a connecting electrode region;
The anisotropic conductive connector having a plurality of conductive path forming portions arranged on the connection electrode region of the adapter main body and formed according to a pattern corresponding to the connection electrode in the adapter main body. It is characterized by that.

  An electrical inspection device for a circuit device according to the present invention comprises the adapter device described above.

According to the method for manufacturing the anisotropic conductive connector of the present invention, the conductive path forming portion is formed by laser processing the conductive elastomer layer, so that the conductive path forming portion having the desired conductivity is obtained with certainty. be able to. Further, after forming a conductive path forming portion on the releasable support plate, the conductive path forming portion is infiltrated into the elastomer material layer, and the elastomer material layer is cured to form an insulating portion. Therefore, it is possible to reliably obtain an insulating part in which no conductive particles are present. In addition, it is not necessary to use a mold in which a large number of ferromagnetic parts used to manufacture a conventional anisotropically conductive connector are arranged.
Therefore, according to the anisotropic conductive connector of the present invention obtained by such a method, the required electrical connection can be reliably achieved for each of the electrodes regardless of the arrangement pattern of the electrodes to be connected. At the same time, even when the electrodes to be connected are arranged with a small pitch and a high density, the required electrical connection to each of the electrodes can be reliably achieved, and the manufacturing can be performed at a low cost. can do.

  According to the adapter device of the present invention, since the anisotropic conductive connector described above is provided, the required electrical connection can be ensured for the circuit device regardless of the arrangement pattern of the electrodes to be inspected of the circuit device to be inspected. Even if the electrodes to be inspected are arranged with a small pitch and a high density, it is possible to reliably achieve the required electrical connection for the circuit device. Can be manufactured at low cost.

  According to the electrical inspection apparatus for a circuit device of the present invention, since the adapter device is provided, the required electrical inspection is performed on the circuit device regardless of the arrangement pattern of the electrodes to be inspected of the circuit device to be inspected. Can be reliably executed, and even if the electrodes to be inspected of the circuit device are arranged with a small pitch and a high density, the required electrical inspection is reliably performed on the circuit device. be able to.

Hereinafter, embodiments of the present invention will be described in detail.
<Anisotropic conductive connector>
FIG. 1 is a cross-sectional view for explaining the structure of an example of the anisotropic conductive connector according to the present invention, and FIG. 2 is an explanatory cross-sectional view showing an enlarged main part of the anisotropic conductive connector shown in FIG. FIG. The anisotropic conductive connector 10 includes a frame plate 11 having a plurality of openings 12 and a single elastic member supported by the frame plate 11 and arranged to close each of the openings 12 of the frame plate 11. The conductive film 15 is constituted.
In the elastic anisotropic conductive film 15, a plurality of conductive path forming portions 16 extending in the thickness direction are arranged so as to be positioned in the openings 12 of the frame plate 11 in accordance with a specific pattern, and the periphery of each of the conductive path forming portions 16. In the present embodiment, an integral insulating portion 17 that insulates adjacent conductive path forming portions 16 from each other is formed in a state of being integrally bonded to the conductive path forming portion 16. The specific pattern of the conductive path forming portion 16 is a pattern corresponding to a pattern of an electrode to be connected, for example, an inspection target electrode of a circuit device to be inspected.
The conductive path forming part 16 is configured by containing conductive particles P exhibiting magnetism in an insulating elastic polymer substance so as to be aligned in the thickness direction. On the other hand, the insulating portion 17 is made of an elastic polymer material that does not contain the conductive particles P at all.
In the example shown in the drawing, on one surface of the elastic anisotropic conductive film 15 (upper surface in FIG. 1), a protruding portion in which the conductive path forming portion 16 protrudes from the surface of the insulating portion 17 is formed.
According to such an example, since the degree of compression by pressurization is greater in the conductive path forming section 16 than in the insulating section 17, a sufficiently low conductive path is reliably formed in the conductive path forming section 16, thereby The change in the resistance value can be reduced with respect to the change or fluctuation of the applied pressure. As a result, even if the applied pressure applied to the elastic anisotropic conductive film 15 is not uniform, each conductive path forming portion 16 It is possible to prevent the occurrence of conductive variation between the two.

As a material constituting the frame plate 11, various non-metallic materials and metallic materials having high mechanical strength can be used.
Specific examples of non-metallic materials include resin materials such as liquid crystal polymers, polyimide resins, polyester resins, polyaramid resins, polyamide resins, glass fiber reinforced epoxy resins, glass fiber reinforced polyester resins, glass fiber reinforced polyimide resins, etc. Examples thereof include a fiber reinforced resin material, an epoxy resin, and a composite resin material containing an inorganic material such as alumina or poron nitride as a filler.
Examples of the metal material include gold, silver, copper, iron, nickel, cobalt, alloys thereof, and alloy steels.
When the anisotropic conductive connector is used in a high temperature environment, it is preferable to use a frame plate 11 having a linear thermal expansion coefficient of 3 × 10 ⁻⁵ / K or less, more preferably 1 × 10 6. ^{−6 to} 2 × 10 ⁻⁵ / K, particularly preferably 1 × 10 ^{−6 to} 6 × 10 ⁻⁶ / K. By using such a frame plate 11, it is possible to suppress misalignment due to thermal expansion of the elastic anisotropic conductive film 15.
Moreover, it is preferable that the thickness of the frame board 11 is 10-200 micrometers, More preferably, it is 15-100 micrometers. When this thickness is too small, the strength required for the frame plate 11 may not be obtained. On the other hand, when this thickness is excessive, the thickness of the elastic anisotropic conductive film 15 is inevitably large, and therefore, good conductivity may not be obtained.

In the elastic anisotropic conductive film 15, the elastic polymer material constituting the conductive path forming portion 16 and the elastic polymer material constituting the insulating portion 17 are of the same type, even if they are of different types. Also good.
As the elastic polymer material constituting the conductive path forming portion 16 and the insulating portion 17, a polymer material having a crosslinked structure is preferable. Various materials can be used as the curable polymer substance-forming material that can be used to obtain such an elastic polymer substance. Specific examples thereof include polybutadiene rubber, natural rubber, and polyisoprene rubber. , Conjugated diene rubbers such as styrene-butadiene copolymer rubber and acrylonitrile-butadiene copolymer rubber and hydrogenated products thereof, blocks such as styrene-butadiene-diene block copolymer rubber, styrene-isoprene block copolymer, etc. Examples include copolymer rubber and hydrogenated products thereof, chloroprene, urethane rubber, polyester rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene copolymer rubber, and ethylene-propylene-diene copolymer rubber. In these, it is preferable to use a silicone rubber from a viewpoint of durability, a moldability, and an electrical property.

As the silicone rubber, those obtained by crosslinking or condensing liquid silicone rubber are preferable. The liquid silicone rubber preferably has a viscosity of 10 ⁵ poise or less at a strain rate of 10 ⁻¹ sec, and may be any of a condensation type, an addition type, a vinyl group or a hydroxyl group. Good. Specific examples include dimethyl silicone raw rubber, methyl vinyl silicone raw rubber, methyl phenyl vinyl silicone raw rubber, and the like.
The silicone rubber preferably has a molecular weight Mw (referred to as a standard polystyrene-converted weight average molecular weight; the same shall apply hereinafter) of 10,000 to 40,000. Moreover, since favorable heat resistance is acquired in the obtained conductive path formation part 16, it says the value of molecular weight distribution index (ratio Mw / Mn of standard polystyrene conversion weight average molecular weight Mw and standard polystyrene conversion number average molecular weight Mn). The same shall apply hereinafter) is preferably 2 or less.

As the conductive particles P contained in the conductive path forming portion 16, magnetic particles are used because the particles can be easily aligned in the thickness direction by a method described later. Specific examples of such conductive particles include particles of metal having magnetism such as iron, cobalt, nickel, particles of these alloys, particles containing these metals, or these particles as core particles, The core particles are formed by plating the surface of the core particles with a metal having good conductivity such as gold, silver, palladium, rhodium, or non-magnetic metal particles or inorganic particles such as glass beads or polymer particles. The surface of the particles may be plated with a conductive magnetic metal such as nickel or cobalt.
Among these, it is preferable to use nickel particles as core particles and the surfaces thereof plated with gold having good conductivity.
The means for coating the surface of the core particles with the conductive metal is not particularly limited, and for example, chemical plating or electrolytic plating, sputtering, vapor deposition or the like is used.

When the conductive particles P used are those in which the surface of the core particles is coated with a conductive metal, good conductivity can be obtained. Therefore, the coverage of the conductive metal on the particle surface (the surface area of the core particles) The ratio of the covering area of the conductive metal with respect to is preferably 40% or more, more preferably 45% or more, and particularly preferably 47 to 95%.
Further, the coating amount of the conductive metal is preferably 0.5 to 50% by mass of the core particle, more preferably 2 to 30% by mass, further preferably 3 to 25% by mass, and particularly preferably 4 to 20%. % By mass. When the conductive metal to be coated is gold, the coating amount is preferably 0.5 to 30% by mass of the core particles, more preferably 2 to 20% by mass, and further preferably 3 to 15%. % By mass.

Moreover, it is preferable that the particle diameter of the electroconductive particle P is 1-100 micrometers, More preferably, it is 2-50 micrometers, More preferably, it is 3-30 micrometers, Most preferably, it is 4-20 micrometers. The particle size distribution (Dw / Dn) of the conductive particles P is preferably 1 to 10, more preferably 1.01 to 7, still more preferably 1.05 to 5, particularly preferably 1.1. ~ 4.
By using the conductive particles satisfying such conditions, the obtained conductive path forming part 16 can be easily deformed under pressure, and sufficient electric current is provided between the conductive particles in the conductive path forming part 16. Contact is obtained.
Further, the shape of the conductive particles P is not particularly limited, but spherical particles, star-shaped particles, or agglomerated particles 2 can be easily dispersed in the polymer substance-forming material. Secondary particles are preferred.
Further, as the conductive particles P, those whose surfaces are treated with a coupling agent such as a silane coupling agent or a lubricant can be appropriately used. By treating the particle surface with a coupling agent or a lubricant, the durability of the anisotropically conductive connector is improved.

  Such conductive particles P are preferably contained in the conductive path forming portion 16 at a volume fraction of 15 to 45%, preferably 20 to 40%. When this ratio is too small, the conductive path forming portion 16 having a sufficiently small electric resistance value may not be obtained. On the other hand, when this ratio is excessive, the obtained conductive path forming part 16 tends to be fragile, and the elasticity necessary for the conductive path forming part 16 may not be obtained.

Moreover, it is preferable that the thickness of the conductive path formation part 16 is 20-250 micrometers, More preferably, it is 30-200 micrometers. When this thickness is too small, sufficient unevenness absorbing ability may not be obtained. On the other hand, if this thickness is excessive, good conductivity may not be obtained.
Moreover, it is preferable that the protrusion height of the protrusion part of the conductive path formation part 16 is 5-70% of the thickness of the said conductive path formation part 16, More preferably, it is 10-60%.

In the present invention, the anisotropic conductive connector 10 is dispersed in a state in which conductive particles exhibiting magnetism are aligned in the thickness direction in an elastic polymer material supported on a releasable support plate. By laser processing the conductive elastomer layer, a plurality of conductive path forming portions 16 are formed on the releasable support plate, and each of the conductive path forming portions 16 formed on the releasable support plate is attached to the frame. The insulating portion material layer made of a liquid polymer material forming material, which is cured to become an elastic polymer material, is formed so as to close the opening 12 of the plate 11, and in this state, the insulating material layer is It is obtained by forming the insulating portion 17 by performing a curing process.
In addition, the conductive elastomer layer is a material for a conductive elastomer in which conductive particles exhibiting magnetism are contained in a liquid elastomer material that is cured to become an elastic polymer substance on a releasable support plate. It is obtained by forming a layer, applying a magnetic field to the conductive elastomer material layer in the thickness direction, and curing the conductive elastomer material layer.
Hereinafter, a method for manufacturing the anisotropic conductive connector 10 will be specifically described.

<Formation of conductive elastomer layer>
First, a conductive elastomer material in which conductive particles exhibiting magnetism are dispersed in a liquid elastomer material that is cured to become an elastic polymer substance is prepared. As shown in FIG. A conductive elastomer material layer 16 </ b> A is formed on the mold release support plate 13 by applying a conductive elastomer material. Here, in the conductive elastomer material layer 16A, as shown in FIG. 4, the conductive particles P exhibiting magnetism are contained in a dispersed state.
Next, by applying a magnetic field to the conductive elastomer material layer 16A in the thickness direction, the conductive particles P dispersed in the conductive elastomer material layer 16A are made conductive as shown in FIG. The material layer 16A is oriented so as to be aligned in the thickness direction. Then, while continuing the action of the magnetic field on the conductive elastomer material layer 16A or after the action of the magnetic field is stopped, the conductive elastomer material layer 16A is cured to perform elasticity as shown in FIG. A conductive elastomer layer 16 </ b> B is formed in a state in which the conductive particles P are contained in the polymer material so that the conductive particles P are aligned in the thickness direction and are supported on the releasable support plate 13.

In the above, as a material constituting the releasable support plate 13, metals, ceramics, resins, composite materials thereof, and the like can be used.
As a method for applying the conductive elastomer material, a printing method such as screen printing, a roll coating method, a blade coating method, or the like can be used.
The thickness of the conductive elastomer material layer 16A is set according to the thickness of the conductive path forming portion to be formed.
As means for applying a magnetic field to the conductive elastomer material layer 16A, an electromagnet, a permanent magnet, or the like can be used.
The strength of the magnetic field applied to the conductive elastomer material layer 16A is preferably 0.2 to 2.5 Tesla.
The curing process of the conductive elastomer material layer 16A is usually performed by a heating process. The specific heating temperature and heating time are appropriately set in consideration of the type of elastomer material constituting the conductive elastomer material layer 16A, the time required to move the conductive particles, and the like.

<< Formation of conductive path forming part >>
As shown in FIG. 7, a thin metal layer 14 for a plating electrode is formed on the surface of the conductive elastomer layer 16B supported on the releasable support plate 13. Next, as shown in FIG. 8, a plurality of openings 18a are formed on the thin metal layer 14 by photolithography according to a specific pattern corresponding to the pattern of the conductive path forming portion to be formed, that is, the pattern of the electrode to be connected. Then, the resist layer 18 having the above is formed. Thereafter, as shown in FIG. 9, the resist layer 18 is subjected to electrolytic plating treatment on the exposed portion of the metal thin layer 14 through the opening 18a of the resist layer 18 using the metal thin layer 14 as a plating electrode. A metal mask 19 is formed in the opening 18a. In this state, the conductive elastomer layer 16B, the metal thin layer 14 and the resist layer 18 are subjected to laser processing to remove a part of the resist layer 18, the metal thin layer 14 and the conductive elastomer layer 16B. As a result, as shown in FIG. 10, a plurality of conductive path forming portions 16 arranged according to a specific pattern are formed on the releasable support plate 13. Thereafter, the remaining thin metal layer 14 and metal mask 19 are peeled off from the surface of the conductive path forming portion 16.

In the above, as a method of forming the metal thin layer 14 on the surface of the conductive elastomer layer 16B, an electroless plating method, a sputtering method, or the like can be used.
As a material constituting the metal thin layer 14, copper, gold, aluminum, rhodium, or the like can be used.
The thickness of the thin metal layer 14 is preferably 0.05 to 2 μm, more preferably 0.1 to 1 μm. When this thickness is too small, a uniform thin layer is not formed, which may be inappropriate as a plating electrode. On the other hand, if this thickness is excessive, it may be difficult to remove by laser processing.
The thickness of the resist layer 18 is set according to the thickness of the metal mask 19 to be formed.
As a material constituting the metal mask 19, copper, iron, aluminum uni, gold, rhodium, or the like can be used.
The thickness of the metal mask 19 is preferably 2 μm or more, more preferably 5 to 20 μm. If this thickness is too small, it may be unsuitable as a mask for the laser.
The laser processing is preferably performed using a carbon dioxide laser, whereby the conductive path forming portion 16 having a desired form can be reliably formed.

<Formation of insulation>
As shown in FIG. 11, a releasable support plate 13A for forming an insulating portion is prepared, and a frame plate 11 is disposed on the surface of the releasable support plate 13A and cured to be an insulating elastic polymer. The insulating material layer 17A is formed by applying a liquid elastomer material that is a substance. Next, as shown in FIG. 12, the releasable support plate 13 formed with a plurality of conductive path forming portions 16 is overlaid on the releasable support plate 13A formed with the insulating material layer 17A. Each of the conductive path forming portions 16 is infiltrated into the insulating portion material layer 17A and brought into contact with the releasable support plate 13A. Thereby, the insulating material layer 17 </ b> A is formed between the adjacent conductive path forming portions 16. Thereafter, in this state, the insulating portion material layer 17A is cured, so that the insulating portion 17 that insulates the conductive path forming portion 16 from each other is formed around the conductive path forming portion 16 as shown in FIG. The elastic anisotropic conductive film 15 is formed integrally with the path forming portion 16.
And the anisotropic conductive connector 10 of the structure shown in FIG. 1 is obtained by releasing the elastic anisotropic conductive film 15 from the releasable support plates 13 and 13A.

In the above, as the material constituting the releasable support plate 13A, the same material as the releasable support plate 13 for forming the conductive path forming portion can be used.
As a method of applying the elastomer material, a printing method such as screen printing, a roll coating method, a blade coating method, or the like can be used.
The thickness of the insulating part material layer 17A is set according to the thickness of the insulating part to be formed.
The curing process of the insulating part material layer 17A is usually performed by a heating process. The specific heating temperature and heating time are appropriately set in consideration of the type of elastomer material constituting the insulating material layer 17A.

According to the above manufacturing method, the conductive elastomer layer 16B, which is dispersed in a state in which the conductive particles P are aligned so as to be aligned in the thickness direction, is laser-processed to remove a part of the conductive elastomer layer 16B. Since the conductive path forming portion 16 is formed, it is possible to reliably obtain the conductive path forming portion 16 having the desired conductivity filled with a required amount of the conductive particles P.
Further, after forming a plurality of conductive path forming portions 16 arranged according to a specific pattern on the releasable support plate 13, an insulating material layer 17A is formed between these conductive path forming portions 16. Since the insulating part 17 is formed by performing the curing process, the insulating part 17 in which the conductive particles P are not present can be reliably obtained.
In addition, it is not necessary to use an expensive mold in which a large number of ferromagnetic parts used to manufacture a conventional anisotropically conductive connector are arranged.
Therefore, according to the anisotropic conductive connector 10 obtained by such a method, a required electrical connection can be reliably achieved for each of the electrodes regardless of the arrangement pattern of the electrodes to be connected. At the same time, even when the electrodes to be connected are arranged with a small pitch and a high density, it is possible to reliably achieve the required electrical connection to each of the electrodes, and to manufacture the electrodes. Cost can be reduced.

<Adapter device>
FIG. 14 is an explanatory cross-sectional view showing a configuration of the adapter device according to the first example of the present invention, and FIG. 15 is an explanatory cross-sectional view showing an adapter main body in the adapter device shown in FIG. This adapter device is for inspecting a circuit device used for, for example, performing an open / short test on a circuit device such as a printed circuit board, and has an adapter body 20 made of a multilayer wiring board.
On the surface of the adapter body 20 (upper surface in FIGS. 14 and 15), a connection electrode region in which a plurality of connection electrodes 21 are arranged according to a specific pattern corresponding to the pattern of the electrode to be inspected of the circuit device to be inspected. 25 is formed.
A plurality of terminal electrodes 22 are arranged on the back surface of the adapter main body 20 according to lattice point positions having a pitch of 0.8 mm, 0.75 mm, 1.5 mm, 1.8 mm, 2.54 mm, for example. The internal wiring portion 23 is electrically connected to the connection electrode 21.
On the surface of the adapter body 20, the anisotropic conductive connector 10 having the configuration shown in FIG. 1 is basically disposed on the connection electrode region 25. The adapter body 20 is provided with appropriate means (not shown). It is fixed.
In the anisotropic conductive connector 10, a plurality of conductive path forming portions 16 are formed according to the same pattern as the specific pattern related to the connection electrode 21 in the adapter body 20, and the anisotropic conductive connector 10 includes: Each of the conductive path forming portions 16 is disposed on the connection electrode 21 of the adapter body 20.

  According to such an adapter device, since the anisotropic conductive connector 10 having the configuration shown in FIG. 1 is provided, each of the electrodes to be inspected regardless of the arrangement pattern of the inspection electrodes of the circuit device to be inspected. The required electrical connection can be reliably achieved, and even if the electrodes to be inspected are arranged with a small pitch and a high density, the required electrical connection to each of the electrodes to be inspected can be achieved. Connection can be reliably achieved, and the manufacturing cost can be reduced.

16 is an explanatory cross-sectional view showing the configuration of the adapter device according to the second example of the present invention, and FIG. 17 is an explanatory cross-sectional view showing the adapter main body in the adapter device shown in FIG. This adapter device is for testing a circuit device used for conducting an electrical resistance measurement test of each wiring pattern on a circuit device such as a printed circuit board, and has an adapter body 20 made of a multilayer wiring board.
On the surface of the adapter main body 20 (the upper surface in FIGS. 16 and 17), connection electrodes for current supply (hereinafter referred to as “current supply”) that are spaced apart from each other and are electrically connected to the same electrode to be inspected. A connection electrode region 25 in which a plurality of connection electrode pairs 21a each including a connection electrode 21b and a voltage measurement connection electrode (hereinafter also referred to as a "voltage measurement electrode") 21c are formed. Has been. These connection electrode pairs 21a are arranged according to a pattern corresponding to the pattern of the electrodes to be inspected of the circuit device to be inspected.
A plurality of terminal electrodes 22 are arranged on the back surface of the adapter main body 20 according to lattice point positions having a pitch of 0.8 mm, 0.75 mm, 1.5 mm, 1.8 mm, 2.54 mm, for example.
Each of the current supply electrode 21 b and the voltage measurement electrode 21 c is electrically connected to the terminal electrode 22 by the internal wiring portion 23.
On the surface of the adapter body 20, the anisotropic conductive connector 10 having the configuration shown in FIG. 1 is basically disposed on the connection electrode region 25. The adapter body 20 is provided with appropriate means (not shown). It is fixed.
In the anisotropic conductive connector 10, a plurality of conductive path forming portions 16 are formed according to the same pattern as the specific pattern related to the connection electrodes 21 b and 21 c in the adapter body 20, and the anisotropic conductive connector 10. Are arranged such that each of the conductive path forming portions 16 is positioned on the connection electrodes 21 b and 21 c of the adapter body 20.

  According to the adapter device described above, since the anisotropic conductive connector 10 having the configuration shown in FIG. 1 is provided, each of the electrodes to be inspected is required regardless of the arrangement pattern of the inspection electrodes of the circuit device to be inspected. Can be reliably achieved, and even if the electrodes to be inspected are arranged with a small pitch and a high density, the required electrical connection to each of the electrodes to be inspected can be achieved. The connection can be reliably achieved, and the manufacturing cost can be reduced.

<Electrical inspection equipment for circuit devices>
FIG. 18 is an explanatory diagram showing the configuration of the first example of the circuit board electrical inspection apparatus according to the present invention. This electrical inspection device performs, for example, an open / short test on a circuit device 5 such as a printed circuit board having electrodes 6 and 7 to be inspected on both sides, and the circuit device 5 is placed in an inspection execution region E. The holder 2 for holding is provided with a positioning pin 3 for arranging the circuit device 5 at an appropriate position in the inspection execution region E. Above the inspection execution area E, an upper-side adapter device 1a and an upper-side inspection head 50a configured as shown in FIG. 14 are arranged in this order from the bottom, and further above the upper-side inspection head 50a, A side support plate 56a is disposed, and the upper side inspection head 50a is fixed to the support plate 56a by a column 54a. On the other hand, below the inspection execution area E, a lower-side adapter device 1b and a lower-side inspection head 50b configured as shown in FIG. 14 are arranged in this order from above, and further below the lower-side inspection head 50b. The lower side support plate 56b is disposed, and the lower side inspection head 50b is fixed to the lower side support plate 56b by a support 54b.
The upper side inspection head 50a includes a plate-like inspection electrode device 51a and an anisotropic conductive sheet 55a having elasticity that is fixed and arranged on the lower surface of the inspection electrode device 51a. The inspection electrode device 51a has a plurality of pin-shaped inspection electrodes 52a arranged on the lower surface thereof at lattice point positions having the same pitch as the terminal electrodes 22 of the upper-side adapter device 1a. The electric wire 53a is electrically connected to a connector 57a provided on the upper support plate 56a, and is further electrically connected to a tester inspection circuit (not shown) via the connector 57a.
The lower inspection head 50b is composed of a plate-shaped inspection electrode device 51b and an anisotropic conductive sheet 55b having elasticity and fixed to the upper surface of the inspection electrode device 51b. The inspection electrode device 51b has a plurality of pin-shaped inspection electrodes 52b arranged on the upper surface thereof at lattice point positions having the same pitch as the terminal electrodes 22 of the lower adapter device 1b. Each of these inspection electrodes 52b The electric wire 53b is electrically connected to a connector 57b provided on the lower support plate 56b, and is further electrically connected to an inspection circuit (not shown) of the tester via the connector 57b.

  The anisotropic conductive sheets 55a and 55b in the upper side inspection head 50a and the lower side inspection head 50b are each formed with a conductive path forming portion that forms a conductive path only in the thickness direction. As such anisotropically conductive sheets 55a and 55b, those in which the respective conductive path forming portions are formed so as to protrude in the thickness direction on at least one surface are preferable in terms of exhibiting high electrical contact stability.

In such an electrical inspection device for circuit boards, the circuit device 5 to be inspected is held in the inspection execution region E by the holder 2, and in this state, each of the upper support plate 56a and the lower support plate 56b is By moving in the direction approaching the circuit device 5, the circuit device 5 is pinched by the upper adapter device 1a and the lower adapter device 1b.
In this state, the electrode 6 to be inspected on the upper surface of the circuit device 5 is electrically connected to the connection electrode 21 of the upper adapter device 1a via the conductive path forming portion 16 of the anisotropic conductive connector 10. The terminal electrode 22 of the upper adapter device 1a is electrically connected to the inspection electrode 52a of the inspection electrode device 51a via an anisotropic conductive sheet 55a. On the other hand, the electrode 7 to be inspected on the lower surface of the circuit device 5 is electrically connected to the connection electrode 21 of the lower-side adapter device 1b via the conductive path forming portion 16 of the anisotropic conductive connector 10, and this lower portion The terminal electrode 22 of the side adapter device 1b is electrically connected to the inspection electrode 52b of the inspection electrode device 51b via the anisotropic conductive sheet 55b.

  In this way, the test electrodes 6 and 7 on both the upper and lower surfaces of the circuit device 5 are respectively connected to the test electrode 52a of the test electrode device 51a in the upper test head 50a and the test electrode device 51b in the lower test head 50b. By being electrically connected to each of the test electrodes 52b, a state of being electrically connected to the tester test circuit is achieved, and a required electrical test is performed in this state.

  According to the circuit board electrical inspection apparatus described above, the upper side adapter device 1a and the lower side adapter device 1b having the configuration shown in FIG. Regardless, the required electrical inspection can be surely performed for the circuit device 5 and the electrodes 6 and 7 of the circuit device 5 are arranged with a small pitch and a high density. However, the required electrical inspection can be reliably executed for the circuit device 5.

FIG. 19 is an explanatory diagram showing the configuration of a second example of the electrical inspection apparatus for circuit boards according to the present invention. This electrical inspection device is for performing an electrical resistance measurement test of each wiring pattern on a circuit device 5 such as a printed circuit board on which both electrodes 6 and 7 to be inspected are formed. The holder 2 for holding in the inspection execution area E is provided, and the holder 2 is provided with positioning pins 3 for arranging the circuit device 5 at an appropriate position in the inspection execution area E.
Above the inspection execution area E, an upper-side adapter device 1a and an upper-side inspection head 50a configured as shown in FIG. 16 are arranged in this order from the bottom, and further above the upper-side inspection head 50a, A side support plate 56a is disposed, and the upper side inspection head 50a is fixed to the support plate 56a by a column 54a. On the other hand, below the inspection execution area E, a lower-side adapter device 1b and a lower-side inspection head 50b configured as shown in FIG. 16 are arranged in this order from above, and further below the lower-side inspection head 50b. The lower side support plate 56b is disposed, and the lower side inspection head 50b is fixed to the support plate 56b by a support column 54b.
The upper side inspection head 50a includes a plate-like inspection electrode device 51a and an anisotropic conductive sheet 55a having elasticity that is fixed and arranged on the lower surface of the inspection electrode device 51a. The inspection electrode device 51a has a plurality of pin-shaped inspection electrodes 52a arranged on the lower surface thereof at lattice point positions having the same pitch as the terminal electrodes 22 of the upper-side adapter device 1a. The electric wire 53a is electrically connected to a connector 57a provided on the upper support plate 56a, and is further electrically connected to a tester inspection circuit (not shown) via the connector 57a.
The lower inspection head 50b is composed of a plate-shaped inspection electrode device 51b and an anisotropic conductive sheet 55b having elasticity and fixed to the upper surface of the inspection electrode device 51b. The inspection electrode device 51b has a plurality of pin-shaped inspection electrodes 52b arranged on the upper surface thereof at lattice point positions having the same pitch as the terminal electrodes 22 of the lower adapter device 1b. Each of these inspection electrodes 52b The electric wire 53b is electrically connected to a connector 57b provided on the lower support plate 56b, and is further electrically connected to an inspection circuit (not shown) of the tester via the connector 57b.
The anisotropic conductive sheets 55a and 55b in the upper side inspection head 50a and the lower side inspection head 50b have basically the same configuration as that of the electrical inspection apparatus of the first example.

In such an electrical inspection device for circuit boards, the circuit device 5 to be inspected is held in the inspection execution region E by the holder 2, and in this state, each of the upper support plate 56a and the lower support plate 56b is By moving in the direction approaching the circuit device 5, the circuit device 5 is pinched by the upper adapter device 1a and the lower adapter device 1b.
In this state, the electrode 6 to be inspected on the upper surface of the circuit device 5 is connected to both the current supply electrode 21b and the voltage measurement electrode 21c in the connection electrode pair 21a of the upper-side adapter device 1a. The terminal electrode 22 of the upper adapter device 1a is electrically connected to the inspection electrode 52a of the inspection electrode device 51a via the anisotropic conductive sheet 55a. ing. On the other hand, the electrode 7 to be inspected on the lower surface of the circuit device 5 is connected to both the current supply electrode 21b and the voltage measurement electrode 21c in the connection electrode pair 21a of the lower adapter device 1b. The terminal electrode 22 of the lower-side adapter device 1b is electrically connected to the inspection electrode 52b of the inspection electrode device 51b via the anisotropic conductive sheet 55b.

  In this way, the test electrodes 6 and 7 on both the upper and lower surfaces of the circuit device 5 are respectively connected to the test electrode 52a of the test electrode device 51a in the upper test head 50a and the test electrode device 51b in the lower test head 50b. By being electrically connected to each of the test electrodes 52b, a state of being electrically connected to the test circuit of the tester is achieved, and a required electrical test is performed in this state. Specifically, a constant current is supplied between the current supply electrode 21b in the upper-side adapter device 1a and the current-supply electrode 21b in the lower-side adapter device 1b, and in the upper-side adapter device 1a. One of the plurality of voltage measuring electrodes 21c is designated, and the designated one voltage measuring electrode 21c is connected to the inspected electrode 5 on the upper surface side electrically connected to the voltage measuring electrode 21c. A voltage is measured between the voltage measuring electrode 21c in the lower adapter device 1b and electrically connected to the corresponding electrode 6 to be inspected on the lower surface side. Based on the obtained voltage value, the designated voltage is measured. The electrical resistance value of the wiring pattern formed between the upper electrode under test 5 electrically connected to one voltage measuring electrode 21c and the corresponding other electrode 6 under test is taken. It is. And the electrical resistance of all the wiring patterns is measured by sequentially changing the designated voltage measuring electrode 21c.

  According to the circuit board electrical inspection apparatus described above, since the upper side adapter device 1a and the lower side adapter device 1b having the configuration shown in FIG. Regardless, the required electrical inspection can be surely performed for the circuit device 5 and the electrodes 6 and 7 of the circuit device 5 are arranged with a small pitch and a high density. However, the required electrical inspection can be reliably executed for the circuit device 5.

The present invention is not limited to the above embodiment, and various modifications can be made.
For example, in the anisotropic conductive connector 10, it is not essential that the conductive path forming portion 16 is formed with a protruding portion, and the entire surface of the elastic anisotropic conductive film 15 may be flat.
Further, the conductive path forming portion 16 may have protrusions formed on both sides thereof. The elastic anisotropic conductive film 15 having such a conductive path forming portion 16 can be obtained as follows. That is, in forming the insulating portion 17, the conductive path forming portion 16 is pressed and compressed in the thickness direction by the releasable support plates 13 and 13A, and the insulating portion material layer 17A is cured in this state, thereby insulating the insulating portion 17. A portion 17 is formed. After that, by releasing the pressure applied to the conductive path forming portion 16 by the releasable support plates 13 and 13A, the compressed conductive path forming portion 16 is restored to the original form. A conductive path forming portion 16 having a protruding portion that protrudes is obtained.
The circuit device to be inspected is not limited to the printed circuit board, and may be a semiconductor integrated circuit device such as a package IC or MCM.

  In addition, as a method of forming the conductive elastomer layer 16B supported on the releasable support plate 13, conductive particles exhibiting magnetism are arranged in the thickness direction in an insulating elastic polymer material manufactured in advance. Utilizing a method in which a conductive elastomer sheet dispersed in such an oriented state is adhered and supported on the releasable support plate 13 by the adhesive property of the conductive elastomer sheet or by an appropriate adhesive. You can also. Here, the conductive elastomer sheet is formed, for example, by forming a conductive elastomer material layer between two resin sheets and applying a magnetic field in the thickness direction to the conductive elastomer layer. It is manufactured by orienting the conductive particles in the material layer to be aligned in the thickness direction and curing the material layer for the conductive elastomer while continuing the action of the magnetic field or after stopping the action of the magnetic field. be able to.

  In forming the conductive path forming portion 16, the conductive path forming portion can be formed by removing all of the conductive elastomer layer 16B other than the portion to be the conductive path forming portion by laser processing. However, as shown in FIGS. 20 and 21, the conductive path forming portion 16 can be formed by removing only the peripheral portion of the conductive elastomer layer 16 </ b> B that becomes the conductive path forming portion. In this case, the remaining part of the conductive elastomer layer 16B can be removed by mechanically peeling from the releasable support plate 13.

Further, as shown in FIG. 22, the anisotropic conductive connector 10 includes a frame plate 11 having a single opening 12 and a single elastic member disposed so as to close the opening 12 of the frame plate 11. The structure which consists of the direction conductive film 15 may be sufficient.
In addition, as shown in FIG. 23, the anisotropic conductive connector 10 includes a frame plate 11 having a plurality of openings 12 and a plurality of elastic plates each arranged so as to close one opening 12 of the frame plate 11. The structure which consists of the direction conductive film 15 may be sufficient.
Further, the anisotropic conductive connector 10 includes a frame plate in which a plurality of openings are formed, one or more elastic anisotropic conductive films arranged so as to close one opening of the frame plate, and a plurality of frame plates. The structure which consists of 1 or 2 or more elastic anisotropic conductive films arrange | positioned so that the opening of this may be plugged may be sufficient.

  Hereinafter, specific examples of the present invention will be described, but the present invention is not limited to the following examples.

<Example 1>
(1) Formation of conductive elastomer layer:
Dispersed in 100 parts by weight of addition-type liquid silicone rubber is 400 parts by weight of conductive particles in which core particles made of nickel are coated with gold (number average particle diameter is 12 μm, the ratio of gold to core particles is 2% by weight). Thus, a conductive elastomer material was prepared. By applying this conductive elastomer material to the surface of a releasable support plate (13) made of stainless steel having a thickness of 5 mm by screen printing, a thickness of 100 μm is formed on the releasable support plate (13). The conductive elastomer material layer (16A) was formed (see FIGS. 3 and 4). Next, a release treatment support plate 13 is obtained by subjecting the conductive elastomer material layer (16A) to a curing process at 120 ° C. for 1 hour while applying a magnetic field of 2 Tesla in the thickness direction by an electromagnet. A conductive elastomer layer (16B) having a thickness of 100 μm supported thereon was formed (see FIGS. 5 and 6). The content ratio of the conductive particles in this conductive elastomer layer was 30% in terms of volume fraction.

(2) Formation of conductive path forming part:
A thin metal layer (14) made of copper having a thickness of 0.3 μm is formed by subjecting the surface of the conductive elastomer layer (16B) supported on the releasable support plate (13) to electroless plating. On the thin metal layer (14), 4800 rectangular openings (18a) each having a size of 120 μm × 60 μm are formed by photolithography, and the minimum separation distance is 30 μm (the minimum center-to-center distance is 90 μm). ), And a resist layer (18) having a thickness of 25 μm was formed (see FIGS. 7 and 8). Thereafter, the surface of the metal thin layer (14) is subjected to an electrolytic plating process to form a metal mask (19) made of copper having a thickness of about 20 μm in the opening (18a) of the resist layer (18) (FIG. 9). reference). In this state, the conductive elastomer layer (16B), the metal thin layer (14), and the resist layer (18) are subjected to laser processing using a carbon dioxide gas laser device, so that the releasable support plates (13 ) 4800 conductive path forming portions (16) supported thereon are formed (see FIG. 10), and then the thin metal layer (14) and the metal mask (19) remaining from the surface of the conductive path forming portion (16) are formed. ) Was peeled off.
In the above, the laser processing conditions by the carbon dioxide laser device are as follows. That is, a carbon dioxide gas laser processing machine “ML-605GTX” (manufactured by Mitsubishi Electric Corporation) is used as an apparatus, and a laser beam is applied to one processing point under the conditions of a laser beam diameter of 60 μm and a laser output of 0.8 mJ. Was irradiated with 10 shots to perform laser processing.

(3) Production of frame plate:
According to the configuration shown in FIG. 1, a frame plate (11) was produced as follows.
Prepare a laminated sheet (“Espanex LB18-50-18NEP” manufactured by Nippon Steel Chemical Co., Ltd.) in which copper foil is laminated on both sides of a resin sheet made of a liquid crystal polymer having a thickness of 50 μm. A resist film was formed by laminating a dry film resist on the foil. Next, the resist film thus formed is subjected to an exposure process and a development process to form a pattern hole corresponding to the opening of the target frame plate in the resist film. An opening having a pattern corresponding to the opening of the target frame plate was formed in the foil, and then the resist film was removed.
And, for the resin sheet in the laminated sheet, laser processing is performed through the opening formed in the copper foil to form an opening, and then the copper foil on both sides in the laminated sheet is removed by etching treatment, A frame plate (11) was prepared.
The frame plate (11) is made of a liquid crystal polymer and has dimensions of 190 mm × 130 mm × 50 μm. The opening (12) is a circle having a diameter of 400 μm, and the total number of openings (12) is 2400.

(4) Formation of insulating part:
By applying addition-type liquid silicone rubber to the surface of the releasable support plate (13A), a coating film having a thickness of 10 μm is formed, and a frame plate (11) is disposed on this coating film, and further, By applying the mold type liquid silicone rubber, an insulating part material layer (17A) having an overall thickness of 70 μm, which is arranged so as to close the opening (12) of the frame plate (11), is formed. Each of the conductive path forming portions (16) is placed on the layer (127) by aligning and overlapping the releasable support plate (13) on which 4800 conductive path forming portions (16) are formed. It was made to infiltrate into the insulating material layer (17A) and contact with the releasable support plate (13A) (see FIGS. 11 and 12). Then, by applying a pressure of 800 kgf to the releasable support plate (13), the thickness of the conductive path forming portion (16) is elastically compressed from 100 μm to 80 μm, and in this state, the condition of 120 ° C. for 1 hour Then, the insulating part material layer (17A) is cured to form an integral insulating part (17) around the conductive path forming part (16), and thus the elastic anisotropic conductive film (15) is formed. After forming (see FIG. 13), the anisotropic anisotropic conductive film (15) was released from the release support plate (13, 13A) to produce the anisotropic conductive connector (10) of the present invention. . The elastic anisotropic conductive film (15) in the anisotropic conductive connector (10) has a conductive path forming portion (16) thickness of 100 μm, an insulating portion (17) thickness of 70 μm, and a conductive path forming portion (16). The minimum separation distance is 30 μm (the minimum center-to-center distance is 90 μm), and the two conductive path forming portions (16) are arranged so as to be positioned in the opening (12) of the frame plate (11). In addition, the conductive path forming portion (17) protrudes from both surfaces of the insulating portion (17), and the protruding height of the conductive path forming portion (16) is 30 μm in total.

(5) Manufacture of adapter device:
An adapter body (20) having the following specifications was manufactured according to the configuration shown in FIG.
That is, the adapter body (20) has a vertical and horizontal dimensions of 160 mm × 120 mm, and the substrate material is a glass fiber reinforced epoxy resin. The dimensions of the connection electrode region on the surface of the adapter body (20) are 120 μm. 4800 rectangular connection electrodes (21) each having a minimum separation distance of 30 μm (minimum center-to-center distance of 90 μm) are arranged in a rectangular shape of × 60 μm. Further, a total of 4800 circular terminal electrodes (22) having a diameter of 400 μm are arranged on the back surface of the adapter body (20) at a pitch of 750 μm.
The anisotropic conductive connector (10) is placed on the connection electrode region on the surface of the adapter body (20), and each of the conductive path forming portions (16) is positioned on the connection electrode (21). The adapter device of the present invention was manufactured by arranging and fixing as described above.

(6) Evaluation of adapter device:
About said adapter apparatus, it electrically connected to the surface of the said conductive path formation part and the said conductive path formation part in the state which compressed each 5% of the conductive path formation parts in the thickness direction using an electrical resistance measuring device. The electrical resistance (hereinafter referred to as “conduction resistance”) between the terminal electrode and the terminal electrode was measured, and the ratio of the conductive path forming portion having this conduction resistance of 0.1Ω or less was determined to be 100%.
In addition, using an electrical resistance measuring instrument, each of the conductive path forming portions is compressed by 5% in the thickness direction, and two adjacent conductive path forming portions (hereinafter referred to as “conductive path forming portion pair”) are adjacent to each other. The electrical resistance between them (hereinafter referred to as “insulation resistance”) was measured, and the ratio of the pair of conductive path forming portions having this insulation resistance of 100 MΩ or more was determined to be 100%.
Thus, in the above adapter device, high conductivity is obtained in all the conductive path forming portions, and sufficient insulation is achieved between the adjacent conductive path forming portions for all the conductive path forming portions. It has been confirmed.

<Comparative example 1>
(1) Mold production:
According to the configuration shown in FIG. 24, a mold for forming an anisotropic conductive film having the following specifications was produced.
The substrate (81, 86) in each of the upper mold (80) and the lower mold (85) is made of iron and has a thickness of 6 mm.
The ferromagnetic part (82, 87) is made of nickel, is rectangular with a vertical and horizontal dimension of 120 μm × 60 μm, has a thickness of 100 μm, and has a minimum separation distance between the plate-like ferromagnetic parts (82, 87). At 30 μm (minimum center-to-center distance is 90 μm), the total number of ferromagnetic layers is 4800.
The non-magnetic part (83, 88) is made of a hardened dry film resist and has a thickness of 0.115 mm.
(2) Production of frame plate:
A frame plate (90) was produced in the same manner as in Example 1.
(3) Preparation of anisotropic conductive elastomer material:
An anisotropic conductive elastomer material is prepared by adding 60 parts by weight of conductive particles having an average particle size of 12 μm to 100 parts by weight of addition-type liquid silicone rubber, and then performing defoaming treatment under reduced pressure. did. In the above, as the conductive particles, the core particles made of nickel and plated with gold (average coating amount: 2% by weight of the weight of the core particles) were used.

(4) Formation of elastic anisotropic conductive film:
A spacer having a thickness of 10 μm in which an opening of 160 mm × 120 mm is formed is positioned on the molding surface of the lower mold (85) of the above-described mold, and the prepared anisotropic conductivity is placed in the opening of the spacer. By applying the elastomer material by screen printing, an anisotropic conductive elastomer material layer having a thickness of 10 μm was formed. Next, on the spacer and the anisotropic conductive elastomer layer, the prepared frame plate (90) and a spacer having a thickness of 10 μm in which an opening of 160 mm × 120 mm is formed are aligned and arranged in this order, and adjusted anisotropic By applying the conductive elastomer material by screen printing, an anisotropic conductive elastomer material layer (95A) having a form corresponding to the target elastic anisotropic conductive film was formed.
Then, the upper mold (80) is positioned and arranged on the anisotropic conductive elastomer material layer (95A), and the ferromagnetic portion (82, 87) is arranged against the anisotropic conductive elastomer material layer (95A). ) By applying a 2T magnetic field in the thickness direction by an electromagnet to a portion located between the conductive particles at 120 ° C. for 1 hour to extend in the thickness direction in which conductive particles are densely contained. An elastic anisotropic conductive film composed of 4800 conductive path forming portions and insulating portions formed around them was formed, and a comparative anisotropic conductive connector was manufactured.
The elastic anisotropic conductive film in this anisotropic conductive connector has a conductive path forming portion thickness of 100 μm, an insulating portion thickness of 70 μm, and a minimum separation distance of the conductive path forming portion of 30 μm (minimum center-to-center distance is 90 μm). The two conductive path forming portions are arranged so as to be located in the opening of the frame plate. The conductive path forming portion protrudes from both surfaces of the insulating portion, and the total protruding height of the conductive path forming portion is 30 μm. Moreover, the content rate of the electroconductive particle in a conductive path formation part is about 30% in a volume fraction.

(5) Manufacture of adapter device:
An adapter body having the same specifications as in Example 1 was prepared, and the anisotropic conductive connector was placed on the connection electrode region on the surface of the adapter body, and each of the conductive path forming portions was located on the connection electrode. The adapter device for comparison was manufactured by arranging and fixing as described above.
(6) Evaluation of adapter device:
With respect to the adapter device, the conduction resistance was measured in the same manner as in Example 1, and the ratio of the conductive path forming portion having this conduction resistance of 0.1Ω or less was determined to be 100%.
In addition, the insulation resistance was measured in the same manner as in Example 1, and the ratio of the conductive path forming portion pair having this insulation resistance of 100 MΩ or more was determined to be 95%.
As described above, in the above adapter device for comparison, high conductivity was obtained in all the conductive path forming portions, but sufficient insulation was provided between adjacent conductive path forming portions for all the conductive path forming portions. The condition could not be achieved.

It is sectional drawing for description which shows the structure in an example of the anisotropically conductive connector which concerns on this invention. It is sectional drawing for description which expands and shows the structure of the principal part of the anisotropically conductive connector shown in FIG. It is sectional drawing for description which shows the state by which the material layer for conductive elastomers was formed on the releasable support plate. It is sectional drawing for description which expands and shows the material layer for electroconductive elastomers. It is sectional drawing for description which shows the state by which the magnetic field was acted on the thickness direction of the conductive elastomer material layer. It is sectional drawing for description which shows the state in which the electroconductive elastomer layer was formed on the releasable support plate. It is sectional drawing for description which shows the state by which the metal thin layer was formed on the conductive elastomer layer. It is sectional drawing for description which shows the state in which the resist layer which has an opening was formed on the metal thin layer. It is sectional drawing for description which shows the state in which the metal mask was formed in opening of a resist layer. It is sectional drawing for description which shows the state in which the several conductive path formation part was formed according to the specific pattern on the releasable support body. It is sectional drawing for description which shows the state by which the frame board was arrange | positioned on the releasable support body, and the material layer for insulation parts was formed. It is sectional drawing for description which shows the state by which the releasable support board in which the conductive path formation part was formed was piled up on the releasable support board in which the material layer for insulation parts was formed. It is sectional drawing for description which shows the state in which the integral insulating part was formed around the conductive path formation part. It is sectional drawing for description which shows the structure in the 1st example of the adapter apparatus which concerns on this invention. It is sectional drawing for description which shows the structure of the adapter main body in the adapter apparatus shown in FIG. It is sectional drawing for description which shows the structure in the 2nd example of the adapter apparatus which concerns on this invention. It is sectional drawing for description which shows the structure of the adapter main body in the adapter apparatus shown in FIG. It is explanatory drawing which shows the structure in the 1st example of the electrical inspection apparatus of the circuit apparatus which concerns on this invention. It is explanatory drawing which shows the structure in the 2nd example of the electrical inspection apparatus of the circuit apparatus which concerns on this invention. It is explanatory drawing which shows the state in which the conductive path formation part was formed by removing only the peripheral part of the part used as the conductive path formation part in a conductive elastomer layer. It is sectional drawing for description which shows the state in which the conductive path formation part was formed by removing only the peripheral part of the part used as the conductive path formation part in a conductive elastomer layer. It is explanatory drawing which shows the structure in the other example of the anisotropically conductive connector which concerns on this invention. It is explanatory drawing which shows the structure in the further another example of the anisotropically conductive connector which concerns on this invention. It is sectional drawing for description which shows the structure of the metal mold | die for shape | molding an anisotropically conductive elastomer sheet in the manufacturing method of the conventional anisotropically conductive connector. It is sectional drawing for description which shows the state by which the frame board was arrange | positioned in the metal mold | die shown in FIG. 22, and the anisotropic conductive elastomer material layer was formed. It is sectional drawing for description which shows the state by which the conventional anisotropically conductive connector was manufactured. It is sectional drawing for description which shows the direction of the magnetic field which acts on the anisotropically conductive elastomer material layer in the manufacturing method of the conventional anisotropically conductive connector.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1a Upper side adapter apparatus 1b Lower side adapter apparatus 2 Holder 3 Positioning pin 5 Circuit apparatus 6,7 Electrode 10 to be inspected 10 Anisotropic conductive connector 11 Frame board 12 Opening 13 and 13A Releasable support board 14 Metal thin layer 15 Elasticity difference Conductive film 16 Conductive path forming part 16A Conductive elastomer material layer 16B Conductive elastomer layer 17 Insulating part 17A Insulating part material layer 18 Resist layer 18a Opening 19 Metal mask 20 Adapter body 21, 21b, 21c Connection electrode 21a Connection Electrode pair 22 Terminal electrode 23 Internal wiring part 25 Connection electrode region 50a Upper side inspection head 50b Lower side inspection head 51a, 51b Inspection electrode device 52a, 52b Inspection electrode 53a, 53b Electric wire 54a, 54b Strut 55a, 55b Anisotropic conduction Sheet 56a Upper support plate 56b Lower support Holding plate 57a, 57b Connector 80 One template
81 Substrate 82, 82a, 82b Ferromagnetic part 83 Nonmagnetic part 85 Other template 86 Substrate 87, 87a, 87b Ferromagnetic part 88 Nonmagnetic part 90 Frame plate 91 Opening 95 Anisotropically conductive elastomer sheet 95A Material layer for anisotropic conductive elastomer 96 Conductive path forming portion 97 Insulating portion

Claims (10)

A frame plate having one or more openings formed therein, and one or more elastic anisotropic conductive films arranged to close the frame plate and supported by the frame plate, the elastic anisotropic The conductive film includes a plurality of conductive path forming portions extending in the thickness direction, which are arranged in the opening of the frame plate, and are arranged in a state in which the conductive particles exhibiting magnetism are aligned in the thickness direction, and a conductive path formation A method of manufacturing an anisotropic conductive connector comprising an insulating portion formed around a portion,
By performing laser processing on the conductive elastomer layer in which the conductive particles exhibiting magnetism are aligned in the thickness direction in the elastic polymer material supported on the releasable support plate, the mold release is performed. Forming a plurality of conductive path forming portions on the conductive support plate,
Each of the conductive path forming portions formed on the releasable support plate is for an insulating portion made of a liquid polymer material forming material which is cured to become an elastic polymer material so as to close the opening of the frame plate. A method for manufacturing an anisotropic conductive connector, comprising the step of forming an insulating portion by intrusion into a material layer and curing the insulating material layer in this state.   The method of manufacturing an anisotropic conductive connector according to claim 1, wherein the laser processing is performed by a carbon dioxide laser.   A metal mask is formed on the surface of the conductive elastomer layer in accordance with the pattern of the conductive path forming portion to be formed, and then the conductive elastomer layer is laser processed to form a plurality of conductive path forming portions. A method for producing an anisotropic conductive connector according to claim 1 or 2.   4. The method of manufacturing an anisotropic conductive connector according to claim 3, wherein the metal mask is formed by plating the surface of the conductive elastomer layer.   A thin metal layer is formed on the surface of the conductive elastomer layer, a resist layer having an opening formed in accordance with a specific pattern is formed on the surface of the thin metal layer, and a portion of the thin metal layer exposed from the opening of the resist layer 4. The method of manufacturing an anisotropic conductive connector according to claim 3, wherein a metal mask is formed by plating the surface of the connector.   A magnetic field is applied in the thickness direction to the conductive elastomer material layer in which conductive particles exhibiting magnetism are contained in a liquid elastomer material that is cured to become an elastic polymer substance. 6. The method for producing an anisotropic conductive connector according to claim 1, wherein the conductive elastomer layer is formed by curing the material layer for elastomer.   An anisotropic conductive connector obtained by the manufacturing method according to claim 1. An adapter body having a connection electrode region in which a plurality of connection electrodes are formed according to a pattern corresponding to an electrode to be inspected in a circuit device to be inspected on the surface;
The anisotropic conductive connector according to claim 7, wherein the anisotropic conductive connector has a plurality of conductive path forming portions formed on a connection electrode region of the adapter main body and formed according to a pattern corresponding to the connection electrode in the adapter main body. An adapter device characterized by comprising: Adapter main body having a connection electrode region in which a plurality of connection electrode pairs each formed of two connection electrodes for current supply and voltage measurement are formed according to a pattern corresponding to an electrode to be inspected in a circuit device to be inspected on the surface When,
The anisotropic conductive connector according to claim 7, wherein the anisotropic conductive connector has a plurality of conductive path forming portions formed on a connection electrode region of the adapter main body and formed according to a pattern corresponding to the connection electrode in the adapter main body. An adapter device characterized by comprising: An electrical inspection device for a circuit device comprising the adapter device according to claim 8 or 9.

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