JP2005510009A - 電導性熱可塑性ポリマー組成物 - Google Patents
電導性熱可塑性ポリマー組成物 Download PDFInfo
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- JP2005510009A JP2005510009A JP2003544769A JP2003544769A JP2005510009A JP 2005510009 A JP2005510009 A JP 2005510009A JP 2003544769 A JP2003544769 A JP 2003544769A JP 2003544769 A JP2003544769 A JP 2003544769A JP 2005510009 A JP2005510009 A JP 2005510009A
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- nickel
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- 239000000203 mixture Substances 0.000 title claims abstract description 31
- 229920001169 thermoplastic Polymers 0.000 title claims abstract description 29
- 239000000835 fiber Substances 0.000 claims abstract description 78
- 229910052751 metal Inorganic materials 0.000 claims abstract description 58
- 239000002184 metal Substances 0.000 claims abstract description 58
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 18
- 229910052759 nickel Inorganic materials 0.000 claims description 16
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 14
- 239000004917 carbon fiber Substances 0.000 claims description 14
- 239000004417 polycarbonate Substances 0.000 claims description 14
- 229920000515 polycarbonate Polymers 0.000 claims description 13
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 12
- 239000004416 thermosoftening plastic Substances 0.000 claims description 12
- 229920000642 polymer Polymers 0.000 claims description 11
- 239000010935 stainless steel Substances 0.000 claims description 11
- 229910001220 stainless steel Inorganic materials 0.000 claims description 11
- -1 polyethylene Polymers 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 238000004898 kneading Methods 0.000 claims description 5
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 239000011885 synergistic combination Substances 0.000 claims description 5
- 239000004793 Polystyrene Substances 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 239000011651 chromium Substances 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- 229920000058 polyacrylate Polymers 0.000 claims description 4
- 229920002223 polystyrene Polymers 0.000 claims description 4
- 229920005992 thermoplastic resin Polymers 0.000 claims description 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229920000914 Metallic fiber Polymers 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229920001897 terpolymer Polymers 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- 229920001634 Copolyester Polymers 0.000 claims description 2
- 239000004952 Polyamide Substances 0.000 claims description 2
- 239000004962 Polyamide-imide Substances 0.000 claims description 2
- 239000004697 Polyetherimide Substances 0.000 claims description 2
- 239000004698 Polyethylene Substances 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 229920001577 copolymer Polymers 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 239000011133 lead Substances 0.000 claims description 2
- 229920002647 polyamide Polymers 0.000 claims description 2
- 229920002312 polyamide-imide Polymers 0.000 claims description 2
- 229920001230 polyarylate Polymers 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229920000728 polyester Polymers 0.000 claims description 2
- 229920001601 polyetherimide Polymers 0.000 claims description 2
- 229920000573 polyethylene Polymers 0.000 claims description 2
- 229920001955 polyphenylene ether Polymers 0.000 claims description 2
- 239000004800 polyvinyl chloride Substances 0.000 claims description 2
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 2
- 239000011135 tin Substances 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- BXOUVIIITJXIKB-UHFFFAOYSA-N ethene;styrene Chemical compound C=C.C=CC1=CC=CC=C1 BXOUVIIITJXIKB-UHFFFAOYSA-N 0.000 claims 1
- 229920002635 polyurethane Polymers 0.000 claims 1
- 239000004814 polyurethane Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 7
- 239000000945 filler Substances 0.000 abstract description 3
- 238000002347 injection Methods 0.000 description 7
- 239000007924 injection Substances 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 239000008188 pellet Substances 0.000 description 5
- 238000009864 tensile test Methods 0.000 description 4
- 239000011231 conductive filler Substances 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 239000004429 Calibre Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- NPURPEXKKDAKIH-UHFFFAOYSA-N iodoimino(oxo)methane Chemical compound IN=C=O NPURPEXKKDAKIH-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000003856 thermoforming Methods 0.000 description 2
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 229920000271 Kevlar® Polymers 0.000 description 1
- 241000422980 Marietta Species 0.000 description 1
- PWHVEHULNLETOV-UHFFFAOYSA-N Nic-1 Natural products C12OC2C2(O)CC=CC(=O)C2(C)C(CCC2=C3)C1C2=CC=C3C(C)C1OC(O)C2(C)OC2(C)C1 PWHVEHULNLETOV-UHFFFAOYSA-N 0.000 description 1
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 1
- 239000012963 UV stabilizer Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920003247 engineering thermoplastic Polymers 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000004761 kevlar Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- GWWNCLHJCFNTJA-UHFFFAOYSA-N nicandrenone-2 Natural products C12OC2C2(O)CC=CC(=O)C2(C)C(CCC23C)C1C3CCC2(O)C(C)C1OC(O)C2(C)OC2(C)C1 GWWNCLHJCFNTJA-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000470 poly(p-phenylene terephthalate) polymer Polymers 0.000 description 1
- 229920002577 polybenzoxazole Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/06—Elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
Landscapes
- Chemical & Material Sciences (AREA)
- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Abstract
【解決手段】金属繊維と金属被覆繊維との組合せを含有する電導性熱可塑性ポリマー組成物。
Description
繊維上の金属被膜の厚さは2マイクロメートル以下、好ましくは1マイクロメートル以下、より好ましくは0.5マイクロメートル以下であり、0.1マイクロメートル以上、好ましくは0.25マイクロメートル以上である。
金属被覆繊維のアスペクト比は200〜1000、好ましくは200〜750である。
これら繊維の供給元としては、ジョージア州マリエッタの13tkaert Fibre、ニュージャージー州ウイコフのINCO Special Product及びカリフォルニア州メンロパークのToho Carbor Fibersがある。
本発明を例証するために好ましい態様の例を示す。しかしこれらは発明の範囲を制限するものではない。
「SE」は2001年10月にオハイオ州デンバーのProceedings of the Antenna Measurement Test Association発行のB.whilmhoff等の「標準ASTM法セルとストリップラインフィールドアプリケータを用いる材料測定の比較」及び1993年6月発行のIEEEIM−Straus.,Vol.42,No.3,740〜745頁の「ストリップラインフィールドアプリケータを用いる材料の複雑な構成パラメータの測定用の改良された脱封入技術」に記載されているストリップラインフィールドアプリケータに従って測定した遮蔽効果である。テスト片は3.2mmのイソ引張りテスト片から厚さ2.66mmに加工してつくった。SE値は1〜2ギガヘルツ(GHz)の周波数範囲のものを反映している。
「Tm」引張りモジュラス又は105psiで示す。
「E」引張り伸びは%で示す。
負荷の下での「DTUL」偏差温度はASTM D648−82に行いシーストHDT300ビカット機で測定した。試験片はイソ引張りテスト片からつくり、脱アニール化して1.82メガパスカル(MPa)の加圧下にテストした。
Claims (14)
- (i)熱可塑性樹脂及び金属繊維と金属被覆繊維の相乗的組合せ物とを溶融混練装置に供給する工程、及び(ii)電導性熱可塑性構造物を形成する工程からなることを特徴とする電導性熱可塑性構造体の製造方法。
- 熱可塑性樹脂がポリエチレン、ポリプロピレン、エチレンとスチレンのインターポリマー、ポリ塩化ビニル、ポリスチレン、衝撃ポリスチレン、スチレンとアクリロニトリルのコポリマー、アクリロニトリルとブタジエンとスチレンのターポリマー、ポリエステル、ポリカーボネート、コポリエステルポリカーボネート、ポリアミド、熱可塑性ポリウレタン、エポキシ樹脂、ポリアクリレート、ポリアクリレートエーテルスルホン、ポリアリーレートエーテルケトン、ポリフェニレンエーテル、ポリアミド−イミド、ポリエーテル−イミド又はそれらのブレンド物である請求項1の方法。
- 熱可塑性樹脂がポリカーボネート、アクリロニトリルとブタジエンとスチレンのターポリマー又はそれらの混合物である請求項1の方法。
- 金属繊維がアルミニウム、亜鉛、銅、銀、ニッケル、ステンレススチール、金、クロム及びこれらの合金から選ばれる金属の繊維である請求項1の方法。
- 金属繊維がステンレススチールの繊維である請求項1の方法。
- 金属被覆繊維が非金属繊維上の金属被膜をもつ請求項1の方法。
- 金属被膜の厚さが0.1〜2マイクロメートルである請求項6の方法。
- 金属被膜の銀、ニッケル、アルミニウム、クロム、スズ、鉛、銅及びそれらの合金から選ばれる被膜である請求項6の方法。
- 非伝導性繊維が炭素、ガラス又はポリマーからなる繊維である請求項6の方法。
- 金属被覆繊維がニッケル被覆炭素繊維である請求項1の方法。
- 金属混練装置が押出機又は針出成形機である請求項1の方法。
- 金属繊維が電気伝導性熱可塑性物の容積基準で2〜15重量%の量で供給される請求項1の方法。
- 金属被覆繊維が3〜25重量%の量で供給される請求項1の方法。
- 請求項1の方法で製造した電導性熱可塑性構造物。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US33318701P | 2001-11-13 | 2001-11-13 | |
PCT/US2002/029986 WO2003043028A2 (en) | 2001-11-13 | 2002-09-20 | Electrically conductive thermoplastic polymer composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005510009A true JP2005510009A (ja) | 2005-04-14 |
JP2005510009A5 JP2005510009A5 (ja) | 2006-01-12 |
Family
ID=23301704
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003544769A Pending JP2005510009A (ja) | 2001-11-13 | 2002-09-20 | 電導性熱可塑性ポリマー組成物 |
Country Status (14)
Country | Link |
---|---|
US (1) | US6936191B2 (ja) |
EP (1) | EP1446446B1 (ja) |
JP (1) | JP2005510009A (ja) |
KR (1) | KR100858603B1 (ja) |
CN (1) | CN1585799A (ja) |
AT (1) | ATE365764T1 (ja) |
AU (1) | AU2002363709A1 (ja) |
BR (1) | BR0214061A (ja) |
DE (1) | DE60220938T2 (ja) |
DK (1) | DK1446446T3 (ja) |
ES (1) | ES2284974T3 (ja) |
MX (1) | MXPA04004566A (ja) |
TW (1) | TWI285655B (ja) |
WO (1) | WO2003043028A2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101164297B1 (ko) * | 2006-03-22 | 2012-07-09 | 프레믹스 오와이 | 전기 전도성 엘라스토머 혼합물, 그 제조 방법 및 그 용도 |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050167188A1 (en) * | 2001-02-15 | 2005-08-04 | Integral Technologies, Inc. | Low cost acoustical structures manufactured from conductive loaded resin-based materials |
US20050191788A1 (en) * | 2001-02-15 | 2005-09-01 | Integral Technologies, Inc. | Low cost magnetic brakes and motion control devices manufactured from conductive loaded resin-based materials |
US7182889B2 (en) * | 2001-02-15 | 2007-02-27 | Integral Technologies, Inc. | Low cost roofing shingles manufactured from conductive loaded resin-based materials |
US20050167189A1 (en) * | 2001-02-15 | 2005-08-04 | Integral Technologies, Inc. | Low cost acoustical structures manufactured from conductive loaded resin-based materials |
US7198735B2 (en) * | 2001-02-15 | 2007-04-03 | Integral Technologies, Inc. | Low cost roofing shingles manufactured from conductive loaded resin-based materials |
US20080063864A1 (en) * | 2001-02-15 | 2008-03-13 | Thomas Aisenbrey | Variable-thickness elecriplast moldable capsule and method of manufacture |
US7223469B2 (en) | 2001-02-15 | 2007-05-29 | Integral Technologies, Inc. | Electriplast moldable composite capsule |
US7935415B1 (en) | 2002-04-17 | 2011-05-03 | Conductive Composites Company, L.L.C. | Electrically conductive composite material |
US7598308B2 (en) * | 2005-03-30 | 2009-10-06 | The Gates Corporation | Metal—elastomer compound |
US7283100B2 (en) * | 2005-04-28 | 2007-10-16 | Delphi Technologies, Inc. | Satellite antenna |
US20070145097A1 (en) * | 2005-12-20 | 2007-06-28 | Intel Corporation | Carbon nanotubes solder composite for high performance interconnect |
DE102006012990A1 (de) * | 2006-03-22 | 2007-09-27 | Bayer Materialscience Ag | Flammgeschützte schlagzähmodifizierte Polycarbonat-Zusammensetzungen |
WO2007126986A2 (en) | 2006-03-31 | 2007-11-08 | Parker-Hannifin Corporation | Electrically conductive article |
KR100742709B1 (ko) | 2006-06-22 | 2007-07-25 | 노바템스 주식회사 | 스테인레스 스틸 스크랩을 이용한 전도성 복합재의제조방법 |
JP4969363B2 (ja) * | 2006-08-07 | 2012-07-04 | 東レ株式会社 | プリプレグおよび炭素繊維強化複合材料 |
US20080139065A1 (en) * | 2006-12-11 | 2008-06-12 | Jayantha Amarasekera | Intrinsically conductive thermoplastic composition and compounding processing for making conductive fiber |
CN101469109B (zh) * | 2007-12-28 | 2012-01-25 | 合肥杰事杰新材料股份有限公司 | 聚酯/金属纤维导电、导热、快结晶复合材料及其制备方法 |
DE102008006523A1 (de) * | 2008-01-29 | 2009-07-30 | Airbus Deutschland Gmbh | Faserverbundbauteil für ein Luft- oder Raumfahrzeug |
US20090297697A1 (en) * | 2008-05-29 | 2009-12-03 | Burgess Lester E | Silver doped white metal particulates for conductive composites |
US8357858B2 (en) | 2008-11-12 | 2013-01-22 | Simon Fraser University | Electrically conductive, thermosetting elastomeric material and uses therefor |
EP2499704B1 (de) * | 2010-03-01 | 2017-06-07 | Franz Binder GmbH & Co. Elektrische Bauelemente KG | Verfahren zum herstellen einer elektrischen schnittstelle und schnittstelle |
KR20120034538A (ko) * | 2010-08-26 | 2012-04-12 | 제일모직주식회사 | 고강성 전자파 차폐 조성물 및 그 성형품 |
WO2012026652A1 (ko) * | 2010-08-26 | 2012-03-01 | 제일모직 주식회사 | 고강성 전자파 차폐 조성물 및 그 성형품 |
US20140361223A1 (en) * | 2011-12-09 | 2014-12-11 | Cheil Industries Inc. | Composite and Molded Product Thereof |
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US9901018B1 (en) | 2017-04-18 | 2018-02-20 | Delphi Technologies, Inc. | Electrically conductive hybrid polymer material |
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59109562A (ja) * | 1982-12-16 | 1984-06-25 | Denki Kagaku Kogyo Kk | カ−ボンブラツクおよびこれを含有した導電性組成物 |
JPS59152936A (ja) * | 1983-02-21 | 1984-08-31 | Kuraray Co Ltd | 電磁しやへい性および剛性に優れたハイブリツト系樹脂組成物 |
JPS62297353A (ja) * | 1986-06-10 | 1987-12-24 | バイエル・アクチエンゲゼルシヤフト | カーボン含有成形体の製造方法 |
JPS6392672A (ja) * | 1986-10-07 | 1988-04-23 | Mitsubishi Monsanto Chem Co | 導電性熱可塑性樹脂組成物 |
JPS63142085A (ja) * | 1986-12-05 | 1988-06-14 | Showa Denko Kk | 導電性シ−ト状接着剤の製造法 |
JPH069819A (ja) * | 1992-06-23 | 1994-01-18 | Teijin Chem Ltd | 電磁波遮蔽用樹脂組成物 |
JPH11106665A (ja) * | 1997-10-06 | 1999-04-20 | Teijin Ltd | 樹脂組成物及びそれからなるエレクトロニクス分野の搬送用冶具 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4404125A (en) * | 1981-10-14 | 1983-09-13 | General Electric Company | Polyphenylene ether resin compositions for EMI electromagnetic interference shielding |
US4610808A (en) * | 1982-07-19 | 1986-09-09 | Mitech Corporation | Conductive resinous composites |
NL8204288A (nl) * | 1982-11-05 | 1984-06-01 | Gen Electric | Polymeermengsel, werkwijze voor het bereiden van het polymeermengsel, voorwerpen gevormd uit het polymeermengsel. |
JPS6088064A (ja) | 1983-10-21 | 1985-05-17 | Seiko Epson Corp | 導電性樹脂組成物 |
US4596670A (en) * | 1983-10-25 | 1986-06-24 | General Electric Company | EMI shielding effectiveness of thermoplastics |
JPS61209120A (ja) | 1985-03-13 | 1986-09-17 | Kanebo Ltd | 導電性熱可塑性樹脂成形品の製造方法 |
JPS62101654A (ja) | 1985-10-29 | 1987-05-12 | Idemitsu Petrochem Co Ltd | 金属繊維含有樹脂組成物 |
JPS6390564A (ja) | 1986-10-03 | 1988-04-21 | Mitsubishi Monsanto Chem Co | 導電性熱可塑性樹脂組成物 |
BE1000277A3 (nl) * | 1987-01-30 | 1988-10-04 | Bekaert Sa Nv | Composietgranulaat omvattende gekroesde vezels en kunststofvoorwerpen daaruit vervaardigd. |
JPS63280603A (ja) | 1987-05-14 | 1988-11-17 | Nkk Corp | 導電性複合プラスチツク材 |
JPS63297459A (ja) | 1987-05-29 | 1988-12-05 | Furukawa Electric Co Ltd:The | 導電性樹脂混和物 |
EP0306671A1 (en) * | 1987-07-20 | 1989-03-15 | Hitachi, Ltd. | Electroconductive resin composition for moulding, and shield moulded therefrom |
US7078098B1 (en) | 2000-06-30 | 2006-07-18 | Parker-Hannifin Corporation | Composites comprising fibers dispersed in a polymer matrix having improved shielding with lower amounts of conducive fiber |
US6150446A (en) | 1997-08-29 | 2000-11-21 | Teijin Limited | Destaticizing thermoplastic resin composition |
US6399737B1 (en) * | 2001-09-21 | 2002-06-04 | General Electric Company | EMI-shielding thermoplastic composition, method for the preparation thereof, and pellets and articles derived therefrom |
-
2002
- 2002-09-20 DK DK02798413T patent/DK1446446T3/da active
- 2002-09-20 KR KR1020047007161A patent/KR100858603B1/ko not_active IP Right Cessation
- 2002-09-20 BR BR0214061-6A patent/BR0214061A/pt not_active Application Discontinuation
- 2002-09-20 WO PCT/US2002/029986 patent/WO2003043028A2/en active IP Right Grant
- 2002-09-20 AT AT02798413T patent/ATE365764T1/de not_active IP Right Cessation
- 2002-09-20 ES ES02798413T patent/ES2284974T3/es not_active Expired - Lifetime
- 2002-09-20 JP JP2003544769A patent/JP2005510009A/ja active Pending
- 2002-09-20 EP EP02798413A patent/EP1446446B1/en not_active Expired - Lifetime
- 2002-09-20 DE DE60220938T patent/DE60220938T2/de not_active Expired - Lifetime
- 2002-09-20 US US10/247,905 patent/US6936191B2/en not_active Expired - Lifetime
- 2002-09-20 CN CNA028224949A patent/CN1585799A/zh active Pending
- 2002-09-20 AU AU2002363709A patent/AU2002363709A1/en not_active Abandoned
- 2002-09-20 MX MXPA04004566A patent/MXPA04004566A/es active IP Right Grant
- 2002-11-12 TW TW091133172A patent/TWI285655B/zh not_active IP Right Cessation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59109562A (ja) * | 1982-12-16 | 1984-06-25 | Denki Kagaku Kogyo Kk | カ−ボンブラツクおよびこれを含有した導電性組成物 |
JPS59152936A (ja) * | 1983-02-21 | 1984-08-31 | Kuraray Co Ltd | 電磁しやへい性および剛性に優れたハイブリツト系樹脂組成物 |
JPS62297353A (ja) * | 1986-06-10 | 1987-12-24 | バイエル・アクチエンゲゼルシヤフト | カーボン含有成形体の製造方法 |
JPS6392672A (ja) * | 1986-10-07 | 1988-04-23 | Mitsubishi Monsanto Chem Co | 導電性熱可塑性樹脂組成物 |
JPS63142085A (ja) * | 1986-12-05 | 1988-06-14 | Showa Denko Kk | 導電性シ−ト状接着剤の製造法 |
JPH069819A (ja) * | 1992-06-23 | 1994-01-18 | Teijin Chem Ltd | 電磁波遮蔽用樹脂組成物 |
JPH11106665A (ja) * | 1997-10-06 | 1999-04-20 | Teijin Ltd | 樹脂組成物及びそれからなるエレクトロニクス分野の搬送用冶具 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101164297B1 (ko) * | 2006-03-22 | 2012-07-09 | 프레믹스 오와이 | 전기 전도성 엘라스토머 혼합물, 그 제조 방법 및 그 용도 |
Also Published As
Publication number | Publication date |
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MXPA04004566A (es) | 2004-09-10 |
US6936191B2 (en) | 2005-08-30 |
WO2003043028A3 (en) | 2003-12-18 |
EP1446446A2 (en) | 2004-08-18 |
TWI285655B (en) | 2007-08-21 |
KR100858603B1 (ko) | 2008-09-17 |
DK1446446T3 (da) | 2007-10-29 |
WO2003043028A2 (en) | 2003-05-22 |
DE60220938D1 (de) | 2007-08-09 |
EP1446446B1 (en) | 2007-06-27 |
KR20050029260A (ko) | 2005-03-24 |
TW200300152A (en) | 2003-05-16 |
US20030089892A1 (en) | 2003-05-15 |
BR0214061A (pt) | 2004-10-13 |
ES2284974T3 (es) | 2007-11-16 |
ATE365764T1 (de) | 2007-07-15 |
CN1585799A (zh) | 2005-02-23 |
DE60220938T2 (de) | 2008-02-28 |
AU2002363709A1 (en) | 2003-05-26 |
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