JP2005339501A - Inspection method of sheet with ic tag - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To execute inspection of electric characteristic of an IC tag in a state of a sheet with IC tag. <P>SOLUTION: The sheet 1 with IC tag 1 comprises a nonconductive sheet 21, a pair of conductors 22 provided on the nonconductive sheet 21 and extending in a strip shape, and a number of IC chips 20 provided on the pair of conductors 22. The IC tag 10 is composed of a pair of extended electrodes 9 and an IC chip 20. The inspection method of the sheet with IC tag 1 comprises a process for preparing the sheet with IC tag 1; a process for cutting the conductors 22 of the sheet with IC tag 1 for every IC chip 20 in the feeding direction and successively forming the IC tag 10 composed of the pair of extended electrodes 9 and the IC chip 20 on the nonconductive sheet 21 extending in the strip form;and a process for inspecting the electric characteristic of each IC tag 10. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for inspecting a sheet with an IC tag having an IC tag or an interposer capable of exchanging data without contact with an external reader / writer.

  Conventionally, an IC tag that exchanges data without contact with an external reader / writer is composed of an IC chip and a pair of conductors, and functions as an antenna when transmitting and receiving data without contact with an external reader / writer And an enlarged electrode. Usually, such an IC tag is supported on a base sheet.

  On the other hand, an interposer used for connecting an antenna circuit also has a pair of enlarged electrodes and an IC chip connected to the enlarged electrodes, and is usually supported on a base sheet. In this interposer, the enlarged electrode functions as a connection terminal with an antenna circuit that functions as an antenna when data is transmitted and received without contact with an external reader / writer, and connects the antenna circuit and the IC chip.

  In the present application, the term IC tag is used as a concept including an interposer.

  In an IC tag including such an interposer, a pair of conductors extending in the longitudinal direction is provided on a base sheet, and an IC chip is continuously disposed between the pair of conductors to produce a sheet with an IC tag. The sheet with the IC tag is obtained by cutting for each IC chip.

  As described above, the IC tag is obtained by cutting the sheet with the IC tag. However, since the conductor is continuous in a sheet shape before the cutting, the quality inspection for the IC tag is performed after the sheet with the IC tag is cut. It must be made. However, it is complicated and inefficient to inspect each IC tag after cutting.

  In this case, if the quality of each IC tag can be inspected in the sheet state without cutting and separating each IC tag, it is convenient to speed up the inspection process. The present invention has been made in consideration of such points, and can perform quality inspection of an IC tag in a state of a sheet with an IC tag, and can speed up the inspection process. The purpose is to provide an inspection method.

  The present invention provides a sheet with an IC tag having a non-conductive sheet extending in a strip shape, a pair of conductors provided on the non-conductive sheet and extending in a strip shape, and a large number of IC chips on the pair of conductors. Cutting the conductor of the IC tag-attached sheet, sequentially producing an IC tag comprising a pair of enlarged electrodes and an IC chip on the non-conductor sheet along the longitudinal direction, A method for inspecting quality, and a method for inspecting a sheet with an IC tag.

  The present invention is an inspection method for a sheet with an IC tag, characterized in that the conductor is cut on both sides of the IC chip with a pair of non-conductive blades spaced apart in the longitudinal direction of the non-conductor sheet. In addition, when cut | disconnecting a conductor, it can cut | disconnect along the width direction orthogonal to a longitudinal direction.

  The present invention is an IC tag sheet inspection method characterized by inspecting the quality of an IC tag in a state where a pair of non-conductive blades have entered the sheet with the IC tag.

  The present invention provides a non-conductive sheet extending in a strip shape, and is provided on the non-conductive sheet so as to be spaced apart from both ends in the width direction perpendicular to the longitudinal direction of the non-conductive sheet and extend in the longitudinal direction of the non-conductive sheet. A step of preparing a sheet with an IC tag having a pair of conductors spaced apart from each other and a plurality of IC chips on the pair of conductors, and at least a pair in the widthwise ends of the non-conductor sheet A through-hole extending over the entire width of the conductor and penetrating the non-conductor sheet and the conductor is formed between the IC chips, so that the IC tag including the pair of enlarged electrodes and the IC chip is non-coated. A method for inspecting a sheet with an IC tag, comprising: a step of sequentially producing a conductor sheet along a longitudinal direction; and a step of inspecting the quality of each IC tag.

  The present invention provides a non-conductive sheet extending in a strip shape, and is provided on the non-conductive sheet so as to be spaced apart from both ends in the width direction perpendicular to the longitudinal direction of the non-conductive sheet and extend in the longitudinal direction of the non-conductive sheet. A step of preparing a sheet with an IC tag having a pair of conductors spaced apart from each other and a plurality of IC chips on the pair of conductors, and at least a pair in the widthwise ends of the non-conductor sheet An incision extending from the conductor surface to the non-conductor sheet is formed between the IC chips to extend the entire width of the conductor of the IC, and the IC tag including the pair of enlarged electrodes and the IC chip is non-conductive. A method for inspecting a sheet with an IC tag, comprising: a step of sequentially producing a body sheet along a longitudinal direction; and a step of inspecting the quality of each IC tag.

  The present invention is a method for inspecting a sheet with an IC tag, further comprising a step of marking an IC tag determined to be abnormal.

  According to the present invention, quality inspection of an IC tag having an IC chip and an enlarged electrode can be performed in the state of a sheet with an IC tag. For this reason, it is possible to speed up the inspection process.

  Embodiments of the present invention will be described below with reference to the drawings.

  1 to 7 are diagrams showing an embodiment of a method for inspecting a sheet with an IC tag according to the present invention.

[Sheet with IC tag 1]
First, the sheet 1 with IC tag and the IC tag 10 will be described with reference to FIGS. FIG. 1 is a cross-sectional view taken along the width direction of the sheet 1 with an IC tag, and FIG. 2 is a cross-sectional view showing a modification of the sheet 1 with an IC tag.

  Here, the IC tag 10 includes not only a non-contact IC tag that exchanges data with an external reader / writer but also an interposer used by connecting to an antenna circuit.

  As shown in FIG. 1, a sheet 1 with an IC tag according to the present embodiment includes a non-conductive sheet (also referred to as a base sheet) 21, a conductor 22 provided on the non-conductive sheet 21, and a conductor IC chip 20 arranged on 22 and protective film 23 arranged on IC chip 20 are provided. Each IC tag 10 is obtained by cutting such a sheet 1 with an IC tag along the width direction for each IC chip 20 to form the enlarged electrodes 9 from the conductor 22.

  The protective film 23 is for preventing the IC chip 20 from being chipped or displaced on the conductor 22 (enlarged electrode 9). In the present embodiment, an example in which the protective film 23 covers the IC chip 20 and a part of the conductor 22 has been shown (FIG. 1), but is not limited thereto. The protective film 23 may cover only the IC chip 20 or may cover the IC chip 20 and the entire conductor 22. Furthermore, the protection treatment of the IC chip 20 may be performed by resin-sealing the IC chip 20 instead of stacking the protective film 23 on the IC chip.

  The IC tag 10 obtained by cutting the sheet 1 with the IC tag is disposed across the enlarged electrode 9 formed from the pair of conductors 22 and the pair of enlarged electrodes 9, 9. The IC tag 10 includes a connected IC chip 20, and the IC tag 10 is supported by a non-conductive sheet 21 and the surface on the IC chip 20 side is covered with a protective film 23.

  Among these, the IC chip 20 has an IC chip body 20a and a flat electrode 20b provided on the lower surface of the IC chip body 20a. The flat electrode 20b is fixed and electrically connected to the conductor 22 by applying the adhesive 18 and thermocompression bonding, pressure bonding, or ultrasonic bonding (intermetal bonding). In the present embodiment, an anisotropic conductive adhesive is used as the adhesive 18 as described later, but a non-conductive adhesive or a normal conductive adhesive may be used.

  On the other hand, as shown in FIG. 2, the IC chip 20 may include an IC chip body 20a and an electrode 20c provided on the IC chip body 20a and having a sharp tip. As shown in FIG. 2, since the tip of the electrode 20c of the IC chip 20 is pointed, when the IC chip 20 is thermocompression-bonded or pressure-bonded to the conductor 22, the electrode 20c becomes an anisotropic conductive adhesive or conductive adhesive. The conductor 22 is pierced through an agent or a non-conductive adhesive. As a result, the electrode 20 c can be firmly fixed to the conductor 22.

[Outline inspection method of sheet 1 with IC tag]
Next, a schematic inspection method for the IC tag sheet 1 will be described with reference to FIG.

  FIG. 3 is a schematic explanatory view showing an embodiment of a method for inspecting a sheet 1 with an IC tag including a method for producing the sheet 1 with an IC tag according to the present invention. In FIG. 3, each process of the inspection method proceeds from the left side to the right side, that is, the left side is an upstream process and the right side is a downstream process.

  As shown in FIG. 3, the method for inspecting the IC tag-attached sheet 1 uses a manufacturing (production and inspection) line 2 for the IC tag-attached sheet 1, and a non-conductor sheet 21 extending in a strip shape, and a non-conductor sheet 21. An IC tag-attached sheet 1 having a pair of conductors 22 provided on the top and extending in a strip shape and a large number of IC chips 20 on the pair of conductors 22 is prepared, and the same direction as the longitudinal direction of the non-conductor sheet 21 The IC tag 10 comprising the pair of enlarged electrodes 9 and the IC chip 20 by cutting the conductor 22 of the sheet 1 with IC tag into the width direction perpendicular to the feed direction for each IC chip 20. Are sequentially manufactured along the feeding direction on the non-conductive sheet 1 and a step of inspecting the quality of each IC tag 10.

  Moreover, in this Embodiment, the process of preparing the sheet | seat 1 with an IC tag includes the non-conductive sheet 21 extending in a strip shape and the longitudinal direction of the non-conductive sheet 21 provided on the non-conductive sheet 21 and extending to each other. A step of preparing a conductor-formed sheet 21a having a pair of spaced apart conductors 22 and feeding it in the same direction as the longitudinal direction of the non-conductor sheet 21, and a conductor 22 of the conductor-formed sheet 21a The step of applying the conductive adhesive 18 by the dispenser 25, the step of preparing and sequentially supplying a large number of IC chips 20, and the mounting (arrangement) of each IC chip 20 on the adhesive-applied portion of the conductor 22 And a step of fixing each IC chip 20 on the conductor 22 via the conductive adhesive 18.

  Further, in the present embodiment, as shown in FIG. 3, a process of protecting the IC chip 20 by laminating the protective film 23 on the IC tag-attached sheet 1, and a sheet with the IC tag laminated with the protective film 23 A winding step around the winding core 1a.

  As described above and as is apparent from FIG. 3 and the like, in this embodiment, the conductor-formed sheet 21a is fed in the same direction as the longitudinal direction of the non-conductor sheet 21, and the process in each step is performed. Will be done. Therefore, in this embodiment, “feed direction” and “longitudinal direction” mean the same direction.

  Hereinafter, each step will be described in more detail.

[Preparation and Supply of Conductor Formed Sheet 21a]
First, the process of preparing and supplying the conductor-formed sheet 21a will be described with reference to FIG.

  FIG. 4 is a perspective view showing a method for producing the IC tag-attached sheet 1. Also in FIG. 4, the left side is an upstream process and the right side is a downstream process, as in FIG.

  As shown in FIG. 4, the means 3 for preparing and supplying the conductor-formed sheet 21 a includes a means for supplying the non-conductive sheet 21, a means for supplying the conductor 22, a nip roller 36, and a cutter 42. And have.

  As shown in FIG. 4, first, the non-conductive sheet 21 extending in a belt shape is continuously supplied and sent to the nip roller 36, and the conductor 22 extending in a belt shape is continuously supplied to the nip roller 36. Sent. During this time, a pressure-bonding adhesive (not shown) is applied between the non-conductive sheet 21 and the conductive body 22. Thereafter, the non-conductor sheet 21 and the conductor 22 are pressure-bonded by the nip roller 36, whereby the non-conductor sheet 21 and the conductor 22 are bonded and fixed to each other, and the conductor 22 is placed on the non-conductor sheet 21. Laminated. In the present embodiment, the width of the conductor 22 and the width of the non-conductor sheet 21 are the same.

  The non-conductor sheet 21 is made of, for example, PET or paper, and the conductor 22 is made of, for example, aluminum or copper foil.

  Next, the non-conductive sheet 21 on which the conductor 22 is laminated is sent to the first accumulator 37. The first accumulator 37 has a pair of support rollers 37b and 37b and a moving roller 37a provided between the support rollers 37b and 37b and movable in the vertical direction. When the moving roller 37a is lowered, the non-conductive sheet 21 in which the conductor 22 is laminated on the first accumulator 37 is stored, and when the moving roller 37a is lifted, the stored non-conductive sheet 21 is changed to the first accumulator 37. 1 is supplied from the accumulator 37 to the downstream side. Thereby, the supply amount and demand amount of the non-conductor sheet 21 laminated with the conductor 22 before and after the first accumulator 37 can be adjusted.

  Thereafter, the non-conductive sheet 21 on which the conductor 22 is laminated is sent to the cutter 42 side. By pressing the cutter against the conductor 22 on the non-conductor sheet 21 that has been sent, the conductor 22 is cut, and a slit 24a is formed in the feed direction (approximately in the center in the width direction perpendicular to the feed direction of the conductor 22). The direction along the thick arrow in FIG. 4 is also referred to as the longitudinal direction). As a result, the conductor 22 is divided into a pair, and the width of the slit 24a is smaller than the width between the electrodes 20b and 20b of the IC chip 20. Moreover, the cutting by the cutter 42 is a so-called half-cut, and the entire thickness of the laminate of the conductor 22 and the non-conductive sheet 21 is not cut, but only the conductor 22 is divided and the non-conductive sheet 21 is divided. It will never be done.

  In this way, the conductor-formed sheet 21a having the non-conductor sheet 21 and the pair of conductors 22 provided on the non-conductor sheet 21 and separated from each other is prepared and supplied.

  In the present embodiment, the example in which the cutter 42 is installed on the downstream side of the first accumulator 37 is shown, but the present invention is not limited to this, and the cutter 42 is installed on the upstream side of the first accumulator 37. Also good.

[Application of adhesive 18]
As shown in FIG. 4, a dispenser (means for applying an adhesive) 25 for applying the conductive adhesive 18 is installed on the downstream side of the cutter 42. The conductive adhesive sheet 18 is applied to the portion where the IC chip 20 is disposed by the dispenser 25 on the conductor-formed sheet 21a. In the present embodiment, the conductive adhesive 18 is applied on the conductor 22 of the conductor-formed sheet 21a.

  In the present embodiment, an anisotropic conductive adhesive is used as the conductive adhesive 18. The anisotropic conductive adhesive is made of a non-conductive binder resin containing conductive particles such as gold-plated resin filler, nickel, or silver, for example, and the thermosetting resin is used as the binder resin. Is used. For this reason, as shown in FIG. 4, even if the conductive adhesive 18 is applied so as to straddle both conductors with the slit 24 a interposed therebetween, the pair of conductors are short-circuited via the conductive adhesive 18. There is nothing.

  In place of the anisotropic conductive adhesive, a nonconductive adhesive or a normal conductive adhesive may be used. Further, as the binder resin of the adhesive 18 and the anisotropic conductive adhesive, not only a thermosetting resin but also a thermoplastic resin or a UV curable resin can be used.

  Moreover, in this Embodiment, although the example which apply | coats the adhesive agent 18 by the dispenser 25 was shown, it is not restricted to this, You may apply | coat the adhesive agent 18 on the conductor formed sheet 21a with a screen printer.

[Preparation and supply of IC chip 20]
Next, a process of preparing and supplying the IC chip 20 will be described with reference to FIG.

  FIG. 5 is a perspective view showing a method for producing the sheet 1 with an IC tag. In FIG. 5, an apparatus (means) 4 for supplying an IC chip is shown on the front side, and a line for feeding the conductor-formed sheet 21a is shown on the back side, and an IC chip arrangement apparatus (arrangement means, mounting apparatus) in between. , Also referred to as mounting means). In FIG. 5, the conductor-formed sheet 21a is sent from the right side to the left side.

  First, the means (device) 4 for supplying an IC chip will be described. As shown in FIG. 5, the device 4 for supplying IC chips is a wafer that holds a wafer 11 with a release sheet formed by adhering a diced wafer 12 composed of a large number of IC chips 20 on a UV foam release sheet 11a. Corresponds to one IC chip 20 among the holding plate (wafer holding part) 13 and the UV foam release sheet 11a of the wafer 11 with the release sheet provided below the wafer holding part 13 and held by the wafer holding part 13. And a UV light irradiation unit 14 for irradiating the UV light.

  Among these, the wafer holding unit 13 is made of transparent glass or the like, and UV light from a UV light irradiation unit 14 to be described later is transmitted and reaches the wafer 11 side with the release sheet. The wafer holder 13 is supported by an XY mobile robot 29 so as to be movable in the X and Y directions. Therefore, the wafer 11 is movable in a plane parallel to the X direction and the Y direction, and thereby each diced wafer 11 is positioned with respect to a UV light irradiation unit 14 and a suction pickup nozzle 31 described later. be able to. In the present embodiment, the X direction is a direction parallel to the feeding direction of the conductor-formed sheet 21a (left and right direction in FIG. 5), and the Y direction is a direction orthogonal to the X direction (lower left and upper right in FIG. 5). Direction).

  Next, the UV light irradiation unit 14 will be described in more detail with reference to FIG. FIG. 6 is a perspective view showing the UV light irradiation unit 14.

  As shown in FIG. 6, the UV light irradiation unit 14 guides the UV lamp 19 that emits UV light and the UV light 16 from the UV lamp 19 from the opening 15 a having the same shape as the IC chip 20 toward the wafer 11 with the release sheet. And a mask 15. In such a UV light irradiation section 14, the UV light from the UV lamp 19 is guided to the release sheet-attached wafer 11 side through the opening 15 a of the mask 15, and the UV light passing through the mask 15 is UV foamed on the release sheet-attached wafer 11. The part corresponding to one IC chip 20 in the release sheet 11a is irradiated. When the UV foaming release sheet 11a is irradiated with UV light 16, the adhesive strength of the irradiated portion is reduced.

  In addition, a condensing lens is provided instead of the mask 15, and the UV light 16 from the UV lamp 19 is condensed by the condensing lens and irradiated to a portion corresponding to one IC chip 20 in the UV foam release sheet 11a. May be.

  Next, a method of preparing and sequentially supplying a large number of IC chips 20 using the IC chip supply device 4 having such a configuration will be described.

  First, a wafer 11 with a release sheet is prepared and prepared by adhering and fixing a diced wafer 12 composed of a large number of IC chips 20 on the UV foam release sheet 11a. Next, the wafer 11 with a release sheet is placed and fixed on the wafer holder 13 made of transparent glass. At this time, the wafer 12 of the wafer 11 with release sheet has its circuit surface (the surface on the side where the electrode 20b of the IC chip 20 is provided) facing downward, that is, the UV foam release sheet 11a side. In this way, in the wafer 11 with the release sheet having the wafer 12 with the circuit surface facing downward, the wafer 12 is placed on a dicing sheet (not shown) with the circuit surface facing upward. After dicing on the dicing sheet, the wafer 12 is transferred to the UV foam release sheet 11a so that the circuit surface faces the UV foam release sheet 11a.

  Next, UV light 16 is irradiated from below the wafer holder 13 holding the wafer 11 with release sheet by the UV lamp 19 of the UV light irradiation unit 14. In this case, a mask 15 having an opening 15 a having a shape corresponding to one IC chip 20 is disposed between the UV lamp 19 and the wafer 11 with the release sheet, and the UV light 16 from the UV lamp 19 is the mask 15. Of the UV foam release sheet 11a of the release sheet-attached wafer 11 through the opening 15a to reach the back side portion corresponding to one IC chip 20.

  Of the UV foam release sheet 11a of the release sheet-attached wafer 11, the UV light 16 from the UV lamp 19 is collected through a condenser lens (not shown) that collects the UV light into a size corresponding to the IC chip 20. The portion corresponding to one IC chip 20 may be irradiated.

  When the UV light 16 reaches the wafer 11 with release sheet, the adhesive strength of the portion irradiated with the UV light 16 in the UV foam release sheet 11a decreases. At this time, one IC chip 20 corresponding to a portion where the adhesive strength of the UV foaming release sheet 11a is reduced is peeled from the UV foaming release sheet 11a in the diced wafer 12 adhered on the UV foaming release sheet 11a. Then float up. In this way, only one IC chip 20 can be supplied from the wafer 12 composed of a large number of IC chips 20. Here, “many” means two or more, but preferably several tens or several hundreds in consideration of production efficiency (FIG. 5).

  This process is performed in parallel with the above-described conductor-formed sheet supply process and the subsequent adhesive application process.

[Disposition (mounting) of IC chip 20]
Next, the arrangement process of the IC chip 20 will be described with reference to FIG.

  First, the arrangement device (means) 5 for the IC chip 20 will be described.

  The arrangement device (suction transfer unit) 5 for the IC chip 20 is arranged at an equal interval on the same circumference centering on the rotation center of the index table 30 and the substantially disk-shaped index table 30 that is rotatable. A suction pickup nozzle 31 that is supported by the index table 30 and sucks the IC chip 20 peeled from the UV foam release sheet 11a, and a CCD camera 49 (FIG. 3) used for positioning the IC chip 20 and inspecting the IC chip 20. It has. The suction pickup nozzle 31 can be lowered and raised with respect to the index table 30.

  Next, a method of arranging (mounting) a large number of IC chips 20 on the conductor-formed sheet 21a using the IC chip 20 arrangement device 5 having such a configuration will be described.

  As shown in FIG. 5, when the conductor-formed sheet 21 a coated with the conductive adhesive 18 reaches the arrangement device 5, the IC chip 20 that is then lifted from the UV foam release sheet 11 a is removed from the index table 30. It is adsorbed by the adsorbing pickup nozzle 31 that has descended. As described above, at this time, the IC chip 20 supplied from the IC chip supply means 4 has a circuit surface, that is, a surface on the electrode 20b side, and the suction pickup nozzle 31 is provided on the electrode 20b side of the IC chip. The surface opposite to the applied surface is adsorbed (FIG. 5).

  Thereafter, the suction pickup nozzle 31 is raised and the index table 30 is rotated, so that the IC chip 20 sucked by the suction pickup nozzle 31 is transferred to the conductor-formed sheet 21a side.

  At this time, based on the image from the CCD camera 49 (FIG. 3), the IC chip 20 sucked by the suction pickup nozzle 31 is inspected. The inspection here is for defects in appearance such as chipping or cracking of the IC chip 20. Here, the IC chip 20 determined to be abnormal is not placed on the conductor-formed sheet 21a.

  The IC chip 20 that has been determined to be normal in the inspection of chipping or cracking is further applied on the conductor-formed sheet 21a on the basis of the image from the CCD camera 49 (the conductive adhesive 18 is applied). Positioning) is performed. The alignment between the IC chip 20 and the conductor-formed sheet 21a on which the IC chip 20 is arranged is based on the image from the CCD camera 49, and the IC chip 20 sucked by the suction pickup nozzle 31 is placed in the suction pickup nozzle 31. The position is adjusted by moving (shifting) relative to the index table 32, or the position is adjusted by moving the suction pickup nozzle 31 relative to the index table 32, or the index table 32 is placed on the conductor-formed sheet 21a. The position adjustment is performed by moving the sheet 21a with respect to the index table 32 and adjusting the position.

  In the present embodiment, an example in which the same CCD camera 49 is used for visual inspection and positioning has been described. However, the present invention is not limited to this, and a dedicated CCD camera may be used.

  When the positioning is completed, the suction pickup nozzle 31 is lowered to place the IC chip 20 on the adhesive application portion 18 of the conductor 22 of the conductor-formed sheet 21a, and the IC chip 20 is conductive on the conductor 22. It is temporarily fixed via the adhesive 18. As described above, the surface facing the conductor-formed sheet 21a is the surface of the IC chip 20 on the electrode 20b side. That is, the suction pickup nozzle 31 does not change the front and back by changing the IC chip 20, in other words, the suction pickup nozzle 31 remains supplied from the IC chip supply means 4 (front and back), and the IC chip 20 is moved. It arrange | positions on the conductor formed sheet 21a. This is because the UV foam release sheet 11a is configured by changing the wafer 12 so that the circuit surface faces the UV foam release sheet 11a, and when the IC chip is placed on the conductor-formed sheet 21a. Both production efficiency and quality can be improved as compared to changing the IC chip each time.

  During the placement of the IC chip 20, the conductor-formed sheet 21a stops moving in the feeding direction for a certain time, for example, 1 to 5 seconds per IC chip. During this stop period, the non-conductive sheet 21 laminated with the continuously supplied conductor 22 is stored in the first accumulator 37 described above.

  Further, as shown in FIG. 3, a second accumulator 38 is installed on the downstream side of the arrangement device 5. While the feeding of the conductor-formed sheet 21a is stopped during the placement, the conductor-formed sheet 21a with the IC chip placed and stored in the second accumulator 38 is fed downstream as required. Go. The second accumulator 38 has the same configuration as the first accumulator 37, and includes a pair of support rollers 38b and 38b and a moving roller 38a that is movable in the vertical direction.

  In addition, when one IC chip 20 is sucked by the suction pickup nozzle 31, the wafer holding unit 13 is moved in the X direction and the Y direction by the XY mobile robot 29 in parallel with the arrangement process, and the next IC chip. 20 comes directly above the opening 15 a of the mask 15. Then, the IC chips 20 are sequentially supplied by the above-described method, and are sequentially adsorbed by the adsorption pick nozzle 31. In this way, the IC chips 20 are sequentially arranged (mounted) on the conductor-formed sheet 21a.

[Fixing IC chip 20]
Next, the fixing process of the IC chip 20 will be described with reference to FIG.

  On the downstream side of the second accumulator 38, a thermocompression bonding machine (means for fixing the IC chip) 26 extending long along the flow direction is provided. The thermocompression bonding machine 26 pressurizes the plurality of IC chips 20 toward the conductor-formed sheet 21a side for a certain period of time while being heated. In this case, the heating temperature is 150 ° C. to 250 ° C., the pressurizing time is several seconds to several tens of seconds, and the number of IC chips to be pressed at one time is about 10 to 100.

  In this way, the flat electrode 20b of the IC chip 20 can be securely bonded and fixed to the conductor 22 of the conductor-formed sheet 21a via the anisotropic conductive adhesive 18. At this time, the flat electrode 20b is reliably electrically connected to the conductor 22 via the conductive particles.

  According to the present embodiment, as described above, the non-conductor sheet 21, the pair of conductors 22 provided on the non-conductor sheet 21 and extending in a strip shape, and a large number of ICs on the pair of conductors 22 The IC tag-attached sheet 1 having the chip 20 is produced.

  The conductor-formed sheet 21a stops moving in the feed direction while being pressed by the thermocompression bonding machine 26. During this stop period, the conductor-formed sheet 21a on which the IC chip has been placed, which is supplied from the placement device 5, is stored in the second accumulator 38 described above.

  Further, as shown in FIG. 3, a third accumulator 39 is installed downstream of the thermocompression bonding machine 26. While the IC chip 20 is being fixed, while the feeding of the conductor-formed sheet 21a on which the IC chip has been arranged is stopped, the IC tag-attached sheet 1 stored in the third accumulator 39 is downstream as necessary. It goes out to the side. The third accumulator 39 has the same configuration as the first accumulator 37 and the second accumulator 38, and has a pair of support rollers 39b and 39b and a movable roller 39a that is movable in the vertical direction. doing.

  In addition, you may enable it to reciprocate the thermocompression bonding machine 26 mentioned above along the feed direction. In this case, the thermocompression bonding machine 26 advances in the feeding direction while heating and pressing the IC chip 20 toward the conductor-formed sheet 21a, so that the movement of the conductor-formed sheet 21a in the feeding direction is not stopped. Get better. Thereby, the accumulators 38 and 39 can be omitted, or the accumulation amount in the accumulators 38 and 39 can be reduced.

  Further, a thermocompression bonding machine (IC chip fixing means) 27 as shown in FIG. 8 may be used. FIG. 8 is a side view showing a thermocompression bonding machine 27 as a modification of the fixing method of the IC chip 20. In FIG. 8, the conductor-formed sheet 21 a on which the IC chip is arranged is sent from the left side to the right side in FIG. 8. The thermocompression bonding machine 27 includes a pair of annular belts 27a disposed with a conductor-formed sheet 21a having an IC chip disposed thereon, a driving roller 27b that supports and drives each annular belt 27a, and an inside of the annular belt 27a. And a pair of pressing members 27c that press the annular belt 27a toward the conductor-formed sheet 21a on which the IC chip is arranged. Of these, at least one of the pair of pressing members 27c has a heating mechanism. In the thermocompression bonding machine 27, the driving roller 27b drives the annular belt 27a at the same feed speed as the conductor-formed sheet 21a. When the conductor-formed sheet 21a with the IC chip disposed between the annular belts 27a is fed between the pressing members 27c, the IC chip 20 is pressed while being heated toward the conductor-formed sheet 21a. Accordingly, the IC-tagged sheet 1 can be manufactured by sequentially fixing the IC chip 20 to the conductor-formed sheet 21a without stopping the movement of the conductor-formed sheet 21a in the feeding direction. In this thermocompression bonding machine 27, both ends in the feeding direction of the pressing member 27a are chamfered so that the conductor-formed sheet 21a on which the IC chip is arranged can be guided between the pressing members 27c without being damaged. It is arcuate in side view (FIG. 8).

  Furthermore, in the present embodiment, the IC chip 20 is heated and pressed by the thermocompression bonding machines 26 and 27 and pressed toward the conductor 22 to fix the IC chip 20 on the conductor 22 by thermocompression bonding. Of course, this assumes that the adhesive for fixing the IC chip 20 to the conductor 22 is made of a thermosetting resin, and is not limited to such an embodiment. Depending on the type of the adhesive 18, the IC chip 20 can be pressure-bonded and fixed onto the conductor 22 simply by pressure bonding without heating.

  Furthermore, when a non-conductive adhesive is used as the adhesive, an ultrasonic vibrator is used as a means for fixing the IC chip 20, and ultrasonic vibration is applied to the IC chip 20, thereby making the IC chip 20 a conductor. 22 can be fixed. In this case, the non-conductive adhesive layer is broken or melted, and the electrode 20 b of the IC chip 20 is metal-bonded to the conductor 22. As a result, even if a non-conductive adhesive is applied between the electrode 20b of the IC chip 20 and the conductor 22, the electrical connection between the electrode 20b of the IC chip 20 and the conductor 22 is ensured. Can be made.

[Production and Inspection of IC Tag 10]
Next, a process of manufacturing and inspecting the IC tag 10 will be described with reference to FIGS.

  FIG. 7 is a perspective view showing a method of cutting the conductor 22 of the IC tag-attached sheet 1 and an inspection method of the IC tag 20. In FIG. 7, the IC tagged sheet 1 is sent from the left side to the right side.

  As shown in FIG. 3, a pair of non-conductive blades (means for creating an IC tag) 46 is installed on the downstream side of the third accumulator 39. The pair of nonconductive blades 46 are separated along the feed direction and extend along the width direction orthogonal to the feed direction. The pair of non-conductive blades 46 are movable in the vertical direction.

  The IC tag-attached sheet 1 sent immediately below the non-conductive blade 46 stops moving in the feed direction. During this stop period, the IC tagged sheet 1 supplied from the fixing means is stored in the third accumulator 39 described above.

  Then, the pair of non-conductive blades 46 descend and cut into the IC tag-attached sheet 1 so as to sandwich the IC chip 20. At this time, as shown in FIG. 7, the non-conductive blade 46 does not cut the entire thickness of the IC tag-attached sheet 1, but only cuts the conductor 22 for each IC chip 20 and divides it. The sheet 21 is not divided. Thereby, the IC tag 10 including the pair of enlarged electrodes 9 formed from the pair of conductors 22 and the IC chip 20 connected to the enlarged electrodes 9 is supported by one non-conductor sheet 21 extending in a band shape. In this state, the non-conductive sheet 21 is successively and sequentially produced along the feeding direction. Therefore, thereafter, the IC tag-attached sheet 1 includes a non-conductive sheet 21 extending in a strip shape, and a plurality of pairs of conductors 22 provided on the non-conductive sheet 21 and arranged along the longitudinal direction of the non-conductive sheet 21. And an IC chip 20 disposed on each pair of conductors 22. In addition, in other words, thereafter, the IC tag-attached sheet is provided on the non-conductive sheet 21 extending in a strip shape and the non-conductive sheet 21, and is arranged along the longitudinal direction of the non-conductive sheet 21. A pair of conductors 22 and an IC chip 20 disposed on each pair of conductors 22, and extends across the entire width of each pair of conductors 22 between each IC chip 20. Then, a cut 24b is formed so as to enter from the surface of the conductor 22 to the non-conductor sheet 21.

  Further, the inspection electrode (inspection device) 43 extends to the enlarged electrode 9 of the IC tag 10 sandwiched between the pair of non-conductive blades 46 with the pair of non-conductive blades 46 cut into the sheet 1 with IC tag. A pair of inspection electrodes 44 are electrically connected to inspect the quality of the IC tag 10. At this time, the cutting edges of the pair of nonconductive blades 46 are in contact with the nonconductive sheet 22. Therefore, the enlarged electrode 9 sandwiched between the pair of non-conductive blades 46 is reliably insulated from the enlarged electrode 9 or the conductor 22 adjacent along the feeding direction. Thereby, the IC tags 10 supported by one non-conductive sheet 21 extending in a band shape can be reliably inspected one by one.

  As the inspection unit 43, for example, a reader / writer, an impedance analyzer, or a resistance value measuring device can be used.

  When a reader / writer is used as the inspecting means 43, it is possible to inspect whether or not data can be transmitted / received while in contact with the IC tag 10. At this time, information can be written to the IC chip 20 using a reader / writer in accordance with the quality confirmation of the IC tag 10. The information to be written is, for example, a quality check result or product information of the IC chip 20 or the final IC tag 10. Among these, as product information, a serial number, a manufacturing date, a product name, a manufacturer, delivery destination information, etc. can be considered.

  Further, when an impedance analyzer is used as the inspection means 43, the sensitivity of the IC chip 20 to radio waves of various frequencies can be measured, and a deviation in resonance frequency can be confirmed. Further, the electric capacity of the capacitor in the IC chip 20, the state of the memory, and the like can be inspected.

  Furthermore, when a resistance value measuring instrument is used as the inspection means 43, the electrical resistance value between the enlarged electrodes 9 is measured, and the abnormal electrical resistance of the IC chip 20 or each pair of enlarged electrodes 9 is not electrically connected to each other. Can be inspected.

  Further, as shown in FIG. 7, the NG mark 48 is marked by an inkjet (not shown) or the like on the IC tag 10 determined as a defective product as a result of the inspection. In this embodiment, the NG mark 48 is attached on the enlarged electrode 9 of the IC tag. However, the NG mark 48 is not limited to this, and may be attached on the IC chip 20 or attached to other portions. May be. Thereby, even if the defective IC tag 10 is included in the sheet 1 with IC tag, it can be surely selected in a subsequent process.

  When the inspection is finished, the inspection electrode 44 is separated from the IC tag 10 and the non-conductive blade 46 is raised, and the IC tag-attached sheet 1 is equivalent to one IC tag, that is, the distance between the pair of non-conductive blades 46. Only sent. As shown in FIG. 7, the IC tag-attached sheet 1 sent downstream from the inspection process is formed with a cut 24 b along the width direction for dividing the conductor 22.

  When the IC tag-attached sheet 1 is fed by one IC tag, the pair of non-conductive blades 46 descends again toward the IC tag-attached sheet 1. In this case, the non-conductive blade 46 disposed on the downstream side (right side in FIG. 7) enters the cut 24b formed by the upstream non-conductive blade 46 by the immediately preceding lowering. On the other hand, the upstream non-conductive blade 46 cuts the conductor 22 to form a new cut 24b as described above, and the IC tag 10 is produced between the pair of non-conductive blades 46. The pair of non-conductive blades 46 enters the IC tag-attached sheet 1 with the IC tag 10 interposed therebetween, and the inspection is performed in a state where the IC tag 10 is insulated from the adjacent conductor 22 or the enlarged electrode 9.

  In this way, while intermittently feeding the IC tag-attached sheet 1, a large number of IC tags 10 are sequentially produced on a single non-conductive sheet 21 extending in a strip shape, and the produced IC tags 10 are sequentially produced. Inspection will be conducted.

  Further, in the present embodiment, the IC tag-attached sheet 1 produced and inspected in this way is further laminated with a protective film 23 as shown in FIG. 3, and then wound around the winding core 1a.

  As described above, the protective film 23 is laminated to prevent the IC chip 20 from being chipped or displaced on the conductor 22 (enlarged electrode 9). It is a protection process. As described above, the protection process for the IC chip 20 may be performed by resin-sealing the IC chip 20 instead of stacking the protective film 23 on the IC chip.

  Furthermore, the protection processing of the IC chip 20 is performed by arranging a pair of sheets having a thickness equal to or greater than the thickness of the IC chip 20 and extending in a strip shape on the IC tag sheet 1 on both sides of the IC chip 20. Alternatively, the winding may be performed by winding the sheet with the IC tag 1 on the winding core 1a. Such a sheet can prevent the wound IC chip 20 of the wound IC tag sheet 1 from being displaced on the conductor 22 (enlarged electrode 9) or being stressed. Furthermore, the wound form of the wound IC tag sheet 1 is stabilized, and rewinding can be prevented.

  Further, the IC tag 10 may be manufactured in a series of flows by cutting the sheet 1 with the IC tag along the cuts 24b without winding the sheet 1 with the IC tag.

  As described above, according to the present embodiment, the conductor-formed sheet 21a is produced by stacking the conductor 22 on the non-conductor sheet 21, and providing the slit 22a with the cutter 42 on the conductor 22. Has been. Therefore, the arrangement interval between the pair of conductors 22 is constant, and the IC chip 20 can be easily positioned when the IC chip is arranged thereafter.

  Further, since an anisotropic conductive adhesive is used as the conductive adhesive 18, even if the conductive adhesive 18 is applied so as to straddle both the conductors 22 with the slit 24 a interposed therebetween, the pair of conductors 22. Is not short-circuited via the conductive adhesive 18. For this reason, the conductive adhesive 18 can be applied easily and quickly.

  Further, the UV light irradiation unit 14 irradiates only one IC chip with the UV light from the UV lamp 19 through the mask 15, and weakens the adhesive force to the UV foaming release sheet 11a with respect to only one IC chip. Yes. For this reason, only one IC chip 20 can be picked up by the suction pickup nozzle 31 without performing a special treatment such as pushing up the UV foam release sheet 11a from below. Therefore, the IC chips 20 can be supplied one by one quickly and accurately without breaking the IC chips 20.

  Furthermore, since the circuit surface of the wafer 12 of the release sheet-attached wafer 11 faces downward, that is, the UV foam release sheet 11a side, the IC chip 20 picked up by the suction pickup nozzle 31 is further held and turned upside down. It can be placed on the conductor 22 without any change. A large number of suction pickup nozzles 31 are provided around the index table 30. For this reason, the IC chip 20 can be quickly and continuously disposed on the conductor-formed sheet 21.

  Further, a plurality of IC chips 20 are collectively fixed to the conductor-formed sheet 21a by a thermocompression bonding machine 26, and a second accumulator 38 and a third accumulator 39 are provided before and after the thermocompression bonding machine 26. Has been placed. As a result, the IC chip 20 can be efficiently and reliably fixed to the conductor-formed sheet 21a, and the electrode 20b of the IC chip 20 and the conductor 22 can be reliably electrically connected. .

  Further, by cutting the conductor 22 using the non-conductive blade 46 extending along the width direction to produce the IC tag 10, the IC tag 10 is supported by the conductor 22 extending in a band shape, Ten electrical characteristics can be tested. Thereby, the test | inspection of the conductor 22 can be performed continuously and efficiently. In addition, when the defective product continues, the production line 2 can be stopped and the respective processes can be inspected, so that it is possible to prevent a large number of defective products from being manufactured.

  Further, the inspection is performed in a state where the pair of non-conductive blades 46 have entered the conductor 22. Therefore, the expansion electrode 9 of the IC tag 10 to be inspected, and the expansion electrode 9 of the adjacent IC tag 10 and the conductor 22 of the sheet 1 with IC tag come into contact with each other due to the expansion and contraction of the sheet 1 with IC tag. There is no end. For this reason, the IC tag 10 to be inspected can be accurately inspected while the IC tag 10 to be inspected is reliably insulated from the other IC tags 10 and the sheet 1 with IC tag.

  From these things, the sheet | seat 1 with an IC tag can be manufactured accurately and efficiently. In addition, a large number of IC tags 10 supported on a non-conductive sheet 21 extending in a strip shape are manufactured, and quality inspection of the IC tag 10 having the IC chip 20 and the enlarged electrode 9 is performed. It can be done in the state. For this reason, since each IC tag 10 can be efficiently inspected, the inspection process can be speeded up. As a result, the inspected sheet 1 with IC tag can be manufactured at low cost.

[Modification of Preparation and Supply of IC Chip 20]
In the present embodiment, a wafer holding plate (wafer holding unit) 13 that holds the release sheet-attached wafer 11 and a UV light irradiation unit 14 that irradiates UV light 16 corresponding to one IC chip 20 are provided. Although the example in which the IC chips 20 are supplied one by one by using the IC chip supply device 4 is shown, the present invention is not limited to this.

  Hereinafter, modified examples of the IC chip supply method will be described with reference to FIGS. FIG. 9 is a perspective view showing a modification of the supply method of the IC chip 20.

  First, the IC chip supply device 50 will be described.

  The IC chip supply means (device) 50 (also referred to as a parts feeder) includes an accommodating portion main body 51 for accommodating the IC chip 20, and a passage 53 connected to the accommodating portion main body 51 for aligning the IC chips 20. In addition, a vibration device 52 for applying vibration in a predetermined direction to the housing main body 51 and the passage 53 is provided.

  Although the accommodating part main body 51 is substantially circular shape in FIG. 9, it may be rectangular. Further, a groove 54 is formed in the accommodating portion main body 51 along the vibration direction of the vibration device 52. For example, when the accommodating portion main body 51 is circular, the groove 54 is provided so as to draw a circle from the center of the accommodating portion main body 51 in the outer circumferential direction (in a spiral shape). The groove 54 is provided for aligning the IC chip 20 by vibration. In addition, in the housing portion main body 51, for example, a large number of IC chips 20 peeled together from the UV foam release sheet 11a are housed. Here, “many” means a plurality of two or more, preferably several tens or several hundreds in consideration of production efficiency (FIG. 9).

  For example, a plurality of vibration devices 52 are arranged in a predetermined portion of the housing main body 51 so as to vibrate in a circle from the center of the housing main body 51 along the groove 54 in the outer circumferential direction. In this way, since the IC chip 20 also moves while vibrating in the vibrating direction, the overlapping IC chips 20 are scattered during the movement. Further, since the groove 54 is provided in the vibration direction, the IC chip 20 moves while being fitted in the groove 54.

  Next, the passage 53 will be described. FIG. 10 is a sectional view showing a passage 53 as a modification of the method of supplying the IC chip 20. As shown in FIGS. 9 and 10, the passage 53 is disposed above the support portion 53a, a support portion 53a that supports the IC chip 20 from below, a side portion 53c that is disposed on both sides of the support portion 53a, and the support portion 53a. It has an upper surface portion 53b and a delivery base 53d that is disposed at the tip of the support portion 53a and delivers the IC chip 20 to the suction pickup nozzle 31. In FIG. 9, the upper surface portion 53b and the side portion 53c are not shown.

  The support portion 53a, the side portion 53c, and the upper surface portion 53b are fixed to each other. These support portion 53a, side portion 53c, and upper surface portion 53b are connected to the vibration device 52 (FIG. 9), and are vibrated in the longitudinal direction (the direction of the thick arrow in FIG. 10) by the vibration device 52. ing. Thereby, the IC chip 20 on the support portion 53a is sequentially moved to the tip side.

  A first suction mechanism 53e is provided in the vicinity of the tip of the support portion 53a. The first suction mechanism 53e can suck and fix the IC chip 20 disposed on the first suction mechanism 53e at that position.

  The delivery table 53d is cut off from the support portion 53a, the side portion 53c, and the upper surface portion 53b, and is fixed without being vibrated by the vibration device 52. As shown in FIG. 10, the side portion 53c extends to the delivery table 53d, but is not connected to the delivery table 53d and can be slid with respect to the delivery table 53d by the vibration mechanism 52. It has become.

  Further, the length of the lower surface of the delivery table 53d is slightly shorter than the length of about one IC chip 20, and a second suction mechanism 53f for adsorbing the IC chip 20 is provided at the approximate center of the lower surface. ing. Further, a third suction mechanism 53g that sucks the IC chip 20 from the side surface is provided on the side surface on the front end side of the delivery table 53d. Similar to the first suction mechanism 53e, the second suction mechanism 53f and the third suction mechanism 53g can suck and fix the IC chip 20 disposed above each of the second suction mechanism 53f and the third suction mechanism 53g.

  The interval between the side portions 53c is wide enough to allow one IC chip 20 to pass through. Therefore, when the IC chip 20 to be used has a rectangular shape, the direction of the IC chip 20 can be adjusted by the passage 53, and the IC chips 20 can be aligned in a row by restricting the lateral displacement. it can. The passage 53 is provided with a groove 54 for aligning the IC chips 20. Moreover, it is preferable that this groove | channel 54 is connected with the groove | channel 54 provided in the accommodating part main body 51, as shown in FIG.

  In the middle of the passage 53, an inspection device 56 for inspecting the front and back surfaces and the orientation of the IC chip 20 is provided. The inspection of the front and back and the orientation of the IC chip 20 is whether or not the surface of the electrode 20b is directed downward and whether or not the position of the electrode 20b is appropriate. The inspection device 56 includes a photographing device 57 that photographs the IC chip 20 and a control device 58 that determines the front and back and the orientation of the IC chip 20 from the photographed video. As the photographing device 57, a CCD camera, a photoelectric sensor or the like is used. Further, on the side of the passage 53, an IC chip 20 (hereinafter, referred to as a front-back improper IC chip), which is determined to be abnormal by the control device 58 in either of the front and back sides, is referred to as an opening 53h (see FIG. An extrusion device 59 for extruding from 10) is provided.

  Next, a method for supplying the IC chip 20 using such a parts feeder 50 will be described.

  First, a large number of IC chips 20 peeled together from the UV foam release sheet 11 a are put into the housing part main body 51. Next, the vibration device 52 applies vibration to the housing main body 51 and the passage 53 in a predetermined direction. As a result, the IC chips 20 in the housing main body 51 are aligned and moved to the passage 53. The IC chip 20 on the passage 53 is aligned by the side portion 53c and is moved to the tip side in a state of being aligned in a line.

  When a sensor (not shown) senses that the IC chip 20 has reached the delivery table 53d, the first suction mechanism 53e, the second suction mechanism 53f, and the third suction mechanism 53g start suction. Therefore, one IC chip 20 is sucked and fixed on the delivery table 53d, and one adjacent IC chip 20 is sucked and fixed at the tip of the support portion 53a. Further, since the upper surface portion 53b is provided on the support portion 53a, even if the passage 53 is continuously vibrated by the vibration mechanism 52, another IC chip is mounted on the fixed IC chip 20. It is possible to prevent the IC chip 20 that has been climbed up from dropping from the passage 53.

  Thereafter, the suction pickup nozzle 31 is lowered to suck the IC chip 20 fixed on the delivery table 53d. The transfer table 53d is fixed without vibration, and the IC chip 20 is positioned on the transfer table 53d and adsorbed and fixed to the transfer table 53d by the side portion 53c and the side surface on the front end side of the transfer table 53d. For this reason, the suction pickup nozzle 31 can accurately suck a desired portion of the IC chip 20. Further, as described above, since the other IC chip 20 is prevented from riding on the IC chip 20 to be sucked, the suction pickup nozzle 31 can smoothly suck the IC chip 20.

  When the suction pickup nozzle 31 sucks the IC chip 53 on the delivery table 53d, the suction of the second suction mechanism 53f and the third suction mechanism 53g is stopped. Thereafter, the suction pickup nozzle 31 rises in a state where the IC chip 20 is sucked, and is disposed on the conductor-formed sheet 21a as described above. In this case, since the position of the IC chip 20 with respect to the suction pickup nozzle 31 is accurately positioned as described above, the IC chip 20 can be accurately disposed on the conductor 12.

  When the suction pickup nozzle 31 is raised, the suction by the first suction mechanism 53e is stopped, and the IC chip 20 resumes moving toward the delivery table 53d. In this modification, the IC chips 20 are sequentially supplied one by one as described above.

  In addition, while the IC chips 20 are aligned on the passage 53, the aligned IC chips 20 are photographed by the photographing device 57. The control device 58 determines whether the front and back sides and the orientation of the IC chip 20 are normal based on the video imaged by the imaging device 57. As a result of the determination, the IC chips 20 whose front and back and orientation are determined to be normal proceed along the passage 53 as described above and are supplied one by one. On the other hand, when an IC chip with an abnormal front or back and orientation is found, the control device 58 drives the extrusion device 59. Thus, the push-out device 59 pushes the defective IC chip 20 facing front and back from the row of the IC chips 20 aligned on the passage 53 to the outside of the passage 53 and removes it from the passage 53. The removed orientation defective IC chip 20 is returned again to the housing main body 51, aligned again, and sent to the passage 53.

  Further, in the placement step, the front and back and the orientation of the IC chip 20 sucked by the suction pickup nozzle 31 can be examined again based on the image from the CCD camera 49 of the placement device 5 described above. As a result of this investigation, the front and back defective IC chips that are determined to be abnormal in either front or back direction are returned to the housing main body 51 again, aligned again, and sent to the passage 53. It is preferable.

  Also in this modified example, the IC chips 20 can be accurately supplied one by one.

[Modification of Preparation of Conductor Formed Sheet 21a]
Furthermore, in this Embodiment, the conductor 22 sheet | seat 21a was prepared by laminating | stacking the conductor 22 on the nonconductor sheet | seat 21, and providing this conductor 22 with the slit 24a. In this example, the slit 24a is provided by dividing the conductor 22 by the cutter 42, but the present invention is not limited to this.

  When the conductor 22 is divided by the cutter 42, the slit 24a has a V-shaped cross section as shown in FIG. 12, and there is an advantage that chips are not generated and that the configuration of the apparatus can be simplified. As shown in FIG. 13 (a), the finally obtained IC tag 10a is provided on the non-conductive sheet 21 and the non-conductive sheet 21, and a pair of enlargements separated from each other with the slit 24a interposed therebetween. The electrodes 9 and 9 and the IC chip 20 electrically connected to the enlarged electrode 9 are provided, and the slit 24a has a substantially V-shaped cross section.

  However, if the conductor 22 is divided by the cutter 42, as shown in FIG. 12, the conductor 22 and the non-conductor sheet 21 are slightly raised (about 10 μm) around the slit 24a. When the IC chip 20 is disposed (mounted) on the conductor-formed sheet 21a and the IC chip 20 is pressed toward the conductor-formed sheet 21a by the fixing means, depending on the shape or size of the IC chip 20 There is a problem that the IC chip 20 is not stable on the conductor 22. Further, if the IC chip 20 is pressed too strongly against the conductor 22 or if the arrangement position (mounting position) of the IC chip 20 on the conductor 22 is not accurate, the raised portion 21c ( 12) is pressed, and even a problem that the swelled portion 21c of each conductor 22 approaches the slit 24a side and contacts each other may occur (FIG. 13B). Furthermore, since the pair of conductors 22 are not brought into contact with each other or because the distance between the electrodes 20b of the IC chip 20 used is long, it may be necessary to widen the width of the slit 24a (for example, up to about 250 μm). is there. When such a large slit 24a is formed by the cutter 42, it is necessary to increase the cutting amount of the cutter 42, and accordingly, the thickness of the non-conductive sheet 21 must be increased (for example, , 50 μm or more).

  In consideration of these advantages and disadvantages when the slit 24a is formed by the cutter 42, the method for forming the slit 24a and the method for manufacturing the conductor-formed sheet 21a itself may be changed as necessary.

  Hereinafter, modified examples of the method for forming the slit 24a or the method for producing the conductor-formed sheet 21a will be described with reference to FIGS. 11 and 14 to 20. In addition, the same code | symbol is attached | subjected to the part same as embodiment mentioned above and its modification, and the detailed description which overlaps is abbreviate | omitted.

(First modification)
FIG. 14 shows a modification of the method for forming the slit 24a. In FIG. 14, the lower left side is the upstream side, and the conductor 22 is sent from the lower left to the upper right. FIG. 15 shows a cross section of the conductor-formed sheet 21a produced according to this modification, and FIG. 16 shows a cross section of an IC tag 10c obtained using this modification.

  As shown in FIG. 14, in this modification, the slit forming device 60 a includes a pair of blades 62, a scraper 64 disposed on the downstream side of the blades 62, and a waste collecting unit (not shown). Each blade 62 is formed of a disk-shaped rotary cutter, and is supported by a blade support portion (not shown) so as to be rotatable about an axis 62a parallel to the width direction of the supplied conductor 22. The pair of blades 62 are separated from each other by the width of the slit 24 a to be formed along the width direction of the conductor 22. The scraper 64 is a position corresponding to the distance between the pair of blades 62 in the width direction of the conductor 22 and is displaced to the downstream side along the feeding direction of the conductor 22 (not shown). Is supported by

  The non-conductive sheet 21 laminated with the conductor 22 is fed toward the slit forming device 60a, and the pair of blades 62 are cut from the conductor 22 side. The cutting of the blade 62 at this time is a half cut, and the cutting edges of the pair of blades 62 are cut until reaching the non-conductive sheet 21, but do not divide through the non-conductive sheet 21 (FIG. 15). As the non-conductor sheet 21 laminated with the conductor 22 is fed, the pair of blades 62 rotate around the shaft 62a while feeding the conductor 22 supported on the non-conductor sheet 21 in the feeding direction. And is divided into three (FIG. 14). Thereafter, the scraper 64 disposed on the downstream side of the pair of blades 62 scrapes the conductor portion (also referred to as a residue) 22c of the conductor 22 between the pair of blades 62 from the non-conductor sheet 21. As a result, the slit 24a is formed (FIG. 14). In this case, removal by the scraper 64 may be performed by peeling only the conductor portion 22c from the non-conductor sheet 21, or scraping the conductor portion 22c together with a part of the non-conductor sheet 21 as shown in FIG. You may make it take.

  Note that the peeled conductor portion 22c is collected by a waste collecting portion (not shown). Further, the cutting amounts of the pair of blades 62 and the scraper 64 are controlled by the blade support portion and the scraper support portion, respectively.

  As shown in FIG. 15, the slit 24a of the conductor-formed sheet 21a produced in this way has a pair of cuts 24c extending to the non-conductive sheet 21, and a rectangular shape having a substantially rectangular cross section provided between the cuts. 24d, and the conductor 22 and the non-conductive sheet 21 do not rise significantly around the slit 24a (even if it rises, it is 5 μm or less). Then, as shown in FIG. 16, the IC tag 10c finally obtained by using this method is provided on the non-conductive sheet 21 and the non-conductive sheet 21, and is separated from each other across the slit 24a. The enlarged electrodes 9 and 9 and the IC chip 20 electrically connected to the enlarged electrode 9 are provided, and a slit 24a is provided between the notches 24c and 24c. And a rectangular portion 24d having a substantially rectangular cross section. As shown in FIG. 16, in such an IC tag 10c, the IC chip 20 can be stably disposed on the conductor 22, and a pair of conductors 22 ( It is possible to prevent conduction between the enlarged electrodes 9). That is, the high-quality IC tag 10c can be stably manufactured regardless of the size and shape of the IC chip 20.

  Further, since it is possible to prevent electrical conduction between the pair of conductors 22 (enlarged electrodes 9), there is no need to make the slit 24a large. Further, even if it is necessary to increase the width of the slit 24a from the size of the IC chip 20 to be used, the control is performed so as to reduce the cutting amount of the pair of blades 62 and the scraper 64 into the non-conductive sheet 21. Thus, only the width of the slit 24a can be increased without increasing the cut amount. Therefore, the thickness of the non-conductive sheet 21 can be reduced. Thereby, material cost can be reduced and the manufacturing cost of the IC tag 10c per piece can be made cheap.

  In addition, in this modification, although the example which comprised a pair of blade 62 from the rotary cutter was shown, it is not restricted as long as a conductor can be cut | divided linearly, For example, it comprises from a pair of flat cutters. Also good.

(Second modification)
Next, FIGS. 17 and 18 show a second modification of the method for forming the slit 24a. FIG. 17 is a perspective view showing a second modification of the method for forming the slit 24a, and FIG. 18 is a diagram showing a conductor-formed sheet produced by the second modification and the second modification of the method for forming the slit 24a. It is sectional drawing which shows 21a.

  As shown in FIGS. 17 and 18, in this modification, the slit forming device 60b includes a lathe cutting tool 66 and a conductor 22 of a non-conductive sheet 21 in which the conductor 22 is laminated. It has a tool support part (not shown) held on the side, and a waste collecting part (not shown). The material of the blade of the cutting tool 66 is not particularly limited, and for example, diamond can be used.

  When the non-conductive sheet 21 laminated with the conductor 22 is fed toward the slit forming apparatus 60b, the cutting tool 66 cuts from the conductor 22 side. The cutting tool 66 is half-cut at this time, and the cutting edge of the cutting tool 66 is cut until it reaches the non-conductive sheet 21, but does not divide through the non-conductive sheet 21 (FIG. 18). Then, as the non-conductive sheet 21 laminated with the conductor 22 is fed, a central portion (also referred to as a cutting residue) 22d in the width direction of the conductor 22 is scraped by the cutting tool 66, and a slit 24a is formed. Go (Figure 18). Note that the scraped cutting waste 22d is collected by a waste collecting unit (not shown). Further, the cutting amount of the cutting tool 66 is controlled by the tool support part.

  According to such a modification, the same operation effect as the 1st modification of the formation method of slit 24a mentioned above can be produced. That is, since the conductor 22 and the non-conductor sheet 21 do not rise significantly around the slit 24a, the IC chip 20 can be stably disposed on the conductor 22, and the IC tag 10 can be manufactured. It is possible to prevent conduction between the pair of conductors 22 (enlarged electrodes 9) during or during use. Further, the thickness of the non-conductive sheet 21 can be reduced, thereby reducing the material cost and reducing the manufacturing cost of the IC tag 10 per unit.

  As shown in FIG. 13A, the finally obtained IC tag 10a is provided with a non-conductive sheet 21 and a pair of enlargements provided on the non-conductive sheet 21 and spaced apart from each other with the slit 24a interposed therebetween. The electrodes 9 and 9 and the IC chip 20 electrically connected to the enlarged electrode 9 are provided, and the slit 24a has a substantially V-shaped cross section.

(Third Modification)
Next, FIGS. 19 and 20 show a third modification of the method for forming the slit 24a. 19 is a perspective view showing a third modification of the method for forming the slit 24a, and FIG. 20 is a perspective view showing a third modification of the method for forming the slit 24a.

  As shown in FIGS. 19 and 20, in this modification, the slit forming device 60c is a roller 68 that is rotatably held around an axis parallel to the width direction of the non-conductive pair sheet 21, and has an outer peripheral surface. A roller 68 having a circumferential blade 68a at a substantially central portion thereof, and a receiver 69 disposed to face the roller 68. In this modification, the receiving body 69 is composed of a receiving roller that is rotatable about an axis parallel to the rotation axis of the roller 68.

  In this modification, the non-conductive sheet 21 in which the conductor 22 is laminated is fed between the roller 68 and the receiver 69. In this case, the conductor 22 faces the roller 68, and the circumferential blade 68a cuts from the conductor 22 side to the non-conductor sheet 21. And the cutting of the circumferential blade 68 is a half cut, and the cutting edge of the circumferential blade 68a is cut until it reaches the non-conductive sheet 21, but does not penetrate through the non-conductive sheet 21 (FIG. 20). In this way, the slit 24a is formed in the conductor 22 by cutting the circumferential blade 68a.

  At this time, as described above, the conductor 22 and the non-conductor sheet 21 are about to rise around the slit 24a. However, the periphery of the portion (slit 24a) divided by the circumferential blade 68 is sandwiched between the roller 68 and the receiver 69 and the non-conductive sheet 21 laminated with the conductor 22 is sandwiched between the roller 68 and the receiver 69. And the formation of the raised portion 21c (FIG. 12) is restricted.

  As shown in FIG. 13A, the finally obtained IC tag 10a is provided on the non-conductive sheet 21 and the non-conductive sheet 21, and a pair of enlargements that are separated from each other with the slit 24a interposed therebetween. The electrodes 9 and 9 and the IC chip 20 electrically connected to the enlarged electrode 9 are provided, and the slit 24a has a substantially V-shaped cross section.

  According to such a modification, the same operational effects as those of the first and second modifications of the method for forming the slit 24a described above can be achieved. That is, since the conductor 22 and the non-conductor sheet 21 do not rise significantly around the slit 24a, the IC chip 20 can be stably disposed on the conductor 22, and the IC tag 10 can be manufactured. It is possible to prevent conduction between the pair of conductors 22 (enlarged electrodes 9) during or during use. Thereby, the thickness of the non-conductor sheet 21 can be reduced, and further, the material cost can be reduced and the manufacturing cost of the IC tag 10 per unit can be reduced.

  Further, according to this modification, the conductor 22 is only cut and divided, and no residue is generated. That is, the waste collection part in the first and second modifications can be dispensed with.

  In addition, in this modification, although the example which comprised the receiving body 69 from the roller was shown, as long as the non-conductor sheet | seat 21 on which the conductor 22 was laminated | stacked between the rollers 68 can be pressed, it is especially limited. For example, the receiving body 69 may be constituted by a receiving table such as a surface plate.

(Fourth modification)
Furthermore, in the present embodiment, the conductor 22 is laminated on the non-conductor sheet 21, and the slits 24a are provided on the conductor 22 with a cutter 42 or the like, so that the non-conductor sheet 21 extending in a belt shape and the non-conductor Although the example which prepares the conductor formed sheet 21a which has the pair of conductors 22 provided on the conductor sheet 21 and extending in the feeding direction of the non-conductor sheet 21 and separated from each other is shown, it is not limited to this. . You may laminate | stack the conductor 22 extended in a pair of strip | belt shape previously divided | segmented on the non-conductor sheet | seat 21a.

(Fifth modification)
Further, by printing conductive ink on the non-conductive sheet 21 with a printing machine, etching the metal foil with an etching device, or transferring the metal foil to the non-conductive sheet 21 with a transfer device. Alternatively, the conductor-formed sheet 21a may be produced. In this case, as shown in FIG. 11, a plurality of pairs of conductors 22 a that are separated in the width direction of the non-conductive sheet 21 extending in a band shape and are continuously arranged in the feeding direction of the non-conductive sheet 21 are arranged. You can also.

  Conductor formation having such a non-conductive sheet 21 extending in a strip shape and a large number of pairs of conductors 22a provided on the non-conductive sheet 21 and disposed along the feeding direction of the non-conductive sheet 21 You may produce and test | inspect the sheet | seat 1 with an IC tag by the method mentioned above using the sheet | seat 21a. In this case, by sequentially fixing the IC tag 10 to the conductor 22a, the IC tag 10 including the pair of enlarged electrodes 9 and the IC chip 20 is formed on one non-conductive sheet 21 extending in a strip shape. A large number of IC tag-attached sheets 1 produced in succession along the feeding direction of the non-conductive sheet 21 can be obtained. Therefore, each IC tag 10 can be inspected in the state of the sheet 1 with IC tag without cutting the conductor 22 by cutting into the sheet 1 with IC tag with the nonconductive blade 46.

  In FIG. 11, through-holes 21b provided at equal intervals are formed in the vicinity of the edge in the width direction of the conductor-formed sheet 21a. By engaging the through holes 21b with protrusions provided on rollers or the like when feeding the conductor-formed sheet 21a in the feeding direction, the conductor-formed sheet 21a and the IC tag-attached sheet 1 in the width direction. It is possible to prevent the deviation. In addition, since no slip occurs between the roller or the like and the conductor-formed sheet 21a, the conductor-formed sheet 21a can be advanced in the feeding direction by a predetermined amount. Therefore, the conductor-formed sheet 21a and the IC tag-attached sheet 1 can be positioned in the width direction and the feed direction with reference to the through hole 21b. This makes it possible to arrange the IC chip 20 with high accuracy, perform the above-described inspection with high accuracy, and the like. Naturally, such a through hole 21b can be used not only for the modified example of the conductor-formed sheet 21a shown in FIG. 11, but also for the conductor-formed sheet 21a described with reference to FIGS.

[Modification of IC tag manufacturing method]
Further, in the present embodiment, as means 46 for producing the IC tag, a pair of non-conductive blades 46 extending in the width direction are used to cut the conductor 22 between the IC chips 20 (FIG. 3 and FIG. 3). FIG. 7) The example in which the IC tag 10 is sequentially manufactured on the non-conductive sheet 21 along the feeding direction has been described. Further, in the above-mentioned “[Modification of Preparation of Conductor-Formed Sheet 21a] (Fifth Modification)”, a plurality of pairs of conductors 22 provided along the feeding direction of the non-conductor sheet 21 ( FIG. 11) shows an example in which the IC tags 20 are sequentially arranged and fixed on the non-conductive sheet 21 to sequentially produce the IC tags 10 along the feeding direction. However, the present invention is not particularly limited to these embodiments, and the IC tags 10 may be sequentially formed on the single non-conductive sheet 21 along the feeding direction using another method.

  Hereinafter, a modification of the method for manufacturing the IC tag 10 on one non-conductive sheet 21 will be described with reference to FIGS. 21 to 28, the same reference numerals are given to the same portions as those of the above-described embodiment and the modified example thereof, and the detailed description thereof is omitted.

(First modification)
FIG. 21 is a perspective view showing a modification of the method for producing the IC tag 10 by cutting the conductor 22 of the IC tag-attached sheet 1 for each IC chip 20. In FIG. 21, the left side is the upstream side, and the IC tagged sheet 1 is fed from the left side to the right side.

  In this modification, the means 120 for producing the IC tag includes a moving blade 122 that moves along a width direction orthogonal to the longitudinal direction (feeding direction) of the sheet 1 with IC tag, and a support rail 124 that supports the moving blade 122. And have. The movable blade 122 is supported by the support rail 124 so as to be movable in the vertical direction.

  When using the means 120 for producing such an IC tag, the sheet 1 with the IC tag is fed, and the portion to be cut of the sheet 1 with the IC tag 1 immediately below the moving blade 122, that is, directly below the moving blade 122, When the substantially intermediate portion of the two IC chips 20 arranged adjacent to each other arrives, the IC tag-attached sheet 1 stops moving in the feeding direction. Then, the moving blade 122 descends and cuts into the IC-tagged sheet 1, and then moves along the width direction to cut the conductor 22. As in the case of the non-conductive blade 46 described above, the cutting of the movable blade 122 at this time is not performed for the entire thickness of the sheet 1 with the IC tag, but enters the non-conductive sheet 21 but before it penetrates. Is not reached. Therefore, the movable blade 122 only divides the conductor 22, and the non-conductive sheet 21 is not divided. Thereby, the IC tag 10 including the pair of enlarged electrodes 9 formed from the pair of conductors 22 and the IC chip 20 connected to the enlarged electrodes 9 is one non-conductor extending in a strip shape (elongated shape). It is produced sequentially while being supported on the sheet 21. As shown in FIG. 21, the IC tag-attached sheet 1 that has undergone such a process is provided on the non-conductive sheet 21 extending in a strip shape and the non-conductive sheet 21, and extends along the longitudinal direction of the non-conductive sheet 21. A plurality of pairs of conductors 22 and IC chips 20 respectively disposed on each pair of conductors 22, and the total width of each pair of conductors 22 between each IC chip 20. A notch 24b extending from the surface of the conductor 22 to the non-conductor sheet 21 is formed.

  Further, a conductor-formed sheet 21a having a non-conductive sheet 21 extending in a strip shape and a pair of conductors 22 provided on the non-conductive sheet 21 and extending in the longitudinal direction of the non-conductive sheet 21 and spaced apart from each other. The conductor 22 is cut along the width direction using the moving blade 122 and the support rail 124 (IC tag producing means 120) described above, and along the width direction at a predetermined interval along the feed direction. By producing a large number of cuts 24b, a non-conductive sheet 21 extending in a strip shape as shown in FIG. 22 and a large number arranged along the longitudinal direction of the non-conductive sheet 21 are provided on the non-conductive sheet 21. A conductor-formed sheet 21 a having a pair of conductors 22, and a notch 24 b that extends from the surface of the conductor 22 to the non-conductor sheet 21 is formed between each pair of conductors 22. The conductor has been formed sheet 21a to have can be prepared. Then, the IC tag 10 is arranged and fixed on each pair of conductors 22 of the conductor-formed sheet 21a, so that the IC tags 10 are sequentially manufactured on the non-conductor sheet 21. You can also.

  Further, in this modified example, as the movable blade 122, the cutting tool 66 described with reference to FIGS. 17 and 18 in “[Modified example of preparation of conductor-formed sheet 21a] (second modified example)”, Alternatively, it is possible to use the roller 68 having the circumferential blade 68a described with reference to FIGS. 19 and 20 in “(Third Modification) of“ Modification of Preparation of Conductor Formed Sheet 21a ””. Furthermore, as the movable blade 122, it is also possible to use the pair of blades 62 described with reference to FIGS. 14 to 16 in “[Modification of Preparation of Conductor-Formed Sheet 21a] (First Modification)”. In this case, a scraper that is supported by the support rail 124 and follows the movement of the movable blade 122 from the rear (for example, “[Modification of Preparation of Conductor Formed Sheet 21a]” (first modification)). Further, a scraper 64) described with reference to FIGS. 14 to 16 may be further provided, and the moving blade 122 and the scraper may constitute a means for producing an IC tag.

(Second modification)
FIG. 23 is a perspective view showing a modification of the method for producing the IC tag 10 by cutting the conductor 22 of the IC tag-attached sheet 1 for each IC chip 20. In FIG. 23, the left side is the upstream side, and the IC tagged sheet 1 is fed from the left side to the right side.

  As shown in FIG. 23, in this modification, the IC tag-attached sheet 1 sent to the means 130 for producing an IC tag includes a non-conductive sheet 21 and a non-conductive sheet 21 on the non-conductive sheet 21. A pair of conductors 22 provided apart from both end portions 21d and 21e in the width direction orthogonal to the longitudinal direction of the non-conductive sheet 21 and extending in the longitudinal direction of the non-conductive sheet 21, and a large number on the pair of conductors 22. IC chip 20. And the means 130 for producing the IC tag is arranged above the IC tag-attached sheet 1 and along the width direction orthogonal to the longitudinal direction of the IC tag-attached sheet 1 (non-conductor sheet 21). A punching device 132 having a punching blade 133 having a width narrower than that between both end portions 21d and 21e of the sheet 21 and wider than the entire width of the pair of conductors 22 of the IC tag-attached sheet 1 is provided. The punching blade 133 is movable in the vertical direction.

  When using the means 130 for producing such an IC tag, the sheet 1 with the IC tag is fed, and the portion to be cut of the sheet 1 with the IC tag is directly below the punching blade 133, that is, directly below the punching blade 133. When the substantially intermediate portion of the two IC chips 20 arranged adjacent to each other arrives, the IC tag-attached sheet 1 stops moving in the feeding direction. Therefore, the punching blade 133 descends and punches the conductor 22 together with the non-conductor sheet 21 to cut the conductor 22. As shown in FIG. 23, this extends along the width direction of the non-conductive sheet 21, is between the width-direction end portions 21 d and 21 e of the non-conductive sheet 21, and is at least the entire width of the pair of conductors 22. The through hole 24e extending across the entire width (through the entire width) and penetrating the non-conductor sheet 21 and the conductor 22, in other words, extending along the width direction of the non-conductor sheet 21, From the width direction one side (lower side in FIG. 23) 21d of the sheet 21 and the conductor 22 disposed on one side in the width direction, the other side in the width direction of the non-conductive sheet 21 (upper side in FIG. 23). A through hole 24e extending between the end 21e and the conductor 22 disposed on the other side in the width direction and penetrating the non-conductive sheet 21 and the conductor 22 is formed between the IC chips 20.

  In this way, the IC tag 10 including the pair of enlarged electrodes 9 formed of the pair of conductors 22 and the IC chip 20 connected to the enlarged electrodes 9 is a single non-extending strip (elongate). It is manufactured sequentially while being supported on the conductor sheet 21. As shown in FIG. 23, the IC tag-attached sheet 1 that has undergone such a process includes a non-conductive sheet 21 that extends in a band shape, and both widthwise end portions 21d and 21e of the non-conductive sheet 21 on the non-conductive sheet 21. A plurality of pairs of conductors 22 disposed along the longitudinal direction of the non-conductor sheet 21, and IC chips 20 respectively disposed on each pair of conductors 22. Further, between each IC chip 20, it extends along the width direction of the non-conductive sheet 21, and is between the width direction both ends 21 d and 21 e of the non-conductive sheet 21, and at least the full width of the pair of conductors 22. The through hole 24e extending across the entire width (through the entire width) and penetrating the non-conductor sheet 21 and the conductor 22, in other words, extending along the width direction of the non-conductor sheet 21, One side in the width direction of the sheet 21 ( 23 on the other side in the width direction of the non-conductive sheet 21 (upper side in FIG. 23) and the other side in the width direction from between the end portion 21d and the conductor 22 arranged on one side in the width direction. A through hole 24e extending between the conductor 22 and the non-conductor sheet 21 and the conductor 22 is formed.

  According to this modification, the conductor 22 can be easily and reliably divided along the feed direction, and the IC tag 10 can be easily and reliably placed on the single non-conductor sheet 21 along the feed direction. It can be made sequentially.

  In this modification, an example in which the pair of conductors 22 of the supplied IC tag-attached sheet 1 is separated from the end portions 21d and 21e in the width direction of the non-conductor sheet 21 is shown. I can't. As shown in FIG. 24, by providing a removal means 134 for removing the conductor 22 arranged in the vicinity of the width direction end portions 21d and 21e of the non-conductive sheet 21 on the upstream side of the means 130 for producing the IC tag, Alternatively, the IC tag is produced from the sheet 1 with the IC tag in which the conductor 22 is also arranged on the widthwise end portions 21d and 21e of the non-conductor sheet 21 by incorporating the removing means 134 into the means 130 for producing the IC tag. It can also be sent to the means 130 to do. In this case, similarly to the slit 24a provided in the conductor-formed sheet 21a, the conductor 22 disposed on the vicinity of the width direction end portions 21d and 21e of the non-conductor sheet 21 can be removed. That is, as the removing means 134, in the cutter 42 described with reference to FIGS. 3 and 4 in the present embodiment, or in “[Modification of Preparation of Conductor Formed Sheet 21a] (First Modification)”. The slit forming device 60a provided with the pair of blades 62, the scraper 64, and the waste collecting portion (not shown) described with reference to FIGS. 14 to 16, or “[Modification of Preparation of Conductor Formed Sheet 21a]” (Second modification) of FIG. 17 and FIG. 18, the slit forming device 60b provided with the cutting tool 66, the tool support (not shown), and the waste collecting part (not shown), Alternatively, the roller 68 and the receiver 69 having the circumferential blade 68a described with reference to FIGS. 19 and 20 in “(Third Modification) of“ Modification of Preparation of Conductor Formed Sheet 21a ””. It can be used a slit forming apparatus 60c or the like having a.

  Moreover, it is the non-conductive sheet 21 extended in strip | belt shape, Comprising: A pair of conductor 22 extended in the longitudinal direction of the non-conductive sheet 21, and mutually spaced apart is the both ends of the width direction orthogonal to the longitudinal direction of the non-conductive sheet 21 A non-conductive sheet 21 provided separately from each of 21d and 21e is prepared, and in the width direction at a predetermined interval along the longitudinal direction using the above-described punching device 132 (means 130 for producing an IC tag). By producing a large number of through-holes 24e along, the non-conductive sheet 21 extending in a strip shape as shown in FIG. 25 and the widthwise ends 21d and 21e of the non-conductive sheet 21 on the non-conductive sheet 21 A conductor-formed sheet 21 a provided with a plurality of pairs of conductors 22 provided apart from each other and arranged along the longitudinal direction of the non-conductor sheet 21, between the conductors 22 of each pair , Extending along the width direction of the non-conductive sheet 21, extending between the width-direction end portions 21 d, 21 e of the non-conductive sheet 21 and extending over the entire width of at least the pair of conductors 22. In other words, the through-hole 24e penetrating the body sheet 21 and the conductor 22 extends along the width direction of the non-conductor sheet 21, and is one end in the width direction (lower side in FIG. 25) of the non-conductor sheet 21. Between the portion 21d and the conductor 22 arranged on one side in the width direction, the conductor 22 arranged on the other side in the width direction (upper side in FIG. 25) 21e of the non-conductive sheet 21 and the other side in the width direction. It is possible to produce a conductor-formed sheet 21a in which a through hole 24e extending between and through the non-conductor sheet 21 and the conductor 22 is formed. Then, the IC tag 10 is arranged and fixed on each pair of conductors 22 of the conductor-formed sheet 21a, so that the IC tags 10 are sequentially manufactured on the non-conductor sheet 21. You can also. In preparing the conductor-formed sheet 21a, first, the non-conductor sheet 21 in which the conductor is arranged up to the vicinity of both widthwise end portions 21d and 21e of the non-conductor sheet 21 is prepared. Next, the conductor 22 on both end portions 21d and 21e in the width direction of the non-conductive sheet 21 is removed by the removing means 134 described above, and then the through hole 24e is formed by the punching device 132. Also good.

  In addition, in this modification, although the removal means 130 showed the example which removes the conductor 22 on the width direction both ends 21d and 21e vicinity of the nonelectroconductive sheet 21, the example is not restricted to this. You may make it remove the conductor 22 along a longitudinal direction in the width direction inner side from the width direction both ends 21d and 21e of the nonconductor sheet 21. FIG. In this case, the conductor 22 is provided at a width direction intermediate portion spaced from the width direction both ends 21 d and 21 e of the non-conductive sheet 21, and a pair of intermediate portion conductors 22 e extending in the longitudinal direction of the non-conductive sheet 21. And a pair of side conductors 22f and 22f disposed on both sides in the width direction both ends 21d and 21e of the non-conductor sheet 21 on both outer sides in the width direction of the pair of intermediate conductors 22e. To be composed. Then, by using the punching device 132 described above, the through hole 24e extending over the entire width of at least the pair of intermediate conductors 22e along the width direction is formed, so that the intermediate conductor 22e extends along the width direction. Can be cut. By using such a method, as shown in FIG. 26, the IC tag-attached sheet 1 that has undergone such a process includes a non-conductive sheet 21 extending in a strip shape, and a non-conductive sheet on the non-conductive sheet 21. A plurality of intermediate conductors 22e provided along the longitudinal direction of the non-conductive sheet 21, and spaced apart from both ends 21d and 21e in the width direction of the 21; and on each pair of intermediate conductors 22e A pair of side conductors 22f disposed on the width direction both ends 21d and 21e of the non-conductor sheet 21 and outside the width direction of the IC chip 20 and the intermediate conductor 22e, respectively. , 22f, and extends between the IC chips 20 along the width direction of the non-conductive sheet 21, and between the width direction opposite ends 21d, 21e of the non-conductive sheet 21, A pair of intermediate leads A through hole 24e extending across the entire width of the body 22e (through the entire width) and penetrating the non-conductive sheet 21 and the intermediate conductor 22e, in other words, along the width direction of the non-conductive sheet 21 The width direction of the non-conductive sheet 21 extends from between the end 21d in the width direction (the lower side in FIG. 26) 21d of the non-conductive sheet 21 and the intermediate conductor 22e disposed on the one side in the width direction. A through hole extending between the other end (upper side in FIG. 26) 21e and the intermediate conductor 22e disposed on the other side in the width direction and penetrating the non-conductive sheet 21 and the intermediate conductor 22e. 24e can produce the sheet | seat 1 with an IC tag currently formed.

  Alternatively, as shown in FIG. 26, by forming a through hole 24 e before placing the IC chip 20 on the conductor 22, a non-conductor sheet 21 extending in a band shape and a non-conductor on the non-conductor sheet 21. A plurality of intermediate conductors 22e disposed along the longitudinal direction of the non-conductive sheet 21 and spaced apart from the width direction end portions 21d and 21e of the sheet 21, and the width direction of the intermediate conductor 22e A conductor-formed sheet 21a including a pair of side conductors 22f and 22f disposed on both ends 21d and 21e in the width direction of the non-conductor sheet 21; Between the pair of intermediate conductors 22e, it extends along the width direction of the non-conductor sheet 21, and is located between the end portions 21d and 21e of the non-conductor sheet 21 in the width direction. Across the entire width of In other words, the through hole 24e that penetrates the non-conductive sheet 21 and the intermediate conductor 22e extends along the width direction of the non-conductive sheet 21, and is one side in the width direction of the non-conductive sheet 21 (see FIG. 26 between the lower end 21d and the intermediate conductor 22e disposed on one side in the width direction, the other end in the width direction (upper side in FIG. 26) 21e and the other in the width direction of the non-conductive sheet 21. The conductor-formed sheet 21a, which extends between the intermediate conductor 22e disposed on the side and penetrates the non-conductor sheet 21 and the intermediate conductor 22e, is formed, Can be produced. Then, by arranging and fixing the IC chip 20 on each pair of intermediate conductors 22e of the conductor-formed sheet 21a, a pair of enlarged electrodes formed from the pair of intermediate conductors 22e. 9 and an IC tag 10 composed of an IC chip 20 connected to the enlarged electrode 9 are sequentially manufactured in a state where the IC tag 10 is supported on a single non-conductive sheet 21 extending in a strip shape (elongated shape). Can do.

  Further, in the present modification, when the IC tag-attached sheet 1 and the conductor-formed sheet 21a shown in FIGS. 23 to 26 are produced, before the through hole 24e is formed, the removing means 134 is used to remove the non-conductor sheet. Although the example which removes the conductor 22 arrange | positioned in 21 width direction both ends 21d and 21e vicinity was shown, it is not restricted to this. After forming the through hole 24e, the conductor 22 arranged on the widthwise end portions 21d and 21e of the non-conductor sheet 21 is removed using the removing means 134, and the IC tag-attached sheet shown in FIGS. 1 and the conductor-formed sheet 21a can also be produced.

(Third Modification)
Furthermore, the non-conductive sheet 21 described in “(Second Modification)”, and both end portions 21 d and 21 e in the width direction perpendicular to the longitudinal direction of the non-conductive sheet 21 on the non-conductive sheet 21, respectively. A sheet 1 with an IC tag that includes a pair of conductors 22 that are spaced apart and extend in the longitudinal direction of the non-conductor sheet 21 and are spaced apart from each other, and a large number of IC chips 20 on the pair of conductors 22. Using the means 46 and 130 for producing the IC tag described in the present embodiment or “(first modification)”, the width of the nonconductive sheet 21 is extended along the width direction of the nonconductive sheet 21. A cut 24b extending between at least the entire width of the pair of conductors 22 (across the entire width) and entering from the surface of the conductor 22 to the non-conductor sheet 21 is between the two end portions 21d and 21e in the direction. In other words, The width direction of the non-conductor sheet 21 extends along the width direction of the conductor sheet 21 and between the width direction one end 21d of the non-conductor sheet 21 and the conductor 22 arranged on one side in the width direction. A cut 24b extending between the other end 21e and the conductor 22 arranged on the other side in the width direction and entering from the surface of the conductor 22 to the non-conductor sheet 21 is formed between the IC chips 20. You can also.

  Thereby, the IC tag 10 including the pair of enlarged electrodes 9 formed from the pair of conductors 22 and the IC chip 20 connected to the enlarged electrodes 9 is one non-conductor extending in a strip shape (elongated shape). It is produced sequentially while being supported on the sheet 21. As shown in FIG. 27, the IC tag-attached sheet 1 having undergone such a process is separated from the non-conductive sheet 21 extending in a strip shape and the widthwise end of the non-conductive sheet 21 on the non-conductive sheet 21. Provided, and a plurality of pairs of conductors 22 disposed along the longitudinal direction of the non-conductor sheet 21, and an IC chip 20 disposed on each pair of conductors 22, respectively, Between the IC chips 20, it extends along the width direction of the non-conductive sheet 21, is between the width-direction end portions 21 d and 21 e of the non-conductive sheet 21, and spans at least the entire width of the pair of conductors 22. The cut 24b extending (crossing the entire width) and entering from the surface of the conductor 22 to the non-conductive sheet 21 extends in other words along the width direction of the non-conductive sheet 21, and the width of the non-conductive sheet 21 One direction (Fig. 27 In the width direction other side (upper side in FIG. 27) 21e and the width direction other side of the non-conductive sheet 21 from between the lower side end portion 21d and the conductor 22 arranged on the width direction one side. A notch 24b extending between the conductor 22 and the non-conductor sheet 21 from the surface of the conductor 22 is formed.

  According to such a modification, even if the cut 24b partially or entirely penetrates the non-conductive sheet 21, the non-conductive substance is formed at the width direction end portions 21d and 21e of the non-conductive sheet 21. Since the sheet 21 is not divided, the IC tags 10 can be sequentially and easily produced on the single non-conductive sheet 21 along the feeding direction.

  Further, similarly to “(second modification)”, a pair of non-conductive sheets 21 extending in the longitudinal direction of the non-conductive sheet 21 and spaced apart from each other are non-conductive sheets. A non-conductive sheet 21 provided separately from both end portions 21d and 21e in the width direction perpendicular to the longitudinal direction of the sheet 21 is prepared, and using the means 46 and 120 for producing the IC tag described above, the longitudinal direction 28, a plurality of cuts 24b are formed in the conductor 22 along the width direction at predetermined intervals along the non-conductive sheet 21 extending in a strip shape and the non-conductive sheet 21 as shown in FIG. A conductor formed with a plurality of conductors 22 provided along the longitudinal direction of the non-conductive sheet 21 and spaced from the width direction end portions 21d and 21e of the non-conductive sheet 21. Sheet 21 In addition, between each pair of conductors 22, it extends along the width direction of the non-conductor sheet 21, and is within the width direction both ends 21 d and 21 e of the non-conductor sheet 21, and at least a pair of conductors The notch 24b extending over the entire width of the conductor 22 and entering the non-conductor sheet 21 from the surface of the conductor 22 extends in the width direction of the non-conductor sheet 21, in other words, the width of the non-conductor sheet 21. From one end in the direction (lower side in FIG. 28) 21d and the conductor 22 disposed on one side in the width direction, the other end in the width direction (upper side in FIG. 28) 21e of the non-conductive sheet 21 Producing a conductor-formed sheet 21a in which cuts 24b extending from the surface of the conductor 22 to the non-conductor sheet 21 are formed between the conductor 22 arranged on the other side in the width direction. Can do. Then, the IC tag 10 is arranged and fixed on each pair of conductors 22 of the conductor-formed sheet 21a, so that the IC tags 10 are sequentially manufactured on the non-conductor sheet 21. You can also.

[Combination of modifications]
As described above, one or a plurality of modified examples for some processes of the present embodiment have been described. However, naturally, modified examples for different processes may be used in combination.

Sectional drawing along the width direction which shows a sheet | seat with an IC tag. Sectional drawing which shows the modification of a sheet | seat with an IC tag. Schematic which shows one Embodiment of the inspection method of a sheet | seat with an IC tag by this invention. The perspective view which shows the preparation methods of a sheet | seat with an IC tag. The perspective view which shows the preparation methods of a sheet | seat with an IC tag. The perspective view which shows the UV light irradiation part of the apparatus which supplies an IC chip. The perspective view which shows the cutting method of the conductor of a sheet | seat with an IC tag, and the inspection method of an IC tag. The side view which shows the modification of the fixing method of IC chip. The perspective view which shows the modification of the supply method of IC chip. Sectional drawing which shows the modification of the supply method of IC chip. The perspective view which shows the modification of a conductor formed sheet. Sectional drawing which shows the conductor formed sheet in which the slit was formed with the cutter. Sectional drawing which shows an IC tag. The figure which shows the modification of the formation method of a slit. Sectional drawing which shows a conductor formed sheet. Sectional drawing which shows an IC tag. The figure which shows the modification of the formation method of a slit. The figure which shows the modification of the formation method of a slit. The figure which shows the modification of the formation method of a slit. The figure which shows the modification of the formation method of a slit. The perspective view which shows the modification of the manufacturing process of IC tag. The perspective view which shows the modification of a conductor formed sheet. The perspective view which shows the modification of the manufacturing process of IC tag. The perspective view which shows the modification of the manufacturing process of IC tag. The perspective view which shows the modification of a conductor formed sheet. The perspective view which shows the modification of a sheet | seat with an IC tag, and a conductor formed sheet. The perspective view which shows the modification of the manufacturing process of IC tag. The perspective view which shows the modification of a conductor formed sheet.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Sheet | seat 9 with an IC tag Expanded electrode 10 IC tag 18 Conductive adhesive 20 IC chip 20a IC chip main body 20b Flat electrode 20c Pointed electrode 21 Non-conductive sheet 21a Conductor formed sheet 21d Width direction end part 21e End 22 in the width direction Conductor 22a Conductor 22e Intermediate conductor 22f Side conductor 24a Slit 24b Cut 24e Through hole 46 Non-conductive blade

Claims (6)

Preparing a sheet with an IC tag having a non-conductive sheet extending in a strip shape, a pair of conductors provided on the non-conductive sheet and extending in a strip shape, and a number of IC chips on the pair of conductors;
Cutting the conductor of the IC tag-attached sheet to sequentially produce an IC tag comprising a pair of enlarged electrodes and an IC chip on the non-conductor sheet along the longitudinal direction;
And a step of inspecting the quality of each IC tag.   2. The method for inspecting a sheet with an IC tag according to claim 1, wherein the conductor is cut on both sides of the IC chip with a pair of non-conductive blades spaced apart in the longitudinal direction of the non-conductor sheet.   3. The method of inspecting an IC tag sheet according to claim 2, wherein the quality of the IC tag is inspected in a state where the pair of nonconductive blades have entered the sheet with the IC tag. The non-conductive sheet extending in a strip shape and the non-conductive sheet are provided on the non-conductive sheet so as to be separated from both ends in the width direction perpendicular to the longitudinal direction of the non-conductive sheet, and extend in the longitudinal direction of the non-conductive sheet and are separated from each other. Preparing a sheet with an IC tag having a pair of conductors and a number of IC chips on the pair of conductors;
A through-hole extending between at least both ends of the non-conductor sheet in the width direction and extending over the entire width of the pair of conductors and penetrating the non-conductor sheet and the conductor is formed between each IC chip. A step of sequentially producing an IC tag comprising a pair of enlarged electrodes and an IC chip on the non-conductive sheet along the longitudinal direction;
And a step of inspecting the quality of each IC tag. The non-conductive sheet extending in a strip shape and the non-conductive sheet are provided on the non-conductive sheet so as to be separated from both ends in the width direction perpendicular to the longitudinal direction of the non-conductive sheet, and extend in the longitudinal direction of the non-conductive sheet and are separated from each other. Preparing a sheet with an IC tag having a pair of conductors and a number of IC chips on the pair of conductors;
An incision extending from the surface of the conductor to the non-conductive sheet is formed between each IC chip within the widthwise opposite ends of the non-conductive sheet and extending over the entire width of the pair of conductors. A step of sequentially producing an IC tag comprising a pair of enlarged electrodes and an IC chip on the non-conductive sheet along the longitudinal direction;
And a step of inspecting the quality of each IC tag.   The method for inspecting a sheet with an IC tag according to any one of claims 1 to 5, further comprising a step of marking an IC tag determined to be abnormal.

Images