JP2005337725A - Illuminator for imaging apparatus, surface mounting machine and component inspection device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To illuminate a surface to be imaged so that light and shade is not formed on the surface to be imaged when the surface to be imaged is looked from a camera even in a state that the surface to be imaged is a mirror surface or near to the mirror surface. <P>SOLUTION: A coaxial illuminator 24 for irradiating a mounting component 9 with light parallel to the optical axis C of the camera 23 by the half mirror 29 provided on the optical axis C is provided and a main illuminator 25 for obliquely irradiating the mounting component 9 with light by the LEDs 34 and 36 arranged to the periphery of the optical axis C is provided. A quantity-of light altering means 37 for lowering the quantity of light of the main illuminator 25 so as to reduce the difference between the luminosity of the mounting component 9 irradiated with light from the coaxial illuminator 24 and the luminosity of the mounting component 9 irradiated with light from the main illuminator 25 is provided. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an illumination device for an imaging device, a surface mounter, and a component inspection device that irradiates light from a camera side onto a lead or an electrode terminal of an electronic component mounted on a printed wiring board, for example.

  2. Description of the Related Art Conventionally, for example, a surface mounter that mounts electronic components on a printed wiring board has a configuration in which the mounted components are sucked by a suction nozzle and transferred from a component supply unit to a mounting position on the printed wiring board. At the time of transfer, a mounting component (electronic component) is imaged from below by an imaging device, and the position of terminals and leads, the presence or absence of a defect, and the like are detected by image processing. The imaging device includes an illumination device that irradiates light on the mounting component from below during imaging.

  As this type of conventional illumination device for an imaging device, for example, there is one disclosed in Patent Document 1. The illumination device disclosed in Patent Document 1 includes a first illumination device that irradiates light on a mounting component from the camera side by a plurality of LEDs arranged to surround the optical axis of the camera of the component recognition device; A second illumination device having an LED for irradiating light from the side to the mounting component. The first lighting device and the second lighting device are selectively used according to the type of mounting component. However, these lighting devices cannot illuminate the mounting component from directly below.

  As an illuminating device capable of irradiating light parallel to the optical axis of the camera, there is one disclosed in Patent Document 2, for example. The imaging apparatus disclosed in Patent Document 2 captures an object to be imaged such as a positioning mark or a circuit pattern provided on a printed wiring board with a camera from above the printed wiring board. A lighting device is attached to the.

  The illuminating device is disposed between the camera and the printed wiring board so as to be positioned on the optical axis of the camera, and is disposed on a side of the half mirror, and uses the half mirror. A first light source that emits light to the object to be imaged, a second light source that is disposed below the half mirror so as to surround the optical axis, and emits light downward, and the second light source It is comprised by the prism etc. which were arrange | positioned under this. Each of these constituent members is housed in one casing and is supported by the casing.

  Each of the first and second light sources includes a plurality of LEDs. The LED constituting the first light source is mounted with a lead penetrating the side wall of the housing, and the LED constituting the second light source is mounted on the lower surface of the light source substrate extending horizontally in the housing. ing. The prism is for collecting the light of the second light source on the object to be imaged, and is formed in an annular shape and disposed on the same axis as the optical axis of the camera.

  In the illuminating device thus configured, the light from the first light source is reflected by a half mirror to irradiate the object to be imaged along the optical axis of the camera, and the light from the second light source is The object to be imaged is refracted by the prism and irradiated obliquely from above. The camera captures an image of the object by receiving reflected light that is emitted from these LEDs and reflected by the object. At this time, in the imaging apparatus equipped with the conventional illumination device, the color of the object to be imaged is similar to the color of the surface of the printed wiring board adjacent to the object to be imaged, or the surface of the object to be imaged is For example, when it is formed to be a mirror surface and easily reflects light, it may be difficult to capture an image of the object to be captured by the camera.

In such a case, the conventional illumination device emits either one of the first light source and the second light source, or emits both so that a clear image is captured by the camera. Thus, a configuration has been adopted in which the amount of light applied to the object to be imaged is increased or decreased.
In addition, the applicant could not find any prior art documents closely related to the present invention by the time of filing other than the prior art documents specified by the prior art document information described in the present specification. .
Japanese Unexamined Patent Publication No. 2000-208998 (FIG. 1) JP-A-4-122840 (page 2-3, FIG. 1)

  However, the above-described conventional illumination device for an imaging device can switch the light emission / extinction of the first light source and the second light source when the surface (imaging surface) of the object to be imaged is a mirror surface or a state close to the mirror surface. Even if both light sources are made to emit light, the object to be imaged cannot always be illuminated so that the image is correctly captured by the camera. This is considered to be due to the fact that the light from the first light source is reduced in amount because it passes through the half mirror. That is, since the light amount from the first light source is smaller than the light amount from the second light source among the light reflected by the object and incident on the camera, the object to be imaged by the camera. In this image, a dark part and a bright part are generated.

  Such a phenomenon remarkably appears when imaging an electronic component having a lead plated with solder. For example, a solder-plated lead has a substantially circular cross section due to its nature, and often has a high reflectivity like a mirror surface. Therefore, when this lead is imaged by the camera, the light from the first light source is regularly reflected at the center of the lead, and the light from the relatively bright second light source is regularly reflected at both ends of the lead. There is a possibility that the two leads are imaged as two thin leads. In order to make this uniform, if the light quantity of the second light source is fixed to a setting that is lowered in accordance with the light quantity of the first light source, the light quantity is obtained when the surface state is a non-mirror surface with low reflectance. It becomes difficult to recognize the lead.

  The present invention has been made to solve such a problem, and can irradiate light so that light and darkness does not occur on the surface to be imaged when viewed from the camera regardless of whether the surface to be imaged is specular or non-specular. An object is to provide an illumination device for an imaging device.

  In order to achieve this object, an illumination device for an imaging apparatus according to the present invention includes a first light source that irradiates an object to be imaged with light parallel to the optical axis by a half mirror provided on the optical axis of the camera, An illumination device for an imaging apparatus, comprising: a second light source that obliquely irradiates the object to be imaged with light from around the optical axis; and an illuminance of the object to be imaged irradiated with light from the first light source; And a light amount changing means for reducing the light amount of the second light source so as to reduce the difference from the illuminance of the object to be imaged irradiated with the light from the second light source.

  The illumination device for an imaging device according to a second aspect is the illumination device for an imaging device according to the first aspect, wherein the light amount changing means is a mirror surface or a glossy surface that approximates a mirror surface. In some cases, the light quantity of the second light source is reduced by a predetermined amount.

A surface mounter according to a third aspect of the invention irradiates light on a mounting component above the component recognition device by the imaging device illumination device according to the first or second aspect of the invention. .
According to a fourth aspect of the present invention, there is provided a component inspection apparatus that irradiates an electronic component to be inspected above a component recognition device by the imaging device illumination device according to the first or second aspect of the present invention. It is.

The illumination device for an imaging device according to the present invention reduces the light amount of the second light source by the light amount changing unit when the imaged surface is a mirror surface or a state close to the mirror surface, so that a bright part and a dark part on the imaged surface It is possible to irradiate with light so as not to occur.
For this reason, according to the present invention, it is possible to illuminate the mirror surface and the imaged surface close to the mirror surface so as to be uniformly bright when viewed from the camera. For example, it is possible to take an image so that the lead of the electronic component can be correctly identified and clearly distinguished from the background. Therefore, according to the present invention, the balance between the light from the first light source and the light from the second light source is changed in accordance with the surface condition of the lead of the electronic component, and in either case, the entire lead shines uniformly. , Recognition can be performed stably.

According to the second aspect of the present invention, when the light amount changing means decreases the light amount of the second light source, the light amount is always decreased by a certain amount.
For this reason, the imaging device equipped with the illumination device according to the present invention has high reliability because it can capture a plurality of imaging objects with a certain accuracy when the imaging surface is a mirror surface.

According to the third aspect of the present invention, since the imaging device illumination device that illuminates the mirror surface or the imaged surface close to the mirror surface so as to be correctly imaged by the imaging device is provided, the lead is plated with solder. Therefore, it is possible to provide a surface mounter that can be mounted on a printed wiring board with high accuracy even if the mounting surface is a mirror surface or an electronic component that is close to the mirror surface.
According to the fourth aspect of the present invention, since the imaging device illumination device that illuminates the mirror surface or the surface to be imaged in a state close to the mirror surface so as to be correctly imaged by the imaging device is provided, the lead is subjected to solder plating. Therefore, it is possible to provide a component inspection apparatus capable of inspecting with high accuracy even for an electronic component whose mounting surface is close to a mirror surface or a mirror surface.

Hereinafter, an embodiment of an illumination device for an imaging device according to the present invention will be described in detail with reference to FIGS. Here, an example in which the illumination device for an imaging device according to the present invention is provided in a surface mounter is shown.
FIG. 1 is a plan view of a surface mounter equipped with an illumination device for an image pickup device according to the present invention, FIG. 2 is a front view of the upper portion of the surface mounter, FIG. 3 is a front view of the image pickup device according to this embodiment, and FIG. FIG. 5 is a side view, FIG. 5 is a flowchart for explaining the operation of the illumination device for an imaging device according to the present invention, FIG. 6 is a schematic diagram showing the illumination device, and FIG. 7 is a diagram showing a captured image. is there.

  In these drawings, the reference numeral 1 indicates a surface mounter according to this embodiment. The surface mounter 1 includes a conveyer 4 that conveys a printed wiring board 3 on an upper part of a base 2, and a head unit 5 that will be described later in the left-right direction (hereinafter referred to simply as the X direction) and the X direction in FIG. And a moving device 6 that moves in the orthogonal front-rear direction (hereinafter, this direction is referred to as Y direction). The conveyor 4 is configured to convey the printed wiring board 3 to the left in FIG. 1 and hold it at a work position by a clamping mechanism (not shown). On both sides of the conveyor 4, a tape feeder 7 for supplying components and a component recognizing device 10 for imaging the mounting component 9 and the like sucked by the suction nozzle 8 (see FIG. 2) from below are provided on the base 2. Is provided.

  The moving device 6 is movable between a Y-direction moving device 12 having two fixed rails 11 and 11 extending in the Y direction above the conveyor 4 and the fixed rails 11 and 11. And an X-direction moving device 14 having rails 13. The head unit 5 is attached to the X-direction moving device 14. The head unit 5 and the moving device 6 are controlled in moving direction, distance, speed, and the like by a control device (not shown).

The Y-direction moving device 12 moves the movable rail 13 of the X-direction moving device 14 in the Y direction by a ball screw shaft 15 extending along the fixed rail 11 and a Y-axis servo motor 16 that drives the ball screw shaft 15. Reciprocate. The movable rail 13 is fixed to a nut member 15 a of the ball screw shaft 15. The Y-axis servomotor 16 is provided with position detecting means 17 comprising an encoder.
The X-direction moving device 14 reciprocates the head unit 5 in the X direction by a ball screw shaft 18 provided in parallel with the movable rail 13 extending in the X direction and an X-axis servo motor 19 that drives the ball screw shaft 18. Let The X-axis servo motor 19 is provided with position detecting means 20 comprising an encoder.

As shown in FIG. 2, the head unit 5 is provided with eight suction heads 21 having the suction nozzles 8 at intervals in the X direction. Each of the suction heads 21 can be rotated on a vertical axis, and can be moved in the vertical direction (hereinafter, this direction is simply referred to as the Z direction).
As shown in FIGS. 3 and 4, the component recognition device 10 includes a camera 23 attached to the inner bottom portion of the lighting device case 22, a coaxial lighting device 24 disposed above the camera 23, It is comprised by the illuminating device 25, the side illuminating device 26, etc.

  The coaxial illumination device 24 and the main illumination device 25 emit light when, for example, a QFP (Quad Flat Package) is imaged as an electronic component to be imaged, and the side illumination device 26 is, for example, a BGA (Ball Grid Array) as an electronic component to be imaged. ) Or CSP (Chip Size Package) or the like, the mounting component 9 having hemispherical terminals 9a is caused to emit light. The coaxial illumination device 24 constitutes a first light source referred to in the present invention, and the main illumination device 25 constitutes a second light source referred to in the present invention.

  The camera 23 includes a line sensor 27 having an upper surface serving as a light receiving surface, and is fixed to an inner bottom portion of the lighting device case 22 with an optical axis C pointing upward. The line sensors 27 are arranged in parallel when the CCD solid-state imaging devices are arranged in one row in the Y direction and in color. As the sensor constituting the camera 23, in addition to the above-described line sensor that sequentially images from the end of the mounting component 9 while the mounting component 9 moves across the camera 23, the mounting component 9 However, it is also possible to use a line sensor that picks up an image of the entire mounting component 9 at one time while moving above the camera 23 or moving slowly.

The coaxial illumination device 24 is for illuminating the lower surface of the mounting component 9 (image-captured electronic component) crossing above the camera 23 from below with light along the optical axis C of the camera 23, as shown in FIG. In addition, a plurality of LEDs 28 provided on the side of the optical axis C and a half mirror 29 on the optical axis C for reflecting the light of the LEDs 28 upward along the optical axis C are configured. . The plurality of LEDs 28 are mounted and supported on a single LED substrate 30. The LED substrate 30 is attached to a support member 31 in a state where the LED 28 is oriented so as to face the half mirror 29, and is supported by the lighting device case 22 via the support member 31.
The half mirror 29 reflects light from the LED 28 upward and allows reflected light from above to pass downward. Both ends of the half mirror 29 are inclined at 45 ° (in a direction perpendicular to the paper surface in FIG. 4). Both end portions) are supported by being fixed to the support member 31.

  The main lighting device 25 is for illuminating the entire lower surface of the mounting component 9 from obliquely below, and is formed in a box shape that opens upward as shown in FIGS. 3 and 4. A support member 32 fixed in the upper end of the case 22, a lower LED substrate 33 disposed horizontally at the inner bottom portion of the support member 32, and a number of devices mounted on the upper surface of the lower LED substrate 33. The LED 34, four upper LED boards 35 attached in an inclined state near the opening of the support member 32, a number of LEDs 36 mounted on these upper LED boards 35, and the amount of light of the LEDs 34, 36 It is constituted by a light amount changing means 37 for changing the light amount.

  The support member 32 is formed in a rectangular box shape in plan view, is formed such that the opening width of the opening portion is larger than the width of the bottom portion, and is inclined so as to be positioned outward as it goes upward in the middle of the side wall. An inclined surface 21a is formed. A through hole 38 (see FIG. 4) forming a part of the optical path is formed at a portion where the optical axis C of the camera 23 intersects on the bottom wall of the support member 32 and the upper wall of the lighting device case 22. Yes.

The lower LED substrate 33 is formed in a rectangular shape in a plan view, and is mounted on the bottom portion of the support member 32 side by side in the X direction. A gap 39 is formed between these lower LED boards 33 and 33 (part where the optical axis C of the camera 23 intersects) so as to constitute a part of the optical path.
The upper LED substrate 35 is gradually inclined away from the optical axis C as it goes upward so as to be parallel to the inclined surface 32a, and is fixed to the inclined surface 32a in this state. The LEDs 34 and 36 mounted on the upper LED substrate 35 and the lower LED substrate 33 have the same emission color.

The lower LED substrate 33 and the upper LED substrate 35 are configured so that the light emission amount of the LEDs 34 and 36 can be changed between 0% and 100%. The light emission amounts of these LEDs 34 and 36 are set by a light amount changing means 37 described later.
The light quantity changing means 37 switches light emission / extinction of the LED 28 of the coaxial illumination device 24, switches light emission / extinction of the LEDs 34, 36 of the main illumination device 25, and adjusts the light quantity. And each LED board 30, 33, 35 of the main lighting device 25 and a circuit connected to the surface mounter control device.

  As shown in FIG. 3, the light amount changing means 37 according to this embodiment includes an electrode surface state setting switch 37a and a light amount adjusting switch 37b. The electrode surface state setting switch 37a can select one of a non-specular mode in which the imaging surface of the electronic component to be imaged is non-specular and a specular mode in which the mirror surface or a state close to the mirror surface is selected. It is configured. When the non-specular mode is selected, the LED 28 of the coaxial illumination device 24 emits light, and the LEDs 34 and 36 of the main illumination device 25 emit light so that the amount of light is 100%.

  When the specular mode is selected, the LED 28 of the coaxial illumination device 24 emits light, and the light emission amounts of the LEDs 34 and 36 of the main illumination device 25 are reduced based on the following setting operation. This setting operation is performed by selecting an auto mode in which the light amounts of the LEDs 34 and 36 are reduced by a predetermined amount and a manual mode in which the light amounts of the LEDs 34 and 36 are manually reduced by the light amount adjustment switch 37b.

  In the auto mode, the LED 34 is set so that there is no difference between the illuminance of the imaged electronic component irradiated with light from the coaxial illumination device 24 and the illuminance of the imaged electronic component irradiated with light from the main illumination device 25. , 36 is reduced to 30%, for example. The amount by which the amount of light is reduced in the auto mode is determined based on the image actually captured by the camera 23 using the component recognition apparatus 10. In the manual mode, by operating the light amount adjustment switch 37b, the light amounts of the LEDs 34 and 36 gradually decrease between 100% and 0%.

Here, operations of the coaxial illumination device 24 and the main illumination device 25 will be described with reference to a flowchart shown in FIG.
First, when the mounting component 9 is a component having a lead such as QFP, the component recognition device 10 includes the coaxial illumination device 24 and the main illumination device as shown in step S1 of FIG. 25 is determined to be used. If the determination result is NO, as shown in step S2, light is emitted so that the coaxial illumination device 24 and the main illumination device 25 have the same ratio in accordance with preset parameters. In this embodiment, both illumination devices emit light so that the amount of light becomes 100%.

Thus, after both the illuminating devices 24 and 25 light-emit, it progresses to step S3 from step S1, and mode selection operation (step S3) of the electrode surface state setting switch 37a by an operator is performed. This mode selection operation selects either the non-specular mode or the specular mode, and when the specular mode is selected, selects either the auto mode or the manual mode.
If the non-specular mode is selected in step S3, the process proceeds from step S4 to step S2, and the light emission states of both the lighting devices 24 and 25 are maintained.

  When the specular mode is selected in step S3 and the auto mode is selected, the process proceeds from step S4 to step S5 through step S6, and the light quantity of the main illumination device 25 is decreased based on an internal constant. In this embodiment, as described above, the amount of light is reduced to 30%. When the specular mode is selected in step S3 and the manual mode is selected, the process proceeds from step S4 to step S5 to step S7, and the light quantity balance between the coaxial illumination device 24 and the main illumination device 25 is manually set. In this embodiment, the light quantity of the coaxial illumination device 24 is made constant, and the light quantity of the main illumination device 25 is lowered by the light quantity adjustment switch 37b.

As shown in FIGS. 3 and 4, the side lighting device 26 supports a frame 41 formed in a rectangular shape in a plan view surrounding the upper end portion of the lighting device case 22 and one side portion of the frame 41. Air cylinder 42, four LED boards 43 held upright on each side of the frame 41, and a large number of LEDs 44 mounted on these LED boards 43.
The frame 41 is provided with four side plates 41 a extending in the up and down directions on the four sides of the lighting device case 22.

  The air cylinder 42 has a cylinder main body 45 detachably attached to a side portion of the lighting device case 22 by two fixing bolts 46, and three piston rods 47 protruding upward from the cylinder main body 45. The frame 41 is attached to the upper end portion. That is, the frame 41 is supported by the air cylinder 42 so as to be movable in the vertical direction, and is detachably attached to the lighting device case 22 via the air cylinder 42.

As shown in FIGS. 3 and 4, the frame 41 according to this embodiment includes an upper position protruding upward from the lighting device case 22 and a lower position where the upper end of the lighting device case 22 is higher than the frame 41. It is comprised so that it may move between side positions.
The LED substrate 43 is provided for each side plate 41 a of the frame 41. Each LED board 43 is formed to have a length extending from one end portion to the other end portion of the side plate 41 a, and is fixed to the side plate 41 a in a state where the LED 44 is erected so as to be oriented in the center direction of the frame 41. . By attaching the LED substrate 43 to the frame 41 in this way, the LEDs 44 of the side illumination device 26 are arranged in a square shape when viewed from the axial direction of the optical axis C of the camera 23 as shown in FIG.

  As shown in FIGS. 3 and 4, the LEDs 44 of the side lighting device 26 are arranged in a row from one end portion to the other end portion in the horizontal direction of one LED substrate 43, and the LED rows are arranged in the vertical direction. It is mounted on the LED substrate 43 so that three rows are formed. Of these three LED rows, the upper LED row 51 and the lower LED row 52 are mounted with the same number of LEDs 44, and the central LED row 53 is the number of LEDs 44 from the upper and lower LED rows 51, 52. Is decreasing. More specifically, the LEDs 44 constituting the central LED row 53 are mounted such that the number of mounted LEDs is small at the central portion of the LED substrate 43 and the number of mounted portions is increased at both ends of the LED substrate 43.

  The surface mounting machine 1 configured as described above causes the mounting component 9 on the tape feeder 7 to be sucked to the suction nozzle 8 and the head unit 5 is moved in the X direction and the Y direction to print from the tape feeder 7. Transfer to a predetermined mounting position on the plate 3. In order to detect the correctness and the suction position including the presence / absence of suction of the mounting component 9 in the middle of the mounting process, or to detect the presence or absence of deformation or loss of leads, terminals, etc. The mounting component 9 is imaged from below by the camera 23 of the component recognition apparatus 10. At this time, the vertical height of the suction head 21 with respect to the head unit 5 is set to a height at which a clear image of the mounting component 9 can be acquired by the camera 23.

  When the mounting component 9 has hemispherical terminals such as BGA and CSP provided on the lower surface, the component recognition device 10 moves the side illumination device 26 to the upper position shown in FIGS. Only the side lighting device 26 emits light. Also in this case, the vertical height of the suction head 21 is set to a height at which a clear image of the mounting component 9 can be acquired by the camera 23. Since the side illumination device 26 is moved to the upper position, a bright and clear image of the hemispherical terminal 9a can be acquired by the side illumination during imaging.

  When the mounting component 9 has a lead such as QFP, the component recognition device 10 captures images by causing the LEDs 28, 34, and 36 of the coaxial illumination device 24 and the main illumination device 25 to emit light. At this time, the side lighting device 26 is lowered to a lower position lower than the upper end of the lighting device case 22, and moves in the X direction so that the mounting component 9 passes over the camera 23. At this time, the vertical height of the suction head 21 is set to a height at which a clear image of the mounting component 9 can be acquired by the camera 23. On the other hand, since the side illumination device 26 is in the lower position, the tip height of the suction head 21 can be lowered when the head unit 5 is moved other than during imaging, and the tact time can be shortened.

  Thus, when the component recognition device 10 images the mounting component 9 having leads, the coaxial illumination device 24 and the main illumination device are set so as to have the light amount set by the electrode surface state setting switch 37a and the light amount adjustment switch 37b. 25 emit light. The light emission amounts of the coaxial illumination device 24 and the main illumination device 25 are 100% when the imaging surface of the lead of the mounting component 9 is a non-mirror surface. When the surface to be imaged is a mirror surface or a state close to a mirror surface, the light emission amount of the coaxial illumination device 24 is 100%, but the light emission amount of the main illumination device 25 is reduced to 30% in the auto mode and is arbitrary in the manual mode. The amount of emitted light is reduced. The state of the illumination light at this time is shown in FIG. In the same figure, the lower LED substrate 33 of the main lighting device 25 is inclined, but is actually in a horizontal state as shown in FIGS. FIG. 6B shows the light emission state of the conventional illumination device. As can be seen from FIG. 6, the light quantity of the main illumination device 25 is relatively large.

  As described above, by reducing the light emission amount of the main illumination device 25, it is possible to irradiate light so that a bright portion and a dark portion do not occur on the surface to be imaged. The device 25 can illuminate the mirror surface and the surface to be imaged in a state close to the mirror surface so as to be uniformly bright when viewed from the camera 23.

As a result, the component recognition apparatus 10 according to this embodiment performs imaging so that the camera 23 can correctly distinguish the background and the background even when the lead is solder plated and the surface to be imaged is a mirror surface. We were able to. As shown in FIG. 7A, the lead image captured by the camera 23 has a small difference in brightness over the entire area of the imaged surface of the lead 51. In the figure, the fact that the difference in brightness is small is shown by making the hatching interval constant. In addition, as shown in FIG. 7B, the image when the imaging target surface is a mirror surface is illuminated by the conventional illumination device, the both side edges of the lead 51 are remarkably bright, and the central portion in the width direction is It becomes relatively dark.
As described above, the component recognition apparatus 10 according to this embodiment changes the balance between the light from the coaxial illumination device 24 and the light from the main illumination device 25 in accordance with the surface state of the lead, so that the surface to be imaged is a mirror surface. In any case of the non-mirror surface, the entire lead shines uniformly, and the lead can be recognized stably.

  In this embodiment, when the light amount of the main illumination device 25 is reduced in the auto mode by the light amount changing means 37, the light amount is always reduced by a certain amount. Therefore, even if the mounting component 9 is changed by selecting the auto mode. It can be illuminated as well. For this reason, the component recognition apparatus 10 can image a plurality of mounting components 9 with a certain accuracy.

  In the above-described embodiment, an example in which the light emission amount of the LEDs 34 and 36 is reduced in order to reduce the light amount of the main illumination device 25 has been described. However, the present invention is not limited to such a limitation. Then, all LEDs may emit light, and in the mirror surface mode, only 1/3 of the total number of LEDs may emit light. In order to reduce the amount of light of the main lighting device 25, an LED having a large amount of light emission and an LED having a small amount of light emission are provided at a predetermined ratio, and only the LED having a large amount of light emission is caused to emit light in the non-specular mode. In the mirror mode, it is possible to adopt a configuration in which only an LED having a small light emission amount emits light.

  Since the surface mounter 1 according to the above-described embodiment is equipped with the imaging device illumination device according to the present invention, the mounting component 9 such as QFP can be mounted on the printed wiring board 3 with high accuracy. The illumination device for an imaging device according to the present invention can be applied to any device as long as it captures a mirror surface or an object to be imaged close to the mirror surface in addition to the component recognition device of the surface mounter. it can. For example, the illumination device for an imaging device according to the present invention is adsorbed by an imaging device that is mounted on a movable head unit of a surface mounter and images a positioning mark on a printed wiring board on a base, or by an adsorption nozzle. An external appearance of the electronic component is imaged and the electronic component is inspected by image processing, or a predetermined waveform current for inspection is input to the electronic component on the inspection table, and the electronic component is inspected by the output waveform, and is provided in the head unit. The lower surface of the electronic component conveyed on the inspection table by the suction nozzle can be imaged and used for a component inspection device that corrects the position of the electronic component placed on the inspection table. This component inspection device is equipped with an imaging device illumination device of the present invention that illuminates a mirror surface or a surface to be imaged in a state close to the mirror surface so that the imaging device correctly captures an image. It becomes possible to inspect with high accuracy.

It is a top view of the surface mounting machine equipped with the illuminating device for imaging devices which concerns on this invention. It is a front view of the upper part of a surface mounter. It is a front view of an imaging device. It is a side view of an imaging device. It is a flowchart for demonstrating operation | movement of the illuminating device for imaging devices. It is a block diagram which shows an illuminating device typically. It is a figure which shows the imaged image.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Surface mounter, 9 ... Surface mount component, 10 ... Component recognition apparatus, 23 ... Camera, 24 ... Coaxial illumination apparatus, 25 ... Main illumination apparatus, 26 ... Side illumination apparatus, 28, 34, 36 ... LED, 37 ... Light quantity changing means, 29 ... half mirror, C ... optical axis.

Claims (4)

  A first light source that irradiates the object to be imaged with light parallel to the optical axis by a half mirror provided on the optical axis of the camera, and a first light source that obliquely irradiates the object to be imaged with light from around the optical axis. In the illumination device for an imaging device including the two light sources, the illuminance of the imaging object irradiated with light from the first light source and the illuminance of the imaging object irradiated with light from the second light source An illumination device for an imaging apparatus, comprising: a light amount changing unit that reduces the light amount of the second light source so that a difference between the light source and the second light source decreases.   2. The illumination device for an imaging apparatus according to claim 1, wherein the light amount changing means reduces the light amount of the second light source by a predetermined amount when the surface to be imaged is a mirror surface or a glossy surface similar to the mirror surface. Lighting device.   A surface mounter that irradiates light on a mounting component above a component recognition device by the imaging device illumination device according to claim 1. A component inspection apparatus for irradiating light to an electronic component to be inspected above a component recognition device by the imaging device illumination device according to claim 1.

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