JP2005353098A - Heat transport device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To effectively transport heat generated from a heating component to a case wall as a heat dissipation part independently on a component arrangement even on an electronic device in which an electronic component radiating heat is mounted together with other members in a narrow place. <P>SOLUTION: A heat transport device is provided with a heat receiving part 14 for conveying heat of the electronic component 1 as a cooling object through an internal liquid channel, the heat dissipation part 16 having a liquid channel inside it, and a liquid driving device 40 provided in a circulation path 18 connecting the heat receiving part 14 and the heat dissipation part 16. The heat dissipation part 16 and the liquid driving device 40 are mounted on predetermined positions on a base material, and the heat receiving part 14 is connected to the outside of the base material through the circulation path 18. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a heat transport device, and more particularly, to a cooling technique for an electronic device suitable for cooling an electronic component constituting the electronic device and keeping it at a predetermined temperature.

  As described in Patent Documents 1 to 3, the conventional electronic device has an independent metal plate or a metal plate constituting a part of the housing interposed between the heat generating member and the metal housing wall, The heat generated by the heat generating member is transported by heat conduction to the metal housing wall, which is a heat radiating part, and is radiated. Further, as described in Patent Document 4, a heat pipe is formed on the wall surface of the metal housing, and the heat generating member is thermally connected to the metal housing wall, so that the heat generated by the heat generating member can be reduced. Dissipate heat.

JP-A-63-250900 Japanese Patent Laid-Open No. 3-255697 Japanese Utility Model Publication No. 5-29153 JP-A-55-71092

  In the above-described conventional example, in the examples of Patent Documents 1 to 3, the heat transfer path from the heat generating member to the metal housing wall is only a thin cross section with a thickness of about 1 mm of the housing wall, so heat conduction is not efficient. Accordingly, it has not been possible to sufficiently cope with an increase in the amount of heat generation. Further, depending on the component arrangement, the metal housing wall is not always at a short conduction distance. For this reason, the arrangement of parts or the housing structure has been limited, for example, the heating member is arranged in the vicinity of the housing. On the other hand, in an electronic device or the like that requires high performance, a component arrangement including a heat generating member has a significant effect on performance due to the wiring length and the like resulting from the speeding up of the electronic circuit. Therefore, in the conventional example, downsizing and high performance of the electronic device have been hindered. Similarly, in the example of Patent Document 4, the heat generating member must be directly connected to the metal housing wall, and the component arrangement or the housing structure including the heat generating member is limited. For this reason, when priority is given to obtaining an optimal part arrangement, measures such as individually disposing heat radiating fins on the heat generating members are required, and the housing must be enlarged.

  The present invention effectively transports heat generated by a heat generating component to a heat radiating portion without being influenced by the component arrangement even in an electronic device in which a heat generating electronic component is mounted in a narrow space together with other members. This is the issue.

  In order to solve the above-mentioned problems, the present invention includes a main body that houses a wiring board on which a plurality of semiconductor elements are mounted and a keyboard is disposed on the upper side of the wiring board, and a side edge of the main body. A heat transport device used in an electronic device having a display device connected to the main body so as to be openable and closable is connected to a heat generating component of any one of the plurality of semiconductor elements and flows into the cooling liquid. A heat receiving part that transmits heat generated by the heat generating component and an inner surface of the back surface of the display device, and the heat receiving part absorbs the heat generated by the heat generating component and flows through the back surface of the display device. A heat radiating part that radiates the cooling liquid and a flexible tube that connects the heat receiving part to the heat radiating part so that the cooling liquid circulates between the heat receiving part and the heat radiating part. As a result, the heat dissipating part and the heat receiving part are connected regardless of the component arrangement of the electronic device, or the heat dissipating part and the heat receiving part can be relatively displaced by opening and closing the display device. To connect to.

  That is, according to the heat transport device of the present invention, the heat receiving part attached in contact with the electronic component that is the heat generating part and the heat radiating part integrally attached to the electronic device are connected by the liquid circulation flow path, thereby cooling liquid. Since many components are mounted in a very narrow housing, it is easy to connect the heat-generating electronic components and the heat-dissipating part without depending on the component arrangement, and cooling By circulating the liquid, the heat of the heat receiving portion can be transported to the heat radiating portion with high efficiency.

  According to the present invention, even in an electronic device in which a heat generating electronic component is mounted in a narrow space together with other members, the heat generated by the heat generating component is effectively transferred to the heat radiating portion without being influenced by the component arrangement. Can be transported.

  Several embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a first embodiment of the present invention. As shown in the figure, the electronic device is composed of a wiring board 2 on which a plurality of semiconductor elements are mounted, a keyboard 4, a disk device 6, a display device 8, and the like, and is housed in a metal housing 10. Among the semiconductor elements mounted on the wiring board 2, the semiconductor element 12 having a particularly large calorific value is composed of a heat receiving header 14 that is a heat receiving part, a heat radiating header 16 that is a heat radiating part, a flexible tube 18 that is a liquid circulation channel, and the like. Cooled by a heat transport device. As shown in the figure, the semiconductor element 12 and the heat receiving header 14 are brought into contact with each other with a thermal compound or high thermal conductive silicon rubber interposed therebetween, and the heat generated in the semiconductor element 12 is efficiently transmitted to the heat receiving header 14. Further, the heat receiving header 14 connected to the semiconductor element 12 is connected by a flexible tube 18 to a heat radiating header 16 installed on the housing wall on the back side of the display device 8. The heat radiating header 16 is thermally and physically attached to the metal housing wall through a thermal compound, high thermal conductive silicon rubber, or by means such as direct screw 20 fixing.

  A flow path is formed inside the heat receiving header 14 and the heat radiating header 16, and a liquid is sealed therein. Further, a liquid driving device is incorporated in the heat radiating header 16, and the liquid is driven between the heat receiving header 14 and the heat radiating header 16. The liquid is driven by reciprocal movement or circulation between the two. Since the heat receiving header 14 and the heat radiating header 16 are connected by a flexible tube, even when a large number of parts are mounted in a very narrow housing, the high heat generating semiconductor element is not affected by the mounting structure. The housing wall, which is a heat radiating part, can be easily connected and heat transport is performed by driving the liquid, so that the heat generated in the high heat generating semiconductor element is effectively transported to the heat radiating header. In the heat dissipating part, the heat dissipating header and the metal housing wall are thermally connected, so heat is widely diffused to the housing wall due to the high thermal conductivity of the metal housing, and high heat dissipating performance is obtained. It is done. Therefore, the semiconductor element can be efficiently cooled.

  FIG. 2 shows details of the heat transport device used in FIG. Fins are provided inside the heat receiving header 14 and the heat radiating header 16 to form a liquid flow path and efficiently transfer heat from the header wall to the liquid inside. Furthermore, the heat dissipation header 16 has a liquid drive mechanism built therein. The heat receiving header 14 can be set to an arbitrary size according to the size of a heat generating member (also referred to as the heat generating member 1) such as the semiconductor element 12, and is thermally connected to the heat generating member 1 by means such as contact. Moreover, the structure which welded the metal pipe to the metal plate (copper, aluminum, etc.) may be sufficient. On the other hand, as an example, the liquid drive mechanism inside the heat dissipation header is a mechanism in which a part of the flow path is a cylinder 22 and the piston 24 is reciprocated by a motor 26 and a link mechanism 28. Although the heat dissipation header 16 is attached to the wall of the metal casing 10, a boss 30 for screwing may be integrally formed on the casing wall at the time of die casting as an attachment structure. Further, the flexible tube 18 connecting the heat receiving header 14 and the heat radiating header 16 may be made of resin and has an inner diameter of about 2 mm. Therefore, both the heat receiving header 14 and the heat radiating header 16 can be reduced in thickness, and even a high heat generating semiconductor element mounted in a narrow space can be effectively cooled.

  FIG. 3 shows a second embodiment of the present invention. In the present embodiment, fins 32a and 32b are integrally formed on the inside of the display-side casing of the metal casing 10 to which the heat radiating header 16 is attached. The height of the fin 32a is about the same as the thickness of the heat dissipation header 16, so that the display is not hindered. Further, by providing the fins in a direction perpendicular to each other, the casing can have high rigidity. However, when the device is used, the fins 32b that are in the horizontal direction have a lower height than the fins 32a in the vertical direction so that the flow of the rising air due to natural convection is not hindered. In addition, air holes 34 are provided in the housing to promote natural convection heat dissipation.

  FIG. 4 shows a third embodiment of the present invention. In the present embodiment, the flow path 36 of the heat radiating header constituting the heat transport device is directly formed on the wall surface of the metal casing 10 by integral molding by die casting when the metal casing is molded. The flow path 36 of the heat radiation header is sealed by a lid 38 connected to the flexible tube 18, and is separately provided via the flexible tube 18 between the heat receiving header 14 attached to the heat generating semiconductor element and the flow path 36 of the heat radiation header. The liquid is driven by the liquid driving device 40 to be driven. For driving the liquid, a liquid circulation by a small pump or a liquid driving mechanism shown as an example in FIG. 2 is used. According to the present embodiment, since there is no contact thermal resistance between the heat dissipation header and the metal casing wall surface that is the heat dissipation surface, effective heat dissipation is possible, and the flow path of the heat dissipation header is integrally formed by die casting when the metal casing is molded. Therefore, a complicated channel structure can be formed.

  FIG. 5 shows a fourth embodiment of the present invention. In this embodiment, the heat dissipating part constituting the heat transport device is a metal pipe 42 and is directly attached to the metal housing 10. The metal pipe 42 is connected to the flexible tube 18 by connectors 44 a and 44 b, and is liquidated by a liquid driving device separately provided via the flexible tube 18 between the heat receiving header attached to the heat generating semiconductor element and the metal pipe 42. Is driven. The metal pipe has the same inner diameter (around 2 mm) as the flexible tube. On the other hand, a U-shaped groove portion 46 is integrally formed on the housing wall. By fitting a metal pipe into the U-shaped groove portion 46, there is no need to use a means such as welding. Can also be efficiently and thermally connected. According to the present embodiment, even if the heat radiating portion and the metal casing are in linear contact with the metal pipe, heat is widely diffused to the casing wall due to the high thermal conductivity of the metal casing. In addition, it is possible to install a metal pipe constituting the liquid flow path on the entire surface of the housing wall with a simple structure, so that a wide area of the housing wall can be effectively used as a heat radiating surface. For this reason, high heat dissipation performance is obtained.

1 is a perspective view of a first embodiment of the present invention. The detailed perspective view of the Example of FIG. The perspective view of the 2nd Example of this invention. FIG. 6 is a configuration explanatory diagram of a third embodiment of the present invention. The perspective view of the 4th Example of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 2 ... Wiring board, 4 ... Keyboard, 6 ... Disk apparatus, 8 ... Display apparatus, 10 ... Metal housing, 12 ... Semiconductor element heat generating member, 14 ... Heat receiving header, 16 ... Radiation header, 18 ... Flexible tube, DESCRIPTION OF SYMBOLS 20 ... Screw, 22 ... Cylinder, 24 ... Piston, 26 ... Motor, 28 ... Link mechanism, 30 ... Boss, 32a, 32b ... Fin, 34 ... Air hole, 36 ... Channel, 38 ... Lid, 40 ... Liquid drive device 42 ... Metal pipe, 44a, 44b ... Connector, 46 ... U-shaped groove.

Claims (2)

A main body in which a wiring board on which a plurality of semiconductor elements are mounted is accommodated and a keyboard is disposed on the upper side of the wiring board, and one side edge of the main body is connected to the main body so as to be openable and closable. In a heat transport device used for an electronic apparatus provided with a display device,
A heat receiving portion that is connected to any one of the plurality of semiconductor elements and transmits heat generated by the heat generating component to a coolant flowing through the heat generating component;
A heat dissipating part that is installed on the inner surface of the back surface of the display device, passes through a coolant that has absorbed heat generated by the heat generating component in the heat receiving unit, and diffuses heat to the back surface of the display device to dissipate the coolant;
A flexible tube that connects the heat receiving portion to the heat radiating portion so that the coolant circulates between the heat receiving portion and the heat radiating portion;
The heat-radiating part and the heat-receiving part are connected via the flexible tube without being influenced by the component arrangement of the electronic device. A main body in which a wiring board on which a plurality of semiconductor elements are mounted is accommodated and a keyboard is disposed on the upper side of the wiring board, and one side edge of the main body is connected to the main body so as to be openable and closable. In a heat transport device used for an electronic apparatus provided with a display device,
A heat receiving portion that is connected to any one of the plurality of semiconductor elements and transmits heat generated by the heat generating component to a coolant flowing through the heat generating component;
A heat dissipating part installed on the inner surface of the back surface of the display device, passing through a cooling liquid that has absorbed heat generated by the heat generating component in the heat receiving part, and thermally diffusing to the back surface of the display device to dissipate the cooling liquid;
A flexible tube that connects the heat receiving portion to the heat radiating portion so that the coolant circulates between the heat receiving portion and the heat radiating portion;
The heat transport device is characterized in that the heat dissipating part and the heat receiving part are connected via the flexible tube so as to be relatively displaceable by opening and closing the display device.

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