JP2005347412A - Sucked state inspection apparatus, surface mounter, and part testing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enable a more accurate inspection of the state of an electronic part as sucked to a suction member. <P>SOLUTION: A special section 1220 is formed on a suction nozzle 122 for sucking an electronic part. The level of the lower end of the electronic part is determined by a side face imaging camera 142, the level of the special section 1220 is determined by using an image taken of the special section 1220, and, based on the positional relationship of the special section 1220 to the lower end of the suction nozzle 122, the distance between the lower end of the suction nozzle 122 and the lower end of the electronic part is calculated. An operating means is provided for inspecting the state of the electronic part as sucked to the suction nozzle 122 based on the calculation result. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention is provided in a surface mounting machine for mounting an electronic component such as an IC chip on a printed circuit board or the like, or a component testing apparatus for inspecting the electronic component, and the electronic component is adsorbed by an adsorbing member having an adsorption nozzle or the like. The present invention also relates to a suction state inspection apparatus that images the electronic component and determines the suction state when the electronic component is moved from a predetermined position to a target position.

  Conventionally, a surface mounter that picks up an electronic component such as an IC chip from a predetermined position and mounts the electronic component on a printed circuit board, or inspects the electronic component by bringing the picked-up electronic component into contact with an inspection electric circuit. The following are mainly known as a component conveying apparatus such as a component testing apparatus.

  The component conveying apparatus includes an adsorption member that adsorbs the electronic component and picks up the electronic component, and a head unit having a plurality of the adsorption members, and the printed circuit board is moved from the predetermined position by moving the head unit. The electronic component is transported to a place where the electronic circuit for inspection is arranged or a place where the electric circuit for inspection is arranged.

  When such an apparatus is used, there may be a position shift or a suction error when the electronic component is sucked by the suction member. In order to transport the electronic component in a normal state, a position shift or a suction mistake is required. It is necessary to inspect whether it has occurred.

  Therefore, as an adsorption state inspection apparatus for performing such an inspection, a light source for irradiating the adsorption member and the electronic component from the side, and a side of the adsorption member and the electronic component by receiving light from the light source. (For example, Patent Document 1).

  In such an inspection apparatus, first, the suction member in a state where the electronic component is not sucked is imaged by the imaging means, and the height of the lower end portion of the suction member is recognized. Next, the electronic component is adsorbed to the lower end portion of the adsorption member, and this state is imaged by the imaging means. The height of the lower end portion of the adsorption member that has been recognized in advance is set to any height. It is recognized by calculating with a calculation means such as a CPU whether or not it exists below, and based on that, it is determined whether or not the adsorption member is normally adsorbed.

In addition, in order to check the displacement of the suction position of the electronic component and correct the component mounting position according to the displacement, for example, the imaging for picking up the suction member and the electronic component as described in Patent Document 2 is performed. There is known a device provided with a means for inspecting a suction state of an electronic component on a suction member using an image obtained by the imaging means. This device first adjusts the distance between the lower end of the electronic component and the imaging means to an appropriate position to focus, then images the electronic component using the imaging means, and further uses the captured image. By detecting the displacement of the electronic component, the suction state of the electronic component is inspected.
JP-A-6-45790 Japanese Patent No. 2801331

  In order to determine whether or not the adsorption member is normally adsorbed and to detect a displacement of the adsorption position of the adsorption member, it is preferable to use the two devices described above in combination. However, when the above device is used in combination, the distance between the lower end portion of the electronic component and the image pickup means is set to an appropriate position for normal imaging from the bottom in order to detect displacement of the electronic component. In order to adjust the focus, it is necessary to move the suction member in the vertical direction according to the shape (for example, thickness) of the electronic component.

  When the suction member is moved in the vertical direction in this way, the height of the lower end portion of the suction member changes accordingly, especially when the electronic component is sucked to the lower end portion of the suction member, the above side It is also conceivable that the image pickup means for picking up an image from one side cannot recognize the height of the lower end portion of the suction member.

  If the height of the lower end cannot be recognized, the difference between the height of the lower end of the suction member and the height of the lower end of the electronic component cannot be measured accurately, and the suction state of the electronic component There may be a situation where the inspection cannot be performed accurately.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an adsorption state inspection device and an adsorption state inspection method that can solve such problems and can more accurately inspect the adsorption state of an electronic component in an adsorption member.

  In order to solve the above-described problems, the present invention provides a component conveying unit provided with an adsorption member that adsorbs an electronic component so that the vertical position can be adjusted, and an image of the adsorption member and the electronic component adsorbed by the adsorption member from the side. First imaging means for obtaining a side image; and second imaging means for obtaining a bottom image by imaging the electronic component adsorbed by the adsorption member from a position perpendicular to or substantially perpendicular to the electronic component adsorption surface. An adsorption state inspection device that inspects an adsorption state using images captured by the first imaging unit and the second imaging unit, and a part that is in a predetermined positional relationship with respect to a lower end portion of the adsorption member, A feature portion recognizable from an image captured from the side is provided, and the height position of the lower end portion of the electronic component detected from the image obtained by imaging by the first imaging means and the image obtained by imaging the feature portion Based on the height position of the feature portion to be taken out and the positional relationship of the feature portion with respect to the lower end portion of the adsorption member, the distance from the lower end portion of the adsorption member to the lower end portion of the electronic component is calculated, An arithmetic means for inspecting the suction state of the electronic component based on the arithmetic result is provided.

  According to this configuration, the calculation of the distance from the lower end portion of the suction member to the lower end portion of the electronic component is performed by detecting the height position of the lower end portion of the electronic component and the image obtained by imaging the characteristic portion. This is performed based on the height position of the characteristic portion and the positional relationship of the characteristic portion with respect to the lower end portion of the adsorption member.

  That is, since the calculation of the distance from the lower end portion of the suction member to the lower end portion of the electronic component can be performed with reference to a feature portion that can be recognized from an image captured from the side, the suction member Even when moving to, the above calculation can be performed accurately. Therefore, it is possible to more accurately inspect the suction state of the electronic component.

  In the adsorption state inspection device of the present invention, it is more preferable that the adsorption member includes a plurality of types having different shapes, and the characteristic portions have the same shape regardless of the type of the adsorption member.

  According to this configuration, data for recognizing the characteristic portion can be shared even when a plurality of types of the suction members are provided to be sucked in an appropriate state according to the shape of the electronic component. It is possible to reduce the burden on the storage portion of this data.

  In the suction state inspection apparatus according to the present invention, it is more preferable that the first imaging unit and the second imaging unit perform imaging substantially simultaneously.

  According to this configuration, it is possible to shorten the time taken for imaging, and it is possible to perform the inspection more efficiently.

  In the suction state inspection apparatus according to the present invention, the characteristic portion is provided at a position outside the field of view of the first imaging unit when the first imaging unit images the suction member and the electronic component sucked by the suction member. Further, a third imaging means for imaging the characteristic portion from the side may be provided.

  However, the configuration of the apparatus is simplified when the characteristic portion is provided at a position that is within the field of view of the first imaging unit when the first imaging unit images the adsorption member and the electronic component adsorbed thereto. This is more preferable in terms of cost reduction.

  In addition, the present invention includes the suction state inspection device, a component supply unit that supplies the electronic component, and a printed board supply unit that supplies a printed board on which the electronic component is mounted, and is provided in the suction state inspection device. In addition, the electronic component is transported from the component supply unit to the board placement position where the printed board is placed by the printed board supply means, and the electronic component is mounted on the printed board. It is a surface mounting machine characterized by enabling.

  Furthermore, the present invention includes the component conveying means provided in the adsorption state inspection device, comprising the adsorption state inspection device, a component supply unit that supplies the electronic component, and an inspection electric circuit that inspects the electronic component. Thus, it is possible to transport the electronic component from the component supply unit toward a position where the electrical circuit for inspection is arranged, and to inspect the electronic component with the electronic circuit for inspection. This is a component inspection device.

  According to the suction state inspection device of the present invention, the calculation of the distance from the lower end portion of the suction member to the lower end portion of the electronic component can be performed based on a feature portion that can be recognized from an image captured from the side. Therefore, even when the adsorption member moves in the vertical direction, the calculation can be accurately performed. Therefore, it is possible to more accurately inspect the suction state of the electronic component in the suction component.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a partial plan view of a surface mounter equipped with an adsorption state inspection apparatus according to the present invention. FIG. 2A is a partial side view of the same. The surface mounter of this embodiment mounts an electronic component C (a small chip component such as an IC, a transistor, or a capacitor: (see FIG. 3B)) on the printed circuit board P mainly by operation of each part mechanism. It comprises a main body mechanism unit 100 and a controller 200 (see FIG. 4) that controls the operation thereof. The main body mechanism unit 100 includes a mounting machine body composed of a base 110 and the like, and a head unit 120 (component conveying means) that is movable relative to the mounting machine body. A printed board carrying conveyor 111 (printed board supply means) is arranged on the base 110, and the printed board P is carried on the conveyor 111 and stopped at a predetermined mounting work position. Yes.

  On both sides of the conveyor 111, component supply units 112 are arranged. These component supply units 112 are provided with multiple rows of tape feeders 112a. Each of the tape feeders 112a is configured such that the tape that holds and holds the electronic component C at predetermined intervals is led out from the reel, and the electronic component C is intermittently taken out by the head unit 120. ing.

  Above the base 110, a head unit 120 for mounting components is provided. The head unit 120 is movable over the component supply unit 112 and the board arrangement position on which the printed board P is arranged, and can move in the X-axis direction and the Y-axis direction.

  That is, a fixed rail 113 in the Y-axis direction and a ball screw shaft 115 that is rotationally driven by a Y-axis servo motor 114 are disposed on the base 110, and a head unit support member 116 is mounted on the fixed rail 113. The nut portion 116 a provided on the support member 116 is screwed onto the ball screw shaft 115.

  Further, the support member 116 is provided with a guide member 117 in the X-axis direction and a ball screw shaft 119 driven by an X-axis servo motor 118, and the head unit 120 is movably held by the guide member 117. A nut portion (not shown) provided on the head unit 120 is screwed onto the ball screw shaft 119. The support member 116 is moved in the Y-axis direction by the operation of the Y-axis servo motor 114, and the head unit 120 is moved in the X-axis direction with respect to the support member 116 by the operation of the X-axis servo motor 118. ing.

  That is, the head unit 120 is movable by the Y-axis servo motor 114, the ball screw shaft 115, the head unit support member 116, the X-axis servo motor 118, and the ball screw shaft 119.

  The head unit 120 is provided with one or a plurality of mounting heads 121 each having a suction nozzle 122 (suction member) at the tip, and in the illustrated example, six mounting heads 121 are provided.

  Each suction nozzle 122 of these mounting heads 121 is formed with a characteristic portion 1220 at a position located a predetermined height above its lower end (see FIG. 3A). The feature portion 1220 is formed in a shape protruding in the horizontal direction, and it is recognized at a glance that the location where the feature portion is formed is a predetermined height from the lower end of each suction nozzle 122. It has become a landmark that can.

  Note that the feature portion 1220 does not necessarily have a shape protruding from the suction nozzle 122 as described above as long as the feature portion 1220 can have the above-described mark function. For example, it may be formed in a concave shape.

  The head unit 120 is provided with a Z-axis servomotor 123 and a Z-axis ball screw shaft 124 that is rotationally driven by the Z-axis servomotor 123 for each mounting head 121.

  A nut member 125 attached to each mounting head 121 in a relatively rotatable state is screwed into the Z-axis ball screw shaft 124, and the ball screw shaft 124 is rotationally driven by the Z-axis servo motor 123. As a result, the mounting head 121 moves in the vertical direction.

  Further, a rotation mechanism 127 that rotates the mounting head 121 about its axis (around the R axis) is arranged for each mounting head 121. These rotation mechanisms 127 are R-axis servomotors 128 (see FIG. 4). ) Is connected to each. Then, by driving the R-axis servo motor 128, each mounting head 121 rotates around the R-axis.

  A support member 129 is provided at the lower end of the head unit 120, and side surface illuminations 130 for irradiating the suction nozzles 122 from the side (horizontal direction) are disposed at the tip of the support member 129. .

  A camera support portion 141 extends from a predetermined portion of the head unit support member 116, and a side surface imaging camera 142 (first image pickup means) is attached to the lower end of the camera support portion 141. Note that the side surface imaging illumination 130 and the side surface imaging camera 142 are arranged in a state of facing each other with the suction nozzle 122 interposed therebetween.

  The side surface imaging camera 142 images the suction nozzle 122 from the side, and can obtain a transmission image from the side near the lower end of the suction nozzle 122 including the characteristic portion 1220. . Note that when the side imaging illumination 130 is disposed in the vicinity of the side imaging camera 142 so as to obtain a reflected image around the lower end portion of the suction nozzle 122, the feature portion 1220 is the side surface of the suction nozzle. It may be engraved or painted.

  Further, on the base 110, a bottom surface imaging camera 151 (second imaging unit) and a bottom surface imaging illumination 152 for imaging the suction nozzle 122 from below are arranged. By using these components, suction is performed. It is possible to obtain an image from below around the lower end of the nozzle 122. When the suction nozzle 122 is mounted on the turret type head, when imaging is performed with the suction nozzle inverted or laterally positioned, the bottom surface imaging camera 151 captures images from above or from the lateral direction. . That is, it is only necessary to pick up an image from a direction (a direction facing the bottom surface of the electronic component) away from the suction nozzle 122 in a direction perpendicular or substantially perpendicular to the electronic component suction surface.

  Next, the control system in this embodiment is demonstrated using FIG.

  The controller 200 is provided at an appropriate position inside the main body mechanism unit 100, and is a well-known CPU for executing logical operations, a ROM for storing various programs for controlling the CPU in advance, and various data temporarily during operation of the apparatus. It is comprised from RAM etc. which memorize | store. The controller 200 includes an axis control unit 201, an imaging device control unit 202, an image memory 203, a mounting information storage unit 204, a machine information storage unit 205, and a calculation unit 206 as functional configurations. Note that a display device 171 for displaying various types of information is connected to the calculation means 206.

  The configuration including the controller 200, the head unit 120, the side surface imaging camera 142, the bottom surface imaging camera 151, and the bottom surface imaging illumination 152 functions as the suction state inspection device according to the present embodiment.

  The axis control means 201 includes a Y-axis servo motor 114, an X-axis servo motor 118, a Z-axis servo motor 123 (first head Z-axis servo motor to sixth head Z-axis servo motor) provided in the surface mounting machine, And it controls the drive of the R-axis servo motor 128 (first head R-axis servo motor to sixth head R-axis servo motor).

  The imaging device control unit 202 controls operations of the side surface imaging camera 142, the bottom surface imaging camera 151, the side surface imaging illumination 130, and the bottom surface imaging illumination 152.

  The image memory 203 stores image data obtained by imaging with the side surface imaging camera 142 and the bottom surface imaging camera 151.

  The mounting information storage unit 204 stores information about the electronic component C mounted on the printed circuit board P. For example, the mounting information storage unit 204 stores data on the shape, such as thickness, width, and height of the electronic component C, and what type The information such as where to mount the electronic component C is stored. In addition, data indicating an image from the bottom surface in a state where these electronic components C are attracted to the suction nozzle 122 in a normal state is also stored. Further, a prescribed value for determining whether or not the electronic component C is attracted in a normal state is also stored.

  The machine information storage unit 205 stores, for example, information related to the surface mounter of the present embodiment. For example, the shape of the feature portion 1220 and the lower end portion of each suction nozzle 122 to the feature portion 1220 are stored. Data relating to the length L10 (see FIGS. 3B to 3D) and the like are stored.

  The calculation means 206 has a calculation function such as a CPU. In this calculation means 206, calculation processing is performed using image data stored in the image memory 203, data stored in the mounting information storage means 204 and machine information storage means 205, control data from the axis control means 201, and the like. And control each element of the apparatus based on the calculation result.

  In particular, when inspecting the suction state of the electronic component C, the height position of the lower end portion of the electronic component C and the feature portion 1220 is detected from the image captured by the side surface imaging camera 142 stored in the image memory 203. Then, a distance L11 (see FIG. 3B) between the characteristic portion 1220 and the lower end portion of the electronic component C is calculated, and the characteristic is calculated from this distance L11 and the lower end portion of the suction nozzle 122 stored in the machine information storage unit 205. A distance L12 from the lower end portion of the suction nozzle 122 to the lower end portion of the electronic component C is calculated based on the length L10 to the portion 1220, and this result and the electronic component C stored in the mounting information storage unit 204 are calculated. By checking the thickness of the electronic component, it is possible to inspect the suction state of the electronic component.

  Next, a procedure relating to the operation of this apparatus will be described with reference to FIG.

  First, the head unit 120 is arranged on the component supply unit 112, and 1 is set as an initial value in a counter N1 for selecting the suction nozzle 122 to be operated (step S1).

  Next, the Z-axis servo motor 123 (the first head Z-axis servo motor in the initial value) to be operated is operated to lower the suction nozzle 122 and suck the electronic component C (step S2).

  Further, the Z-axis servo motor 123 is operated to raise the suction nozzle 122 so that the lower surface thereof is in focus with the bottom surface imaging camera 151 according to the electronic component C sucked to the lower end portion of the suction nozzle 122. (Step S3).

  If the electronic component C is not picked up by all the suction nozzles 122 to be subjected to the soft suction operation (NO in step S4), 1 is added to the counter N1 (step S5), and the process proceeds to step S2. Return. That is, the suction operation of the electronic component C is performed in the suction nozzle 122 (for example, the second suction nozzle 122b when the counter N1 is 2) as the next operation target. This operation is performed until the electronic component C is sucked by all the suction nozzles 122 to be targeted.

  When the electronic component C is attracted to all the suction nozzles 122 (YES in step S4), 1 is set as an initial value in the counter N2 for selecting the suction nozzle 122 to be imaged (step S6). Further, the Y-axis servo motor 114 and the X-axis servo motor 118 are operated to move the head unit above the bottom surface imaging camera 151 (step S7).

  Next, in step S <b> 8, the bottom surface imaging camera 151 and the bottom surface imaging illumination 152 are operated to capture an image from the bottom surface of the electronic component C or the tip portion of the suction nozzle 122. Then, the captured image is stored in the image memory 203.

  Then, the calculation means 206 collates this captured image with the image from the bottom surface showing the state in which the electronic component C stored in the mounting information storage means 204 is sucked in a normal state, and calculates the correction amount. Calculate (step S9). When this correction amount is outside the range of the predetermined value stored in advance in the machine information storage means 205, or when the electronic component C itself is not picked up, that is, when the recognition state is not good (NO in step S10). ), Error processing is performed such as displaying an error on the display device 171 and waiting for a return treatment by the operator (step S11), and then proceeds to step S14 described later.

  If this correction amount is within the range of the specified value, that is, if the recognition state is good, in step S12, the side imaging illumination 130 (the first side imaging illumination 130a when the counter N2 is 1) and The side imaging camera 142 is operated to capture an image from the side of the tip of the electronic component C or the N2nd suction nozzle, and this captured image is stored in the image memory 203.

  Further, the thickness of the part is calculated by the calculation means 206 using the image from the side (step S13). Details of the procedure for calculating the thickness of the component will be described in a subroutine described later.

  If all the suction nozzles 122 have not been inspected (NO in step S14), 1 is added to the counter N2 (step S15), and the process returns to step S7.

  When inspection of all the suction nozzles is completed (YES in step S14), the head unit 120 starts to be mounted to mount the electronic component C (step S16), and the electronic component C is mounted on the printed circuit board P (step S16). S17).

  Next, a subroutine relating to component thickness calculation will be described with reference to FIG.

  First, information on the length L10 from the lower end portion of the suction nozzle 122 to the feature portion 1220 is read from the machine information storage unit 205 (step S31).

  Next, the height position of the feature portion 1220 is detected using the image captured from the side stored in the image memory 203 (step S32). If this detection is not possible (NO in step S33), error processing is performed such as displaying an error on the display device 171 and waiting for a return treatment by the operator (step S34), and this subroutine is terminated.

  When this detection is successful (YES in step S33), the height position of the lower end portion of the electronic component C is detected. When the lower end portion of the electronic component C cannot be detected as in the state illustrated in FIG. 3D (NO in step S36), an error is displayed on the display device 171 (step S34), and this subroutine is terminated. When the lower end portion can be detected (YES in step S36), the shape of the electronic component is checked (step S37), this shape is determined (step S38), and if the lower end surface is inclined, there is a suction failure. If the lower end surface is almost parallel to the lower end portion of the suction nozzle, that is, the suction surface, the process proceeds to step S39 to calculate the thickness of the electronic component C.

  In step S39, first, a distance L11 between the feature portion 1220 and the lower end portion of the electronic component C is used using the height position of the feature portion 1220 and the height position of the lower end portion of the electronic component C that have already been detected. b)) is calculated.

  Next, based on the distance L11 and the length L10 from the lower end portion of the suction nozzle 122 to the feature portion 1220 stored in the machine information storage means 205, the lower end portion of the suction nozzle 122 and the lower end of the electronic component C are stored. The distance L12 to the part is calculated.

  Then, the distance L12 is compared with the thickness of the electronic component C stored in the mounting information storage unit 204, and for example, as shown in FIG. In other words, if the range of the dimensional tolerance in the thickness of the electronic component C is exceeded, the subroutine is terminated after displaying an error on the display device 171 (step S34). finish.

  FIG. 7 is a flowchart showing adjustment processing of the scale of the side surface imaging camera and the height of the mounting head. In this adjustment processing, data necessary for the above-described thickness calculation of the components is examined and stored in advance. This is done at the time of factory shipment or maintenance. In this flowchart, it is assumed that nozzles selected from a plurality of types of nozzles are interchangeably mounted on each mounting head, and a plurality of heads and a plurality of types of nozzles that are selectively mounted on each head. Adjustment processing is performed for each.

  In the adjustment process, a specific mounting head 121 and a specific nozzle among a plurality of types of suction nozzles 122 selectively attached to the head are set in advance as a reference head and a reference nozzle. A reference nozzle is set (step S51). Subsequently, the controller is requested to confirm that nothing is attached to the nozzle (step S52), and it is determined whether or not there is an input indicating confirmation that the nozzle is not attached (step S53). If there is, a request for return by the coordinator is requested (step S54).

  When it is confirmed that nothing is attached to the nozzle (when the determination in step S3 is YES), the head 121 is set to the initial height state, and in this state, the nozzle 122 is based on the imaging by the side imaging camera 142. , And the feature portion 1220 are detected (step S55).

  Then, it is determined whether or not the scale has already been calculated (step S56), and if it has been calculated, the process proceeds to step S59 described later. The lower end and the characteristic portion 1220 are detected (step S57). A scale is calculated based on the amount of movement of the head 121 and the difference between the lower end of the nozzle 122 and the characteristic portion 1220 detected in steps S55 and S57, respectively, and is stored in the machine information storage unit (step S58). Proceed to step S59.

  In step S59, it is determined whether the current investigation target is a reference head or a reference nozzle. If the reference head and the reference nozzle are used, the process proceeds to step S61 described below. If not, the corrected initial height of the corresponding head and nozzle is set to be the same as the lower end position of the reference head and the reference nozzle at the initial height. Is stored in the machine information storage unit (step S60), and then the process proceeds to step S61.

  In step S61, it is determined whether or not the adjustment process has been completed for all nozzle types that may be selectively attached to the head. If not, the nozzle is replaced with the next nozzle (step S62). Returning to step S52, the following processing is repeated.

  When the adjustment process is completed for all nozzle types for the corresponding head, the shape of the lower edge of the component is checked (step S63), and then it is determined whether the adjustment process is completed for all heads (step S64). If not, the adjustment target is changed to the next head (step S65), and the process returns to step S52 to repeat the subsequent processing.

  When the adjustment process is completed for all the heads, the process of this flowchart is completed.

  According to the configuration of the present embodiment, the calculation of the distance L12 from the lower end portion of the suction nozzle 122 to the lower end portion of the electronic component C is performed by calculating the height position of the lower end portion of the electronic component C and the height position of the characteristic portion 1220. And based on a distance L10 from the lower end portion of the suction nozzle 122 to the characteristic portion 1220.

  That is, the calculation of the distance L12 from the lower end portion of the suction nozzle 122 to the lower end portion of the electronic component C can be performed based on the feature portion 1220 that can be recognized from the image captured from the side. Even when moving in the vertical direction, the distance L12 from the lower end of the suction nozzle 122 to the lower end of the electronic component C can be accurately calculated. Therefore, it is possible to more accurately inspect the suction state of the electronic component C.

  In addition, the side imaging camera 142 can obtain an image from the side near the lower end of the suction nozzle including the characteristic portion 1220. That is, since both the characteristic portion 1220 and the lower end portion of the suction nozzle 122 can be imaged by the same camera, the configuration of the apparatus can be simplified.

  Although one embodiment of the present invention has been described above, other modifications may be made as appropriate within the scope of the claims. Examples of these modifications mainly include the following.

Second embodiment (see FIG. 8)
In the present embodiment, unlike the first embodiment, imaging of the suction nozzle 122 and imaging of the characteristic portion 1220 are performed by separate cameras.

  First, the feature portion 1220 is disposed above the suction nozzle 122, that is, outside the field of view of the side surface imaging camera 142.

  As a means for imaging the feature portion 1220, a feature portion imaging camera 161 (third imaging means) and a feature portion imaging illumination 162 are arranged on the top of the head unit 120. The operations of the feature portion imaging cameras 161 and 162 are controlled by the imaging device control means 202 as shown in the block diagram of FIG.

  Further, in the operation for examining the suction state, the feature portion imaging camera 161 and the feature portion imaging illumination 162 are operated to image the feature portion 1220 in tandem with the process of step S12 (see FIG. 5). Operation is also added. Then, based on the imaging by the feature portion imaging illumination 162, the amount of displacement from the reference height position of the feature portion (the height position of the feature portion 1220 when the suction nozzle 122 is raised to the predetermined reference height) is examined, The position of the lower end of the suction nozzle 122 is obtained based on this displacement amount, and the lower end of the suction nozzle 122 is obtained from this and the height position of the lower end portion of the electronic component obtained based on the image taken by the side surface imaging camera 142. The distance from the part to the lower end part of the electronic component C is accurately calculated.

  Note that the imaging of the feature part 1220 by the feature part imaging camera 161 and the feature part imaging illumination 162 and the imaging of the suction nozzle 122 by the side imaging camera 142 and the side imaging illumination 130 are performed at substantially the same timing. .

  Further, in the scale and mounting head height adjustment processing performed at the time of factory shipment, maintenance, etc., the processing in step S55 and steps S57 and S58 in FIG. This is performed for both of the cameras 161.

Other Embodiments (1) In the surface mounting machine of the present invention, the suction nozzle 122 has a plurality of types of shapes and is detachable from the main body portion of the mounting head 121, and the shape of the electronic component C It is preferable that the suction nozzle 122 can be appropriately replaced according to the point that the suction state of the electronic component C can be improved. When such a configuration is adopted, the feature portion 1220 may have the same shape regardless of the shape of the suction nozzle 122, so that it is not necessary to increase the types of the shape of the feature portion 1220 to be stored in the machine information storage means 205, This is preferable because the capacity can be reduced.

  (2) The component recognition apparatus of the present embodiment is not applicable only to a surface mounter, and may be applied to, for example, a component inspection apparatus provided with an inspection electric circuit for inspecting the electronic component C. Is possible. In addition, when applied to such a configuration, the head unit 120 moves over the position where the component supply unit 112 and the inspection electric circuit are arranged.

1 is a plan view schematically showing a surface mounter according to a first embodiment of the present invention. It is the schematic which showed the head unit periphery part in the II-II cross section of FIG. (A) is the side view which showed the front-end | tip part periphery of the suction nozzle, (b)-(d) is the image which imaged the front-end | tip part periphery of the suction nozzle in the state which adsorb | sucked the electronic component with the side surface imaging camera. FIG. It is a schematic control block diagram of the surface mounter. It is a schematic flowchart which shows operation | movement of the said surface mounting machine. It is the general | schematic flowchart which showed the subroutine for determining the adsorption | suction state of an electronic component in operation | movement of the said surface mounting machine. It is a flowchart which shows the adjustment process of the scale of a side surface imaging camera, and the height of the head for mounting. It is the schematic which showed the side surface cross section of the head unit periphery part of the surface mounter concerning 2nd Embodiment of this invention. It is a schematic control block diagram of the surface mounting machine concerning 2nd Embodiment of this invention.

Explanation of symbols

111 Conveyor (printed board supply means)
112 Component supply unit 120 Head unit (component conveying means)
122 Suction nozzle (Suction member)
142 Side imaging camera (first imaging means)
151 Bottom imaging camera (second imaging means)
161 Feature Part Imaging Camera (Third Imaging Unit)
206 Calculation means 1220 Characteristic part C Electronic component P Printed circuit board

Claims (7)

Component conveying means provided with an adsorption member that adsorbs electronic components so that the vertical position can be adjusted,
First imaging means for capturing a side image by imaging the adsorption member and the electronic component adsorbed thereto from the side;
A second imaging unit that captures an image of the electronic component adsorbed by the adsorbing member from a position perpendicular to or substantially perpendicular to the electronic component adsorption surface and obtains a bottom image;
An adsorption state inspection device that inspects an adsorption state using images captured by the first imaging unit and the second imaging unit,
While providing a feature portion that can be recognized by an image captured from the side, in a portion that is in a predetermined positional relationship with the lower end portion of the adsorption member,
The height position of the lower end portion of the electronic component detected from the image obtained by imaging by the first imaging means, the height position of the feature portion detected from the image obtained by imaging the feature portion, and the suction member Calculation that calculates the distance from the lower end of the suction member to the lower end of the electronic component based on the positional relationship of the characteristic portion with respect to the lower end, and inspects the suction state of the electronic component based on the calculation result An adsorption state inspection apparatus characterized by comprising means. In the adsorption state inspection device according to claim 1,
The adsorbing member comprises a plurality of types having different shapes,
The attraction state inspection device, wherein the characteristic portion has the same shape regardless of the type of the attraction member. In the adsorption | suction state inspection apparatus in any one of Claim 1 or 2,
The adsorption state inspection apparatus characterized in that imaging by the first imaging means and the second imaging means is performed substantially simultaneously. In the adsorption | suction state inspection apparatus in any one of Claims 1-3,
An adsorption state inspection apparatus, wherein the characteristic portion is provided at a position within the field of view of the first imaging means when the first imaging means images the adsorption member and the electronic component adsorbed thereto. In the adsorption | suction state inspection apparatus in any one of Claims 1-3,
The characteristic portion is provided at a position outside the field of view of the first imaging means when the first imaging means images the adsorption member and the electronic component adsorbed thereto, and the characteristic portion is imaged from the side. An adsorption state inspection apparatus comprising three imaging means. The adsorption state inspection device according to any one of claims 1 to 5,
A component supply unit for supplying the electronic component;
A printed circuit board supply means for supplying a printed circuit board on which the electronic component is mounted,
The electronic component is conveyed from the component supply unit to the board arrangement position where the printed board is arranged by the printed board supply means by the component conveyance means provided in the suction state inspection device,
A surface mounting machine characterized in that it is possible to mount this electronic component on the printed circuit board. The adsorption state inspection device according to any one of claims 1 to 5,
A component supply unit for supplying the electronic component;
An inspection electric circuit for inspecting the electronic component,
The electronic component is conveyed from the component supply unit to a position where the electric circuit for inspection is arranged by the component conveying means provided in the adsorption state inspection device, and the electronic component is transferred to the electronic circuit for inspection. It is possible to inspect with a component testing device.

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