JP2005290409A5 - - Google Patents

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Publication number: JP2005290409A5
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP2004102899A

Other languages

Japanese (ja)

Other versions

JP2005290409A (en

JP4356071B2 (en

Filing date

2004-03-31

Publication date

2006-08-24

2004-03-31 Application filed filed Critical

2004-03-31 Priority claimed from JP2004102899A external-priority patent/JP4356071B2/en

2004-03-31 Priority to JP2004102899A priority Critical patent/JP4356071B2/en

2005-03-03 Priority to US11/070,339 priority patent/US20050230244A1/en

2005-03-25 Priority to CNB2005100594763A priority patent/CN100447290C/en

2005-03-30 Priority to KR1020050026676A priority patent/KR100665243B1/en

2005-03-30 Priority to TW094109924A priority patent/TWI310407B/en

2005-10-20 Publication of JP2005290409A publication Critical patent/JP2005290409A/en

2006-08-24 Publication of JP2005290409A5 publication Critical patent/JP2005290409A5/ja

2006-09-08 Priority to KR1020060086790A priority patent/KR20060102322A/en

2009-06-05 Priority to US12/479,121 priority patent/US8409498B2/en

2009-11-04 Publication of JP4356071B2 publication Critical patent/JP4356071B2/en

2009-11-04 Application granted granted Critical

2024-03-31 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Description

JP2004102899A 2004-03-31 2004-03-31 Sputtering target material and manufacturing method thereof Expired - Lifetime JP4356071B2 (en)

Priority Applications (7)

Application Number	Priority Date	Filing Date	Title
JP2004102899A JP4356071B2 (en)	2004-03-31	2004-03-31	Sputtering target material and manufacturing method thereof
US11/070,339 US20050230244A1 (en)	2004-03-31	2005-03-03	Sputter target material and method of producing the same
CNB2005100594763A CN100447290C (en)	2004-03-31	2005-03-25	Sputter target material and method of producing the same
TW094109924A TWI310407B (en)	2004-03-31	2005-03-30	Sputter target material and method of producing the same
KR1020050026676A KR100665243B1 (en)	2004-03-31	2005-03-30	Sputtering Target Material and Manufacturing Method Thereof
KR1020060086790A KR20060102322A (en)	2004-03-31	2006-09-08	Sputtering Target Material and Manufacturing Method Thereof
US12/479,121 US8409498B2 (en)	2004-03-31	2009-06-05	Method of producing a sputter target material

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2004102899A JP4356071B2 (en)	2004-03-31	2004-03-31	Sputtering target material and manufacturing method thereof

Publications (3)

Publication Number	Publication Date
JP2005290409A JP2005290409A (en)	2005-10-20
JP2005290409A5 true JP2005290409A5 (en)	2006-08-24
JP4356071B2 JP4356071B2 (en)	2009-11-04

Family

ID=35323679

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2004102899A Expired - Lifetime JP4356071B2 (en)	2004-03-31	2004-03-31	Sputtering target material and manufacturing method thereof

Country Status (1)

Country	Link
JP (1)	JP4356071B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP7108606B2 (en)	2016-09-29	2022-07-28	プランゼーエスエー	sputtering target

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2008255440A (en) *	2007-04-06	2008-10-23	Hitachi Metals Ltd	MoTi ALLOY SPUTTERING TARGET MATERIAL
AT10578U1 (en) *	2007-12-18	2009-06-15	Plansee Metall Gmbh	DUNGOUS SOLAR CELL WITH MOLYBDAN-CONTAINING ELECTRODE LAYER
JP5518375B2 (en) *	2008-09-19	2014-06-11	山陽特殊製鋼株式会社	Formed body made of molybdenum alloy having excellent drillability for accelerating electrode and method for producing the same
JP5287669B2 (en) *	2009-11-04	2013-09-11	住友金属鉱山株式会社	Method for producing zinc oxide-based oxide pellets for vacuum deposition
US8449817B2 (en)	2010-06-30	2013-05-28	H.C. Stark, Inc.	Molybdenum-containing targets comprising three metal elements
US8449818B2 (en) *	2010-06-30	2013-05-28	H. C. Starck, Inc.	Molybdenum containing targets
US9334565B2 (en)	2012-05-09	2016-05-10	H.C. Starck Inc.	Multi-block sputtering target with interface portions and associated methods and articles
AT13602U3 (en)	2013-10-29	2014-08-15	Plansee Se	Sputtering target and method of preparation
US10704137B2 (en) *	2014-09-30	2020-07-07	Jx Nippon Mining & Metals Corporation	Master alloy for sputtering target and method for producing sputtering target
JP7205213B2 (en) *	2018-03-27	2023-01-17	日立金属株式会社	TiW alloy target and manufacturing method thereof
JP7267086B2 (en) *	2019-05-07	2023-05-01	株式会社アルバック	Sputtering target manufacturing method
CN111850490B (en) *	2020-07-29	2023-01-20	丰联科光电(洛阳)股份有限公司	Binary molybdenum alloy sputtering target material and preparation method thereof

2004
- 2004-03-31 JP JP2004102899A patent/JP4356071B2/en not_active Expired - Lifetime

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP7108606B2 (en)	2016-09-29	2022-07-28	プランゼーエスエー	sputtering target

Publication	Publication Date	Title
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JP2006045672A5 (en)	2008-05-15
JP2007119645A5 (en)	2008-09-11
JP2006063441A5 (en)	2007-09-06
JP2006523255A5 (en)	2007-04-26
JP2006101735A5 (en)	2007-12-20
JP2008525570A5 (en)	2011-09-01
JP2004262980A5 (en)	2006-03-30
JP2007525546A5 (en)	2011-03-10
JP2005290409A5 (en)	2006-08-24
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JP2006273834A5 (en)	2007-03-22
JP2008525527A5 (en)	2008-12-18

JP2005290409A5 - - Google Patents

Info

Links

Description

Priority Applications (7)

Applications Claiming Priority (1)

Publications (3)

Family

ID=35323679

Family Applications (1)

Country Status (1)

Cited By (1)

Families Citing this family (12)

Cited By (1)

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