JP2005289784A - Method for producing inorganic board and inorganic decorative board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for producing an inorganic board, by which an inorganic board comprising a mineral fiber, an inorganic powder body, and a binder as essential components, having good adhesiveness to a decorative board and enabling satisfactory formation of the decorative layer in the form of a mirror finished surface etc., is produced in excellent productivity and to provide an inorganic decorative board comprised of the inorganic board as a substrate. <P>SOLUTION: The inorganic board having the satisfactory adhesiveness to the decorative layer and having excellent surface smoothness is formed by mixing and dispersing the raw material comprising the mineral fiber, the inorganic powder body and the binder as the essential components into water to prepare a slurry, subjecting the slurry to a wet paper making process to form a wet mat, drying the wet mat such that the moisture content reaches <10% to form a dry board, and sanding the surface of the dry board, then heating and compressing the dry board to cure the binder. Also, the inorganic decorative board is provided with the decorative layer of a high design in the mirror surface finish form etc., on the surface of the inorganic board. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for producing an inorganic board capable of producing an inorganic board suitable for use as a substrate for a decorative board such as an interior material, a building material, an opening member, and furniture for a building such as a house, and the The present invention relates to an inorganic decorative board using an inorganic board as a substrate and having good adhesion to a decorative layer.

  Conventionally, gypsum boards and plywood have been widely used as interior finishing materials for buildings such as houses and substrates for decorative face materials such as furniture. However, the gypsum board is heavy and difficult to construct, and when water is absorbed, strength properties such as bending strength are remarkably lowered, and therefore there is a problem in using the gypsum board around a water such as a kitchen. On the other hand, the plywood is light and easy to construct, but has the disadvantage that it easily burns and rots easily.

  For this reason, as described in Patent Document 1, the present applicant formed a laminated body in which a lightweight intermediate layer was sandwiched between front and back layers by pressing with a continuous press and then bonded by drying. A method for manufacturing a lightweight, high-strength three-layered inorganic board that cures the agent was proposed. However, in the above method, in particular, when a thin inorganic plate having a thickness of 10 mm or less is manufactured, since it is thin and lightweight, the need for a lightweight intermediate layer is reduced, and in order to form a three-layer structure, The manufacturing apparatus is complicated and the productivity is also poor.

  For this reason, it is conceivable that the wet-made single-layer wet mat is dried with a hot air dryer, and then the obtained dry board is heated and compressed to form a thin and strong inorganic plate. When the moisture content of the dryboard is high, the dryboard becomes soft, and the dryboard is easily damaged and difficult to handle during handling when transported or set in a hot press or other hot press device for heat compression. There was a problem. Also, during heat compression, puncture may occur due to rapid evaporation of moisture contained in the dry board, and curved deformation may occur on the side edges, reducing productivity and production yield. There was a problem of letting.

  On the other hand, when the dryboard is sufficiently dried, the above problems can be solved, but the decorative layer is applied to the surface of the inorganic board obtained by hot-pressing such a dryboard by painting, printing, sticking a decorative sheet, etc. If it is provided, the surface layer becomes brittle by causing fine damage or the like on the surface layer of the inorganic board by heat compression, resulting in poor adhesion between the decorative layer and the inorganic board, and the decorative layer is easily peeled off. There was a problem.

  In addition, when such a dry board is heated and pressurized with an embossing die, there are problems that the surface of the formed inorganic plate is further cracked or cracked, or the inorganic plate itself becomes brittle.

For this reason, as shown in Patent Document 2, the present applicant uses a thermosetting resin for the binder, and the wet mat has a moisture content of less than 10% by weight in a state where the thermosetting resin binder is not cured. It was proposed that the above-mentioned problems can be solved and that a decorative layer can be satisfactorily provided on the surface by drying and forming into a dry board and compressing the dry board by heating.
JP-A-5-50417 Japanese Patent Application No. 2003-363013

  However, when a smooth decorative layer such as a mirror finish is to be formed by painting or printing, a higher level of smoothness is required on the surface of the substrate. Even if an attempt is made to smooth the surface of the inorganic board according to the above, the smoothness is insufficient to provide the above-mentioned mirror-finished decorative layer, and the inorganic board after heat compression is hardened and densified. As a result, the durability of the abrasive paper is short, and a great deal of time and labor is required for changing the set, resulting in poor productivity. In addition, in order to form a mirror-like decorative layer on the surface of such an inorganic board with insufficient smoothness, a large number of paints may be repeatedly applied. As it gets worse, the cost increases.

  The present invention has been made in view of such conventional problems, and has been made in order to further improve the invention described in Patent Document 2 above, and combines mineral fibers and inorganic powders. An inorganic board formed with an agent as an essential component, in particular, an adhesive board with good adhesion to a decorative layer, and an inorganic board that can be satisfactorily formed even with a highly-designed decorative layer such as a mirror surface is manufactured with high productivity. It is an object of the present invention to provide a method for producing an inorganic board, and an inorganic decorative board using the inorganic board as a substrate.

  In order to achieve the object of the present invention, the method for producing an inorganic plate according to the invention of claim 1 is prepared by mixing and dispersing raw materials containing mineral fibers, an inorganic powder and a binder as essential components in water. The resulting slurry is wet-made to form a wet mat, the wet mat is dried to a moisture content of less than 10% by weight to form a dry board, the dry board is sanded, and then heated and compressed. The binder is cured.

  According to a second aspect of the present invention, there is provided a method for producing an inorganic plate according to the first aspect of the present invention, wherein the binder is a thermosetting resin binder, and the dried thermosetting resin binder at least on the surface of the dried board is not yet present. It is in the state of hardening.

  The manufacturing method of the inorganic board which concerns on invention of Claim 3 is invention of Claim 1 or 2, A binder is a thermosetting resin binder, The thermosetting resin binder of the at least surface layer of the dry board after drying Is in an uncured state.

  According to a fourth aspect of the present invention, there is provided a method for producing an inorganic plate according to any one of the first to third aspects, wherein water or a resin aqueous solution is applied to at least the surface of the dry board before heating and compression. .

  According to a fifth aspect of the present invention, there is provided a method for producing an inorganic board according to any one of the first to fourth aspects, wherein the dry board has a thickness of 1.5 mm to 10 mm and a specific gravity of 0.4 to 1.8. It heat-compresses so that it may become.

  The inorganic decorative board according to the invention of claim 6 is characterized in that a decorative layer is provided on the surface of the inorganic board obtained by the method for producing an inorganic board according to any one of claims 1 to 5. To do.

  According to the manufacturing method of the inorganic board according to the invention of claim 1, the wet mat is dried so that the moisture content is less than 10% by weight and formed into a dry board having an appropriate strength. When the dry board is transported to the hot-pressing device or set between the hot plates of the hot-pressing device, breakage does not occur and the handling property is good. In addition, since the amount of moisture brought into the hot-pressing device is reduced, it is possible to prevent the puncture phenomenon that easily occurs during heating and compression, the curved deformation of the side end face, etc., and to significantly improve productivity and production yield. Can do.

  In addition, since the binder is hardened by heating and compressing after sanding the dry board, the binding force of the binder that hardens once and firmly binds the mineral fiber or inorganic powder is crushed by the heat compression. It does not weaken and reduce the strength of the surface layer or the entire inorganic plate. Therefore, when a decorative layer is provided on the surface of the obtained inorganic plate by painting, printing, applying a decorative sheet, etc., the decorative layer can be satisfactorily adhered to the inorganic plate without causing substrate peeling.

  In addition, the dry board is a wet matte surface with a rough surface with irregularities formed by wet papermaking, so the surface is rough, but the surface of this dry board is pre-sanded before heat compression. Even if it is a high-design decorative layer such as a mirror surface without adverse effects of the rough surface of the dry board when heated and compressed, it can be formed with good productivity when heated and compressed. It can form in the inorganic board which has.

  Furthermore, the specific gravity of the dry board is lower than that of the inorganic board after heat compression, and the moisture content is less than 10% by weight and the binder is not sufficiently cured, so that the load of sanding is very small. Sanding productivity can be improved by improving the durability of the abrasive paper and reducing the labor required for changing the set.

  According to the manufacturing method of the inorganic board which concerns on invention of Claim 2, using the thermosetting resin binder, it dries so that the thermosetting resin binder of the at least surface layer of a dry board may exist in an uncured state. Therefore, in addition to the effect of the invention of claim 1, it is possible to produce an inorganic board having better adhesion to the decorative layer with higher productivity, and to improve the water resistance and water resistance strength of the inorganic board. it can.

  According to the method for producing an inorganic board according to the invention of claim 3, since the heat-compression is performed by the embossing mold, in addition to the invention of claim 1 or 2, a dry board in which the binder is not sufficiently cured with a low specific gravity. On the other hand, it is possible to form an inorganic plate on which an arbitrary concavo-convex pattern is rolled from a fine concavo-convex pattern to a deep-drawn concavo-convex pattern without causing defects such as cracks and cracks.

  Since the manufacturing method of the inorganic board which concerns on invention of Claim 4 has apply | coated water | moisture content to the surface or front and back surfaces of the dry board before heat compression, only the surface of the dry board before heat compression can be made soft with water. Therefore, in addition to the effects of the first to third aspects of the invention, a smooth surface and a sharp concavo-convex pattern surface can be satisfactorily formed on the inorganic plate without causing defects such as cracks and cracks. be able to.

  According to the manufacturing method of the inorganic board which concerns on invention of Claim 5, in any one invention of Claim 1 thru | or 4, thickness is 1.5 mm or more and 10 mm or less, and specific gravity is 0.4 or more and 1.8. Since it is heat-compressed below, in addition to the effect of any one of claims 1 to 4, it is formed into an inorganic plate that is thin, lightweight, and excellent in strength properties such as bending strength and hardness. be able to.

  According to the inorganic decorative board according to the invention of claim 6, the decorative layer is provided on the surface of the inorganic board obtained by the method for producing an inorganic board according to any one of claims 1 to 5. The adhesion of a layer and an inorganic board is good, and the inorganic decorative board excellent in the decorating property can be obtained.

  Hereinafter, embodiments of the present invention will be described in detail. The following description of the preferred embodiment is exemplary and is not intended to limit the invention in any way.

  First, a raw material containing mineral fibers, an inorganic powder and a binder as essential components is mixed with a large amount of water to prepare a slurry, and this slurry is used as a round net type wet papermaking device or a long net type wet papermaking device. Wet paper making is used to form a wet mat having a water content of about 80% by weight.

  Examples of the mineral fiber used here include rock wool, slug wool, and glass wool. And these mineral fiber is added 20 to 80 weight% with respect to the solid component in a slurry. When the addition amount is less than 20% by weight, the entanglement between the mineral fibers is reduced and the bending strength is weakened. When the addition amount exceeds 80% by weight, the addition ratio of the inorganic powder is reduced, and the surface denseness is reduced. Since it becomes low and cosmetics are impaired, it is not preferable.

  As the inorganic powder, calcium carbonate, microsilica, aluminum hydroxide, slag powder or the like can be used. These inorganic powders are added in an amount of 10 to 70% by weight based on the solid components in the slurry. When the addition amount is less than 10% by weight, the density of the formed inorganic board surface is lowered and the cosmetic properties are impaired. When the addition amount is more than 70% by weight, the addition ratio of mineral fibers is reduced and the bending strength is weak. This is not preferable.

  In addition, as the binder, thermosetting resin binders such as phenol resin and melamine resin, or water-soluble or water-dispersible polymer binders such as polyvinyl alcohol, starches, polyacrylamide, SBR latex, and acrylic resin emulsion. Alternatively, these binders can be used in combination. In particular, the thermosetting resin binder can improve the water resistance and water resistance strength of the resulting inorganic decorative board, and is therefore suitable for use in interior materials for water use such as kitchens and toilets.

  Such a binder is added in an amount of 2 to 20% by weight, preferably about 7 to 15% by weight, based on the solid components in the slurry. This is because when the addition amount of the binder is less than 7% by weight, strength properties such as bending strength are lowered, and when it exceeds 15% by weight, fire resistance is deteriorated. In the description of this embodiment, a case where a thermosetting resin binder is used as the binder will be described below.

  In addition, as solid components that can be added to the slurry as required, synthetic resin fibers such as polypropylene, polyester, and vinylon, plant fibers such as hemp and wood fibers, flocculants, sizing agents, and antifoaming agents Etc.

  Next, the wet mat that has been wet-made is carried into a hot air circulation dryer and dried so that the moisture content is less than 10% by weight, preferably less than 4% by weight, to form a dry board. The wet mat is dried so that the thermosetting synthetic resin binder contained in the wet mat is in an uncured state, preferably not precured. Such drying conditions can be performed by appropriately setting a drying temperature, a drying time, and a drying schedule depending on the type of the binder. For example, when phenol resin powder is used as a binder, the wet mat is dried so that the temperatures of the front and back layers and the inner layer are in the temperature range of 60 ° C to 140 ° C. Thereby, it can form in the bulky dry board in the state where the phenol resin powder in the wet mat is not precured.

  The dry board thus obtained is dried so that the moisture content is less than 10% by weight, preferably less than 4% by weight, so that the thermosetting resin binder is in an uncured state. Further, due to the entanglement of mineral fibers, etc., it has strength properties such as an appropriate bending strength, and is not damaged during handling such as transportation to a heating and compression process, which will be described later, and setting in a hot-pressing device. That is, when the moisture content of the dry board exceeds 10% by weight, its own weight increases and becomes soft and easily breaks during the handling. Therefore, in order to obtain the strength properties necessary for such handling, the moisture content is 10% by weight. It is necessary to dry to less than, preferably less than 4% by weight.

  Here, since the surface of the wet mat made by wet papermaking is a rough surface with a lot of fine irregularities, the surface of the dry board that is dried as it is is also formed into a rough surface with the above-mentioned many fine irregularities. ing. For this reason, the surface of the dry board is smoothed by sanding.

  By this sanding treatment, the uneven rough surface of the dry board is smoothed, and an inorganic board having a very uniform and good smooth surface can be formed by heating and compression in the subsequent process, as well as a decorative layer by normal painting and printing A mirror-like decorative layer with a high design can also be formed on the inorganic plate with good productivity and economy.

  The dry board has a moisture content of less than 10% by weight, preferably less than 4% by weight, is light and bulky, and the binder thermosetting resin is uncured. Compared with the case of sanding the plate, the sanding load is small, the durability of the abrasive paper is good, and the sanding can be performed with very high productivity.

  Next, the sandboard-treated dry board is transported to a hot press or other hot-pressing device, set between hot plates and heated and compressed. Prior to this heating and compression, water or a resin aqueous solution is applied to the front and back surfaces of the dry board. Apply. By applying such moisture, only the front and back surfaces of the dry board can be softened, and heat compression can be performed without causing cracks or cracks. Moreover, when heat-compressing using an embossing type | mold, an embossed type | mold uneven | corrugated pattern can be rolled more sharply. In addition, what is necessary is just to perform such application | coating of water or resin aqueous solution as needed, and can also be performed only with respect to the surface.

  Next, the dry board is inserted between hot plates of a hot press apparatus such as a multi-stage hot press, and using an embossing die with an appropriately uneven pattern engraved on the surface, the temperature is equal to or higher than the curing temperature of the thermosetting resin. It is heated and compressed at a temperature to cure the thermosetting resin binder and to form an inorganic plate having an uneven pattern appropriately rolled on the surface.

  In this heat compression, since the thermosetting resin binder of the dry board before heat compression is not precured, the once cured thermosetting resin binder may be crushed or cracks or cracks may be generated on the surface. It can be done satisfactorily without. And the said embossed uneven | corrugated pattern can be sharply rolled on the surface of an inorganic board.

  In addition, in this embodiment, although the example which heat-compresses using an embossing type | mold was shown, what was provided with the convex part for reprinting the joint groove pattern of a tile as such an embossing type | mold, geometric pattern, It is possible to use a flower pattern, a wrinkle pattern, or any other pattern having an uneven pattern for transferring an arbitrary pattern. Moreover, not only an embossing type but a flat type | mold without an uneven | corrugated pattern, such as a mirror-like flat type | mold, can also be heat-compressed.

  By this heat compression, an inorganic plate having an embossed pattern rolled on the surface having a thickness of 1.5 mm to 10 mm and a specific gravity of 0.4 to 1.8 is formed. Here, when the thickness of the inorganic plate is less than 1.5 mm or the specific gravity is less than 0.4, strength properties such as bending strength are lowered, and a large amount of binder is mixed to compensate for this. Then, since fireproofness falls, it is not preferable. Moreover, when the thickness of an inorganic board exceeds 10 mm or specific gravity becomes 1.8 or more, since it becomes heavy, workability | operativity worsens and becomes expensive, it is not preferable.

  Moreover, since the moisture content of the dry board is less than 10% by weight, the amount of moisture brought into the heating and compressing device is reduced, and the puncture phenomenon and the curved deformation of the side end surface are not caused. The inorganic board according to the present embodiment can be manufactured with good production yield.

  Next, a decorative layer is formed on the surface of the inorganic board obtained above by painting, printing and / or attaching a decorative sheet to form an inorganic decorative board. The type of decorative layer to be formed is not particularly limited, but since the surface of the inorganic plate is formed into a good smooth surface, the inorganic decorative plate having a decorative layer such as a mirror-like paint finish or a printed finish appearance Can be formed with high productivity.

  As a means for forming the decorative layer, for example, in the case of paint finishing, a contact type coating machine such as a roll coater can be used as well as a non-contact type coating machine such as a spray coater or a flow coater. Even if it is used, since the inorganic plate is excellent in surface smoothness, it can be coated very well without causing uneven coating.

  Similarly, in the case of printing finishing, it is possible to use a non-contact type printing machine such as an ink jet printing machine as well as a contact type printing machine such as a gravure offset printing machine or a screen printing machine. It can print very well.

  In addition, it is also possible to combine painting and printing as in the case of printing on the coated surface after coating on the surface of the inorganic board. In addition, a decorative sheet such as decorative paper can be attached to the surface of the inorganic board to form a decorative layer.

  Furthermore, it is possible to apply a clear paint or a color clear paint made of a synthetic resin paint such as acrylic or urethane on the surface of these decorative layers to form a decorative layer with further improved surface protection. it can.

  A raw material consisting of 50% by weight of slag wool, 39% by weight of calcium carbonate, 6% by weight of powdered phenolic resin, 4% by weight of starch, 1% by weight of polyester fiber as a heat-sealing fiber, and a flocculant is added to a large amount of water. The mixture was stirred to obtain a slurry having a solid concentration of 3% by weight. Next, this slurry was made using a round net type wet paper making apparatus, and the thickness was adjusted by a wet press to form a wet mat having a thickness of 7 mm and a water content of 80% by weight.

  Next, this wet mat was carried into a hot-air circulating dryer, and dried for 20 minutes in a temperature range of a surface layer of the wet mat of 80 ° C. to 135 ° C. to form a dry board having a moisture content of 3% by weight. This dry board was in an uncured state in which at least the powdered phenolic resin of the surface layer did not reach the pre-cured state, and the surface was a rough surface with fine irregularities.

  Next, the obtained dry board was sanded to form a smooth surface. The dry board has a low moisture content and is bulky, and since the powdered phenol resin is in an uncured state, the dry board was not clogged and could be sanded well with little load.

Subsequently, the dry board subjected to the sanding is conveyed to a multistage hot press apparatus, and water of 100 g / m ² on one side is uniformly applied to each of the front and back surfaces of the dry board, and then between the hot press hot plates. Then, the resin was heated and compressed through an embossing mold at 200 ° C. for 5 minutes to sufficiently cure the phenol resin powder. Here, as an embossed mold, a smooth tile surface and a convex groove for forming a joint groove portion and a joint groove forming convex portion for rolling a smooth tile surface and a joint groove portion provided vertically and horizontally between the tile surfaces are provided. Was used. By this heat compression, an inorganic board having a smooth tile surface convex part and joint groove concave part having a thickness of 3.0 mm and a specific gravity of 1.2 was obtained.

  The dry board was not damaged in a series of handling such as transporting the dry board to a hot press apparatus and inserting it between hot plates. Further, the puncture phenomenon and the curved deformation of the side end portion did not occur during the heat compression by the hot press apparatus. Furthermore, the surface of the obtained inorganic board had no cracks or cracks, and had a good appearance with sharply formed joint groove recesses.

Next, after white coating is performed on the entire surface of the inorganic board obtained above by a spray coating machine, the tile surface convex portions are printed in a desired color pattern by a gravure offset printing machine, and the surface is made of acrylic silicon resin. The clear coating material obtained was applied in a solid content conversion of 25 g / m ² ) to obtain an inorganic decorative board according to this example. The inorganic decorative board thus obtained had a good appearance in which a sharp mirror-like printed pattern and white joint grooves were formed on the tile surface protrusions.

  In addition, as a result of performing a cross-cut test on this inorganic decorative board according to JIS K 5600 (Paint General Test Method), the substrate was not peeled off, and the adhesion between the inorganic board and the decorative layer was good. It was.

Comparative Example 1

  The same wet mat as that obtained in the above example was dried with a dryer at 200 ° C. for 10 minutes to obtain a dry board having a moisture content of 15% by weight. This dry board was sanded in the same manner as in the example, and heated and compressed by an embossing die in the same manner as in the example to obtain an inorganic material according to this comparative example 1.

  Part of this inorganic plate is damaged when transported to a hot press, etc., and when heated and compressed, part of the plate is punctured and curved at the side edges, resulting in poor production yield. Met.

Comparative Example 2

  The same wet mat as that obtained in the above example was dried with a dryer at 200 ° C. for 20 minutes to obtain a dry board having a moisture content of 2% by weight and a cured phenol resin powder as a binder. This dry board was sanded in the same manner as in the example, and heat-compressed with an embossing die in the same manner as in the example, and a decorative layer was formed in the same manner as in the example to obtain an inorganic decorative board according to this comparative example 2. It was.

  This inorganic decorative board was not damaged during handling such as transport to a hot press, and neither a puncture phenomenon during heat compression nor deformation of the side edges occurred. On the other hand, as a result of performing the same cross-cut test as in the examples, the surface layer of the inorganic board was peeled off on the back surface of the decorative layer, and the surface layer of the inorganic board became brittle with heating and compression, and the substrate was peeled off. It turned out that it is easy to produce.

Comparative Example 3

  The same wet mat as that obtained in the above example was dried under the same conditions as in the example to obtain a dry board having a moisture content of 3% by weight as in the example. Then, without sanding the surface of this dry board, it was heat-compressed with an embossing die in the same manner as in the example, and the tile surface convex part of the inorganic decorative board after this heat-compression was sanded, and then the same as in the example. A decorative layer was formed to obtain an inorganic decorative board according to Comparative Example 3.

  The inorganic decorative board according to Comparative Example 3 obtained in this way had good handleability as well as the examples, and neither puncture phenomenon nor curved deformation occurred. Moreover, as a result of performing the same cross-cut test as in the examples, the substrate was not peeled off, and the adhesion between the inorganic board and the decorative layer was good. However, the load at the time of sanding was larger than that of the example, and the time for replacing the abrasive paper was shortened, resulting in poor productivity. Furthermore, the smoothness of the surface is inferior compared to the inorganic board of the example, and the decorative surface of the tile surface convex part and the joint groove concave part after providing the decorative layer is also compared with the decorative surface of the inorganic decorative board of the example. It was rough, dull and inferior in decoration.

Claims (6)

  A slurry prepared by mixing and dispersing raw materials containing mineral fiber, inorganic powder and binder as essential components in water is formed into a wet mat, and the wet mat has a water content of 10% by weight. A method for producing an inorganic board, comprising: drying to form a dry board, forming a dry board, sanding the dry board, and then heating and compressing to cure the binder.   The inorganic board according to claim 1 or 2, wherein the binder is a thermosetting resin binder, and the thermosetting resin binder on at least the surface layer of the dried dry board is in an uncured state. Production method.   The method for producing an inorganic plate according to claim 1, wherein the heat compression is performed by an embossing mold.   The method for producing an inorganic board according to any one of claims 1 to 3, wherein water or an aqueous resin solution is applied to at least the surface of the dry board before heating and compression.   5. The inorganic board according to claim 1, wherein the dry board is heated and compressed to have a thickness of 1.5 mm to 10 mm and a specific gravity of 0.4 to 1.8. Production method.   An inorganic decorative board comprising a decorative layer on a surface of an inorganic board obtained by the method for producing an inorganic board according to any one of claims 1 to 5.