JP2005244642A - Piezoelectric oscillator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a piezoelectric oscillator suitable for miniaturization of the entire structure. <P>SOLUTION: The piezoelectric oscillator is configured in such a way that a rectangular container 1 accommodating a piezoelectric vibration element 5 in its inside is fixed on a support base 6, and an IC element 7 for outputting an oscillation signal corresponding to an oscillation frequency of the piezoelectric vibration element 5 and mounting leg portions 12 disposed along the bottom periphery of the support base 6 are attached on the bottom surface of the support base 6. In this oscillator, a resin material 13 is filled between the side surface of the IC element 7 and the side surfaces of the mounting leg portions 12, so that the bottom surface of the IC element 7 is exposed. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a piezoelectric oscillator used as a timing device for communication equipment, electronic equipment, and the like.

  Conventionally, a piezoelectric oscillator such as a temperature-compensated crystal oscillator has been used as a timing device for a portable communication device or the like.

  For example, as shown in FIG. 5, such a conventional temperature-compensated crystal oscillator has a container body 23 in which a crystal resonator element is housed, a recess 25 in the center area of the upper surface, and a plurality of external terminals on the lower surface. The IC element 26 for controlling the oscillation output based on the vibration of the crystal resonator element is accommodated in the region surrounded by the lower surface of the container body 21 and the inner surface of the recess 25. The thing of the made structure is known (for example, refer patent document 1).

The container body 23 and the mounting base 21 are usually made of a ceramic material such as alumina ceramics, and a predetermined wiring pattern is formed inside and on the surface, and a conventionally known green sheet laminating method or the like is adopted. It is produced by. A plurality of bonding electrodes 24 are provided at corresponding positions on the lower surface of the container body 23 and the upper surface of the mounting base 21, and the bonding electrodes 24 are connected to each other via a conductive bonding material. Thus, the container body 23 was fixed to the upper surface of the mounting base 21.
JP-A-10-98151

  However, in the above-described conventional piezoelectric oscillator, since the inner wall of the recess 25 provided in the mounting base 21 is arranged so as to surround the IC element 26, the area of the mounting base 21 is vertical. In any of the lateral directions, the size is larger than that of the IC element 26, which makes it difficult to reduce the size of the piezoelectric oscillator.

  On the other hand, if the thickness of the inner wall of the concave portion 25 is set to be thin in order to reduce the size of the piezoelectric oscillator, the IC element 26 is not completely sealed with the container body 23. Comes out. When the IC element 26 is a flip-chip IC, when the circuit surface is inspected by infrared rays that transmit Si used as the material of the IC element 26, the IC element 26 is Since the organic component of the resin material hinders infrared transmission to the circuit surface (lower surface), the inspection accuracy is impaired.

  The present invention has been devised in view of the above-described drawbacks, and an object of the present invention is to provide a piezoelectric oscillator that is downsized and has good oscillation characteristics.

  In the piezoelectric oscillator of the present invention, a rectangular container body that accommodates a piezoelectric vibration element is fixed on a support base, and an oscillation signal corresponding to the oscillation frequency of the piezoelectric vibration element is applied to the lower surface of the support base. A piezoelectric oscillator in which an IC element to be output and a mounting leg disposed along the outer periphery of the lower surface of the support base are attached, and between the side surface of the IC element and the side surface of the mounting leg. The resin material is filled so that the lower surface of the IC element is exposed.

  The piezoelectric oscillator according to the present invention is characterized in that the mounting leg is made of a metal post.

  In the piezoelectric oscillator of the present invention, a quartz crystal vibration element is used as the piezoelectric vibration element, and temperature compensation data for correcting the oscillation signal according to a temperature state is stored in the IC element. A write control terminal made of a metal post for writing temperature compensation data to the IC element is attached to the lower surface of the substrate with the outer side surface exposed.

  Furthermore, the piezoelectric oscillator according to the present invention is characterized in that the mounting leg portion is composed of four metal posts attached to the four corners of the lower surface of the support base.

  Furthermore, in the piezoelectric oscillator of the present invention, the resin material is filled between the side surfaces of adjacent mounting legs, and the lower end of the write control terminal is positioned above the lower end of the mounting legs. And the lower end of the write control terminal is covered with a part of the resin material.

  According to the piezoelectric oscillator of the present invention, the container body containing the piezoelectric vibration element is fixed on the support base, and the IC element for oscillation output and the outer periphery of the bottom face of the support base are provided on the lower surface of the support base. Since the mounting legs made of metal posts are attached, the entire area where the mounting legs do not exist on the lower surface of the support base is used for mounting IC elements and other electronic component elements. For example, when the mounting legs are provided only at the four corners of the support base, the length of the support base can be reduced by designing the both ends of the IC element between the adjacent mounting legs. It can be made approximately equal to the length of the IC element, which makes it possible to reduce the overall structure of the piezoelectric oscillator.

  However, since the resin material is filled between the side surface of the IC element and the side surface of the mounting leg so that the lower surface of the IC element is exposed, the circuit surface is inspected by infrared rays that transmit Si. In this case, there is nothing that obstructs the transmission of infrared rays from below the IC element to the circuit surface (upper surface) of the IC element, so that the infrared inspection can be performed with high accuracy, and a piezoelectric oscillator with good oscillation characteristics is selected. can do.

  In the piezoelectric oscillator of the present invention, since the mounting leg is made of a metal post, the electric resistance value of the oscillation circuit is lowered and the oscillation operation is reduced, so that the output efficiency can be increased.

  Further, according to the piezoelectric oscillator of the present invention, a quartz crystal vibration element is used as the piezoelectric vibration element, temperature compensation data for correcting the oscillation signal according to a temperature state is stored in the IC element, and the support base When a piezoelectric oscillator is assembled, a write control terminal made of a metal post for writing temperature compensation data to the IC element is attached to the lower surface of the IC element with the outer side surface exposed. The piezoelectric oscillator can be manufactured simply by attaching the write control terminal to a predetermined position on the lower surface of the support base, and it becomes possible to improve the productivity of the piezoelectric oscillator.

  Still further, according to the piezoelectric oscillator of the present invention, the mounting base is composed of four metal posts attached to the four corners of the lower surface of the supporting base, so that the supporting base is firmly connected to an external wiring board such as a mother board. Therefore, the oscillation signal can be output stably.

  Furthermore, according to the piezoelectric oscillator of the present invention, since the resin material is filled between the side surfaces of the adjacent mounting legs, the piezoelectric oscillator is mounted on an external wiring board such as a mother board by soldering or the like. Piezoelectric oscillators that can effectively prevent problems such as the solder that joins the oscillator and external wiring board scooping up the mounting legs made of metal posts and causing a short circuit between the mounting legs. Can be obtained. However, the oxidative corrosion of the side surface of the metal post forming the mounting leg is also effectively prevented, so that the reliability of the piezoelectric oscillator can be maintained high, and the mounting strength of the mounting leg with respect to the support base can be increased. There is also an advantage that it can be reinforced.

  The lower end of the write control terminal described above is positioned above the lower end of the mounting leg, and the lower end of the write control terminal is covered with a part of the resin material, so that the piezoelectric oscillator is externally attached by soldering or the like. When mounted on a wiring board, the disadvantage that a part of the melted solder contacts the write control terminal and causes a short circuit is effectively prevented, and the piezoelectric oscillator can be handled easily. There is.

  Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

  1 is an exploded perspective view showing an embodiment in which the piezoelectric oscillator of the present invention is applied to a temperature compensated crystal oscillator, FIG. 2 is a cross-sectional view of the temperature compensated crystal oscillator of FIG. 1, and FIG. 3 is a temperature compensated crystal oscillator of FIG. 4 is an exploded perspective view of the crystal oscillator as viewed from below. The temperature-compensated crystal oscillator shown in these drawings fixes a rectangular container body 1 containing a crystal resonator element 5 on a support base 6. FIG. In addition, an IC element 7 and a plurality of mounting legs 12 are attached to the lower surface of the support base 6.

  The container body 1 includes, for example, a highly airtight substrate 2 made of a ceramic material such as glass-ceramic and alumina ceramic, a seal ring 3 made of a metal such as 42 alloy, Kovar, phosphor bronze, and the seal ring 3. The container body 1 is formed by attaching the seal ring 3 to the upper surface of the substrate 2 and placing and fixing the lid body 4 on the upper surface of the substrate 2. The crystal resonator element 5 is mounted on the upper surface of the substrate 2 located inside the substrate.

  The container body 1 is for hermetically sealing the quartz resonator element 5 in its interior, specifically, in a space surrounded by the upper surface of the substrate 2, the inner surface of the seal ring 3, and the lower surface of the lid body 4. A pair of mounting pads connected to the vibration electrode of the crystal resonator element 5 is formed on the upper surface of the substrate 2, and a conductive material such as solder is bonded to the bonding electrode 9 of the support base 6 described later on the lower surface of the substrate 2. A plurality of bonding electrodes 8 connected via a bonding agent are provided, and these mounting pads and bonding electrodes 8 are connected via wiring patterns on the substrate surface, via-hole conductors embedded in the substrate, internal wirings, and the like. The corresponding ones are electrically connected to each other.

  When the substrate 2 of the container body 1 is made of alumina ceramic, a conductive paste serving as a wiring pattern is applied to the surface of a ceramic green sheet obtained by adding and mixing an appropriate organic solvent to a predetermined ceramic material powder. It is manufactured by applying conventionally known screen printing or the like, laminating a plurality of these, press-molding, and firing at a high temperature.

  The seal ring 3 and the lid body 4 of the container body 1 are manufactured by forming a metal such as 42 alloy into a predetermined shape by using a conventionally known metal processing method, and the obtained seal ring 3 is attached to the substrate 2. After soldering to a conductor layer previously deposited on the upper surface, and subsequently mounting and fixing the crystal vibrating element 5 on the upper surface of the substrate 2 using a conductive adhesive, it is conventionally known on the upper surface of the seal ring 3. The container body 1 is assembled by joining the lid body 4 by resistance welding or the like. In this way, when the seal ring 3 and the lid 4 are joined by resistance welding, a Ni plating layer, an Au plating layer, or the like is previously deposited on the surfaces of the seal ring 3 and the lid 4.

  On the other hand, the quartz crystal vibrating element 5 accommodated in the container body 1 is formed by attaching and forming a pair of vibrating electrodes on both main surfaces of a crystal piece cut along a predetermined crystal axis, and a variable voltage from the outside. Is applied to the quartz crystal piece via a pair of vibrating electrodes, thickness shear vibration occurs at a predetermined oscillation frequency.

  The crystal vibrating element 5 is mounted on the upper surface of the substrate 2 by electrically connecting a pair of vibrating electrodes to a corresponding mounting pad on the upper surface of the substrate via a conductive adhesive. An electrical connection with the container body 1 and a mechanical connection are made simultaneously.

  Here, if the lid 4 of the container body 1 is connected to the ground mounting legs 12 on the lower surface of the support base 6 (to be described later) via the wiring pattern of the container body 1 or the support base 6, the lid is used during use. Since the body 4 is grounded and the shielding function is provided, the crystal resonator element 5 and the IC element 7 to be described later can be better protected than an unnecessary electric action from the outside. Therefore, the lid body 4 of the container body 1 is preferably connected to the ground mounting legs 12 via the container body 1, the wiring pattern of the support base 6, or the like.

  The support base 6 on which the container 1 is placed and fixed has a substantially rectangular shape, and includes a plurality of mounting legs 12 and a plurality of write control terminals 11 along the outer periphery of the lower surface. Is attached. In the present embodiment, the mounting legs 12 are individually attached and erected at the four corners on the lower surface of the support base, and two write control terminals 11 are further adjacent to each other between the adjacent mounting legs 12. The IC element 7 is mounted in the central region of the lower surface of the support base that is arranged in parallel and surrounded by the four mounting legs 12 and the two write control terminals 11.

  The support base 6 supports the container body 1 described above on its upper surface and supports the IC element 7, the write control terminal 11, the mounting leg 12 and the like on its lower surface. It is formed so as to have a flat plate shape by using a resin material such as epoxy resin, polycarbonate, epoxy resin or polyimide resin, or ceramic material such as glass-ceramic or alumina ceramic. In particular, when a resin material is used for the support base 6, the thermal expansion coefficient between the external wiring board and the support base becomes close when mounted on an external wiring board made of a resin material such as a mother board. It can have high reliability in an environment where changes are repeated.

  The plurality of mounting legs 12 mounted and erected on the lower surface of the support base 6 function as external terminals, that is, an external wiring board such as a temperature compensated crystal oscillator as a mother board (not shown). When being mounted on, it is electrically connected to the wiring of the external electric circuit by soldering or the like. In the piezoelectric oscillator of this embodiment, since the mounting leg 12 is made of a metal post, the electrical resistance value of the oscillation circuit is lowered and the oscillation operation is reduced, so that the output efficiency can be increased.

  The four mounting legs 12 described above function as a power supply voltage terminal, a ground terminal, an oscillation output terminal, and an oscillation control terminal, and the lower surface of these mounting legs 12 is bonded to an external wiring board. For example, nickel plating, gold plating, or the like is applied to a predetermined thickness in order to improve the bonding state of solder or the like used for the soldering.

  As described above, according to the piezoelectric oscillator of the present embodiment, the mounting base 12 is composed of the four metal posts attached to the four corners of the lower surface of the support base 6, so that the support base 6 is an external wiring board such as a motherboard. Therefore, it is possible to stably output an oscillation signal.

  Here, of the four mounting legs 12, if the ground mounting leg 12 and the oscillation output mounting leg 12 are arranged close to each other, the oscillation signal output from the oscillation output terminal It is possible to effectively prevent noise interference. Therefore, it is preferable that the mounting leg 12 for ground and the mounting leg 12 for oscillation output are arranged close to each other.

  Further, in the case where the above-described support base 6 is made of a resin material, the support base 6 is made of an organic multilayer base body in which a resin layer and a wiring conductor layer are alternately and sequentially formed on the surface of a copper plate serving as a base. Next, a part of the base copper plate is used as a metal post and the rest is chemically removed to obtain the mounting leg 12 mounted on the support base 6. As a build-up method for forming an organic multilayer substrate to be the support substrate 6, a process of forming a wiring conductor by an additive method after forming a through-hole connection portion of a layered photosensitive resin material by photoetching is repeated. In addition, the copper foil may be removed by removing the unnecessary portion by a subtractive method, forming a through-hole connection post in advance and forming a prepreg around the post, and then repeating the heat treatment. It is also possible to use a method of forming by curing.

  On the other hand, as the IC element 7 attached to the lower surface of the support base 6, a semiconductor element made of Si is used. For example, a rectangular flip chip IC having a plurality of connection pads on the upper surface is used. The circuit forming surface (upper surface) includes a temperature sensing element (thermistor) for detecting the ambient temperature state, a memory for storing temperature compensation data for compensating the temperature characteristics of the crystal resonator element 5, and temperature compensation data. Based on this, a temperature compensation circuit that corrects the vibration characteristics of the crystal resonator element 5 according to a temperature change, an oscillation circuit that is connected to the temperature compensation circuit and generates a predetermined oscillation output, and the like are provided. The oscillation output is used as a reference signal such as a clock signal after being output to the outside.

  Further, the IC element 7 has both end portions arranged between adjacent mounting leg portions, and two end faces arranged substantially in parallel are exposed from between adjacent mounting leg portions. The exposed side surface of the IC element 7 is slightly inward of the outer periphery of the container body 1 and the support base 6, for example, 1 μm to 500 μm inward of the outer periphery of the support base 6, along the outer periphery of the support base 6. In this case, since the width dimension of the support base 6 in the direction orthogonal to the exposed side surface of the IC element 7 is designed to be substantially equal to the length of one side of the IC element 7, the temperature compensated crystal The overall structure of the oscillator can be made compact.

  On the lower surface of the support base 6 on which the IC element 7 is disposed, electrode pads corresponding to the connection pads of the IC element 7 are provided on a one-to-one basis. Solder or gold bumps are provided on these electrode pads. The IC element 7 is attached to and mounted on the lower surface of the support base 6 by bonding the connection pads of the IC element 7 via a conductive bonding material such as the like, whereby the electronic circuit in the IC element 7 is attached to the container body 1. It is electrically connected to the crystal resonator element 5, the mounting leg 12, and the like via a wiring pattern, a wiring pattern of the support base 6, and the like.

  Further, the resin material 13 is filled between the side surface of the IC element 7 and the side surface of the mounting leg 12 so that the lower surface of the IC element 7 is exposed. The circuit surface of the IC element 7 is indispensable for the appearance inspection because the end side portion is particularly easily lost when it is separated from the wafer. In this embodiment, as shown in FIG. When the circuit surface is inspected with the transmitted infrared rays, there is nothing that obstructs the infrared transmission from the lower side of the IC element 7 to the circuit surface (upper surface) of the IC element 7 so that the infrared inspection is performed with high accuracy. Thus, it is possible to select piezoelectric oscillators having good oscillation characteristics.

  The resin material 13 having such a structure can be formed by applying and curing an uncured resin solution so as to cover the IC element 7 and then scraping until the upper surface of the IC element 7 is exposed. When the resin material 13 is shaved, the top surfaces of the IC element 7 and the mounting leg 12 may be slightly shaved, but this is not particularly problematic.

  Further, according to the piezoelectric oscillator of this embodiment, since the resin material 13 is also filled between the side surfaces of the adjacent mounting legs 12, when mounting the piezoelectric oscillator on an external wiring board such as a mother board by soldering or the like, It is possible to effectively prevent a problem that the solder for joining the piezoelectric oscillator and the external wiring board crawls up along the mounting legs 12 made of metal posts and causes a short circuit between the mounting legs, and is easy to handle. A piezoelectric oscillator can be obtained. However, the oxidative corrosion of the side surface of the metal post forming the mounting leg 12 is also effectively prevented, so that the reliability of the piezoelectric oscillator can be maintained high, and the mounting strength of the mounting leg 12 to the support base 6 can be increased. There is also an advantage that the resin material 13 can be reinforced.

  In addition, it is preferable that 90% or more of the entire surface of the mounting leg 12 is covered with the resin material 13. For example, a region about 25% from the lower end of the mounting leg 12 is used. Even if the side surface is exposed in FIG. 5, if other portions are covered with the resin material 13, it is possible to effectively prevent the occurrence of a short circuit due to the adhesion of solder during mounting on the external wiring board. In addition, there is almost no influence of oxidative corrosion due to contact of moisture contained in the atmosphere. In this case, if the exposed portion of the mounting leg 12 is coated with a metal such as Au having good solder wettability, a solder fillet is formed in this exposed region, and the mounting strength of the temperature compensated crystal oscillator is improved. There are advantages to being.

  Further, if the resin material 13 described above is formed of a transparent material, even if the side surface of the IC element 7 exposed from the adjacent mounting leg portions 12-12 is covered with the resin material 13, the support base 6 is not affected. Since the joint portion can be directly viewed, the joining state of the IC element 7 can be easily confirmed by visual inspection or the like when inspecting the product, and the inspection workability can be improved.

  A plurality of write control terminals 11 for writing temperature compensation data to the IC element 7 are attached to the lower surface of the support base 6 described above.

  The write control terminal 11 is formed by a metal post obtained by forming a metal material such as copper into a columnar shape, like the mounting leg portion 12 described above, and the length dimension of the write control terminal 11 is the same as that of the write control terminal 11. The lower end is formed slightly shorter so as to be positioned above the lower end of the mounting leg 12 and is attached to the lower surface of the support base 6 so that a part of the side surface is exposed from between adjacent mounting legs.

  These write control terminals 11 are juxtaposed along the edge of the support base 6 and are electrically connected to the IC element 7 via the wiring pattern of the support base 6. Therefore, after assembling the temperature compensated crystal oscillator, the probe needle of the temperature compensation data writing device is applied to these write control terminals 11 from the side, and the temperature compensation data corresponding to the temperature characteristics of the crystal resonator element 5 is written. As a result, the temperature compensation data is stored in the memory of the IC element 7.

  According to such a piezoelectric oscillator of this embodiment, the write control terminal 12 can be connected to other components only by attaching the write control terminal 12 made of a metal post to a predetermined position on the lower surface of the support base 6. As a result of the integration, the assembly process of the temperature-compensated crystal oscillator is simplified, and the productivity of the temperature-compensated crystal oscillator can be improved.

  In addition, as described above, the lower end of the write control terminal 11 is positioned above the lower end of the mounting leg 12, and the lower end of the write control terminal 11 is covered with a part of the resin material 13, so that the piezoelectric oscillator When solder is mounted on the external wiring board by soldering or the like, a disadvantage that a part of the melted solder contacts the write control terminal 11 to cause a short circuit is effectively prevented. There is an advantage that becomes simple.

  Thus, the above-described temperature compensated crystal oscillator is mounted on an external wiring board such as a mother board by soldering or the like, and crystal oscillation is performed while correcting the oscillation frequency according to the temperature state using the temperature compensation circuit of the IC element 7. By outputting a predetermined oscillation signal corresponding to the oscillation frequency of the element 5, it functions as a temperature compensated crystal oscillator.

  In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.

  For example, in the above-described embodiment, a crystal oscillator using a crystal resonator element as a piezoelectric resonator element has been described as an example, but instead of this, a piezoelectric vibrator other than a crystal resonator element, specifically, a surface acoustic wave element The present invention can also be applied to the case where a piezoelectric oscillator is configured using a piezoelectric vibration element such as the above.

  In the above-described embodiment, a general conductive bonding material such as solder is used to attach the IC element 7, the write control terminal 11, the mounting leg 12, and the like to the lower surface of the support base 6. However, the present invention is not limited to this. For example, an anisotropic conductive adhesive or the like may be used as the conductive bonding material. In that case, the IC element 7 or the mounting leg 12 or the like for the support base 6 may be used. There is also an advantage that the attaching operation becomes extremely simple and the assembly process of the piezoelectric oscillator is further simplified.

  Further, in the above-described embodiment, the lid 4 of the container body 1 is bonded to the substrate 2 via the seal ring 3. Instead, a metallized pattern for bonding is formed on the upper surface of the substrate 2. In addition, the lid 4 may be directly welded to the metallized pattern.

  Furthermore, in the above-described embodiment, the seal ring 3 is directly attached to the upper surface of the substrate of the container body 1, but instead, the upper surface of the substrate 2 is made of the same ceramic material as the substrate 2. The frame body may be attached integrally, and the seal ring 3 may be attached to the upper surface of the frame body.

  Further, in the above-described embodiment, for example, as shown in FIG. 4, an electronic component element other than an IC element, such as a chip capacitor for noise removal, is provided on the lower surface of the support base 6 positioned between the adjacent mounting legs 12-12. 14 or the like may be arranged, and in this case, the vacant area on the lower surface of the support base is used more effectively, and thus the piezoelectric oscillator can be further downsized.

It is a disassembled perspective view which shows one Embodiment which applied the piezoelectric oscillator of this invention to the temperature compensation type | mold crystal oscillator. It is sectional drawing of the temperature compensation type | mold crystal oscillator of FIG. It is the disassembled perspective view which looked at the temperature compensation type | mold crystal oscillator of FIG. 1 from the downward direction. It is the disassembled perspective view which looked at the piezoelectric oscillator concerning other embodiment of this invention from the downward direction. It is a disassembled perspective view of the conventional temperature compensation type | mold crystal oscillator.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Container body 2 ... Board | substrate 3 ... Seal ring 4 ... Lid body 5 ... Quartz crystal vibration element (piezoelectric vibration element)
DESCRIPTION OF SYMBOLS 6 ... Support base body 7 ... IC element 8, 9 ... Joining electrode 11 ... Write control terminal 12 ... Mounting leg 13 ... Resin material 14 ... Chip-shaped capacitor

Claims (5)

An IC element for fixing a rectangular container housing a piezoelectric vibration element therein on a support base, and outputting an oscillation signal corresponding to the oscillation frequency of the piezoelectric vibration element to the lower surface of the support base; A piezoelectric oscillator formed by attaching mounting legs arranged along the outer periphery of the lower surface of the support base,
A piezoelectric oscillator, wherein a resin material is filled between a side surface of the IC element and a side surface of the mounting leg so that a lower surface of the IC element is exposed. The piezoelectric oscillator according to claim 1, wherein the mounting leg is made of a metal post. A crystal resonator element is used as the piezoelectric resonator element, and temperature compensation data for correcting the oscillation signal according to a temperature state is stored in the IC element, and the IC element is provided on the lower surface of the support base. 3. The piezoelectric oscillator according to claim 1, wherein a write control terminal made of a metal post for writing temperature compensation data is attached with the outer side surface exposed. 4. The piezoelectric oscillator according to claim 1, wherein the mounting leg portion includes four metal posts attached to four corners on the lower surface of the support base. The resin material is also filled between the side surfaces of the adjacent mounting legs, and the lower end of the writing control terminal is positioned above the lower end of the mounting leg, and the lower end of the writing control terminal The piezoelectric oscillator according to claim 4, wherein a part of the resin material is coated with the piezoelectric oscillator.

Images