JP2005132923A - 低温硬化性樹脂組成物及び低温硬化性樹脂組成物を用いたプリプレグ - Google Patents
低温硬化性樹脂組成物及び低温硬化性樹脂組成物を用いたプリプレグ Download PDFInfo
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- JP2005132923A JP2005132923A JP2003369406A JP2003369406A JP2005132923A JP 2005132923 A JP2005132923 A JP 2005132923A JP 2003369406 A JP2003369406 A JP 2003369406A JP 2003369406 A JP2003369406 A JP 2003369406A JP 2005132923 A JP2005132923 A JP 2005132923A
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- 239000011342 resin composition Substances 0.000 title claims description 65
- 238000013035 low temperature curing Methods 0.000 title abstract 4
- 229920005989 resin Polymers 0.000 claims abstract description 38
- 239000011347 resin Substances 0.000 claims abstract description 38
- 229920001567 vinyl ester resin Polymers 0.000 claims abstract description 32
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 30
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 30
- 150000002978 peroxides Chemical class 0.000 claims abstract description 25
- 239000004645 polyester resin Substances 0.000 claims abstract description 24
- 229920001225 polyester resin Polymers 0.000 claims abstract description 24
- 238000007348 radical reaction Methods 0.000 claims abstract description 9
- 150000001491 aromatic compounds Chemical class 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 8
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 claims description 8
- 150000001923 cyclic compounds Chemical group 0.000 claims description 6
- 230000009477 glass transition Effects 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 4
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 239000011229 interlayer Substances 0.000 claims description 3
- 230000002401 inhibitory effect Effects 0.000 abstract 1
- 238000010526 radical polymerization reaction Methods 0.000 description 13
- -1 1-Cyclohexyl-1-methylethyl Chemical group 0.000 description 11
- 239000003822 epoxy resin Substances 0.000 description 6
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- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical group C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
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- VNQNXQYZMPJLQX-UHFFFAOYSA-N 1,3,5-tris[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]-1,3,5-triazinane-2,4,6-trione Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CN2C(N(CC=3C=C(C(O)=C(C=3)C(C)(C)C)C(C)(C)C)C(=O)N(CC=3C=C(C(O)=C(C=3)C(C)(C)C)C(C)(C)C)C2=O)=O)=C1 VNQNXQYZMPJLQX-UHFFFAOYSA-N 0.000 description 1
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- LTKRLZOWPZIKOF-UHFFFAOYSA-N 2,3,3-trimethylpentan-2-yl 7,7-dimethyloctaneperoxoate Chemical compound CCC(C)(C)C(C)(C)OOC(=O)CCCCCC(C)(C)C LTKRLZOWPZIKOF-UHFFFAOYSA-N 0.000 description 1
- ZFFMLCVRJBZUDZ-UHFFFAOYSA-N 2,3-dimethylbutane Chemical group CC(C)C(C)C ZFFMLCVRJBZUDZ-UHFFFAOYSA-N 0.000 description 1
- QSRJVOOOWGXUDY-UHFFFAOYSA-N 2-[2-[2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]ethoxy]ethoxy]ethyl 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCCOCCOCCOC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 QSRJVOOOWGXUDY-UHFFFAOYSA-N 0.000 description 1
- VFBJXXJYHWLXRM-UHFFFAOYSA-N 2-[2-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]ethylsulfanyl]ethyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCCSCCOC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 VFBJXXJYHWLXRM-UHFFFAOYSA-N 0.000 description 1
- GAODDBNJCKQQDY-UHFFFAOYSA-N 2-methyl-4,6-bis(octylsulfanylmethyl)phenol Chemical compound CCCCCCCCSCC1=CC(C)=C(O)C(CSCCCCCCCC)=C1 GAODDBNJCKQQDY-UHFFFAOYSA-N 0.000 description 1
- HXIQYSLFEXIOAV-UHFFFAOYSA-N 2-tert-butyl-4-(5-tert-butyl-4-hydroxy-2-methylphenyl)sulfanyl-5-methylphenol Chemical compound CC1=CC(O)=C(C(C)(C)C)C=C1SC1=CC(C(C)(C)C)=C(O)C=C1C HXIQYSLFEXIOAV-UHFFFAOYSA-N 0.000 description 1
- HCILJBJJZALOAL-UHFFFAOYSA-N 3-(3,5-ditert-butyl-4-hydroxyphenyl)-n'-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyl]propanehydrazide Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)NNC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 HCILJBJJZALOAL-UHFFFAOYSA-N 0.000 description 1
- WPMYUUITDBHVQZ-UHFFFAOYSA-N 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoic acid Chemical compound CC(C)(C)C1=CC(CCC(O)=O)=CC(C(C)(C)C)=C1O WPMYUUITDBHVQZ-UHFFFAOYSA-N 0.000 description 1
- GGCWBROBGQFJFS-UHFFFAOYSA-N 3-(5,5-ditert-butyl-4-hydroxycyclohexa-1,3-dien-1-yl)-N'-[3-(5,5-ditert-butyl-4-hydroxycyclohexa-1,3-dien-1-yl)propanoyl]propanehydrazide Chemical compound C(C)(C)(C)C1(CC(=CC=C1O)CCC(=O)NNC(CCC=1CC(C(=CC1)O)(C(C)(C)C)C(C)(C)C)=O)C(C)(C)C GGCWBROBGQFJFS-UHFFFAOYSA-N 0.000 description 1
- QRLSTWVLSWCGBT-UHFFFAOYSA-N 4-((4,6-bis(octylthio)-1,3,5-triazin-2-yl)amino)-2,6-di-tert-butylphenol Chemical compound CCCCCCCCSC1=NC(SCCCCCCCC)=NC(NC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=N1 QRLSTWVLSWCGBT-UHFFFAOYSA-N 0.000 description 1
- VSAWBBYYMBQKIK-UHFFFAOYSA-N 4-[[3,5-bis[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]-2,4,6-trimethylphenyl]methyl]-2,6-ditert-butylphenol Chemical compound CC1=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C1CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 VSAWBBYYMBQKIK-UHFFFAOYSA-N 0.000 description 1
- UYQYTUYNNYZATF-UHFFFAOYSA-N 6-methyl-4,6-bis(octylsulfanylmethyl)cyclohexa-1,3-dien-1-ol Chemical compound CCCCCCCCSCC1=CC=C(O)C(C)(CSCCCCCCCC)C1 UYQYTUYNNYZATF-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- RQNBFDPHZUYMJX-UHFFFAOYSA-N CC(C)(C)C1=CC(=CC(=C1O)C(C)(C)C)C(=O)CCOP(=O)(O)O Chemical compound CC(C)(C)C1=CC(=CC(=C1O)C(C)(C)C)C(=O)CCOP(=O)(O)O RQNBFDPHZUYMJX-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- OKOBUGCCXMIKDM-UHFFFAOYSA-N Irganox 1098 Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)NCCCCCCNC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 OKOBUGCCXMIKDM-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- CGRTZESQZZGAAU-UHFFFAOYSA-N [2-[3-[1-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]-2-methylpropan-2-yl]-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]-2-methylpropyl] 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCC(C)(C)C2OCC3(CO2)COC(OC3)C(C)(C)COC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 CGRTZESQZZGAAU-UHFFFAOYSA-N 0.000 description 1
- QNRVNBAZGBMHMC-UHFFFAOYSA-N [3,5-bis(3,5-ditert-butyl-4-hydroxybenzoyl)-2,4,6-trimethylphenyl]-(3,5-ditert-butyl-4-hydroxyphenyl)methanone Chemical compound CC1=C(C(=O)C=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C(C(=O)C=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C1C(=O)C1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 QNRVNBAZGBMHMC-UHFFFAOYSA-N 0.000 description 1
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- FQUNFJULCYSSOP-UHFFFAOYSA-N bisoctrizole Chemical compound N1=C2C=CC=CC2=NN1C1=CC(C(C)(C)CC(C)(C)C)=CC(CC=2C(=C(C=C(C=2)C(C)(C)CC(C)(C)C)N2N=C3C=CC=CC3=N2)O)=C1O FQUNFJULCYSSOP-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
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- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
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- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
【解決手段】 ビニルエステル樹脂若しくはポリエステル樹脂と、過酸化物と、ラジカル反応(の進行)を防止する性質を有する酸化防止剤とから成る低温硬化性樹脂。
【選択図】 図1
Description
2−tert−Butyl−6−(3−tert−butyl−2−hydroxy−5−methylbenzyl)−4−methylphenyl acrylate(商品名:Sumilizer GM)
2,6−Di−tert−butyl−4−methylphenol(商品名:S-umilizer BHT(BHT−P))
6−[3−(3−t−Butyl−4−hydroxy−5−methylphen-yl)propoxy]−2,4,8,10−tetra−t−butyldiben-z[d,f][1,3,2]dioxaphosphepin(商品名:Sumili-zer GP)
triethyleneglycol−bis〔3−(3−t−butyl−5−methyl−4−hydroxyphenyl)propionate〕(商品名:IRGANOX 245,245FF)
4,4’−Butylidenebis(6−tert−butyl−3−meth-ylphenol)(商品名:Sumilizer BBM−S)
Claims (9)
- ビニルエステル樹脂若しくはポリエステル樹脂と、過酸化物と、常温時においてラジカル反応を防止する性質を有する酸化防止剤とから成ることを特徴とする低温硬化性樹脂組成物。
- 請求項1記載の低温硬化性樹脂組成物において、酸化防止剤は一分子中に二つ以上の二重結合を有する環式化合物であることを特徴とする低温硬化性樹脂組成物。
- 請求項2記載の低温硬化性樹脂組成物において、環式化合物は芳香族化合物であることを特徴とする低温硬化性樹脂組成物。
- 請求項3記載の低温硬化性樹脂組成物において、芳香族化合物として、2,4,6−トリアルキルフェノール若しくは2,4,5−トリアルキルフェノールを含む芳香族化合物が採用されていることを特徴とする低温硬化性樹脂組成物。
- 請求項4記載の低温硬化性樹脂組成物において、2,4,6−トリアルキルフェノール若しくは2,4,5−トリアルキルフェノールを含む芳香族化合物は、2,4,6−トリアルキルフェノール若しくは2,4,5−トリアルキルフェノールの少なくとも1つのアルキル基がt−ブチル基である芳香族化合物であることを特徴とする低温硬化性樹脂組成物。
- 請求項5記載の低温硬化性樹脂組成物において、t−ブチル基はヒドロキシル基の両隣に設けられていることを特徴とする低温硬化性樹脂組成物。
- 請求項1〜8いずれか1項に記載の低温硬化性樹脂組成物において、ビニルエステル樹脂若しくはポリエステル樹脂が100重量部、過酸化物が0.1乃至10重量部、更に酸化防止剤が0.05乃至10重量部混合されて成ることを特徴とする低温硬化性樹脂組成物。
- 請求項1〜7いずれか1項に記載の低温硬化性樹脂組成物を基材に設けて成ることを特徴とする低温硬化性樹脂組成物を用いたプリプレグ。
- 請求項8記載の低温硬化性樹脂組成物を用いたプリプレグにおいて、60℃乃至90℃で0.25時間乃至4時間加熱処理して、ガラス転移温度が120℃以上、且つ、層間剪断強度が50MPa以上の特性を具備せしめたことを特徴とする低温硬化性樹脂組成物を用いたプリプレグ。
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006049374A (ja) * | 2004-07-30 | 2006-02-16 | Matsushita Electric Works Ltd | 電気用コンポジット白色積層板 |
JP2006045266A (ja) * | 2004-07-30 | 2006-02-16 | Matsushita Electric Works Ltd | 電気用白色積層板 |
JP2016203397A (ja) * | 2015-04-15 | 2016-12-08 | 東邦テナックス株式会社 | プリプレグ製造方法 |
-
2003
- 2003-10-29 JP JP2003369406A patent/JP3987479B2/ja not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006049374A (ja) * | 2004-07-30 | 2006-02-16 | Matsushita Electric Works Ltd | 電気用コンポジット白色積層板 |
JP2006045266A (ja) * | 2004-07-30 | 2006-02-16 | Matsushita Electric Works Ltd | 電気用白色積層板 |
JP4595430B2 (ja) * | 2004-07-30 | 2010-12-08 | パナソニック電工株式会社 | Ledを実装するプリント配線板用基板 |
JP4595429B2 (ja) * | 2004-07-30 | 2010-12-08 | パナソニック電工株式会社 | Ledを実装するプリント配線板用積層板 |
JP2016203397A (ja) * | 2015-04-15 | 2016-12-08 | 東邦テナックス株式会社 | プリプレグ製造方法 |
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