JP2005186099A - Laser beam machining device and method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain uniform machining quality in a laser beam machining device in which a plurality of laser beams can be superimposed, and a laser beam machining method. <P>SOLUTION: The laser beam machining device is equipped with a first and second perforated mirrors 4, 5 which have reflection surfaces 4b, 5b with holes and holes 4a, 5a, and with a first and second ring-shaped beam forming sections 6, 7 which form cross sectionally ring-shaped beams 13, 14 toward each of the reflection surfaces 4b, 5b with the holes in the first and second mirrors 4, 5 with the holes. The first and second perforated mirrors 4, 5 with the holes are arrayed in order from the position where a workpiece 9 is set. The light reflected by the reflection surface 5b with the hole of the second mirror 5 with the hole which is arranged at a position farther from the workpiece 9 in the first and second mirrors 4, 5 with the holes is designed to pass through the hole 4a of the first perforated mirror 4 with the hole which is arranged at a position nearer to the workpiece 9 and converged on a focal point. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention provides a laser processing apparatus capable of superimposing a plurality of laser beams and a laser processing method for performing laser processing using the laser processing apparatus.

In a conventional laser device, light emitted from a laser oscillator is emitted from an arbitrary direction using a mirror, an optical fiber or the like, and the emitted laser beam is irradiated toward a certain point on a workpiece. By doing so, laser processing is performed (for example, refer to Patent Documents 1 and 2).
JP 2002-210576 A (see FIG. 5) Japanese Unexamined Patent Publication No. 2001-001170 (see FIG. 1)

  However, since the relationship between the moving direction of the irradiation point and the incident angle of the entire laser beam to the workpiece is not always constant, the laser absorption characteristic of the workpiece changes depending on the moving direction. For this reason, in order to obtain uniform processing quality, there is a problem that the laser beam can be scanned only in one specific direction.

  Further, since the light intensity distribution is not a rotationally symmetric body with the optical axis as the rotation axis, the intensity distribution changes significantly when focused on. For this reason, the conventional concept of depth of focus does not hold, and there is a problem that the processing point position must be strictly managed.

  In view of the above points, it is a first object of the present invention to obtain uniform processing quality in a laser processing apparatus and a laser processing method capable of superimposing a plurality of laser beams. Another object of the present invention is to provide a laser processing apparatus and a laser processing method capable of superimposing a plurality of laser beams so that laser processing can be performed based on the concept of depth of focus.

  In order to achieve the above object, according to the first aspect of the present invention, a mirror with a hole (4, 5) provided with a reflecting surface with a hole (4b, 4c, 5b, 5c) and a hole (4a, 5a) is provided. A plurality of beams having a ring-shaped cross section (13, 14, 20) toward each of the reflecting surfaces with holes (4b, 4c, 5b, 5c) in the plurality of mirrors with holes (4, 5). 21, 32, 33) and a plurality of ring-shaped beam forming portions (6, 7), and the plurality of mirrors with holes (4, 5) are arranged in order from the position where the workpiece (9) is installed. Light reflected by the reflecting surfaces with holes (5b, 5c) of the mirrors (5) arranged side by side and arranged at a position far from the workpiece (9) among the plurality of mirrors with holes (4, 5) However, it is passed through the hole (4a) of the thing (4) arranged closer than that and condensed toward the focal point. It is characterized that it is.

  According to such a configuration, a plurality of laser beams can be superimposed and the focal points of the respective laser beams can be made substantially coincident. For this reason, each laser beam can be directed to the same processing point. Therefore, the relationship of the incident angle of each laser beam to the workpiece (9) is constant, the laser absorption characteristics of the workpiece (9) can be prevented from changing depending on the moving direction, and uniform machining quality and It becomes possible to do.

  Specifically, as shown in claim 2 or 3, a mirror disposed with a first hole (4) is disposed at a close position, and the reflection surface with holes and the reflection surface with holes (4b, 4c). ) And the first hole (4a), the mirror with the second hole (5) disposed at a distant position, the reflection surface with the hole and the hole as the reflection surface with the second hole (5b, 5c) and The first ring-shaped beam forming portion (6) is formed as a second hole (5a) and forms a beam directed to the first holed mirror (4) among the plurality of ring-shaped beam forming portions (6, 7). The beam formed thereby is the first beam (13, 20, 32), and the beam directed toward the second holed mirror (5) is formed among the plurality of ring-shaped beam forming units (6, 7). The second ring-shaped beam forming section (7) is to be operated, and the beam formed thereby is the second beam. 14, 21, 33), and when the second beam (14, 21, 33) is reflected by the second holed mirror (5), the reflected light is formed on the first holed mirror (4). The light is condensed toward the focal point through one hole (4a).

  For example, as shown in claim 4, the first ring-shaped beam forming section (6) is configured to include a conical outer surface mirror (6a) and a conical inner surface mirror (6b), and the first laser beam emitting section. The first beam (13) is formed from the laser beam (10) emitted from (1), and the first holed mirror (4) may have a condensing mirror (4b).

  According to a fifth aspect of the present invention, the first ring-shaped beam forming section (6) includes a conical outer surface mirror (6a) and an annular condenser mirror (6c), and emits a first laser beam. The first beam (20) is formed from the laser beam (10) emitted from the section (1), and the first holed mirror (4) can be configured to have a plane mirror (4c).

  Furthermore, as shown in claim 6, the first ring-shaped beam forming section (6) includes a cone-type condensing mirror (6d) and a conical inner surface mirror (6b), and the first laser is formed. The first beam (32) is formed from the laser beam (10) emitted from the beam emitting unit (1), and the first holed mirror (4) is configured to include a plane mirror (4c). it can.

  In these cases, as shown in claim 7, after the laser beam (10) emitted from the first laser beam emitting section (1) passes through the hole (4a) in the first holed mirror (4). You may make it inject into a 1st ring-shaped beam formation part (6).

  On the other hand, as shown in claim 8, for example, the second ring-shaped beam forming section (7) includes a conical outer surface mirror (7a) and a conical inner surface mirror (7b). The second beam (14) is formed from the laser beam (11) emitted from the emission part (2), and the second holed mirror (5) has a condensing mirror (5b). can do.

  According to a ninth aspect of the present invention, the second ring-shaped beam forming section (7) includes a conical outer surface mirror (7a) and an annular condensing mirror (7c), and emits a second laser beam. The second beam (21) can be formed from the laser beam (11) emitted from the section (2), and the second holed mirror (5) can be configured to have a plane mirror (5c).

  Furthermore, as shown in claim 10, the second ring-shaped beam forming section (7) includes a cone-type condensing mirror (7d) and a conical inner surface mirror (7b). The second beam (33) is formed from the laser beam (11) emitted from the emission unit (2), and the second holed mirror (5) may be configured to have a plane mirror (5c). .

  In these cases, as shown in claim 11, after the laser beam (11) emitted from the second laser beam emitting portion (2) has passed through the hole (5a) in the second holed mirror (5). You may make it inject into a 2nd ring-shaped beam formation part (7).

  In the invention described in claim 12, the third laser beam emitting section (3) that emits a laser beam at a position farther than the mirror with the second hole (5) when viewed from the position where the workpiece (9) is installed. And a condensing lens (8) provided between the second holed mirror (5) and the third laser beam emitting part (3). As described above, the third laser beam emitting section (3) may be provided, and the laser beam (12) therefrom may be condensed by the condenser lens (8).

  In the invention according to claim 13, a welding rod extending from a position farther than the mirror with the second hole (5) to a position for installing the workpiece (9) when viewed from the position for installing the workpiece (9). (50) is provided. Thus, it is also possible to set it as the laser processing apparatus combined with a welding rod (50).

  The invention according to claim 14 includes first and second laser beam emitting portions (1, 2) for emitting laser beams (10, 11), and first and second ring-shaped beam forming portions (6, 7). ) Is configured to include conical outer surface mirrors (6a, 7a) and conical inner surface mirrors (6b, 7b), and from the laser beams emitted from the first and second laser beam emitting units (1, 2). The first and second beams are formed, and the first holed mirrors (4, 5) are configured to have plane mirrors (4c, 5c), and further the first holed mirrors. A condensing lens (40) is provided between (4) and the position where the workpiece (9) is installed, and the beam reflected by the first and second mirrors with holes (4, 5) is a condensing lens. It is characterized by being focused by the Even in such a configuration, the laser beams can be superimposed as described in the first aspect.

  A fifteenth aspect of the present invention is a laser processing method for manufacturing a product by laser processing a workpiece (9) using the laser processing device according to any one of the first to fourteenth aspects. The step of adjusting the focal position of the reflected light at the mirrors with holes (4, 5), the step of arranging the workpiece (9) at the focal position, and the processed portion of the workpiece (9) with the reflected light And irradiating to.

  Thus, a product can be manufactured by performing laser processing of the workpiece (9) using the laser processing apparatus according to any one of claims 1 to 14.

  In addition, the code | symbol in the bracket | parenthesis of each said means shows the correspondence with the specific means as described in embodiment mentioned later.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, the same or equivalent parts are denoted by the same reference numerals in the drawings.

(First embodiment)
Hereinafter, a laser processing apparatus to which an embodiment of the present invention is applied will be described. FIG. 1 shows a schematic diagram of a laser processing apparatus according to this embodiment, and a description will be given based on this figure.

  The laser processing apparatus in this embodiment superimposes three laser beams. As shown in FIG. 1, the laser processing apparatus includes a plurality of laser beam emitting units 1, 2 and 3, first and second holed mirror units 4 and 5, first and second ring-shaped beam forming units. 6 and 7 and a condenser lens 8 are provided. With these configurations, the laser processing apparatus manufactures a product by processing the workpiece 9.

  The plurality of laser beam emitting units 1 to 3 are composed of three units, ie, first to third laser beam emitting units 1 to 3, and are composed of, for example, light or an optical fiber divided from a plurality of laser oscillators or a single laser oscillator. The substantially linear laser beams 10 to 12 are emitted.

  The first and second mirrors 4 and 5 with holes have holes 4a and 5a formed at the center thereof. The holes 4a and 5a formed in the mirrors with holes 4 and 5 may have the same size, but in this embodiment, the sizes are different depending on the distance from the workpiece 9, and the distance is short. It is said to be a large size. The first and second mirrors 4 and 5 with holes can pass the laser beams 10 and 11 emitted from the first and second laser beam emitting units 1 and 2 through the holes 4a and 5a provided respectively. It is configured as follows.

  The first and second mirrors 4 and 5 with holes have, for example, condensing mirrors 4b and 5b constituting a paraboloid, and are described below by the first and second ring-shaped beam forming units 6 and 7, respectively. The formed ring beams 13 and 14 are reflected and condensed. By this reflection and condensing, the cross section perpendicular to the traveling direction of the laser beam is gradually reduced, and the light intensity distribution is gradually strengthened until reaching the focal point.

  The first and second ring-shaped beam forming portions 6 and 7 are configured by combining conical outer surface mirrors 6a and 7a and conical inner surface mirrors 6b and 7b. The conical outer surface mirrors 6a and 7a have a reflecting surface in the shape of the outer surface of the cone, and the laser beams 10 and 11 incident on the apex of the cone parallel to the cone axis extend in all directions in parallel to a plane perpendicular to the cone axis. Thus, the disk-like beams 15 and 16 are reflected. The conical inner surface mirrors 6b and 7b have a reflecting surface in the shape of the inner surface of the cone, and the reflecting surface is disposed so as to face the conical outer surface mirrors 6a and 7a. These conical inner surface mirrors 6 b and 7 b reflect the disk-shaped beams 15 and 16 to form ring-shaped beams 13 and 14.

  The conical outer surface mirrors 6a and 7a and the conical inner surface mirrors 6b and 7b are configured to be relatively movable in the direction of the conical axis by a position adjusting mechanism (not shown).

  The condensing lens 8 is composed of, for example, a convex lens, condenses the laser beam 12 emitted from the third laser beam emitting unit 3 to form a condensed beam 17 and irradiates the workpiece 9.

  Next, a method for processing, for example, welding, a processed portion of the workpiece using the laser processing apparatus shown in FIG. 1 will be described.

  The laser beam 10 emitted from the first laser beam emitting unit 1 passes through the hole 4 a of the mirror 4 with the first hole, and then enters the outer cone mirror 6 a in the first ring-shaped beam forming unit 6. At this time, the center position of the emitted light is made to substantially coincide with the apex of the conical outer mirror 6a. As a result, the incident laser beam 10 is reflected in all directions in parallel with the plane perpendicular to the cone axis by the cone outer surface mirror 6a to form a disk-shaped beam 15.

  The disk-shaped beam 15 is incident on the conical inner surface mirror 6b facing the conical outer surface mirror 6a. Then, the light is reflected by the conical inner surface mirror 6b and becomes a ring-shaped (cylindrical) beam 13 and is irradiated to the mirror 4 with the first hole.

  The ring-shaped beam 13 is reflected and collected by the condenser mirror 4 b provided in the first holed mirror 4 to be a condensed beam 18. Then, the processed portion of the workpiece 9 is irradiated at a position where the condensed beam 18 is substantially in focus.

  On the other hand, the laser beam 11 emitted from the second laser beam emitting unit 2 is the same as described above, and after passing through the hole 5a of the mirror 5 with the second hole, the cone in the second ring beam forming unit 7 is used. The light enters the outer mirror 7a. As a result, the incident laser beam 11 is reflected in all directions in parallel with a plane perpendicular to the cone axis by the cone outer surface mirror 7 a to form a disk-shaped beam 16.

  The disk-shaped beam 16 is incident on the conical inner surface mirror 7b facing the conical outer surface mirror 7a. Then, the light is reflected by the conical inner surface mirror 7 b and becomes a ring-shaped (cylindrical) beam 14 and is applied to the mirror 5 with the second hole.

  The ring-shaped beam 14 is reflected and collected by the condenser mirror 5 b provided in the second holed mirror 5 to be a condensed beam 19. Then, after the condensed beam 19 passes through the hole 4a of the first holed mirror 4, the processed portion of the workpiece 9 is irradiated at a position that is substantially in focus.

  Further, the laser beam 12 emitted from the third laser beam emitting unit 3 is condensed by the condenser lens 8 to become a condensed beam 17, and is condensed in the first and second mirrors 4 and 5 with holes. After passing through the holes 4a and 5a, the processed portion of the workpiece 9 is irradiated at the focal position.

  In this way, the laser beams 10 to 12 emitted from the first to third laser beam emitting units 1 to 3 are all the first and second holed mirrors 4 and 5 and the ring-shaped beam forming units 6 and 7. When the light is collected by the light collecting means, the respective focal points and the processed portion of the workpiece 9 can be substantially matched.

  Then, the workpiece 9 is moved in a desired direction in a state where the laser beams 10 to 12 are irradiated onto the machining portion of the workpiece 9 as described above. Thereby, the welding process of the process part of the to-be-processed object 9 can be performed.

  Prior to performing the above-described welding process, the relative positions of the conical inner surface mirrors 6b and 7b and the conical outer surface mirrors 6a and 7a of the first and second ring-shaped beam forming portions 6 and 7 are adjusted by the position adjusting mechanism. Thus, it is possible to obtain irradiation light optimal for the processing conditions of the workpiece 9. That is, by adjusting the reflection positions of the conical inner surface mirrors 6b and 7b with respect to the disk-shaped beams 15 and 16, the processing conditions of the workpiece 9 can be optimized.

  For example, in the case of FIG. 1, in the first ring-shaped beam forming portion 6, the cone outer surface mirror 6 b is inserted to a relatively deep position with respect to the cone inner surface mirror 6 b, so that the cone inner surface mirror 6 b is shallow. The disk-shaped beam 15 is reflected at the position, and the diameter of the ring-shaped beam 13 is increased. Further, in the second ring-shaped beam forming section 7, the conical inner surface mirror 7b is inserted to a relatively shallow position with respect to the conical inner surface mirror 7b, so that the disk-shaped beam is formed at a deep position of the conical inner surface mirror 7b. 16 is reflected so that the diameter of the ring-shaped beam 16 is narrower than that of the first ring-shaped beam forming portion 6. If it does in this way, it will become possible to obtain optimal irradiation light in each ring-shaped beam forming part 6 and 7, respectively.

  As described above, according to the laser processing apparatus shown in the present embodiment, a plurality of laser beams 10 to 12 can be superimposed, and the focal points of the laser beams 10 to 12 can be made substantially coincident. For this reason, each laser beam 10-12 can be made to go to the same processing point. Therefore, the relationship between the incident angles of the laser beams 10 to 12 on the workpiece 9 is constant, the laser absorption characteristics of the workpiece 9 can be prevented from changing depending on the moving direction, and the processing quality is uniform. It becomes possible.

  Further, since the light intensity distribution is a rotationally symmetric body with the optical axis as the rotation axis, even if defocusing occurs in which the processed portion of the workpiece 9 and the focal points of the laser beams 17 to 19 are deviated, the light intensity is remarkably increased. It is possible to prevent the intensity distribution from changing. For this reason, it becomes possible to perform processing based on the viewpoint of the depth of focus, and there is an effect that strict management of the processing point position is not required.

(Second Embodiment)
A second embodiment of the present invention will be described. FIG. 2 shows the overall configuration of the laser processing apparatus in the present embodiment. Hereinafter, the laser processing apparatus according to the present embodiment will be described with reference to FIG. 2. However, since the configuration is substantially the same as that of the laser processing apparatus according to the first embodiment shown in FIG. 1, only different portions will be described.

  In the present embodiment, the conical inner surface mirrors 6b and 7b of the first and second ring-shaped beam forming portions 6 and 7 are replaced with annular condenser mirrors 6c and 7c, as compared to the first embodiment, and The difference is that the condensing mirrors 4b and 5b of the first and second mirrors 4 and 5 are replaced with flat mirrors 4c and 5c.

  The first and second ring-shaped beam forming units 6 and 7 are constituted by conical outer surface mirrors 6a and 7a and annular condenser mirrors 6c and 7c. The annular condenser mirrors 6c and 7c have a parabolic mirror composed of an annular paraboloid whose curved surface (for example, a parabola) is formed into an annular shape, and the parabolic mirror serves as a condenser mirror and has a ring-shaped cone. The disk-like beams 15 and 16 reflected by the outer mirrors 6a and 7a are reflected and collected to form the condensed beams 20 and 21. By this reflection and condensing, the cross section perpendicular to the traveling direction of the condensed beams 20 and 21 is gradually reduced, and the light intensity distribution in the cross section is gradually strengthened until reaching the focal point.

  Further, the plane mirrors 4c and 5c of the first and second mirrors 4 and 5 with holes have a traveling direction of the condensed beams 20 and 21 being condensed by the first and second ring-shaped beam forming units 6 and 7, respectively. change. Thus, the focused beams 22 and 23 whose angles are changed by, for example, 90 ° by the first and second mirrors 4 and 5 are irradiated onto the processed portion of the workpiece 9.

  As described above, the first and second ring-shaped beam forming units 6 and 7 have a function of condensing the laser beams 10 and 11, and the first and second mirrors 4 and 5 with holes have the condensed beam 20. , 21 can be adjusted only.

(Third embodiment)
A third embodiment of the present invention will be described. FIG. 3 shows the overall configuration of the laser processing apparatus in the present embodiment. Hereinafter, the laser processing apparatus according to the present embodiment will be described with reference to FIG. 3. However, since the configuration is substantially the same as that of the laser processing apparatus according to the first embodiment shown in FIG. 1, only different portions will be described.

  In the present embodiment, the conical outer surface mirrors 6a and 7a of the first and second ring-shaped beam forming units 6 and 7 are replaced with cone-shaped condensing mirrors 6d and 7d, compared to the first embodiment, and The difference is that the condensing mirrors 4b and 5b of the first and second mirrors 4 and 5 with holes are replaced with flat mirrors 4c and 5c.

  The first and second ring-shaped beam forming units 6 and 7 are composed of cone-type condensing mirrors 6d and 7d and conical inner surface mirrors 6b and 7b. The cone-type condensing mirrors 6d and 7d have a parabolic mirror having a parabolic surface in which a curved surface (for example, a parabola) is formed in an annular shape, and the parabolic mirror is used as a condensing mirror. The laser beams 10 and 11 from the laser beam irradiation units 1 and 2 are reflected to be focused beams 30 and 31. The reflected light beams 30 and 31 are reflected by the conical inner surface mirrors 6b and 7b, thereby changing the angle of the traveling direction. Thereby, the condensed beams 32 and 33 having a ring-shaped cross section are formed, and the cross section perpendicular to the traveling direction of the laser beam is gradually reduced, so that the light intensity distribution in the cross section is gradually increased until reaching the focal point. It has become.

  Further, the plane mirrors 4c and 5c of the first and second mirrors 4 and 5 having holes have a traveling direction of the condensed beams 32 and 33 being condensed by the first and second ring-shaped beam forming units 6 and 7, respectively. change. Thus, the focused beams 34 and 35 whose angles are changed by 90 °, for example, by the first and second mirrors 4 and 5 are irradiated onto the processed portion of the workpiece 9.

  As described above, the first and second ring-shaped beam forming units 6 and 7 have a function of condensing the laser beams 10 and 11, and the first and second mirrors 4 and 5 with a condensing beam 32. , 33 can be adjusted only.

(Fourth embodiment)
A fourth embodiment of the present invention will be described. FIG. 4 shows the overall configuration of the laser processing apparatus in the present embodiment. Hereinafter, the laser processing apparatus according to the present embodiment will be described with reference to FIG. 4. However, since the configuration is substantially the same as that of the laser processing apparatus according to the first embodiment illustrated in FIG. 1, only different portions will be described.

  In the present embodiment, in contrast to the first embodiment, the condensing mirrors 4b and 5b of the first and second mirrors 4 and 5 with holes are replaced with flat mirrors 4c and 5c, and the third laser beam. Instead of the condensing lens 8 for condensing the laser beam 12 from the irradiation unit 3, the condensing lens 40 for condensing all the laser beams 10-12 of the first to third laser beam irradiation units 1-3. Is different.

  The plane mirrors 4c and 5c of the first and second mirrors 4 and 5 with holes change the traveling direction of the ring beams 13 and 14 formed by the first and second ring beam forming units 6 and 7, respectively. Thereby, the ring-shaped beams 41 and 42 whose angles are changed by, for example, 90 ° by the first and second mirrors 4 and 5 with holes are obtained.

  Moreover, the condensing lens 40 is arrange | positioned between the plane mirror 4c of the mirror 4 with a 1st hole, and the to-be-processed object 9, and is comprised by the convex lens, for example. The condensing lens 40 condenses the ring beams 41 and 42 whose traveling directions are changed by the first and second mirrors 4 and 5 with the holes and the laser beam 12 from the third laser beam irradiation unit 3 and collects them. The focused light beams 43, 44, and 45 are irradiated onto the processing portion of the workpiece 9 at a substantially focal position.

  As described above, the first and second ring-shaped beam forming units 6 and 7 and the first and second mirrors 4 and 5 with a hole do not have a function of condensing the laser beams 10 and 11, thereby The formed ring-shaped beams 41 and 42 may be condensed by one condenser lens 40.

(Other embodiments)
(1) In each of the above embodiments, the first and second mirrors with holes 4 and 5 are provided with two mirrors with holes, but these are merely examples, and two or more structures may be used. Is possible. In other words, if the laser beam focused by each of the mirrors with a plurality of holes passes through the holes of each mirror with a hole, the annular beam can be superimposed as much as possible, as long as the dimensions that can be manufactured, such as optical components, allow. Can do.

  (2) In the first to fourth embodiments, the laser beams 10 and 11 emitted from the first and second laser beam irradiation units 1 and 2 pass through the holes of the first and second mirrors 4 and 5 with holes. However, it is not always necessary to use such a configuration.

  For example, the first embodiment can be configured as shown in FIG. That is, in the first embodiment, the first and second laser beam irradiating units 1 and 2 are both disposed on the back side of the condensing mirrors 4b and 5b of the first and second mirrors 4 with holes, and the conical outer surface. The reflecting surfaces of the mirrors 6a and 7a and the reflecting surfaces of the conical inner surface mirrors 6b and 7b are both directed to the first and second laser beam irradiation units 1 and 2 side. However, as shown in FIG. 5, the first and second laser beam irradiating units 1 and 2 are arranged on the front side of the condensing mirrors 4b and 5b of the first and second mirrors 4 and 5 with holes, and the outer surface of the cone The reflection surfaces of the mirrors 6a and 7a are directed toward the first and second laser beam irradiation units 1 and 2, and the reflection surfaces of the conical inner surface mirrors 6b and 7b are opposite to the first and second laser beam irradiation units 1 and 2, respectively. It is also possible to adopt a configuration that faces the side. Note that, here, the other modifications as shown in FIG. 5 are not described for all of the first to fourth embodiments, but all of these embodiments can be configured similarly to FIG. is there.

  Of course, it is not necessary for all the light collecting means to have the configuration shown in FIG. 5, and the light collecting means shown in the first to fourth embodiments may be used in combination with the configuration shown in FIG. Is possible.

  (3) In the first to third embodiments, the condensing lens 8 is provided at the tail of each of the mirrors 4 and 5 with holes, but the laser is collected by a condensing means other than the condensing lens 8, for example, a condensing mirror. The beam may be condensed, or the condensing means may not be provided at the end.

  (4) In the first to third embodiments, the combination of the mirrors with holes 4 and 5 and the welding rod is also possible. FIG. 6 shows a combination example of the mirrors with holes 4 and 5 and the welding rod 50.

  As shown in this figure, the welding rod 50 is inserted from the rear end of the mirrors 4 and 5 with holes so as to pass through the holes 4a and 5a of the mirrors 4 and 5 with holes. The workpieces can also be welded by a combination of the focused beams 18 and 19 collected through the arc and arc discharge by the welding rod 50.

  Conventionally, there is a welding apparatus using a welding rod. This apparatus is shown in FIG. 7A, and uses a welding rod 61 inclined obliquely laterally with respect to the propagation direction of the laser 60 and supplies an arc 62 obliquely laterally. Originally, it is ideal that all the energy of the arc 62 is supplied into the keyhole 63 formed by the laser 60, the electron density in the keyhole 63 is increased, and the stable keyhole 63 is maintained. However, since the welding rod 61 is disposed obliquely laterally, the workpiece 64 is shielded, and most of the arc energy is consumed only for melting the workpiece 64.

  On the other hand, according to the laser processing apparatus having the above-described configuration, as shown in FIG. 7B, the welding rod 50 can be disposed immediately above the keyhole 9a. It can be supplied directly into the keyhole 9a and stable laser processing can be expected.

  (5) In the above embodiments, the condensing means (first and second condensing means) for the laser beams 10 and 11 are the conical outer surface mirrors 6a and 7a and the conical inner surface mirrors 6b and 7b in the first embodiment. The first and second ring-shaped beam forming units 6 and 7 and the first and second mirrors 4 and 5 having the condensing mirrors 4b and 5b, and the conical outer surface mirrors 6a and 7a and the annular condensing in the second embodiment. First and second ring-shaped beam forming units 6 and 7 having mirrors 6c and 7c, first and second mirrors 4 and 5 having flat mirrors 4c and 5c, and cone-type condensing mirror 6d in the third embodiment. 7d and first and second ring-shaped beam forming portions 6 and 7 having conical inner surface mirrors 6b and 7b, and first and second holed mirrors 4 and 5 having plane mirrors 4c and 5c. That is, the same condensing means is adopted for each embodiment, and the first ring-shaped beam forming unit 6 and the first holed mirror 4, the second ring-shaped beam forming unit 7 and the second holed mirror 5 have the same configuration. It is supposed to be. However, these are also examples, and the first ring-shaped beam forming unit 6 and the first mirror 4 with a hole may be different from the second ring-shaped beam forming unit 7 and the second mirror 5 with a hole. .

  (6) In the first to third embodiments, three mirrors provided in the first holed mirror 4 and the first ring-shaped laser forming unit 6 or the second holed mirror 5 and the second ring-shaped laser forming unit 7 are provided. While any one of the mirrors in the set is provided with a light collecting function, any two or three of them can be provided with a light collecting function.

It is a figure which shows schematic structure of the laser beam apparatus in 1st Embodiment of this invention. It is a figure which shows schematic structure of the laser beam apparatus in 2nd Embodiment of this invention. It is a figure which shows schematic structure of the laser beam apparatus in 3rd Embodiment of this invention. It is a figure which shows schematic structure of the laser beam apparatus in 4th Embodiment of this invention. It is a figure which shows schematic structure of the laser beam apparatus in other embodiment of this invention. It is a figure which shows schematic structure of the laser beam apparatus using the welding rod in other embodiment of this invention. It is the figure which showed the mode at the time of the welding of the laser beam apparatus using the conventional welding rod, and the laser beam apparatus shown in FIG.

Explanation of symbols

  1 to 3... First to third laser beam emitting portions 4, 5... First and second mirror portions with holes 4 a, 5 a, holes, 4 b, 5 b, focusing mirror, 4 c, 5 c, plane mirror, 6 , 7 ... first and second ring-shaped beam forming portions, 6a, 7a ... conical outer surface mirror, 6b, 7b ... conical inner surface mirror, 6c, 7c ... annular condensing mirror, 6d, 7d ... cone type condensing mirror, 8 40 ... Condensing lens, 50 ... Welding rod.

Claims (15)

While having a plurality of mirrors with holes (4, 5) provided with reflective surfaces with holes (4b, 4c, 5b, 5c) and holes (4a, 5a),
Beams (13, 14, 20, 21, 32) having a ring-shaped cross section toward each of the reflecting surfaces with holes (4b, 4c, 5b, 5c) in the mirrors with holes (4, 5). 33) a plurality of ring-shaped beam forming sections (6, 7),
The plurality of mirrors with holes (4, 5) are arranged in order from the position where the workpiece (9) is installed,
Of the plurality of mirrors with holes (4, 5), the light reflected by the reflective surface with holes (5b, 5c) of the one (5) arranged at a position far from the workpiece (9) A laser processing apparatus characterized in that the laser processing apparatus is configured to pass through the hole (4a) of a thing (4) disposed closer to the center and to be focused toward the focal point. The first hole-equipped mirror (4) is disposed at the close position, the reflective surface with holes and the holes are the first reflective surfaces with holes (4b, 4c) and the first holes (4a),
The second hole mirror (5) is disposed at the far position, the reflection surface with holes and the holes are the second hole reflection surfaces (5b, 5c) and the second hole (5a),
Of the plurality of ring-shaped beam forming portions (6, 7), the one that forms the beam directed toward the first holed mirror (4) is formed by the first ring-shaped beam forming portion (6). The beam is a first beam (13, 20, 32),
Of the plurality of ring-shaped beam forming portions (6, 7), the second ring-shaped beam forming portion (7), which forms the beam directed toward the second holed mirror (5), is formed thereby. The beam is a second beam (14, 21, 33),
When the second beam (14, 21, 33) is reflected by the second holed mirror (5), the reflected light is reflected in the first hole (4) formed in the first holed mirror (4). The laser processing apparatus according to claim 1, wherein the laser beam is focused toward the focal point through 4a). A first holed mirror (4) provided with a first holed reflective surface (4b, 4c) and a first hole (4a);
A second holed mirror (5) provided with a second holed reflecting surface (5b, 5c) and a second hole (5a);
A first ring-shaped beam forming section (13, 20 and 32) for forming a ring-shaped first beam (13, 20, 32) toward the first holed reflecting surface (4b, 4c) of the first holed mirror (4). 6) and
A second ring-shaped beam forming section (2) for forming a second beam (14, 21, 33) having a ring-shaped cross section toward the reflecting surface (5b, 5c) with the second hole in the mirror (5) with the second hole. 6)
When the first beam (13, 20, 32) is reflected by the first holed mirror (4), the reflected light is condensed toward the focal point,
When the second beam (14, 21, 33) is reflected by the second holed mirror (5), the reflected light is reflected in the first hole (4) formed in the first holed mirror (4). A laser processing apparatus characterized in that light is condensed toward the focal point through 4a). A first laser beam emitting section (1) for emitting a laser beam (10);
The first ring-shaped beam forming section (6) includes a conical outer surface mirror (6a) and a conical inner surface mirror (6b), and is a laser beam emitted from the first laser beam emitting section (1). Forming the first beam (13) from a beam (10);
The laser processing apparatus according to claim 2 or 3, wherein the first holed mirror (4) includes a condensing mirror (4b). A first laser beam emitting section (1) for emitting a laser beam (10);
The first ring-shaped beam forming part (6) includes a conical outer mirror (6a) and an annular condenser mirror (6c), and is emitted from the first laser beam emitting part (1). The first beam (20) is formed from a laser beam (10);
The laser processing apparatus according to claim 2 or 3, wherein the first holed mirror (4) includes a plane mirror (4c). A first laser beam emitting section (1) for emitting a laser beam (10);
The first ring-shaped beam forming section (6) includes a cone type condensing mirror (6d) and a conical inner surface mirror (6b), and is emitted from the first laser beam emitting section (1). The first beam (32) is formed from the laser beam (10),
The laser processing apparatus according to claim 2 or 3, wherein the first holed mirror (4) includes a plane mirror (4c). The laser beam (10) emitted from the first laser beam emitting part (1) passes through the hole (4a) in the first holed mirror (4) and then the first ring-shaped beam forming part ( The laser processing apparatus according to any one of claims 4 to 6, wherein the laser processing apparatus is incident on 6). A second laser beam emitting section (2) for emitting a laser beam (11);
The second ring-shaped beam forming section (7) includes a conical outer surface mirror (7a) and a conical inner surface mirror (7b), and the laser emitted from the second laser beam emitting section (2). Forming the second beam (14) from a beam (11);
The laser processing apparatus according to any one of claims 2 to 7, wherein the mirror with the second hole (5) includes a condensing mirror (5b). A second laser beam emitting section (2) for emitting a laser beam (11);
The second ring-shaped beam forming part (7) includes a conical outer mirror (7a) and an annular condenser mirror (7c), and is emitted from the second laser beam emitting part (2). The second beam (21) is formed from a laser beam (11);
The laser processing apparatus according to any one of claims 2 to 7, wherein the mirror with the second hole (5) includes a plane mirror (5c). A second laser beam emitting section (2) for emitting a laser beam (11);
The second ring-shaped beam forming section (7) includes a cone-type condensing mirror (7d) and a conical inner surface mirror (7b), and is emitted from the second laser beam emitting section (2). The second beam (33) is formed from the laser beam (11).
The laser processing apparatus according to any one of claims 2 to 7, wherein the mirror with the second hole (5) includes a plane mirror (5c). The laser beam (11) emitted from the second laser beam emitting unit (2) passes through the hole (5a) in the second holed mirror (5) and then the second ring-shaped beam forming unit ( The laser beam machining apparatus according to any one of claims 8 to 10, wherein the laser beam machining apparatus is incident on 7). A third laser beam emitting section (3) for emitting a laser beam to a position farther than the second holed mirror (5) when viewed from the position where the workpiece (9) is installed;
The condensing lens (8) provided between the mirror with the second hole (5) and the third laser beam emitting part (3) is provided. The laser processing apparatus as described in any one. A welding rod (50) extending from a position farther than the second holed mirror (5) to a position for installing the workpiece (9) when viewed from the position for installing the workpiece (9) is provided. The laser processing apparatus according to claim 2, wherein the laser processing apparatus is provided. Comprising first and second laser beam emitting sections (1, 2) for emitting laser beams (10, 11);
The first and second ring-shaped beam forming units (6, 7) include conical outer surface mirrors (6a, 7a) and conical inner surface mirrors (6b, 7b). The first and second beams are formed from the laser beams emitted from the laser beam emitting portions (1, 2),
The first and second mirrors with holes (4, 5) are configured to have plane mirrors (4c, 5c),
Further, a condenser lens (40) is provided between the first holed mirror (4) and the position where the workpiece (9) is installed, and the first and second holed mirrors (4, 5). 4. The laser processing apparatus according to claim 2, wherein the beam reflected at () is condensed by the condenser lens. A laser processing method for manufacturing a product by laser processing a workpiece (9) using the laser processing apparatus according to any one of claims 1 to 14,
Adjusting the focal position of the reflected light at each of the mirrors with holes (4, 5);
Placing the workpiece (9) at the focal position;
Irradiating the processed portion of the workpiece (9) with the reflected light.

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