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JP2005153031A - Wire saw and working fluid feed method of wire saw - Google Patents

Wire saw and working fluid feed method of wire saw Download PDF

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JP2005153031A
JP2005153031A JP2003390806A JP2003390806A JP2005153031A JP 2005153031 A JP2005153031 A JP 2005153031A JP 2003390806 A JP2003390806 A JP 2003390806A JP 2003390806 A JP2003390806 A JP 2003390806A JP 2005153031 A JP2005153031 A JP 2005153031A
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wire
workpiece
machining
wire saw
saw
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Takashi Yamaoka
隆 山岡
Haruki Inoue
晴喜 井上
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Yasunaga Corp
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Yasunaga Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a wire saw, efficiently making a working fluid adhere to a wire to sufficiently feed the fluid to a work piece and a working point, and efficiently cooling the wire and a groove roller to improve the working accuracy of the work piece. <P>SOLUTION: In this wire saw 1, while the working fluid 10 is fed to the reciprocating wire 2, the work piece 8 is vertically pressed to the wire 2 to cut the work piece. The wire saw includes a driving means 20 for periodically moving the wire 2 or the work piece 8 in the vertical direction in cutting the work piece 8, thereby feeding the working fluid 10 to the working point. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、加工液を供給しながらワイヤを往復動作させて高硬度の被加工物を切断するワイヤソー及びワイヤソーの加工液供給方法に関する。   The present invention relates to a wire saw that reciprocates a wire while supplying a machining fluid to cut a workpiece having a high hardness, and a method for supplying a machining fluid for the wire saw.

例えば、被加工部材としてのシリコンの結晶材料を薄く切断して半導体ウェハを製造したり、水晶、サファイア等を切断する手段としてワイヤと加工液(スラリー)とを使用して切断するワイヤソーがある。図3に示すように切り上げ(アップカット)方式のワイヤソー1は、新線リール(図示せず)から繰り出されたワイヤ2を3本の溝ローラ3、4、5に所定のピッチ(スライスすべき板厚+切り代)で各溝に巻き付け、これら複数列のワイヤ2の下方に配設したテーブル7に載置固定した被加工物(以下「ワーク」という)8をワイヤ2の下方から押し付けながらテーブル7を上動させ、溝ローラ3を駆動モータ6で駆動して所定のワイヤ速度(往復速度)+ワイヤフィード(新線繰り出し量)になるように各ワイヤ2を矢印で示す直線方向に水平に往復動作させると共に、図4に示すようにワーク8の上方に配置した加工液供給装置9から各ワイヤ2に加工液10を供給し、ワイヤ2により加工液10に分散している砥粒のラッピング作用を生じさせ、このラッピング作用によりワーク8の切断を行うようになっている。ローラ5を出たワイヤ2は巻取リール(図示せず)に巻き取られる(例えば、特許文献1参照。)。   For example, a semiconductor wafer is manufactured by thinly cutting a silicon crystal material as a member to be processed, or a wire saw that uses a wire and a processing liquid (slurry) as means for cutting crystal, sapphire, or the like. As shown in FIG. 3, the wire saw 1 of the up-cut method is to slicing the wire 2 fed from a new wire reel (not shown) into three groove rollers 3, 4 and 5 with a predetermined pitch (to be sliced). The workpiece (hereinafter referred to as “workpiece”) 8 wound around each groove with a thickness of (plate thickness + cutting allowance) and placed and fixed on a table 7 disposed below the plurality of rows of wires 2 is pressed from below the wires 2. The table 7 is moved upward, and the groove roller 3 is driven by the drive motor 6 so that each wire 2 is horizontally aligned in a linear direction indicated by an arrow so that a predetermined wire speed (reciprocating speed) + wire feed (new line feed amount) is obtained. As shown in FIG. 4, the machining liquid 10 is supplied to each wire 2 from the machining liquid supply device 9 disposed above the workpiece 8 as shown in FIG. 4, and the abrasive grains dispersed in the machining liquid 10 by the wire 2 are supplied. Wrapping action Cause, and performs the cutting of the workpiece 8 by the wrapping action. The wire 2 exiting the roller 5 is wound up on a take-up reel (not shown) (see, for example, Patent Document 1).

加工液供給装置9は、加工液10を供給するノズル11、このノズル11から供給された加工液10を溜めるタンク12、及びタンク12の底面の左右両側隅部に設けられたフィルタ13から成り、これら左右のフィルタ13からタンク12内の加工液10を矢印のようにカーテン状に流下させて各ワイヤ2のワーク8の両側に供給するようになっている。
特許第2656719号公報(図1)
The machining liquid supply device 9 includes a nozzle 11 that supplies the machining liquid 10, a tank 12 that stores the machining liquid 10 supplied from the nozzle 11, and a filter 13 that is provided at the left and right corners of the bottom surface of the tank 12. The machining liquid 10 in the tank 12 is made to flow down in a curtain shape as indicated by arrows from the left and right filters 13 and is supplied to both sides of the workpiece 8 of each wire 2.
Japanese Patent No. 2656719 (FIG. 1)

しかしながら、上記構成のワイヤソーにおいては、往復動作するワイヤ2は、カーテン状に流下する加工液10を横切るだけであるためワイヤ2に効率よく加工液10を付着させることができず、しかも、ワイヤ2に付着してワーク8に運ばれた加工液10は、ワイヤ2とワーク8との隙間が狭いために大半がワーク8の表面で落下してしまい加工点に持ち込まれる量が僅かとなり、加工液10を加工点に充分に供給することができない。このため、ワイヤ2の切れ味が悪く、加工精度が悪い。また、切断に伴い発生した熱(以下「加工熱」という)がワイヤ2を介して溝ローラ4、5を加熱し、これらの溝ローラ4、5の熱膨張によりワーク8の加工方向の反りや、うねりが大きくなり加工精度が悪化する等の問題がある。   However, in the wire saw having the above-described configuration, the reciprocating wire 2 only crosses the machining liquid 10 flowing down in a curtain shape, so that the machining liquid 10 cannot be efficiently attached to the wire 2. Most of the machining fluid 10 adhered to the workpiece 8 and carried to the workpiece 8 falls on the surface of the workpiece 8 because the gap between the wire 2 and the workpiece 8 is narrow, and the amount of the machining fluid 10 brought into the machining point becomes small. 10 cannot be sufficiently supplied to the processing point. For this reason, the sharpness of the wire 2 is poor and the processing accuracy is poor. Further, the heat generated by the cutting (hereinafter referred to as “processing heat”) heats the groove rollers 4 and 5 via the wire 2, and the heat expansion of these groove rollers 4 and 5 causes warping of the workpiece 8 in the processing direction. There is a problem that waviness increases and machining accuracy deteriorates.

本発明は、上述の点に鑑みてなされたもので、加工液を効率よくワイヤに付着させて被加工物との加工点に充分に供給可能とすると共に、ワイヤ及び溝ローラを効率よく冷却して被加工物の加工精度の向上を図るようにしたワイヤソー及びワイヤソーの加工液供給方法を提供することを目的する。   The present invention has been made in view of the above-described points. The machining liquid is efficiently attached to the wire so that it can be sufficiently supplied to the machining point with the workpiece, and the wire and the groove roller are efficiently cooled. It is an object of the present invention to provide a wire saw and a processing fluid supply method for the wire saw that can improve the processing accuracy of a workpiece.

上記目的を達成するため、請求項1の発明では、往復動作するワイヤに加工液を供給しながら被加工物を前記ワイヤに対し垂直方向に押し付けて切断するワイヤソーにおいて、前記被加工物の切断時に前記ワイヤ又は被加工物を前記垂直方向に定期的に移動させる駆動手段を備えたことを特徴としている。
請求項2の発明では、請求項1に記載のワイヤソーにおいて、前記被加工物の切断位置に応じて前記ワイヤの往復速度を変化させる制御手段を更に備えたことを特徴としている。
In order to achieve the above object, according to the first aspect of the present invention, in a wire saw for cutting a workpiece by pressing the workpiece in a direction perpendicular to the wire while supplying a machining fluid to the reciprocating wire, A driving means for periodically moving the wire or the workpiece in the vertical direction is provided.
According to a second aspect of the present invention, in the wire saw according to the first aspect, the wire saw further comprises control means for changing a reciprocating speed of the wire in accordance with a cutting position of the workpiece.

請求項3の発明では、請求項1に記載のワイヤソーにおいて、前記被加工物の切断位置に応じて前記ワイヤの張力を変化させる制御手段を更に備えたことを特徴としている。
請求項4の発明では、請求項1乃至3に記載のワイヤソーにおいて、前記ワイヤの下方に前記被加工物の両側近傍まで前記ワイヤに沿って加工液受けプレートを設け、前記加工液受けプレートに前記加工液を供給して前記ワイヤに接触させることを特徴としている。
According to a third aspect of the present invention, in the wire saw according to the first aspect, the wire saw according to the first aspect further comprises control means for changing a tension of the wire in accordance with a cutting position of the workpiece.
According to a fourth aspect of the present invention, in the wire saw according to any one of the first to third aspects, a working fluid receiving plate is provided along the wire to the vicinity of both sides of the workpiece under the wire, and the working fluid receiving plate is provided with the working fluid receiving plate. It is characterized in that a machining fluid is supplied and brought into contact with the wire.

請求項5の発明では、往復動作ワイヤに加工液を供給しながら被加工物を前記ワイヤに垂直方向に押し付けて切断するワイヤソーの加工液供給方法において、前記被加工物の切断時に前記ワイヤ又は被加工物を前記垂直方向に定期的に移動させて前記ワイヤと被加工物との間に隙間を開け、前記隙間に前記加工液を送り込むことを特徴としている。   According to a fifth aspect of the present invention, in a wire saw machining fluid supply method for cutting a workpiece by pressing the workpiece in a direction perpendicular to the wire while supplying the machining fluid to a reciprocating wire, the wire or workpiece is cut when the workpiece is cut. A workpiece is periodically moved in the vertical direction to form a gap between the wire and the workpiece, and the machining liquid is fed into the gap.

請求項1の発明では、ワイヤ又は被加工物をワイヤに対し垂直方向に定期的に移動させることでワイヤと被加工物との間に隙間を開けることができ、この隙間に前記ワイヤに付着した加工液を引き込むことが可能となり、ワイヤの加工点に前記加工液を供給することが可能となる。これにより、ワークの加工能力の向上、加工精度の向上等を図ることが可能となる。   According to the first aspect of the present invention, it is possible to open a gap between the wire and the workpiece by periodically moving the wire or the workpiece in a direction perpendicular to the wire, and the wire or the workpiece is attached to the wire. The machining fluid can be drawn in, and the machining fluid can be supplied to the machining point of the wire. Thereby, it becomes possible to improve the machining capability of the workpiece, improve the machining accuracy, and the like.

請求項2の発明では、前記被加工物の切断位置に応じて前記ワイヤの往復速度を変化させることで、被加工物の加工開始位置を精度良く位置決めすることができ、これに伴い被加工物の加工精度も良くなる。
請求項3の発明では、前記被加工物の切断位置に応じて前記ワイヤの張力を変化させることで、加工能力の増加、被加工物の加工方向の反りやうねりを小さく抑えることが可能となり、加工精度を向上させることが可能となる。
According to the invention of claim 2, by changing the reciprocating speed of the wire in accordance with the cutting position of the workpiece, the processing start position of the workpiece can be accurately positioned. The processing accuracy is improved.
In the invention of claim 3, by changing the tension of the wire according to the cutting position of the workpiece, it becomes possible to suppress an increase in processing capability, warpage and undulation in the processing direction of the workpiece, Processing accuracy can be improved.

請求項4の発明では、ワイヤと被加工物との間に加工液を充分に供給することができ、これにより、ワイヤと被加工物との押し付け力を増加することができ、加工能力が増加し、加工速度が高くなると共に切れ味が良くなり、加工精度が向上する。また、ワイヤに加工液を充分に付着させることができることでワイヤに付着した加工液をワイヤを往復動させる溝ローラに供給することができ、加工熱による前記ワイヤ及び溝ローラの熱膨張が押さえられて加工方向の反りやうねりが小さくなり、加工精度が向上する。   In the invention of claim 4, the working fluid can be sufficiently supplied between the wire and the workpiece, thereby increasing the pressing force between the wire and the workpiece and increasing the machining capability. In addition, the processing speed increases, the sharpness improves, and the processing accuracy improves. In addition, since the machining fluid can be sufficiently adhered to the wire, the machining fluid adhered to the wire can be supplied to the groove roller that reciprocates the wire, and thermal expansion of the wire and the groove roller due to machining heat is suppressed. As a result, warpage and undulation in the machining direction are reduced, and machining accuracy is improved.

請求項5の発明では、被加工物の切断時にワイヤと被加工物との間の隙間に加工液を充分に供給することができ、これにより、ワイヤと被加工物との押し付け力を増加することができ、加工能力が増加し、加工速度が高くなると共に切れ味が良くなり、加工精度が向上する。更に、ワイヤに加工液を充分に付着させることができ、且つワイヤに付着した加工液をワイヤを往復動させるための溝ローラに供給することができ、加工熱による前記ワイヤ及び溝ローラの熱膨張が押さえられ、加工方向の反りやうねりが小さくなり、加工精度が向上する。   In the invention of claim 5, when the workpiece is cut, the machining liquid can be sufficiently supplied to the gap between the wire and the workpiece, thereby increasing the pressing force between the wire and the workpiece. The processing capability increases, the processing speed increases, the sharpness improves, and the processing accuracy improves. Further, the machining fluid can be sufficiently adhered to the wire, and the machining fluid adhered to the wire can be supplied to the groove roller for reciprocating the wire, and the wire and the groove roller are thermally expanded by machining heat. Is suppressed, warping and undulation in the machining direction are reduced, and machining accuracy is improved.

以下、本発明の実施例を図面に基づいて説明する。
図1は、本発明に係るワイヤソーの概略構成を示す。尚、図3及び図4に示す部材と同一部材には同一の符号を付してある。ワイヤソー1は、新線リール(図示せず)から繰り出されたワイヤ2を3本の溝ローラ3、4、5に所定のピッチ(スライスすべき板厚+切り代)で各溝に巻き付け、これら複数列のワイヤ2の下方に配設したテーブル7に載置固定したワーク8をワイヤ2の下方から押し付けながらテーブル7を上下に移動させ、溝ローラ3を駆動モータで駆動して所定のワイヤ速度(往復速度)+ワイヤフィード(新線繰り出し量)になるように各ワイヤ2を矢印A、Bで示す直線方向に水平に往復動作させると共に、ワーク8の上方に配置した加工液供給装置9から各ワイヤ2に加工液10を供給し、ワイヤ2により加工液10に分散している砥粒のラッピング作用を生じさせ、このラッピング作用によりワーク8の切断を行うようになっている。また、ワイヤ2の繰出し側には張力調整手段(図示せず)が設けられており、ワイヤ2の張力を所定の値に調整可能とされている。
Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 shows a schematic configuration of a wire saw according to the present invention. The same members as those shown in FIGS. 3 and 4 are denoted by the same reference numerals. The wire saw 1 winds a wire 2 fed from a new wire reel (not shown) around each groove at a predetermined pitch (plate thickness to be sliced + cutting allowance) around three groove rollers 3, 4 and 5. The table 7 is moved up and down while pressing the work 8 placed and fixed on the table 7 arranged below the plurality of rows of wires 2 from below the wire 2, and the groove roller 3 is driven by a drive motor to obtain a predetermined wire speed. Each wire 2 is horizontally reciprocated in the linear direction indicated by arrows A and B so that (reciprocating speed) + wire feed (new line feed amount), and from the machining fluid supply device 9 disposed above the workpiece 8 The machining liquid 10 is supplied to each wire 2, and a lapping action of abrasive grains dispersed in the machining liquid 10 is generated by the wire 2, and the workpiece 8 is cut by this lapping action. Further, tension adjusting means (not shown) is provided on the feeding side of the wire 2 so that the tension of the wire 2 can be adjusted to a predetermined value.

加工液供給装置9は、加工液10を供給するノズル11、このノズル11から供給された加工液10を溜めるタンク12、及びタンク12の底面の左右両側隅部に設けられたフィルタ13、13から成り、これらの左右のフィルタ13、13からタンク12内の加工液10をカーテン状に流下させて各ワイヤ2のワーク8の両側に供給するようになっている。   The processing liquid supply device 9 includes a nozzle 11 that supplies the processing liquid 10, a tank 12 that stores the processing liquid 10 supplied from the nozzle 11, and filters 13 and 13 that are provided at the left and right corners of the bottom surface of the tank 12. Thus, the machining liquid 10 in the tank 12 flows down in a curtain shape from these left and right filters 13 and 13 and is supplied to both sides of the workpiece 8 of each wire 2.

複数列のワイヤ2の下方位置には僅かな間隔(1〜8mm)を存してワーク8の左右両側に加工液受けプレート15、15が設けられている。これらの左右の加工液受けプレート15、15は、溝ローラ4、5の長さ(紙面に垂直方向)と略同じ長さ(幅)とされ、左右の溝ローラ4、5の近傍からワーク8の両側部近傍位置までワイヤ2に沿って水平に配置されており、基端側の両側部がブラケット(図示せず)を介して支持板16に固定され、該支持板16は、不図示のフレームに固定されている。加工液受けプレート15の上面と支持板16の下端との間には充分な隙間が設けられており、ワイヤ2が往復動作自在に遊貫されている。尚、加工液受けプレート15は、幅広の平板でも良く、或いはワイヤ2と平行な両側部を上方に折曲させて樋状としても良い。   Work fluid receiving plates 15 and 15 are provided on the left and right sides of the workpiece 8 with a slight gap (1 to 8 mm) below the plurality of rows of wires 2. These left and right machining fluid receiving plates 15 and 15 have substantially the same length (width) as the length of the groove rollers 4 and 5 (perpendicular to the paper surface). Are disposed horizontally along the wire 2 up to a position near both side portions of the base plate, and both side portions on the base end side are fixed to the support plate 16 via brackets (not shown), and the support plate 16 is not shown. It is fixed to the frame. A sufficient gap is provided between the upper surface of the working fluid receiving plate 15 and the lower end of the support plate 16, and the wire 2 is allowed to reciprocate freely. The working fluid receiving plate 15 may be a wide flat plate, or may be formed into a bowl shape by bending both side portions parallel to the wire 2 upward.

支持板16の下部には加工液供給装置9のフィルタ13、13の下方、且つワイヤ2の上方にガイドプレート17が設けられている。ガイドプレート17は、上端が支持板16の下部に固定されてワーク8側に斜め下方に加工液受けプレート15の略中央近傍まで延出され、先端がワイヤ2の上方に僅かな隙間(1〜5mm)を存して離隔している。このガイドプレート17は、フィルタ13からカーテン状に流下する加工液を加工液受けプレート15の上面に導き供給する。   Under the support plate 16, a guide plate 17 is provided below the filters 13 and 13 of the machining liquid supply device 9 and above the wire 2. The upper end of the guide plate 17 is fixed to the lower portion of the support plate 16 and extends obliquely downward to the workpiece 8 side to near the center of the machining liquid receiving plate 15, and the tip is slightly above the wire 2 (1 to 1). 5mm) apart. The guide plate 17 guides and supplies the machining liquid flowing down from the filter 13 in a curtain shape to the upper surface of the machining liquid receiving plate 15.

テーブル7は、駆動手段20により矢印C、Dで示すように垂直に上下動(昇降)可能とされている。テーブル7の基台7aには送りナット21が軸方向を垂直(上下方向)に向けて配置されて固定されており、この送りナット21に送りねじ22が垂直に螺合されている。送りねじ22の基端にはギヤ23が固定されており、タイミングベルト24を介して駆動モータ26の軸に固定されたギヤ25に噛合されている。駆動モータ26は、前記ギヤ25から23を介して送りねじ22を駆動し、テーブル7を上動(上昇)又は下動(下降)させて、ワーク8の切断時にワイヤ2をワーク8に押し付けたり、ワイヤ2とワーク8との間に隙間を開けるようになっている。   The table 7 can be vertically moved (moved up and down) vertically as indicated by arrows C and D by the driving means 20. A feed nut 21 is arranged and fixed on the base 7a of the table 7 with the axial direction being vertical (vertical direction), and a feed screw 22 is vertically screwed to the feed nut 21. A gear 23 is fixed to the proximal end of the feed screw 22, and meshes with a gear 25 fixed to the shaft of the drive motor 26 via a timing belt 24. The drive motor 26 drives the feed screw 22 through the gears 25 to 23 to move the table 7 upward (upward) or downward (downward) to press the wire 2 against the workpiece 8 when the workpiece 8 is cut. A gap is formed between the wire 2 and the workpiece 8.

制御装置28は、コンピュータを備えており、所定のプログラムに従ってワーク8の切断位置(加工位置)に応じてワイヤ2とワーク8との間に隙間を開ける周期、隙間の間隔、ワーク即ち、テーブル7を下降又は上昇させる速度(テーブル速度)を制御すべく駆動モータ26を制御する。また、制御装置28は、モータ6を制御してワイヤ2の速度(往復速度)、ワイヤフィード(新線繰り出し量)を等を制御する。ワイヤ2とワーク8との間に隙間を開ける周期、隙間の間隔、テーブル速度等は、ワーク8の形状や材質等に応じて最適な値に制御される。   The control device 28 includes a computer, and according to a predetermined program, a cycle for opening a gap between the wire 2 and the workpiece 8 according to a cutting position (processing position) of the workpiece 8, a gap interval, a workpiece, that is, the table 7. The drive motor 26 is controlled to control the speed (table speed) for lowering or raising the speed. Further, the control device 28 controls the motor 6 to control the speed of the wire 2 (reciprocating speed), the wire feed (new line feed amount), and the like. The cycle of opening the gap between the wire 2 and the workpiece 8, the gap interval, the table speed, and the like are controlled to optimum values according to the shape, material, and the like of the workpiece 8.

以下に動作を説明する。
図2に示すようにワーク8の切断時に、ノズル11からタンク12に加工液10が供給され、この加工液10は、左右のフィルタ13、13から矢印で示すようにカーテン状に流下し、ガイドプレート17により加工液受けプレート15上に供給され、当該加工液受けプレート15上を長手方向(左右方向)に流れる。ワイヤ2は、この加工液受けプレート15上に供給された加工液10の中を矢印A又はBで示す左右方向へ水平に往復動作する。従って、ワイヤ2は、加工液受けプレート15の略全長に亘りその表面に加工液10が付着する。尚、ワイヤ2は、その下部が加工受けプレート15上の加工液10に接触するだけでも加工点に加工液を充分に供給することが可能である。
The operation will be described below.
As shown in FIG. 2, when the workpiece 8 is cut, the machining liquid 10 is supplied from the nozzle 11 to the tank 12, and the machining liquid 10 flows down from the left and right filters 13, 13 in a curtain shape as indicated by arrows, and guides The plate 17 is supplied onto the machining liquid receiving plate 15 and flows on the machining liquid receiving plate 15 in the longitudinal direction (left-right direction). The wire 2 reciprocates horizontally in the left-right direction indicated by the arrow A or B in the machining liquid 10 supplied onto the machining liquid receiving plate 15. Therefore, the processing liquid 10 adheres to the surface of the wire 2 over substantially the entire length of the processing liquid receiving plate 15. Note that the wire 2 can sufficiently supply the machining liquid to the machining point even if the lower portion of the wire 2 comes into contact with the machining liquid 10 on the machining receiving plate 15.

制御装置28は、ワイヤ2が矢印Aで示す右方に移動する時に駆動モータ26を駆動してテーブル7を僅かに下降させてワイヤ2と加工点との間に隙間を開ける。ワイヤ2の表面に付着した加工液10のうち両側に付着している加工液は、当該ワイヤ2とワーク8との隙間が小さいためにその大半がワーク8の表面で掻き落とされて落下するが、ワイヤ2の下側に付着している加工液が図示のようにワイヤ2とワーク8の加工点との間の前記隙間に左方から多量に引き込まれる。これにより、ワイヤ2とワーク8との加工点に充分な量の加工液が供給される。同時に切粉が加工点から右方に効率よく排出される。   The control device 28 drives the drive motor 26 when the wire 2 moves to the right indicated by the arrow A, and slightly lowers the table 7 to open a gap between the wire 2 and the processing point. Most of the machining liquid adhering to both sides of the machining liquid 10 adhering to the surface of the wire 2 is scraped off by the surface of the work 8 and drops because the gap between the wire 2 and the work 8 is small. The machining liquid adhering to the lower side of the wire 2 is drawn in a large amount from the left into the gap between the wire 2 and the machining point of the workpiece 8 as shown in the figure. As a result, a sufficient amount of machining fluid is supplied to the machining points of the wire 2 and the workpiece 8. At the same time, chips are efficiently discharged from the processing point to the right.

次いで、制御装置28がテーブル27を上昇させてワーク8の加工点をワイヤ2に押し付けながらワイヤ2を矢印Bで示す左方に走行移動させて、前記多量に供給された加工液によりワーク8を切断する。制御装置28は、制御プログラムに基づいてワーク8の切断位置(加工位置)に応じてワイヤ2とワーク8との間に隙間を開ける周期、隙間の間隔、ワーク8即ち、テーブル7を下降又は上昇させる速度(テーブル速度)、ワーク8をワイヤ2に押し付ける時間等を最適な値に制御する。これにより、ワイヤ2にワーク8を押し付ける力を増加させることができ、加工能力が増加し、加工速度が高くなると共に、切れ味が良くなり、加工精度も向上する。   Next, the control device 28 raises the table 27 and moves the wire 2 to the left as shown by the arrow B while pressing the machining point of the workpiece 8 against the wire 2, and the workpiece 8 is moved by the large amount of machining fluid supplied. Disconnect. The control device 28 lowers or raises the cycle of opening the gap between the wire 2 and the workpiece 8 according to the cutting position (machining position) of the workpiece 8 based on the control program, the gap interval, the workpiece 8, that is, the table 7. The speed to be pressed (table speed), the time for pressing the workpiece 8 against the wire 2, and the like are controlled to optimum values. Thereby, the force which presses the workpiece | work 8 to the wire 2 can be increased, processing capability increases, a processing speed becomes high, sharpness improves, and processing precision improves.

往復動作するワイヤ2が矢印A方向に動いている場合、左側の加工液受けプレート15上の加工液10は、上述したようにワーク8の方向に運ばれるが、右側の加工液受けプレート15上の加工液10は、ワイヤ2に付着して溝ローラ5の方向に運ばれ、当該ワイヤ2と溝ローラ5とを効率よく冷却する。反対にワイヤ2が矢印B方向に動いている場合も同様にしてワイヤ2と溝ローラ4とを効率よく冷却する。これにより、加工熱による溝ローラ4、5の熱膨張が押さえられ、ワーク8の加工方向の反り、うねりが小さくなり、加工精度が向上する。   When the reciprocating wire 2 moves in the direction of arrow A, the machining fluid 10 on the left machining fluid receiving plate 15 is conveyed in the direction of the workpiece 8 as described above, but on the right machining fluid receiving plate 15. The machining liquid 10 adheres to the wire 2 and is carried in the direction of the groove roller 5 to cool the wire 2 and the groove roller 5 efficiently. On the contrary, when the wire 2 moves in the direction of arrow B, the wire 2 and the groove roller 4 are cooled efficiently in the same manner. Thereby, the thermal expansion of the groove rollers 4 and 5 due to the processing heat is suppressed, the warp and the undulation in the processing direction of the workpiece 8 are reduced, and the processing accuracy is improved.

上述したようにワークを定期的(周期的)に昇降させることでワイヤ2のワーク8との加工点に充分な加工液を供給することができるためにテーブル速度を速くすることが可能であり、加工開始から加工終了までに要する総加工時間を短く、且つワーク8の加工精度を向上させることが可能である。
尚、テーブル7を下降させてワイヤ2とワーク8との間に隙間を開け、加工液受けプレート15を設けずに図4に示すようにワイヤ2をカーテン状に流下する加工液10を単に横切らせても、ワイヤ2の下側に付着した加工液10を加工点に供給することが可能である。しかしながら、上述したように加工液受けプレート15を設けることで、ワイヤ2の周囲に多量の加工液を付着させることが可能となり、加工点に充分な量の加工液を供給することが可能となる。これにより、上述した各効果を得ることが可能となる。
As described above, it is possible to increase the table speed because sufficient machining fluid can be supplied to the machining point of the wire 2 with the workpiece 8 by raising and lowering the workpiece periodically (periodically). It is possible to shorten the total machining time required from the machining start to the machining end and improve the machining accuracy of the workpiece 8.
Note that the table 7 is lowered to create a gap between the wire 2 and the workpiece 8, and the machining fluid 10 that flows down the wire 2 in a curtain shape as shown in FIG. Even in this case, it is possible to supply the machining liquid 10 adhered to the lower side of the wire 2 to the machining point. However, by providing the machining fluid receiving plate 15 as described above, a large amount of machining fluid can be attached around the wire 2 and a sufficient amount of machining fluid can be supplied to the machining point. . Thereby, each effect mentioned above can be acquired.

また、上記実施例では、ワークの加工位置(切断位置)に応じてテーブル速度を変えた場合について説明したが、ワーク8の加工位置に応じて制御装置28により溝ローラ3の駆動モータ6(図3)を制御してワイヤ往復速度を変えるようにしてもよい。この場合、ワーク8の加工開始(スタート)時のワイヤ2の速度を遅くすることでワーク8の加工位置を精度良く位置決めすることができ、これに伴いワーク8の加工精度も良くなる。   In the above-described embodiment, the case where the table speed is changed in accordance with the workpiece processing position (cutting position) has been described. However, the drive motor 6 (see FIG. The wire reciprocating speed may be changed by controlling 3). In this case, the processing position of the workpiece 8 can be accurately positioned by slowing down the speed of the wire 2 at the start (start) of the processing of the workpiece 8, and the processing accuracy of the workpiece 8 is also improved accordingly.

或いは、制御装置28によりワーク8の加工位置に応じてワイヤ2の張力を変えるようにしてもよい。この場合、加工開始時のワイヤ2の張力を高くすることで溝ローラ4、5からワーク8までの距離が長くてもワイヤ2が撓み難くなると共に加工能力が増加しワーク8の加工方向の反りやうねりを小さく抑えることが可能となり、加工精度を向上させることができる。   Alternatively, the tension of the wire 2 may be changed according to the processing position of the workpiece 8 by the control device 28. In this case, by increasing the tension of the wire 2 at the start of machining, the wire 2 becomes difficult to bend even if the distance from the groove rollers 4 and 5 to the workpiece 8 is long, and the machining capability increases and the workpiece 8 warps in the machining direction. It becomes possible to suppress waviness and undulation, and the machining accuracy can be improved.

また、上記実施形態では加工液をワイヤの上方より供給する場合について説明したが、これに限るものではなく、加工液をワイヤの下方、或いは側方から供給する場合でもワイヤの下方に加工液受けプレートを設けることにより同様の効果を得ることができる。
また、上記実施形態では水平に往復移動するワイヤ2の下方からワーク8を上昇させてワイヤ2に押し付けて切断する切り上げ(アップカット)方式のワイヤソーについて説明したが、ワイヤ2の上方にテーブル7を配置しワーク8を下降させてワイヤ2に押し付けて切断する切り下げ(ダウンカット)方式のワイヤソーについても、加工液受けプレート15とワイヤ2間の距離を調整することによりワイヤ2の上部に加工液を付着させ、テーブル7を定期的に上昇させてワイヤ2の上部とワーク8との間に隙間を開け、この隙間に加工液を送り込んで加工点に充分な加工液を供給することで、上述した切り上げ方式のワイヤソーの場合と同様の効果を得ることができる。
In the above embodiment, the case where the machining fluid is supplied from above the wire has been described. However, the present invention is not limited to this. Even when the machining fluid is supplied below or from the side of the wire, the machining fluid is received below the wire. A similar effect can be obtained by providing a plate.
In the above-described embodiment, the up-cut type wire saw that lifts the workpiece 8 from below the wire 2 that reciprocates horizontally and presses the workpiece 8 against the wire 2 for cutting is described. However, the table 7 is placed above the wire 2. With regard to a down-saw type wire saw in which the workpiece 8 is lowered and pressed against the wire 2 for cutting, the working fluid is applied to the upper portion of the wire 2 by adjusting the distance between the working fluid receiving plate 15 and the wire 2. As described above, the table 7 is periodically lifted to open a gap between the upper portion of the wire 2 and the workpiece 8, and a sufficient amount of machining liquid is supplied to the machining point by feeding the machining liquid into the gap. The same effect as in the case of a round-up wire saw can be obtained.

更に、上記実施形態では、ワイヤ2の高さ位置を一定にしてテーブル7を上下に定期的に移動(昇降)させてワイヤ2とワーク8との間に隙間を開ける場合について記述したが、テーブル7の高さ位置を一定にしてワイヤ2を定期的に上下に移動(昇降)させるようにしても同様の効果を得ることが可能である。   Further, in the above-described embodiment, the case has been described in which the height position of the wire 2 is fixed and the table 7 is periodically moved up and down (lifted) to open a gap between the wire 2 and the workpiece 8. The same effect can be obtained even if the height position of 7 is kept constant and the wire 2 is periodically moved up and down (lifted).

本発明に係るワイヤソーの要部断面図である。It is principal part sectional drawing of the wire saw which concerns on this invention. 図1に示すワイヤソーの加工時における加工液の供給動作の説明図である。It is explanatory drawing of the supply operation | movement of the process liquid at the time of a process of the wire saw shown in FIG. ワイヤソーの構成の一例を示す要部斜視図である。It is a principal part perspective view which shows an example of a structure of a wire saw. 従来のワイヤソーの加工液供給装置の説明図である。It is explanatory drawing of the processing liquid supply apparatus of the conventional wire saw.

符号の説明Explanation of symbols

1 ワイヤソー
2 ワイヤ
3、4、5 溝ローラ
6 駆動モータ
7 テーブル
8 ワーク
9 加工液供給装置
20 駆動手段
21 送りナット
22 送りねじ
23、25 ギヤ
24 タイミングベルト
26 駆動モータ
28 制御装置
DESCRIPTION OF SYMBOLS 1 Wire saw 2 Wire 3, 4, 5 Groove roller 6 Drive motor 7 Table 8 Work 9 Processing liquid supply apparatus 20 Drive means 21 Feed nut 22 Feed screw 23, 25 Gear 24 Timing belt 26 Drive motor 28 Control apparatus

Claims (5)

往復動作するワイヤに加工液を供給しながら被加工物を前記ワイヤに対し垂直方向に押し付けて切断するワイヤソーにおいて、
前記被加工物の切断時に前記ワイヤ又は被加工物を前記垂直方向に定期的に移動させる駆動手段を備えたことを特徴とするワイヤソー。
In a wire saw that cuts a workpiece by pressing the workpiece in a direction perpendicular to the wire while supplying a working fluid to the reciprocating wire,
A wire saw comprising driving means for periodically moving the wire or the workpiece in the vertical direction when the workpiece is cut.
前記被加工物の切断位置に応じて前記ワイヤの往復速度を変化させる制御手段を更に備えたことを特徴とする請求項1記載のワイヤソー。   2. The wire saw according to claim 1, further comprising control means for changing a reciprocating speed of the wire in accordance with a cutting position of the workpiece. 前記被加工物の切断位置に応じて前記ワイヤの張力を変化させる制御手段を更に備えたことを特徴とする請求項1記載のワイヤソー。   2. The wire saw according to claim 1, further comprising control means for changing a tension of the wire in accordance with a cutting position of the workpiece. 前記ワイヤの下方に前記被加工物の両側近傍まで前記ワイヤに沿って加工液受けプレートを設け、前記加工液受けプレートに前記加工液を供給して前記ワイヤに接触させることを特徴とする請求項1乃至3記載のワイヤソー。   The processing liquid receiving plate is provided along the wire to the vicinity of both sides of the workpiece under the wire, and the processing liquid is supplied to the processing liquid receiving plate to be brought into contact with the wire. The wire saw according to 1 to 3. 往復動作するワイヤに加工液を供給しながら被加工物を前記ワイヤに対し垂直方向に押し付けて切断するワイヤソーの加工液供給方法において、
前記被加工物の切断時に前記ワイヤ又は被加工物を前記垂直方向に定期的に移動させて前記ワイヤと被加工物との間に隙間を開け、前記隙間に前記加工液を送り込むことを特徴とするワイヤソーの加工液供給方法。
In a wire saw machining fluid supply method of cutting a workpiece by pressing the workpiece in a direction perpendicular to the wire while supplying the machining fluid to a reciprocating wire,
The wire or the workpiece is periodically moved in the vertical direction when the workpiece is cut to open a gap between the wire and the workpiece, and the machining liquid is fed into the gap. Wire saw machining fluid supply method.
JP2003390806A 2003-11-20 2003-11-20 Wire saw and working fluid feed method of wire saw Pending JP2005153031A (en)

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JP2007054913A (en) * 2005-08-24 2007-03-08 Denso Corp Wire saw machining apparatus and machining method using wire saw
JP2007326167A (en) * 2006-06-07 2007-12-20 Toyo Advanced Technologies Co Ltd Wire saw
JP2008213103A (en) * 2007-03-06 2008-09-18 Yasunaga Corp Working fluid feeding device of wire saw
JP2009061529A (en) * 2007-09-05 2009-03-26 Denso Corp Wire saw device for manufacturing silicon carbide substrate
JP2011104719A (en) * 2009-11-18 2011-06-02 Komatsu Ntc Ltd Method for preventing wire gathering/separation of multi-wire saw
WO2013094117A1 (en) * 2011-12-22 2013-06-27 信越半導体株式会社 Method for cutting work piece
KR101279681B1 (en) * 2010-09-29 2013-06-27 주식회사 엘지실트론 Sawing Apparatus of Single Crystal the same
WO2016051668A1 (en) * 2014-09-29 2016-04-07 信越半導体株式会社 Ingot cutting method
JP2016174173A (en) * 2014-04-30 2016-09-29 ジルトロニック アクチエンゲゼルシャフトSiltronic AG Method of cutting large number of slices of especially uniform thickness from work piece simultaneously

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* Cited by examiner, † Cited by third party
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JP2007054913A (en) * 2005-08-24 2007-03-08 Denso Corp Wire saw machining apparatus and machining method using wire saw
JP4622741B2 (en) * 2005-08-24 2011-02-02 株式会社デンソー Wire saw processing apparatus and processing method using wire saw
JP2007326167A (en) * 2006-06-07 2007-12-20 Toyo Advanced Technologies Co Ltd Wire saw
JP2008213103A (en) * 2007-03-06 2008-09-18 Yasunaga Corp Working fluid feeding device of wire saw
JP2009061529A (en) * 2007-09-05 2009-03-26 Denso Corp Wire saw device for manufacturing silicon carbide substrate
JP2011104719A (en) * 2009-11-18 2011-06-02 Komatsu Ntc Ltd Method for preventing wire gathering/separation of multi-wire saw
US8752537B2 (en) 2010-09-29 2014-06-17 Lg Siltron Inc. Sawing apparatus of single crystal ingot
KR101279681B1 (en) * 2010-09-29 2013-06-27 주식회사 엘지실트론 Sawing Apparatus of Single Crystal the same
JP2013129046A (en) * 2011-12-22 2013-07-04 Shin Etsu Handotai Co Ltd Workpiece cutting method
WO2013094117A1 (en) * 2011-12-22 2013-06-27 信越半導体株式会社 Method for cutting work piece
JP2016174173A (en) * 2014-04-30 2016-09-29 ジルトロニック アクチエンゲゼルシャフトSiltronic AG Method of cutting large number of slices of especially uniform thickness from work piece simultaneously
WO2016051668A1 (en) * 2014-09-29 2016-04-07 信越半導体株式会社 Ingot cutting method
JP2016068182A (en) * 2014-09-29 2016-05-09 信越半導体株式会社 Ingot cutting method

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