JP2005026982A - Piezoelectric device and its manufacturing method, cellular phone unit and electronic equipment utilizing same, and mounting device of piezoelectric vibrating piece - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a piezoelectric device for fixing the tip without any contact with the bottom surface of a package substrate by effectively avoiding inclination fixing to the package of a piezoelectric vibrating piece; and to provide a method for manufacturing the piezoelectric device, a mounting device of the piezoelectric vibrating piece, and a cellular phone and electronic equipment utilizing the piezoelectric device. <P>SOLUTION: In the method for manufacturing the piezoelectric device, the piezoelectric vibrating piece 32 is supported in cantilever for accommodation in the package. The method includes a formation process of the package 36, a process (ST11) for coating the substrate of the package with a conductive adhesive, a process (ST13) for placing a base 46 of the piezoelectric vibrating piece 32 on the conductive adhesive for mounting, a process (ST14) for curing the conductive adhesive, a process for sealing the package, and a process (ST13) for temporarily curing the conductive adhesive after the coating process of the conductive adhesive. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a piezoelectric device and a manufacturing method thereof, a mounting device for a piezoelectric vibrating piece, and a mobile phone and an electronic apparatus using the piezoelectric device.
[0002]
[Prior art]
Quartz containing a piezoelectric vibrating piece in a package for small information devices such as HDDs (hard disk drives), mobile computers, and IC cards, and mobile communication devices such as mobile phones, car phones, and paging systems. Piezoelectric devices such as vibrators and crystal oscillators are widely used.
FIG. 10 is a flowchart showing a fixing method of the piezoelectric vibrating piece among the manufacturing methods of the piezoelectric vibrating piece used in such a piezoelectric device, and FIG. 11 is a schematic sectional view showing a known configuration example of the piezoelectric device. FIG. 12 is a schematic plan view showing a fixing structure of a piezoelectric vibrating piece used in a piezoelectric device (see Patent Document 1).
[0003]
In FIG. 11, the piezoelectric device 1 houses a piezoelectric vibrating piece 2 in a package 3. The piezoelectric vibrating piece 2 is fixed to the electrode 4 in the package 3 in a cantilever manner using a conductive adhesive 5. The package 3 is hermetically sealed by the lid body 6.
[0004]
A method for fixing the piezoelectric vibrating piece 2 of the piezoelectric device 1 described in FIG. 11 will be described with reference to FIG.
First, the conductive adhesive 5 is applied on the electrodes 4 and 4 (see FIG. 12) formed on the package 3 of FIG.
Next, the piezoelectric vibrating piece (quartz) 2 is sucked by a suction head (not shown) (ST2). Then, the attracted and held piezoelectric vibrating piece 2 is mounted on the package 3 (ST3). Specifically, in step ST <b> 3, the base portion 2 a on which an electrode (not shown) of the piezoelectric vibrating piece 2 is formed is placed on the conductive adhesive 5.
In this state, in a curing furnace such as a belt furnace, the package 3 is heated for a predetermined time while the belt is conveyed to cure the conductive adhesive 5 (ST4).
When the piezoelectric vibrating piece 2 is joined, the opening of the package 3 is sealed with the sealing material 3a in a vacuum or in an inert gas atmosphere such as nitrogen (ST5).
[0005]
By the way, according to such a process, as shown in FIG. 11, the tip portion 2b side of the piezoelectric vibrating piece 2 may be fixed in a lowered state.
That is, since the piezoelectric vibrating reed 2 is fixed in a cantilever manner, the tip 2b of the piezoelectric vibrating reed 2 is not supported, and thus the piezoelectric vibrating reed 2 is lowered by its own weight until the conductive adhesive 5 is completely cured. May be fixed in an inclined state.
In the package 3, the piezoelectric vibrating reed 2 is tilted and fixed, and the piezoelectric vibrating reed 2 may not be able to oscillate, particularly when the tip 2 b is in contact with the bottom surface of the package 3.
In FIG. 12, a plurality of protrusions 8, 8, 8 are provided on the bottom surface of the package 3, and by supporting a plurality of locations on the base 2 a of the piezoelectric vibrating piece 2 with the protrusions 8, 8, 8, The support region is expanded in a planar shape to prevent inclination.
[0006]
FIG. 13 is a schematic sectional view (see Patent Document 2) showing another known fixing method.
In the figure, a conductive adhesive 5 is applied on an electrode (not shown) on the bottom surface of the package 3-1. On the conductive adhesive 5, the base portion 2-1a of the piezoelectric vibrating piece 2-1 is placed.
In this state, the piezoelectric vibrating piece 2-1 is sucked and held by a suction head or the like and floated in the direction of the arrow so that the base portion 2-1a and the tip portion 2-1b have the same height. That is, a step of correcting the inclination once is provided.
Thus, the inclination of the piezoelectric vibrating piece 2-1 is prevented from being fixed.
[0007]
[Patent Document 1] JP-A-2003-78382
[Patent Document 2] JP-A-2003-46356
[0008]
[Problems to be solved by the invention]
Here, it is considered that the above-described tilt fixing of the piezoelectric vibrating piece is caused by the following two causes.
The first cause is the fluidity before curing of the conductive adhesive. When the base of the piezoelectric vibrating piece is placed on the conductive adhesive before curing, the base is separated by the fluidity of the conductive adhesive. It cannot be supported horizontally in the holding state and tilts.
The second cause is that the flatness of the surface of the package side electrode to which the conductive adhesive is applied is not sufficient and is not parallel to the bottom surface of the package, so that the piezoelectric vibrating piece corresponds to the inclination of the surface of the electrode. Will be tilted and fixed.
[0009]
According to the study by the present inventors, the first cause among the first cause and the second cause is considered to be dominant in what causes the tilted fixation of the piezoelectric vibrating piece. That is, the place due to the fluidity of the conductive adhesive when mounting the piezoelectric vibrating piece is dominant. That is, since it takes a certain amount of time to move to the curing device after placing the piezoelectric vibrating piece after applying the conductive adhesive, the piezoelectric vibrating piece is displaced during that time.
For this reason, even with the structure of FIG. 12 that attempts to improve the flatness of the mounting surface, the solution is insufficient, and the method of FIG. 13 adds a process of floating the piezoelectric vibrating piece to the conventional process. However, as long as there is fluidity of the conductive adhesive, the piezoelectric vibrating piece is inclined again.
Therefore, in order to improve the inclination fixing of the piezoelectric vibrating piece, it is necessary to use a technique that takes measures against the fluidity of the conductive adhesive used for bonding.
[0010]
The present invention has been made to solve the above-described problems, and effectively avoids the tilting of the piezoelectric vibrating piece with respect to the package so that the tip portion can be fixed without touching the bottom surface of the package substrate. It is an object of the present invention to provide a piezoelectric device and a manufacturing method thereof, a mounting device for a piezoelectric vibrating piece, and a mobile phone and an electronic device using the piezoelectric device.
[0011]
[Means for Solving the Problems]
According to the first aspect of the present invention, there is provided a method of manufacturing a piezoelectric device in which a piezoelectric vibrating piece is cantilevered and accommodated in a package, wherein the package forming step and a conductive material on a substrate of the package are provided. A step of applying a conductive adhesive, a step of mounting and mounting the base of the piezoelectric vibrating piece over the conductive adhesive, a step of curing the conductive adhesive, and sealing the package. The method is achieved by a method of manufacturing a piezoelectric device including a step of temporarily curing the conductive adhesive after the step of applying the conductive adhesive.
[0012]
According to the configuration of the first invention, a step of temporarily curing the conductive adhesive is adopted after the step of applying the conductive adhesive in the manufacturing process of the piezoelectric device. Here, the “temporary curing process” refers to the following process. That is, the conductive adhesive is obtained by adding a conductive filler to a synthetic resin agent containing a solvent as an adhesive component that exhibits bonding strength. Among the components of such a conductive adhesive, in an uncured state, it has fluidity due to a large amount of solvent. Therefore, in the present invention, the solvent on the surface portion of the applied conductive adhesive is volatilized to some extent, its viscosity is increased, and when the piezoelectric vibrating piece is placed, it is in a state where it does not deform due to its weight. That is. That is, the temporary curing is a state in which the solvent near the surface of the applied conductive adhesive is volatilized, but the binder is not polymerized in a state where all the solvent is not volatilized. As a result, when the piezoelectric vibrating piece is placed, the conductive adhesive can be prevented from being deformed so that the region on the tip side sinks, and the piezoelectric vibrating piece can be supported substantially horizontally. If the conductive adhesive is completely cured in this state, the binder contained in the adhesive is polymerized, and the piezoelectric vibrating piece can be fixed almost horizontally by the chemical bonding force.
Thus, according to the present invention, there is provided a method for manufacturing a piezoelectric device that effectively avoids tilt fixing of a piezoelectric vibrating piece with respect to a package so that the tip portion can be fixed without touching the bottom surface of the package substrate. Can do.
[0013]
According to a second invention, in the configuration of the first invention, the temporary curing step of the conductive adhesive is performed simultaneously with the mounting step of the piezoelectric vibrating piece.
According to the configuration of the second invention, if the above-described temporary curing of the conductive adhesive is performed at the same time as the mounting step of placing the piezoelectric vibrating piece on the conductive adhesive, the mounting and the temporary curing are performed simultaneously. While the fluidity of the adhesive is high, the piezoelectric vibrating piece is supported during the mounting operation, and the conductive adhesive can be temporarily cured immediately before the piezoelectric vibrating piece is displaced.
[0014]
According to a third invention, in the configuration of the first invention, the temporary curing step of the conductive adhesive is performed immediately before the mounting step of the piezoelectric vibrating piece.
According to the configuration of the third aspect of the invention, even if the above-described temporary curing of the conductive adhesive is started immediately before mounting the piezoelectric vibrating piece and is temporarily cured during mounting, the piezoelectric vibrating piece is supported. The conductive adhesive can be temporarily cured before being displaced in the state. In this case, since the conventional mounting jig or the like does not need to be changed, the manufacturing line can be changed with little change.
[0015]
According to a fourth invention, in the configuration of the first invention, the temporary curing step of the conductive adhesive is performed immediately after the mounting step of the piezoelectric vibrating piece.
According to the configuration of the fourth invention, the temporary curing of the conductive adhesive described above is started immediately after the mounting of the piezoelectric vibrating piece, and is shorter in the time required for the displacement of the piezoelectric vibrating piece. Is temporarily cured, the piezoelectric vibrating piece can be fixed almost horizontally. Also in this case, since it is not necessary to change the conventional mounting jig or the like, the manufacturing line can be changed with little change.
[0016]
According to a fifth invention, in the configuration of the second invention, in a state where the piezoelectric vibrating piece is held by a holding jig, a base portion of the piezoelectric vibrating piece is placed on the conductive adhesive, and the holding jig is used. The temporary curing step is performed by heating the conductive adhesive from a tool through the piezoelectric vibrating piece.
According to the configuration of the fifth aspect of the present invention, the conductive adhesive can be easily temporarily cured simultaneously with the mounting by the holding jig having the above configuration.
[0017]
According to the sixth aspect of the present invention, there is provided, according to the sixth aspect, means for holding at least the package substrate of the piezoelectric device and the conductive adhesive that is moved by the drive arm and is applied to the package substrate while holding the piezoelectric vibrating piece. This is achieved by a piezoelectric vibrating reed mounting device that is mounted on the agent and includes a head unit that includes a heating unit that heats the piezoelectric vibrating reed in the mounted state.
According to the configuration of the sixth invention, the head unit of the mounting apparatus of the present invention is not greatly changed by adding only the heating means to the conventional configuration as the means for holding the piezoelectric vibrating piece. However, the apparatus which can perform temporary hardening of a conductive adhesive at the time of mounting can be obtained.
[0018]
According to a seventh invention, in the configuration of the sixth invention, the head section includes a vacuum suction means, and the heating means is provided around the vacuum suction means.
According to the seventh aspect of the present invention, only the heating means is added around the vacuum suction means conventionally provided in this type of apparatus, so that the conductive adhesive can be temporarily mounted at the time of mounting without any major change. An apparatus capable of curing can be obtained.
[0019]
According to an eighth aspect of the present invention, there is provided a piezoelectric device in which a piezoelectric vibrating piece is cantilevered and accommodated in a package, and the piezoelectric vibrating piece in the package is temporarily mounted on a package substrate of the package. This is achieved by a piezoelectric device that is mounted on a cured conductive adhesive and that the conductive adhesive is fully cured after mounting.
According to the configuration of the eighth invention, the piezoelectric device of the present invention is mounted on the conductive adhesive temporarily cured on the package substrate when the piezoelectric vibrating piece is mounted on the package. In addition, since the conductive adhesive is completely cured after mounting, the piezoelectric vibrating piece is cantilevered almost horizontally, and the tip of the piezoelectric vibrating piece can touch the package substrate as in the case of being tilted and fixed. Therefore, the oscillation performance is not impaired, and the product quality can be reliably maintained.
[0020]
According to the ninth invention, the above object is a mobile phone device using a piezoelectric device that cantilever-supports and accommodates a piezoelectric vibrating piece in a package, wherein the piezoelectric vibrating piece in the package is A clock signal for control is obtained by a piezoelectric device which is mounted on a conductive adhesive temporarily cured on a package substrate of the package, and the conductive adhesive is completely cured after mounting. This is achieved by a mobile phone device.
[0021]
According to the tenth aspect of the present invention, there is provided an electronic apparatus using a piezoelectric device that cantilever-supports and accommodates a piezoelectric vibrating piece in a package, wherein the piezoelectric vibrating piece in the package is An electronic device that is mounted on a conductive adhesive temporarily cured on a package substrate of the package and that obtains a clock signal for control by a piezoelectric device in which the conductive adhesive is completely cured after mounting. Achieved by equipment.
[0022]
DETAILED DESCRIPTION OF THE INVENTION
1 to 3 show an embodiment of a piezoelectric device of the present invention, FIG. 1 is a schematic plan view thereof, and FIG. 2 is a schematic sectional view taken along line AA of FIG.
1 and 2, the piezoelectric device 30 shows an example in which a crystal resonator is configured. The piezoelectric device 30 houses a piezoelectric vibrating piece 32 in a package 36. FIG. The manufacturing method of the package 36 will be briefly described. For example, a plurality of substrates formed by forming an aluminum oxide ceramic green sheet as an insulating material are stacked and then sintered. Each of the plurality of substrates is formed with a predetermined hole on the inner side thereof, so that a predetermined internal space S2 is formed on the inner side when stacked.
This internal space S2 is a housing space for housing the piezoelectric vibrating piece.
That is, as shown in FIG. 2, in this embodiment, the package 36 is formed by, for example, stacking the first laminated substrate 51 and the second laminated substrate 52 from below.
[0023]
In the inner space S2 of the package 36, in the vicinity of the left end portion, the first laminated substrate 51 that is a package substrate that is exposed to the inner space S2 and constitutes the inner bottom portion is, for example, nickel-plated and gold-plated on tungsten metallization. The electrode parts 31, 31 formed in (1) are provided.
The electrode portions 31, 31 are connected to the outside and supply a drive voltage. For this reason, the electrode portions 31, 31 are electrically connected to mounting terminals 48, 49 formed exposed on the bottom surface of the package 36. Connected.
Conductive adhesives 43, 43 are applied on the electrode portions 31, 31, and the base 46 of the piezoelectric vibrating piece 32 is placed on the conductive adhesives 43, 43. , 43 are fixed by being cured. This process will be described in detail later.
In addition, as the conductive adhesives 43 and 43, a synthetic resin agent as an adhesive component exhibiting a bonding force and containing conductive particles such as fine silver particles can be used. A system-based or polyimide-based conductive adhesive or the like can be used.
[0024]
The package 36 is not limited to such a shallow box shape. For example, a shallow box-shaped lid (not shown) is placed on the first substrate 51 which is a package substrate, with the opening facing downward. Various forms of packages can be used, such as a form in which a piezoelectric vibrating piece is housed inside and sealed so as to face down.
[0025]
A lid body 39 is joined to the open upper end of the package 36 by using a brazing material 33 to be sealed. The lid 39 may be formed of a metal such as ceramics or Kovar. In this embodiment, preferably, after sealing and fixing to the package 36, the laser beam L2 is externally applied as shown in FIG. In order to adjust the frequency by the mass reduction method by irradiating the metal coating portion (not shown) of the piezoelectric vibrating piece 32, the piezoelectric vibrating piece 32 is made of a material that transmits light, particularly thin glass.
As a glass material suitable for the lid 39, for example, borosilicate glass is used, for example, as a thin glass manufactured by the downdraw method.
[0026]
The piezoelectric vibrating piece 32 is formed by etching a crystal. In the case of this embodiment, a so-called AT-cut vibrating piece obtained by cutting a quartz wafer into a rectangle according to a predetermined orientation is used. .
As shown in FIGS. 1 and 2, excitation electrodes 45 and 45 are formed on the main surface, that is, the front surface and the back surface of the rectangular piezoelectric vibrating piece 32. Furthermore, connection electrode portions 34 and 35 are formed at both ends in the width direction on the base 46 side of the piezoelectric vibrating piece 32, and each connection electrode portion 34 and 35 has a peripheral portion from the surface of the piezoelectric vibrating piece 32. It wraps around and is formed in the same form on the back surface. These connection electrode portions 34 and 35 are integrally connected to the excitation electrodes 45 and 45.
[0027]
Here, the piezoelectric vibrating piece 32 is not limited to the AT-cut vibrating piece, for example, a base portion fixed to the package 36 side, and a pair of base portions extending in parallel toward one side with the base portion as a base end. A so-called tuning fork-type piezoelectric vibrating piece (not shown) that includes a vibrating arm and is shaped like a tuning fork as a whole can also be used.
A so-called convex type resonator element (not shown), a surface acoustic wave element (SAW element), etc. formed by wrapping the short sides at both ends of the AT cut resonator element as shown in FIGS. You can also
In particular, the present invention is effective for the tuning fork type vibrating piece and the convex type vibrating piece described above.
[0028]
The piezoelectric device 30 of the present embodiment is configured as described above. Next, a manufacturing method thereof will be described.
FIG. 3 is a flowchart showing an example of a manufacturing method of the piezoelectric device 30. The manufacturing process of the piezoelectric device 30 will be described with reference to FIG.
First, the package 36 and the piezoelectric vibrating piece 32 described with reference to FIGS. 1 and 2 are prepared. Since these manufacturing methods have already been described briefly, they will be omitted.
[0029]
Next, as shown in FIG. 4, application is performed by dropping a conductive adhesive 43 onto the electrode portion 31 of the prepared package 36 using a syringe or a nozzle 41 (ST11). As described above, various conductive adhesives 43 can be used. Here, for example, 15 weight percent of a silane compound having about 2 to 3 hydroxyl groups or alkoxyl groups in one molecule as a binder is used. In addition, a conductive filler containing about 80 weight percent of silver powder having an average particle size of about 5 μm and about 5 weight percent of a solvent composed of petroleum and additives is used.
Next, the piezoelectric vibrating piece (crystal vibrating piece) 32 is mounted using, for example, a mounting apparatus 60 as shown in FIG. 5 (ST12). In this example, the mounting of the piezoelectric vibrating piece 32 and the temporary curing of the conductive adhesive 43 are performed simultaneously.
The stage 71 for fixing the work is provided with chucks 72 and 72 for fixing the package 36 on the upper surface thereof. The package 36 can be attached and detached by opening and closing the chucks 72, 72. The package 36 is supported in a state of being positioned at a predetermined position on the stage by closing the chucks 72, 72. It has become so.
[0030]
The mounting apparatus 60 includes, for example, a support 61 and a movable arm 62 provided on the support 61. The column 61 holds the movable arm 62 at a predetermined height required for work with respect to at least the package 36 supported on the stage 71, and the head unit 63 is moved to the arrow through the movable arm 62. It is made to go up and down along the B direction. The movable arm 62 is connected to the control means 68 via the support column 61, and performs a necessary operation in response to a command from the control means 68. In this case, the movable arm 62 may be configured to be able to send in a direction orthogonal to the arrow B direction.
The control means 68 is constituted by a computer with built-in software corresponding to a procedure required for executing a mounting process described later, or a sequence circuit that functions in the same manner.
The head portion 63 is an improvement of the head portion of the conventional mounting device for the piezoelectric vibrating piece 32 and has a common main configuration. The head portion 63 has a holding means 65 for holding the piezoelectric vibrating piece 32 at the tip (lower end). The holding means 65 is configured to hold the piezoelectric vibrating piece 32 horizontally.
[0031]
The holding means 65 is formed of a metal material having excellent thermal conductivity, and for example, a suction nozzle 67 passes through the center thereof. As shown by an arrow A, the suction nozzle 67 is evacuated by a vacuum pump or the like (not shown).
A heating unit 64 is provided so as to surround the holding unit 65. The heating means 64 is composed of an electric heater such as a sheathed heater connected to a power supply 66, and is connected to the control means 68 via the power supply 66. When a current from a power source is applied, the heating means 64 generates heat corresponding to the electrical resistance.
[0032]
In the above configuration, as shown in FIG. 5, the movable arm of the column 61 moves along a direction not shown in accordance with a command from the control means 68, and the conductive adhesive 43 of the conductive adhesive 43 is moved as shown in FIG. 4. The piezoelectric vibrating piece 32 to be placed on the package 36 that has been applied is attracted and held, and is moved to the illustrated position.
Next, the control means 68 lowers the movable arm 62 along the support 61 in the direction of the arrow B, so that the base 46 of the piezoelectric vibrating piece 32 is placed on the conductive adhesive 43 as shown in FIG. Placed on. In this case, the head unit 63 applies a predetermined load directed downward to the piezoelectric vibrating piece 32 via the movable arm 62.
[0033]
As a result, as shown in FIG. 7A, the base 46 of the piezoelectric vibrating piece 32 slightly sinks into the conductive adhesive 43 applied so as to rise on the electrode portion 31 while maintaining the horizontal state. Include. Here, in the head unit 63, a drive current is applied from the power supply 66 to the heating unit 64 according to a command from the control unit 68, and heat from the heating unit 64 is applied to the piezoelectric vibrating piece 32 via the holding unit 65. It is transmitted to the conductive adhesive 43 from the connection electrode portion 34.
Here, as described above, the conductive adhesive 43 includes the solvent 43a, the conductive filler 43b, and the binder 43c. In the state of FIG. High nature. And by the said heating, as shown in FIG.7 (b), the volatile solvent 43a evaporates with a heat | fever, and the content falls.
[0034]
FIG. 7B shows a state in which the conductive adhesive 43 is temporarily cured. The solvent 43a on the surface portion of the conductive adhesive 43 is volatilized to some extent to increase its viscosity, and the piezoelectric vibrating piece 32 In a state where the base 46 is placed, the weight is set so as not to further deform due to its weight. Here, the temporary curing means that the solvent 43a near the surface of the applied conductive adhesive 43 is volatilized, but the solvent 43a contained in the conductive adhesive 43 is not completely volatilized, and the binders 43c are in contact with each other. This is a state where the polymerization is not carried out. As a result, the conductive adhesive 43 prevents the piezoelectric vibrating piece 32 from being deformed so that a region on the front end side (not shown) sinks in a state where the base 46 of the piezoelectric vibrating piece 32 is placed. It can be supported horizontally.
[0035]
It should be noted here that when the heating temperature is higher than necessary and the curing proceeds rapidly, the solvent 43a near the surface of the conductive adhesive 43 volatilizes rapidly and the polymerization of the binder 43c occurs only near the surface. Occurs and the surface becomes hard. For this reason, the solvent 43a remaining inside cannot be volatilized in the subsequent main curing, and the piezoelectric vibrating piece 32 cannot be fixed appropriately.
From this point of view, the conditions required in the pre-curing step are, for example, a heating temperature (degrees Celsius, hereinafter referred to as “degree Celsius”) of about 180 degrees to 200 degrees, and a heating time of about 1 second. is there.
[0036]
Next, the conductive adhesive 43 is temporarily cured, and the piezoelectric vibrating piece 32 is temporarily fixed in a horizontal posture, and is sent to a curing furnace (not shown) such as a belt furnace, for example. Curing is done. In the main curing, for example, the heating temperature is about 180 degrees and the heating time is about 1 hour.
As a result, as shown in FIG. 8, all of the solvent 43a contained in the conductive adhesive 43 is volatilized, and the binder 43c is polymerized to fix the piezoelectric vibrating piece almost horizontally by its chemical bonding force. Is possible.
Next, as described with reference to FIGS. 1 and 2, the lid body 39 is sealed using the sealing material 33 on the package 36 in a vacuum or in an inert gas atmosphere such as nitrogen (ST15).
As described above, according to the present embodiment, the tilting of the piezoelectric vibrating piece 32 with respect to the package 36 is effectively avoided, and the tip 47 (see FIG. 2) is fixed without touching the package substrate 51. Can do.
[0037]
In the above-described embodiment, the temporary curing process of the conductive adhesive 43 and the mounting process of the piezoelectric vibrating piece 32 are performed simultaneously. For this reason, the mounting and provisional curing are simultaneously performed, and while the fluidity of the conductive adhesive 43 is high, the piezoelectric vibrating piece 32 is reliably supported by the head portion 63, and before the piezoelectric vibrating piece 32 is displaced, There is an advantage that the conductive adhesive 43 can be temporarily cured immediately.
[0038]
However, the present invention is not limited to this, and the temporary curing of the conductive adhesive 43 may be started immediately before mounting the piezoelectric vibrating piece 32 and may be temporarily cured during mounting. If it is short, the conductive adhesive can be temporarily cured before the piezoelectric vibrating piece 32 is displaced in a supported state. In this case, since there is no need to change the conventional mounting jig or the like, there is an advantage that it can be implemented with almost no change in the production line.
Alternatively, the temporary curing of the conductive adhesive 43 is started immediately after the mounting of the piezoelectric vibrating piece 32, and the conductive adhesive 43 is temporarily cured in a time shorter than the time required for the displacement of the piezoelectric vibrating piece 32. Good.
[0039]
Furthermore, the heating means required for temporary curing of the conductive adhesive 43 is not limited to that in the above embodiment, for example, even if a necessary amount of heat is obtained by irradiating a halogen lamp in accordance with the heating temperature or heating time in the above embodiment. Good. Similarly, a necessary amount of heat may be obtained by hot air injection means arranged on the production line.
[0040]
FIG. 9 is a diagram showing a schematic configuration of a digital mobile phone device as an example of an electronic apparatus using the piezoelectric device according to the above-described embodiment of the present invention.
In the figure, a microphone 308 for receiving the voice of the sender and a speaker 309 for setting the received content as voice output are provided, and further, an integrated circuit or the like as a control unit connected to the modulation and demodulation unit of the transmission / reception signal. A controller (CPU) 301 is provided.
The controller 301 is an information input / output unit 302 including an LCD as an image display unit and operation keys for inputting information in addition to modulation and demodulation of transmission / reception signals, and a memory which is an information storage unit including a RAM, a ROM, etc. 303 is controlled. For this reason, the piezoelectric device 30 is attached to the controller 301, and the output frequency is used as a clock signal suitable for the control content by a predetermined frequency dividing circuit (not shown) built in the controller 301. Has been. The piezoelectric device 30 attached to the controller 301 may not be a single piezoelectric device 30 but may be an oscillator that combines the piezoelectric device 30 and a predetermined frequency dividing circuit.
[0041]
The controller 301 is further connected to a temperature compensated crystal oscillator (TCXO) 305, and the temperature compensated crystal oscillator 305 is connected to the transmission unit 307 and the reception unit 306. As a result, even if the basic clock from the controller 301 fluctuates when the environmental temperature changes, it is corrected by the temperature compensated crystal oscillator 305 and supplied to the transmission unit 307 and the reception unit 306.
As described above, by using the piezoelectric device 30 according to the above-described embodiment in an electronic apparatus such as the digital cellular phone device 300, the piezoelectric vibrating piece is correctly fixed in the package. A high digital cellular phone device 300 can be obtained.
[0042]
The present invention is not limited to the above-described embodiment. Each configuration of each embodiment can be appropriately combined or omitted, and can be combined with other configurations not shown.
In addition, the present invention can be applied to all piezoelectric devices as long as the piezoelectric vibrating piece is accommodated in the package, regardless of the name of the crystal resonator, the crystal oscillator, or the like.
[Brief description of the drawings]
FIG. 1 is a schematic plan view showing an embodiment of a piezoelectric device of the present invention.
FIG. 2 is a schematic cross-sectional view taken along line AA in FIG.
3 is a flowchart showing a main part of an example of a manufacturing process of the piezoelectric device of FIG. 1;
FIG. 4 is an explanatory diagram showing a process of ST11 in FIG.
FIG. 5 is a diagram showing a part of the process of ST12 in FIG. 3 and a schematic configuration of the mounting apparatus.
FIG. 6 is a diagram showing a part of the process of ST13 in FIG. 3;
FIG. 7 is a diagram showing a part of the process of ST13 in FIG. 3;
FIG. 8 is a diagram showing a part of the process of ST14 in FIG. 3;
FIG. 9 is a diagram showing a schematic configuration of a digital mobile phone device as an example of an electronic apparatus using a piezoelectric device according to an embodiment of the present invention.
FIG. 10 is a flowchart showing a method for fixing a piezoelectric vibrating piece in a conventional method for manufacturing a piezoelectric vibrating piece used in a piezoelectric device.
FIG. 11 is a schematic cross-sectional view showing a known configuration example of a piezoelectric device.
FIG. 12 is a schematic plan view showing a fixing structure of a piezoelectric vibrating piece used in a piezoelectric device.
FIG. 13 is a schematic sectional view showing another known fixing method.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 30 ... Piezoelectric device, 31, 31 ... Electrode part, 32 ... Piezoelectric vibrating piece, 36 ... Package, 43 ... Conductive adhesive, 60 ... Mounting apparatus.

Claims (10)

A method of manufacturing a piezoelectric device in which a piezoelectric vibrating piece is cantilevered and accommodated in a package,
Forming the package;
An application step of applying a conductive adhesive on the substrate of the package;
From the conductive adhesive, mounting and mounting the base of the piezoelectric vibrating piece;
Curing the conductive adhesive;
And a step of sealing the package,
A method for manufacturing a piezoelectric device comprising a step of temporarily curing the conductive adhesive after the step of applying the conductive adhesive. The method for manufacturing a piezoelectric device according to claim 1, wherein the temporary curing step of the conductive adhesive is performed simultaneously with the mounting step of the piezoelectric vibrating piece. The method for manufacturing a piezoelectric device according to claim 1, wherein the temporary curing step of the conductive adhesive is performed immediately before the mounting step of the piezoelectric vibrating piece. The method for manufacturing a piezoelectric device according to claim 1, wherein the temporary curing step of the conductive adhesive is performed immediately after the mounting step of the piezoelectric vibrating piece. With the piezoelectric vibrating piece held by a holding jig, the base of the piezoelectric vibrating piece is placed on the conductive adhesive, and the conductive adhesive is passed from the holding jig through the piezoelectric vibrating piece. The method for manufacturing a piezoelectric device according to claim 2, wherein the temporary curing step is performed by heating the substrate. Means for holding at least the package substrate of the piezoelectric device;
A head unit that is moved by a driving arm, holds the piezoelectric vibrating piece, is placed on the conductive adhesive applied to the package substrate, and includes a heating unit that heats the piezoelectric vibrating piece in the placed state. A mounting device for a piezoelectric vibrating piece. The apparatus for mounting a piezoelectric vibrating piece according to claim 6, wherein the head unit includes a vacuum suction unit, and the heating unit is provided around the vacuum suction unit. A piezoelectric device in which a piezoelectric vibrating piece is cantilevered and accommodated in a package,
The piezoelectric vibrating piece in the package is mounted on a conductive adhesive temporarily cured on a package substrate of the package, and the conductive adhesive is completely cured after mounting. , Piezoelectric devices. A mobile phone device using a piezoelectric device that cantilever-supports and accommodates a piezoelectric vibrating piece in a package,
A piezoelectric vibrating piece in the package is mounted on a conductive adhesive temporarily cured on a package substrate of the package, and is controlled by a piezoelectric device in which the conductive adhesive is completely cured after mounting. A cellular phone device characterized in that a clock signal for use is obtained. An electronic device using a piezoelectric device that cantilever-supports and accommodates a piezoelectric vibrating piece in a package,
The piezoelectric vibrating reed in the package is mounted on a conductive adhesive temporarily cured on the package substrate of the package, and is controlled by a piezoelectric device in which the conductive adhesive is completely cured after mounting. An electronic device characterized in that a clock signal for use is obtained.

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