JP2005072152A - Damping apparatus and stage unit, and exposure equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To realize precise damping without causing such problems as a large installation space, weight adding, or the like even if vibration occurs in a plurality of directions. <P>SOLUTION: A damping apparatus comprises a vibration system V1 which is such that a mass body 67 and an elastic body 66 are connected to make coupled vibration in a first direction, and a second vibration system V2 which is such that a second elastic body 65 is connected to the mass body 67 to make coupled vibration in a second direction different from the first one (independently in terms of vibration from the vibration system V1). <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a vibration damping apparatus, a stage apparatus, and an exposure apparatus, and more particularly to a vibration damping apparatus, a stage apparatus, and an exposure apparatus that are suitable for use in a lithography process when manufacturing a device such as a semiconductor integrated circuit or a liquid crystal display. is there.

2. Description of the Related Art Conventionally, in a lithography process, which is one of semiconductor device manufacturing processes, a circuit pattern formed on a mask or reticle (hereinafter referred to as a reticle) is applied to a wafer or glass plate coated with a resist (photosensitive agent). Various exposure apparatuses that transfer onto a photosensitive substrate are used.
For example, as an exposure apparatus for semiconductor devices, a reticle pattern is projected onto a wafer using a projection optical system in accordance with the miniaturization of the minimum line width (device rule) of a pattern accompanying the recent high integration of integrated circuits. A reduction projection exposure apparatus that performs reduction transfer is mainly used.

  As this reduction projection exposure apparatus, a step-and-repeat type static exposure type reduction projection exposure apparatus (so-called stepper) that sequentially transfers a reticle pattern to a plurality of shot areas (exposure areas) on a wafer, and this stepper Is a step-and-scan type scanning exposure apparatus (so-called scanning stepper) that transfers the reticle pattern to each shot area on the wafer by synchronously moving the reticle and wafer in a one-dimensional direction. It has been known.

  By the way, the exposure apparatus described above repeats exposure to other shot areas after exposure to a certain shot area on the wafer. Therefore, a wafer stage (in the case of a stepper) or a reticle stage and wafer stage ( This is caused by the vibration caused by the movement of the scanning stepper), causing a relative position error between the projection optical system and the wafer, and the pattern is transferred to a position different from the design value on the wafer. When the component is included, there is a possibility of causing image blur (increase in pattern line width). For this reason, conventionally, measures such as increasing the strength of members that generate vibrations and reducing the number of places that become sources of vibrations have been taken, but this measure causes problems such as increasing the weight and size of the device. Occurs.

For this reason, in Patent Document 1, a mass body and an elastic body (spring element) constitute a vibration system, and this vibration system is provided with a mass damper that vibrates coupled with the vibration of the vibration suppression object. Is disclosed. In this technology, the vibration system of the mass damper is excited by the vibration of the object to be damped, and the vibration energy of the object to be damped can be reduced, resulting in vibration without increasing the weight and size of the device. It is possible to prevent a decrease in exposure accuracy.
Further, in Patent Document 2, the first elastic body is disposed on both sides in the first horizontal direction across the core rod extending from the mass, and the first elastic body is disposed on both sides in the second horizontal direction across the core rod. There is disclosed a mass damper in which a second elastic body having a spring constant different from that of the elastic body is arranged adjacently in the circumferential direction.
With this technique, it is possible to appropriately reduce vibration (swing) from either the first or second horizontal direction.
JP 2002-151379 A JP 11-294522 A

However, the following problems exist in the conventional technology as described above.
For example, when the vibration control object vibrates in the Z direction, it is possible to control the vibration control object by providing a mass damper that vibrates in the Z direction. It is assumed that not only the direction but also the X direction and the Y direction vibrate. In this case, if the vibration in the X direction or the Y direction has a frequency that may adversely affect the device performance, it is necessary to separately provide a mass damper that vibrates in each direction. This causes a problem of increased costs.
In particular, in recent years, with the miniaturization of patterns, adverse effects on device performance due to minute vibrations cannot be ignored.

  Therefore, it is conceivable that vibration is controlled in a plurality of directions by using the technique described in Patent Document 2, but in this technique, deformation of one elastic body may affect the other adjacent elastic body. The vibrations in each direction are not sufficient to control the vibrations with high accuracy (for example, nano-order).

  The present invention has been made in consideration of the above points, and even when vibration occurs in a plurality of directions, vibration can be controlled with high accuracy without causing problems such as a large installation space and weight. An object is to provide a vibration damping device, a stage device, and an exposure device.

In order to achieve the above object, the present invention adopts the following configuration corresponding to FIGS. 1 to 8 showing the embodiment.
The vibration damping device of the present invention is a vibration damping device (MD) including a vibration system (V1) in which a mass body (67) and an elastic body (66) are connected and coupled to vibrate in a first direction (Z direction). The second elastic body (65) is connected to the mass body (67) and has a second vibration system (V2) that vibrates in a second direction (X direction) different from the first direction. It is characterized by.

Therefore, in the vibration damping device of the present invention, the vibration in the first direction (Z direction) of the vibration damping object (32) can be controlled by the vibration system (V1) being coupled and vibrating. The vibration in the second direction (X direction) of the vibration control object (32) can be controlled by the second vibration system (V2) that vibrates in a coupled manner. Here, since the vibration system (V1) and the second vibration system (V2) are usually connected to and shared by the mass body (67) that requires the most space and weight, the mass system is individually provided. This eliminates the need for a large installation space, weight, and cost increase even when vibrations in both directions are suppressed.
Further, in the present invention, the vibration system (V1) and the second vibration system (V2) are coupled to each other in a vibration-independent manner, so that the coupled vibrations in each direction do not interfere with each other and the vibration control object (32 ) In the first and second directions can be controlled with high accuracy.

  Moreover, the stage apparatus of this invention is a stage apparatus (2) which has a moving body (32), Comprising: As an apparatus which controls the vibration accompanying the movement of a moving body (32), any one of Claim 1 to 6 The vibration damping device (MD) described in one item is used.

  Therefore, in the stage apparatus of the present invention, even when vibration occurs in a plurality of directions (Z direction, X direction) with the movement of the movable body (32) such as a mover, a large installation space is secured and weighted. The vibration in each direction can be suppressed without causing the problem of cost increase.

  The exposure apparatus of the present invention is an exposure apparatus (EX) that exposes the pattern of the mask (M) onto the substrate (P), and a setting apparatus that sets an illumination area of illumination light that illuminates the mask (M); A stage apparatus (10) according to claim 7 or 8, wherein at least one of a mask stage (MST) holding and moving the mask (M) and a substrate stage (PST) holding and moving the substrate (P) is provided. 2) is used.

  Therefore, in the exposure apparatus of the present invention, when setting the illumination area, when the mask (M) is moved, or when the substrate (P) is moved, even if vibration occurs in a plurality of directions, a wide installation space can be obtained. It is possible to suppress vibrations in each direction without causing problems such as securing, increasing weight, and increasing costs.

  In the present invention, it is possible to provide a highly accurate vibration damping function in the multi-axis direction without causing problems such as securing a large installation space, increasing weight, and increasing costs. Further, in the present invention, it is possible to perform highly accurate exposure processing by eliminating the adverse effect of minute vibrations on the apparatus performance.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a vibration damping device, a stage device, and an exposure device according to the present invention will be described below with reference to FIGS.
FIG. 1 is a schematic block diagram showing an embodiment of an exposure apparatus provided with a vibration damping device of the present invention as a mass damper on a wafer stage. Here, the exposure apparatus EX in the present embodiment is a so-called scanning stepper that transfers a pattern provided on the mask M onto the photosensitive substrate P via the projection optical system PL while moving the mask M and the photosensitive substrate P synchronously. It is. In the following description, the direction that coincides with the optical axis AX of the projection optical system PL is the Z-axis direction, and the synchronous movement direction (scanning direction) in a plane perpendicular to the Z-axis direction is the Y-axis direction, Z-axis direction, and Y-axis. A direction perpendicular to the direction (non-scanning direction) will be described as the X-axis direction. Further, the “photosensitive substrate” herein includes a semiconductor wafer coated with a resist, and the “mask” includes a reticle on which a device pattern to be reduced and projected on the photosensitive substrate is formed.

(First embodiment)
In FIG. 1, an exposure apparatus EX has a mask apparatus (reticle stage) MST that holds and moves a mask (reticle) M, a stage apparatus 1 having a mask surface plate 3 that supports the mask stage MST, and a light source. The illumination optical system IL that illuminates the mask M supported by the mask stage MST with exposure light, the substrate stage PST that holds and moves the photosensitive substrate (substrate) P, and the substrate surface plate 4 that supports the substrate stage PST A stage device 2 having a projection optical system PL for projecting a pattern image of the mask M illuminated by the exposure light EL onto the photosensitive substrate P supported by the substrate stage PST, and supporting the stage device 1 and the projection optical system PL. A reaction frame 5 and a control device CONT for overall control of the operation of the exposure apparatus EX. The reaction frame 5 is installed on a base plate 6 placed horizontally on the floor surface, and step portions 5a and 5b projecting inward are formed on the upper side and the lower side of the reaction frame 5, respectively. Yes.

  The stage apparatus 2 supports the substrate stage PST, the substrate surface plate 4 that supports the substrate stage PST so as to be movable in a two-dimensional direction along the XY plane, and the substrate stage PST that is movable while being guided in the X-axis direction. An X guide stage 35, an X linear motor 40 provided on the X guide stage 35 and capable of moving the substrate stage PST in the X axis direction, and a pair of Y linear motors 30 capable of moving the X guide stage 35 in the Y axis direction, 30. The substrate stage PST has a substrate holder PH that holds the photosensitive substrate P such as a wafer by vacuum suction, and the photosensitive substrate P is supported by the substrate stage PST via the substrate holder PH. A plurality of air bearings 37 that are non-contact bearings are provided on the bottom surface of the substrate stage PST, and the substrate stage PST is supported in a non-contact manner with respect to the substrate surface plate 4 by these air bearings 37. The substrate surface plate 4 is supported substantially horizontally above the base plate 6 via a vibration isolation unit 13.

  A mover 34a of an X trim motor 34 is attached to the + X side of the X guide stage 35 (see FIG. 2). A stator (not shown) of the X trim motor 34 is provided on the reaction frame 5. Therefore, the reaction force when driving the substrate stage PST in the X-axis direction is transmitted to the base plate 6 via the X trim motor 34 and the reaction frame 5.

FIG. 2 is a schematic perspective view of the stage apparatus 2 having the substrate stage PST.
As shown in FIG. 2, the stage apparatus 2 can move the substrate stage PST in the X axis direction with a predetermined stroke while being guided by the X guide stage 35 having a long shape along the X axis direction and the X guide stage 35. An X linear motor 40 and a pair of Y linear motors 30 and 30 provided at both ends in the longitudinal direction of the X guide stage 35 and capable of moving the X guide stage 35 together with the substrate stage PST in the Y-axis direction are provided.

  The X linear motor 40 includes a stator 41 including a coil unit provided on the X guide stage 35 so as to extend in the X-axis direction, and a magnet unit provided corresponding to the stator 41 and fixed to the substrate stage PST. The movable element 42 which consists of these is provided. The stator 41 and the mover 42 constitute a moving magnet type linear motor 40, and the substrate stage PST is moved in the X-axis direction by driving the mover 42 by electromagnetic interaction with the stator 41. Moving. Here, the substrate stage PST is supported in a non-contact manner by a magnetic guide including a magnet and an actuator that maintain a predetermined amount of gap in the Z-axis direction with respect to the X guide stage 35. The substrate stage PST is moved in the X-axis direction by the X linear motor 40 while being supported by the X guide stage 35 in a non-contact manner.

  Each of the Y linear motors 30 includes a mover 32 as a moving body including a magnet unit provided at both ends of the X guide stage 35 in the longitudinal direction, and a stator 31 including a coil unit provided corresponding to the mover 32. And. Here, the stators 31 and 31 are provided on support portions 36 and 36 (see FIG. 1) protruding from the base plate 6. In FIG. 1, the stator 31 and the mover 32 are illustrated in a simplified manner. The stator 31 and the mover 32 constitute a moving magnet type linear motor 30, and the mover 32 is driven by electromagnetic interaction with the stator 31, whereby the X guide stage 35 is moved in the Y-axis direction. Move to. Further, the X guide stage 35 can be rotated in the θZ direction by adjusting the driving of the Y linear motors 30 and 30. Therefore, the Y linear motors 30 and 30 enable the substrate stage PST to move in the Y axis direction and the θZ direction almost integrally with the X guide stage 35.

  Each of the movers 32 and 32 is provided with a mass damper (vibration control device) MD for damping the vibration accompanying the movement of the mover 32. As shown in FIG. 3, the mass damper MD includes a U-shaped support member 61 provided on the movable element 32, and a moving table 62 provided to be movable in the X direction with respect to the support member 61. The vibration system V1 that vibrates in the Z direction as the first direction and the vibration system (second vibration system) V2 that vibrates in the X direction as the second direction are mainly configured.

  The support member 61 is composed of a bottom plate portion 61a and side wall portions 61b and 61b erected from both ends in the X direction of the bottom plate portion 61a. The bottom plate portion 61a has a guide member 63 along the X direction, 63 extends in the Y direction at intervals (in FIG. 3, the guide member 63 on the back side of the drawing is not shown). In this guide member 63, an X-axis guide (constraint member) 64 constituted by an LM (Linear Motion) guide or the like provided at the lower part of the moving table 62 is movable in the X direction, and in the Y direction (third direction). And the movement table 62 moves relative to the support member 61 by moving the X-axis guide 64 along the guide member 63. It moves (slids) in the X-axis direction while being constrained in the direction and the Z-axis direction (non-movable state).

  The moving table 62 is disposed in the horizontal direction with an elastic body (second elastic body) 65 interposed as an X-axis spring element between the X-direction end faces and the side walls 61b and 61b. On the moving table 62, a plurality of (four in FIG. 3) elastic bodies 66 and mass bodies 67 which are Z-axis spring elements are connected in the Z direction. The elastic bodies 65 and 66 are formed of a rubber material having a relatively large viscous damping coefficient such as sorbosein (registered trademark). The mass body 67 is made of a metal having a relatively large specific gravity, such as tungsten or lead. The elastic body 66 and the mass body 67 constitute a vibration system V1 that vibrates in the Z direction by the vibration of the mover 32.

  The mass body 67 is movable in the Z direction by a Z-axis guide (supporting member) 68 protruding from the movement table 62 along the Z direction and penetrating the mass body 67, and is restrained (moved in the X direction and the Y direction). Supported in a disabled state. The Z-axis guide 68 is preferably disposed at a position passing through the center of gravity of the mass body 67 in order to implement stable coupled vibration. As the Z-axis guide 68, for example, a ball spline mechanism having a spline shaft provided on the moving table 62 and a spline nut provided on the mass body 67 can be employed. By the elastic body 65 and the mass body 67 connected to the elastic body 65 via the moving table 62 and the Z-axis guide 68, a vibration system V2 that vibrates in the X direction by the vibration of the mover 32 is generated. Composed.

In addition, this mass damper MD is arrange | positioned in the location used as the antinode of a vibration, when the needle | mover 32 vibrates.
Further, the mass of the mass body 67 is set based on the mode mass corresponding to the vibration mode of the mover 32. Specifically, it is known from vibrational engineering that effective damping can be obtained by selecting 5% to 10% of the modal mass of the mover 32, but here it is set to 10% of the modal mass. Has been. Further, the mass body 67 is reduced in size by using a material having a large specific gravity such as tungsten or lead. In addition, the natural frequency of the mass damper MD including the elastic bodies 65 and 66 and the mass body 67 as the vibration systems V1 and V2 is set to substantially match the natural frequency of the mover 32.

  Returning to FIG. 1, an X moving mirror 51 extending along the Y-axis direction is provided at the −X side edge of the substrate stage PST, and a laser interferometer 50 is disposed at a position facing the X moving mirror 51. Is provided. The laser interferometer 50 irradiates laser light (detection light) toward each of the reflection surface of the X movable mirror 51 and the reference mirror 52 provided at the lower end of the projection optical system PL, and the reflected light and the incident light are incident thereon. By measuring the relative displacement between the X moving mirror 51 and the reference mirror 52 based on the interference with light, the position of the substrate stage PST and thus the photosensitive substrate P in the X-axis direction is detected in real time with a predetermined resolution. Similarly, a Y moving mirror 53 (not shown in FIG. 1, refer to FIG. 2) extending along the X-axis direction is provided on the side edge on the + Y side on the substrate stage PST. A Y laser interferometer (not shown) is provided at the facing position, and the Y laser interferometer is a reference mirror (not shown) provided at the reflecting surface of the Y movable mirror 53 and the lower end of the projection optical system PL. And the relative displacement between the Y moving mirror and the reference mirror based on the interference between the reflected light and the incident light, thereby measuring the substrate stage PST and eventually the photosensitive substrate P. A position in the Y-axis direction is detected in real time with a predetermined resolution. The detection result of the laser interferometer is output to the control device CONT, and the control device CONT controls the position of the substrate stage PST via the linear motors 30 and 40 based on the detection result of the laser interferometer.

The illumination optical system IL includes a mirror arranged in a predetermined positional relationship, a variable dimmer, a beam shaping optical system, an optical integrator, a condensing optical system, a vibrating mirror, an illumination system aperture stop plate, a beam splitter, a relay lens system, And a blind mechanism (setting device) or the like, and is supported by a support column 7 fixed to the upper surface of the reaction frame 5. The blind mechanism includes a fixed blind having an opening of a predetermined shape that defines an illumination area on the reticle R, and a fixed reticle blind by a movable blade at the start and end of scanning exposure to prevent exposure of unnecessary portions. And a movable blind that further restricts the illumination area on the mask M defined by.
As the exposure light EL emitted from the illumination optical system IL, for example, far ultraviolet light (g-line, h-line, i-line) emitted from a mercury lamp and far ultraviolet light (wavelength 248 nm) such as KrF excimer laser light (wavelength 248 nm). DUV light), vacuum ultraviolet light (VUV light) such as ArF excimer laser light (wavelength 193 nm) and F ₂ laser light (wavelength 157 nm), or the like is used.

  The mask surface plate 3 of the stage apparatus 1 is supported almost horizontally on the step portion 5a of the reaction frame 5 through the vibration isolation unit 8 at each corner, and an opening 3a through which the pattern image of the mask M passes at the center portion. It has. The mask stage MST is provided on the mask surface plate 3, and has an opening K that communicates with the opening 3a of the mask surface plate 3 and through which the pattern image of the mask M passes. A plurality of air bearings 9 which are non-contact bearings are provided on the bottom surface of the mask stage MST, and the mask stage MST is supported by the air bearing 9 so as to be levitated with a predetermined clearance from the mask surface plate 3.

FIG. 4 is a schematic perspective view of the stage apparatus 1 having the mask stage MST.
As shown in FIG. 4, the stage apparatus 1 (mask stage MST) includes a mask coarse movement stage 16 provided on the mask surface plate 3, a mask fine movement stage 18 provided on the mask coarse movement stage 16, and a mask. Provided on the upper surface of a pair of Y linear motors 20 and 20 capable of moving the coarse movement stage 16 in the Y-axis direction with a predetermined stroke on the surface plate 3 and the upper protrusion 3b at the center of the mask surface plate 3, A pair of Y guide portions 24, 24 for guiding the coarse movement stage 16 moving in the direction, and a pair of X voice coils capable of fine movement of the fine movement stage 18 in the X axis, Y axis, and θZ directions on the coarse movement stage 16 A motor 17X and a pair of Y voice coil motors 17Y are provided. In FIG. 1, the coarse movement stage 16 and the fine movement stage 18 are simplified and illustrated as one stage.

  Each of the Y linear motors 20 is provided corresponding to the pair of stators 21 including a coil unit (armature unit) provided on the mask surface plate 3 so as to extend in the Y-axis direction. And a mover 22 composed of a magnet unit fixed to the coarse movement stage 16 via a connecting member 23. The stator 21 and the mover 22 constitute a moving magnet type linear motor 20, and the mover 22 is driven by electromagnetic interaction with the stator 21, whereby the coarse movement stage 16 (mask Stage MST) moves in the Y-axis direction. Each of the stators 21 is levitated and supported with respect to the mask surface plate 3 by a plurality of air bearings 19 which are non-contact bearings. For this reason, the stator 21 moves in the −Y direction according to the movement of the coarse movement stage 16 in the + Y direction according to the law of conservation of momentum. The movement of the stator 21 cancels out the reaction force accompanying the movement of the coarse movement stage 16 and can prevent the change in the position of the center of gravity. The stator 21 may be provided on the reaction frame 5 in place of the mask surface plate 3. When the stator 21 is provided on the reaction frame 5, the air bearing 19 is omitted, the stator 21 is fixed to the reaction frame 5, and the reaction force acting on the stator 21 due to the movement of the coarse movement stage 16 is applied to the reaction frame 5. You may escape to the floor.

  Each of the Y guide portions 24 guides the coarse movement stage 16 moving in the Y-axis direction, and extends in the Y-axis direction on the upper surface of the upper protruding portion 3b formed at the center portion of the mask surface plate 3. It is fixed to. In addition, an air bearing (not shown) that is a non-contact bearing is provided between the coarse movement stage 16 and the Y guide parts 24, 24, and the coarse movement stage 16 is supported in a non-contact manner with respect to the Y guide part 24. Has been.

  The fine movement stage 18 sucks and holds the mask M via a vacuum chuck (not shown). A pair of Y moving mirrors 25a and 25b made of a corner cube is fixed to the end of the fine movement stage 18 in the + Y direction, and an X movement made of a plane mirror extending in the Y-axis direction is attached to the end of the fine movement stage 18 in the -X direction. A mirror 26 is fixed. Then, three laser interferometers (all not shown) that irradiate the measuring beams to the movable mirrors 25a, 25b, and 26 measure the distances from the movable mirrors, so that the X axis of the mask stage MST, The Y axis and the position in the θZ direction are detected with high accuracy. Based on the detection results of these laser interferometers, the control device CONT drives each motor including the Y linear motor 20, the X voice coil motor 17X, and the Y voice coil motor 17Y, and a mask M supported by the fine movement stage 18. The position control of (mask stage MST) is performed.

  Returning to FIG. 1, the pattern image of the mask M that has passed through the opening K and the opening 3a is incident on the projection optical system PL. Projection optical system PL is composed of a plurality of optical elements, and these optical elements are supported by a lens barrel. The projection optical system PL is a reduction system having a projection magnification of, for example, 1/4 or 1/5. The projection optical system PL may be either an equal magnification system or an enlargement system. A flange portion 10 integrated with the lens barrel is provided on the outer periphery of the lens barrel of the projection optical system PL. In the projection optical system PL, the flange portion 10 is engaged with the lens barrel surface plate 12 supported substantially horizontally by the step portion 5b of the reaction frame 5 via the vibration isolation unit 11.

Next, the operation of the stage apparatus 2 in the exposure apparatus EX having the above configuration will be described below.
When the substrate stage PST is moved in the Y direction, the mover 32 of the Y linear motor 30 moves along the stator 31. The vibration in the Z direction generated with the movement of the mover 32 is transmitted to the elastic body 66 and the mass body 67 through the support member 61, the guide member 63, the X-axis guide 64, and the moving table 62, and the vibration system of the mass damper MD. V1 is excited and oscillates in the Z direction. Among the coupled vibrations, the vibration of the mover 32 in the Z direction is attenuated by the large viscosity of the elastic body 66 and the amplitude thereof is reduced. In addition, since the mass of the mass body 67 is about 10% of the mode mass of the mover 32 and the natural frequency of the mass damper MD substantially matches the natural frequency of the mover 32, the mass damper MD is connected continuously. Due to the generated vibration, the resonance peak at the natural frequency of the mover 32 is reduced, and the residual vibration is also reduced. In addition, since the mass body 67 moves along the Z-axis guide 68, it does not interfere with the coupled vibration in the Z direction.

  On the other hand, when vibration in the X direction is generated along with the movement of the mover 32, the X-axis guide 64 moves along the guide member 63, so that the moving table 62 is integrated with the support member 61 (movable element 32). Instead, the elastic member 65 moves in the X direction in a state in which the support member 61 is delayed in phase and attenuated by the viscosity (elastic deformation). At this time, since the mass body 67 is rigidly coupled to the moving table 62 in the X direction by the Z-axis guide 68, the mass body 67 moves integrally with the moving table 62 in the X direction. Therefore, the vibration system V2 of the mass damper MD composed of the elastic body 65 and the mass body 67 is excited by the vibration in the X direction generated along with the movement of the mover 32, and the combined vibration is generated in the X direction. The vibration in the X direction generated at 32 can be attenuated (damped) independently of the vibration system V1.

Next, an exposure operation in the exposure apparatus EX having the above configuration will be described.
Preparatory work such as reticle alignment and baseline measurement using a reticle microscope and off-axis alignment sensor is performed, and then fine alignment (EGA; enhanced global alignment, etc.) of the photosensitive substrate P using the alignment sensor is completed. Then, the arrangement coordinates of a plurality of shot areas on the photosensitive substrate P are obtained. Then, while monitoring the measurement value of the laser interferometer 50 based on the alignment result, the linear motors 30 and 40 are controlled to move the substrate stage PST to the scanning start position for the exposure of the first shot of the photosensitive substrate P. . Then, scanning in the Y direction of the mask stage MST and the substrate stage PST is started via the linear motors 20 and 30, and when both the stages MST and PST reach their target scanning speeds, they are set by driving the blind mechanism. The pattern area of the mask M is illuminated by the exposure illumination light, and scanning exposure is started.

  During this scanning exposure, the moving speed in the Y direction of the mask stage MST and the moving speed in the Y direction of the substrate stage PST are speed ratios corresponding to the projection magnification (1/5 or 1/4) of the projection optical system PL. Thus, the mask stage MST and the substrate stage PST are synchronously controlled via the linear motors 20 and 30 so as to be maintained. Then, different areas of the pattern area of the mask M are sequentially illuminated with illumination light, and the illumination of the entire pattern area is completed, whereby the scanning exposure of the first shot on the photosensitive substrate P is completed. Thereby, the pattern of the mask M is reduced and transferred to the first shot area on the photosensitive substrate P via the projection optical system PL.

As described above, in this embodiment, the vibration system V1 that attenuates the vibration in the Z direction generated in the mover 32 and the vibration system V2 that attenuates the vibration in the X direction usually require the most space and weight. Since the mass body 67 to be used is shared, there is no need to separately provide the mass body, and there is no problem of securing a large installation space, increasing the weight, and increasing the cost.
Further, in the present embodiment, the elastic bodies 65 and 66 are elastically deformed without affecting each other, so that the vibration systems V1 and V2 can be vibrated independently and independently without being interfered with each other. It is possible to control the vibration in the direction and the X direction with high accuracy. Therefore, in the present embodiment, it is possible to perform highly accurate exposure processing by eliminating the adverse effect of minute vibrations on apparatus performance.

(Second Embodiment)
Next, a second embodiment of the mass damper MD according to the present invention will be described with reference to FIG. In the second embodiment, components having the same functions as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified.
In the first embodiment, the mass damper MD is configured to vibrate in two directions, the Z direction and the X direction. In the second embodiment, the mass damper MD is further configured to vibrate in the Y direction.

  The mass damper MD shown in FIG. 5 includes a moving table 62, a guide member 63, an X-axis guide 64, elastic bodies 65 and 66, a mass body 67, and a Z-axis guide 68 that constitute the vibration systems V1 and V2 shown in FIG. Further, a support member 69 is additionally provided between the support member 61 and the movable element 32 on which and the like are mounted. The support member 69 is provided on the movable element 32, and includes a bottom plate portion 69a and side wall portions 69b and 69b that are erected from both ends in the Y direction of the bottom plate portion 69a. Guide members 73 and 73 are extended along the Y direction at intervals in the X direction on the bottom plate 69a (in FIG. 5, the guide member 73 on the back side of the drawing is not shown). In this guide member 73, a Y-axis guide 74, which is provided below the support member 61 and has the same configuration as the X-axis guide 64, is movable in the Y direction, and the movement in the X and Z directions is constrained (rigidly coupled). When the Y-axis guide 74 moves along the guide member 73, the support member 61 moves (slids) in the Y-axis direction without being movable in the X-axis direction and the Z-axis direction. Move).

  A rubber material having a relatively large viscous damping coefficient such as sorbosein (registered trademark) between the both end surfaces of the support member 61 in the Y direction and the side walls 69b and 69b of the support member 69, as in the elastic bodies 65 and 66. The elastic bodies 75 and 75 which are Y-axis spring elements formed in the above are interposed. This elastic body 75 and the mass body 67 connected to the elastic body 75 via a support member 61, a moving table 62, and a Z-axis guide 68, vibrate in a coupled vibration in the Y direction due to the vibration of the mover 32. V3 is configured.

  In the mass damper MD having the above-described configuration, the vibration in the Z direction caused by the movement of the mover 32 is caused by the support member 69, the guide member 73, the Y-axis guide 74, the support member 61 the guide member 63, the X-axis guide 64, The vibration is transmitted to the elastic body 66 and the mass body 67 via the table 62, and the vibration system V1 of the mass damper MD is excited to vibrate in the Z direction. Further, as described above, the vibration system V2 of the mass damper MD composed of the elastic body 65 and the mass body 67 is excited by the vibration in the X direction generated along with the movement of the mover 32, and the combined vibration is generated in the X direction. However, since the support member 61 is rigidly coupled to the support member 69 in the X direction and is configured integrally with the mover 32, it does not affect the coupled vibration in the X direction of the vibration system V2.

When the vibration in the Y direction is generated along with the movement of the mover 32, the Y-axis guide 74 moves along the guide member 73, so that the support member 61 is integrated with the support member 69 (the mover 32). Instead, the elastic body 75 moves in the Y direction in a state where the support member 69 causes phase delay and attenuation due to the viscosity (elastic deformation) of the elastic body 75. At this time, the mass body 67 is rigidly connected to the moving table 62 in the Y direction by the Z-axis guide 68, and the moving table 62 is rigidly connected to the support member 61 in the Y direction by the guide member 63 and the X-axis guide 64. Therefore, the mass body 67 moves integrally with the support member 61 in the Y direction. Therefore, the vibration system V3 of the mass damper MD composed of the elastic body 75 and the mass body 67 is excited by the vibration in the Y direction generated along with the movement of the mover 32, and the combined vibration is generated in the Y direction. The vibration in the Y direction generated in 32 can be attenuated (damped) independently of the vibration systems V1 and V2.
As described above, in the present embodiment, vibrations in the X direction, the Y direction, and the Z direction that occur with the movement of the mover 32 have a compact configuration and are each highly accurate without interfering with each other. Is possible.

(Third embodiment)
Next, a third embodiment of the mass damper MD according to the present invention will be described with reference to FIG. In the first embodiment, the moving table 62 is restrained in the Y direction and the Z direction by the LM guide in the mass damper MD. However, in the present embodiment, a sheet-like plate spring is used. In the third embodiment, components having the same functions as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified.

  In the mass damper MD shown in FIG. 6, the side wall 61 a of the support member 61 is provided only on one side (−X side), and the elastic body 65 is also interposed between the side wall 61 a and the moving table 62. ing. The + X side end surface of the support member 61 and the + X side end surface of the moving table 62 are fastened and fixed using fastening members 77a and 77b, respectively, and are arranged along the YZ plane. It is connected by. The leaf spring 76 has rigidity in the direction along the surface (Y direction, Z direction), and has flexibility in the direction orthogonal to the surface (X direction). In addition, between the support member 61 and the moving table 62, the axis line is parallel to the Y direction, and a roller material 78 is interposed, for example, so that the moving table 62 is less loaded in the X direction with respect to the supporting member 61. It is movable.

  In the mass damper MD having the above configuration, when vibration in the Z direction is generated as the mover 32 moves, the vibration system V1 including the elastic body 66 and the mass body 67 is excited to vibrate in the Z direction. . At this time, the moving table 62 is constrained to the support member 61 by the leaf spring 76 in the Z direction and is configured integrally with the mover 32, and thus does not affect the coupled vibration in the Z direction of the vibration system V1. Further, when vibration in the X direction is generated as the mover 32 moves, the vibration system V <b> 2 composed of the elastic body 65 and the mass body 67 is excited and vibrates in the X direction via the moving table 62. At this time, the leaf spring 76 has flexibility in the X direction, and the roller table 78 rolls around an axis parallel to the Y axis, so that the moving table 62 has a hindrance to the support member 61. Without any adverse effect on the coupled vibration in the X direction of the vibration system V2.

  In the first and second embodiments described above, the movement table 62 is restrained from moving in the Z direction and the Y direction using the LM guide, so that rolling resistance and backlash may occur in the X direction in the coupled vibration and in the Z direction and the Y direction. In this embodiment, the movable table 62 can be vibrated in the X direction with a simple member of the leaf spring 76, and an expensive member may be used. Since the movement in the Z direction and the Y direction is constrained, high-accuracy vibration control is possible and it is possible to contribute to a reduction in price.

(Fourth embodiment)
Next, a fourth embodiment of the mass damper MD according to the present invention will be described with reference to FIG. Note that in the fourth embodiment, components having the same functions as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified. In the present embodiment, the coupled vibration direction of the vibration system V2 is different from that of the first embodiment.

That is, as shown in FIG. 7, in the present embodiment, a rotary bearing 79 is provided between the moving table 62 and the support member 61, and the moving table 62 is parallel to the Z axis with respect to the support member 61. It is configured to be rotatable in a direction around the axis (second direction; θZ). The rotation center of the rotary bearing 79 is preferably coaxial with the Z-axis guide 68 in order to perform stable coupled vibration.
In the present embodiment, even when vibration occurs in the θZ direction in addition to the vibration in the Z direction accompanying the movement of the mover 32, a large installation space can be secured, weighted, and cost can be shared by sharing the mass body 67. The vibration in each direction can be attenuated without causing the problem of increase.

  As described above, the preferred embodiments according to the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to the examples. It is obvious for those skilled in the art that various changes or modifications can be conceived within the scope of the technical idea described in the claims. It is understood that it belongs to.

For example, in the above embodiment, the configuration using the LM guide as the restraining member in the predetermined direction is configured using a leaf spring in the same manner as the third embodiment, so that low-cost and high-accuracy vibration suppression is achieved. Can be realized.
Further, the vibration control target is not limited to the movable element 32, and the moving body such as the substrate holder PH and the substrate stage PST, and the non-moving of the substrate surface plate 4 and the like that may vibrate with the movement of the moving body. It is also possible to install a mass damper MD on the body to control the vibration. In any case, effective damping can be realized by installing a mass damper in the vicinity of the place where the vibration is caused.

  Further, the installation target of the mass damper MD is not limited to the stage apparatus 2 including the substrate stage PST. If there is a possibility of vibration, the stage apparatus 1 including the mask stage MST (movable element 22, mask) Coarse movement stage 16, mask fine movement stage 18, mask surface plate 3 etc.) or a blind mechanism as a stage device driven by a movable blind. In this case, it is possible to suppress vibrations that occur with the movement of the mask and the movable blind.

  The photosensitive substrate P of the above embodiment is not only a semiconductor wafer for a semiconductor device, but also a glass substrate for a liquid crystal display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus that scans and exposes the pattern of the mask M by synchronously moving the mask M and the photosensitive substrate P, the mask M and the substrate P are stationary. The present invention can also be applied to a step-and-repeat projection exposure apparatus in which the pattern of the mask M is exposed in this state and the photosensitive substrate P is sequentially moved stepwise.

  The type of exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor device that exposes a semiconductor device pattern on a wafer, but an exposure apparatus for manufacturing a liquid crystal display element that exposes a liquid crystal display element pattern on a square glass plate, The present invention can be widely applied to an exposure apparatus for manufacturing a thin film magnetic head, an image sensor (CCD) or a mask.

Further, as a light source for exposure illumination light, bright lines (g line (436 nm), h line (404.7 nm), i line (365 nm)) generated from an ultrahigh pressure mercury lamp, KrF excimer laser (248 nm), ArF excimer laser (193 nm), F ₂ laser (157 nm) as well as charged particle beams such as X-rays and electron beams can be used. For example, when an electron beam is used, thermionic emission type lanthanum hexabolite (LaB ₆ ) or tantalum (Ta) can be used as the electron gun. Further, when an electron beam is used, a configuration using the mask M may be used, or a pattern may be formed directly on the wafer without using the mask M. Further, a high frequency such as a YAG laser or a semiconductor laser may be used.

As the projection optical system PL, when using far ultraviolet rays such as an excimer laser, a material that transmits far ultraviolet rays such as quartz or fluorite is used as a glass material, and when using an F ₂ laser or X-ray, a catadioptric system or a refractive system is used. (The mask M is also of a reflective type), and when an electron beam is used, an electron optical system comprising an electron lens and a deflector may be used as the optical system. Needless to say, the optical path through which the electron beam passes is in a vacuum state. Further, the present invention can be applied to a proximity exposure apparatus that exposes the pattern of the mask M by bringing the mask M and the substrate P into close contact without using the projection optical system PL.

  In the case where a linear motor is used for the substrate stage PST and the mask stage MST as in the above embodiment, the magnetic levitation type using Lorentz force may be used instead of the air levitation type using an air bearing. Each stage PST, MST may be a type that moves along a guide, or may be a guideless type that does not have a guide.

  The reaction force generated by the movement of the substrate stage PST may be released mechanically to the floor (ground) using a frame member as described in JP-A-8-166475. Further, the reaction force generated by the movement of the mask stage MST may be released mechanically to the floor (ground) using a frame member as described in JP-A-8-330224.

  As described above, the exposure apparatus EX according to the present embodiment maintains various mechanical subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 8, the semiconductor device has a step 201 for designing a function / performance of the device, a step 202 for producing a mask (reticle) based on the design step, and a step 203 for producing a substrate as a base material of the device. The substrate is manufactured through the substrate processing step 204 for exposing the mask pattern onto the substrate by the exposure apparatus EX of the above-described embodiment, the device assembly step (including the dicing process, bonding process, and package process) 205, the inspection step 206, and the like.

It is a schematic block diagram which shows one Embodiment of the exposure apparatus provided with the stage apparatus of this invention. It is a schematic perspective view which shows one Embodiment of the stage apparatus provided with the damping device of this invention. It is an external appearance perspective view which shows schematic structure of the mass damper of 1st Embodiment. It is a schematic perspective view which shows one Embodiment of a stage apparatus which has a mask stage. It is a figure which shows schematic structure of the mass damper of 2nd Embodiment. It is a figure which shows schematic structure of the mass damper of 3rd Embodiment. It is a figure which shows schematic structure of the mass damper of 4th Embodiment. It is a flowchart figure which shows an example of the manufacturing process of a semiconductor device.

Explanation of symbols

EX exposure equipment M Mask (reticle)
MST mask stage (reticle stage)
MD mass damper (damping device)
P Photosensitive substrate (substrate)
PST substrate stage V1 vibration system V2 vibration system (second vibration system)
2 Stage device 32 Movable element (moving body)
65 Elastic body (second elastic body)
66 Elastic body 67 Mass body 68 Z-axis guide (supporting member)
76 Leaf spring (spring member)

Claims (9)

A vibration damping device including a vibration system in which a mass body and an elastic body are connected to vibrate in a first direction,
A vibration damping device comprising a second vibration system, wherein a second elastic body is connected to the mass body and oscillates in a second direction different from the first direction. The vibration damping device according to claim 1,
A support member that supports the mass body in the first direction and that cannot move in the second direction;
The second elastic body is connected to the mass body via the support member. The vibration damping device according to claim 2,
A vibration damping device comprising a restraining member that is movable in the second direction and restrains the third direction that intersects the second direction. The vibration damping device according to claim 3,
The vibration control device according to claim 1, wherein the restraining member is a spring member having flexibility in the second direction and having rigidity in the third direction. The vibration damping device according to any one of claims 1 to 4,
The vibration damping device according to claim 1, wherein the second direction is a direction substantially orthogonal to the first direction. The vibration damping device according to any one of claims 1 to 4,
The vibration damping device according to claim 1, wherein the second direction is a direction around an axis parallel to the first direction. A stage apparatus having a moving body,
A stage device, wherein the vibration damping device according to any one of claims 1 to 6 is used as a device for damping vibration associated with movement of the movable body. The stage apparatus according to claim 7, wherein
A mover that moves the movable body in cooperation with a stator;
The stage device is characterized in that the vibration damping device is provided in the movable element. An exposure apparatus that exposes a mask pattern onto a substrate,
At least one of a setting device that sets an illumination area of illumination light that illuminates the mask, a mask stage that moves while holding the mask, and a substrate stage that moves while holding the substrate, 8. An exposure apparatus using the stage apparatus according to 8.

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