JP2004335631A - Stage unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enhance positioning accuracy of a stage by preventing deterioration in position measuring accuracy due to fluctuation of temperature regulated air. <P>SOLUTION: The stage unit comprises an interferometer mounted on the slider side and measuring the position of a slider 5C moving on the surface of a stage lapping plate 5D, and reflectors 9 and 10 secured to the lapping plate side wherein air gap holes 9C and 10C for passing temperature regulated air from the space on the back side of the reflector to the space on the reflective surface side are provided between the lower surface of the reflector and the surface of the lapping plate. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a stage device used for moving or positioning a substrate such as a semiconductor wafer or an exposure master in a precision machine such as a semiconductor exposure apparatus.
[0002]
[Prior art]
2. Description of the Related Art In a semiconductor manufacturing process, a projection exposure apparatus that projects and transfers a pattern of an original reticle onto a silicon wafer as a substrate to be exposed is used to project and expose the reticle pattern onto the wafer. A reticle stage and a wafer stage, which are stage devices, are used to sequentially move the reticle stage and the wafer stage.
[0003]
8 to 10 show the configuration and operation of a conventional projection exposure apparatus. In the figure, reference numeral 1 denotes an illumination system unit which shapes exposure light from an exposure light source (not shown) and irradiates it to a reticle (original: not shown). Reference numeral 2 denotes a reticle stage on which a reticle which is an original of an exposure pattern is mounted, and scans the mounted reticle with respect to a wafer (substrate) 8 at a predetermined reduction exposure magnification ratio. Reference numeral 3 denotes a reduction projection lens which reduces and projects the original pattern formed on the reticle onto the wafer 8.
[0004]
Reference numeral 4 denotes an exposure apparatus main body, 5 denotes a wafer stage, and the exposure apparatus main body 4 supports the reticle stage 2, the projection lens 3, and the wafer stage 5. The wafer stage 5 moves the wafer 8 stepwise to the sequential exposure position, and performs the scanning operation of the wafer 8 in synchronization with the reticle scanning operation. The wafer stage 5 includes a stage base 5D and a slider (moving body) 5C.
[0005]
An illuminance sensor 5A and a stage reference mark 5B are provided on the upper surface of the wafer stage 5 (the upper surface of the slider 5C). The illuminance sensor 5A is used to calibrate the illuminance of the exposure light before the exposure and correct the exposure amount. The reference mark 5B is provided with a target for stage alignment measurement. As shown in the cross-sectional view of FIG. 10B, the slider 5C is provided with a drive coil 5F for driving the slider 5C in-plane on the upper surface (reference surface) of the stage base 5D. A stage iron plate 5D is provided with a comb iron core yoke 5E facing the drive coil 5F, and the slider 5C moves the stage iron plate 5D by the interaction between the yoke excited by the drive coil 5F and the comb iron core yoke 5E. It is driven in-plane in the two-dimensional XY directions above.
[0006]
Reference numeral 6 denotes a focus scope, which measures the focus of the wafer 8 from the lens barrel of the reduction projection lens 3. Reference numeral 6A denotes an alignment scope, which is a microscope that measures an alignment mark (not shown) on the wafer and an alignment reference mark 5B on the wafer stage, and performs measurement when performing in-wafer alignment and alignment between the reticle and the wafer. A wafer transfer robot 7 supplies a wafer 8 to the wafer stage 5. Reference numeral 8 denotes a wafer having a resist applied to the surface of a single crystal silicon substrate for projecting and transferring a reticle pattern drawn on the reticle through a reduction exposure system. In FIG. 8A, the wafer chuck and the wafer portion on the upper surface of the slider 5C are shown in a cross section so that the relationship between the reduction projection lens 3, the light beam of the focus scope 6, and the wafer 8 can be understood.
[0007]
A plurality of laser interferometers (not shown) are mounted on the slider 5C to measure the position of the slider 5C (hereinafter, referred to as the position of the wafer stage), that is, the position of the wafer 8. An X bar mirror (X interferometer mirror) 9 is a target for measuring the position of the wafer stage in the X direction by a laser interferometer. 9A is an X interferometer measurement light, and 9B is an X interferometer base that holds and positions the X bar mirror 9. Numeral 10 denotes a Y bar mirror (Y interferometer mirror), which is a target for measuring the position of the wafer stage 5 in the Y direction. 10A is a Y interferometer measurement light, and 10B is a Y interferometer mirror base for holding and positioning the Y interferometer mirror 10. Reference numerals 111 and 112 denote temperature control air blowouts for controlling the temperature of the stage space, and blow temperature control air from the illustrated position.
[0008]
[Problems to be solved by the invention]
By the way, the present inventors have found that in the above-described conventional example, the stage positioning accuracy has not reached the level predicted and expected from the configuration of the position measurement system and the stage drive system. The present inventors have studied the causes of the deterioration of control accuracy in the conventional example, and have obtained the following findings.
[0009]
That is, in the configuration shown in FIG. 8, as shown in FIG. 10A, when the movement of the slider 5C is controlled, a drive current is applied to the drive coil 5F, so that the outer peripheral temperature of the slider 5C increases. In this state, the temperature-controlled air outlets 111A and 112A from the temperature-controlled air outlet 111 and the temperature-controlled air outlet 112 are illustrated in FIG. 9 so that the X interferometer mirror base 9B and the Y interferometer mirror base 10B do not obstruct the air flow. The air is blown in the direction shown in the figure. The temperature of the temperature-controlled air (fluctuation) 111B and the temperature of the temperature-controlled air (fluctuation) 112B rise with respect to the temperature of the temperature-controlled air 111A and 112A immediately after the temperature-controlled air is blown out by the temperature rising portion of the slider 5C, and the space air is increased. Of the X interferometer measurement light 9A and the Y interferometer measurement light 10A act as a measurement error factor, thereby causing a measurement error. As a result, when the wafer stage (slider 5C) is positioned at the target position based on the interferometer measurement value, a target value error occurs, and the control accuracy of the stage device deteriorates.
[0010]
In the present invention, attention is paid to the following problems which have been problems in the configuration of the conventional example. Conventionally, when the interferometer is mounted on a slider using a position measurement interferometer for a flat motor stage, a bar mirror fixing member is supported on the fixed side from above the stage base with a solid receiving structure for the entire mirror. When forming the one-way air conditioning air, the air was blown out from the bar mirror fixed side, so the temperature rise air from the heat source of the slider affected the fluctuation of the interferometer measurement optical axis, resulting in control accuracy. There is a problem that is deteriorated.
An object of the present invention is to prevent deterioration of position measurement accuracy and improve stage positioning accuracy in a stage device in which an interferometer for measuring the position of the slider is mounted on the slider and a reflection mirror is fixed to the stage base. As an issue.
[0011]
[Means for Solving the Problems]
In order to achieve the above object, according to the present invention, the position of a moving body is measured based on a surface plate having a reference surface, a moving body moving on the reference surface, and a distance to a position of a reflecting surface of a reflecting mirror. A position measurement interferometer, wherein the position measurement interferometer is mounted on the moving body, and the reflection mirror is a stage device integrally attached to the surface plate, wherein a lower surface of the reflection mirror and the reference An opening communicating between the back side space of the reflection mirror and the reflection surface side space is provided between the first and second surfaces.
[0012]
[Action]
According to the present invention, an opening is provided between the lower surface of the reflecting mirror for measuring the position of the moving body and the reference surface, which is the supporting surface of the moving body, to communicate the back side space and the reflecting surface side space of the reflecting mirror. I have. This allows air to be blown from the outside of the reflection mirror to the inside of the moving body, allowing the temperature of the interferometer measurement space to be controlled without being affected by the heat source of the moving body, and the stage positioning accuracy Is improved.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
In a preferred embodiment of the present invention, the present invention is applied to a wafer stage or a wafer stage and a reticle stage of a step-and-scan type projection exposure apparatus called a scanner or a scanning exposure apparatus or a step-and-repeat type projection exposure apparatus called a stepper. Applied.
That is, an exposure apparatus according to a preferred embodiment of the present invention projects a pattern drawn on an original surface onto a substrate via a projection optical system, and transmits both the original and the substrate, or only the substrate, to the projection optical system. An exposure apparatus for repeatedly exposing a pattern of an original to a substrate by relatively moving the substrate by a stage device, wherein a position measuring interferometer is mounted on a movable portion of the substrate or the original stage, and a substrate corresponding to the interferometer is provided. Alternatively, a reflection mirror is provided on the original stage fixed portion side, the reflection mirror is supported and fixed on a surface plate movably supporting the movable portion, and the reflection mirror is provided between the lower surface of the reflection mirror and the surface plate from the outer periphery of the substrate stage. An exposure apparatus having an opening communicating with a board surface.
[0014]
In the above-described exposure apparatus, the temperature-regulated air maintained at a substantially constant temperature from the vicinity of the outer periphery of the reflection mirror is directed in a direction of transmitting through the opening provided between the lower surface of the reflection mirror and the surface plate and the upper portion of the reflection mirror. Blow. Further, it is preferable that a plurality of the reflection mirrors are provided orthogonal to each other, and the blowout of the temperature-regulated air is blown from a substantially oblique direction to the openings provided between the lower surfaces of the plurality of reflection mirrors and the surface plate. Further, the stage device may be a planar motor having a movable portion that can move in a plane on the surface plate. This planar motor may have an electromagnetic moving part that is driven to move in a plane on the surface plate. Here, the term air is used in a concept that includes not only purified and dried air but also an inert gas such as a nitrogen gas or a helium gas or a mixed gas of these inert gases and air.
[0015]
【Example】
Hereinafter, examples of the present invention will be described.
[Example 1]
1 and 2 show the configuration and operation of a projection exposure apparatus according to a first embodiment of the present invention. The projection exposure apparatus according to the present embodiment is different from the conventional example described with reference to FIGS. 8 to 10 in that the temperature control air blowouts 111 and 112 are provided on the same side as the slider 5C as the moving body with respect to the X bar mirror 9 and the Y bar mirror 10. In contrast, the temperature-controlled air outlets 11 and 12 corresponding to the temperature-controlled air outlets 111 and 112 are disposed on the back side of the X-bar mirror 9 and the Y-bar mirror 10. Are provided with air-conditioning air holes 9C and 10C, which are openings for allowing temperature-regulated air to pass through, on the X interferometer mirror base 9B and the Y interferometer mirror base 10B, which fix and support the mirror. Since other configurations are the same, in FIGS. 1 and 2, portions common to FIGS. 8 and 9 are denoted by the same reference numerals and description thereof is omitted.
[0016]
In the configuration of FIGS. 1 and 2, reference numerals 11 and 12 denote temperature-controlled air blowouts for controlling the temperature of the stage space, and blow temperature-controlled air from the illustrated position. On the other hand, when the movement of the slider 5C is controlled, the drive current is applied to the drive coil 5F, so that the outer peripheral temperature of the slider 5C increases. In this state, the temperature control air 11A and 12A from the temperature control air blow 11 and the temperature control air blow 12 are blown from the back surface of the upper surface of the X interferometer mirror 9 and the Y interferometer mirror 10 to the X interferometer mirror. The air is blown from the back of the air-conditioning gap holes 9C and 10C provided between the 9 and Y interferometer mirrors 10 and the stage base 5D. Therefore, the temperature control air 11A and 12A adjust the temperature of the interferometer optical paths of the X interferometer measurement light 9A and the Y interferometer measurement light 10A before reaching the outer peripheral portion of the slider 5C whose temperature has increased. In addition, the temperature can be controlled by the temperature control air 11B and 12B, which is the same temperature as the air 11A and 12A, without receiving the temperature rise disturbance of the slider 5C.
[0017]
Finally, the temperature-regulated air 11B and 12B, which have temperature-controlled the interferometer optical paths of the X interferometer measurement light 9A and the Y interferometer measurement light 10A, flow around the slider 5C, and the temperature is slightly affected by the temperature rising portion. The temperature of the temperature-controlled air 11C and 12C is increased, and the temperature-controlled air stops flowing. As described above, it is possible to prevent the influence of the fluctuation, which is the cause of the target value error, and prevent the control accuracy of the stage device from deteriorating.
[0018]
[Example 2]
FIG. 3 shows a second embodiment. In the first embodiment, two temperature control air blowouts 11 and 12 are used, but here, only one temperature control air blowout 13 is used as the temperature control air blowout. The temperature of the two interferometer optical paths, that is, the X interferometer measurement light 9A and the Y interferometer measurement light 10A, is controlled by one temperature control air outlet 13 in a diagonal direction with respect to the X interferometer mirror 9 and the Y interferometer mirror 10. The temperature control air 13A is blown off from this.
[0019]
Here, as in the first embodiment, when the movement of the slider 5C is controlled, a drive current is applied to the drive coil 5F, so that the outer peripheral temperature of the slider 5C increases. In this embodiment, in this embodiment, the temperature-controlled air from the temperature-controlled air blowout 13 blows the upper surfaces of the X interferometer mirror 9 and the Y interferometer mirror 10 to both mirrors at the same time from the diagonal back of the mirror, and the X interference A temperature-regulated air 13A having a constant temperature is blown from the back of the air-conditioning gap 9C and the back of the air-conditioning gap 10C provided between the measuring mirror 9 and the Y interferometer mirror 10 and the stage base 5D. Since the temperature of the interferometer optical path of the 9A and Y interferometer measurement light 10A is adjusted, the temperature control air 13B in the interferometer optical path is not affected by the temperature rise disturbance of the slider 5C, and the interference optical path is at the same temperature as the air 13A. Temperature control becomes possible. Finally, the temperature-regulated air whose temperature has been adjusted in the interferometer optical path of the X interferometer measurement light 9A and the Y interferometer measurement light 10A flows around the slider 5C, and the temperature is slightly increased due to the effect of the temperature increase portion. In the state of the air 13C, the flow of the temperature-regulated air ends. As described above, it is possible to prevent the influence of the fluctuation, which is the cause of the target value error, and prevent the control accuracy of the stage device from deteriorating.
[0020]
[Example 3]
FIG. 4 shows a third embodiment. In the first embodiment, the two temperature-controlled air outlets 11 and 12 are arranged so as to blow the temperature-controlled air substantially parallel to the surface plate (reference surface) of the stage base 5D. The air conditioning air outlets 14 and 15 are arranged so as to blow out the temperature-adjusting air from obliquely above, that is, at a predetermined depression angle with respect to the surface of the surface plate.
[0021]
Here, as in the first embodiment, when the movement of the slider 5C is controlled, a drive current is applied to the drive coil 5F, so that the outer peripheral temperature of the slider 5C increases. In this state, in this embodiment, the temperature-controlled air from the temperature-controlled air outlets 14 and 15 blows the upper surfaces of the X interferometer mirror 9 and the Y interferometer mirror 10 from obliquely above the back of the mirror, and the X interferometer mirror Temperature control air 14A and 15A having a constant temperature are blown from the back of the air-conditioning gap 9C and the back of the air-conditioning gap 10C provided between the mirror 9 and the Y interferometer mirror 10 and the stage base 5D. In order to control the temperature of the interferometer optical path of the 9A and Y interferometer measurement light 10A, the temperature-regulated air 14B and 15B in the interferometer optical path are not affected by the temperature rise disturbance of the slider 5C at the same temperature as the air 14A and 15A. Temperature control becomes possible.
[0022]
Further, unlike the first embodiment, the temperature control of the interferometer measurement optical path can be performed without being affected by the surface plate temperature and the slider ambient temperature by blowing the temperature control air obliquely from above. Finally, the temperature-regulated air whose temperature has been adjusted in the interferometer optical path of the X interferometer measurement light 9A and the Y interferometer measurement light 10A flows around the slider 5C, and the temperature is slightly increased due to the effect of the temperature increase portion. In the state of the conditioned air 14C and 15C, the flow of the temperature conditioned air ends. As described above, it is possible to prevent the influence of the fluctuation, which is the cause of the target value error, and prevent the control accuracy of the stage device from deteriorating.
[0023]
[Example 4]
FIG. 5 shows a fourth embodiment. In the present embodiment, as in the third embodiment, the temperature-adjusted air is blown obliquely from above using one temperature-adjusted air outlet 16 as in the second embodiment. Here, as in the second embodiment, when the movement of the slider 5C is controlled, a drive current is applied to the drive coil 5F, so that the outer peripheral temperature of the slider 5C increases. In this state, in this embodiment, the temperature-controlled air from the temperature-controlled air blowout 16 is blown from the upper surface of the X interferometer mirror 9 and the Y interferometer mirror 10 from above the diagonally rear surface of the mirror at a time. In addition, air conditioning air 16A having a constant temperature is blown from the air-conditioning air gap 9C and the back surface of the air-conditioning air gap 10C provided between the X interferometer mirror 9, the Y interferometer mirror 10, and the stage base 5D, and X interference is caused. In order to control the temperature of the interferometer optical path of the meter measurement light 9A and the Y interferometer measurement light 10A, the temperature control air 16B in the interference light path is not affected by the temperature rise disturbance of the slider 5C and has the same temperature as the air 16A. Becomes possible.
[0024]
Also, unlike the first and second embodiments, the temperature control of the interferometer measurement optical path can be performed without being affected by the surface plate temperature and the slider ambient temperature by blowing the temperature control air obliquely from above. . Finally, the temperature-regulated air whose temperature has been adjusted in the interferometer optical path of the X interferometer measurement light 9A and the Y interferometer measurement light 10A flows around the slider 5C, and the temperature is slightly increased due to the effect of the temperature increase portion. In the state of the air 16C, the flow of the temperature-regulated air ends. As described above, it is possible to prevent the influence of the fluctuation, which is the cause of the target value error, and prevent the control accuracy of the stage device from deteriorating.
[0025]
[Example 5]
FIG. 6 shows a fifth embodiment. In the first to fifth embodiments, a configuration is also conceivable in which a 6-axis fine movement stage 5G is mounted above the slider 5C to perform coarse / fine movement drive. FIG. 6 shows a configuration in which a 6-axis fine-movement stage 5G is mounted on the slider 5C in the first embodiment to perform coarse-fine movement.
[0026]
In this embodiment, an interferometer using a semiconductor laser having a measurement resolution of about several tens of nm is mounted for coarse movement measurement of the slider 5C, and a measurement resolution of several nm or less is used for measurement of the six-axis fine movement stage 5G. A He-Ne laser interferometer is used. At this time, the laser head of the He-Ne laser interferometer becomes large and cannot be mounted on the movable part. Therefore, by providing the fine-movement X interferometer mirror 9E on the six-axis fine-movement stage 5G, The position of the fine movement stage 5G is measured by the fine movement X interferometer measurement light 9C. The position of fine movement X interferometer measurement light 9C is determined by fine movement X interferometer support 9D.
[0027]
In the configuration of the fifth embodiment, the temperature of the interference optical paths of the X interferometer measurement lights 9A and 10A is controlled by the temperature-controlled air transmitted through the air-conditioning air gaps 9C and 10C, thereby causing interference due to the influence of the ambient temperature of the slider 5C. The fluctuation of the optical path is prevented from occurring, and the optical path of the fine movement X interferometer measurement light 9C is controlled by the temperature control air passing through the X interferometer mirrors 9 and 10 of the temperature control air blowouts 11 and 12 so that the slider is controlled. The fluctuation of the interference light path due to the influence of the ambient temperature of 5C is prevented from occurring. In this way, it is possible to stabilize the optical path temperature of the interferometer of both the slider 5C and the fine movement stage 5G, that is, to prevent fluctuation.
[0028]
[Example 6]
FIG. 7 shows a sixth embodiment. As shown in FIG. 6, the temperature control air blowout 17 may be provided in the air conditioning air gap.
[0029]
According to the above embodiment, the interferometer-equipped coarse-motion planar motor has a configuration in which the fixed-side bar mirror support member has a gap between the stage base and the direction in which the temperature control air is blown out from the back side of the bar mirror to the slider. A part of the temperature control air is blown through the upper and lower gaps of the bar mirror to control the temperature of the interferometer measurement space without being affected by the heat source of the slider, thereby improving the stage positioning accuracy.
[0030]
[Scope of Application of the Invention]
The present invention can be implemented by being appropriately modified without being limited to the above embodiments. For example, the temperature-controlled air may be an inert gas such as a nitrogen gas or a helium gas, or a mixed gas of an inert gas and air. In the above description, an example in which the present invention is applied to a so-called scanner is mainly described. However, the present invention relates to an exposure apparatus of another type such as a stepper, a semiconductor manufacturing apparatus other than the exposure apparatus, and a scanning electron microscope. It is also applicable to precision machines such as. Further, in the above description, the air-conditioning air holes have been described as examples in which one rectangular hole is provided for each reflection mirror support, but a plurality of air holes may be provided, and the shape may be circular or elliptical. It may be a polygon other than a triangle or a rectangle. As a result, the reflection mirror support can be configured in a lattice shape or a honeycomb shape.
[0031]
Embodiment
Examples of embodiments of the present invention are listed as follows.
[Embodiment 1] A surface plate having a reference surface, a moving object that moves on the reference surface, and a position measurement interferometer that measures the position of the moving object based on the distance to the position of the reflecting surface of the reflecting mirror. Having, the position measurement interferometer is mounted on the moving body, the reflection mirror is a stage device integrally attached to the surface plate,
A stage device, wherein an opening is provided between the lower surface of the reflection mirror and the reference surface to communicate from the space on the back side of the reflection mirror to the space on the reflection surface side.
[Embodiment 2] There is further provided a means for blowing temperature-regulated air maintained at a substantially constant temperature from the outside of the reflection mirror to the moving body or the platen reference surface through the opening above the reflection mirror and the opening. The stage device according to embodiment 1, which is characterized by the features.
[Embodiment 3] The stage apparatus according to Embodiment 2, wherein the blowing means blows the temperature-regulated air at a predetermined depression angle with respect to the reference surface or the moving body.
[Embodiment 4] Embodiment 2 or Embodiment 3 wherein a pair of the reflecting mirrors are provided orthogonally, and the blowing means blows air from substantially a single direction corresponding to both of the pair of reflecting mirrors. The described stage device.
[Fifth Embodiment] The first to fourth embodiments are characterized in that the moving body is driven on a reference plane by a planar motor having a mover provided on the moving body and a stator provided on the surface plate. The stage device according to any one of the above.
[Embodiment 6] By projecting a pattern drawn on an original plate onto a substrate via a projection optical system, and moving both the original plate and the substrate or only the substrate relative to the projection optical system by a stage device. An exposure apparatus for repeatedly exposing a pattern of an original to a substrate,
An exposure apparatus, wherein at least one of the stage devices for moving the original or the substrate relative to the projection optical system is the stage device according to any one of the first to fifth embodiments.
【The invention's effect】
According to the present invention, in a configuration in which an interferometer for position measurement is mounted on a moving body moving on a reference surface on a stage base and a reflection mirror for position measurement is fixed on the stage base, the lower surface of the reflection mirror and the reference Since an opening communicating from the back side of the reflection mirror to the reflection surface side is provided between the reflection mirror and the surface, the temperature control air can be blown from the back side of the reflection mirror. Therefore, the temperature of the interferometer measurement space can be controlled without being affected by the heat source of the moving body, and the stage positioning accuracy is improved. In addition, the temperature of the reference surface of the stage base is kept constant by blowing temperature-regulated air at a constant temperature to the upper surface of the base surface of the stage base. The temperature of the interferometer measurement space can be controlled without the need.
[Brief description of the drawings]
FIG. 1 is an overall view of a projection exposure apparatus according to an embodiment of the present invention and a partial detailed view of a plane motor stage (wafer stage).
FIG. 2 is an explanatory diagram of a planar motor stage according to the first embodiment.
FIG. 3 is an explanatory view of a planar motor stage according to a second embodiment.
FIG. 4 is an explanatory view of a planar motor stage according to a third embodiment.
FIG. 5 is an explanatory view of a planar motor stage according to a fourth embodiment.
FIG. 6 is an explanatory view of a planar motor stage according to a fifth embodiment.
FIG. 7 is an explanatory view of a planar motor stage according to a sixth embodiment.
FIG. 8 is an overall view of an overall exposure apparatus and a partial detailed view of a planar motor stage according to a conventional example.
FIG. 9 is an explanatory diagram of a planar motor stage in the conventional example of FIG.
FIG. 10 is an explanatory diagram of an operation range of the flat motor stage in FIG. 9;
[Description of Signs] 1: Illumination system unit, 2: Reticle stage, 3: Reduction projection lens, 4: Exposure device body, 5: Wafer stage, 5A: Illuminance sensor, 5B: Reference mark, 5C: Slider, 5D: Stage Surface plate, 5E: comb tooth core yoke, 5F: drive coil, 5G: 6-axis fine movement stage, 6: focus scope, 6A: alignment scope, 7: wafer transfer robot, 8: wafer, 9: X interferometer mirror, 9A : X interferometer measurement light, 9B: X interferometer mirror base, 9C: Air conditioning air gap, 9D: Fine X-interferometer support, 9E: Fine X-interferometer mirror, 10: Y interferometer mirror, 10A: Y interferometer Measurement light, 10B: Y interferometer mirror base, 10C: Air conditioning air holes, 11 to 16, 111, 112: Temperature controlled air blowing, 11A to 11C, 12A to 12C, 13A to 1 C, 14A~14C, 15A~15C, 16A~16C, 111A~111C, 112A~112C: temperature control air.

Claims (1)

A surface plate having a reference surface, a moving body that moves on the reference surface, and a position measurement interferometer that measures the position of the moving body based on a distance to a position of a reflection surface of a reflection mirror; The interferometer for measurement is mounted on the moving body, and the reflecting mirror is a stage device integrally attached to the surface plate,
A stage device, wherein an opening is provided between the lower surface of the reflection mirror and the reference surface to communicate from the space on the back side of the reflection mirror to the space on the reflection surface side.

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