JP2004323205A - Component mounting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a variation in feed rate of a tape-like substrate. <P>SOLUTION: An image photographed by a TV camera 31 of an IC mounting apparatus 12 is taken in an image recognizing part 32, and the position of a mark M on the tape-like substrate T in the x-direction is recognized. A control part 33 taken, therein, the position of the mark in the x-direction, calculates the error amount ▵x thereof from the position of the mark, and calculates the next feed rate (drive rate) for each device based on the errors of the specific feed rates of devices 11 to 14 and the error amount of the mark. At the next feed timing, the apparatus drives two-table linear motors LM1, LM2, LM3, and LM4 simultaneously at a feed rate calculated for each device. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a component mounting apparatus that mounts components on electrodes on individual substrates while transporting a tape-shaped substrate in which individual substrates are connected in a tape shape in steps.
[0002]
[Prior art]
In recent years, when a chip component is mounted on an electrode on a substrate, as shown in FIG. (See Patent Documents 1 to 3 below). In the example shown in FIG. 1, in the transport direction of the tape-shaped substrate T, an adhesive application station for applying an adhesive to the electrodes, a mounting station for mounting chip components, a pressing (and heating) station, and An inspection station is provided, and each station works together to transport the tape-shaped substrate T stepwise. Although FIG. 1 is a diagram showing a mounting process according to an embodiment of the present invention, it is also used for the description of a conventional technique for convenience.
[0003]
[Patent Document 1]
JP 2000-302304 A [Patent Document 2]
Japanese Patent Application Laid-Open No. Hei 5-26647 [Patent Document 3]
JP-A-8-235687
[Problems to be solved by the invention]
However, in the above-described conventional example, there is a problem that the feed amount of the tape-shaped substrate is varied due to a difference in the feed amount between the stations, the elongation of the tape-shaped substrate due to the heating of the pressing (and heating) station, and the like. . In particular, in order to align the chip components in the mounting station with the electrodes on the substrate, when performing image recognition by imaging the electrodes with a camera, in recent years, the miniaturization of the electrodes on the chip components and the substrate has progressed, and the imaging field of view has increased. Since it is very narrow, electrodes on the substrate may not be able to enter this imaging field of view due to variations in the feed amount of the tape-like substrate.
[0005]
Here, when the tape-shaped substrate is flexible, a method of providing a buffer portion for loosening the tape-shaped substrate between the stations can be considered, but the adhesive put on the adhesive application station or the mounting station respectively is considered. This method cannot be applied to prevent the chip components from shifting during movement.
[0006]
SUMMARY OF THE INVENTION The present invention has been made in consideration of the above-described problems of the related art, and has as its object to provide a component mounting apparatus capable of preventing a variation in a feed amount of a tape-shaped substrate.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides a component mounting apparatus for mounting components on electrodes on the individual substrates while transporting the tape-like substrate in which individual substrates are connected in a tape shape in a stepwise manner by a transporting means. At
Imaging means for imaging a mark formed in advance for each of the individual substrates of the tape-shaped substrate,
Image recognition means for recognizing a mark imaged by the imaging means,
Error calculation means for calculating the difference between the position of the mark in the transport direction of the image recognized by the image recognition means and the position of the previous mark,
Means for controlling the transport means so that the difference calculated by the error calculation means becomes 0 at the time of transport of the next tape-shaped substrate,
The configuration was provided.
According to the above configuration, the component mounting apparatus of the present invention can prevent a variation in the feed amount of the tape-shaped substrate.
[0008]
Further, the imaging means also serves as an imaging means for imaging the electrodes in order to position and mount components on electrodes formed on each of the individual substrates of the tape-shaped substrate. I do.
With the above configuration, the component mounting apparatus of the present invention can be configured at low cost.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is an explanatory view showing a mounting process of an embodiment of a component mounting apparatus according to the present invention, FIG. 2 is an external view showing the component mounting apparatus of FIG. 1, and FIG. 3 shows a feeder section of each apparatus of FIG. FIG. 4 is a perspective view, FIG. 4 is a view showing the clamp of FIG. 3 in detail, FIG. 5 is an explanatory view showing the operation of the clamp of FIGS. 3 and 4, FIG. 6 is an explanatory view showing a feed correction mark used in the present invention, FIG. 7 is a block diagram showing a linear motor control unit according to the present invention, and FIG. 8 is a flowchart for explaining the operation of the linear motor control unit in FIG.
[0010]
In FIG. 1, the tape-shaped substrate T is transported in the direction of the arrow, and first, an adhesive is applied onto an electrode (not shown) on the tape-shaped substrate T by an adhesive application header 1, and then an IC mounting header (not shown) The IC 2 is mounted on the electrode on which the adhesive is applied, and then the IC 2 is pressurized by the pressure header 3. Finally, an image is taken by the inspection TV camera 4 to check whether or not the IC 2 is normally mounted. You.
[0011]
As shown in FIG. 2, the component mounting apparatus includes a tape feeding device 10, an adhesive application device 11, an IC mounting (mounting) device 12, a pressing device 13, and an inspection device 14 from the upstream side to the downstream side. And a tape winding device 15. Each of the adhesive application device 11, the IC mounting (mounting) device 12, and the pressing device 13 is also provided with a TV camera (not shown). The work position is imaged by each camera, specified by image recognition, and an adhesive application header is provided. 1. The work is performed by positioning the IC mounting header and the pressure header 3.
[0012]
FIG. 3 shows a feeder unit 20 provided in each of the apparatuses 11 to 14 for transporting the tape-shaped substrate T. The feeder unit 20 includes a fixed clamp 21, moving clamps 22, 23, and a fixed clamp 24 from the upstream side to the downstream side. The fixed clamps 21, 24 do not move in the tape transport direction, and the moving clamp 22 , 23 can be moved between the fixed clamps 21, 24 by a two-table linear motor 25.
[0013]
4A is a front view of the clamps 21 to 24, FIG. 4B is a perspective view of the two-table linear motor 25, and FIG. 4C is a perspective view of each of the clamps 21 to 24. Here, on both sides of the tape-shaped substrate T, perforations for feeding (not shown) are formed at the same pitch in the transport direction, and the engaging portions 27 of the clamps 21 to 24 are formed by the air cylinder 26 on the tape-shaped substrate T. By opening and closing in the thickness direction, both ends can be clamped by engaging with this perforation.
[0014]
Next, a schematic operation of feeding the tape-shaped substrate T by the clamps 21 to 24 will be described with reference to FIG. FIG. 5A shows a state where all the clamps 21 to 24 are “open”, and the moving clamps 22 and 23 are located at positions near the fixed clamp 21 on the upstream side. FIG. 5 (2) shows a feed start state in which the moving clamps 22 and 23 are closed (the fixed clamps 21 and 24 are “open”) from the state of FIG. 5 (1), and FIG. 5 (3) is FIG. 2 shows a state in which the movable clamps 22 and 23 clamp the tape-shaped substrate T and move in the direction of the fixed clamp 24 on the downstream side (the fixed clamps 21 and 24 are “open”).
[0015]
FIG. 5D shows a feed completed state in which the movable clamps 22 and 23 have reached a position close to the fixed clamp 24 on the downstream side. In this state, all the clamps 21 to 24 are closed and the above-described operation is performed in each station. Is When the work of each station is completed, the fixed clamps 21 and 24 are in the "closed" state, and the movable clamps 22 and 23 are in the "open" state as shown in FIG. As shown in FIG. 5 (6), a return state is established, and then, when the return is completed, as shown in FIG. Next, as shown in FIG. 5 (8), the fixed clamps 21 and 24 are in the “open” state, that is, return to the state shown in FIG. 5 (2).
[0016]
By the way, the apparatuses 11 to 14 of the respective stations as described above have a variation in the feed amount even if the same feed amount command is given, and the pressurizing device 13 also performs heating, so this heat is transmitted to the upstream side. As a result, the elongation of the tape-shaped substrate T becomes non-uniform in the transport direction, so that the feed amount of each station gradually changes. Therefore, as shown in FIG. 6, a mark M for feed correction is provided for each substrate unit of the tape-shaped substrate T, and an error amount Δx in the transport direction (referred to as x direction) of the mark M is detected for each substrate unit. The error is corrected at the time of feeding. In the present embodiment, a TV camera 31 for positioning the IC 2 on the electrode on the tape-shaped substrate T in the IC mounting device 12 is also used as a TV camera for imaging the mark M.
[0017]
FIG. 7 shows a control system of the two-table linear motor 25 (LM1, LM2, LM3, LM4) in the devices 11 to 14 of each station, and FIG. 8 shows the operation of the control unit 33 of FIG. First, an image captured by the TV camera 31 of the IC mounting device 12 is captured by the image recognition unit 32, and the positions of the electrodes on the tape-shaped substrate T in the xyθ direction and the positions of the marks M in the x direction are recognized. The control unit 33 determines the xyθ direction of the IC 2 mounted on the electrode based on the xyθ direction of the electrode, drives and controls a header (not shown) holding the IC 2, and captures the current position of the mark M in the x direction. (Step S1) Then, an error amount Δx from the previous position of the mark M is calculated (Step S2).
[0018]
Here, the control unit 32 stores in advance an error of the feed amount unique to each of the devices 11 to 14, and based on the error of the feed amount for each of the devices 11 to 14 and the error amount Δx of the mark M, the device 11 Next, the next feed amount (drive amount) for each of １４14 is calculated (steps S3, S4). Then, at the next feed timing, the two-table linear motors LM1, LM2, LM3, and LM4 are simultaneously driven by the feed amounts calculated for the respective devices 11 to 14 (step S5). Step S4 determines whether or not step S3 has been executed for all of the two-table linear motors LM1 to LM4.
[0019]
Here, in FIG. 7, the feed amounts of all the devices 11 to 14 are corrected. However, when the variation of the feed amounts of the pressurizing device 13, the inspection device 14, and the adhesive application device 11 does not pose a problem. May correct only the IC mounting (mounting) device 12.
[0020]
【The invention's effect】
As described above, according to the first aspect of the invention, it is possible to provide a component mounting apparatus that prevents a variation in the feed amount of the tape-shaped substrate.
According to the second aspect of the present invention, the component mounting apparatus can be configured at low cost.
[Brief description of the drawings]
FIG. 1 is an explanatory view showing a mounting process of an embodiment of a component mounting apparatus according to the present invention. FIG. 2 is an external view showing the component mounting apparatus of FIG. 1. FIG. FIG. 4 shows the clamp of FIG. 3 in detail. (A) Front view of the clamp. (B) Perspective view of a two-table linear motor. (C) Perspective view of each clamp. FIG. 6 is an explanatory diagram showing the operation of the clamp. FIG. 6 is an explanatory diagram showing a feed correction mark used in the present invention. FIG. 7 is a block diagram showing a linear motor control unit in the present invention. Flowchart for explaining operation of unit [Description of reference numerals]
1 Adhesive coated header 2 IC
Reference Signs List 3 Pressing header 4 Inspection TV camera 10 Tape feeding device 11 Adhesive coating device 12 IC mounting (mounting) device 13 Pressing device 14 Inspection device 15 Tape winding device 20 Feeder units 21, 24 Fixed clamps 22, 23 Moving clamps 25, LM1 to LM4 Two-table linear motor 26 Air cylinder 27 Engagement unit 31 TV camera 32 Image recognition unit 33 Control unit M Mark T Tape substrate

Claims (2)

In a component mounting apparatus that mounts components on electrodes on the individual substrates while transporting the substrate in a tape shape in which the individual substrates are connected in a tape shape by a transport unit,
Imaging means for imaging a mark formed in advance for each of the individual substrates of the tape-shaped substrate,
Image recognition means for recognizing a mark imaged by the imaging means,
Error calculation means for calculating the difference between the position of the mark in the transport direction of the image recognized by the image recognition means and the position of the previous mark,
Means for controlling the transport means so that the difference calculated by the error calculation means becomes 0 at the time of transport of the next tape-shaped substrate,
Equipped component mounting equipment. The image pickup means also serves as an image pickup means for picking up an image of the electrode in order to position and mount a component on an electrode formed for each of the individual substrates of the tape-shaped substrate. Item 1. The component mounting apparatus according to Item 1.

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