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JP2004354534A - Light irradiation device - Google Patents

Light irradiation device Download PDF

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Publication number
JP2004354534A
JP2004354534A JP2003149871A JP2003149871A JP2004354534A JP 2004354534 A JP2004354534 A JP 2004354534A JP 2003149871 A JP2003149871 A JP 2003149871A JP 2003149871 A JP2003149871 A JP 2003149871A JP 2004354534 A JP2004354534 A JP 2004354534A
Authority
JP
Japan
Prior art keywords
light
led chip
guide member
light guide
irradiation device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003149871A
Other languages
Japanese (ja)
Inventor
Masao Yamaguchi
昌男 山口
Ryoji Yokoya
良二 横谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP2003149871A priority Critical patent/JP2004354534A/en
Publication of JP2004354534A publication Critical patent/JP2004354534A/en
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00Illuminated signs; Luminous advertising
    • G09F13/04Signs, boards or panels, illuminated from behind the insignia
    • G09F13/14Arrangements of reflectors therein
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0004Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
    • G02B19/0019Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having reflective surfaces only (e.g. louvre systems, systems with multiple planar reflectors)
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G02B19/0061Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
    • G02B19/0066Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED in the form of an LED array

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Led Device Packages (AREA)
  • Light Guides In General And Applications Therefor (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Planar Illumination Modules (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light irradiation device for uniforming light emitted from the emission face of a light guide member while suppressing the number of LED chips. <P>SOLUTION: The light irradiation device comprises the light guide member 1 having a notch 4 on which light emitted from the LED chip 5 is incident, a light reflection part 7 reflecting the incident light in the notch 4, and the light emission face 3 emitting light output by the LED chip; and the LED chip 5 arranged at a position opposed to an opening of the notch part 4. The light guide member 1 guides light emitted from the LED chip 5, for instance, is molded of a resin such as an acrylic material, and formed in a reverse trapezoid shape in the case seen from the front. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【0001】
【発明の属する技術分野】
本発明は、光照射装置、特に導光部材を用いた光照射装置に関する。
【0002】
【従来の技術】
この種の従来例としては、特開2002−133932号公報に示されるものがある。このものは、後面に、表面が曲面に形成された3つの凸部を有し、これらの凸部の頂部にそれぞれ発光ダイオード収容凹部が設けられるとともに、両側面がそれぞれ曲面に形成され、前面に前記3つの凸部の発光ダイオード収納凹部からそれぞれ入射した光を出射する出射面が形成された導光部材と、前記の前記3つの凸部の発光ダイオード収納凹部にそれぞれ挿入された赤色発光ダイオード、緑色発光ダイオード及び青色発光ダイオードと、前記導光部材の出射面に設けられ、前記出射面から出射する光を拡散させる拡散層とを備えている。
【0003】
【特許文献1】
特開2002−133932号公報
【0004】
【発明が解決しようとする課題】
上記従来例においては、前記の構成により、赤色LEDと、緑色LED及び青色LEDが発する赤、緑、青の光をほぼ完全に混色させ、出射光のほとんどを白色光として出射することができるというものである。
【0005】
しかしながら、上記従来例では、の両側面がそれぞれ曲面に形成されているため、出射面から出射する光が均一にならない、すなわち、出射光にムラが生じることが懸念される。
【0006】
本発明は、かかる事由に鑑みてなしたものであり、その目的とするところは、LEDの個数を抑制しつつ、出射面からの光を均一にすることのできる光照射装置を提供することである。
【0007】
【課題を解決するための手段】
請求項1に係る発明は、LEDチップと、LEDチップの前方に位置してLEDチップからの光が入射される切り欠き部及び、切り欠き部の両側に位置してLEDチップの前方に向かって次第に広がる略平面形状の光反射部が形成された導光部材と、を有することを特徴とする。
【0008】
請求項2に係る発明は、請求項1記載の光照射装置において、前記導光部材は、切り欠き部を挟んでLEDチップの前方に向かって次第に広がる一対の反射板を有し、前記光反射部と反射板とでLEDチップの周囲を囲むようにしたことを特徴とする請求項1記載の光照射装置。
【0009】
請求項3に係る発明は、請求項1記載の光照射装置において、前記導光部材は、切り欠き部を挟んでLEDチップの前方に向かって次第に広がる略平面形状のテーパ部分を有し、光反射部とテーパ部分とでLEDチップの周囲を囲むようにしたことを特徴とする請求項1記載の光照射装置。
【0010】
【発明の実施の形態】
(第1の実施形態)
第1の実施形態を図1に基づいて説明する。図1(a)は本実施形態の光照射装置の上面図、(b)は、(a)のX−X線に沿って切断した断面図、(c)は、(a)のY−Y線に沿って切断した断面図である。
【0011】
本実施形態の光照射装置は、LEDチップ5から出射される光が入射される切り欠き部4と、切り欠き部4に入射された光を反射させる光反射部7と、LEDチップ5が出力した光を出射する光出射面3と、を有する導光部材1と、前記切り欠き部4の開口に対向する位置に配置されるLEDチップ5と、を備えている。
【0012】
具体的に説明すると、導光部材1は、LEDチップ5から出射された光を導光するもので、たとえばアクリル材料等の樹脂で成形され、図1(b)に示すように、前面から見た場合において、逆台形状に形成されている。導光部材1は、光出射面3における幅が約44mm、下面2における幅が約22mm、そして光出射面3と下面2との間隔が約15mmである。また、導光部材1は図1(c)に示すように側面から見た場合において、四辺形に形成されており、その厚みは10mmである。そして、導光部材1の下部中央付近には、前面視において、幅が約6mm、高さが約3mmの四辺形の切り欠き部4が形成され、この切り欠き部4は導光部材1の厚み方向に貫通している。そして、この切り欠き部4に対向する部分には、プリント配線基板6に実装されたLEDチップ5が配置されている。LEDチップ5は、例えば窒化ガリウム系の青色LEDであり、LEDチップ5の周囲には、青色LEDが出射した青色光を波長変換することにより黄色光に変換する蛍光体(図示はしない)が設けられている。そして、切り欠き部4の両側に位置して切り欠き部4から光出射面3に向かって次第に広がる略平面形状の透光性を有する光反射部4を設けている。
【0013】
この導光部材1は、前面視において三角形の支持部材8によって略平面形状の光反射部7で支持されている。そして、導光部材1、LEDチップ5、プリント配線基板6、支持部材8は、開口を有する筐体9に収納されている。
【0014】
以上の構成において、LEDチップ5に直流電流を通電すると、LEDチップ5は青色光を出射し、青色光は蛍光体に入射する。蛍光体に入射した青色光は、蛍光体により青色光から黄色光に変換されて蛍光体から出射される。そして、LEDチップ5が放射する青色の光と、蛍光体から出射される黄色光との混色により白色光を出力する。ここで、切り欠き部4の光出射面3に平行な面に入射した光は、導光部材1の内部で導光されて光出射面3の中央付近から出射される。また、切り欠き部4の光出射面3に垂直な面に入射した光は、略平面形状の光反射部7で反射し、光出射面3の両側から出射される。このように、LEDチップ5から導光部材1の幅方向の成分を持って出射された光は、導光部材1の切り欠き部4から直接光出射面3に至る光と、光出射面3で反射される光との2つの光学挙動を示す。これにより、光出射面3から見ると、実際には1つのLEDチップ5が存在するのみであっても図1(a)に示すように発光部が3つ観察される。このことはすなわち、光出射面3からの光が均一に分散されることを意味し、結果的に均一性の高い光を出力することができる。
(第2の実施形態)
第2の実施形態を図2に基づいて説明する。図2(a)は本実施形態の光照射装置の上面図、(b)は、(a)のX−X線に沿って切断した断面図、(c)は、(a)のY−Y線に沿って切断した断面図である。
【0015】
本実施形態は、導光部材1の切り欠き部4に反射板10を設けた点が第1の実施形態と異なり、他は同じである。なお、図1と同一部分には、同一符号を付して説明は省略する。
【0016】
具体的には、図2(c)に示すように、導光部材1の側面から見て、切り欠き部4を挟んでLEDチップ5の前方すなわち光出射面3の方向に向かって広がる一対の反射板10を設け、光反射部7と反射板10とでLEDチップ5の周囲を囲むようにしている。ここで、反射板10は、例えばアルミ板等の高反射率の材料で形成され、プリント配線基板6に対して55°の角度、即ち開き角55°となるように配置されている。
【0017】
この構成により、LEDチップ5から導光部材1の幅方向の成分を持って出射された光の挙動は第1の実施形態で述べたものと同じであるが、導光部材1の厚み方向の成分を持って出射された光は、反射板10の表面で反射されて、導光部材1内に入射し、導光部材1内を導光して、光出射面3から出射される。
【0018】
これにより、LEDチップ5から導光部材1の厚み方向の成分を持って出射された光が導光部材1内を導光することになり、より効率良くLEDチップ5からの光を外部に出射することができる。
(第3の実施形態)
第3の実施形態を図3に基づいて説明する。図3(a)は本実施形態の光照射装置の上面図、(b)は、(a)のX−X線に沿って切断した断面図、(c)は、(a)のY−Y線に沿って切断した断面図である。
【0019】
本実施形態は、LEDチップ5から導光部材1の厚み方向成分を持って出射される光を反射するテーパ部分11を設けたものである。即ち、図3(c)に示すように、切り欠き部4を挟んでLEDチップ5の前方に向かって次第に広がる略平面形状に形成されるテーパ部分11を導光部材1に設け、光反射部7とテーパ部分11とでLEDチップ5の周囲を囲むようにしている。ている。ここで、第1の実施形態においては、切り欠き部4は導光部材1の厚み方向に貫通していたが、本実施形態においてはテーパ部分11の存在により貫通していない状態となっている。
【0020】
この構成により、LEDチップ5から導光部材1の幅方向の成分を持って出射された光の挙動は第1の実施形態で述べたものと同じであるが、導光部材1の厚み方向の成分を持って出射された光は、テーパ部11分での入射角が大きくなることによりテーパ部分11で全反射され易くなる。
【0021】
これにより、LEDチップ5から導光部材1の厚み方向の成分を持って出射された光が導光部材1内を導光することになり、より効率良くLEDチップ5から光を外部に出射することができる。
(第4の実施形態)
第4の実施形態を図4に基づいて説明する。図4は、本実施形態の光照射装置の上部パネル14の一部を切り欠いた正面図である。
【0022】
本実施形態は、第1の実施形態の光照射装置3個を一列に配設し、導光部材1の光出射面3に対向するように、表示内容(本実施形態では「EXIT」)が記された表示導光部材12を設けたものである。ここで、導光部材1の光出射面3は、約3mmの厚みを有する肉厚部13を介して表示導光部材12に取り付けられている。
【0023】
この構成により、第1の実施形態で述べたように、複数の光照射装置からは、均一な光が出力され、これらの光が表示導光部材12内を導光するとともに、表示導光部材12の前面から光が出力されるため、表示導光部材12に記された文字を表示することができる。
【0024】
なお、本実施形態においては、約3mmの厚みを有する肉厚部13を介して導光部材1の光出射面3を表示導光部材12に接続したが、図5に示すように、導光部材1を延伸させ、導光部材1が表示導光部材12を兼ねるようにしても良い。この場合には、一体で成形されるため導光部材1への入射効率を高めることができる。また、LEDチップ5として青色LEDを用いたが、赤色LED等、他の色のLEDを用いてもよい。また、光反射部4は透光性を有するようにしたが、非透光性のものであってもよい。
【0025】
【発明の効果】
以上の発明によれば、導光部材にLEDチップの前方にLEDチップからの光が入射される切り欠き部を設けるとともに、LEDチップの光の照射方向に次第に広がる略平面形状の光反射部7を設けたことにより、LEDチップからの光が均一に分散され、導光部材の導光部材の出射面から出射する光の均一性を高めることができる。
【図面の簡単な説明】
【図1】(a)は第1の実施形態の光照射装置の上面図、(b)は、(a)のX−X線に沿って切断した断面図、(c)は、(a)のY−Y線に沿って切断した断面図である。
【図2】(a)は第2の実施形態の光照射装置の上面図、(b)は、(a)のX−X線に沿って切断した断面図、(c)は、(a)のY−Y線に沿って切断した断面図である。
【図3】(a)は第3の実施形態の光照射装置の上面図、(b)は、(a)のX−X線に沿って切断した断面図、(c)は、(a)のY−Y線に沿って切断した断面図である。
【図4】第4の実施形態の光照射装置の上部パネル14を切り欠いた正面図である。
【図5】第4の実施形態の光照射装置の別例を示す図である。
【符号の説明】
1 導光部材
2 下面
3 光出射面
4 切り欠き部
5 LEDチップ
6 プリント配線基板
7 光反射部
8 支持部材
9 筐体
10 反射板
11 テーパ部分
12 表示導光部材
13 肉厚部
14 上部パネル
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a light irradiation device, and particularly to a light irradiation device using a light guide member.
[0002]
[Prior art]
A conventional example of this type is disclosed in Japanese Patent Application Laid-Open No. 2002-133932. This device has, on the rear surface, three convex portions whose surfaces are formed as curved surfaces, light emitting diode housing concave portions are provided at the tops of these convex portions, respectively, and both side surfaces are each formed on a curved surface, and the front surface is formed. A light-guiding member having an emission surface for emitting light incident from the light-emitting diode housing recesses of the three protrusions, and red light-emitting diodes respectively inserted into the light-emitting diode housing recesses of the three protrusions; The light-emitting device includes a green light-emitting diode and a blue light-emitting diode, and a diffusion layer provided on an emission surface of the light guide member and diffusing light emitted from the emission surface.
[0003]
[Patent Document 1]
JP-A-2002-133932
[Problems to be solved by the invention]
In the above-mentioned conventional example, it can be said that, with the above configuration, red, green, and blue light emitted by the red LED, the green LED, and the blue LED can be almost completely mixed, and most of the emitted light can be emitted as white light. Things.
[0005]
However, in the above conventional example, since both side surfaces are formed as curved surfaces, there is a concern that light emitted from the emission surface may not be uniform, that is, unevenness may occur in the emitted light.
[0006]
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a light irradiation device that can make light from an emission surface uniform while suppressing the number of LEDs. is there.
[0007]
[Means for Solving the Problems]
The invention according to claim 1 is an LED chip, a notch portion located in front of the LED chip and receiving light from the LED chip, and located on both sides of the notch portion toward the front of the LED chip. And a light guide member on which a substantially planar light reflecting portion that gradually widens is formed.
[0008]
According to a second aspect of the present invention, in the light irradiation device according to the first aspect, the light guide member has a pair of reflectors that gradually spread toward the front of the LED chip with a notch therebetween, and The light irradiation device according to claim 1, wherein the portion and the reflection plate surround the periphery of the LED chip.
[0009]
According to a third aspect of the present invention, in the light irradiation device according to the first aspect, the light guide member has a substantially planar tapered portion that gradually widens toward the front of the LED chip with the cutout portion interposed therebetween. 2. The light irradiation device according to claim 1, wherein the reflection portion and the tapered portion surround the periphery of the LED chip.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
(1st Embodiment)
A first embodiment will be described with reference to FIG. 1A is a top view of the light irradiation device of the present embodiment, FIG. 1B is a cross-sectional view taken along line XX of FIG. 1A, and FIG. 1C is YY of FIG. It is sectional drawing cut | disconnected along the line.
[0011]
The light irradiation device according to the present embodiment includes a notch portion 4 into which light emitted from the LED chip 5 is incident, a light reflecting portion 7 that reflects the light incident on the notch portion 4, and an output from the LED chip 5. A light guide member 1 having a light exit surface 3 for emitting light is provided, and an LED chip 5 disposed at a position facing the opening of the cutout portion 4.
[0012]
More specifically, the light guide member 1 guides light emitted from the LED chip 5, and is formed of, for example, a resin such as an acrylic material, and is viewed from the front as shown in FIG. In this case, it is formed in an inverted trapezoidal shape. The light guide member 1 has a width on the light emitting surface 3 of about 44 mm, a width on the lower surface 2 of about 22 mm, and a distance between the light emitting surface 3 and the lower surface 2 of about 15 mm. The light guide member 1 is formed in a quadrilateral when viewed from the side as shown in FIG. 1C, and has a thickness of 10 mm. In the vicinity of the lower center of the light guide member 1, a quadrangular cutout 4 having a width of about 6 mm and a height of about 3 mm as viewed from the front is formed. It penetrates in the thickness direction. The LED chip 5 mounted on the printed wiring board 6 is arranged in a portion facing the notch 4. The LED chip 5 is, for example, a gallium nitride-based blue LED, and a phosphor (not shown) that converts the blue light emitted by the blue LED into yellow light by wavelength conversion is provided around the LED chip 5. Have been. In addition, light reflecting portions 4 having a substantially planar light-transmitting property are provided on both sides of the notch portion 4 and gradually spread from the notch portion 4 toward the light emitting surface 3.
[0013]
The light guide member 1 is supported by a substantially planar light reflecting portion 7 by a triangular support member 8 in a front view. The light guide member 1, the LED chip 5, the printed wiring board 6, and the support member 8 are housed in a housing 9 having an opening.
[0014]
In the above configuration, when a DC current is applied to the LED chip 5, the LED chip 5 emits blue light, and the blue light enters the phosphor. The blue light that has entered the phosphor is converted from blue light to yellow light by the phosphor and emitted from the phosphor. Then, white light is output by mixing the blue light emitted by the LED chip 5 and the yellow light emitted from the phosphor. Here, the light incident on the surface of the notch 4 parallel to the light exit surface 3 is guided inside the light guide member 1 and exits from the vicinity of the center of the light exit surface 3. Further, the light incident on the surface of the notch 4 perpendicular to the light emitting surface 3 is reflected by the substantially planar light reflecting portion 7 and emitted from both sides of the light emitting surface 3. As described above, the light emitted from the LED chip 5 with the component in the width direction of the light guide member 1 includes the light directly reaching the light emission surface 3 from the notch 4 of the light guide member 1 and the light emission surface 3. 2 shows two optical behaviors with the light reflected by. As a result, when viewed from the light emitting surface 3, three light emitting units are observed as shown in FIG. 1A even though there is actually only one LED chip 5. This means that light from the light exit surface 3 is uniformly dispersed, and as a result, light with high uniformity can be output.
(Second embodiment)
A second embodiment will be described with reference to FIG. 2A is a top view of the light irradiation apparatus according to the present embodiment, FIG. 2B is a cross-sectional view taken along line XX of FIG. 2A, and FIG. 2C is YY of FIG. It is sectional drawing cut | disconnected along the line.
[0015]
The present embodiment is different from the first embodiment in that a notch 4 of the light guide member 1 is provided with a reflection plate 10, and the other is the same. The same parts as those in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted.
[0016]
Specifically, as shown in FIG. 2C, when viewed from the side surface of the light guide member 1, a pair of the light guide members 1, the front of the LED chip 5 with the notch 4 interposed, that is, a pair of A reflector 10 is provided, and the light reflector 7 and the reflector 10 surround the LED chip 5. Here, the reflection plate 10 is formed of a material having a high reflectance, such as an aluminum plate, and is arranged to have an angle of 55 ° with respect to the printed wiring board 6, that is, an opening angle of 55 °.
[0017]
With this configuration, the behavior of light emitted from the LED chip 5 with a component in the width direction of the light guide member 1 is the same as that described in the first embodiment, but in the thickness direction of the light guide member 1. The light emitted with the component is reflected on the surface of the reflection plate 10, enters the light guide member 1, guides the light inside the light guide member 1, and is emitted from the light emission surface 3.
[0018]
Thereby, the light emitted from the LED chip 5 with the component in the thickness direction of the light guide member 1 is guided inside the light guide member 1, and the light from the LED chip 5 is more efficiently emitted to the outside. can do.
(Third embodiment)
A third embodiment will be described with reference to FIG. 3A is a top view of the light irradiation apparatus of the present embodiment, FIG. 3B is a cross-sectional view taken along line XX of FIG. 3A, and FIG. It is sectional drawing cut | disconnected along the line.
[0019]
In the present embodiment, a tapered portion 11 that reflects light emitted from the LED chip 5 with a component in the thickness direction of the light guide member 1 is provided. That is, as shown in FIG. 3 (c), the light guide member 1 is provided with a tapered portion 11 which is formed in a substantially planar shape gradually expanding toward the front of the LED chip 5 with the notch portion 4 interposed therebetween. The LED chip 5 is surrounded by 7 and the tapered portion 11. ing. Here, in the first embodiment, the cutout portion 4 penetrates in the thickness direction of the light guide member 1, but in the present embodiment, the cutout portion 4 does not penetrate due to the presence of the tapered portion 11. .
[0020]
With this configuration, the behavior of light emitted from the LED chip 5 with a component in the width direction of the light guide member 1 is the same as that described in the first embodiment, but in the thickness direction of the light guide member 1. The light emitted with the component is easily totally reflected by the tapered portion 11 because the incident angle at the tapered portion 11 increases.
[0021]
As a result, light emitted from the LED chip 5 with a component in the thickness direction of the light guide member 1 is guided inside the light guide member 1, and light is emitted from the LED chip 5 to the outside more efficiently. be able to.
(Fourth embodiment)
A fourth embodiment will be described with reference to FIG. FIG. 4 is a front view in which a part of the upper panel 14 of the light irradiation device of the present embodiment is cut away.
[0022]
In the present embodiment, the three light irradiation devices of the first embodiment are arranged in a line, and the display content (“EXIT” in this embodiment) is displayed so as to face the light emitting surface 3 of the light guide member 1. The display light guide member 12 described above is provided. Here, the light emitting surface 3 of the light guide member 1 is attached to the display light guide member 12 via a thick portion 13 having a thickness of about 3 mm.
[0023]
With this configuration, as described in the first embodiment, uniform light is output from the plurality of light irradiation devices, and these lights guide the inside of the display light guide member 12 and the display light guide member. Since light is output from the front surface of the display 12, characters written on the display light guide member 12 can be displayed.
[0024]
In the present embodiment, the light exit surface 3 of the light guide member 1 is connected to the display light guide member 12 through the thick portion 13 having a thickness of about 3 mm. However, as shown in FIG. The member 1 may be extended so that the light guide member 1 also serves as the display light guide member 12. In this case, since they are integrally formed, the efficiency of incidence on the light guide member 1 can be increased. Although the blue LED is used as the LED chip 5, another color LED such as a red LED may be used. Further, the light reflecting portion 4 is made to have a light transmitting property, but may be a non-light transmitting material.
[0025]
【The invention's effect】
According to the invention described above, the light guide member is provided with the cutout portion in front of the LED chip where the light from the LED chip is incident, and the substantially planar light reflecting portion 7 that gradually spreads in the light irradiation direction of the LED chip. Is provided, the light from the LED chip is uniformly dispersed, and the uniformity of the light emitted from the emission surface of the light guide member of the light guide member can be improved.
[Brief description of the drawings]
FIG. 1A is a top view of a light irradiation device according to a first embodiment, FIG. 1B is a cross-sectional view taken along line XX of FIG. 1A, and FIG. 3 is a cross-sectional view taken along the line YY of FIG.
2A is a top view of a light irradiation device according to a second embodiment, FIG. 2B is a cross-sectional view taken along line XX of FIG. 2A, and FIG. 3 is a cross-sectional view taken along the line YY of FIG.
3A is a top view of a light irradiation device according to a third embodiment, FIG. 3B is a cross-sectional view taken along line XX of FIG. 3A, and FIG. 3 is a cross-sectional view taken along the line YY of FIG.
FIG. 4 is a front view of a light irradiation device according to a fourth embodiment, in which an upper panel 14 is cut away.
FIG. 5 is a diagram showing another example of the light irradiation device of the fourth embodiment.
[Explanation of symbols]
REFERENCE SIGNS LIST 1 light guide member 2 bottom surface 3 light emission surface 4 cutout portion 5 LED chip 6 printed wiring board 7 light reflection portion 8 support member 9 housing 10 reflection plate 11 taper portion 12 display light guide member 13 thick portion 14 upper panel

Claims (3)

LEDチップと、LEDチップの前方に位置してLEDチップからの光が入射される切り欠き部、及び切り欠き部の両側に位置してLEDチップの前方に向かって次第に広がる略平面形状の光反射部が形成された導光部材と、を有することを特徴とする光照射装置。An LED chip, a notch portion located in front of the LED chip and receiving light from the LED chip, and a substantially planar light reflection located on both sides of the notch portion and gradually expanding toward the front of the LED chip A light guide member having a portion formed therein. 前記導光部材は、切り欠き部を挟んでLEDチップの前方に向かって次第に広がる一対の反射板を有し、前記光反射部と反射板とでLEDチップの周囲を囲むようにしたことを特徴とする請求項1記載の光照射装置。The light guide member has a pair of reflectors that gradually spread toward the front of the LED chip with the notch therebetween, and the light reflector and the reflector surround the LED chip. The light irradiation device according to claim 1, wherein 前記導光部材は、切り欠き部を挟んでLEDチップの前方に向かって次第に広がる略平面形状のテーパ部分を有し、光反射部とテーパ部分とでLEDチップの周囲を囲むようにしたことを特徴とする請求項1記載の光照射装置。The light guide member has a substantially planar tapered portion that gradually widens toward the front of the LED chip with the cutout portion interposed therebetween, and the light reflecting portion and the tapered portion surround the LED chip. The light irradiation device according to claim 1, wherein
JP2003149871A 2003-05-27 2003-05-27 Light irradiation device Pending JP2004354534A (en)

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WO2006126802A1 (en) * 2005-05-26 2006-11-30 Lg Innotek Co., Ltd Backlight assembly and display apparatus having the same
EP1729058A1 (en) * 2005-05-30 2006-12-06 LG Electronics, Inc. Backlight unit having light emitting diodes and method for manufacturing the same
WO2007058501A1 (en) * 2005-11-18 2007-05-24 Seoul Semiconductor Co., Ltd. Luminous element for backlight unit
KR100727856B1 (en) 2005-08-08 2007-06-14 희성전자 주식회사 Reflect Plate of Direct type Backlight using LED and Backlight unit thereof
JP2007294317A (en) * 2006-04-26 2007-11-08 Canon Inc Light source device, and image display device
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US8480251B2 (en) 2005-05-26 2013-07-09 Lg Innotek Co., Ltd. Backlight assembly having LEDs and side reflectors and display apparatus having the same
WO2006126802A1 (en) * 2005-05-26 2006-11-30 Lg Innotek Co., Ltd Backlight assembly and display apparatus having the same
US8801219B2 (en) 2005-05-26 2014-08-12 Lg Innotek Co., Ltd. Backlight assembly having LEDs and side reflectors and display apparatus having the same
US8267543B2 (en) 2005-05-26 2012-09-18 Lg Innotek Co., Ltd. Backlight assembly having LEDs and side reflectors and display apparatus having the same
EP1729058A1 (en) * 2005-05-30 2006-12-06 LG Electronics, Inc. Backlight unit having light emitting diodes and method for manufacturing the same
US7427145B2 (en) 2005-05-30 2008-09-23 Lg Electronics Inc. Backlight unit having light emitting diodes and method for manufacturing the same
KR100727856B1 (en) 2005-08-08 2007-06-14 희성전자 주식회사 Reflect Plate of Direct type Backlight using LED and Backlight unit thereof
WO2007058501A1 (en) * 2005-11-18 2007-05-24 Seoul Semiconductor Co., Ltd. Luminous element for backlight unit
US8337046B2 (en) 2005-11-18 2012-12-25 Seoul Semiconductor Co., Ltd. Luminous element for backlight unit
JP2007294317A (en) * 2006-04-26 2007-11-08 Canon Inc Light source device, and image display device
JP4721437B2 (en) * 2006-04-26 2011-07-13 キヤノン株式会社 Light source device and video display device
WO2014091914A1 (en) * 2012-12-10 2014-06-19 シチズンホールディングス株式会社 Led device and manufacturing method thereof
JP5611492B1 (en) * 2012-12-10 2014-10-22 シチズンホールディングス株式会社 LED device and manufacturing method thereof
CN104854716A (en) * 2012-12-10 2015-08-19 西铁城控股株式会社 Led device and manufacturing method thereof
US9490398B2 (en) 2012-12-10 2016-11-08 Citizen Holdings Co., Ltd. Manufacturing method of light emitting device in a flip-chip configuration with reduced package size
CN104854716B (en) * 2012-12-10 2017-06-20 西铁城时计株式会社 LED matrix and its manufacture method

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