JP2004346213A - Mold-releasing agent and adhesive laminated tape - Google Patents
Mold-releasing agent and adhesive laminated tape Download PDFInfo
- Publication number
- JP2004346213A JP2004346213A JP2003145663A JP2003145663A JP2004346213A JP 2004346213 A JP2004346213 A JP 2004346213A JP 2003145663 A JP2003145663 A JP 2003145663A JP 2003145663 A JP2003145663 A JP 2003145663A JP 2004346213 A JP2004346213 A JP 2004346213A
- Authority
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- Prior art keywords
- adhesive
- release
- layer
- ethylene
- propylene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 63
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 63
- 239000003795 chemical substances by application Substances 0.000 title claims abstract description 60
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims abstract description 29
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000005977 Ethylene Substances 0.000 claims abstract description 26
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims abstract description 26
- 229920000642 polymer Polymers 0.000 claims abstract description 19
- 229920001155 polypropylene Polymers 0.000 claims abstract description 19
- 229920001577 copolymer Polymers 0.000 claims abstract description 18
- 239000004711 α-olefin Substances 0.000 claims abstract description 17
- -1 polypropylene Polymers 0.000 claims abstract description 16
- 239000004743 Polypropylene Substances 0.000 claims abstract description 9
- 239000010410 layer Substances 0.000 claims description 82
- 239000012790 adhesive layer Substances 0.000 claims description 60
- 239000000758 substrate Substances 0.000 claims description 32
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 19
- 125000000524 functional group Chemical group 0.000 claims description 16
- 238000002844 melting Methods 0.000 claims description 12
- 230000008018 melting Effects 0.000 claims description 12
- 229920001038 ethylene copolymer Polymers 0.000 claims description 9
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 claims description 7
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 claims description 6
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 3
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 abstract description 7
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 239000000463 material Substances 0.000 description 34
- 238000000034 method Methods 0.000 description 14
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 239000000243 solution Substances 0.000 description 11
- 238000005227 gel permeation chromatography Methods 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 229920000058 polyacrylate Polymers 0.000 description 7
- 229920000098 polyolefin Polymers 0.000 description 7
- 239000003431 cross linking reagent Substances 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 239000012968 metallocene catalyst Substances 0.000 description 6
- 230000007423 decrease Effects 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 239000000123 paper Substances 0.000 description 5
- ZGEGCLOFRBLKSE-UHFFFAOYSA-N 1-Heptene Chemical compound CCCCCC=C ZGEGCLOFRBLKSE-UHFFFAOYSA-N 0.000 description 4
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 4
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1-dodecene Chemical compound CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 4
- GQEZCXVZFLOKMC-UHFFFAOYSA-N 1-hexadecene Chemical compound CCCCCCCCCCCCCCC=C GQEZCXVZFLOKMC-UHFFFAOYSA-N 0.000 description 4
- HFDVRLIODXPAHB-UHFFFAOYSA-N 1-tetradecene Chemical compound CCCCCCCCCCCCC=C HFDVRLIODXPAHB-UHFFFAOYSA-N 0.000 description 4
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- VAMFXQBUQXONLZ-UHFFFAOYSA-N n-alpha-eicosene Natural products CCCCCCCCCCCCCCCCCCC=C VAMFXQBUQXONLZ-UHFFFAOYSA-N 0.000 description 4
- CCCMONHAUSKTEQ-UHFFFAOYSA-N octadec-1-ene Chemical compound CCCCCCCCCCCCCCCCC=C CCCMONHAUSKTEQ-UHFFFAOYSA-N 0.000 description 4
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 4
- 229920006267 polyester film Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000005160 1H NMR spectroscopy Methods 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000011954 Ziegler–Natta catalyst Substances 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000007334 copolymerization reaction Methods 0.000 description 3
- 238000002425 crystallisation Methods 0.000 description 3
- 230000008025 crystallization Effects 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 150000002978 peroxides Chemical class 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920005604 random copolymer Polymers 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- RFFLAFLAYFXFSW-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl RFFLAFLAYFXFSW-UHFFFAOYSA-N 0.000 description 2
- 229940106006 1-eicosene Drugs 0.000 description 2
- FIKTURVKRGQNQD-UHFFFAOYSA-N 1-eicosene Natural products CCCCCCCCCCCCCCCCCC=CC(O)=O FIKTURVKRGQNQD-UHFFFAOYSA-N 0.000 description 2
- YHQXBTXEYZIYOV-UHFFFAOYSA-N 3-methylbut-1-ene Chemical compound CC(C)C=C YHQXBTXEYZIYOV-UHFFFAOYSA-N 0.000 description 2
- LDTAOIUHUHHCMU-UHFFFAOYSA-N 3-methylpent-1-ene Chemical compound CCC(C)C=C LDTAOIUHUHHCMU-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 229940069096 dodecene Drugs 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- ALSOCDGAZNNNME-UHFFFAOYSA-N ethene;hex-1-ene Chemical group C=C.CCCCC=C ALSOCDGAZNNNME-UHFFFAOYSA-N 0.000 description 2
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 229920000092 linear low density polyethylene Polymers 0.000 description 2
- 239000004707 linear low-density polyethylene Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920001684 low density polyethylene Polymers 0.000 description 2
- 239000004702 low-density polyethylene Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229920001384 propylene homopolymer Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- 229920002873 Polyethylenimine Polymers 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 239000002981 blocking agent Substances 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000012933 diacyl peroxide Substances 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 238000012685 gas phase polymerization Methods 0.000 description 1
- 239000011086 glassine Substances 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 125000000555 isopropenyl group Chemical group [H]\C([H])=C(\*)C([H])([H])[H] 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- RPDJEKMSFIRVII-UHFFFAOYSA-N oxomethylidenehydrazine Chemical compound NN=C=O RPDJEKMSFIRVII-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920005653 propylene-ethylene copolymer Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000007613 slurry method Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- PZJJKWKADRNWSW-UHFFFAOYSA-N trimethoxysilicon Chemical group CO[Si](OC)OC PZJJKWKADRNWSW-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000003643 water by type Substances 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【0001】
【発明の属する技術分野】
本発明は、離型剤および粘着性積層テープに関する。なお、本明細書において粘着とは接着なども含む広義の意味である。
【0002】
【従来の技術】
離型剤は粘着テープの粘着面を保護するのに広く使用されている。離型性能の点で最も優れている離型剤の一つはシリコーン系の離型剤である。ところで、シリコーン系離型剤には微量のシロキサン系ガスが含まれており、用途によってはこのシロキサン系ガスが腐蝕その他の重大な障害をもたらすことがある。シリコーン系離型剤の代りとしてフッ素樹脂系の離型剤も提案されているが、その離型性能は必ずしも満足すべきものではない。
【0003】
また、ポリエチレン系樹脂組成物から成る離型剤には、低密度ポリエチレン系樹脂を主成分とする離型剤(例えば特許文献1及び2参照)、高密度ポリエチレン系樹脂を主成分とする離型剤(例えば特許文献3及び4参照)がある。低密度ポリエチレン系樹脂を主成分とする離型剤は、大きな剥離力が必要で、感圧接着層保護フィルムとして使用した場合、剥離時に接着層の一部が離型層表面に移行したり剥離後の接着層の表面の形状がパルス状と成るスティックスリップと呼ばれる剥離を引き起こしたり、粘着剤と貼合わせた状態で加熱された際、剥離力が増大したり、剥離後の粘着剤の粘着力を低下させてしまう等の問題がある。
【0004】
更に、ポリプロピレンを主たる成分とした熱可塑性エラストマ−オレフィンエラストマーを使用した離型材が提案され(例えば特許文献5参照)、プロピレンエチレン共重合体とポリプロピレン組成物より成る離型材が提案されている(例えば特許文献6参照)。しかしながら、これらは、剥離力が高く実用上十分なものではない。
【0005】
【特許文献1】
特公昭51−20205号公報
【特許文献2】
特表平11−508958号公報
【特許文献3】
特開2000−239624号公報
【特許文献4】
特開2000−119411号公報
【特許文献5】
特表2001−516790号公報
【特許文献6】
特開2000−218745号公報
【0006】
【発明が解決しようとする課題】
本発明は、上記実情に鑑みなされたものであり、その目的は、シリコーン系の発生ガス成分を含まず、種々の粘着剤に対して良好な離型性を有すると共に、剥離力の変動が小さく、且つ粘着剤と貼り合わせて加熱下に置いた後も低い剥離力を保持できる離型剤を提供することにある。
【0007】
【課題を解決するための手段】
すなわち、本発明の第1の要旨は、エチレンと1種以上のα−オレフィン(但しエチレンを除く)とのみから成るエチレン系共重合体(A)とポリプロピレン含有量が80重量%以上のプロピレン系重合体(B)を含有し、エチレン系共重合体(A)とプロピレン系重合体(B)の重量比が40:60〜90:10であることを特徴とする離型剤に存する。
【0008】
本発明の第2の要旨は、粘着層と離型層とから成る粘着性積層体であって、離型層が上記の離型剤から成ることを特徴とする粘着性積層体に存する。
【0009】
本発明の第3の要旨は、基材の少なくとも一面に粘着層と離型層とから成る粘着性積層体の粘着層が基材に接する様に設けられている粘着性積層テープであって、離型層が上記の離型剤から成ることを特徴とする粘着性積層テープに存する。
【0010】
本発明の第4の要旨は、基材、離型層、粘着剤層および粘着層用基材の順に積層されている粘着性積層テープであって、離型層が上記の離型剤から成ることを特徴とする粘着性積層テープに存する。
【0011】
【発明の実施の形態】
以下、本発明を詳細に説明する。先ず、本発明の離型剤について説明する。本発明の離型剤は、必須成分として以下に説明するエチレン系共重合体(A)とプロピレン系重合体(B)とを含有する。
【0012】
エチレン系共重合体(A)は、エチレンと1種以上のα−オレフィン(但しエチレンを除く)とのみから成る。α−オレフィンとしては、例えば、プロピレン、1−ブテン、1−ペンテン、3−メチル−1−ブテン、1−ヘキセン、4−メチル−1−ペンテン、3−メチル−1−ペンテン、1−ヘプテン、1−オクテン、1−デセン、1−ドデセン、1−テトラデセン、1−ヘキサデセン、1−オクタデセン、1−エイコセン等の、炭素数3〜20程度のα−オレフィン等が挙げられる。これらの中では、プロピレン、ブテン、ヘキセン、オクテンの何れか1種以上が好ましい。エチレン系共重合体(A)におけるα−オレフィンの共重合割合は、通常1〜25モル%、好ましくは3〜15モル%である。α−オレフィンの共重合割合が多くなり過ぎてエチレン含量が少な過ぎる場合は、離型剤の耐熱性が低下する傾向がある。
【0013】
本発明においては、特に、メタロセン系触媒を使用して製造されたエチレン系共重合体(A)が好ましい。メタロセン系触媒は、分子量分布が狭く、且つ低分子量成分の少ないポリオレフィンを与え、しかも、共重合を均一に行わせることが出来るため、コモノマー含有量が平均組成と著しく異なる成分の生成も抑制される。従って、メタロセン系触媒を使用して製造したエチレン系共重合体(A)を使用した離型剤は、べたつきが少なく、また、架橋の際の効果的なゲル化が可能となるため、架橋により耐薬品性を高くすることが出来る。エチレン系共重合体(A)の製造は、溶液重合、気相重合、スラリー重合など、公知の任意の重合方法によることが出来る。
【0014】
本発明で使用するプロピレン系重合体(B)としては、プロピレンホモ重合体、プロピレン−α−オレフィンランダム共重合体、プロピレン−α−オレフィンブロック共重合体などが挙げられる。α−オレフィンとしては、例えば、プロピレン、1−ブテン、1―ペンテン、3―メチル−1―ブテン、1―ヘキセン、4−メチル−1−ペンテン、3−メチル−1−ペンテン、1−ヘプテン、1―オクテン、1―デセン、1−ドデセン、1−テトラデセン、1−ヘキサデセン、1−オクタデセン、1−エイコセン等の炭素数3〜20程度のα−オレフィンが挙げられる。コモノマーとして使用するα−オレフィンは1種であってもよく、2種以上を併用してもよい。プロピレン系重合体(B)におけるポリプロピレン含有量は、80重量%以上、好ましくは85重量%以上である。ポリプロピレン含有量が80重量%未満の場合は耐熱性が低下する。
【0015】
プロピレン系重合体(B)は公知の方法によって製造される。例えば、チーグラーナッタ触媒、メタロセン触媒などが触媒として使用され、バッチ法、気相法、スラリー法など公知のプロセスによって製造される。
【0016】
プロピレン系重合体(B)の融点は、離型剤と耐熱性の観点から、通常80℃以上、好ましくは120℃以上であり、その上限は通常165℃である。融点が80℃未満の場合は、前述のエチレン系共重合体(A)の融点と肉迫しプロピレン系重合体(B)が有する耐熱性が低下する。
【0017】
プロピレン系重合体(B)の融点を制御するためには、プロピレンと共重合するα−オレフィンの量や種類を変化させる方法、プロピレンの単独重合体においてプロピレンの立体規則性分布や位置異性を制御する方法、ノルボルネン重合体等のプロピレン系重合体(B)と相溶化する成分を添加し結晶化速度を制御する方法、結晶化核剤を使用して結晶系や結晶化開始温度を変える方法など、種々の方法を使用することが出来る。
【0018】
プロピレン系重合体(B)の重量平均分子量は、通常1×104以上、好ましくは3×104以上である。重量平均分子量が1×104未満の場合は、離型剤の機械的強度が小さくなり、この離型剤から成る離型層を粘着層から剥離する際に剥離が不良となったり、離型層が部分的に粘着層に残留したりすることがある。
【0019】
本発明においては、基材密着性に優れた離型剤を得るため、エチレン系共重合体(A)及び/又はプロピレン系重合体(B)に官能基を付与することが出来る。官能基としては、エポキシ基、酸無水物基、カルボキシル基、ヒドロキシル基、アミノ基、イソシアネート基、トリメトキシシリル基などの反応性を有する官能基、ビニル基、イソプロペニル基、(メタ)アクリレート基、アリル基などの不飽和結合を有する基などが挙げられる。
【0020】
官能基の付与は、エチレン系共重合体(A)及び/又はプロピレン系重合体(B)に官能基を有するモノマーをパーオキサイドの存在下で付加反応させる等、常法に従って行えばよい。パーオキサイドとしては、ケトンパーオキサイド、ハイドロパーオキサイド、ジアシルパーオキサイド等の公知のものが使用され。官能基の量は、通常10モル%以下、好ましくは5モル%以下である。官能基が多過ぎる場合、離型剤の離型性が損なわれる恐れがある。
【0021】
本発明の離型剤は、エチレン系共重合体(A)とプロピレン系重合体(B)とを必須成分とするが、更に他の付加的成分を含有させてもよい。エチレン系共重合体(A)及び/又はプロピレン系重合体(B)に官能基を付与した場合、付加的成分としては、例えば架橋剤、すなわち、上記のポリオレフィンの官能基と反応する官能基を複数個有する化合物が挙げられる。斯かる架橋剤の使用割合は、ポリオレフィンの官能基/架橋剤の官能基のモル比として、通常0.1〜10、好ましくは0.5〜2である。官能基のモル比がこの範囲を外れる場合は、未反応の官能基の残存数が多くなり、一般に離型性が低下する。他の付加的成分としては、アンチブロック剤、抗酸化剤、顔料、紫外線吸収剤、充填剤、老化防止剤などが挙げられる。
【0022】
本発明の離型剤は、エチレン系共重合体(A)とプロピレン系重合体(B)とに、所望により種々の付加的成分を配合し、溶媒に溶解したり溶融混練することにより製造できる。エチレン系共重合体(A)とプロピレン系重合体(B)との重量比は40:60〜90:10、好ましくは40:60〜80:20である。プロピレン系重合体(B)の割合が上記範囲未満の場合は、粘着剤との剥離力や離型剤の耐熱性が低下し、上記範囲を超える場合は、離型剤の耐熱性は優れるものの剥離力が増大する。
【0023】
次に、本発明の粘着性積層体および粘着性積層テープについて説明する。本発明の粘着性積層体は、粘着層と離型層とから成る粘着性積層体であって、離型層が上記の離型剤から成ることを特徴とする。そして、適宜に基材を使用して各種の態様の粘着性積層テープに使用される。
【0024】
<粘着性積層テープ−1>
この態様は、基材上に粘着層と基材とが隣接する様に粘着性積層体を設けたものである。すなわち、層構成は、基材/粘着層/離型層と成る。使用に際しては、離型層を剥離し、粘着層面を露出させて対象物に粘着させればよい。
【0025】
<粘着性積層テープ−2>
この態様は、基材上に離型層と基材とが隣接する様に粘着性積層体を設け、更に粘着性積層体の粘着層側に粘着層用基材を設けたものである。すなわち、層構成は、基材/離型層/粘着層/基材と成る。使用に際しては、基材および離型層を剥離し、粘着層面を露出させて対象物に粘着させればよい。
【0026】
<粘着性積層テープ−3>
この態様は、粘着層用基材の両面に基材と粘着層とが隣接する様に粘着性積層体を設けたものである。すなわち、層構成は、離型層/粘着層/基材/粘着層/離型層と成る。使用に際しては、一方の粘着層を被覆している離型層を剥離し、その粘着層の外側面を露出させて一方の対象物に粘着し、次いで、他方の粘着層を被覆している離型層を剥離し、その粘着層の外側面を露出させて他方の対象物に粘着することにより、2個の対象物同士を粘着する両面粘着性テープとして使用することが出来る。
【0027】
<粘着性積層テープ−4>
この態様は、粘着性積層体の粘着層の表面に離型層を設けたものである。すなわち、層構成は、離型層/粘着層/離型層と成る。使用に際しては、一方の離型層を剥離し、粘着層の一面を露出させて一方の対象物に粘着させ、次いで、他方の離型層を剥離し、粘着層の他面を露出させて他方の対象物と粘着させることにより、2個の対象物同士を粘着する両面粘着性テープとして使用することが出来る。
【0028】
<粘着性積層テープ−5>
この態様は、前記の粘着性積層体を使用せず、基材の一面に粘着層、他面に離型層を設け、ロール状に巻回し、粘着性積層テープ巻回体としたものである。すなわち、層構成は、粘着層/基材/離型層と成る。離型層は基材との密着性があるため、使用に際しては、巻き戻して粘着層と離型層の界面で剥離させ、粘着層面を露出させて対象物に粘着させればよい。
【0029】
上記の何れの構成の粘着性積層テープでも、離型層の厚さを厚くしたり、離型層をこれと密着性を有する離型層用基材と一体化して使用することにより、離型層を剥離する際の機械的強度を確保することが出来る。
【0030】
また、何れの構成の粘着性積層テープの場合も、離型層用基材は離型層と、粘着層用基材は粘着層と、それぞれ必要に応じて一体化して使用され、離型層用基材には離型剤との密着性および機械的強度、粘着層用基材には粘着剤との密着性および機械的強度が求められる。上述の粘着性積層テープ巻回体に使用する基材は、離型層用基材と粘着層用基材とを兼ねている。
【0031】
粘着性積層テープ巻回体を含め粘着性積層テープに使用する基材としては、常用のもの、例えば、ポリエチレンテレフタレート、ポリブチレンテレフタレート等のポリエステル、ポリプロピレン、ポリエチレン、ポリメチルペンテン等のポリオレフィン、ポリカーボネート等の樹脂から成るフィルム、グラシン紙、上質紙、コート紙、含浸紙、合成紙などの紙、更には、アルミニウム、ステンレススチール等の金属箔などを使用しればよい。基材の厚さは、通常10〜100μm、好ましくは25〜50μmである。
【0032】
基材には、粘着層や離型層との接着性を向上させるため、コロナ処理、プラズマ処理、フレームプラズマ処理などを施したり、プライマー層などを設けてもよい。プライマー層としては、ポリエチレン、ポリプロピレン、スチレン系共重合体、ポリエステル、ポリウレタン、ポリビニルアルコール、ポリエチレンイミン、ポリアクリレート、ポリメタクリレート、これらの変性物などの高分子材料(所謂アンカーコート剤)を使用することが出来る。
【0033】
上記のテープの製造に際し、粘着層および離型層の形成は常法により行えばよい。通常、離型層は、基材上に離型剤を塗布したり、押出機から離型剤をシート状に溶融押出しして基材上にラミネートしたり、基材原料および離型剤を押出機から共押出しすることにより形成される。
【0034】
粘着剤としては、通常、アクリル系、ゴム系、ポリウレタン系、シリコン系などの粘着剤と称されているものが主に使用されるが、他の粘着剤を使用することも出来る。そして、粘着層は、基材または基材上に設けられた離型層上に粘着剤をそのまま又は溶液として塗布したり、他の基材に塗工した粘着層を転写塗工したり、基材原料、離型剤および粘着剤を押出機で共押出しすることにより形成することが出来る。
【0035】
なお、積層体の製造に際しては、基材層と離型層とを共押出しする等、複数の層を同時に溶融押出成形するのが生産性の点で優れている。
【0036】
溶融押出法により離型層を形成する場合は、離型剤の230℃、2.16kgfでのメルトインデックスは、通常0.5〜40g/10分、好ましくは1〜20g/10分とされる。メルトインデックスがこれより大きくても小さくても押出し成形性は低下する。
【0037】
なお、基材と離型層、更には、基材と離型層と粘着層を共押出成形した場合には、引続き、一軸または二軸に延伸して、厚さを薄くし且つ強度を向上させることも出来る。延伸倍率は通常は2〜10倍である。離型層の厚さは、通常は0.5〜150μm、好ましくは0.5〜10μm、更に好ましくは0.5〜5μmである。離型層の厚さが薄すぎる場合は、厚さの均一性を確保するのが困難であり、厚すぎる場合は、積層体の弾性率が低下する。
【0038】
【実施例】
以下、実施により本発明を更に詳細に説明するが、本発明は、その要旨を超えない限り、以下の実施例に限定されるものではない。なお、実施例における物性の測定法は以下の方法で行った。
【0039】
(1)常温下の離型性の評価:
粘着性積層テープを調製した後、25℃、50RHで72時間養生して安定化する。次いで、粘着性積層テープを幅25mm、長さ150mmに切断し、粘着層と隣接する基材の背面をステンレス板に固定し、剥離試験器を使用し、25℃、50RHの雰囲気下で300mm/minの引っ張り速度で離型層と粘着層の界面を180度剥離させ、その際の力(常態剥離力)を測定する。結果は5回の測定の平均値で表示した。常態剥離力が小さいほど粘着層との剥離が容易で常温下の離型性が良好である。
【0040】
(2)加熱下の離型性の評価:
粘着性積層テープを調製した後、25℃、50RHで72時間養生して安定化する。次いで、粘着性積層テープを20g/cm2荷重下に100℃で1時間保持する。次いで、室温で放冷した後、粘着性積層テープを幅25mm、長さ150mmに切断し、粘着層と隣接する基材の背面をステンレス板に固定し、剥離試験器を使用し、25℃、50RHの雰囲気下で300mm/minの引っ張り速度で離型層と粘着層の界面を180度剥離させる。その際の力(加熱剥離力)を測定する。結果は5回の測定の平均値で表示した。加熱剥離力が小さいほど粘着層との剥離が容易で加熱下の離型性が良好である。
【0041】
また、エチレン系共重合体(A)、プロピレン系重合体(B)及び粘着剤としては以下に記載のものを使用した。そして、これらの分子量および融点の測定は次の方法で行った。
【0042】
(3)分子量:
ゲルパーミエーションクロマトグラフィーにより、標準ポリスチレンで作成した検量線を使用して算出した。測定条件は次の表1に通りである。
【0043】
【表1】
機 種:Waters社製、GPC150C
溶 媒:オルトジクロロベンゼン
温 度:140℃
インジェクション濃度:0.1重量%
注入量:200μl
流 量:1.0ml/min
検出器:IR.波長3.42μm
カラム:昭和電工社製、AD806MS
カラムサイズ:30cm×3本
分子量の算出法:ユニバーサルキャリブレーション法により直鎖ポリエチレンの分子量として計算
【0044】
(4)融点の測定:
パーキンエルマー社製DSC「DSC−7」を使用し、次の要領で測定した。すなわち、先ず、200℃で10分間事前恒温後、−20℃/minで20℃まで冷却し5分恒温する。次いで、20℃/minで昇温する。この昇温過程での融解に伴うDSCピークの吸熱ピーク位置を融点とする。測定は窒素雰囲気下で行い、試料重量は7mgとした。
【0045】
(EP1)
メタロセン触媒を使用して製造したエチレン−プロピレン共重合体である。H−NMRで求めた組成は、エチレン/プロピレン=74/26(重量比)、GPCで求めた重量平均分子量は97000で、数平均分子量に対する重量平均分子量の比は2.3、密度は0.863g/cc、MFRは3.2g/10分であった。
【0046】
(EP2)
メタロセン触媒を使用して製造したエチレン−プロピレン共重合体である。H−NMRで求めた組成は、エチレン/プロピレン=73/27(重量)、GPCで求めた重量平均分子量は71000で、数平均分子量に対する重量平均分子量の比は2.1、密度は0.865g/cc、MFRは6g/10分であった。
【0047】
(EP3)
メタロセン触媒を使用して製造したエチレン−ヘキセンランダム共重合体である。H−NMRで求めた組成は、エチレン/ヘキセン=90/10(モル比)、GPCで求めた重量平均分子量は70100で、数平均分子量に対する重量平均分子量の比は2.3、密度は0.880g/cc、MPRは3.5g/10分であった。
【0048】
(EP4)
前記のEP1:100重量部、2−ヒドロキシエチルメタクリレート:3重量部、2,5−ジメチル−2,5−ジ−ter−ブチルパーオキサイド:0.15重量部を混合した後、ラボプラストミル混練機(東洋精機社製)を使用し、窒素雰囲気下、180℃で3分間、回転数60rpmで混練して得た、ヒドロキシル基を有する変性エチレン−ヘキセンランダム共重合体である。FT−IRスペクトルによる1724cm− 1のカルボニル基の特性吸収強度の測定値から見積もった2−ヒドロキシエチルメタクリレートの含有量は0.9重量%であった。密度0.881g/cc、MFRは4.2g/10分であった。
【0049】
(PP1)
メタロセン触媒を使用してプロピレンを重合した。GPCで求めた重量平均分子量は394400、数平均分子量に対する重量平均分子量の比は2.4であった。融点は155℃であった。
【0050】
(PP2)
チグラーナッタ触媒を使用してプロピレンとエチレン(重量比97.4:2.6)を重合した。GPCで求めた重量平均分子量は397000、数平均分子量に対する重量平均分子量の比は4.2であった。融点は123℃であった。
【0051】
(PP3)
チグラーナッタ触媒を使用してプロピレンとエチレン(重量比94.0:6.0)を重合した。GPCで求めた重量平均分子量は210000、数平均分子量に対する重量平均分子量の比は5.3であった。融点は109℃であった。
【0052】
(ポリアクリル酸エステル系粘着剤A)
n−ブチルアクリレート100重量部とアクリル酸5重量部とをトルエンに溶解し、ベンゾイルパーオキサイドを使用して常法により重合させ、重量平均分子量が約50万のアクリル系ポリマーの溶液(固形分50重量%)を得た。これに固形分量が30%となる様に酢酸エチルを加えた後、アクリル系ポリマー100重量部当たりイソシアネート系架橋剤を3重量部添加してポリアクリル酸エステル系粘着剤Aとした。
【0053】
実施例1
プロピレン重合体1(PP1)とエチレンプロピレン共重合体1(EP1)とを表1に示す重量比で配合し、二軸押出機を使用し、210℃、平均滞留時間3分で混練し、離型剤を製造した。この離型剤をTダイ成形機から220℃で押出し、離型層のみから成る離型シートを得た。離型シートの厚さは50μmであった。
【0054】
アプリケーター(太佑機材(株)製:100μm用)を使用し、塗工液の厚さが100μm、幅8cmとなる様に、厚さ25μmのポリエステルフィルムに23℃でポリアクリル酸エステル系粘着剤溶液Aを塗布した。塗布後2秒経過してから、80℃に加熱されたドライヤ(佐竹化学機器工業(株)製:セーフベンドライヤN50S5)内で2分間乾燥させた。その後、取り出して室温に冷却し、粘着層および基材から成る粘着シートを得た。
【0055】
次いで、室温まで冷却してから2分後に、上記の粘着シートを前記の離型シート上に置き、その上から、2kgのローラーを30cm/minの速度で一往復させ、粘着層と離型層を圧着させた。これにより、離型層、粘着層、基材の順に積層されている粘着性積層テープ1を作製した。
【0056】
日東電工社製:N502テープを粘着シートとし、前記の離型シート上に置き、その上から、2kgのローラーを30cm/minの速度で一往復させ、粘着層と離型層を圧着させた。これにより、離型層、粘着層、基材の順に積層されている粘着性積層テープ2を作製した。
【0057】
実施例2〜6
プロピレン重合体とエチレンα−オレフィン重合体とを表1に示す重量比で配合し、二軸押出機を使用し、230℃、平均滞留時間3分で混練し、離型剤を製造した。
【0058】
Tダイ成形機から、LLDPE(密度0.93g/cc、メルトインデックス2.0g/10min)と離型剤含有プロピレン重合体の等重量ブレンド物と上記の離型剤とを240℃で共押出し、基材および離型層から成る離型シートを得た。基材の厚さは25μm、離型層の厚さは4μmであった。
【0059】
なお、実施例6では、離型剤の製造に際し、離型剤100重量部に対し、ゼオライト系のアンチブロッキング剤(平均粒子径2μm)を2重量部となる様に配合した。
【0060】
アプリケーター(太佑機材(株)製:100μm用)を使用し、塗工液の厚さが100μm、幅8cmとなる様に、厚さ25μmのポリエステルフィルム上にポリアクリル酸エステル系粘着剤溶液Aを23℃で塗布した。塗布後2秒経過してから、80℃に加熱されたドライヤ(佐竹化学機器工業(株)製:セーフベンドライヤN50 S5)内で2分間乾燥させた。その後、取り出して室温に冷却して粘着層および基材より成る粘着シートを得た。
【0061】
次いで、室温まで冷却してから2分後、上記の粘着シートを前記の離型シート上に置き、その上から、2kgのローラーを30cm/minの速度で一往復させ、粘着層と離型層を圧着させた。これにより、基材、離型層、粘着層、基材の順に積層されている粘着性積層テープを調製した。
【0062】
日東電工社製:N502テープを粘着シートとし、前記の離型シート上に置き、その上から、2kgのローラーを30cm/minの速度で一往復させ、粘着層と離型層を圧着させた。これにより、離型層、粘着層、基材の順に積層されている粘着性積層テープ2を作製した。
【0063】
実施例7
表1に示すプロピレン重合体と官能基変性されたエチレン1−ヘキセン共重合体(EP−4)を60℃に加熱したトルエンに溶解し、その後、冷却して離型剤の2重量%トルエン溶液を調製した。この離型剤溶液に、三菱化学社製の「NY718A」(トリオール1モルに脂肪族ジイソシアネート3モルを付加した3官能性イソシアネートの76重量%酢酸ブチル溶液)を添加して架橋剤を含む離型剤溶液を調製した。この溶液は、架橋剤をポリオレフィン(PE−3)に含まれている2−ヒドロキシエチルメタクリレートに対してイソシアネート基が1.1当量となる量含有している。
【0064】
厚さ25μmのポリエステルフィルム上に、上記のトルエン溶液を乾燥後の厚さが0.1μmとなる様に塗布し、150℃の雰囲気下で1分間乾燥させて離型シートを得た。
【0065】
次いで、上記の離型シートの離型層上に、乾燥後の厚さが40μmになる様に、ポリアクリル酸エステル系粘着剤溶液Aを塗布し、80℃で5分間乾燥し、粘着剤層を形成した。この粘着層に基材として厚さ25μmのポリエステルフィルムを貼り合わせ、基材、離型層、粘着層、基材の順に積層されている粘着性積層テープ1を作製した。また、実施例2と同様に粘着性積層テープ2を作製した
【0066】
比較例1〜3
離型剤として表1に示す組成物を使用した以外は、実施例1と全く同様にして粘着性積層テープ1及び2を得た。
【0067】
比較例4
離型剤としてエチレンα−オレフィン共重合体(EP1)を使用し、基材をLLDPE(密度0.93g/cc、メルトインデックス2.0g/10min)のみとした以外は、実施例2と同様にして、基材、離型層、粘着層、基材の順に積層されている粘着性積層テープ1及び2を作製した。
【0068】
【表2】
【0069】
【発明の効果】
以上説明した本発明によれば、シリコーン系発ガス成分を含まず、種々の粘着剤に対して良好な離型性を有すると共に、剥離力の変動が小さく、且つ粘着剤と貼り合わせて加熱下に置いた後も低い剥離力を保持できる離型剤が提供され、本発明の工業的価値は顕著である。[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a release agent and an adhesive laminated tape. In this specification, the term “adhesion” has a broad meaning including adhesion and the like.
[0002]
[Prior art]
Release agents are widely used to protect the adhesive surface of adhesive tapes. One of the most excellent release agents in terms of release performance is a silicone release agent. By the way, a small amount of a siloxane-based gas is contained in a silicone-based release agent, and this siloxane-based gas may cause corrosion and other serious obstacles depending on applications. Fluororesin-based release agents have been proposed in place of silicone-based release agents, but their release performance is not always satisfactory.
[0003]
The release agent composed of the polyethylene resin composition includes a release agent mainly composed of a low-density polyethylene resin (for example, see Patent Literatures 1 and 2) and a release agent mainly composed of a high-density polyethylene resin. Agents (see, for example, Patent Documents 3 and 4). A release agent containing a low-density polyethylene resin as a main component requires a large peeling force, and when used as a pressure-sensitive adhesive layer protective film, a part of the adhesive layer migrates to the surface of the release layer during peeling or peels off. The shape of the surface of the adhesive layer afterwards causes peeling called stick-slip that becomes pulse-like, or when heated in a state of being bonded to an adhesive, the peeling force increases or the adhesive force of the adhesive after peeling There is a problem such as lowering.
[0004]
Further, a release material using a thermoplastic elastomer-olefin elastomer containing polypropylene as a main component has been proposed (for example, see Patent Document 5), and a release material comprising a propylene ethylene copolymer and a polypropylene composition has been proposed (for example, Patent Document 6). However, these have high peeling strength and are not practically sufficient.
[0005]
[Patent Document 1]
JP-B-51-20205
[Patent Document 2]
Japanese Patent Publication No. Hei 11-508958
[Patent Document 3]
JP 2000-239624 A
[Patent Document 4]
JP-A-2000-119411
[Patent Document 5]
JP 2001-516790 A
[Patent Document 6]
JP 2000-218745 A
[0006]
[Problems to be solved by the invention]
The present invention has been made in view of the above circumstances, and its object is to include a silicone-based generated gas component, to have good releasability for various pressure-sensitive adhesives, and to have a small variation in peeling force. Another object of the present invention is to provide a release agent capable of maintaining a low peeling force even after being bonded to an adhesive and placed under heating.
[0007]
[Means for Solving the Problems]
That is, a first gist of the present invention is to provide an ethylene copolymer (A) comprising only ethylene and one or more α-olefins (excluding ethylene) and a propylene copolymer having a polypropylene content of 80% by weight or more. A mold release agent comprising a polymer (B), wherein the weight ratio of the ethylene copolymer (A) to the propylene polymer (B) is from 40:60 to 90:10.
[0008]
A second gist of the present invention resides in an adhesive laminate comprising an adhesive layer and a release layer, wherein the release layer comprises the above-mentioned release agent.
[0009]
A third aspect of the present invention is an adhesive laminated tape in which an adhesive layer of an adhesive laminate comprising an adhesive layer and a release layer is provided on at least one surface of a substrate so as to be in contact with the substrate, The adhesive layered tape is characterized in that the release layer comprises the release agent described above.
[0010]
A fourth gist of the present invention is an adhesive laminated tape in which a base material, a release layer, an adhesive layer, and a base material for an adhesive layer are laminated in this order, wherein the release layer comprises the above release agent. The present invention resides in an adhesive laminated tape characterized in that:
[0011]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the present invention will be described in detail. First, the release agent of the present invention will be described. The release agent of the present invention contains, as essential components, an ethylene copolymer (A) and a propylene polymer (B) described below.
[0012]
The ethylene-based copolymer (A) comprises only ethylene and one or more α-olefins (excluding ethylene). Examples of the α-olefin include propylene, 1-butene, 1-pentene, 3-methyl-1-butene, 1-hexene, 4-methyl-1-pentene, 3-methyl-1-pentene, 1-heptene, Α-olefins having about 3 to 20 carbon atoms, such as 1-octene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, and 1-eicosene. Among these, any one or more of propylene, butene, hexene, and octene are preferred. The copolymerization ratio of the α-olefin in the ethylene copolymer (A) is usually 1 to 25 mol%, preferably 3 to 15 mol%. If the copolymerization ratio of the α-olefin is too high and the ethylene content is too low, the heat resistance of the release agent tends to decrease.
[0013]
In the present invention, an ethylene copolymer (A) produced using a metallocene catalyst is particularly preferred. The metallocene-based catalyst provides a polyolefin having a narrow molecular weight distribution and a low molecular weight component, and can perform the copolymerization uniformly, so that the generation of components whose comonomer content is significantly different from the average composition is also suppressed. . Therefore, the release agent using the ethylene-based copolymer (A) produced using the metallocene-based catalyst has a low stickiness and can effectively gel at the time of cross-linking. Chemical resistance can be increased. The production of the ethylene copolymer (A) can be performed by any known polymerization method such as solution polymerization, gas phase polymerization, and slurry polymerization.
[0014]
Examples of the propylene-based polymer (B) used in the present invention include a propylene homopolymer, a propylene-α-olefin random copolymer, and a propylene-α-olefin block copolymer. Examples of the α-olefin include propylene, 1-butene, 1-pentene, 3-methyl-1-butene, 1-hexene, 4-methyl-1-pentene, 3-methyl-1-pentene, 1-heptene, Α-olefins having about 3 to 20 carbon atoms, such as 1-octene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, and 1-eicosene. The α-olefin used as a comonomer may be one type, or two or more types may be used in combination. The polypropylene content in the propylene-based polymer (B) is at least 80% by weight, preferably at least 85% by weight. When the polypropylene content is less than 80% by weight, the heat resistance decreases.
[0015]
The propylene-based polymer (B) is produced by a known method. For example, a Ziegler-Natta catalyst, a metallocene catalyst, or the like is used as a catalyst, and is manufactured by a known process such as a batch method, a gas phase method, or a slurry method.
[0016]
The melting point of the propylene-based polymer (B) is usually 80 ° C. or higher, preferably 120 ° C. or higher, from the viewpoint of the release agent and heat resistance, and the upper limit is usually 165 ° C. When the melting point is lower than 80 ° C., the heat resistance of the propylene-based polymer (B) is reduced because it is close to the melting point of the ethylene-based copolymer (A).
[0017]
In order to control the melting point of the propylene-based polymer (B), a method of changing the amount and type of the α-olefin copolymerized with propylene, and controlling the stereoregular distribution and positional isomerism of propylene in the propylene homopolymer A method of controlling the crystallization rate by adding a component compatible with the propylene-based polymer (B) such as a norbornene polymer, a method of using a crystallization nucleating agent to change the crystal system and the crystallization start temperature, and the like. , Various methods can be used.
[0018]
The weight average molecular weight of the propylene polymer (B) is usually 1 × 104Above, preferably 3 × 104That is all. Weight average molecular weight is 1 × 104If the value is less than the above, the mechanical strength of the release agent becomes small, and when the release layer composed of the release agent is peeled off from the adhesive layer, the release becomes poor, or the release layer is partially formed on the adhesive layer. May remain.
[0019]
In the present invention, a functional group can be added to the ethylene-based copolymer (A) and / or the propylene-based polymer (B) in order to obtain a release agent having excellent substrate adhesion. Functional groups include epoxy, acid anhydride, carboxyl, hydroxyl, amino, isocyanate, trimethoxysilyl, and other reactive functional groups, vinyl, isopropenyl, and (meth) acrylate groups. And a group having an unsaturated bond such as an allyl group.
[0020]
The functional group may be imparted by a conventional method, for example, by subjecting an ethylene copolymer (A) and / or a propylene polymer (B) to an addition reaction of a monomer having a functional group in the presence of a peroxide. Known peroxides such as ketone peroxide, hydroperoxide and diacyl peroxide are used as the peroxide. The amount of the functional group is usually at most 10 mol%, preferably at most 5 mol%. If the number of functional groups is too large, the release property of the release agent may be impaired.
[0021]
The release agent of the present invention contains an ethylene-based copolymer (A) and a propylene-based polymer (B) as essential components, but may further contain other additional components. When a functional group is provided to the ethylene-based copolymer (A) and / or the propylene-based polymer (B), examples of the additional component include a crosslinking agent, that is, a functional group that reacts with the functional group of the polyolefin. Compounds having a plurality of compounds are exemplified. The usage ratio of such a crosslinking agent is usually 0.1 to 10, preferably 0.5 to 2, as a molar ratio of the functional group of the polyolefin / the functional group of the crosslinking agent. When the molar ratio of the functional groups is out of this range, the number of remaining unreacted functional groups increases, and the releasability generally decreases. Other additional components include antiblocking agents, antioxidants, pigments, UV absorbers, fillers, antioxidants, and the like.
[0022]
The release agent of the present invention can be produced by blending various additional components with the ethylene-based copolymer (A) and the propylene-based polymer (B), if desired, and dissolving in a solvent or melt-kneading. . The weight ratio of the ethylene-based copolymer (A) to the propylene-based polymer (B) is from 40:60 to 90:10, preferably from 40:60 to 80:20. When the proportion of the propylene-based polymer (B) is less than the above range, the peeling force with the pressure-sensitive adhesive and the heat resistance of the release agent decrease, and when it exceeds the above range, the heat resistance of the release agent is excellent. The peel force increases.
[0023]
Next, the adhesive laminate and the adhesive laminated tape of the present invention will be described. The adhesive laminate of the present invention is an adhesive laminate comprising an adhesive layer and a release layer, wherein the release layer comprises the above-mentioned release agent. Then, it is used for various types of adhesive laminated tapes by appropriately using a base material.
[0024]
<Adhesive laminated tape-1>
In this embodiment, an adhesive laminate is provided on a substrate such that the adhesive layer and the substrate are adjacent to each other. That is, the layer configuration is base material / adhesive layer / release layer. In use, the release layer may be peeled off to expose the adhesive layer surface and adhere to the object.
[0025]
<Adhesive laminated tape-2>
In this embodiment, an adhesive laminate is provided on a substrate such that the release layer and the substrate are adjacent to each other, and a substrate for an adhesive layer is further provided on the adhesive layer side of the adhesive laminate. That is, the layer configuration is: base material / release layer / adhesive layer / base material. At the time of use, the substrate and the release layer may be peeled off, and the adhesive layer surface may be exposed to adhere to the target.
[0026]
<Adhesive laminated tape-3>
In this embodiment, the adhesive laminate is provided on both surfaces of the adhesive layer base material such that the base material and the adhesive layer are adjacent to each other. That is, the layer configuration is: release layer / adhesive layer / substrate / adhesive layer / release layer. In use, the release layer covering one adhesive layer is peeled off, the outer surface of the adhesive layer is exposed and adhered to one object, and then the release layer covering the other adhesive layer is applied. By peeling the mold layer and exposing the outer surface of the adhesive layer to adhere to the other object, it can be used as a double-sided adhesive tape for adhering two objects.
[0027]
<Adhesive laminated tape-4>
In this embodiment, a release layer is provided on the surface of the adhesive layer of the adhesive laminate. That is, the layer configuration is: release layer / adhesive layer / release layer. In use, one release layer is peeled off, one surface of the adhesive layer is exposed and adhered to one object, and then the other release layer is peeled and the other surface of the adhesive layer is exposed and the other Can be used as a double-sided adhesive tape for adhering two objects to each other.
[0028]
<Adhesive laminated tape-5>
In this embodiment, an adhesive layer is provided on one surface of the base material, a release layer is provided on the other surface, and the adhesive laminate is wound into a roll without using the above-mentioned adhesive laminate. . That is, the layer configuration is: adhesive layer / substrate / release layer. Since the release layer has adhesiveness to the base material, when used, it may be unwound and peeled off at the interface between the adhesive layer and the release layer to expose the adhesive layer surface and adhere to the object.
[0029]
In any of the above-described adhesive laminated tapes, the thickness of the release layer is increased, or the release layer is integrated with the release layer base material having adhesion to the release layer, and the release is performed. Mechanical strength at the time of peeling the layer can be ensured.
[0030]
In addition, in the case of the adhesive laminated tape of any configuration, the release layer substrate is used as a release layer, and the adhesive layer substrate is used as an integral part of the adhesive layer, if necessary. The base material for adhesion is required to have adhesion and mechanical strength with a release agent, and the adhesion layer base material is required to have adhesion and mechanical strength with an adhesive. The base material used for the above-mentioned wound adhesive laminated tape serves both as a base material for the release layer and a base material for the adhesive layer.
[0031]
As the base material used for the adhesive laminated tape including the wound adhesive laminated tape, a common substrate, for example, polyethylene terephthalate, polyester such as polybutylene terephthalate, polypropylene, polyethylene, polyolefin such as polymethylpentene, polycarbonate, etc. Paper, such as a film made of the above resin, glassine paper, high-quality paper, coated paper, impregnated paper, and synthetic paper; and metal foil such as aluminum and stainless steel. The thickness of the substrate is usually 10 to 100 μm, preferably 25 to 50 μm.
[0032]
The base material may be subjected to a corona treatment, a plasma treatment, a flame plasma treatment, or the like, or a primer layer or the like, in order to improve the adhesiveness with the adhesive layer or the release layer. As the primer layer, use of a polymer material (a so-called anchor coating agent) such as polyethylene, polypropylene, styrene-based copolymer, polyester, polyurethane, polyvinyl alcohol, polyethyleneimine, polyacrylate, polymethacrylate, or a modified product thereof. Can be done.
[0033]
In the production of the above tape, the formation of the adhesive layer and the release layer may be performed by a conventional method. Usually, the release layer is formed by applying a release agent onto a base material, melt-extruding the release agent into a sheet from an extruder and laminating it on the base material, or extruding a base material and a release agent. It is formed by coextrusion from a machine.
[0034]
As the pressure-sensitive adhesive, those usually referred to as pressure-sensitive adhesives such as acrylic, rubber, polyurethane, and silicone are mainly used, but other pressure-sensitive adhesives can also be used. The adhesive layer is formed by applying the adhesive as it is or as a solution on the base material or the release layer provided on the base material, transferring the adhesive layer applied to another base material by transfer coating, It can be formed by co-extruding a material, a release agent and an adhesive with an extruder.
[0035]
In the production of the laminate, it is excellent in terms of productivity to melt-extrude a plurality of layers at the same time, such as by co-extrusion of the base material layer and the release layer.
[0036]
When the release layer is formed by a melt extrusion method, the melt index of the release agent at 230 ° C. and 2.16 kgf is usually 0.5 to 40 g / 10 minutes, preferably 1 to 20 g / 10 minutes. . Extrusion moldability is reduced if the melt index is larger or smaller.
[0037]
In the case where the base material and the release layer, and further, the base material, the release layer and the adhesive layer are co-extruded, they are continuously stretched uniaxially or biaxially to reduce the thickness and improve the strength. It can also be done. The stretching ratio is usually 2 to 10 times. The thickness of the release layer is usually 0.5 to 150 μm, preferably 0.5 to 10 μm, and more preferably 0.5 to 5 μm. If the thickness of the release layer is too small, it is difficult to ensure uniformity of the thickness, and if it is too large, the elastic modulus of the laminate decreases.
[0038]
【Example】
Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited to the following examples unless it exceeds the gist of the present invention. In addition, the measuring method of the physical property in an Example was performed by the following methods.
[0039]
(1) Evaluation of releasability at normal temperature:
After preparing the adhesive laminated tape, it is cured at 25 ° C. and 50 RH for 72 hours to be stabilized. Next, the adhesive laminated tape is cut into a width of 25 mm and a length of 150 mm, the back surface of the base material adjacent to the adhesive layer is fixed to a stainless steel plate, and a peeling tester is used at 300C / 50 RH in an atmosphere of 25 ° C and 50 RH. The interface between the release layer and the pressure-sensitive adhesive layer is peeled 180 degrees at a pulling speed of min, and the force (normal peel force) at that time is measured. The results were expressed as the average of five measurements. The smaller the normal release force, the easier the release from the adhesive layer and the better the releasability at normal temperature.
[0040]
(2) Evaluation of releasability under heating:
After preparing the adhesive laminated tape, it is cured at 25 ° C. and 50 RH for 72 hours to be stabilized. Next, the adhesive laminated tape was weighed at 20 g / cm.2Hold at 100 ° C. for 1 hour under load. Next, after cooling at room temperature, the adhesive laminated tape was cut into a width of 25 mm and a length of 150 mm, the back surface of the base material adjacent to the adhesive layer was fixed to a stainless steel plate, and a peel tester was used at 25 ° C. The interface between the release layer and the adhesive layer is peeled off by 180 degrees at a pulling speed of 300 mm / min under an atmosphere of 50 RH. The force at that time (heat peeling force) is measured. The results were expressed as the average of five measurements. The smaller the heat peeling force, the easier the peeling from the adhesive layer, and the better the releasability under heating.
[0041]
Further, as the ethylene copolymer (A), the propylene polymer (B) and the pressure-sensitive adhesive, those described below were used. The molecular weight and the melting point were measured by the following method.
[0042]
(3) Molecular weight:
Calculated by gel permeation chromatography using a calibration curve made with standard polystyrene. The measurement conditions are as shown in Table 1 below.
[0043]
[Table 1]
Model: Waters, GPC150C
Solvent: orthodichlorobenzene
Temperature: 140 ° C
Injection concentration: 0.1% by weight
Injection volume: 200 μl
Flow rate: 1.0 ml / min
Detector: IR. 3.42 μm wavelength
Column: AD806MS, manufactured by Showa Denko KK
Column size: 30cm x 3
Calculation method of molecular weight: Calculated as molecular weight of linear polyethylene by universal calibration method
[0044]
(4) Measurement of melting point:
The measurement was performed as follows using a DSC “DSC-7” manufactured by PerkinElmer. That is, first, after preliminarily constant temperature at 200 ° C. for 10 minutes, the temperature is cooled to −20 ° C./min to 20 ° C. and constant temperature for 5 minutes. Next, the temperature is raised at 20 ° C./min. The endothermic peak position of the DSC peak accompanying the melting in this temperature raising process is defined as the melting point. The measurement was performed in a nitrogen atmosphere, and the sample weight was 7 mg.
[0045]
(EP1)
It is an ethylene-propylene copolymer produced using a metallocene catalyst. The composition determined by H-NMR was ethylene / propylene = 74/26 (weight ratio), the weight average molecular weight determined by GPC was 97000, the ratio of the weight average molecular weight to the number average molecular weight was 2.3, and the density was 0.3. 863 g / cc and MFR was 3.2 g / 10 min.
[0046]
(EP2)
It is an ethylene-propylene copolymer produced using a metallocene catalyst. The composition determined by H-NMR was ethylene / propylene = 73/27 (weight), the weight average molecular weight determined by GPC was 71,000, the ratio of the weight average molecular weight to the number average molecular weight was 2.1, and the density was 0.865 g. / Cc, MFR was 6 g / 10 min.
[0047]
(EP3)
It is an ethylene-hexene random copolymer produced using a metallocene catalyst. The composition determined by H-NMR was ethylene / hexene = 90/10 (molar ratio), the weight average molecular weight determined by GPC was 70100, the ratio of the weight average molecular weight to the number average molecular weight was 2.3, and the density was 0.3. 880 g / cc and MPR were 3.5 g / 10 min.
[0048]
(EP4)
After mixing 100 parts by weight of the above-mentioned EP, 3 parts by weight of 2-hydroxyethyl methacrylate, and 0.15 parts by weight of 2,5-dimethyl-2,5-di-tert-butyl peroxide: kneading with Labo Plastomill. A modified ethylene-hexene random copolymer having a hydroxyl group, obtained by kneading at 180 ° C. for 3 minutes at a rotation speed of 60 rpm in a nitrogen atmosphere using a machine (manufactured by Toyo Seiki Co., Ltd.). 1724 cm by FT-IR spectrum− 1The content of 2-hydroxyethyl methacrylate estimated from the measured value of the characteristic absorption intensity of the carbonyl group was 0.9% by weight. The density was 0.881 g / cc and the MFR was 4.2 g / 10 minutes.
[0049]
(PP1)
Propylene was polymerized using a metallocene catalyst. The weight average molecular weight determined by GPC was 394400, and the ratio of the weight average molecular weight to the number average molecular weight was 2.4. Melting point was 155 ° C.
[0050]
(PP2)
Propylene and ethylene (weight ratio 97.4: 2.6) were polymerized using a Ziegler-Natta catalyst. The weight average molecular weight determined by GPC was 397000, and the ratio of the weight average molecular weight to the number average molecular weight was 4.2. Melting point was 123 ° C.
[0051]
(PP3)
Propylene and ethylene (weight ratio 94.0: 6.0) were polymerized using a Ziegler-Natta catalyst. The weight average molecular weight determined by GPC was 210,000, and the ratio of the weight average molecular weight to the number average molecular weight was 5.3. Melting point was 109 ° C.
[0052]
(Polyacrylate ester-based adhesive A)
100 parts by weight of n-butyl acrylate and 5 parts by weight of acrylic acid are dissolved in toluene and polymerized by a conventional method using benzoyl peroxide to obtain a solution of an acrylic polymer having a weight average molecular weight of about 500,000 (solid content: 50 % By weight). Ethyl acetate was added thereto so that the solid content became 30%, and then 3 parts by weight of an isocyanate-based cross-linking agent was added per 100 parts by weight of the acrylic polymer to obtain a polyacrylate-based pressure-sensitive adhesive A.
[0053]
Example 1
Propylene polymer 1 (PP1) and ethylene propylene copolymer 1 (EP1) were blended at the weight ratio shown in Table 1, and kneaded using a twin screw extruder at 210 ° C. for an average residence time of 3 minutes. A mold was produced. This release agent was extruded from a T-die molding machine at 220 ° C. to obtain a release sheet composed of only a release layer. The thickness of the release sheet was 50 μm.
[0054]
Using an applicator (manufactured by Taiyo Kiki Co., Ltd .: for 100 μm), a polyacrylic ester-based adhesive solution at 23 ° C. on a 25 μm thick polyester film so that the coating liquid has a thickness of 100 μm and a width of 8 cm. A was applied. Two seconds after the application, drying was performed for 2 minutes in a dryer (Safeben Dryer N50S5, manufactured by Satake Chemical Instruments Co., Ltd.) heated to 80 ° C. Then, it was taken out and cooled to room temperature to obtain an adhesive sheet comprising an adhesive layer and a substrate.
[0055]
Next, two minutes after cooling to room temperature, the pressure-sensitive adhesive sheet was placed on the release sheet, and a 2 kg roller was reciprocated once at a speed of 30 cm / min. Was crimped. Thus, the adhesive laminated tape 1 in which the release layer, the adhesive layer, and the substrate were laminated in this order was produced.
[0056]
Nitto Denko Corporation: N502 tape was used as an adhesive sheet, placed on the release sheet, and a 2 kg roller was reciprocated from above at a speed of 30 cm / min to press the adhesive layer and the release layer. Thereby, the adhesive laminated tape 2 in which the release layer, the adhesive layer, and the base material were laminated in this order was produced.
[0057]
Examples 2 to 6
A propylene polymer and an ethylene α-olefin polymer were blended at a weight ratio shown in Table 1, and kneaded using a twin-screw extruder at 230 ° C. for an average residence time of 3 minutes to produce a release agent.
[0058]
From a T-die molding machine, an equal weight blend of LLDPE (density 0.93 g / cc, melt index 2.0 g / 10 min) and release agent-containing propylene polymer and the above release agent are coextruded at 240 ° C. A release sheet comprising a substrate and a release layer was obtained. The thickness of the substrate was 25 μm, and the thickness of the release layer was 4 μm.
[0059]
In Example 6, a zeolite-based anti-blocking agent (average particle size: 2 μm) was mixed with 100 parts by weight of the release agent in the production of the release agent so as to be 2 parts by weight.
[0060]
Using an applicator (manufactured by Taiyo Kiki Co., Ltd .: for 100 μm), apply a polyacrylate pressure-sensitive adhesive solution A on a 25 μm-thick polyester film so that the coating liquid has a thickness of 100 μm and a width of 8 cm. It was applied at 23 ° C. Two seconds after the application, drying was performed for 2 minutes in a dryer (Safetaken Dryer N50 S5, manufactured by Satake Chemical Instruments Co., Ltd.) heated to 80 ° C. Then, it was taken out and cooled to room temperature to obtain an adhesive sheet comprising an adhesive layer and a substrate.
[0061]
Next, two minutes after cooling to room temperature, the above-mentioned pressure-sensitive adhesive sheet was placed on the release sheet, and a 2-kg roller was reciprocated from the top at a speed of 30 cm / min. Was crimped. As a result, an adhesive laminated tape in which the substrate, the release layer, the adhesive layer, and the substrate were laminated in this order was prepared.
[0062]
Nitto Denko Corporation: N502 tape was used as an adhesive sheet, placed on the release sheet, and a 2 kg roller was reciprocated from above at a speed of 30 cm / min to press the adhesive layer and the release layer. Thereby, the adhesive laminated tape 2 in which the release layer, the adhesive layer, and the base material were laminated in this order was produced.
[0063]
Example 7
A propylene polymer and a functional group-modified ethylene 1-hexene copolymer (EP-4) shown in Table 1 were dissolved in toluene heated to 60 ° C, and then cooled to give a 2% by weight toluene solution of a release agent. Was prepared. To this release agent solution, "NY718A" (a 76% by weight butyl acetate solution of trifunctional isocyanate obtained by adding 3 mol of aliphatic diisocyanate to 1 mol of triol) manufactured by Mitsubishi Chemical Corporation was added, and a release agent containing a crosslinking agent was added. An agent solution was prepared. This solution contains a crosslinking agent in an amount such that the isocyanate group becomes 1.1 equivalents to 2-hydroxyethyl methacrylate contained in the polyolefin (PE-3).
[0064]
The above toluene solution was applied on a 25 μm-thick polyester film so that the thickness after drying became 0.1 μm, and dried in an atmosphere at 150 ° C. for 1 minute to obtain a release sheet.
[0065]
Then, a polyacrylate pressure-sensitive adhesive solution A is applied on the release layer of the release sheet so that the thickness after drying becomes 40 μm, and dried at 80 ° C. for 5 minutes. Was formed. A polyester film having a thickness of 25 μm was adhered to the adhesive layer as a substrate to prepare an adhesive laminated tape 1 in which a substrate, a release layer, an adhesive layer, and a substrate were laminated in this order. Further, an adhesive laminated tape 2 was produced in the same manner as in Example 2.
[0066]
Comparative Examples 1-3
Adhesive laminated tapes 1 and 2 were obtained in exactly the same manner as in Example 1 except that the compositions shown in Table 1 were used as release agents.
[0067]
Comparative Example 4
In the same manner as in Example 2 except that ethylene α-olefin copolymer (EP1) was used as a release agent, and only the substrate was LLDPE (density 0.93 g / cc, melt index 2.0 g / 10 min). Thus, adhesive laminated tapes 1 and 2 in which a substrate, a release layer, an adhesive layer, and a substrate were laminated in this order were produced.
[0068]
[Table 2]
[0069]
【The invention's effect】
According to the present invention described above, it does not contain a silicone-based gas generating component, has good releasability for various pressure-sensitive adhesives, has a small variation in peeling force, and is bonded to a pressure-sensitive adhesive under heating. The present invention provides a release agent capable of maintaining a low peel force even after being placed in the mold, and the industrial value of the present invention is remarkable.
Claims (7)
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JP2003145663A JP4269779B2 (en) | 2003-05-23 | 2003-05-23 | Release agent and adhesive laminated tape |
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JP2007152867A (en) * | 2005-12-08 | 2007-06-21 | Lintec Corp | Release sheet |
JP2007320979A (en) * | 2006-05-30 | 2007-12-13 | Dainippon Printing Co Ltd | Self-adhesive laminate |
WO2011155534A1 (en) * | 2010-06-11 | 2011-12-15 | 日東電工株式会社 | Adhesive sheet and use of same |
JP2012512952A (en) * | 2008-12-19 | 2012-06-07 | スリーエム イノベイティブ プロパティズ カンパニー | Method for manufacturing adhesive article |
WO2012105339A1 (en) * | 2011-02-04 | 2012-08-09 | 日東電工株式会社 | Release agent, manufacturing method therefor, release material, and pressure-sensitive adhesive tape |
WO2012105342A1 (en) * | 2011-02-04 | 2012-08-09 | 日東電工株式会社 | Pressure-sensitive adhesive tape |
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JPWO2014103781A1 (en) * | 2012-12-26 | 2017-01-12 | 三井化学東セロ株式会社 | Release film and method for producing the same |
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JP4590346B2 (en) * | 2005-12-08 | 2010-12-01 | リンテック株式会社 | Release sheet |
JP2007152867A (en) * | 2005-12-08 | 2007-06-21 | Lintec Corp | Release sheet |
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JP2017534483A (en) * | 2014-09-22 | 2017-11-24 | ダウ グローバル テクノロジーズ エルエルシー | Foil wrap with adhesive properties |
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