JP2004342708A - Component recognizing device and surface mounting machine equipped therewith - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component recognizing device that can specify the position of the front end section of a projecting portion protruded from a component toward the image picking-up side of an image picking-up means, and to provide a surface mounting machine equipped with the device. <P>SOLUTION: The component recognizing device is provided with a line sensor 35 which picks up the image of a component sucked by means of a suction head and a pluralities of LEDs 31 which project light rays upon the component at the time of picking up the image of the component. The device is also provided with a refractive lens 32 which makes the natural light rays S of the LEDs 31 parallel to a prescribed direction, respectively refracts the parallel rays of light into planar refracted rays of light H, and concentrates the planar refracted rays of light H to a fixed position. The line sensor 35 is positioned so that the refractive lens 32 may concentrate the planar refracted rays of light H to the apex of a ball terminal BT protruded from the component toward the image picking-up side of the line sensor 35 and, at the same time, the sensor 35 may receive reflected rays of light R reflected by the apex of the ball terminal BT when the apex of the ball terminal BT is contained in the image picking-up range of the sensor 35. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention provides a head unit having a head for picking up a component, an imaging unit including a line sensor arranged on a movement path of the head unit and imaging a component sucked on the head while the head unit moves, A component recognizing device comprising: a plurality of illuminating means for irradiating the component with light when the component is imaged; and configured to recognize the component attracted to the head based on the image of the component captured by the image capturing means. Things.
[0002]
[Prior art]
Conventionally, a head unit having a component suction head sucks components such as ICs from a component supply unit, transports the components onto a printed circuit board that has been positioned, and mounts them at a predetermined position on the printed circuit board. A mounting machine (hereinafter, referred to as a mounting machine) is generally known.
[0003]
In such a mounting machine, there is a certain degree of variation in the position of the component when the component is sucked by the head, and it is required to correct the mounting position according to the shift of the component suction position. For this reason, the picked-up component is recognized, and the shift of the suction position with respect to the head is detected.
[0004]
As an apparatus for performing such component recognition, for example, an imaging unit including a line sensor and an illuminating unit are installed on a base of a mounting machine, and a head unit after picking up a component is moved on the imaging unit, and an illuminating unit is moved. While irradiating the component-recognition light uniformly on the imaging-side surface of the suction component, the imaging unit performs imaging to capture component images line by line, and performs component recognition based on the captured image. An apparatus configured as described above has been proposed (see Patent Document 1).
[0005]
[Patent Document 1]
JP-A-12-299600
[0006]
[Problems to be solved by the invention]
By the way, some of the electronic components include a portion protruding toward the imaging side of the imaging unit. When such an electronic component is mounted on a printed circuit board, the protruding portion of the electronic component may be provided. It is necessary to detect the position. For example, as shown in FIG. 5, the positions of the component main body BH and the hemispherical ball terminals BT protruding on the component main body BH are obtained based on the image obtained by the image pickup means, and defects such as chipping in the ball terminals BT are obtained. In addition to examining the presence / absence of a component, the displacement of the component suction position is examined to determine a corresponding correction amount, and the mounting position of the ball terminal BT with respect to the printed circuit board is adjusted. Thus, when detecting the position of the ball terminal BT, it is necessary to detect the vertex position of the ball terminal BT.
[0007]
Therefore, in order to three-dimensionally recognize the ball terminal BT using the component recognition device of Patent Document 1 described above, the illumination means is deflected from one vertically below the component to one side in the horizontal direction, and the component is irradiated obliquely from below. It is conceivable that the imaging means is deflected to the other side so that the reflected light from the component is captured obliquely downward on the other side. In this case, in the component recognition device of Patent Document 1, since the illumination unit uniformly irradiates light to the component, when the ball terminal BT is imaged, it is shown in FIG. 6B. As described above, the shadow BK of the ball terminal BT is generated, and the outline of the ball terminal BT is concealed by the shadow BK. As a result, it is difficult to specify the vertex position of the ball terminal BT. There is.
[0008]
Further, in a component having a lead on the side of the component, it is necessary to specify the position of the tip of the lead in order to detect an abnormality such as breakage of the lead. After the lead extends outward from the component side, if the tip is formed to be bent and protruded toward the imaging side of the imaging means, a portion extending outward from the component side of the lead is If the shadow of the tip of the projecting portion formed by bending from this portion is projected, it may be difficult to identify the tip of the lead for the same reason as described above.
[0009]
The present invention has been made in view of the above-described problems, and provides a component identification device and a mounting device capable of specifying the position of the tip of a projecting portion protruded from a component toward an imaging side of an imaging unit. The purpose of the present invention is to provide a surface mounter equipped with the above.
[0010]
[Means for Solving the Problems]
In order to solve the above-described problems, the present invention provides a head unit having a component suction head, and a line sensor arranged on a movement path of the head unit, and imaging a component sucked by the head while the head unit moves. And a plurality of illuminating means for irradiating the component with light when the component is imaged, so that the component adsorbed on the head is recognized based on the image of the component captured by the image capturing means. In the configured component recognition device,
A first light condensing unit that changes the direction of light so that the irradiation light of each of the illumination units is substantially parallel to the scanning direction of the imaging unit,
A second light collecting means for collecting the light substantially collimated by the first light collecting means at a certain position,
When the tip of the projecting portion protruding from the component toward the imaging side of the imaging unit is included in the imaging range of the imaging unit, the second light collection unit is substantially parallel to the first light collection unit. The light that has been converted into light is condensed at or near the tip of the projecting portion of the component, and the imaging unit is located at a position where the reflected light reflected at or near the tip of the projecting portion can be received. It is characterized by being provided.
[0011]
According to the present invention, when the distal end of the projecting portion projecting from the component is included in the imaging range of the imaging unit, the second focusing unit is converted into substantially parallel light by the first focusing unit. The imaging means is disposed at a position where the reflected light can be received at or near the tip of the projecting portion of the component and at or near the tip of the projecting portion. Therefore, the imaging means captures an image in which the portion corresponding to the tip of the protruding portion within the imaging range is extremely bright.
[0012]
On the other hand, since the light is condensed at or near the front end of the projecting portion by the second light condensing means, a portion other than the front end of the projecting portion is predetermined by the second light condensing means. As a result of irradiating the light radiated at the light condensing angle in a diffused state, the imaging means captures an image in which the portion corresponding to the protruding portion other than the tip portion in the imaging range is extremely dark.
[0013]
Therefore, the above-described invention can capture an image in which the brightness of the vicinity of the tip of the projecting portion of the component and the brightness of the other portion are significantly different, so that the position of the tip of the projecting portion with respect to the component is specified. be able to.
[0014]
The component identification device further includes a reflection unit that reflects light reflected at or near the tip of the protruding portion, and the imaging unit is disposed so as to be able to receive the light reflected by the reflection unit. It is preferred that
[0015]
According to this configuration, by adjusting the angle of reflection of the light by the reflection unit, it is possible to change the arrangement position of the imaging unit that requires a relatively large space, so that it is possible to form a compact component recognition device as a whole. It becomes.
[0016]
In the component identification device, the second light condensing means is configured to condense light emitted from each illumination means to a vertex of a spherical surface protruding from the component toward an imaging side of the imaging means. It is preferred that
[0017]
According to this configuration, the position of the vertex of the spherical surface protruding from the component can be specified.
[0018]
Further, the present invention includes the component recognition device, a component supply unit that supplies a component for mounting, and a substrate transport unit that carries a substrate to be mounted to a mounting operation position, and the head supplies the component from the component supply unit. The surface mounter is configured to adsorb a component, perform recognition by a component recognition device, and then mount the component on the substrate.
[0019]
According to this surface mounter, in the process in which the component sucked from the component supply unit by the head is conveyed to the substrate, the component is recognized by the component recognition device, so that the component is recognized in accordance with the recognized component position. The component can be mounted on the board while correcting the displacement.
[0020]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.
[0021]
1 and 2 schematically show a mounting machine equipped with a component recognition device according to the present invention. In these figures, a conveyor 2 for transporting a printed board is arranged on a base 1 of the mounting machine main body, and a printed board P is transported on the conveyor 2 and stopped at a predetermined mounting work position. ing. In the front-rear direction (the vertical direction in FIG. 1) of the conveyor 2, component supply units 3 are arranged. Each of the component supply units 3 is provided with a mounting seat 16 in parallel with the conveyor 2. A large number of feeders for supplying various parts are arranged on each mounting seat 16, and in the example shown in the figure, a large number of tape feeders 4 are fixed in parallel and in a state where each is positioned. Each of the tape feeders 4 is configured such that small pieces of electronic components such as an IC, a transistor, and a capacitor are housed at predetermined intervals, and a tape held is taken out from a reel. The tape is intermittently sent out as a component is picked up by a suction head 13 described later.
[0022]
As shown in FIGS. 1 and 2, a component mounting head unit 5 is provided above the base 1, and the head unit 5 is mounted in the X-axis direction (a direction parallel to the conveyor 2) and the Y-axis direction (the Y-axis direction). 1 (in a direction orthogonal to the conveyor 2 in FIG. 1).
[0023]
That is, the support member 6 of the head unit 5 is arranged on the base 1 so as to be movable on a fixed rail 7 in the Y-axis direction, and the head unit 5 is placed on the support member 6 along the guide member 8 in the X-axis direction. It is movably supported. Then, the Y-axis servo motor 9 moves the support member 6 in the Y-axis direction via the ball screw 10, and the X-axis servo motor 11 moves the head unit 5 in the X-axis direction via the ball screw 12. It is being done.
[0024]
A plurality of suction heads 13 for mounting components are mounted on the head unit 5, and in this embodiment, eight suction heads 13 are arranged in a line in the X-axis direction. Further, the suction head 13 can move in the Z-axis direction (FIG. 2) and rotate around the R-axis (nozzle center axis) with respect to the frame of the head unit 5, respectively. Means and a rotary drive means. A suction nozzle 14 is provided at the lower end of the suction head 13 in the Z-axis direction (FIG. 2), and a negative pressure is supplied to the suction nozzle 14 from a negative pressure supply unit (not shown) when components are sucked. The components are attracted by the suction force of the pressure.
[0025]
A component recognition device 20 is provided within the movement range of the head unit 5 and in the vicinity of the component supply unit 3 on the base 1. The lower surface of the component sucked by the suction nozzle 14 by the component recognition device 20 is provided. An image is taken.
[0026]
3A and 3B show the component recognition device 20 of FIG. 1, wherein FIG. 3A is a perspective view showing a path of light emitted through the refraction lens 32, and FIG. FIG. In FIG. 3B, the component recognition device 20 includes a base plate 21 fixed to the base 1. At the upper right end of the base plate 21, an illuminating means 30 for irradiating the lower surface of the component D sucked by the suction nozzle 14 with light for imaging is fixed.
[0027]
In the present embodiment, the illumination means 30 includes a total of 40 LEDs 31 arranged in 5 columns and 8 rows. These LEDs 31 are fixed to the base plate 21 so as to irradiate the lower surface of the component D conveyed to a substantially central position in the X direction of the base plate 21 with natural light S at an inclination angle of about 40 ° on the XZ plane. . A refraction lens 32 is provided on the natural light S irradiation path of each LED 31.
[0028]
The refraction lens 32 converts the natural light S emitted from each of the LEDs 31 into a parallel light or a substantially parallel light that is substantially orthogonal to a predetermined plane (for example, a plane connecting the base plate 21 or the tip of the surface of the refraction lens 32 on the LED 31 side). The first light condensing means is formed by forming the LED 31 side surface into a convex shape at 40 locations corresponding to each LED 31 so as to be bent when light enters so that In addition, a lens is provided on the LED 31 itself, and when the irradiation light from the LED 31 is parallel light or substantially parallel light, each LED 31 is so arranged that the irradiation light from each LED 31 becomes parallel light or substantially parallel light as a whole. Is attached to the base plate 21. In this case, the LED 31 serves as both the illuminating unit and the first condensing unit, and the surface of the refracting lens 32 on the LED 31 side has a flat shape.
[0029]
The surface of the refraction lens 32 on the side opposite to the LED 31 is formed in a convex shape in a semi-cylindrical shape. As shown in FIG. The light is bent while maintaining parallel or substantially parallel in the axial direction, becomes flat bent light H, and is condensed at a linear condensing position SI in the Y-axis direction. The position of the suction head 13 in the Z-axis direction is adjusted so that the position of the lower surface of the component D coincides with the focusing position SI. Further, as shown in FIG. 3A, on the light condensing position SI, high light condensing portions SI1, SI2, SI3 corresponding to the arrangement pitch of the LEDs 31 in the Y axis direction are formed, and bright portions in the Y axis direction, Since dark portions are alternately generated, a diffuser 33 for diffusing the planar bending light H only in the Y-axis direction is provided between the refractive lens 32 and the component D. Accordingly, each planar bending light H spreads in a fan shape in the Y-axis direction toward the component D side, and has substantially uniform brightness in the Y-axis direction.
[0030]
That is, the natural light S emitted from each of the LEDs 31 of the illumination means 30 is bent by the refraction lens 32 and the diffuser 33 into the planar bending light H, and the planar bending light H is condensed on the lower surface of the component D. By diffusing in the Y-axis direction, each planar bending light H is irradiated on the condensing position SI extending in the Y-axis direction on the lower surface of the component D. Each planar bending light H applied to the light condensing position SI is reflected to the left, which is symmetric with respect to the YZ plane with respect to the light condensing position SI, and the reflected light R is reflected by a mirror 34 as a reflecting means. Thus, the light is reflected downward.
[0031]
A line sensor 35 is fixed to the base plate 21 so that the light reflected by the mirror 34 can be received.
[0032]
The component recognition device 20 configured as described above, in other words, makes the natural light S of each LED 31 of the lighting means 30 parallel to a predetermined direction, and bends the parallel light into planar bending light H, respectively. A refracting lens 32 for condensing the planar bending light H to the light condensing position SI is provided, and a line sensor 35 is provided at a position where the reflected light R reflected at the light condensing position SI can be received.
[0033]
Further, an auxiliary lighting means 30a for irradiating the lower surface of the component D with natural light S from below vertically is fixed to the upper end of the base plate 21. The auxiliary lighting device 30a includes forty auxiliary LEDs 31a having a configuration similar to that of the LED 31, and an auxiliary refraction lens 32a having a configuration similar to that of the refraction lens 32 and the diffuser 33 in an irradiation direction of the auxiliary LED 31a. An auxiliary diffuser 33a is provided, and each of these components irradiates auxiliary light to the light condensing position SI of the component D as necessary.
[0034]
In order to explain the component recognition operation of the component recognition device 20 configured as described above, FIG. 4 will be described with an example of a case where a ball terminal BT projects downward as shown in FIG. It will be described with reference to FIG.
[0035]
FIG. 4 is a front view showing an imaging state of the top of the ball terminal BT in the component recognition device 20 of FIG. A plane connecting an unillustrated light-receiving slit of the line sensor 35 and a line-up image sensor on a plane P2 that forms an angle A with the center plane P1 of the planar bending light H from the illumination means 30 is made to coincide. When the line sensor 35 is arranged as described above, the normal of the intersection line L1 on the plane P0 that passes through the intersection line L1 between the plane P1 and the plane P2 and bisects the inner angle of the planes P1 and P2, and the image of the component The part where the normal line of the part coincides is taken into the line sensor 35 as an image.
[0036]
FIG. 4A shows a case where the intersection line L1 is shifted from the light condensing position SI. Even in this case, the suction head 13 is moved so that the top of the ball terminal BT passes through a portion where the plane P2 passing through the imaging line of the line sensor 35 intersects the planar bending light H (ZH range in the Z-axis direction). The height in the Z-axis direction is adjusted based on the data of the component type and the layout data of the component recognition device 20 before the component type sucked by the suction head 13 is changed. The suction head 13 moves in a direction orthogonal to the arrangement direction (Y-axis direction) of the image sensors of the line sensor 35 while maintaining the adjusted Z-axis height, and the ball terminals BT arranged on the lower surface of the component body BH. Are sequentially captured by the line sensor 35 through the imaging range SH of the line sensor 35, and are recognized as images.
[0037]
Part of the planar bending light H is reflected at the top of the ball terminal BT, and the reflected light R is captured by the line sensor 35. If the length between the intersection line L1 and the light condensing position SI is shorter than the length between the light condensing position SI and the refraction lens 32, the top of the ball terminal BT can be brightly illuminated. It is desirable that the intersection line L1 and the light condensing position SI coincide with each other. By doing so, an image in which the ball terminal BT is significantly brightly illuminated can be obtained. However, in order to make the intersection line L1 coincide with the light condensing position SI as described above, high precision is required for adjusting the height of the suction head 13 in the Z-axis direction.
[0038]
On the other hand, since the refraction lens 32 has an aberration, a cylindrical converging position SI ′ extending in the Y-axis direction may be formed around the converging position SI (see FIG. 4B). Even in this case, if the height of the suction head 13 in the Z-axis direction is adjusted so that the plane P2 passing through the imaging line of the line sensor 35 passes through the light condensing position SI, the top of the ball terminal BT is imaged. It becomes possible.
[0039]
As described above, according to the component recognition device 20, when the tip of the ball terminal BT protruding from the component body BH is included in the imaging range of the line sensor 35, the LED 31 irradiates the refractive lens 32. The natural light S is bent into the plane bending light H, and the plane bending light H is condensed at or near the apex of the ball terminal BT, and the reflected light R reflected at or near the apex of the ball terminal BT is formed. Since the line sensor 35 is provided at a position where light can be received, the line sensor 35 captures an image in which a portion corresponding to the vertex of the ball terminal BT in the imaging range SH, that is, an image near the vertex TH is extremely bright. (See FIG. 6A).
[0040]
On the other hand, since the planar bending light H is condensed on the vertex of the ball terminal BT or in the vicinity thereof by the refraction lens 32, a predetermined condensing is performed by the refraction lens 32 on a portion other than the vertex of the ball terminal BT. As a result of irradiating the planar bending light H radiated at an angle in a diffused state, the line sensor 35 captures an image in which a portion corresponding to a portion other than the apex of the ball terminal BT in the imaging range SH is extremely dark. .
[0041]
Therefore, the component recognition device 20 can capture an image in which the brightness near the vertex portion TH of the ball terminal BT is significantly different from that of the other portions, and thus specifies the vertex position of the ball terminal BT with respect to the component body BH. be able to.
[0042]
The component recognition device 20 further includes a mirror 34 that reflects the planar bending light H reflected at or near the vertex of the ball terminal BT, and the line sensor 35 receives the reflected light R reflected by the mirror 34. Since the arrangement is made possible, by adjusting the reflection angle of the planar bending light H by the mirror 34, the arrangement location of the line sensor 35 requiring a relatively large space can be changed. As a result, a compact component recognition device 20 can be formed.
[0043]
In the above embodiment, the mirror 34 reflects the reflected light R reflected from the component D and guides the reflected light R to the line sensor 35. However, instead of or in addition to this configuration, the mirror 34 emits the reflected light R through the diffuser 33. A mirror for reflecting the planar bending light H to be guided to the component D may be provided.
[0044]
Further, in addition to the configuration of the component recognition device 20 of each of the above-described embodiments, the line sensor 35 is swingably supported on the base plate 21 around an axis parallel to the Y axis as shown by an arrow Y1 in FIG. If a displacement mechanism (not shown) for supporting the line sensor 35 so as to be relatively displaceable with respect to the base plate 21 along the reflection path of the planar bending light H as shown by an arrow Y2 is provided, the refractive lens 32 , The reflected light R from the ball terminal BT can be received while including the vertex of the ball terminal BT within the imaging range SH, and By displacing the displacement mechanism so as not to receive the reflected light R from the component body BH, the height of the suction head 13 in the Z-axis direction can be set while setting the condensing position SI to relatively about. Even without adjustment, it is possible to identify the vertex position of the ball terminal BT.
[0045]
FIG. 4A shows a case where the intersection line L1 is on the anti-refractive lens 32 side with respect to the light condensing position SI, but the intersection line L1 is shifted toward the refraction lens 32 with respect to the light condensing position S1. Similarly, if the distance between the intersection line L1 and the converging position SI is shorter than the length between the converging position SI and the refraction lens 32, the top of the ball terminal BT can be illuminated brightly. Thus, the top of the ball terminal BT can be imaged.
[0046]
Further, the illuminant to be lit may be changed from among a large number of illuminants (LEDs 31) arranged in the irradiation unit 30 so that the illuminant can be appropriately selected. For example, it is possible to switch between a state in which all of the LEDs 31 of the irradiation unit 30 are turned on, and a state in which the center row is turned off and both rows are turned on. In this case, when only a part is lit, the area other than the vicinity of the ball vertex BT may be darkened and the contrast may be clear.
[0047]
For example, when the focal position of the central portion of the refractive lens 32 is shifted from the focal position of the peripheral portion and the position of the intersection line L1 is close to the focal position of the peripheral portion, the planar bending from the central portion of the refractive lens 32 is performed. The light H is reflected at the top of the ball terminal BT, and the reflected light R passes through the imaging range SH of the line sensor 35 and is captured by the line sensor 35. In this case, it is effective to turn off the center row and turn on the rows on both sides.
[0048]
Further, in the above description, the identification of the apex position of the ball terminal BT has been described as an example. However, in addition, a component D having a projecting portion projecting from the imaging side of the line sensor 35, for example, a lead is a component. After being extended laterally outward, in a state where it is sucked by the suction head 13, the position of the leading end of the lead of the component having a lead bent and formed toward the imaging side of the imaging means is specified. In such a case, the component recognition device 20 can be employed.
[0049]
In the above-described embodiment, the component recognition device 20 mounted on the surface mounter is described as an example. However, the present invention is not limited to the surface mounter. It can also be mounted on a component testing device 40 that tests electronic components such as chips.
[0050]
FIG. 7 is a plan view showing a component test apparatus 40 on which the component recognition device 20 according to the present invention is mounted. It should be noted that the X-axis and the Y-axis are shown in the figure to clarify the directionality.
[0051]
As shown in FIG. 7, a plurality of trays 42 for storing electronic components and a test head 43 for inspecting the electronic components in the trays 42 are arranged on a base 41 of the component test apparatus 40. A head 44 capable of adsorbing the electronic components in each tray 42 and being displaceable in the X and Y directions is provided above the position where the trays 42 are disposed. The components adsorbed by the heads 44 are provided on a movable table. 45. The movable table 45 is disposed on the base 41 so as to be freely displaceable between a position Q1 at which components can be received from the head 44 and a position Q2 displaced in the Y direction. Transfer head units 46A and 46B are provided above the movable table 45 so that the electronic components on the movable table 45 displaced to the position Q2 can be sucked.
[0052]
Each of the transport head units 46A and 46B is supported by the base 41 so as to be displaceable in the X direction, and transports the electronic components on the movable table 45 to the test head 43. ing. Each of the transport head units 46A and 46B includes a pair of head bodies 47a and 47b, and the head bodies 47a and 47b each include a suction nozzle (not shown) extending downward. The electronic components sucked by the suction nozzles are conveyed according to the driving of the head units 46A and 46B, and input terminals projecting from the lower surface of the electronic components are mounted on the test head 43. The test current is applied by 43 (the test is executed).
[0053]
In such a component testing device 40, the component recognition device 20 is provided on the substrate 41 between the movable table 45 located at the position Q2 and the test head 43. That is, the lower surface (that is, the input terminal) of the electronic component sucked from the movable table 45 by each suction nozzle is captured by the component recognition device 20 in the process of being conveyed to the test head 43. Therefore, the position of the tip of the input terminal protruding from the lower surface of the electronic component can be specified by the component recognition device 20. As a result, the electronic component can be moved to the test head 43 while correcting the positional deviation with respect to the test head 43. Can be attached to
[0054]
【The invention's effect】
As described above, according to the present invention, when the tip of the projecting portion projecting from the component is included in the imaging range of the imaging unit, the second focusing unit is connected to the first focusing unit. The light substantially collimated is condensed at or near the tip of the projecting portion of the component, and the light is reflected at a position at or near the tip of the projecting portion where the reflected light can be received. Since the imaging means is provided, the imaging means captures an image in which the portion corresponding to the tip of the protruding portion within the imaging range is extremely bright.
[0055]
On the other hand, since the light is condensed at or near the front end of the projecting portion by the second light condensing means, a portion other than the front end of the projecting portion is predetermined by the second light condensing means. As a result of irradiating the light radiated at the light condensing angle in a diffused state, the imaging means captures an image in which the portion corresponding to the protruding portion other than the tip portion in the imaging range is extremely dark.
[0056]
Therefore, the above-described invention can capture an image in which the brightness of the vicinity of the tip of the projecting portion of the component and the brightness of the other portion are significantly different, so that the position of the tip of the projecting portion with respect to the component is specified. be able to.
[Brief description of the drawings]
FIG. 1 is a plan view schematically showing a mounting machine equipped with a component recognition device according to an embodiment of the present invention.
FIG. 2 is a side view schematically showing the mounting machine of FIG. 1;
3A and 3B show the component recognition device 20 of FIG. 1, wherein FIG. 3A is a perspective view showing a path of light emitted through a refraction lens 32, and FIG. FIG.
4A and 4B are front views showing an imaging state of a top of a ball terminal BT in the component recognition device 20 of FIG. 3, wherein FIG. 4A shows a state in which intersection lines coincide with each other, and FIG. Are shown schematically.
FIG. 5 is a perspective view showing a component on which ball terminals are protruded.
6A and 6B show images obtained by capturing the components of FIG. 5; FIG. 6A shows an image captured by the component recognition device of the present invention, and FIG. Is shown.
FIG. 7 is a plan view schematically showing a component test apparatus equipped with the component recognition device according to the embodiment of the present invention.
[Explanation of symbols]
5 Head unit
14 Suction head
20 Parts recognition device
30 Lighting means
32 refraction lens
34 mirror
35 line sensor
BT ball terminal
SH imaging range

Claims (4)

A head unit having a head for picking up parts, an image pickup means arranged on a movement path of the head unit, and a line sensor for picking up an image of a part sucked by the head while the head unit is moving; A component recognition device comprising: a plurality of illumination means for irradiating the component with light; and configured to recognize the component adsorbed on the head based on the image of the component captured by the imaging unit.
A first light condensing unit that changes the direction of light so that the irradiation light of each of the illumination units is substantially parallel to the scanning direction of the imaging unit,
A second light collecting means for collecting the light substantially collimated by the first light collecting means at a certain position,
When the tip of the projecting portion protruding from the component toward the imaging side of the imaging unit is included in the imaging range of the imaging unit, the second light collection unit is substantially parallel to the first light collection unit. The light that has been converted into light is condensed at or near the tip of the projecting portion of the component, and the imaging unit is located at a position where the reflected light reflected at or near the tip of the projecting portion can be received. A component identification device, which is provided. 2. The component recognition device according to claim 1, further comprising a reflection unit configured to reflect light reflected at or near a tip end of the protruding portion, wherein the imaging unit can receive light reflected by the reflection unit. A component recognizing device, wherein the component recognizing device is disposed. 3. The component recognition device according to claim 1, wherein the second condensing unit is configured such that a vertex of a spherical surface protruded from the component toward the imaging side of the imaging unit with the light emitted from each illumination unit. A component recognizing device configured to condense light to a component. 4. The component recognition device according to claim 1, further comprising: a component supply unit configured to supply a component to be mounted; and a board transport unit configured to transport a board to be mounted to a mounting operation position. A surface mounter configured to adsorb a component from a component supply unit by a head, recognize the component by a component recognition device, and then mount the component on the substrate.

Images