JP2004228428A - Stage controller, exposure device, and manufacturing method of device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a stage controller which controls to move a stage at high speed with high precision by suppressing the vibration of the stage and shortening the setting time and executing compensation for the external disturbance force perfectly. <P>SOLUTION: A first control system 13 generates a first control signal S1 for controlling the position of a stage by a proportional differential control (PD control) based on an error signal DS which is difference between a position instruction signal CS outputted from a position command generator 11, and a stage position signal PS indicating the actual position of the stage. A second control system 15 generates a second control signal S2 for controlling an acceleration of the stage by a proportional integral (PI control) based on the difference between the first control signal S1 and an acceleration signal AS indicating the acceleration of the stage. A stage controller 1 gives a driving signal DS amplifying the second control signal S2 by an amplifier 16 to the stage, and controls the stage. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a stage control apparatus, an exposure apparatus, and a device manufacturing method, and in particular, to a stage that controls the operation of a stage that is configured to be movable with a moving object such as a mask (reticle) and a wafer mounted thereon. The present invention relates to a control apparatus, an exposure apparatus including the apparatus, and a device manufacturing method for manufacturing a device using the exposure apparatus.
[0002]
[Prior art]
2. Description of the Related Art In a photolithography process in a manufacturing process of a micro device such as a liquid crystal display, a semiconductor device, an imaging device (such as a CCD), and a thin film magnetic head, a circuit pattern formed on a mask or a reticle is printed on a surface through a projection optical system. An exposure apparatus that projects onto a substrate such as a wafer or a glass plate coated with a resist is used. As one of such exposure apparatuses, there is known an exposure apparatus (stepper) of a step-and-repeat type in which a pattern formed on a reticle is collectively reduced and projected onto each shot area on a wafer. In the stepper, collective exposure is performed on one shot area, and when the exposure is completed, the operation of stepwise moving the wafer and performing collective exposure on the next shot area is repeatedly performed.
[0003]
Also, in order to enlarge the exposure range of the pattern formed on the reticle, the exposure light from the illumination optical system is limited to a slit shape, and a part of the pattern formed on the reticle is placed on the wafer using the slit light. A scanning exposure apparatus of a step-and-scan method in which a reticle and a wafer are synchronously scanned with respect to a projection optical system and a pattern is sequentially transferred onto a wafer in a reduced projection state is also used.
[0004]
Generally, in an exposure apparatus, a stage device is used for positioning a reticle and a wafer with high accuracy, or scanning a reticle and / or a wafer with high accuracy at a constant speed. In this type of stage device, for example, a linear motor is used as a driving mechanism for driving the stage at high speed and in a non-contact manner. The linear motor includes a stator and a movable element. When one of the stator and the movable element includes a coil, the other includes a magnetic body such as a magnet.
[0005]
One form of a scanning exposure apparatus includes a wafer stage for holding a wafer and a reticle stage for holding a reticle. The reticle stage includes a reticle fine movement stage and a reticle coarse movement stage in order to improve synchronization accuracy. In each stage, for example, positioning for exposure and scanning operation are performed by a PID (proportional-integral-derivative) type stage controller. In particular, since the reticle coarse movement stage moves at high speed, a linear motor and a drive amplifier for obtaining a large thrust are required.
[0006]
FIG. 11 is a control block diagram showing a configuration example of a conventional stage control device provided in the above-described exposure apparatus. The conventional stage control device 500 shown in FIG. 11 compensates for the position command generator 501, the subtractor 502, the proportional controller 503, the integration controller 504, the differentiation controller 505, the adder 506, and the mass of the stage to be controlled. And an amplifier 507 for performing the operation.
[0007]
The drive signal output from the stage control device 500 is supplied to the linear motor, and the stage to be controlled is driven by the generated thrust. In FIG. 11, the block denoted by reference numeral 508 represents the characteristics of the power amplifier and the motor, and the block denoted by reference numeral 509 represents a transfer function for converting the force applied to the stage into a position. Since the position of the stage is measured by the laser interferometer, the block 509 can be considered to include the stage and the laser interferometer. A block denoted by reference numeral 510 indicates a source of disturbance force applied to the stage, and a block denoted by reference numeral 511 indicates an adder that combines the external force generated by the motor and the disturbance force applied to the stage. .
[0008]
A stage position signal indicating the position of the stage output from the block 509 is input to a subtractor 502 in the stage control device 500, and the difference from the position command signal indicating the target position of the stage output from the position command generator 501 is obtained. Is calculated. This error signal is input to each of the proportional controller 503, the integral controller 504, and the derivative controller 505. The proportional controller 503, the integral controller 504, and the derivative controller 505 respectively calculate and output a proportional control signal, an integral control signal, and a derivative control signal corresponding to the error signal. The output proportional control signal, integral control signal, and differential control signal are added by an adder 506, amplified at a predetermined amplification factor by an amplifier 507, and then supplied as a drive signal to a motor via a power amplifier. Thus, in the control system shown in FIG. 11, a control circuit that performs PID control of the stage using the stage position signal as a feedback signal is configured. For details of the conventional stage control device, for example, refer to Patent Document 1 below.
[0009]
[Patent Document 1]
JP-A-9-36204
[0010]
[Problems to be solved by the invention]
Meanwhile, the conventional stage control device shown in FIG. 11 mainly has the following two problems.
(1) When the stage is moved to the commanded position, vibration occurs in the stage, and the settling time becomes longer.
(2) Compensation for disturbance force applied to the stage is incomplete.
[0011]
FIG. 12 is a diagram illustrating a simulation result obtained by stepwise moving the stage by the conventional stage control device illustrated in FIG. 11. In this simulation, the disturbance force is set to zero, and the position command generator 501 generates a step-like position command signal for moving the stage with a step width of 1 [m] as the position command signal when the time is 0 [s]. Is raised from.
[0012]
Referring to FIG. 12, the stage moved over a distance specified by the position command signal and caused an overshoot of about 35%, and the behavior was oscillating with a damping coefficient of 0.3. The settling time is about 0.02 [s]. As described above, the conventional stage control device shown in FIG. 11 has a problem that the stage (1) vibrates when moving the stage to the commanded position, and the settling time becomes long.
[0013]
FIG. 13 is a diagram showing a simulation result when a disturbance force is applied to the stage controlled by the conventional stage control device shown in FIG. Also in this simulation, the position command generator 501 generates a step-like position command signal for moving the stage with a step width of 1 [m] as the position command signal when the time is 0 [s]. As for the disturbance force, a motor that becomes a 100% load on the motor is applied to the stage 0.02 [s] after the position command signal is generated from the position command generator 501.
[0014]
Referring to FIG. 13, at 0 to 0.02 [s] until the disturbance force is applied, the stage shows the same response as in FIG. 12, but at time 0.02 [s], the disturbance force is reduced. When applied to the stage, a deviation occurs at a constant gradient, and the stage cannot be moved to the commanded position. As described above, the conventional stage control device shown in FIG. 11 has a problem in that the compensation of the disturbance force applied to the stage (2) is incomplete.
[0015]
The present invention has been made in view of the above circumstances, and it is possible to control the movement of a stage at high speed and with high accuracy by suppressing vibration of the stage, shortening the settling time, and completely compensating for disturbance force. An object of the present invention is to provide a stage control device capable of performing the above, an exposure apparatus including the apparatus, and a device manufacturing method for manufacturing a device using the exposure apparatus.
[0016]
[Means for Solving the Problems]
In order to solve the above problem, a stage control device according to a first aspect of the present invention is a stage control device (1) for controlling a movable stage (2), the acceleration signal indicating the acceleration of the stage. (AS), a first feedback control system that performs at least integral control on the acceleration of the stage, and a position signal (PS) that indicates the actual position of the stage as feedback to control at least proportionally the position of the stage. And two feedback control systems.
According to the present invention, the stage acceleration is at least integratedly controlled based on the fed back acceleration signal indicating the stage acceleration, and the stage position is at least proportionally controlled based on the fed back position signal indicating the stage position. Therefore, the vibration of the stage is suppressed, the settling time is shortened, and the compensation for the disturbance force applied to the stage can be completely performed. Thereby, the movement of the stage can be controlled at high speed and with high accuracy.
In order to solve the above-mentioned problem, a stage control device according to a second aspect of the present invention includes a stage control device (1) that controls a movable stage (2). A target position signal output unit (11) for outputting a target position signal (CS) indicating the position of the stage, and an error signal (DS) that is a difference between the target position signal and a position signal (PS) indicating the actual position of the stage. A first control system (13) for generating a first control signal (S1) for at least proportionally controlling the position of the stage; an acceleration signal (AS) indicating the acceleration of the stage and the first control signal; And a second control system (15) for generating a second control signal (S2) for performing at least integral control of the acceleration of the stage based on the control signal.
According to the present invention, the first control signal for at least proportionally controlling the position of the stage is generated based on the target position signal indicating the target position of the stage and the position signal indicating the actual position of the stage. A second control signal for at least integrating control of the stage acceleration is generated based on the acceleration signal indicating the stage acceleration and the stage is controlled, so that the vibration of the stage is suppressed and the settling time is shortened. Can be completely compensated for the disturbance force applied to. Thereby, the movement of the stage can be controlled at high speed and with high accuracy.
Here, in the stage control device according to a second aspect of the present invention, the second control system includes an integration control unit (15b) that generates an integration control signal (S22) for performing integral control of the acceleration of the stage; A first proportional control section (15a) that is provided in parallel with the control section and generates a first proportional control signal (S21) that proportionally controls the acceleration of the stage; the integral control signal and the first proportional control signal; And a first adder (15c) for adding the second control signal to the second control signal.
Further, in the stage control device according to a second aspect of the present invention, the first control system includes a second proportional control unit (13a) that generates a second proportional control signal (S11) for proportionally controlling the position of the stage. A differential control unit (13b) provided in parallel with the second proportional control unit to generate a differential control signal (S12) for differentially controlling the position of the stage; the second proportional control signal and the differential control Preferably, a second adder (13c) for adding the signal to the first control signal is provided.
Further, a stage control device according to a second aspect of the present invention includes a laser interferometer (8) that measures a position of the stage and outputs the position signal.
Furthermore, a stage control device according to a second aspect of the present invention includes an operation unit that performs an operation on the position signal and outputs the acceleration signal, or measures the acceleration of the stage and outputs the acceleration signal. It is characterized by having an accelerometer (7) for outputting.
An exposure apparatus according to the present invention includes: an exposure unit (IU, PL) for exposing a pattern of a mask (R) onto a substrate (W) via an optical system (PL); and a mask stage (35) for moving the mask. An exposure apparatus (31) including a substrate stage (37) for moving the substrate, wherein at least one of the mask stage and the substrate stage is controlled using the stage control device (1, 111). It is characterized by being done.
According to the present invention, since at least one of the mask stage and the substrate stage is controlled using the stage control capable of controlling the movement of the stage with high speed and high precision, a fine pattern is superimposed on the substrate with high accuracy. The transfer can be performed with high accuracy, and the time required for moving the stage can be shortened, so that the throughput (the number of substrates that can be exposed in a unit time) can be improved.
The device manufacturing method of the present invention is a device manufacturing method including a lithography step (S33), characterized in that the lithography step includes an exposure step (S46) of performing exposure using the above-described exposure apparatus.
According to the present invention, since the lithography step includes an exposure step of performing exposure using the above-described exposure apparatus, a large number of devices can be efficiently manufactured with a high yield.
[0017]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a stage control apparatus, an exposure apparatus, and a device manufacturing method according to an embodiment of the present invention will be described in detail with reference to the drawings.
[0018]
[Stage control device]
FIG. 1 is a block diagram schematically showing an overall configuration of a control system including a stage control device according to an embodiment of the present invention. In FIG. 1, reference numeral 1 denotes a stage control device according to an embodiment of the present invention, and 2 denotes a stage device to be controlled. The stage device 2 includes a base 3, a linear motor 4, a table unit 5, a moving mirror 6, and an acceleration sensor 7.
[0019]
The base 3 is spatially fixed, and the table section 5 is configured to be movable in a state where the object OB is fixedly mounted. The linear motor 4 has a stator fixed to the base 3 and a mover fixed to the table 5, and generates a thrust according to a thrust command signal DS output from the stage control device 1. This thrust is transmitted to the stator and the mover, whereby the stage 5 moves relative to the base 3.
[0020]
The movable mirror 6 is attached to one end of the table unit 5 and is used for measuring the position of the table unit 5. A laser interferometer 8 is disposed at a position facing the mirror surface of the movable mirror 6, and irradiates the laser beam from the laser interferometer 8 to the movable mirror 6 to detect the reflected laser light, so that the table section 5 is reflected. Is measured. A stage position signal PS as a position signal indicating the measured position of the table unit 5 is output to the stage control device 1. The acceleration sensor 7 is attached to one end of the table unit 5 and detects the acceleration of the table unit 5. An acceleration signal AS indicating the detected acceleration is output to the stage control device 1.
[0021]
FIG. 2 is a control block diagram showing a configuration example of the stage control device 1 according to one embodiment of the present invention. The stage control device 1 shown in FIG. 2 includes a position command generator 11, a subtractor 12, a first control system 13, a subtractor 14, a second control system 15, and an amplifier 16. The position command generator 11 generates a position command signal CS as a target position signal indicating a target position of the stage device 2 (table section 5). The subtractor 12 obtains a difference between the position command signal CS output from the position command generator 11 and the stage position signal PS output from the laser interferometer 8 shown in FIG. 1, and calculates the difference as an error signal (thrust command signal). ) Output as DS.
[0022]
The first control system 13 includes a proportional controller 13a as a second proportional control unit, a differential controller 13b as a differential control unit, and an adder 13c as a second addition unit, and is based on the error signal DS. To generate a first control signal S1 for performing proportional differential control (PD control) on the position of the stage device 2. The proportional controller 13a and the differential controller 13b are provided in parallel, and each receives an error signal DS. The proportional controller 13a generates a proportional control signal S11 (second proportional control signal) for proportionally controlling the position of the stage device 2 according to the input error signal DS.
[0023]
Further, the differential controller 13b generates a differential control signal S12 for differentially controlling the position of the stage device 2 according to the input error signal DS. The adder 13c adds the proportional control signal S11 and the differential control signal S12 to generate a first control signal S1. The subtracter 14 calculates and outputs a difference between the first control signal S1 output from the first control system 13 and the acceleration signal AS output from the acceleration sensor 7 shown in FIG.
[0024]
The second control system 15 includes a proportional controller 15a as a first proportional controller, an integral controller 15b as an integral controller, and an adder 15c as a first adder. A second control signal S2 for performing proportional-integral control (PI control) of the acceleration of the stage device 2 based on a signal indicating a difference between the first control signal S1 and the acceleration signal AS is generated.
[0025]
The proportional controller 15a and the integral controller 15b are provided in parallel, and a signal from the subtractor 14 is input to each. The proportional controller 15a generates a proportional control signal S21 (first proportional control signal) for proportionally controlling the acceleration of the stage device 2 according to the input signal. Further, the integration controller 15b generates an integration control signal S22 for performing integral control of the acceleration of the stage device 2 according to the input signal. The adder 15c adds the proportional control signal S21 and the integral control signal S22 to generate a second control signal S2.
[0026]
The amplifier 16 converts the second control signal output from the first control system 15 to the mass of the stage device 2 (the movable element of the linear motor 4 and the table 5 in FIG. 1) in order to compensate for the mass of the stage device 2 to be controlled. , The second control signal S2 is amplified with an amplification factor according to the mass including the movable mirror 6, the acceleration sensor 7, and the like, and output as a drive signal DS.
[0027]
In FIG. 2, a block denoted by reference numeral 17 represents a characteristic (dynamic characteristic) of the power amplifier and the linear motor 4, a block denoted by reference numeral 18 represents a mass of the stage device 2, and denoted by reference numeral 19. The indicated block represents a transfer function for converting the acceleration of the stage device 2 into a position. Since the position of the stage is measured by the laser interferometer 8, it can be considered that the combination of the blocks 18 and 19 includes the stage device 2 and the laser interferometer 8.
[0028]
The block denoted by reference numeral 20 in FIG. 2 represents the acceleration sensor 7 in FIG. In FIG. 2, the gain is normalized so as to be “1”. Further, a block denoted by reference numeral 21 represents a source of disturbance force applied to the stage, and a block denoted by reference numeral 22 is an adder that combines the external force generated by the linear motor 4 and the disturbance force applied to the stage device 2. Is shown. Each control parameter shown in each block in FIGS. 2 and 11 is set by, for example, the Ziggler-Nichols method, and the control system is designed so as to be optimized as a whole.
[0029]
In the above configuration, if the position command signal CS is issued from the position command generator 11 when the stage device 2 is located at the origin position (the position where the stage position signal PS is “0”), the first control system An error signal DS having a value equal to the position command signal CS is input to 13. The error signal DS input to the first control system 13 is input to a proportional controller 13a and a differential controller 13b. The proportional controller 13a generates a proportional control signal S11 corresponding to the error signal DS, At 13b, a differential control signal S12 corresponding to the error signal DS is generated.
[0030]
The proportional control signal S11 and the differential control signal S12 are added by the adder 13c and output as a first control signal S1. Since the acceleration signal AS is “0” when the stage device 2 is stationary, a signal having a value equal to the first control signal S1 is input to the second control system 15 via the subtractor 14. The signal input to the second control system 15 is input to the proportional controller 15a and the integral controller 15b, and the proportional controller 13a generates a proportional control signal S21 corresponding to the input signal, and the integral controller 15b Generates an integration control signal S22 corresponding to the input signal. The proportional control signal S21 and the integral control signal S22 are added by the adder 15c and output as a second control signal S2.
[0031]
The second control signal S2 is amplified at a predetermined amplification rate in the amplifier 16 and supplied to the linear motor 4 in FIG. 1 as a drive signal DS, and the linear motor 4 generates a thrust according to the supplied drive signal DS. Thereby, the stage device 2 starts accelerating. When the stage device 2 starts accelerating, the acceleration is detected by the acceleration sensor 7 (block 20), and the position of the stage device 2 is detected by the laser interferometer 8.
[0032]
The detected acceleration signal AS and stage position signal PD are input to the stage control device 1. When the stage device 2 starts moving, the stage position signal PS changes, so that the value of the error signal DS output from the subtractor 12 also changes, which differs from the value previously output from the first control system 13. A first control signal S1 having a value is output. Similarly, when the stage device 2 starts accelerating, the value of the signal output from the subtractor 14 also changes because the acceleration signal AS is no longer “0”, so that the second control system 15 has a different value. The second control signal S2 is output. Hereinafter, the same operation is performed until the error signal DS becomes “0”, that is, until the stage device 2 moves to the target position.
[0033]
As described above, in the stage control device of the present embodiment, the acceleration signal AS indicating the acceleration of the stage device 2 is fed back, and the acceleration of the stage device 2 is proportionally integrated controlled (PI controlled) by the second control system 15. A first feedback control system, and a second feedback control system in which a position signal PS indicating an actual position of the stage device 2 is fed back and the position of the stage device 2 is proportionally differentiated (PD controlled) by a first control system 13. Is configured.
[0034]
Next, the response characteristics of the stage control device according to the embodiment of the present invention will be described. FIG. 3 is a diagram showing a simulation result of the stage control device 1 according to the embodiment of the present invention in which the stage device 2 is step-moved. In this simulation, the disturbance force applied to the stage device 2 is set to zero (the output from the block 21 in FIG. 2 is set to “0”) and the position is set, similarly to the simulation in which the result of FIG. 12 is obtained. When the time is 0 [s], the position command generator 11 generates a step-like position command signal CS for moving the stage device 2 with a step width of 1 [m] as a command signal.
[0035]
Referring to FIG. 3, the stage device 2 does not behave in an oscillating manner despite the generation of the step-like position command signal CS, and the settling time is 0.005 [s] or less. It can be seen that the settling time is extremely short as compared with the settling time of 0.02 [s] when controlled by the conventional stage control device that performs the PID control shown.
[0036]
FIG. 4 is a diagram showing a simulation result when a disturbance force is applied to the stage device 2 controlled by the stage control device 1 according to one embodiment of the present invention. In this simulation, as in the simulation in which the result of FIG. 2 was obtained, a step-like position command signal for moving the stage device 2 with a step width of 1 [m] as the position command signal CS is set to 0 [ s], the position command generator 11 generates the signal. The disturbance force is applied to the stage device 2 0.02 [s] after the position command signal CS is generated from the position command generator 11 and becomes a 100% load on the motor.
[0037]
Referring to FIG. 4, although a disturbance force is applied at time 0.02 [s]. A result similar to the simulation result shown in FIG. 3 obtained when no disturbance force is applied to the stage device 2 is obtained. This is a result of the disturbance force applied to the stage device 2 being completely compensated. As described above, when the movement of the stage device 2 is controlled by the stage control device 1 of the present embodiment, the vibration of the stage device 2 can be suppressed, the settling time can be shortened, and the disturbance force is completely compensated. can do. Thereby, the movement of the stage device 2 can be controlled at high speed and with high accuracy.
[0038]
As described above, the stage control device according to one embodiment of the present invention has been described. However, the stage control device of the present invention can be freely changed within the scope of the present invention without being limited to the above embodiment. For example, in the embodiment described above, the first control system 13 performs proportional differential control (PD control) of the position of the stage device 2, and the second control system 15 performs proportional integral control (PI control) of the acceleration of the stage device 2. Was explained. However, the differential control in the first control system 13 and the proportional control in the second control system 15 are not always essential, and can be omitted as necessary. That is, the first control system 13 may perform at least proportional control (P control), and the second control system 15 may perform at least integral control (I control).
[0039]
Further, in the above-described embodiment, the configuration has been described in which the acceleration sensor 7 is attached to one end of the table unit 5 provided in the stage device 2 and the acceleration signal AS is obtained by actually measuring the acceleration of the stage device 2. However, the acceleration sensor 7 is not necessarily required, and may be omitted. In the case of such a configuration, an operation unit that performs a differential operation on the stage position signal PS detected by the laser interferometer 8 and outputs an acceleration signal is provided in the stage control device 1, and the acceleration output from the operation unit is provided. The signal is output to the subtractor 14.
[0040]
(Exposure equipment)
Next, the exposure apparatus of the present invention will be described in detail. FIG. 5 is a diagram showing a schematic configuration of an exposure apparatus according to an embodiment of the present invention. In the present embodiment, the pattern formed on the reticle R is transferred onto the wafer W while the reticle R as a mask and the wafer W as a substrate are relatively moved with respect to the projection optical system PL in FIG. An example in which the present invention is applied to a step-and-scan type exposure apparatus that manufactures a semiconductor element by using the method will be described.
[0041]
In the following description, the XYZ rectangular coordinate system shown in FIG. 5 is set, and the positional relationship of each member will be described with reference to the XYZ rectangular coordinate system. The XYZ orthogonal coordinate system is set so that the X axis and the Y axis are parallel to the wafer W, and the Z axis is in a direction orthogonal to the wafer W (a direction along the optical axis AX of the projection optical system PL). Is set. In the XYZ coordinate system in FIG. 5, the XY plane is actually set to a plane parallel to the horizontal plane, and the Z axis is set vertically upward. In the present embodiment, the direction (scanning direction) for moving the reticle R and the wafer W during exposure (during pattern transfer) is set to the Y direction. The rotation directions around the respective axes are denoted by θZ, θY, and θX.
[0042]
The exposure apparatus 31 shown in FIG. 5 is schematically composed of an illumination optical system IU, a stage device 32, a projection optical system PL, a stage device 33, and a main frame. The illumination optical system IU illuminates a rectangular (or arc-shaped) illumination area on the reticle R as a mask with uniform illumination by exposure illumination light from a light source (not shown). The stage device 32 includes a reticle stage 35 as a mask stage that holds and moves the reticle R, and a reticle surface plate 36 that supports the reticle stage 35. The projection optical system PL projects the pattern formed on the reticle R onto a wafer W as a substrate at a reduction ratio of 1 / α (α is, for example, 5 or 4). The stage device 33 includes a wafer stage 37 as a substrate stage that holds and moves the wafer W, and a wafer surface plate 38 that holds the wafer stage 37. The main frame 34 supports the stage device 32 and the projection optical system PL.
[0043]
The illumination optical system IU is supported by a support column 39 fixed to the upper surface of the main frame 34. The illumination light for exposure may be, for example, an ultraviolet bright line (g-line, i-line) emitted from an extra-high pressure mercury lamp, far ultraviolet light (DUV light) such as KrF excimer laser light (wavelength 248 nm), or ArF. Excimer laser light (wavelength 193 nm) or F ₂ Vacuum ultraviolet light (VUV) such as laser light (wavelength 157 nm) is used. The main frame 34 is installed on a base plate 40 mounted horizontally on the floor surface, and has upper and lower sides formed with step portions 34a and 34b protruding inward.
[0044]
A reticle surface plate 36, which is a part of the stage device 32, is supported substantially horizontally on a step 34a of the main frame 34 at each corner via an anti-vibration unit 41, and is formed on the reticle R at the center thereof. An opening 42a through which the patterned image passes is formed. In FIG. 5, only the vibration isolating unit 41 arranged in the X direction is shown, and the vibration isolating unit arranged in the Y direction is not shown.
[0045]
Note that metal or ceramics can be used as the material of the reticle surface plate 36. The anti-vibration unit 41 has a configuration in which an air mount 43 capable of adjusting the internal pressure and a voice coil motor 44 are arranged in series on the step 34a. By these vibration isolating units 41, micro vibration transmitted to the reticle surface plate 36 via the base plate 40 and the main frame 34 is insulated at a micro G level (G is a gravitational acceleration).
[0046]
A reticle stage 35 is supported on the reticle surface plate 36 so as to be two-dimensionally movable along the reticle surface plate 36. A plurality of air bearings (air pads) 45 are fixed to the bottom surface of the reticle stage 35, and the reticle stage 35 is levitated and supported on the reticle surface plate 36 by a clearance of about several microns by these air bearings 45. I have. At the center of the reticle stage 35, there is formed an opening 46a which communicates with the opening 42a of the reticle surface plate 36 and through which the pattern image of the reticle R passes. Further, at one end of the reticle stage 35, an acceleration sensor 47 for detecting the acceleration of the reticle stage 35 is provided. The detection result of the acceleration sensor 47 is output to a stage control device 111 (see FIG. 8) described later.
[0047]
Here, the stage device 32 including the reticle stage 35 will be described in detail. FIG. 6 is an external perspective view of the stage device 32 including the reticle stage 35 provided in the exposure apparatus according to the embodiment of the present invention. The stage device 32 shown in FIG. 6 corresponds to the stage device 2 as a control target shown in FIG. As shown in FIG. 6, the reticle stage 35 is configured to include an L-shaped ceramic coarse movement stage 70 and a ceramic fine movement stage 71 molded in a rectangular frame shape. It is juxtaposed on the reticle surface plate 36. Between the coarse movement stage 70 and the fine movement stage 71, three linear motors 72 to 74 for fine movement are provided. Of these, two linear motors 72 and 73 generate thrust for fine movement in the scanning direction (Y direction) and fine movement in the θ direction at the time of step & scan exposure, and one linear motor 74 performs non-scanning. This is for generating thrust for fine movement in the direction (X direction).
[0048]
In the reticle stage 35 including the coarse moving stage 70 and the fine moving stage 71, a linear motor (actuator) for fine moving generates an extremely large thrust (torque) in the scanning direction as compared with the non-scanning direction. Needed. For this reason, in the present embodiment, by providing the two linear motors 72 and 73 that generate thrust in the scanning direction at appropriate intervals in the non-scanning direction, the linear motion stage unit 70 is accelerated or decelerated. However, the fine movement stage 71 can be finely moved in the Y direction and the θ direction at a sufficient response speed against the acceleration.
[0049]
Each of the three fine-movement linear motors 72 to 74 is an MM type (moving magnet type) in which a permanent magnet unit is fixed to the fine movement stage 71 and a coil unit is fixed to the coarse movement stage 70. Although the configuration is not essential, the configuration may be an MC (moving coil) type in which the arrangement of the magnet unit and the coil unit is reversed for all or some of them in some cases.
[0050]
Further, as linear motors for largely moving the coarse movement stage 70, columnar stators 75b and 76b in which a large number of disk-shaped or donut-shaped strong permanent magnets are stacked in the Y direction in a cylindrical case are provided. And shaft type linear motors 75 and 76 in combination with movers 75a and 76a containing coil windings that wrap around the stator in an annular shape.
[0051]
The shaft type linear motor has a simple structure of the coil winding housed in the movers 75a and 76a, and is easy to assemble the magnet arrays in the stators 75b and 76b. ) Has the advantage of high conversion efficiency of output energy (thrust torque). Furthermore, since the structure of the coil winding is simple, there is an advantage that the structure of the internal circulation path when the cooling coolant is supplied into the movers 75a and 76a can be simplified, and the cooling efficiency can be increased.
[0052]
In this embodiment, each of the stators 75b and 76b of the shaft type linear motors 75 and 76 is fixed to the linear slider type air bearing members 77a and 77b and the air bearing members 78a and 78b, respectively. It is configured to be linearly movable in the Y direction along guide surfaces 36a and 36b formed on both sides. That is, the air bearing members 77a and 77b are fixed to both ends in the longitudinal direction of the stator 75b, and the air bearing members 78a and 78b are fixed to both ends in the longitudinal direction of the stator 76b. As a result, the stator 75b and the air bearing members 77a, 77b are configured to be integrally movable on the reticle surface plate 36 in the Y direction as a first counter mass 79a, and the stator 76b and the air bearing members 78a, 78b The second counter mass 79b is configured to be integrally movable on the reticle surface plate 36 in the Y direction.
[0053]
Each of the movers 75a, 76a of the shaft type linear motors 75, 76 has an appropriate coupling member such that its inner peripheral wall is positioned with a gap of about 1 to 4 mm from the outer peripheral wall of the corresponding stator 75b, 76b. Is attached to the coarse movement stage section 70 via the. Four pads 80 (only one is shown in FIG. 6) for forming an air bearing are provided between the upper surface of the reticle surface plate 36 and the lower surface of the coarse movement stage unit 70.
[0054]
The Y-direction air bearing is formed between the coarse movement stage 70 and the side guide surface 36b of the reticle surface plate 36 at the end (the shaft type linear motor 76 side) extending in the Y direction. A pad 81 is provided, and the pad 81 is formed of a vacuum pressurized type or a magnetic pressurized type combination pad. Further, four pads 82 (only two are shown in FIG. 6) for forming an air bearing between the fine movement stage portion 71 and the upper surface of the reticle surface plate 36 are provided on the lower surface of the fine movement stage portion 71. On the upper surface of the fine movement stage section 71, a mounting section 83 of a linear movable mirror 104 (see FIG. 8) and two corner mirrors 105 are provided for length measurement by a laser interferometer forming a part of a position measurement section. , 106 (see FIG. 8) are formed.
[0055]
In order to measure the movement position of the counter mass 79a in the Y direction, a linear encoder set 88a (not shown) is attached to the air bearing member 77a forming a part of the counter mass 79a. A linear encoder set 88b is attached to an air bearing member 78a forming a part of the mass 79b. The linear encoder set 88b includes a read head 86b and a scale 87b. The read head 86b is fixed to the air bearing member 78a, and the scale 87b is fixed to the reticle surface plate 36. In FIG. 6, the illustration of the read head unit 86a and the scale unit 87a constituting the linear encoder set 88a is omitted.
[0056]
Further, as linear motors for individually moving the counter masses 79a, 79b in the Y direction, linear motor sets 91a, 91b (the linear motor set 91a is not shown in FIG. 6) are air bearing members 77b, 78b. Is attached to each. The linear motor set 91b includes a stator 89b and a mover 90b. The mover 90b is fixed to an air bearing member 78b, and the stator 49b is fixed to a side of the reticle surface plate 36. In FIG. 6, the illustration of the stator 89a and the movable element 90a constituting the linear motor set 91a is omitted.
[0057]
These linear motor sets 91a and 91b may be any of a VCM (voice coil motor) type using Lorentz force as a thrust and an electromagnet type (sawer motor or the like) using a reactance force as a thrust (driving force). It is optional whether to mount 89a and mover 90a and to mount stator 49b and mover 90b. However, the larger one of the stators 89a, 89b and the movers 90a, 90b is preferably provided on the air bearing members 78a, 78b so as to be a part of the mass of the counter masses 79a, 79b.
[0058]
Referring back to FIG. 5, the projection optical system PL includes a plurality of refractive optical elements (lens elements), and both the object plane (reticle R) side and the image plane (wafer W) side are telecentric and have a circular projection field of view. Having. In addition, as the glass material of the plurality of lens elements included in the projection optical system PL, for example, quartz or fluorite is selected according to the wavelength of the illumination light for exposure. When the illumination light emitted from the illumination optical system IU illuminates the reticle R, the illumination light transmitted through the reticle R enters the projection optical system PL, and a partial inverted image of the pattern formed on the reticle becomes an image of the projection optical system PL. At the center of the circular field on the surface side, an image is formed while being limited to a slit shape. As a result, the projected partial inverted image of the pattern is reduced and transferred to the resist layer on the surface of one of the plurality of shot areas on the wafer W arranged on the imaging plane of the projection optical system PL.
[0059]
Some of the lens elements (for example, five lens elements) provided in the projection optical system PL (constituting the projection optical system PL) are driven by a drive source such as an actuator using a piezoelectric element, a magnetostrictive actuator, or a fluid pressure actuator. It is configured to be movable in the axis AX direction (Z direction) and to be tiltable about the X direction or Y direction. By adjusting the attitude of one of the lens elements configured to be movable and tiltable, or by adjusting the attitude of a plurality of lens elements in association with each other, for example, five rotations generated in the projection optical system PL The symmetric aberration and the five eccentric aberrations can be individually corrected. The five rotationally symmetric aberrations referred to here include magnification, distortion (distortion), coma, field curvature, and spherical aberration. The five eccentric aberrations include eccentric distortion, eccentric coma, eccentric astigmatism, and eccentric spherical aberration.
[0060]
The projection optical system PL is mounted on a lens barrel base 49 made of a casting or the like substantially horizontally supported on a step portion 34b of the main frame 34 via a vibration isolating unit 48 from above with the optical axis AX direction as the Z direction. While being inserted, the flange 50 is engaged. Here, the anti-vibration unit 48 is arranged at each corner of the lens barrel base 49, and has a configuration in which an air mount 51 and a voice coil motor 52 capable of adjusting the internal pressure are arranged in series on the step 34b. I have. In FIG. 5, only the vibration isolating unit 48 arranged in the X direction is shown, and the vibration isolating unit arranged in the Y direction is not shown. By these vibration isolating units 48, minute vibrations transmitted to the lens barrel base 49 (and the projection optical system PL) via the base plate 40 and the main frame 34 are insulated at the micro G level.
[0061]
The stage device 33 includes a wafer stage 37, a wafer surface plate 38 that supports the wafer stage 37 movably in a two-dimensional direction along the XY plane, and a sample table that is provided integrally with the wafer stage 37 and holds the wafer W by suction. ST, an X guide bar XG that supports the wafer stage 37 and the sample stage ST so as to be relatively movable. A plurality of air bearings (air pads) 53, which are non-contact bearings, are fixed to the bottom surface of the wafer stage 37, and the wafer stage 37 is placed on the wafer base 38 by the air bearings 53, for example, with a clearance of about several microns. Floating supported via.
[0062]
The wafer surface plate 38 is supported substantially horizontally above the base plate 40 via an anti-vibration unit 54. The anti-vibration unit 54 is arranged at each corner of the wafer surface plate 38, and has a configuration in which an air mount 55 and a voice coil motor 56 whose internal pressure is adjustable are arranged in parallel on the base plate 40. In FIG. 5, only the vibration isolating unit 54 arranged in the X direction is shown, and the vibration isolating unit arranged in the Y direction is not shown. By these vibration isolating units 54, micro vibration transmitted to the wafer surface plate 38 via the base plate 40 is insulated at a micro G level. An acceleration sensor 57 for detecting the acceleration of the wafer stage 37 is attached to one end of the wafer stage 37.
[0063]
Here, the stage device 33 will be described in detail. FIG. 7 is an external perspective view of the stage device 33 provided in the exposure apparatus according to one embodiment of the present invention. As shown in FIG. 7, the X guide bar XG has a long shape along the X direction, and movers 58, 58 each composed of an armature unit are provided at both ends in the length direction. The stators 59, 59 having magnet units corresponding to the movers 58, 58 are provided on support portions 60, 60 projecting from the base plate 40 (in FIG. 1, the mover 58 and the fixed member are fixed). The child 59 is shown simply.)
[0064]
The linear motors 61 and 61 are configured by the mover 58 and the stator 59, and the X guide bar XG moves in the Y direction by driving the mover 58 by electromagnetic interaction with the stator 59. It moves and rotates in the θZ direction by adjusting the drive of the linear motors 61 and 61. That is, the wafer stage 37 (and the sample stage ST, hereinafter simply referred to as the sample stage ST) is driven in the Y direction and the θZ direction almost integrally with the X guide bar XG by the linear motor 61.
[0065]
A mover of the X trim motor 92 is mounted on the −X direction side of the X guide bar XG. The X trim motor 92 adjusts the position of the X guide bar XG in the X direction by generating a thrust in the X direction. A stator (not shown) is provided on the main frame 34. Therefore, a reaction force when driving the wafer stage 37 in the X direction is transmitted to the base plate 40 via the main frame 34.
[0066]
The sample stage ST is supported by the X guide bar XG in a non-contact manner so as to be relatively movable in the X direction via a magnetic guide including a magnet and an actuator that maintains a predetermined gap in the Z direction between the sample stage ST and the X guide bar XG.・ Holded. Further, the wafer stage 37 is driven in the X direction by electromagnetic interaction by an X linear motor 93 having a stator embedded in the X guide bar XG. Although not shown, the mover of the X linear motor 93 is attached to the wafer stage 37. A wafer W is fixed to the upper surface of the sample stage ST via a wafer holder 62 by vacuum suction or the like (see FIG. 1).
[0067]
Note that the X linear motor 93 is arranged closer to the wafer W mounted on the wafer stage 37 than the linear motor 61, and the mover of the linear motor is fixed to the sample stage ST. . For this reason, it is desirable to use a moving magnet type linear motor for the X linear motor 93 in which the coil serving as a heat source becomes a stator and moves away from the wafer W and is not directly fixed to the sample stage ST. Further, the linear motor 61 needs a much larger thrust than the X linear motor 93 because the X linear motor 93, the X guide bar XG, and the sample stage ST are integrally driven. Therefore, a large amount of power is required, and the amount of heat generated is larger than that of the X linear motor 93. Therefore, it is desirable to use a moving coil type linear motor as the linear motor 61. However, since the moving coil type linear motor needs to circulate the coolant through the mover 58, if there is a problem in the device configuration, a moving magnet type linear motor having a magnet on the mover 58 side is used. May be.
[0068]
The position of the wafer stage 37 in the X direction changes with respect to a reference mirror 63 (see FIG. 1) fixed to the lower end of the lens barrel of the projection optical system PL. 1 is measured in real time at a predetermined resolution, for example, a resolution of about 0.5 to 1 nm by the laser interferometer 65 shown in FIG. The position of the wafer stage 37 in the Y direction is measured by a reference mirror, a laser interferometer, and a movable mirror (not shown) which are arranged substantially orthogonal to the reference mirror 63, the movable mirror 64, and the laser interferometer 65. At least one of these laser interferometers is a multi-axis interferometer having two or more measurement axes. Based on the measurement values of these laser interferometers, the wafer stage 37 (and thus the wafer W) in the X direction is measured. In addition to the position and the position in the Y direction, the θ rotation amount and the leveling amount can be obtained.
[0069]
As shown in FIG. 5, three laser interferometers 66 are fixed to three different places on the flange 50 of the projection optical system PL (however, in FIG. 5, one of these laser interferometers is fixed). Is shown as a representative). Openings 67a are respectively formed in portions of the lens barrel base 49 facing each of the laser interferometers 66, and laser beams (measuring beams) in the Z direction from each of the laser interferometers 66 through these openings 67a. Is irradiated toward the wafer surface plate 38. A reflection surface is formed on the upper surface of the wafer surface plate 38 at a position facing each measurement beam. Therefore, the three laser interferometers 66 measure three different Z positions of the wafer surface plate 38 with the flange 50 as a reference.
[0070]
Next, a schematic configuration of a control system of the stage device 32 will be described. FIG. 8 is a block diagram showing a schematic configuration of a control system of the stage device 32. Note that components corresponding to those shown in FIGS. 5 and 6 are denoted by the same reference numerals. In FIG. 8, members not shown in FIG. 6, that is, laser interferometers 101 to 103 for measuring the position and rotation amount of the fine movement stage 71 in the XY plane, and fixed to the fine movement stage 71. The movable mirror 104 and the corner mirrors 105 and 106, and the corner mirror 107 and the laser interferometer 108 fixed to the coarse movement stage 70 are also illustrated. The laser interferometers 101 to 103 and the laser interferometer 108 correspond to the laser interferometer 8 shown in FIG.
[0071]
The measurement results of the laser interferometers 101 to 103 and 108 are output to the position information calculation unit 109. The position information calculation unit 109 calculates the position information in the X direction of the fine movement stage unit 71 from the measurement result of the laser interferometer 101, and calculates the Y information of the fine movement stage unit 71 from one of the measurement results of the laser interferometers 102, 103, and 108. The position information in the direction is calculated, and information indicating the amount of rotation of the fine movement stage section 71 in the XY plane is calculated from the difference between the measurement results of the two laser interferometers 102 and 103. Further, the detection results of the linear encoder sets 88a and 88b are input to the position information calculation unit 109, and the position information calculation unit 109 calculates the position information of the counter masses 79a and 79b in the Y direction based on these detection results. I do.
[0072]
The position information calculated by the position information calculation unit 109 is output to the main control system 110 and the stage control device 111. The detection results of the acceleration sensor 47 provided on the reticle stage 35 and the acceleration sensor 57 provided on the wafer stage 37 are output to the stage control device 111. The main control system 110 refers to the position information from the position information calculation unit 109 and, based on a preset recipe (a control command group that defines the operation of the exposure apparatus), outputs target information (corresponding to the position command signal CS). Output to the stage control device 111.
[0073]
The stage control device 111 corresponds to the stage control device 1 shown in FIG. 1, and supplies a drive signal according to target information from the main control system 110 to the shaft type linear motors 75 and 76 to control the reticle stage 35. Move in the Y direction. At this time, the stage control device 111 feeds back a detection signal output from the acceleration sensor 47 as an acceleration signal AS, performs proportional-plus-integral control of the acceleration of the reticle stage 35, and outputs the position information calculated by the position information calculation unit 109 to the stage. The position signal PS is fed back as the position signal PS, and the position of the reticle stage 35 is proportionally and differentially controlled. Further, the stage control device 111 applies a drive current to the linear motor sets 91a and 91b to absorb a reaction force generated due to acceleration / deceleration of the reticle stage 35, and supplies counter currents 79a and 79b (not shown in FIG. 8). ) Is moved in the direction opposite to the direction in which the reticle stage 35 moves.
[0074]
By performing the above control, the movement of the reticle stage 35 can be controlled at high speed and with high accuracy. In FIG. 8, the control system of the stage device 32 has been described as an example. However, the same control system is also provided for the stage device 33 to control the movement of the wafer stage 37 at high speed and high accuracy. can do. For the stage device 33, the detection result of the acceleration sensor 57 mounted on the wafer stage 37 is used as the acceleration signal AS, and the position information calculated from the measurement result of the laser interferometer 65 is used as the stage position signal PS.
[0075]
[Device manufacturing method]
Next, a method for manufacturing a device using the exposure apparatus according to the embodiment of the present invention in a lithography process will be briefly described. FIG. 9 is a flowchart showing an example of a manufacturing process of a micro device (a semiconductor chip such as an IC or LSI, a liquid crystal panel, a CCD, a thin-film magnetic head, a micromachine, etc.). As shown in FIG. 9, first, in step S30 (design step), a function / performance design of a micro device (for example, a circuit design of a semiconductor device or the like) is performed, and a pattern design for realizing the function is performed. Subsequently, in step S31 (mask manufacturing step), a mask (reticle) on which the designed circuit pattern is formed is manufactured. On the other hand, in step S32 (wafer manufacturing step), a wafer is manufactured using a material such as silicon.
[0076]
Next, in step S33 (wafer processing step), using the mask and the wafer prepared in steps S30 to S32, an actual circuit or the like is formed on the wafer by a lithography technique or the like, as described later. Next, in step S34 (device assembly step), device assembly is performed using the wafer processed in step S33. Step S34 includes processes such as a dicing process, a bonding process, and a packaging process (chip encapsulation) as necessary. Finally, in step S35 (inspection step), inspections such as an operation confirmation test and a durability test of the microdevice manufactured in step S34 are performed. After these steps, the microdevice is completed and shipped.
[0077]
FIG. 10 is a diagram showing an example of a detailed flow of step S33 in FIG. 9 in the case of a semiconductor device. In FIG. 10, in step S41 (oxidation step), the surface of the wafer is oxidized. In step S42 (CVD step), an insulating film is formed on the wafer surface. In step S43 (electrode formation step), electrodes are formed on the wafer by vapor deposition. In step S44 (ion implantation step), ions are implanted into the wafer. Each of the above steps S41 to S44 constitutes a preprocessing step in each stage of the wafer processing, and is selected and executed according to a necessary process in each stage.
[0078]
In each stage of the wafer process, when the above-mentioned pre-processing step is completed, the post-processing step is executed as follows. In this post-processing step, first, in step S45 (resist forming step), a photosensitive agent is applied to the wafer. Subsequently, in step S46 (exposure step), the circuit pattern of the mask is transferred onto the wafer by the lithography system (exposure apparatus) and the exposure method described above. Next, in step S47 (development step), the exposed wafer is developed, and in step S48 (etching step), the exposed members other than the portion where the resist remains are removed by etching. Then, in step S49 (resist removing step), unnecessary resist after etching is removed. By repeatedly performing these pre-processing steps and post-processing steps, multiple circuit patterns are formed on the wafer.
[0079]
【The invention's effect】
As described above, according to the present invention, the acceleration of the stage is at least integratedly controlled based on the acceleration signal indicating the fed back acceleration of the stage, and the position of the stage is determined based on the position signal indicating the fed back position of the stage. Is at least proportionally controlled, so that the vibration of the stage is suppressed and the settling time is shortened, and further, there is an effect that the compensation for the disturbance force applied to the stage can be completely performed. Thereby, there is an effect that the movement of the stage can be controlled at high speed and with high accuracy.
Further, according to the present invention, the first control signal for at least proportionally controlling the position of the stage based on the target position signal indicating the target position of the stage and the position signal indicating the actual position of the stage is generated, and the first control signal is generated. A second control signal for at least integrating control of the acceleration of the stage is generated based on the signal and the acceleration signal indicating the acceleration of the stage, and the stage is controlled, so that the vibration of the stage is suppressed and the settling time is reduced, In addition, there is an effect that compensation for disturbance force applied to the stage can be completely performed. Thereby, there is an effect that the movement of the stage can be controlled at high speed and with high accuracy.
Further, according to the present invention, since at least one of the mask stage and the substrate stage is controlled using the stage control capable of controlling the movement of the stage with high speed and high accuracy, a fine pattern is formed on the substrate at a high level. The transfer can be performed with the overlay accuracy, and the time required for moving the stage can be shortened, so that the throughput can be improved.
Further, according to the present invention, since the lithography step includes an exposure step of performing exposure using the above-described exposure apparatus, there is an effect that a large number of devices can be efficiently manufactured with a high yield.
[Brief description of the drawings]
FIG. 1 is a block diagram schematically showing an overall configuration of a control system including a stage control device according to an embodiment of the present invention.
FIG. 2 is a control block diagram illustrating a configuration example of a stage control device 1 according to an embodiment of the present invention.
FIG. 3 is a diagram showing a simulation result obtained by moving the stage device 2 stepwise by the stage control device 1 according to the embodiment of the present invention.
FIG. 4 is a diagram showing a simulation result when a disturbance force is applied to the stage device 2 controlled by the stage control device 1 according to one embodiment of the present invention.
FIG. 5 is a diagram showing a schematic configuration of an exposure apparatus according to an embodiment of the present invention.
FIG. 6 is an external perspective view of a stage device 32 including a reticle stage 35 provided in the exposure apparatus according to one embodiment of the present invention.
FIG. 7 is an external perspective view of a stage device 33 provided in the exposure apparatus according to the embodiment of the present invention.
FIG. 8 is a block diagram showing a schematic configuration of a control system of the stage device 32.
FIG. 9 is a flowchart illustrating an example of a manufacturing process of a micro device.
FIG. 10 is a diagram showing an example of a detailed flow of step S33 in FIG. 9 in the case of a semiconductor device.
FIG. 11 is a control block diagram illustrating a configuration example of a conventional stage control device.
FIG. 12 is a diagram showing a simulation result obtained by stepwise moving the stage by the conventional stage control device shown in FIG. 11;
13 is a diagram showing a simulation result when a disturbance force is applied to a stage controlled by the conventional stage control device shown in FIG.
[Explanation of symbols]
1 Stage control device
2 Stage equipment (stage)
7 acceleration sensor (accelerometer)
8 Laser interferometer
11 Position command generator (target position signal output unit)
13 First control system
15 Second control system
13a Proportional controller (second proportional controller)
13b Differential controller (differential controller)
13c adder (second adder)
15a Proportional controller (first proportional controller)
15b integral controller (integral controller)
15c adder (first adder)
31 Exposure equipment
35 Reticle stage (mask stage)
37 Wafer Stage (Substrate Stage)
111 Stage control device
AS acceleration signal
CS position command signal (target position signal)
DS error signal (thrust command signal)
IU illumination optical system (exposure means)
PL projection optical system (optical system, exposure means)
PS stage position signal (position signal)
R reticle (mask)
S1 First control signal
S2 Second control signal
S11 Proportional control signal (second proportional control signal)
S12 Differential control signal
S21 Proportional control signal (first proportional control signal)
S22 Integration control signal
S33 Wafer processing step (lithography process)
S46 Exposure step (exposure step)
W wafer (substrate)

Claims (9)

In a stage control device that controls a stage configured to be movable,
A first feedback control system that feeds back an acceleration signal indicating the acceleration of the stage and performs at least integral control of the acceleration of the stage;
A second feedback control system that feeds back a position signal indicating an actual position of the stage and performs at least proportional control of the position of the stage. In a stage control device that controls a stage configured to be movable,
A target position signal output unit that outputs a target position signal indicating a target position of the stage,
A first control system that generates a first control signal for at least proportionally controlling the position of the stage based on an error signal that is a difference between the target position signal and a position signal indicating an actual position of the stage;
A stage that includes a second control system that generates a second control signal for at least integratingly controlling the acceleration of the stage based on the first control signal and an acceleration signal indicating the acceleration of the stage. Control device. An integration control unit that generates an integration control signal that integrates and controls the acceleration of the stage;
A first proportional control unit that is provided in parallel with the integral control unit and generates a first proportional control signal that proportionally controls the acceleration of the stage;
3. The stage control device according to claim 2, further comprising: a first adder that adds the integration control signal and the first proportional control signal to generate the second control signal. A second proportional control unit that generates a second proportional control signal that proportionally controls a position of the stage;
A differential control unit that is provided in parallel with the second proportional control unit and generates a differential control signal that differentially controls the position of the stage;
4. The stage control device according to claim 2, further comprising a second adding unit that adds the second proportional control signal and the differential control signal to generate the first control signal. The stage control device according to any one of claims 2 to 4, further comprising a laser interferometer that measures a position of the stage and outputs the position signal. The stage control device according to claim 5, further comprising a calculation unit that performs a calculation on the position signal and outputs the acceleration signal. The stage control device according to claim 5, further comprising an accelerometer that measures the acceleration of the stage and outputs the acceleration signal. Exposure means for exposing a pattern of a mask onto a substrate via an optical system, a mask stage for moving the mask, and a substrate stage for moving the substrate, comprising:
An exposure apparatus wherein at least one of the mask stage and the substrate stage is controlled using the stage control device according to any one of claims 1 to 7. A method for manufacturing a device including a lithography step,
A device manufacturing method, comprising an exposure step of performing exposure using the exposure apparatus according to claim 8 in the lithography step.

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