JP2004221153A - Stacked electronic component array - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a stacked electronic component array with small equivalent serial inductance of a ground electrode and a hot electrode. <P>SOLUTION: The ground electrode 18 is formed substantially over the entire surface of a sheet 12, and its leads 18a are taken out substantially at equal intervals to front and rear parts and lateral parts of the sheet 12 and to left and right end surfaces of the same radially from the central position P of the ground electrode 18 (sheet 12). Capacitor electrodes 13, 14, 15, and 16 are also formed substantially over the entire surface of the sheet 12, and their leads 13a, 14a, 15a, and 16a are led point symmetrically one by one to a front side surface of the sheet 12 and to a rear side surface of the same or to the left end surface of the sheet 12 and to the right end surface of the same. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a multilayer electronic component array, and more particularly to a multilayer electronic component array in which two-terminal capacitor elements, three-terminal capacitor elements, LC composite elements, and the like are arranged in an array in a laminate.
[0002]
[Prior art]
As a conventional capacitor array, the one described in Patent Document 1 is known. As shown in FIG. 19, the three-terminal capacitor array 1 has four built-in three-terminal capacitor elements, and includes a ceramic sheet 2 having capacitor electrodes (hot electrodes) 3, 4,. It is composed of a ceramic sheet 2 provided with a ground electrode 5 on its surface, a ceramic sheet 2 provided with no electrodes, and the like.
[0003]
The ground electrode 5 is formed over substantially the entire surface of the ceramic sheet 2, and the lead portion 5 a is drawn out to the left and right sides of the front and rear sides of the ceramic sheet 2. Also, the capacitor electrodes 3, 4,... Are formed over substantially the entire surface of the ceramic sheet 2, and the lead portions 3a, 4a,. . The lead-out portions 3a, 4a,... Of the capacitor electrodes 3, 4,. The lead portions 5a of the ground electrodes 5 are formed at the same position in the laminating direction.
[0004]
The ceramic sheet 2 on which the ground electrode 5 is formed and the ceramic sheet 2 on which the capacitor electrodes 3, 4,... Are formed are alternately stacked and then integrally fired to form a laminate 6 shown in FIG. . Six external electrodes are formed on each of the front and rear side surfaces of the laminated body 6, and the external electrodes G on both sides of the front and rear side surfaces serve as a common ground external electrode, and a total of eight external electrodes 7a, 7b, 8a, 8b, 9a, 9b, 10a, and 10b are individual external electrodes of the three-terminal capacitor element.
[0005]
[Patent Document 1]
Japanese Utility Model Publication No. Sho 62-188126
[Problems to be solved by the invention]
However, in the conventional three-terminal capacitor array 1, the lead portion 5 a of the ground electrode 5 is drawn only to the front and rear side surfaces of the multilayer body 6. For this reason, the ground electrode 5 has only two drawing directions, and there is a problem that the equivalent series inductance (ESL) of the ground electrode 5 is relatively large. Also, the positions of the lead portions 3a and 3a of the capacitor electrodes 3, 4,..., The positions of 4a and 4a,. Not symmetric. Therefore, there is a problem that the equivalent series inductance (ESL) of the capacitor electrodes 3, 4,... Is relatively large.
[0007]
Therefore, an object of the present invention is to provide a multilayer electronic component array having a small equivalent series inductance of a ground electrode and a hot electrode.
[0008]
Means and action for solving the problem
In order to achieve the object, a multilayer electronic component array according to the present invention includes:
(A) stacking a plurality of hot electrodes, a plurality of insulating layers, and a plurality of ground electrodes to form a rectangular parallelepiped laminate;
(B) a plurality of electronic elements having a capacitance formed by the hot electrode and the ground electrode facing each other via an insulating layer are arranged in an array in the laminate;
(C) a lead portion of each hot electrode is electrically connected to a hot external electrode provided on an end face or a side face of the laminate;
(D) a plurality of lead portions of each ground electrode are electrically connected to a ground external electrode provided on an end face or a side face of the laminate;
(E) hot external electrodes and ground external electrodes are alternately arranged over the end face and side face of the laminate;
It is characterized by. The electronic element is a two-terminal capacitor element, a three-terminal capacitor element, an LC composite element, or the like.
[0009]
The lead portion of each hot electrode is electrically connected to the hot external electrode, the plurality of lead portions of each ground electrode are electrically connected to the ground external electrode, and the hot external electrode and the ground external electrode are connected to the end face of the laminate and Since the noise currents (high-frequency currents) flowing through the ground electrode are alternately arranged on the side surfaces, the noise currents (high-frequency currents) flow to the ground external electrode through a plurality of substantially radially arranged lead portions. Therefore, the magnetic fields generated by the noise current cancel each other as a whole, and the equivalent series inductance of the ground electrode is reduced.
[0010]
Since the hot external electrodes and the ground external electrodes are alternately arranged, electromagnetic interference (crosstalk) between adjacent hot external electrodes (between adjacent electronic elements) is suppressed by the ground external electrodes.
[0011]
In addition, the plurality of lead portions of the ground electrode are led out to the four end faces and side surfaces of the multilayer body, and the lead portions are arranged in line symmetry, so that the lead portions are arranged more radially.
[0012]
In addition, since the hot electrode has a plurality of lead portions and the lead portions are arranged point-symmetrically, magnetic fields generated by a noise current flowing through the hot electrode cancel each other as a whole, so that the equivalent of the hot electrode is obtained. The series inductance becomes smaller.
[0013]
Furthermore, by arranging the hot electrodes of a plurality of electronic elements so as to overlap in the stacking direction of the stacked body, a stacked type occupying a small area on a printed circuit board while sufficiently securing the capacitance of each electronic element. An electronic component array is obtained.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of a multilayer electronic component array according to the present invention will be described with reference to the accompanying drawings.
[0015]
[First Embodiment, FIGS. 1 to 6]
The first embodiment will be described using a three-terminal type (through-type) capacitor array as an example. As shown in FIG. 1, the three-terminal capacitor array 11 has four built-in three-terminal capacitor elements C1 to C4, and has capacitor electrodes (hot electrodes) 13, 14, 15, and 16 provided on the surface, respectively. It is composed of a dielectric ceramic sheet 12, a dielectric ceramic sheet 12 provided with a ground electrode 18 on the surface thereof, a dielectric ceramic sheet 12 provided with no electrodes, and the like.
[0016]
The dielectric ceramic sheet 12 is formed by kneading a dielectric ceramic powder together with a binder or the like and forming the mixture into a sheet. The capacitor electrodes 13 to 16 and the ground electrode 18 are formed by a method such as screen printing, sputtering, vapor deposition, or photolithography. As a material, a material mainly composed of a low-resistance metal material such as Ag, Pd, Ag-Pd, Ni, Cu, or Al is used.
[0017]
The ground electrode 18 is formed over substantially the entire surface of the sheet 12, and the lead portions 18 a are drawn out at substantially equal intervals from the center position P of the ground electrode 18 (sheet 12) to the front and rear side surfaces and the left and right end surfaces of the sheet 12. ing. The drawer 18a is arranged symmetrically with respect to the line. The capacitor electrodes 13, 14, 15, 16 are also formed over substantially the entire surface of the sheet 12, and the lead portions 13a, 14a, 15a, 16a are formed on the front and rear sides of the sheet 12, or the left and right end faces of the sheet 12. Each one is drawn point-symmetrically. The lead portions 13a to 16a of the capacitor electrodes 13 to 16 are formed at different positions in the laminating direction. The lead portions 18a of the ground electrodes 18 are formed at the same position in the laminating direction.
[0018]
The capacitor electrodes 13 to 16 are arranged so as to overlap in the stacking direction of the sheets 12, and are sandwiched by the ground electrodes 18 with the dielectric ceramic sheet 12 interposed therebetween. An electrostatic capacitance is formed between the capacitor electrodes 13 to 16 and the ground electrode 18. Each of the capacitor electrodes 13 to 16 constitutes a three-terminal capacitor element C2, C3, C1, C4 together with the ground electrodes 18 arranged above and below.
[0019]
After the above dielectric ceramic sheets 12 are stacked, they are integrally fired to form a rectangular parallelepiped laminate 20 shown in FIG. On the front and rear side surfaces and the left and right end surfaces of the laminated body 20, ground external electrodes G and hot external electrodes 21a, 21b,..., 24a, 24b are alternately provided at substantially equal intervals. The ground external electrodes G on the left and right end surfaces of the multilayer body 20 are formed at corners (corner parts) of the multilayer body 20 and extend around the front and rear side surfaces. The external electrodes 21a to 24b and G are formed by applying and baking a paste for external electrodes, and then coating with a plating film of Ni or solder.
[0020]
The lead portions 15a of the capacitor electrode 15 are electrically connected to the hot external electrodes 21a and 21b, respectively. The lead portions 13a of the capacitor electrode 13 are electrically connected to the hot external electrodes 22a and 22b, respectively. The lead portions 14a of the capacitor electrode 14 are electrically connected to the hot external electrodes 23a and 23b, respectively. The lead portions 16a of the capacitor electrode 16 are electrically connected to the hot external electrodes 24a and 24b, respectively. The lead portions 18a of the ground electrode 18 are electrically connected to the eight ground external electrodes G, respectively.
[0021]
FIG. 3 is an equivalent circuit diagram of the three-terminal capacitor array 11. The signal current (DC current) flows from the hot external electrodes 21a to 24a to the hot external electrodes 21b to 24b through the capacitor electrodes 13 to 16. On the other hand, the noise current (high-frequency current) that has entered the capacitor electrodes 13 to 16 flows through the three-terminal capacitor elements C1 to C4 and the ground electrode 18 and the ground external electrode G.
[0022]
Here, in the three-terminal capacitor array 11, as shown in FIG. 4, the lead portion 18 a of the ground electrode 18 is drawn radially from the center position P to the four surfaces of the multilayer body 20. Thereby, the magnetic fields respectively generated by the noise currents cancel each other as a whole. As a result, the equivalent series inductance of the ground electrode 18 can be reduced.
[0023]
Further, since each of the capacitor electrodes 13 to 16 has the two lead portions 13a to 16a drawn out point-symmetrically with respect to the center position P, for example, as shown in FIG. The noise current that enters the capacitor electrode 14 and the noise current that enters the capacitor electrode 14 through the hot external electrode 23b flow substantially in opposite directions. Thereby, the magnetic fields respectively generated by the noise currents cancel each other as a whole. As a result, the equivalent series inductance of each of the capacitor electrodes 13 to 16 can be reduced.
[0024]
FIG. 6 is a graph showing the impedance characteristics of the three-terminal capacitor array 11 (size: 3.2 mm × 1.6 mm) (see the solid line 28). For comparison, the impedance characteristics of a conventional two-terminal capacitor array having a size of 3.2 mm × 1.6 mm (the lead portion of the ground electrode is drawn only on two surfaces) are also shown (dotted line). 29).
[0025]
In addition, since the ground external electrodes G and the hot external electrodes 21a to 24b are alternately provided at substantially equal intervals over the end surface and the side surface of the multilayer body 20, the space between the adjacent hot external electrodes 21a to 24b is shielded by the ground external electrode G. be able to. As a result, electromagnetic interference between the hot external electrodes 21a to 24b can be reduced.
[0026]
Further, since the three-terminal capacitor elements C1 to C4 are arranged in the stacking direction of the multilayer body 20, it is possible to prevent the size of components from increasing while ensuring sufficient capacitance of each capacitor element. The three-terminal capacitor array 11 having a small upper occupied area can be obtained.
[0027]
[Second embodiment, FIGS. 7 to 9]
As shown in FIG. 7, the multilayer electronic component array 31 of the second embodiment is different from the three-terminal capacitor array 11 of the first embodiment in that a meandering shape (meander shape) is used instead of the rectangular capacitor electrodes 13 to 16. ) Uses the inductor electrodes (hot electrodes) 33-36. As a result, as shown in FIG. 8, a distributed constant type in which the inductance elements of the inductor electrodes 33 to 36 are combined with the capacitor elements C1 to C4 formed by the inductor electrodes 33 to 36 and the ground electrode 18 facing each other. An LC composite component array 31 incorporating four LC composite elements is obtained.
[0028]
Each of the inductor electrodes 33 to 36 has, for example, a point-symmetric shape with respect to the center position P of the sheet 12 as shown in FIG. The respective lead-out portions 33a, 34a, 35a, 36a are drawn point-symmetrically one by one on the front side surface and the rear side surface of the seat 12, or one on the left end surface and the right end surface of the seat 12, respectively. Therefore, the noise current that enters the inductor electrode 34 through the hot external electrode 23a and the noise current that enters the inductor electrode 34 through the hot external electrode 23b flow in substantially opposite directions. Thereby, the magnetic fields respectively generated by the noise currents can be mutually canceled as a whole.
[0029]
[Third Embodiment, FIGS. 10 to 13]
As shown in FIG. 10, the multilayer electronic component array 51 of the third embodiment is different from the three-terminal capacitor array 11 of the first embodiment in that the inductor electrodes 52, instead of the capacitor electrodes 13 to 16, serve as hot electrodes. , And capacitor electrodes 53, 54, 56, 57,... Thereby, as shown in FIG. 11, the capacitor elements formed by the inductance elements L1 to L4 of the inductor electrodes 52, 55,... And the capacitor electrodes 53, 54, 56, 57,. An LC composite component array 51 having four built-in π-type (lumped constant) LC composite elements combined with C1 to C8 is obtained.
[0030]
Each of the inductor electrodes 52, 55, ... and each of the capacitor electrodes 53, 54, 56, 57, ... have a point-symmetrical shape with respect to the center position P of the sheet 12, as shown in Figs. ing. Therefore, the magnetic fields generated by the noise current can be canceled out.
[0031]
[Fourth embodiment, FIGS. 14 to 18]
In the fourth embodiment, a two-terminal capacitor array will be described as an example. As shown in FIG. 14, the two-terminal capacitor array 71 has four built-in two-terminal capacitor elements C <b> 1 to C <b> 4, and has capacitor electrodes (hot electrodes) 73, 74, 75, 76 provided on the surface, respectively. It is composed of a dielectric ceramic sheet 72, a dielectric ceramic sheet 72 provided with a ground electrode 78 on the surface thereof, a dielectric ceramic sheet 72 provided with no electrodes, and the like.
[0032]
The ground electrode 78 is formed over substantially the entire surface of the sheet 72, and the lead portions 78 a are drawn out at substantially equal intervals from the center position P of the ground electrode 78 (the sheet 72) to the front and rear side surfaces and the left and right end surfaces of the sheet 72. ing. The capacitor electrodes 73, 74, 75, and 76 are also formed over substantially the entire surface of the sheet 72, and the lead portions 73 a, 74 a, 75 a, and 76 a are drawn out to the front side or the rear side of the sheet 72. The lead portions 73a to 76a of the capacitor electrodes 73 to 76 are formed at different positions in the laminating direction. The lead portions 78a of the respective ground electrodes 78 are formed at the same position in the laminating direction.
[0033]
Each of the capacitor electrodes 73 to 76 is sandwiched between ground electrodes 78 with a dielectric ceramic sheet 72 therebetween. Each of the capacitor electrodes 73 to 76 constitutes a two-terminal capacitor element C1, C2, C3, C4 together with the ground electrodes 78 arranged above and below.
[0034]
After the above dielectric ceramic sheets 72 are stacked, they are integrally fired to form a laminate 80 shown in FIG. Ground external electrodes G and hot external electrodes 81 to 84 are alternately provided at substantially equal intervals on the front and rear side surfaces and the left and right end surfaces of the stacked body 80.
[0035]
The lead portion 73 a of the capacitor electrode 73 is electrically connected to the hot external electrode 81. The lead portion 74a of the capacitor electrode 74 is electrically connected to the hot external electrode 82. The lead portion 75a of the capacitor electrode 75 is electrically connected to the hot external electrode 83. The hot external electrode 84 is electrically connected to a lead portion 76 a of the capacitor electrode 76. The lead portions 78a of the ground electrode 78 are electrically connected to the four ground external electrodes G, respectively.
[0036]
FIG. 16 is an equivalent circuit diagram of the two-terminal capacitor array 71. Noise currents (high-frequency currents) that have entered the capacitor electrodes 73 to 76 from the hot external electrodes 81 to 84 flow to the ground electrode 78 and the ground external electrode G through the two-terminal capacitor elements C1 to C4.
[0037]
Here, in the two-terminal capacitor array 71, as shown in FIG. 17, the lead portion 78 a of the ground electrode 78 is drawn radially from the center position P to the four surfaces of the multilayer body 80. Thereby, the magnetic fields respectively generated by the noise currents cancel each other as a whole. As a result, the equivalent series inductance of the ground electrode 78 can be reduced.
[0038]
FIG. 18 is a graph showing the impedance characteristics of the two-terminal capacitor array 71 (size: 2.0 mm × 1.25 mm × 0.85 mm) (see the solid line 88). For comparison, the impedance characteristics of a conventional two-terminal capacitor array having a size of 2.0 mm × 1.25 mm × 0.85 mm (where the lead portion of the ground electrode is drawn in only two directions) is also described. (See dotted line 89).
[0039]
[Other embodiments]
The multilayer electronic component array according to the present invention is not limited to the above embodiment, but can be variously modified within the scope of the gist. For example, the laminated body is not limited to a rectangular parallelepiped shape, and may be a cylindrical shape or the like.
[0040]
In the above embodiment, the insulating sheets on which the electrodes are formed are stacked and then integrally fired, but the invention is not necessarily limited to this. The sheet may be fired in advance. Further, an electronic component array may be manufactured by a manufacturing method described below. After a paste-like insulating material is applied by printing or the like to form an insulating layer, a paste-like conductive material is applied to the surface of the insulating layer to form an electrode of an arbitrary shape. Next, a paste-like insulating material is applied over the electrodes. In this way, an electronic component array having a laminated structure is obtained by successively coating.
[0041]
【The invention's effect】
As apparent from the above description, according to the present invention, the lead portions of each hot electrode are electrically connected to the hot external electrodes, and the plurality of lead portions of each ground electrode are electrically connected to the ground external electrodes. Since the hot external electrodes and the ground external electrodes are alternately arranged over the end face and the side face of the stacked body, the noise current (high-frequency current) flowing through the ground electrode passes through a plurality of substantially radially arranged lead-out portions. Flows to the ground external electrode. Therefore, the magnetic fields generated by the noise current cancel each other as a whole, and the equivalent series inductance of the ground electrode is reduced. In addition, the plurality of lead portions of the ground electrode are led out to the four end faces and side surfaces of the multilayer body, and the lead portions are arranged in line symmetry, so that the lead portions are arranged more radially.
[0042]
Furthermore, since the hot electrode has a plurality of lead portions and the lead portions are arranged point-symmetrically, magnetic fields generated by noise current flowing through the hot electrode cancel each other as a whole, so that the equivalent of the hot electrode is obtained. The series inductance becomes smaller. As a result, a multilayer electronic component array having a small equivalent series inductance of the ground electrode and the hot electrode can be obtained.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view showing a first embodiment of a multilayer electronic component array according to the present invention.
FIG. 2 is an external perspective view of the multilayer electronic component array shown in FIG.
FIG. 3 is an electric equivalent circuit diagram of the multilayer electronic component array shown in FIG. 2;
FIG. 4 is a plan view of a dielectric ceramic sheet provided with a ground electrode.
FIG. 5 is a plan view of a dielectric ceramic sheet provided with capacitor electrodes.
FIG. 6 is a graph showing impedance characteristics of the multilayer electronic component array shown in FIG. 2;
FIG. 7 is an exploded perspective view showing a second embodiment of the multilayer electronic component array according to the present invention.
8 is an electric equivalent circuit diagram of the multilayer electronic component array shown in FIG.
FIG. 9 is a plan view of a dielectric ceramic sheet provided with inductor electrodes.
FIG. 10 is an exploded perspective view showing a third embodiment of the multilayer electronic component array according to the present invention.
11 is an electrical equivalent circuit diagram of the multilayer electronic component array shown in FIG.
FIG. 12 is a plan view of a dielectric ceramic sheet provided with inductor electrodes.
FIG. 13 is a plan view of a dielectric ceramic sheet provided with capacitor electrodes.
FIG. 14 is an exploded perspective view showing a fourth embodiment of the multilayer electronic component array according to the present invention.
15 is an external perspective view of the multilayer electronic component array shown in FIG.
16 is an electrical equivalent circuit diagram of the multilayer electronic component array shown in FIG.
FIG. 17 is a plan view of a dielectric ceramic sheet provided with a ground electrode.
FIG. 18 is a graph showing impedance characteristics of the multilayer electronic component array shown in FIG.
FIG. 19 is an exploded perspective view showing a conventional multilayer electronic component array.
20 is an external perspective view of the multilayer electronic component array shown in FIG. 19;
[Explanation of symbols]
11 three-terminal capacitor array 12 dielectric ceramic sheets 13, 14, 15, 16 ... capacitor electrodes 13a, 14a, 15a, 16a ... lead-out part 18 ... ground electrode 18a ... lead-out part 20 ... laminates 21a, 21b, 22a , 22b, 23a, 23b, 24a, 24b ... hot external electrodes 31 ... LC composite component arrays 33, 34, 35, 36 ... inductor electrodes 33a, 34a, 35a, 36a ... lead-out portions 51 ... LC composite component arrays 52, 55 ... Inductor electrodes 53, 54, 56, 57: Capacitor electrodes 71: Two-terminal capacitor array 72: Dielectric ceramic sheets 73, 74, 75, 76: Capacitor electrodes 73a, 74a, 75a, 76a: Leader 78: Ground electrode 78a ... Drawer section 80... Stacked bodies 81, 82, 83, 84. Pole C1 to C8 ... capacitor element G ... external ground electrode

Claims (5)

By stacking a plurality of hot electrodes, a plurality of insulating layers and a plurality of ground electrodes, a rectangular parallelepiped laminate is formed,
A plurality of electronic elements having a capacitance formed by the hot electrode and the ground electrode facing each other via the insulating layer are arranged in an array in the laminate,
A lead portion of each of the hot electrodes is electrically connected to a hot external electrode provided on an end face or a side face of the laminate,
A plurality of lead portions of each of the ground electrodes are electrically connected to a ground external electrode provided on an end surface or a side surface of the laminate,
The hot external electrodes and the ground external electrodes are alternately arranged over end surfaces and side surfaces of the laminate,
A stacked electronic component array characterized by the above-mentioned. 2. The multilayer electronic device according to claim 1, wherein the plurality of extraction portions of the ground electrode are extended to four end surfaces and side surfaces of the multilayer body, and the extraction portions are arranged line-symmetrically. 3. Parts array. 3. The multilayer electronic component array according to claim 1, wherein the hot electrode has a plurality of lead portions, and the lead portions are arranged point-symmetrically. 4. 4. The multilayer electronic component array according to claim 1, wherein hot electrodes of the plurality of electronic elements are arranged so as to overlap in a stacking direction of the multilayer body. 5. The multilayer electronic component array according to any one of claims 1 to 4, wherein the electronic element is any one of a two-terminal capacitor element, a three-terminal capacitor element, and an LC composite element.

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