JP2004207672A - Package for light emitting element and light emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for a light emitting element and a light emitting device in which emission efficiency of the light emitting device is enhanced by enhancing the coating strength of a reflective layer being applied to the inner surface of a through hole in a frame, and by reflecting the light emitted from the light emitting element well on the reflective layer thereby radiating the light uniformly and efficiently to the outside. <P>SOLUTION: In the package for a light emitting element, a ceramics frame 2 having a central through hole 2a for containing the light emitting element 3 is bonded to the upper surface of a rectangular prism ceramics substrate 1 having a part 1a for mounting the light emitting element 3 such that the frame 2 surrounds the mounting part 1a. The frame 2 comprises a sintered body of aluminum oxide wherein the inner surface of the through hole 2a is coated with a metal layer 6a containing tungsten and molybdenum and the metal layer 6a is coated sequentially with a nickel plating layer 6b and a silver plating layer 6c. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a light-emitting element housing package for housing a light-emitting element such as a light-emitting diode and a light-emitting device.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a ceramic package has been used as a light emitting element housing package (hereinafter, also referred to as a package) for housing a light emitting element such as a light emitting diode. As shown in FIG. 3, the conventional ceramic package has a mounting portion 21a formed of a conductor layer for mounting the light emitting element 23 at the center of the upper surface, and is led out from the mounting portion 21a and its periphery to the lower surface. And a substantially rectangular frame having a substantially rectangular parallelepiped ceramic base 21 having a pair of metallized wiring conductors 24a and 24b, and a through hole 22a in the center for receiving the light emitting element 23, which is joined to the upper surface of the base 21. And a frame 22 made of ceramic.
[0003]
Then, the light emitting element 23 is fixed to the mounting portion 21a connected to the one metallized wiring conductor 24a led out on the upper surface of the base 21 via a conductive bonding material or the like, and the electrode of the light emitting element 23 and the other metallized wiring are connected. By electrically connecting the conductor 24b to the conductor 24b via the bonding wire 25, and then filling the through hole 22a of the frame 22 with a transparent sealing resin (not shown) to seal the light emitting element 23, (For example, see Patent Document 1 below).
[0004]
In such a ceramic package, in order to improve the light emission efficiency of the light emitting device by reflecting the light emitted by the light emitting element 23 housed therein to improve the light emitting efficiency of the light emitting device, nickel A metallized metal layer 26a having a plated metal layer 26b made of a metal such as (Ni) or gold (Au) on its surface is deposited.
[0005]
Also, this package is manufactured by a ceramic green sheet (hereinafter, also referred to as green sheet) lamination method, and specifically, manufactured as follows. A green sheet for the base 21 and a green sheet for the frame 22 are prepared, and a through hole for leading the metallized wiring conductors 24a and 24b and a through hole for accommodating the light emitting element 23 are mainly provided in these green sheets. Punch almost perpendicular to the surface. Next, a conductor paste made of a high melting point metal powder such as W or Mo for forming metallized wiring conductors 24a and 24b is applied from the upper surface to the lower surface of the green sheet for the base 21 by a conventionally known screen printing method or the like. The above-mentioned conductor paste for forming the metallized metal layer 26a is applied to the inner surface of the through hole of the green sheet for 22 by a screen printing method or the like. A green sheet for the base 21 and a green sheet for the frame 22 are vertically stacked, and then fired at a high temperature to form a sintered body. After that, the metallized wiring conductors 24a, 24b and the metallized metal layer 26a are manufactured by depositing a plated metal layer 26b made of a metal such as Ni or Au by an electroless plating method or an electrolytic plating method.
[0006]
However, according to this conventional package, the inner surface of the through hole 22a is substantially perpendicular to the upper surface of the base 11, so that the light reflected on the inner surface of the through hole 22a is not uniformly and satisfactorily emitted to the outside. There is a problem that the luminous efficiency of the light emitting device using is not so high.
[0007]
Therefore, as shown in FIG. 2, a through hole 12a for accommodating the light emitting element 13 is provided at the center on the upper surface of the substantially rectangular parallelepiped base 11 having a mounting portion 11a for mounting the light emitting element 13 on the upper surface. A package formed by joining the frame body 12, wherein the inner surface of the through hole 12 a of the frame body 12 extends outward at an angle of 35 to 70 degrees with respect to the upper surface of the base body 11 and has a center line average roughness The present applicant has proposed a package having a plating metal layer 16b having an Ra of 1 to 3 μm and a reflectance of 80% or more for light emitted by the light emitting element 13 (Patent Document 1 below).
[0008]
According to this package, the inner surface of the through hole 12a extends outward at an angle of 35 to 70 degrees with respect to the upper surface of the base 11, and Ra of 1 to 3 μm and the light emitting element 13 emit light on the inner surface. Since the metallized metal layer 16a having a reflectance to light of 80% or more is applied, the light emitted from the light emitting element 13 housed in the through hole 12a is preferably provided by the plated metal layer 16b on the inner surface of the inclined through hole 12a. And radiate uniformly and efficiently toward the outside.
[0009]
This package is manufactured as follows. A through hole 12a is pierced in the green sheet for the frame 12 so that the inner surface thereof has an inclined surface of 35 to 70 degrees, and then a conductive paste is applied to the inner surface of the through hole 12a of the green sheet for the frame 12, Next, the green sheet for the frame body 12 and the green sheet for the base body 11 are laminated and joined in such a direction that the inner surface of the through hole 12a of the green sheet for the frame body 12 extends outward. By firing these, a frame 12 having a through hole 12a on the upper surface of the base 11 is laminated and integrated, and a sintered body in which a metallized metal layer 16a is adhered to the inner surface of the through hole 12a is obtained. Next, the metallized metal layer 16a on the inner surface of the through hole 12a is manufactured by depositing a plated metal layer 16b having a Ra of 1 to 3 μm and a reflectance of the light emitting element 13 for light of 80% or more.
[0010]
[Patent Document 1]
Japanese Patent Application Laid-Open No. 14-232017
[Problems to be solved by the invention]
However, according to the package of Patent Document 1, although the metallized metal layer 16a is adhered to the inner surface of the through hole 12a, heat generated from the light emitting element 13 and other external heat are generated at the metallized metal layer 16a. When the metallized metal layer 16a is applied, thermal stress is generated between the metallized metal layer 16a and the frame 12 in which the through hole 12a is formed due to a difference in thermal expansion coefficient between the metallized metal layer 16a and the frame body 12. In addition, there is a problem that the metallized metal layer 16a is peeled off from the portion where it is applied.
[0012]
Further, on the exposed surface of the metallized metal layer 16a, a plated metal layer 16b made of Ag, which is superior to Au in that the metal color shows a good white color for reflection and does not change the light color between incident light and reflected light, is provided. Is applied, the adhesion strength between the plating metal layer 16b and the metallized metal layer 16a is weak, and when the transparent sealing resin is filled in the through holes 12a of the frame 12, the light emitting element 13 is sealed. When the sealing resin is cured by applying heat, a thermal stress is generated between the sealing resin and the plating metal layer 16b and the metallized metal layer 16a due to a difference in thermal expansion coefficient between the sealing resin and the plating metal layer 16b. There is also a problem that the plating metal layer 16b is peeled off from the metallized metal layer 16a by acting to peel off the metallized metal layer 16a.
[0013]
Accordingly, the present invention has been completed in view of the above-mentioned conventional problems, and an object thereof is to provide a metallized metal layer applied to the inner surface of a through hole of a frame and a plated metal layer applied to the surface thereof. And the plating metal layer reflects the light of the light emitting element satisfactorily and radiates it uniformly and efficiently to the outside, thereby making it possible to extremely increase the light emitting efficiency of the light emitting device. An object of the present invention is to provide a highly reliable package for housing a light emitting element and a light emitting device.
[0014]
[Means for Solving the Problems]
The light-emitting element housing package of the present invention is a ceramic having a through hole for housing the light-emitting element in the center on the upper surface of a rectangular parallelepiped base made of ceramic having a mounting portion for mounting the light-emitting element on the upper surface. In the light emitting element housing package in which a frame made of is joined so as to surround the mounting portion, the frame is made of an aluminum oxide sintered body, and a metal containing tungsten and molybdenum on an inner surface of the through hole. A metal layer, and a nickel plating layer and a silver plating layer are sequentially deposited on the metal layer.
[0015]
In the light-emitting element housing package of the present invention, the frame is made of an aluminum oxide sintered body, and a metal layer containing tungsten and molybdenum is adhered to the inner surface of the through hole. Thermal stress generated due to a difference in thermal expansion coefficient between the frame made of the body and the metal layer is reduced, and the metal layer can be prevented from peeling off from the inner surface of the through hole.
[0016]
Further, since the Ni plating layer and the Ag plating layer are sequentially deposited on the metal layer, the adhesion strength between the metal layer and the Ni plating layer is strong, and the Ni plating layer and the Ag plating layer have good wettability. Since the adhesion strength is good, it is possible to prevent the Ni plating layer and the Ag plating layer from peeling off from the parts where they are adhered when the light emitting element is sealed with the transparent resin.
[0017]
Therefore, the reliability of the deposition of the reflective layer composed of the metal layer, the Ni plating layer, and the Ag plating layer is high, and the light emitted by the light emitting element housed in the through hole is favorably transmitted to the Ag plating layer on the inner surface of the through hole. The light can be reflected and radiated uniformly and efficiently toward the outside.
[0018]
A light emitting device according to the present invention includes the light emitting element housing package according to the present invention, a light emitting element mounted on the mounting portion, and a transparent resin covering the light emitting element.
[0019]
According to the light emitting device of the present invention, the above configuration makes it possible to achieve high reliability of the deposition of the reflective layer and high reflective performance.
[0020]
BEST MODE FOR CARRYING OUT THE INVENTION
The light emitting element housing package of the present invention will be described in detail below. FIG. 1 is a cross-sectional view showing an example of an embodiment of the package of the present invention, wherein 1 is a base, 2 is a frame, and these mainly constitute a package of the present invention for accommodating the light emitting element 3. ing.
[0021]
The package according to the present invention has a ceramic body having a through hole 2a for accommodating the light emitting element 3 at the center on the upper surface of a rectangular parallelepiped base 1 made of ceramic having a mounting portion 1a for mounting the light emitting element 3 on the upper surface. The frame 2 is formed of an aluminum oxide sintered body, and a metal layer 6a containing tungsten and molybdenum is formed on the inner surface of the through hole 2a. The structure is such that a Ni plating layer 6b and an Ag plating layer 6c are sequentially deposited on the metal layer 6a.
[0022]
The base 1 of the present invention is a substantially rectangular parallelepiped made of ceramics such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, and a glass ceramic sintered body. And a mounting portion 1a formed of a conductor layer for mounting the light emitting element 3 on the upper surface thereof. When the substrate 1 is made of, for example, an aluminum oxide sintered body, a raw material powder of aluminum oxide, silicon oxide, magnesium oxide, calcium oxide, or the like is mixed with a suitable organic binder, a solvent, or the like to form a slurry. Is formed into a sheet by a well-known doctor blade method, calender roll method, or the like to obtain a green sheet (ceramic green sheet). Thereafter, the green sheet is subjected to an appropriate punching process, and a plurality of the green sheets are laminated. (About 1600 ° C.).
[0023]
The base 1 has a metallized wiring conductor 4a extending from the mounting portion 1a on the upper surface to the lower surface and a metallized wiring conductor 4b extending from the periphery of the mounting portion 1a to the lower surface. The mounting portion 1a and the metallized wiring conductors 4a and 4b are made of metallized metal powder such as W, Mo, manganese (Mn), and the metallized wiring conductors 4a and 4b electrically connect the light emitting element 3 housed in the package to the outside. Function as conductive paths. A light-emitting element 3 such as a light-emitting diode is fixed to the mounting portion 1a with a conductive bonding material such as a gold-silicon alloy or a silver-epoxy resin, and a light-emitting portion is provided around the mounting portion 1a of the metallized wiring conductor 4b. The electrodes of the element 3 are electrically connected via the bonding wires 5. Further, the light emitting element 3 may be connected to the mounting portion 1a and the metallized wiring conductor 4b by flip chip mounting.
[0024]
The mounting portion 1a may be a mounting area on the upper surface of the base 1 where the light emitting element 3 is directly mounted on the upper surface of the base 1. For example, as shown in a cross-sectional view of the package of FIG. A mounting area for mounting the light emitting element 3 is formed on the upper surface, and metallized wiring conductors 4a and 4b are formed from the periphery of the mounting portion 1a to the lower surface. In this case, the light emitting element 3 such as a light emitting diode is fixed to the mounting portion 1a, which is a mounting region on the upper surface of the base 1, with a resin adhesive or the like, and the light emitting element 3 is attached to the metallized wiring conductors 4a and 4b around the mounting portion 1a. Are electrically connected via bonding wires 5a, 5b and the like.
[0025]
The metallized wiring conductors 4a and 4b provided on the base 1 are made of metallized high melting point metal powder such as W, Mo, and Mn. The metallized wiring conductors 4a and 4b are connected to wiring conductors of an external electric circuit (not shown), It electrically connects each electrode of the element 3 to an external electric circuit. The metallized wiring conductors 4a and 4b are prepared by adding a suitable organic solvent and a solvent to a high-melting point metal powder such as W, for example, and applying a conductive paste to a green sheet serving as the base 1 in advance by a conventionally known screen printing method. By printing and applying the pattern, it is adhered and formed at a predetermined position on the substrate 1.
[0026]
If metal having excellent corrosion resistance and excellent wettability of brazing material such as Ni, Au or Ag is applied to the exposed surfaces of the metallized wiring conductors 4a and 4b to a thickness of about 1 to 20 μm, the metallized wiring is The conductors 4a and 4b can be effectively prevented from being oxidized and corroded, and the bonding between the metallized wiring conductor 4a and the light emitting element 3 and the bonding between the metallized wiring conductor 4b and the bonding wire 5 can be strengthened. Therefore, on the exposed surfaces of the metallized wiring conductors 4a and 4b, a Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer or an Ag plating layer having a thickness of about 0.1 to 3 μm are formed by electrolytic plating or electroless plating. It is preferable to apply them sequentially by a method.
[0027]
Further, even when the mounting portion 1a is formed of a conductor layer, a metal having excellent corrosion resistance and excellent wettability of a brazing material such as Ni, Au or Ag is formed on the exposed surface of the mounting portion 1a to a thickness of about 1 to 20 μm. It is preferable that the mounting portion 1a is oxidized and corroded effectively, and the bonding between the mounting portion 1a and the light emitting element 3 can be strengthened. Therefore, even when the mounting portion 1a is formed of a conductor layer, a Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer or an Ag plating layer having a thickness of about 0.1 to 3 μm are formed on the exposed surface thereof. More preferably, they are sequentially applied by an electrolytic plating method or an electroless plating method.
[0028]
The frame 2 of the present invention is made of an aluminum oxide (alumina) sintered body, and as described above, a green sheet having substantially the same composition as that in the case where the substrate 1 is made of an aluminum oxide sintered body, 2 is subjected to a punching process for forming a substantially circular or substantially square through hole 2 a for accommodating the light emitting element 3 in the center portion, and a plurality of the holes are laminated and laminated on a green sheet serving as the base 1. And is integrated with the substrate 1.
[0029]
Further, a conductive paste obtained by adding a suitable organic solvent and a solvent to a mixed metal powder of W and Mo and mixing the inner surface of the through hole 2a of the green sheet to be the frame 2 by a conventionally known screen printing method. By printing and applying a predetermined pattern, the metal layer 6a is formed on substantially the entire inner surface of the through hole 2a or on a predetermined position.
[0030]
The metal layer 6a preferably contains 1 to 5 parts by weight of Mo with respect to 100 parts by weight of W. When the amount is less than 1 part by weight, the frame 2 made of an alumina sintered body (coefficient of thermal expansion: about 7.8 × 10 ⁻⁶ / ° C.) and W (coefficient of thermal expansion: about 4.6 × 10 ⁻⁶ / ° C.) C.) and Mo (thermal expansion coefficient: about 5.7 × 10 ⁻⁶ / ° C.) tend to increase thermal stress due to the difference in thermal expansion coefficient with the metal layer 6a. If it exceeds 5 parts by weight, the adhesion strength of the metal layer 6a to the frame 2 tends to be weak.
[0031]
That is, the metal layer 6a has a thermal expansion coefficient of about 4.6 × 10 ⁻⁶ / ° C., and a thermal expansion coefficient of about 5.7 × 10 ⁻⁶ / ° C., and thus has an alumina sintered body as compared with W. By containing a small amount of Mo having a similar thermal expansion coefficient, the thermal expansion coefficient becomes close to that of the alumina sintered body. As a result, the reliability of the attachment of the metal layer 6a to the frame 2 is greatly improved.
[0032]
An Ni plating layer 6b having a thickness of about 1 to 10 μm on the metal layer 6a and an Ag plating layer 6c having a thickness of about 0.1 to 3 μm on the Ni plating layer 6b are sequentially formed by electrolytic plating or electroless plating. Has been adhered. That is, the Ni plating layer 6b is interposed between the metal layer 6a and the Ag plating layer 6c, the adhesion strength between the metal layer 6c and the Ni plating layer 6b is high, and the Ni plating layer 6b and the Ag plating The layer 6c has good wettability and strong adhesion strength. Thus, when the transparent resin is filled in the through-hole 2a of the frame 2 to seal the light emitting element 3, even if the transparent resin is cured by applying heat, the Ni plating layer 6b is thermally stressed by the heat. And Ag plating layer 6c can be prevented from peeling off from the portions where they are applied. The Ag plating layer 6c functions as a reflection layer that effectively reflects the light emitted by the light emitting element 3 housed inside the through hole 2a, shows a good metallic color of white, and makes incident light and reflected light. It is superior to Au in that it does not change the light color.
[0033]
In the present invention, the angle θ (FIG. 1) formed by the inner surface of the through hole 2a and the upper surface of the base 1 is preferably 35 to 70 degrees. If it exceeds 70 degrees, it becomes difficult to reflect light emitted from the light emitting element 3 housed inside the through hole 2a to the outside well. is less than 35 degrees, it is difficult to form the inner surface of the through hole 2a at such an angle stably and efficiently by a punching method.
[0034]
The through hole 2a of the frame 2 is formed by punching a through hole in a green sheet for the frame 2 using a punching die. At this time, the inner surface of the through hole formed in the green sheet for the frame 2 is formed so as to spread at an angle θ of 35 to 70 degrees from one main surface to the other main surface of the green sheet. By forming the inner surface of the through hole 2a so as to spread at an angle θ of 35 to 70 degrees from one main surface to the other main surface of the green sheet, the inner surface of the through hole 2a It is formed so as to spread outward at an angle θ of 35 to 70 degrees with respect to the upper surface of the first. The through-hole 2a preferably has a substantially circular cross-sectional shape. In this case, light emitted from the light emitting element 3 accommodated in the through-hole 2a is uniformly reflected in all directions by the inner surface of the substantially circular through-hole 2a. Can be radiated very uniformly to the outside.
[0035]
The arithmetic average roughness Ra of the surface of the Ag plating layer 6c attached to the inner surface of the through hole 2a is preferably 1 to 3 μm. If it is less than 1 μm, it is difficult to uniformly reflect the light emitted from the light emitting element 3 accommodated in the through hole 2a, and the intensity of the reflected light tends to be uneven. If it exceeds 3 μm, it is difficult to form such a rough surface stably and efficiently by a punching method.
[0036]
Further, the Ag plating layer 6c preferably has a reflectance of 80% or more with respect to light emitted from the light emitting element 3 accommodated in the through hole 2a. If it is less than 80%, it becomes difficult to satisfactorily reflect the light emitted by the light emitting element 3 accommodated in the through hole 2a.
[0037]
Further, the metal layer 6a, the Ni plating layer 6b, and the Ag plating layer 6c may be formed at least in a portion above the upper surface of the light emitting element 3 on the inner surface of the through hole 2a, or at least the Ag plating layer 6c It is sufficient that the Ni plating layer 6b is formed at a position above the upper surface of the light emitting element 3 and the light of the light emitting element 3 can be efficiently reflected to the outside. Further, the metal layer 6a, the Ni plating layer 6b, and the Ag plating layer 6c are formed not only on the inner surface of the through hole 2a but also on the exposed upper surface of the base 1 around the mounting portion 1a and the metallized wiring conductors 4a, 4b. Is also good. In this case, light that has been irregularly reflected on the inner surface of the through hole 2a or in the transparent resin and has reached the exposed upper surface of the base 1 can be effectively reflected to the outside.
[0038]
In addition, the upper surface of the frame 2 is coated with black, brown, dark blue, or the like to increase the contrast between the light emitting region (including the reflection region) of the light emitting element 3 and the non-light emitting region, or to light the adjacent light emitting device. Interference can be suppressed.
[0039]
The transparent resin covering the light emitting element 3 is made of an epoxy resin, a urea resin, a silicone resin, or the like.
[0040]
Thus, according to the package of the present invention, the light emitting element 3 is mounted on the mounting portion 1a of the base 1, and the electrode of the light emitting element 3 is electrically connected to the metallized wiring conductor 4b via the bonding wire 5. Thereafter, a light emitting device is obtained by providing a transparent resin so as to cover the light emitting element 3 or filling the through hole 2a in which the light emitting element 3 is accommodated with the transparent resin to seal the light emitting element 3.
[0041]
After the light emitting element 3 is sealed by providing a transparent resin so as to cover the light emitting element 3, a transparent lid may be bonded to the upper surface of the frame 2, or may be sealed with glass instead of the transparent resin. The transparent lid may be joined to the upper surface of the frame 2 without providing the transparent resin.
[0042]
Note that the present invention is not limited to the above-described embodiment, and various changes can be made without departing from the spirit of the present invention.
[0043]
【The invention's effect】
The light-emitting element housing package of the present invention is made of a ceramic having a through hole for housing the light-emitting element in the center on the upper surface of a rectangular parallelepiped base made of ceramic having a mounting portion for mounting the light-emitting element on the upper surface. The frame body is joined so as to surround the mounting portion, the frame body is made of an aluminum oxide sintered body, and a metal layer containing tungsten and molybdenum is applied to the inner surface of the through hole, and the metal layer Since the nickel plating layer and the silver plating layer are sequentially deposited on the top, the thermal stress generated due to the difference in the thermal expansion coefficient between the frame made of the aluminum oxide sintered body and the metal layer is reduced, The metal layer can be prevented from peeling off from the inner surface of the through hole.
[0044]
Further, since the Ni plating layer and the Ag plating layer are sequentially deposited on the metal layer, the adhesion strength between the metal layer and the Ni plating layer is strong, and the Ni plating layer and the Ag plating layer have good wettability. Since the adhesion strength is good, it is possible to prevent the Ni plating layer and the Ag plating layer from peeling off from the parts where they are adhered when the light emitting element is sealed with the transparent resin.
[0045]
Therefore, the reliability of the deposition of the reflective layer composed of the metal layer, the Ni plating layer, and the Ag plating layer is high, and the light emitted by the light emitting element housed in the through hole is favorably transmitted to the Ag plating layer on the inner surface of the through hole. The light can be reflected and radiated uniformly and efficiently toward the outside.
[0046]
The light-emitting device of the present invention includes the light-emitting element housing package of the present invention, the light-emitting element mounted on the mounting portion, and the transparent resin covering the light-emitting element. It is high and has high reflection performance.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing an example of an embodiment of a light emitting element housing package of the present invention.
FIG. 2 is a cross-sectional view of an example of a conventional light emitting element storage package.
FIG. 3 is a cross-sectional view of another example of a conventional light emitting element storage package.
FIG. 4 is a cross-sectional view showing another example of the embodiment of the light emitting element housing package of the present invention.
[Explanation of symbols]
1: base 1a: mounting portion 2: frame 2a: through hole 3: light emitting element 6a: metal layer 6b: Ni plating layer 6c: Ag plating layer

Claims (2)

On the upper surface of a rectangular parallelepiped base having a mounting portion for mounting the light emitting element on the upper surface, a frame made of ceramic having a through hole in the center portion for housing the light emitting element surrounds the mounting portion. In the light emitting element housing package joined as described above, the frame body is made of an aluminum oxide sintered body, and a metal layer containing tungsten and molybdenum is attached to the inner surface of the through hole. A nickel-plated layer and a silver-plated layer are sequentially applied to the package. A light emitting device, comprising: the light emitting element storage package according to claim 1; a light emitting element mounted on the mounting portion; and a transparent resin covering the light emitting element.

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